Camera module and electronic device comprising camera module

Abstract

A camera module according to one embodiment of the present disclosure may comprise: a reflective member including an incident surface and an exit surface through which light introduced through the incident surface passes; a bracket on which the reflective member is disposed; a camera housing including a support part in which at least a portion of the bracket is disposed and a sidewall part perpendicular to the support part; a first carrier which is disposed in the camera housing and which has at least a portion facing the bracket; a lens assembly which includes at least one lens facing the incident surface of the reflective member, and which is disposed in the first carrier such that the lens is spaced apart from the reflective member in the optical axis direction of the lens; a cover member which includes an opening for accommodating a portion of the lens assembly and which is coupled to the camera housing; an image sensor which is disposed in the camera housing, and into which the light passing through the exit surface of the reflective member is introduced; a foreign matter collection part having at least a portion disposed between the image sensor and the lens assembly when the cover member is viewed from above; and an adhesive member disposed in the foreign matter collection part. Other various embodiments are possible.

Description

Camera module and electronic device including camera module

[0001] Various embodiments disclosed in this document relate to a camera module and an electronic device including a camera module.

[0002] Various electronic devices, such as smart phones, tablet PCs, portable multimedia players (PMPs), personal digital assistants (PDAs), laptop personal computers, and wearable devices such as wrist watches and head-mounted displays (HMDs), contain cameras and can capture images using cameras.

[0003] As the number of users using electronic devices to take photos and videos increases, the performance of cameras embedded in these devices is also improving. For example, when taking images using a camera embedded in an electronic device, adjusting the focus of the subject or compensating for any camera shake (e.g., hand shake) that may occur during the capture may be necessary to obtain a clear image.

[0004] A camera module used in an electronic device may include an auto focus (AF) function that automatically adjusts the focus of a lens on a subject and / or an optical image stabilizer (OIS) function that compensates for shaking that occurs in the camera module when photographing a subject. The AF function and the optical image stabilizer function of the camera module may be driven based on an electromagnetic force using a magnet and a coil.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0006] According to one embodiment of the present disclosure, a camera module may include a reflective member having an incident surface and an exit surface through which light entering the incident surface passes. The camera module may include a bracket on which the reflective member is disposed. The camera module may include a camera housing including a support portion on which at least a portion of the bracket is disposed and a side wall portion perpendicular to the support portion. The camera module may include a first carrier disposed in the camera housing and having at least a portion facing the bracket. The camera module may include a lens assembly including at least one lens facing the incident surface of the reflective member and disposed in the first carrier such that the lens is spaced apart from the reflective member in the direction of the optical axis. The camera module may include a cover member coupled to the camera housing and including an opening accommodating a portion of the lens assembly. The camera module may include an image sensor disposed in the camera housing and into which light passing through the exit surface of the reflective member is introduced. The camera module may include a foreign matter capturing portion, at least part of which is disposed between the image sensor and the lens assembly when the cover member is viewed from above. The camera module may include an adhesive member disposed on the foreign matter capturing portion.

[0007] According to one embodiment of the present disclosure, in an electronic device including a camera module, the camera module may include a reflective member including an incident surface and an exit surface through which light entering the incident surface passes. The camera module may include a bracket on which the reflective member is disposed. The camera module may include a camera housing including a support portion on which at least a portion of the bracket is disposed and a side wall portion perpendicular to the support portion. The camera module may include a first carrier disposed in the camera housing and having at least a portion facing the bracket. The camera module may include a lens assembly including at least one lens facing the incident surface of the reflective member and disposed in the first carrier such that the lens is spaced apart from the reflective member in the direction of the optical axis. The camera module may include a cover member coupled to the camera housing and including an opening accommodating a portion of the lens assembly. The camera module may include an image sensor disposed in the camera housing and into which light passing through the exit surface of the reflective member is introduced. The camera module may include a foreign matter capturing portion, at least part of which is disposed between the image sensor and the lens assembly when the cover member is viewed from above. The camera module may include an adhesive member disposed on the foreign matter capturing portion.

[0008] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0010] FIG. 2 is a block diagram illustrating a camera module according to various embodiments.

[0011] FIG. 3A is a perspective view of a camera module according to one embodiment of the present disclosure.

[0012] FIG. 3b is a front view of a camera module according to one embodiment of the present disclosure.

[0013] Figure 4 is a perspective view of the combined camera modules shown in Figures 3a and 3b.

[0014] FIG. 5 is a perspective view of a first carrier including a foreign matter collection unit according to one embodiment of the present disclosure.

[0015] Figure 6 is a cross-sectional view taken along line P1-P1 of Figure 3b.

[0016] FIG. 7 is a drawing of an embodiment of the present disclosure in which a first carrier is movable in the optical axis direction relative to a second carrier, and the second carrier is movable in a direction perpendicular to the optical axis relative to a camera housing.

[0017] FIG. 8 is a perspective view of a camera module according to one embodiment of the present disclosure.

[0018] Fig. 9 is a perspective view of the combined camera module illustrated in Fig. 8.

[0019] Figure 10 is a perspective view of a bracket including a foreign body collecting section and a reflective member arranged thereon.

[0020] Fig. 11 is a cross-sectional view taken along line P2-P2 of Fig. 8.

[0021] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0022] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0023] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0024] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0034] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0036] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0039] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0040] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0041] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] FIG. 2 is a block diagram illustrating a camera module (180) according to various embodiments. Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0044] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0045] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows at least a portion of the image shake caused by the movement to be captured to be compensated for. According to one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). The memory (250) can at least temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to a shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) may be configured as at least a portion of the memory (130), or as a separate memory that operates independently therefrom.

[0046] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) for at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0047] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties (e.g., angle of view) or functions. In this case, for example, the plurality of camera modules (180) may include at least one of a wide-angle camera, a telephoto camera, or an IR Camera (time of flight camera, structured light camera). For example, a plurality of camera modules including lenses having different angles of view are configured, and the electronic device may be controlled to change the angle of view variably according to a user's selection. According to one embodiment, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0048] FIG. 3A is a perspective view of a camera module according to one embodiment of the present disclosure. FIG. 3B is a front view of the camera module according to one embodiment of the present disclosure. FIG. 4 is a combined perspective view of the camera modules illustrated in FIGS. 3A and 3B.

[0049] According to one embodiment of the present disclosure, as illustrated in FIG. 3A, FIG. 3B or FIG. 4, a camera module (300) (e.g., the camera module (180) of FIG. 1) includes a bracket (310) in which a reflective member (R) is accommodated, a camera housing (320), a first carrier (330) (e.g., the first housing, the first bracket (310), the OIS carrier), a second carrier (340) (e.g., the second housing, the second bracket (310), the AF carrier), a middle guide (350) (e.g., the guide member), a lens assembly (360), a stopper (370), a cover member (380) (e.g., a shield can), an image sensor (391) (e.g., the image sensor (230) of FIG. 2), an IR filter (400) (e.g., the IR filter (400) of FIG. 6), an AF actuator (e.g., an AF magnetic body (512) and an AF The first OIS actuator (e.g., the first OIS magnetic body (522) and the first OIS coil (521)), the second OIS actuator (e.g., the second OIS magnetic body (532) and the second OIS coil (531)), the flexible printed circuit board (FPCB) (540), a plurality of AF balls (b1) and / or a plurality of OIS balls (b2) may be included. At least one of the above-described configurations may be omitted or another configuration may be added.

[0050] According to one embodiment, as illustrated in FIG. 4, the camera module (300) may have a first carrier (330) and a second carrier (340) disposed inside the camera housing (320). The first carrier (330) may be disposed inside the second carrier (340) while the lens assembly (360) is accommodated therein. In one embodiment, the camera housing (320) may have an open upper surface so that the second carrier (340) can be inserted and may provide a space in which the second carrier (340) can be seated. In one embodiment, the second carrier (340) may have an open upper surface so that the first carrier (330) can be inserted and may provide a space in which the first carrier (330) can be seated. In one embodiment, the first carrier (330) may include a receiving groove (331) into which the lens assembly (360) is inserted. In one embodiment, the lens assembly (360) can be inserted into the receiving groove (331) of the first carrier (330) and fixed to the interior of the first carrier (330).

[0051] In one embodiment, referring to FIG. 4, a lens assembly (360) (e.g., a lens assembly, a lens module) may include at least one lens (361), a lens barrel (362) (e.g., a barrel) in which the lens (361) is disposed. In one embodiment, the lens assembly (360) may be disposed on a second carrier (340) while being coupled to a first carrier (330). In one embodiment, the lens assembly (360) may be disposed such that the lens (361) is spaced apart from an incident surface (S1) of the reflective member (R) in the +Z direction of FIG. 4. In one embodiment, at least a portion of the lens assembly (360) may be positioned in an opening (383) of a cover member (380) (e.g., a shield can) so as to be visually exposed to the outside of the camera module (300).

[0052] In one embodiment, referring to FIG. 4 and FIG. 6 described below, the first carrier (330) may be placed on the second carrier (340) while the lens assembly (360) is accommodated therein. In one embodiment, the first carrier (330) may be an optical image stabilizer (OIS) drive unit. In one embodiment, the first carrier (330) may move relative to a counterpart (e.g., the camera housing (320) and the second carrier (340)) in a first axis direction perpendicular to the optical axis (e.g., the X-axis or Y-axis direction of FIG. 4) and / or a second axis direction perpendicular to the first axis (e.g., the X-axis or Y-axis direction of FIG. 4) as the processor (120) controls the OIS actuator (e.g., the first OIS actuator (e.g., the first OIS coil (521) and the first OIS magnet (522)) and / or the second OIS actuator (e.g., the second OIS coil (531) and the second OIS magnet (532))) to compensate for image shake.

