Vehicle power amplifier device

Abstract

A vehicle power amplifier device of a vehicle audio system, comprising a cover plate, a circuit board, and a heat sink. The cover plate is fixedly connected to the heat sink, an internal space is defined between the cover plate and the heat sink, and the circuit board is arranged in the internal space. The circuit board is provided with board end connectors, the heat sink comprises a substrate, the substrate is provided with through holes for the corresponding board end connectors to pass through, the heat sink further comprises baffle plates arranged around the corresponding board end connectors, and the baffle plates and the substrate are fixedly connected or integrated. The vehicle power amplifier device of the present disclosure reduces the influence of external interference signals on the power amplifier, and also reduces the influence of the power amplifier on external electronic components.

Description

Vehicle power amplifier device Cross-reference to related applications

[0001] This application claims priority to Chinese patent application No. CN 202422182184X filed on September 6, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure belongs to the technical field of vehicle audio, and particularly relates to a vehicle power amplifier device for a vehicle audio system. BACKGROUND

[0003] In the existing automobile modification market, the modification of automobile audio occupies a large share, and a vehicle power amplifier device must be used in the modification process of vehicle audio. The vehicle power amplifier device is an audio power amplifier in a vehicle audio system. The function of the vehicle power amplifier device is to select and preprocess the audio input signal, and to perform power amplification to enable the electrical signal to have the ability to drive a speaker.

[0004] The vehicle power amplifier device generally includes a circuit board, and a board end connector is arranged on the circuit board. In the existing vehicle power amplifier device, the board end connector is generally arranged on the circuit board, and at least a part of the board end connector is exposed outside the shell of the vehicle power amplifier device, which makes the power amplifier susceptible to external interference signals, and the internal radiation of the power amplifier easily interferes with other vehicle electronic components, resulting in EMC (Electromagnetic Compatibility) exceeding the standard.

[0005] The above information disclosed in the background section is only intended to enhance the understanding of the background of the present application, and therefore it can include information that does not constitute the prior art known to those of ordinary skill in the art. SUMMARY

[0006] The present disclosure relates to a vehicle power amplifier device for a vehicle audio system, which can reduce the influence of external interference signals on the power amplifier while reducing the influence of the power amplifier on external electronic components.

[0007] One aspect of the present disclosure provides a vehicle power amplifier device for a vehicle audio system, comprising a cover plate, a circuit board and a heat sink, the cover plate and the heat sink are fixedly connected, an internal space is enclosed between the cover plate and the heat sink, and the circuit board is arranged in the internal space; wherein a board end connector is arranged on the circuit board, the heat sink comprises a base plate, a through hole is formed in the base plate for the board end connector to pass through, and the heat sink further comprises a baffle, and the board end connector is surrounded by the baffle.

[0008] In an embodiment, the baffle encloses a channel, the main body of the board end connector is located in the channel, and the end of the board end connector is exposed from the channel. Thus, most of the board end connector is located in the channel, only a small part of the board end connector is exposed from the channel, the influence of external interference signals on the power amplifier is reduced, and EMC is better.

[0009] In an embodiment, the baffle extends inwardly from the substrate, and the through hole constitutes an outlet of the channel. The end of the board end connector is exposed from the outlet.

[0010] In an embodiment, the plurality of heat dissipation fins of the heat sink extend outwardly from the substrate.

[0011] In an embodiment, the length of the board end connector extending to the outside of the substrate is less than the length of the heat dissipation fin extending outwardly relative to the substrate.

[0012] In an embodiment, the baffle is fixedly connected to the substrate; or, the baffle and the substrate are one integral part.

[0013] In an embodiment, the baffle continuously surrounds the board end connector. Thus, the influence of external interference signals on the power amplifier can be greatly reduced.

[0014] In an embodiment, the gap between the baffle and the board end connector is less than 0.5 mm. The smaller gap between the baffle and the board end connector can effectively reduce the influence of external interference signals on the power amplifier and reduce the influence of the power amplifier on external electronic components.

[0015] In an embodiment, the board end connector is fixed to the circuit board for accessing the audio source signal of the vehicle audio system and electrically connected to the vehicle loudspeaker.

