Curable composition and electronic component device

Abstract

[Problem] To provide: a curable composition with which deterioration in the physical properties of a cured product can be suppressed even when a curing time is shortened; and an electronic component device comprising the cured product. [Solution] This curable composition comprises a curable component, wherein when the glass transition temperature of a cured product obtained by post-curing, under the conditions of 175ºC and 3 hours, a molded product obtained by molding said curable composition under the conditions of a mold temperature of 175ºC and a curing time of 150 seconds is defined as Tg1, and the glass transition temperature of a cured product obtained by post-curing the molded product under the conditions of 175ºC and 5 hours is defined as Tg2, Tg1 / Tg2 is at least 0.9.

Description

Curable composition and electronic component device

[0001] The present disclosure relates to curable compositions and electronic component devices.

[0002] In the field of element encapsulation of electronic component devices such as transistors, integrated circuits (ICs), and large-scale integrations (LSIs), resin encapsulation has traditionally been mainstream from the standpoints of productivity, cost, etc., and curable compositions containing epoxy resins have been widely used. The reason curable compositions containing epoxy resins are used is because epoxy resins have an excellent balance of various properties such as electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to insert products.

[0003] Underfill materials are widely used as encapsulants in bare-chip mounted electronic component devices such as COB (Chip on Board), COG (Chip on Glass), and TCP (Tape Carrier Package). Furthermore, in electronic component devices (flip chips) in which electronic components such as semiconductor elements are directly bump-connected to a wiring substrate made of ceramic, glass epoxy resin, glass imide resin, polyimide film, or the like, epoxy resin compositions are used as underfill materials to fill gaps between the bump-connected electronic components and the wiring substrate. Underfill materials play an important role in protecting electronic components from temperature, humidity, and external mechanical forces.

[0004] In order to provide an encapsulating epoxy resin composition having excellent moisture-resistant adhesive strength and low stress, and an electronic component device having elements encapsulated therewith and having high reliability (moisture resistance and thermal shock resistance), an encapsulating epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (C) rubber particles, and (D) an inorganic filler, as well as an electronic component device having elements encapsulated with this encapsulating epoxy resin composition have been disclosed (see, for example, Patent Document 1).

[0005] Japanese Patent Application Laid-Open No. 2001-270976

[0006] Regarding the use of fossil resources, there are issues such as resource depletion and the carbon dioxide (CO ) generated during incineration.２ ) is a concern for global warming. Therefore, we must reduce the use of fossil resources and CO2 derived from fossil resources. ２ There is a demand to reduce carbon dioxide emissions. To achieve this, there is a demand to use carbon-neutral biomass-derived materials (bioplastics), shorten the curing time of resin compositions, simplify processing steps, etc. However, shortening the curing time of resin compositions may result in a deterioration in the physical properties of the resulting cured product.

[0007] An object of the present disclosure is to provide a curable composition that can suppress deterioration in the physical properties of the resulting cured product even when the curing time is shortened, and an electronic component device that includes this cured product.

[0008] Specific means for achieving the above object are as follows. <1> A curable composition containing a curable component, wherein the curable composition is molded under conditions of a mold temperature of 175°C and a curing time of 150 seconds, and the molded product is post-cured under conditions of 175°C for 3 hours to obtain a cured product, where Tg1 is the glass transition temperature of the cured product, and Tg2 is the glass transition temperature of the cured product obtained by post-curing under conditions of 175°C for 5 hours. The curable composition has a Tg1 / Tg2 ratio of 0.9 or more. <2> The curable composition according to <1>, further containing an inorganic filler. <3> The curable composition according to <1> or <2>, wherein the curable component includes an epoxy resin, and the curable composition further includes a curing agent. <4> The curable composition according to <3>, wherein the epoxy resin includes a biphenyl-type epoxy resin. <5> The curable composition according to any one of <1> to <4>, further containing a curing accelerator, wherein the curing accelerator includes a cyclic amidine compound. <6> The curable composition according to any one of <1> to <5>, which is used for sealing an electronic component. <7> An electronic component device comprising: a support member, an electronic component placed on the support member, and a cured product of the curable composition according to <6> that seals the electronic component.

[0009] According to the present disclosure, it is possible to provide a curable composition that can suppress deterioration in the physical properties of the resulting cured product even when the curing time is shortened, and an electronic component device that includes this cured product.

[0010] 1 is a graph showing the measurement results of the flexural modulus E (GPa), flexural strength S (MPa), and breaking elongation ε (%) in Examples 1 and 2. (A) is a schematic plan view showing the electrode structure on one surface of the test piece used in the measurement of the volume resistivity according to the present example, and (B) is a schematic plan view showing the electrode structure on the other surface of the test piece used in the measurement of the volume resistivity according to the present example.

[0011] Hereinafter, embodiments of the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0012] In the present disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes as long as the purpose of the process is achieved. In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In numerical ranges described in stages in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another staged numerical range. In the present disclosure, each component may contain multiple corresponding substances. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, particles corresponding to each component may include multiple types of particles. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0013] <Curable Composition> The curable composition of the present disclosure includes a curable component. The curable composition is molded under conditions of a mold temperature of 175°C and a curing time of 150 seconds to obtain a molded product. The molded product is then post-cured at 175°C for 3 hours to obtain a cured product having a glass transition temperature Tg1. The cured product is then post-cured at 175°C for 5 hours to obtain a cured product having a glass transition temperature Tg2. The ratio Tg1 / Tg2 is 0.9 or more.

