Display device

Abstract

Provided in the embodiments of the present invention is a display device, which comprises: a display panel and a backlight module. The backlight module comprises: a driving substrate and a plurality of light-emitting devices. Each light-emitting device comprises: a chip carrier, wherein the chip carrier forms an accommodating space having a bottom and a side wall; at least two light-emitting chips, wherein the at least two light-emitting chips respectively emit light of different wavelengths, and the light-emitting chips are located at the bottom of the accommodating space inside the chip carrier; and an encapsulation unit provided in the accommodating space, wherein the encapsulation unit is arranged on the side of the light-emitting chips facing away from the bottom of the accommodating space inside the chip carrier, and the diameter of the side of the encapsulation unit close to the light-emitting chips is larger than that of the side of the encapsulation unit facing away from the light-emitting chips. In this way, the light emitted by the light-emitting chips can be converged toward a center, and is prevented from being directly emitted out and instead irradiated on a side wall of the encapsulation unit, such that the light can be further reflected or refracted, thereby achieving light mixing, improving a display effect, and enhancing the user experience.

Description

Display device

[0001] Cross-reference to related applications

[0002] The present application claims priority to the Chinese patent application No. 202411104088.1, filed on August 12, 2024, and entitled “A display device”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the technical field of display, in particular to a display device. BACKGROUND

[0004] Mini Light Emitting Diode (Mini LED) chip is a miniaturized LED chip. Using Mini LED as a backlight light source in liquid crystal display can not only realize thin backlight module, but also realize more precise dynamic control, improve the dynamic contrast of liquid crystal display, and achieve better High-Dynamic Range (HDR) display effect.

[0005] At present, the Mini LED backlight industry is developing towards thinner, lower cost and lower energy consumption. Under the background of carbon neutralization and carbon peak, electronic products such as home appliances and lighting need to pursue higher energy efficiency solutions. Full-color LED backlight can realize independent control of the switching and brightness of red LEDs, green LEDs and blue LEDs, and according to the display picture needs, the switching of red LEDs, green LEDs and blue LEDs in different positions of the backlight source is adjusted, so as to eliminate the energy loss of full-white backlight under the filtering of the color filter of the liquid crystal display panel, and realize a large energy saving under the same brightness target. The application of full-color LED backlight has almost become a certain trend.

[0006] The full-color LED backlight in the current industry has the problems of uneven color when red LEDs, green LEDs and blue LEDs are lit at the same time, and large divergence angle when light exits, which causes light crosstalk problem, thereby affecting the display effect and further leading to poor user experience. SUMMARY

[0007] The display device provided by the embodiments of the present application comprises:

[0008] a display panel configured to display an image;

[0009] a backlight module located on the light entrance side of the display panel, the backlight module being configured to provide backlight; the backlight module comprises a driving substrate and a plurality of light emitting devices electrically connected with the driving substrate;

[0010] A plurality of light emitting device arrays are arranged on a driving substrate, the driving substrate is configured to provide driving signals to the light emitting devices, and the light emitting devices are driven to emit light;

[0011] Each light emitting device comprises:

[0012] A chip support, the chip support forms a containing space, the containing space has a bottom and a sidewall;

[0013] At least two light emitting chips, the at least two light emitting chips respectively emit light of different wavelengths, and the at least two light emitting chips are located on the bottom of the containing space in the chip support;

[0014] A packaging unit is arranged in the containing space, and the packaging unit is arranged on a side of the at least two light emitting chips away from the bottom of the containing space in the chip support;

[0015] The diameter of the side of the packaging unit close to the at least two light emitting chips is greater than the diameter of the side of the packaging unit away from the at least two light emitting chips.

[0016] In some embodiments of the application, the packaging unit has a gap with the sidewall of the containing space; the width of the side of the gap close to the at least two light emitting chips is less than the width of the side of the gap away from the at least two light emitting chips;

[0017] The gap is filled with a medium material, and the medium material is configured to reflect the light emitted by the at least two light emitting chips.

[0018] In some embodiments of the application, the refractive index of the medium material filled in the gap is less than the refractive index of the packaging unit.

[0019] In some embodiments of the application, the light emitting surface of the packaging unit is a plane parallel to the bottom of the containing space;

[0020] Or, the light emitting surface of the packaging unit is a curved surface convex in a direction away from the light emitting chips;

[0021] Or, the light emitting surface of the packaging unit is a curved surface concave in a direction close to the light emitting chips.

[0022] In some embodiments of the application, if the light emitting surface of the packaging unit is a plane parallel to the bottom of the containing space, a refractive optical lens or a reflective optical lens is arranged on the top of the packaging unit;

[0023] If the light emitting surface of the packaging unit is a curved surface convex in a direction away from the at least two light emitting chips, the top of the packaging unit does not need to be provided with an optical lens;

[0024] If the light emitting surface of the packaging unit is a curved surface concave in a direction close to the at least two light emitting chips, a reflective optical lens is arranged on the top of the packaging unit.

