Wearable device including heat dissipation sheets

Abstract

A head-wearable device according to an embodiment comprises: a housing part including a sidewall; one or more electronic components arranged on a printed circuit board; a first heat dissipation sheet facing the printed circuit board, disposed on a first portion of the sidewall, and configured to dissipate heat caused by the one or more electronic components; a second heat dissipation sheet spaced apart from the first heat dissipation sheet and disposed on a second portion of the sidewall; a speaker spaced apart from the printed circuit board and disposed on the second portion and a third portion of the sidewall through an adhesive on the sidewall; and a third heat dissipation sheet thermally connecting the first heat dissipation sheet and the second heat dissipation sheet.

Description

Wearable devices including heat-dissipating sheets

[0001] The present disclosure relates to a wearable device including heat dissipating sheets.

[0002] Wearable devices can be worn on the user's body. For example, eyeglass-type devices can be used while attached to the user's face. Wearable devices can include electronic components to provide various functions. To dissipate heat generated by the electronic components, the wearable device can include a heat dissipation sheet.

[0003] The heat sink sheet can be formed from a material with desirable thermal properties, such as graphite. If the heat sink sheet is composed of a material that does not adhere well to the selected adhesive, it may be difficult to secure other components to the heat sink sheet.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] A head-wearable device is provided. The head-wearable device may include a side wall, and a housing part that comes into contact with a part of a user's body when the head-wearable device is worn by the user and supports the head-wearable device. The head-wearable device may include one or more electronic components disposed within the housing part. The head-wearable device may include a first heat dissipation sheet disposed on a first portion of the side wall, the first heat dissipation sheet configured to dissipate heat generated from the one or more electronic components. The head-wearable device may include a second heat dissipation sheet spaced apart from the first heat dissipation sheet and disposed on a second portion of the side wall. The head-wearable device may include a speaker disposed on the second portion of the side wall and a third portion of the side wall via an adhesive. The third portion of the side wall may be positioned between the first portion of the side wall and the second portion of the side wall. The head-wearable device may include a third heat-dissipating sheet thermally connecting the first heat-dissipating sheet and the second heat-dissipating sheet. The third heat-dissipating sheet may include a first portion disposed on the side wall of the housing part and in contact with the first heat-dissipating sheet, a second portion disposed on the side wall of the housing part and in contact with the second heat-dissipating sheet, and a third portion extending from the first portion of the third heat-dissipating sheet to the second portion of the third heat-dissipating sheet and disposed within the third portion of the side wall. A material forming the third heat-dissipating sheet may be different from a material forming the first heat-dissipating sheet or the second heat-dissipating sheet.

[0006] A head-wearable device is provided. The head-wearable device may include a display. The head-wearable device may include a housing assembly. The housing assembly may include a rim surrounding the display, and a temple rotatably connected to the rim, the temple having a side wall, and supported by a user's ear when the head-wearable device is worn on the user. The head-wearable device may include a printed circuit board disposed within the temple. The head-wearable device may include one or more electronic components disposed on the printed circuit board. The head-wearable device may include a first heat dissipation sheet facing the printed circuit board, disposed on a first portion of the side wall, and configured to dissipate heat generated from the one or more electronic components. The head-wearable device may include a second heat dissipation sheet spaced apart from the first heat dissipation sheet and disposed on a second portion of the side wall. The head-wearable device may include a speaker spaced apart from the printed circuit board, attached to the side wall via an adhesive on the side wall, and disposed over the second portion and the third portion of the side wall. A portion of the adhesive may be disposed on the third portion of the side wall to seal an edge of the speaker. The third portion of the side wall may be positioned between the first portion of the side wall and the second portion of the side wall. The head-wearable device may include a third heat dissipation sheet thermally connecting the first heat dissipation sheet and the second heat dissipation sheet.The third heat-radiating sheet may include a first portion disposed on the side wall of the temple and in contact with the first heat-radiating sheet, a second portion disposed on the side wall of the temple and in contact with the second heat-radiating sheet, and a third portion extending from the first portion of the third heat-radiating sheet to the second portion of the third heat-radiating sheet and disposed within the third portion of the side wall.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0008] FIG. 2 illustrates a perspective view of a wearable device according to one embodiment.

[0009] FIG. 3 illustrates one or more hardware elements arranged within a wearable device according to one embodiment.

[0010] FIG. 4 and FIG. 5 illustrate the appearance of a wearable device according to one embodiment.

[0011] FIG. 6 is a perspective view of a head-wearable device according to one embodiment.

[0012] Figure 7 is an exploded view of a head-wearable device according to one embodiment.

[0013] Figure 8 is a part of a perspective view of the first temple with the first cover plate omitted.

[0014] Fig. 9 is a perspective view including a cross-section of the first temple of Fig. 8 taken along line AA'.

[0015] Figure 10 is a part of a perspective view of the first temple with the first side wall omitted.

[0016] Figure 11 illustrates a first temple omitting the printed circuit board, the first speaker, and the first cover plate.

[0017] Figure 12 illustrates a first temple with heat dissipation sheets and a first adhesive arranged thereon.

[0018] Figure 13 illustrates a first temple with the first cover plate omitted.

[0019] Fig. 14 is a cross-sectional view of the first temple of Fig. 13 taken along the BB' line.

[0020] FIG. 15 illustrates the interior of a first temple according to one embodiment in which the printed circuit board and the first speaker are omitted.

[0021] Figures 16a and 16b are cross-sectional views of a first temple according to one embodiment.

[0022] Fig. 17 is a perspective view of a third heat dissipation sheet according to one embodiment.

[0023] Figure 18 illustrates a first temple including a recess.

[0024] Figure 19 illustrates a third heat dissipation sheet including a protrusion.

[0025] Figure 20 illustrates a first temple on which a third heat dissipation sheet including a protrusion is arranged.

[0026] Figures 21 and 22 illustrate the second temple.

[0027] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0028] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0029] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0030] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0031] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0036] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0037] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0041] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0043] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0046] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0047] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0048] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] An electronic device (101) according to one embodiment may include a wearable device. For example, the electronic device (101) may include a head-mounted display (HMD) that is wearable on a user's head. The electronic device (101) may be referred to as a head-mounted display (HMD) device, a headgear electronic device, a glasses-type (or goggle-type) electronic device, a video see-through (VST) or visible see-through device, an extended reality (XR) device, a virtual reality (VR) device, and / or an augmented reality (AR) device. For example, the electronic device (101) may include an accessory (e.g., a strap) for attaching to a user's head. An example of a hardware configuration included in the electronic device (101) is described below. In the wearable devices illustrated in FIGS. 2 and 3 (e.g., the wearable device (200) of FIG. 2), the external appearance of the wearable device having the form of glasses is illustrated, but the embodiment is not limited thereto. An example of the structure of a wearable device that can be worn on a user's head (e.g., the wearable device (400) of FIG. 4) is described below with reference to FIGS. 4 and 5.

[0051] FIG. 2 illustrates an example of a perspective view of a wearable device according to one embodiment. FIG. 3 illustrates one or more hardware elements arranged within a wearable device according to one embodiment.

[0052] According to one embodiment, a wearable device (200) may have the form of glasses that can be worn on a body part of a user (e.g., a head). The wearable device (200) may include a head-mounted display (HMD). For example, the housing of the wearable device (200) may include a flexible material, such as rubber and / or silicone, that is configured to fit closely to a portion of the user's head (e.g., a portion of the face surrounding both eyes). For example, the housing of the wearable device (200) may include one or more straps that can be twined around the user's head, and / or one or more temples that can be detachably attached to the ears of the head. The housing of the wearable device (200) may include one or more temples, each temple being an arm, protrusion, or other member extending from the wearable device (200) and arranged to be positioned near the user when the wearable device is worn.

[0053] Referring to FIG. 2, a wearable device (200) according to one embodiment may include at least one display (250) and a frame supporting at least one display (250).

[0054] According to one embodiment, a wearable device (200) can be worn on a part of a user's body. The wearable device (200) can provide augmented reality (AR), virtual reality (VR), or mixed reality (MR) that combines augmented reality and virtual reality to a user wearing the wearable device (200). For example, the wearable device (200) can display a virtual reality image provided from at least one optical device (282, 284) of FIG. 3 on at least one display (250) in response to a user's designated gesture acquired through the motion recognition cameras (260-2, 260-3) of FIG. 3.

[0055] According to one embodiment, at least one display (250) may provide visual information to a user. For example, at least one display (250) may include a transparent or translucent lens. At least one display (250) may include a first display (250-1) and / or a second display (250-2) spaced apart from the first display (250-1). For example, the first display (250-1) and the second display (250-2) may be positioned at positions corresponding to the user's left and right eyes, respectively.

[0056] Referring to FIG. 3, at least one display (250) can provide visual information transmitted from external light to a user through a lens included in at least one display (250), and other visual information distinct from the visual information. The lens can be formed based on at least one of a Fresnel lens, a pancake lens, or a multi-channel lens. For example, at least one display (250) can include a first surface (231) and a second surface (232) opposite to the first surface (231). A display area can be formed on the second surface (232) of at least one display (250). When a user wears the wearable device (200), external light can be transmitted to the user by being incident on the first surface (231) and transmitted through the second surface (232). For another example, at least one display (250) can display an augmented reality image combined with a virtual reality image provided from at least one optical device (282, 284) on a real screen transmitted through external light, in a display area formed on the second surface (232).

[0057] In one embodiment, at least one display (250) may include at least one waveguide (233, 234) that diffracts light emitted from at least one optical device (282, 284) and transmits the diffracted light to a user. The at least one waveguide (233, 234) may be formed based on at least one of glass, plastic, or polymer. A nano-pattern may be formed on at least a portion of the exterior or interior of the at least one waveguide (233, 234). The nano-pattern may be formed based on a grating structure having a polygonal and / or curved shape. Light incident on one end of the at least one waveguide (233, 234) may be propagated to the other end of the at least one waveguide (233, 234) by the nano-pattern. At least one waveguide (233, 234) may include at least one diffractive element (e.g., a diffractive optical element (DOE), a holographic optical element (HOE)) and at least one reflective element (e.g., a reflective mirror). For example, at least one waveguide (233, 234) may be arranged within the wearable device (200) to guide a screen displayed by at least one display (250) to the user's eyes. For example, the screen may be transmitted to the user's eyes based on total internal reflection (TIR) ​​occurring within the at least one waveguide (233, 234).

[0058] The wearable device (200) can analyze an object included in a real image collected through a shooting camera (260-4), combine a virtual object corresponding to an object to be provided with augmented reality among the analyzed objects, and display the virtual object on at least one display (250). The virtual object can include at least one of text and an image regarding various information related to the object included in the real image. The wearable device (200) can analyze the object based on a multi-camera such as a stereo camera. For the object analysis, the wearable device (200) can perform spatial recognition (e.g., simultaneous localization and mapping (SLAM)) using a multi-camera and / or time-of-flight (ToF). A user wearing the wearable device (200) can view an image displayed on at least one display (250).

[0059] According to one embodiment, the frame may be formed as a physical structure that allows the wearable device (200) to be worn on the user's body. According to one embodiment, the frame may be configured so that, when the user wears the wearable device (200), the first display (250-1) and the second display (250-2) can be positioned corresponding to the user's left and right eyes. The frame may support at least one display (250). For example, the frame may support the first display (250-1) and the second display (250-2) to be positioned corresponding to the user's left and right eyes.

[0060] Referring to FIG. 2, the frame may include a region (220) that at least partially contacts a part of the user's body when the user wears the wearable device (200). For example, the region (220) of the frame that contacts a part of the user's body may include a region that contacts a part of the user's nose, a part of the user's ear, and a part of the side of the user's face that the wearable device (200) makes contact with. According to one embodiment, the frame may include a nose pad (210) that contacts a part of the user's body. When the wearable device (200) is worn by the user, the nose pad (210) may contact a part of the user's nose. The frame may include a first temple (204) and a second temple (205) that contact a part of the user's body that is distinct from the part of the user's body.

[0061] For example, the frame may include a first rim (201) that surrounds at least a portion of the first display (250-1), a second rim (202) that surrounds at least a portion of the second display (250-2), a bridge (203) that is disposed between the first rim (201) and the second rim (202), a first pad (211) that is disposed along a portion of the edge of the first rim (201) from one end of the bridge (203), a second pad (212) that is disposed along a portion of the edge of the second rim (202) from the other end of the bridge (203), a first temple (204) that extends from the first rim (201) and is fixed to a portion of an ear of the wearer, and a second temple (205) that extends from the second rim (202) and is fixed to a portion of an ear opposite the ear. The first pad (211) and the second pad (212) may be in contact with a portion of the user's nose, and the first temple (204) and the second temple (205) may be in contact with a portion of the user's face and a portion of the user's ear. The temples (204, 205) may be rotatably connected to the rim through the hinge units (206, 207) of FIG. 3. The first temple (204) may be rotatably connected to the first rim (201) through the first hinge unit (206) disposed between the first rim (201) and the first temple (204). The second temple (205) may be rotatably connected to the second rim (202) through the second hinge unit (207) disposed between the second rim (202) and the second temple (205). According to one embodiment, the wearable device (200) can identify an external object (e.g., a user's fingertip) touching the frame and / or a gesture performed by the external object by using a touch sensor, a grip sensor, and / or a proximity sensor formed on at least a portion of a surface of the frame.