[0014] The curable composition of the present disclosure tends to maintain its glass transition temperature even when the post-curing time is shortened. This allows the mold shrinkage of the cured product, the warpage of a substrate provided with the cured product, and the adhesive strength to be favorably maintained even when the post-curing time is shortened. For example, while the post-curing conditions are typically 175 to 180°C for about 5 hours, shortening the post-curing time to about 3 hours at 175 to 180°C still prevents the aforementioned decrease in mold shrinkage, warpage, or adhesive strength.

[0015] In the curable composition of the present disclosure, Tg1 / Tg2 may be 0.95 or more, or may be 0.98 or more. The upper limit of Tg1 / Tg2 is not particularly limited. Tg1 and Tg2 are values ​​measured by the method described in the examples below.

[0016] (Curable Component) The curable composition of the present disclosure contains a curable component. Examples of the curable component include epoxy resins, phenolic resins, melamine resins, urea resins, unsaturated polyester resins, alkyd resins, urethane resins, vinyl resins, polyimide resins such as maleimide resins, polyamide resins, polyamideimide resins, silicone resins, and (meth)acrylic resins. The curable composition may contain only one type of curable component, or may contain two or more types of curable components.

[0017] The curable component may contain an epoxy resin. Specific examples of such epoxy resins include novolac epoxy resins obtained by epoxidizing a novolac resin obtained by condensing or co-condensing, under an acidic catalyst, at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, and propionaldehyde; triphenylmethane epoxy resins obtained by epoxidizing a triphenylmethane phenolic resin obtained by condensing or co-condensing, under an acidic catalyst, the above-mentioned phenolic compound with an aromatic aldehyde compound such as benzaldehyde and salicylaldehyde; and copolymers obtained by epoxidizing a novolac resin obtained by co-condensing, under an acidic catalyst, the above-mentioned phenolic compound, a naphthol compound, and an aldehyde compound. diphenylmethane-type epoxy resins which are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl-type epoxy resins which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins which are diglycidyl ethers of stilbene-based phenolic compounds; sulfur-containing epoxy resins which are diglycidyl ethers of bisphenol S, etc.; epoxy resins which are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester-type epoxy resins which are glycidyl esters of polycarboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine-type epoxy resins in which active hydrogen atoms bonded to nitrogen atoms of aniline, diaminodiphenylmethane, isocyanuric acid, etc. are substituted with glycidyl groups; and dicyclopentadiene-type epoxy resins obtained by epoxidizing a co-condensation resin of dicyclopentadiene and a phenolic compound.Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which are produced by epoxidizing an intramolecular olefin bond; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenolic resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenolic resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenolic resins; and dicyclopentadiene-modified phenolic resins, which are glycidyl ethers of dicyclopentadiene-modified phenolic resins. Examples of suitable epoxy resins include pentadiene-modified epoxy resins, cyclopentadiene-modified epoxy resins which are glycidyl ethers of cyclopentadiene-modified phenolic resins, polycyclic aromatic ring-modified epoxy resins which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins, naphthalene-type epoxy resins which are glycidyl ethers of naphthalene ring-containing phenolic resins, halogenated phenol novolac-type epoxy resins, hydroquinone-type epoxy resins, trimethylolpropane-type epoxy resins, linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid, and aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Epoxidized acrylic resins are also suitable as epoxy resins. These other epoxy resins may be used alone or in combination of two or more.

[0018] The epoxy resin preferably contains a biphenyl-type epoxy resin, and more preferably contains a biphenyl-type epoxy resin and a biphenylaralkyl-type epoxy resin.

[0019] When the curable component contains an epoxy resin, the content of the epoxy resin relative to the total amount of the curable component is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, and even more preferably 90% by mass to 100% by mass. When the epoxy resin contains a biphenyl-type epoxy resin or a biphenylaralkyl-type epoxy resin, the total content of the biphenyl-type epoxy resin and the biphenylaralkyl-type epoxy resin relative to the total amount of the epoxy resin is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, and even more preferably 90% by mass to 100% by mass.

[0020] The epoxy equivalent of the epoxy resin is not particularly limited. From the viewpoint of a balance of various properties such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq. When two or more epoxy resins are used in combination, the epoxy equivalent of the mixture of two or more epoxy resins preferably falls within the above range. In the present disclosure, the epoxy equivalent of the epoxy resin is a value measured by a method in accordance with JIS K 7236:2009.

[0021] (Curing Agent) When the curable composition of the present disclosure contains an epoxy resin, the curable composition may contain a curing agent. Examples of the curing agent include an amine-based curing agent, a phenol-based curing agent, an acid anhydride-based curing agent, and an active ester compound. One type of curing agent may be used alone, or two or more types may be used in combination.

