Semiconductor module trimming and forming apparatus

Abstract

Disclosed in the present invention is a semiconductor module trimming and forming apparatus, comprising a workbench, and a loading device, a module push-out device, a transfer device I, a trimming and forming device, a shaping and inspection device, a transfer device II and an unloading device, which are arranged on the workbench, wherein frames with semiconductor modules are placed in magazines conveyed by the loading device; the module push-out device is configured to push the frames out of the magazines; and then the transfer device I removes the frames and places the frames in the trimming and forming device. The beneficial effects are as follows: the semiconductor module trimming and forming apparatus of the present application further performs Y-direction shaping, X-direction shaping, visual inspection and flatness inspection on the semiconductor modules after trimming and forming the semiconductor modules, thereby ensuring that the manufactured finished semiconductor module product meets the requirements for a PIN angle of ±1°, a PIN position tolerance of ±0.3 mm, a pin height of ±0.3 mm, flatness, etc.; and the manufactured semiconductor module product is of high quality and performance, thereby meeting the product quality requirements of customers for high quality.

Description

A semiconductor module cutting and bending device TECHNICAL FIELD

[0001] The present application relates to the field of IGBT products, in particular to a semiconductor module cutting and bending device. BACKGROUND

[0002] With the continuous updating of products, IGBT products are iteratively upgraded from encapsulation modules to plastic encapsulation modules, the performance of the whole product is improved, and the structure is updated to be combined by a frame and injection molding, thereby deriving a cutting and bending device. The cutting and bending device cuts the frame and bends the PIN pin for the plastic encapsulation module. However, the existing cutting and bending device still has the problem of low cutting and bending quality in actual use, which leads to the difficulty of the manufactured semiconductor module product to meet the high-quality product quality requirements of customers.

[0003] SUMMARY

[0004] The main purpose of the present application is to provide a semiconductor module cutting and bending device, which aims to solve the problem that the existing cutting and bending device cannot manufacture high-quality semiconductor module products.

[0005] To solve the above problems, the present application provides a semiconductor module cutting and bending device, which comprises a workbench, an upper feeding device, a module pushing device, a carrying device one, a cutting and bending device, a shaping and detecting device, a carrying device two and a lower discharging device arranged on the workbench. The frame with semiconductor modules is placed in the clip conveyed by the upper feeding device. The module pushing device is used to push the frame out of the clip, and then the carrying device one takes away the frame and places it in the cutting and bending device. The cutting and bending device cuts and bends the semiconductor modules in the frame to obtain semiconductor module finished products and separate them from the frame. The shaping and detecting device picks up the semiconductor module finished products to perform PIN pin shaping, visual detection and flatness detection in the Y direction and the X direction. After the shaping and detecting, the carrying device two sends the semiconductor module finished products to the lower discharging device to complete the discharging.

[0006] In an embodiment, the semiconductor module cutting and bending device further comprises a laser coding device and a code reading device. The module pushing device pushes the frame out of the clip to the laser coding device for laser coding. The coded frame is read by the code reading device, and then taken away by the carrying device one.

[0007] In an embodiment, the upper feeding device comprises a conveying line four and a conveying line five arranged directly above the conveying line four. The conveying line four and the conveying line five are horizontally arranged and parallel to each other, and are fixedly connected with the workbench. The conveying line four and the conveying line five can horizontally transfer the clips. A plurality of stacked frames with semiconductor modules are horizontally slidably inserted into the clips, and the upper and lower adjacent two frames do not contact.

[0008] In an embodiment, the module pushing device is located at the same side of the conveying line four and the conveying line five, and the module pushing device comprises:

[0009] The translation device two is fixedly connected with the workbench;