[0062] According to one embodiment, the wearable device (200) may include hardwares (e.g., hardwares described above based on the block diagram of FIG. 2) that perform various functions. For example, the hardwares may include a battery module (270), an antenna module (275), at least one optical device (282, 284), speakers (e.g., speakers 255-1, 255-2), microphones (e.g., microphones 265-1, 265-2, 265-3), a light-emitting module, and / or a printed circuit board (PCB) (290) (e.g., a printed circuit board). The various hardware components may be arranged within a frame.

[0063] According to one embodiment, the microphones (e.g., microphones 265-1, 265-2, 265-3) of the wearable device (200) may be arranged on at least a portion of the frame to acquire sound signals. A first microphone (265-1) arranged on the bridge (203), a second microphone (265-2) arranged on the second rim (202), and a third microphone (265-3) arranged on the first rim (201) are illustrated in FIG. 3 , but the number and arrangement of the microphones (265) are not limited to the embodiment of FIG. 3 . When the number of microphones (265) included in the wearable device (200) is two or more, the wearable device (200) may identify the direction of the sound signal by using a plurality of microphones arranged on different portions of the frame.

[0064] According to one embodiment, at least one optical device (282, 284) can project a virtual object onto at least one display (250) to provide various image information to a user. For example, at least one optical device (282, 284) can be a projector. At least one optical device (282, 284) can be disposed adjacent to at least one display (250) or can be included within at least one display (250) as a part of at least one display (250). According to one embodiment, the wearable device (200) can include a first optical device (282) corresponding to a first display (250-1) and a second optical device (284) corresponding to a second display (250-2). For example, at least one optical device (282, 284) may include a first optical device (282) disposed at an edge of a first display (250-1) and a second optical device (284) disposed at an edge of a second display (250-2). The first optical device (282) may transmit light to a first waveguide (233) disposed on the first display (250-1), and the second optical device (284) may transmit light to a second waveguide (234) disposed on the second display (250-2).

[0065] In one embodiment, the camera (260) may include a recording camera (260-4), an eye tracking camera (ET CAM) (260-1), and / or motion recognition cameras (260-2, 260-3). The recording camera (260-4), the eye tracking camera (260-1), and the motion recognition cameras (260-2, 260-3) may be positioned at different locations on the frame and may perform different functions. The eye tracking camera (260-1) may output data indicating the position or gaze of the eyes of a user wearing the wearable device (200). For example, the wearable device (200) may detect the gaze from an image including the user's pupils obtained through the eye tracking camera (260-1).

[0066] The wearable device (200) can identify an object (e.g., a real object and / or a virtual object) focused on by the user using the user's gaze acquired through the gaze tracking camera (260-1). The wearable device (200) that has identified the focused object can execute a function (e.g., gaze interaction) for interaction between the user and the focused object. The wearable device (200) can express a part corresponding to the eye of an avatar representing the user in a virtual space using the user's gaze acquired through the gaze tracking camera (260-1). The wearable device (200) can render an image (or screen) displayed on at least one display (250) based on the position of the user's eyes.

[0067] For example, the visual quality of a first region related to the gaze within an image and the visual quality (e.g., resolution, brightness, saturation, grayscale, PPI (pixels per inch)) of a second region distinct from the first region may be different from each other. The wearable device (200) may obtain an image having the visual quality of the first region and the visual quality of the second region that match the user's gaze using foveated rendering. For example, when the wearable device (200) supports an iris recognition function, user authentication may be performed based on iris information obtained using the gaze tracking camera (260-1). Although an example in which the gaze tracking camera (260-1) is positioned toward the user's right eye is illustrated in FIG. 3, the embodiment is not limited thereto, and the gaze tracking camera (260-1) may be positioned solely toward the user's left eye, or toward both eyes.

[0068] In one embodiment, the capturing camera (260-4) can capture an actual image or background to be aligned with a virtual image to implement augmented reality or mixed reality content. The capturing camera (260-4) can be used to acquire a high-resolution image based on HR (high resolution) or PV (photo video). The capturing camera (260-4) can capture an image of a specific object existing at a location viewed by the user and provide the image to at least one display (250). The at least one display (250) can display a single image in which information about an actual image or background including the image of the specific object acquired using the capturing camera (260-4) is superimposed on a virtual image provided through at least one optical device (282, 284). The wearable device (200) can compensate for depth information (e.g., the distance between the wearable device (200) and an external object acquired through a depth sensor) using the image acquired through the capturing camera (260-4). The wearable device (200) can perform object recognition through an image acquired using a photographing camera (260-4). The wearable device (200) can perform a function of focusing on an object (or subject) in an image (e.g., auto focus) and / or an optical image stabilization (OIS) function (e.g., anti-shake function) using the photographing camera (260-4). The wearable device (200) can perform a pass-through function to display an image acquired through the photographing camera (260-4) by overlapping at least a portion of a screen representing a virtual space on at least one display (250). In one embodiment, the photographing camera (260-4) can be disposed on a bridge (203) disposed between a first rim (201) and a second rim (202).

[0069] The gaze tracking camera (260-1) can implement more realistic augmented reality by tracking the gaze of a user wearing the wearable device (200) and matching the user's gaze with visual information provided to at least one display (250). For example, when the wearable device (200) looks straight ahead, the wearable device (200) can naturally display environmental information related to the user's front at a location where the user is located on at least one display (250). The gaze tracking camera (260-1) can be configured to capture an image of the user's pupil to determine the user's gaze. For example, the gaze tracking camera (260-1) can receive gaze detection light reflected from the user's pupil and track the user's gaze based on the position and movement of the received gaze detection light. In one embodiment, the gaze tracking camera (260-1) can be positioned at positions corresponding to the user's left and right eyes. For example, the gaze tracking camera (260-1) may be positioned within the first rim (201) and / or the second rim (202) to face the direction in which the user wearing the wearable device (200) is positioned.

[0070] The motion recognition camera (260-2, 260-3) can recognize the movement of the user's entire body, such as the user's torso, hand, or face, or a part of the body, and thereby provide a specific event on a screen provided on at least one display (250). The motion recognition camera (260-2, 260-3) can recognize the user's motion (gesture recognition), obtain a signal corresponding to the motion, and provide a display corresponding to the signal on at least one display (250). The processor can identify the signal corresponding to the motion, and perform a designated function based on the identification. The motion recognition camera (260-2, 260-3) can be used to perform a spatial recognition function using SLAM and / or a depth map for 6 degrees of freedom pose (6 dof pose). The processor can perform a gesture recognition function and / or an object tracking function using the motion recognition camera (260-2, 260-3). In one embodiment, the motion recognition cameras (260-2, 260-3) may be positioned on the first rim (201) and / or the second rim (202).

[0071] The camera (260) included in the wearable device (200) is not limited to the above-described gaze tracking camera (260-1) and motion recognition cameras (260-2, 260-3). For example, the wearable device (200) can identify an external object included in the FoV using a camera positioned toward the user's FoV. The wearable device (200) can identify an external object based on a sensor for identifying the distance between the wearable device (200) and the external object, such as a depth sensor and / or a time of flight (ToF) sensor. The camera (260) positioned toward the FoV can support an autofocus function and / or an optical image stabilization (OIS) function. For example, the wearable device (200) may include a camera (260) (e.g., a face tracking (FT) camera) positioned toward the face to obtain an image including the face of a user wearing the wearable device (200).

[0072] Although not shown, in one embodiment, the wearable device (200) may further include a light source (e.g., an LED) that emits light toward a subject (e.g., a user's eyes, face, and / or an external object within the FoV) being photographed using the camera (260). The light source may include an LED having an infrared wavelength. The light source may be disposed on at least one of the frame and hinge units (206, 207).

[0073] According to one embodiment, the battery module (270) may supply power to electronic components of the wearable device (200). In one embodiment, the battery module (270) may be disposed within the first temple (204) and / or the second temple (205). For example, the battery module (270) may be a plurality of battery modules (270). The plurality of battery modules (270) may be disposed within each of the first temple (204) and the second temple (205). In one embodiment, the battery module (270) may be disposed at an end of the first temple (204) and / or the second temple (205).

[0074] The antenna module (275) can transmit signals or power to the outside of the wearable device (200), or receive signals or power from the outside. In one embodiment, the antenna module (275) can be positioned within the first temple (204) and / or the second temple (205). For example, the antenna module (275) can be positioned close to one surface of the first temple (204) and / or the second temple (205).

[0075] The speaker (255) can output an audio signal to the outside of the wearable device (200). The audio output module may be referred to as a speaker. In one embodiment, the speaker (255) may be positioned within the first temple (204) and / or the second temple (205) so as to be positioned adjacent to the ear of a user wearing the wearable device (200). For example, the speaker (255) may include a second speaker (255-2) positioned within the first temple (204) and thus adjacent to the user's left ear, and a first speaker (255-1) positioned within the second temple (205) and thus adjacent to the user's right ear.

[0076] The light-emitting module (not shown) may include at least one light-emitting element. The light-emitting module may emit light of a color corresponding to a specific state or emit light with an action corresponding to a specific state in order to visually provide information regarding a specific state of the wearable device (200) to the user. For example, when the wearable device (200) requires charging, it may emit red light at a regular cycle. In one embodiment, the light-emitting module may be disposed on the first rim (201) and / or the second rim (202).

[0077] Referring to FIG. 3, according to one embodiment, a wearable device (200) may include a printed circuit board (PCB) (290). The PCB (290) may be included in at least one of the first temple (204) and the second temple (205). The PCB (290) may include an interposer disposed between at least two sub-PCBs. One or more hardwares included in the wearable device (200) (e.g., hardwares illustrated by different blocks in FIG. 2) may be disposed on the PCB (290). The wearable device (200) may include a flexible PCB (FPCB) for interconnecting the hardwares.

[0078] According to one embodiment, a wearable device (200) may include at least one of a gyro sensor, a gravity sensor, and / or an acceleration sensor for detecting a posture of the wearable device (200) and / or a posture of a body part (e.g., a head) of a user wearing the wearable device (200). Each of the gravity sensor and the acceleration sensor may measure gravitational acceleration and / or acceleration based on mutually perpendicular designated three-dimensional axes (e.g., an x-axis, a y-axis, and a z-axis). The gyro sensor may measure an angular velocity of each of the designated three-dimensional axes (e.g., an x-axis, a y-axis, and a z-axis). At least one of the gravity sensor, the acceleration sensor, and the gyro sensor may be referred to as an inertial measurement unit (IMU). According to one embodiment, the wearable device (200) may identify a user's motion and / or gesture performed to execute or terminate a specific function of the wearable device (200) based on the IMU.

[0079] FIG. 4 and FIG. 5 illustrate the appearance of a wearable device according to one embodiment.

[0080] The wearable device (400) of FIGS. 4 and 5 may include at least a portion of the hardware of the wearable device (200) described with reference to FIGS. 2 and / or 3. According to one embodiment, an example of the appearance of a first side (410) of a housing of the wearable device (400) is illustrated in FIG. 4, and an example of the appearance of a second side (420) opposite to the first side (410) may be illustrated in FIG. 5.

[0081] Referring to FIG. 4, according to one embodiment, a first surface (410) of a wearable device (400) may have a form attachable to a body part of a user (e.g., the face of the user). Although not shown, the wearable device (400) may further include a strap for fixing to a body part of a user, and / or one or more temples (e.g., the first temple (204) and / or the second temple (205) of FIGS. 2 and 3). A first display (250-1) for outputting an image to a left eye among the user's two eyes, and a second display (250-2) for outputting an image to a right eye among the user's two eyes may be disposed on the first surface (410). The wearable device (400) is formed on the first surface (410) and may further include a rubber or silicone packing to prevent interference by light (e.g., ambient light) different from the light emitted from the first display (250-1) and the second display (250-2).

[0082] According to one embodiment, the wearable device (400) may include cameras (260-1) for photographing and / or tracking both eyes of the user adjacent to each of the first display (250-1) and the second display (250-2). The cameras (260-1) may be referred to as the eye tracking camera (260-1) of FIG. 3. According to one embodiment, the wearable device (400) may include cameras (260-5, 260-6) for photographing and / or recognizing the face of the user. The cameras (260-5, 260-6) may be referred to as FT cameras. The wearable device (400) may control an avatar representing the user in a virtual space based on the motion of the user's face identified using the cameras (260-5, 260-6). For example, the wearable device (400) may change the texture and / or shape of a portion of an avatar (e.g., a portion of an avatar representing a human face) using information obtained by cameras (260-5, 260-6) (e.g., FT cameras) and representing the facial expression of a user wearing the wearable device (400).

