Flexible display module and manufacturing method therefor, and electronic device

Abstract

A flexible display module (100) and a manufacturing method therefor, and an electronic device. In the flexible display module, a support structure (20) comprises a first fiber substrate (21) and a first adhesive material (22) bonded to the first fiber substrate, and a conductive structure (30) comprises a conductive portion (32) arranged in a second fiber substrate (31), a first conductive layer (33) and a second conductive layer (34) which are arranged on two sides of the second fiber substrate, and a second adhesive material (38) arranged on the first conductive layer; the second adhesive material is bonded to the first adhesive material; and the conductive structure is bonded to the support structure by means of the second adhesive material and the first adhesive material.

Description

Flexible display modules and their fabrication methods, electronic devices Technical Field

[0001] This application relates to the field of display technology, and in particular to a flexible display module and its manufacturing method, as well as electronic devices. Background Technology

[0002] With the development of display technology, the demand for thinner and lighter flexible electronic products is gradually increasing. The design of the support structure in flexible electronic products plays a crucial role in achieving this thinness and lightness. Currently, the industry commonly uses low-density composite materials as support structures in flexible display modules, such as carbon fiber reinforced polymer (CFRP). Compared to using metal materials such as stainless steel as support structures, CFRP lacks conductivity due to the resin content. To address the conductivity issue of CFRP, two methods exist: attaching copper foil to the surface of the CFRP and sputtering a layer of metallic nickel on the surface using physical vapor deposition (PVD) to create a conductive structure. For the copper foil method, the copper foil thickness is 35-50 μm, and the high density of copper results in a thick and heavy conductive structure. The PVD method, which sputters metallic nickel, reduces both thickness and weight compared to copper foil, but PVD is more expensive, and the high sputtering temperature affects the flatness of the CFRP, leading to a decrease in yield. Invention Overview

[0003] This application provides a flexible display module and its manufacturing method, as well as an electronic device, to alleviate the technical problems of high cost and low yield in fabricating conductive structures on support structures.

[0004] The technical solution provided in this application is as follows:

[0005] In a first aspect, embodiments of this application provide a flexible display module, which includes:

[0006] Flexible display panel;

[0007] A conductive support structure is disposed on the back side of the flexible display panel. The conductive support structure includes a support structure and a conductive structure. The support structure includes a first fiber substrate and a first adhesive material bonded to the first fiber substrate.

[0008] The conductive structure is disposed on the side of the support structure away from the flexible display panel, and the conductive structure includes a second fiber substrate and a conductive portion disposed within the second fiber substrate;

[0009] The conductive structure further includes a first conductive layer, a second conductive layer, and a second adhesive material. The first conductive layer is located on the side of the second fiber substrate closer to the support structure, and the second conductive layer is located on the side of the second fiber substrate away from the first conductive layer. The first conductive layer is connected to the second conductive layer through the conductive portion. The second adhesive material is located on the side of the first conductive layer closer to the support structure and is bonded to the first adhesive material. The conductive structure is bonded to the support structure through the second adhesive material and the first adhesive material.

[0010] Secondly, embodiments of this application also provide a method for manufacturing a flexible display module, comprising:

[0011] A first fiber substrate is provided, wherein the first fiber substrate is filled with a first adhesive material;

[0012] A conductive structure is prepared, the conductive structure including a second fiber substrate and a conductive portion disposed within the second fiber substrate, the conductive structure further including a first conductive layer located on the side of the second fiber substrate near the support structure, a second conductive layer located on the side of the second fiber substrate away from the first conductive layer, and a second adhesive material located on the side of the first conductive layer near the support structure, the first conductive layer being connected to the second conductive layer through the conductive portion;

[0013] The first fiber substrate and the conductive structure are integrally thermo-pressed to form a support structure by combining the first fiber substrate with the first adhesive material, and by combining the second adhesive material with the first adhesive material, so that the conductive structure is combined with the support structure through the second adhesive material and the first adhesive material to form a conductive support structure.

[0014] A flexible display panel is provided, and the conductive support structure is attached to the back side of the flexible display panel, with the conductive structure located on the side of the support structure away from the flexible display panel.

[0015] Thirdly, embodiments of this application also provide an electronic device that includes a flexible display module as described in one of the foregoing embodiments. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments or prior art, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 is a partial cross-sectional structural diagram of the flexible display module provided in an embodiment of this application.

[0018] Figure 2 is a detailed structural diagram of the support structure in Figure 1.

[0019] Figure 3 is a detailed structural diagram of the conductive structure in Figure 1.

[0020] Figure 4 is a schematic diagram showing the detailed structure of the second fiber substrate in Figure 3.

[0021] Figure 5 is a schematic diagram of the arrangement of the conductive structure on the support structure provided in the embodiment of this application.