[0053] In one embodiment, the reflective member (R) may include a configuration that refracts or reflects the path of light, such as a prism or a mirror. In one embodiment, referring to FIG. 4, the reflective member (R) may include an incident surface (S1) on which light is incident, a reflective surface (S3) on which light is reflected or refracted, and an exit surface (S2) on which light incident on the incident surface (S1) is emitted. In one embodiment, the incident surface (S1) of the reflective member (R) may face the lens (361) of the lens assembly (360). Light entering from the outside of the camera module (300) may pass through the lens (361) of the lens assembly (360) - the incident surface (S1) of the reflective member (R) - the exit surface (S2) of the reflective member (R) and enter the image sensor (391) disposed on a part of the camera housing (320) (e.g., the side wall portion (322)) so as to face the exit surface (S2) of the reflective member (R). In one embodiment, light entering the incident surface (S1) of the reflective member (R) is refracted at about 90 degrees through the reflective surface (S3) and emitted to the exit surface (S2) to enter the image sensor (391).

[0054] In one embodiment, the reflective member (R) may be formed in various shapes. In one embodiment, referring to FIG. 6 described below, the cross-section of the reflective member (R) may have a trapezoidal shape. In one embodiment, the cross-section of the reflective member (R) may have a triangular shape in which the incident surface (S1) and the exit surface (S2) form a right angle. In addition, the reflective member (R) may be deformed into various shapes depending on the usage conditions so that the light entering the lens (361) may be refracted and transmitted to the image sensor (391). In one embodiment, the reflective member (R) may include a mirror. In this case, the incident surface and the exit surface may be defined as virtual surfaces rather than the physical surfaces of the mirror.

[0055] According to one embodiment, an additional reflective member (not shown) may be disposed between the reflective member (R) and the side wall portion (322) of the camera housing (320). In one embodiment, the additional reflective member may include an incident surface through which light is incident, a reflective surface through which light is reflected or refracted, and an exit surface through which light incident on the incident surface is emitted. In one embodiment, the incident surface and the exit surface of the additional reflective member may be substantially perpendicular. In one embodiment, the additional reflective member may have a trapezoidal cross-section or a triangular shape in which the incident surface and the exit surface are perpendicular, and may be formed in various other shapes. In one embodiment, the incident surface of the additional reflective member may face the exit surface (S2) of the reflective member (R). The exit surface of the additional reflective member may face the image sensor (391). In one embodiment, when the incident surface and the exit surface of the additional reflective member are substantially perpendicular, the image sensor (391) may be disposed on the support (321) of the camera housing (320) or a portion (e.g., one surface of the camera housing (320)) facing the support (321) so as to face the exit surface of the additional reflective member. Accordingly, light entering from the outside of the camera module (300) may pass through the lens (361) of the lens assembly (360) - the incident surface (S1) of the reflective member (R) - the exit surface (S2) of the reflective member (R) - the incident surface of the additional reflective member - the exit surface of the additional reflective member, and then enter the image sensor (391) disposed on a portion (e.g., the support (321)) of the camera housing (320) so as to face the exit surface of the additional reflective member.

[0056] In one embodiment, referring to FIG. 4, the reflective member (R) may be mounted on the bracket (310). In one embodiment, the bracket (310) may include a mounting groove formed in a shape corresponding to the reflective member (R). In one embodiment, the reflective member (R) may be placed on the bracket (310) such that the inclined surface located within the mounting groove and the reflective surface (S3) face each other.

[0057] In one embodiment, referring to FIG. 4 and FIG. 6 described below, the camera housing (320) can accommodate a bracket (310) on which a reflective member (R) is arranged, a second carrier (340), a middle guide (350), a first carrier (330), a lens assembly (360), and a stopper (370).

[0058] In one embodiment, referring to FIG. 4, the camera housing (320) may include a support portion (321) (e.g., a support surface) on which the second carrier (340) is placed, and a side wall portion (322) (e.g., a side portion, a partition portion) substantially perpendicular to the support portion (321). As will be described below, the side wall portion (322) of the camera housing (320) may be formed along a perimeter of the support portion (321). In one embodiment, the side wall portion (3222) may include a first portion (3221), a second portion (3222), a third portion (3223), and / or a fourth portion (3224). In one embodiment, the first portion (3221) and the third portion (3223) may face each other, and the second portion (3222) and the fourth portion (3224) may face each other. The first part (3221) and the second part (3222) may be perpendicular to each other, and the third part (3223) and the fourth part (3224) may be perpendicular to each other.

[0059] In one embodiment, referring to FIG. 4, the AF coil (511) may be disposed in the first portion (3221) of the camera housing (320). In one embodiment, the first OIS coil (521) may be disposed in the second portion (3222). In one embodiment, the second OIS coil (531) may be disposed in the third portion (3223). In one embodiment, the AF coil (511), the first OIS coil (521), and the second OIS coil (531) may not be limited to the above locations and may be disposed in various portions of the camera housing (320). In one embodiment, the fourth portion (3224) of the camera housing (320) may face the exit surface (S2) of the reflective member (R). In one embodiment, the image sensor (391) may be positioned in the fourth portion (3224) of the camera housing (320) so that light emitted from the emission surface (S2) of the reflective member (R) may be introduced.

[0060] In one embodiment, referring to FIG. 4, the camera housing (320) may include an opening (323) into which a bracket (310) may be inserted. In one embodiment, the opening (323) of the camera housing (320) may be formed in the support (321). In one embodiment, the bracket (310) may be inserted into the opening (323) of the camera housing (320) and secured to the camera housing (320).

[0061] In one embodiment, referring to FIG. 4, the second carrier (340) may be placed in the camera housing (320) to face the support (321) of the camera housing (320). In one embodiment, the second carrier (340) may be placed in the camera housing (320) in a form that surrounds the bracket (310) fixed to the support (321) of the camera housing (320). In one embodiment, as will be described with reference to FIGS. 3A to 6, the second carrier (340) may be an AF (auto focus) drive unit. In one embodiment, the second carrier (340) may perform an AF (auto focus) function to automatically adjust the focus of the lens (361) on a subject by moving in the optical axis direction (e.g., the Z-axis direction of FIG. 4) of the lens (361) relative to the camera housing (320) as the processor (120) controls the AF actuator (e.g., the AF coil (511) and the AF magnet (512)).

[0062] In one embodiment, referring to FIG. 4, a middle guide (350) may be disposed between a first carrier (330) and a second carrier (340). In one embodiment, the middle guide (350) may prevent the first carrier (330) from moving relative to the second carrier (340) along a first axis (e.g., X-axis or Y-axis) and / or a second axis (e.g., Y-axis or X-axis) for shake correction or from rotating relative to the camera housing (320) or the second carrier (340) about an optical axis (e.g., roll axis, Z-axis in FIG. 4) when an external impact is applied to the camera module (300).

[0063] In one embodiment, referring to FIG. 4, the stopper (370) may be coupled to the second carrier (340) to prevent the first carrier (330) from being separated from the second carrier (340). For example, the stopper (370) may prevent the first carrier (330) from being separated or lifted in the +Z direction of FIG. 4 relative to the second carrier (340).

[0064] In one embodiment, referring to FIG. 4, a cover member (380) (e.g., a shield can) may be positioned at the outermost portion of the camera module (300) to cover at least a portion of the camera housing (320). In one embodiment, the cover member (380) may include a material that shields electromagnetic waves generated from the outside of the camera module (300). In one embodiment, the cover member (380) may block or reduce electromagnetic waves generated from the outside of the camera module (300), thereby reducing malfunction of the camera module (300).

[0065] In one embodiment, referring to FIGS. 3A, 3B, and 4, the cover member (380) may be formed in a two-stage shape. In one embodiment, the cover member (380) may include a first cover portion (381) coupled with the camera housing (320) and a second cover portion (382) formed to protrude from the first cover portion (381). In one embodiment, the first cover portion (381) and the second cover portion (382) may be formed integrally through an injection molding process. As in the camera module (600) of FIG. 8, which will be described later, the cover member (380) may be formed such that after the first cover portion (381) is formed, the second cover portion (382) is formed on the first cover portion (381) through a separate insert injection molding process. In this case, the first cover part (381) and the second cover part (382) may be formed of different materials, but may also be formed of the same material.

[0066] In one embodiment, the second cover portion (382) may be formed to protrude in the +Z direction with respect to FIG. 3A relative to the first cover portion (381) and may include an opening (383) formed along the periphery of the lens assembly (360) to accommodate at least a portion of the lens assembly (360). In one embodiment, the second cover portion (382) may be formed to surround the lens assembly (360) to prevent or prevent light entering toward the lens (361) from directly entering the image sensor (391). In one embodiment, the second cover portion (382) may prevent or prevent foreign substances (e.g., dust, fluid) from outside the camera module (300) from entering the image sensor (391).

