Image sensor, camera module, and electronic device including same

Abstract

This image sensor and / or an electronic device including same comprises: an imaging surface including an array of a plurality of photodiodes; and a microlens array disposed on the imaging surface and including an array of a plurality of microlenses disposed to correspond to at least two adjacent photodiodes among the plurality of photodiodes, respectively, wherein each of the plurality of microlenses may provide a first lens region corresponding to a first photodiode of the at least two adjacent photodiodes, a second lens region corresponding to a second photodiode of the at least two adjacent photodiodes, and a concave portion disposed between an incident surface of the first lens region and an incident surface of the second lens region. The incident surface of the first lens region may have an asymmetric shape with respect to the apex of the incident surface of the first lens region, the incident surface of the first lens region and the incident surface of the second lens region may have a symmetrical shape with respect to each other, and the imaging surface may be configured to receive or detect light transmitted through the microlens array.

Description

Image sensors, camera modules and electronic devices including them

[0001] Embodiments of the present disclosure relate to image sensors, for example, image sensors, camera modules and / or electronic devices including the same.

[0002] Light Field technology, which individually divides each light beam incident on a camera lens to form an image, is widely known. According to Light Field technology, by arranging a microlens in front of the image sensor, in addition to the main lens that constitutes the camera, the intensity information of light passing through the main lens can be separated and stored by direction.

[0003] Phase detect auto focusing (PDAF) can be implemented using Light Field technology to divide the image into different focus points based on the incident light. While this technology, which separates the intensity information of the incident light by direction, can be useful, the process of equipping the image sensor with micro lenses has limitations in miniaturization. Consequently, some of the light receiving elements equipped on the image sensor cannot be used for image acquisition or output, resulting in images with lower resolution compared to the number of pixels equipped on the image sensor.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to one embodiment of the present disclosure, an image sensor and / or an electronic device including the same may include a photodiode array including an array of a plurality of photodiodes, and a microlens array disposed on or above the photodiode array, the microlens array including an array of a plurality of microlenses disposed respectfully corresponding to at least two adjacent photodiodes among the plurality of photodiodes. In one embodiment, each of the plurality of microlenses may provide a first lens region corresponding to a first photodiode among the at least two adjacent photodiodes, a second lens region corresponding to a second photodiode among the at least two adjacent photodiodes, and a concave portion disposed between an incident surface of the first lens region and an incident surface of the second lens region. In one embodiment, the incident surface of the first lens region may have an asymmetrical shape with respect to a vertex of the incident surface of the first lens region, and the incident surface of the first lens region and the incident surface of the second lens region may have symmetrical shapes with respect to each other. In one embodiment, the photodiode array may be configured to receive or detect light transmitted through the microlens array.

[0006] According to one embodiment of the present disclosure, a camera module and / or an electronic device including the same may include a lens unit, and an image sensor configured to receive or detect light focused or guided by the lens unit. In one embodiment, the image sensor may include a photodiode array that converts light focused or guided by the lens unit into an electrical signal by including an array of a plurality of photodiodes, and an array of a plurality of micro lenses each arranged corresponding to at least two adjacent photodiodes among the plurality of photodiodes, and may include a micro lens array arranged between the lens unit and the photodiode array. In one embodiment, each of the plurality of micro lenses may provide a first lens region corresponding to a first photodiode among the at least two adjacent photodiodes, a second lens region corresponding to a second photodiode among the at least two adjacent photodiodes, and a concave region arranged between an incident surface of the first lens region and an incident surface of the second lens region. In one embodiment, the incident surface of the first lens area may have an asymmetrical shape with respect to the vertex of the incident surface of the first lens area, and the incident surface of the first lens area and the incident surface of the second lens area may have symmetrical shapes with respect to each other.

[0007] According to one embodiment of the present disclosure, an electronic device may include a camera module (180) of the above-described and / or hereinafter-described embodiments. In one embodiment, in a first shooting mode, the first photodiode and the second photodiode may be configured to function as independent pixels with respect to each other, and in a second shooting mode different from the first shooting mode, the first photodiode and the second photodiode may be configured to be combined to function as one pixel.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a block diagram illustrating components of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a diagram illustrating an image sensor according to one embodiment of the present disclosure.

[0012] FIG. 4 is a diagram illustrating a pixel group including a micro lens and a filter array according to one embodiment of the present disclosure.

[0013] FIG. 5 is a diagram illustrating a 4PD pixel structure according to one embodiment of the present disclosure.

[0014] FIG. 6 is a diagram illustrating an image sensor according to one embodiment of the present disclosure.

[0015] FIG. 7 is a drawing showing a structure in which unit micro lenses are arranged in an image sensor according to one embodiment of the present disclosure.

[0016] FIG. 8 is a drawing for explaining the distribution of incident light in an image sensor according to one embodiment of the present disclosure.

[0017] FIG. 9 is a drawing showing a micro lens array (or micro lens) of an image sensor according to one embodiment of the present disclosure.

[0018] FIG. 10 is a drawing showing a micro lens array (or micro lens) of an image sensor according to one embodiment of the present disclosure.

[0019] FIG. 11 is a drawing showing a micro lens array (or micro lens) of an image sensor according to one embodiment of the present disclosure.

[0020] FIG. 12 is a drawing showing a micro lens array (or micro lens) of an image sensor according to one embodiment of the present disclosure.

[0021] FIG. 13 is a diagram showing a color filter array of an image sensor according to one embodiment of the present disclosure.

[0022] FIG. 14 is a diagram showing a color filter array of an image sensor according to one embodiment of the present disclosure.

[0023] FIG. 15 is a diagram showing a color filter array of an image sensor according to one embodiment of the present disclosure.

[0024] FIG. 16 is a diagram showing a color filter array of an image sensor according to one embodiment of the present disclosure.

[0025] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0026] When performing auto focusing (AF) based on phase difference, the higher the separation ratio of the microlens, the easier it is to obtain phase difference information. However, as the number of light-receiving elements (e.g., photodiodes) for phase difference detection increases, or as the separation ratio increases while the same number of light-receiving elements are used for phase difference detection, the quality of the acquired image may deteriorate. For example, when the number of light-receiving elements for phase difference detection increases and / or the separation ratio increases, image information about the subject may decrease, artifacts may occur during the remosaic processing, or the resolution of the output image may deteriorate.

[0027] One embodiment of the present disclosure is intended to at least resolve the above-described problems and / or disadvantages and provide at least the advantages described below, thereby providing an image sensor, a camera module and / or an electronic device including the same that maintains light collection performance while lowering the separation ratio.

[0028] One embodiment of the present disclosure may provide a camera module and / or an electronic device including the same that can provide improved image quality while implementing a focus adjustment function based on phase difference.

[0029] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0030] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0031] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0032] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment of the present disclosure. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0034] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0035] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0036] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0041] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0042] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0046] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0048] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0051] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0052] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0056] The embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it is understood that the component can be connected to the other component directly (e.g., wired), wirelessly, or via a third component.

[0057] The term "module" used in the embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0058] Embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0059] According to one embodiment, a method according to the embodiment(s) of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0060] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0061] FIG. 2 is a block diagram illustrating components of an electronic device (200) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure. The electronic device (200) (e.g., a camera) according to one embodiment can capture a photo (or video) by collecting light reflected by a subject. The electronic device (200) may include an image capture unit (210), an image interface (220), an image processing unit (230), a first memory (240), a processor (260), a display (270), and a second memory (280). According to one embodiment of the present disclosure, the image capture unit (210) may constitute a camera (e.g., the camera module (180) of FIG. 1), and the image signal processor (232) and the processor (260) may constitute at least one processor (e.g., the processor (120) of FIG. 1).

[0062] According to one embodiment, the image capture unit (210) may include a lens unit (211), an aperture (212), an imaging element (213) (hereinafter referred to as 'image sensor (213)'), a shutter (214), and a driving unit (215, 216).

[0063] According to one embodiment, the lens unit (211) can focus light reflected from a subject and reaching the electronic device (200) onto the image sensor (213). For example, the lens unit (211) can focus or guide light reflected by the subject onto the image sensor (213) by including at least one lens aligned along an optical axis. In one embodiment, the image capture unit (210) can be, for example, a single camera, a dual camera, a 360-degree camera, or a spherical camera. The lenses included in the lens assembly (e.g., the lens unit (211)) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens may have at least one different lens property from other lens lenses. The lens assembly may include, for example, a wide-angle lens or a telephoto lens.

[0064] According to one embodiment, the amount of light (light quantity) collected through the lens unit (211) can be controlled through the aperture (212), and the light passing through the aperture (212) can reach the image sensor (213). In one embodiment, the aperture (212) can be understood as being substantially a part of the lens unit (211). For example, in the embodiment illustrated in FIG. 2, the aperture (212) is illustrated as a separate configuration from the lens unit (211), but alternatively, the aperture (212) may be configured to be integrated into the lens unit (211).

[0065] According to one embodiment, the image sensor (213) may include a pixel array (e.g., the photodiode array (401) of FIG. 6) in which a plurality of light-receiving elements (e.g., the photodiodes (411, 511) of FIG. 6 or FIG. 7) are two-dimensionally arranged in a grid shape. Each of the plurality of light-receiving elements may be assigned one of a plurality of reference colors. In one embodiment, the plurality of reference colors may include, for example, RGB (red, green, blue), RGBW (red, green, blue, white), CMY (cyan, magenta, yellow), CMYK (cyan, magenta, yellow, black), RYB (red, yellow, blue), and RGBIR (red, green, blue, infrared ray). In one embodiment, the plurality of light-receiving elements may function as independent image pixels, and at least two adjacent light-receiving elements may be combined to function as one image pixel depending on the shooting mode.

[0066] According to one embodiment, a plurality of micro lenses (e.g., micro lenses (421, 521) of FIG. 6 or 7) may be arranged on a side closer to the subject in the optical axis direction based on a plurality of light-receiving elements. The micro lens(es) may, for example, focus light incident within a specified angular range onto a specified light-receiving element. In one embodiment, the image sensor (213) may generate a digital signal (or an electrical signal) based on light reflected from the subject, and may generate digital image data (hereinafter, abbreviated as “image data”) based on the electrical signal. The image sensor (213) may include, for example, one image sensor selected from among image sensors with different properties, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same properties, or a plurality of image sensors having different properties. The image sensor (213) may use, for example, a CCD (charge coupled device) or a CMOS (complementary metal oxide semiconductor).

[0067] According to one embodiment, the image sensor (213) may include a photodiode (PD), a transfer transistor (TX) (or transfer gate), a reset transistor (RX) (or reset gate), and a floating diffusion node (FD). The photodiode (PD) may generate and accumulate photocharges corresponding to an optical image of a subject. The transfer transistor (TX) may transfer the photocharges focused on the photodiode (PD) to the floating diffusion node (FD) in response to a transfer signal. The reset transistor (RX) may discharge the charge stored in the floating diffusion node (FD) in response to a reset signal. Before the reset signal is applied, the charge stored in the floating diffusion node (FD) is output, and at this time, correlated double sampling (CDS) processing may be performed, and an analog signal on which CDS processing has been performed may be converted into a digital signal through an analog-to-digital circuit (ADC) and / or an analog front end (AFE). The image sensor (213) of the present disclosure may be, for example, equipped with four photodiodes in a pixel corresponding to one micro lens (e.g., a 4PD pixel).