[0010] The lifting device two is connected with the translation device two, and the lifting device two is driven by the translation device two to move close to or away from the conveying line four and the conveying line five, the moving direction is the same as the conveying direction of the conveying line four and the conveying line five, an installation plate two is arranged on the lifting device two, the installation plate two is driven by the lifting device two to move close to or away from the conveying line four or the conveying line five, a lifting device three, a lower clamping arm and a motor one are installed on the installation plate two, the lower clamping arm is located at the lower end of the lifting device three, the upper end of the lifting device three is connected with an upper clamping arm, when the lower clamping arm is close to the conveying line four or the conveying line five and is level with the conveying line four or the conveying line five, the conveying line four moves the magazine to the lower clamping arm or the conveying line five takes away the magazine on the lower clamping arm, the lifting device three drives the upper clamping arm to move downward to clamp and fix the magazine together with the lower clamping arm, the motor one is located beside the upper clamping arm, the motor one is drivingly connected with a rotary block, the rotary block is driven by the motor one to rotate around the vertical axis of the rotary block, the lower end of the rotary block is provided with a pair of blocking pins which are arranged at intervals and symmetrically distributed on the two sides of the axis of the rotary block;

[0011] An installation frame six is fixedly connected with the workbench, a translation device twelve and an installation plate eight are arranged on the installation frame six, the installation plate eight is horizontally slidably connected with the installation frame six, the translation device twelve is connected with the installation plate eight and is used to drive the installation plate eight to horizontally slide on the installation frame six, the sliding direction is the same as the moving direction of the translation device two;

[0012] A translation device thirteen is horizontally slidably installed on the installation plate eight, the sliding direction is perpendicular to the sliding direction of the installation plate eight, a spring is connected between the translation device thirteen and the installation plate eight, the extension direction of the spring is the same as the sliding direction of the translation device thirteen;

[0013] A push rod is connected with the translation device thirteen, the push rod is driven by the translation device thirteen to horizontally move to push the frame in the magazine out;

[0014] The magazine is open at both ends in the moving direction of the push rod, one end of the push rod enters from one open end of the magazine, and then pushes the frame to extend out from the other open end of the magazine, recesses are arranged on the upper surfaces of both ends of the magazine, a rotating lever which can rotate around a vertical axis is arranged in each recess, one end of the rotating lever is connected with a blocking rod, the rotating lever drives the blocking rod to move away from or return to the open end of the magazine, when the blocking rod is located at the open end of the magazine, the frame cannot enter or exit the magazine;

[0015] When the clip is translated to the lower clamping arm, the swivel block moves horizontally into the groove, and a pair of blocking pins are located on both sides of the lever, and the motor drives the swivel block to rotate and drives the lever to rotate through the pair of blocking pins.

[0016] In an embodiment, the laser coding device comprises a laser coding machine and a conveying line six arranged below the laser coding machine, the laser coding machine and the conveying line six are fixedly connected with the workbench, the push rod pushes the frame in the clip out to the conveying line six, and the conveying line six conveys the frame to below the laser coding machine for laser coding.

[0017] In an embodiment, the code reading device comprises a mounting bracket two and a code reader arranged at the upper end of the mounting bracket two, the mounting bracket two is fixedly connected with the workbench, and the conveying line six conveys the frame coded by the laser to below the code reader for code reading.

[0018] In an embodiment, the carrying device one and the carrying device two are the same structure;

[0019] The carrying device one comprises a mounting bracket three and a three-axis translation mechanism arranged on the mounting bracket three, a motor two is arranged on the three-axis translation mechanism, the motor two is driven by the three-axis translation mechanism to translate along the XYZ three-axis, a suction nozzle one is connected to the lower end of the motor two, the suction nozzle one is driven by the motor two to rotate around the vertical axis, and the suction nozzle one is used to suck the semiconductor module.

[0020] In an embodiment, the punching and bending device comprises:

[0021] A mounting plate three is fixedly connected with the workbench;

[0022] A lower channel rod is horizontally fixedly installed on the mounting plate three, a plurality of lower limiting nails are arranged on the lower channel rod at equal intervals along the length direction;

[0023] A pair of channel sliding plates are vertically slidably installed on the mounting plate three and symmetrically arranged on both sides of the lower channel rod, the channel sliding plates are horizontally arranged, and the frame with the semiconductor module can be placed on the pair of channel sliding plates by the carrying device one;

[0024] A lifting device four is fixedly connected with the mounting plate three and the channel sliding plates, and is used to drive the channel sliding plates to lift and lower, when the channel sliding plates are lowered, the frame on the channel sliding plates is in contact with the lower channel rod and is limited by the lower limiting nails;

[0025] A translation device three is fixedly connected with the workbench;