[0083] Referring to FIG. 5, a camera (e.g., cameras 260-7, 260-8, 260-9, 260-10, 260-11, 260-12)) and / or a sensor (e.g., a depth sensor (330)) for obtaining information related to the external environment of the wearable device (400) may be disposed on a second surface (420) opposite to the first surface (410) of FIG. 4. For example, the cameras (260-7, 260-8, 260-9, 260-10) may be disposed on the second surface (420) for recognizing external objects. The cameras (260-7, 260-8, 260-9, 260-10) of FIG. 5 can correspond to the motion recognition cameras (260-2, 260-3) of FIG. 3.

[0084] For example, using cameras (260-11, 260-12), the wearable device (400) can obtain images and / or videos to be transmitted to each of the user's eyes. The camera (260-11) can be placed on the second face (420) of the wearable device (400) to obtain an image to be displayed through the second display (250-2) corresponding to the right eye among the two eyes. The camera (260-12) can be placed on the second face (420) of the wearable device (400) to obtain an image to be displayed through the first display (250-1) corresponding to the left eye among the two eyes. The cameras (260-11, 260-12) can correspond to the shooting camera (260-4) of FIG. 3.

[0085] According to one embodiment, the wearable device (400) may include a depth sensor (330) disposed on the second face (420) to identify a distance between the wearable device (400) and an external object. Using the depth sensor (330), the wearable device (400) may obtain spatial information (e.g., a depth map) for at least a portion of the FoV of a user wearing the wearable device (400). Although not illustrated, a microphone may be disposed on the second face (420) of the wearable device (400) to obtain a sound output from an external object. The number of microphones may be one or more, depending on the embodiment.

[0086] Fig. 6 is a perspective view of a head-wearable device according to one embodiment. Fig. 7 is an exploded view of a head-wearable device according to one embodiment.

[0087] According to one embodiment, the wearable device may be referred to as a head-wearable device (600) that can be worn on a user's head or face. Referring to FIG. 6, the head-wearable device (600) according to one embodiment may include a housing assembly (601) and a display (608). The housing assembly (601) may define the exterior of the head-wearable device (600) and may accommodate electronic components for providing various functions of the head-wearable device (600).

[0088] A head-worn device (600) according to one embodiment may perform functions related to augmented reality (AR) and / or mixed reality (MR). For example, the head-worn device (600) may include at least one lens positioned adjacent to a user's eyes while the device is worn by the user. The head-worn device (600) may combine light passing through the lens with light emitted from a display (608). A display area of ​​the display (608) may be formed within the lens through which the light passes. Because the head-worn device (600) combines the light and the light emitted from the display (608), the user may see an image that is a mixture of a real object recognized by the light passing through the lens and a virtual object formed by the light emitted from the display (608). The augmented reality, mixed reality, and / or virtual reality described above may be referred to as extended reality (XR). According to one embodiment, the head-worn device (600) may perform functions related to video see-through (VST) and / or virtual reality (VR).

[0089] In one embodiment, the display (608) can output visual information to a user of the head-worn device (600). When the user wears the head-worn device (600), the display (608) can be arranged in front of the user's eyes. For example, the display (608) can be controlled by a processor including circuitry such as a graphic processing unit (GPU) to output visualized information to the user. The display (608) can include a flexible display, a flat panel display (FPD), and / or electronic paper. The display (608) can include a liquid crystal display (LCD), a plasma display panel (PDP), and / or one or more light emitting diodes (LEDs). The LEDs can include organic LEDs (OLEDs). However, embodiments of the present disclosure are not limited thereto, and for example, if the head-wearable device (600) includes a lens for transmitting external light (or ambient light), the display (608) may include a projector (or projection assembly) for projecting light onto the lens. When a user wears the head-wearable device (600), the pixels included in the display (608) may be arranged to face either of the user's two eyes. For example, the display (608) may include display areas (or active areas) corresponding to each of the user's two eyes. For example, the display (608) may include a first display (608a) corresponding to the user's right eye and a second display (608b) corresponding to the user's left eye. The second display (608b) may be spaced apart from the first display (608a).

[0090] According to one embodiment, the housing assembly (601) can include a rim (605) that at least partially encloses the display (608). For example, the housing assembly (601) can include a first rim (606) that at least partially encloses the first display (608a) and a second rim (607) that at least partially encloses the second display (608b).

[0091] According to one embodiment, the housing assembly (601) may include a housing part that comes into contact with a part of the user's body and supports the head-wearable device (600) when the head-wearable device (600) is worn by the user. For example, the housing assembly (601) may include a temple (602) that extends from a rim (605) in a glasses-type device and is supported by the user's ear. The temple (602) may include a first temple (603) that is rotatably connected to a first rim (606) and a second temple (604) that is rotatably connected to a second rim (607). The first temple (603) may extend from the first rim (606) and be supported by the user's right ear. The second temple (604) may extend from the second rim (607) and be supported by the user's left ear. The first temple (603) and the second temple (604) can each be in contact with the user's ear and support the head-wearable device (600).

[0092] According to one embodiment, the head-wearable device (600) may have electronic components for various functions of the head-wearable device (600) disposed within the first temple (603) and the second temple (604). For example, speakers configured to provide audio signals (e.g., the first speaker (631) and the second speaker (632) of FIG. 7) may be accommodated in each of the first temple (603) and the second temple (604). For example, the first speaker (631) may be disposed within the first temple (603), and the second speaker (632) may be disposed within the second temple (604). The first temple (603) and the second temple (604) may include speaker holes for providing a path for audio signals provided from each of the speakers to be radiated to the outside of the housing part (e.g., the temple (602)), and port holes for improving the quality of the audio signals.

[0093] Referring to FIG. 7, a printed circuit board (621) and a first speaker (631) may be placed within a first temple (603). The first temple (603) may include a first side wall (611), a first frame (612), and a first cover plate (613). The first frame (612) may surround an edge of the first side wall (611). The first cover plate (613) may be coupled to the first frame (612) to define an internal space of the first temple (603) together with the first frame (612). The internal space of the first temple (603) may be referred to as a space surrounded by the first side wall (611), the first frame (612), and the first cover plate (613). The first speaker (631) and the printed circuit board (621) may be placed in the internal space of the first temple (603).

[0094] According to one embodiment, the printed circuit board (621) may include a plurality of conductive layers and a plurality of non-conductive layers alternatively stacked with the plurality of conductive layers. The printed circuit board (621) may provide electrical connections between various electronic components using wires and conductive vias formed on the plurality of conductive layers. According to one embodiment, one or more electronic components (622) may be disposed on the printed circuit board (621). For example, a processor for controlling the overall operation of the head-wearable device (600) (e.g., the processor (120) of FIG. 1) and / or a wireless communication circuit for wireless communication with an external electronic device (e.g., the wireless communication module (192) of FIG. 1) may be disposed on the printed circuit board (621). In addition, various electronic components may be disposed on the printed circuit board (621).

[0095] In one embodiment, the first speaker (631) may be disposed on the first side wall (611) of the first temple (603). For example, the first speaker (631) may be attached to the first side wall (611) via a first adhesive (860) interposed between the first speaker (631) and the first side wall (611). The first adhesive (860) may be disposed along an edge of the first speaker (631). In one embodiment, the first speaker (631) may be spaced apart from the printed circuit board (621).

[0096] In one embodiment, the second speaker (632) may be disposed on the second side wall (661) of the second temple (604). For example, the second speaker (632) may be attached to the second side wall (661) via a second adhesive (870) interposed between the second speaker (632) and the second side wall (661). The second adhesive (870) may be disposed along an edge of the second speaker (632). In one embodiment, the second speaker (632) may be spaced apart from the battery (651).

[0097] One or more electronic components (622) and the first speaker (631) may be configured to operate based on power provided from the battery (651). When the one or more electronic components (622) and the first speaker (631) operate, heat may be generated due to resistance included in the one or more electronic components (622) and the first speaker (631). If the heat from the one or more electronic components (622) and the first speaker (631) remains in a localized area, the temperature of the internal space of the first temple (603) may increase. The increase in temperature may cause damage or malfunction of the one or more electronic components (622) and the first speaker (631). For example, heat may be emitted from the processor while the processor is controlling the operation of the head-worn device (600). The above heat may cause a temperature rise in the processor or electronic components placed around the processor, which may result in damage or malfunction of the head-wearable device (600).

[0098] A head-wearable device (600) according to one embodiment may include heat dissipation sheets for dissipating heat generated from one or more electronic components (622) and a speaker. The head-wearable device (600) may include a first heat dissipation sheet (641), a second heat dissipation sheet (642), and a third heat dissipation sheet (643) disposed within a first temple (603). In the present disclosure, the first, second, and third heat dissipation sheets are described, but are not limited thereto, and may have other shapes other than sheets. The first heat dissipation sheet may be a first heat dissipation member. The second heat dissipation sheet may be a second heat dissipation member. The third heat dissipation sheet may be a third heat dissipation member. The first heat dissipation sheet (641) may be placed on a portion of the first side wall (611) (e.g., the first portion (611a) of FIG. 11) so as to face the printed circuit board (621). The second heat dissipation sheet (642) may be placed on another portion of the first side wall (611) on which the speaker is placed (e.g., the second portion (611b) of FIG. 11). The first speaker (631) may be placed over the second portion (611b) of the first side wall (611). It should be understood that the structure in which the first speaker (631) is placed “over” the second portion (611b) of the first side wall (611) does not indicate an absolute positional relationship between the first speaker (631) and the second portion (611b), but rather indicates a relative positional relationship between the first speaker (631) and the second portion (611b). For example, the first speaker (631) being placed on the second part (611b) can be referenced as being positioned in the +x direction of the first side wall (611) in the drawing illustrated in FIG. 7.

[0099] In one embodiment, the battery (651) and the second speaker (632) may be disposed within the second temple (604). The descriptions regarding the structure of the first temple (603) may be substantially identically applied to the second temple (604). For example, the structure of the second temple (604) may be substantially identical to the structure of the first temple (603). The second temple (604) may include a second side wall (661), a second frame (662), and a second cover plate (663) defining an interior space of the second temple (604). The second frame (662) may surround an edge of the second side wall (661). The second cover plate (663) may be coupled to the second frame (662) to define the interior space of the second temple (604) together with the second frame (662). The internal space of the second temple (604) may be referred to as a space surrounded by the second side wall (661), the second frame (662), and the second cover plate (663). A second speaker (632) and a battery (651) may be placed in the internal space of the second temple (604).

[0100] According to one embodiment, a fourth heat dissipation sheet (671), a fifth heat dissipation sheet (672), and a sixth heat dissipation sheet (673) may be included to dissipate heat generated from the battery (651) and the second speaker (632). The fourth heat dissipation sheet (671) may correspond to the first heat dissipation sheet (641). The fifth heat dissipation sheet (672) may correspond to the second heat dissipation sheet (642). The sixth heat dissipation sheet (673) may correspond to the third heat dissipation sheet (643).

[0101] Fig. 8 is a partial perspective view of the first temple with the first cover plate omitted. Fig. 9 is a partial perspective view of the first temple of Fig. 8, including a cross-section taken along line AA'. Fig. 10 is a partial perspective view of the first temple with the first side wall omitted.

[0102] The descriptions regarding the first speaker (631) and the first temple (603) described below can be substantially equally applied to the second speaker (e.g., the second speaker (632) of FIG. 7) and the second temple (e.g., the second temple (604) of FIG. 7).

[0103] Referring to FIG. 8, the first temple (603) may include a second speaker hole (851) and a second port hole (852) for an audio signal provided from the first speaker (631). The second speaker hole (851) may be aligned with a first speaker hole (821) to be described later, thereby providing a path for the audio signal to be transmitted to the outside of the first temple (603). For example, the first speaker hole (821) may be connected to a front chamber (e.g., a front chamber (920) of FIG. 9) formed in front of the diaphragm (810) through the second speaker hole (851). The first enclosure (820) may include a first port hole (822). In order to improve the quality of the above audio signal, the first port hole (822) can be connected to a rear chamber (e.g., the rear chamber (910) of FIG. 9) formed at the rear of the diaphragm (810).

[0104] In one embodiment, the first speaker (631) may be attached to the first side wall (611) and the first cover plate (e.g., the first cover plate (613) of FIG. 7) via an adhesive. For example, the first cover plate (613) may be adjacent to a rear chamber (910) formed at the rear of the diaphragm (810), and the first side wall (611) may be close to a front chamber (920) formed at the front of the diaphragm (810). The first speaker (631) may be attached to the first side wall (611) via a first adhesive (860). For example, a first enclosure (820) enclosing components of the first speaker (631) may be attached to the first side wall (611) via the first adhesive (860).

[0105] Referring to FIG. 9, the first speaker (631) may include a diaphragm (810), a first enclosure (820), a permanent magnet (830), and a yoke (840).