[0068] In one embodiment, the shutter (214) can control the time that the image sensor (213) is exposed to light. For example, if the shutter (214) operates slowly, more light can enter the image sensor (213), and if the shutter (214) operates quickly, less light can enter the image sensor (213). In one embodiment, the shutter (214) can be implemented in a physical manner that blocks / transmits light, or in an electronic manner that controls the reset and readout of the photodiode.

[0069] According to one embodiment, the driving unit (215, 216) may be configured to adjust the position of the lens unit (211), the aperture (212), or the image sensor (213). The driving unit (215, 216) may include a first driving unit (215) and a second driving unit (216). For example, the first driving unit (215) may move the lens unit (211) parallel to the optical axis direction. By implementing an auto focus (AF) (hereinafter, 'focus control') operation of the image capture unit (210) through the first driving unit (215), the focus of light formed on the image sensor (213) may be adjusted. In addition, for example, the second driving unit (216) may adjust the position of the lens unit (211) or the image sensor (213) to prevent shaking that occurs when the user operates the image capture unit (210). The second driving unit (216) may move or control (e.g., adjust read-out timing, etc.) at least one lens (e.g., lens unit (211)) or image sensor (213) included in the lens assembly in a specific direction in response to movement of the image capture unit (210) or the electronic device (200) including the same, in order to at least partially compensate for negative effects (e.g., image shaking) caused by the movement on the image being captured. According to one embodiment, the second driving unit (216) may be implemented as, for example, an electronic image stabilizer or an optical image stabilizer, and may detect the movement using a gyro sensor (not shown) or an acceleration sensor (not shown) arranged inside or outside the image capture unit (210).

[0070] According to one embodiment, the image interface (220) may be disposed between the image sensor (213) and the image processing unit (230) to perform the interface. Data output from the image sensor (213) through the image interface (220) may be transmitted to the image processing unit (230). Depending on the configuration of the electronic device (200), the image interface (220) may be included in the image processing unit (230). In addition, depending on the configuration of the electronic device (200), the image interface (220) may be omitted, or another interface not shown in the drawing may be additionally provided.

[0071] According to one embodiment, the memory (240, 280) may temporarily store at least a portion of an image acquired through, for example, the image sensor (213) for the next image processing operation, or store commands or data related to at least one other component (e.g., the image processing unit (230)) of the electronic device (200). For example, when image acquisition according to the shutter (214) is delayed or a plurality of images are acquired at high speed, the acquired original image (e.g., a high-resolution image) may be stored in the memory (240, 280), and a corresponding copy image (e.g., a low-resolution image) may be previewed through a display (e.g., the display (270) or the display module (160) of FIG. 1). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (240, 280) may be processed, for example, by the image signal processor (232). In one embodiment, the memory (240, 280) may be configured as at least a portion of the memory of the electronic device (200) (e.g., memory (130) of FIG. 1), or as a separate memory that operates independently therefrom.

[0072] According to one embodiment, the memories (240, 280) may include a first memory (240) and a second memory (280) that are separated from each other as illustrated in FIG. 2. According to one embodiment, the first memory (240) may store at least one correction data (e.g., white balance correction data, gamma correction data, knee correction data, etc.). For example, the at least one correction data may be stored in a look-up table (LUT) format. According to one embodiment, the second memory (280) is a non-volatile memory (e.g., flash memory) that may store image data generated by the image processing unit (230). Although FIG. 2 illustrates that the memories (240, 280) are separate components according to the functions they perform for the sake of convenience of explanation, it should be noted that the memories are not necessarily limited to what is illustrated, and for example, they may be implemented as a single component.

[0073] According to one embodiment, the image processing unit (230) may be configured to perform various processing on image data output from the image sensor (213). The image processing unit (230) may perform image processing (e.g., depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening) on ​​an image acquired through the image sensor (213) or an image stored in a memory (e.g., the first memory (240)). Additionally or alternatively, the image processing unit (230) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the image capture unit (210) (e.g., the image sensor (213)). The image processed by the image processing unit (230) may be stored again in the memory (240, 280) for further processing or may be transmitted to an external component of the image capture unit (210) (e.g., the memory (130), the display module (160), the electronic device (102), The image processing unit (230) may include, according to one embodiment, a preprocessing unit (e.g., Pre ISP) (231) and an image signal processor (ISP) (232).

[0074] According to one embodiment, the preprocessing unit (231) can perform functions such as image alignment or gamma processing. For example, if there is shaking between multiple images captured consecutively, the preprocessing unit (231) can remove or reduce the shaking component through an image alignment process. The image signal processor (232) can correct and synthesize the signal received from the preprocessing unit (231) to generate an overall image signal. According to one embodiment, the preprocessing unit (231) can be integrated with the image signal processor (232) to form the image processing unit (230).

[0075] According to one embodiment, the image processing unit (230) may be configured as at least a part of the processor (260) (e.g., the processor (120) of FIG. 1) or may be configured as a separate processor that operates independently of the processor (260). For example, the preprocessing unit (231) and the image signal processor (232) of the image processing unit (230) may be integrated into the processor (260) (e.g., the processor (120) of FIG. 1). Alternatively, when the image processing unit (230) is configured as a separate processor from the processor (260), images processed by the image processing unit (230) may be displayed through the display (270) (e.g., the display module (160) of FIG. 1) as is or after undergoing additional image processing by the processor (260).

[0076] According to one embodiment, in addition to analyzing and calculating image data output from the image sensor (213), the image processing unit (230) may also generate a signal for controlling the lens unit (211) or the image sensor (213). For example, the image processing unit (230) may generate a signal for controlling the first driving unit (215) to move the lens unit (211) in the optical axis direction, or may generate a signal for controlling the second driving unit (216) to move the lens unit (211) or the image sensor (213) to prevent shaking.

[0077] According to one embodiment, the processor (260) (e.g., the processor (120) of FIG. 1) may include one or more of a central processing unit (CPU), an application processor (AP), or a communication processor (CP). The processor (260) may, for example, perform operations or data processing related to control and / or communication of at least one other component included in the electronic device (200). As described above, the processor (260) may include the image processing unit (230) as at least a part of the processor (260), or may operate as a separate processor that operates independently of the image processing unit (230).

[0078] In one embodiment, the display (270) may include an LCD, an LED display, an OLED display, a MEMS display, or an electronic paper display. The display (270) may display, for example, an image captured by the image capture unit (210), an image whose white balance has been corrected by the image processing unit (230), or the like. In one embodiment, the display (270) may include a touch screen and may receive, for example, a touch, gesture, proximity, or hovering input using an electronic pen or a part of the user's body.

[0079] In describing the embodiments below, it may be assumed that the preprocessing unit (231) is included in at least a part of the image signal processor (232), and accordingly, the image signal processor (232) may be described as having substantially the same configuration as the image processing unit (230). In one embodiment of the present disclosure, the term “at least one processor” may mean to include both cases where the image processing unit (230) is provided as at least a part of the processor (260) or is provided separately from the processor (260). In describing the embodiments below, the image signal processor (232) may be described as a separate processor that operates independently of the processor (260), but this is for the convenience of description, and it should be noted that the combination of the image processing unit (230), the image signal processor (232), and the processor (260) according to the embodiment(s) of the present disclosure is not limited to any one form.

[0080] FIG. 3 is a drawing showing an image sensor (300) (e.g., image sensor (213) of FIG. 2) according to one embodiment of the present disclosure.

[0081] Referring to FIG. 3, the image sensor (300) (e.g., the image sensor (213) of FIG. 2) may include a plurality of pixels or a plurality of photodiodes. FIG. 3 illustrates, for example, 14 photodiodes arranged in the Y-axis direction (horizontal direction) and 10 photodiodes arranged in the Z-axis direction (vertical direction), for a total of 140 photodiodes; however, the present invention is not limited thereto, and the image sensor (300) may include millions or tens of millions or more photodiodes. In one embodiment, the image sensor (300) may process light acquired from each of the photodiodes (411) of FIG. 6 as independent pixel information, and / or may combine light acquired from two or more adjacent photodiodes among the photodiodes (411) and process them as one pixel information. For example, it can be understood that when in a shooting mode in an environment with sufficient illumination, one light-receiving element (e.g., photodiode (411) of FIG. 6) outputs one independent pixel information, and when in a shooting mode in a low-illuminance environment, multiple light-receiving elements are combined to output one pixel information.

[0082] According to one embodiment, the image sensor (300) may include a micro lens array (310), a filter array (320), a light receiving unit (330) (e.g., a photodiode array (401) of FIG. 6), and a data processing unit (340). In one embodiment, the micro lens array (310) may be implemented by an array of a plurality of micro lenses (e.g., micro lenses (421, 521) of FIG. 6 or 7), and the micro lenses may be arranged according to a specified rule. In one embodiment, each micro lens may focus at least a portion of the incident light onto a specific light receiving element (e.g., a photodiode (411, 511) of FIG. 6 or 7).

[0083] According to one embodiment, the filter array (320) may be composed of a plurality of spatially divided colors that can selectively pass light. In one embodiment, the filter array (320) may be implemented by arranging filters of specified colors (e.g., color filters (431, 531) of FIG. 6 or 7) according to specified rules. In one embodiment, when the filter array (320) is arranged, a specified reference color (e.g., red (R), green (G), blue (B) of FIG. 4) may be assigned to each of a plurality of photodiodes (or light-receiving elements) included in the image sensor (300). The plurality of pixels may be designed to receive light having a wavelength range designated therefor among light incident in a direction perpendicular to the Y-axis and Z-axis (e.g., in the X-axis direction). In one embodiment, the same reference color may be assigned to two or more adjacent photodiodes. The two or more adjacent photodiodes to which the same reference color is assigned may be set to output one pixel information according to a shooting mode. In one embodiment, different reference colors may be assigned to photodiodes configured to output one pixel of information depending on the shooting mode.

[0084] According to one embodiment, an electrical signal corresponding to the received light may be output from a plurality of photodiodes. For example, the light receiving unit (330) may be composed of a plurality of light receiving elements (331, 332, 333, 334) (e.g., photodiodes) that convert light of a wavelength selected by the filter array (320) into an electrical signal. The data calculation unit (340) may calculate the electrical signal output from the light receiving unit (330). The data calculation unit (340) may be an analog calculation unit included in the image sensor (300), or may be a digital calculation unit of a processor (e.g., processor (260) of FIG. 2).

