Microinverter

Abstract

The present invention relates to a microinverter which may comprise: a case in which a circuit board is disposed in an inner space; a potting material stored in the inner space of the case and covering the circuit board; and a heat dissipation structure disposed to pass through the case and having one surface exposed to the outside of the case and the opposite surface in contact with the potting material.

Description

microinverter

[0001] The present invention relates to a micro inverter.

[0002] An inverter is a device that converts direct current (DC) into alternating current (AC). It is used in various industrial applications, including electric motor drives, uninterruptible power supplies (UPS), and active power filters, as well as in renewable energy conversion systems, including solar power generation, and hybrid vehicles.

[0003] Recently, the solar power inverter market, centered around the US, has been adopting microinverters (MI). Microinverters are distributed systems that convert direct current to alternating current on a module-by-module basis, with each individual solar cell module equipped with a small inverter.

[0004] Microinverters are typically positioned at the rear of solar power-generating DC modules. However, the heat generated by the inverter's operation and the heat generated by the DC module's power generation can transfer to the MI, causing overheating. Furthermore, as MI devices become increasingly miniaturized, circuit elements are increasingly integrated into smaller volumes. This heat generated within the microinverter's circuit elements reduces conversion efficiency and shortens the device's lifespan due to thermal damage to internal components.

[0005] The present invention aims to provide a micro inverter that improves the heat dissipation performance of a case to prevent overheating, thereby increasing conversion efficiency and enhancing the durability and usability of the device.

[0006] One aspect of the present invention provides a micro-inverter including a case in which a circuit board is placed in an internal space, a potting material stored in the internal space of the case and covering the circuit board, and a heat dissipation structure disposed to penetrate the case, one surface of which is exposed to the outside of the case and the other surface of which is in contact with the potting material.

[0007] A microinverter according to an embodiment of the present invention can improve durability, usability, and performance by dissipating heat from internal components to the outside. The microinverter can dissipate internal heat to the outside because its heat-dissipating structure contacts the potting material stored within it and comes into contact with external air.

[0008] The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention pertains from this specification and the attached drawings.

[0009] FIG. 1 is a schematic diagram illustrating a micro inverter according to one embodiment of the present invention.

[0010] Fig. 2 is a perspective view of the micro inverter of Fig. 1 aligned with respect to the surface on which the heat dissipation structure is installed.

[0011] Figure 3 is an exploded perspective view of the micro inverter illustrated in Figure 2.

[0012] Fig. 4 is a cross-sectional view of the portion where the sealing cap of Fig. 2 is installed.

[0013] Figure 5 is a drawing for explaining the process of filling potting material into the case of Figure 2.

[0014] Fig. 6 is a drawing for explaining the air flow path in the case of Fig. 2.

[0015] Fig. 7 is a drawing schematically illustrating the heat dissipation structure of Fig. 2.

[0016] Figure 8 is a cross-sectional view taken along line AA' of Figure 2.

[0017] Figure 9 is a drawing showing an enlarged portion of section C in Figure 8.

[0018] FIG. 10 is a drawing showing another embodiment of the heat dissipation structure shown in FIG. 9.

[0019] Fig. 11 is a cross-sectional view taken along line BB' of Fig. 2.

[0020] Figure 12 is a drawing showing an enlarged portion of part D in Figure 11.

[0021] Figure 13 is a cross-sectional view of a micro inverter installed in an external structure from the side.

[0022] One aspect of the present invention provides a micro-inverter including a case in which a circuit board is placed in an internal space, a potting material stored in the internal space of the case and covering the circuit board, and a heat dissipation structure disposed to penetrate the case, one surface of which is exposed to the outside of the case and the other surface of which is in contact with the potting material.

[0023] Additionally, the heat dissipation structure may have a first heat dissipation fin protruding from the first surface to a first height and a second heat dissipation fin protruding from the other surface to a second height.

[0024] Additionally, the heat dissipation structure may have different first and second heights.

[0025] Additionally, the number of the first heat dissipation fins and the number of the second heat dissipation fins of the heat dissipation structure may be different.

[0026] Additionally, the heat dissipation structure may have a surface area exposed to the outside greater than the surface area in contact with the potting material.

[0027] Additionally, the case may further include a support bracket mounted to the case so as to face the heat dissipation structure and supporting the case to an external structure.

[0028] Additionally, the support bracket may include a bracket body mounted on the installation surface of the external structure, and a snap extending from the bracket body and connected to the case, but separating the case from the installation surface.

[0029] In addition, the heat dissipation structure may be positioned in the case to face the installation surface, so that a predetermined gap may be set between the heat dissipation structure and the installation surface.

[0030] Additionally, the potting material can transfer heat generated in the circuit board to the heat dissipation structure.

[0031] In addition, the potting material is provided as a fluid material and can flow along the surface of the circuit board and dissipate heat generated from the circuit board to the surroundings.

[0032] Another aspect of the present invention provides a micro inverter, comprising a case having a first case facing outward and a second case facing an external structure, a circuit board disposed in an internal space of the first case and the second case, a potting material stored in the internal space and covering the circuit board, and a heat dissipation structure disposed to penetrate the second case, one surface of which is exposed to the outside of the second case and the other surface of which is in contact with the potting material, wherein the second case is concave and has a concave portion through which external air flows, and the heat dissipation structure is disposed on the concave portion.

