Server and heat dissipation control method

Abstract

The present disclosure relates to the technical field of server apparatuses and provides a server and a heat dissipation control method. The server comprises a chassis, a first fan, a second fan, power supply units, air guide assemblies, and a control unit. The chassis comprises side panels, wherein the side panels are provided with ventilation holes. The first fan and the second fan are arranged on two sides of the chassis in the direction of length of the chassis. The power supply units are located on the sides of the first fan close to the side panels. The ventilation holes are close to air inlets of the power supply units. The air guide assemblies can block the ventilation holes or open the ventilation holes. The first fan, the second fan, the power supply units and the air guide assemblies are all electrically connected to the control unit. Therefore, when the first fan and the power supply units compete for air, the ventilation holes can be opened to allow air from the external environment to be added to the air inlets of the power supply units, thereby preventing the formation of negative air pressure at the air inlets of the power supply units, allowing fans of the power supply units to obtain a sufficient air velocity, and also preventing the formation of heat dissipation islands at the air inlets of the power supply units.

Description

Servers and thermal control methods

[0001] Cross-references to related applications

[0002] This application claims the benefit and priority of Chinese Patent Application No. 202411206340.X, filed with the Chinese Patent Office on August 30, 2024, entitled "Server and Heat Dissipation Control Method", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of server technology, and more particularly to a server and a heat dissipation control method. Background Technology

[0004] With the rapid development of network technologies such as big data, cloud computing, artificial intelligence, and the Internet of Things, traditional servers can no longer meet the exponentially increasing data processing demands of the internet. To address this challenge, AI servers have emerged. Because GPUs excel in parallel computing and are suitable for computationally intensive tasks such as deep learning and machine learning, artificial intelligence (AI) servers are typically configured with multiple graphics processing units (GPUs) to increase data processing capabilities. However, due to the relatively high power consumption of GPU modules, the server's cooling requirements are correspondingly increased.

[0005] Currently, in some existing servers, as shown in Figure 1, the power supply 10 and system fan 20 are located on the same side, and the air intakes of the power supply 10's own fan and the system fan 20 are roughly in the same plane. During heat dissipation, the power supply 10's own fan draws hot air from inside the server to the outside, and simultaneously, the system fan 20 also draws hot air from inside the server to the outside. The power supply 10's own fan and the system fan 20 draw hot air in the same direction.

[0006] However, in practice, the power and speed of the power supply 10's own fan are far less than those of the system fan 20. During the process of drawing in hot air, the system fan 20 competes with the power supply 10 for airflow. Specifically, the system fan 20 draws hot air from the power supply 10's air intake, causing negative air pressure at the power supply 10's air intake. This creates a heat dissipation island at the power supply 10's air intake, resulting in high air pressure and heat buildup. The heat cannot be effectively dissipated, ultimately preventing the power supply 10's fan from reaching sufficient airflow, leading to overheating and triggering the over-temperature protection mechanism. Simultaneously, due to the negative air pressure, the power supply 10's own fan may also reverse direction, failing to rotate normally in the forward direction, causing a fan alarm on the power supply 10. Summary of the Invention

[0007] The first aspect of this disclosure provides a server, including:

[0008] A chassis, the chassis including a side panel, the side panel being disposed on the side of the chassis in the width direction, the side panel being provided with ventilation holes;

[0009] A first fan and a second fan are disposed inside the chassis and on opposite sides of the chassis along its length.

[0010] A power supply unit is disposed inside the chassis. The power supply unit is located on the side of the first fan near the side panel, and the ventilation hole is near the air inlet of the power supply unit.

[0011] An air guide assembly is disposed inside the chassis and near the air inlet of the power supply unit, and the air guide assembly is movable between a first position blocking the ventilation hole and a second position opening the ventilation hole;

[0012] The control unit is located inside the chassis, and the first fan, the second fan, the power supply unit, and the air guide assembly are all electrically connected to the control unit.

[0013] In some embodiments, the chassis includes a top plate, a bottom plate, a front plate, a rear plate, and two side plates, which are connected to each other to form an accommodating space, wherein the rear plate and the front plate are each provided with a plurality of through holes.

[0014] In some embodiments, the interior of the chassis is provided with a dustproof mesh, which is attached to the inner wall of the side panel and covers all ventilation holes.

[0015] In some embodiments, when the air guide assembly is in the second position, the air guide assembly is located between the air inlet of the power supply unit and the air inlet of the first fan in the width direction of the chassis.

[0016] In some embodiments, the air guide assembly includes an air guide plate and a driver, the air guide plate being connected to the driver and the driver being electrically connected to the control unit, the driver being able to drive the air guide plate to move and to cause the air guide plate to block or open the ventilation hole.

[0017] In some embodiments, the driver is either a drive motor or an electro-hydraulic actuator.

[0018] In some embodiments, the driver is a drive motor, the air guide plate is connected to the output shaft of the driver, the air guide plate includes a blocking part and a connecting part connected to each other, and an included angle is formed between the blocking part and the connecting part, wherein, when the air guide assembly is in the first position, the blocking part is attached to the inner wall surface of the side plate.

[0019] In some embodiments, the end face of the sealing portion facing the side plate is provided with a sealing layer made of rubber material.

[0020] In some embodiments, the air guide assembly includes a pair of drivers connected to the air guide plate.

[0021] In some embodiments, the number of power supply units is two, and the two power supply units are respectively arranged on both sides of the first fan along the width direction of the chassis;

[0022] The number of side panels is two, and the two side panels are respectively located on both sides of the width direction of the chassis. The ventilation holes on the two side panels are respectively close to the air inlets of the two power supply units.

