Light-emitting device and electronic equipment

Abstract

A light-emitting device according to an embodiment of the present disclosure has an insulation layer, an insulating side wall, a lower electrode, an organic layer, and an upper electrode. The side wall is erected so as to enclose the light-emitting region on the insulation layer surface when observed in plan view. The lower electrode is disposed such as to cover from the insulation layer surface enclosed by the side wall to a portion of the side wall inner surface. The organic layer is disposed such as to cover the lower electrode surface and the side wall inner surface not covered by the lower electrode. The upper electrode is disposed such as to cover the organic layer inner surface.

Description

Light-emitting device and electronic device

[0001] The present disclosure relates to a light-emitting device and an electronic device.

[0002] An organic electroluminescence (EL) device is a light-emitting device that constitutes each pixel on the display screen of a display device. An organic EL device includes an organic layer and an upper electrode and a lower electrode that sandwich the organic layer. When a voltage is applied between the upper electrode and the lower electrode, the organic layer emits light.

[0003] As pixels become smaller, degradation of image quality due to color mixing of light emitted from adjacent light-emitting elements becomes a problem for display devices. For this reason, there is a technology to suppress color mixing by providing a pixel separation film between adjacent light-emitting devices (see, for example, Patent Document 1).

[0004] JP 2014-110132 A

[0005] However, when a pixel separation film is provided between adjacent light emitting devices in a display device, the light emitting area of ​​each light emitting device is reduced, resulting in a reduction in light emission intensity.

[0006] Therefore, the present disclosure proposes a light-emitting device and electronic equipment that can increase the light emission intensity.

[0007] A light-emitting device according to an embodiment of the present disclosure includes an insulating layer, an insulating sidewall, a lower electrode, an organic layer, and an upper electrode. The sidewall is erected on the surface of the insulating layer in a plan view so as to surround a light-emitting region. The lower electrode is provided so as to cover the surface of the insulating layer surrounded by the sidewall and a portion of the inner surface of the sidewall. The organic layer is provided so as to cover the surface of the lower electrode and the inner surface of the sidewall that is not covered by the lower electrode. The upper electrode is provided so as to cover the inner surface of the organic layer.

[0008] FIG. 1 is a schematic cross-sectional view showing a configuration example of the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 4 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 6 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 7 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 8 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 9 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 1 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device according to a second embodiment; FIG. 2 is a schematic cross-sectional view showing an example of the configuration of a light-emitting device according to a third embodiment; FIG. 3 is a front view showing an example of the appearance of a digital still camera; FIG. 4 is a rear view showing an example of the appearance of a digital still camera; FIG. 5 is an external view of a head-mounted display; FIG. 6 is an external view of a see-through head-mounted display; FIG. 7 is an external view of a television device; FIG. 8 is an external view of a smartphone; FIG. 9 is a diagram (part 1) showing the internal configuration of a car; FIG. 10 is a diagram (part 2) showing the internal configuration of a car.

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the following embodiments, the same components are designated by the same reference numerals, and redundant description will be omitted. Here, the light-emitting device according to the embodiment will be described as an example in which the light-emitting device is a light-emitting element constituting each pixel on the display screen of an image display device.

[0010] The image display device according to the embodiment is an example of an electronic device having the light emitting device according to the embodiment. Note that the light emitting device according to the embodiment is not limited to light emitting elements that constitute pixels of a display screen. For example, the light emitting device according to the embodiment can also be applied to a light emitter of a lighting fixture.

[0011] <<1. Configuration Example of Light-Emitting Device>> Fig. 1 is a schematic cross-sectional view showing a configuration example of a light-emitting device 1 according to a first embodiment. Note that Fig. 1 selectively shows the light-emitting device 1 for two pixels in the display section of an image display device 10. The light-emitting device 1 is an M-OLED (Micro-Organic Electro Luminescence), which is an organic EL (Organic Electro Luminescence) device with a particularly small element size. A plurality of light-emitting devices 1 are arranged in a matrix in the display section of the image display device 10.

[0012] 1, each light-emitting device 1 includes an insulating layer 11, an insulating sidewall 12, a lower electrode 13, an organic layer 14, an upper electrode 15, and a moisture-absorbing protective film 16. The insulating layer 11 is, for example, a semiconductor oxide film such as silicon oxide.

[0013] The side walls 12 are made of, for example, the same semiconductor oxide film such as silicon oxide as the insulating layer 11. The side walls 12 are erected on the surface of the insulating layer 11 in a plan view so as to surround the light-emitting region of each light-emitting device 1. Specifically, the side walls 12 are provided in a grid pattern in a plan view so as to partition each pixel in the display unit of the image display device 10.