[0033] In addition, the recessed portion is sunken to a preset depth in the outermost surface of the second case adjacent to the installation surface of the external structure on which the case is installed, and the heat dissipation structure may have a predetermined gap from the installation surface.

[0034] Additionally, the second case may have at least one gate groove connected to the concave portion and through which the external air flows into the concave portion.

[0035] Additionally, the second case may have a third gate groove facing the heat dissipation structure and through which the external air flows into the concave portion.

[0036] Additionally, the case may further include a support bracket mounted to the case so as to face the heat dissipation structure and supporting the case to an external structure.

[0037] Additionally, the heat dissipation structure may have a base plate mounted on the second case, a first heat dissipation fin protruding from one surface of the base plate to a first height, and a second heat dissipation fin protruding from the other surface of the base plate to a second height.

[0038] Additionally, the heat dissipation structure may have different first and second heights.

[0039] Additionally, the thickness of the base plate may be smaller than the first height and larger than the second height.

[0040] Additionally, the second case may have a first injection port for injecting the potting material, and a second injection port spaced apart from the first injection port.

[0041] Additionally, the second case may further include a first gate groove adjacent to the first injection port and connected to the concave portion, a second gate groove adjacent to the second injection port and connected to the concave portion, and a third gate groove disposed on the opposite side of the first gate groove or the second gate groove and connected to the concave portion.

[0042] The present invention is capable of various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, as well as the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various forms.

[0043] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same drawing reference numerals, and redundant descriptions thereof will be omitted.

[0044] In the examples below, the terms first, second, etc. are not used in a limiting sense, but are used for the purpose of distinguishing one component from another.

[0045] In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0046] In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not preclude the possibility that one or more other features or components may be added.

[0047] In the following examples, when a part such as an area, component, etc. is said to be on or above another part, it includes not only the case where it is directly above the other part, but also the case where another area, component, etc. is interposed in between.

[0048] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

[0049] In the following examples, when it is said that areas, components, etc. are connected, it includes not only cases where the areas or components are directly connected, but also cases where other areas or components are interposed between the areas or components and are indirectly connected.

[0050] FIG. 1 is a drawing schematically illustrating a micro inverter (10) according to one embodiment of the present invention, and FIG. 2 is a perspective view of the micro inverter (10) of FIG. 1 aligned with respect to the surface on which the heat dissipation structure (200) is installed.

[0051] Hereinafter, the left-right direction is referred to as the X-axis, the front-back direction as the Y-axis, and the up-down direction as the Z-axis, based on the micro inverter (10) illustrated in Fig. 1.

[0052] Referring to FIGS. 1 and 2, a micro inverter (10) includes a case (100) storing a circuit board therein, a heat dissipation structure (200), and a support bracket (300), and can be connected to a first connector (400) and a second connector (500).

[0053] The case (100) may have an internal space. The case (100) forms the exterior of the micro inverter (10) and may accommodate a circuit board (600) therein (see FIG. 3). The case (100) may fix the position of the circuit board (600). To this end, the internal shape of the case (100) may correspond to the shape of the circuit board (600).

[0054] The case (100) can protect the circuit board (600) placed inside. For example, considering the stable operation of the micro inverter (10) and the influence of the surrounding environment, it can have the functions of heat resistance, moisture resistance, water resistance, electrical insulation, cold resistance, oil resistance, impact resistance, and waterproof resistance.

[0055] In one embodiment, the case (100) may be comprised of a first case (110) and a second case (120). The case (100) may be assembled such that the first case (110) and the second case (120) face each other in the Z-axis direction.

[0056] The first case (110) and the second case (120) may include connection positions of the first connector (400) and the second connector (500). The first connector (400) and the second connector (500) are interposed between the first case (110) and the second case (120), and the connection position of the first connector (400) and the connection position of the second connector (500) may be set.

[0057] According to one embodiment, the first connector (400) and the second connector (500) may be arranged parallel to each other in the X-axis direction on the same side of the case (100). The first connector (400) and the second connector (500) are insulated from each other so that current can be input and output through each connector.

[0058] According to one embodiment, the case (100) can store a potting material (see FIG. 6) in its internal space. The internal space of the case (100) can be sealed to prevent the potting material contained therein from leaking out or foreign substances from penetrating.

[0059] For example, the case (100) may have an injection port for injecting the potting material on one side and may include a sealing cap (130) for sealing the port. In addition, the case (100) may seal the assembly portion of the first case (110) and the second case (120), the connection position of the first connector (400), and the connection position of the second connector (500).

[0060] The heat dissipation structure (200) is positioned on one side of the case (100) and can be arranged to penetrate the case (100). The heat dissipation structure (200) is made of a material having thermal conductivity and can transfer heat generated inside the case (100) to the outside. The heat dissipation structure (200) can release heat generated while the micro inverter (10) is operating, thereby preventing overheating, improving conversion efficiency, and extending the lifespan of components.

[0061] The support bracket (300) may be provided to support one side of the case (100). The support bracket (300) may be positioned to face the case (100) in the Z-axis direction. For example, the support bracket (300) may be positioned adjacent to the second case (120).

[0062] The support bracket (300) can be installed in an external structure, such as another device, building, etc., in a state of being assembled with the case (100). The micro inverter (10) can be installed by being fixed to the desired installation location by the support bracket (300).