[0106] In one embodiment, the diaphragm (810) may be configured to convert an electrical signal into an audio signal. The diaphragm (810) may be configured to generate an audio signal by vibrating based on the electrical signal. The permanent magnet (830) may be configured to cause the diaphragm (810) to vibrate. The yoke (840) may fix the permanent magnet (830) and collect the force of the magnetic field generated by the permanent magnet (830) to increase the output and / or efficiency of the first speaker (631). The first enclosure (820) is a component that defines the appearance of the first speaker (631) and may surround the diaphragm (810), the permanent magnet (830), and the yoke (840).

[0107] In one embodiment, an audio signal generated from the diaphragm (810) may resonate in a rear chamber (910) within a first enclosure (820). The rear chamber (910) within the first enclosure (820) may be referred to as a resonant space. The audio signal generated from the diaphragm (810) may be amplified at a resonant frequency based on the volume of the resonant space within the first enclosure (820). The first enclosure (820) may include a first port hole (822) connected to the rear chamber (910) through which air within the rear chamber (910) may flow. The first port hole (822) may be aligned with a second port hole (852) of the first temple (603). By allowing air to flow within the rear chamber (910) through the first port hole (822) and the second port hole (852), the low-frequency sound of the audio signal can be enhanced.

[0108] According to one embodiment, the first enclosure (820) may include a first speaker hole (821) that provides a path for an audio signal generated from the diaphragm (810) to be transmitted to the outside of the first speaker (631). The first speaker hole (821) may be aligned with a second speaker hole (851) of the first temple (603). Vibration of the diaphragm (810) causes vibration of air within the front chamber (920), and an audio signal generated by the vibration may be provided to the outside of the head-wearable device (e.g., the head-wearable device (600) of FIG. 6) through the first speaker hole (821) and the second speaker hole (851). If the front chamber (920) is not sealed at a portion other than the first speaker hole (821), the audio signal may be distorted, thereby degrading the quality of the audio signal. For sealing the front chamber (920), the first adhesive (860) can seal the edge of the first enclosure (820).

[0109] Referring to FIG. 10, the first speaker (631) can be attached to the first side wall of the first temple (603) (e.g., the first side wall (611) of FIG. 9) via a first adhesive (860). Since the first speaker (631) illustrated in FIG. 10 is positioned within the first temple (603), it can be positioned between the first side wall (611) and the first cover plate (613). The first adhesive (860) can be interposed between the first enclosure (820) of the first speaker (631) and the first side wall (611), thereby attaching the first speaker (631) to the first side wall (611). The first adhesive (860) can seal the front chamber (920) connected to the first speaker hole (821). For sealing the front chamber (920), the first adhesive (860) may be positioned to seal the edge of the first speaker (631). For example, within FIG. 10, the first adhesive (860) may be positioned to form a closed loop, thereby sealing the front chamber (920) connected to the first speaker hole (821).

[0110] The head-wearable device (600) may include a heat dissipation sheet. The heat dissipation sheet for dissipating heat generated from one or more electronic components (e.g., one or more electronic components (622) of FIG. 7) disposed on a printed circuit board (e.g., printed circuit board (621) of FIG. 7) may be configured to spread the heat within the first temple (603) so that the heat is not concentrated within a localized area. The heat spread to the entire area of ​​the first temple (603) may be released to the outside of the first temple (603). When the heat dissipation sheet is disposed to entirely cover the first side wall (611) to spread the heat to the entire area of ​​the first temple (603), the heat dissipation sheet and the adhesive may overlap. Since the heat dissipation sheet is formed from heat-dissipating materials for spreading heat, it may be difficult for the adhesive to be firmly attached onto the heat dissipation sheet. If the adhesive includes a portion that overlaps the heat-dissipating sheet and a portion that does not overlap the heat-dissipating sheet, a step portion of the adhesive may be formed, making it difficult for the adhesive to be firmly attached to the heat-dissipating sheet. Since the adhesive is likely to detach from the heat-dissipating sheet, sealing the internal space of the first enclosure (820) may be difficult. If the internal space of the first enclosure (820) is not properly sealed, the audio signal provided from the first speaker (631) may be distorted, resulting in deterioration in the quality of the audio signal.

[0111] According to one embodiment, in order for the first adhesive (860) to seal the edge of the first speaker (631), a portion (861) of the first adhesive (860) may extend perpendicularly to the extension direction of the first temple (603) (e.g., the y-axis direction of FIG. 10). For example, the portion (861) of the first adhesive (860) may extend in a direction from the upper surface (1001) of the first temple (603) toward the lower surface (1002). A heat dissipation sheet for dissipating and diffusing heat of electronic components disposed within the first temple (603) may extend parallel to the extension direction of the first temple (603) in order to entirely diffuse the heat within the first temple (603). Since the heat dissipation sheet extends parallel to the extension direction of the first temple (603) and a portion (861) of the first adhesive (860) extends perpendicular to the extension direction of the first temple (603), when the heat dissipation sheet is formed as a single segment, the heat dissipation sheet and the first adhesive (860) can overlap.

[0112] According to one embodiment, a head-wearable device (600) may include heat dissipation sheets that are separated from each other. As the heat dissipation sheets are separated from each other, a portion (861) of a first adhesive (860) extending perpendicular to the extension direction of the first temple (603) and the heat dissipation sheets may not overlap each other. According to one embodiment, a first heat dissipation sheet (e.g., a first heat dissipation sheet (641) of FIG. 7), a second heat dissipation sheet (e.g., a second heat dissipation sheet (642) of FIG. 7), and a third heat dissipation sheet (e.g., a third heat dissipation sheet (643) of FIG. 7) may be disposed within the first temple (603). The first heat dissipation sheet (641), the second heat dissipation sheet (642), and the third heat dissipation sheet (643) can spread heat generated from one or more electronic components (622) and speakers within the first temple (603) and provide sealing of the interior space of the first enclosure (820).

[0113] Hereinafter, with reference to the drawings, detailed structures of the first heat-radiating sheet (641), the second heat-radiating sheet (642), and the third heat-radiating sheet (643) will be described. The descriptions of the first heat-radiating sheet (641), the second heat-radiating sheet (642), and the third heat-radiating sheet (643) described below can be substantially equally applied to the fourth heat-radiating sheet (e.g., the fourth heat-radiating sheet (671) of FIG. 7), the fifth heat-radiating sheet (e.g., the fifth heat-radiating sheet (672) of FIG. 7), and the sixth heat-radiating sheet (e.g., the sixth heat-radiating sheet (673) of FIG. 7), respectively.

[0114] Figure 11 illustrates a first temple without the printed circuit board, the first speaker, and the first cover plate. Figure 12 illustrates a first temple with heat dissipation sheets and a first adhesive disposed thereon.

[0115] Referring to FIGS. 11 and 12, the first heat-dissipating sheet (641) and the second heat-dissipating sheet (642) may be spaced apart from each other. For example, the first heat-dissipating sheet (641) and the second heat-dissipating sheet (642) may not be formed integrally but may be separated from each other. The first heat-dissipating sheet (641) may be placed on the first portion (611a) of the first side wall (611). The second heat-dissipating sheet (642) may be placed on the second portion (611b) of the first side wall (611). When the first heat dissipation sheet (641) is placed on the first portion (611a) of the first side wall (611) and the second heat dissipation sheet (642) is placed on the second portion (611b) of the first side wall (611), the first heat dissipation sheet (641) and the second heat dissipation sheet (642) may be spaced apart from each other. The first heat dissipation sheet (641) may be placed so as to face a printed circuit board (e.g., a printed circuit board (621) of FIG. 12). The second heat dissipation sheet (642) may be placed so as to face a first speaker (e.g., a first speaker (631) of FIG. 12).

[0116] Since the first heat dissipation sheet (641) and the second heat dissipation sheet (642) are spaced apart from each other, heat generated from one or more electronic components (e.g., one or more electronic components (622) of FIG. 12) that is conducted through the first heat dissipation sheet (641) may be difficult to conduct to the second heat dissipation sheet (642), and heat generated from the first speaker (631) that is conducted through the second heat dissipation sheet (642) may be difficult to conduct to the first heat dissipation sheet (641). If the heat generated from one or more electronic components (622) is spread only through the first heat dissipation sheet (641), the heat may be difficult to spread throughout the internal space of the first temple (603). If the heat generated from the first speaker (631) is spread only through the second heat dissipation sheet (642), the heat may be difficult to spread throughout the internal space of the first temple (603).

[0117] According to one embodiment, the third heat dissipation sheet (643) may be configured to thermally connect the first heat dissipation sheet (641) and the second heat dissipation sheet (642). By physically contacting the third heat dissipation sheet (643) with each of the first heat dissipation sheet (641) and the second heat dissipation sheet (642), the first heat dissipation sheet (641) and the second heat dissipation sheet (642) may be thermally connected to each other through the third heat dissipation sheet (643).

[0118] For example, heat generated from one or more electronic components (622) disposed on a printed circuit board (621) can be transferred to a first heat dissipation sheet (641) facing the printed circuit board (621). The heat can be conducted to a second heat dissipation sheet (642) by being conducted along the first heat dissipation sheet (641) and the third heat dissipation sheet (643). Since the heat can spread along the first heat dissipation sheet (641), the second heat dissipation sheet (642), and the third heat dissipation sheet (643), the heat can be spread throughout the interior space of the first temple (603) rather than being concentrated in a localized area within the first temple (603) (e.g., an area around the first portion (611a)). The heat can be spread throughout the internal space of the first temple (603) and released to the outside of the first temple (603), so that heat generated from one or more electronic components (622) can be dissipated.

[0119] For example, heat generated from the first speaker (631) can be transferred to the second heat dissipation sheet (642) facing the first speaker (631). The heat can be conducted to the first heat dissipation sheet (641) by being conducted along the second heat dissipation sheet (642) and the third heat dissipation sheet (643). Since the heat can be spread along the first heat dissipation sheet (641), the second heat dissipation sheet (642), and the third heat dissipation sheet (643), the heat can be spread throughout the interior space of the first temple (603) rather than being concentrated within a localized area within the first temple (603) (e.g., an area around the second portion (611b)). The heat can be spread throughout the interior space of the first temple (603) and dissipated to the outside of the first temple (603). The heat generated from the first speaker (631) can be dissipated.

[0120] In one embodiment, a first adhesive (860) for attaching the first speaker (631) to the first sidewall (611) may be disposed on the first sidewall (611). For example, the first adhesive (860) may be disposed along an edge of the first speaker (631) to seal the edge of the first speaker (631). To enable the first adhesive (860) to seal the edge of the first speaker (631), the first adhesive (860) may include a portion (861) that crosses a third portion (611c) of the first sidewall (611) between a first portion (611a) of the first sidewall (611) and a second portion (611b) of the first sidewall (611). The above-described part (861) of the first adhesive (860) can cross between the first heat-dissipating sheet (641) and the second heat-dissipating sheet (642).

[0121] According to one embodiment, a portion of the third heat dissipation sheet (643) may be inserted into the first side wall (611), and another portion of the third heat dissipation sheet (643) may be disposed on the first side wall (611). The other portion of the third heat dissipation sheet (643) disposed on the first side wall (611) may be referred to as a portion of the third heat dissipation sheet (643) that contacts each of the first heat dissipation sheet (641) and the second heat dissipation sheet (642).

[0122] According to one embodiment, the third heat dissipation sheet (643) may include a first portion (643a), a second portion (643b), and a third portion (643c). The first portion (643a) of the third heat dissipation sheet (643) may be a portion of the third heat dissipation sheet (643) that is in contact with the first heat dissipation sheet (641). The second portion (643b) of the third heat dissipation sheet (643) may be a portion of the third heat dissipation sheet (643) that is in contact with the second heat dissipation sheet (642). The third part (643c) of the third heat-radiating sheet (643) is a part of the third heat-radiating sheet (643) that extends from the first part (643a) of the third heat-radiating sheet (643) to the second part (643b) of the third heat-radiating sheet (643), and can be positioned between the first part (643a) and the second part (643b).

[0123] According to one embodiment, the first portion (643a) of the third heat-dissipating sheet (643) may be positioned so as to be exposed to the first side wall (611) and may be in contact with the first heat-dissipating sheet (641). For example, the first portion (643a) of the third heat-dissipating sheet (643) may be positioned on the first portion (611a) of the first side wall (611) on which the first heat-dissipating sheet (641) is positioned, or may form substantially the same surface as the first side wall (611). By positioning the portion (641a) of the first heat-dissipating sheet (641) on the first portion (643a) that is positioned on the first portion (611a), the first portion (643a) of the third heat-dissipating sheet (643) may be in contact with the first heat-dissipating sheet (641). As the first portion (643a) of the third heat-dissipating sheet (643) comes into contact with the first heat-dissipating sheet (641), the third heat-dissipating sheet (643) can be thermally connected to the first heat-dissipating sheet (641). The third heat-dissipating sheet (643) can further include a fourth portion (643d) that extends from the first portion (643a) of the third heat-dissipating sheet (643) to be inserted into the first side wall (611). The fourth portion (643d) can be at least partially inserted and fixed into the first portion (611a) of the first side wall (611).

