Flexible LED transparent display module, and LED transparent display screen

Abstract

A flexible LED transparent display module (100), and an LED transparent display screen (1000). A flexible LED transparent display module (100). In the flexible LED transparent display module, a transparent substrate in the LED transparent display module in the prior art is eliminated, and LED lamp beads (2) are directly mounted on a substrate-free flexible circuit network (1), which is flexible and has no substrate, wherein the substrate-free flexible circuit network (1) is extremely thin and is flexible. In this way, while ensuring high resolution and high light transmittance, when a plurality of flexible LED transparent display modules (100) are tiled, same can be aligned more easily and connected more easily at tiling joints, and even higher resolution can be achieved. The gap error between adjacent flexible LED transparent display modules (100) is smaller, and gaps at the tiling joints are more uniform, thereby ensuring an excellent display effect.

Description

Flexible LED transparent display module and LED transparent display screen

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 2024221430032, filed on August 30, 2024, entitled "Flexible LED Transparent Display Module and LED Transparent Display Screen", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of LEDs, and more particularly to the field of transparent LED displays. Background Technology

[0004] Transparent LED displays are increasingly widely used in the market and have evolved into various product forms. A technology for transparent LED displays, in which LED beads are arrayed on a transparent substrate, has emerged. As shown in Figures 1 and 2, an improved transparent LED display 1000 is provided, comprising a panel 200, a back panel 300, and an LED transparent display module 100 sandwiched between the panel 200 and the back panel 300. By assembling multiple LED transparent display modules 100 to form a larger transparent display, a larger display area can be achieved. As shown in Figure 1, the LED transparent display module 100 includes a transparent substrate 3, on which a circuit layer 1 is provided, and an array of LED beads 2, each encapsulated with a chip, is mounted on the transparent substrate 3. This type of LED transparent display screen 1000 has the advantage of high transparency. However, under normal circumstances, the size of a single LED transparent display module 100 is limited. For example, its length or width can reach a maximum of 550mm. When a larger screen is needed, multiple LED transparent display modules 100 must be spliced ​​together. When higher density and smaller pitch are required, such as a pitch of less than 3.9mm, due to certain processing errors in the transparent substrate 3, it is not easy to align the LED transparent display modules 100 at the splicing point. The LED transparent display screen 1000 has obvious bright and dark lines at the splicing point, which affects the display effect.

[0005] Utility Model Content

[0006] To overcome the problems of the prior art, this application provides a flexible LED light-transmitting display module and an LED transparent display screen.

[0007] This application provides a flexible LED transparent display module, including a baseless flexible circuit network and LED beads arranged in an array on the baseless flexible circuit network; the baseless flexible circuit network includes power supply lines arranged at intervals and with opposite polarities, and signal lines arranged between the power supply lines;

[0008] The power supply line extends from both sides with equidistant electrode pin pads, the signal line includes signal pin pads, and the electrode pin pads and the signal pin pads form a lamp bead soldering area; the LED lamp bead is soldered on the lamp bead soldering area.

[0009] The LED lamp bead includes two electrode pins with opposite polarities and at least one signal pin; the electrode pins of the LED lamp bead are soldered to the electrode pin pads with the same polarity; the signal pins of the LED lamp bead are soldered in parallel or in series to the signal pin pads.

[0010] The spacing between the LED beads is ≤8mm, and the width of at least one of the power supply line and the signal line is ≤1.5mm.

[0011] This application eliminates the transparent substrate in existing LED transparent display modules, instead directly mounting LED beads onto a flexible, substrate-free, baseless flexible circuit network. This baseless flexible circuit network is extremely thin and flexible. Therefore, while maintaining high resolution and high light transmittance, it allows for easier alignment and connection at the splicing points when multiple flexible LED transparent display modules are joined. The resolution can even be higher. The gap error between adjacent flexible LED transparent display modules is smaller, and the gaps at the splicing points are more uniform, ensuring excellent display effects.

[0012] The circuit pattern layers commonly formed in existing LED transparent poster display modules are typically the natural color of the metal material (usually copper foil) or the color of metal plating (such as silver or nickel plating). In practical applications, the natural color of the copper foil or the color of metal plating can produce various reflections and interference colors, which are extremely detrimental to the LED display quality and easily interfere with the display effect. Therefore, a preferred approach can be further optimized and improved.