[0063] According to one embodiment, the case (100) and the support bracket (300) can be assembled by a locking unit. The locking unit can be provided with a first locker and a second locker that are arranged to be assembled with each other. When either the case (100) or the support bracket (300) has a first locker, the other can have a second locker that is assembled with the first locker.

[0064] For convenience of explanation, the following is based on an embodiment in which a first locker (122) is provided in a case (100) and a second locker (320) is provided in a support bracket (300).

[0065] According to one embodiment, the first locker (122) may be placed on one side of the case (100), and the second locker (320) may be placed on the support bracket (300) at a position corresponding to the first locker (122). The first locker (122) and the second locker (320) may be assembled to secure the case (100) to the support bracket (300). The first locker (122) and the second locker (320) may be provided in multiple numbers.

[0066] Figure 3 is an exploded perspective view of the micro inverter (10) illustrated in Figure 2.

[0067] Referring to FIG. 3, the micro inverter (10) may include a first case (110), a second case (120), a heat dissipation structure (200), a circuit board (600), a support bracket (300), a first connector (400), and a second connector (500).

[0068] According to one embodiment, the first case (110) may include a cover portion (111), a joint groove (113), a first fitting piece (114), and a second fitting piece (115).

[0069] The cover portion (111) may be provided in a roughly plate shape that covers one surface of the circuit board (600). The cover portion (111) may be provided to cover the upper surface of the circuit board (600). The cover portion (111) may be exposed to the outside when the micro inverter (10) is installed in an external structure.

[0070] The joint groove (113) may be formed on the surface of the cover portion (111) facing the second case (120). According to one embodiment, the joint groove (112) may be formed along the perimeter of the bottom surface of the cover portion (111). The joint groove (112) may be provided so as to be engageable with the base protrusion (123) of the second case (120).

[0071] The first fitting piece (114) is provided on one side of the cover portion (111) and can be fastened to the first connector (400) connected to the case (100). The first fitting piece (114) can be positioned adjacent to the position where the first connector (400) is connected. For example, the first fitting piece (114) can be provided as a protrusion that protrudes from the surface where the first case (110) contacts the first connector (400).

[0072] The second fitting piece (115) is provided on the other side of the cover portion (111) and can be fastened to the second connector (500) connected to the case (100). The second fitting piece (115) can be positioned adjacent to the position where the second connector (500) is connected. For example, the second fitting piece (115) can be provided as a protrusion protruding from the surface where the first case (110) contacts the second connector (500).

[0073] According to one embodiment, the second case (120) may include a base portion (121), a first locker (122), a base protrusion (123), a third fitting piece (124), and a fourth fitting piece (125).

[0074] The base portion (121) may be positioned opposite the cover portion (111) and may be provided to cover the other surface of the circuit board (600). The base portion (121) may correspond to the shape of the bottom surface of the circuit board (600). The base portion (121) may support the circuit board (600) and fix its position.

[0075] The first locker (122) may be placed on the edge of the second case (120). The first locker (122) may be provided so as to be assembled with the second locker (320) of the support bracket.

[0076] The base protrusion (123) may be formed on a surface facing the first case (110). According to one embodiment, the base protrusion (123) may be formed along the upper periphery of the base portion (121). The base protrusion (123) may be provided so as to be connectable to the joint groove (112).

[0077] The third fitting piece (124) is provided on one side of the base portion (121) and can be fastened to the first connector (400) connected to the case (100). The third fitting piece (124) can be positioned adjacent to the position where the first connector (400) is connected. For example, the third fitting piece (124) can be provided as a protrusion protruding from the surface where the second case (120) contacts the first connector (400).

[0078] The fourth fitting piece (125) is provided on the other side of the base portion (121) and can be fastened to the second connector (500) connected to the case (100). The fourth fitting piece (125) can be positioned adjacent to the position where the second connector (500) is connected. For example, the fourth fitting piece (125) can be provided as a protrusion protruding from the surface where the second case (120) contacts the second connector (400).

[0079] According to one embodiment, the second case (120) may have a fixing hole (1201) into which a heat dissipation structure (200) is inserted, and an injection hole (1202) for injecting the potting material.

[0080] The fixing hole (1201) may be provided as a hole penetrating the second case (120) to fit and fix the heat dissipation structure (200). The fixing hole (1201) may be provided in a shape corresponding to the shape of the heat dissipation structure (200).

[0081] For example, when the second case (120) and the heat dissipation structure (200) are formed separately, the fixing hole (1201) may be provided in a shape that can be fastened to the heat dissipation structure (200).

[0082] As another example, when the second case (120) and the heat dissipation structure (200) are manufactured as an integrated structure using a double injection method, the fixing hole (1201) can be defined as the boundary surface of the second case (120) and the heat dissipation structure (200).

[0083] In the drawing, the second case (120) is illustrated as having one fixing hole (1201), but this is not limited to this and may be provided in a different number as needed. For example, at least one fixing hole (1201) may be arranged on the concave portion of the second case (120).

[0084] The injection hole (1202) may be provided as a hole penetrating the second case (120) to inject the potting material. The injection hole (1202) may be defined as an injection port (1214) formed on one side of the second case (120). The injection hole (1202) may be sealed by a sealing cap (130) after the potting material is injected. In the drawing, the second case (120) is illustrated as having two injection ports (1214), but this is not limited thereto, and a different number may be provided as needed.