[0026] The upper flow channel rod is located directly above the lower flow channel rod, and a plurality of upper limiting pins are arranged on the upper flow channel rod at equal intervals along the length direction. The upper flow channel rod, the upper limiting pins, the lower flow channel rod and the lower limiting pins are arranged symmetrically. The upper flow channel rod is connected with the third translation device, and the third translation device drives the upper flow channel rod to move horizontally. The moving direction is the same as the length direction of the lower flow channel rod. When the flow channel slide plate rises, the frame on the flow channel slide plate contacts the upper flow channel rod and is limited by the upper limiting pins. At this time, the third translation device drives the frame on the flow channel slide plate to move horizontally through the upper flow channel rod and the upper limiting pins. The moving direction is along the length direction of the lower flow channel rod and the flow channel slide plate.

[0027] The die-cutting mold includes a die-cutting movable mold, a die-cutting fixed mold and a fifth lifting device. The die-cutting fixed mold is located below the lower flow channel rod and the flow channel slide plate and is fixedly connected with the third mounting plate. The die-cutting movable mold is located above the flow channel slide plate and the upper flow channel rod and is connected with the fifth lifting device. The fifth lifting device is fixedly connected with the workbench. The fifth lifting device drives the die-cutting movable mold to descend and cooperate with the die-cutting fixed mold to cut the frame with the semiconductor module.

[0028] The bending mold includes a bending fixed mold, a bending movable mold and a sixth lifting device. The bending fixed mold is located below the lower flow channel rod and the flow channel slide plate and is fixedly connected with the third mounting plate. The bending movable mold is located above the flow channel slide plate and the upper flow channel rod and is connected with the sixth lifting device. The sixth lifting device is fixedly connected with the workbench. The sixth lifting device drives the bending movable mold to descend and cooperate with the bending fixed mold to bend the PIN angle of the semiconductor module and separate the semiconductor module from the frame.

[0029] The frame with the semiconductor module moves horizontally on the flow channel slide plate, passes through the die-cutting mold first and then passes through the bending mold.

[0030] In an embodiment, the shape detection device includes:

[0031] The fourth translation device is fixedly connected with the workbench and is provided with a seventh lifting device. The fourth translation device drives the seventh lifting device to move horizontally. The seventh lifting device is connected with a suction nozzle two. The seventh lifting device drives the suction nozzle two to ascend and descend. The suction nozzle two can be guided by the fourth translation device and the seventh lifting device to the end of the flow channel slide plate to suck the frame and the semiconductor module.

[0032] The fifth translation device is fixedly connected with the workbench and has the same horizontal moving direction as the fourth translation device. The fifth translation device is provided with an eighth lifting device. The fifth translation device drives the eighth lifting device to move horizontally. The eighth lifting device is provided with a fourth mounting plate. The eighth lifting device drives the fourth mounting plate to ascend and descend. The fourth mounting plate is installed with five suction nozzles three. The five suction nozzles three are arranged in a straight line on the fourth mounting plate along the horizontal moving direction of the fifth translation device and are arranged at equal intervals.

[0033] A carrier one, a Y-direction shaping mechanism, an X-direction shaping mechanism, a carrier four, a visual detection mechanism and a flatness detection mechanism are sequentially arranged below the suction nozzle two and the suction nozzle three along the moving direction of the translation device five, the carrier one, the Y-direction shaping mechanism, the X-direction shaping mechanism and the carrier four are installed on a mounting plate five, the mounting plate five is fixedly connected with the workbench, the visual detection mechanism and the flatness detection mechanism are fixedly connected with the workbench;

[0034] The Y-direction shaping mechanism comprises:

[0035] A rotation device one is fixedly connected with the mounting plate five, an upper end of the rotation device one is provided with the carrier two, and the carrier two is driven by the rotation device one to rotate around a vertical axis;

[0036] A lifting device nine is fixedly connected with the mounting plate five;

[0037] A translation device six is connected with the lifting device nine, and the translation device six is lifted by the lifting device nine;

