Display panel and manufacturing method thereof

Abstract

The application provides a display panel and a preparation method thereof. The display panel comprises a display panel body, a plurality of binding terminals arranged on the backlight side of the display panel body, an adhesive layer arranged on the backlight side of the display panel body, the adhesive layer comprising a plurality of first through holes corresponding to the binding terminals, a chip on film arranged on the side of the adhesive layer away from the display panel body, the chip on film comprising a chip on film body part in contact with the adhesive layer, the side of the chip on film body part facing the adhesive layer being provided with a plurality of connecting terminals corresponding to the first through holes, and the first through holes being provided with conductive glue, and the connecting terminals being electrically connected to the binding terminals through the conductive glue. In the display panel provided by the application, the first through holes directly define the forming position of the conductive glue, the conductive glue can be well supported and protected, thus no additional protective glue is needed, and the problems of complex process and low yield caused by the protective glue are avoided.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and its manufacturing method. Background Technology

[0002] In recent years, high screen-to-body ratio display technology has become a research hotspot in the field of display technology. For the same screen size, display panels with a high screen-to-body ratio offer a wider display area compared to conventional display panels, thus enhancing the user experience.

[0003] To achieve a high screen-to-body ratio, a back-mounting method is often used to reduce the width of the display panel bezel. For example... Figure 1 As shown, the current conventional back-side bonding scheme is as follows: a bonding terminal 101' is provided on the edge area of ​​the backlight side of the display panel body 10', and a first support layer 20', a heat dissipation buffer composite layer (Super clean foam, abbreviated as: SCF) 30', a double-sided adhesive layer 40', a second support layer 50' and a chip on film (Chip On Film, abbreviated as: COF) 60' are stacked sequentially in the middle area of ​​the backlight side of the display panel body 10'. A connection terminal 601' is provided on the edge of the side of the chip on film 60' facing away from the display panel body 10', and the bonding terminal 101' is electrically connected to the connection terminal 601' through conductive adhesive 70'.

[0004] However, in this structure, in order to ensure that the conductive adhesive 70' can smoothly transition from the edge area to the middle area, a first protective adhesive 80' is required to support the conductive adhesive 70'. At the same time, in order to ensure the electrical performance of the conductive adhesive 70', a second protective adhesive 90' ​​is also required to seal and protect the conductive adhesive 70', making the manufacturing process more complex. Moreover, the dispensing of the first protective adhesive 80' and the second protective adhesive 90' ​​is difficult, and the dispensing pattern and amount are hard to control, which can easily lead to problems such as overflow or insufficient adhesive, resulting in a low yield rate of display panel production. This problem urgently needs to be solved. Summary of the Invention

[0005] This application provides a display panel and its manufacturing method, which can effectively solve the problems of complex manufacturing process and low yield caused by the application of protective adhesive in existing display panels.

[0006] On one hand, this application provides a display panel, the display panel comprising: a display panel body, wherein a plurality of bonding terminals are disposed on the backlight side of the display panel body; an adhesive layer disposed on the backlight side of the display panel body, the adhesive layer including a plurality of first through holes, the first through holes being correspondingly disposed to the bonding terminals; and a flip-chip film disposed on the side of the adhesive layer away from the display panel body, including a flip-chip film body portion in contact with the adhesive layer, the flip-chip film body portion having a plurality of connecting terminals disposed on the side facing the adhesive layer, the connecting terminals being correspondingly disposed to the first through holes; wherein conductive adhesive is disposed in the first through holes, and the connecting terminals are electrically connected to the bonding terminals through the conductive adhesive.

[0007] Optionally, the flip-chip film body includes a plurality of second through holes, the second through holes being disposed corresponding to the first through holes, and the opening area of ​​the second through holes being smaller than the opening area of ​​the first through holes.

[0008] Optionally, the axis of the first through hole and the axis of the second through hole are collinear.

[0009] Optionally, the connecting terminal is disposed around the periphery of the second through hole, and the conductive adhesive is disposed in both the first through hole and the second through hole.

[0010] Optionally, the display panel further includes: a support layer disposed on the side of the flip-chip film body facing away from the display panel body; and a heat dissipation buffer composite layer disposed on the side of the support layer facing away from the display panel body.

[0011] Optionally, the orthographic projection of the support layer on the display panel body is a first projection, and the orthographic projection of the heat dissipation buffer composite layer on the display panel body is a second projection, both the first projection and the second projection covering each of the bonding terminals.

[0012] Optionally, the display panel further includes: a double-sided adhesive layer disposed on the side of the heat dissipation buffer composite layer away from the display panel body; wherein, the flip-chip film further includes a flip-chip film extension portion, one end of the flip-chip film extension portion being connected to the flip-chip film body portion, and the other end being bent to the side of the double-sided adhesive layer away from the display panel body and fixedly connected to the double-sided adhesive layer.

[0013] Optionally, the display panel further includes: a flexible circuit board disposed on the side of the flip-chip film extension portion away from the display panel body and electrically connected to the other end of the flip-chip film extension portion; and an integrated circuit disposed on the side of the flip-chip film extension portion away from the display panel body.

[0014] Optionally, the display panel further includes: a flexible circuit board disposed on the side of the flip-chip film body portion away from the display panel body; and an integrated circuit disposed on the side of the flip-chip film body portion away from the display panel body; wherein the display panel further includes a notch penetrating the support layer and the heat dissipation buffer composite layer, the flexible circuit board and the integrated circuit are located within the notch, and the notch is misaligned with the bonding terminal.