[0013] Preferably, an anti-interference ink layer is formed on at least one surface of the substrate-free flexible circuit network on which LED beads are mounted. In this way, the interference caused by the natural color of the circuit pattern layer is greatly reduced by using the anti-interference ink layer.

[0014] During their research and development, the inventors discovered that LED chips can be either TOP-type or CHIP-type. Because of the smaller pixel pitch, CHIP-type chips offer sufficient space within a small area to accommodate the driver IC and the light-emitting chip, making them the optimal choice. However, a drawback of CHIP-type chips is that RGB light leaks outwards, creating inter-pixel interference.

[0015] Preferably, the LED bead is a chip-type LED bead, and the chip-type LED bead has a light-blocking ink layer on its side. This eliminates light leakage from the chip-type LED bead, avoids interference, and further improves display quality.

[0016] Preferably, the anti-interference ink layer on the baseless flexible circuit network and the anti-transmittance ink layer on the side of the CHIP type lamp bead are one of black, dark gray, dark blue, and dark purple.

[0017] Preferably, all the LED beads have the same structure; the power supply line includes a first power supply line and a second power supply line with opposite polarities, and the electrode pin pads include a first electrode pin pad and a second electrode pin pad; the first electrode pin pads and the second electrode pin pads on the adjacent rows of LED bead soldering areas are in opposite positions, and the LED beads installed on the adjacent rows of LED bead soldering areas have a 180° difference in installation angle.

[0018] Alternatively, the positions of the first electrode pin pad and the second electrode pin pad on the lamp bead soldering area of ​​adjacent columns are opposite; the installation angles of the LED lamp beads installed on the lamp bead soldering areas of the adjacent columns differ by 180°.

[0019] Preferably, the LED beads include a first LED bead and a second LED bead with oppositely arranged electrode pins; the first electrode pin pads and the second electrode pin pads on the solder areas of adjacent columns of LED beads are in the same position, and the LED beads in the adjacent columns are respectively the first LED bead and the second LED bead.

[0020] Preferably, the signal pin pads include input signal pin pads and output signal pin pads;

[0021] The input signal pin pad on the next LED soldering area of ​​an adjacent series-connected LED soldering area is connected to the output signal pin pad on the previous LED soldering area.

[0022] A second aspect of this application provides an LED transparent display screen, including a back plate, a front plate, and one or more transparent display modules sandwiched between the back plate and the front plate, wherein the transparent display modules are the aforementioned flexible LED transparent display modules.

[0023] The improved LED transparent display screen of this application eliminates the transparent substrate in existing LED transparent display modules. Instead, it directly mounts LED beads onto a flexible, substrate-free, baseless flexible circuit network. This baseless flexible circuit network is extremely thin and flexible. Therefore, while maintaining high resolution and high light transmittance, it allows for easier alignment and connection at the splicing points when multiple flexible LED transparent display modules are spliced ​​together. Its resolution can even be higher. The gap error between adjacent flexible LED transparent display modules is smaller, and the gaps at the splicing points are more uniform, ensuring excellent display effects.

[0024] Preferably, a potting compound is filled between the back plate and the front panel, and the potting compound secures the flexible LED transparent display module between the back plate and the front panel.

[0025] Preferably, it further includes a display driving device, which is disposed on top of the transparent display module and is used to drive the flexible LED transparent display module; the display driving device includes a power supply and a controller, and the flexible LED transparent display module is connected to the power supply and controller in the display driving device through an interface circuit.

[0026] Preferably, the display driver device further includes an adapter board, on which the interface circuit of the flexible LED transparent display module is plugged into the adapter board, and the adapter board is electrically connected to the power supply and controller in the display driver device.