[0025] In some embodiments of the present application, the light emitting device further comprises a packaging layer between the at least one light emitting chip and the packaging unit, the packaging layer covering the at least two light emitting chips and the bottom of the accommodating space in the chip support.

[0026] In some embodiments of the present application, the bottom of the accommodating space is provided with a reflective layer, the reflective layer is located on the side of the packaging layer close to the light emitting chip, the reflective layer comprises an opening, and the opening exposes the light emitting chip.

[0027] In some embodiments of the present application, the packaging unit is provided with at least one first positioning part on the side close to the packaging layer;

[0028] The packaging layer is provided with at least one second positioning part, the at least one second positioning part is provided one by one with the at least one first positioning part, and each second positioning part is configured to fix the corresponding first positioning part;

[0029] The packaging unit is assembled and fixed with the packaging layer through the at least one first positioning part.

[0030] In some embodiments of the present application, the material of the packaging layer is different from the material of the packaging unit;

[0031] The packaging layer and the packaging unit are respectively made;

[0032] The packaging layer covering the at least two light emitting chips and the bottom of the accommodating space in the chip support is formed in the accommodating space by a dispensing process;

[0033] At least one second positioning part is formed in the packaging layer by a patterning process;

[0034] The packaging unit with at least one first positioning part is made by mold forming, and the packaging unit with at least one first positioning part is installed on the packaging layer.

[0035] In some embodiments of the present application, the bottom of the packaging unit is provided with two first positioning parts, the light emitting device comprises two light emitting chips, and the two first positioning parts are respectively located on the two sides of the two light emitting chips.

[0036] In some embodiments of the present application, the material of the packaging layer is the same as the material of the packaging unit;

[0037] The packaging layer and the packaging unit are integrally formed, the material of the packaging unit is filled in the accommodating space, and the packaging unit is formed in the accommodating space by a one-time compression molding process.

[0038] In some embodiments of the present application, the diameter of the side of the packaging unit close to the at least two light emitting chips is smaller than the size of the accommodating space, and the interface of the gap between the packaging unit and the side wall of the accommodating space is trapezoidal.

[0039] In some inventive embodiments, the diameter of the packaging unit close to the side of the at least two light emitting chips is equal to the size of the accommodating space, and the interface between the packaging unit and the side wall of the accommodating space is triangular.

[0040] The display device provided by the embodiments of the present application comprises a display panel and a backlight module; the backlight module comprises a driving substrate and a plurality of light emitting devices; the light emitting device comprises a chip support, the chip support forms an accommodating space, the accommodating space has a bottom and a side wall; at least two light emitting chips, the two light emitting chips respectively emit light of different wavelengths, and the light emitting chips are located at the bottom of the accommodating space in the chip support; a packaging unit is arranged in the accommodating space, the packaging unit is arranged at the side of the light emitting chips away from the bottom of the accommodating space in the chip support; and the diameter of the packaging unit close to the side of the light emitting chips is greater than the diameter of the packaging unit away from the side of the light emitting chips. In this way, the light emitted by the light emitting chips can be gathered to the center, and the light emitted by the light emitting chips can be prevented from directly emitting out, but can be incident on the side wall of the packaging unit, so that the light can further be reflected or refracted; further, light mixing can be realized, the display effect can be improved, and the user experience can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0041] FIG. 1 is a structural schematic diagram of a prior light emitting device provided by the embodiments of the present application;

[0042] FIG. 2 is a structural schematic diagram of a display device provided by the embodiments of the present application;

[0043] FIG. 3 is a structural schematic diagram of a display device provided by the embodiments of the present application;

[0044] FIG. 4 is a sectional structural schematic diagram of a light emitting device provided by the embodiments of the present application;

[0045] FIG. 5 is a sectional structural schematic diagram of a chip support provided by the embodiments of the present application;

[0046] FIG. 6a is a top view structural schematic diagram of a chip support provided by the embodiments of the present application;

[0047] FIG. 6b is a top view structural schematic diagram of a light emitting device provided by the embodiments of the present application;

[0048] FIG. 7 is a sectional structural schematic diagram of a light emitting device provided by the embodiments of the present application;

[0049] FIG. 8 is a sectional structural schematic diagram of a light emitting device provided by the embodiments of the present application;

[0050] FIG. 9 is a sectional structural schematic diagram of a light emitting device provided by the embodiments of the present application;

[0051] FIG. 10 is a sectional structural schematic diagram of a light emitting device provided by the embodiments of the present application;

[0052] Fig. 11 is a schematic diagram of a cross-sectional structure of a light emitting device according to an embodiment of the present application;

[0053] Fig. 12 is a schematic diagram of a cross-sectional structure of a light emitting device according to an embodiment of the present application;

[0054] Fig. 13 is a schematic diagram of a cross-sectional structure of a light emitting device according to an embodiment of the present application. DETAILED DESCRIPTION

[0055] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. And the embodiments in the present application and the features in the embodiments can be combined with each other without conflict if possible. Based on the described embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the protection scope of the present application.