[0015] Optionally, the display panel body includes: a first substrate layer disposed on the side of the adhesive layer away from the flip-chip film body portion; a bonding terminal layer disposed on the side of the first substrate layer away from the flip-chip film body portion; a barrier layer disposed on the side of the bonding terminal layer away from the flip-chip film body portion; and a second substrate layer disposed on the side of the barrier layer away from the flip-chip film body portion; wherein the bonding terminal layer includes the plurality of bonding terminals, the first substrate layer includes a plurality of third through holes, the third through holes being correspondingly disposed with the first through holes, and the conductive adhesive being disposed in both the first through holes and the third through holes.

[0016] On the other hand, this application provides a method for manufacturing a display panel, the method comprising the following steps:

[0017] A display panel body is provided, wherein a plurality of bonding terminals are provided on the backlight side of the display panel body;

[0018] An adhesive layer is formed on the backlight side of the display panel body, wherein the adhesive layer includes a plurality of first through holes, and the first through holes are correspondingly disposed with the bonding terminals;

[0019] A flip-chip film is formed on the side of the adhesive layer away from the display panel body. The flip-chip film includes a flip-chip film body portion that contacts the adhesive layer. A plurality of connection terminals are provided on the side of the flip-chip film body portion facing the adhesive layer. The connection terminals are corresponding to the first through hole.

[0020] The method for manufacturing the display panel further includes the following steps: providing conductive adhesive in the first through hole, wherein the connecting terminal is electrically connected to the bonding terminal through the conductive adhesive;

[0021] The step of setting conductive adhesive in the first through hole is located before or after the step of forming a flip-chip film on the side of the adhesive layer away from the display panel body.

[0022] This application provides a display panel and its manufacturing method. The display panel includes: a display panel body with a plurality of bonding terminals disposed on its backlight side; an adhesive layer including a plurality of first through holes; and a flip-chip film including a flip-chip film body portion in contact with the adhesive layer, wherein a plurality of connection terminals are disposed on the side of the flip-chip film body portion facing the adhesive layer; wherein the connection terminals are correspondingly disposed with the first through holes and bonding terminals, and conductive adhesive is disposed within the first through holes. In the display panel provided by this application, the first through holes directly define the formation position of the conductive adhesive, and the sidewalls of the first through holes can provide good support and protection for the conductive adhesive within the first through holes, thereby eliminating the need for additional first and second protective adhesives, avoiding the problems of complex manufacturing processes and low yield caused by the use of protective adhesives, and reducing the production cost of the display panel. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a display panel in the prior art;

[0025] Figure 2 This is a schematic diagram of the structure of a display panel provided in Embodiment 1 of this application;

[0026] Figure 3 This is a schematic flowchart illustrating the method for fabricating a display panel according to Embodiment 1 of this application;

[0027] Figure 4 This is a schematic diagram of the structure of a display panel provided in Embodiment 2 of this application;

[0028] Figure 5 This is a schematic diagram of the structure of a display panel provided in Embodiment 3 of this application;

[0029] Figure 6 This is a planar schematic diagram of the flip-chip thin film provided in Embodiment 3 of this application;

[0030] Figure 7 This is a schematic flowchart of the method for preparing the display panel provided in Embodiment 3 of this application;

[0031] Figure 8a This is a schematic diagram of the structure of the display panel body provided in Embodiment 3 of this application;

[0032] Figure 8b This is a schematic diagram of the structure of forming an adhesive layer on the backlight side of the display panel body according to Embodiment 3 of this application;

[0033] Figure 8c This is a schematic diagram of the structure in Embodiment 3 of this application, in which a flip-chip film is formed on the side of the adhesive layer opposite to the display panel body;

[0034] Figure 8d This is a schematic diagram of the structure provided in Embodiment 3 of this application, showing the placement of conductive adhesive in the first through hole;

[0035] Figure 8e This is a schematic diagram of the structure provided in Embodiment 3 of this application, in which a support layer, a heat dissipation buffer composite layer and a double-sided adhesive layer are formed sequentially on the side of the flip-chip film body that is away from the display panel body;

[0036] Figure 8f This is a schematic diagram of the structure provided in Embodiment 3 of this application, in which the extended portion of the flip-chip film is folded back to the side of the double-sided adhesive layer away from the display panel body;

[0037] Figure 9 This is a schematic diagram of the structure of a display panel provided in Embodiment 4 of this application. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0039] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials. Detailed descriptions are provided below; it should be noted that the order of description of the following embodiments is not intended to limit the preferred order of embodiments.

[0040] Example 1

[0041] Figure 2 This is a schematic diagram of the structure of a display panel provided in Embodiment 1 of this application. (Refer to...) Figure 2 As shown, Embodiment 1 of this application provides a display panel, which includes: a display panel body 10, with a plurality of bonding terminals 101 disposed on the backlight side of the display panel body 10; an adhesive layer 20 disposed on the backlight side of the display panel body 10, the adhesive layer 20 including a plurality of first through holes 211, the first through holes 211 being correspondingly disposed with respect to the bonding terminals 101; and a flip-chip film 30 disposed on the side of the adhesive layer 20 away from the display panel body 10, including a flip-chip film body portion 31 in contact with the adhesive layer 20, the flip-chip film body portion 31 having a plurality of connection terminals 301 disposed on the side facing the adhesive layer 20, the connection terminals 301 being correspondingly disposed with respect to the first through holes 211; wherein, conductive adhesive 01 is disposed in the first through hole 211, and the connection terminals 301 are electrically connected to the bonding terminals 101 through the conductive adhesive 01.

[0042] In the display panel provided in this application, the first through hole 211 directly defines the formation position of the conductive adhesive 01. The sidewall of the first through hole 211 can provide good support and protection for the conductive adhesive 01 in the first through hole 211, so there is no need to set an additional protective adhesive with support, sealing and protection functions. Correspondingly, it also avoids the problems of complex process and low yield caused by setting a protective adhesive, and reduces the production cost of the display panel.

