Display module and display device

Abstract

The present disclosure relates to a display module. The display module comprises a display panel, a chip on film, and a flexible circuit board; the display panel is connected to the flexible circuit board by means of the chip on film; a first end of the display panel is bent such that the chip on film is located on the back surface of the display panel; one end of the chip on film is bent such that the flexible circuit board is located on the side of the chip on film away from the display panel; the display module further comprises a heat dissipation film layer provided on the back surface of the display panel; the heat dissipation film layer comprises a metal layer; the metal layer comprises a main body region; the main body region comprises a first edge region; the orthographic projection of a first binding region on the heat dissipation film layer is at least partially located in the first edge region; the main body region comprises a second edge region other than the first edge region; the metal layer further comprises a connecting portion formed by extending outward at least part of the second edge region; and the connecting portion is electrically connected to the flexible circuit board. The present disclosure further relates to a display device.

Description

Display module and display device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411254468.3, filed on September 6, 2024, the contents of which are incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of display product manufacturing, and in particular to a display device. BACKGROUND

[0004] Due to high-specification reliability requirements for vehicle-mounted applications, vehicle-mounted OLED small-size module designs often encounter module size limitations, making it difficult to accommodate COF (Chip On Film) and FPC (Flexible Printed Circuit) flat arrangement, which requires a reverse COF to achieve, involving multiple bending operations, and the COF separates the FPC from the module BKT (support structure on the back of the display module), making it impossible to directly use a large-area adhesive on the back of the FPC to achieve FPC fixation and grounding. SUMMARY

[0005] To solve the above technical problems, the present disclosure provides a display module and a display device to solve the problem of grounding difficulty of the flexible printed circuit in a small-size module.

[0006] To achieve the above purpose, the technical solution adopted by the embodiments of the present disclosure is as follows: a display module, comprising a display panel, a chip on film, and a flexible printed circuit, the display panel is connected with the flexible printed circuit through the chip on film, in a first direction, the display panel has a display area and a first binding area located on one side of the display area, the first binding area is bent to the back of the display panel;

[0007] In the first direction, the chip on film comprises a second binding area and a third binding area arranged oppositely, the second binding area is connected with the first binding area, and the chip on film is located on the back of the display panel;

[0008] The third binding area is bent to the side of the chip on film away from the display panel, the flexible printed circuit is connected with the third binding area, and the flexible printed circuit is located on the side of the chip on film away from the display panel;

[0009] The display module further comprises a heat dissipation film layer arranged on the back of the display panel, the heat dissipation film layer comprises a metal layer, the metal layer comprises a main body area, the main body area comprises a first edge area, a normal projection of the first binding area on the heat dissipation film layer is at least partially located in the first edge area, along the circumferential direction of the main body area, the main body area comprises a second edge area in addition to the first edge area, the metal layer further comprises a connecting portion formed by extending outward from at least part of the second edge area, the connecting portion is bent to the side of the metal layer away from the display panel to be electrically connected with the flexible circuit board.

[0010] Optionally, the connecting portion is electrically connected with the copper exposed area of the flexible circuit board close to the one side of the display panel, or the connecting portion is electrically connected with the copper exposed area of the flexible circuit board away from the one side of the display panel.

[0011] Optionally, at least one side of the flexible circuit board comprises a first area exposed to the arrangement of the chip on film in the second direction, the second direction is perpendicular to the first direction, and the second direction is parallel to the light emitting surface of the display panel.

[0012] An adhesive layer is arranged between the first area and the metal layer, and the adhesive force of the adhesive layer is >6000gf / inch.

[0013] Optionally, the adhesive layer uses VHB glue.

[0014] Optionally,

[0015] The main body area is rectangular, the second edge area comprises a first sub-edge area arranged opposite to the first edge area, and a second sub-edge area and a third sub-edge area arranged adjacent to the first edge area, the first edge area and the first sub-edge area are arranged opposite to each other in the first direction, and the second sub-edge area and the third sub-edge area are arranged opposite to each other in the second direction.

[0016] At least part of the second sub-edge area and / or at least part of the third sub-edge area extend outward to form the connecting portion.

[0017] Optionally, the connecting portion comprises a first connecting area for electrical connection with the flexible circuit board, the area of the first connecting area is smaller than the area of the adhesive surface of the adhesive layer and the flexible circuit board, and the first connecting area is crimped to the one side of the flexible circuit board close to the display panel under the adhesive action of the adhesive layer.