[0014] That is, the sidewalls 12 function as element isolation regions that isolate each pixel, thereby preventing light emitted from one light-emitting device 1 from entering an adjacent light-emitting device 1, thereby preventing color mixing from occurring on the display screen.

[0015] Furthermore, an air gap (void) 17 is provided inside the side wall 12. The air gap 17 has a lower refractive index than the silicon oxide that constitutes the side wall 12. As a result, the air gap 17 reflects light emitted from the adjacent light emitting device 1 and passing through the side wall 12 at the interface with the side wall 12, thereby improving the light collection efficiency of the light emitting device 1.

[0016] The lower electrode 13 is an electrode that functions as an anode electrode of the organic EL. The lower electrode 13 is made of, for example, a TIO (Tinium Tin Oxide) film. Note that the material of the lower electrode 13 is not limited to an ITO film as long as it is a light-transmitting and conductive material.

[0017] The lower electrode 13 is provided so as to continuously cover from the surface of the insulating layer 11 surrounded by the sidewall 12 to a part of the inner surface of the sidewall 12. In other words, the lower electrode 13 is provided so as to have a shallow cup shape.

[0018] The organic layer 14 is provided so as to cover the surface of the lower electrode 13 and the inner surface of the side wall 12 that is not covered by the lower electrode 13. The surface of the lower electrode 13 here refers to the surface of the lower electrode 13 opposite to the surface facing the insulating layer 11 and the side wall 12.

[0019] The upper electrode 15 functions as a cathode electrode of the organic EL element. The upper electrode 15 is made of, for example, an IZO (Indium Zinc Oxide) film. The material for the upper electrode 15 is not limited to the IZO film, as long as it is a light-transmitting and conductive material.

[0020] The upper electrode 15 is provided so as to cover the inner surface of the organic layer 14. Here, the inner surface of the organic layer 14 refers to the surface of the organic layer 14 opposite to the surface facing the lower electrode 13 and the side wall 12.

[0021] The moisture absorbing protective film 16 is made of, for example, a nitride semiconductor film such as silicon nitride. The moisture absorbing protective film 16 may also be made of aluminum oxide. The moisture absorbing protective film 16 is provided so as to cover the entire surface of the display unit of the image display device 10 including the light emitting device 1. This allows the moisture absorbing protective film 16 to suppress performance degradation of the organic layer 14 due to moisture.

[0022] In the light-emitting device 1, the organic layer 14 emits light when a predetermined voltage is applied between the lower electrode 13 and the upper electrode 15. At this time, the region of the organic layer 14 sandwiched between the lower electrode 13 and the upper electrode 15 emits light.

[0023] Here, lower electrode 13 has a bottom surface portion covering insulating layer 11 and a side surface portion that is continuous from the bottom surface portion and covers part of sidewall 12. Therefore, in light-emitting device 1, organic layer 14 in a portion between the bottom surface portion of lower electrode 13 and upper electrode 15 also emits light from organic layer 14 in a portion between the side surface portion of lower electrode 13 and upper electrode 15.

[0024] As a result, even if the occupied area of ​​the light-emitting device 1 is reduced by providing the side walls 12, the light-emitting area in the organic layer 14 is larger than that of a typical organic EL device that has a flat lower electrode, for example, and therefore the light-emitting intensity can be increased.

[0025] Furthermore, in the light-emitting device 1, as shown by the straight arrows in FIG. 1 , the light rays emitted from the light-emitting region of the organic layer 14 are reflected by the sidewalls 12, which not only suppresses the occurrence of color mixing but also improves the light-collection efficiency.

[0026] Furthermore, in the light-emitting device 1, the air gap 17 having a lower refractive index than the material of the side wall 12 is provided inside the side wall 12, so that even if a part of the light emitted from the light-emitting region passes through the side wall 12, the transmitted light is reflected at the interface between the side wall 12 and the air gap 17. This allows the light-emitting device 1 to improve the light-collection efficiency.

[0027] 2. Method for Manufacturing Light-Emitting Device According to First Embodiment Next, a method for manufacturing the light-emitting device 1 according to the first embodiment will be described with reference to Fig. 2 to Fig. 11C. Fig. 2 to Fig. 11C are schematic cross-sectional views showing the manufacturing process of the light-emitting device 1 according to the first embodiment.

[0028] 2, when manufacturing the light emitting device 1, for example, an insulating layer 11 is formed on a semiconductor substrate such as a silicon substrate using a semiconductor oxide film such as silicon oxide. Then, a low refractive index layer having a refractive index lower than that of silicon oxide, such as amorphous silicon or amorphous carbon, is formed on the insulating layer 11.