[0043] Furthermore, in existing technologies, the protective adhesive and conductive adhesive are only applied to the edge region of the backlight side of the display panel body. Therefore, there is a significant difference in the film structure design between the edge region and the middle region of the backlight side of the display panel body. After curing, the protective adhesive and conductive adhesive may shrink, causing deformation of the display panel body and affecting its normal display. In contrast, the display panel provided in this application features a more flexible design for the first through-hole 211 and the conductive adhesive 01 within it. These can be placed in any region of the backlight side of the display panel body 10 according to actual needs, resulting in a more uniform film structure design on the backlight side of the display panel body 10. This improves the display quality and stability of the display panel.

[0044] Specifically, the orthographic projections of the adhesive layer 20 and the flip-chip film body 31 onto the display panel body 10 both cover the display panel body 10, and the first through holes 211 in the adhesive layer 20 are evenly spaced, thereby enabling the conductive adhesive 01 located within the first through holes 211 to be evenly spaced in the corresponding backlight side area of ​​the display panel body 10, greatly improving the uniformity of the film structure design on the backlight side of the display panel body 10, and improving the display quality and stability of the display panel. Correspondingly, the connecting terminals 301 are evenly spaced in the corresponding backlight side area of ​​the display panel body 10; the bonding terminals 101 are evenly spaced in the corresponding backlight side area of ​​the display panel body 10.

[0045] In an embodiment of this application, the display panel further includes: a support layer 40 disposed on the side of the flip-chip film body 31 opposite to the display panel body 10; and a heat dissipation buffer composite layer 50 disposed on the side of the support layer 40 opposite to the display panel body 10.

[0046] In the existing technology, the film layer difference between the bonding terminal and the connecting terminal is large, the thickness of the conductive adhesive is generally in the range of 200 to 400 μm, and the extension length of the conductive adhesive in the horizontal direction is generally more than 500 to 1000 μm, making it difficult to connect the bonding terminals. In the display panel provided in this application, since both the support layer 40 and the heat dissipation buffer composite layer 50 are disposed on the side of the flip-chip film body 31 facing away from the display panel body 10, the electrical connection between the connecting terminal 301 and the bonding terminal 101 only needs to pass through the adhesive layer 20. This greatly reduces the process difficulty and the thickness of the conductive adhesive 01 required for the electrical connection between the connecting terminal 301 and the bonding terminal 101, and reduces the amount of conductive adhesive 01 used for the electrical connection between the connecting terminal 301 and the bonding terminal 101, saving process materials and reducing manufacturing costs. Furthermore, the reduced amount of conductive adhesive 01 used for the electrical connection between the connecting terminal 301 and the bonding terminal 101 further reduces or avoids deformation during the curing process of the conductive adhesive 01, further improving the display quality and stability of the display panel. Preferably, the thickness of the conductive adhesive 01 is less than 30 μm.

[0047] Furthermore, in the embodiments of this application, the orthographic projection of the support layer 40 on the display panel body 10 is a first projection, and the orthographic projection of the heat dissipation buffer composite layer 50 on the display panel body 10 is a second projection. Both the first projection and the second projection cover each of the bonding terminals 101.

[0048] Specifically, in the prior art, since the protective adhesive and the conductive adhesive are disposed on the edge area of ​​the backlight side of the display panel body, and the support layer and the heat dissipation buffer composite layer are disposed in the middle area of ​​the backlight side of the display panel body, the orthographic projection of the support layer and the heat dissipation composite conductive layer on the display panel body 10 cannot cover the bonding terminal 101. Although the protective adhesive has a certain encapsulation and protection effect on the conductive adhesive, the sealing performance is still poor. However, in the display panel provided in this application, since both the first projection and the second projection cover each of the bonding terminals 101, the support layer 40 and the heat dissipation buffer composite layer 50 can provide multi-layer coverage of the bonding terminal 101, greatly improving the encapsulation performance of the display panel and having the beneficial effect of improving the stability of the display panel and its resistance to water and oxygen.

[0049] Furthermore, the heat dissipation buffer composite layer 50 includes a heat dissipation film formed of copper foil material. Since the second projection covers each of the bonding terminals 101, it can also improve the display panel's resistance to external interference and enhance its shielding performance.

[0050] In an embodiment of this application, the display panel further includes: a double-sided adhesive layer 60 disposed on the side of the heat dissipation buffer composite layer 50 away from the display panel body 10; wherein, the flip-chip film 30 further includes a flip-chip film extension portion 32, one end of the flip-chip film extension portion 32 is connected to the flip-chip film body portion 31, and the other end is bent to the side of the double-sided adhesive layer 60 away from the display panel body 10 and fixedly connected to the double-sided adhesive layer 60.

[0051] In the display panel provided in this application, the flip-chip film extension 32, which is folded back and fixed to the double-sided adhesive layer 60, can provide space for the installation of the flexible circuit board 70 and the integrated circuit 80 without affecting the adhesion between the flip-chip film body 31 and the adhesive layer 20.

[0052] Specifically, in the embodiments of this application, the display panel further includes: a flexible circuit board 70 disposed on the side of the flip-chip film extension 32 away from the display panel body 10, and electrically connected to the other end of the flip-chip film extension 32; and an integrated circuit 80 disposed on the side of the flip-chip film extension 32 away from the display panel body 10.

[0053] In embodiments of this application, the display panel further includes: a polarizer 90 disposed on the light-emitting side of the display panel body 10; an optical adhesive layer 100 disposed on the side of the polarizer 90 facing away from the display panel body 10; and a cover plate 110 disposed on the side of the optical adhesive layer 100 facing away from the display panel body 10.

[0054] In the embodiments of this application, the types of display panels include, but are not limited to, liquid crystal display (LCD) display panels, organic light-emitting diode (OLED) display panels, quantum dot light-emitting diode (QLED) display panels, mini light-emitting diode (mini LED) display panels, and micro light-emitting diode (micro LED) display panels.