[0018] Optionally, the connecting portion includes a first connecting area for electrical connection with the flexible circuit board, the first connecting area being electrically connected to the side of the flexible circuit board away from the display panel via conductive adhesive.

[0019] Optionally, a bending area is further provided between the main body area and the connecting part, and a hollow pattern is provided on the bending area.

[0020] Optionally, the main body area is rectangular, and the second edge area includes a first sub-edge area disposed opposite to the first edge area, and a second sub-edge area and a third sub-edge area disposed adjacent to the first edge area. In the first direction, the first edge area and the first sub-edge area are disposed opposite to each other, and in the second direction, the second sub-edge area and the third sub-edge area are disposed opposite to each other.

[0021] At least a portion of the first sub-edge region extends outward to form the connecting portion.

[0022] Optionally, the main body area is rectangular, and the second edge area includes a first sub-edge area disposed opposite to the first edge area, and a second sub-edge area and a third sub-edge area disposed adjacent to the first edge area. In the first direction, the first edge area and the first sub-edge area are disposed opposite to each other, and in the second direction, the second sub-edge area and the third sub-edge area are disposed opposite to each other.

[0023] The connection portion is formed by extending at least a portion of the first sub-edge region outward, and by extending at least a portion of the second sub-edge region and / or at least a portion of the third sub-edge region outward.

[0024] Optionally, the area of ​​the display area is approximately the same as the area of ​​the flexible circuit board.

[0025] This disclosure also provides a display device, including the display module described above.

[0026] Optionally, the display module is applied to a vehicle steering wheel.

[0027] The beneficial effects of this disclosure are: the display module further includes a heat dissipation film layer disposed on the back of the display panel, the heat dissipation film layer includes a metal layer, and the grounding of the flexible circuit board is achieved by extending a local area of ​​the metal layer outward and electrically connecting it with the exposed copper area on the flexible circuit board. Attached Figure Description

[0028] Figure 1 shows a schematic diagram of a display module in the related technology;

[0029] Figure 2 shows a schematic diagram of a display module in the related technology;

[0030] FIG. 3 shows a schematic diagram of a display module in an embodiment of the present disclosure;

[0031] FIG. 4 shows a schematic diagram of a display module in an embodiment of the present disclosure;

[0032] FIG. 5 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure;

[0033] FIG. 6 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure;

[0034] FIG. 7 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure;

[0035] FIG. 8 shows a schematic diagram of a display module in an embodiment of the present disclosure;

[0036] FIG. 9 shows a schematic diagram of a display module in an embodiment of the present disclosure;

[0037] FIG. 10 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure;

[0038] FIG. 11 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure;

[0039] FIG. 12 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure;

[0040] FIG. 13 shows a schematic diagram of a display module in an embodiment of the present disclosure;

[0041] FIG. 14 shows a schematic diagram of a display module in an embodiment of the present disclosure;

[0042] FIG. 15 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure;

[0043] FIG. 16 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure;

[0044] FIG. 17 shows a schematic diagram of a heat dissipation film layer in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0045] In order to make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of the present disclosure.

[0046] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms "first", "second", and similar terms are used herein merely to distinguish one element from another, and are not intended to imply any order or sequence. Also, the terms "a", "an", or "the" are not limited, even if the article "the" is used in association with the term, unless otherwise defined. The terms "comprises", "comprising", or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. The terms "connected" or "coupled" are not limited to direct connections or physical connections, but can include indirect connections or physical connections, such as electrical connections, whether direct or indirect, and whether or not between devices or components.