[0038] A mounting frame five is connected with the translation device six, the mounting frame five is horizontally moved by the translation device six, an upper end of the mounting frame five is provided with a shaping block one and a translation device seven, the shaping block one is vertically and fixedly provided with a shaping plate at the upper end, the translation device seven is connected with a shaping block two, the shaping block two is horizontally moved by the translation device seven to approach or move away from the shaping plate, the moving direction of the translation device seven is same as that of the translation device six, the upper end of the shaping plate and one side of the shaping block two close to the shaping plate are provided with mutually parallel and equal-height shaping edges, when the semiconductor module is placed on the carrier two, the bent PIN angle of the semiconductor module extends into a pair of shaping edges, and the PIN angle bent by 90 degrees is in contact with the shaping edge of the upper end of the shaping plate;

[0039] The X-direction shaping mechanism comprises:

[0040] A rotation device two is fixedly connected with the mounting plate five, an upper end of the rotation device two is provided with the carrier three, and the carrier three is driven by the rotation device two to rotate around a vertical axis;

[0041] A translation device eight is fixedly connected with the mounting plate five, and the moving direction of the translation device eight is perpendicular to that of the translation device six;

[0042] A translation device nine is connected with the translation device eight, and the translation device nine is horizontally moved by the translation device eight, the moving direction of the translation device nine is same as that of the translation device six;

[0043] The shaping block three is connected with the translation device nine, and is driven by the translation device nine to move horizontally to approach or move away from the carrier three. A shaping rack is arranged on one side of the shaping block three close to the carrier three. A plurality of shaping tooth grooves are arranged on the shaping rack. The semiconductor module on the carrier three can be stretched into each shaping tooth groove when the shaping block three moves horizontally to approach the carrier three.

[0044] The visual detection mechanism comprises:

[0045] The mounting plate six is fixedly connected with the workbench. The mounting plate seven is horizontally slidably arranged on the mounting plate six. The carrier five is arranged on the mounting plate seven.

[0046] The translation device ten is fixedly arranged on the lower surface of the mounting plate six and is connected with the mounting plate seven, and is used to drive the mounting plate seven to slide horizontally.

[0047] The lower visual backlight and the side visual backlight are arranged above the carrier five and are fixedly connected with the mounting plate six.

[0048] The lower visual camera is arranged directly below the lower visual backlight and is fixedly connected with the lower surface of the mounting plate six.

[0049] The side visual camera is arranged on the mounting plate six.

[0050] The flatness detection mechanism comprises:

[0051] The translation device eleven is fixedly connected with the workbench.

[0052] The three-dimensional laser line scanner is connected with the translation device eleven and is driven by the translation device eleven to move horizontally.

[0053] The conveying line seven is arranged below the three-dimensional laser line scanner and is fixedly connected with the workbench. The conveying direction of the conveying line seven is perpendicular to the translation direction of the translation device eleven. The carrier six is arranged on the conveying line seven. The conveying line seven is used to drive the carrier six to move horizontally.

[0054] The suction nozzle two is driven by the translation device four and the lifting device seven to place the suctioned semiconductor module on the carrier one. The five suction nozzles three are driven by the translation device five and the lifting device eight to place the semiconductor module on the carrier one on the carrier two, the carrier three, the carrier four, the carrier five and the carrier six in sequence, so that the semiconductor module sequentially undergoes Y-direction shaping, X-direction shaping, visual detection and flatness detection.

[0055] In an embodiment, the blanking device comprises:

[0056] The installation plate one is fixedly connected with the workbench, the translation device one and the slide rail one are arranged on the installation plate one, the clamp hand is connected with the translation device one, the clamp hand is horizontally moved by the translation device one, the tray is clamped by the clamp hand, the tray is horizontally slidably arranged on the slide rail one, the tray is horizontally slidably arranged on the slide rail one, the translation device one drives the tray to horizontally slide on the slide rail one, the carrying device two picks up the semiconductor module on the carrier six and places it on the tray;

[0057] The conveying line one and the conveying line two are arranged on the same side of the installation plate one and are fixedly connected with the workbench, the conveying line one and the conveying line two are horizontally arranged and are parallel to each other, the conveying line two is located directly above the conveying line one, the basket is arranged on the conveying line one and the conveying line two, a plurality of trays are horizontally slidably inserted into the basket and are arranged in stacks, and adjacent two trays are not in contact.

