Display device and method for manufacturing same

Abstract

This display device comprises: a display panel including at least one pixel; a printed circuit board electrically connected to the pixel; a heat dissipation layer including graphite and disposed between the display panel and the printed circuit; and a side cover member including resin and covering a side surface of the heat dissipation layer.

Description

Display device and method for manufacturing the same

[0001] The present invention relates to a display device and a method for manufacturing the same. More particularly, the present invention relates to a display device including a multi-functional member that performs heat dissipation, electromagnetic interference (EMI) shielding, and electrostatic discharge (ESD) shielding.

[0002] Typically, a display device includes a display panel and a display panel driver. The display panel displays an image based on an input image and includes a plurality of gate lines, a plurality of data lines, and a plurality of pixels. The display panel driver includes a gate driver that provides a gate signal to the plurality of gate lines, a data driver that provides a data voltage to the data lines, and a drive control unit that controls the operations of the gate driver and the data driver.

[0003] The display device may generate heat during operation. If the display device is not properly dissipated, it may overheat and be damaged. Typically, in the case of OLED self-luminous displays, the current for light emission is transmitted to the organic EL diode, generating heat. This heat causes deterioration of the EL material, such as burn-in, and reduces image quality. Furthermore, if this heat comes into contact with the human body on the front of the display, it may cause damage to the human body, such as burns.

[0004] Additionally, the display device may generate electromagnetic waves during operation. If the electromagnetic waves are not properly shielded and the user is exposed to them for a long period of time, there is a risk of health problems occurring. Furthermore, the display device may generate static electricity during operation. If the static electricity is not properly shielded, the display device may malfunction or be damaged.

[0005] One object of the present invention is to provide a display device including a multi-functional member having improved thermal conductivity.

[0006] Another object of the present invention is to provide a method for manufacturing the display device.

[0007] However, the purpose of the present invention is not limited to the above-described purposes, and may be expanded in various ways without departing from the spirit and scope of the present invention.

[0008] In order to achieve the above-described object of the present invention, a display device according to an embodiment of the present invention includes a display panel, a printed circuit board, a heat dissipation layer, a cover layer, and a side cover member. The display panel includes at least one pixel. The printed circuit board is disposed below the display panel and is electrically connected to the pixel. The heat dissipation layer includes graphite and is disposed between the display panel and the printed circuit board. The cover layer is disposed on one surface of the heat dissipation layer facing the printed circuit board. The side cover member covers a side surface of the heat dissipation layer.

[0009] In one embodiment, the cover layer may comprise the same material as the side cover member.

[0010] In one embodiment, the cover layer may comprise a different material from the side cover member.

[0011] In one embodiment, the cover layer may comprise at least one material selected from the group of resins consisting of acrylic, epoxy, polyurethane, and silicone.

[0012] In one embodiment, the cover layer may further include at least one material selected from a filler group consisting of boron nitride (BN), graphite powder, graphene, carbon fiber, and carbon nanotube. The mass ratio of the resin group included in the cover layer may be about 30 wt% to about 90 wt%. The mass ratio of the filler group included in the cover layer may be about 10 wt% to about 70 wt%.

[0013] In one embodiment, the average thickness of the heat dissipation layer may be greater than the average thickness of the cover layer. The average thickness of the heat dissipation layer may be from about 10 μm to about 1000 μm. The average thickness of the cover layer may be from about 5 μm to about 50 μm.

[0014] In one embodiment, the thermal conductivity of the heat dissipation layer may be about 100 W / (m·K) to 1700 W / (m·K).

[0015] In one embodiment, the cover layer is adhered to the one surface of the heat dissipation layer and may include polyethylene terephthalate (PET).

[0016] In one embodiment, the cover layer may have a contact hole defined therein that penetrates the cover layer in the thickness direction. The heat dissipation layer may be connected to the printed circuit board through the contact hole.

[0017] In one embodiment, the display device may further include an adhesive layer disposed between the display panel and the heat dissipation layer. The average thickness of the adhesive layer may be greater than the average thickness of the cover layer and less than the average thickness of the heat dissipation layer. The adhesive layer may bond the heat dissipation layer and the display panel to each other and may include polyethylene terephthalate.

[0018] In order to achieve the above-described object of the present invention, a display device according to an embodiment of the present invention includes a display panel, a printed circuit board, a heat dissipation layer, a first cover layer, and a second cover layer. The display panel includes at least one pixel. The printed circuit board is disposed below the display panel and is electrically connected to the pixel. The heat dissipation layer includes graphite and is disposed between the display panel and the printed circuit board. The first cover layer is disposed on one side of the heat dissipation layer facing the printed circuit board and extends from the one side to cover a portion of a side surface of the heat dissipation layer. The second cover layer is disposed on the other side of the heat dissipation layer opposite to the one side, and extends from the other side to contact the first cover layer.

[0019] In one embodiment, the first cover layer may be adhered to the one surface of the heat dissipation layer and may include polyethylene terephthalate. The second cover layer may bond the heat dissipation layer and the display panel to each other on the other surface of the heat dissipation layer and may include polyethylene terephthalate.

[0020] In one embodiment, a contact hole may be defined in the first cover layer that penetrates the first cover layer in the thickness direction. The heat dissipation layer may be connected to the printed circuit board through the contact hole.

[0021] In one embodiment, the first cover layer and the second cover layer may be formed integrally to define a single metal coating layer that surrounds the one side, the other side, and the side surface of the heat dissipation layer. The average thickness of the metal coating layer may be about 1 μm to about 20 μm.

[0022] In order to achieve another object of the present invention described above, a method for manufacturing a display device according to an embodiment of the present invention includes the steps of forming a cover layer on one side of a heat dissipation layer including graphite, the step of forming an adhesive layer on the other side of the heat dissipation layer opposite to the one side, and the step of covering a side surface of the heat dissipation layer using a polymer material or a metal material.

[0023] In one embodiment, the step of forming the cover layer on the one side of the heat dissipation layer may include the steps of unfolding a rolled graphite sheet, coating a material for forming the cover layer on the one side of the graphite sheet, and cutting the graphite sheet and the coated cover layer. In the step of covering the side surface of the heat dissipation layer, the side surface of the heat dissipation layer may be surrounded by a side cover member.

[0024] In one embodiment, the step of forming the cover layer on the one side of the heat dissipation layer may include the steps of unfolding a rolled graphite sheet, cutting the graphite sheet to form the heat dissipation layer, and coating a material for forming the cover layer on the one side of the heat dissipation layer. In the step of covering the side surface of the heat dissipation layer, the side surface of the heat dissipation layer may be surrounded by a side cover member.

[0025] In one embodiment, the step of covering the side surface of the heat dissipation layer may include the step of tensioning the cover layer from the one side of the heat dissipation layer to the side surface, the step of forming the adhesive layer from the other side of the heat dissipation layer to the side surface, and the step of contacting the cover layer and the adhesive layer with each other so that the cover layer and the adhesive layer seal the side surface of the heat dissipation layer.

[0026] In one embodiment, the step of forming the cover layer on the one side of the heat dissipation layer may include the steps of unfolding a rolled graphite sheet, cutting the graphite sheet to form the heat dissipation layer, and plating the heat dissipation layer so that the cover layer surrounds all of the one side, the other side, and the side surface of the heat dissipation layer. In the step of forming the adhesive layer on the other side of the heat dissipation layer opposite to the one side, the adhesive layer may be in contact with the cover layer surrounding the heat dissipation layer.

[0027] In one embodiment, the method for manufacturing the display device may further include a step of forming a contact hole penetrating the cover layer in the thickness direction and a step of electrically connecting the cover layer and a printed circuit board through the contact hole. The cover layer may include at least one material selected from the group of resins consisting of acrylic, epoxy, polyurethane, polyethylene terephthalate, and silicone.

[0028] A display device according to embodiments of the present invention may include a cover layer for covering a heat dissipation layer comprising graphite. Accordingly, the phenomenon of impurities such as particles from the surface of the heat dissipation layer being introduced into the display panel or printed circuit board can be prevented. In addition, since the display device includes a multi-functional member including the heat dissipation layer and the cover layer, the display device can easily perform the functions of electromagnetic wave shielding and static electricity shielding.