[0047] The terms "parallel", "perpendicular", and "identical" as used in the present disclosure include the strict meanings of "parallel", "perpendicular", and "identical", as well as "approximately parallel", "approximately perpendicular", "approximately identical" and the like, which include a certain tolerance, and are intended to mean within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art, taking into account measurement and tolerances associated with measurement of the particular quantity (e.g., limitations of a measurement system). For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0048] The traditional cognitive vehicle-mounted OLED screen is mainly applied to large-size platforms such as central control instrument entertainment, and there is relatively sufficient space for the arrangement of PCB / FPC / COF circuit structures, and there is usually no grounding difficulty problem; for individual small-size (less than 3 inch) space shortage cases (main application scenarios are steering wheel finger screen, gear lever screen, boss key screen, etc.), the traditional scheme is to use a conductive adhesive 4 to bond a flexible circuit board 3, but due to multiple bending, there is a high rebound force (300 g), (the display panel 1 and the chip on film 2 are bound and connected, the other end of the chip on film 2 is bound and connected with the flexible circuit board 3, and the binding area of the display panel 1 is bent to the backlight side of the display panel 1, so that the chip on film 2 is located on the backlight side of the display panel 1, and the binding area of the chip on film 2 is bent to the side away from the display panel 1, so that the flexible circuit board 3 is stacked on the side away from the display panel 1 of the chip on film 2), and the conductive adhesive 4 needs to have the property of conductivity, so it is difficult to achieve a relatively high level of bonding performance (<3000 gf / inch), and the bonding area is small, and there is a high peeling risk in the vehicle high-temperature environment; as shown in FIG. 1 and FIG. 2, the small-size vehicle-mounted OLED screen multiple bending structure uses conductive adhesive as the assembly and static electricity conduction structure, the display panel is connected with the flexible circuit board through the chip on film, and the flexible circuit board is connected to the back of the display panel through the conductive adhesive layer, and the blue arrow in FIG. 2 represents a position where peeling risk is prone to occur. Under the rebound action of the chip on film bending area, the conductive adhesive layer and the display panel are prone to peeling risk.

[0049] Referring to FIGS. 3-17, to solve the above problems, the present embodiment provides a display module, comprising a display panel 1, a chip on film 2 and a flexible circuit board 3,

[0050] In the first direction (X direction in FIG. 3), the display panel 1 has a display area and a first binding area 11 located on one side of the display area, and the first binding area 11 is bent to the back of the display panel 1;

[0051] In the first direction, the chip on film 2 comprises a second binding area 21 and a third binding area 22 arranged oppositely, the second binding area 21 is connected with the first binding area 11, and the chip on film 2 is located on the back of the display panel 1;

[0052] The third binding area 22 is bent to the side away from the display panel 1 of the chip on film 2, the flexible circuit board 3 is connected with the third binding area 22, and the flexible circuit board 3 is located on the side away from the display panel 1 of the chip on film 2;

[0053] The display module further comprises a heat dissipation film layer arranged on the back of the display panel 1, the heat dissipation film layer comprises a metal layer, the metal layer comprises a main body area 51, the main body area 51 comprises a first edge area 501, the first binding area 11 is at least partially located on the first edge area 501 in the orthographic projection of the heat dissipation film layer, along the circumferential direction of the main body area 51, the main body area 51 comprises a second edge area in addition to the first edge area 501, the metal layer further comprises a connecting part 52 formed by extending outwardly from at least part of the second edge area, the connecting part 52 is bent to the side of the metal layer away from the display panel 1 to be electrically connected with the flexible circuit board 3. By using the above scheme, in the embodiment, the metal layer in the heat dissipation film layer is partially outwardly expanded, and the connecting part 52 formed by outward expansion is bent to the side of the metal layer away from the display panel 1 to be electrically connected with the flexible circuit board 3 to realize grounding, thereby solving the problem of grounding difficulty of the flexible circuit board 3 in a small-size module.

[0054] Illustratively, the metal layer is a copper foil, which has the characteristics of ultra-thin (thickness of 0.03-0.1 mm) and plasticity, and the copper foil will be plastically deformed after bending, and the rebound force can be ignored.

[0055] It should be noted that the cross section (cross section in the direction parallel to the light-emitting surface of the display panel) shape of the whole display module can be regular or irregular, for example, polygon, circle, etc., and the cross section (cross section in the direction parallel to the light-emitting surface of the display panel) shape of the whole display module can also be irregular. The shape of the metal layer, the shape of the flexible circuit board 3, etc. are consistent with the shape of the whole display module, for example, the cross section of the display module is rectangular, and the first edge area is an edge area arranged close to one side of the rectangle.

[0056] In an exemplary embodiment, the connecting part 52 is electrically connected with the copper-exposed area on the side of the flexible circuit board 3 close to the display panel 1, or the connecting part 52 is electrically connected with the copper-exposed area on the side of the flexible circuit board 3 away from the display panel 1.