[0023] The number of air guide components is two, and the two air guide components are respectively installed at the air inlets of the two power supply units.

[0024] In some embodiments, the number of ventilation holes is multiple, and the multiple ventilation holes are arranged in a rectangular array.

[0025] In some embodiments, a wind pressure detection mechanism is also included, which is disposed at the air inlet of the power supply unit and is electrically connected to the control unit.

[0026] In some embodiments, the power supply unit has a built-in temperature sensor, which is disposed inside the power supply unit and electrically connected to the control unit.

[0027] In some embodiments, the control unit is disposed at the air inlet of the first fan.

[0028] A second aspect of this disclosure provides a heat dissipation control method for a server according to any one of the first aspects of this disclosure, the heat dissipation control method comprising:

[0029] When the negative air pressure at the air inlet of the power supply unit is detected to be greater than 500Pa, the air guide assembly is moved to the second position, so that the ventilation holes of the side panel are open.

[0030] In some embodiments, the heat dissipation control method further includes:

[0031] When the speed of the first fan is detected to be greater than 70%, the fan in the power supply unit is controlled to run at its maximum speed.

[0032] In some embodiments, the heat dissipation control method further includes:

[0033] When the negative air pressure at the air inlet of the power supply unit is detected to be greater than 500Pa, the first fan is controlled to stop rotating and the speed of the second fan is increased.

[0034] When the negative air pressure at the air inlet of the power supply unit is detected to be less than 100Pa, the first and second fans are controlled to return to their default states.

[0035] In some embodiments, the heat dissipation control method further includes:

[0036] When the temperature at the air inlet of the power supply unit is detected to reach a preset temperature value, the speed of the first fan is reduced and the speed of the second fan is increased. The preset temperature value is lower than the alarm threshold set by the power supply unit itself.

[0037] In some embodiments, the heat dissipation control method further includes:

[0038] When the temperature at the air inlet of the power supply unit is detected to rise after reaching the preset temperature value, the air guide assembly is moved to the second position, so that the ventilation holes of the side panel are open.

[0039] In some embodiments, the preset temperature value is 3°C lower than the alarm threshold set by the power supply unit itself. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 is a schematic diagram of a partial structure of a server in related technologies.

[0042] Figure 2 is a schematic diagram of the structure of a server according to one embodiment of the present disclosure.

[0043] Figure 3 is a structural schematic diagram of an air guide assembly according to one embodiment of the present disclosure.

[0044] Figure 4 is a structural schematic diagram of another state of the air guide assembly shown in Figure 3.

[0045] Figure 5 is a structural schematic diagram of the air guide assembly according to yet another embodiment of the present disclosure.

[0046] Figure 6 is a schematic diagram of the connection of the control unit in the server according to one embodiment of the present disclosure. Detailed Implementation

[0047] The embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this disclosure.

[0048] In the description of the embodiments of this disclosure, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this disclosure. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] In the description of the embodiments of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure based on the specific circumstances.

[0050] In the embodiments of this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0052] According to one aspect of this disclosure, a server and a heat dissipation control method are provided. The server includes a chassis, a first fan and a second fan, a power supply unit, an air guide assembly, and a control unit. The first fan and the second fan are respectively disposed on opposite sides of the chassis along its length. The power supply unit is disposed on the side of the first fan, near a side panel of the chassis. Ventilation holes are provided on the side panel, and the air inlet of the power supply unit is close to the ventilation holes on the side panel. The air guide assembly can block or open the ventilation holes. During heat dissipation, when the control unit determines that the first fan and the power supply unit may compete for airflow, it can control the air guide assembly to open the ventilation holes. At this time, external air can be drawn into the power supply unit through the ventilation holes for heat dissipation, ensuring that the power supply unit receives sufficient airflow and effectively preventing overheating inside the power supply unit. The server and heat dissipation control method of this embodiment are further described below with reference to Figures 2 to 6.

[0053] Specifically, as shown in Figures 2 and 6, the server includes: a chassis 100, a first fan 200, a second fan 300, a power supply unit 400, an air guide assembly 500, and a control unit 600.

[0054] The chassis 100 includes a side panel 110, which is located on the side of the chassis 100 in the width direction and has ventilation holes 111. A first fan 200 and a second fan 300 are located inside the chassis 100, on opposite sides of the chassis 100 in the length direction. A power supply unit 400 is located inside the chassis 100, on the side of the first fan 200 near the side panel 110, and the ventilation holes 111 are near the air inlet of the power supply unit 400. An air guide assembly 500 is located inside the chassis 100 and near the air inlet of the power supply unit 400, and the air guide assembly 500 can move between a first position blocking the ventilation holes 111 and a second position opening the ventilation holes 111. A control unit 600 is located inside the chassis 100, and the first fan 200, the second fan 300, the power supply unit 400, and the air guide assembly 500 are all electrically connected to the control unit 600.

[0055] For example, the chassis 100 can be made of metallic or non-metallic materials; for instance, it can be made of stainless steel sheet. The chassis 100 has internal storage space for functional components used in server operation, such as the GPU and control unit 600, which can be housed within this space. The chassis 100 has a side panel 110, which forms the outer shell of the chassis 100. The side panel 110 protects the internal functional components. Ventilation holes 111 are provided on the side panel 110, allowing the internal storage space of the chassis 100 to be fluidly connected to the external environment through these holes for heat dissipation. For example, cold air from the outside environment can enter the chassis 100 through the ventilation holes 111, or hot air from inside the chassis 100 can reach the outside environment through the ventilation holes 111.