[0022] Specific examples of the amine curing agent include aromatic amine curing agents having one aromatic ring, such as m-phenylenediamine, 2,3-diaminotoluene, 2,4-diaminotoluene, 2,4-diaminotoluene, 3,5-diethyl-2,4-diaminotoluene, 3,5-diethyl-2,6-diaminotoluene, and 2,4-diaminoanisole; 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 4,4'-methylenebis(2-ethylaniline), 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 3,4'-diaminodiphenylmethane; aromatic amine curing agents having two aromatic rings, such as 3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane and 3,3',5,5'-tetraethyl-4,4'-diaminodiphenylmethane; hydrolysis condensates of aromatic amine curing agents; aromatic amine curing agents having a polyether structure, such as polytetramethylene oxide di-p-aminobenzoate and polytetramethylene oxide di-para-aminobenzoate; condensates of aromatic diamines and epichlorohydrin; and reaction products of aromatic diamines and styrene.

[0023] Examples of acid anhydride curing agents include phthalic anhydride, maleic anhydride, methyl himic anhydride, himic anhydride, succinic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, chlorendic anhydride, methyltetrahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride maleic acid adduct, benzophenonetetracarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride having multiple alkyl groups obtained by Diels-Alder reaction from maleic anhydride and a diene compound, and various cyclic acid anhydrides such as dodecenyl succinic anhydride.

[0024] Examples of phenolic curing agents include polyhydric phenolic compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol; novolac phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with an aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde, under an acidic catalyst; and phenolic resins synthesized from the above phenolic compounds and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, or the like. terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above-mentioned phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above-mentioned phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde in the presence of an acid catalyst; and phenolic resins obtained by copolymerization of two or more of these.

[0025] The type of active ester compound is not particularly limited as long as it has one or more ester groups in the molecule that react with epoxy groups. Examples of active ester compounds include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified products of heterocyclic hydroxy compounds. Examples of active ester compounds include ester compounds obtained from at least one of an aliphatic carboxylic acid and an aromatic carboxylic acid and at least one of an aliphatic hydroxy compound and an aromatic hydroxy compound. Ester compounds containing an aliphatic compound as a polycondensation component tend to have excellent compatibility with epoxy resins due to the presence of an aliphatic chain. Ester compounds containing an aromatic compound as a polycondensation component tend to have excellent heat resistance due to the presence of an aromatic ring. Specific examples of active ester compounds include aromatic esters obtained by the condensation reaction of an aromatic carboxylic acid with a phenolic hydroxyl group. Among these, aromatic esters are preferred which are obtained by a condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group, using as raw materials a mixture of an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms on the aromatic ring of benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, diphenylsulfonic acid, etc. have been substituted with carboxy groups, a monohydric phenol in which one hydrogen atom on the aromatic ring has been substituted with a hydroxyl group, and a polyhydric phenol in which 2 to 4 hydrogen atoms on the aromatic ring have been substituted with hydroxyl groups. That is, aromatic esters having structural units derived from the aromatic carboxylic acid component, structural units derived from the monohydric phenol, and structural units derived from the polyhydric phenol are preferred.

[0026] When the curable composition contains a curing agent, the curing agent is preferably a phenol-based curing agent, and preferably contains a biphenylaralkyl-type phenolic resin, or preferably contains a biphenylaralkyl-type phenolic resin and a melamine-modified phenolic resin.

[0027] In the curable composition of the present disclosure, the content of the curing agent is not particularly limited, and the ratio of the equivalent number of the functional group of the curing agent (for example, an amino group in the case of an amine-based curing agent, a phenolic hydroxyl group in the case of a phenol-based curing agent, an acid anhydride group in the case of an acid anhydride-based curing agent, or an ester group in the case of an active ester compound) to the equivalent number of the epoxy resin (equivalent number of curing agent / equivalent number of epoxy resin) is preferably set in the range of 0.6 to 1.4, more preferably in the range of 0.7 to 1.3, and even more preferably in the range of 0.8 to 1.2.

[0028] The curable composition of the present disclosure may further contain an inorganic filler. The type of inorganic filler is not particularly limited. Specific examples include inorganic materials such as silica (e.g., fused silica, crystalline silica), glass, alumina, aluminum nitride, boron nitride, talc, clay, mica, titanium oxide, calcium titanate, strontium titanate, and barium titanate. An inorganic filler having a flame-retardant effect may also be used. Examples of inorganic fillers having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides (e.g., magnesium-zinc composite hydroxide), and zinc borate.

[0029] Among inorganic fillers, silica such as fused silica is preferred from the viewpoint of reducing the linear expansion coefficient, and alumina is preferred from the viewpoint of high thermal conductivity. Boron nitride is preferred from the viewpoint of reducing the dielectric loss tangent. One type of inorganic filler may be used alone, or two or more types may be used in combination. The inorganic filler may be in the form of powder, beads obtained by spheroidizing powder, fiber, etc.

[0030] The average particle diameter of the inorganic filler is not particularly limited. For example, the volume average particle diameter is preferably 0.2 μm to 50 μm, and more preferably 0.5 μm to 30 μm. When the volume average particle diameter is 0.2 μm or more, an increase in viscosity of the curable composition tends to be further suppressed. When the volume average particle diameter is 50 μm or less, the ability to fill narrow gaps tends to be further improved. The volume average particle diameter of the inorganic filler refers to the value measured as the volume average particle diameter (D50) using a laser diffraction scattering particle size distribution measuring device.