[0057] In an exemplary embodiment, in the first direction (X direction in reference to FIG. 3), the opposite ends of the chip on film 2 are respectively bound and connected with the display panel 1 and the flexible circuit board 3, in the second direction (Y direction in reference to FIG. 3), at least one side of the flexible circuit board 3 comprises a first area 31 exposed to the chip on film 2 (reference to FIG. 3), the second direction is perpendicular to the first direction, and the second direction is parallel to the display surface of the display panel 1.

[0058] An adhesive layer 4 is arranged between the first area 31 and the metal layer, and the adhesive force of the adhesive layer 4 is greater than 6000 gf / inch.

[0059] In the related art, in order to realize the grounding of the flexible circuit board 3, the flexible circuit board 3 needs to be connected with the support structure on the back of the display panel 1 through conductive adhesive. However, for a small-size display module, there is insufficient space, and after multiple bending settings, the connection area of the flexible circuit board 3 and the conductive adhesive is limited. In addition, due to the conductive property of the conductive adhesive, the adhesive force is insufficient, and peeling phenomenon is prone to occur. In the embodiment, the metal layer is arranged to be extended outward to realize grounding conduction with the flexible circuit board 3. The fixing of the flexible circuit board 3 can select an adhesive layer 4 with relatively strong adhesive force. The adhesive layer 4 can not need to have conductive property, thereby enhancing the connection stability of the flexible circuit board 3.

[0060] In an exemplary embodiment, the adhesive layer 4 adopts VHB (Very High Bond) adhesive with high adhesive force, but is not limited thereto.

[0061] In an exemplary embodiment, the main area 51 is rectangular, the second edge area includes a first sub-edge area 504 arranged opposite to the first edge area 501, and a second sub-edge area 502 and a third sub-edge area 503 arranged adjacent to the first edge area 501. In the first direction, the first edge area 501 and the first sub-edge area 504 are arranged opposite to each other, and in the second direction, the second sub-edge area 502 and the third sub-edge area 503 are arranged opposite to each other.

[0062] At least part of the second sub-edge area 502 and / or at least part of the third sub-edge area 503 extend outward to form the connecting part 52.

[0063] In FIGS. 3-12, the second sub-edge area 502 and the third sub-edge area 503 are both provided with the connecting part 52 to ensure the grounding stability of the flexible circuit board 3.

[0064] In an exemplary embodiment, the connecting part 52 includes a first connecting area 521 (refer to the area in the dashed line box in FIGS. 10 and 15) for electrical connection with the flexible circuit board 3. The area of the first connecting area 521 is smaller than the area of the adhesive surface of the adhesive layer 4 and the flexible circuit board 3. Under the adhesive action of the adhesive layer 4 and the flexible circuit board 3, the first connecting area 521 is crimped on one side of the flexible circuit board 3 close to the display panel 1.

[0065] The adhesive layer 4 is made of a material with high adhesive force to enhance the connection stability of the flexible circuit board 3. In this case, the first connection area 521 is located between the flexible circuit board 3 and the adhesive layer 4, and the area of the first connection area 521 is smaller than the area of the adhesive surface of the adhesive layer 4 and the flexible circuit board 3. Therefore, no additional conductive adhesive is needed between the first connection area 521 and the flexible circuit board 3. Under the adhesive action of the adhesive layer 4 and the flexible circuit board 3, the first connection area 521 is pressed against the side of the flexible circuit board 3 close to the display panel 1, thereby realizing the electrical connection between the first connection area and the exposed copper area of the flexible circuit board 3.

[0066] For example, the connection part 52 is formed by extending outward from a part of the corresponding second sub-edge area 502 (i.e., in the first direction, the length of the connection part 52 is less than or equal to the length of the second sub-edge area 502), and / or the connection part 52 is formed by extending outward from a part of the corresponding third sub-edge area 503 (i.e., in the first direction, the length of the connection part 52 is less than or equal to the length of the third sub-edge area 503), which facilitates the bending of the connection part 52.

[0067] In an exemplary embodiment, the connection part 52 includes a first connection area 521 for electrical connection with the flexible circuit board 3. The first connection area 521 is electrically connected to the side of the flexible circuit board 3 away from the display panel 1 through conductive adhesive.

[0068] It should be noted that, since the connection part 52 is formed by extending part of the metal layer, the connection part 52 is bent to achieve connection with the flexible circuit board 3. The bending of the connection part 52 is plastic deformation, and the rebound force is negligible. Therefore, the conductive adhesive between the first connection area and the flexible circuit board 3 does not need to be specially selected to have strong adhesion, and peeling problem will not occur.