[0027] Preferably, there are two or more transparent display modules, and the outermost power supply lines of the baseless flexible circuit network on adjacent LED transparent display modules overlap and connect, and the power supply lines have the same polarity. Attached Figure Description

[0028] Figure 1 is a cross-sectional schematic diagram of an LED transparent display module provided in the prior art;

[0029] Figure 2 is a cross-sectional schematic diagram of an LED transparent display screen provided in the prior art;

[0030] Figure 3a is a cross-sectional schematic diagram of the flexible LED transparent display module provided in a specific embodiment of this application;

[0031] Figure 3b is a perspective view of the flexible LED transparent display module provided in a specific embodiment of this application;

[0032] Figure 4 is a cross-sectional schematic diagram of the LED transparent display screen provided in a specific embodiment of this application;

[0033] Figure 5 is a partial top view of the front of the flexible LED transparent module provided in a specific embodiment of this application;

[0034] Figure 6 is a rear view of Figure 5;

[0035] Figure 7 is an enlarged schematic diagram of point A in Figure 5 without the application of a line coating;

[0036] Figure 8 is a schematic diagram of further improvements in this 7;

[0037] Figure 9 is a schematic diagram of further improvements to Figure 8;

[0038] Figure 10 is a perspective view of the LED transparent display screen provided in a specific embodiment of this application;

[0039] Figure 11 is a front view of the LED transparent display screen provided in a specific embodiment of this application;

[0040] Figure 12 is a side view of the LED transparent display screen provided in a specific embodiment of this application;

[0041] Figure 13 is an enlarged view of point B in Figure 12;

[0042] Figure 14 is an enlarged view of point C in Figure 12;

[0043] Figure 15 is a cross-sectional schematic diagram of two or more transparent display modules spliced ​​together in the prior art;

[0044] Figure 16 is a cross-sectional schematic diagram of the edge splicing point when two or more flexible transparent display modules are spliced ​​together in a specific embodiment of this application.

[0045] The reference numerals in the background art are as follows: 1. Circuit pattern layer; 2. LED beads; 3. Transparent substrate; 100. LED transparent display module; 200. Panel; 300. Backplate; 1000. LED transparent display screen.

[0046] The reference numerals in the accompanying drawings are as follows: 1. Baseless flexible circuit network; 2. LED lamp bead; 100. Flexible LED transparent display module; 200. Panel; 300. Backplate; 400. Display driver; 500. Encapsulant; 1000. LED transparent display screen; Lamp bead soldering area; 10a. Signal input pin pad; 10b. Signal output pin pad; 10c. First electrode pin pad; 10d. Second electrode pin pad; 11. Power supply line; 11a. First power supply line; 11b. Second power supply line; 12. Signal line; 13. Anti-interference ink layer; 14. Interface circuit; 15. Overlap; 2a. First lamp bead; 2b. Second lamp bead; 20. Anti-light-transmitting ink layer; 401. Power supply; 402. Controller; 403. Adapter board. Detailed Implementation

[0047] To make the technical problems, technical solutions, and beneficial effects solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0048] In the description of this application, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0049] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0050] Example 1

[0051] As shown in Figures 3a-6, this example provides a flexible LED transparent display module and a flexible LED transparent display screen. As shown in Figures 3a and 3b, the flexible LED transparent display module 100 includes a substrate-free flexible circuit network 1 and LED beads 2 arranged in an array on the substrate-free flexible circuit network 1. The substrate-free flexible circuit network 1 includes power supply lines 11, signal lines 12, and LED bead soldering areas 10, and the LED beads 2 are soldered on the LED bead soldering areas 10. Specifically, the flexible LED transparent display module 100 includes a substrate-free flexible circuit network 1 and LED beads arranged in an array on the substrate-free flexible circuit network 1. The LED beads 2 are mounted on the substrate; the substrate-free flexible circuit network 1 includes power supply lines 11 arranged at intervals with opposite polarities, and signal lines 12 arranged between the power supply lines; electrode pin pads are equidistantly arranged on both sides of the power supply lines 1, and the signal lines include signal pin pads, the electrode pin pads and the signal pin pads forming the LED bead solder area 10; the LED beads 2 are soldered onto the LED bead solder area 10; in this way, it can be made into a flexible LED transparent display module as shown in Figure 3b, because there is no substrate, its overall structure exhibits flexible and bendable characteristics and presents a mesh structure.