[0056] Specifically, the chassis 100 can be constructed as a rectangular box, having perpendicular length, width, and height directions. The chassis 100 may include a top plate, a bottom plate, a front plate, a rear plate, and two side plates 110. The top and bottom plates are located on opposite sides of the chassis 100 in the height direction, the front and rear plates are located on opposite sides of the chassis 100 in the length direction, and the two side plates 110 are located on opposite sides of the chassis 100 in the width direction. Furthermore, the top plate, bottom plate, front plate, rear plate, and two side plates 110 can be connected to each other to form an enclosing space.

[0057] It is understood that the above description is only used to illustrate the structure of the chassis 100 and does not limit the specific size of the chassis 100. In actual use scenarios, the dimensions of the chassis 100 in the length, width and height directions can be adjusted according to requirements, and the spatial position of the chassis 100 can also be adjusted according to requirements.

[0058] For example, both the first fan 200 and the second fan 300 include a drive motor and fan blades. The fan blades are connected to the output end of the drive motor, and the output end of the drive motor can drive the fan blades to rotate during rotation, thereby achieving air extraction. In one example, alternatively, as shown in FIG2, the first fan 200 and the second fan 300 are both disposed inside the chassis 100, and the first fan 200 and the second fan 300 are respectively located on both sides of the length direction of the chassis 100.

[0059] Optionally, as shown in Figure 6, the first fan 200 and the second fan 300 are both electrically connected to the control unit 600 inside the chassis 100, and the first fan 200 and the second fan 300 can operate according to the control signal of the control unit 600.

[0060] Specifically, the first fan 200 can be located on the inner side near the rear panel, and the second fan 300 can be located on the inner side near the front panel. In addition, in order to facilitate airflow and achieve the extraction of hot air, the rear panel and the front panel can be provided with through holes.

[0061] In some embodiments, the chassis 100 is provided with functional components inside. These functional components may be disposed between the first fan 200 and the second fan 300. For example, for heat dissipation, the GPU may be disposed between the first fan 200 and the second fan 300. These functional components may also be fixedly disposed on the front and rear panels. For example, for connecting to other external devices, a connector for connecting to other external devices may be disposed on the front and rear panels.

[0062] In some embodiments, in order to ensure structural strength, the front plate and the rear plate can be made of metal materials. For example, the front plate and the rear plate can be manufactured from stainless steel sheet by stamping or other methods. Moreover, the front plate and the rear plate are provided with bolt holes and hollow structures that penetrate along their thickness direction. Functional components, including the first fan 200 and the second fan 300, can be fixedly installed on the front plate and the rear plate by means of bolts or other structures.

[0063] In one example, alternatively, the first fan 200 has an air inlet and an air outlet on both sides of the chassis 100 along its length. The air inlet of the first fan 200 is located inside the chassis 100, and the air outlet of the first fan 200 faces the outside of the chassis 100 and is connected to the external environment. After the first fan 200 is powered on, it can draw air from inside the chassis 100 to the external environment.

[0064] Similarly, the second fan 300 has an air inlet and an air outlet on both sides of the chassis 100 along its length. The air outlet of the second fan 300 is located inside the chassis 100, while the air inlet of the second fan 300 faces the outside of the chassis 100 and is connected to the external environment. After the second fan 300 is powered on, it can draw air from the external environment into the internal storage space of the chassis 100.

[0065] During the heat dissipation process, functional components such as the GPU inside the chassis 100 generate a lot of heat when they are working. At this time, the second fan 300 can draw cool air from the outside environment into the chassis 100. The cool air entering the chassis 100 can absorb the heat inside the chassis 100 and become hot air. Then, the first fan 200 draws the hot air inside the chassis 100 out to the outside environment. This air circulation allows the heat inside the chassis 100 to be continuously discharged to the outside environment through the air, achieving effective heat dissipation.

[0066] Moreover, in actual use, the speed of the first fan 200 and the second fan 300 can be controlled according to the temperature inside the chassis 100.

[0067] Specifically, a temperature sensor is installed inside the chassis 100 to detect the internal temperature. The temperature sensor, the first fan 200, and the second fan 300 are electrically connected to a control unit 600 inside the chassis 100. The control unit 600 can then control the speed of the first fan 200 and the second fan 300 based on the temperature information detected by the temperature sensor. For example, when the internal temperature of the chassis 100 is low, minimal heat dissipation is not required, and the control unit 600 can control the first fan 200 and the second fan 300 to operate at a lower speed based on the current temperature signal. When the internal temperature of the chassis 100 is high, sufficient heat dissipation is needed to prevent the internal components from burning out due to high temperatures. The control unit 600 can then control the first fan 200 and the second fan 300 to operate at a higher speed based on the current temperature signal, allowing air from the outside environment to enter the chassis 100 with higher circulation efficiency for heat exchange.

[0068] For example, the power supply unit (PSU) 400 is a type of power supply for computers that converts electrical energy (different from battery-powered power supplies), also known as a power supply adapter. The PSU 400 is responsible for converting standard AC power into low-voltage, stable DC power to supply other functional components within the server. During operation, the PSU 400 generates a significant amount of heat. If this heat is not handled promptly, the internal temperature of the PSU 400 will rise. To avoid safety hazards, the PSU 400 will reduce its external output power or may even stop operating. Therefore, in addition to a power modulation module, the PSU 400 also has a built-in fan. In actual use, the built-in fan of the PSU 400 continuously runs to dissipate heat from its internal components.

[0069] In one example, alternatively, the power supply unit 400 is electrically connected to the control unit 600 inside the chassis 100, and the power supply unit 400 is capable of supplying power to the control unit 600. Furthermore, the fan built into the power supply unit 400 can operate according to control signals from the control unit 600.