[0029] Next, the low-refractive-index layer is patterned to have a grid shape in a plan view, so as to surround the region where the lower electrode 13 of each light-emitting device 1 will be formed later, thereby forming low-refractive-index regions 18. At this time, the low-refractive-index regions 18 are formed in a tapered shape that narrows the further they are from the insulating layer 11. This makes it possible to improve the light-collection efficiency of light emitted from the organic layer 14, which will be formed later. Next, the surface of the low-refractive-index regions 18 is covered with an oxide semiconductor film such as silicon oxide, to form sidewalls 12.

[0030] Thereafter, as shown in Fig. 3, an ITO film 13A is formed on the surface of the insulating layer 11 and the sidewall. Next, as shown in Fig. 4, the hole covered with the ITO film 13A is filled with resist 19, and then the resist 19 in the portion of the hole shallower than the portion of the ITO film 13A to be left as the lower electrode 13 is etched back and removed by dry etching or wet etching. At this time, the area of ​​the lower electrode 13 is determined by the depth to which the resist 19 is left. The larger the area of ​​the lower electrode 13, the larger the area that becomes the light-emitting region in the organic layer 14.

[0031] Thereafter, using the resist as a mask, the ITO film 13A in the portion that does not become the lower electrode 13 is etched back by dry etching or wet etching to form the lower electrode 13. Next, after removing the resist used as the mask, the organic layer 14, the upper electrode 15, and the moisture-absorbing protective film 16 are laminated and formed on the lower electrode 13 and the sidewall 12, as shown in FIG.

[0032] At this time, first, the organic layer 14 is formed to a predetermined thickness and to cover the entire surfaces of the lower electrode 13 and the sidewall 12. Next, the upper electrode 15 is formed from IZO so as to cover the entire surface of the organic layer 14. Then, the moisture absorbing protective film 16 is formed from silicon nitride so as to cover the entire surface of the upper electrode 15.

[0033] Thereafter, as shown in FIG. 6, the structure shown in FIG. 5 is etched back from the top surface of the moisture absorbing protective film 16 to a position reaching the top of the side wall 12, thereby electrically isolating the upper electrodes 15 of each light emitting device 1 from each other.

[0034] Next, as shown in Fig. 7, a silicon nitride film is formed on the entire surface of the structure shown in Fig. 6 to form a moisture absorbing protective film 16. Thereafter, as shown in Fig. 8, an opening is formed in the center of the top of the side wall 12 so as to reach the low refractive index region 18, and the side wall 12 is exposed to plasma in a vacuum state to remove the low refractive index region 18 inside the side wall 12, thereby forming an air gap 17, and the light emitting device 1 is completed.

[0035] Here, the process of removing the low refractive index regions 18 will be described with reference to Figures 9A to 11C. Figures 9A, 10A, and 11A are schematic cross-sectional views of four light-emitting devices 1 corresponding to four pixels, taken along line A-A in Figure 7. Figure 9B is a schematic cross-sectional view of the light-emitting device 1 taken along line B-B in Figure 9A. Figure 9C is a schematic cross-sectional view of the light-emitting device 1 taken along line C-C in Figure 9A.

[0036] Fig. 10B is a schematic cross-sectional view of the light-emitting device 1 taken along line B-B shown in Fig. 10A. Fig. 10C is a schematic cross-sectional view of the light-emitting device 1 taken along line CC shown in Fig. 9A. Fig. 11B is a schematic cross-sectional view of the light-emitting device 1 taken along line B-B shown in Fig. 11A. Fig. 11C is a schematic cross-sectional view of the light-emitting device 1 taken along line CC shown in Fig. 11A.

[0037] 9A, 10A, and 11A, components other than the sidewall 12, the organic layer 14, and the low refractive index region 18 are omitted from the illustration in order to facilitate understanding of the method for removing the low refractive index region 18.

[0038] 9A, 9B, and 9C before the low refractive index regions 18 are removed. From this state, openings are formed at the intersections of the side walls 12 that partition the organic layer 14 into a grid shape in a plan view, as shown in FIG. 10A.

[0039] 10B, openings are formed at the intersections of the side walls 12 from the surface of the moisture absorbing protective film 16 to a depth that reaches the top surface of the low refractive index region 18, thereby exposing the surface of the low refractive index region 18. On the other hand, as shown in FIG. 10C, no openings are formed in the moisture absorbing protective film 16 other than at the intersections of the side walls 12. In this way, by minimizing the number of openings formed in the moisture absorbing protective film 16, it is possible to prevent a decrease in the mechanical strength of the light emitting device 1.

[0040] 11A, 11B, and 11C, when the light-emitting device 1 with the opening formed therein is subjected to a vacuum plasma treatment, only the low refractive index region 18 is removed by dry etching, and an air gap 17 is formed inside the sidewall 12. The low refractive index region 18 may also be removed by wet etching.