[0085] According to one embodiment, a unit pixel included in the image sensor (300) may include a micro lens, a color filter(s), and a light-receiving element(s), and electrical data output from each unit pixel may be used as a basic unit for calculation in the data calculation unit (340). In one embodiment, the image sensor (300) may obtain one pixel's information by using the light-receiving element(s) corresponding to one micro lens, or may obtain independent pixel's information by using each of a plurality of light-receiving elements corresponding to one micro lens depending on the shooting mode.

[0086] FIG. 4 is a diagram illustrating a pixel group (301) including a micro lens (310) and a filter array (320) according to one embodiment of the present disclosure. FIG. 5 is a diagram illustrating a 4PD pixel structure according to one embodiment of the present disclosure.

[0087] According to one embodiment, a pixel group (301) included in an image sensor (300) is composed of a combination of two or more unit pixels (302), wherein one unit pixel (302) may include a micro lens, a color filter(s), and a light-receiving element(s). The micro lens may serve to refract and / or focus light. The color filter(s) may be arranged behind the micro lens based on the light travel path, and may allow light having a designated reference color, i.e., light having a designated wavelength range, to pass therethrough. The light-receiving element(s) may be, for example, a photo diode, arranged behind the micro lens and the color filter.

[0088] According to one embodiment, when light reaches the light-receiving element(s), the light-receiving element(s) and / or the unit pixel (302) corresponding to the incident light can output an electrical signal by the photoelectric effect. The electrical signal can generate a charge (or current) according to the intensity (or light quantity) of the received light. In FIG. 4, as one embodiment, four unit pixels (302) are combined to form one pixel group (301). In one embodiment, the unit pixel (302) of FIG. 5 can be understood as including a 2X2 array of light-receiving elements (P1, P2, P3, P4) (e.g., photodiodes) under one micro lens (311).

[0089] Referring further to FIG. 4, one pixel group (301) may include a filter array (320) in a 2×2 arrangement. According to the embodiment of FIG. 4, the first color filter (321) and the second color filter (322) included in the first row may be provided as [green (G), red (R)], respectively, and the third color filter (323) and the fourth color filter (324) included in the second row may be provided as [blue (B), green (G)], respectively. That is, one pixel group (301) may include a filter array (320) formed in a [green (G), red (R)]×[blue (B), green (G)] pattern. In one embodiment, the plurality of micro lenses (310) included in the pixel group (301) may include first to fourth micro lenses (311, 312, 313, 314) arranged corresponding to the first to fourth color filters (321, 322, 323, 324), respectively.

[0090] According to one embodiment, the pixel group (301) may be repeatedly arranged to form the image sensor (300) (e.g., the light-receiving unit (330)) of FIG. 3. The repeating arrangement structure and pattern of the filter array (320) may vary depending on the embodiment. As an example, FIG. 4 illustrates a pixel group (301) having a filter array (320) formed in a Bayer pattern, but is not limited thereto, and the filter array (320) may be formed in various patterns including RGB (red, green, blue), CYYM (cyan, yellow, yellow, magenta), CYGM (cyan, yellow, green, magenta), RGBW (red, green, blue, white), RYYB (red, yellow, yellow, blue), and X-trans (e.g., a large-pattern RGB filter array that suppresses the moire effect). In the following description, for the convenience of explanation, the RGB pattern (or RGGB pattern) will be described as the center, but it should be noted that the repeating arrangement structure and pattern of the color filters are not limited thereto. In one embodiment, a plurality of pixel groups (301) as shown in FIG. 4 may be provided to form an image sensor (300).

[0091] According to one embodiment, one micro lens and one color filter may be arranged in a unit pixel, and one light-receiving element may be arranged behind the color filter. That is, one light-receiving element may be arranged in one unit pixel. In one embodiment, one micro lens and one color filter may be arranged in a unit pixel, and multiple light-receiving elements may be arranged behind the color filter. In one embodiment, multiple light-receiving elements may be arranged behind one micro lens, and multiple color filters may be arranged between the micro lens and the light-receiving elements. Referring to the embodiment of FIG. 6 described below, a configuration in which multiple (e.g., two) color filters (431) and multiple (e.g., two) light-receiving elements are arranged under one micro lens (421) can be exemplified. In one embodiment, the image sensor (400) of the embodiment of FIG. 6 may be understood to include four photodetectors under one micro lens (421), in which case the photodetectors may be arranged in a 2X2 array.

[0092] According to one embodiment, two, three, four or more light-receiving elements (P1, P2, P3, P4) may be arranged in a unit pixel (302). When a plurality of light-receiving elements (P1, P2, P3, P4) are arranged in a unit pixel (302), elements having the same specifications may be arranged symmetrically (line-symmetrically or point-symmetrically) with respect to the center of the unit pixel. For example, when two light-receiving elements are arranged in a unit pixel (302), they may be arranged line-symmetrically in the left / right or top / bottom directions with respect to the center of the unit pixel. When two light-receiving elements are arranged in a unit pixel (302), the unit pixel structure may be referred to as a dual pixel structure (hereinafter, referred to as a '2PD pixel structure'). When three light-receiving elements are arranged in a unit pixel (302), the unit pixel structure may be referred to as a triple pixel structure (hereinafter, referred to as a '3PD pixel structure'). When four light-receiving elements are arranged in a unit pixel (302), the unit pixel structure may be referred to as a quad pixel structure (hereinafter, referred to as a '4PD pixel structure'). As such, in the present disclosure, a case in which a unit pixel (302) includes a plurality (N; here, 'N' is a natural number) of light-receiving elements (or a case in which a plurality (N) of light-receiving elements are included per micro lens) may be referred to as an 'NPD pixel structure'.

[0093] According to one embodiment, each light-receiving element included in a unit pixel (302), for example, the 2PD pixel structure, the 3PD pixel structure, the 4PD pixel structure, and / or the NPD pixel structure, may be referred to as a 'sub-light-receiving unit (or sub-pixel)'. For example, when a unit pixel (302) includes a plurality of light-receiving elements, each of the light-receiving elements may be understood as a sub-pixel. As mentioned above, each of the light-receiving elements may be set to output independent pixel information according to the shooting mode. Alternatively, the light-receiving element included in each unit pixel (302) may also be referred to as a 'photoelectric conversion element'. In addition, the light-receiving element included in each unit pixel is exemplified by a photodiode, but may alternatively include a pinned-photodiode, a phototransistor, or a photogate.

[0094] According to one embodiment, a plurality of light-receiving elements included in a unit pixel (302) can independently receive incident light. In the process in which each of the plurality of light-receiving elements independently receives light, the incident light can be converted into an electrical signal and then output.

[0095] Referring further to FIG. 5, the unit pixel (302) is divided into a total of four parts (A1, A2, A3, A4), two each in the Y direction (e.g., the Y direction in FIG. 4) and the Z direction (e.g., the Z direction in FIG. 4) by the arrangement of four different light-receiving elements (e.g., the photodiodes (411, 511) in FIG. 6 or 7), and the photoelectric conversion signals of the individual light-receiving elements can be independently read. 'The photoelectric conversion signals of the individual light-receiving elements are independently read' can be understood as, for example, that each of the light-receiving elements outputs independent pixel information. According to one embodiment, four light-receiving elements (P1, P2, P3, P4) may be provided in a unit pixel (302) including one micro lens (311) and one color filter (321). According to the embodiment illustrated in FIG. 5, four light-receiving elements (P1, P2, P3, P4) included in a unit pixel (302) or arranged under one micro lens may be combined to output one pixel information. In the illustrated embodiment, the unit pixel (302) may have a 4PD pixel structure and may include a light-receiving element P1, a light-receiving element P2, a light-receiving element P3, and a light-receiving element P4, respectively. For example, when four light-receiving elements (P1, P2, P3, P4) output independent pixel information, the image sensor can provide an image with a high resolution, and when four light-receiving elements (P1, P2, P3, P4) are combined to output one pixel information, the image sensor can provide an image with relatively low resolution but with suppressed noise.

[0096] According to one embodiment, a phase difference detection operation can be performed using the arrangement relationship of different light-receiving elements included in a unit pixel. When describing the phase difference detection operation, the term 'unit pixel' may refer to one micro lens and a plurality (e.g., four) of light-receiving elements arranged corresponding to the micro lens. The phase difference may be generated, for example, due to the relative positions of the plurality of light-receiving elements arranged corresponding to one micro lens. The 'phase difference detection operation' may be performed for each direction in which the light-receiving elements are arranged. Taking the unit pixel of FIG. 5 as an example, the 'phase difference detection operation' may include a Y-axis direction phase difference detection operation between light-receiving elements P1 and P2 (or light-receiving elements P3 and P4) arranged adjacent to each other in the Y-axis direction. Alternatively, the 'phase difference detection operation' may include a Z-axis direction phase difference detection operation between light-receiving elements P1 and P3 (or light-receiving elements P2 and P4) arranged adjacent to each other in the Z-axis direction.

[0097] According to one embodiment, in the 4PD pixel structure of FIG. 5, the light-receiving elements (P1, P2, P3, P4) can output photoelectric conversion signals independently of each other, and the photoelectric conversion signals output from the light-receiving elements (P1, P2, P3, P4) can serve as a basis for acquiring a subject image. In one embodiment, in a low-light environment, the electronic device (200) or the image sensor (213, 300) can be configured to function as one pixel by combining at least two of the light-receiving elements (P1, P2, P3, P4). For example, by combining two or more adjacent light-receiving elements, it can be easy to secure the amount of light for acquiring a subject image even in a low-light environment. In one embodiment, when the separation ratio of the light-receiving elements (P1, P2, P3, P4) increases, more accurate phase difference information can be acquired, but the subject image quality may deteriorate. According to one embodiment of the present disclosure, the microlens(es) can provide a separation ratio required for phase difference information acquisition in an NPD pixel structure while implementing an environment in which good quality images can be acquired.

[0098] In examining the embodiments below, the image sensor (e.g., the image sensor (213, 300) of FIG. 2 or 3), the camera module (e.g., the camera module (180) of FIG. 1) and / or the electronic device (e.g., the electronic device (101, 200) of FIG. 1 or 2) described above may be referred to. The configuration of the above-described embodiment may be selectively combined with the configuration of the embodiment described below or may partially replace the configuration of the embodiment described below. In describing the embodiments described below, the same reference numbers in the drawings may be assigned or omitted for configurations that can be easily understood through the preceding embodiments, and a detailed description thereof may also be omitted.

[0099] FIG. 6 is a diagram illustrating an image sensor according to one embodiment of the present disclosure.

[0100] Referring to FIG. 6, the image sensor (400) (e.g., the image sensor (300) of FIG. 3) and / or the camera module including the same (e.g., the camera module (180) of FIG. 1) may output light information for acquiring (or generating) an image of a subject as an electrical signal by receiving light transmitted through the lens unit (211) (e.g., the lens unit (211) of FIG. 2) (or light focused or guided by the lens unit (211). In one embodiment, the image sensor (400) may include a photodiode array (401), a microlens array (402), and / or a filter array (403). In one embodiment, the combination or arrangement of color filters in the filter array (403) may vary depending on the specifications of the image sensor (400) and / or the camera module including the same (e.g., the electronic device (101, 200) of FIG. 1 or 2).