[0069] In an exemplary embodiment, a bending area is further provided between the main body area 51 and the connection part 52. The bending area is located between the main body area 51 and the first connection area 521. Under the action of the bending area, the first connection area 521 is located on the side of the main body area 51 away from the display panel 1. The bending area is provided with a hollow pattern 5001.

[0070] The hollow pattern 5001 can have various specific structural forms. For example, it can be a plurality of hollow holes arranged at intervals. The shape of the hollow hole can be regular or irregular geometric shapes, such as square, circular, etc., which are not limited herein.

[0071] In an exemplary embodiment, the main body region is rectangular, the second edge region includes a first sub-edge region 504 opposite to the first edge region 501, and a second sub-edge region 502 and a third sub-edge region 503 adjacent to the first edge region 501, the first edge region 501 and the first sub-edge region 504 are opposite to each other in the first direction, and the second sub-edge region 502 and the third sub-edge region 503 are opposite to each other in the second direction.

[0072] At least part of the first sub-edge region 504 extends outward to form the connecting portion 52.

[0073] The connecting portion 52 is arranged in the first sub-edge region 504, which can effectively shield the exposed part of the bending region of the chip-on-film 2, and achieve good EMI (electromagnetic interference) shielding function.

[0074] It should be noted that the bending region between the connecting portion 52 arranged in the second sub-edge region 502 and the main body region 51, and the bending region between the connecting portion 52 arranged in the third sub-edge region 503 and the main body region 51 can be provided with a hollow pattern 5001 (see FIGS. 3 and 5), or can not be provided with a hollow pattern (see FIGS. 8 and 13). The bending region between the connecting portion 52 arranged in the first sub-edge region 504 and the main body region 51 is not provided with a hollow pattern, and is a solid structure as a whole (see FIG. 13), so as to effectively shield the exposed part of the bending region 23 (see FIG. 4) of the chip-on-film 2.

[0075] In an exemplary embodiment, the main body region is rectangular, the second edge region includes a first sub-edge region 504 opposite to the first edge region 501, and a second sub-edge region 502 and a third sub-edge region 503 adjacent to the first edge region 501, the first edge region 501 and the first sub-edge region 504 are opposite to each other in the first direction, and the second sub-edge region 502 and the third sub-edge region 503 are opposite to each other in the second direction.

[0076] At least part of the first sub-edge region 504 extends outward to form the connecting portion 52.

[0077] In an exemplary embodiment, the main body area 51 is rectangular, the second edge area includes a first sub-edge area 504 disposed opposite to the first edge area 501, and a second sub-edge area 502 and a third sub-edge area 503 disposed adjacent to the first edge area 501, the first edge area 501 and the first sub-edge area 504 are disposed opposite in the first direction, and the second sub-edge area 502 and the third sub-edge area 503 are disposed opposite in the second direction;

[0078] At least part of the first sub-edge area 504 extends outward to form the connecting portion 52, and at least part of the second sub-edge area 502 and / or at least part of the third sub-edge area 503 extend outward to form the connecting portion 52.

[0079] At least part of the second sub-edge area 502 and at least part of the third sub-edge area 503 extend to form the connecting portion 52, and at least part of the first sub-edge area 504 extends to form the connecting portion 52, as shown in FIGS. 13-17.

[0080] In an exemplary embodiment, in the first direction, the display panel 1 includes a display area and a first binding area 11 located on one side of the display area, and the area of the display area is substantially the same as the area of the flexible circuit board 3.

[0081] It should be noted that the display module in the present embodiment is a small-size display module, and the area of the display area is substantially the same as the area of the flexible circuit board 3, including a certain tolerance, within the acceptable deviation range for a specific value determined by those skilled in the art.