[0056] Unless otherwise defined, technical terms or scientific terms used in the present application shall have the ordinary meaning understood by a person of ordinary skill in the art to which the present application pertains. The terms "first", "second" and similar terms used in the present application do not denote any order, quantity or importance, but are used to distinguish different components. The terms "comprise", "comprising", "include", "including" and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect", "connected", "connection" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0057] It should be noted that the sizes and shapes of the figures in the drawings do not reflect true proportions, but only serve to illustrate the content of the present application. And the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout.

[0058] The liquid crystal display device is mainly composed of a backlight module and a liquid crystal display panel. The liquid crystal display panel itself does not emit light and needs to rely on the light source provided by the backlight module to realize brightness display. Using light emitting diodes (LEDs) as the backlight source can perform dynamic control on the light source in multiple partitions, significantly improve the dynamic contrast of the liquid crystal display device, and improve the display effect.

[0059] Mini Light Emitting Diode (Mini LED) chip is a micro LED chip, and the Mini LED is used as a backlight light source in liquid crystal display. The Mini LED can not only realize thin backlight module, but also realize more fine dynamic control, improve dynamic contrast of liquid crystal display, and achieve better High-Dynamic Range (HDR) display effect.

[0060] At present, the Mini LED backlight industry develops in the direction of thinner, lower cost and lower energy consumption. Under the background of carbon neutralization and carbon peak, electronic products such as home appliances and lighting need to pursue higher energy efficiency solutions. Full-color LED backlight can realize independent control of the switching and brightness of red LEDs, green LEDs and blue LEDs, and according to the display picture, the switching of red LEDs, green LEDs and blue LEDs in different positions of the backlight source is controlled, so as to eliminate the energy loss of full-white backlight under the filtering of the color filter of the liquid crystal display panel, and realize a large energy saving under the same brightness target. The application of full-color LED backlight has almost become a certain trend.

[0061] FIG. 1 is a structural schematic diagram of a prior light emitting device according to an embodiment of the present application.

[0062] The full-color LED backlight in the current industry has the problems of uneven light emitting color when red LEDs, green LEDs and blue LEDs are lit at the same time, and light crosstalk caused by a large divergence angle of light rays when the light rays are emitted, thereby affecting the display effect and further leading to poor user experience. As shown in FIG. 1, most of the light rays L are directly emitted without multiple reflection and refraction, thereby causing the problem of uneven light emitting color of the light emitting device when the red LEDs, green LEDs and blue LEDs are lit at the same time, and the problem of light crosstalk caused by the large divergence angle of the light rays L and the disordered emission direction of the light rays L.

[0063] Based on the above problems, the display device is provided, and FIG. 2 is a structural schematic diagram of a display device according to an embodiment of the present application.

[0064] As shown in FIG. 2, the display device includes a display panel 10 configured to display an image.

[0065] Exemplarily, the display panel is a liquid crystal display panel, which is composed of liquid crystal molecules sandwiched between two glass substrates, and the display of images can be realized by controlling the arrangement state of the liquid crystal molecules. The liquid crystal molecules are a kind of substance between solid and liquid, and the liquid crystal molecules can change the arrangement direction under certain conditions. When the electric current passes through the liquid crystal molecules, the liquid crystal molecules will arrange according to the direction of the electric field, so as to change the polarization direction of the light, and then control the transmission and blocking of the light, and finally form a visible image.

[0066] Exemplarily, the display panel can include a color filter film layer; under the condition of full-color LED backlight, such arrangement can ensure better color display effect of the display panel and improve the viewing effect.

[0067] Exemplarily, the display panel can not include a color filter film layer; under the condition of full-color LED backlight, such arrangement can save the color filter film layer, so as to reduce the production cost of the display panel and save the cost.

[0068] The backlight module 20 is located at the light-incident side of the display panel 10, and the backlight module 20 is configured to provide backlight; wherein the light-emitting effect of the backlight provided by the backlight module will directly affect the visual effect of the liquid crystal display panel.

[0069] The structure of the backlight module is various, mainly including side-light type and direct type. The light source of the side-light type backlight module is located at one side of the liquid crystal panel, and the light is uniformly distributed to the whole panel through the light guide plate; the direct type backlight module directly places the light source behind the liquid crystal panel, and uniformly scatters the light through the reflection plate and diffusion plate and other components. The side-light type backlight module is widely used in small and medium-sized liquid crystal display panels due to its lightness, thinness, power saving and other characteristics; and the direct type backlight module occupies an important position in large-sized liquid crystal display devices due to its high brightness, good light-emitting viewing angle and other advantages.