[0085] The circuit board (600) can be placed between the first case (110) and the second case (120). The circuit board (600) can be accommodated in an internal space formed by assembling the first case (110) and the second case (120). The circuit board (600) can be supported by the first case (110) and the second case (120) and its position can be fixed.

[0086] The circuit board (600) may be configured to convert direct current power into alternating current power. The circuit board (600) may have a first connector (400) connected to one side and a second connector (500) connected to the other side.

[0087] The circuit board (600) may be provided with electronic circuits and circuit components formed at preset locations on one or both sides of the board. For example, the circuit board (600) may be provided as a conventional printed circuit board assembly (PCBA). The following description assumes that the circuit board (600) is used singly, but may be used by integrating it into multiple layers as needed.

[0088] According to one embodiment, the circuit board (600) may have a substrate portion (610) and a circuit portion (620). The substrate portion (610) may have a plate shape, and may have a circuit pattern printed on one or both sides, or may provide a surface on which circuit components are arranged. The circuit portion (620) may be arranged on one or both sides of the substrate portion (610). The circuit portion (620) may include a circuit for converting direct current power into alternating current power. The circuit portion (620) may include components such as a circuit pattern, an integrated circuit (IC), a capacitor, and a transformer printed with copper on the substrate portion (610). For example, the circuit portion (620) may include each circuit component, such as a voltage boost circuit for boosting an input direct current voltage, a conversion circuit for converting direct current power into alternating current power, etc.

[0089] According to one embodiment, the support bracket (300) may include a bracket body (310), a second locker (320), and a snap (330).

[0090] The bracket body (310) may support the bottom surface of the second case (120) or may be positioned facing the bottom surface of the second case (120) but spaced apart from it. The bracket body (310) may be mounted on the installation surface when the micro inverter (10) is installed on an external structure.

[0091] The second locker (320) is provided on the upper surface of the bracket body (310) and can be positioned corresponding to the first locker (122). The second locker (320) can be provided so as to be assembled to the first locker (122).

[0092] The snap (330) may be formed to protrude from the bracket body (310) to a predetermined height. The snap (330) may be assembled to the case (100) using a conventional snap-fit ​​fastening method. The snap-fit ​​fastening method is a method of connecting two parts without a separate connecting member, in which a hook is inserted into a predetermined groove or surface to fasten.

[0093] According to one embodiment, the snap (330) may have a snap-fit ​​structure that is connected to one side of the first case (110) or the second case (120). At least a portion of the snap (330) may be elastic, and the second case (120) may be connected to the snap (330) by a forced fit. The case (100) may be installed on the external structure by being connected to the snap (330). At this time, depending on the protruding height of the snap (330), the case (100) may be fixed at a position spaced apart from the installation surface.

[0094] The first connector (400) and the second connector (500) may be provided to connect the micro inverter (10) to the outside. The first connector (400) and the second connector (500) may be connected to an external power source and power system using a cable or other connector.

[0095] According to one embodiment, the first connector (400) may be provided as a direct current (DC) connector, and the second connector (500) may be provided as an alternating current (AC) connector.

[0096] The first connector (400) can be directly connected to the circuit board (600). One end of the first connector (400) can be connected to the circuit board (600). A solar cell module (not shown) can be connected to the other end of the first connector (400). The solar cell module is a device that converts light energy into battery energy through the photovoltaic effect. The first connector (400) can input direct current power generated by the solar cell module and transmit the input direct current power to the circuit board (600).

[0097] The second connector (500) can be directly connected to the circuit board (600). One end of the second connector (500) can be connected to the circuit board (600). A power system (not shown) can be connected to the other end of the second connector (500). The second connector (500) can output AC power converted from the circuit board (600) and transmit the output AC power to the power system via an AC output cable.

[0098] Fig. 4 is a cross-sectional view of a portion where the sealing cap (130) of Fig. 2 is installed, and Fig. 5 is a drawing for explaining the process of filling a potting material (P) into the case (100) of Fig. 2.

[0099] Referring to FIGS. 2, 4 and 5, the sealing cap (130) can be coupled to the injection hole (1202) of the second case (120) to seal the internal space (S1) of the case (100).

[0100] A sealing cap (130) may be provided to seal the injection hole (1202). Hereinafter, the surface exposed to the outside of the case (100) is defined as the outer surface, and the surface facing the internal space (S1) of the case is defined as the inner surface.

[0101] According to one embodiment, the sealing cap (130) may be provided with a joint portion (131) and an insert portion (132). The joint portion (131) may be an edge portion of the sealing cap (130) and may be joined to the periphery of the injection hole (1202). The insert portion (132) may be provided such that the center of the sealing cap (130) is concavely recessed and may be inserted into the injection hole (1202).

[0102] In an optional embodiment, the second case (120) may include an injection port (1214) protruding outwardly. The injection hole (1202) may be extended into a tubular shape by the injection port (1214).

[0103] The injection port (1214) may be formed in a tubular shape extending in the -Z direction from the injection hole (1202). The injection port (1214) may expand the depth into which the sealing cap (130) is inserted and may support at least the circumferential surface of the sealing cap (130). A supporter (1215) may be further provided on the inner wall of the injection port (1214).