[0031] The volume average particle diameter of the inorganic filler in the curable composition or its cured product can be measured by a known method. For example, the inorganic filler is extracted from the curable composition or cured product using an organic solvent, nitric acid, aqua regia, or the like, and then thoroughly dispersed using an ultrasonic disperser or the like to prepare a dispersion. Using this dispersion, the volume average particle diameter of the inorganic filler can be measured from the volume-based particle size distribution measured using a laser diffraction / scattering particle size distribution analyzer. Alternatively, the cured product can be embedded in a transparent epoxy resin or the like, polished, and the resulting cross-section observed using a scanning electron microscope to obtain the volume average particle size distribution. Furthermore, the volume average particle diameter of the inorganic filler can also be measured by continuously observing two-dimensional cross-sections of the cured product using an FIB device (focused ion beam SEM) or the like, followed by three-dimensional structural analysis.

[0032] From the viewpoint of the flowability of the curable composition, the particle shape of the inorganic filler is preferably spherical rather than angular, and the particle size distribution of the inorganic filler is preferably wide.

[0033] The content of the inorganic filler is not particularly limited and may be appropriately set depending on the application of the curable composition. For example, the content of the inorganic filler may be 50% by volume to 90% by volume, or 60% by volume to 85% by volume, based on the total amount of the curable composition.

[0034] (Mold Release Agent) The curable composition of the present disclosure may contain a mold release agent from the viewpoint of obtaining good mold releasability during molding. There are no particular limitations on the mold release agent, and conventionally known mold release agents can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. One type of mold release agent may be used alone, or two or more types may be used in combination.

[0035] When the curable composition of the present disclosure contains a release agent, the content of the release agent is preferably 0.1 parts by mass to 20 parts by mass, more preferably 0.5 parts by mass to 10 parts by mass, and even more preferably 1 part by mass to 5 parts by mass, per 100 parts by mass of the curable component. When the amount of the release agent is 1 part by mass or more per 100 parts by mass of the curable component, sufficient release properties tend to be obtained. When the amount is 5 parts by mass or less, better adhesion tends to be obtained. The content of the release agent is preferably 0.01 parts by mass to 10 parts by mass, more preferably 0.1 parts by mass to 5 parts by mass, per 100 parts by mass of the epoxy resin and the curing agent combined. When the amount of the release agent is 0.01 parts by mass or more per 100 parts by mass of the epoxy resin and the curing agent combined, sufficient release properties tend to be obtained. When the amount is 10 parts by mass or less, better adhesion tends to be obtained.

[0036] (Curing Accelerator) The curable composition of the present disclosure may contain a curing accelerator as needed. The type of curing accelerator is not particularly limited and can be selected depending on the type of curable component, the desired properties of the curable composition, and the like.

[0037] Examples of the curing accelerator include diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, and 2-heptadecylimidazoline. cyclic amidine compounds such as benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenol novolak salts of the cyclic amidine compounds or their derivatives; quinone compounds such as nyl-1,4-benzoquinone, and compounds having intramolecular polarization obtained by adding a compound having a π bond, such as diazophenylmethane; cyclic amidinium compounds such as the tetraphenylborate salt of DBU, the tetraphenylborate salt of DBN, the tetraphenylborate salt of 2-ethyl-4-methylimidazole, and the tetraphenylborate salt of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide;Organic phosphines such as primary phosphines such as ethylphosphine and phenylphosphine, secondary phosphines such as dimethylphosphine and diphenylphosphine, and tertiary phosphines such as triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkyl alkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, and tris(benzyl)phosphine; phosphine compounds such as complexes of the organic phosphines with organic borons; and the organic phosphines or the phosphine compounds, which may be combined with maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone. quinone compounds such as 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and anthraquinone, and compounds having intramolecular polarization obtained by adding a compound having a π bond such as diazophenylmethane; a compound having intramolecular polarization, which is obtained by reacting a halogenated phenol compound such as 1-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, or 4-bromo-4'-hydroxybiphenyl with the halogenated phenol compound, followed by a dehydrohalogenation step;Examples of the curing accelerator include tetra-substituted phosphonium compounds such as tetraphenylphosphonium, tetraphenylborate salts of tetra-substituted phosphonium such as tetraphenylphosphonium tetra-p-tolylborate, and salts of tetra-substituted phosphonium with phenolic compounds; salts of tetraalkylphosphonium with partial hydrolysates of aromatic carboxylic acid anhydrides; phosphobetaine compounds; and adducts of phosphonium compounds with silane compounds. One type of curing accelerator may be used alone, or two or more types may be used in combination.

[0038] When the curable composition contains a curing accelerator, the amount thereof is preferably 0.1 to 40 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and curing agent). When the amount of the curing accelerator is 0.1 parts by mass or more per 100 parts by mass of the curable component (or the total of the epoxy resin and curing agent), the composition tends to cure well in a short time. When the amount of the curing accelerator is 40 parts by mass or less per 100 parts by mass of the curable component (or the total of the epoxy resin and curing agent), the curing speed is not too fast, and a good molded product tends to be obtained.