[0041] 12 is a schematic cross-sectional view showing an example of the configuration of a light emitting device 1A according to the second embodiment. As shown in Fig. 12, the light emitting device 1A of the image display device 10A according to the second embodiment differs from the light emitting device 1 according to the first embodiment in the internal structure of the insulating layer 11, but the other configurations are similar to those of the light emitting device 1 according to the first embodiment.

[0042] The insulating layer 11 of the light-emitting device 1A is provided with a metal layer 21 therein. As a result, in the light-emitting device 1A, even if light emitted from the organic layer 14 passes through the lower electrode 13 and enters the insulating layer 11, as shown by the straight arrows in Fig. 12, the light is reflected by the metal layer 21, thereby preventing a decrease in the light emission intensity.

[0043] Furthermore, the metal layer 21 is electrically connected to the lower electrode 13 by, for example, a metallic via 22. This allows the light emitting device 1A to use the metal layer 21 both to reflect light rays and as wiring for applying a voltage to the lower electrode.

[0044] Furthermore, air gap 17 of light-emitting device 1A extends from the inside of side wall 12 to the inside of insulating layer 11. As a result, light-emitting device 1A can improve the light-collection efficiency by reflecting light rays that are emitted from organic layer 14, transmitted through lower electrode 13, and reflected by metal layer 21 at the interface between side wall 12 and air gap 17, as indicated by the straight arrows in Fig. 12 .

[0045] The metal layer 21 and via 22 shown in Figure 12 may be provided in the insulating layer 11 of the light-emitting device 1 according to the first embodiment, or may be provided in the insulating layer 11 of the light-emitting device 1B according to the third embodiment (see Figure 13) described next.

[0046] <<4. Light-emitting device according to the third embodiment>> A schematic cross-sectional view showing an example of the configuration of a light-emitting device 1B according to the third embodiment. As shown in Fig. 13, the light-emitting device 1B of the image display device 10B according to the third embodiment has a low refractive index region 18 provided inside the side wall 12 instead of the air gap 17 of the light-emitting device 1 shown in Fig. 1. The other configuration is the same as that of the light-emitting device 1 according to the first embodiment.

[0047] 7. Therefore, the number of manufacturing steps for the light emitting device 1B can be reduced compared to the light emitting device 1 according to the first embodiment, thereby reducing manufacturing costs. Furthermore, the light emitting device 1B has no air gap 17 inside the sidewall 12, and the low refractive index region 18 is filled inside the sidewall 12, resulting in increased mechanical strength.

[0048] Moreover, the low refractive index region 18 has a lower refractive index than the side wall 12. Therefore, the light emitting device 1B can prevent light emitted from the organic layer 14 from entering an adjacent light emitting device 1B, thereby preventing color mixing. Furthermore, light rays reflected at the interface between the side wall 12 and the low refractive index region 18 return to the light emitting device 1B that emitted the light. This allows the light condensing efficiency of the light emitting device 1B to be improved.

[0049] <<5. Structure of Organic Layer>> The light emitting devices 1, 1A, and 1B according to the first to third embodiments function as pixels on the display screen of the image display device 10. Therefore, each of the light emitting devices 1, 1A, and 1B emits white light or light of one of the three primary colors.

[0050] Specifically, the organic layer 14 may have a white-type structure in which, for example, light-emitting layers of three colors, red, green, and blue, are stacked, i.e., white light is extracted. Alternatively, in this embodiment, the organic layer 14 may be any of the light-emitting layers of three colors, red, green, and blue. Furthermore, in this embodiment, the organic layer 14 may be formed from an organic material or an inorganic material.

[0051] More specifically, the organic layer 14 may have a structure in which, for example, a hole injection layer, a hole transport layer, a light emitting layer, a light emitting separation layer, and an electron transport layer are stacked.

[0052] The hole injection layer can be made of, for example, hexaazatriphenylene (HAT).

[0053] The hole transport layer can be composed of, for example, α-NPD [N,N'-di(1-naphthalyl)-N,N'-diphenyl-[1,1'-biphenyl]-4,4'-diamine].

[0054] In the red light-emitting layer, a portion of holes injected from the lower electrode 13 via the hole injection layer and the hole transport layer and a portion of electrons injected from the upper electrode 15 via the electron transport layer are recombined under application of an electric field, thereby generating red light. The red light-emitting layer contains, for example, at least one of a red light-emitting material, a hole transport material, an electron transport material, and a positive and negative charge transport material. The red light-emitting material may be a fluorescent material or a phosphorescent material. Specifically, the red light-emitting layer may be composed of, for example, a mixture of 4,4-bis(2,2-diphenylvinyl)biphenyl (DPVBi) and 30 wt % of 2,6-bis[(4'-methoxydiphenylamino)styryl]-1,5-dicyanonaphthalene (BSN).