[0029] In the method for manufacturing a display device according to embodiments of the present invention, since the cover layer covering the heat dissipation layer is formed by coating, attaching, or plating the heat dissipation layer, a separate lamination process involving heat is not required to protect the heat dissipation layer, and thus, defects occurring in the display device can be reduced. Accordingly, the reliability of the display device can be improved.

[0030] However, the effects of the present invention are not limited to the effects described above, and may be expanded in various ways without departing from the spirit and scope of the present invention.

[0031] FIG. 1 is a plan view showing a display device according to one embodiment of the present invention.

[0032] Fig. 2 is a cross-sectional view showing the unfolded state of the display device of Fig. 1 taken along line I-I'.

[0033] Fig. 3 is a cross-sectional view showing a bent state of the display device of Fig. 1 taken along line I-I'.

[0034] Fig. 4 is a cross-sectional view showing a cross-section of a part of the display panel of Fig. 1.

[0035] Fig. 5 is a cross-sectional view showing a cross-section along line II-II' of a multi-function member included in the display device of Fig. 1.

[0036] FIGS. 6 to 11 are drawings for explaining an example of a method for manufacturing the display device of FIG. 1.

[0037] FIG. 12 and FIG. 13 are drawings for explaining another example of a method for manufacturing the display device of FIG. 11.

[0038] Fig. 14 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention.

[0039] Fig. 15 is a cross-sectional view showing a cross-section of a multi-function member and circuit board included in the display device of Fig. 14.

[0040] Figures 16 to 18 are drawings for explaining a method of manufacturing the display device of Figure 14.

[0041] Fig. 19 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention.

[0042] Fig. 20 is a cross-sectional view showing a cross-section of a multi-function member included in the display device of Fig. 19.

[0043] Fig. 21 is a drawing for explaining a method of manufacturing the display device of Fig. 19.

[0044] Fig. 22 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention.

[0045] Fig. 23 is a cross-sectional view showing a cross-section of a multi-function member and a circuit board included in the display device of Fig. 22.

[0046] Fig. 24 is a drawing for explaining a method of manufacturing the display device of Fig. 22.

[0047] Fig. 25 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention.

[0048] Fig. 26 is a cross-sectional view showing a cross-section of a multi-function member included in the display device of Fig. 25.

[0049] With respect to the embodiments of the present invention disclosed in the text, specific structural and functional descriptions are merely illustrative for the purpose of explaining the embodiments of the present invention, and the embodiments of the present invention may be implemented in various forms and should not be construed as being limited to the embodiments described in the text.

[0050] The present invention is susceptible to various modifications and takes various forms. Specific embodiments are illustrated in the drawings and described in detail herein. However, this is not intended to limit the present invention to specific disclosed forms, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention.

[0051] While terms like "first" and "second" may be used to describe various components, these components should not be limited by these terms. These terms may be used to distinguish one component from another. For example, without departing from the scope of the present invention, a first component could be referred to as a "second component," and similarly, a second component could also be referred to as a "first component."

[0052] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components in between. Conversely, when a component is referred to as being "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. Other expressions that describe the relationship between components, such as "between" and "directly between" or "adjacent to" and "directly adjacent to", should be interpreted similarly.

[0053] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" indicate the presence of a described feature, number, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0054] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and shall not be construed in an idealized or overly formal sense unless explicitly defined herein.

[0055] Meanwhile, if a particular embodiment can be implemented differently, the functions or operations specified within a particular block may occur in a different order than specified in the flowchart. For example, two consecutive blocks may actually be executed substantially simultaneously, or, depending on the related functions or operations, the blocks may be executed in reverse order.

[0056] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the attached drawings. Identical components in the drawings are designated by the same reference numerals, and redundant descriptions of identical components are omitted.

[0057] FIG. 1 is a plan view showing a display device according to one embodiment of the present invention.

[0058] Referring to FIG. 1, a display device (DD) according to one embodiment of the present invention may be a device activated according to an electrical signal. For example, the display device (DD) may be a small display device used in small electronic devices such as smartphones, mobile phones, smart watches, game consoles, and cameras. In addition, the display device (DD) may be a medium- to large-sized display device used in medium- to large-sized electronic devices such as laptops, tablet PCs, televisions, computer monitors, vehicle monitors, and outdoor billboards.

[0059] In this specification, a plane may be defined as a first direction (DR1) and a second direction (DR2) intersecting the first direction (DR1). For example, the second direction (DR2) may intersect the first direction (DR1) perpendicularly. Additionally, a third direction (DR3) may intersect the plane perpendicularly.

[0060] A display device (DD) may include a display panel (DP), a pixel (PX), a plurality of gate lines (GL), a plurality of data lines (DL), a gate driver (GDV), a driver circuit (CC), and a printed circuit board (PCB).

[0061] A display panel (DP) may include a display area (DA), a peripheral area (PA), a bending area (BA), and a pad area (PDA). As a display device (DD) includes a display panel (DP), the display device (DD) may also include a display area (DA), a peripheral area (PA), a bending area (BA), and a pad area (PDA).

[0062] The display area (DA) may be an area that generates light or displays an image by controlling the transmittance of light provided from an external light source. At least one pixel (PX) may be arranged in the display area (DA). For example, the display panel (DP) may include at least one pixel (PX).

[0063] A pixel (PX) can emit light to generate an image. For example, a plurality of pixels (PX) can be arranged in a first direction (DR1) and a second direction (DR2). In addition, the pixel (PX) can include a plurality of sub-pixels that emit light of different colors. For example, the sub-pixels can include a red sub-pixel that emits red light, a green sub-pixel that emits green light, and a blue sub-pixel that emits blue light.

[0064] A plurality of gate lines (GL) and a plurality of data lines (DL) may be arranged in a display area (DA). The gate lines (GL) and the data lines (DL) may intersect each other. The gate lines (GL) may extend in a first direction (DR1). Each of the gate lines (GL) may be spaced apart from each other in a second direction (DR2). The data lines (DL) may extend along the second direction (DR2). Each of the data lines (DL) may be spaced apart from each other in the first direction (DR1). Within the display area (DA), a pixel (PX) may be arranged in an area where one of the gate lines (GL) intersects one of the data lines (DL). The pixel (PX) may be electrically connected to the gate line and the data line.

[0065] The peripheral area (PA) may be adjacent to the display area (DA). For example, the peripheral area (PA) may surround at least a portion of the display area (DA). The peripheral area (PA) may be an area that does not display an image. However, the peripheral area (PA) according to embodiments of the present invention is not necessarily limited thereto, and an image may be displayed in at least a portion of the peripheral area (PA). For example, a pixel (PX) that emits light may be arranged in at least a portion of the peripheral area (PA).

[0066] A gate driver (GDV) for driving a pixel (PX) may be arranged in the peripheral area (PA). The gate driver (GDV) may transmit gate signals, such as a light emission control signal or a scan signal, to the pixel (PX) via gate lines (GL). The pixel (PX) may emit light based on the gate signal.

[0067] The bending area (BA) may be adjacent to the peripheral area (PA). For example, the bending area (BA) may be adjacent to one side of the peripheral area (PA) in the second direction (DR2). The bending area (BA) may be bent along the bending axis (BAX). For example, the bending axis (BAX) may extend along the first direction (DR1). The bending axis (BAX) may be a central axis for bending the display panel (DP) in the bending area (BA). However, although the display panel (DP) is illustrated as being bent in the bending area (BA) in FIG. 1, the display panel (DP) according to embodiments of the present invention is not necessarily limited thereto, and a flexible circuit film connected to one end of the display panel (DP) in the bending area (BA) may be bent along the bending axis (BAX), and the other end of the flexible circuit film opposite to the one end may be electrically connected to a printed circuit board (PCB).

[0068] The pad area (PDA) may be adjacent to the bending area (BA). For example, the pad area (PDA) may be adjacent to one side of the bending area (BA) in the second direction (DR2). The driving circuit unit (CC) may be disposed on the display panel (DP). In one embodiment, the driving circuit unit (CC) may include a data driving unit. For example, the driving circuit unit (CC) may provide a data signal for driving the pixel (PX). The pixel (PX) may emit light based on the data signal.