[0022] Figure 6 is a flowchart illustrating the flexible display module fabrication method provided in the embodiments of this application. Embodiments of the present invention

[0023] The following descriptions of the embodiments are with reference to the accompanying illustrations, illustrating specific embodiments in which this application can be implemented. Directional terms used in this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustration and understanding of this application, and not for limiting this application. In the figures, structurally similar units are denoted by the same reference numerals. In the figures, the thickness of some layers and regions is exaggerated for clarity and ease of description. That is, the dimensions and thicknesses of each component shown in the figures are arbitrarily shown, but this application is not limited thereto.

[0024] This application provides a flexible display module, which includes:

[0025] Flexible display panel;

[0026] A conductive support structure is disposed on the back side of the flexible display panel. The conductive support structure includes a support structure and a conductive structure. The support structure includes a first fiber substrate and a first adhesive material bonded to the first fiber substrate.

[0027] The conductive structure is disposed on the side of the support structure away from the flexible display panel, and the conductive structure includes a second fiber substrate and a conductive portion disposed within the second fiber substrate;

[0028] The conductive structure further includes a first conductive layer, a second conductive layer, and a second adhesive material. The first conductive layer is located on the side of the second fiber substrate closer to the support structure, and the second conductive layer is located on the side of the second fiber substrate away from the first conductive layer. The first conductive layer is connected to the second conductive layer through the conductive portion. The second adhesive material is located on the side of the first conductive layer closer to the support structure and is bonded to the first adhesive material. The conductive structure is bonded to the support structure through the second adhesive material and the first adhesive material.

[0029] In one embodiment, the support structure and the conductive structure are combined by integral hot pressing.

[0030] In one embodiment, the conductive structure further includes a third conductive layer disposed on the side of the first conductive layer away from the second fiber substrate and a fourth conductive layer disposed on the side of the second conductive layer away from the second fiber substrate. The third conductive layer is located between the first conductive layer and the second adhesive material. The oxidation resistance of the third conductive layer is greater than that of the first conductive layer, and the oxidation resistance of the fourth conductive layer is greater than that of the second conductive layer.

[0031] In one embodiment, the first conductive layer and the second conductive layer are made of the same material, and the first conductive layer and the conductive portion are made of the same material, and the third conductive layer and the fourth conductive layer are made of the same material; the material of the first conductive layer includes at least one of copper, gold, and silver, and the material of the third conductive layer includes at least one of nickel, titanium, and molybdenum.

[0032] In one embodiment, the conductive structure further includes an electrochemical passivation layer disposed on the side of the fourth conductive layer away from the second fiber substrate, wherein the oxidation resistance of the electrochemical passivation layer is greater than that of the fourth conductive layer.

[0033] In one embodiment, the thickness of the second adhesive material is less than 1 micrometer.

[0034] In one embodiment, both the first adhesive material and the second adhesive material comprise epoxy resin, phenolic resin, or conductive resin containing conductive particles or conductive fibers.

[0035] In one embodiment, the surface resistance of the conductive structure is less than the vertical resistance of the conductive support structure.

[0036] In one embodiment, the flexible display module further includes a back plate and a buffer layer disposed between the flexible display panel and the support structure. The buffer layer is located on the side of the back plate away from the flexible display panel. The material of the back plate is different from the material of the support structure. The material of the back plate includes polyethylene terephthalate. The material of the buffer layer is different from the material of the support structure. The material of the buffer layer includes foam.

[0037] In one embodiment, the first fiber substrate includes at least two layers of carbon fiber stacked together, with adjacent carbon fiber layers bonded together by the first adhesive; the second fiber substrate includes a polyester fiber layer or a weakly conductive fiber layer formed by blending polyester fiber with conductive fiber.

[0038] In one embodiment, the first fiber substrate includes three layers of carbon fiber stacked together, each layer of the carbon fiber layer including carbon fibers, and the carbon fibers in two adjacent layers of the carbon fiber layer pass through the first adhesive material and contact each other.

[0039] In one embodiment, the thickness of the first adhesive material between two adjacent carbon fiber layers is less than 1 micrometer.

[0040] In one embodiment, the thickness of the second fiber substrate is less than 20 micrometers, and the thickness of the conductive structure is less than 22 micrometers.

[0041] In one embodiment, the thickness of the second fiber substrate is 10 micrometers, and the thickness of the conductive structure is 12 micrometers.

[0042] In one embodiment, the orthographic projection of the conductive structure on the flexible display panel lies within the orthographic projection of the supporting structure on the flexible display panel.

[0043] In one embodiment, the flexible display panel has a bending area and a non-bending area located on at least one side of the bending area, the support structure is provided with a hollow structure at the position corresponding to the bending area, and the conductive structure is provided corresponding to the non-bending area.