[0055] On the other hand, this application also provides a method for manufacturing a display panel.

[0056] Specifically, Figure 3 This is a schematic flowchart illustrating the method for fabricating a display panel according to Embodiment 1 of this application. (Refer to...) Figure 2 and Figure 3 As shown, the method for manufacturing the display panel includes the following steps:

[0057] S01: A display panel body 10 is provided, wherein a plurality of bonding terminals 101 are provided on the backlight side of the display panel body 10.

[0058] S02: An adhesive layer 20 is formed on the backlight side of the display panel body 10, wherein the adhesive layer 20 includes a plurality of first through holes 211, and the first through holes 211 are correspondingly disposed with the bonding terminal 101.

[0059] S03: Conductive adhesive 01 is provided in the first through hole 211.

[0060] S04: A flip-chip film 30 is formed on the side of the adhesive layer 20 away from the display panel body 10. The flip-chip film 30 includes a flip-chip film body portion 31 that contacts the adhesive layer 20. A plurality of connection terminals 301 are provided on the side of the flip-chip film body portion 31 facing the adhesive layer 20. The connection terminals 301 are correspondingly provided with the first through hole 211. The connection terminals 301 are electrically connected to the bonding terminal 101 through the conductive adhesive 01.

[0061] Furthermore, in step S04, the flip-chip film 30 further includes a flip-chip film extension portion 32, one end of which is electrically connected to the flip-chip film body portion 31. The flip-chip film extension portion 32 protrudes from the display panel body 10, and a flexible circuit board 70 and an integrated circuit 80 are disposed on the side of the flip-chip film extension portion 32 facing the display panel body 10.

[0062] Furthermore, the method for manufacturing the display panel further includes the following steps:

[0063] S05: A support layer 40, a heat dissipation buffer composite layer 50, and a double-sided adhesive layer 60 are sequentially formed on the side of the flip-chip film body 31 opposite to the display panel body 10.

[0064] S06: Fold the flip-chip film extension 32 to the side of the double-sided adhesive layer 60 away from the display panel body 10, and bond and fix the flip-chip film extension 32 and the flexible circuit board 70 to the double-sided adhesive layer 60.

[0065] Example 2

[0066] Figure 4 This is a schematic diagram of the structure of a display panel provided in Embodiment 2 of this application. (Refer to...) Figure 4 As shown, Embodiment 2 of this application provides a display panel, which includes: a display panel body 10, on which a plurality of bonding terminals 101 are disposed on the backlight side; an adhesive layer 20 disposed on the backlight side of the display panel body 10, the adhesive layer 20 including a plurality of first through holes 211, the first through holes 211 being correspondingly disposed with respect to the bonding terminals 101; and a flip-chip film 30 disposed on the side of the adhesive layer 20 away from the display panel body 10, including a flip-chip film body portion 31 in contact with the adhesive layer 20, the flip-chip film body portion 31 having a plurality of connection terminals 301 on the side facing the adhesive layer 20, the connection terminals 301 being correspondingly disposed with respect to the first through holes 211; wherein, conductive adhesive 01 is disposed in the first through hole 211, and the connection terminals 301 are electrically connected to the bonding terminals 101 through the conductive adhesive 01.

[0067] The display panel provided in Embodiment 2 of this application has a similar structure to the display panel in Embodiment 1, both including a support layer 40 and a heat dissipation buffer composite layer 50. The identical parts will not be described again in this embodiment. The difference is that in the display panel provided in this embodiment, the flip-chip film 30 only includes the flip-chip film body portion 31. That is, the flip-chip film 30 does not need to have an additional flip-chip film extension portion folded back to the side of the heat dissipation buffer composite layer 50 away from the display panel body 10, thus eliminating the bending process of the flip-chip film 30, thereby reducing process difficulty and saving manufacturing costs.

[0068] Specifically, the display panel further includes: a flexible circuit board 70 disposed on the side of the flip-chip film body 31 opposite to the display panel body 10; and an integrated circuit 80 disposed on the side of the flip-chip film body 31 opposite to the display panel body 10. The display panel also includes a notch 02 penetrating the support layer 40 and the heat dissipation buffer composite layer 50, and the flexible circuit board 70 and the integrated circuit 80 are located within the notch 02.

[0069] In the display panel provided in this application, since the flexible circuit board 70 and the integrated circuit 80 are located within the notch 02, the overall thickness of the display panel can be reduced while eliminating the need for the bending process of the flip-chip film 30, which is beneficial for thinning the display panel. Furthermore, since the integrated circuit 80 can be directly electrically connected to each of the connection terminals 301 through the flip-chip film body 31, the connection distance between the integrated circuit 80 and each connection terminal 301 can also be reduced, thereby reducing RC delay.

[0070] Furthermore, the orthographic projection of the support layer 40 on the display panel body 10 is a first projection, and the orthographic projection of the heat dissipation buffer composite layer 50 on the display panel body 10 is a second projection. The first projection and the second projection cover each of the bonding terminals 101, and the notch 02 is misaligned with the bonding terminal 101.

[0071] In the display panel provided in this application, since the notch 02 is misaligned with the bonding terminal 101, the support layer 40 and the heat dissipation buffer composite layer 50 can still cover the bonding terminal 101 with multiple film layers, which greatly improves the encapsulation performance of the display panel and has the beneficial effect of improving the stability of the display panel and its resistance to water and oxygen.

[0072] On the other hand, this application also provides a method for manufacturing a display panel.

[0073] Reference Figure 3 and Figure 4 As shown, the method for manufacturing the display panel includes the following steps:

[0074] S01: A display panel body 10 is provided, wherein a plurality of bonding terminals 101 are provided on the backlight side of the display panel body 10.