[0052] Specifically, the LED bead 2 includes two electrode pins with opposite polarities and at least one signal pin; the electrode pins of the LED bead are soldered to electrode pin pads with the same polarity; each LED bead soldering area 10 is provided with a pin pad corresponding to the pin of the LED bead 2;

[0053] The signal pins of the LED beads are soldered in parallel or in series onto the signal pin pads.

[0054] The spacing between the LED beads is ≤8mm, and the width of at least one of the power supply line and the signal line is ≤1.5mm.

[0055] The signal line 12 is connected to the signal pin pad on the lamp bead soldering area 10 to provide control signals to the LED lamp bead 2; the power supply line 11 is electrically connected to the electrode pin pad on the lamp bead soldering area 10 to provide power to the LED lamp bead 2.

[0056] This example eliminates the transparent substrate in existing LED transparent display modules, instead directly mounting LED beads 2 onto a flexible, substrate-free, baseless flexible circuit network 1. This baseless flexible circuit network 1 is extremely thin and flexible. Thus, while maintaining high resolution and high light transmittance, when multiple flexible LED transparent display modules 100 are spliced ​​together, the splicing points are easier to align and connect. The resolution can even be higher. The gap error between adjacent flexible LED transparent display modules 100 is smaller, and the gaps at the splicing points are more uniform, ensuring excellent display effects.

[0057] The LED bead 2 is generally known to the public, and since it is not the core innovation of this application, it is only briefly introduced. The LED bead 2 in this example includes a driver chip (or driver IC) and a light-emitting chip. Its corresponding solder area 10 has multiple pins. In this example, the pins include two electrode pins and two signal pins; the electrode pins include a first electrode pin and a second electrode pin; the polarities of the two electrode pins are opposite, for example, the first electrode pin is the positive electrode pin; the second electrode pin is the negative electrode pin. It is used to provide power to the light-emitting chip within the LED bead 2; the two signal pins are respectively called the first signal input pin and the first signal output pin; the driver chip has an interface that connects to each light-emitting chip and each pin via bonding wires. In this example, the light-emitting chips include red, green, and blue light-emitting chips; they are arranged in a line; of course, they can also be arranged in a triangular pattern. The light-emitting chips can be all or partly located on the driver chip. Of course, depending on the control method, there can be multiple signal pins for the control signal input and output. For example, two sets of input signal pins and two sets of output signal pins.

[0058] As shown in Figure 7, the circuit pattern layer commonly formed in existing LED transparent poster display modules is generally the natural color of the metal material (usually copper foil). In practical applications, the natural color of copper foil can cause various reflections and interference from the copper's own color, which is extremely detrimental to the LED display quality and easily interferes with the display effect. During research and development, the inventors also discovered that the LED chip 2 can be either a TOP type or a CHIP type. Because the pixel pitch is relatively small, CHIP type chips have sufficient space within a small area to accommodate the driver IC and the light-emitting chip, making them the optimal choice. However, a disadvantage of CHIP type chips is that RGB light leaks outwards, creating interference colors between pixels.

[0059] As shown in Figure 8, preferably, an anti-interference ink layer 13 is formed on the surface of the substrate-free flexible circuit network 1 on at least one side where LED beads 2 are installed. In this way, the interference caused by the natural color of the circuit pattern layer is greatly reduced by using the anti-interference ink layer 13. Alternatively, more preferably, an anti-interference ink layer 13 is formed on both surfaces of the substrate-free flexible circuit network 1.

[0060] As shown in Figure 9, preferably, the LED bead 2 is a chip-type LED bead, and the side of the chip-type LED bead is provided with an anti-light-transmitting ink layer 20. This eliminates light leakage from the chip-type LED bead, avoids interference, and further improves the display quality.

[0061] Regarding the anti-interference ink layer 13 and the anti-light-transmitting ink layer 20, generally, suitable anti-interference or anti-light-transmitting inks can be found through color selection. In terms of parameter limitations, the depth of the color can be quantified by the color depth value (such as the Integ value). The larger the color depth value, the darker the color, and the better the light-blocking effect may be. The color depth value is generally related to the lightness range and the type of color. Lightness range: Choose colors with lower lightness values, i.e., darker parts of the color. In the CIELAB color space, a lower lightness index L (such as L<30) usually indicates a darker color and lower light transmittance. However, please note that this range is not absolute, as color performance will vary under different materials and light sources. Color type: Prioritize dark colors, such as black, dark gray, dark blue, and dark purple. These colors give a visually stable and substantial feeling, while also having a good light-blocking effect.