[0101] According to one embodiment, the photodiode array (401) may include an array of a plurality of photodiodes (411). For example, the photodiodes (411) may be arranged to form a specified number of rows and columns to implement the photodiode array (401) (e.g., the pixel array (330) of FIG. 3). In one embodiment, the photodiodes (411) may function as independent pixels, and two or more adjacent photodiodes (411) may be combined to function as one pixel depending on the specifications of the image sensor (400) or the camera module including the image sensor (400). In one embodiment, two or more photodiodes (411) arranged under one microlens (421) may function as pixels that detect phase difference information for a focus adjustment function, as described with reference to the embodiment of FIG. 5.

[0102] According to one embodiment, the microlens array (402) may include an array of a plurality of microlenses (421). In one embodiment, the microlens array (421) is disposed on or above the photodiode array (401), and light focused or guided by the lens unit (211) may be transmitted through the microlens array (402) and provided to the photodiode array (401). For example, the photodiodes (411) may receive light that has passed through a corresponding microlens (421) (or a corresponding lens region (e.g., the second lens region (521a, 521b) of FIG. 7)) and convert it into an electrical signal. In one embodiment, the microlens (421) may focus or guide light incident within a specified angular range to the corresponding photodiode (411)(s). As will be described with reference to FIG. 7, when two or more photodiodes (411) are arranged under one microlens (421), a concave portion (e.g., a concave portion (523) of FIG. 7) may be provided on the incident surface of the microlens (421). In one embodiment, when a plurality of photodiodes (411) are arranged under a microlens (421) including a concave portion, the plurality of photodiodes (411) may have sufficient light reception efficiency to acquire a subject image while being used to detect phase difference information for focus adjustment. This will be described again with reference to FIG. 7.

[0103] According to one embodiment, the filter array (403) is disposed between the photodiode array (401) and the microlens array (402), and may include color filters (431) arranged corresponding to each of the photodiodes (411). In one embodiment, one color filter (431) may be arranged corresponding to a plurality (e.g., four) of the photodiodes (411). In one embodiment, the color filters (431) may have different optical properties. For example, the color filters (431) may substantially determine the color properties assigned to the photodiodes (411). In one embodiment, the color filters (431) arranged corresponding to two adjacent photodiodes (411) may transmit light of the same wavelength. In one embodiment, the color filters (431) arranged corresponding to two adjacent photodiodes (411) may transmit light of different wavelengths. The arrangement of color attributes in the filter array (403) may be implemented in various ways depending on the specifications of the image sensor to be actually manufactured (e.g., the image sensor (300, 400) of FIG. 3 or FIG. 6) or the electronic device including the same. The arrangement of color attributes in the filter array (403) will be examined again with reference to FIGS. 13 to 16.

[0104] FIG. 7 is a diagram illustrating a structure in which unit micro lenses are arranged in an image sensor according to one embodiment of the present disclosure. FIG. 8 is a diagram for explaining the distribution of incident light in an image sensor according to one embodiment of the present disclosure.

[0105] Referring to FIGS. 7 and 8, on an image sensor (500) (e.g., the image sensor (300) of FIG. 3) and / or a camera module including the same (e.g., the camera module (180) of FIG. 1), a plurality of photodiodes (511; 511a, 511b) (and / or a photodiode array (501)) may be arranged under one micro lens (521) (and / or a micro lens array (502)). Similar to the embodiment described above, a color filter (531a, 531b) (and / or a color filter array (503)) may be arranged between the micro lens array (502) and the photodiode array (501). In the embodiment of FIGS. 7 and 8, it can be understood that two photodiodes (511; 511a, 511b) are arranged under one micro lens (521). For example, at least two photodiodes (511; 511a, 511b) arranged adjacently may be arranged under one micro lens (521). In the illustrated embodiment, it may be understood that two photodiodes (511; 511a, 511b) are arranged or arranged adjacently along one direction. In one embodiment, a structure in which two photodiodes (511; 511a, 511b) are arranged under one micro lens (521) when viewed in a side view (or cross-sectional view) may be understood as four photodiodes (511; 511a, 511b) are arranged in a 2X2 array under one micro lens (521). The embodiment(s) of the present disclosure are not limited by the illustrated configuration, and in one embodiment, a structure in which three or more photodiodes (511; 511a, 511b) are arranged under one micro lens (521) may be implemented, and it is noted that for the sake of simplicity of explanation, a configuration in which two photodiodes (511; 511a, 511b) are arranged under one micro lens (521) in the horizontal direction of FIG. 7 is exemplified.

[0106] According to one embodiment, a plurality (e.g., two) of photodiodes (511; 511a, 511b) arranged along one direction may be arranged under one micro lens (521). For example, when including a photodiode array (501) implemented as an array of m photodiodes (511; 511a, 511b) (e.g., the pixel array (330) of FIG. 3 or the photodiode array (401) of FIG. 6), the image sensor (300, 400) of FIG. 3 or FIG. 6 may include m / 2 micro lenses (521), and it may be understood that two photodiodes (511; 511a, 511b) are arranged under one micro lens (521). For example, in a structure in which four photodiodes (511; 511a, 511b) are arranged along one direction, two micro lenses (521) may be arranged along one direction. In one embodiment, in a structure in which six photodiodes (511; 511a, 511b) are arranged along one direction, three micro lenses (521) may be arranged along one direction.

[0107] In one embodiment, within an image sensor (500) (e.g., image sensor (300) of FIG. 3) and / or a camera module (e.g., camera module (180) of FIG. 1) including the same, the number of photodiodes (511; 511a, 511b) may be a positive integer multiple of the number of microlenses (521).

[0108] According to one embodiment, the micro lens (521) may provide a first lens area (521a) corresponding to a first photodiode (511a) among at least two adjacent photodiodes (511; 511a, 511b), and a second lens area (521b) corresponding to a second photodiode (511b) among at least two adjacent photodiodes (511; 511a, 511b). In one embodiment, a concave portion (523) may be provided between an incident surface (ISa) of the first lens area (521a) and an incident surface (ISb) of the second lens area (521b). For example, it can be understood that the first lens region (521a) and the second lens region (521b) have substantially convex lens shapes and are arranged parallel to one side of each other, such that a groove (e.g., a concave portion (523)) is formed between the first lens region (521a) and the second lens region (521b) or at the boundary between the first lens region (521a) and the second lens region (521b). In one embodiment, it can be understood that the incident surface of the micro lens (521) is implemented by the incident surface (ISa) of the first lens region (521a), the incident surface (ISb) of the second lens region (521b), and / or the concave portion (523). In describing the illustrated embodiment, it has been mentioned that the first lens region (521a) and the second lens region (521b) have a convex lens shape, but the embodiment(s) of the present disclosure are not limited thereto, and the shape of the micro lens (521) (or its incident surface (ISa, ISb)) may be implemented differently depending on the specifications of the image sensor (500) to be actually manufactured.

[0109] According to one embodiment, the first lens region (521a) can focus a portion of light incident from the outside (or transmitted through the lens unit (211) of FIG. 6) onto the first photodiode (511a). For example, the lens regions (521a, 521b) are arranged to correspond to corresponding ones of the photodiodes (511; 511a, 511b), and the photodiodes (511; 511a, 511b) can receive light aligned or guided by one of the lens regions (521a, 521b) through corresponding ones of the color filters (531; 531a, 531b). In one embodiment, the incident surface (ISa) of the first lens region (521a) can have an asymmetrical shape with respect to its vertex (e.g., the first vertex (VP1)). For example, the incident surface (ISa) of the first lens area (521a) may have a substantially symmetrical shape within a portion of a specified radius from the first vertex (VP1), and the incident surface (ISa) of the first lens area (521a) may be asymmetrical in a portion exceeding the specified radius. In one embodiment, when the incident surface (ISa) of the first lens area (521a) has a partially asymmetrical shape, at least a portion of the light may be incident on the first photodiode (511a) in an asymmetrical state with respect to the first vertex (VP1), thereby generating a phase difference with respect to the second photodiode (511b). Here, the “asymmetrical state” may refer to a state including information about the phase difference between the first photodiode (511a) and the second photodiode (511b). For example, the first photodiode (511a) may function as one of the pixels for acquiring focus adjustment state information. In one embodiment, 'obtaining focus adjustment state information' may be understood as being able to predict distance information and / or depth information to a subject.

[0110] According to one embodiment, the second lens area (521b) can focus another portion of the light incident from the outside (or transmitted through the lens unit (211) of FIG. 6) onto the second photodiode (511b). In one embodiment, the incident surface (ISb) of the second lens area (521b) may have an asymmetrical shape with respect to its vertex (e.g., the second vertex (VP2)). For example, the incident surface (ISb) of the second lens area (521b) may have a substantially symmetrical shape within a specified radius from the second vertex (VP2), and the incident surface (ISb) of the second lens area (521b) may be asymmetrical with respect to a portion exceeding the specified radius. In one embodiment, when the incident surface (ISb) of the second lens area (521b) has a partially asymmetrical shape, at least a portion of the light incident on the second photodiode (511b) may generate a phase difference with respect to the first photodiode (511a). For example, the second photodiode (521b) can function as another pixel for acquiring focus adjustment status information.

[0111] According to one embodiment, a phase difference can be detected using the first photodiode (511a) and the second photodiode (511b) by having an incident surface (ISa) of the first lens area (521a) include an asymmetrical area with respect to the first vertex (VP1) and an incident surface (ISb) of the second lens area (521b) include an asymmetrical area with respect to the second vertex (VP2), and / or by having the first lens area (521a) and the second lens area (521b) arranged symmetrically with respect to each other. The phase difference information detected by the first photodiode (511a) and the second photodiode (511b) can be utilized as basic information for performing a focus adjustment function.

[0112] In one embodiment, the incident surface (ISa) of the first lens area (521a) may have a symmetrical shape in an area of ​​about 60% or more and about 95% or less with respect to the first vertex (VP1), and may have an asymmetrical shape in an area of ​​about 5% or more and about 40% or less. Such a symmetrical or asymmetrical shape may also be similar in the incident surface (ISb) of the second lens area (521b). In one embodiment, the incident surface (ISa) of the first lens area (521a) may have a symmetrical shape in an area of ​​about 70% or more and about 80% or less with respect to the first vertex (VP1). For example, the amount of light that is about 5% or more and about 40% or less of the amount of light that passes through the first lens area (521a) (or the second lens area (521b)) according to the embodiment(s) of the present disclosure can be the basis for obtaining phase difference information. In one embodiment, when an image is obtained from light having a large ratio of the amount of light that is the basis for obtaining phase difference information, the data processing capacity in image acquisition can increase. The embodiment(s) of the present disclosure can improve image quality and / or reduce the load in image processing by obtaining phase difference information but lowering the ratio of the amount of light that is the basis for obtaining phase difference information.