[0124] According to one embodiment, the second portion (643b) of the third heat-dissipating sheet (643) may be positioned so as to be exposed to the first side wall (611) and may be in contact with the second heat-dissipating sheet (642). For example, the second portion (643b) of the third heat-dissipating sheet (643) may be positioned on the second portion (611b) of the first side wall (611) on which the second heat-dissipating sheet (642) is positioned, or may form substantially the same surface as the first side wall (611). By positioning a portion (642a) of the second heat-dissipating sheet (642) on the first portion (643a) that is positioned on the first portion (611a), the second portion (643b) of the third heat-dissipating sheet (643) may be in contact with the second heat-dissipating sheet (642). As the second portion (643b) of the third heat-dissipating sheet (643) comes into contact with the second heat-dissipating sheet (642), the third heat-dissipating sheet (643) can be thermally connected to the second heat-dissipating sheet (642). The third heat-dissipating sheet (643) can further include a fifth portion (643e) that extends from the second portion (643b) of the third heat-dissipating sheet (643) to be inserted into the first side wall (611). The fifth portion (643e) can be at least partially inserted and fixed into the second portion (611b) of the first side wall (611).

[0125] According to one embodiment, the third portion (643c) of the third heat-dissipating sheet (643) can extend from the first portion (643a) of the third heat-dissipating sheet (643) to the second portion (643b) of the third heat-dissipating sheet (643). The third portion (643c) of the third heat-dissipating sheet (643) can be disposed within the third portion (611c) of the first side wall (611). The third portion (643c) of the third heat-dissipating sheet (643) can be separated from the first adhesive (860) by the side wall (611). The third portion (643c) of the third heat-dissipating sheet (643) can be substantially surrounded by the side wall (611). For example, the third portion (643c) of the third heat-dissipating sheet (643) may extend to be inserted into the third portion (611c) of the first side wall (611) between the first portion (643a) and the second portion (643b). As the third portion (643c) of the third heat-dissipating sheet (643) is positioned within the third portion (611c) of the first side wall (611), the third portion (643c) of the third heat-dissipating sheet (643) may not be exposed on the first side wall (611). For example, when the first temple (603) is viewed from above, the first portion (643a) of the third heat-dissipating sheet (643) and the second portion (643b) of the third heat-dissipating sheet (643) may be visible. When looking at the first temple (603) from above, the fourth part (643d) of the third heat-dissipating sheet (643), the fifth part (643e) of the third heat-dissipating sheet (643), and the third part (643c) of the third heat-dissipating sheet (643) may be positioned within the first side wall (611) and may not be visible. By the fourth part (643d) of the third heat-dissipating sheet (643), the fifth part (643e) of the third heat-dissipating sheet (643), and the third part (643c) of the third heat-dissipating sheet (643) inserted into the first side wall (611), the third heat-dissipating sheet (643) may be fixed to the first side wall (611). The first part (643a) of the third heat dissipation sheet (643) can be positioned between the third part (643c) and the fourth part (643d).The second part (643b) of the third heat dissipation sheet (643) can be positioned between the third part (643c) and the fifth part (643e).

[0126] Referring to FIGS. 11 and 12, a first heat-dissipating sheet (641) and a second heat-dissipating sheet (642) may be disposed on a first side wall (611) into which a third heat-dissipating sheet (e.g., the third heat-dissipating sheet (643) of FIG. 11) is partially inserted. When the first heat-dissipating sheet (641) is disposed on a first portion (611a) of the first side wall (611), a first portion (643a) of the third heat-dissipating sheet (643) may be in contact with a portion (641a) of the first heat-dissipating sheet (641). When the second heat-dissipating sheet (642) is disposed on a second portion (611b) of the first side wall (611), a second portion (643b) of the third heat-dissipating sheet (643) may be in contact with a portion (642a) of the second heat-dissipating sheet (642). Since the third heat dissipation sheet (643) is in contact with both the first heat dissipation sheet (641) and the second heat dissipation sheet (642), it can thermally connect the first heat dissipation sheet (641) and the second heat dissipation sheet (642).

[0127] Referring to FIG. 12, the printed circuit board (621) may be placed so as to face the first heat dissipation sheet (641). The first speaker (631) may be placed on the second portion (611b) and the third portion (611c) of the first side wall (611). The first speaker (631) may be attached to the first side wall (611) via a first adhesive (860).

[0128] According to one embodiment, the shape of the first adhesive (860) may correspond to the shape of the edge of the first enclosure (820). Since the first speaker (631) is disposed on the second portion (611b) and the third portion (611c) of the first side wall (611), the first adhesive (860) may be disposed to surround a portion of the outer edge of the second heat dissipation sheet (642). As described below, the first enclosure (820) may include a first speaker hole (821) through which an audio signal output from the diaphragm (810) of the first speaker (631) is radiated. The first adhesive (860) may be disposed to seal the edge of the first speaker (631) (the first enclosure (820)) in order to seal the internal space of the enclosure including the diaphragm (810). As described above, when the first adhesive (860) comes into contact with the second heat-dissipating sheet (642), the first adhesive (860) may detach from the second heat-dissipating sheet (642) due to the properties of the heat-dissipating materials forming the second heat-dissipating sheet (642). The first adhesive (860) may include a portion (e.g., a portion (861) of FIG. 11) disposed on the third portion (611c) of the first side wall (611) so as to seal the edge of the first speaker (631) without coming into contact with the second heat-dissipating sheet (642). The portion (861) of the first adhesive (860) may cross between the first portion (e.g., the first portion (643a) of FIG. 11) and the second portion (e.g., the second portion (643b) of FIG. 11) disposed on the first side wall (611).

[0129] In one embodiment, as the first heat dissipation sheet (641) and the second heat dissipation sheet (642) are separated, the first adhesive (860) may not come into contact with the first heat dissipation sheet (641) or the second heat dissipation sheet (642). Since the first adhesive (860) is spaced from the second heat dissipation sheet (642) disposed on the second portion (611b) of the first side wall (611), the first adhesive (860) may be directly attached to the first side wall (611). Since the third heat dissipation sheet (643) is not disposed on the third portion (611c) of the first side wall (611) but is inserted into the interior of the third portion (611c) of the first side wall (611), a portion of the first adhesive (860) (e.g., a portion (861) of FIG. 11) can be attached on the third portion (611c) of the first side wall (611). Since the first speaker (631) can be attached to the first side wall (611) through the first adhesive (860) disposed so as not to come into contact with the first heat dissipation sheet (641) or the second heat dissipation sheet (642), the first speaker (631) can be firmly attached to the first side wall (611). Since the first adhesive (860) does not include a portion overlapping with the first heat dissipation sheet (641) or the second heat dissipation sheet (642), it can be firmly attached to the first side wall (611), so that the sealing of the internal space of the first speaker (631) can be stabilized.

[0130] In one embodiment, the first temple (603) can be manufactured through an injection molding process. For example, non-conductive materials forming the first temple (603) are injected into a mold having a shape corresponding to the shape of the first temple (603), and then the non-conductive materials are cured, thereby manufacturing the first temple (603). The third heat dissipation sheet (643) can be partially positioned within the first side wall (611) through an insert molding process when manufacturing the first temple (603). The third heat dissipation sheet (643) having a shape as shown in FIG. 11 can be placed within the mold, and injection molding materials can be injected into the mold. When the non-conductive materials are cured, the third heat dissipation sheet (643) including the third portion (643c) inserted within the first side wall (611) of the first temple (603) can be provided.

[0131] According to one embodiment, the material forming the third heat-dissipating sheet (643) may be different from the material forming the first heat-dissipating sheet (641) or the second heat-dissipating sheet (642). For example, the third heat-dissipating sheet (643) may be formed of a metal material. For example, the third heat-dissipating sheet (643) may be formed of copper, but is not limited thereto. Since the third heat-dissipating sheet (643) must maintain the shape illustrated in FIG. 11 while the first temple (603) is manufactured through an insert injection process, the third heat-dissipating sheet (643) may be formed of a metal material capable of maintaining the shape. The first heat-dissipating sheet (641) and / or the second heat-dissipating sheet (642) may be formed of a carbon-based heat-dissipating material. For example, the first heat-dissipating sheet (641) and / or the second heat-dissipating sheet (642) may be formed of graphite. Graphite has electrical insulation properties, and thus may be suitable as a material for heat dissipation of electronic components such as one or more electronic components (622) and the first speaker (631). Since the weight of graphite is lighter than that of metal, the first heat dissipation sheet (641) and / or the second heat dissipation sheet (642) may be formed of graphite to reduce the weight of the head-wearable device (600).

[0132] Fig. 13 illustrates a first temple with the first cover plate omitted. Fig. 14 is a cross-sectional view of the first temple of Fig. 13 taken along line BB'.

[0133] Referring to FIG. 13, the first heat dissipation sheet (641) may face the printed circuit board (621). The second heat dissipation sheet (642) may face the first speaker (631). The first speaker (631) may be spaced apart from the printed circuit board (621). For example, a third heat dissipation sheet (e.g., the third heat dissipation sheet (643) of FIG. 11) that thermally connects the first heat dissipation sheet (641) and the second heat dissipation sheet (642) may not be visible from the outside when the first temple (603) is viewed from above because it is in contact with the first heat dissipation sheet (641) and the second heat dissipation sheet (642), and a portion of the third heat dissipation sheet (643) is inserted inside the first side wall (611).

[0134] Referring to FIG. 14, the third heat dissipation sheet (643) may be configured to conduct heat generated from one or more electronic components (622) disposed on a printed circuit board (621) and transferred to the first heat dissipation sheet (641) to a second heat dissipation sheet (642) spaced apart from the first heat dissipation sheet (641).

[0135] According to one embodiment, when one or more electronic components (622) disposed on a printed circuit board (621) operate, heat may be emitted. The heat emitted from the one or more electronic components (622) may be transferred to a first heat dissipation sheet (641) facing the printed circuit board (621). The heat transferred to the first heat dissipation sheet (641) may be conducted along the first heat dissipation sheet (641). Since a portion (641a) of the first heat dissipation sheet (641) is in contact with a first portion (643a) of a third heat dissipation sheet (643), the heat conducted along the first heat dissipation sheet (641) may be conducted to the third heat dissipation sheet (643). The heat conducted to the third heat dissipation sheet (643) may be conducted along the third heat dissipation sheet (643). For example, heat conducted from the first heat-dissipating sheet (641) to the third heat-dissipating sheet (643) can be conducted from the first portion (643a) of the third heat-dissipating sheet (643) to the third portion (643c) of the third heat-dissipating sheet (643) and the second portion (643b) of the third heat-dissipating sheet (643). Since a portion (642a) of the second heat-dissipating sheet (642) is in contact with the second portion (643b) of the third heat-dissipating sheet (643), heat conducted along the third heat-dissipating sheet (643) can be conducted to the second heat-dissipating sheet (642). For example, heat conducted along the third heat-dissipating sheet (643) can be conducted from the second portion (643b) of the third heat-dissipating sheet (643) through a portion (642a) of the second heat-dissipating sheet (642) to the second heat-dissipating sheet (642). Heat conducted to a portion (642a) of the second heat-dissipating sheet (642) can be conducted along the second heat-dissipating sheet (642).

[0136] According to one embodiment, heat generated from one or more electronic components (622) can spread to the entire area of ​​the first temple (603) through the first heat dissipation sheet (641), the third heat dissipation sheet (643), and the second heat dissipation sheet (642). A conduction path of the heat generated from the one or more electronic components (622) can be referred to as a first conduction path formed along the printed circuit board (621) - the first heat dissipation sheet (641) - the third heat dissipation sheet (643) - and the second heat dissipation sheet (642). Even if the first heat dissipation sheet (641) and the second heat dissipation sheet (642) are separated, the heat generated from one or more electronic components (622) can spread from the first heat dissipation sheet (641) through the third heat dissipation sheet (643) to the second heat dissipation sheet (642), so that the heat can be effectively dissipated.

[0137] According to one embodiment, the third heat dissipation sheet (643) may be configured to conduct heat generated from the first speaker (631) and transferred to the second heat dissipation sheet (642) to the first heat dissipation sheet (641) spaced apart from the second heat dissipation sheet (642).