[0062] Preferably, the anti-interference ink layer 13 on the baseless flexible circuit network 1 and the anti-transmittance ink layer 20 on the side of the CHIP type lamp bead are one of black, dark gray, dark blue, and dark purple.

[0063] As shown in Figures 4 and 5, the specific implementation methods of the baseless flexible circuit network 1 will be described below through several specific methods. The power supply line 11 includes several first power supply lines 11a and second power supply lines 11b with opposite polarities; the electrode pin pads include first electrode pin pads 10c and second electrode pin pads 10d with opposite polarities; and signal pin pads, including signal input pin pads 10a and signal output pin pads 10b.

[0064] The first power supply line 11a is electrically connected to the first electrode pin pad 10c on each lamp bead soldering area 10, and the second power supply line 11b is electrically connected to the second electrode pin pad 10d on each lamp bead soldering area 10. In this way, the LED lamp bead 2 can be powered by the first power supply line 11a and the second power supply line 11b, and at the same time, control signals can be provided to the LED lamp bead 2 through the signal pin pad.

[0065] The input signal pin pad on the next LED soldering area 10 of the adjacent series-connected LED soldering areas 10 is connected to the output signal pin pad on the previous LED soldering area 10.

[0066] Regarding the method of signal provision, it can be either series or parallel. For example, in this case, the preferred method is to provide the signal in series. As shown in Figures 5 and 6, the baseless flexible circuit network 1 has N rows * M columns of LED chip soldering areas 10; the signal pin pads in the N LED chip soldering areas 10 in the same column are connected in series through signal lines 12; (or, the signal pin pads in the M LED chip soldering areas 10 in the same row are connected in series through signal lines 12).

[0067] Regarding the power supply method, each column of LED beads 2 or each row of LED beads 2 can have an independent first power supply line 11a and a second power supply line 11b on both sides. However, adjacent LED beads 2 can also share the first power supply line 11a or the second power supply line 11b. For example, as shown in Figures 5 and 6, the power supply line 11 in this example includes a plurality of first power supply lines 11a and second power supply lines 11b arranged in columns (or rows) at intervals.

[0068] The first power supply line 11a and the second power supply line 11b arranged in a row are arranged side by side with each row of LED beads 2 at intervals, and the soldering area 10 of each row of LED beads is located between the spaced first power supply line 11a and the second power supply line 11b.

[0069] Of course, the following method is also feasible, and the essence is the same. The first power supply line 11a and the second power supply line 11b arranged in rows are arranged side by side with the LED beads 2 at intervals, and the soldering area 10 of each row of LED beads is located between the spaced first power supply line 11a and the second power supply line 11b.

[0070] There are several ways to implement the aforementioned power supply line 11 and signal line 12. For example, the first power supply line 11a and the second power supply line 11b, which are spaced apart, are metal layers printed on a transparent substrate, along with the lamp bead soldering area 10; generally, they are printed copper foil layers. They are prepared using, for example, an FPC (flexible printed circuit board). Alternatively, only the lamp bead soldering area 10 can be implemented by printing, while the power supply line 11 and signal line 12 are connected using copper foil or copper wire, or other alternative metal wires or metal foils for electrical connection.

[0071] The first electrode pin pad 10c on the lamp bead soldering area 10 is integrally printed with its adjacent first power supply line 11a; the second electrode pin pad 10d on the lamp bead soldering area 10 is integrally printed with its adjacent second power supply line 11b.

[0072] Regarding the structure of LED beads 2, it can be constructed by assembling an array of identical LED beads 2, or by arranging beads with opposite polarities in adjacent rows or columns. The following are several specific implementation methods.

[0073] In one implementation, all the LED beads 2 have the same structure; the first electrode pin pads 10c and second electrode pin pads 10d on the LED bead solder areas 10 of adjacent rows are in opposite positions, and the LED beads 2 installed on the LED bead solder areas 10 of the adjacent rows have a 180° difference in installation angle (i.e., installed with a 180° relative rotation); or the first electrode pin pads 10c and second electrode pin pads 10d on the LED bead solder areas 10 of adjacent columns are in opposite positions, and the LED beads 2 installed on the LED bead solder areas 10 of the adjacent columns have a 180° difference in installation angle. This implementation effectively reduces color difference caused by the LED beads 2 during signal concatenation.