[0016] In an embodiment, the vehicle power amplifier device includes a plurality of the board end connectors, a first board end connector of the plurality of the board end connectors is configured to be electrically connected to the host of the vehicle audio system or the vehicle control to receive the audio source signal, and a second board end connector of the plurality of the board end connectors is configured to be electrically connected to the vehicle loudspeaker (speaker voice coil) in the vehicle.

[0017] In an embodiment, the heat sink includes a plurality of heat dissipation fins extending outwardly from the substrate, and the heat dissipation fins are used to dissipate heat for the circuit board and components (such as the power amplifier) thereon.

[0018] In an embodiment, the length of the board end connector extending to the outside of the substrate is less than the length of the heat dissipation fin extending outwardly relative to the substrate.

[0019] In an embodiment, the heat sink has an inner cavity, and the heat sink further comprises a plurality of limiting posts arranged in the inner cavity, one end of the limiting posts being connected to the base plate, and the other end of the limiting posts extending inwardly and contacting or opposing the circuit board.

[0020] In an embodiment, the cover plate, the circuit board and the base plate are fixed by screws, and the circuit board is entirely enclosed in the inner space.

[0021] In an embodiment, the base plate and the baffle plate are integrally punched from a metal or alloy plate. The metal or alloy plate can be a copper plate, an aluminum plate, a copper alloy plate or an aluminum alloy plate.

[0022] In an embodiment, the heat sink is a single integral metal or alloy part. The metal or alloy part can be a copper part, an aluminum part, a copper alloy part or an aluminum alloy part.

[0023] The above scheme has the following advantages:

[0024] The vehicle-mounted power amplifier device of the present disclosure has the following advantages: BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the present disclosure, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained according to these drawings without creative labor.

[0026] Fig. 1 is a schematic diagram of a vehicle-mounted power amplifier device according to an embodiment of the present disclosure;

[0027] Fig. 2 is a sectional view along the direction A-A in Fig. 1;

[0028] Fig. 3 is an exploded schematic diagram of the vehicle-mounted power amplifier device;

[0029] Fig. 4 is a schematic diagram of a heat sink.

[0030] In the drawings,

[0031] 1 - cover plate;

[0032] 2 - circuit board; 21 - board end connector;

[0033] 3 - heat sink; 31 - base plate; 311 - through hole; 32 - baffle; 321 - channel; 33 - heat dissipation fin; 34 - inner cavity; 341 - limiting column;

[0034] 4 - inner space; 5 - screw. DETAILED DESCRIPTION

[0035] The preferred embodiments of the present disclosure will be described in detail below with reference to the drawings, so that the advantages and features of the present disclosure can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is intended to help understand the present disclosure, but does not constitute a limitation on the present disclosure. In addition, the technical features involved in the various embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other.

[0036] In this article, "inner" and "outer" are defined with reference to the internal space enclosed between the cover plate and the heat sink, with the orientation towards the internal space as the inner, and vice versa. The orientation words "front", "back", "up" and "down" are intended to facilitate the understanding of the structure of the vehicle warning device by those skilled in the art, and are not used to limit the orientation of the vehicle amplifier device after installation (for example, installed in the vehicle).

[0037] The drawings of FIGS. 1-4 are drawn to true scale, and in order to maintain the brevity of the specification, the proportions of the various elements are not listed one by one, but the proportions and positions of the various elements should be considered as part of the content of this specification.

[0038] The existing vehicle amplifier device includes a circuit board and a board end connector provided on the circuit board, which is completely exposed on the circuit board, which inevitably has some drawbacks, such as the power amplifier being easily affected by external interference signals, the internal radiation of the power amplifier easily interfering with other vehicle electronic components, leading to EMC exceeding the standard, dust and other particulate matter easily entering the power amplifier, affecting the service life of components, etc.

[0039] Referring to FIGS. 1-4, the present embodiment provides a vehicle amplifier device for a vehicle audio system, which includes a cover plate 1, a circuit board 2 and a heat sink 3, the circuit board 2 being located between the cover plate 1 and the heat sink 3.