[0039] (Stress Relaxant) The curable composition of the present disclosure may contain a stress relaxation agent. By including a stress relaxation agent, warpage of the package and the occurrence of package cracks can be further reduced. Examples of the stress relaxation agent include commonly used known stress relaxation agents (flexibilizers). Specific examples include thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based elastomers; indene-styrene-coumarone copolymers; organic phosphorus compounds such as triphenylphosphine oxide and phosphate esters; rubber particles such as NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone powder; and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. One type of stress relaxation agent may be used alone, or two or more types may be used in combination. Examples of silicone-based stress relaxation agents include those having an epoxy group, those having an amino group, and those modified with polyether, and silicone compounds such as silicone compounds having an epoxy group and polyether-based silicone compounds are more preferred.

[0040] When the curable composition contains a stress relaxation agent, the amount thereof is, for example, preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and the curing agent).

[0041] From the viewpoint of dielectric loss tangent, the content of the silicone-based stress relaxation agent is preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 7% by mass or less, particularly preferably 5% by mass or less, and extremely preferably 0.5% by mass or less, relative to the entire curable composition. The lower limit of the content of the silicone-based stress relaxation agent is not particularly limited, and may be 0% by mass or 0.1% by mass.

[0042] [Various Additives] In addition to the components described above, the curable composition of the present disclosure may contain various additives such as a coupling agent, an ion trapping agent, a flame retardant, a colorant, and an ultraviolet absorber, as exemplified below. The curable composition of the present disclosure may contain various additives known in the technical field as needed, in addition to the additives exemplified below.

[0043] (Coupling Agent) The curable composition of the present disclosure may contain a coupling agent. From the viewpoint of improving the adhesion between the curable component (or the epoxy resin and the curing agent) and the inorganic filler, the curable composition preferably contains a coupling agent. Examples of the coupling agent include known coupling agents such as silane-based compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane, and disilazane, titanium-based compounds, aluminum chelate-based compounds, and aluminum / zirconium-based compounds.

[0044] When the curable composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass, per 100 parts by mass of the inorganic filler. When the amount of the coupling agent is 0.05 parts by mass or more per 100 parts by mass of the inorganic filler, adhesiveness tends to be further improved. When the amount of the coupling agent is 5 parts by mass or less per 100 parts by mass of the inorganic filler, moldability of the package tends to be further improved.

[0045] (Ion trapping agent) The curable composition of the present disclosure may contain an ion trapping agent. When the curable composition is used to seal electronic components, it is preferable that the curable composition contain an ion trapping agent from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device including the sealed electronic components. The ion trapping agent is not particularly limited, and conventionally known ion trapping agents can be used. Specific examples include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. The ion trapping agents may be used alone or in combination of two or more. Among these, hydrotalcites represented by the following general formula (A) are preferred.

[0046] Mg （１－Ｘ） Al Ｘ (OH) ２ (CO ３ ) Ｘ／２ ・mH ２ O ……(A) (0<X≦0.5, m is a positive number)

[0047] When the curable composition contains an ion trapping agent, the content thereof is not particularly limited as long as it is an amount sufficient to trap ions such as halogen ions. For example, the content of the ion trapping agent is preferably 0.1 to 30 parts by mass, and more preferably 0.3 to 1 part by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and the curing agent).

[0048] (Flame Retardant) The curable composition of the present disclosure may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specific examples include organic or inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom, or a phosphorus atom, and metal hydroxides. The flame retardants may be used alone or in combination of two or more.

[0049] When the curable composition contains a flame retardant, the amount thereof is not particularly limited as long as it is an amount sufficient to obtain the desired flame retardant effect. For example, the amount of the flame retardant is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and the curing agent).

[0050] (Colorant) The curable composition of the present disclosure may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant can be appropriately selected depending on the purpose, etc. One type of colorant may be used alone, or two or more types may be used in combination.

[0051] (Solvent) The curable composition of the present disclosure may contain a solvent such as water or an organic solvent from the viewpoint of reducing viscosity. In particular, when an epoxy resin and a curing agent that are solid at 25°C are used, it is preferable to blend a solvent in order to obtain a curable composition that is liquid at 25°C. The organic solvent is not particularly limited, and examples thereof include alcohol-based solvents such as methyl alcohol, ethyl alcohol, propyl alcohol, and butyl alcohol; ketone-based solvents such as acetone and methyl ethyl ketone; glycol ether-based solvents such as ethylene glycol ethyl ether, ethylene glycol methyl ether, ethylene glycol butyl ether, propylene glycol methyl ether, dipropylene glycol methyl ether, propylene glycol ethyl ether, and propylene glycol methyl ether acetate; lactone-based solvents such as γ-butyrolactone, δ-valerolactone, and ε-caprolactone; amide-based solvents such as dimethylacetamide and dimethylformamide; and aromatic solvents such as toluene and xylene. These organic solvents may be used alone or in combination of two or more. Among these, organic solvents having a boiling point of 170° C. or higher are preferred from the viewpoint of avoiding the formation of bubbles due to sudden evaporation when the curable composition, which is liquid at 25° C., is cured.