[0074] As another implementation, as shown in Figure 5, the LED beads 2 include a first LED bead and a second LED bead with oppositely arranged electrode pins; the first electrode pin pads 10c and second electrode pin pads 10d on the LED bead solder areas 10 of adjacent columns are in the same position, and the LED beads 2 in the adjacent columns are respectively the first LED bead and the second LED bead. Alternatively, the first electrode pin pads 10c and second electrode pin pads 10d on the LED bead solder areas 10 of adjacent rows are in the same position, and the LED beads 2 in the adjacent rows are respectively the first LED bead and the second LED bead. When a smaller pixel pitch and better physical transparency (i.e., transparency) are required, for example, when a pixel pitch of less than 3.9 mm is required while still maintaining more than 50% physical transparency, the LED beads 2 used in such a small pixel pitch case contain a driver IC and a light-emitting chip. It is difficult for general TOP type LED beads to achieve opposite electrode pin arrangements between adjacent columns of LED beads 2, so CHIP type LED beads are generally used to accommodate the driver IC and light-emitting chip within a small size range.

[0075] As a third method, the first electrode pin pad 10c and the second electrode pin pad 10d on the lamp bead soldering area 10 of adjacent columns are in opposite positions; wherein, the first lamp bead and the second lamp bead with opposite electrode pins are respectively installed on the lamp bead soldering area 10 of adjacent columns.

[0076] Alternatively, the positions of the first electrode pin pad 10c and the second electrode pin pad 10d on the lamp bead soldering area 10 of adjacent rows are opposite; wherein, the first lamp bead and the second lamp bead with opposite electrode pins are respectively installed on the lamp bead soldering area 10 of adjacent rows.

[0077] The following is a brief description of the fabrication process of this flexible LED display module. As one feasible method, the aforementioned LED chip soldering area 10, power supply lines 11, and signal lines 12 are formed on a rigid or flexible substrate using etching or other feasible processes to form the substrate-free flexible circuit network 1 described in this application. Then, the substrate-free flexible circuit network 1 is peeled off from the substrate, and an anti-interference ink layer 13 is sprayed or brushed onto the peeled substrate-free flexible circuit network 1. Then, the LED chips 2, which have been sprayed or brushed with the anti-light-transmitting ink layer 20, are installed. Alternatively, the LED chips 2 can be installed first, and then the anti-light-transmitting ink layer 20 can be sprayed or brushed onto the four sides of the LED chips 2. In this way, the flexible LED transparent display module 100 described in this example can be obtained.

[0078] Of course, LED beads 2 can be installed first on an intermediate product that still has a substrate, and then a flexible LED transparent display module 100 can be obtained by glassing the substrate. Finally, an anti-interference ink layer 13 and an anti-light-transmitting ink layer 20 can be sprayed or brushed onto the flexible LED transparent display module 100. Of course, any other process that can prepare this flexible LED transparent display module 100 is also feasible, and the product obtained by such process is also within the protection scope of this application.

[0079] Example 2

[0080] To further explain this flexible LED display screen, the following figures (Figures 4 and 10-16) will be used for illustration. As shown in Figure 4, this example provides an LED transparent display screen 1000, including a back panel 300, a front panel 200, and one or more transparent display modules sandwiched between the back panel 300 and the front panel 200. The transparent display module is the flexible LED transparent display module 100 in Embodiment 1 above. The back panel 300 and the front panel 200 are generally transparent, such as made of tempered glass or other transparent plastics. In most scenarios, the back panel 300 and the front panel 200 are rigid transparent plates, but in a few applications, they can also be flexible transparent plates.