[0044] In one embodiment, the surface shape of the conductive structure includes at least one of square, circular, and frame shapes.

[0045] This application also provides a method for manufacturing a flexible display module, which includes:

[0046] A first fiber substrate is provided, wherein the first fiber substrate is filled with a first adhesive material;

[0047] A conductive structure is prepared, the conductive structure including a second fiber substrate and a conductive portion disposed within the second fiber substrate, the conductive structure further including a first conductive layer located on the side of the second fiber substrate near the support structure, a second conductive layer located on the side of the second fiber substrate away from the first conductive layer, and a second adhesive material located on the side of the first conductive layer near the support structure, the first conductive layer being connected to the second conductive layer through the conductive portion;

[0048] The first fiber substrate and the conductive structure are integrally thermo-pressed to form a support structure by combining the first fiber substrate with the first adhesive material, and by combining the second adhesive material with the first adhesive material, so that the conductive structure is combined with the support structure through the second adhesive material and the first adhesive material to form a conductive support structure.

[0049] A flexible display panel is provided, and the conductive support structure is attached to the back side of the flexible display panel, with the conductive structure located on the side of the support structure away from the flexible display panel.

[0050] In one embodiment, the step of preparing the conductive structure includes:

[0051] Provide a second fiber substrate;

[0052] Copper is electroplated on the second fiber substrate to form a conductive portion within the second fiber substrate and a first conductive layer and a second conductive layer are formed on two opposing surfaces of the second fiber substrate.

[0053] Nickel is electroplated on the second fiber substrate to form a third conductive layer on the first conductive layer and a fourth conductive layer on the second conductive layer;

[0054] The fourth conductive layer is subjected to electrochemical passivation treatment to form an electrochemical passivation layer on the fourth conductive layer;

[0055] The second adhesive material is coated onto the third conductive layer.

[0056] This application also provides an electronic device that includes a flexible display module from one of the foregoing embodiments.

[0057] The flexible display module, its manufacturing method, and electronic device of this application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0058] Please refer to Figures 1 to 5. Figure 1 is a partial cross-sectional structural diagram of the flexible display module provided in this application embodiment. Figure 2 is a detailed structural diagram of the support structure in Figure 1. Figure 3 is a detailed structural diagram of the conductive structure in Figure 1. Figure 4 is a detailed structural diagram of the second fiber substrate in Figure 3. Figure 5 is a schematic diagram of the arrangement of the conductive structure on the support structure provided in this application embodiment. Referring to Figure 1, the flexible display module 100 includes a flexible display panel 10 and a conductive support structure 1 disposed on the back side of the flexible display panel 10. The conductive support structure 1 includes a support structure 20 and a conductive structure 30. The conductive structure 30 is disposed on the side of the support structure 20 away from the flexible display panel 10. The flexible display panel 10 includes an organic light-emitting diode (OLED) display panel, etc. Organic light-emitting diode display panels have flexible characteristics and can realize functions such as bending and folding. Optionally, the flexible display panel 10 includes a flexible substrate and functional layers such as a driving circuit layer, a light-emitting functional layer, and an encapsulation layer stacked on the flexible substrate.

[0059] The flexible display panel 10 has a light-emitting side and a non-light-emitting side opposite to the light-emitting side. The light-emitting side refers to the side of the flexible display panel 10 used to display images, and the non-light-emitting side is the back side of the flexible display panel 10.

[0060] Optionally, the flexible display module 100 further includes a back plate 40 and a buffer layer 50 disposed between the flexible display panel 10 and the support structure 20. The buffer layer 50 is located on the side of the back plate 40 away from the flexible display panel 10. The back plate 40 is used to support the flexible display panel 10 and prevent the film layer of the flexible display panel 10 from collapsing. The material of the back plate 40 is different from that of the support structure 20, and the material of the back plate 40 includes polyethylene terephthalate (PET) and the like. The material of the buffer layer 50 is different from that of the support structure 20, and the material of the buffer layer 50 may include foam and the like, thereby providing stress buffering and heat dissipation channels for the flexible display panel 10.

[0061] The flexible display module 100 further includes a polarizer 60 and a cover plate 70 disposed on the light-emitting side of the flexible display panel 10. The cover plate 70 is disposed on the side of the polarizer 60 away from the flexible display panel 10. The basic structure of the polarizer 60 includes two layers of TAC (cellulose triacetate) and PVA (polyvinyl alcohol) between the two TAC layers. The PVA layer is responsible for polarization; however, PVA is highly susceptible to hydrolysis. To protect the physical properties of the polarizing film, a TAC film with high light transmittance, good water resistance, and a certain mechanical strength is laminated on both sides of the PVA for protection. The polarizer 60 is a polymer film layer with high polarization optical properties and resistance to high temperature and humidity. It is used to reduce the reflection of natural light by the flexible display panel 10, making the light emitted by the flexible display panel 10 closer to natural light, effectively reducing visual fatigue for viewers.