[0052] The content of volatile components including organic solvents and the like is not particularly limited as long as it is to an extent that bubbles are not formed when the liquid curable composition is cured, and is preferably 5% by mass or less, more preferably 1% by mass or less, and even more preferably 0.1% by mass or less, based on the total mass of the liquid curable composition. In the present disclosure, the volatile content of the curable composition is calculated by heating the curable composition at 180°C for 30 minutes and based on the weight difference before and after heating.

[0053] (Method for Preparing Curable Composition) The method for preparing the curable composition is not particularly limited. When the curable composition is solid at 25°C, a common method includes thoroughly mixing predetermined amounts of components using a mixer or the like, melt-kneading the mixture using a mixing roll, extruder, or the like, cooling, and pulverizing. More specifically, a method includes stirring and mixing predetermined amounts of the components, kneading the mixture using a kneader, roll, extruder, or the like that has been preheated to 70°C to 140°C, cooling, and pulverizing. When the curable composition is liquid at 25°C, the composition can be obtained, for example, by stirring, melting, mixing, dispersing, or the like predetermined amounts of the components, either collectively or separately, while optionally applying a heat treatment. The apparatus for mixing, stirring, dispersing, or the like of the components is not particularly limited, and examples thereof include a mortar and pestle mill equipped with a stirrer, a heating device, or the like, a three-roll mill, a ball mill, a planetary mixer, a bead mill, and the like.

[0054] (Use of Curable Composition) The use of the curable composition is not particularly limited. For example, the curable composition may be used for sealing electronic components, for producing adhesive films such as dicing films and die bonding films, or for producing laminates such as copper-clad laminates.

[0055] <Electronic Component Device> When the curable composition of the present disclosure is used to seal an electronic component, the electronic component device of the present disclosure includes a support member, an electronic component placed on the support member, and a cured product of the curable composition sealing the electronic component. Examples of the electronic component device include a support member such as a lead frame, a pre-wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate, on which electronic components (active elements such as semiconductor chips, transistors, diodes, and thyristors, passive elements such as capacitors, resistors, and coils, antennas, etc.) are mounted, and the resulting electronic component region is sealed with the curable composition (e.g., a high-frequency device).

[0056] In the electronic component device of the present disclosure, if necessary, another electronic component may be disposed on the surface of the support member opposite to the surface on which the electronic component is disposed. The other electronic component may be sealed with the curable composition, another resin composition, or may not be sealed.

[0057] (Method for manufacturing an electronic component device) The method for manufacturing an electronic component device of the present disclosure includes a step of placing an electronic component on a support member and a step of encapsulating the electronic component with the curable composition described above. The method for carrying out each of the above steps is not particularly limited, and can be carried out by a general method. Furthermore, the types of support member and electronic component used in manufacturing the electronic component device are not particularly limited, and support members and electronic components commonly used in manufacturing electronic component devices can be used.

[0058] Methods for encapsulating electronic components using a curable composition that is solid at 25°C include low-pressure transfer molding, injection molding, and compression molding. Among these, low-pressure transfer molding is common. When using a curable composition that is liquid at 25°C, a post-insertion method may be used in which, after connecting the electronic component and a support member, the curable composition penetrates into the gap between the electronic component and the support member by utilizing capillary action. Alternatively, a pre-application method may be used in which the curable composition is first applied to the support member, and then, when connecting the electronic component to the support member by thermocompression bonding, the connection of the electronic component and the support member and the curing reaction of the curable composition are simultaneously carried out.

[0059] The present disclosure will be specifically described below using examples, but the scope of the present disclosure is not limited to these examples.

[0060] The components shown below were mixed in the blending ratios (parts by mass) shown in Table 1 to prepare curable compositions of Examples and Comparative Examples.

[0061] Epoxy resin 1: biphenyl-type epoxy resin (epoxy equivalent weight 192 g / eq, among epoxy resins represented by general formula (II), R ８ When the oxygen atom is substituted at the 4 and 4' positions, the 3, 3', 5 and 5' positions are methyl groups, and the other R ８ is a hydrogen atom.)

[0062]

[0063] Epoxy resin 2: a mixture of biphenyl aralkyl type epoxy resin and biphenyl type epoxy resin (mixing mass ratio 8:2, epoxy equivalent 237 g / eq) Epoxy resin 3: a biphenyl type epoxy resin, epoxy equivalent 192 g / eq (epoxy equivalent 192 g / eq, among the epoxy resins represented by general formula (II), R ８ When the oxygen atom is substituted at the 4 and 4' positions, the 3, 3', 5 and 5' positions are methyl groups, and the other R ８ is a hydrogen atom.)

[0064] Curing agent 1: melamine-modified phenolic resin, reactive group equivalent 120 g / eq. Curing agent 2: biphenyl aralkyl phenolic resin (high molecular weight resin), hydroxyl group equivalent 199 g / eq. Curing agent 3: biphenyl aralkyl phenolic resin (low molecular weight resin), hydroxyl group equivalent 199 g / eq.