[0069] A printed circuit board (PCB) may be adjacent to a display panel (DP) positioned on a pad area (PDA). At least a portion of the printed circuit board (PCB) may overlap at least a portion of the display panel (DP) positioned on the pad area (PDA). In one embodiment, the printed circuit board (PCB) may include a power voltage generation unit. For example, the printed circuit board (PCB) may generate a power voltage for supplying to a pixel (PX).

[0070] Fig. 2 is a cross-sectional view showing an unfolded state of the display device of Fig. 1 taken along line I-I'. Fig. 3 is a cross-sectional view showing a bent state of the display device of Fig. 1 taken along line I-I'. Fig. 4 is a cross-sectional view showing a cross-section of a portion of the display panel of Fig. 1. Fig. 5 is a cross-sectional view showing a cross-section of a multi-function member included in the display device of Fig. 1 taken along line II-II'.

[0071] Referring to FIGS. 2 to 5, a display device (DD) may include a display panel (DP), a driving circuit (CC), a multi-function member (MFE), a side cover member (SM), a printed circuit board (PCB), an anisotropic conductive film (ACF), an optical function layer (OL), and a window layer (WN). The multi-function member (MFE) may include a heat dissipation layer (HDL), a cover layer (CVL), and an adhesive layer (ADL).

[0072] The display panel (DP) may include a substrate (SUB), a first insulating layer (ISL), an active layer (ACT), a second insulating layer (ISL2), a gate electrode (GE), a third insulating layer (ISL3), a source electrode (SE), a drain electrode (DE), a fourth insulating layer (ISL4), a pixel electrode (PE), an emission layer (EML), a common electrode (CME), and an encapsulation layer (ENL). The encapsulation layer (ENL) may include a first encapsulation layer (ENL1), a second encapsulation layer (ENL2), and a third encapsulation layer (ENL3).

[0073] The substrate (SUB) may form the base of the display panel (DP). In one embodiment, the substrate (SUB) may be a transparent insulating substrate. For example, the substrate (SUB) may include glass, quartz, plastic, or the like. These may be used alone or in combination.

[0074] A first insulating layer (ISL1) may be disposed on a substrate (SUB). The first insulating layer (ISL1) may prevent impurities from diffusing from the substrate (SUB) to the active layer (ACT). The first insulating layer (ISL1) may include an inorganic insulating material such as silicon, silicon nitride, or silicon oxide. The active layer (ACT) may be disposed on the first insulating layer (ISL1).

[0075] The active layer (ACT) may include amorphous silicon, polycrystalline silicon, or an oxide semiconductor. The active layer (ACT) may include a source region and a drain region doped with impurities, and a channel region disposed between the source region and the drain region.

[0076] The second insulating layer (ISL2) may be disposed on the first insulating layer (ISL1). The second insulating layer (ISL2) may cover the active layer (ACT) on the first insulating layer (ISL1). In one embodiment, the second insulating layer (ISL2) may have a substantially uniform thickness along the profile of the active layer (ACT). However, the second insulating layer (ISL2) according to embodiments of the present invention is not necessarily limited thereto, and the second insulating layer (ISL2) may sufficiently cover the active layer (ACT) and may have a substantially flat upper surface without forming a step around the active layer (ACT). The second insulating layer (ISL2) may include an inorganic insulating material.

[0077] The gate electrode (GE) may be disposed on the second insulating layer (ISL2). The gate electrode (GE) may overlap the channel region of the active layer (ACT) in a plane. The gate electrode (GE) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, or the like.

[0078] The third insulating layer (ISL3) may be disposed on the second insulating layer (ISL2). The third insulating layer (ISL3) may cover the gate electrode (GE) on the second insulating layer (ISL2). In one embodiment, the third insulating layer (ISL3) may have a substantially uniform thickness along the profile of the gate electrode (GE). However, the third insulating layer (ISL3) according to embodiments of the present invention is not necessarily limited thereto, and the third insulating layer (ISL3) may sufficiently cover the gate electrode (GE) and may have a substantially flat upper surface without forming a step around the gate electrode (GE).

[0079] A source electrode (SE) and a drain electrode (DE) may be disposed on a third insulating layer (ISL3). The source electrode (SE) and the drain electrode (DE) may be in contact with an active layer (ACT) through a contact hole penetrating the second insulating layer (ISL2) and the third insulating layer (ISL3). The source electrode (SE) and the drain electrode (DE) may overlap the source region and the drain region of the active layer (ACT), respectively. Each of the source electrode (SE) and the drain electrode (DE) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, or the like. The active layer (ACT), the gate electrode (GE), the source electrode (SE), and the drain electrode (DE) may define a transistor (TR) for operating a pixel (for example, the pixel (PX) of FIG. 1).

[0080] The fourth insulating layer (ISL4) may be disposed on the third insulating layer (ISL3). The fourth insulating layer (ISL4) may have a substantially flat upper surface. The fourth insulating layer (ISL4) may include an organic insulating material such as polyimide (PI). In one embodiment, a contact hole may be defined in the fourth insulating layer (ISL4) through which a portion of the upper surface of the drain electrode (DE) is exposed. However, the fourth insulating layer (ISL4) according to embodiments of the present invention is not necessarily limited thereto, and a hole may be defined in the fourth insulating layer (ISL4) through which a portion of the upper surface of the source electrode (SE) is exposed.

[0081] A pixel defining layer (PDL) may be disposed on a fourth insulating layer (ISL4). The pixel defining layer (PDL) may partially cover the pixel electrode (PE). In addition, a hole may be defined in the pixel defining layer (PDL) that exposes at least a portion of the pixel electrode (PE). For example, the hole in the pixel defining layer (PDL) may expose a central portion of the pixel electrode (PE), and the pixel defining layer (PDL) may cover an edge of the pixel electrode (PE). The pixel defining layer (PDL) may include the same material as the fourth insulating layer (ISL4).

[0082] The pixel electrode (PE) may be disposed on the fourth insulating layer (ISL4). In one embodiment, the pixel electrode (PE) may be in contact with the drain electrode (DE) through the hole. However, the pixel electrode (PE) according to embodiments of the present invention is not necessarily limited thereto, and the pixel electrode (PE) may be in contact with the source electrode (SE) through the hole. The pixel electrode (PE) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, or the like. For example, the pixel electrode (PE) may include silver (Ag) and indium tin oxide (ITO).

[0083] The emission layer (EML) may be disposed on a pixel defining layer (PDL). The emission layer (EML) may be disposed on a pixel electrode (PE) exposed by the hole of the pixel defining layer (PDL). The emission layer (EML) may include an organic light-emitting material. The organic light-emitting material may include a low-molecular organic compound or a high-molecular organic compound. However, the present invention is not limited thereto, and the emission layer (EML) may also include a material such as a quantum dot.

[0084] A common electrode (CE) may be disposed on the light-emitting layer (EML). The common electrode (CE) may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc. For example, the common electrode (CE) may include aluminum (Al), platinum (Pt), silver (Ag), magnesium (Mg), gold (Au), chromium (Cr), tungsten (W), titanium (Ti), etc. These may be used alone or in combination. The pixel electrode (PE), the light-emitting layer (EML), and the common electrode (CE) may define a light-emitting element (EE).

[0085] A first encapsulation layer (ENL1) may be disposed on a common electrode (CE). The first encapsulation layer (ENL1) may cover a light-emitting element (LED). The first encapsulation layer (ENL1) may have a substantially uniform thickness along a profile of the common electrode (CE). A second encapsulation layer (ENL2) may be disposed on the first encapsulation layer (ENL1). The second encapsulation layer (ENL2) may have a substantially flat upper surface without generating a step around the first encapsulation layer (ENL1). A third encapsulation layer (ENL3) may be disposed on the second encapsulation layer (ENL2). The third encapsulation layer (ENL3) may have a substantially uniform thickness and a substantially flat upper surface. The first to third encapsulation layers (ENL1, ENL2, and ENL3) may seal a display area (DA) to protect the light-emitting element (EE) from external impurities.

[0086] A driving circuit (CC) may be mounted on a display panel (DP). The driving circuit (CC) may be positioned on a portion overlapping a pad area (PDA) of the display panel (DP).

[0087] A multi-function element (MFE) may be disposed at a lower portion of a display panel (DP). For example, the multi-function element (MFE) may be disposed at a lower portion of a non-bent portion of the display panel (DP) (e.g., a portion overlapping a display area (DA) and a peripheral area (PA) of the display panel (DP). The multi-function element (MFE) may perform a function of dissipating heat generated in the display panel (DP) to the outside, supporting the display panel (DP), or blocking light incident from the outside.