[0055] When an electric field is applied, some of the holes injected from the lower electrode 13 via the hole injection layer, hole transport layer, and emission separation layer and some of the electrons injected from the upper electrode 15 via the electron transport layer recombine to generate blue light. The blue light-emitting layer contains, for example, at least one of a blue light-emitting material, a hole transport material, an electron transport material, and a bipolar charge transport material. The blue light-emitting material may be a fluorescent material or a phosphorescent material. Specifically, the blue light-emitting layer may be composed of, for example, DPVBi mixed with 2.5 wt % of 4,4'-bis[2-{4-(N,N-diphenylamino)phenyl}vinyl]biphenyl (DPAVBi).

[0056] When an electric field is applied, some of the holes injected from the lower electrode 13 via the hole injection layer, hole transport layer, and emission separation layer and some of the electrons injected from the upper electrode 15 via the electron transport layer recombine to generate green light. The green light-emitting layer contains, for example, at least one of a green light-emitting material, a hole transport material, an electron transport material, and a bipolar charge transport material. The green light-emitting material may be a fluorescent material or a phosphorescent material. Specifically, the green light-emitting layer may be composed of, for example, DPVBi mixed with 5 wt % coumarin 6.

[0057] The emission separation layer is a layer for adjusting the injection of carriers into the emission layers, and the balance of light emission of each color is adjusted by injecting electrons and holes into each emission layer through the emission separation layer. The emission separation layer can be composed of, for example, a 4,4'-bis[N-(1-naphthyl)-N-phenyl-amino]biphenyl derivative.

[0058] The electron transport layer may be made of, for example, BCP (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Alq3 (aluminum quinolinol), Bphen (bathophenanthroline), etc. The electron transport layer is made up of at least one layer, and may include an electron transport layer doped with an alkali metal or alkaline earth metal.

[0059] The electron transport layer doped with an alkali metal or alkaline earth metal can be configured by doping, for example, 0.5 to 15 wt % of a host material such as BCP (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Alq3 (aluminum quinolinol), or Bphen (bathophenanthroline) with, for example, 0.5 to 15 wt % of an alkali metal such as lithium (Li), sodium (Na), potassium (K), rubidium (Rb), or cesium (Cs) or an alkaline earth metal such as magnesium (Mg), calcium (Ca), strontium (Sr), or barium (Ba) as a dopant material by co-evaporation.

[0060] An electron injection layer may be provided between the electron transport layer and the upper electrode 15. The electron injection layer is intended to enhance electron injection from the cathode and may be composed of an alkali metal or alkaline earth metal, a compound containing the alkali metal or alkaline earth metal, or a mixture containing the alkali metal or alkaline earth metal. For example, the electron injection layer may be composed of lithium (Li), lithium fluoride (LiF), or the like.

[0061] A buffer layer may be provided between the electron transport layer and the upper electrode 15. The buffer layer is intended to mitigate process damage during the deposition of the upper electrode 15. The buffer layer may be made of, for example, Mg, magnesium silver alloy (MgAg), Ca, Li, LiF, or lithium carbonate (Li ２ CO ３ ), Cs, cesium carbonate (Cs ２ CO ３ The alkali metal or alkaline earth metal may be a simple substance, a compound containing the alkali metal or alkaline earth metal, or a mixture containing the alkali metal or alkaline earth metal.

[0062] The thickness of each layer constituting the organic layer 14 is preferably, for example, 1 to 20 nm for the hole injection layer, 10 to 200 nm for the hole transport layer, 5 to 50 nm for the light emitting layer, and 10 to 200 nm for the electron transport layer.

[0063] <<6. Application Examples>> For example, the technology according to the present disclosure may be applied to the display units of various electronic devices, etc. Therefore, examples of electronic devices to which the technology can be applied will be described below.

[0064] 14A is a front view showing an example of the appearance of a digital still camera 500, and Fig. 14AB is a rear view showing an example of the appearance of the digital still camera 500. This digital still camera 500 is an interchangeable lens single-lens reflex type, and has an interchangeable taking lens unit (interchangeable lens) 512 located approximately in the center of the front of a camera main body 511, and a grip part 513 for the photographer to hold on the left side of the front.

[0065] A monitor 514 is provided at a position shifted to the left from the center on the back of the camera body 511. An electronic viewfinder (eyepiece window) 515 is provided above the monitor 514. By looking through the electronic viewfinder 515, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 512 and determine the composition. The monitor 514 and the electronic viewfinder 515 can be an image display device 10 that employs the light-emitting devices 1, 1A, and 1B according to the embodiments of the present disclosure as pixels.