[0113] According to one embodiment, the first lens region (521a) or the second lens region (521b) may be arranged symmetrically with respect to each other while including incident surfaces (ISa, ISb) that are asymmetrical with respect to the vertices (VP1, VP2). For example, light reaching the first photodiode (511a) and the second photodiode (511b) may include phase difference information (e.g., focus adjustment status information) between the first photodiode (511a) and the second photodiode (511b). In one embodiment, about 5% or more and about 40% or less of the light incident on the incident surface of the first lens region (521a) (or the second lens region (521b)) may include phase difference information between the first photodiode (511a) and the second photodiode (511b). In one embodiment, approximately 20% or more and approximately 25% or less of the light incident on the incident surface (ISa, ISb) of the first lens area (521a) (or the second lens area (521b)) may include phase difference information between the first photodiode (511a) and the second photodiode (511b). For example, focus adjustment state information may be acquired when the first photodiode (511a) or the second photodiode (511b) combined with the above-described microlens (521) each receives light including phase difference information with respect to the other.

[0114] In the embodiment of FIG. 8, when it is defined that approximately 9 light bundles (IL) are incident on the first lens area (521a) (or the second lens area (521b)), approximately 7 light bundles (IL1) may be incident symmetrically, and approximately 2 light bundles (IL2) may be incident asymmetrically. In one embodiment, the light bundle (IL) incident on the first lens area (521a) and the light bundle (IL) distribution on the second lens area (521b) may be symmetrical (point-symmetrical or line-symmetrical) with respect to each other. It can be understood that the incidence tendency of the light bundle (IL) is substantially determined by the shapes of the incidence surfaces (ISa, ISb). The shapes (e.g., curvature) of the incidence surfaces (ISa, ISb) may be appropriately selected in consideration of the specifications required for obtaining subject image information and phase difference information, or the incidence tendency of the light bundle (IL). In one embodiment, 'asymmetric incidence' or 'incidence tendency of light bundle (IL)' may be described as 'phase separation ratio'. For example, it may be defined that the greater the asymmetry, the higher the phase separation ratio. In one embodiment, in a structure in which a plurality of photodiodes (e.g., a first photodiode (511a) and a second photodiode (511b)) are arranged under one micro lens, the first photodiode (511a) and the second photodiode (511b) may separate and receive light incident through the lens assembly based on the incident angle. When receiving light by separating the incident angle, a difference in sensitivity according to the incident angle may occur, and when this difference in sensitivity is suppressed, it may be defined as 'low phase separation ratio'. In one embodiment, the phase separation ratio may be secured or controlled by using a partial shape of the micro lens (e.g., a symmetrical shape or an asymmetrical shape).

[0115] In this way, the micro lens (521) according to the embodiment(s) of the present disclosure can be arranged to correspond to a plurality of adjacent photodiodes (511; 511a, 511b) (e.g., at least two), and a part of the lens area (e.g., the first lens area (521a) or the second lens area (521b) of FIG. 7) corresponding to one photodiode (511; 511a, 511b) can be implemented in an asymmetrical shape to provide an environment in which phase difference information can be acquired. In one embodiment, another part of the lens area (521a, 521b) corresponding to one photodiode (511; 511a, 511b) can be implemented in a symmetrical shape that provides refractive power, thereby increasing light collection efficiency. For example, the micro lens (521)(s) according to the embodiment(s) of the present disclosure can provide an environment in which focus adjustment status information can be acquired while providing sufficient light reception efficiency to enable acquisition of a subject image.

[0116] According to one embodiment, the first lens region (521a) and the second lens region (521b), which correspond to the two adjacent photodiodes (511; 511a, 511b), respectively, may have a shape symmetrical with respect to each other, or may be arranged symmetrically with respect to each other. For example, it may be understood that the first photodiode (511a) and the second photodiode (511b) are arranged to have line symmetry (or point symmetry) with respect to each other. Accordingly, the two adjacent photodiodes (511; 511a, 511b) (and / or a single micro lens (521) aligned therewith) may be combined to function as a pixel that detects phase difference information.

[0117] According to one embodiment, in the first shooting mode, the first photodiode (511a) and the second photodiode (511b) can output independent pixel information with respect to each other, and in the second shooting mode, the first photodiode (511a) and the second photodiode (511b) can be combined to output one pixel information. For example, the first shooting mode may refer to a shooting mode in an environment where sufficient illumination is secured, and the first photodiode (511a) and the second photodiode (511b) can function as independent pixels with respect to each other, which can be useful for obtaining a high-resolution image. In one embodiment, the second shooting mode may refer to a shooting mode in an environment where low illumination is secured, and the first photodiode (511a) and the second photodiode (511b) can be combined to function as one pixel, so that the image sensor (400, 500) can obtain a high-quality image with suppressed noise even if the resolution is somewhat lowered.

[0118] According to one embodiment, the micro lens (521)(s) may be implemented by overlapping a plurality of layers. For example, the micro lens (521) may include a first lens portion (e.g., the first lens portion (621a) of FIG. 9) corresponding to a plurality of photodiodes (511; 511a, 511b)) and a plurality of second lens portions (e.g., the second lens portions (621b-1, 621b-2) of FIG. 9) arranged on the first lens portion. For example, the phrase "implemented by overlapping a plurality of layers" may refer to a structure in which a lens array implemented by an arrangement of first lens portions (621a) and a lens array implemented by an arrangement of second lens portions are stacked. In order to illustrate the correlation with the first lens region (521a) or the second lens region (521b) of FIG. 7, the reference numbers of the second lens parts are distinguished as “621b-1” and “621b-2” and described or indicated in the drawing, but it should be noted that the embodiment(s) of the present disclosure are not limited by the drawings or reference numbers of the drawings. In one embodiment, lens array(s) implemented by additional third lens parts (e.g., the third lens part (921c) of FIG. 12) and / or additional fourth lens parts may be provided to implement the micro lens (521) or the micro lens array (502). In one embodiment, the lens array implemented by the arrangement of the first lens parts may be arranged between the arrangement of the second lens parts and the photodiode array. In one embodiment, the second lens parts may correspond to at least one of the photodiodes arranged below the first lens part. The structure or arrangement of these micro lens(es) will be examined with reference to FIGS. 9 to 12.

[0119] FIG. 9 is a drawing showing a micro lens array (or micro lens) of an image sensor according to one embodiment of the present disclosure.

[0120] Referring to FIG. 9, the micro lens array (602) may include a plurality of micro lenses (621). For example, FIG. 9 may illustrate a micro lens array (602) implemented by arranging four micro lenses (621) in a 2X2 array. In one embodiment, the micro lens array (602) of FIG. 9 may be arranged on a photodiode array implemented by 16, for example, a 4X4 array of photo diodes. In one embodiment, the micro lens (621) may include a first lens portion (621a) corresponding to a plurality (for example, at least two adjacent) photodiodes (for example, the photodiodes 411 and 511 of FIGS. 6 to 8) and a plurality of second lens portions (621b-1, 621b-2) arranged on the first lens portion (621a). In the illustrated embodiment, the second lens portions (621b-1, 621b-2) may be understood as being arranged on the surface of the first lens portion (621a). However, the embodiment(s) of the present disclosure are not limited thereto, and a first micro lens array may be implemented by the arrangement of the first lens portions (621a), and a second micro lens array implemented by the arrangement of the second lens portions (621b-1, 621b-2) may be arranged to overlap the first micro lens array.

[0121] According to one embodiment, the first lens portion (621a) may be arranged to correspond to, for example, four (e.g., in a 2X2 array) photodiodes, and each of the second lens portions (621b-1, 621b-2) may be arranged to correspond to any one of the four (e.g., in a 2X2 array) photodiodes. For example, it may be understood that one second lens portion (621b-1, 621b-2) is arranged to correspond to one photodiode, and one first lens portion (621a) is arranged to correspond to four photodiodes. In one embodiment, when one second lens portion (621b-1, 621b-2) is arranged corresponding to one photodiode, the second-first lens portion (621b-1) of the second lens portions (621b-1, 621b-2) may provide the first lens area (521a) of FIG. 7, and the second-second lens portion (621b-2) of the second lens portions (621b-1, 621b-2) may provide the second lens area (521b) of FIG. 7. In one embodiment, the photodiodes corresponding to the second lens portions (621b-1, 621b-2) may output independent pixel information with respect to each other, and / or the photodiodes corresponding to the first lens portion (621a) may be combined to output one pixel information. For example, in a low-light environment, photodiodes arranged under one micro lens (621) may be combined and set to output one pixel information, and in a good-light environment, the photodiodes may be set to output independent pixel information.

[0122] According to one embodiment, among the photodiodes arranged corresponding to one micro lens (621), photodiodes arranged point-symmetrically or line-symmetrically with respect to each other may be combined to function as pixels for phase difference detection. Here, 'point symmetry or line symmetry' may refer to symmetry with respect to a center point or symmetry with respect to a straight line passing through the center point when the micro lens (621) is drawn in a plan view. For example, in the micro lens (621) structure of FIG. 9, two photodiodes aligned adjacently along a horizontal direction may be combined to obtain focus adjustment state information. In one embodiment, in the micro lens (621) structure of FIG. 9, two photodiodes aligned adjacently along a vertical direction may be combined to obtain focus adjustment state information. In one embodiment, in the micro lens (621) structure of FIG. 9, two photodiodes aligned adjacently along a diagonal direction may be combined to obtain focus adjustment state information.

[0123] According to one embodiment, when the first lens portion (621a) is defined as having a first width (w1), the second lens portions (621b-1, 621b-2) may have a second width (w2). In one embodiment, the first width (w1) may be an integer multiple of the second width (w2). For example, in the embodiment of FIG. 9, the width of the first lens portion (621a) (e.g., the first width (w1)) may be twice the width of the second lens portions (621b-1, 621b-2)(s) (e.g., the second width (w2)).

[0124] According to one embodiment, the cross-sectional shape of the micro lens (621) at the cut line SC1 in FIG. 9 may be somewhat different from that illustrated. For example, it should be noted that the position of the cut line SC1 indicated in the plan view of the micro lens (621) in FIG. 9 and the drawing illustrating the cross-section of the corresponding cut line are simplified for convenience of explanation and / or for comparing and explaining the widths (or diameters) of the lens portions (621a, 621b-1, 621b-2). The positions or cross-sectional shapes of the cut lines SC2, SC3, and SC4 in FIGS. 10 to 12 described below may also be similar. FIG. 10 is a drawing illustrating a micro lens array (or micro lens) of an image sensor according to one embodiment of the present disclosure.