[0088] The heat dissipation layer (HDL) may include graphite. In one embodiment, the heat dissipation layer (HDL) may include natural graphite or artificial graphite. For example, the heat dissipation layer (HDL) may be pure graphite. A first side (S1) of the heat dissipation layer (HDL) may face a printed circuit board (PCB). For example, the first side (S1) of the heat dissipation layer (HDL) may face in a direction opposite to a third direction (DR3). A second side (S2) of the heat dissipation layer (HDL), opposite to the first side (S1), may face the display panel (DP). For example, the second side (S2) of the heat dissipation layer (HDL) may face in the third direction (DR3).

[0089] In this specification, the first side (S1) of the heat dissipation layer (HDL) may be referred to as one side of the heat dissipation layer (HDL), and the second side (S2) of the heat dissipation layer (HDL) may be referred to as the other side of the heat dissipation layer (HDL).

[0090] In one embodiment, the thermal conductivity of the heat dissipation layer (HDL) may be about 100 W / (m·K) to about 1700 W / (m·K). Preferably, the thermal conductivity of the heat dissipation layer (HDL) may be about 500 W / (m·K) to about 1700 W / (m·K). The heat dissipation layer (HDL) can efficiently spread heat generated in the display device (DD), thereby removing hot spots in specific parts of the display device (DD) and lowering the overall heat (temperature) of the display device (DD).

[0091] In one embodiment, the average thickness of the heat dissipation layer (HDL) may be from about 10 μm to about 1000 μm. Preferably, the average thickness of the heat dissipation layer (HDL) may be from about 10 μm to about 100 μm.

[0092] The cover layer (CVL) may be disposed on the first surface (S1) of the heat dissipation layer (HDL). For example, the cover layer (CVL) may entirely cover the first surface (S1) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVL) may be a coating layer coated on the first surface (S1) of the heat dissipation layer (HDL). In another embodiment, the cover layer (CVL) may be an adhesive layer adhered on the first surface (S1) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVL) may have a substantially uniform thickness and cover the first surface (S1) of the heat dissipation layer (HDL).

[0093] In one embodiment, the cover layer (CVL) may include a resin. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc. These may be used alone or in combination.

[0094] In another embodiment, the cover layer (CVL) may include a resin and a filler. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc., and the filler may include boron nitride (BN), graphite powder, graphene, carbon fiber, carbon nanotube, etc. These may be used alone or in combination. Specifically, the mass ratio of the resin included in the cover layer (CVL) may be 30 wt% to 90 wt%, and the mass ratio of the filler included in the cover layer (CVL) may be 10 wt% to 70 wt%.

[0095] In another embodiment, the cover layer (CVL) may include an adhesive material. For example, the cover layer (CVL) may include polyethylene terephthalate (PET). In other words, the cover layer (CVL) may be a single-sided adhesive PET that adheres to the first side (S1) of the heat dissipation layer (HDL).

[0096] In one embodiment, the cover layer (CVL) may be in contact with a printed circuit board (PCB). Specifically, when the cover layer (CVL) includes a conductive material, the multi-function element (MFE) can more easily perform electromagnetic interference (EMI) shielding and electrostatic discharge (ESD) shielding functions as the cover layer (CVL) is in contact with the printed circuit board (PCB).

[0097] In one embodiment, the average thickness of the cover layer (CVL) may be about 5 μm to 50 μm. In one embodiment, the average thickness of the cover layer (CVL) may be less than the average thickness of the heat dissipation layer (HDL).

[0098] An adhesive layer (ADL) may be disposed on a second side (S2) of a heat dissipation layer (HDL). The adhesive layer (ADL) may be disposed between the heat dissipation layer (HDL) and the display panel (DP) in a cross-sectional view. In one embodiment, the adhesive layer (ADL) may bond the heat dissipation layer (HDL) and the display panel (DP) to each other. For example, the adhesive layer (ADL) may include polyethylene terephthalate. In other words, the adhesive layer (ADL) may be a double-sided adhesive PET that may be adhered to the second side (S2) of the heat dissipation layer (HDL) and the side of the display panel (DP) facing the heat dissipation layer (HDL).

[0099] In one embodiment, the average thickness of the adhesive layer (ADL) may be from about 5 μm to about 55 μm. In one embodiment, the average thickness of the adhesive layer (ADL) may be greater than the average thickness of the cover layer (CVL). In one embodiment, the average thickness of the adhesive layer (ADL) may be less than the average thickness of the heat dissipation layer (HDL). In one embodiment, the thermal conductivity of the adhesive layer (ADL) may be less than the thermal conductivity of the heat dissipation layer (HDL).

[0100] The side cover member (SM) can cover the side surface (S3) of the heat dissipation layer (HDL). For example, the side cover member (SM) can entirely surround the side surface (S3) of the heat dissipation layer (HDL). In one embodiment, an edge portion of the cover layer (CVL) can be in contact with the side cover member (SM). For example, the side cover member (SM) can surround the edge portion of the cover layer (CVL). In one embodiment, an edge portion of the adhesive layer (ADL) can be in contact with the side cover member (SM). For example, the side cover member (SM) can surround the edge portion of the adhesive layer (ADL).

[0101] In one embodiment, the side cover member (SM) may include acrylic, epoxy, polyurethane, boron nitride, graphite powder, graphene, carbon fiber, carbon nanotube, etc. These may be used alone or in combination. In one embodiment, the side cover member (SM) may include the same material as the cover layer (CVL). In another embodiment, the side cover member (SM) may include a different material from the cover layer (CVL).

[0102] In one embodiment, the side cover member (SM) may be formed by coating on the side surface (S3) of the heat dissipation layer (HDL). In another embodiment, the side cover member (SM) may be formed on the side surface (S3) of the heat dissipation layer (HDL) through a process of sealing the side surface (S3) of the heat dissipation layer (HDL).

[0103] A printed circuit board (PCB) may be disposed under a cover layer (CVL). As the display panel (DP) is bent in the bending area (BA), the printed circuit board (PCB) may be electrically connected to the display panel (DP). For example, the printed circuit board (PCB) may be electrically connected to the display panel (DP) via an anisotropic conductive film (ACF).

[0104] An optical function layer (OL) may be disposed on a display panel (DP). The optical function layer (OL) may be a layer that performs an optical function of controlling light. In one embodiment, the optical function layer (OL) may be a polarizing layer. The optical function layer (OL) may be disposed in a display area (DA) and a peripheral area (PA). The optical function layer (OL) may polarize light incident from the outside onto the display panel (DP). The optical function layer (OL) may be elongated in one direction. The elongation direction of the optical function layer (OL) may be an absorption axis, and a direction perpendicular to the elongation direction may be a transmission axis. However, the optical function layer (OL) according to embodiments of the present invention is not necessarily limited to a polarizing layer, and may be various types of functional layers that perform an optical function. For example, the optical function layer (OL) may include a color filter layer.

[0105] A window layer (WN) may be disposed on an optical function layer (OL). The window layer (WN) may be disposed in a display area (DA), a peripheral area (PA), and a bending area (BA). The window layer (WN) may protect the display panel (DP) and the optical function layer (OL). The window layer (WN) may include tempered glass, tempered plastic, or the like. The window layer (WN) may be formed as a single layer or may have a structure in which a plurality of functional layers are laminated. The window layer (WN) may prevent occurrence of defects such as fingerprints, scratches, impressions, or impacts on the display panel (DP) and the optical function layer (OL).

[0106] As described above, the display device (DD) may include a cover layer (CVL) and a side cover member (SM) for covering the first surface (S1) and the side surface (S3) of the heat dissipation layer (HDL) including graphite, respectively. Accordingly, it is possible to prevent impurities such as particles from entering the display panel (DP) or the printed circuit board (PCB) from the surface of the heat dissipation layer (HDL).

[0107] FIGS. 6 to 11 are drawings for explaining an example of a method for manufacturing the display device of FIG. 1.

[0108] In the following, any content that overlaps with the content described with reference to FIGS. 1 to 5 may be omitted or briefly described.