[0066] 15 is an external view of a head-mounted display 600. The head-mounted display 600 has, for example, ear hooks 612 for wearing on the user's head on both sides of a glasses-shaped display unit 611. In this head-mounted display 600, the display unit 611 can be an image display device 10 that employs the light-emitting devices 1, 1A, and 1B according to the embodiments of the present disclosure as pixels.

[0067] 16 is an external view of a see-through head mounted display 634. The see-through head mounted display 634 is composed of a main body 632, an arm 633, and an eyepiece tube 631.

[0068] The main body 632 is connected to the arm 633 and the glasses 630. Specifically, an end of the long side of the main body 632 is coupled to the arm 633, and one side of the main body 632 is connected to the glasses 630 via a connecting member. The main body 632 may also be worn directly on the head of the human body.

[0069] The main body 632 incorporates a control board for controlling the operation of the see-through head-mounted display 634 and a display unit. The arm 633 connects the main body 632 to the lens barrel 631 and supports the lens barrel 631. Specifically, the arm 633 is coupled to an end of the main body 632 and an end of the lens barrel 631, respectively, and fixes the lens barrel 631. The arm 633 also incorporates a signal line for communicating data related to images provided from the main body 632 to the lens barrel 631.

[0070] The lens barrel 631 projects image light provided from the main body 632 via the arm 633 through an eyepiece lens toward the eyes of a user wearing the see-through head-mounted display 634. In this see-through head-mounted display 634, the display unit of the main body 632 can be an image display device 10 that employs the light-emitting devices 1, 1A, and 1B according to the embodiments of the present disclosure as pixels.

[0071] 17 shows an example of the appearance of a television device 710. This television device 710 has, for example, a video display screen unit 711 including a front panel 712 and a filter glass 713, and this video display screen unit 711 is configured by an image display device 10 that employs the light-emitting devices 1, 1A, and 1B according to the embodiments of the present disclosure as pixels.

[0072] 18 shows an example of the appearance of a smartphone 800. The smartphone 800 has a display unit 802 that displays various information, an operation unit that includes buttons and the like that accept operation inputs from a user, etc. The display unit 802 can be an image display device 10 that employs the light-emitting devices 1, 1A, and 1B according to this embodiment as pixels.

[0073] 19A and 19B are diagrams showing the internal configuration of a vehicle having, as a display device, an image display device 10 that employs, as pixels, the light-emitting devices 1, 1A, and 1B according to embodiments of the present disclosure. In detail, Fig. 19A is a diagram showing the interior of the vehicle from the rear to the front, and Fig. 19B is a diagram showing the interior of the vehicle from diagonally rear to diagonally front.

[0074] 19A and 19B has a center display 911, a console display 912, a head-up display 913, a digital rearview mirror 914, a steering wheel display 915, and a rear entertainment display 916. Some or all of these displays can be implemented by the image display device 10 that employs the light-emitting devices 1, 1A, and 1B according to the embodiments of the present disclosure as pixels.

[0075] The center display 911 is disposed on the center console 907 in a position facing the driver's seat 901 and the passenger seat 902. While FIGS. 19A and 19B show an example of a horizontally elongated center display 911 extending from the driver's seat 901 side to the passenger seat 902 side, the screen size and location of the center display 911 are arbitrary. The center display 911 can display information detected by various sensors (not shown). As a specific example, the center display 911 can display an image captured by an image sensor, a distance image to obstacles in front of or to the side of the vehicle measured by a ToF (Time of Flight) sensor, the body temperature of a passenger detected by an infrared sensor, etc. The center display 911 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information.

[0076] The safety-related information includes information such as detection of drowsiness, distraction, child mischief, whether a seatbelt is fastened, and whether a passenger has been abandoned. This information is detected, for example, by a sensor (not shown) placed on the back side of the center display 1911. The operation-related information is obtained by detecting gestures related to passenger operations using a sensor. The detected gestures may include operations of various in-vehicle equipment. For example, the sensor may detect operations of the air conditioning system, navigation system, AV (Audio / Visual) system, lighting system, etc. The life log includes life logs of all passengers. For example, the life log includes a record of each passenger's behavior while in the vehicle. By acquiring and saving the life log, the condition of the passenger at the time of the accident can be confirmed. The health-related information is obtained by detecting the passenger's body temperature using a temperature sensor and inferring the passenger's health condition based on the detected body temperature. Alternatively, the passenger's face may be captured using an image sensor, and the passenger's health condition may be inferred from the facial expression in the captured image. Furthermore, the system may have an automated voice conversation with the occupant and estimate the occupant's health condition based on the occupant's responses. The authentication / identification-related information includes a keyless entry function that uses a sensor to perform facial recognition, a function that automatically adjusts seat height and position using facial recognition, etc. The entertainment-related information includes a function that uses a sensor to detect operation information of an AV device by the occupant, and a function that recognizes the occupant's face using a sensor and provides content suitable for the occupant via the AV device.