[0081] The aforementioned transparent LED display screen 1000 has various applications, such as in the field of transparent LED poster displays. Transparent LED poster displays allow for easy content changes without obstructing light transmission through shop windows, and are gradually gaining market popularity. However, due to size limitations, the area of ​​transparent LED poster displays is generally about 1-1.5 square meters, with a height-to-width ratio typically between 1.56 and 1.79, close to 16:9. It is difficult to simultaneously achieve both "transparency" and "screen resolution." Current technology results in most transparent LED poster screens having a pixel pitch ≥3.9mm and transparency <50%, failing to achieve ideal clarity and suitable transparency. The flexible LED display screen provided in this example can effectively achieve ideal clarity and transparency. The flexible transparent LED display module 100 is sandwiched between the backplate 300 and the front panel 200, providing front and rear protection. A power supply 401 and a controller 402 are added to one end. In this example, the pixel pitch of each LED bead 2 is less than 3.9mm, and the size of the LED bead 2 is preferably less than 1.5mm x 1.5mm. It can be made into a transparent LED poster screen, which has a good transparency effect and can display the poster content clearly.

[0082] When the back panel 300 and the front panel 200 are made of flexible materials, such as PET (Polyethylene terephthalate), PC (Polycarbonate), SGP (Ion-polymer Interlayer), PI (Polyimide), PVB (a type of glass interlayer film), EVA (ethylene-vinyl acetate copolymer), etc., they can be used to form a flexible transparent LED display screen.

[0083] As shown in Figures 10-12, a typical LED transparent display screen 1000 also includes a display driving device 400. The display driving device 400 is generally located on one side of the transparent display screen, such as the left or right side, the bottom, or the top. In this example, the display driving device 400 is located on the top of the transparent display module and is used to drive the flexible LED transparent display module 100. The display driving device 400 includes a power supply 401 and a controller 402. The flexible LED transparent display module 100 is connected to the power supply 401 and the controller 402 in the display driving device 400 through an interface circuit 14.

[0084] As shown in Figure 13, this example includes some improvements. Specifically, the display driver device 400 further includes an adapter board 403. The interface circuit 14 on the flexible LED transparent display module 100 is plugged into the adapter board 403. The adapter board 403 is electrically connected to the power supply 401 and controller 402 within the display driver device 400. The interface circuit 14 is used to electrically connect to the power supply line 11 and signal line 12 on the flexible LED transparent display module 100, and forms a plug-in terminal through a group of gold fingers or pin headers. This plug-in terminal is plugged into the adapter board 403. The rest of the display driver device 400 is publicly known and will not be described in detail. Connecting the power supply 401 and controller 402 of the display driver device through the adapter board plug-in method can more conveniently and quickly realize display driving, with a simple structure and easy implementation.

[0085] As shown in Figure 14, preferably, potting compound 500 is filled between the back plate 300 and the panel 200, and the potting compound 500 fixes the flexible LED transparent display module 100 between the back plate 300 and the panel 200.

[0086] As shown in Figures 15 and 16, the following will further explain why this application has better effects, so that those skilled in the art can more easily understand the concept of this application. As shown in Figure 15, it is a schematic diagram of the existing LED transparent display module 100 splicing to form a transparent display screen. Because the transparent substrate in the LED transparent display module 100 is generally rigid glass or other transparent plastic and has a certain thickness, it has been found in practice that it is particularly easy to form uneven heights at the joints, and the gaps are not easy to align. When the product is carefully observed, color differences are easily formed at the splicing points.

[0087] As shown in Figure 16, the flexible LED display module can be fabricated using the non-residue flexible circuit network 1 of this application, which effectively avoids the above-mentioned situation. For example, when there are two or more transparent display modules, the non-residue flexible circuit networks 1 on adjacent LED transparent display modules 100 can be overlapped and welded. During the overlap and welding, an overlap 15 as shown in Figure 16 is formed. However, since the non-residue flexible circuit network 1 itself is flexible and its thickness is particularly thin, ranging from 30μm to 180μm, ideally 100μm to 180μm.

[0088] The improved LED transparent display screen 1000 in this example eliminates the transparent substrate in existing LED transparent display modules. Instead, it directly mounts LED beads 2 onto a flexible, substrate-free, baseless flexible circuit network 1. This baseless flexible circuit network 1 is very thin and flexible. Therefore, while maintaining high resolution and high light transmittance, it allows for easier alignment and connection at the splicing points when multiple flexible LED transparent display modules 100 are joined. Its resolution can even be higher. The gap error between adjacent flexible LED transparent display modules 100 is smaller, and the gaps at the splicing points are more uniform, ensuring excellent display effects.