[0104] The supporter (1215) may be formed as a wall portion protruding toward the center from the inner wall of the injection port (1214). As a specific example, the supporter (1215) may be formed in a ring shape surrounding the inner wall of the injection port (1214). The supporter (1215) may reduce the diameter of the injection hole (1202) while supporting the inner surface of the sealing cap (130) inserted into the injection port (1214).

[0105] When the sealing cap (130) is inserted into the injection port (1214), the insertion portion (132) covers the injection hole (1202), and the bonding portion (131) can be in contact with the supporter (1215) to form a first bonding surface (13101) and a second bonding surface (13102). The first bonding surface (13101) can be bonded to the outer surface (12151) of the supporter, and the second bonding surface (13102) can be bonded to the inner surface (12152) of the supporter and fixed. For example, the sealing cap (130) can be bonded to the supporter (1215) by ultrasonic bonding.

[0106] The potting material (P) can be stored in the internal space (S1) of the case (100) and cover the circuit board (600). The potting material (P) can be filled into the internal space (S1) of the case through the injection hole (1202) and can be provided to fill the periphery of the circuit board (600). The potting material (P) can be arranged to fill at least the space between the circuit board (600) and the heat dissipation structure (200).

[0107] The potting material (P) can transfer heat between the circuit board (600) and the heat dissipation structure (200) by including a material with high thermal conductivity. The potting material (P) can release heat by transferring heat generated from the circuit board (600) to the surroundings.

[0108] Meanwhile, the potting material (P) can wrap the circuit board (600) to prevent damage caused by external environmental factors. For example, the potting material (P) can include heat-resistant, chemical-resistant, and moisture-proof materials, thereby preventing damage to the circuit board (600) caused by heat or chemicals, corrosion caused by moisture, etc. In addition, the potting material (P) can include an insulating material, thereby insulating the surface of the circuit board (600) and preventing electrical interference.

[0109] In one embodiment, the potting material (P) may be provided as a fluid material. The potting material (P) may flow along the surface of the circuit board (600) and dissipate heat generated in the circuit board (600) to the surrounding area.

[0110] As another example, the potting material (P) may be provided as a conditionally curable material and may coat and protect the surface of the circuit board (600). For example, the potting material (P) may be provided as a two-component silicone, and may be cured when the silicone is mixed with a curing agent.

[0111] Referring to Fig. 5, the first case (110) and the second case (120) can be assembled to house a circuit board (600). Before injecting the potting material (P), the internal space (S1) may be in a state where the periphery of the circuit board (600) is empty.

[0112] In one embodiment, the second case (120) may have a plurality of injection ports (1214). The second case (120) may have a first injection port (1214a) through which potting material (P) is injected, and a second injection port (1214b) spaced apart from the first injection port (1214a).

[0113] The potting material (P) can be filled into the internal space (S1) through the first inlet (1214a), and the air present in the internal space (S1) can be discharged through the second inlet (1214b). As a result, the pressure in the internal space (S1) does not increase, and the potting material (P) can be prevented from flowing back through the first inlet (1214a).

[0114] Fig. 6 is a drawing for explaining the flow path of air in the case (100) of Fig. 2.

[0115] Referring to FIG. 6, the second case (120) may have a concave portion that is concave and allows air to flow, and the heat dissipation structure (200) may be placed on the concave portion.

[0116] The second case (120) may have a first concave portion (1211) and a second concave portion (1212) sunken from the outermost surface (1210).

[0117] The first concave portion (1211) and the second concave portion (1212) may be formed by being sunken to a predetermined depth from the outermost surface (1210). In one embodiment, the first concave portion (1211) and the second concave portion (1212) may be sunken to different depths to form a step.

[0118] A mount portion (1213) may be formed in either the first concave portion (1211) or the second concave portion (1212). A heat dissipation structure (200) may be placed in the mount portion (1213). As a result, the second case (120) may form a path for external air to flow into the heat dissipation structure (200) through the first concave portion (1211) and the second concave portion (1212).

[0119] In one embodiment, the mount portion (1213) may be protruded from the bottom surface of the first concave portion (1211) or the second concave portion (1212). Since the mount portion (1213) is positioned adjacent to the path of the first concave portion (1211) and the second concave portion (1212), external air is not blocked while passing through the first concave portion (1211) and the second concave portion (1212), thereby increasing the fluidity of the air. In addition, since the mount portion (1213) protrudes from the first concave portion (1211) and the second concave portion (1212), the size of the internal space of the case (100) can be expanded, thereby securing a space for storing the potting material.

[0120] Referring again to FIG. 1, when the micro inverter (10) is installed in an external structure, the second case (120) may be installed in a direction facing the external structure. At this time, the second case (120) may have at least one gate groove through which external air is introduced into the first concave portion (1211) and the second concave portion (1212) due to the shapes of the first concave portion (1211) and the second concave portion (1212).

[0121] In the following, in order to explain the flow of air when a plurality of gate grooves are provided in the second case (120), the lower part of the drawing is defined as the forward direction of the second case (120), and the upper part of the drawing is defined as the rearward direction of the second case (120).

[0122] According to one embodiment, the second case (120) may be provided with a third gate groove (G3) in the front direction, and a first gate groove (G1) and a second gate groove (G2) in the rear direction.