[0070] Fig. 3 is a second structural schematic diagram of the display device provided by the embodiment of the present application.

[0071] As shown in Fig. 3, the backlight module 20 includes: a driving substrate 2 and a plurality of light emitting devices 1 electrically connected with the driving substrate 2;

[0072] Among them, the plurality of light emitting devices 1 are arrayed on the driving substrate 2, and the driving substrate 2 is configured to provide driving signals for the light emitting devices 1 to drive the light emitting devices 1 to emit light;

[0073] Exemplarily, the driving substrate 2 can adopt a printed circuit board (PCB), for example, a high density interconnector (HDI) circuit board. The shape of the driving substrate 2 can be adaptively set according to the display device, which is not limited herein.

[0074] Fig. 4 is a schematic diagram of a cross-sectional structure of a light emitting device according to an embodiment of the present application.

[0075] As shown in Fig. 4, the light emitting device 1 comprises a chip support 11, a light emitting chip 12, an encapsulation layer 13, and an encapsulation unit 14.

[0076] Fig. 5 is a schematic diagram of a cross-sectional structure of a chip support according to an embodiment of the present application.

[0077] As shown in Fig. 5, the chip support 11 has an accommodating space 110 formed in the interior thereof, and the accommodating space 110 has a bottom and a sidewall.

[0078] Fig. 6a is a schematic diagram of a top view of a chip support according to an embodiment of the present application; and Fig. 6b is a schematic diagram of a top view of a light emitting device according to an embodiment of the present application.

[0079] As shown in Figs. 6a and 6b, each light emitting device comprises at least two light emitting chips 12, and the at least two light emitting chips 12 respectively emit light of different wavelengths.

[0080] Exemplarily, the light emitting chip 12 in each light emitting device can be three, including a red light emitting chip, a green light emitting chip, and a blue light emitting chip. The red light emitting chip is configured to emit red light, the green light emitting chip is configured to emit green light, and the blue light emitting chip is configured to emit blue light, thereby realizing full-color backlight. The full-color backlight can reduce the power consumption of the display device and save energy.

[0081] Exemplarily, the light emitting chip 12 is an LED chip, a Mini LED chip, or a Micro LED chip.

[0082] In addition to flip chip packaging technology, wire bonding packaging technology can also be used in the packaging process of the light emitting chip. Wire bonding is a process for achieving semiconductor electrical characteristics, which uses thin gold wires to connect the contacts of the light emitting chip on the driving substrate to the contacts of the driving substrate. This method belongs to the traditional wire bonding method, and compared with flip chip bonding, wire bonding technology plays an important role in realizing the electrical signal transmission between the light emitting chip and the driving substrate. Flip chip packaging technology is to connect the light emitting chip and the driving substrate bump to improve the speed of the semiconductor. These two technologies have their own advantages, and suitable packaging process can be selected according to different application requirements and design.

[0083] As shown in FIG. 4, the light emitting chip 12 is located at the bottom of the accommodating space in the chip support 11;

[0084] As shown in FIGS. 6a and 6b, the bottom of the accommodating space 110 can also be provided with a plurality of first pads 16-1 and second pads 16-2.

[0085] As an example, the first pad is a positive electrode, and the second pad is a negative electrode; or the first pad is a negative electrode, and the second pad is a positive electrode; which is not specifically limited here.

[0086] As shown in FIGS. 6a and 6b, each light emitting chip 12 is respectively electrically connected with a plurality of first pads 16-1 and second pads 16-2;

[0087] As shown in FIG. 6b, each light emitting chip 12 is arranged in a linear manner along a first direction F1, and a plurality of first pads 16-1 and a plurality of second pads 16-2 are respectively located on both sides of each light emitting chip 12 along a second direction F2; the first direction F1 and the second direction F2 are perpendicular to each other.

[0088] Each light emitting chip 12 is electrically connected with the first pad 16-1 and the second pad 16-2 corresponding to the light emitting chip 12, and the first pad 16-1 and the second pad 16-2 corresponding to the light emitting chip 12 are located on both sides of the light emitting chip 12 along the second direction F2.

[0089] That is, by arranging each light emitting chip 12 in a linear manner, the design is relatively simple, and wiring is facilitated, and the circuit design is simplified.

[0090] As an example, the chip support 11 in the light emitting device 1 is electrically connected with the driving substrate through a plurality of first pads 16-1 and second pads 16-2, so as to transmit the driving signal provided by the driving substrate to each light emitting chip 12, and then make each light emitting chip 12 emit light according to the driving signal.