[0109] Referring to FIGS. 6 to 8, after a rolled graphite sheet (GPS) is spread out, a covering material (CM) can be formed on a first surface (S1) of the spread portion of the graphite sheet (GPS). A cover layer (CVL) can be formed on the first surface (S1) of the spread portion of the graphite sheet (GPS) using the covering material (CM). For example, the covering material (CM) can be evenly applied in a powder or liquid state on the first surface (S1) of the graphite sheet (GPS) using a device such as a dispenser. Accordingly, the first surface (S1) of the graphite sheet (GPS) can be coated using the covering material (CM). However, the process of forming the covering material (CM) and the covering layer (CVL) according to embodiments of the present invention is not necessarily limited thereto, and a covering layer (CVL) in the form of a film may be manufactured using the covering material (CM), and the covering layer (CVL) in the form of a film may be attached on a graphite sheet (GPS).

[0110] The covering material (CM) may be a material forming the cover layer (CVL) of FIG. 2. In one embodiment, the covering material (CM) may include a resin. For example, the resin may include acrylic, epoxy, polyurethane, silicone, or the like. These may be used alone or in combination.

[0111] In another embodiment, the covering material (CM) may include a resin and a filler. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc., and the filler may include boron nitride, graphite powder, graphene, carbon fiber, carbon nanotube, etc. These may be used alone or in combination. Specifically, the mass ratio of the resin included in the covering material (CM) may be 30 wt% to 90 wt%, and the mass ratio of the filler included in the covering material (CM) may be 10 wt% to 70 wt%.

[0112] In another embodiment, the covering material (CM) may include an adhesive material. For example, the covering material (CM) may include polyethylene terephthalate. In other words, the covering material (CM) may be a single-sided adhesive PET that adheres to one side of the graphite sheet (GPS).

[0113] Referring to Fig. 9, an adhesive layer (ADL) may be formed on the second side (S2) of the unfolded portion of the graphite sheet (GPS). For example, the adhesive layer (ADL) may be adhered to the second side (S2) of the unfolded portion of the graphite sheet (GPS). After the cover layer (CVL) and the adhesive layer (ADL) are formed on each of the two sides of the graphite sheet (GPS), a structure in which the graphite sheet (GPS), the cover layer (CVL), and the adhesive layer (ADL) are combined may be cut to a specific size. For example, the structure may be cut along a cutting line (CUT). Accordingly, the cut structure may be manufactured into a multi-functional member (for example, the multi-functional member (MFE) of Fig. 2). In addition, the graphite sheet (GPS) may be cut to a specific size to form a heat dissipation layer (HDL).

[0114] Referring to Fig. 10, a side surface of the manufactured multi-functional member may be exposed. For example, a side surface (S3) of a heat dissipation layer (HDL) may be exposed. A side cover member (SM) may be formed on the exposed side surface (S3) of the heat dissipation layer (HDL). For example, the side cover member (SM) may be used to coat the side surface (S3) of the heat dissipation layer (HDL). In another example, the side cover member (SM) may be used to seal the side surface (S3) of the heat dissipation layer (HDL). In one embodiment, the side cover member (SM) may simultaneously cover not only the side surface (S3) of the heat dissipation layer, but also an edge portion of the adhesive layer (ADL) and an edge portion of the cover layer (CVL).

[0115] Referring to FIG. 11, a display panel (DP) may be placed on the multi-function member, and a printed circuit board (PCB) may be placed below the multi-function member. For example, the multi-function member may be coupled to the display panel (DP) via an adhesive layer (ADL). The multi-function member may be in contact with the printed circuit board (PCB). Accordingly, the display device (DD) of FIG. 1 may be manufactured.

[0116] As described above, in the method for manufacturing the display device (DD), since a cover layer (CVL) covering the heat dissipation layer (HDL) is formed, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and thus, defects occurring in the display device (DD) can be reduced. Accordingly, the reliability of the display device (DD) can be improved.

[0117] In addition, since a cover layer (CVL) can be formed on a graphite sheet (GPS) while unfolding the graphite sheet (GPS) in a roll state, the manufacturing cost and time of the display device (DD) can be reduced.

[0118] FIG. 12 and FIG. 13 are drawings for explaining another example of a method for manufacturing the display device of FIG. 11.

[0119] The method for manufacturing a display device (DD) described with reference to FIGS. 12 and 13 may be substantially the same as or similar to the method for manufacturing a display device (DD) described with reference to FIGS. 6 to 11, except that the order of the process of cutting a graphite sheet (GPS) and the process of forming a cover layer (CVL) and an adhesive layer (ADL) are different.

[0120] In the following, any content that overlaps with the content described with reference to FIGS. 6 to 11 may be omitted or briefly described.

[0121] Referring to FIGS. 2, 12, and 13, after a rolled graphite sheet (GPS) is unrolled, a heat dissipation layer (HDL) may be formed by cutting the graphite sheet (GPS) along a cutting area (CA). The cutting area (CA) may have a specific size and pattern for manufacturing a heat dissipation layer (HDL) to be used in the manufacture of a display device. A covering material (CM) may be formed on a first surface (S1) of the heat dissipation layer (HDL). Thereafter, the covering material (CM) may be entirely applied on the first surface (S1) of the heat dissipation layer (HDL) to form a cover layer (CVL), and an adhesive layer (ADL) may be formed on a second surface (S2) of the heat dissipation layer (HDL). Thereafter, a side cover member (SM) may be formed on a side surface (S3) of the heat dissipation layer (HDL), and thus a multi-function member (MFE) may be manufactured. A display device (DD) of FIG. 1 can be manufactured by combining a display panel (DP) and a printed circuit board (PCB) with a multi-function element (MFE).

[0122] In other words, the method for manufacturing a display device described with reference to FIGS. 6 to 11 includes a process of forming a cover layer (CVL) on a rolled graphite sheet (GPS) and cutting the graphite sheet (GPS), but the method for manufacturing a display device described with reference to FIGS. 12 and 13 may include a process of forming a cover layer (CVL) on a heat dissipation layer (HDL) after cutting the rolled graphite sheet (GPS).

[0123] As described above, in the method for manufacturing the display device (DD), since a cover layer (CVL) covering the heat dissipation layer (HDL) is formed, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and thus, defects occurring in the display device (DD) can be reduced. Accordingly, the reliability of the display device (DD) can be improved.

[0124] Fig. 14 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention. Fig. 15 is a cross-sectional view showing a cross-section of a multi-function member and a circuit board included in the display device of Fig. 14.

[0125] The display device (DDa) described with reference to FIGS. 14 and 15 may be substantially the same as or similar to the display device (DD) described with reference to FIGS. 1 to 5 except for the cover layer (CVLa) and the contact portion (CP).

[0126] In the following, any content that overlaps with the content described with reference to FIGS. 1 to 5 may be omitted or briefly described.

[0127] Referring to FIGS. 14 and 15, the display device (DDa) may include a multi-function member (MFEa). The multi-function member (MFEa) may include a heat dissipation layer (HDL), a cover layer (CVLa) disposed on a first surface (S1) of the heat dissipation layer (HDL), and an adhesive layer (ADL) disposed on a second surface (S2) of the heat dissipation layer (HDL).

[0128] At least one contact hole (H) may be defined in the cover layer (CVLa) that penetrates the cover layer (CVLa) in the thickness direction (e.g., the third direction (DR3)). A plurality of contact holes (H) may be arranged on a plane. For example, a plurality of contact holes (H) may be arranged in the first direction (DR1) and / or the second direction (DR2). However, the number and arrangement of the contact holes (H) according to embodiments of the present invention are not necessarily limited thereto.

[0129] The heat dissipation layer (HDL) and the printed circuit board (PCB) may be connected to each other through a contact hole (H). For example, the heat dissipation layer (HDL) and the printed circuit board (PCB) may be electrically or physically connected to each other through a contact portion (CP) filling the contact hole (H). The contact portion (CP) may contact a first surface (S1) of the heat dissipation layer (HDL) and one surface of the printed circuit board (PCB). In one embodiment, the contact portion (CP) may include a conductive material.