[0123] The first gate groove (G1) is positioned adjacent to the first inlet (1214a) and can be connected to the first concave portion (1211). External air can be introduced into the first concave portion (1211) through the first gate groove (G1) and move toward the heat dissipation structure (200) along the first concave portion (1211).

[0124] The second gate groove (G2) is positioned adjacent to the first inlet (1214a) and can be connected to the second concave portion (1212). External air can be introduced into the second concave portion (1212) through the second gate groove (G2) and move toward the heat dissipation structure (200) along the second concave portion (1212).

[0125] The third gate groove (G3) may be provided as a spaced apart from the joint portion of the first connector (400) and the joint portion of the second connector (500). The third gate groove (G3) may be connected to the first concave portion (1211) and may be positioned to face the heat dissipation structure (200). External air may enter the first concave portion (1211) through the third gate groove (G3) and move toward the mount portion (1213) to contact the heat dissipation structure (200).

[0126] Accordingly, the first gate groove (G1), the second gate groove (G2), and the third gate groove (G3) can form an air flow path that is connected by the first concave portion (1211) and the second concave portion (1212). The air flow path can guide external air to move toward the heat dissipation structure (200). The heat dissipation structure (200) is located within the path through which the external air flows, and can quickly release heat transferred from the internal space (S1) of the case (100) to the outside.

[0127] Since the third gate home (G3) faces the first gate home (G1) or the second gate home (G2) in the front-back direction and is connected to the first concave portion (1211) and the second concave portion (1212), a ventilation path can be formed between them.

[0128] For example, when external air is introduced into the third gate groove (G3), it can move along the first concave portion (1211) and the second concave portion (1212), thereby allowing heat transfer to the heat dissipation structure (200). The air that has received heat can be discharged into the first gate groove (G1) or the second gate groove (G2).

[0129] Likewise, when external air is introduced into the first gate groove (G1) or the second gate groove (G2), it moves along the first concave portion (1211) and the second concave portion (1212), so that heat can be transferred to the heat dissipation structure (200). The air that has received heat can be discharged into the third gate groove (G3).

[0130] Fig. 7 is a drawing schematically illustrating the heat dissipation structure (200) of Fig. 2.

[0131] Referring to FIGS. 3 and 7, a heat dissipation structure (200) may be positioned to penetrate the second case (120). The heat dissipation structure (200) may be provided with a base plate (210), a first heat dissipation fin (220), a second heat dissipation fin (230), and a fastening protrusion (240).

[0132] The base plate (210) is provided in a plate shape and can be fitted through a fixing hole (1201). A first heat dissipation fin (220) can be formed on one surface of the base plate (210), and a second heat dissipation fin (230) can be formed on the other surface.

[0133] The first heat dissipation fin (220) may be provided as a protrusion protruding from one surface of the base plate (210) at a predetermined height, and the second heat dissipation fin (230) may be provided as a protrusion protruding from the other surface of the base plate (210) at a predetermined height.

[0134] The fastening protrusion (240) may be provided as a protrusion formed on the circumferential surface of the base plate (210). The fastening protrusion (240) may be provided so as to be fastened by contacting the inner surface of the fixing hole (1201), as illustrated in FIG. 9 described later.

[0135] Figure 8 is a cross-sectional view taken along line AA' of Figure 2, and Figure 9 is a drawing showing an enlarged portion C of Figure 8.

[0136] Referring to FIGS. 2, 6, 8, and 9, the heat dissipation structure (200) can be positioned to penetrate the second case (120). The heat dissipation structure (200) can be fixed by inserting the base plate (210) into the fixing hole (1201) and fastening it with a fastening protrusion (240).

[0137] The first case (110) and the second case (120) can seal the internal space (S1) by combining the joint groove (112) and the base protrusion (123). A potting material (P) can be stored in the internal space (S1). The potting material (P) can transfer heat generated from the circuit board (600) to the heat dissipation structure (200) to release it to the outside, or transfer it to the periphery of the circuit board (600) to disperse the heat.

[0138] The heat dissipation structure (200) has one surface exposed to the outside of the case (100) and the other surface can come into contact with the potting material (P). The heat dissipation structure (200) can release heat generated in the internal space (S1) to the outside of the inverter (10).

[0139] Accordingly, the micro inverter (10) can release heat generated in the internal space (S1) by the potting material (P) and the heat dissipation structure (200), and prevent a decrease in conversion efficiency and damage to components due to overheating.

[0140] The circuit board (600) may be arranged so that the flat plate-shaped substrate portion (610) faces the first case (110), and the circuit portion (620) to which circuit components, etc. are attached faces the second case (120).

[0141] The second case (120) corresponds to the shape of the circuit portion (620) and may include an outermost surface (1210), a first concave portion (1211), a second concave portion (1212), and a mount portion (1213).

[0142] Hereinafter, the gap between the first case (110) and the second case (120) is defined as an “internal height”, and the step of the outermost surface (1210), the first concave portion (1211), the second concave portion (1212), and the mount portion (1213) is explained. That is, the internal height of the outermost surface (1210) is the largest, and the internal height of the second concave portion (1212) is the smallest.