[0091] As shown in FIG. 4, the packaging unit 14 is arranged in the accommodating space 110, and the packaging unit 14 is arranged on the side of the bottom of the accommodating space 110 away from the chip support 11. The packaging unit is arranged to converge and collimate the light emitted by each light emitting chip, thereby improving the light efficiency.

[0092] For example, the material of the packaging unit can be selected from at least one of organic light diffusion materials such as polycarbonate (PC), polystyrene (PS) plastic, polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), optical grade silica gel, and inorganic light diffusion materials such as silicon dioxide, titanium dioxide, calcium carbonate, magnesium silicate, barium sulfate, and the like.

[0093] In the packaging unit 14, the diameter of the side close to the light emitting chip 12 is greater than the diameter of the side away from the light emitting chip 12. This arrangement can make the light emitted by the light emitting chip converge towards the center of the accommodating space, thereby reducing the divergence angle of the light, and most of the light is emitted in the direction directly above, avoiding the light from being emitted in other directions, thereby preventing light crosstalk, improving the display effect, and further improving the user experience. In addition, since the diameter of the side of the packaging unit away from the light emitting chip is small, the light emitted by the light emitting chip can be prevented from being directly emitted, but the light can be incident on the side wall of the packaging unit, so that the light can be further reflected or refracted, thereby realizing light mixing.

[0094] In some embodiments of the present application, as shown in FIG. 4, the packaging unit 14 has a gap 15 with the side wall of the accommodating space 110. The existence of the gap can prevent the packaging unit from being successfully placed in the accommodating space of the chip support.

[0095] The width of the side of the gap 15 close to the light emitting chip 12 is smaller than the width of the side away from the light emitting chip 12.

[0096] The gap 15 is filled with a medium material, and the medium material is configured to reflect the light emitted by the light emitting chip 12.

[0097] In the gap, the size gradually increases in the direction away from the light emitting chip, which can further reflect or refract the light emitted by the light emitting chip after the medium material is filled, thereby mixing the light.

[0098] FIG. 7 is a cross-sectional structure schematic diagram of a light emitting device according to an embodiment of the present application. FIG. 8 is a cross-sectional structure schematic diagram of a light emitting device according to an embodiment of the present application. FIG. 9 is a cross-sectional structure schematic diagram of a light emitting device according to an embodiment of the present application. FIG. 10 is a cross-sectional structure schematic diagram of a light emitting device according to an embodiment of the present application. FIG. 11 is a cross-sectional structure schematic diagram of a light emitting device according to an embodiment of the present application.

[0099] For example, when the diameter of the side of the packaging unit 14 close to the light emitting chip 12 is smaller than the size of the accommodating space 110, as shown in FIG. 4, FIG. 7 and FIG. 8, the cross section of the gap 15 between the packaging unit 14 and the side wall of the accommodating space 110 is trapezoidal. Such arrangement can avoid the packaging unit from failing to be successfully placed in the accommodating space, and has a reserved space for installation.

[0100] For example, when the diameter of the side of the packaging unit 14 close to the light emitting chip 12 is substantially equal to the size of the accommodating space 110, as shown in FIG. 9, FIG. 10 and FIG. 11, the cross section of the gap 15 between the packaging unit 14 and the side wall of the accommodating space 110 is triangular. Such arrangement can avoid light loss and fully converge the light emitted by the light emitting chip by covering the bottom of the accommodating space with the side of the packaging unit close to the light emitting chip.

[0101] In some embodiments of the present application, the refractive index of the medium material filled in the gap 15 is smaller than the refractive index of the material of the packaging unit 14. Such arrangement can make the light emitted by the light emitting chip achieve total reflection in the accommodating space inside the chip support, adjust the exit angle of the light, further achieve sufficient light mixing, and thus improve the optical color uniformity of the light emitting device.

[0102] For example, the material filled in the gap 15 can be encapsulating silica gel, wherein the encapsulating silica gel is doped with low refractive index nanoparticles such as silicon dioxide (SiO2), titanium dioxide (TiO2), or doped with polymers such as polyethylene (PE) or polystyrene (PS), so as to reduce the refractive index of the silica gel, achieve the refractive index of the material filled in the gap lower than the refractive index of the material of the packaging unit, and thus achieve total reflection at the interface.

[0103] In some embodiments of the present application, the light exit surface of the packaging unit 14 is a plane parallel to the bottom of the accommodating space 110, as shown in FIG. 8 and FIG. 11, and the top of the packaging unit 14 is a plane. Such arrangement can facilitate the assembly of optical lenses according to the needs in subsequent production, further improve the light efficiency, and thus improve the display effect. For example, a refractive optical lens or a reflective optical lens can be used in cooperation.

[0104] FIG. 12 is a cross-sectional structure schematic diagram of a light emitting device according to an embodiment of the present application.

[0105] For example, as shown in FIG. 12, a flat convex optical lens 17 can be assembled on the top of the packaging unit 14 in the light emitting device 1, further converging the light and improving the utilization rate of the light, avoiding light loss, and thus improving the display effect.