[0138] According to one embodiment, when the first speaker (631) operates, heat may be emitted. The heat emitted from the first speaker (631) may be transferred to the second heat dissipation sheet (642) facing the first speaker (631). The heat transferred to the second heat dissipation sheet (642) may be conducted along the second heat dissipation sheet (642). Since a portion (642a) of the second heat dissipation sheet (642) is in contact with a second portion (643b) of the third heat dissipation sheet (643), the heat conducted along the second heat dissipation sheet (642) may be conducted to the third heat dissipation sheet (643). The heat conducted to the third heat dissipation sheet (643) may be conducted along the third heat dissipation sheet (643). For example, heat conducted from the second heat-dissipating sheet (642) to the third heat-dissipating sheet (643) can be conducted from the second portion (643b) of the third heat-dissipating sheet (643) to the third portion (643c) of the third heat-dissipating sheet (643) and the first portion (643a) of the third heat-dissipating sheet (643). Since a portion (641a) of the first heat-dissipating sheet (641) is in contact with the first portion (643a) of the third heat-dissipating sheet (643), heat conducted along the third heat-dissipating sheet (643) can be conducted to the first heat-dissipating sheet (641). For example, heat conducted along the third heat-dissipating sheet (643) can be conducted from the first portion (643a) of the third heat-dissipating sheet (643) through a portion (641a) of the first heat-dissipating sheet (641) to the first heat-dissipating sheet (641). Heat conducted to a portion (641a) of the first heat-dissipating sheet (641) can be conducted along the first heat-dissipating sheet (641).

[0139] According to one embodiment, heat generated from the first speaker (631) can spread to the entire area of ​​the first temple (603) through the second heat dissipation sheet (642), the third heat dissipation sheet (643), and the first heat dissipation sheet (641). The conduction path of the heat generated from the first speaker (631) can be referred to as a second conduction path formed along the second heat dissipation sheet (642), the third heat dissipation sheet (643), and the first heat dissipation sheet (641). Even if the first heat dissipation sheet (641) and the second heat dissipation sheet (642) are separated, the heat generated from the first speaker (631) can spread from the second heat dissipation sheet (642), through the third heat dissipation sheet (643), to the first heat dissipation sheet (641), so that the heat can be effectively dissipated.

[0140] According to one embodiment, the first adhesive (860) that attaches the first speaker (631) to the first side wall (611) can firmly attach the first speaker (631) to the first side wall (611) because it is spaced from the second heat dissipation sheet (642). The first adhesive (860) can include a portion (861) that is disposed on the third portion (611c) of the first side wall (611) to seal an edge of the first speaker (631). The edge of the first speaker (631) can be sealed by the first adhesive (860) that includes the portion (861).

[0141] FIG. 15 illustrates the interior of a first temple according to one embodiment in which the printed circuit board and the first speaker are omitted.

[0142] Referring to FIG. 15, the second heat dissipation sheet (e.g., the second heat dissipation sheet (642) of FIG. 7) may be omitted, and the third heat dissipation sheet (643) may extend from the first portion (643a) in contact with the first heat dissipation sheet (641) in a direction away from the first heat dissipation sheet (641). For example, the second heat dissipation sheet (642) may not be disposed on the second portion (611b) of the first side wall (611). Instead of the second heat dissipation sheet (642), the third heat dissipation sheet (643) may extend in a direction away from the first heat dissipation sheet (641). Since the second heat dissipation sheet (642) is omitted, the third heat dissipation sheet (643) may extend within the first side wall (611) without being exposed above the second portion (611b) of the first side wall (611). As the third portion (643c) of the third heat-dissipating sheet (643) extends away from the first heat-dissipating sheet (641), heat generated from one or more electronic components (e.g., one or more electronic components (622) of FIG. 7) disposed on a printed circuit board (e.g., printed circuit board (621) of FIG. 7) can spread to the entire area of ​​the first temple (603) along the first heat-dissipating sheet (641) and the third heat-dissipating sheet (643).

[0143] Figures 16a and 16b are cross-sectional views of a first temple according to one embodiment.

[0144] Referring to FIG. 16A, the first portion (643a) and the second portion (643b) of the third heat-radiating sheet (643) may be positioned on substantially the same surface as the first side wall (611), thereby being exposed to the outside of the first side wall (611). For example, when manufacturing the first temple (603), the first temple (603) may be manufactured so that the first side wall (611) is positioned on the same surface as the front surface of the first portion (643a) and the front surface of the second portion (643b). When the injection material for forming the first temple (603) is not positioned over the first portion (643a) of the third heat-radiating sheet (643) and the second portion (643b) of the third heat-radiating sheet (643), and the injection material injected into the mold is cured, the first temple (603) illustrated in FIG. 16A may be manufactured.

[0145] According to one embodiment, as the first portion (643a) of the third heat-dissipating sheet (643) and the second portion (643b) of the third heat-dissipating sheet (643) are exposed to the outside of the first side wall (611), the first heat-dissipating sheet (641) and the second heat-dissipating sheet (642) can come into contact with the third heat-dissipating sheet (643). For example, as the first heat-dissipating sheet (641) is disposed on the first portion (643a) of the third heat-dissipating sheet (643) that is exposed within the first portion (611a) of the first side wall (611), the first portion (643a) of the third heat-dissipating sheet (643) can come into contact with the first heat-dissipating sheet (641). As the second heat-dissipating sheet (642) is placed on the second portion (643b) of the third heat-dissipating sheet (643) exposed within the second portion (611b) of the first side wall (611), the second portion (643b) of the third heat-dissipating sheet (643) can contact the second heat-dissipating sheet (642). The third heat-dissipating sheet (643) can thermally connect the first heat-dissipating sheet (641) and the second heat-dissipating sheet (642) by contacting each of the first heat-dissipating sheet (641) and the second heat-dissipating sheet (642).

[0146] In the example of FIG. 16a, the third heat-dissipating sheet (643) is illustrated as including a fourth portion (643d) and a fifth portion (643e) extending from the first portion (643a) of the third heat-dissipating sheet (643) to be inserted into the first side wall (611), but the present disclosure is not limited thereto. Referring to FIG. 16b, the first portion (643a) of the third heat-dissipating sheet (643) and / or the second portion (643b) of the third heat-dissipating sheet (643) may extend substantially flat. For example, the first portion (643a) of the third heat-dissipating sheet (643) may extend substantially flat and come into contact with the first heat-dissipating sheet (641). For example, the second portion (643b) of the third heat-radiating sheet (643) may be extended substantially flatly and may come into contact with the second heat-radiating sheet (642). In the case of the structure illustrated in FIG. 16b, the contact area between the first heat-radiating sheet (641) and the first portion (643a) of the third heat-radiating sheet (643) and / or the contact area between the second heat-radiating sheet (642) and the second portion (643b) of the third heat-radiating sheet (643) may be relatively increased, so that the heat-radiating effect by the heat-radiating sheets (641, 642, 643) may be improved.

[0147] Fig. 17 is a perspective view of a third heat dissipation sheet according to one embodiment.

[0148] Referring to FIG. 17, the third heat dissipation sheet (643) may include one or more first through holes (1710) formed within the third portion (643c). For example, the one or more first through holes (1710) may be formed by penetrating a portion of the third portion (643c) of the third heat dissipation sheet (643).

[0149] According to one embodiment, the one or more first through holes (1710) can increase the contact area between the third portion (643c) of the third heat dissipation sheet (643) and the first side wall (e.g., the first side wall (611) of FIG. 7). As described above, the first temple (e.g., the first temple (603) of FIG. 7) and the third heat dissipation sheet (643) can be manufactured through an insert injection process. When the third heat dissipation sheet (643) including the one or more first through holes (1710) is placed into a mold for manufacturing the first temple (603) and injection materials forming the first temple (603) are injected, the injection materials can be inserted into the one or more first through holes (1710). When the injection materials are positioned within one or more first through holes (1710), and the injection materials are cured, a portion of the first side wall (611) may be formed within the one or more first through holes (1710). A contact area between the first side wall (611) and the third portion (643c) of the third heat dissipation sheet (643) may increase by the area of ​​the side surface of the one or more first through holes (1710). As the contact area increases, the third portion (643c) of the third heat dissipation sheet (643) may be stably bonded within the first side wall (611).

[0150] Referring to FIG. 17, the third heat dissipation sheet (643) may include one or more second through holes (1720) formed in the fourth portion (643d) and / or one or more third through holes (1730) formed in the fifth portion (643e). For example, the one or more second through holes (1720) may be formed by penetrating a portion of the fourth portion (643d) of the third heat dissipation sheet (643). The one or more third through holes (1730) may be formed by penetrating a portion of the fifth portion (643e) of the third heat dissipation sheet (643).

[0151] According to one embodiment, the one or more second through holes (1720) may increase a contact area between the fourth portion (643d) of the third heat dissipation sheet (643) and the first side wall (e.g., the first side wall (611) of FIG. 7). The one or more third through holes (1730) may increase a contact area between the fifth portion (643e) of the third heat dissipation sheet (643) and the first side wall (611). The descriptions for the one or more first through holes (1710) may be substantially equally applicable to each of the one or more second through holes (1720) and / or the one or more third through holes (1730). By forming a portion of the first side wall (611) within one or more of the second through holes (1720) and / or within one or more of the third through holes (1730), the contact area between the first side wall (611) and the fourth portion (643d) of the third heat dissipation sheet (643) and / or the contact area between the first side wall (611) and the fifth portion (643e) of the third heat dissipation sheet (643) can be increased. The third heat dissipation sheet (643) can be stably coupled to the first side wall (611) through the one or more of the second through holes (1720) and / or the one or more of the third through holes (1730).

[0152] Figure 18 illustrates a first temple including a recess.

[0153] Referring to FIG. 18, the first temple (603) may include a recess (1810) having a designated shape. For example, the recess (1810) may allow a third portion (643c) of a third heat-dissipating sheet (643) inserted into the first side wall (611) of the first temple (603) to be visible from the outside of the first temple (603). The recess (1810) may extend from the outer surface of the first temple (603) toward the inside of the first temple (603) such that a portion of the third portion (643c) of the third heat-dissipating sheet (643) is visible from the outside of the first temple (603). The recess (1810) of the first temple (603) may be formed by removing a portion of the first temple (603). The recess (1810) may be referred to as a negative structure from the perspective of extending from the outer surface of the first temple (603) toward the inner surface of the first temple (603).

[0154] According to one embodiment, a portion of the third portion (643c) corresponding to the recess (1810) may be visible from the outside of the first temple (603) through the recess (1810). As the third heat dissipation sheet (643) is disposed within the first temple (603) in which the recess (1810) is formed, a portion of the third portion (643c) corresponding to the recess (1810) may be visible from the outside of the first temple (603) through the recess (1810). A portion of the third portion (643c) visible through the recess (1810) may be visible from the outside of the first temple (603) according to a designated shape of the recess (1810). For example, the recess (1810) may have a designated shape, such as a trademark, a logo, or a letter. A portion of the third portion (643c) recognizable through the recess (1810) can enhance the design of the first temple (603). For example, if the third heat-dissipating sheet (643) is formed of a metal material (e.g., copper), the third heat-dissipating sheet (643) can have a color unique to the metal material. As the third portion (643c) is recognizable through the recess (1810) having a designated shape, a pattern having the unique color can be formed.

[0155] Fig. 19 illustrates a third heat dissipation sheet including a protrusion. Fig. 20 illustrates a first temple on which a third heat dissipation sheet including a protrusion is arranged.

[0156] Referring to FIG. 19, the third heat-radiating sheet (643) may include a protrusion (1910). The protrusion (1910) may protrude from the third portion (643c) toward the first temple (e.g., the first temple (603) of FIG. 6). The protrusion (1910) may have a designated shape, such as a trademark, logo, or letter. The protrusion (1910) may be formed on the third portion (643c) of the third heat-radiating sheet (643).

[0157] Referring to FIG. 20, when the third heat-radiating sheet (643) including the protrusion (1910) is placed inside the first temple (603), the protrusion (1910) may be exposed to the outer surface of the first temple (603). For example, the protrusion (1910) of the third heat-radiating sheet (643) may form a plane substantially identical to the outer surface of the first temple (603) by protruding from the third portion (643c) toward the outer surface of the first temple (603). For example, when manufacturing the first temple (603), the third heat-radiating sheet (643) including the protrusion (1910) may be placed inside a mold having a shape corresponding to the shape of the first temple (603). In a state where the third heat-dissipating sheet (643) is positioned such that the protrusion (1910) of the third heat-dissipating sheet (643) forms a substantially identical plane with the outer surface of the first temple (603), injection materials forming the first temple (603) can be injected into the mold. As the injection materials harden, the protrusion (1910) of the third heat-dissipating sheet (643) can form a substantially identical plane with the outer surface of the first temple (603).

[0158] As described above, the recess (1810) of the first temple (603) illustrated in FIG. 18 may be formed by removing a portion of the first temple (603). Alternatively, the first temple (603) illustrated in FIG. 20 may be manufactured such that the protrusion (1910) of the third heat-dissipating sheet (643) forms substantially the same plane as the outer surface of the first temple (603) without going through the process of removing a portion of the first temple (603). Since the injection-molded materials forming the first temple (603) are not injected into the portion occupied by the protrusion (1910), when the injection-molded materials are cured, the protrusion (1910) may be naturally exposed to the outside of the first temple (603). The protrusion (1910) of the third heat-dissipating sheet (643) that is visible from the outside of the first temple (603) may reinforce the design of the first temple (603).

[0159] Figures 21 and 22 illustrate the second temple.

[0160] Referring to FIG. 21, the above-described descriptions can be substantially equally applied to the fourth heat dissipation sheet (671), the fifth heat dissipation sheet (672), and the sixth heat dissipation sheet (673) included in the second temple (604).