[0075] S02: An adhesive layer 20 is formed on the backlight side of the display panel body 10, wherein the adhesive layer 20 includes a plurality of first through holes 211, and the first through holes 211 are correspondingly disposed with the bonding terminal 101.

[0076] S03: Conductive adhesive 01 is provided in the first through hole 211.

[0077] S04: A flip-chip film 30 is formed on the side of the adhesive layer 20 away from the display panel body 10. The flip-chip film 30 includes a flip-chip film body portion 31 that contacts the adhesive layer 20. A plurality of connection terminals 301 are provided on the side of the flip-chip film body portion 31 facing the adhesive layer 20. The connection terminals 301 are correspondingly provided with the first through hole 211. The connection terminals 301 are electrically connected to the bonding terminal 101 through the conductive adhesive 01.

[0078] Furthermore, in step S04, the flip-chip film 30 includes only the flip-chip film body portion 31 and does not include the flip-chip film extension portion. The flip-chip film body portion 31 is provided with a flexible circuit board 70 and an integrated circuit 80 on the side opposite to the display panel body 10.

[0079] In embodiments of this application, the method for manufacturing the display panel includes the following steps:

[0080] S05: A support layer 40 and a heat dissipation buffer composite layer 50 are sequentially formed on the side of the flip-chip film body 31 away from the display panel body 10, and a notch 02 is formed through the support layer 40 and the heat dissipation buffer composite layer 50. The orthogonal projection of the notch 02 on the flip-chip film body 31 covers the orthogonal projection of the flexible circuit board 70 and the integrated circuit 80 on the flip-chip film body 31.

[0081] Further, in step S05, the orthographic projection of the support layer 40 on the display panel body 10 is a first projection, and the orthographic projection of the heat dissipation buffer composite layer 50 on the display panel body 10 is a second projection. The first projection and the second projection cover each of the bonding terminals 101, and the notch 02 is misaligned with the bonding terminal 101.

[0082] Example 3

[0083] Figure 5 This is a schematic diagram of the structure of a display panel provided in Embodiment 3 of this application. Figure 6 This is a planar schematic diagram of the flip-chip thin film provided in Embodiment 3 of this application. (Refer to...) Figure 5 and Figure 6 As shown, Embodiment 3 of this application provides a display panel, which includes: a display panel body 10, on which a plurality of bonding terminals 101 are disposed; an adhesive layer 20 disposed on the backlight side of the display panel body 10, the adhesive layer 20 including a plurality of first through holes 211, the first through holes 211 being correspondingly disposed with respect to the bonding terminals 101; and a flip-chip film 30 disposed on the side of the adhesive layer 20 away from the display panel body 10, including a flip-chip film body portion 31 in contact with the adhesive layer 20, the flip-chip film body portion 31 having a plurality of connection terminals 301 on the side facing the adhesive layer 20, the connection terminals 301 being correspondingly disposed with respect to the first through holes 211; wherein, conductive adhesive 01 is disposed in the first through hole 211, and the connection terminals 301 are electrically connected to the bonding terminals 101 through the conductive adhesive 01.

[0084] The display panel provided in Embodiment 3 of this application has a similar structure to the display panel in Embodiment 1 above, both including: a support layer 40, a heat dissipation buffer composite layer 50, and a double-sided adhesive layer 60. The flip-chip film 30 includes a flip-chip film body portion 31 and a flip-chip film extension portion 32. The same parts will not be described again in this embodiment. The difference is that in the display panel provided in this embodiment, the flip-chip film body portion 31 includes a plurality of second through holes 311. The second through holes 311 are correspondingly disposed with respect to the first through holes 211, and the opening area of ​​the second through holes 311 is smaller than the opening area of ​​the first through holes 211.

[0085] Specifically, in the display panel provided in this application, since the flip-chip film body 31 includes a plurality of second through holes 311, the second through holes 311 are correspondingly arranged with the first through holes 211, and the opening area of ​​the second through holes 311 is smaller than the opening area of ​​the first through holes 211, in the process of manufacturing the display panel, the conductive adhesive 01 can be injected into the second through holes 311, so that the conductive adhesive 01 flows into the first through holes 211, thus completing the step of setting the conductive adhesive 01 in the first through holes 211. This method of setting the conductive adhesive 01 in the first through holes 211 makes it easier to control the shape of the conductive adhesive 01 in the first through holes 211, and avoids the short circuit problem caused by the conductive adhesive 01 overflowing from the first through holes 211, which is more advantageous in terms of cost and efficiency.

[0086] Furthermore, the axis of the first through hole 211 and the axis of the second through hole 311 are collinear. That is, the line connecting the center point of the first through hole 211 and the center point of the second through hole 311 is perpendicular to the plane of the display panel body 10. By making the axes of the first through hole 211 and the second through hole 311 collinear, the conductive adhesive flowing into the first through hole 211 through the second through hole 311 can be more uniform in shape, thereby ensuring the connection effect of the conductive adhesive 01.

[0087] Furthermore, the connecting terminal 301 surrounds the periphery of the second through hole 311, and the conductive adhesive 01 is disposed within both the first through hole 211 and the second through hole 311. By surrounding the second through hole 311 with the connecting terminal 301 and disposing of the conductive adhesive 01 within both the first and second through holes 211, this application ensures that all areas within the first through hole 211 are filled with the conductive adhesive 01, thereby guaranteeing the connection stability between the connecting terminal 301 and the conductive adhesive 01 within the first through hole 211.