[0106] In some embodiments of the present application, the light-exit surface of the packaging unit 14 is a curved surface protruding in the direction away from the light-emitting chips 12, as shown in FIGS. 4 and 9. The top of the packaging unit 14 is a protruding arc-shaped curved surface. This arrangement does not require an additional optical lens, thereby reducing cost and process complexity.

[0107] In some embodiments of the present application, the light-exit surface of the packaging unit 14 is a curved surface recessed in the direction close to the light-emitting chips 12, as shown in FIGS. 7 and 10. The top of the packaging unit 14 is a recessed arc-shaped curved surface. This arrangement of the packaging unit can meet the actual light-exit requirement, and cooperate with the assembly of a reflective optical lens in subsequent manufacturing, thereby further improving light efficiency and display effect.

[0108] In some embodiments of the present application, as shown in FIG. 4, the light-emitting device 1 further comprises a packaging layer 13 located between the light-emitting chips 12 and the packaging unit 14.

[0109] The packaging layer 13 covers the bottom of the accommodating space 110 in each of the two light-emitting chips 12 and the chip support 11. The thickness of the packaging layer 13 is greater than the thickness of each light-emitting chip 12. The packaging layer 13 is configured to protect the light-emitting chips from damage and to act as a flat layer during manufacturing.

[0110] For example, the packaging layer 13 can be formed by curing packaging glue. The packaging glue can be a transparent resin material such as epoxy resin or silicone resin that can be used as an adhesive. In specific implementation, the packaging glue can further include a reinforcing material mixed in the transparent matrix. The reinforcing material is used to enhance the packaging performance and curing performance of the packaging glue. Specifically, the reinforcing material can include a mixture of one or more of a dispersing agent, a solvent, a crosslinking agent, an initiator, etc., without limitation.

[0111] The packaging glue can further be doped with diffusion particles. The diffusion particles are uniformly dispersed in the packaging layer 13 formed by curing the packaging glue. When the display device displays an image, the light emitted by the light-emitting chips is fully mixed through the refraction and reflection of the diffusion particles, making the light emitted by the display device more uniform. The material of the diffusion particles can be at least one of an organic light diffusion material such as polycarbonate (PC), polystyrene (PS) plastic, polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), optical-grade silicone, etc., and an inorganic light diffusion material such as silicon dioxide, titanium dioxide, calcium carbonate, magnesium silicate, barium sulfate, etc., without limitation.

[0112] In some embodiments of the present application, the bottom of the accommodating space 110 is provided with a reflective layer located on the side of the packaging layer close to the light-emitting chips.

[0113] The reflective layer comprises an opening, and the opening exposes each light emitting chip 12. The reflective layer can reflect the light emitted by each light emitting chip 12, improve the brightness uniformity of the light, avoid uneven distribution of the light field of the light, and avoid light loss, and improve the light efficiency.

[0114] For example, the material of the reflective layer can be silver. The reflective layer avoids the pads and the light emitting chip, avoids affecting the signal transmission, thereby preventing signal interference, and the reflective layer can be customized to a pattern. The specific pattern can be designed according to requirements.

[0115] The light emitting device can realize multiple reflection and refraction of the light emitted by the light emitting chip in the accommodating space, the light emitted by the light emitting chip can be fully mixed, the color uniformity of the light is improved, the display effect is improved, and the user experience is improved. As shown in FIG. 4, the light L has multiple reflection and refraction, and the diameter of the side of the packaging unit close to the light emitting chip is greater than the diameter of the side of the packaging unit away from the light emitting chip, which can prevent the light L from directly emitting out, thereby avoiding that the light L is not fully mixed, that is, avoiding that the light is not fully mixed.

[0116] In some embodiments of the present application, as shown in FIG. 4, the side of the packaging unit 14 close to the packaging layer 13 is provided with at least one first positioning part; for example, each first positioning part protrudes in a direction close to the corresponding light emitting chip 12;

[0117] The packaging layer 13 is provided with at least one second positioning part; for example, each second positioning part is recessed in a direction close to the corresponding light emitting chip 12;

[0118] As shown in FIG. 4, the at least one second positioning part and the at least one first positioning part are one-to-one corresponding, and each second positioning part is configured to fix the corresponding first positioning part.

[0119] Taking one light emitting chip 12 as an example, the second positioning part recessed in a direction close to the light emitting chip 12 can be embedded with the first positioning part protruding in a direction close to the light emitting chip 12.

[0120] As shown in FIG. 4, the packaging unit 14 is assembled and fixed with the packaging layer 13 through the first positioning parts.

[0121] By providing the at least one first positioning part and the at least one second positioning part, the packaging unit can be positioned, thereby being quickly assembled, and the packaging unit can be fixed on the packaging layer to avoid falling off and improve the stability of the light emitting device.