[0082] The display module includes a display panel 1, a chip-on-film 2, and a flexible circuit board 3, the display panel 1 performs signal transmission with the flexible circuit board 3 through the chip-on-film 2, the display module in the present embodiment is a small-size display module, the binding area of the display panel 1 is bent to the back of the display panel 1, the chip-on-film 2 is bound and connected with the display panel 1, and the binding area of the chip-on-film 2 for binding with the flexible circuit board 3 is bent to the side of the chip-on-film 2 away from the display panel 1, and the flexible circuit board 3 is located on the side of the chip-on-film 2 away from the display panel 1;

[0083] The back of the display panel 1 is provided with a heat dissipation film layer, the heat dissipation film layer comprises a metal layer, the metal layer comprises a main body area 51, the main body area 51 comprises a first edge area 501, the first binding area is at least partially located on the first edge area 501 in the orthographic projection of the heat dissipation film layer, along the circumferential direction of the main body area 51, the main body area 51 comprises a second edge area in addition to the first edge area 501, the metal layer further comprises a connecting part 52 formed by extending outwardly from at least part of the second edge area, the connecting part 52 is bent to the side of the metal layer away from the display panel 1 to be electrically connected with the copper exposed area of the flexible circuit board 3;

[0084] The support pad 6 is arranged between the COF 2 and the heat dissipation film layer to ensure the bending radius of the display panel 1 and support the COF 2 to ensure the flatness of the flat area of the COF 2;

[0085] The flexible circuit board 3 comprises a binding side for binding with the COF 2, and two non-binding sides arranged adjacent to the binding side, on at least one of the non-binding sides, the flexible circuit board 3 comprises a first area 31 exposed to the COF 2 (see FIG. 3), and a bonding adhesive layer 4 is arranged between the first area 31 and the heat dissipation film layer, the bonding adhesive layer 4 realizes the bonding and fixing of the flexible circuit board 3 and ensures the bending radius of the bending area of the COF 2.

[0086] For the embodiment in which the connecting part 52 is electrically connected with the side of the flexible circuit board 3 close to the display panel 1, referring to FIGS. 1-7, the assembly method of the display module comprises the following steps:

[0087] Attaching a polarizing plate on the light-emitting side of the display panel 1;

[0088] Binding and connecting the display panel 1 with the COF 2, and binding and connecting the COF 2 with the flexible circuit board 3;

[0089] Attaching a cover plate on the light-emitting side of the polarizing plate;

[0090] Attaching a heat dissipation film layer on the back (i.e. the backlight side) of the display panel 1;

[0091] Attaching the support pad 6 on the side of the heat dissipation film layer away from the display panel 1;

[0092] Bending the binding area of the display panel 1 to the back of the display panel 1;

[0093] Attaching the bonding adhesive layer 4 on the side of the heat dissipation film layer away from the display panel 1;

[0094] The connecting part 52 is bent so that the first connecting area of the connecting part 52 is located on the adhesive layer 4;

[0095] The binding area of the COF 2 is bent to the side of the COF 2 away from the display panel 1, so that the FPCB 3 is fixed by the adhesive layer 4 and electrically connected with the connecting part 52.

[0096] For the embodiment in which the connecting part 52 is electrically connected with the FPCB 3 on the side of the display panel 1, referring to FIGS. 8-17, the assembling method of the display module comprises the following steps:

[0097] The polarizing sheet is attached on the light-emitting side of the display panel 1;

[0098] The display panel 1 is connected with the COF 2, and the COF 2 is connected with the FPCB 3;

[0099] The cover plate is attached on the light-emitting side of the polarizing sheet;

[0100] The heat dissipation film layer is attached on the back side (i.e. the backlight side) of the display panel 1;

[0101] The support pad 6 is attached on the side of the heat dissipation film layer away from the display panel 1;

[0102] The binding area of the display panel 1 is bent to the back side of the display panel 1;

[0103] The adhesive layer 4 is attached on the side of the heat dissipation film layer away from the display panel 1;

[0104] The binding area of the COF 2 is bent to the side of the COF 2 away from the display panel 1, so that the FPCB 3 is fixed by the adhesive layer 4;

[0105] The connecting part 52 is bent so that the first connecting area of the connecting part 52 is electrically connected with the exposed copper area on the side of the FPCB 3 away from the display panel 1.

[0106] The display device provided by the embodiment of the present disclosure comprises the display module.

[0107] For example, the display module is applied to a vehicle-mounted steering wheel, such as a finger screen, a lever screen, a boss key screen, etc. on a vehicle-mounted steering wheel.

[0108] The following points need to be explained:

[0109] (1) The drawings of the embodiment of the present disclosure only involve the structures involved in the embodiment of the present disclosure, and other structures can be referred to the general design.

[0110] (2) For clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions are exaggerated or reduced, that is, the drawings are not drawn on an actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly" on or under the other element, or an intervening element can also be present.