[0062] The cover plate 70 can be made of transparent organic polymer materials such as polyethylene terephthalate, which provides excellent optical properties and wear resistance, allowing the flexible display panel 10 to transmit light while protecting it from external damage. Alternatively, the cover plate 70 can be made of ultra-thin glass, which also provides excellent optical properties and corrosion resistance, thus protecting the flexible display panel 10 from water and oxygen corrosion.

[0063] The support structure 20 is disposed on the side of the buffer layer 50 away from the flexible display panel 10. The support structure 20 is used to reinforce the supporting performance of the back plate 40 and maintain the bending shape of the flexible display panel 10. The flexible display panel 10 has a bending area and a non-bending area located on at least one side of the bending area. The support structure 20 is provided with a hollow structure 201 at the position corresponding to the bending area. The hollow structure 201 can release the bending stress of the flexible display panel 10.

[0064] Referring to Figure 2, the support structure 20 includes a first fiber substrate 21 and a first adhesive material 22 disposed in the first fiber substrate 21. Optionally, the first fiber substrate 21 includes at least two layers of carbon fiber stacked together, with adjacent carbon fiber layers bonded together by the first adhesive material 22. Preferably, the first fiber substrate 21 includes three layers of carbon fiber stacked together, each layer comprising carbon fibers with good electrical conductivity. The carbon fibers in adjacent carbon fiber layers pass through the first adhesive material 22 and contact each other to achieve vertical conductivity of the support structure 20 in the vertical direction, where the vertical direction is perpendicular to the horizontal plane where the support structure 20 is located. The thickness of the first adhesive material 22 between adjacent carbon fiber layers is less than 1 micrometer, so that the carbon fibers can pierce the first adhesive material 22 to achieve vertical conductivity of adjacent carbon fiber layers in the vertical direction. The first adhesive material 22 also fills the gaps between the carbon fibers. The first adhesive material includes epoxy resin, phenolic resin, or conductive resin containing conductive particles or conductive fibers, etc., and epoxy resin is preferred in this embodiment. Epoxy resin has excellent physical and mechanical properties, electrical insulation properties, and adhesion properties to various materials, especially to metals.

[0065] Carbon fiber, also known as carbon fiber cloth, carbon fiber woven fabric, carbon fiber prepreg, carbon fiber reinforced fabric, carbon cloth, carbon fiber woven fabric, carbon fiber tape, and carbon fiber sheet, has advantages such as high strength, low density, and thinness. Primarily composed of carbon, carbon fiber possesses properties such as high temperature resistance, friction resistance, electrical conductivity, thermal conductivity, and corrosion resistance. It has a fibrous, flexible shape and can be processed into various fabrics. Due to its graphite microcrystalline structure preferentially oriented along the fiber axis, it exhibits very high tensile strength and tensile modulus along the fiber axis. Carbon fiber also boasts advantages such as low density, high specific strength, and high specific modulus.

[0066] Understandably, the carbon fiber layer may include carbon fibers extending in different directions. Specifically, it may be woven from warp and weft threads of carbon fiber material, forming a mesh structure. The first adhesive 22 is located within the mesh structure of the carbon fiber layer and on its surface, used to bond the carbon fiber layer during the formation of the support structure 20. The warp direction is the first direction, and the weft direction is the second direction, with the first and second directions perpendicular to each other. Specifically, the carbon fiber extending along the first direction can be the first carbon fiber, and the carbon fiber extending along the second direction can be the second carbon fiber.

[0067] Referring to Figure 3, the conductive structure 30 is disposed on the side of the support structure 20 away from the buffer layer 50. The conductive structure 30 includes a second fiber substrate 31 and a conductive portion 32 disposed within the second fiber substrate 31. The conductive structure 30 also includes a first conductive layer 33 located on the side of the second fiber substrate 31 near the support structure 20, a second conductive layer 34 located on the side of the second fiber substrate 31 away from the first conductive layer 33, and a second adhesive material 38 located on the side of the first conductive layer 33 near the support structure 20. The second adhesive material 38 is bonded to the first adhesive material 22, and the conductive structure 30 is bonded to the support structure 20 through the second adhesive material 38 and the first adhesive material 22. The first conductive layer 33 is connected to the second conductive layer 34 through the conductive portion 32. By integrally molding the conductive structure 30 with the support structure 20 through the second adhesive material 38 and the first adhesive material 22 to form the conductive support structure 1, the problems of high cost and low yield associated with sputtering a nickel layer onto the surface of a carbon fiber composite board using physical vapor deposition (PVD) to form the conductive structure 30 can be avoided.