[0088] In an embodiment of this application, the display panel body 10 includes: a first substrate layer 11 disposed on the side of the adhesive layer 20 away from the flip-chip film body portion 31; a bonding terminal layer 12 disposed on the side of the first substrate layer 11 away from the flip-chip film body portion 31; a barrier layer 13 disposed on the side of the bonding terminal layer 12 away from the flip-chip film body portion 31; a second substrate layer 14 disposed on the side of the barrier layer 13 away from the flip-chip film body portion 31; and a display function layer 15 disposed on the side of the second substrate layer 14 away from the flip-chip film body portion 31. The bonding terminal layer 12 includes a plurality of bonding terminals 101, and the first substrate layer 11 includes a plurality of third through holes 111, the third through holes 111 being correspondingly disposed to the first through holes 211, and the conductive adhesive 01 being disposed within both the first through holes 211 and the third through holes 111.

[0089] Compared to Embodiment 1, since the conductive adhesive 01 in the first through hole 211 needs to pass through the third through hole 111 to achieve electrical connection with the bonding terminal 101, the conductive adhesive 01 can be formed more precisely in the area where the bonding terminal 101 is located, further ensuring the stability of the electrical connection between the conductive adhesive 01 in the first through hole 211 and the bonding terminal 101.

[0090] On the other hand, this application also provides a method for manufacturing a display panel.

[0091] Figure 7This is a schematic flowchart illustrating the method for fabricating the display panel provided in Embodiment 3 of this application. (Refer to...) Figures 5-7 As shown, the method for manufacturing the display panel includes the following steps:

[0092] S01: A display panel body 10 is provided, wherein a plurality of bonding terminals 101 are provided on the backlight side of the display panel body 10.

[0093] S02: An adhesive layer 20 is formed on the backlight side of the display panel body 10, wherein the adhesive layer 20 includes a plurality of first through holes 211, and the first through holes 211 are correspondingly disposed with the bonding terminal 101.

[0094] S03: A flip-chip film 30 is formed on the side of the adhesive layer 20 away from the display panel body 10. The flip-chip film 30 includes a flip-chip film body portion 31 that is in contact with the adhesive layer 20. A plurality of connection terminals 301 are provided on the side of the flip-chip film body portion 31 facing the adhesive layer 20. The connection terminals 301 are correspondingly provided with the first through hole 211.

[0095] S04: Conductive adhesive 01 is provided in the first through hole 211, wherein the connecting terminal 301 is electrically connected to the binding terminal 101 through the conductive adhesive 01.

[0096] Figure 8a This is a schematic diagram of the structure of the display panel body provided in Embodiment 3 of this application, with reference to... Figure 8a In step S01, the display panel body 10 includes: a first substrate layer 11 disposed on the side of the adhesive layer 20 away from the flip-chip film body portion 31; a bonding terminal layer 12 disposed on the side of the first substrate layer 11 away from the flip-chip film body portion 31; a barrier layer 13 disposed on the side of the bonding terminal layer 12 away from the flip-chip film body portion 31; and a second substrate layer 14 disposed on the side of the barrier layer 13 away from the flip-chip film body portion 31. The bonding terminal layer 12 includes a plurality of bonding terminals 101, and the first substrate layer 11 includes a plurality of third through-holes 111, the third through-holes 111 being correspondingly disposed with respect to the bonding terminals 101.

[0097] Figure 8b This is a schematic diagram of the structure of forming an adhesive layer on the backlight side of the display panel body according to Embodiment 3 of this application, with reference to... Figure 8b In step S02, the first through hole 211 and the third through hole 111 are respectively provided.

[0098] Figure 8c This is a schematic diagram of the structure of a flip-chip thin film 30 formed on the side of the adhesive layer away from the display panel body, as provided in Embodiment 3 of this application. Figure 8c In step S03, the flip-chip film body portion 31 includes a plurality of second through holes 311, the second through holes 311 being correspondingly disposed with the first through holes 211, and the opening area of ​​the second through holes 311 being smaller than the opening area of ​​the first through holes 211; the flip-chip film 30 further includes: a flip-chip film extension portion 32, one end of the flip-chip film extension portion 32 being electrically connected to the flip-chip film body portion 31, the flip-chip film extension portion 32 protruding from the display panel body 10, and a flexible circuit board 70 and an integrated circuit 80 being disposed on the side of the flip-chip film extension portion 32 facing the display panel body 10.

[0099] Figure 8d This is a schematic diagram of the structure of providing conductive adhesive in the first through hole according to Embodiment 3 of this application, with reference to... Figure 8d In step S04, conductive adhesive 01 is injected into the second through hole 311, allowing it to flow into the first through hole 211, thus completing the step of placing conductive adhesive 01 in the first through hole 211. This method of placing conductive adhesive 01 in the first through hole 211 makes it easier to control the shape of the conductive adhesive 01 within the first through hole 211, avoiding short circuit problems caused by the conductive adhesive 01 overflowing from the first through hole 211, and is more advantageous in terms of cost and efficiency. Furthermore, conductive adhesive 01 is also placed in the third through hole 111.

[0100] In the embodiments of this application, the method for preparing the display panel further includes steps S05 and S06.

[0101] Specifically, Figure 8e This is a schematic diagram of the structure provided in Embodiment 3 of this application, showing a support layer, a heat dissipation buffer composite layer, and a double-sided adhesive layer formed sequentially on the side of the flip-chip film body facing away from the display panel body. (Refer to...) Figure 8e The S05 step is as follows: a support layer 40, a heat dissipation buffer composite layer 50 and a double-sided adhesive layer 60 are sequentially formed on the side of the flip-chip film body 31 opposite to the display panel body 10.

[0102] Specifically, Figure 8f This is a schematic diagram of the structure provided in Embodiment 3 of this application, in which the extended portion of the flip-chip film is folded back to the side of the double-sided adhesive layer away from the display panel body. (Refer to...) Figure 8f The S06 step is as follows: fold the flip-chip film extension 32 back onto the side of the double-sided adhesive layer 60 away from the display panel body 10, and bond and fix the flip-chip film extension 32 and the flexible circuit board 70 to the double-sided adhesive layer 60.