[0070] In one example, alternatively, as shown in Figure 2, the power supply unit 400 is fixedly disposed in the housing space inside the chassis 100, and there is an installation space between the first fan 200 and the side plate 110, in which the power supply unit 400 is disposed.

[0071] The power supply unit 400 has an air inlet and an air outlet on both sides of the chassis 100 along its length. The air inlet of the power supply unit 400 is located inside the chassis 100 and is on the same side as the air inlet of the first fan 200. The air outlet of the power supply unit 400 faces the outside of the chassis 100 and is connected to the external environment.

[0072] During server operation, the power supply unit 400 can draw air from inside the chassis 100 to the external environment. In this process, on the one hand, the air circulates inside the power supply unit 400, which can carry away the heat generated by the power supply unit 400 itself; on the other hand, the air carrying heat inside the chassis 100 can also pass through the power supply unit 400 and be transferred to the external environment, which can reduce the temperature inside the chassis 100.

[0073] Furthermore, in one example, alternatively as shown in FIG2, the power supply unit 400 has a side panel 110 on the side opposite to the first fan 200 in the width direction of the chassis 100, and the ventilation holes 111 on the side panel 110 are close to the air inlet of the power supply unit 400. When the ventilation holes 111 are open, air from the outside environment can reach the area where the air inlet of the power supply unit 400 is located through the ventilation holes 111.

[0074] For example, the air guide assembly 500 is disposed inside the chassis 100, and the air guide assembly 500 can be used to close or open the ventilation holes 111 of the side panel 110.

[0075] During server operation, the functional components inside the chassis 100 generate heat. Initially, the airflow assembly 500 is positioned in the first position, blocking the ventilation holes 111, thus maintaining a relatively sealed interior. When heat dissipation is required, the second fan 300 draws cool air from the outside environment into the chassis 100. This cool air absorbs heat from the chassis 100 and becomes hot air. Then, the first fan 200 draws this hot air out of the chassis 100. Simultaneously, the fan built into the power supply unit 400 also draws this hot air out of the chassis 100. This air circulation ensures effective heat dissipation for both the chassis 100 and the power supply unit 400.

[0076] When the control unit 600 determines that the first fan 200 and the power supply unit 400 are competing for airflow, it can control the air guide assembly 500 to move to a second position where the ventilation hole 111 is open. At this time, external air can enter the interior of the chassis 100 through the ventilation hole 111. During the continuous operation of the fan built into the power supply unit 400, the air entering the interior of the chassis 100 through the ventilation hole 111 can directly supplement the air intake of the power supply unit 400. This supplemented air can be drawn in by the power supply unit 400, which can be used to reduce the temperature of the power supply unit 400.

[0077] Therefore, in this server, by providing ventilation holes 111 on the side panel 110 and an air guide assembly 500 inside the server, when the control unit 600 determines that the first fan 200 and the power supply unit 400 are competing for airflow, the air guide assembly 500 can open the ventilation holes 111 to allow air from the outside environment to supplement the air intake of the power supply unit 400. This prevents negative air pressure from forming at the air intake of the power supply unit 400, ensuring that the fan of the power supply unit 400 receives sufficient airflow, preventing overheating of the internal components of the power supply unit 400 and triggering over-temperature protection, thus ensuring the normal operation of the server. Simultaneously, it also prevents the air intake of the power supply unit 400 from forming a heat dissipation island, ensuring that the heat inside the chassis 100 is effectively dissipated to the outside environment.

[0078] Furthermore, in one example, with the air guide assembly 500 in the second position, the air guide assembly 500 is located between the air inlet of the power supply unit 400 and the air inlet of the first fan 200 in the width direction of the chassis 100.

[0079] It is understood that the side panel 110 is provided with ventilation holes 111. When the air guide assembly 500 moves to the first position, the air guide assembly 500 can effectively fit against the inner wall of the side panel 110 where the ventilation holes 111 are provided, and can fully cover and block the ventilation holes 111. At this time, the ventilation holes 111 will no longer allow the interior of the box and the external environment to be fluidly connected.

[0080] After the air guide assembly 500 moves to the second position, it can move to a position between the air inlet of the power supply unit 400 and the air inlet of the first fan 200 in the width direction of the enclosure. At this time, the air guide assembly 500 can divide the space in front of the air inlet of the power supply unit 400 and the air inlet of the first fan 200 into two areas. These two areas are located on both sides of the air guide assembly 500, and these two areas correspond to the air inlet of the power supply unit 400 and the air inlet of the first fan 200, respectively. During the operation of the server, the fan in the power supply unit 400 and the first fan 200 can respectively draw air from the two areas.

[0081] Furthermore, as one implementation, as shown in Figure 2, the air guide assembly 500 includes an air guide plate 510 and a driver 520. The air guide plate 510 is connected to the driver 520, and the driver 520 is electrically connected to the control unit 600. The driver 520 can drive the air guide plate 510 to move and can block or open the ventilation hole 111.

[0082] For example, the air guide plate 510 can be made of metal or non-metal materials, and the driver 520 can be an electro-hydraulic push rod or a rotary motor, etc. The driver 520 can drive the air guide plate 510 to move according to the drive signal issued by the control unit 600.

[0083] In practical use, when the air guide assembly 500 moves to the first position, the driver 520 can drive the air guide plate 510 to adhere to the inner wall of the side plate 110 and block the ventilation holes 111 on the side plate 110. At this time, the air guide plate 510 can fully block the ventilation holes 111 in the width direction of the chassis 100, and air from the outside environment cannot enter the interior of the chassis 100 through the ventilation holes 111. At the same time, air inside the chassis 100 cannot reach the outside environment through the ventilation holes 111. When the air guide assembly 500 moves to the second position, the driver 520 can drive the air guide plate 510 away from the side plate 110 and open the ventilation holes 111 on the side plate 110. At this time, the air guide plate 510 can move away from the ventilation holes 111 in the width direction of the chassis 100, and air from the outside environment can enter the interior of the chassis 100 through the ventilation holes 111. At the same time, air inside the chassis 100 can also reach the outside environment through the ventilation holes 111.