[0077] The console display 912 can be used to display, for example, life log information. The console display 912 is disposed near the shift lever 908 on the center console 907 between the driver's seat 901 and the passenger seat 902. The console display 912 can also display information detected by various sensors (not shown). The console display 912 may also display an image of the vehicle's surroundings captured by an image sensor, or an image showing the distance to obstacles around the vehicle.

[0078] The head-up display 913 is virtually displayed behind the windshield 904 in front of the driver's seat 901. The head-up display 913 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. Since the head-up display 913 is often virtually disposed in front of the driver's seat 901, it is suitable for displaying information directly related to the operation of the vehicle, such as the vehicle's speed and remaining fuel (battery) level.

[0079] The digital rearview mirror 914 can not only display the view behind the vehicle but also the status of passengers in the rear seats. Therefore, by placing a sensor (not shown) on the back side of the digital rearview mirror 914, it can be used to display life log information, for example.

[0080] The steering wheel display 915 is disposed near the center of the steering wheel 906 of the vehicle. The steering wheel display 915 can be used to display at least one of, for example, safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the steering wheel display 915 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, and for displaying information regarding the operation of AV equipment, air conditioning equipment, etc.

[0081] The rear entertainment display 916 is attached to the back side of the driver's seat 901 and the passenger seat 902 and is intended for viewing by rear seat passengers. The rear entertainment display 916 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, since the rear entertainment display 916 is located directly in front of the rear seat passengers, information related to the rear seat passengers is displayed on the rear entertainment display 916. For example, the rear entertainment display 916 may display information related to the operation of an AV device or an air conditioning system, or may display the results of measurements such as the body temperature of the rear seat passengers taken with a temperature sensor (not shown).

[0082] (Effects) The light-emitting devices 1, 1A, and 1B according to the embodiments have an insulating layer 11, insulating side walls 12, a lower electrode 13, an organic layer 14, and an upper electrode 15. The side walls 12 are erected on the surface of the insulating layer 11 so as to surround the light-emitting region in a plan view. The lower electrodes 13 are provided so as to cover the surface of the insulating layer 11 surrounded by the side walls 12 and a portion of the inner surface of the side walls 12. The organic layer 14 is provided so as to cover the surface of the lower electrodes 13 and the inner surfaces of the side walls 12 that are not covered by the lower electrodes 13. The upper electrodes 15 are provided so as to cover the inner surfaces of the organic layers 14.

[0083] Therefore, in the light-emitting device 1, in addition to the organic layer 14 in the portion between the bottom surface portion of the lower electrode 13 and the upper electrode 15, the organic layer 14 in the portion between the side surface portion of the lower electrode 13 and the upper electrode 15 also emits light. This increases the light-emitting region in the organic layer 14 of the light-emitting device 1, thereby enabling an increase in emission intensity.

[0084] Furthermore, the side wall 12 has an air gap 17 therein. Therefore, even if part of the light emitted from the light-emitting region passes through the side wall 12, the transmitted light is reflected at the interface between the side wall 12 and the air gap 17. This allows the light-emitting device 1 to improve the light-collection efficiency.

[0085] Furthermore, the light emitting device 1B has a low refractive index region 18 having a refractive index lower than that of the semiconductor oxide film 10 provided inside the sidewall 12. Therefore, the light emitting device 1B can suppress the occurrence of color mixing by preventing light rays emitted from the organic layer 14 from entering the adjacent light emitting device 1B. Furthermore, light rays reflected at the interface between the sidewall 12 and the low refractive index region 18 return toward the light emitting device 1B that emitted the light rays. This allows the light emitting device 1B to improve its light collection efficiency.

[0086] Furthermore, the light-emitting device 1A has a metal layer 21 provided inside the insulating layer 11. As a result, in the light-emitting device 1A, even if light emitted from the organic layer 14 passes through the lower electrode 13 and enters the insulating layer 11, as shown by the straight arrows in Fig. 12, the light is reflected by the metal layer 21, thereby preventing a decrease in the light emission intensity.

[0087] Furthermore, the metal layer 21 is electrically connected to the lower electrode 13. This allows the light emitting device 1A to use the metal layer 21 both to reflect light rays and as wiring for applying a voltage to the lower electrode.

[0088] Furthermore, light-emitting device 1A has air gap 17 extending from the inside of side wall 12 to the inside of insulating layer 11. As a result, light-emitting device 1A can reflect light emitted from organic layer 14, transmitted through lower electrode 13, and reflected by metal layer 21 at the interface between side wall 12 and air gap 17, as indicated by the straight arrow in Fig. 12, thereby improving the light-collection efficiency.