[0089] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A flexible LED transparent display module, characterized in that, It includes a baseless flexible circuit network and LED beads arranged in an array on the baseless flexible circuit network; the baseless flexible circuit network includes power supply lines arranged at intervals and with opposite polarities, and signal lines arranged between the power supply lines; The power supply line extends from both sides with equidistant electrode pin pads, the signal line includes signal pin pads, and the electrode pin pads and the signal pin pads form a lamp bead soldering area; the LED lamp bead is soldered on the lamp bead soldering area. The LED lamp bead includes two electrode pins with opposite polarities and at least one signal pin; the electrode pins of the LED lamp bead are soldered to the electrode pin pads with the same polarity; the signal pins of the LED lamp bead are soldered in parallel or in series to the signal pin pads. The spacing between the LED beads is ≤8mm, and the width of at least one of the power supply line and the signal line is ≤1.5mm.

2. The flexible LED transparent display module according to claim 1, characterized in that, An anti-interference ink layer is formed on the surface of at least one side of the flexible circuit network on which LED beads are installed.

3. The flexible LED transparent display module according to claim 1, characterized in that, The LED bead is a CHIP type bead, and the side of the CHIP type bead is provided with an anti-light-transmitting ink layer.

4. The flexible LED transparent display module according to any one of claims 2-3, characterized in that, The anti-interference ink layer on the non-base flexible circuit network and the anti-light-transmitting ink layer on the side of the CHIP type lamp bead are one of the following colors: black, dark gray, dark blue, and dark purple.

5. The flexible LED transparent display module according to claim 1, characterized in that, Each of the LED beads has the same structure; the power supply line includes a first power supply line and a second power supply line with opposite polarities; the electrode pin pads include a first electrode pin pad and a second electrode pin pad; the first electrode pin pads and the second electrode pin pads on the adjacent rows of LED bead soldering areas are in opposite positions, and the LED beads installed on the adjacent rows of LED bead soldering areas have a 180° difference in installation angle. Alternatively, the positions of the first electrode pin pad and the second electrode pin pad on the lamp bead soldering area of ​​adjacent columns are opposite; the installation angles of the LED lamp beads installed on the lamp bead soldering areas of the adjacent columns differ by 180°.

6. The flexible LED transparent display module according to claim 1, characterized in that, The LED beads include a first LED bead and a second LED bead with oppositely arranged electrode pins; the first electrode pin pads and the second electrode pin pads on the solder areas of adjacent columns of LED beads are in the same position, and the LED beads in the adjacent columns are respectively the first LED bead and the second LED bead.

7. The flexible LED transparent display module according to claim 6, characterized in that, The signal pin pads include input signal pin pads and output signal pin pads; The input signal pin pad on the next LED soldering area of ​​an adjacent series-connected LED soldering area is connected to the output signal pin pad on the previous LED soldering area.

8. An LED transparent display screen, characterized in that, It includes a back plate, a front plate, and one or more transparent display modules sandwiched between the back plate and the front plate, wherein the transparent display module is a flexible LED transparent display module as described in any one of claims 1-7.

9. The LED transparent display screen according to claim 8, characterized in that, A potting compound is filled between the back plate and the front panel, which secures the flexible LED transparent display module between the back plate and the front panel.

10. The LED transparent display screen according to claim 9, characterized in that, It also includes a display driving device, which is disposed on the top of the transparent display module and is used to drive the flexible LED transparent display module; the display driving device includes a power supply and a controller, and the flexible LED transparent display module is connected to the power supply and controller in the display driving device through an interface circuit.

11. The LED transparent display screen according to claim 10, characterized in that, The display driver also includes an adapter board, on which the interface circuit of the flexible LED transparent display module is plugged into. The adapter board is electrically connected to the power supply and controller in the display driver.

12. The LED transparent display screen according to claim 11, characterized in that, There are two or more transparent display modules, and the outermost power supply lines of the baseless flexible circuit network on adjacent LED transparent display modules overlap and connect, and the power supply lines have the same polarity.

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