[0130] In one embodiment, the contact portion (CP) may be formed integrally with the heat dissipation layer (HDL). For example, the contact portion (CP) may be a portion of the heat dissipation layer (HDL) that protrudes from a first surface (S1) of the heat dissipation layer (HDL) toward a printed circuit board (PCB). In another embodiment, the contact portion (CP) may be formed integrally with the printed circuit board (PCB). For example, the contact portion (CP) may be a portion of the printed circuit board (PCB) that protrudes from the first surface of the printed circuit board (PCB) toward the heat dissipation layer (HDL). In yet another embodiment, the contact portion (CP) may be a separate component from each of the heat dissipation layer (HDL) and the printed circuit board (PCB). For example, the contact portion (CP) may be a conductive tape such as an anisotropic conductive film, a thermally conductive adhesive, a conductive material, or the like. However, the contact portion (CP) according to embodiments of the present invention is not necessarily limited thereto.

[0131] In one embodiment, the cover layer (CVLa) may include a resin. For example, the resin may include acrylic, epoxy, polyurethane, silicone, or the like. These may be used alone or in combination.

[0132] In another embodiment, the cover layer (CVLa) may include an adhesive material. For example, the cover layer (CVLa) may include polyethylene terephthalate. In other words, the cover layer (CVLa) may be a single-sided adhesive PET that adheres to the first side (S1) of the heat dissipation layer (HDL).

[0133] However, the materials included in the cover layer (CVLa) according to embodiments of the present invention are not necessarily limited thereto, and the cover layer (CVLa) may include resin and filler. For example, the resin may include acrylic, epoxy, polyurethane, silicone, etc., and the filler may include boron nitride, graphite powder, graphene, carbon fiber, carbon nanotube, etc. These may be used alone or in combination.

[0134] As described above, the display device (DDa) may include a cover layer (CVLa) and a side cover member (SM) for covering a first surface (S1) and a side surface (S3), respectively, of a heat dissipation layer (HDL) including graphite. Accordingly, it is possible to prevent impurities such as particles from entering the display panel (DP) or the printed circuit board (PCB) from the surface of the heat dissipation layer (HDL). In addition, the heat dissipation layer (HDL) and the printed circuit board (PCB) may be connected to each other through a contact hole (H). Accordingly, the multi-function member (MFEa) may more easily perform the electrostatic shielding and electrostatic shielding roles.

[0135] Figures 16 to 18 are drawings for explaining a method of manufacturing the display device of Figure 14.

[0136] The manufacturing method of the display device (DDa) described with reference to FIGS. 16 to 18 may be the same as or similar to the manufacturing method of the display device (DD) described with reference to FIGS. 6 to 11, except for the process of forming the contact hole (H).

[0137] In the following, any content that overlaps with the content described with reference to FIGS. 6 to 11, 14, and 15 may be omitted or briefly described.

[0138] Referring to FIGS. 16 to 18, a masking tape (MT) can be attached to a first surface (S1) of a graphite sheet (GPS). The masking tape (MT) can be attached to a specific position on the first surface (S1) of the graphite sheet (GPS). For example, the masking tape (MT) can be attached to a position where a contact hole (H) is formed on the first surface (S1) of the graphite sheet (GPS). After the masking tape (MT) is attached, a covering material (CM) can be formed on the first surface (S1) of the graphite sheet (GPS). After the covering material (CM) is evenly coated on the first surface (S1) of the graphite sheet (GPS), the masking tape (MT) can be removed from the graphite sheet (GPS) to form a cover layer (CVLa) in which a contact hole (H) is defined. After forming the cover layer (CVLa), the graphite sheet (GPS) is cut to manufacture the multi-function member (MFEa) of FIG. 14, and the multi-function member (MFEa), the display panel (e.g., the display panel (DP) of FIG. 2), and the printed circuit board (e.g., the printed circuit board (PCB) of FIG. 2) are joined to each other to manufacture the display device (DDa).

[0139] However, the process of forming a contact hole (H) according to embodiments of the present invention is not necessarily limited to this, and after the first side (S1) of the graphite sheet (GPS) is entirely covered with a covering material (CM), a portion of the covering material (CM) may be removed to form a cover layer (CVLa) in which a contact hole (H) is defined.

[0140] As described above, in the method for manufacturing the display device (DDa), since a cover layer (CVLa) covering the heat dissipation layer (HDL) is formed, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and thus, defects occurring in the display device (DDa) can be reduced. Accordingly, the reliability of the display device (DDa) can be improved.

[0141] In addition, since a contact hole (H) is formed using a masking tape (MT), the manufacturing process and time of a multi-function member (MFEa) that performs electromagnetic shielding and electrostatic shielding can be shortened.

[0142] Fig. 19 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention. Fig. 20 is a cross-sectional view showing a cross-section of a multi-function member included in the display device of Fig. 19.

[0143] The display device (DDb) described with reference to FIGS. 19 and 20 may have a manufacturing method identical or similar to that of the display device (DD) described with reference to FIGS. 1 to 5, except for the cover layer (CVLb) and the adhesive layer (ADLb).

[0144] In the following, any content that overlaps with the content described with reference to FIGS. 1 to 5 may be omitted or briefly described.

[0145] Referring to FIGS. 19 and 20, the display device (DDb) may include a multi-function member (MFEb). The multi-function member (MFEb) may include a heat dissipation layer (HDL), a cover layer (CVLb) disposed on a first surface (S1) of the heat dissipation layer (HDL), and an adhesive layer (ADLb) disposed on a second surface (S2) of the heat dissipation layer (HDL). In the present specification, the cover layer (CVLb) may be referred to as a first cover layer, and the adhesive layer (ADLb) may be referred to as a second cover layer.

[0146] In one embodiment, the cover layer (CVLb) may cover a first surface (S1) and a portion of a side surface (S3) of the heat dissipation layer (HDL). For example, the cover layer (CVLb) may extend from the first surface (S1) of the heat dissipation layer (HDL) to cover a portion of the side surface (S3) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVLb) may be adhered to the first surface (S1) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVLb) may include polyethylene terephthalate. In other words, the cover layer (CVLb) may be a single-sided adhesive PET. However, the material included in the cover layer (CVLb) according to embodiments of the present invention is not necessarily limited thereto, and the cover layer (CVLb) may also include a resin and / or a filler.

[0147] In one embodiment, the adhesive layer (ADLb) may cover a portion of the second surface (S2) and the side surface (S3) of the heat dissipation layer (HDL). For example, the adhesive layer (ADLb) may extend from the second surface (S2) of the heat dissipation layer (HDL) to cover a portion of the side surface (S3) of the heat dissipation layer (HDL). In one embodiment, the adhesive layer (ADLb) may bond the heat dissipation layer (HDL) and the display panel (DP) to each other on the second surface (S2) of the heat dissipation layer (HDL). In other words, the adhesive layer (ADLb) may be a double-sided adhesive PET.

[0148] In one embodiment, the cover layer (CVLb) and the adhesive layer (ADLb) may entirely cover the side surface (S3) of the heat dissipation layer (HDL). For example, the cover layer (CVLb) and the adhesive layer (ADLb) may each contact each other on the side surface (S3) of the heat dissipation layer (HDL), and the cover layer (CVLb) together with the adhesive layer (ADLb) may entirely surround the side surface (S3) of the heat dissipation layer (HDL).

[0149] As described above, the display device (DDb) may include a cover layer (CVLb) and an adhesive layer (ADLb) for covering the first side (S1), the second side (S2), and the side surface (S3) of the heat dissipation layer (HDL) including graphite, respectively. Accordingly, it is possible to prevent impurities such as particles from entering the display panel (DP) or the printed circuit board (PCB) from the surface of the heat dissipation layer (HDL).

[0150] In addition, the display device (DDb) of FIG. 19 may not include a side cover member (e.g., the side cover member (SM) of FIG. 2), unlike the display device (DD) of FIG. 1. For example, in the display device (DDb) of FIG. 19, since the cover layer (CVLb) and the adhesive layer (ADLb) entirely surround the side surface (S3) of the heat dissipation layer (HDL), the cover layer (CVLb) and the adhesive layer (ADLb) may perform the role of the side cover member.

[0151] Fig. 21 is a drawing for explaining a method of manufacturing the display device of Fig. 19.

[0152] The method for manufacturing the display device (DDb) described with reference to FIG. 21 may be the same as or similar to the method for manufacturing the display device (DD) described with reference to FIGS. 6 to 11, except for the process of covering the side surface (S3) of the heat dissipation layer (HDL) using the cover layer (CVLb) and the adhesive layer (ADLb).