[0040] Further, the heat sink 3 includes a base plate 31, and the cover plate 1, the circuit board 2 and the base plate 31 are fixedly connected, specifically, the cover plate 1, the circuit board 2 and the base plate 31 are fixedly connected by a plurality of screws 5. An inner space 4 is enclosed between the cover plate 1 and the heat sink 3, and the circuit board 2 is arranged in the inner space 4, further, the circuit board 2 is entirely enclosed in the inner space 4, which can reduce the risk of small particulate matter entering the power amplifier, increase the contact area between the heat sink 3 and the circuit board 2, improve the heat dissipation effect, and also enhance the support of the heat sink 3 to the circuit board 2, so that the circuit board 2 is not easily deformed.

[0041] The circuit board 2 is provided with a board end connector 21. The board end connector provided on the circuit board serves to connect the circuit on the circuit board with external devices or components, thereby improving the connection efficiency. In the embodiment, the board end connector 21 is fixed on the circuit board 2 for electrically connecting the audio source signal of the vehicle-mounted audio system and the vehicle-mounted speaker. The circuit board 2 can further be provided with one or more power amplifiers, and the input end and the output end of the one or more power amplifiers are respectively provided with one of the board end connectors 21.

[0042] The number of the board end connectors 21 is multiple, and the first board end connector 21 is configured to be electrically connected with the host of the vehicle-mounted audio system or the vehicle-mounted control device to receive the audio source signal, such as a music signal. The second board end connector 21 is connected with the voice coil of the vehicle-mounted speaker, and the audio source signal amplified by the power amplifier is selectively fed to each vehicle-mounted speaker to realize sound playback on the vehicle. In the embodiment, as shown in FIG. 4, the number of the board end connectors 21 is two, one of which is connected with the audio source signal of the vehicle-mounted audio system, and the other of which is connected with the vehicle-mounted speaker, and the audio source signal is transmitted to the vehicle-mounted speaker after being amplified and is emitted by the vehicle-mounted speaker.

[0043] [Corrected according to Rule 91 on 23.04.2025] As shown in FIGS. 3 and 4, the heat sink 3 includes a baffle 32 and a plurality of heat dissipation fins 33 extending outward from the base plate 31. The plurality of heat dissipation fins 33 are arranged side by side and spaced apart, and a heat dissipation channel is formed between two adjacent heat dissipation fins 33. Further, the base plate 31 is provided with through holes 311 for the board end connectors 21 to pass through, and the number of the through holes 311 corresponds to the number of the board end connectors 21, i.e., the number of the through holes 311 is two. The baffle 32 is fixedly connected with or integrally provided with the base plate 31. In the embodiment, the baffle 32 and the base plate 31 are integrally provided, and in other embodiments, the baffle 32 and the base plate 31 can be fixedly connected.

[0044] Further, the baffle 32 is arranged around the board end connector 21. More specifically, the baffle 32 continuously surrounds the board end connector 21 for one turn. The baffle 32 encloses a channel 321, and when the circuit board 2 is installed on the heat sink 3, the main body part of the board end connector 21 is located in the channel 321, and the end of the board end connector 21 is exposed from the channel 321, i.e., most of the board end connector is located in the channel, and only a small part of the board end connector is exposed from the channel 321, which can effectively reduce the influence of external interference signals on the power amplifier.

[0045] The length of the board end connector 21 extending to the outside of the substrate 31 is less than the length of the heat dissipation fins 33 extending outwardly relative to the substrate 31, the main body part of the board end connector 21 is shielded by the baffle 32 and is not completely exposed on the circuit board 2, which can reduce the influence of external interference signals on the power amplifier. The gap between the baffle 32 and the board end connector 21 is less than 0.5 mm, the connection between the baffle 32 and the board end connector 21 is relatively tight, and the anti-interference ability is relatively strong. The baffle 32 extends inwardly from the substrate 31, the through hole 311 forms an outlet of the channel 321, and the main body part of the board end connector 21 is located in the channel, and only the tail end is exposed from the outlet of the channel. Not only can it reduce the influence of external interference signals on the power amplifier, but also can reduce the influence of the power amplifier on external electronic components.

[0046] The heat sink 3 is a single integrated metal or alloy part. The inwardly extending baffle 32 and the outwardly extending heat dissipation fins 33 are formed by stamping, punching and other processes. The metal or alloy can be copper, plate, copper alloy or aluminum alloy. Preferably, the entire heat sink 3 is a single copper alloy part.