[0067] According to one embodiment, the camera module (300) can adjust the focus by moving the second carrier (340) in the optical axis direction (e.g., the Z-axis direction of FIG. 4) relative to the camera housing (320) under the control of the processor (120). In one embodiment, the second carrier (340) can move in the optical axis direction (e.g., the Z-axis direction of FIG. 4) of the lens (361) via an AF actuator. In one embodiment, the AF actuator can include an AF coil (511) disposed in the first portion (3221) of the camera housing (320) and an AF magnet (512) disposed in the second carrier (340) to face the AF coil (511). In some embodiments, the AF coil (511) can be disposed in the second carrier (340) and the AF magnet (512) can be disposed in the camera housing (320). The second carrier (340) can perform an AF (auto focus) function to automatically adjust the focus of the lens (361) on a subject by moving in the optical axis direction through an electromagnetic force acting between the AF coil (511) and the AF magnetic body (512). In one embodiment, the AF coil (511) can be electrically connected to a flexible printed circuit board (540) disposed in the camera housing (320). As the processor (120) controls a driving circuit (e.g., driver IC) (not shown) of the camera module (300), a current generated in the driving circuit can be supplied to the AF coil (511) through the flexible printed circuit board (540) connected to the driving circuit. Accordingly, an electromagnetic effect is induced between the AF coil (511) and the AF magnetic body (512), and the second carrier (340) can move in the optical axis direction with respect to the camera housing (320).

[0068] In one embodiment, the AF magnet (512) may be disposed on the second carrier (340) so that the N and S poles face the AF coil (511) disposed on the camera housing (320). In this case, the second carrier (340) may be moved in the optical axis direction with respect to the camera housing (320) while maintaining a vertical distance (e.g., the Y-axis distance in FIG. 4) between the AF coil (511) and the AF magnet (512).

[0069] In one embodiment not shown in the drawing, one of the AF coil (511) and the AF magnet (512) is disposed on the back surface of the second carrier (340) (e.g., the surface facing the support (321) of the camera housing (320), and the other of the AF coil (511) and the AF magnet (512) is disposed on the support (321) of the camera housing (320) to face either the AF coil (511) or the AF magnet. For example, when the AF magnet (512) is disposed on the back surface of the second carrier (340), the AF coil (511) may be disposed on the camera housing (320), and vice versa. In one embodiment, the AF magnet (512) may be disposed on the second carrier (340) or the camera housing (320) such that one of the N pole and the S pole faces the AF coil (511). In this case, the vertical distance of the AF magnetic body (512) to the AF coil (511) can be changed through the electromagnetic force acting on the AF coil (511). Accordingly, the second carrier (340) can move in the direction of the optical axis through the electromagnetic force acting between the AF coil (511) and the AF magnetic body (512) to perform an AF (auto focus) function that automatically adjusts the focus of the lens (361) on the subject.

[0070] According to one embodiment, the camera module (300) can compensate for image shake by moving the first carrier (330) relative to the second carrier (340) under the control of the processor (120). In one embodiment, the electronic device (101) can compensate for image shake by moving the first carrier (330) in the opposite direction to the direction in which the camera module (300) shakes. In one embodiment, the first carrier (330) can be moved in a first axis direction (e.g., the X-axis or the Y-axis of FIG. 4) and / or a second axis direction (e.g., the Y-axis or the X-axis of FIG. 4) substantially perpendicular to the optical axis relative to the second carrier (340) via the first OIS actuator and the second OIS actuator.

[0071] In one embodiment, the first OIS actuator may include a first OIS coil (521) disposed in a second portion (3222) of the camera housing (320) and a first OIS magnetic body (522) disposed in a first carrier (330) facing the first OIS coil (521). In some embodiments, the first OIS coil (521) may be disposed in the first carrier (330), and the first OIS magnetic body (522) may be disposed in the camera housing (320). In one embodiment, the first carrier (330) may be moved in a first axial direction substantially perpendicular to the optical axis via an electromagnetic force acting between the first OIS coil (521) and the first OIS magnetic body (522). In one embodiment, the first OIS coil (521) may be electrically connected to a flexible printed circuit board (540) disposed in the camera housing (320). In one embodiment, the flexible printed circuit board (540) can surround the sidewall portion (322) of the camera housing (320) (e.g., the first portion (3221), the second portion (3222), and the third portion (3223)). The processor (120) controls the driving circuit (e.g., the driver IC) (not shown) of the camera module (300), so that current generated in the driving circuit can be supplied to the first OIS coil (521) through the flexible printed circuit board (540) connected to the driving circuit. Accordingly, an electromagnetic effect is induced between the first OIS coil (521) and the first OIS magnetic body (522), and the first carrier (330) can move in the first axial direction with respect to the second carrier (340) to perform an optical image stabilizer function of correcting image shake.

[0072] In one embodiment, the second OIS actuator may include a second OIS coil (531) disposed in a third portion (3223) of the camera housing (320) and a second OIS magnet (532) disposed in the first carrier (330) and facing the second OIS coil (531). In some embodiments, the second OIS coil (531) may be disposed in the first carrier (330), and the second OIS magnet (532) may be disposed in the camera housing (320). In one embodiment, the first carrier (330) may move in a second axial direction substantially perpendicular to the optical axis through an electromagnetic force acting between the second OIS coil (531) and the second OIS magnet (532). In one embodiment, the second OIS coil (531) may be electrically connected to a flexible printed circuit board (540) disposed in the camera housing (320). The processor (120) controls the driving circuit (e.g., driver IC) (not shown) of the camera module (300), so that the current generated in the driving circuit can be supplied to the second OIS coil (531) through the flexible printed circuit board (540) connected to the driving circuit. Accordingly, an electromagnetic effect is induced between the second OIS coil (531) and the second OIS magnetic body (532), and the first carrier (330) can move in the second axial direction with respect to the second carrier (340) to perform an optical image stabilizer function that corrects shaking of the image.

[0073] In one embodiment, the first OIS magnet (522) and the second OIS magnet (532) may be disposed on the first carrier (330) such that the N pole and the S pole may face the first OIS coil (521) and the second OIS coil (531) disposed on the camera housing (320), respectively. In this case, the first OIS actuator (e.g., the first OIS magnet (522) and the first OIS coil (521)) may move the first carrier (330) relative to the camera housing (320) in the Y-axis direction of FIG. 4, so that the vertical distance (e.g., the X-axis direction distance of FIG. 4) between the first OIS magnet (522) and the first OIS coil (521) may not change. The second OIS actuator (e.g., the second OIS magnet (532) and the second OIS coil (531)) may move the first carrier (330) relative to the camera housing (320) in the X-axis direction of FIG. 4 so that the vertical distance (e.g., the distance in the Y-axis direction of FIG. 4) between the first OIS magnet (522) and the first OIS coil (521) does not change.

[0074] In one embodiment, the first OIS magnetic body (522) and the second OIS magnetic body (532) may be disposed on the first carrier (330) such that one of the N pole and the S pole may face the first OIS coil (521) and the second OIS coil (531) disposed on the camera housing (320), respectively. In this case, the first OIS actuator (e.g., the first OIS magnetic body (522) and the first OIS coil (521)) may move the first carrier (330) in the X-axis direction of FIG. 4 relative to the camera housing (320), thereby changing the vertical distance (e.g., the X-axis direction distance of FIG. 4) between the first OIS magnetic body (522) and the first OIS coil (521). Additionally, the second OIS actuator (e.g., the second OIS magnet (532) and the 12th OIS coil) may change the vertical distance (e.g., the distance in the Y-axis direction in FIG. 4) between the first OIS magnet (522) and the first OIS coil (521) by moving the first carrier (330) relative to the camera housing (320) in the Y-axis direction in FIG. 4.

[0075] According to one embodiment, as illustrated in FIG. 4, at least one AF ball (b1) may be positioned between the second carrier (340) and the camera housing (320). In one embodiment, the AF ball (b1) may be a bearing ball. In one embodiment, the AF ball (b1) may guide the movement of the second carrier (340) when the second carrier (340) moves relative to the camera housing (320) through an electromagnetic force between the AF magnetic body (512) and the AF coil (511). For example, the AF ball (b1) may guide the movement of the second carrier (340) in the optical axis direction relative to the camera housing (320).

[0076] In one embodiment, referring to FIG. 4, the AF ball (b1) may be disposed in a first guide groove (4011, 4012) and a second guide groove (4021, 4022) formed to substantially extend in the optical axis direction (e.g., the Z-axis direction of FIG. 4) in at least one of the camera housing (320) and the second carrier (340). In one embodiment, the first guide groove (4011, 4012) may be formed in the first part (3221) of the camera housing (320). In one embodiment, the second guide groove (4021, 4022) may be formed in the second carrier (340) to correspond to the first guide groove (4011, 4012). In one embodiment, referring to FIG. 4, the first guide grooves (4011, 4012) may include a first-first guide groove (4011) and a first-second guide groove (4012). In one embodiment, the first-first guide groove (4011) and the first-second guide groove (4012) may be spaced apart from each other in the first part (3221) of the camera housing (320). In one embodiment, an AF coil (511) may be arranged between the first-first guide groove (4011) and the first-second guide groove (4012). In one embodiment, referring to FIG. 4, the second guide grooves (4021, 4022) may include a second-first guide groove (4021) and a second-second guide groove (4022). In one embodiment, the second-first guide groove (4021) may be formed to correspond to the first-first guide groove (4011) in the second carrier (340). The second-second guide groove (4022) may be formed to correspond to the first-second guide groove (4012) in the second carrier (340). In one embodiment, an AF magnetic material (512) may be arranged between the second-first guide groove (4021) and the second-second guide groove (4022).In one embodiment, the AF ball (b1) may be positioned between the first-first guide groove (4011) and the second-first guide groove (4021) and between the first-second guide groove (4012) and the second-second guide groove (4022), respectively, to guide movement of the second carrier (340) in the optical axis direction relative to the camera housing (320).