[0122] As shown in FIG. 4, the thickness of the encapsulation layer 13 is greater than the thickness of each light emitting chip 12, which can facilitate the formation of the second positioning part, thereby achieving positioning assembly while avoiding damage to the light emitting device.

[0123] In some embodiments of the present application, as shown in FIG. 4, the material of the encapsulation layer 13 is different from the material of the encapsulation unit 14, and the encapsulation layer 13 and the encapsulation unit 14 are respectively made; such arrangement can facilitate the design and manufacture of the encapsulation layer and the encapsulation unit respectively, thereby improving the process precision.

[0124] The manufacturing process includes: forming the encapsulation layer 13 covering the bottom of the accommodating space 110 in the chip support 11 and the accommodating space 110 of each light emitting chip 12 by means of the point gluing process;

[0125] The patterned processing is used to form at least one second positioning part in the encapsulation layer 13;

[0126] The encapsulation unit 14 with at least one first positioning part is made by means of the mold forming, and the encapsulation unit 14 with at least one first positioning part is installed on the encapsulation layer 13.

[0127] The encapsulation layer and the encapsulation unit are respectively made of different materials, and the refractive index of the encapsulation layer and the encapsulation unit can be designed according to the requirements. Different materials have different refractive indexes, and the refractive index of the encapsulation layer and the encapsulation unit can be freely selected and designed, thereby ensuring better light efficiency and better display effect.

[0128] It should be noted that when the material of the encapsulation layer 13 is the same as the material of the encapsulation unit 14, the encapsulation layer and the encapsulation unit can also be respectively made, i.e., the same material can save costs.

[0129] In some embodiments of the present application, as shown in FIGS. 7 to 12, the bottom of the encapsulation unit 14 is provided with two first positioning parts, the light emitting device includes two light emitting chips, and the two first positioning parts are respectively located on the two sides of the two light emitting chips 12; such arrangement can stably fix the encapsulation unit on the encapsulation layer and avoid the light emitting chips, thereby preventing the influence on the light emitting chips.

[0130] For example, the bottom of the encapsulation unit 14 can also have three first positioning parts, four first positioning parts, five first positioning parts, etc., and the specific number can be set according to the requirements, which is not limited herein.

[0131] For example, the present application provides steps for manufacturing a light emitting device, which specifically includes:

[0132] First, the chip support is made by means of the mold injection forming, and a plurality of pads are arranged on the bottom of the accommodating space of the chip support;

[0133] Then, the light emitting chips are arranged at the bottom of the accommodating space of the chip support, and are welded with the pads through die bonding glue;

[0134] Then, the encapsulation glue is filled through a dispensing process, and is cured to form an encapsulation layer covering the light emitting chips and the bottom of the accommodating space in the chip support;

[0135] Then, the encapsulation unit is made through mold forming, and is mounted on the encapsulation layer in the accommodating space of the chip support;

[0136] Finally, the encapsulation silicon is filled in the gap between the encapsulation unit and the side wall of the accommodating space through a dispensing process to form the light emitting device.

[0137] Fig. 13 is a cross-sectional structure schematic view of the light emitting device provided by the embodiment of the present application.

[0138] In some embodiments of the present application, as shown in Fig. 13, the material of the encapsulation layer 13 is the same as that of the encapsulation unit 14, and the encapsulation layer 13 and the encapsulation unit 14 are integrally formed; such arrangement can reduce the process steps, lower the process complexity, and save the assembly steps, facilitating the manufacturing and production.

[0139] In the manufacturing process, the material of the encapsulation unit is filled in the accommodating space, and the encapsulation unit is formed in the accommodating space through one-time stamping forming.

[0140] For example, the present application provides a step of manufacturing a light emitting device, which specifically comprises:

[0141] First, the chip support is made through mold injection forming, and a plurality of pads are arranged at the bottom of the accommodating space of the chip support;

[0142] Then, at least two light emitting chips are arranged at the bottom of the accommodating space of the chip support, and are welded with the pads through die bonding glue;

[0143] Then, the material of the encapsulation unit is filled in the accommodating space of the chip support, and the encapsulation unit is formed in the accommodating space through one-time stamping forming.

[0144] Finally, the encapsulation silicon is filled in the gap between the encapsulation unit and the side wall of the accommodating space through a dispensing process to form the light emitting device.

[0145] In the specific implementation, in the embodiment of the present application, the display device can be any product or component with display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, etc. Other essential components of the display device should be understood by those skilled in the art, and are not described here in detail, nor should they be regarded as a limitation on the present application.

[0146] While the preferred embodiments of the application have been described, additional variations and modifications can be made to these embodiments by those skilled in the art once they have the benefit of the present disclosure without departing from the spirit and scope of the application. Accordingly, it is intended that the appended claims include all such modifications and variations as fall within the scope of the present application.