[0153] In the following, any content that overlaps with the content described with reference to FIGS. 6 to 11, FIG. 19, and FIG. 20 may be omitted or briefly described.

[0154] Referring to Fig. 21, a material forming a cover layer (CVLb) may be applied entirely on a first surface (S1) of a heat dissipation layer (HDL). A material forming an adhesive layer (ADLb) may be applied entirely on a second surface (S2) of the heat dissipation layer (HDL). Pressure or heat may be applied to the material forming the cover layer (CVLb) so that the material forming the cover layer (CVLb) covers a portion of a side surface (S3) of the heat dissipation layer (HDL). The pressure or heat may be applied to the material forming the adhesive layer (ADLb) so that the material forming the adhesive layer (ADLb) covers a portion of a side surface (S3) of the heat dissipation layer (HDL). The pressure or heat may be applied until the material forming the adhesive layer (ADLb) and the material forming the cover layer (CVLb) come into contact with each other on the side surface (S3) of the heat dissipation layer (HDL). Accordingly, a cover layer (CVLb) covering a first surface (S1) of the heat dissipation layer (HDL) and a part of a side surface (S3) of the heat dissipation layer (HDL) and an adhesive layer (ADLb) covering a second surface (S2) of the heat dissipation layer (HDL) and a part of a side surface (S3) of the heat dissipation layer (HDL) can be formed. Accordingly, the multi-function member (MFEb) of FIG. 19 is manufactured, and a display device (DDb) can be manufactured by combining the multi-function member (MFEb), a display panel (for example, the display panel (DP) of FIG. 2), and a printed circuit board (for example, the printed circuit board (PCB) of FIG. 2) with each other.

[0155] As described above, in the method for manufacturing the display device (DDb), since a cover layer (CVLb) is formed to cover the heat dissipation layer (HDL), a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and thus, defects occurring in the display device (DDb) can be reduced. Accordingly, the reliability of the display device (DDb) can be improved.

[0156] In addition, by applying heat or pressure to the material forming the cover layer (CVLb) and the adhesive layer (ADLb), respectively, the cover layer (CVLb) and the adhesive layer (ADLb) covering the side surface (S3) of the heat dissipation layer (HDL) are formed, so that the time and cost for manufacturing the display device (DDb) can be shortened.

[0157] Fig. 22 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention. Fig. 23 is a cross-sectional view showing a cross-section of a multi-function member and a circuit board included in the display device of Fig. 22.

[0158] The display device (DDc) described with reference to FIGS. 22 and 23 may be substantially the same as or similar to the display device (DDb) described with reference to FIGS. 19 and 20, except for the cover layer (CVLc) and the contact portion (CP).

[0159] In the following, any content that overlaps with the content described with reference to FIGS. 19 and 20 may be omitted or briefly described.

[0160] Referring to FIGS. 22 and 23, the display device (DDc) may include a multi-function member (MFEc). The multi-function member (MFEc) may include a heat dissipation layer (HDL), a cover layer (CVLc) disposed on a first surface (S1) of the heat dissipation layer (HDL), and an adhesive layer (ADLc) disposed on a second surface (S2) of the heat dissipation layer (HDL).

[0161] At least one contact hole (H) may be defined in the cover layer (CVLc) that penetrates the cover layer (CVLc) in the thickness direction (e.g., the third direction (DR3)). A plurality of contact holes (H) may be arranged on a plane. For example, a plurality of contact holes (H) may be arranged in the first direction (DR1) and / or the second direction (DR2). However, the number and arrangement of the contact holes (H) according to embodiments of the present invention are not necessarily limited thereto.

[0162] The heat dissipation layer (HDL) and the printed circuit board (PCB) may be connected to each other through a contact hole (H). For example, the heat dissipation layer (HDL) and the printed circuit board (PCB) may be electrically or physically connected to each other through a contact portion (CP) filling the contact hole (H). The contact portion (CP) may contact a first surface (S1) of the heat dissipation layer (HDL) and one surface of the printed circuit board (PCB). In one embodiment, the contact portion (CP) may include a conductive material.

[0163] In one embodiment, the contact portion (CP) may be formed integrally with the heat dissipation layer (HDL). For example, the contact portion (CP) may be a portion of the heat dissipation layer (HDL) that protrudes from a first surface (S1) of the heat dissipation layer (HDL) toward a printed circuit board (PCB). In another embodiment, the contact portion (CP) may be formed integrally with the printed circuit board (PCB). For example, the contact portion (CP) may be a portion of the printed circuit board (PCB) that protrudes from the first surface of the printed circuit board (PCB) toward the heat dissipation layer (HDL). In yet another embodiment, the contact portion (CP) may be a separate component from each of the heat dissipation layer (HDL) and the printed circuit board (PCB). For example, the contact portion (CP) may be a conductive tape such as an anisotropic conductive film, a thermally conductive adhesive, a conductive material, or the like. However, the contact portion (CP) according to embodiments of the present invention is not necessarily limited thereto.

[0164] As described above, the display device (DDc) may include a cover layer (CVLc) and an adhesive layer (ADLc) for covering the first side (S1), the second side (S2), and the side surface (S3) of the heat dissipation layer (HDL) including graphite, respectively. Accordingly, it is possible to prevent impurities such as particles from entering the display panel (DP) or the printed circuit board (PCB) from the surface of the heat dissipation layer (HDL).

[0165] Additionally, the heat dissipation layer (HDL) and the printed circuit board (PCB) can be connected to each other through a contact hole (H). Accordingly, the multi-function element (MFEc) can more easily perform the electrostatic shielding and electrostatic shielding roles.

[0166] Fig. 24 is a drawing for explaining a method of manufacturing the display device of Fig. 22.

[0167] The method for manufacturing the display device (DDc) described with reference to FIG. 24 may be the same as or similar to the method for manufacturing the display device (DD) described with reference to FIGS. 6 to 11, except for the process of covering the side surface (S3) of the heat dissipation layer (HDL) using the cover layer (CVLc) and the adhesive layer (ADLc) and the process of forming the contact hole (H). In addition, the method for manufacturing the display device (DDc) described with reference to FIG. 24 may be the same as or similar to the method for manufacturing the display device (DDb) described with reference to FIG. 21, except for the process of forming the contact hole (H).

[0168] In the following, any content that overlaps with the content described with reference to FIGS. 6 to 11 and FIGS. 21 to 23 may be omitted or briefly described.

[0169] Referring to FIG. 24, heat or pressure may be applied to the material forming the cover layer (CVLc) and the material forming the adhesive layer (ADLc), respectively, to form the cover layer (CVLc) and the adhesive layer (ADLc) that cover the side surface (S3) of the heat dissipation layer (HDL). In addition, a portion of the cover layer (CVLc) may be removed to form a contact hole (H). The contact hole (H) may be formed using a masking tape (for example, the masking tape (MT) of FIG. 16). However, the process of forming the contact hole (H) according to embodiments of the present invention is not necessarily limited thereto.

[0170] In one embodiment, the process of applying heat or pressure may be performed before the process of forming the contact hole (H). In another embodiment, the process of applying heat or pressure may be performed after the process of forming the contact hole (H). In yet another embodiment, the process of applying heat or pressure may be performed simultaneously with the process of forming the contact hole (H).

[0171] As described above, in the method for manufacturing the display device (DDc), since a cover layer (CVLc) covering the heat dissipation layer (HDL) is formed, a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and thus, defects occurring in the display device (DDc) can be reduced. Accordingly, the reliability of the display device (DDc) can be improved.

[0172] In addition, since the contact hole (H) is formed using the above masking tape, the manufacturing process and time of the multi-function member (MFEc) that performs electromagnetic shielding and electrostatic shielding can be shortened.

[0173] In addition, by applying heat or pressure to the materials forming the cover layer (CVLc) and the adhesive layer (ADLc), respectively, the cover layer (CVLc) and the adhesive layer (ADLc) covering the side surface (S3) of the heat dissipation layer (HDL) are formed, so that the time and cost for manufacturing the display device (DDc) can be shortened.

[0174] Fig. 25 is a cross-sectional view showing a cross-section of a display device according to another embodiment of the present invention. Fig. 26 is a cross-sectional view showing a cross-section of a multi-function member included in the display device of Fig. 25.