[0077] According to one embodiment, as illustrated in FIG. 4, at least one OIS ball (b2) may be placed between the first carrier (330) and the second carrier (340). In one embodiment, the OIS ball (b2) may be a bearing ball. In one embodiment, the OIS ball (b2) may guide movement of the first carrier (330) in the first axis and / or the second axis direction when the first carrier (330) is moved relative to the second carrier (340) via an electromagnetic force of the first OIS actuator and / or the second OIS actuator.

[0078] In one embodiment, the OIS balls (b2) may be at least three and may be arranged at positions corresponding to the four corners of the first carrier (330) which is substantially rectangular in shape. In one embodiment, when the middle guide (350) (e.g., the middle guide (350)) is not arranged between the first carrier (330) and the second carrier (340), the OIS balls (b2) may be arranged in guide grooves formed on the surfaces where the first carrier (330) and the second carrier (340) face each other. In one embodiment, when the middle guide (350) is arranged between the first carrier (330) and the second carrier (340), the first carrier (330) may include a third guide groove (403) formed on the surface facing the middle guide (350) (e.g., the surface facing the -Z direction of FIG. 4). The middle guide (350) is formed on a surface facing the first carrier (330) (e.g., a surface facing the +Z direction in FIG. 4) and may include a fourth guide groove (404) corresponding to the third guide groove (403). In one embodiment, the OIS ball (b2) may be accommodated in the third guide groove (403) and the fourth guide groove (404) to guide movement of the first carrier (330) with respect to the second carrier (340). In one embodiment, the third guide groove (403) and the fourth guide groove (404) may include a groove guiding movement of the OIS ball (b2) in the X-axis direction and a groove guiding movement in the Y-axis direction, respectively. In one embodiment, the fourth guide groove (404) may be formed on different surfaces of the middle guide (350).

[0079] According to one embodiment, as illustrated in FIGS. 4 and 6, an IR filter (400) and an image sensor (391) may be disposed on a side wall portion (322) (e.g., the fourth portion (3224)) of the camera housing (320). In one embodiment, the image sensor (391) may be disposed on the fourth portion (3224) of the camera housing (320) so as to face the IR filter (400). In one embodiment, the IR filter (400) may be a filter that selectively reflects or absorbs near-infrared wavelengths to block them from entering the image sensor (391). In one embodiment, the IR filter (400) may be disposed on the fourth portion (3224) of the camera housing (320) so as to be positioned between the emission surface (S2) of the reflective member (R) and the image sensor (391). The image sensor (391) detects light emitted or reflected from a subject and transmitted through a lens (361) - a reflective member (R) - an IR filter (400), and converts the light into an electrical signal, thereby obtaining an image corresponding to the subject. In one embodiment, a substrate (e.g., a flexible printed circuit board) (390) connected to the image sensor (391) may be electrically connected to a main substrate on which a processor (120) is disposed via a connector (392).

[0080] FIG. 5 is a perspective view of a first carrier including a foreign matter collecting unit according to one embodiment of the present disclosure. FIG. 6 is a cross-sectional view taken along line P1-P1 of FIG. 3b.

[0081] In one embodiment, the cover member (380) may include an opening (383) for receiving the lens assembly (360). At least a portion of the lens assembly (360) may be received in the opening (383) of the cover member (380). In one embodiment, the lens assembly (360) is disposed in the first carrier (330) and may move in the first and / or second axial directions with respect to the second carrier (340) together with the first carrier (330) for image shake correction. The opening (383) of the cover member (380) may be formed to be sized to receive movement of the lens assembly (360). In one embodiment, foreign matter inside the electronic device (101) and / or foreign matter outside the electronic device (101) may enter the interior of the camera module (300) through the opening (383) of the cover member (380). Foreign matter that has entered the camera module (300) may enter the image sensor (391) or a component adjacent to the image sensor (391) (e.g., IR filter (400)). In this case, when taking a picture or video, the foreign matter may be captured together, which may deteriorate the quality of the picture or video. According to one embodiment of the present disclosure, the camera module (300) may include a foreign matter collection unit (410) (e.g., a dust trap, a foreign matter prevention unit, and / or an adsorption unit) disposed therein. In one embodiment, the foreign matter collection unit (410) may be located in a path through which foreign matter that has entered the interior of the camera module (300) (e.g., foreign matter that has entered through the opening (383) of the cover member (380) or foreign matter that was present in the camera module (300)) enters the image sensor (391). For example, the foreign matter capturing unit (410) may be positioned at least partially between the lens assembly (360) and the image sensor (391) when the camera module (300) is viewed from above (e.g., when viewed in the -Z direction of FIG. 6). In one embodiment, the foreign matter capturing unit (410) may include an adhesive member (P) capable of capturing foreign matter (e.g., bond, double-sided tape, liquid adhesive).Accordingly, foreign substances that have entered the interior of the camera module (300) may be absorbed through the adhesive member (P) of the foreign substance collection unit (410), so that the amount of foreign substances that enter the vicinity of the image sensor (391) may be reduced or may not enter the vicinity of the image sensor (391).

[0082] In one embodiment, the foreign matter collecting portion (410) may be formed in at least one of the lens barrel (362) of the lens assembly (360), the first carrier (330) in which the lens assembly (360) is accommodated, and the bracket (310) in which the reflective member (R) is accommodated. For example, the foreign matter collecting portion (410) may be a part of the lens barrel (362), the first carrier (330), and / or the bracket (310). In one embodiment, the foreign matter collecting portion (410) is formed such that a portion thereof protrudes toward the image sensor (391) from at least one of the lens barrel (362), the first carrier (330), and the bracket (310), and when the camera module (300) is viewed from above (e.g., in the -Z direction of FIG. 6), at least a portion thereof may be disposed between the lens (361) and the image sensor (391).

[0083] In one embodiment, the foreign matter capturing unit (410) may include a recess (411) in which an adhesive member (P) is disposed. The foreign matter capturing unit (410) may be disposed inside the recess (411) to capture foreign matter that has entered the interior of the camera module (300) (e.g., foreign matter that has entered through the opening (383) of the cover member (380) or foreign matter that has existed inside the camera module (300). In some embodiments, the foreign matter capturing unit (410) may not include the recess (411). For example, in an embodiment in which the adhesive member (P) is a double-sided tape, the adhesive member (P) may be attached to one surface of the foreign matter capturing unit (410).

[0084] In one embodiment, the adhesive member (P) of the foreign matter capturing unit (410) is made of a liquid and can be applied to the recess (411) of the foreign matter capturing unit (410) through a dispenser or injector. In one embodiment, the liquid adhesive member (P) can include at least one of epoxy resin, silicone, acrylic, polyurethane, and cyanoacrylate. In one embodiment, the adhesive member (P) can be a double-sided tape.

[0085] According to one embodiment, the embodiment of FIGS. 5, 6 and 7 to be described below may be an embodiment in which the foreign matter collecting unit (410) is formed on the first carrier (330). In one embodiment, referring to FIGS. 5 and 6, the first carrier (330) may include the foreign matter collecting unit (410). In one embodiment, the foreign matter collecting unit (410) may be formed such that at least a portion thereof protrudes from the first carrier (330) toward the image sensor (391) in the + X direction of FIG. 6. In one embodiment, the foreign matter collecting unit (410) may be formed on the outside of the receiving groove (331) in which the lens assembly (360) is disposed when the cover member (380) is viewed from above, such that at least a portion thereof may be disposed between the lens assembly (360) and the image sensor (391). For example, the recess (411) of the foreign matter collecting unit (410) and the adhesive member (P) may be disposed between the lens assembly (360) and the image sensor (391). In one embodiment, at least a portion of the foreign matter collecting unit (410) may be disposed between the exit surface (S2) of the reflective member (R) and the image sensor (391) when the cover member (380) is viewed from above. In this case, when the cover member (380) is viewed from above, at least a portion of the recess (411) of the foreign matter collecting unit (410) and the adhesive member (P) may be disposed between the exit surface (S2) of the reflective member (R) and the image sensor (391). Therefore, foreign substances that have entered the interior of the camera module (300) may be adsorbed through the foreign matter collecting unit (410) and may not be introduced around the image sensor (391).

[0086] In one embodiment, referring to FIGS. 5 and 6, the foreign matter collecting portion (410) may be formed to surround at least a portion of the lens assembly (360) when the cover member (380) is viewed from above (e.g., in the -Z direction of FIG. 6). In one embodiment, the foreign matter collecting portion (410) may include a first portion (410a) positioned between the lens assembly (360) and the image sensor (391) when the cover member (380) is viewed from above (e.g., in the -Z direction of FIG. 6), a second portion (410b) extending along the X-axis of FIG. 5 so as to be perpendicular to the first portion (410a), and a third portion (410c) extending along the X-axis of FIG. 5 so as to be perpendicular to the first portion (410a) and facing the second portion (410b). In one embodiment, as illustrated in FIGS. 5 and 6, the foreign matter capturing portion (410) includes a first portion (410a), a second portion (410b), and a third portion (410c), so that an area corresponding to the opening (383) of the cover member (380) can be increased. As the area corresponding to the opening (383) of the cover member (380) of the foreign matter capturing portion (410) becomes wider, the amount of foreign matter captured can be increased.