[0084] Specifically, as shown in Figure 3, the driver 520 is a rotary motor with a rotatable output end. The driver 520 is fixedly installed inside the server, for example, it can be fixedly installed on the base plate. The air guide plate 510 is fixedly connected to the output end of the driver 520. During rotation, the driver 520 can drive the air guide plate 510 to fit against the side plate 110 or drive the air guide plate 510 away from the side plate 110. When the air guide plate 510 fits against the side plate 110, the air guide plate 510 can block the ventilation holes 111 on the side plate 110. When the air guide plate 510 moves away from the side plate 110, the ventilation holes 111 on the side plate 110 can remain unobstructed.

[0085] For example, in Figure 3, when the actuator 520 drives the air guide plate 510 to move counterclockwise, the air guide plate 510 can fit against the side plate 110 and block the ventilation hole 111. As shown in Figure 4, when the actuator 520 drives the air guide plate 510 to move clockwise, the air guide plate 510 can move away from the side plate 110 and open the ventilation hole 111.

[0086] It is understood that there is a certain distance between the driver 520 and the side plate 110. In order for the air guide plate 510 to fully block all the ventilation holes 111, in one example, the air guide plate 510 may include a blocking part and a connecting part connected to each other, with an included angle between the blocking part and the connecting part. The connecting part is connected to the driver 520. When the driver 520 drives the air guide plate 510 to rotate, when the air guide assembly 500 moves to the first position, the end face of the blocking part facing the side plate 110 can fully fit against the inner wall surface of the side plate 110. This end face can cover all the ventilation holes 111, thereby effectively blocking the ventilation holes 111. Moreover, in order to improve the sealing effect, the end face of the blocking part facing the side plate 110 may also be provided with a sealing layer made of rubber material.

[0087] When the air guide assembly 500 moves to the second position, the blocking part can move away from the side plate 110, and the end face of the blocking part facing the side plate 110 is in an inclined state. At this time, as shown in Figure 4, the end of the blocking part close to the power supply unit 400 is the first end, and the end of the blocking part away from the power supply unit 400 is the second end. In the width direction of the chassis 100, the distance between the first end and the side plate 110 is greater than the distance between the second end and the side plate 110. The blocking part is in an inclined state, and the end face of the blocking part facing the side plate 110 can be used to guide the air from the ventilation hole 111 into the air inlet of the power supply unit 400.

[0088] In another alternative example, as shown in Figure 5, the actuator 520 is an electro-hydraulic push rod with a retractable output end. The actuator 520 is fixedly installed inside the housing 100, for example, it can be fixedly installed on the base plate. The air guide plate 510 is fixedly connected to the output end of the actuator 520. During the extension and retraction process, the actuator 520 can drive the air guide plate 510 to conform to the side plate 110 or drive the air guide plate 510 away from the side plate 110. When the air guide plate 510 conforms to the side plate 110, it can block the ventilation holes 111 on the side plate 110. When the air guide plate 510 moves away from the side plate 110, the ventilation holes 111 on the side plate 110 remain open.

[0089] For example, in Figure 5, when the driver 520 drives the air guide plate 510 to move to the left, the air guide plate 510 can fit against the side plate 110 and block the ventilation hole 111. When the driver 520 drives the air guide plate 510 to move to the right, the air guide plate 510 can move away from the side plate 110 and open the ventilation hole 111.

[0090] Optionally, to ensure structural stability and prevent the air guide plate 510 from falling off the driver 520, the number of drivers 520 can be two. The two drivers 520 are arranged in parallel and spaced apart inside the chassis 100. The output ends of the two drivers 520 are connected to the air guide plate 510 at the same time and can drive the air guide plate 510 to move simultaneously.

[0091] Furthermore, in one example, as shown in Figure 2, there are two power supply units 400, which are respectively arranged on both sides of the first fan 200 along the width direction of the chassis 100; there are two side plates 110, which are respectively located on both sides of the width direction of the chassis 100, and the ventilation holes 111 on the two side plates 110 are respectively close to the air inlets of the two power supply units 400; there are two air guide assemblies 500, which are respectively arranged correspondingly at the air inlets of the two power supply units 400.

[0092] For example, inside the chassis 100, a power supply unit 400 is provided on both sides of the first fan 200 in the width direction of the chassis 100, and the two power supply units 400 are symmetrically arranged on both sides of the power supply unit 400. Furthermore, each of the two side panels 110 in the width direction of the chassis 100 is provided with a ventilation hole 111, and the two power supply units 400 are respectively located on the inner side of the two side panels 110. The ventilation holes 111 on the two side panels 110 are respectively located near the air inlets of the two power supply units 400. Simultaneously, an air guide assembly 500 is also provided in the area where the air inlet of each power supply unit 400 is located, and the two air guide assemblies 500 are symmetrically arranged in the width direction of the chassis 100.