[0125] FIG. 10 illustrates, for example, one micro lens, wherein the micro lens (721) may include a first lens portion (721a) corresponding to a plurality of (e.g., 16) photodiodes and a plurality of second lens portions (721b-1, 721b-2) arranged on the first lens portion (721a). The overlapping arrangement of the second lens portions (721b-1, 721b-2) on the first lens portion (721a) may be similar to the preceding embodiment, and thus a detailed description thereof will be omitted. In one embodiment, the first lens portion (721a) may be arranged to correspond to, for example, 16 (e.g., 4X4 array) photodiodes, and each of the second lens portions (721b-1, 721b-2) may be arranged to correspond to, for example, 4 (e.g., 2X2 array) photodiodes. For example, it can be understood that one second lens portion (721b-1, 721b-2) is arranged corresponding to four photodiodes, and one first lens portion (721a) is arranged corresponding to 16 photodiodes.

[0126] According to one embodiment, depending on the shooting environment, four photodiodes corresponding to one of the second lens parts (721b-1, 721b-2) may be combined and set to output one pixel information, and / or 16 photodiodes corresponding to the first lens part (721a) may be combined and set to output one pixel information. In one embodiment, in a shooting mode in a good lighting environment, 16 photodiodes corresponding to the first lens part (721a) may be set to output independent pixel information with respect to each other. In one embodiment, among the 16 photodiodes corresponding to the first lens part (721a), photodiodes arranged at positions that are point-symmetrical or line-symmetrical with respect to each other may be combined to output pixel information for phase difference information detection. In one embodiment, among the four photodiodes corresponding to one second lens portion (721b-1, 721b-2), photodiodes arranged at positions that are point-symmetrical or line-symmetrical with respect to each other can be combined to function as pixels for detecting phase difference information.

[0127] According to one embodiment, when the first lens portion (721a) is defined as having a first width (w1), the second lens portions (721b-1, 721b-2) may have a second width (w2). In one embodiment, the first width (w1) may be an integer multiple of the second width (w2). For example, in the embodiment of FIG. 10, the width of the first lens portion (721a) (e.g., the first width (w1)) may be twice the width of the second lens portions (721b-1, 721b-2) (e.g., the second width (w2)).

[0128] FIG. 11 is a drawing showing a micro lens array (or micro lens) of an image sensor according to one embodiment of the present disclosure.

[0129] FIG. 11 illustrates, for example, one micro lens (821), which may include a first lens portion (821a) corresponding to a plurality of (e.g., 16) photodiodes and a plurality of second lens portions (821b) arranged on the first lens portion (821a). The overlapping arrangement of the second lens portions (821b) on the first lens portion (821a) may be similar to the preceding embodiment, and thus a detailed description thereof will be omitted. In one embodiment, the first lens portion (821a) may be arranged to correspond to, for example, 16 (e.g., 4X4 array) photodiodes, and the second lens portions (821b) may each be arranged to correspond to one of the 16 (e.g., 4X4 array) photodiodes. For example, it can be understood that one second lens portion (821b) is arranged corresponding to one of the photodiodes, and one first lens portion (821a) is arranged corresponding to 16 photodiodes.

[0130] According to one embodiment, depending on the shooting environment, 16 photodiodes corresponding to the first lens portion (821a) may be combined and set to output one pixel information, and / or 16 photodiodes corresponding to the first lens portion (821a) may be set to output independent pixel information with respect to each other. In one embodiment, among the 16 photodiodes corresponding to the first lens portion (821a), photodiodes arranged at positions that are point-symmetrical or line-symmetrical with respect to each other may be combined and function as pixels for detecting phase difference information.

[0131] According to one embodiment, when the first lens portion (821a) is defined as having a first width (w1), the second lens portion (821b) may have a second width (w2). In one embodiment, the first width (w1) may be an integer multiple of the second width (w2). For example, in the embodiment of FIG. 11, the width of the first lens portion (821a) (e.g., the first width (w1)) may be four times the width of the second lens portion (821b) (e.g., the second width (w2)).

[0132] FIG. 12 is a drawing showing a micro lens array (or micro lens) of an image sensor according to one embodiment of the present disclosure.

[0133] FIG. 12 illustrates, for example, one micro lens (921), and the micro lens (921) may include a first lens portion (921a) corresponding to a plurality of (e.g., 16) photodiodes, a plurality of second lens portions (921b) arranged on the first lens portion (921a), and a third lens portion (921c) arranged between the first lens portion (921a) and the second lens portion (921b). For example, when FIGS. 9 to 11 illustrate a structure in which two micro lens arrays are overlapped, FIG. 12 may be understood to illustrate a structure in which three micro lens arrays are overlapped.

[0134] In one embodiment, the first lens portion (921a) may be arranged to correspond to, for example, 16 (e.g., in a 4X4 array) photodiodes, and each of the second lens portions (921b) may be arranged to correspond to one of the 16 (e.g., in a 4X4 array) photodiodes. For example, it may be understood that one second lens portion (921b) is arranged to correspond to one of the photodiodes, and one first lens portion (921a) is arranged to correspond to 16 photodiodes. In one embodiment, one third lens portion (921c) may be understood to be arranged to correspond to 4 (e.g., in a 2X2 array) of the 16 (e.g., in a 4X4 array) photodiodes. In one embodiment, the third lens portion (921c) may be disposed on the first lens portion (921a), and the second lens portion (921b) may be disposed on the third lens portion (921c).

[0135] According to one embodiment, depending on the shooting environment, 16 photodiodes corresponding to the first lens portion (921a) may be combined to output one pixel information, or 4 photodiodes corresponding to the third lens portion (921c) may be combined to output one pixel information. In one embodiment, in a shooting mode in a good lighting environment, 16 photodiodes corresponding to the first lens portion (921a) may be set to output independent pixel information with respect to each other. In one embodiment, among the 4 photodiodes corresponding to the third lens portion (921c), photodiodes arranged at positions that are point-symmetrical or line-symmetrical with respect to each other may be combined, or among the 16 photodiodes corresponding to the first lens portion (921a), photodiodes arranged at positions that are point-symmetrical or line-symmetrical with respect to each other may be combined to function as pixels for detecting phase difference information.

[0136] According to one embodiment, when the first lens portion (921a) is defined as having a first width (w1), the second lens portion (921b) may have a second width (w2). In one embodiment, the first width (w1) may be an integer multiple of the second width (w2). For example, in the embodiment of FIG. 12, the width of the first lens portion (921a) may be four times the width of the second lens portion (921b). In one embodiment, the width (w3) of the third lens portion (921c) may be twice the width of the second lens portion (921b) (e.g., the second width (w2)).

[0137] According to one embodiment, the embodiments of FIGS. 9 to 12 may be examples of micro lenses or micro lens arrays corresponding to a structure in which four photodiodes are arranged in a horizontal or vertical direction (e.g., the photodiode array (401, 501) of FIG. 6 or 8). In one embodiment, when m (wherein, 'm' is a natural number greater than or equal to 2) photodiodes are arranged along one direction in the photodiode array (401, 501), the micro lens array may have as many micro lens(es) as the natural number closest to m / 2 arranged along one direction. For example, one micro lens may be arranged corresponding to two (e.g., a 2X1 array) or four (e.g., a 2X2 array) photodiodes. In one embodiment, when m photodiodes (wherein 'm' is a natural number greater than or equal to 3) are arranged along one direction in the photodiode array (401, 501), the microlens array may have as many microlenses as the natural number closest to m / 3 arranged along one direction. For example, one microlens may be arranged corresponding to 3 (e.g., a 3X1 array) or 9 (e.g., a 3X3 array) photodiodes. In one embodiment, when m photodiodes (wherein 'm' is a natural number greater than or equal to 4) are arranged along one direction in the photodiode array (401, 501), the microlens array may have as many microlenses as the natural number closest to m / 4 arranged along one direction. For example, one microlens may be arranged corresponding to 4 (e.g., a 4X1 array) or 16 (e.g., a 4X4 array) photodiodes. In one embodiment, the number of photodiodes arranged along one direction may be an integer multiple of the number of microlenses arranged corresponding to the photodiodes of the array.For example, when including 10 micro lenses, the image sensor may include a photodiode array (401, 501) implemented with 20 photodiodes, 30 photodiodes, or m0 photodiodes (where 'm' is a natural number greater than or equal to 4). In one embodiment, one micro lens may be arranged corresponding to n X m photodiodes (where n and m are integers greater than or equal to 1, and at least one of n and m is greater than or equal to 2).

[0138] FIG. 13 is a diagram illustrating a color filter array of an image sensor according to an embodiment of the present disclosure. FIG. 14 is a diagram illustrating a color filter array of an image sensor according to an embodiment of the present disclosure. FIG. 15 is a diagram illustrating a color filter array of an image sensor according to an embodiment of the present disclosure. FIG. 16 is a diagram illustrating a color filter array of an image sensor according to an embodiment of the present disclosure.

[0139] FIG. 13 may illustrate a filter array (603a) arranged on a 4X4 array of photodiodes (e.g., the photodiode arrays (401, 501) of FIG. 6 or 8). In one embodiment, an image sensor (e.g., the image sensors (300, 400, 500) of FIGS. 3, 6, 7, and / or 8) may have higher sensitivity to light in a green (G) wavelength band compared to light in a blue (B) or red (R) wavelength band. For example, when including a filter array combining color filters of blue (B), red (R), and green (G) (e.g., the filter arrays (320, 403, 503) of FIGS. 3, 6, 7, and / or 8), the green (G) color filters may be arranged in greater numbers than the blue (B) color filters or the red (R) color filters. In the illustrated embodiment, the filter array (603a) may include a 4X4 array of green (G) color filters. In one embodiment, the filter array (603a) may be implemented by a 4X4 array of red (R) color filters or a 4X4 array of blue (B) color filters. In one embodiment, the filter array (603a) of FIG. 13 may be arranged on a photodiode array in combination with any one of the micro lenses (621, 721, 821, 921) of FIGS. 9 to 12.

[0140] FIG. 14 may illustrate a filter array (603b) disposed on a 4X4 array of photodiodes (e.g., the photodiode arrays (401, 501) of FIG. 6 or 8). In the illustrated embodiment, when four blue (B) color filters are disposed and / or four red (R) color filters are disposed, eight green (G) color filters may be disposed. In one embodiment, when n rows of color filters are in a GRGR array, n+1 rows of color filters may be in a BGBG array. In one embodiment, the filter array (603b) of FIG. 14 may be disposed on the photodiode array in combination with any one of the micro lenses (621, 721, 821, 921) of FIGS. 9 to 12.

[0141] FIG. 15 may illustrate a filter array (603c) disposed on a 4X4 array of photodiodes (e.g., the photodiode arrays (401, 501) of FIG. 6 or 8). In the illustrated embodiment, when four blue (B) color filters are disposed and / or four red (R) color filters are disposed, eight green (G) color filters may be disposed. In one embodiment, when the color filters in rows n and / or the color filters in rows n+3 are in a GRRG array, the color filters in rows n+1 and / or the color filters in rows n+2 may be in a BGGB array. In one embodiment, the filter array (603c) of FIG. 15 may be disposed on the photodiode array in combination with any one of the micro lenses (621, 721, 821, 921) of FIGS. 9 to 12.