[0087] However, in the above description, the foreign matter capturing unit (410) formed in the first carrier (330) is described as including a first part (410a), a second part (410b), and a third part (410c), but it may not be limited thereto. For example, the foreign matter capturing unit (410) may omit either the second part (410b) or the third part (410c). In one embodiment, foreign matter that has entered the interior of the camera module (300) may enter the image sensor (391) through the path between the lens assembly (360) and the image sensor (391). By arranging the foreign matter capturing unit (410) in the path between the lens assembly (360) and the image sensor (391), the amount of foreign matter that has entered the image sensor (391) can be reduced. Accordingly, even if the foreign matter capturing unit (410) includes only the first portion (410a) formed on the first carrier (330), it can capture foreign matter that has entered the interior of the camera module (300) and reduce the amount of foreign matter that has entered the vicinity of the image sensor (391).

[0088] According to one embodiment, the positional relationship of the foreign matter capturing portion (410) with the opening (383) of the cover member (380) can be varied. In one embodiment, referring to FIG. 6, the foreign matter capturing portion (410) can at least partially overlap with the opening (383) of the cover member (380) when the cover member (380) is viewed from above (e.g., in the -Z direction of FIG. 6). For example, the recess (411) and the adhesive member (P) of the foreign matter capturing portion (410) can at least partially overlap with the opening (383) of the cover member (380) when the cover member (380) is viewed from above (e.g., in the -Z direction of FIG. 6). In some embodiments, the recess (411) of the foreign matter collecting portion (410) and the adhesive member (P) may be positioned outside the opening (383) when the cover member (380) is viewed from above, and may not overlap with the opening (383) of the cover member (380). In one embodiment, the maximum radius of the recess (411) and the adhesive member (P) centered on the optical axis of the lens (361) may be wider than the maximum radius of the opening (383) of the cover member (380). However, when the recess (411) of the foreign matter collecting portion (410) is positioned inside the opening (383) of the cover member (380) when the cover member (380) is viewed from above, the maximum radius of the recess (411) centered on the optical axis of the lens (361) may be equal to or smaller than the maximum radius of the opening (383) of the cover member (380). In addition, the positional relationship between the recess (411) of the foreign body capturing portion (410) and the adhesive member (P) with respect to the opening (383) of the cover member (380) may be varied depending on the structure of the camera module (300).

[0089] According to one embodiment, as illustrated in FIG. 6, the lens assembly (360) may be inserted into the receiving groove (331) of the first carrier (330) and fixed to the first carrier (330) via an adhesive (e.g., bond, tape). In one embodiment, the adhesive member (P) disposed in the recess (411) of the foreign matter collecting unit (410) may extend into the receiving groove (331) of the first carrier (330) to cover the adhesive that attaches the lens assembly (360) and the first carrier (330). Therefore, the foreign matter collecting unit (410) may have improved performance in capturing foreign substances that have entered the interior of the camera module (300) as the area where the adhesive member (P) is disposed is expanded.

[0090] In one embodiment, referring to FIG. 6, the receiving groove (331) of the first carrier (330) may be at least partially positioned below the recess (411) of the foreign matter trapping portion (410) (e.g., in the -Z direction of FIG. 6). For example, the receiving groove (331) of the first carrier (330) may include a first support surface (332) that supports or faces the protrusion (363) of the lens barrel (362). The first support surface (332) may be positioned below (e.g., in the -Z direction of FIG. 6) the second support surface (412) positioned within the recess (411). Accordingly, the adhesive member (P) disposed in the recess (411) of the foreign matter trapping portion (410) may extend into the receiving groove (331) of the first carrier (330) to cover the adhesive that attaches the lens assembly (360) and the first carrier (330).

[0091] FIG. 7 is a drawing of an embodiment of the present disclosure in which a first carrier is movable in the optical axis direction relative to a second carrier, and the second carrier is movable in a direction perpendicular to the optical axis relative to a camera housing.

[0092] According to one embodiment, FIG. 7 assumes that the first carrier (330) of the camera module (300) described through FIGS. 3A to 6 is an AF driving unit, and the second carrier (340) is an OIS driving unit. In the following description, descriptions of configurations identical or similar to those of the camera module (300) described through FIGS. 3A to 7 will be omitted.

[0093] In one embodiment, referring to FIG. 7, the first carrier (330) may be an AF driving unit disposed on the second carrier (340). In one embodiment, the first carrier (330) may perform an AF (auto focus) function to automatically adjust the focus of the lens (361) on a subject by moving in the optical axis direction (e.g., the Z-axis direction in FIG. 7) of the lens (361) with respect to the camera housing (320) as the processor (120) controls the AF actuator (e.g., the AF coil (not shown) (e.g., the AF coil (511) of FIG. 4) and the AF magnet (not shown) (e.g., the AF magnet (512) of FIG. 4).

[0094] In one embodiment, the second carrier (340) may move in a first axis direction (e.g., the X-axis or Y-axis direction of FIG. 7) and / or a second axis direction (e.g., the Y-axis or X-axis direction of FIG. 7) perpendicular to the optical axis of the lens (361) relative to the camera housing (320) as the processor (120) controls the OIS actuator (e.g., the OIS coils (521, 531) of FIG. 4 and the OIS magnets (522, 532) of FIG. 4) to compensate for image shake.

[0095] In one embodiment, since the first carrier (330) is an AF driving unit, the AF actuator may include an AF coil disposed on the second carrier (340) and an AF magnetic body disposed on the first carrier (330) to face the AF coil. In some embodiments, the AF coil may be disposed on the first carrier (330) and the AF magnetic body may be disposed on the second carrier (340). The first carrier (330) may move in the optical axis direction through an electromagnetic force acting between the AF coil and the AF magnetic body to perform an AF (auto focus) function that automatically adjusts the focus of the lens (361) on a subject. In one embodiment, the AF ball (b1) may be disposed between the first carrier (330) and the second carrier (340) to guide the optical axis direction movement of the first carrier (330) with respect to the second carrier (340).

[0096] In one embodiment, since the second carrier (340) is an OIS driving unit, the first OIS actuator may include a first OIS coil (e.g., the first OIS coil (521) of FIG. 4) disposed on a portion of the camera housing (320) and a first OIS magnetic body (not shown) (e.g., the first OIS magnetic body (522) of FIG. 4) disposed on the second carrier (340) and facing the first OIS coil. In some embodiments, the first OIS coil may be disposed on the second carrier (340), and the first OIS magnetic body may be disposed on the camera housing (320). In one embodiment, the second carrier (340) may move in a first axis direction substantially perpendicular to the optical axis through an electromagnetic force acting between the first OIS coil and the first OIS magnetic body to correct image shake. In one embodiment, the second OIS actuator may include a second OIS coil (not shown) (e.g., the second OIS coil (531) of FIG. 4) disposed in a portion of the camera housing (320) and a second OIS magnetic body (not shown) (e.g., the OIS magnetic body (532) of FIG. 4) disposed in a second carrier (340) facing the second OIS coil. In some embodiments, the second OIS coil may be disposed in the second carrier (340), and the second OIS magnetic body may be disposed in the camera housing (320). In one embodiment, the second carrier (340) may move in a second axial direction substantially perpendicular to the optical axis through an electromagnetic force acting between the second OIS coil and the second OIS magnetic body to compensate for image shake. In one embodiment, the OIS ball (b2) may be positioned between the second carrier (340) and the camera housing (320) to guide movement of the second carrier (340) in the first axis direction and / or the second axis direction relative to the camera housing (320).

[0097] In one embodiment, the foreign matter capturing unit (410) of FIG. 7 may be substantially the same as the foreign matter capturing unit (410) of FIG. 5, except that it is formed on the first carrier (330), which is the AF driving unit. In one embodiment, the foreign matter capturing unit (410) (e.g., the foreign matter capturing unit (410) of FIG. 5) may be formed on the first carrier (330), which is the AF driving unit. In one embodiment, the foreign matter capturing unit (410) may be located in a path through which foreign matter that has entered the interior of the camera module (300) (e.g., foreign matter that has entered through the opening (383) of the cover member (380) or foreign matter that was present in the camera module (300)) is introduced into the image sensor (391). For example, when the foreign matter capturing unit (410) is viewed from above the camera module (300) (e.g., in the -Z direction of FIG. 7), at least a portion of the foreign matter capturing unit (410) may be positioned between the lens assembly (360) and the image sensor (391). Accordingly, foreign matter that has entered the interior of the camera module (300) may be absorbed through the adhesive member (P) of the foreign matter capturing unit (410) and may not be introduced around the image sensor (391).

[0098] FIG. 8 is a perspective view of a camera module according to one embodiment of the present disclosure. FIG. 9 is a perspective view of the assembled camera module illustrated in FIG. 8. FIG. 10 is a perspective view of a bracket including a foreign matter collecting unit and having a reflective member disposed thereon. FIG. 11 is a cross-sectional view taken along line P2-P2 of FIG. 8.

[0099] The embodiments of FIGS. 8 to 11 below may be embodiments in which the foreign matter collecting portion (420) is formed on the bracket (610) (e.g., the bracket (310) of FIG. 4). In the following description, descriptions of configurations identical or similar to those described through FIGS. 3A to 7 will be omitted. The embodiments of FIGS. 8 to 11 below may have differences in the cover member (680) (e.g., the cover member (380) of FIG. 4) and the bracket (610) compared to the embodiments of FIGS. 3A to 7. Therefore, the differences between the cover member (380) and the bracket (310) of FIG. 4 and the cover member (680) and the bracket (610) of FIG. 9 will be described.