[0175] The display device (DDd) described with reference to FIGS. 25 and 26 may be substantially the same as or similar to the display device (DD) described with reference to FIGS. 1 to 5, except for the cover layer (CVLd).

[0176] In the following, any content that overlaps with the content described with reference to FIGS. 1 to 5 may be omitted or briefly described.

[0177] Referring to FIGS. 25 and 26, the multi-function member (MFEd) may include a heat dissipation layer (HDL), a cover layer (CVLd) covering the heat dissipation layer (HDL), and an adhesive layer (ADL) disposed on the cover layer (CVLd). In one embodiment, the cover layer (CVLd) may include a conductive metal material. For example, the metal material may include aluminum (Al), copper (Cu), silver (Ag), or the like. These may be used alone or in combination. In one embodiment, the cover layer (CVLd) may be a metal coating layer. For example, the cover layer (CVLd) may be formed through a plating process. In one embodiment, the average thickness of the cover layer (CVLd) may be about 1 μm to about 20 μm.

[0178] In one embodiment, the cover layer (CVLd) can surround the first side (S1), the second side (S2), and the side surface (S3) of the heat dissipation layer (HDL). In one embodiment, the cover layer (CVLd) can be in contact with a printed circuit board (PCB). An adhesive layer (ADL) can be adhered to one side of the cover layer (CVLd). The adhesive layer (ADL) can bond the multi-function element (MFEd) and the display panel (DP).

[0179] As described above, the display device (DDd) may include a cover layer (CVLd) for covering the first side (S1), the second side (S2), and the side surface (S3) of the heat dissipation layer (HDL) including graphite. Accordingly, it is possible to prevent impurities such as particles from entering the display panel (DP) or the printed circuit board (PCB) from the surface of the heat dissipation layer (HDL).

[0180] As described above, in the method for manufacturing the display device (DDd), since the cover layer (CVLd) is formed by plating the heat dissipation layer (HDL), a separate lamination process involving heat is not required to protect the heat dissipation layer (HDL), and thus, defects occurring in the display device (DDd) can be reduced. Accordingly, the reliability of the display device (DDd) can be improved.

[0181] The present invention can be applied to display devices and electronic devices including them. For example, the present invention can be applied to high-resolution smartphones, mobile phones, smart pads, smart watches, tablet PCs, vehicle navigation systems, televisions, computer monitors, laptops, and the like.

[0182] Although the present invention has been described above with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the present invention as set forth in the following claims.

Claims

1. A display panel comprising at least one pixel; A printed circuit board disposed at the lower portion of the display panel and electrically connected to the pixels; A heat dissipation layer comprising graphite and disposed between the display panel and the printed circuit board; a cover layer disposed on one side of the heat dissipation layer facing the printed circuit board; and A display device comprising a side cover member comprising a resin and covering a side surface of the heat dissipation layer.

2. A display device according to claim 1, characterized in that the cover layer comprises the same material as the side cover member.

3. A display device according to claim 1, characterized in that the cover layer comprises a material different from that of the side cover member.

4. A display device according to claim 1, characterized in that the cover layer comprises at least one material selected from a resin group consisting of acrylic, epoxy, polyurethane, and silicone.

5. In the fourth paragraph, the cover layer further includes at least one material selected from the group of fillers consisting of boron nitride (BN), graphite powder, graphene, carbon fiber, and carbon nanotube. The mass ratio of the resin group included in the cover layer is 30 wt% to 90 wt%, A display device characterized in that the mass ratio of the filler group included in the cover layer is 10 wt% to 70 wt%.

6. In the first paragraph, the average thickness of the heat dissipation layer is greater than the average thickness of the cover layer, The average thickness of the heat dissipation layer is 10 μm to 1000 μm, A display device characterized in that the average thickness of the cover layer is 5 μm to 50 μm.

7. A display device according to claim 1, characterized in that the thermal conductivity of the heat dissipation layer is 100 W / (m·K) to 1700 W / (m·K).

8. A display device according to claim 1, wherein the cover layer is adhered to one surface of the heat dissipation layer and comprises polyethylene terephthalate (PET).

9. In the first paragraph, a contact hole is defined in the cover layer that penetrates the cover layer in the thickness direction, A display device characterized in that the heat dissipation layer is connected to the printed circuit board through the contact hole.

10. In paragraph 1, Further comprising an adhesive layer disposed between the display panel and the heat dissipation layer, The average thickness of the adhesive layer is greater than the average thickness of the cover layer and less than the average thickness of the heat dissipation layer, A display device characterized in that the adhesive layer bonds the heat dissipation layer and the display panel to each other and includes polyethylene terephthalate.

11. A display panel comprising at least one pixel; A printed circuit board disposed at the lower portion of the display panel and electrically connected to the pixels; A heat dissipation layer comprising graphite and disposed between the display panel and the printed circuit board; A first cover layer disposed on one side of the heat dissipation layer facing the printed circuit board and extending from the one side to cover a portion of the side surface of the heat dissipation layer; and A display device including a second cover layer disposed on the other side opposite to the one side of the heat dissipation layer and extending from the other side to contact the first cover layer.

12. In the 11th paragraph, the first cover layer is adhered to the one surface of the heat dissipation layer and includes polyethylene terephthalate, A display device characterized in that the second cover layer combines the heat dissipation layer and the display panel on the other side of the heat dissipation layer, and comprises polyethylene terephthalate.

13. In the 12th paragraph, a contact hole is defined in the first cover layer that penetrates the first cover layer in the thickness direction, A display device characterized in that the heat dissipation layer is connected to the printed circuit board through the contact hole.

14. In paragraph 11, The first cover layer and the second cover layer are formed integrally to define one metal coating layer that surrounds the one side, the other side, and the side surface of the heat dissipation layer, A display device characterized in that the average thickness of the metal coating layer is 1 μm to 20 μm.

15. A step of forming a cover layer on one side of a heat dissipation layer including graphite; A step of forming an adhesive layer on the other side opposite to the one side of the heat dissipation layer; and A method for manufacturing a display device, comprising the step of covering a side surface of the heat dissipation layer using a polymer material or a metal material.

16. In the 15th paragraph, the step of forming the cover layer on the one side of the heat dissipation layer is as follows: Step of unfolding a graphite sheet in a rolled state; A step of coating a material forming the cover layer on one side of the graphite sheet; and comprising a step of cutting the graphite sheet and the coated cover layer; A method for manufacturing a display device, characterized in that, in the step of covering the side surface of the heat dissipation layer, the side surface of the heat dissipation layer is surrounded by a side cover member.

17. In the 15th paragraph, the step of forming the cover layer on the one side of the heat dissipation layer is as follows: Step of unfolding a graphite sheet in a rolled state; A step of cutting the graphite sheet to form the heat dissipation layer; and Comprising a step of coating a material forming the cover layer on the one surface of the heat dissipation layer, A method for manufacturing a display device, characterized in that, in the step of covering the side surface of the heat dissipation layer, the side surface of the heat dissipation layer is surrounded by a side cover member.

18. In the 15th paragraph, the step of covering the side surface of the heat dissipation layer is: A step of tensioning the cover layer from the one side of the heat dissipation layer to the side surface; A step of forming the adhesive layer from the other side of the heat dissipation layer to the side surface; and A method for manufacturing a display device, characterized in that it comprises a step of bringing the cover layer and the adhesive layer into contact with each other so that the cover layer and the adhesive layer seal the side surface of the heat dissipation layer.

19. In the 15th paragraph, the step of forming the cover layer on the one side of the heat dissipation layer is as follows: Step of unfolding a graphite sheet in a rolled state; A step of cutting the graphite sheet to form the heat dissipation layer; and A step of plating the heat dissipation layer so that the cover layer surrounds all of the one side, the other side, and the side surface of the heat dissipation layer, In the step of forming the adhesive layer on the other side opposite to the one side of the heat dissipation layer, A method for manufacturing a display device, characterized in that the adhesive layer is in contact with the cover layer surrounding the heat dissipation layer.

20. In paragraph 15, A step of forming a contact hole penetrating the cover layer in the thickness direction; and Further comprising a step of electrically connecting the cover layer and the printed circuit board through the contact hole, A method for manufacturing a display device, characterized in that the cover layer comprises at least one material selected from the group of resins consisting of acrylic, epoxy, polyurethane, polyethylene terephthalate and silicone.

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