[0065] Curing accelerator 1: 2-phenyl-4-methyl-5-hydroxymethylimidazole

[0066] Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane Coupling agent 2: 3-glycidoxypropyltrimethoxysilane Coupling agent 3: 3-methacryloxypropyltrimethoxysilane

[0067] Inorganic filler 1: silica particles, average particle diameter 12 nm Inorganic filler 2: silica particles, average particle diameter 6.6 μm Inorganic filler 3: silica particles, average particle diameter 0.5 μm Inorganic filler 4: aluminum particles, average particle diameter 10.85 μm Inorganic filler 5: silica particles, average particle diameter 8.2 μm Inorganic filler 6: silica particles, average particle diameter 0.5 μm

[0068] The average particle size of each inorganic filler was a value obtained by the following measurement. Specifically, the inorganic filler was first added to a dispersion medium (water) in an amount ranging from 0.01% by mass to 0.1% by mass, and the mixture was dispersed in a bath-type ultrasonic cleaner for 5 minutes. Five milliliters of the resulting dispersion was poured into a cell, and the particle size distribution was measured at 25°C using a laser diffraction / scattering particle size distribution analyzer (HORIBA, Ltd., LA920). The particle size at an integrated value of 50% (volume basis) in the resulting particle size distribution was taken as the volume-average particle size.

[0069]

[0070] The curable compositions prepared in the examples were used to measure the following physical properties, and the results are shown in Tables 2 to 6.

[0071] (Glass Transition Temperature) The curable composition was molded using a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds, followed by post-curing at 175°C for 1 to 5 hours to produce a cured product. The cured product had a rectangular shape with a short side of 5.1 mm, a long side of 20 mm, and a thickness of 2 mm. The linear expansion coefficient was measured using a thermomechanical analyzer (e.g., TMA / SS6100 manufactured by Seiko Instruments Inc.). The test load was 98 mN, and the heating rate was 5°C / min. The temperature at the intersection of the tangent line at 10°C to 30°C and the tangent line at 200°C to 220°C was taken as the glass transition temperature (°C) of the cured product. Furthermore, the glass transition temperature of the cured product after post-curing for 3 hours was taken as Tg1, and the glass transition temperature of the cured product after post-curing for 5 hours was taken as Tg2, and the ratio Tg1 / Tg2 was calculated. The results are shown in Table 2.

[0072]

[0073] As shown in Table 2, post-curing improved the glass transition temperature of the cured product. When the post-curing time was 2 hours or more, the glass transition temperature of the cured product remained at the same level, confirming that the same level of glass transition temperature could be maintained even when the post-curing time was shortened.

[0074] (Warpage) A curable composition was transfer molded onto an Ag-plated Cu substrate (Spot AgCu) or PPF (a Cu-cored substrate plated with Ni-Pd and flash-treated with Au) at a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds, followed by post-curing at 175°C for 1 to 5 hours to prepare a sample for measuring warpage. The sample had a short side of 50 mm, a long side of 50 mm, and a thickness of 0.7 mm. The warpage (μm) of the sample was determined using Akrometrix. The results are shown in Table 3.

[0075]

[0076] As shown in Table 3, the amount of warpage was negative in all samples, and the substrate warped toward the cured product, a phenomenon known as smile warpage. Furthermore, the same warpage performance was obtained even when the post-curing time was changed; for example, the warpage performance was similar even when the post-curing time was changed from 5 hours to 3 hours. It was confirmed that Example 2 tended to suppress warpage more than Example 1.

[0077] (Molding Shrinkage) The curable composition was molded using a transfer molding machine under conditions of a molding temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds to obtain a plate-shaped molded product (length 127 mm, width 12.7 mm, thickness 6.4 mm). The mold shrinkage (%) of the molded product (Molding Shrinkage A in Table 4) was calculated using the previously measured mold cavity length D at 25°C and the length d of the molded product at room temperature (25°C) according to the following formula. The results are shown in Table 4. Mold shrinkage (%) = ((D - d) / D) × 100. The plate-shaped molded product was then post-cured at 175°C for 1 to 5 hours to obtain a plate-shaped cured product. The mold shrinkage (%) of the cured product (Molding Shrinkage B in Table 4, 1 h to 5 h) was then calculated based on the above formula. The results are shown in Table 4.

[0078]

[0079] As shown in Table 4, the same mold shrinkage rate was obtained even when the post-curing time was changed. For example, even when the post-curing time was changed from 5 hours to 3 hours, the mold shrinkage rate was almost the same.

[0080] (Room Temperature Bending Test) The curable composition was loaded into a transfer molding machine and molded under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds to obtain a molded product. Separately, a molded product was post-cured at 175°C for 1 to 5 hours. This produced rectangular parallelepiped test pieces (molded products) measuring 127mm x 12.7mm x 4mm, and rectangular parallelepiped test pieces (cured products post-cured for 1 to 5 hours). Using a Tensilon (A&D Co., Ltd.) as the evaluation device, a three-point support bending test in accordance with JIS-K-7171 (2016) was performed at room temperature (25°C), and the flexural modulus E, flexural strength S, and elongation at break ε of the test pieces were calculated using the following formulas.

[0081] The flexural modulus E (GPa), flexural strength S (MPa), and breaking elongation ε (%) are defined by the following formula. In the formula, P is the load cell value (N), y is the displacement (mm), l is the span = 64 mm, w is the test piece width = 12.7 mm, and h is the test piece thickness = 4 mm. The subscript max indicates the maximum value. For the flexural modulus E, the value calculated using the formula described below was converted to GPa. The results are shown in Figure 1.