[0103] Example 4

[0104] Figure 9 This is a schematic diagram of the structure of a display panel provided in Embodiment 4 of this application, referring to... Figure 9 This application provides a display panel in embodiment four, comprising: a display panel body 10, wherein a plurality of bonding terminals 101 are disposed on the backlight side of the display panel body 10; an adhesive layer 20 disposed on the backlight side of the display panel body 10, the adhesive layer 20 including a plurality of first through holes 211, the first through holes 211 being correspondingly disposed with respect to the bonding terminals 101; and a flip-chip film 30 disposed on the side of the adhesive layer 20 away from the display panel body 10, including a flip-chip film body portion 31 in contact with the adhesive layer 20, wherein a plurality of connecting terminals 301 are disposed on the side of the flip-chip film body portion 31 facing the adhesive layer 20, the connecting terminals 301 being correspondingly disposed with respect to the first through holes 211; wherein conductive adhesive 01 is disposed in the first through hole 211, and the connecting terminals 301 are electrically connected to the bonding terminals 101 through the conductive adhesive 01.

[0105] The display panel provided in Embodiment 4 of this application has a similar structure to the display panel in Embodiment 2 above, and the same parts will not be described again in this application. The difference is that in the display panel provided in this application embodiment, the flip-chip body portion 31 includes a plurality of second through holes 311, the second through holes 311 are correspondingly arranged with the first through holes 211, and the opening area of ​​the second through holes 311 is smaller than the opening area of ​​the first through holes 211.

[0106] Specifically, in the display panel provided in this application, since the flip-chip film body 31 includes a plurality of second through holes 311, the second through holes 311 are correspondingly arranged with the first through holes 211, and the opening area of ​​the second through holes 311 is smaller than the opening area of ​​the first through holes 211, in the process of manufacturing the display panel, the conductive adhesive 01 can be injected into the second through holes 311, so that the conductive adhesive 01 flows into the first through holes 211, thus completing the step of setting the conductive adhesive 01 in the first through holes 211. This method of setting the conductive adhesive 01 in the first through holes 211 makes it easier to control the shape of the conductive adhesive 01 in the first through holes 211, and avoids the short circuit problem caused by the conductive adhesive 01 overflowing from the first through holes 211, which is more advantageous in terms of cost and efficiency.

[0107] Furthermore, the connecting terminal 301 surrounds the periphery of the second through hole 311, and the conductive adhesive 01 is disposed within both the first through hole 211 and the second through hole 311. By surrounding the second through hole 311 with the connecting terminal 301 and disposing of the conductive adhesive 01 within both the first and second through holes 211, this application ensures that all areas within the first through hole 211 are filled with the conductive adhesive 01, thereby guaranteeing the connection stability between the connecting terminal 301 and the conductive adhesive 01 within the first through hole 211.

[0108] In an embodiment of this application, the display panel body 10 includes: a first substrate layer 11 disposed on the side of the adhesive layer 20 away from the flip-chip film body portion 31; a bonding terminal layer 12 disposed on the side of the first substrate layer 11 away from the flip-chip film body portion 31; a barrier layer 13 disposed on the side of the bonding terminal layer 12 away from the flip-chip film body portion 31; and a second substrate layer 14 disposed on the side of the barrier layer 13 away from the flip-chip film body portion 31. The bonding terminal layer 12 includes a plurality of bonding terminals 101, and the first substrate layer 11 includes a plurality of third through holes 111, the third through holes 111 being correspondingly disposed to the first through holes 211, and the conductive adhesive 01 being disposed within both the first through holes 211 and the third through holes 111.

[0109] Compared to Embodiment 2, since the conductive adhesive 01 in the first through hole 211 needs to pass through the third through hole 111 to achieve electrical connection with the bonding terminal 101, the conductive adhesive 01 can be formed more precisely in the area where the bonding terminal 101 is located, thereby further ensuring the stability of the electrical connection between the conductive adhesive 01 in the first through hole 211 and the bonding terminal 101.

[0110] On the other hand, this application also provides a method for manufacturing a display panel.

[0111] Reference Figure 7 and Figure 9 As shown, the method for manufacturing the display panel includes the following steps:

[0112] S01: A display panel body 10 is provided, wherein a plurality of bonding terminals 101 are provided on the backlight side of the display panel body 10.

[0113] S02: An adhesive layer 20 is formed on the backlight side of the display panel body 10, wherein the adhesive layer 20 includes a plurality of first through holes 211, and the first through holes 211 are correspondingly disposed with the bonding terminal 101.

[0114] S03: A flip-chip film 30 is formed on the side of the adhesive layer 20 away from the display panel body 10. The flip-chip film 30 includes a flip-chip film body portion 31 that is in contact with the adhesive layer 20. A plurality of connection terminals 301 are provided on the side of the flip-chip film body portion 31 facing the adhesive layer 20. The connection terminals 301 are correspondingly provided with the first through hole 211.

[0115] S04: Conductive adhesive 01 is provided in the first through hole 211, wherein the connecting terminal 301 is electrically connected to the binding terminal 101 through the conductive adhesive 01.

[0116] Further, in step S03, the flip-chip film body portion 31 includes a plurality of second through holes 311, the second through holes 311 are correspondingly disposed with the first through holes 211, and the opening area of ​​the second through holes 311 is smaller than the opening area of ​​the first through holes 211; the flip-chip film 30 includes only the flip-chip film body portion 31, but does not include the flip-chip film extension portion 32, wherein the flip-chip film body portion 31 has a flexible circuit board 70 and an integrated circuit 80 disposed on the side away from the display panel body 10.