[0093] In actual use, in the initial state of server operation, both air guide components 500 are in the first position, meaning that the two air guide components 500 can respectively block the ventilation holes 111 on the two side plates 110. At this time, the interior of the chassis 100 can remain relatively sealed. During the heat dissipation process, when the first fan 200 competes with the power supply units 400 on both sides for airflow, the two air guide components 500 can be moved simultaneously to the second position, opening the ventilation holes 111. At this time, external air can enter the interior of the chassis 100 through the ventilation holes 111 on both sides. Moreover, during the continuous operation of the fan built into the power supply unit 400, the air entering the interior of the chassis 100 through the ventilation holes 111 can be supplemented to the air intake of the power supply unit 400 under the guidance of the air guide plate 510. This can prevent negative air pressure from forming at the air intake of the power supply unit 400, ensuring that the fan of the power supply unit 400 receives sufficient airflow, preventing the interior of the power supply unit 400 from overheating and triggering over-temperature protection, and ensuring that the server can operate normally. At the same time, it can also prevent the air intake of the power supply unit 400 from forming a heat dissipation island, ensuring that the heat inside the chassis 100 can be effectively dissipated to the external environment.

[0094] Furthermore, in one example, there are multiple ventilation holes 111 arranged in a rectangular array.

[0095] For example, the ventilation holes 111 can be constructed as circular holes, elliptical holes or square holes, etc. Each side plate 110 is provided with a plurality of ventilation holes 111. The plurality of ventilation holes 111 can be arranged sequentially at intervals along a first direction, or sequentially at intervals along a second direction perpendicular to the first direction. In this case, the plurality of ventilation holes 111 are arranged in a rectangular array.

[0096] The above configuration ensures that air from the external environment can enter the chassis 100 effectively and efficiently, while also protecting the functional components inside the chassis 100.

[0097] Alternatively, in some embodiments, the multiple ventilation holes 111 may be arranged in other ways on the side plate 110, for example, in a circular array.

[0098] In addition, to prevent external debris from entering the interior of the enclosure, a dust filter is installed inside the enclosure 100. The dust filter is attached to the inner wall of the side panel 110 and covers all the ventilation holes 111.

[0099] Furthermore, in one example, as shown in Figures 2 and 6, the server also includes a wind pressure detection mechanism 700, which is disposed at the air inlet of the power supply unit 400 and is electrically connected to the control unit 600.

[0100] It is understood that the wind pressure detection mechanism 700 can effectively detect the wind pressure status at the air inlet of the power supply unit 400. Moreover, the wind pressure detection mechanism 700 can transmit the detected wind pressure information to the control unit 600, and the control unit 600 can then control the movement of the air guide assembly 500 based on the wind pressure information.

[0101] Furthermore, in one example, the power supply unit 400 may have a built-in temperature sensor, which is located inside the power supply unit 400 and electrically connected to the control unit 600.

[0102] It is understood that the temperature sensor can effectively detect the temperature inside the power supply unit 400, and the temperature sensor can transmit the detected temperature information to the control unit 600. Subsequently, the control unit 600 can control the operation of the fan inside the power supply unit 400 based on the temperature information.

[0103] Furthermore, in one example, the control unit 600 may be located at the air inlet of the first fan 200.

[0104] It is understandable that by placing the control unit 600 at the air inlet of the first fan 200, the first fan 200 can also cool the control unit 600 during operation.

[0105] Specifically, the control unit 600 can be a control chip with various control programs built in. The control unit 600 can be used to control the speed of the first fan 200 and the second fan 300, as well as the speed of the fan in the power supply unit 400. It can prevent the fan in the power supply unit 400 from reversing, and can also control the movement of the air guide assembly 500.

[0106] For example, as shown in FIG5, the wind pressure detection mechanism 700 can be electrically connected to the control unit 600 via a serial communication bus to realize data transmission. In addition, the first fan 200, the second fan 300, the power supply unit 400 and the air guide assembly 500 can also be electrically connected to the control unit 600 via a serial communication bus to realize data transmission.

[0107] As mentioned above, this disclosure also provides a heat dissipation control method for the aforementioned server, as shown in Figure 5. The heat dissipation control method includes:

[0108] When the negative air pressure at the air inlet of the power supply unit 400 is detected to be greater than 500Pa, the air guide assembly 500 is controlled to move to the second position, so that the ventilation hole 111 of the side plate 110 is in the open state.

[0109] For example, during normal server operation, in the default initial state, the air guide assembly 500 is in the first position. At this time, the ventilation holes 111 of the side panel 110 are closed, and the first fan 200, the second fan 300, and the fans in the power supply unit 400 are all running. Furthermore, the operating status and speed of the first fan 200 and the second fan 300 can be adjusted according to the internal temperature of the chassis 100. For example, the higher the internal temperature of the chassis 100, the faster the speed of the first fan 200 and the second fan 300. Correspondingly, the operating status and speed of the fans built into the power supply unit 400 can be adjusted according to the internal temperature of the power supply unit 400. For example, the higher the internal temperature of the power supply unit 400, the faster the speed of the fans built into the power supply unit 400. The operating data of the first fan 200, the second fan 300, and the fans in the power supply unit 400 are also transmitted to the control unit 600 in real time.

[0110] When the control unit 600 detects through the wind pressure detection mechanism 700 that the negative wind pressure at the air inlet of the power supply unit 400 is greater than 500Pa, it indicates that the first fan 200 has started to compete with the fan of the power supply unit 400 for airflow during operation. If the current state continues, the power supply unit 400 may not be able to absorb enough airflow and will not be able to dissipate heat properly. To avoid abnormalities in the power supply unit 400, the control unit 600 can send a control signal to the air guide assembly 500, causing the air guide assembly 500 to move from the first position to the second position, so that the ventilation hole 111 switches from the blocked state to the open state. At this time, air from the outside environment can enter the interior of the enclosure through the ventilation hole 111. This air can supplement the fan of the power supply unit 400, ensuring that the power supply unit 400 absorbs enough airflow, allowing the power supply unit 400 to dissipate heat properly and ensuring that the power supply unit 400 can work normally.