[0068] Optionally, the second fiber substrate 31 comprises a polyester fiber layer or a weakly conductive fiber layer formed by blending polyester fibers with conductive fibers. Referring to FIG4, the second fiber substrate 31 comprises fibers 311, with gaps 310 between the fibers 311. The conductive portion 32 is located within the gaps 310 of the fibers 311. The thickness of the second fiber substrate 31 is less than 20 micrometers, for example, the thickness of the second fiber substrate 31 is 19 micrometers, 18 micrometers, 17 micrometers, 16 micrometers, 15 micrometers, 14 micrometers, 13 micrometers, 12 micrometers, 11 micrometers, 10 micrometers, 9 micrometers, 8 micrometers, etc. Preferably, the thickness of the second fiber substrate 31 is less than or equal to 10 micrometers.

[0069] The first conductive layer 33 and the second conductive layer 34 are made of the same material, and the first conductive layer 33 and the conductive portion 32 are made of the same material. The material of the first conductive layer 33 includes at least one of the metals with excellent conductivity, such as copper, gold, and silver. The first conductive layer 33, the second conductive layer 34, and the conductive portion 32 are integrally formed. Specifically, copper is electroplated onto the second fiber substrate 31 using an electroplating process. The electroplated copper forms within the gaps between the fibers of the second fiber substrate 31 and on two opposing surfaces of the second fiber substrate 31, such as the upper and lower surfaces of the second fiber substrate 31. The electroplated copper formed within the gaps between the fibers of the second fiber substrate 31 forms the conductive portion 32, the electroplated copper formed on the upper surface of the second fiber substrate 31 forms the first conductive layer 33, and the electroplated copper formed on the lower surface of the second fiber substrate 31 forms the second conductive layer 34.

[0070] By electroplating copper into the fiber gaps and upper and lower surfaces of the second fiber substrate 31, costs can be reduced and conductivity can be achieved on the upper and lower surfaces and vertically of the conductive structure 30. Specifically, double-sided electroplating is simpler and less expensive than single-sided electroplating. Single-sided electroplating requires a mask to be set to cover the non-plated layers, and the cost of the copper and nickel metal used in the plating layer is much lower than the cost of the mask fixture. To achieve isotropic conductivity, i.e., conductivity in both the surface and vertical directions, the conductive structure 30 needs to be electroplated on both sides, and the fiber gaps should also be electroplated with metal to achieve conductivity on the upper and lower surfaces and vertically of the conductive layer.

[0071] The thickness of both the first conductive layer 33 and the second conductive layer 34 is less than 1 micrometer, for example, the thicknesses of the first conductive layer 33 and the second conductive layer 34 are 0.9 micrometers, 0.8 micrometers, 0.7 micrometers, 0.6 micrometers, 0.5 micrometers, 0.4 micrometers, 0.3 micrometers, 0.2 micrometers, and 0.1 micrometers, respectively. The thickness of the conductive structure 30 is less than 22 micrometers. Compared with the method of attaching copper foil to the surface of carbon fiber composite board, the thickness of the conductive structure 30 can be reduced, thereby reducing the weight. Moreover, the use of fiber as the substrate for the conductive structure 30 can further reduce the weight of the conductive structure 30.

[0072] The second adhesive material 38 includes epoxy resin, phenolic resin, or conductive resin containing conductive particles or conductive fibers. Optionally, the material of the second adhesive material 38 is the same as that of the first adhesive material 22 to further improve the stability of the bond between the conductive structure 30 and the support structure 20. The thickness of the second adhesive material 38 is less than 1 micrometer, for example, the thickness of the second adhesive material 38 is 0.9 micrometers, 0.8 micrometers, 0.7 micrometers, 0.6 micrometers, 0.5 micrometers, 0.4 micrometers, 0.3 micrometers, 0.2 micrometers, 0.1 micrometers, etc., so that the carbon fibers in the support structure 20 can pierce the second adhesive material 38 to achieve vertical conductivity between the support structure 20 and the conductive structure 30 in the vertical direction, thereby achieving vertical conductivity of the conductive support structure 1 in the vertical direction.

[0073] In one embodiment, the support structure 20 and the conductive structure 30 are combined by integral hot pressing to form the conductive support structure 1, thereby saving a process step and eliminating the impact of PVD sputtering temperature on the appearance of the carbon fiber sheet, thus achieving cost reduction and yield improvement in design.

[0074] In one embodiment, referring to FIG5, the orthographic projection of the conductive structure 30 on the flexible display panel 10 lies within the orthographic projection of the supporting structure 20 on the flexible display panel 10. The conductive structure 30 is disposed corresponding to the non-bending area of ​​the flexible display panel 10. The surface shape of the conductive structure 30 includes at least one of square, circular, and frame shapes, for example, the surface shape of the conductive structure 30 shown in FIG5(a) is circular; the surface shape of the conductive structure 30 shown in FIG5(b) is square; and the surface shape of the conductive structure 30 shown in FIG5(c) is frame-shaped. Of course, the surface shape of the conductive structure 30 in this application is not limited to these, and the surface of the conductive structure 30 can be specifically set according to actual needs.