[0117] In embodiments of this application, the method for manufacturing the display panel further includes the following steps:

[0118] S05: A support layer 40 and a heat dissipation buffer composite layer 50 are sequentially formed on the side of the flip-chip film body 31 away from the display panel body 10, and a notch 02 is formed through the support layer 40 and the heat dissipation buffer composite layer 50. The orthogonal projection of the notch 02 on the flip-chip film body 31 covers the orthogonal projection of the flexible circuit board 70 and the integrated circuit 80 on the flip-chip film body 31.

[0119] In summary, this application provides a display panel and its manufacturing method. The display panel includes a display panel body with multiple bonding terminals disposed on the backlight side of the display panel body; an adhesive layer disposed on the backlight side of the display panel body, the adhesive layer including multiple first through holes, the first through holes corresponding to the bonding terminals; and a flip-chip film disposed on the side of the adhesive layer away from the display panel body, including a flip-chip film body portion in contact with the adhesive layer, the flip-chip film body portion having multiple connection terminals disposed on the side facing the adhesive layer, the connection terminals corresponding to the first through holes; wherein, conductive adhesive is disposed in the first through holes, and the connection terminals are electrically connected to the bonding terminals through the conductive adhesive. In the display panel provided by this application, the first through holes directly define the formation position of the conductive adhesive, which can provide good support and protection for the conductive adhesive, thus eliminating the need for additional protective adhesive and avoiding the problems of complex manufacturing process and low yield caused by the use of protective adhesive.

[0120] The above provides a detailed description of a display panel and its preparation method according to the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display panel, characterized in that, The display panel includes: The display panel body has multiple bonding terminals on its backlight side; An adhesive layer is disposed on the backlight side of the display panel body, and the adhesive layer includes a plurality of first through holes, the first through holes being disposed corresponding to the bonding terminals; A flip-chip film is disposed on the side of the adhesive layer away from the display panel body, including a flip-chip film body portion in contact with the adhesive layer, and a plurality of connection terminals are disposed on the side of the flip-chip film body portion facing the adhesive layer, and the connection terminals are disposed corresponding to the first through hole; The first through hole is provided with conductive adhesive, and the connecting terminal is electrically connected to the bonding terminal through the conductive adhesive.

2. The display panel according to claim 1, characterized in that, The flip-chip film body includes a plurality of second through holes, which are correspondingly arranged with the first through holes, and the opening area of ​​the second through holes is smaller than the opening area of ​​the first through holes.

3. The display panel according to claim 2, characterized in that, The axis of the first through hole and the axis of the second through hole are collinear.

4. The display panel according to claim 3, characterized in that, The connecting terminal is arranged around the second through hole, and the conductive adhesive is provided in both the first through hole and the second through hole.

5. The display panel according to claim 1, characterized in that, The display panel also includes: A support layer is disposed on the side of the flip-film body that faces away from the display panel body; A heat dissipation buffer composite layer is disposed on the side of the support layer opposite to the display panel body.

6. The display panel according to claim 5, characterized in that, The orthographic projection of the support layer on the display panel body is the first projection, and the orthographic projection of the heat dissipation buffer composite layer on the display panel body is the second projection. Both the first projection and the second projection cover each of the bonding terminals.

7. The display panel according to claim 5, characterized in that, The display panel also includes: A double-sided adhesive layer is disposed on the side of the heat dissipation buffer composite layer that is away from the display panel body; The flip-chip film further includes a flip-chip film extension portion, one end of which is connected to the flip-chip film body portion, and the other end is bent to the side of the double-sided adhesive layer away from the display panel body, and is fixedly connected to the double-sided adhesive layer.

8. The display panel according to claim 7, characterized in that, The display panel also includes: A flexible circuit board is disposed on the side of the flip-chip film extension portion away from the display panel body and is electrically connected to the other end of the flip-chip film extension portion. An integrated circuit is disposed on the side of the flip-film extension that is away from the display panel body.

9. The display panel according to claim 6, characterized in that, The display panel also includes: A flexible circuit board is disposed on the side of the flip-chip film body that is away from the display panel body; An integrated circuit is disposed on the side of the flip-film body portion away from the display panel body; The display panel further includes a notch that penetrates the support layer and the heat dissipation buffer composite layer. The flexible circuit board and the integrated circuit are located within the notch, and the notch is misaligned with the bonding terminal.

10. The display panel according to claim 1, characterized in that, The display panel body includes: The first substrate layer is disposed on the side of the adhesive layer opposite to the body portion of the flip-film; A bonding terminal layer is disposed on the side of the first substrate layer opposite to the flip-film body portion; A barrier layer is provided on the side of the bonding terminal layer opposite to the flip-chip body portion; The second substrate layer is disposed on the side of the barrier layer opposite to the flip-film body portion; The bonding terminal layer includes the plurality of bonding terminals, the first substrate layer includes the plurality of third through holes, the third through holes are connected to the first through holes, and the conductive adhesive fills the first through holes and extends into the third through holes.

11. A method for manufacturing a display panel, characterized in that, The method for manufacturing the display panel includes the following steps: A display panel body is provided, wherein a plurality of bonding terminals are provided on the backlight side of the display panel body; An adhesive layer is formed on the backlight side of the display panel body, wherein the adhesive layer includes a plurality of first through holes, and the first through holes are correspondingly disposed with the bonding terminals; A flip-chip film is formed on the side of the adhesive layer away from the display panel body. The flip-chip film includes a flip-chip film body portion that contacts the adhesive layer. A plurality of connection terminals are provided on the side of the flip-chip film body portion facing the adhesive layer. The connection terminals are provided corresponding to the first through hole. The method for manufacturing the display panel further includes the following steps: providing conductive adhesive in the first through hole, wherein the connecting terminal is electrically connected to the bonding terminal through the conductive adhesive; The step of setting conductive adhesive in the first through hole is located before or after the step of forming a flip-chip film on the side of the adhesive layer away from the display panel body.

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