[0142] FIG. 16 may illustrate a filter array (603d) disposed on a 4X4 array of photodiodes (e.g., the photodiode arrays (401, 501) of FIG. 6 or 8). In the illustrated embodiment, the filter array (603d) may be implemented by combining a 2X2 array of blue (B) color filters, a 2X2 array of red (R) color filters, and / or a 2X2 array of green (G) color filters. In one embodiment, the filter array (603d) may include a greater number of green (G) color filters than blue (B) color filters or red (R) color filters. In one embodiment, the filter array (603d) of FIG. 16 may be disposed on the photodiode array in combination with any one of the micro lenses (621, 721, 821, 921) of FIGS. 9 to 12. In one embodiment, the micro lenses (521, 621) of FIGS. 7-9 can be combined with the filter array (603a) of FIG. 16. In one embodiment, one of the micro lenses (521, 621) of FIGS. 7-9 can be combined with the red (R) color filter(s) of the filter array (603a) of FIG. 16. In one embodiment, one of the micro lenses (521, 621) of FIGS. 7-9 can be combined with the green (G) color filter(s) of the filter array (603a) of FIG. 16. In one embodiment, one of the micro lenses (521, 621) of FIGS. 7-9 can be combined with the blue (B) color filter(s) of the filter array (603a) of FIG. 16. In one embodiment, two micro lenses (521, 621) of FIGS. 7 through 9 may be combined with a filter array (603a) of FIG. 16. In one embodiment, as will be described with reference to FIG. 16, the micro lenses (521, 621) of FIG. 7 or FIG. 9 may be combined with a 2X2 array of red (R) color filters, and / or a 2X2 array of blue (B) color filters.In this case, the microlens(es) arranged corresponding to the green (G) color filters (e.g., the microlens indicated by '629' in FIG. 16) may not have a phase separation ratio. Here, 'the microlens does not have a phase separation ratio' may refer to the fact that the incident surface of the microlens (e.g., the incident surface (ISa, ISb) of FIG. 7) is implemented in a shape that is symmetrical with respect to the vertex (e.g., the vertex (VP1, VP2) of FIG. 7). In one embodiment, one microlens that does not have a phase separation ratio may be arranged corresponding to one color filter or one photodiode. In one embodiment, the microlens arranged corresponding to the green (G) color filters may be the microlenses (521, 621) of FIG. 7 or FIG. 9, and the microlens(es) arranged corresponding to the red (R) color filters and / or the blue (B) color filters may not have a phase separation ratio. In one embodiment, two microlenses (621) of FIG. 9 may be arranged at any position on the filter array (603d) of FIG. 16.

[0143] According to one embodiment, when any one of the micro lenses (621, 721, 821, 921) (or micro lens array) of FIGS. 9 to 12 is combined with the filter arrays (603a, 603b, 603c, 603d) of FIGS. 13 to 16, the image sensor (300, 400, 500) can independently use the photodiodes (411, 511) of FIGS. 6 to 8 to obtain pixel information while operating in the first shooting mode according to the shooting environment or the settings of the electronic device (e.g., the electronic device (101, 200) of FIG. 1 or 2). In one embodiment, when any one of the micro lenses (621, 721, 821, 921) (or micro lens array) of FIGS. 9 to 12 is combined with the filter array (603a, 603b, 603c, 603d) of FIGS. 13 to 16, and / or when operating in a second shooting mode according to a shooting environment or settings of an electronic device, the image sensor (300, 400, 500) may receive a larger amount of light even if the resolution is somewhat reduced by combining adjacent photodiodes of the aXb array (wherein, 'a' is a natural number greater than or equal to 2, and 'b' is a natural number) among the photodiodes (411, 511) of FIGS. 6 to 8. In one embodiment, the 'shooting environment' may refer to the illumination in the shooting space, and when in shooting mode in a low-light environment, the image sensor (300, 400, 500) can acquire an image with suppressed noise.

[0144] According to one embodiment, in an operation of acquiring focus adjustment state information (e.g., phase difference), a unit pixel may be set based on a micro lens including a first lens area corresponding to a 2X2 array of photodiodes among the micro lenses (621, 721, 821, 921) (or micro lens array) of FIGS. 9 to 12, or a micro lens including a first lens area corresponding to a 4X4 array of photodiodes. In one embodiment, in an operation of acquiring focus adjustment state information (e.g., phase difference), a unit pixel may include two or more photodiodes, and photodiodes having the same phase within the unit pixel may be combined to acquire phase difference information. In one embodiment, when a first lens area corresponding to a 4X4 array of photodiodes is set as a unit pixel, and the filter arrays (603a, 603b, 603c, 603d) of FIGS. 13 to 16 are combined, the color filters of the unit pixel(s) for phase difference detection may be arranged to have a symmetrical structure. When the color filters of the unit pixel(s) for phase difference detection are arranged in a symmetrical structure, the operation of mixing red-green-blue to produce an imaging value for autofocus can be omitted.

[0145] According to one embodiment, the image sensor (e.g., the image sensor (300, 400, 500) of FIGS. 3, 6, 7, and / or 8) may further include a first filter array disposed under a first microlens (e.g., one of the microlenses 621 of FIG. 9) among the plurality of microlenses, as illustrated in FIG. 16, and / or a second filter array disposed under a second microlens (e.g., another of the microlenses 621 of FIG. 9) adjacent to the first microlens among the plurality of microlenses. The first filter array may include, for example, a 2X2 array of blue color filters (B), and the second filter array may include a 2X2 array of red color filters (R). In one embodiment, the blue color filter (B) array and the red color filter (R) array are each disposed under the microlens (621) of FIG. 9, and may be aligned on one side of or diagonally relative to each other. For example, the blue color filter (B) array and the red color filter (R) array can be understood as being aligned symmetrically with respect to each other. In one embodiment, the micro lenses (621) combined in the blue color filter array (B) and the red color filter (R) array can be understood as being aligned symmetrically with respect to each other.

[0146] In one embodiment, the image sensor (e.g., the image sensor (300, 400, 500) of FIGS. 3, 6, 7, and / or 8) may further include third filter arrays arranged in contact with at least one of the first filter array or the second filter array. In one embodiment, each of the third filter arrays may include a 2X2 array of green color filters (G). In one embodiment, the green color filter (G) arrays may each be combined with a microlens (629) different from the microlens (621) of FIG. 9. For example, one green color filter (G) may be arranged under one microlens (629), and the incident surface of the microlens indicated by '629' may have a shape that is substantially symmetrical about its vertex. In one embodiment, the green color filter (G) arrays may be understood to be aligned symmetrically with respect to one another. In the illustrated embodiment, the third filter arrays (e.g., green color filter (G) arrays) may be understood to be arranged symmetrically with respect to each other while simultaneously contacting the blue color filter (B) array and the red color filter (R) array, respectively.

[0147] As described above, the image sensor, camera module, and / or electronic device according to the embodiment(s) of the present disclosure may include a microlens (or microlens array) that can suppress a decrease in light collection efficiency while lowering a separation ratio for phase difference information detection, thereby obtaining phase difference information for an auto-focus function while providing good image quality. In one embodiment, the separation ratio for phase difference information detection may be secured by asymmetrically distributing incident light and / or by a difference in sensitivity of light incident in a specified angular direction. The “difference in sensitivity of light incident in a specified angular direction” may refer to, for example, a difference in sensitivity between light incident in a -10 degree angular direction and light incident in a +10 degree direction. In one embodiment, since subject image information can also be obtained through a light-receiving element (e.g., a photodiode) for phase difference information detection, the camera module and / or the electronic device including the same may provide improved image quality.

[0148] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description of the above-described embodiment(s).

[0149] According to one embodiment of the present disclosure, an image sensor (e.g., an image sensor (213, 300, 400, 500) of FIGS. 2, 3, 6, 7 and / or 8) and / or an electronic device (e.g., an electronic device (101, 200) of FIG. 1 or 2) including the same comprises a photodiode array (e.g., a pixel array (330) of FIG. 3, a photodiode array (401, 501) of FIGS. 6 and / or 8) including an array of a plurality of photodiodes (e.g., a light-receiving element (331, 332, 333, 334) of FIG. 3 or a photodiode (411, 511) of FIGS. 6 to 8), and a plurality of micro lenses (e.g., a micro lens of FIGS. 3, 6, 7 and / or 8) arranged respectfully corresponding to at least two adjacent photodiodes among the plurality of photodiodes. An array of lenses (311, 312, 313, 314, 421, 521)) may be included, and a micro lens array (e.g., the micro lens array (310, 402, 502) of FIG. 3, FIG. 6, FIG. 7 and / or FIG. 8) may be disposed on or above the photodiode array. In one embodiment, each of the plurality of micro lenses may provide a first lens region (e.g., a first lens region (521a) of FIG. 7) corresponding to a first photodiode (e.g., a first photodiode (511a) of FIG. 7) among the at least two adjacent photodiodes, a second lens region (e.g., a second lens region (521b) of FIG. 7) corresponding to a second photodiode (e.g., a second photodiode (511b) of FIG. 7) among the at least two adjacent photodiodes, and a concave portion (e.g., a concave portion (523) of FIG. 7) disposed between an incident surface of the first lens region (e.g., an incident surface indicated as 'ISa' of FIG. 7) and an incident surface of the second lens region (e.g., an incident surface indicated as 'ISb' of FIG. 7).In one embodiment, the incident surface of the first lens region may be asymmetrical with respect to a vertex of the incident surface of the first lens region (e.g., a vertex indicated by 'VP1' in FIG. 7), and the incident surface of the first lens region and the incident surface of the second lens region may be symmetrical with respect to each other. In one embodiment, the photodiode array may be configured to receive or detect light transmitted through the microlens array.

[0150] According to one embodiment, the incident surface of the first lens area may have a symmetrical shape in an area of ​​60% or more and 95% or less with respect to the vertex of the incident surface of the first lens area.

[0151] In one embodiment, the first photodiode and the second photodiode may be configured to function as independent pixels in the first shooting mode. In one embodiment, in a second shooting mode different from the first shooting mode, the first photodiode and the second photodiode may be configured to function as a single pixel in combination.

[0152] According to one embodiment, each of the plurality of micro lenses may include a first lens portion corresponding to at least two adjacent photodiodes (e.g., the first lens portion (621a) of FIG. 9), a second-first lens portion (e.g., the second-first lens portion (621b-1) of FIG. 9) disposed on the first lens portion and providing the first lens area, and a second-second lens portion (e.g., the second-second lens portion (621b-2) of FIG. 9) disposed on the first lens portion and providing the second lens area.