[0089] The organic layer 14 emits white light or light of one of the three primary colors, thereby making the light emitting devices 1, 1A, and 1B applicable to image display devices 10, 10A, and 10B that display color images.

[0090] Moreover, an electronic device (image display device 10) according to the embodiment includes light-emitting devices 1, 1A, and 1B. The light-emitting devices 1, 1A, and 1B each include an insulating layer 11, an insulating sidewall 12, a lower electrode 13, an organic layer 14, and an upper electrode 15. The sidewall 12 is erected on the surface of the insulating layer 11 so as to surround a light-emitting region in a planar view. The lower electrode 13 is provided so as to cover the surface of the insulating layer 11 surrounded by the sidewall 12 and a portion of the inner surface of the sidewall 12. The organic layer 14 is provided so as to cover the surface of the lower electrode 13 and the inner surface of the sidewall 12 that is not covered by the lower electrode 13. The plurality of light-emitting devices 1, 1A, and 1B are arranged two-dimensionally. This allows the electronic device according to the embodiment to have a larger light-emitting region in the organic layer 14, thereby increasing the light-emitting intensity.

[0091] The present technology can also be configured as follows. (1) A light-emitting device having an insulating layer, an insulating sidewall erected on the surface of the insulating layer in a plan view so as to surround a light-emitting region, a lower electrode provided so as to cover from the surface of the insulating layer surrounded by the sidewall to a part of the inner surface of the sidewall, an organic layer provided so as to cover the surface of the lower electrode and the inner surface of the sidewall that is not covered by the lower electrode, and an upper electrode provided so as to cover the inner surface of the organic layer. (2) The light-emitting device according to (1), wherein the sidewall has an air gap therein. (3) The light-emitting device according to (1), wherein the sidewall has a low-refractive-index region provided inside the sidewall, the low-refractive-index region having a refractive index lower than that of a semiconductor oxide film. (4) The light-emitting device according to any one of (1) to (3), wherein the insulating layer has a metal layer provided inside the insulating layer. (5) The light-emitting device according to (4), wherein the metal layer is electrically connected to the lower electrode. (6) The light-emitting device according to (5), wherein the sidewall has an air gap extending into the insulating layer. (7) The light-emitting device according to any one of (1) to (6), wherein the organic layer emits light of white or one of three primary colors. (8) An electronic device in which a plurality of light-emitting devices are two-dimensionally arranged, each light-emitting device having an insulating layer, an insulating sidewall standing on a surface of the insulating layer so as to surround a light-emitting region in a plan view, a lower electrode provided so as to cover from the surface of the insulating layer surrounded by the sidewall to a part of an inner surface of the sidewall, an organic layer provided so as to cover a surface of the lower electrode and an inner surface of the sidewall that is not covered by the lower electrode, and an upper electrode provided so as to cover the surface of the organic layer.

[0092] REFERENCE SIGNS LIST 1, 1A, 1B Light-emitting device 11 Insulating layer 12 Sidewall 13 Lower electrode 14 Organic layer 15 Upper electrode 16 Moisture-absorbing protective film 17 Air gap 18 Low refractive index region

Claims

1. A light-emitting device having an insulating layer; insulating side walls erected on the surface of the insulating layer in a planar view so as to surround a light-emitting region; a lower electrode provided so as to cover from the surface of the insulating layer surrounded by the side walls to a portion of the inner surface of the side walls; an organic layer provided so as to cover the surface of the lower electrode and the inner surface of the side walls that is not covered by the lower electrode; and an upper electrode provided so as to cover the inner surface of the organic layer.

2. The light emitting device according to claim 1, wherein the sidewall has an air gap therein.

3. The light emitting device according to claim 1, further comprising a low refractive index region provided inside said side wall and having a refractive index lower than that of the semiconductor oxide film.

4. The light emitting device according to claim 1, further comprising a metal layer provided inside the insulating layer.

5. The light emitting device according to claim 4, wherein the metal layer is electrically connected to the lower electrode.

6. The light emitting device of claim 5, further comprising an air gap extending from the interior of said sidewall to the interior of said insulating layer.

7. The light-emitting device according to claim 1, wherein the organic layer emits light of white or one of the three primary colors.

8. An electronic device in which a plurality of light-emitting devices are arranged two-dimensionally, each of the light-emitting devices comprising: an insulating layer; insulating side walls erected on the surface of the insulating layer so as to surround a light-emitting region in a planar view; a lower electrode provided so as to cover from the surface of the insulating layer surrounded by the side walls to a part of the inner surface of the side walls; an organic layer provided so as to cover the surface of the lower electrode and the inner surface of the side walls that is not covered by the lower electrode; and an upper electrode provided so as to cover the surface of the organic layer.

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