[0075] In one embodiment, referring to FIG3, the conductive structure 30 further includes a third conductive layer 35 disposed on the side of the first conductive layer 33 away from the second fiber substrate 31, and a fourth conductive layer 36 disposed on the side of the second conductive layer 34 away from the second fiber substrate 31. The oxidation resistance of the third conductive layer 35 is greater than that of the first conductive layer 33, and the oxidation resistance of the fourth conductive layer 36 is greater than that of the second conductive layer 34. This improves the oxidation problem of the first conductive layer 33 and the second conductive layer 34, enhancing the corrosion resistance and oxidation resistance of the conductive structure 30. The third conductive layer 35 and the fourth conductive layer 36 are made of the same material; for example, the material of the third conductive layer 35 includes at least one of nickel, titanium, and molybdenum.

[0076] Optionally, nickel can be electroplated onto the first conductive layer 33 and the second conductive layer 34 to form a third conductive layer 35 on the first conductive layer 33 and a fourth conductive layer 36 on the second conductive layer 34. The thickness of both the third conductive layer 35 and the fourth conductive layer 36 is less than 1 micrometer, for example, 0.9 micrometers, 0.8 micrometers, 0.7 micrometers, 0.6 micrometers, 0.5 micrometers, 0.4 micrometers, 0.3 micrometers, 0.2 micrometers, or 0.1 micrometers. The thickness of the conductive structure 30 is less than 22 micrometers.

[0077] In one embodiment, referring to FIG3, the conductive structure 30 further includes an electrochemical passivation layer 37 disposed on the side of the fourth conductive layer 36 away from the second fiber substrate 31. The oxidation resistance of the electrochemical passivation layer 37 is greater than that of the fourth conductive layer 36. The electrochemical passivation layer 37 can be formed by electrochemically passivating the fourth conductive layer 36. By electrochemically passivating the fourth conductive layer 36, a dense metal oxide film can be formed on the surface of the fourth conductive layer 36. The dense metal oxide film is the electrochemical passivation layer 37, which can further improve the corrosion resistance and oxidation resistance of the conductive structure 30. The thickness of the electrochemical passivation layer 37 is less than 1 micrometer, for example, the thickness of the electrochemical passivation layer 37 is 0.9 micrometers, 0.8 micrometers, 0.7 micrometers, 0.6 micrometers, 0.5 micrometers, 0.4 micrometers, 0.3 micrometers, 0.2 micrometers, 0.1 micrometers, etc. The thickness of the conductive structure 30 is less than 22 micrometers.

[0078] In one embodiment, the thickness of the conductive structure 30 is less than 22 micrometers. For example, when the thickness of the second fiber substrate 31 is 10 micrometers, the thickness of the conductive structure 30 is 12 micrometers. That is, the conductive structure 30 in this application can form a conductive structure 30 with a thickness of less than 12 micrometers by electroplating a conductive layer on the second fiber substrate 31, thereby reducing the overall weight of the conductive support structure 1.

[0079] The bonding force between the conductive structure 30 and the supporting structure 20, as well as the conductivity of the conductive supporting structure 1, are superior to those of the structure formed by sputtering a nickel layer onto the surface of a carbon fiber composite plate using physical vapor deposition (PVD). Specifically, the surface resistivity at room temperature and after boiling in water for the conductive structure formed by sputtering a nickel layer onto the surface of a carbon fiber composite plate using PVD is 0.9 ohms to 1.1 ohms, and the surface resistivity in salt spray is 1 ohm to 1.5 ohms. In contrast, the surface resistivity at room temperature and after boiling in water for the conductive structure 30 of this application is 0.2 ohms to 0.3 ohms, and the surface resistivity in salt spray is 0.5 ohms to 0.7 ohms. The surface resistivity of the conductive structure 30 in this application is less than the vertical resistance of the conductive supporting structure 1. The salt spray adhesion of the conductive structure formed by sputtering a nickel layer onto the surface of a carbon fiber composite plate using PVD is 4B, while the salt spray adhesion of the conductive structure 30 in this application is 5B.