[0147] It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the application without departing from the spirit and scope of the application. Thus, it is intended that the present application include all such modifications and alterations insofar as they come within the scope of the appended claims and their equivalents.

Claims

1. A display device, characterized by comprising: The display device comprises: a display panel configured to display an image; a backlight module located at the light-incident side of the display panel, the backlight module being configured to provide backlight; the backlight module comprises a driving substrate and a plurality of light-emitting devices electrically connected to the driving substrate; the plurality of light-emitting devices are arranged in an array on the driving substrate, and the driving substrate is configured to provide driving signals to the plurality of light-emitting devices to drive the plurality of light-emitting devices to emit light; each light-emitting device comprises: a chip support forming a containing space, the containing space having a bottom and a sidewall; at least two light-emitting chips respectively emitting light of different wavelengths, the at least two light-emitting chips being located at the bottom of the containing space in the chip support; a packaging unit is arranged in the containing space, the packaging unit being arranged on a side of the at least two light-emitting chips away from the bottom of the containing space in the chip support; a diameter of the packaging unit on a side close to the at least two light-emitting chips is greater than a diameter of the packaging unit on a side away from the at least two light-emitting chips.

2. The display device of claim 1, wherein, the packaging unit and the sidewall of the containing space have a gap; a width of the gap on a side close to the at least two light-emitting chips is less than a width of the gap on a side away from the light-emitting chips; the gap is filled with a medium material configured to reflect light emitted by the at least two light-emitting chips.

3. The display device of claim 2, wherein, a refractive index of the medium material filled in the gap is less than a refractive index of a material of the packaging unit.

4. The display device of claim 1, wherein an outlight surface of the packaging unit is a plane parallel to the bottom of the containing space; or, the outlight surface of the packaging unit is a curved surface protruding in a direction away from the at least two light-emitting chips; or, the outlight surface of the packaging unit is a curved surface recessed in a direction close to the at least two light-emitting chips.

5. The display device of claim 4, wherein if the outlight surface of the packaging unit is a plane parallel to the bottom of the containing space, a refractive optical lens or a reflective optical lens is arranged on a top of the packaging unit; or if the outlight surface of the packaging unit is a curved surface protruding in a direction away from the at least two light-emitting chips, the top of the packaging unit does not need to be provided with an optical lens; or if the outlight surface of the packaging unit is a curved surface recessed in a direction close to the at least two light-emitting chips, a reflective optical lens is arranged on the top of the packaging unit.

6. A display device as claimed in any one of claims 1 to 5, characterized in that The light-emitting device further comprises a packaging layer between the at least two light-emitting chips and the packaging unit, the packaging layer covering the at least two light-emitting chips and the bottom of the containing space in the chip support.

7. The display device of claim 6, wherein The bottom of the containing space is provided with a reflective layer on a side of the packaging layer close to the at least two light-emitting chips, and the reflective layer comprises an opening exposing the at least two light-emitting chips.

8. The display device of claim 6, wherein, a side of the packaging unit close to the packaging layer is provided with at least one first positioning portion; The packaging layer is provided with at least one second positioning part corresponding to the at least one first positioning part, each second positioning part is configured to fix the corresponding first positioning part; The packaging unit is assembled and fixed with the packaging layer through the at least one first positioning part.

9. The display device of claim 8, wherein, The material of the packaging layer is different from the material of the packaging unit; The packaging layer and the packaging unit are respectively manufactured; A packaging layer covering the at least two light emitting chips and the bottom of the accommodating space in the chip support is formed in the accommodating space through a dispensing process; The at least one second positioning part is formed in the packaging layer through a patterning process; The packaging unit with the at least one first positioning part is manufactured through mold forming, and the packaging unit with the at least one first positioning part is installed on the packaging layer.

10. The display device of claim 8, wherein, The bottom of the packaging unit is provided with two first positioning parts, and the light emitting device includes two light emitting chips, and the two first positioning parts are respectively located on two sides of the two light emitting chips.

11. The display device of claim 6, wherein, The material of the packaging layer is the same as the material of the packaging unit; The packaging layer and the packaging unit are integrally formed, the material of the packaging unit is filled in the accommodating space, and the packaging unit is formed in the accommodating space through one-time stamping forming process.

12. The display device according to any one of claims 1 to 5 and 7 to 11, wherein The diameter of the side of the packaging unit close to the at least two light emitting chips is smaller than the size of the accommodating space, and the interface of the gap between the packaging unit and the side wall of the accommodating space is trapezoidal.

13. The display device according to any one of claims 1 to 5 and 7 to 11, wherein The diameter of the side of the packaging unit close to the at least two light emitting chips is equal to the size of the accommodating space, and the interface of the gap between the packaging unit and the side wall of the accommodating space is triangular.

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