[0100] According to one embodiment of the present disclosure, as illustrated in FIGS. 8 and 9, a camera module (600) (e.g., the camera module (180) of FIG. 1, the camera module (300) of FIG. 3a) includes a bracket (610) (e.g., the bracket (310) of FIG. 4) in which a reflective member (R) is received, a camera housing (620) (e.g., the camera housing (320) of FIG. 4), a first carrier (630) including a receiving groove (631) (e.g., the first carrier (330) of FIG. 4, the first housing, the first bracket, the OIS carrier), a second carrier (640) (e.g., the second carrier (340) of FIG. 4, the second housing, the second bracket, the AF carrier), a middle guide (650) (e.g., the middle guide (350) of FIG. 4, the guide member), a lens (661) (e.g., the lens (661) of FIG. 11, the lens (661) of FIG. 4) A lens assembly (660) including a lens (361) and a lens barrel (662) (e.g., the lens barrel (662) of FIG. 11, the lens barrel (362) of FIG. 4), a stopper (670) (e.g., the stopper (370) of FIG. 4), a cover member (680) (e.g., the cover member (380) of FIG. 4, a shield can), an image sensor (391) (e.g., the image sensor (391) of FIG. 4), an IR filter (400) (e.g., the IR filter (400) of FIG. 4), an AF actuator (e.g., an AF magnetic body (512) (e.g., the magnetic body (512) of FIG. 4) and an AF coil (511) (e.g., the AF coil (511) of FIG. 4), a first OIS actuator (e.g., a first OIS A magnetic body (522) (e.g., the first OIS magnetic body (522) of FIG. 4) and a first OIS coil (521) (e.g., the first OIS coil (521) of FIG. 4), a second OIS actuator (e.g., the second OIS magnetic body (532) (e.g., the second OIS magnetic body (532) of FIG. 4) and a second OIS coil (531) (e.g., the second OIS coil (531) of FIG. 4), a flexible printed circuit board (540) (e.g., the flexible printed circuit board (540) of FIG. 4),It may include a plurality of AF balls (b1) (e.g., AF balls (b1) of FIG. 4) and / or a plurality of OIS balls (b2) (e.g., OIS balls (b2) of FIG. 4). At least one of the above-described configurations may be omitted or another configuration may be added. In one embodiment, the camera housing (620) may include an opening (623) into which a bracket (610) is inserted, a support portion (621), a side wall portion (622) (e.g., a first portion (6221), a second portion (6222), a third portion (6223), and a fourth portion (6224)) similar to the camera housing (320) of FIG. 4. In one embodiment, the AF coil (511) may be disposed in the third portion (6223) of the camera housing (620), the first OIS coil (521) may be disposed in the second portion (6222), the second OIS coil (531) may be disposed in the first portion (6221), and the image sensor (391) may be disposed in the fourth portion (6224).

[0101] In one embodiment, referring to FIG. 9, the AF ball (b1) may be disposed in a first guide groove (6011, 6012) and a second guide groove (6021, 6022) formed to substantially extend in the optical axis direction (e.g., the Z-axis direction of FIG. 9) in at least one of the camera housing (620) and the second carrier (640). In one embodiment, the first guide groove (6011, 6012) may be formed in the third portion (6223) of the camera housing (620). In one embodiment, the second guide groove (6021, 6022) may be formed in the second carrier (640) to correspond to the first guide groove (6011, 6012). In one embodiment, referring to FIG. 9, the first guide grooves (6011, 6012) may include a first-first guide groove (6011) and a first-second guide groove (6012). In one embodiment, the first-first guide groove (6011) and the first-second guide groove (6012) may be spaced apart from each other in a third portion (6223) of the camera housing (620). In one embodiment, an AF coil (511) may be arranged between the first-first guide groove (6011) and the first-second guide groove (6012). In one embodiment, referring to FIG. 9, the second guide grooves (6021, 6022) may include a second-first guide groove (6021) and a second-second guide groove (6022). In one embodiment, the second-first guide groove (6021) may be formed to correspond to the first-first guide groove (6011) in the second carrier (640). The second-second guide groove (6022) may be formed to correspond to the first-second guide groove (6012) in the second carrier (640). In one embodiment, an AF magnetic material (512) may be arranged between the second-first guide groove (6021) and the second-second guide groove (6022).In one embodiment, the AF ball (b1) may be positioned between the first-first guide groove (6011) and the second-first guide groove (6021) and between the first-second guide groove (6012) and the second-second guide groove (6022), respectively, to guide movement of the second carrier (640) in the optical axis direction relative to the camera housing (620).

[0102] In one embodiment, referring to FIG. 9, there may be at least three OIS balls (b2) and they may be positioned at positions corresponding to the four corners of the first carrier (630) which is substantially rectangular in shape. In one embodiment, when the middle guide (650) (e.g., the middle guide (650)) is not positioned between the first carrier (630) and the second carrier (640), the OIS balls (b2) may be positioned in guide grooves formed on the surfaces where the first carrier (630) and the second carrier (640) face each other. In one embodiment, when the middle guide (650) is positioned between the first carrier (630) and the second carrier (640), the first carrier (630) may include a third guide groove (603) formed on the surface facing the middle guide (650) (e.g., the surface facing the -Z direction of FIG. 9). The middle guide (650) is formed on a surface facing the first carrier (630) (e.g., a surface facing the +Z direction in FIG. 9) and may include a fourth guide groove (604) corresponding to the third guide groove (603). In one embodiment, the OIS ball (b2) may be accommodated in the third guide groove (603) and the fourth guide groove (604) to guide movement of the first carrier (630) with respect to the second carrier (640). In one embodiment, the third guide groove (603) and the fourth guide groove (604) may include a groove guiding movement of the OIS ball (b2) in the X-axis direction and a groove guiding movement in the Y-axis direction, respectively. In one embodiment, the fourth guide groove (604) may be formed on different surfaces of the middle guide (650).

[0103] According to one embodiment, as illustrated in FIGS. 8 and 9, the cover member (680) may be formed in a two-stage shape. In one embodiment, the cover member (680) may include a first cover portion (681) coupled with the camera housing (620) and a second cover portion (682) formed to protrude from the first cover portion (681). In one embodiment, the cover member (680) may be formed by forming the second cover portion (682) on the first cover portion (681) through a separate insert injection process after the first cover portion (681) is formed. In one embodiment, the insert injection process may be a process of placing pre-manufactured parts in an injection mold in advance and then injecting an injection molded article into the mold to produce a final product. In one embodiment, the cover member (680) may be formed by placing the first cover portion (681) in the injection mold and then injecting an injection molded article forming the second cover portion (682) into the mold. In one embodiment, the first cover portion (681) and the second cover portion (682) may be formed into various shapes as they are formed through different injection processes. In addition, the first cover portion (681) and the second cover portion (682) may be formed of different materials or the same material as they are formed through different injection processes.

[0104] According to one embodiment, as illustrated in FIGS. 9, 10, and 11, the bracket (610) in which the reflective member (R) is accommodated may include a foreign matter trap (420). In one embodiment, the foreign matter trap (420) may be formed such that at least a portion thereof protrudes from the bracket (610) in the direction of FIG. 11 + X toward the image sensor (391). In one embodiment, the foreign matter trap (420) may be arranged substantially parallel to the incident surface (S1) of the reflective member (R) in the bracket (610).

[0105] In one embodiment, referring to FIGS. 9, 10, and 11, the foreign matter collecting unit (420) may be disposed between the lens assembly (660) and the image sensor (391) when the cover member (680) is viewed from above. For example, the recess (421) of the foreign matter collecting unit (420) and the adhesive member (P) may be disposed between the lens assembly (660) and the image sensor (391). In one embodiment, at least a portion of the foreign matter collecting unit (420) may be disposed between the emission surface (S2) of the reflective member (R) and the image sensor (391) when the cover member (680) is viewed from above. In this case, when the cover member (680) is viewed from above, the recess (421) of the foreign matter collecting portion (420) and at least a portion of the adhesive member (P) may be placed between the emission surface (S2) of the reflective member (R) and the image sensor (391). Therefore, foreign matter that has entered the interior of the camera module (600) may be absorbed through the foreign matter collecting portion (420) and may not enter the vicinity of the image sensor (391).

[0106] In one embodiment not shown in the drawing, the foreign matter collecting unit (420) may be formed on the bracket (610) to surround at least a portion of the lens assembly (660), like the foreign matter collecting unit (420) of FIG. 5, when the cover member (680) is viewed from above (e.g., in the -Z direction of FIG. 11). In one embodiment, the foreign matter collecting unit (420) may include a first portion positioned between the lens assembly (660) and the image sensor (391), a second portion extending perpendicularly to the first portion, and a third portion extending perpendicularly to the first portion and facing the second portion. In one embodiment, the foreign matter collecting unit (420) may include the first portion, the second portion, and the third portion, thereby increasing an area corresponding to the opening (683) of the cover member (680). The foreign substance capturing portion (420) can increase the amount of foreign substances captured as the area corresponding to the opening (683) of the cover member (680) becomes wider.

[0107] According to one embodiment, the positional relationship of the foreign matter capturing portion (420) with the opening (683) of the cover member (680) can be varied. In one embodiment, referring to FIG. 11, the foreign matter capturing portion (420) can at least partially overlap with the opening (683) of the cover member (680) when the cover member (680) is viewed from above (e.g., in the -Z direction of FIG. 11). For example, the recess (421) and the adhesive member (P) of the foreign matter capturing portion (420) can at least partially overlap with the opening (683) of the cover member (680) when the cover member (680) is viewed from above (e.g., in the -Z direction of FIG. 11). In some embodiments, the recess (421) and the adhesive member (P) of the foreign body trapping member (420) may be positioned outside the opening (683) when the cover member (680) is viewed from above, so as not to overlap with the opening (683) of the cover member (680).