[0047] The heat sink 3 has an inner cavity 34, and the heat sink 3 further comprises a plurality of limiting columns 341 arranged in the inner cavity 34, and the number of the limiting columns 341 is two. One end of each limiting column 341 is connected to the substrate 31, and the other end of the limiting column 341 extends inwardly and contacts or opposes the circuit board 2. When the circuit board 2 is installed in the inner cavity 34 of the heat sink 3, the limiting column 341 can effectively play a limiting and positioning role.

[0048] The vehicle-mounted power amplifier device of the embodiment is assembled by first placing the circuit board 2 into the inner cavity 34 of the heat sink 3 through the limiting column 341, then placing the board end connector 21 on the circuit board 2 into the channel 321, and then placing the cover plate 1 on the circuit board 2, and finally fixing and connecting the cover plate 1, the circuit board 2 and the substrate 31 through the plurality of screws 5.

[0049] The cover plate 1 and the heat sink 3 form an internal space 4, and the circuit board 2 is entirely enclosed in the internal space 4. The main body part of the board end connector 21 on the circuit board 2 is arranged in the channel 321 surrounded by the baffle 32, and the tail end is exposed from the through hole 311. Compared with the heat sink arranged on the circuit board in the prior art, the entire board end connector is directly exposed on the circuit board, which can greatly reduce the influence of external interference signals on the power amplifier.

[0050] The vehicle-mounted power amplifier device of the embodiment has at least the following advantages:

[0051] (1) Reduce the influence of external interference signals on the power amplifier; (2) Reduce the influence of the power amplifier on external electronic components; (3) Reduce the risk of small particles entering the interior of the power amplifier; (4) Increase the grounding area of the power amplifier; (5) Enhance the support of the heat sink to the circuit board, so that the circuit board is not easily deformed; (6) Increase the contact area of the heat sink and the circuit board, so that the heat dissipation effect is improved.

[0052] Features of embodiments of the present disclosure are set forth in the following clauses:

[0053] Clause 1. An in-vehicle power amplifier of an in-vehicle audio system, comprising a cover plate, a circuit board and a heat sink, the cover plate and the heat sink are fixedly connected, an internal space is enclosed between the cover plate and the heat sink, and the circuit board is arranged in the internal space; wherein the circuit board is provided with a board end connector, the heat sink comprises a base plate, a through hole is formed in the base plate for the board end connector to pass through, and the heat sink further comprises a baffle arranged around the board end connector, and the baffle is fixedly connected with the base plate or is integrated with the base plate.

[0054] Clause 2. The in-vehicle power amplifier according to clause 1, wherein the baffle encloses a channel, a main body portion of the board end connector is located in the channel, and an end of the board end connector is exposed from the channel.

[0055] Clause 3. The in-vehicle power amplifier according to clause 2, wherein the baffle extends inwardly from the base plate, and the through hole constitutes an outlet of the channel.

[0056] Clause 4. The in-vehicle power amplifier according to clause 1, wherein the baffle continuously surrounds the board end connector for one round.

[0057] Clause 5. The in-vehicle power amplifier according to clause 1, wherein a gap between the baffle and the board end connector is less than 0.5 mm.

[0058] Clause 6. The in-vehicle power amplifier according to clause 1, wherein the board end connector is fixed to the circuit board for accessing a sound source signal of the in-vehicle audio system and electrically connecting with in-vehicle loudspeakers.

[0059] Clause 7. The in-vehicle power amplifier according to clause 1, wherein the heat sink comprises a plurality of heat dissipation fins extending outwardly from the base plate.

[0060] Clause 8. The in-vehicle power amplifier according to clause 7, wherein a length of the board end connector extending to an outside of the base plate is less than a length of the heat dissipation fins.

[0061] Clause 9. The vehicle-mounted power amplifier of clause 1, wherein the heat sink has an inner cavity, and the heat sink further comprises a plurality of limiting posts arranged in the inner cavity, one end of the limiting posts is connected to the base plate, and the other end of the limiting posts extends inward and contacts or opposes the circuit board.