[0143] As described above in FIG. 6, the first concave portion (1211) and the second concave portion (1212) can be sunken to a predetermined depth from the outermost surface (1210) to form a path for air to flow to the outer surface of the second case (120). At the same time, the first concave portion (1211) and the second concave portion (1212) are arranged adjacent to the circuit portion (620) facing their inner surfaces, so that the circuit board (600) can be fixed, and the micro inverter (10) can be manufactured more compactly.

[0144] According to one embodiment, the mount portion (1213) may be provided with an internal height such that the heat dissipation structure (200) and the circuit board (600) do not directly contact each other. Thus, the internal height of the mount portion (1213) may be provided higher than the internal heights of the first concave portion (1211) and the second concave portion (1212). The inner surface of the heat dissipation structure (200) is sufficiently spaced from the circuit portion (620), so that the second heat dissipation fin (230) can contact the potting material (P) to allow heat transfer.

[0145] Meanwhile, when the bracket body (310) of the support bracket (300) is attached to an external structure in order to install the micro inverter (10), the closer the installation surface is to the heat dissipation structure (200), the more the installation surface may be affected by temperature changes in the installation surface. When the temperature of the installation surface increases, the temperature of the outer surface of the heat dissipation structure (200) of the micro inverter (10) increases, and thus the performance of dissipating heat generated in the internal space (S1) to the outside may deteriorate.

[0146] According to one embodiment, the mount portion (1213) may be provided with an internal height such that the heat dissipation structure (200) and the installation surface do not directly contact each other. Thus, the internal height of the mount portion (1213) may be provided lower than the internal height of the outermost surface (1210). The outer surface of the heat dissipation structure (200) may be sufficiently spaced from the installation surface, so that the first heat dissipation fin (220) may be introduced into the first concave portion (1211) and the second concave portion (1212) and come into contact with the flowing air, thereby allowing heat transfer to occur.

[0147] FIG. 10 is a drawing showing another embodiment of the heat dissipation structure shown in FIG. 9.

[0148] Comparing FIGS. 9 and 10, the heat dissipation structure (200) may be provided with a different shape of the fastening protrusion (240-1). Since the first heat dissipation fin (220) and the second heat dissipation fin (230) are the same as those described above, the description will focus on the fastening protrusion (240-1).

[0149] The heat dissipation structure (200) may be provided with a ring-shaped fastening protrusion (240-1) protruding from the circumference of the base plate (210), and at this time, the mount portion (1213) may have a fastening groove (12131) formed on the surface facing the fastening protrusion (240-1). The fastening protrusion (240-1) may be physically fitted into the fastening groove (12131) or may be chemically bonded, and thus the heat dissipation structure (200) may be stably mounted on the mount portion (1213).

[0150] Fig. 11 is a cross-sectional view taken along the line BB' of Fig. 2, and Fig. 12 is a drawing showing an enlarged portion D of Fig. 11.

[0151] Referring to FIGS. 7, 9, 11 and 12, the heat dissipation structure (200) may have a surface area exposed to the outside that is larger than the surface area in contact with the potting material (P).

[0152] The heat dissipation structure (200) can facilitate heat transfer on the outer surface exposed to the outside compared to the inner surface in contact with the potting material (P). The temperature of the outer surface of the heat dissipation structure (200) can be cooled relatively faster than the temperature of the inner surface. Therefore, heat generated in the internal space (S1) can be effectively released to the outside through the heat dissipation structure (200).

[0153] According to one embodiment, the first heat dissipation fin (220) may be formed to protrude from one surface of the base plate (210) to a first height (D1). At least one second heat dissipation fin (220) may be provided. The second heat dissipation fin (230) may be formed to protrude from the other surface of the base plate (210) to a second height (D2). At least one second heat dissipation fin (230) may be provided.

[0154] For example, the first height (D1) of the first heat dissipation fin (220) may be provided to be greater than the second height (D2) of the second heat dissipation fin (230). Accordingly, the surface area of ​​the surface on which the first heat dissipation fin (220) is formed may be provided to be greater than the surface area of ​​the surface on which the second heat dissipation fin (230) is formed.

[0155] As another example, the number of first heat dissipation fins (220) may be greater than the number of second heat dissipation fins (230). Accordingly, the surface area of ​​the surface on which the first heat dissipation fins (220) are formed may be greater than the surface area of ​​the surface on which the second heat dissipation fins (230) are formed.

[0156] According to another embodiment, the first heat dissipation fin (220) and the second heat dissipation fin (230) may include different materials and thus have different thermal conductivities. The thermal conductivity of the first heat dissipation fin (220) may be higher than that of the second heat dissipation fin (230). As a result, the heat dissipation structure (200) may facilitate heat transfer on its outer surface, which is exposed to the outside, compared to its inner surface, which is in contact with the potting material (P). The temperature of the outer surface of the heat dissipation structure (200) may be cooled relatively faster than the temperature of the inner surface. Therefore, heat generated in the internal space (S1) may be effectively released to the outside through the heat dissipation structure (200).

[0157] The first heat dissipation fin (220) of the heat dissipation structure (200) can form a large contact area with air, thereby increasing heat exchange efficiency. The second heat dissipation fin (230) of the heat dissipation structure (200) can maintain an effective contact area with the potting material (P) stored in the internal space of the case (100), while at the same time not hindering the fluidity of the potting material (P).