[0111] Furthermore, in one example, the heat dissipation control method also includes:

[0112] When the speed of the first fan 200 is detected to be greater than 70%, the fan in the power supply unit 400 is controlled to run at its maximum speed.

[0113] For example, during the rotation of the first fan 200, its own speed is transmitted to the control unit 600 in real time. When the control unit 600 detects that the speed of the first fan 200 is greater than 70% of its maximum speed, it indicates that the temperature inside the chassis 100 has reached a certain level. At this time, the first fan 200 will compete with the fan of the power supply unit 400 for airflow at the current speed, which may cause the power supply unit 400 to not absorb enough airflow and malfunction. To avoid the power supply unit 400 from malfunctioning, the control unit 600 can send a control signal to the fan in the power supply unit 400 to make the fan run at its maximum speed. At this time, the fan in the power supply unit 400 will rotate at its maximum speed and can draw air from inside the chassis 100 with maximum suction power. This air can replenish the fan of the power supply unit 400, ensuring that the power supply unit 400 absorbs enough airflow and effectively dissipates heat, ultimately ensuring that the power supply unit 400 can work normally.

[0114] Furthermore, in one example, the heat dissipation control method also includes:

[0115] When the negative air pressure at the air inlet of the power supply unit 400 is detected to be greater than 500Pa, the first fan 200 is controlled to stop rotating and the speed of the second fan 300 is increased.

[0116] When the negative air pressure at the air inlet of the power supply unit 400 is detected to be less than 100Pa, the first fan 200 and the second fan 300 are controlled to return to their default state.

[0117] As mentioned earlier, when the control unit 600 detects through the wind pressure detection mechanism 700 that the negative air pressure at the air inlet of the power supply unit 400 is greater than 500Pa, it indicates that the first fan 200 has begun to compete with the fan of the power supply unit 400 for airflow during operation. If this state continues, the power supply unit 400 may not be able to absorb enough airflow and may not be able to dissipate heat properly. To prevent the power supply unit 400 from malfunctioning, the control unit 600 can send a control signal to the first fan 200 to allow the first fan 200 to... When the fan stops rotating, the first fan 200 no longer draws air from inside the chassis 100 to the outside environment. At the same time, the second fan 300 increases its operating speed, allowing air from the outside environment to enter the chassis 100 at a faster speed, replenishing the air inside the chassis 100. This air can replenish the air intake of the power supply unit 400, reducing the negative air pressure at the air intake of the power supply unit 400, ensuring that the power supply unit 400 absorbs enough airflow, allowing the power supply unit 400 to dissipate heat normally, and ensuring that the power supply unit 400 can work normally.

[0118] Furthermore, when the control unit 600 detects through the wind pressure detection mechanism 700 that the negative wind pressure at the air inlet of the power supply unit 400 is less than 100Pa, it indicates that the air inside the chassis 100 has reached a normal circulation state. At this time, in order to properly dissipate heat inside the chassis 100, the control unit 600 can send control signals to the first fan 200 and the second fan 300. The first fan 200 and the second fan 300 operate in the default state, that is, the operating state and speed of the first fan 200 and the second fan 300 can be automatically adjusted according to the temperature inside the chassis 100.

[0119] Furthermore, in one example, the heat dissipation control method also includes:

[0120] When the temperature at the air inlet of the power supply unit 400 is detected to reach a preset temperature value, the speed of the first fan 200 is reduced and the speed of the second fan 300 is increased. The preset temperature value is lower than the alarm threshold set by the power supply unit 400 itself.

[0121] It is understood that the power supply unit 400 has a self-set alarm threshold. When the internal temperature of the power supply unit 400 is lower than this alarm threshold, the power supply unit 400 can operate normally. When the internal temperature of the power supply unit 400 exceeds this alarm threshold, the power supply unit 400 will reduce its external output power and may even shut down. In other words, to ensure that the power supply unit 400 can operate normally, it is necessary to ensure that the maximum operating temperature of the power supply unit 400 is lower than its self-set alarm threshold. In one example, alternatively, the preset temperature value can be lower than the alarm threshold set by the power supply unit 400 itself.

[0122] During actual server operation, when the control unit 600 detects that the temperature at the air inlet of the power supply unit 400 has reached a preset temperature value, if operation continues in the current state, the internal temperature of the power supply unit 400 may exceed its own set alarm threshold, and it may ultimately fail to function properly. Therefore, on the one hand, the speed of the first fan 200 can be reduced, allowing more air to leave the chassis 100 under the suction of the fan built into the power supply unit 400, improving the heat dissipation effect of the power supply unit 400. On the other hand, the speed of the second fan 300 can be increased, allowing more heat from the external environment to enter the chassis 100 for heat exchange. Ultimately, this allows more air to enter the power supply unit 400 for heat exchange, effectively reducing the internal temperature of the power supply unit 400.

[0123] Furthermore, in one example, the heat dissipation control method also includes:

[0124] When the temperature at the air inlet of the power supply unit 400 is detected to rise after reaching the preset temperature value, the air guide assembly 500 is moved to the second position, so that the ventilation hole 111 of the side plate 110 is in the open state.

[0125] For example, if reducing the speed of the first fan 200 and increasing the speed of the second fan 300 still fails to effectively reduce the internal temperature of the power supply unit 400, the control unit 600 will send a control signal to the driver 520 in the air guide assembly 500, causing the driver 520 to move the air guide plate 510 away from the side plate 110, and causing the ventilation holes 111 on the side plate 110 to be open, allowing cold air from the outside environment to enter the interior of the chassis 100. This cold air can reach the air inlet of the power supply unit 400 and then enter the interior of the power supply unit 400 to cool the power supply unit 400.