[0108] In one embodiment, the maximum radius of the recess (421) centered on the optical axis of the lens (661) and the adhesive member (P) may be wider than the maximum radius of the opening (683) of the cover member (680). However, when the cover member (680) is viewed from above, if the recess (421) of the foreign matter collecting unit (420) is located inside the opening (683) of the cover member (680), the maximum radius of the recess (421) centered on the optical axis of the lens (661) may be equal to or smaller than the maximum radius of the opening (683) of the cover member (680). In addition, the positional relationship between the recess (421) of the foreign matter collecting unit (420) and the adhesive member (P) with respect to the opening (683) of the cover member (680) may be variously modified depending on the structure of the camera module (600).

[0109] In one embodiment of the present disclosure, the camera module (600) may include a foreign matter collecting unit (420) formed on the bracket (610) and positioned between the lens assembly (660) and the image sensor (391). The adhesive member (P) of the foreign matter collecting unit (420) may, as illustrated in FIG. 11, collect foreign matters introduced through the opening (683) of the cover member (680) or foreign matters existing inside the camera module (600). Accordingly, as the amount of foreign matters introduced into the interior of the camera module (600) and introduced around the image sensor (391) is reduced, the phenomenon of deterioration in the quality of photos and videos due to foreign matters may be improved or prevented.

[0110] Camera modules (e.g., camera module (180) of FIG. 1, camera module (300) of FIG. 3A, and camera module (600) of FIG. 8) may be capable of high magnification by utilizing the refraction of light. Camera modules (180, 300, 600) utilizing the refraction of light may include a camera housing (320, 620), a reflective member (R) (e.g., a prism, a mirror), a lens assembly (360, 660) including at least one lens (361, 661), and an image sensor (230, 391). The lens assembly (360, 660) may be disposed in the camera housing (320, 620) so as to face an incident surface (S1) of the reflective member (R) through which light is introduced when the reflective member (R) is disposed in the camera housing (320, 620). Light passing through the lens assembly (360, 660) enters the incident surface (S1) of the reflective member (R), and can be reflected or refracted by the reflective member (R) and transmitted to the image sensor (230, 391).

[0111] Meanwhile, the camera module (180, 300, 600) may include a cover member (e.g., shield can) (380, 680) constituting the exterior. The cover member (380, 680) may include an opening (383, 683) for accommodating a lens assembly (360, 660) so that the lens (361, 661) can be visually exposed to the outside of the camera module (180, 300, 600). The lens assembly (360, 660) is disposed on a carrier (e.g., the first carrier (330) of FIG. 4, the first carrier (630) of FIG. 9) disposed below the cover member (380, 680) so as to adjust the focus of the lens (361, 661) as it moves in the optical axis direction of the lens (361, 661) (e.g., the Z-axis direction of FIG. 3A or the Z-axis direction of FIG. 8), or can correct image shake by moving in a direction perpendicular to the optical axis (e.g., the X-axis and / or Y-axis direction of FIG. 3A or FIG. 8). The opening (383, 683) of the cover member (380, 680) can be formed to a size capable of accommodating the movement of the lens assembly (360, 660). Foreign substances inside the electronic device (101) and / or outside the electronic device (101) may enter the interior of the camera module (1800, 300, 600) through the opening (383, 683) of the cover member (380, 680). Foreign substances entering the interior of the camera module (180, 300, 600) may enter around the image sensor (230, 391). In this case, when taking a photo or video, the foreign substances may be captured together, which may deteriorate the quality of the photo or video.

[0112] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0113] According to one embodiment of the present disclosure, a camera module (180, 300, 600) comprises a reflective member (R) including an incident surface (S1) and an exit surface (S2) through which light entering the incident surface passes, a bracket (310, 610) on which the reflective member is arranged, a support portion (321, 621) on which at least a portion of the bracket is arranged, and a side wall portion (322, 622) perpendicular to the support portion, a first carrier (330, 630) arranged in the camera housing and having at least a portion facing the bracket, at least one lens (361, 661) facing the incident surface of the reflective member, a lens assembly (360, 660) arranged in the first carrier and having the lens spaced apart from the reflective member in the direction of the optical axis of the lens, a cover including an opening (383, 683) for accommodating a portion of the lens assembly and coupled to the camera housing The cover member may include a foreign matter collecting member (380, 680), an image sensor (230, 391) disposed in the camera housing and into which light passing through the emission surface of the reflective member is introduced, a foreign matter collecting member (410, 420) at least part of which is disposed between the image sensor and the lens assembly when the cover member is viewed from above, and an adhesive member (P) disposed in the foreign matter collecting member.

[0114] In one embodiment, the foreign body trapping member may be formed in any one of the bracket, the first carrier, and the lens assembly.

[0115] In one embodiment, when the cover member is viewed from above, at least a portion of the foreign matter trapping portion may overlap the opening.

[0116] In one embodiment, the foreign matter collecting portion may include a first portion (410a) positioned between the lens assembly and the image sensor when the cover member is viewed from above, a second portion (410b) extending vertically with respect to the first portion, and a third portion (410c) extending vertically with respect to the first portion and facing the second portion, and may be formed on the first carrier.

[0117] In one embodiment, the first carrier may include a receiving groove (331, 631) in which the lens assembly is received, and the foreign matter collecting portion may include a recess (411) formed on the outside of the receiving groove when the cover member is viewed from above and in which the adhesive member is placed.

[0118] In one embodiment, the adhesive member may extend from the recess into the receiving groove to cover the adhesive that attaches the lens assembly and the first carrier.

[0119] In one embodiment, the first support surface (332) located within the receiving groove of the first carrier may be located lower than the second support surface (412) located within the recess of the foreign matter collecting portion.

[0120] In one embodiment, the foreign matter collecting portion is formed on the bracket and protrudes toward the image sensor, and when the cover member is viewed from above, can be substantially parallel to an incident surface of the reflective member facing the lens assembly.

[0121] In one embodiment, the foreign body capturing portion may include a recess (421) in which the adhesive member is placed.

[0122] In one embodiment, the cover member may include a first cover portion (381, 681) coupled with the camera housing and a second cover portion (382, 682) formed to protrude from the first cover portion and having the opening formed therein.

[0123] In one embodiment, the second cover portion may be formed on the first cover portion through an insert injection process.

[0124] In one embodiment, the camera module may further include a second carrier (340, 640) disposed in the camera housing and accommodating the first carrier.

[0125] In one embodiment, the camera module may further include a first OIS magnetic body (522) disposed on one of the camera housing and the first carrier, a first OIS coil (521) disposed on the other of the camera housing and the first carrier and facing the first OIS magnetic body, a second OIS magnetic body (532) disposed on one of the camera housing and the first carrier, a second OIS coil (531) disposed on the other of the camera housing and the first carrier and facing the second OIS magnetic body, and an OIS ball (b2) disposed between the first carrier and the second carrier to guide movement of the first carrier with respect to the second carrier. The first carrier can move in a first axis direction perpendicular to the optical axis of the lens through an electromagnetic force acting between the first OIS magnetic body and the first OIS coil, and can move in a second axis direction perpendicular to the first axis through an electromagnetic force acting between the second OIS magnetic body and the second OIS coil.

[0126] In one embodiment, the camera housing further includes an AF magnet (512) disposed on one of the camera housing and the second carrier, an AF coil (511) disposed on the other of the camera housing and the second carrier, and an AF ball (b1) disposed between the camera housing and the second carrier to guide movement of the second carrier with respect to the camera housing, wherein the second carrier can move in the optical axis direction of the lens through an electromagnetic force acting between the AF magnet and the AF coil.

[0127] In one embodiment, the camera housing comprises: an AF magnetic body (512) disposed on one of the first carrier and the second carrier; an AF coil (511) disposed on the other of the first carrier and the second carrier and facing the AF magnetic body; a first OIS magnetic body (522) disposed on one of the camera housing and the second carrier; a first OIS coil (521) disposed on the other of the camera housing and the second carrier and facing the first OIS magnetic body; a second OIS magnetic body (532) disposed on one of the camera housing and the second carrier; a second OIS coil (531) disposed on the other of the camera housing and the second carrier and facing the second OIS magnetic body; an AF ball (b1) disposed between the first carrier and the second carrier and guiding movement of the first carrier with respect to the second carrier; an OIS disposed between the second carrier and the camera housing and guiding movement of the second carrier with respect to the camera housing. A ball (b2) may be further included. The first carrier may move in the direction of the optical axis of the lens through an electromagnetic force acting between the AF magnetic body and the AF coil. The second carrier may move in a first axis direction perpendicular to the optical axis of the lens through an electromagnetic force acting between the first OIS magnetic body and the first OIS coil, and may move in a second axis direction perpendicular to the first axis through an electromagnetic force acting between the second OIS magnetic body and the second OIS coil.

[0128] In one embodiment, the reflective member may include an incident surface (S1) facing the lens assembly and an exit surface (S2) perpendicular to the incident surface and facing the image sensor. At least a portion of the foreign matter collecting unit may be disposed between the exit surface of the reflective member and the image sensor when the cover member is viewed from above.

[0129] In one embodiment, the cover member may be formed of a material that shields electromagnetic waves.