[0080] In one embodiment, this application also provides a method for fabricating a flexible display module. Referring to Figures 1 to 6, Figure 6 is a schematic flowchart of the flexible display module fabrication method provided in this embodiment. The flexible display module fabrication method includes the following steps:

[0081] S601: Provide a first fiber substrate 21, wherein the first fiber substrate 21 is filled with a first adhesive material 22;

[0082] S602: Prepare a conductive structure 30, the conductive structure 30 including a second fiber substrate 31 and a conductive portion 32 disposed in the second fiber substrate 31, the conductive structure 30 further including a first conductive layer 33 located on the side of the second fiber substrate 31 near the support structure 20, a second conductive layer 34 located on the side of the second fiber substrate 31 away from the first conductive layer 33, and a second adhesive 38 located on the side of the first conductive layer 33 near the support structure 20, the first conductive layer 33 being connected to the second conductive layer 34 through the conductive portion 32;

[0083] The step of preparing the conductive structure 30 includes:

[0084] Provide a second fiber substrate 31;

[0085] Copper is electroplated on the second fiber substrate 31 to form a conductive portion 32 in the second fiber substrate 31 and a first conductive layer 33 and a second conductive layer 34 on two opposite surfaces of the second fiber substrate 31.

[0086] Nickel is electroplated on the second fiber substrate 31 to form a third conductive layer 35 on the first conductive layer 33 and a fourth conductive layer 36 on the second conductive layer 34.

[0087] The fourth conductive layer 36 is subjected to electrochemical passivation treatment to form an electrochemical passivation layer 37 on the fourth conductive layer 36;

[0088] The second adhesive material 38 is coated on the third conductive layer 35.

[0089] S603: The first fiber substrate 21 and the conductive structure 30 are integrally hot-pressed to form a support structure 20 by combining the first fiber substrate 21 with the first adhesive material 22, and the second adhesive material 38 is combined with the first adhesive material 22, so that the conductive structure 30 is combined with the support structure 20 through the second adhesive material 38 and the first adhesive material 22 to form a conductive support structure 1.

[0090] S604: Provide a flexible display panel 10, attach the conductive support structure 1 to the back side of the flexible display panel 10, and position the conductive structure 30 on the side of the support structure 20 away from the flexible display panel 10.

[0091] Based on the same inventive concept, this application also provides an electronic device, which includes the flexible display module 100 described in one of the foregoing embodiments or the flexible display module 100 prepared by the flexible display module preparation method described in one of the foregoing embodiments. The electronic device can be a mobile phone or smartphone, a portable gaming device, a laptop computer, a PDA, a portable internet device, a music player, and a data storage device, other handheld devices, and devices such as headphones. The electronic device can also be other wearable devices that require charging.

[0092] As can be seen from the above embodiments:

[0093] This application provides a flexible display module and its manufacturing method. In an electronic device, the flexible display module includes a flexible display panel and a conductive support structure disposed on the back side of the flexible display panel. The conductive support structure includes a support structure and a conductive structure. The support structure includes a first fiber substrate and a first adhesive material bonded to the first fiber substrate. The conductive structure includes a conductive portion disposed in a second fiber substrate, a first conductive layer and a second conductive layer disposed on the upper and lower surfaces of the second fiber substrate, and a second adhesive material disposed on the side of the first conductive layer near the support structure. The second substrate is bonded to the first adhesive material, and the conductive structure is bonded to the support structure through the second adhesive material and the first adhesive material. In this way, the conductive structure and the support structure can be integrally formed to form the conductive support structure, which avoids the problems of high cost and low yield caused by sputtering a metallic nickel layer on the surface of a carbon fiber composite plate to form a conductive structure using physical vapor deposition.

[0094] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0095] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A flexible display module, comprising: Flexible display panel; A conductive support structure is disposed on the back side of the flexible display panel. The conductive support structure includes a support structure and a conductive structure. The support structure includes a first fiber substrate and a first adhesive material bonded to the first fiber substrate. The conductive structure is disposed on the side of the support structure away from the flexible display panel, and the conductive structure includes a second fiber substrate and a conductive portion disposed within the second fiber substrate; The conductive structure further includes a first conductive layer, a second conductive layer, and a second adhesive material. The first conductive layer is located on the side of the second fiber substrate closer to the support structure, and the second conductive layer is located on the side of the second fiber substrate away from the first conductive layer. The first conductive layer is connected to the second conductive layer through the conductive portion. The second adhesive material is located on the side of the first conductive layer closer to the support structure and is bonded to the first adhesive material. The conductive structure is bonded to the support structure through the second adhesive material and the first adhesive material.

2. The flexible display module according to claim 1, wherein, The supporting structure and the conductive structure are combined by integral hot pressing.

3. The flexible display module according to claim 1, wherein, The conductive structure further includes a third conductive layer disposed on the side of the first conductive layer away from the second fiber substrate and a fourth conductive layer disposed on the side of the second conductive layer away from the second fiber substrate. The third conductive layer is located between the first conductive layer and the second adhesive material. The oxidation resistance of the third conductive layer is greater than that of the first conductive layer, and the oxidation resistance of the fourth conductive layer is greater than that of the second conductive layer.