[0153] According to one embodiment, the first lens portion may have a first width (e.g., the first width (w1) of FIG. 9), the second-1 lens portion or the second-2 lens portion may have a second width (e.g., the second width (w2) of FIG. 9), and the first width may be an integer multiple of the second width.

[0154] According to one embodiment, when m photodiodes are arranged along one direction, p microlenses may be arranged corresponding to the m photodiodes. Here, 'm' is a natural number greater than or equal to 4, and 'p' may be any one of the natural number closest to m / 2, the natural number closest to m / 3, or the natural number closest to m / 4.

[0155] According to one embodiment, one of the micro lenses may be arranged corresponding to 2X1 of the photodiodes, 2X2 of the photodiodes, 3X3 of the photodiodes, or 4X4 of the photodiodes.

[0156] According to one embodiment, the image sensor as described above may further include a filter array (e.g., filter array (320, 403, 503) of FIGS. 3, 6, 7, and / or 8) including color filters arranged corresponding to each of the plurality of photodiodes. In one embodiment, the filter array may be disposed between the photodiode array and the microlens array.

[0157] According to one embodiment, among the color filters, a first color filter (e.g., a filter indicated by '531a' in FIG. 7) arranged corresponding to the first photodiode and a second color filter (e.g., a filter indicated by '531b' in FIG. 7) arranged corresponding to the second photodiode may be configured to transmit light of the same wavelength.

[0158] According to one embodiment, among the color filters, a first color filter arranged corresponding to the first photodiode and a second color filter arranged corresponding to the second photodiode may be configured to transmit light of different wavelengths.

[0159] According to one embodiment, the image sensor as described above may further include a first filter array including a 2X2 array of blue color filters and positioned under a first micro lens among the plurality of micro lenses, and a second filter array including a 2X2 array of red color filters and positioned under a second micro lens adjacent to the first micro lens among the plurality of micro lenses.

[0160] In one embodiment, the image sensor as described above may further include third filter arrays, each of which includes a 2X2 array of green color filters and is arranged in contact with at least one of the first filter array or the second filter array. In one embodiment, the third filter arrays may be arranged symmetrically with respect to one another.

[0161] According to one embodiment of the present disclosure, a camera module (e.g., a camera module (180) of FIG. 1) and / or an electronic device including the same (e.g., an electronic device (101, 200) of FIG. 1 or FIG. 2) may include a lens unit (e.g., a lens unit (211) of FIG. 2 or FIG. 6), and an image sensor (e.g., an image sensor (213, 300, 400, 500) of FIGS. 2, 3, 6, 7, and / or 8) configured to receive or detect light focused or guided by the lens unit. In one embodiment, the image sensor includes an array of a plurality of photodiodes (e.g., light-receiving elements (331, 332, 333, 334) of FIG. 3 or photodiodes (411, 511) of FIGS. 6 to 8) that convert light focused or guided by the lens unit into an electrical signal, and an array of a plurality of micro lenses (e.g., micro lenses (311, 312, 313, 314, 421, 521) of FIGS. 3, 6, 7 and / or 8) arranged corresponding to at least two adjacent photodiodes among the plurality of photodiodes, and a micro lens array (e.g., micro lenses of FIGS. 3, 6, 7 and / or 8) arranged between the lens unit and the photodiode array. It may include an array (310, 402, 502).In one embodiment, each of the plurality of micro lenses may provide a first lens region (e.g., a first lens region (521a) of FIG. 7) corresponding to a first photodiode (e.g., a first photodiode (511a) of FIG. 7) among the at least two adjacent photodiodes, a second lens region (e.g., a second lens region (521b) of FIG. 7) corresponding to a second photodiode (e.g., a first photodiode (511a) of FIG. 7) among the at least two adjacent photodiodes, and a concave portion (e.g., a concave portion (523) of FIG. 7) disposed between an incident surface of the first lens region (e.g., an incident surface indicated as 'ISa' of FIG. 7) and an incident surface of the second lens region (e.g., an incident surface indicated as 'ISb' of FIG. 7). In one embodiment, the incident surface of the first lens area may be asymmetrical with respect to a vertex of the incident surface of the first lens area (e.g., a vertex indicated as 'VP1' in FIG. 7), and the incident surface of the first lens area and the incident surface of the second lens area may be symmetrical with respect to each other.

[0162] According to one embodiment, the incident surface of the first lens area may have a symmetrical shape in an area of ​​60% or more and 95% or less with respect to the vertex of the incident surface of the first lens area.

[0163] In one embodiment, the first photodiode and the second photodiode may be configured to function as independent pixels in the first shooting mode. In one embodiment, in a second shooting mode different from the first shooting mode, the first photodiode and the second photodiode may be configured to function as a single pixel in combination.

[0164] According to one embodiment, each of the plurality of micro lenses may include a first lens portion corresponding to at least two adjacent photodiodes (e.g., the first lens portion (621a) of FIG. 9), a second-first lens portion (e.g., the second-first lens portion (621b-1) of FIG. 9) disposed on the first lens portion and providing the first lens area, and a second-second lens portion (e.g., the second-first lens portion (621b-2) of FIG. 9) disposed on the first lens portion and providing the second lens area.

[0165] According to one embodiment, the first lens portion has a first width (e.g., the first width (w1) of FIG. 9), the second-1 lens portion or the second-2 lens portion has a second width (e.g., the first width (w2) of FIG. 9), and the first width may be an integer multiple of the second width.

[0166] According to one embodiment, one of the micro lenses may be arranged corresponding to 2X1 of the photodiodes, 2X2 of the photodiodes, 3X3 of the photodiodes, or 4X4 of the photodiodes.

[0167] In one embodiment, the image sensor may further include a filter array (e.g., filter array (320, 403, 503) of FIGS. 3, 6, 7, and / or 8) including color filters arranged corresponding to each of the plurality of photodiodes. In one embodiment, the filter array may be disposed between the photodiode array and the microlens array.

[0168] According to one embodiment, among the color filters, a first color filter (e.g., a filter indicated by '531a' in FIG. 7) arranged corresponding to the first photodiode and a second color filter (e.g., a filter indicated by '531b' in FIG. 7) arranged corresponding to the second photodiode may be configured to transmit light of the same wavelength.

[0169] According to one embodiment, among the color filters, a first color filter arranged corresponding to the first photodiode and a second color filter arranged corresponding to the second photodiode may be configured to transmit light of different wavelengths.

[0170] An electronic device according to one embodiment of the present disclosure may include an image sensor or camera module as described above, and may be configured such that the first photodiode and the second photodiode function as independent pixels with respect to each other in a first shooting mode, and may be configured such that the first photodiode and the second photodiode function as one pixel in combination in a second shooting mode different from the first shooting mode.

[0171] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In the image sensor (213; 300; 400; 500), A photodiode array (330; 401; 501) comprising an array of a plurality of photodiodes; and An array of a plurality of micro lenses (311, 312, 313, 314; 421; 521) disposed respectfully corresponding to at least two adjacent photo diodes among the plurality of photo diodes, and a micro lens array (310; 402; 502) disposed on or above the photo diode array, Each of the plurality of micro lenses provides a first lens area (521a) corresponding to a first photodiode (511a) among the at least two adjacent photodiodes, a second lens area (521b) corresponding to a second photodiode (511b) among the at least two adjacent photodiodes, and a concave portion (523) disposed between an incident surface (ISa) of the first lens area and an incident surface (ISb) of the second lens area. The incident surface of the first lens area is asymmetrical with respect to the vertex (VP1) of the incident surface of the first lens area, and the incident surface of the first lens area and the incident surface of the second lens area are symmetrical with respect to each other. The above photodiode array is an image sensor configured to receive or detect light passing through the micro lens array.

2. In the first paragraph, the image sensor has a shape in which the incident surface of the first lens area is symmetrical in an area of ​​60% or more and 95% or less with respect to the vertex of the incident surface of the first lens area.

3. In any one of paragraphs 1 to 2, In the first shooting mode, the first photodiode and the second photodiode are configured to function as independent pixels with respect to each other, An image sensor configured such that the first photodiode and the second photodiode are combined to function as one pixel in a second shooting mode different from the first shooting mode.

4. In any one of the first to third paragraphs, each of the plurality of micro lenses, A first lens portion (621a) corresponding to at least two adjacent photodiodes; A second-first lens portion (621b-1) disposed on the first lens portion and providing the first lens area; and An image sensor comprising a second-second lens portion (621b-2) disposed on the first lens portion and providing the second lens area.

5. In paragraph 4, The first lens portion has a first width (w1), and the second-first lens portion or the second-second lens portion has a second width (w2). An image sensor wherein the first width is an integer multiple of the second width.

6. In any one of the first to fifth clauses, when m of the photodiodes are arranged along one direction, an image sensor in which p of the micro lenses are arranged corresponding to m of the photodiodes, (Here, 'm' is a natural number greater than or equal to 4, and 'p' is either the natural number closest to m / 2, the natural number closest to m / 3, or the natural number closest to m / 4).

7. In any one of the first to fifth clauses, one of the micro lenses is an image sensor arranged corresponding to 2X1 of the photodiodes, 2X2 of the photodiodes, 3X3 of the photodiodes, or 4X4 of the photodiodes.

8. In any one of paragraphs 1 to 7, Further comprising a filter array (320; 403; 503) including color filters arranged corresponding to each of the plurality of photodiodes, The above filter array is an image sensor arranged between the photodiode array and the micro lens array.

9. In the 8th paragraph, a camera module in which, among the color filters, a first color filter (531a) arranged corresponding to the first photodiode and a second color filter (531b) arranged corresponding to the second photodiode are configured to transmit light of the same wavelength.

10. In the 8th paragraph, a camera module in which, among the color filters, a first color filter arranged corresponding to the first photodiode and a second color filter arranged corresponding to the second photodiode are configured to transmit light of different wavelengths.

11. In any one of paragraphs 1 to 10, A first filter array comprising blue color filters in a 2X2 array and positioned below a first micro lens among the plurality of micro lenses; and An image sensor further comprising a second filter array comprising red color filters in a 2X2 array and positioned below a second micro lens adjacent to the first micro lens among the plurality of micro lenses.

12. In paragraph 11, Further comprising third filter arrays including green color filters in a 2X2 array and arranged in contact with at least one of the first filter array or the second filter array, An image sensor in which the third filter arrays are arranged symmetrically with respect to each other.

13. In the camera module (180), Lens section (211); and An image sensor (213; 300; 400; 500) according to any one of claims 1 to 12, configured to receive or detect light focused or guided by the lens unit, The above photodiode array is configured to convert light focused or guided by the lens unit into an electrical signal, The above micro lens array is a camera module arranged between the lens unit and the photodiode array.

14. In electronic devices (101; 200), Includes a camera module (180) of Article 13, In the first shooting mode, the first photodiode and the second photodiode are configured to function as independent pixels with respect to each other, An electronic device configured such that the first photodiode and the second photodiode are combined to function as one pixel in a second shooting mode different from the first shooting mode.

Images