[0161] In one embodiment, the second temple (604) may include a second side wall (661). For example, a battery (651) and a second speaker (632) may be positioned within the second temple (604). The fourth heat dissipation sheet (671), the fifth heat dissipation sheet (672), and the sixth heat dissipation sheet (673) may be configured to dissipate heat generated from the battery (651) and the second speaker (632).

[0162] In one embodiment, the second speaker (632) may be attached to the second side wall (661) via a second adhesive (870). As described above, when the second adhesive (870) overlaps a heat-dissipating sheet formed of heat-dissipating materials, the second adhesive (870) may detach.

[0163] According to one embodiment, the fourth heat dissipation sheet (671) may be disposed on the first portion (661a) of the second side wall (661). The fifth heat dissipation sheet (672) may be disposed on the second portion (661b) of the second side wall (661). The fifth heat dissipation sheet (672) may not be in contact with the fourth heat dissipation sheet (671) and may be spaced apart from the fourth heat dissipation sheet (671).

[0164] According to one embodiment, the sixth heat dissipation sheet (673) can thermally connect the fourth heat dissipation sheet (671) and the fifth heat dissipation sheet (672). The sixth heat dissipation sheet (673) can include a first portion (673a), a second portion (673b), and a third portion (673c). The first portion (673a) of the sixth heat dissipation sheet (673) can contact the fourth heat dissipation sheet (671). The second portion (673b) of the sixth heat dissipation sheet (673) can contact the fifth heat dissipation sheet (672). The third portion (673c) of the sixth heat dissipation sheet (673) can extend from the first portion (673a) to the second portion (673b).

[0165] In one embodiment, the third portion (673c) of the sixth heat dissipation sheet (673) can be inserted into the second side wall (661). As the third portion (673c) of the sixth heat dissipation sheet (673) is inserted into the second side wall (661), a portion (871) of the second adhesive (870) can cross the third portion (661c) between the first portion (661a) of the second side wall (661) and the second portion (661b) of the second side wall (661). In one embodiment, the second adhesive (870) can seal the edge of the second speaker (632).

[0166] Referring to FIG. 22, the arrangement structure of the aforementioned heat dissipation sheets (e.g., the first heat dissipation sheet (641), the second heat dissipation sheet (642), and the third heat dissipation sheet (643) of FIG. 11) may correspond to the heat dissipation sheets (e.g., the fourth heat dissipation sheet (671), the fifth heat dissipation sheet (672), and the sixth heat dissipation sheet (673)) arranged within the second temple (604). For example, the first heat dissipation sheet (641) may correspond to the fourth heat dissipation sheet (671), the second heat dissipation sheet (642) may correspond to the fifth heat dissipation sheet (672), and the third heat dissipation sheet (643) may correspond to the sixth heat dissipation sheet (673).

[0167] According to one embodiment, a battery (651) and a second speaker (632) may be disposed within a second temple (604). The second temple (604) may include structures such as a guide wall (2211) for supporting the battery (651), a hole structure (2212) into which a screw is inserted, or a mounting portion (2213) on which a microphone is mounted. The guide wall (2211), the hole structure (2212), and the mounting portion (2213) may be disposed on a second side wall (661). Due to the guide wall (2211), the hole structure (2212), and the mounting portion (2213) disposed on the second side wall (661), it may be difficult to place an integrated heat dissipation sheet on the second side wall (661) of the second temple (604).

[0168] As described with reference to FIG. 21, the fourth heat dissipation sheet (671) may be disposed on the first portion (661a) of the second side wall (661). The fifth heat dissipation sheet (672) may be disposed on the second portion (661b) of the second side wall (661). The fifth heat dissipation sheet (672) may not be in contact with the fourth heat dissipation sheet (671) and may be spaced apart from the fourth heat dissipation sheet (671). A guide wall (2211), a hole structure (2212), and a mounting portion (2213) may be positioned between the fourth heat dissipation sheet (671) and the fifth heat dissipation sheet (672).

[0169] According to one embodiment, the sixth heat dissipation sheet (673) can thermally connect the fourth heat dissipation sheet (671) and the fifth heat dissipation sheet (672). The sixth heat dissipation sheet (673) can include a first portion (673a), a second portion (673b), and a third portion (673c). The first portion (673a) of the sixth heat dissipation sheet (673) can be in contact with the fourth heat dissipation sheet (671). The second portion (673b) of the sixth heat dissipation sheet (673) can be in contact with the fifth heat dissipation sheet (672). The third portion (673c) of the sixth heat dissipation sheet (673) can be inserted into the interior of the second side wall (661) and extend from the first portion (673a) to the second portion (673b). In parts where it is difficult to place a heat dissipation sheet, such as a guide wall (2211), a hole structure (2212), or a mounting portion (2213), the third part (673c) of the sixth heat dissipation sheet (673) is inserted into the second side wall (661), so that the fourth heat dissipation sheet (671) and the fifth heat dissipation sheet (672), which are spaced apart from each other, can be thermally connected. In addition, in parts where it is difficult to place a heat dissipation sheet, a heat dissipation sheet having a structure identical or similar to the third heat dissipation sheet (643) or the sixth heat dissipation sheet (673) described above can be placed.

[0170] A wearable device is provided. The wearable device includes a housing, and the housing includes one or more surfaces within the housing. The wearable device further includes a first heat dissipation sheet, the first heat dissipation sheet being configured to dissipate heat generated by one or more electronic components and being disposed on a first portion of at least one surface of the housing. The wearable device further includes a second heat dissipation sheet, the second heat dissipation sheet being configured to dissipate heat generated by one or more electronic components and being disposed on a second portion of at least one surface of the housing, and being spaced apart from the first heat dissipation sheet. The wearable device further includes a speaker, the speaker being disposed on a second portion of the second heat dissipation sheet and a third portion of at least one surface of the housing via an adhesive. The third portion of at least one surface of the housing is positioned between the first heat dissipation sheet and the second heat dissipation sheet. The wearable device further includes a heat dissipation member thermally connecting the first heat dissipation sheet and the second heat dissipation sheet. The heat dissipation member includes a first portion in contact with the first heat dissipation sheet and a second portion in contact with the second heat dissipation sheet. The heat dissipation member further includes a third portion extending from the first portion of the first heat dissipation sheet to the second portion of the third heat dissipation sheet, wherein the third portion of the heat dissipation member is disposed away from the third portion of at least one surface.

[0171] A wearable device may be a device that a user can wear. A wearable device may be a device that can be worn on the user's head. A wearable device may be a device that is worn on the user's head. Alternatively, a wearable device may be a device that can be worn on a part of the user's body other than the user's head, such as the user's wrist.

[0172] The housing may be in contact with a part of the user's body when worn by the user. At least one surface within the housing may be a surface of a side wall of the housing. If at least one surface within the housing is a surface of a side wall of the housing, the side wall may be in contact with a part of the user's body when worn by the user.

[0173] The first heat dissipation sheet may be arranged to dissipate heat generated by the speaker. The second heat dissipation sheet may be arranged to dissipate heat generated by the speaker. The heat dissipation member may be arranged to dissipate heat generated by the speaker.

[0174] The wearable device may further include one or more electronic components disposed within the housing. The first heat dissipation sheet may be arranged to dissipate heat generated by the one or more electronic components. The second heat dissipation sheet may be arranged to dissipate heat generated by the one or more electronic components. The first heat dissipation sheet may be arranged to dissipate heat generated by the speaker. The heat dissipation member may be arranged to dissipate heat generated by the one or more electronic components.

[0175] The heat dissipation member may be a third heat dissipation sheet.

[0176] A third portion of the heat dissipation member may be included within a side wall of the housing.

[0177] The material forming the heat dissipation member may be different from the material forming the first heat dissipation sheet. The material forming the heat dissipation member may be different from the material forming the second heat dissipation sheet.

[0178] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0179] A head-wearable device (101, 200, 400, 600) is provided. The head-wearable device (101, 200, 400, 600) may include a side wall (611), and a housing part (603) that comes into contact with a part of a user's body when the head-wearable device (101, 200, 400, 600) is worn by the user and supports the head-wearable device (101, 200, 400, 600). The head-wearable device (101, 200, 400, 600) may include one or more electronic components (622) arranged within the housing part (603). For example, one or more electronic components (622) may be disposed on a printed circuit board (621) disposed within a housing part (603). The head-wearable device (101, 200, 400, 600) may include a first heat dissipation sheet (641) disposed on a first portion (611a) of the side wall (611) and configured to dissipate heat generated from the one or more electronic components (622). The head-wearable device (101, 200, 400, 600) may include a second heat dissipation sheet (642) disposed on a second portion (611b) of the side wall (611) and spaced apart from the first heat dissipation sheet (641). The head-wearable device (101, 200, 400, 600) may include a speaker (631) attached to the side wall (611) via an adhesive (860) on the side wall (611) and positioned on the second portion (611b) and the third portion (611c) of the side wall (611). The speaker (631) may be spaced apart from the printed circuit board (621).A portion (861) of the adhesive (860) is disposed on a third portion (611c) of the side wall (611) to seal an edge of the speaker (631), and the third portion (611c) of the side wall (611) may be positioned between the first portion (611a) of the side wall (611) and the second portion (611b) of the side wall (611). The head-wearable device (101, 200, 400, 600) may include a third heat-dissipating sheet (643) that thermally connects the first heat-dissipating sheet (641) and the second heat-dissipating sheet (642). The third heat-radiating sheet (643) may include a first portion (643a) disposed on the side wall (611) of the housing part (603) and in contact with the first heat-radiating sheet (641), a second portion (643b) disposed on the side wall (611) of the housing part (603) and in contact with the second heat-radiating sheet (642), and a third portion (643c) extending from the first portion (643a) of the third heat-radiating sheet (643) to the second portion (643b) of the third heat-radiating sheet (643) and disposed within the third portion (611c) of the side wall (611). A material forming the third heat-radiating sheet (643) may be different from a material forming the first heat-radiating sheet (641) or the second heat-radiating sheet (642).

[0180] According to one embodiment, the adhesive (860) can be attached to the side wall (611) by being spaced apart from the second heat dissipation sheet (642) disposed on the second portion (611b) of the side wall (611).

[0181] According to one embodiment, the head-wearable device (101, 200, 400, 600) may further include a printed circuit board (621) disposed within the housing part (603), spaced apart from the speaker (631), and having the one or more electronic components (622) disposed thereon. The third heat dissipation sheet (643) may be configured to conduct heat generated from the one or more electronic components (622) disposed on the printed circuit board (621) and transferred to the first heat dissipation sheet (641) facing the printed circuit board (621) to the second heat dissipation sheet (642) spaced apart from the first heat dissipation sheet (641).

[0182] According to one embodiment, the third heat dissipation sheet (643) may be configured to conduct heat generated from the speaker (631) and transferred to the second heat dissipation sheet (642) disposed under the speaker (631) to the first heat dissipation sheet (641) spaced apart from the second heat dissipation sheet (642).

[0183] According to one embodiment, the speaker (631) may include an enclosure (820) including a diaphragm (810) and a first speaker hole (821) surrounding the diaphragm (810) and providing a path for an audio signal generated from the diaphragm (810) to be transmitted to the outside of the speaker (631). The housing part (603) may include a second speaker hole (851) aligned with the first speaker hole (821) and providing a path for the audio signal to be transmitted to the outside of the housing part (603).

[0184] According to one embodiment, the adhesive (860) may be interposed between the edge of the enclosure (820) and the side wall (611) to seal a front chamber (920) formed on the front side of the diaphragm (810) and connected to the second speaker hole (851) through the first speaker hole (821).

[0185] According to one embodiment, at least one of the front surface of the first portion (643a) of the third heat-dissipating sheet (643) or the front surface of the second portion (643b) of the third heat-dissipating sheet (643) may be positioned on substantially the same plane as the side wall (611).

[0186] According to one embodiment, the first heat dissipation sheet (641) or the second heat dissipation sheet (642) may be formed from graphite, and the third heat dissipation sheet (643) may be formed from a metal material.

[0187] According to one embodiment, the third heat dissipation sheet (643) may include one or more through holes (1710, 1720, 1730) to increase the contact area between the side wall (611) of the housing part (603) and the third heat dissipation sheet (643).

[0188] According to one embodiment, the third heat dissipation sheet (643) may further include a fourth portion (643d) extending from the first portion (643a) of the third heat dissipation sheet (643) to be inserted into the side wall (611) of the housing part (603), and a fifth portion (643e) extending from the second portion (643b) of the third heat dissipation sheet (643) to be inserted into the side wall (611) of the housing part (603). The first portion (643a) of the third heat dissipation sheet (643) may be positioned between the third portion (643c) of the third heat dissipation sheet (643) and the fourth portion (643d) of the third heat dissipation sheet (643). The second part (643b) of the third heat-dissipating sheet (643) may be positioned between the third part (643c) of the third heat-dissipating sheet (643) and the fifth part (643e) of the third heat-dissipating sheet (643).