[0082]

[0083]

[0084]

[0085] As shown in FIG. 1, even when the post-curing time was changed, the same flexural modulus E (GPa), flexural strength S (MPa), and elongation at break ε (%) were obtained.

[0086] (Spiral flow) The spiral flow was measured using a spiral flow measurement mold conforming to EMMI-1-66, where the curable composition was molded under conditions of a mold temperature of 180°C, a molding pressure of 6.9 MPa (70 kgf), and a curing time of 150 seconds, and the flow distance (cm) was determined. In Example 1, the flow distance was 223 cm, and in Example 2, the flow distance was 204 cm.

[0087] (Adhesion Strength Measurement) The adhesion strength of the curable composition on a Cu substrate or a PPF (pre-plated frame) (referred to as Adhesion Strength 1 and Adhesion Strength 2, respectively) was evaluated as follows. For the measurement of adhesion strength, a sample was prepared by first molding the curable composition onto a Cu substrate or a PPF using a transfer mold, curing the composition at 175°C for a curing time of 150 seconds, and then post-curing the composition at 175°C for 1 to 5 hours. The cured sample had a short side of 3.0 mm, a long side of 3.5 mm, and a thickness of 2.9 mm. The prepared samples (samples before post-curing and samples post-cured for 1 to 5 hours) were subjected to a shear strength test at room temperature (e.g., 25°C) using a bond tester (e.g., Nordson, product name 4000 Optima) in which a tool of the device was applied to the cured sample. Alternatively, similarly prepared samples (samples before post-curing and samples post-cured for 1 to 5 hours) were heated and humidified at 85°C and 85% RH for 168 hours, and then measured for shear strength using a bond tester (e.g., Nordson, product name 4000 Optima) in which the tool of the device was pressed against the cured product at 260°C. The results are shown in Table 5.

[0088]

[0089] As shown in Table 5, the same adhesive strength was obtained even when the post-curing time was changed. For example, the adhesive strength was the same even when the post-curing time was changed from 5 hours to 3 hours.

[0090] (Volume Resistivity) Using a mold capable of molding disc-shaped test specimens with a diameter of 100 mm and a thickness of 3 mm, the curable composition obtained above was molded using a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds to obtain a molded product. The molded product was post-cured at 175°C for 1 to 5 hours to prepare a test specimen. Using a mask seal and conductive silver paint, a surface electrode consisting of an inner circular portion 2 and an outer circular portion 4 was formed on one side of the obtained test specimen 10 as shown in Figure 2(A). Similarly, a back electrode 6 as shown in Figure 2(B) was formed on the other side of the test specimen 10. The test specimen 10 with the electrode formed thereon was placed in an environment at room temperature (25°C in Table 6) or 150°C, and the value of the volume resistivity meter was read 1 minute after application of a voltage of 500 V. The volume resistivity of the molded product before post-curing and the cured product after 1 to 5 hours of post-curing was calculated using the following formula (1): Volume Resistivity (Ω·cm) = (πd ２ / 4t) × (Rv) Formula (1) d: outer diameter of inner circle of surface electrode = 5.0 (cm) t: thickness of test piece = 0.3 (cm) Rv: volume resistance value (MΩ) π: circumference constant = 3.14

[0091] (Volume Resistivity After Moisture Absorption) The same test specimens as those used in the above-mentioned volume resistivity measurements were used, and these test specimens were treated for 20 hours under pressure cooker test conditions (2 atmospheres (0.2 MPa) / 121°C / 100% RH). After the treatment, water droplets were wiped off the surface of the test specimen, which was then placed in an environment at 25°C, and the value of the volume resistivity meter was read 1 minute after a voltage of 500 V was applied. The volume resistivity after moisture absorption (25°C in Table 6) of the molded product before post-curing and the cured product after 1 to 5 hours of post-curing was calculated using the above formula (1).

[0092]

[0093] As shown in Table 6, the same volume resistivity was obtained even when the post-curing time was changed.

[0094] All publications, patent applications, and technical standards mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent application, or technical standard was specifically and individually indicated to be incorporated by reference.

Claims

A curable composition comprising a curable component, The curable composition is molded under conditions of a mold temperature of 175°C and a curing time of 150 seconds, and the molded product is post-cured under conditions of 175°C for 3 hours to obtain a cured product having a glass transition temperature Tg1 and a glass transition temperature Tg2, wherein Tg1 / Tg2 is 0.9 or more. 　 The curable composition of claim 1 further comprising an inorganic filler. 　 The curable composition of claim 1 or claim 2, wherein the curable component comprises an epoxy resin, and the curable composition further comprises a curing agent. 　 The curable composition according to claim 3 , wherein the epoxy resin comprises a biphenyl-type epoxy resin. 　 The curable composition according to any one of claims 1 to 4, further comprising a curing accelerator, wherein the curing accelerator comprises a cyclic amidine compound. 　 The curable composition according to any one of claims 1 to 5, which is used for sealing electronic parts. 　 An electronic component device comprising: a support member; an electronic component placed on the support member; and a cured product of the curable composition according to claim 6 that seals the electronic component.

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