[0062] Clause 10. The vehicle-mounted power amplifier of clause 1, wherein the cover plate, the circuit board and the base plate are fixed by screws, and the circuit board is entirely enclosed in the inner space.

[0063] As shown in the specification and claims, the term "comprising" and "including" only indicates the inclusion of the steps and elements explicitly stated, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0064] As understood by those skilled in the art, the singular forms "a", "an" and "the" as used herein are intended to include the plural forms as well, unless otherwise specifically stated. It will be further understood that "a plurality of" means two or more, and other quantifiers like "multiple" have a similar meaning.

[0065] It will be further understood that the terms "first", "second", and the like, are used to describe various information, but these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a specific order or importance. In fact, the expressions "first", "second", etc. can be used interchangeably. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information, without departing from the scope of the present disclosure.

[0066] In the present disclosure, unless otherwise specifically stated and limited, "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. "Below", "under" and "underneath" of a first feature to a second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0067] The above embodiments are only for illustrating the technical concepts and characteristics of the present disclosure, and are a preferred embodiment, the purpose of which is to enable those skilled in the art to understand the content of the present disclosure and implement it, and cannot limit the protection scope of the present disclosure.

Claims

1. A vehicle-mounted power amplifier device comprising a cover plate, a circuit board and a heat sink, wherein, The cover plate and the heat sink are fixedly connected, an internal space is enclosed between the cover plate and the heat sink, and the circuit board is arranged in the internal space. The circuit board is provided with a board end connector, the heat sink includes a base plate, a through hole is formed in the base plate for the board end connector to pass through, and the heat sink further includes a baffle, and the board end connector is surrounded by the baffle.

2. The in-vehicle power amplifier device according to claim 1, characterized by, The baffle encloses a channel, a main body part of the board end connector is located in the channel, and an end of the board end connector is exposed from the channel.

3. The in-vehicle power amplifier device according to claim 2, characterized by, The baffle extends inwardly from the base plate, and the through hole constitutes an outlet of the channel.

4. The in-vehicle power amplifier device according to claim 3, characterized by, A plurality of heat dissipation fins of the heat sink extend outwardly from the base plate.

5. The in-vehicle power amplifier device according to claim 4, characterized by, A length of the board end connector extending to an outside of the base plate is less than a length of the heat dissipation fins extending outwardly relative to the base plate.

6. The car-mounted power amplifier device according to any one of the preceding claims, characterized by, The baffle is fixedly connected to the base plate, or the baffle and the base plate are an integral part.

7. The car-mounted power amplifier device according to any one of the preceding claims, characterized by, The baffle continuously surrounds the board end connector.

8. The car-mounted power amplifier device according to any one of the preceding claims, characterized by, A gap between the baffle and the board end connector is less than 0.5 mm.

9. The car-mounted power amplifier device according to any one of the preceding claims, characterized by, The board end connector is fixed to the circuit board for accessing a sound source signal of a vehicle-mounted audio system or being electrically connected with a vehicle-mounted loudspeaker.

10. The in-vehicle power amplifier device according to claim 9, wherein The vehicle-mounted power amplifier device includes a plurality of the board end connectors, a first board end connector of the plurality of board end connectors is configured to be electrically connected with a host of a vehicle-mounted audio system or a vehicle-mounted control device to receive a sound source signal, and a second board end connector of the plurality of board end connectors is configured to be electrically connected with a vehicle-mounted loudspeaker in a vehicle.

11. The in-vehicle power amplifier apparatus according to any one of claims, characterized by, The heat sink has an inner cavity, and the heat sink further includes a plurality of limiting columns arranged in the inner cavity, one end of the limiting column is connected to the base plate, and the other end of the limiting column extends inwardly and is in contact with or opposite to the circuit board.

12. The car-mounted power amplifier device according to any preceding claim, characterized by, The cover plate, the circuit board and the base plate are fixed by screws, and the circuit board is entirely enclosed in the internal space.

13. The car-mounted power amplifier device according to any one of the preceding claims, characterized by, The base plate and the baffle are integrally stamped from a metal or alloy plate.

14. The car-mounted power amplifier device according to any one of the preceding claims, characterized by, The heat sink is a single integral metal or alloy part.

Images