4. The flexible display module according to claim 3, wherein, The first conductive layer and the second conductive layer are made of the same material, and the first conductive layer and the conductive part are made of the same material. The third conductive layer and the fourth conductive layer are made of the same material. The material of the first conductive layer includes at least one of copper, gold, and silver, and the material of the third conductive layer includes at least one of nickel, titanium, and molybdenum.

5. The flexible display module according to claim 3, wherein, The conductive structure further includes an electrochemical passivation layer disposed on the side of the fourth conductive layer away from the second fiber substrate, wherein the oxidation resistance of the electrochemical passivation layer is greater than that of the fourth conductive layer.

6. The flexible display module according to claim 1, wherein, The thickness of the second adhesive material is less than 1 micrometer.

7. The flexible display module according to claim 6, wherein, Both the first adhesive material and the second adhesive material include epoxy resin, phenolic resin, or conductive resin containing conductive particles or conductive fibers.

8. The flexible display module according to claim 1, wherein, The surface resistance of the conductive structure is less than the vertical resistance of the conductive support structure.

9. The flexible display module according to claim 1, wherein, The flexible display module further includes a back plate and a buffer layer disposed between the flexible display panel and the support structure. The buffer layer is located on the side of the back plate away from the flexible display panel. The material of the back plate is different from the material of the support structure. The material of the back plate includes polyethylene terephthalate. The material of the buffer layer is different from the material of the support structure. The material of the buffer layer includes foam.

10. The flexible display module according to any one of claims 1 to 9, wherein, The first fiber substrate includes at least two layers of carbon fiber stacked together, with adjacent carbon fiber layers bonded together by the first adhesive; the second fiber substrate includes a polyester fiber layer or a weakly conductive fiber layer formed by blending polyester fiber with conductive fiber.

11. The flexible display module according to claim 10, wherein, The first fiber substrate comprises three layers of carbon fiber stacked together, each layer of the carbon fiber layer comprising carbon fibers, and the carbon fibers in two adjacent layers of the carbon fiber layer passing through the first adhesive material and contacting each other.

12. The flexible display module according to claim 11, wherein, The thickness of the first adhesive material between two adjacent carbon fiber layers is less than 1 micrometer.

13. The flexible display module according to claim 9, wherein, The thickness of the second fiber substrate is less than 20 micrometers, and the thickness of the conductive structure is less than 22 micrometers.

14. The flexible display module according to claim 13, wherein, The thickness of the second fiber substrate is 10 micrometers, and the thickness of the conductive structure is 12 micrometers.

15. The flexible display module according to any one of claims 1 to 9, wherein, The orthographic projection of the conductive structure on the flexible display panel lies within the orthographic projection of the supporting structure on the flexible display panel.

16. The flexible display module according to claim 15, wherein, The flexible display panel has a bending area and a non-bending area located on at least one side of the bending area. The support structure has a hollow structure at the position corresponding to the bending area, and the conductive structure is provided corresponding to the non-bending area.

17. The flexible display module according to claim 15, wherein, The surface shape of the conductive structure includes at least one of square, circular, and frame shapes.

18. A method for manufacturing a flexible display module, comprising: A first fiber substrate is provided, wherein the first fiber substrate is filled with a first adhesive material; A conductive structure is prepared, the conductive structure including a second fiber substrate and a conductive portion disposed within the second fiber substrate, the conductive structure further including a first conductive layer located on the side of the second fiber substrate near the support structure, a second conductive layer located on the side of the second fiber substrate away from the first conductive layer, and a second adhesive material located on the side of the first conductive layer near the support structure, the first conductive layer being connected to the second conductive layer through the conductive portion; The first fiber substrate and the conductive structure are integrally thermo-pressed to form a support structure by combining the first fiber substrate with the first adhesive material, and by combining the second adhesive material with the first adhesive material, so that the conductive structure is combined with the support structure through the second adhesive material and the first adhesive material to form a conductive support structure. A flexible display panel is provided, and the conductive support structure is attached to the back side of the flexible display panel, with the conductive structure located on the side of the support structure away from the flexible display panel.

19. The method for manufacturing a flexible display module according to claim 18, wherein, The steps for preparing the conductive structure include: Provide a second fiber substrate; Copper is electroplated on the second fiber substrate to form a conductive portion within the second fiber substrate and a first conductive layer and a second conductive layer are formed on two opposing surfaces of the second fiber substrate. Nickel is electroplated on the second fiber substrate to form a third conductive layer on the first conductive layer and a fourth conductive layer on the second conductive layer; The fourth conductive layer is subjected to electrochemical passivation treatment to form an electrochemical passivation layer on the fourth conductive layer; The second adhesive material is coated onto the third conductive layer.

20. An electronic device comprising a flexible display module as claimed in any one of claims 1 to 17.

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