[0158] Fig. 13 is a cross-sectional view of a micro inverter (10) installed in an external structure (W) viewed from the side.

[0159] Referring to FIG. 6, FIG. 11 to FIG. 13, the micro inverter (10) can be installed in an external structure (W).

[0160] As described above, the micro inverter (10) may form an exterior in the direction in which the first case (110) is exposed to the outside, and the second case (120) may form an exterior in the direction facing the installed external structure (W). The micro inverter (10) may be installed by fixing a support bracket (300) to the external structure (W).

[0161] The outermost surface (1210) of the second case (120) can be placed adjacent to the external structure (W) on which the case (100) is installed.

[0162] The first concave portion (1211) and the second concave portion (1212) are spaced apart from the installation surface of the external structure (W), so that external air introduced through the first gate groove (G1), the second gate groove (G2), and the third gate groove (G3) of FIG. 6 can flow between them.

[0163] The heat dissipation structure (200) can release heat received from the circuit board (600) side to the external air, and the micro inverter (10) can be effectively cooled.

[0164] According to one embodiment, a predetermined gap may be set between the heat dissipation structure (200) and the installation surface. The heat dissipation structure (200) may be installed on the mount portion (1213) and may be further spaced apart from the installation surface. The first heat dissipation fin (220) of the heat dissipation structure (200) may be spaced apart by a third height (D3) based on the outermost surface (1210). Accordingly, a gap of at least the third height (D3) may be set between the heat dissipation structure (200) and the installation surface.

[0165] While the present invention has been described with reference to one embodiment illustrated in the accompanying drawings, this is merely exemplary, and those skilled in the art will appreciate that various modifications and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention should be determined solely by the appended claims.

Claims

1. A case in which a circuit board is placed in the internal space; A potting material stored in the internal space of the case and covering the circuit board; and A micro inverter comprising a heat dissipation structure disposed to penetrate the case, one side of which is exposed to the outside of the case, and the other side of which is in contact with the potting material.

2. In paragraph 1, The above heat dissipation structure A first heat dissipation fin protruding from the above surface to a first height; and A micro inverter having a second heat dissipation fin protruding from the above surface to a second height.

3. In paragraph 2, The above heat dissipation structure A micro inverter having different first and second heights.

4. In paragraph 2, The above heat dissipation structure A micro inverter, wherein the number of the first heat dissipation fins and the number of the second heat dissipation fins are different.

5. In paragraph 1, The above heat dissipation structure A micro-inverter having a surface area exposed to the outside greater than a surface area in contact with the potting material.

6. In paragraph 1, A micro inverter further comprising a support bracket mounted on the case so as to face the heat dissipation structure and supporting the case to an external structure.

7. In paragraph 6, The above support bracket is A bracket body mounted on the installation surface of the above external structure; A micro inverter comprising a snap extending from the bracket body and connected to the case, but separating the case from the installation surface.

8. In paragraph 7, The above heat dissipation structure A micro inverter arranged so as to face the installation surface in the case, such that a predetermined gap is set between the heat dissipation structure and the installation surface.

9. In paragraph 1, The above potting material A micro inverter that transfers heat generated in the circuit board to the heat dissipation structure.

10. In paragraph 1, The above potting material A microinverter made of a fluid material, which flows along the surface of the circuit board and dissipates heat generated from the circuit board to the surroundings.

11. A case having a first case facing outward and a second case facing an external structure, wherein a circuit board is arranged in the internal space of the first case and the second case; A potting material stored in the internal space and covering the circuit board; and A heat dissipation structure is disposed to penetrate the second case, one side of which is exposed to the outside of the second case, and the other side of which is in contact with the potting material; A micro inverter in which the second case has a concave portion through which external air flows, and the heat dissipation structure is disposed on the concave portion.

12. In paragraph 11, The above concave part The case is sunk to a preset depth in the outermost surface of the second case adjacent to the installation surface of the external structure on which the case is installed, A micro inverter, wherein the heat dissipation structure has a predetermined gap from the installation surface.

13. In paragraph 11, The second case above A micro inverter having at least one gate groove connected to the recessed portion and through which external air flows into the recessed portion.

14. In paragraph 11, The second case above A micro inverter having a third gate groove facing the heat dissipation structure and through which the external air flows into the concave portion.

15. In paragraph 11, A micro inverter further comprising a support bracket mounted on the case so as to face the heat dissipation structure and supporting the case to an external structure.

16. In paragraph 11, The above heat dissipation structure A base plate mounted on the second case; A first heat dissipation fin protruding from one surface of the base plate to a first height; and A micro inverter having a second heat dissipation fin protruding from the other surface of the base plate to a second height.

17. In paragraph 16, The above heat dissipation structure A micro inverter having different first and second heights.

18. In paragraph 16, A micro inverter wherein the thickness of the base plate is smaller than the first height and larger than the second height.

19. In paragraph 11, The second case above A first injection port for injecting the above potting material; and A micro inverter having a second inlet spaced apart from the first inlet.

20. In paragraph 19, The second case above A first gate groove adjacent to the first injection port and connected to the concave portion; A second gate groove adjacent to the second injection port and connected to the concave portion; and A micro inverter further comprising a third gate home disposed on the opposite side of the first gate home or the second gate home and connected to the concave portion.

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