[0111] (3) The embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments, without conflict.

[0112] It can be understood that the above implementation is only an exemplary implementation adopted for illustrating the principles of the present disclosure, however the present disclosure is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also considered to be within the protection scope of the present disclosure.

Claims

1. A display module, wherein, The display module comprises a display panel, a chip on film and a flexible circuit board, the display panel is connected with the flexible circuit board through the chip on film, in a first direction, the display panel has a display area and a first binding area located on one side of the display area, the first binding area is bent to the back of the display panel; In the first direction, the chip on film comprises a second binding area and a third binding area located oppositely, the second binding area is connected with the first binding area, and the chip on film is located on the back of the display panel; The third binding area is bent to the side of the chip on film away from the display panel, the flexible circuit board is connected with the third binding area, and the flexible circuit board is located on the side of the chip on film away from the display panel; The display module further comprises a heat dissipation film layer arranged on the back of the display panel, the heat dissipation film layer comprises a metal layer, the metal layer comprises a main body area, the main body area comprises a first edge area, the orthographic projection of the first binding area on the heat dissipation film layer is at least partially located in the first edge area, along the circumferential direction of the main body area, the main body area comprises a second edge area except the first edge area, the metal layer further comprises a connecting part extending outward from at least part of the second edge area, the connecting part is bent to the side of the metal layer away from the display panel to be electrically connected with the flexible circuit board.

2. The display module of claim 1, wherein, The connecting part is electrically connected with the copper exposed area on the side of the flexible circuit board close to the display panel, or the connecting part is electrically connected with the copper exposed area on the side of the flexible circuit board away from the display panel.

3. The display module of claim 1, wherein, In a second direction, at least one side of the flexible circuit board comprises a first area exposed to the chip on film, the second direction is perpendicular to the first direction, and the second direction is parallel to the light emitting surface of the display panel; An adhesive layer is arranged between the first area and the metal layer, and the adhesive force of the adhesive layer is greater than 6000 gf / inch.

4. The display module of claim 3, wherein, The adhesive layer adopts VHB glue.

5. The display module of claim 3, wherein, The main body area is rectangular, the second edge area comprises a first sub-edge area located oppositely to the first edge area, and a second sub-edge area and a third sub-edge area located adjacently to the first edge area, in the first direction, the first edge area and the first sub-edge area are located oppositely, and in the second direction, the second sub-edge area and the third sub-edge area are located oppositely; At least part of the second sub-edge area and / or at least part of the third sub-edge area extend outward to form the connecting part.

6. The display module of claim 5, wherein, The connecting part comprises a first connecting area for electrical connection with the flexible circuit board, the area of the first connecting area is smaller than the area of the adhesive surface of the adhesive layer and the flexible circuit board, and under the adhesive action of the adhesive layer and the flexible circuit board, the first connecting area is crimped on the side of the flexible circuit board close to the display panel.

7. The display module of claim 5, wherein, The connecting part comprises a first connecting area for electrical connection with the flexible circuit board, the first connecting area is electrically connected with the side of the flexible circuit board away from the display panel through conductive glue.

8. The display module of claim 5, wherein, A bending area is further arranged between the main body area and the connecting part, and the bending area is provided with a hollow pattern.

9. The display module of claim 3, wherein, The main body area is rectangular, the second edge area includes a first sub-edge area opposite to the first edge area, and a second sub-edge area and a third sub-edge area adjacent to the first edge area, the first edge area and the first sub-edge area are opposite in the first direction, and the second sub-edge area and the third sub-edge area are opposite in the second direction. At least part of the first sub-edge area extends outward to form the connecting part.

10. The display module of claim 3, wherein, The main body area is rectangular, the second edge area includes a first sub-edge area opposite to the first edge area, and a second sub-edge area and a third sub-edge area adjacent to the first edge area, the first edge area and the first sub-edge area are opposite in the first direction, and the second sub-edge area and the third sub-edge area are opposite in the second direction. At least part of the first sub-edge area extends outward to form the connecting part, and at least part of the second sub-edge area and / or at least part of the third sub-edge area extends outward to form the connecting part.

11. The display module of claim 1, wherein, The area of the display area is substantially the same as the area of the flexible circuit board.

12. A display device, wherein, The display module includes any one of claims 1-11.

13. The display device of claim 12, wherein, The display module is applied to a vehicle-mounted steering wheel.

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