[0126] In other words, when the air inside the chassis 100 is insufficient to cool the power supply unit 400, the ventilation holes 111 of the side panel 110 can be opened to allow cool air from the outside environment to enter the power supply unit 400 for heat exchange, thereby effectively reducing the temperature inside the power supply unit 400.

[0127] Furthermore, in one example, the preset temperature value can be set to be 3°C lower than the alarm threshold set by the power supply unit 400 itself.

[0128] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0129] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

[0130] List of reference numerals: 10, Power supply; 20, System fan; 100, Chassis; 110, Side panel; 111, Ventilation vent; 200, First fan; 300, Second fan; 400, Power supply unit; 500, Air guide assembly; 510, Air guide plate; 520, Driver; 600, Control unit; 700, Air pressure detection mechanism.

Claims

1. A server, characterized in that, include: A chassis, the chassis including a side panel, the side panel being disposed on the side of the chassis in the width direction, the side panel being provided with ventilation holes; A first fan and a second fan are disposed inside the chassis and on opposite sides of the chassis along its length. A power supply unit is disposed inside the chassis. The power supply unit is located on the side of the first fan near the side panel, and the ventilation hole is near the air inlet of the power supply unit. An air guide assembly is disposed inside the chassis and near the air inlet of the power supply unit. The air guide assembly is movable between a first position that blocks the ventilation holes of the side panel and a second position that opens the ventilation holes of the side panel. The control unit is located inside the chassis, and the first fan, the second fan, the power supply unit, and the air guide assembly are all electrically connected to the control unit.

2. The server according to claim 1, characterized in that, The chassis includes a top plate, a bottom plate, a front plate, a rear plate, and two side plates. The top plate, bottom plate, front plate, rear plate, and two side plates are connected to each other to form an accommodating space. The rear plate and the front plate each have multiple through holes.

3. The server according to claim 1, characterized in that, The chassis is equipped with a dustproof mesh inside, which is attached to the inner wall of the side panel and covers all ventilation holes.

4. The server according to claim 1, characterized in that, With the air guide assembly in the second position, the air guide assembly is located between the air inlet of the power supply unit and the air inlet of the first fan in the width direction of the chassis.

5. The server according to claim 1, characterized in that, The air guide assembly includes an air guide plate and a driver. The air guide plate is connected to the driver, and the driver is electrically connected to the control unit. The driver can drive the air guide plate to move and can cause the air guide plate to block or open the ventilation hole.

6. The server according to claim 5, characterized in that, The driver is either a drive motor or an electro-hydraulic actuator.

7. The server according to claim 6, characterized in that, The driver is a drive motor, and the air guide plate is connected to the output shaft of the driver. The air guide plate includes a blocking part and a connecting part that are connected to each other. An angle is formed between the blocking part and the connecting part. When the air guide assembly is in the first position, the blocking part is attached to the inner wall surface of the side plate.

8. The server according to claim 7, characterized in that, The end face of the sealing part facing the side plate is provided with a sealing layer made of rubber material.

9. The server according to claim 5, characterized in that, The air guide assembly includes a pair of drivers connected to the air guide plate.

10. The server according to claim 1, characterized in that, The number of power supply units is two, and the two power supply units are respectively arranged on both sides of the first fan along the width direction of the chassis; The number of side panels is two, and the two side panels are respectively located on both sides of the width direction of the chassis. The ventilation holes on the two side panels are respectively close to the air inlets of the two power supply units. The number of air guide components is two, and the two air guide components are respectively installed at the air inlets of the two power supply units.

11. The server according to claim 1, characterized in that, The number of ventilation holes is multiple, and the multiple ventilation holes are arranged in a rectangular array.

12. The server according to claim 1, characterized in that, It also includes a wind pressure detection mechanism, which is located at the air inlet of the power supply unit and is electrically connected to the control unit.

13. The server according to claim 1, characterized in that, The power supply unit has a built-in temperature sensor, which is located inside the power supply unit and electrically connected to the control unit.

14. The server according to claim 1, characterized in that, The control unit is located at the air inlet of the first fan.

15. A heat dissipation control method for a server as described in any one of claims 1 to 14, characterized in that, The heat dissipation control method includes: When the negative air pressure at the air inlet of the power supply unit is detected to be greater than 500Pa, the air guide assembly is moved to the second position, so that the ventilation holes of the side panel are open.

16. The heat dissipation control method according to claim 15, characterized in that, The heat dissipation control method further includes: When the speed of the first fan is detected to be greater than 70%, the fan in the power supply unit is controlled to run at its maximum speed.

17. The heat dissipation control method according to claim 15, characterized in that, The heat dissipation control method further includes: When the negative air pressure at the air inlet of the power supply unit is detected to be greater than 500Pa, the first fan is controlled to stop rotating and the speed of the second fan is increased. When the negative air pressure at the air inlet of the power supply unit is detected to be less than 100Pa, the first and second fans are controlled to return to their default states.

18. The heat dissipation control method according to claim 15, characterized in that, The heat dissipation control method further includes: When the temperature at the air inlet of the power supply unit is detected to reach a preset temperature value, the speed of the first fan is reduced and the speed of the second fan is increased. The preset temperature value is lower than the alarm threshold set by the power supply unit itself.

19. The heat dissipation control method according to claim 18, characterized in that, The heat dissipation control method further includes: When the temperature at the air inlet of the power supply unit is detected to rise after reaching the preset temperature value, the air guide assembly is moved to the second position, so that the ventilation holes of the side panel are open.

20. The heat dissipation control method according to claim 18, characterized in that, The preset temperature value is 3°C lower than the alarm threshold set by the power supply unit itself.

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