[0130] In one embodiment, the camera module may further include an additional reflective member disposed between the reflective member and the side wall portion of the camera housing, the additional reflective member including an incident surface facing the exit surface of the reflective member and an exit surface facing the image sensor. The image sensor may be disposed on the support portion of the camera housing (320) or a portion facing the support portion to face the exit surface of the additional reflective member.

[0131] According to one embodiment of the present disclosure, in an electronic device (101) including a camera module (180, 300, 600), the camera module comprises: a reflective member (R) including an incident surface (S1) and an exit surface (S2) through which light entering the incident surface passes; a bracket (310, 610) on which the reflective member is disposed; a support portion (321, 621) on which at least a portion of the bracket is disposed; and a side wall portion (322, 622) perpendicular to the support portion; a first carrier (330, 630) disposed in the camera housing and having at least a portion facing the bracket; at least one lens (361, 661) facing the incident surface of the reflective member; a lens assembly (360, 660) disposed in the first carrier and having the lens spaced apart from the reflective member in the direction of the optical axis of the lens; and accommodating a portion of the lens assembly. It may include a cover member (380, 680) that includes an opening (383, 683) and is coupled to the camera housing, an image sensor (230, 391) that is disposed in the camera housing and into which light passing through the emission surface of the reflective member is introduced, a foreign matter collecting member (410, 420) that is disposed at least partially between the image sensor and the lens assembly when the cover member is viewed from above, and an adhesive member (P) that is disposed in the foreign matter collecting member.

[0132] In one embodiment, the foreign body trapping member may be formed on any one of the bracket, the first carrier, and the lens assembly.

[0133] In one embodiment, when the cover member is viewed from above, at least a portion of the foreign matter trapping portion may overlap the opening.

[0134] According to one embodiment of the present disclosure, the camera module (180, 300, 600) may include a foreign matter collecting unit (410, 420) (e.g., a dust trap, a foreign matter prevention unit, and / or an adsorption unit) disposed therein. The foreign matter collecting unit (410, 420) may be located in a path through which foreign matter that has entered the interior of the camera module (180, 300, 600) (e.g., foreign matter that has entered through an opening (383, 683) of a cover member (380, 680) or foreign matter that was present in the camera module (180, 300, 600)) is introduced to the image sensor (230, 391). The foreign matter collecting unit (410, 420) may include an adhesive member (P) (e.g., a bond, a double-sided tape, a liquid adhesive) capable of collecting foreign matter. Accordingly, foreign substances that have entered the interior of the camera module (180, 300, 600) may be absorbed through the adhesive member (P) of the foreign substance collection unit (410, 420) and may not be introduced around the image sensor (230, 391). Accordingly, as the amount of foreign substances that have entered the interior of the camera module (180, 300, 600) and that have entered around the image sensor (230, 391) is reduced, the phenomenon of deterioration in the quality of photos and videos due to foreign substances may be improved or prevented.

[0135] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0136] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0137] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0138] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0139] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0140] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0141] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In the camera module (180, 300, 600), A reflective member (R) including an incident surface (S1) and an exit surface (S2) through which light entering the incident surface passes; A bracket (310, 610) on which the above reflective member is placed; A camera housing (320, 620) including a support portion (321, 621) on which at least a portion of the above bracket is arranged and a side wall portion (322, 622) perpendicular to the support portion; A first carrier (330, 630) disposed in the camera housing and having at least a portion facing the bracket; A lens assembly (360, 660) comprising at least one lens (361, 661) facing the incident surface of the reflective member, the lens being arranged on the first carrier such that the lens is spaced apart in the direction of the optical axis of the lens with respect to the reflective member; A cover member (380, 680) including an opening (383, 683) for accommodating a portion of the lens assembly and coupled to the camera housing; An image sensor (230, 391) disposed in the camera housing and into which light passing through the emission surface of the reflective member is introduced; When the cover member is viewed from above, a foreign matter collecting portion (410, 420) at least part of which is disposed between the image sensor and the lens assembly; and A camera module including an adhesive member (P) disposed in the foreign matter capturing section.

2. In paragraph 1, The above foreign matter collection unit, A camera module formed on any one of the above bracket, the first carrier and the lens assembly.

3. In paragraph 1, A camera module in which at least a portion of the foreign matter capturing portion overlaps with the opening when the cover member is viewed from above.

4. In paragraph 2, The above foreign matter collection unit, When the cover member is viewed from above, a first part (410a) located between the lens assembly and the image sensor; A second portion (410b) extending vertically with respect to the first portion, and A camera module formed on the first carrier, comprising a third portion (410c) extending perpendicularly to the first portion and facing the second portion.

5. In paragraph 4, The first carrier is, It includes a receiving groove (331, 631) in which the above lens assembly is received, The above foreign matter collection unit, A camera module including a recess (411) formed on the outer side of the receiving groove and in which the adhesive member is placed when the cover member is viewed from above.

6. In paragraph 5, The above adhesive member is, A camera module extending from the recess to the receiving groove and covering the adhesive that attaches the lens assembly and the first carrier.

7. In paragraph 5, The first support surface (332) located within the receiving groove of the first carrier is A camera module positioned below the second support surface (412) located within the recess of the foreign body collecting portion.

8. In paragraph 2, The above foreign matter collection unit, formed on the above bracket and protruding toward the image sensor, A camera module that is substantially parallel to the incident surface of the reflective member facing the lens assembly when the cover member is viewed from above.

9. In paragraph 8, The above foreign matter collection unit, A camera module including a recess (421) in which the adhesive member is placed.

10. In paragraph 1, The above cover member, It includes a first cover part (381, 681) that is combined with the camera housing and a second cover part (382, 682) that is formed to protrude from the first cover part and has the opening formed therein. The above second cover part A camera module formed in the first cover portion through an insert injection process.

11. In paragraph 1, A camera module further comprising a second carrier (340, 640) disposed in the camera housing and accommodating the first carrier.

12. In paragraph 11, A first OIS magnet (522) disposed in one of the camera housing and the first carrier; A first OIS coil (521) disposed on the other of the camera housing and the first carrier and facing the first OIS magnetic body; A second OIS magnet (532) disposed in one of the camera housing and the first carrier; A second OIS coil (531) disposed on the other of the camera housing and the first carrier and facing the second OIS magnetic body; and An OIS ball (b2) disposed between the first carrier and the second carrier to guide movement of the first carrier relative to the second carrier; An AF magnet (512) disposed in either the camera housing or the second carrier; An AF coil (511) disposed on the other of the camera housing and the second carrier; and Further comprising an AF ball (b1) positioned between the camera housing and the second carrier to guide movement of the second carrier relative to the camera housing; The above first carrier is, Move in the first axis direction perpendicular to the optical axis of the lens through the electromagnetic force acting between the first OIS magnetic body and the first OIS coil, Move in the second axis direction perpendicular to the first axis through the electromagnetic force acting between the second OIS magnetic body and the second OIS coil, The above second carrier, A camera module that moves in the direction of the optical axis of the lens through an electromagnetic force acting between the AF magnetic body and the AF coil.

13. In paragraph 11, An AF magnetic material (512) disposed on either the first carrier or the second carrier; An AF coil (511) disposed on the other of the first carrier and the second carrier and facing the AF magnetic body; A first OIS magnet (522) disposed in one of the camera housing and the second carrier; A first OIS coil (521) disposed on the other of the camera housing and the second carrier and facing the first OIS magnetic body; A second OIS magnet (532) disposed in one of the camera housing and the second carrier; A second OIS coil (531) disposed on the other of the camera housing and the second carrier and facing the second OIS magnetic body; An AF ball (b1) positioned between the first carrier and the second carrier to guide movement of the first carrier relative to the second carrier; Further comprising an OIS ball (b2) positioned between the second carrier and the camera housing to guide movement of the second carrier relative to the camera housing; The above first carrier is, Moves in the direction of the optical axis of the lens through the electromagnetic force acting between the AF magnetic body and the AF coil, The above second carrier, Move in the first axis direction perpendicular to the optical axis of the lens through the electromagnetic force acting between the first OIS magnetic body and the first OIS coil, A camera module that moves in a second axis direction perpendicular to the first axis through an electromagnetic force acting between the second OIS magnetic body and the second OIS coil.

14. In paragraph 1, The above reflective member is, It includes an incident surface (S1) facing the lens assembly and an exit surface (S2) perpendicular to the incident surface and facing the image sensor, The above foreign matter collection unit, A camera module in which, when viewed from above, at least a portion of the cover member is positioned between the emission surface of the reflective member and the image sensor.

15. In an electronic device (101) including a camera module (180, 300, 600), The above camera module, A reflective member (R) including an incident surface (S1) and an exit surface (S2) through which light entering the incident surface passes; A bracket (310, 610) on which the above reflective member is placed, A camera housing (320, 620) including a support portion (321, 621) on which at least a portion of the above bracket is placed and a side wall portion (322, 622) perpendicular to the support portion; A first carrier (330, 630) disposed in the above camera housing and having at least a portion facing the bracket; A lens assembly (360, 660) including at least one lens (361, 661) facing the incident surface of the reflective member, and arranged on the first carrier so that the lens is spaced apart in the direction of the optical axis of the lens with respect to the reflective member, A cover member (380, 680) including an opening (383, 683) for accommodating a portion of the lens assembly and coupled to the camera housing; An image sensor (230, 391) placed in the above camera housing and into which light passing through the emission surface of the reflective member is introduced; When the above cover member is viewed from above, a foreign matter collecting portion (410, 420) at least part of which is disposed between the image sensor and the lens assembly, and An electronic device including an adhesive member (P) disposed in the foreign matter collecting section.

Images