[0189] According to one embodiment, the housing part (603) may include a recess (1810) extending from an outer surface of the housing part (603) toward an interior of the housing part (603) and having a designated shape, such that the third portion (611c) of the third heat-dissipating sheet (643) is visible from the outside of the housing part (603). A portion of the third portion (611c) corresponding to the recess (1810) may be visible from the outside of the housing part (603) through the recess (1810).

[0190] According to one embodiment, the third heat-dissipating sheet (643) may include a protrusion (1910) having a designated shape, which protrudes from the third portion (611c) of the third heat-dissipating sheet (643) toward the outer surface of the housing part (603), is exposed to the outer surface of the housing part (603), and has a designated shape. The protrusion (1910) may be visible from the outside of the housing part (603).

[0191] According to one embodiment, the head-wearable device (101, 200, 400, 600) may further include a display (608) that displays visual information to the user wearing the head-wearable device (101, 200, 400, 600). The head-wearable device (101, 200, 400, 600) may further include a rim (605) that surrounds the display (608). The housing part (603) may include a temple (603) that is rotatably connected to the rim (605) and comes into contact with the user's ear.

[0192] According to one embodiment, the head-wearable device (101, 200, 400, 600) may further include another temple (604) that accommodates a battery (651), is in contact with the other ear of the user, and is rotatably connected to the rim (605).

[0193] According to one embodiment, a portion (641a) of the first heat-dissipating sheet (641) in contact with the first portion (643a) of the third heat-dissipating sheet (643) may be disposed on the first portion (643a) of the third heat-dissipating sheet (643). A portion (642a) of the second heat-dissipating sheet (642) in contact with the second portion (643b) of the third heat-dissipating sheet (643) may be disposed on the second portion (643b) of the third heat-dissipating sheet (643).

[0194] A head-wearable device (101, 200, 400, 600) is provided. The head-wearable device (101, 200, 400, 600) may include a display (608). The head-wearable device (101, 200, 400, 600) may include a housing assembly (601). The housing assembly (601) may include a rim (605) surrounding the display (608), and a side wall (611) rotatably connected to the rim (605), and a temple (603) supported by the ear of the user when the head-wearable device (101, 200, 400, 600) is worn by the user. The head-wearable device (101, 200, 400, 600) may include a printed circuit board (621) disposed within the temple (603). The head-wearable device (101, 200, 400, 600) may include one or more electronic components (622) disposed on the printed circuit board (621). The head-wearable device (101, 200, 400, 600) may include a first heat dissipation sheet (641) disposed on a first portion (611a) of the side wall (611), facing the printed circuit board (621), and configured to dissipate heat generated from the one or more electronic components (622). The head-wearable device (101, 200, 400, 600) may include a second heat-dissipating sheet (642) spaced apart from the first heat-dissipating sheet (641) and disposed on a second portion (611b) of the side wall (611). The head-wearable device (101, 200, 400, 600) may include a speaker (631) spaced apart from the printed circuit board (621), attached to the side wall (611) via an adhesive (860) on the side wall (611), and disposed on the second portion (611b) and the third portion (611c) of the side wall (611).A portion (861) of the adhesive (860) may be disposed on a third portion (611c) of the side wall (611) to seal an edge of the speaker (631). The third portion (611c) of the side wall (611) may be positioned between the first portion (611a) of the side wall (611) and the second portion (611b) of the side wall (611). The head-wearable device (101, 200, 400, 600) may include a third heat-dissipating sheet (643) that thermally connects the first heat-dissipating sheet (641) and the second heat-dissipating sheet (642). The third heat dissipation sheet (643) may include a first portion (643a) disposed on the side wall (611) of the temple (603) and in contact with the first heat dissipation sheet (641), a second portion (643b) disposed on the side wall (611) of the temple (603) and in contact with the second heat dissipation sheet (642), and a third portion (643c) extending from the first portion (643a) of the third heat dissipation sheet (643) to the second portion (643b) of the third heat dissipation sheet (643) and disposed within the third portion (611c) of the side wall (611).

[0195] According to one embodiment, the adhesive (860) can be attached to the side wall (611) by being spaced apart from the second heat dissipation sheet (642) disposed on the first portion (611a) of the side wall (611).

[0196] According to one embodiment, the third heat dissipation sheet (643) may be configured to conduct heat generated from the one or more electronic components (622) disposed on the printed circuit board (621) and transferred to the first heat dissipation sheet (641) facing the printed circuit board (621) to the second heat dissipation sheet (642) spaced apart from the first heat dissipation sheet (641). The third heat dissipation sheet (643) may be configured to conduct heat generated from the speaker (631) and transferred to the second heat dissipation sheet (642) disposed under the speaker (631) to the first heat dissipation sheet (641) spaced apart from the second heat dissipation sheet (642).

[0197] According to one embodiment, the speaker (631) may include an enclosure (820) including a diaphragm (810) and a first speaker hole (821) surrounding the diaphragm (810) and providing a path for an audio signal generated from the diaphragm (810) to be transmitted to the outside of the speaker (631). The temple (603) may include a second speaker hole (851) aligned with the first speaker hole (821) and providing a path for the audio signal to be transmitted to the outside of the temple (603). The adhesive (860) may be interposed between an edge of the enclosure (820) and the side wall (611) so as to be connected to the second speaker hole (851) through the first speaker hole (821) and seal a front chamber (920) formed on a front side of the diaphragm (810).

[0198] According to one embodiment, the housing assembly (601) may further include another temple (604) rotatably connected to the rim, including another side wall (661), and supported by the other ear of the user when the head-wearable device (101, 200, 400, 600) is worn by the user. The wearable device (101, 200, 400, 600) may include a battery (651) disposed within the other temple (604). The wearable device (101, 200, 400, 600) may include a fourth heat dissipation sheet (671) facing the battery (651) and disposed on a first portion (661a) of the other side wall (661), the fourth heat dissipation sheet being configured to dissipate heat generated from the battery (651). The wearable device (101, 200, 400, 600) may include a fifth heat dissipation sheet (672) spaced apart from the fourth heat dissipation sheet (671) and disposed on a second portion (661b) of the other side wall (661). The wearable device (101, 200, 400, 600) may include another speaker (632) spaced apart from the battery (651), attached to the other side wall (661) via another adhesive (870) on the other side wall (661), and disposed on the second portion (661b) and the third portion (661c) of the other side wall (661). A portion (871) of the other adhesive (870) may be placed on a third portion (661c) of the other side wall (661) to seal the edge of the other speaker (632). The third portion (661c) of the other side wall (661) may be positioned between the first portion (661a) of the other side wall (661) and the second portion (661b) of the other side wall (661).The above wearable device (101, 200, 400, 600) may include a sixth heat dissipation sheet (673) that thermally connects the fourth heat dissipation sheet (671) and the fifth heat dissipation sheet (672). The sixth heat-radiating sheet (673) may include a first portion (673a) disposed on the other side wall (661) of the other temple (604) and in contact with the fourth heat-radiating sheet (671), a second portion (673b) disposed on the other side wall (661) of the other temple (604) and in contact with the fifth heat-radiating sheet (672), and a third portion (673c) extending from the first portion (673a) of the sixth heat-radiating sheet (673) to the second portion (673b) of the sixth heat-radiating sheet (673) and disposed within the third portion (661c) of the other side wall (661).

[0199] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0200] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0201] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0202] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0203] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0204] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0205] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0206] It should be understood that all of the embodiments and their technical features described above may be combined in various ways, as long as there is no conflict. That is, any combination of two or more of the embodiments described above is encompassed and contemplated by the present invention. One or more features of each embodiment may be incorporated into other embodiments, providing the corresponding advantages or advantages.

Claims

1. Head - In wearable devices, A housing part including a side wall, which comes into contact with a part of the user's body when the head-wearable device is worn by the user, and which supports the head-wearable device; One or more electronic components disposed within the housing part; A first heat dissipation sheet disposed on a first portion of the side wall and configured to dissipate heat generated from one or more electronic components; A second heat dissipation sheet spaced apart from the first heat dissipation sheet and disposed on a second portion of the side wall; A speaker disposed on the second portion of the side wall and the third portion of the side wall through an adhesive, the third portion of the side wall being positioned between the first portion of the side wall and the second portion of the side wall; and A third heat-radiating sheet thermally connecting the first heat-radiating sheet and the second heat-radiating sheet, the third heat-radiating sheet: A first part disposed on the side wall of the housing part and in contact with the first heat dissipation sheet; A second part disposed on the side wall of the housing part and in contact with the second heat dissipation sheet, and A third portion extending from the first portion of the third heat-radiating sheet to the second portion of the third heat-radiating sheet and disposed within the third portion of the side wall, The material forming the third heat-radiating sheet is: Different from the material forming the first heat-radiating sheet or the second heat-radiating sheet, Head - Wearable Device.

2. In paragraph 1, The above adhesive, By being spaced apart from the second heat dissipation sheet disposed on the second portion of the side wall, and attached to the side wall, Head - Wearable Device.

3. In paragraph 1 or 2, Further comprising a printed circuit board spaced apart from the speaker, on which one or more electronic components are arranged, and arranged within the housing part; The third heat dissipation sheet is, A heat transfer device configured to conduct heat generated from one or more electronic components arranged on the printed circuit board to the first heat dissipation sheet facing the printed circuit board to the second heat dissipation sheet spaced apart from the first heat dissipation sheet. Head - Wearable Device.

4. In any one of paragraphs 1 to 3, The third heat dissipation sheet is, The heat generated from the speaker is configured to be transferred to the second heat dissipation sheet disposed under the speaker, and is conducted to the first heat dissipation sheet spaced apart from the second heat dissipation sheet. Head - Wearable Device.

5. In any one of paragraphs 1 to 4, The above speaker, diaphragm, and An enclosure comprising a first speaker hole configured to surround the diaphragm and provide a path for an audio signal generated from the diaphragm to be transmitted to the outside of the speaker, The above housing part, A second speaker hole is aligned with the first speaker hole of the enclosure and configured to provide a path for the audio signal to be transmitted outside the housing part. Head - Wearable Device.

6. In paragraph 5, The above adhesive, Through the first speaker hole of the enclosure, connected to the second speaker hole, and interposed between the edge of the enclosure and the side wall to seal the front chamber formed on the front side of the diaphragm, Head - Wearable Device.

7. In any one of paragraphs 1 to 6, At least one of the front surface of the first part of the third heat-dissipating sheet or the front surface of the second part of the third heat-dissipating sheet and the side wall, located substantially on the same plane, Head - Wearable Device.

8. In any one of paragraphs 1 to 7, The first heat-dissipating sheet or the second heat-dissipating sheet, formed from graphite, The third heat dissipation sheet is, formed of metal material, Head - Wearable Device.

9. In any one of paragraphs 1 to 8, The third heat dissipation sheet is, including one or more through holes for increasing the contact area between the side wall of the housing part and the third heat dissipation sheet; Head - Wearable Device.

10. In any one of paragraphs 1 to 9, The third heat dissipation sheet is, A fourth portion extending from the first portion of the third heat-dissipating sheet to be inserted into the side wall of the housing part, and A fifth portion extending from the second portion of the third heat-radiating sheet to be inserted into the side wall of the housing part, The first part of the third heat-radiating sheet is, Located between the third part of the third heat-radiating sheet and the fourth part of the third heat-radiating sheet, The second part of the third heat-radiating sheet is, Located between the third part of the third heat-radiating sheet and the fifth part of the third heat-radiating sheet, Electronic devices.

11. In any one of paragraphs 1 to 10, The above housing part, The third part of the third heat-dissipating sheet includes a recess having a specified shape, extending from the outer surface of the housing part toward the inside of the housing part so that it is visible from the outside of the housing part, A part of the third portion corresponding to the recess, Through the above recess, visible from the outside of the housing part, Head - Wearable Device.

12. In any one of paragraphs 1 to 11, The third heat dissipation sheet is, A protrusion having a specified shape and protruding from the third part of the third heat-dissipating sheet toward the outer surface of the housing part, and exposed to the outer surface of the housing part, The protrusion of the third heat-radiating sheet is, Visible from the outside of the above housing part, Head - Wearable Device.

13. In any one of paragraphs 1 to 12, a display for displaying visual information to the user wearing the head-wearable device; and Further comprising a rim surrounding the above display, The above housing part, A temple rotatably connected to the rim and in contact with the user's ear, Head - Wearable Device.

14. In paragraph 13, The above housing part, further comprising another temple that accommodates a battery, fits into the other ear of the user, and is rotatably connected to the rim; Head - Wearable Device.

15. In any one of paragraphs 1 to 14, A portion of the first heat-radiating sheet that is in contact with the first portion of the third heat-radiating sheet, is placed on the first part of the third heat-radiating sheet, A portion of the second heat-radiating sheet in contact with the second portion of the third heat-radiating sheet, Placed on the second part of the third heat-radiating sheet, Head - Wearable Device.

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