[0058] The lifting device one is arranged on the same side of the conveying line one and the conveying line two, the conveying line three is arranged on the lifting device one, the conveying line three is lifted by the lifting device one, the conveying line three is horizontally arranged and has the same conveying direction as the conveying line one and the conveying line two, when the lifting device one lifts the conveying line three to the same height as the conveying line one or the conveying line two, the conveying line one can horizontally convey the basket on the conveying line three or the conveying line three can horizontally convey the basket on the conveying line two, the horizontal moving direction of the basket on the conveying line one and the conveying line two is opposite, the lifting of the conveying line three by the lifting device one can make each layer of the tray in the basket on the conveying line three be at the same height as the slide rail one, the clamp hand clamps the tray in the basket on the conveying line three which is at the same height as the slide rail one and horizontally moves the tray to the slide rail one under the action of the translation device one, after the tray is filled with semiconductor modules, the clamp hand pushes the tray to horizontally move into the basket on the conveying line three along the slide rail one under the action of the translation device one.

[0059] Beneficial effects: the semiconductor module cutting and bending equipment of the application performs Y direction shaping, X direction shaping, visual detection and flatness detection on the semiconductor module after punching and bending, ensures that the manufactured semiconductor module product meets the requirements of PIN needle angle ±1°, PIN needle position degree ±0.3mm, needle height ±0.3mm and flatness, and has high product quality and high quality, thereby meeting the high-quality product quality requirements of customers. BRIEF DESCRIPTION OF DRAWINGS

[0060] In order to make the technical solutions of the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only need to be some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0061] Fig. 1 is a structural schematic diagram of a semiconductor module cutting and bending equipment according to the present application;

[0062] Fig. 2 is a top view of the semiconductor module cutting and bending equipment according to the present application;

[0063] Fig. 3 is a structural schematic diagram of a feeding device according to the present application;

[0064] Fig. 4 is a structural schematic diagram of a module pushing device according to the present application;

[0065] Fig. 5 is an enlarged view of part A in Fig. 4;

[0066] Fig. 6 is a structural schematic diagram of the module pushing device according to the present application;

[0067] Fig. 7 is a structural schematic diagram of a laser code printing device according to the present application;

[0068] Fig. 8 is a structural schematic diagram of a code reading device according to the present application;

[0069] Fig. 9 is a structural schematic diagram of a carrying device 1 and a carrying device 2 according to the present application;

[0070] Fig. 10 is a structural schematic diagram of a punching and bending device according to the present application;

[0071] Fig. 11 is an enlarged view of part B in Fig. 10;

[0072] Fig. 12 is a schematic diagram of Fig. 10 without a punching die and a bending die;

[0073] Fig. 13 is a schematic diagram of Fig. 10 without a punching die and a bending die;

[0074] Fig. 14 is a schematic diagram of a frame with a semiconductor module;

[0075] Fig. 15 is a schematic diagram of a semiconductor module with an unbent PIN corner;

[0076] Fig. 16 is a structural schematic diagram of a shaping detection device according to the present application;

[0077] Fig. 17 is a structural schematic diagram of a Y-direction shaping mechanism according to the present application;

[0078] Fig. 18 is a structural schematic diagram of an X-direction shaping mechanism according to the present application;

[0079] Figure 19 is a structural schematic diagram of the visual detection mechanism of the present application;

[0080] Figure 20 is a structural schematic diagram of the visual detection mechanism of the present application;

[0081] Figure 21 is a structural schematic diagram of the flatness detection mechanism of the present application;

[0082] Figure 22 is a structural schematic diagram of the blanking device of the present application;

[0083] Figure 23 is a structural schematic diagram of the lifting device one and the conveying line three of the present application;

[0084] Figure 24 is a structural schematic diagram of the gripper of the present application;

[0085] Figure 25 is a structural schematic diagram of the gripper of the present application.

[0086] The reference signs are explained as follows:

[0087] 1. Blanking device; 101. Mounting plate one; 102. Translation device one; 103. Gripper; 1031. Mounting frame one; 1032. Push-pull device one; 1033. Fixed clamping arm; 1034. Movable clamping arm; 1035. Pivot one; 1036. Pivot two; 104. Slide rail one; 105. Conveying line one; 106. Conveying line two; 107. Lifting device one; 108. Conveying line three;

[0088] 2. Feeding device; 21. Conveying line four; 22. Conveying line five;

[0089] 3. Module pushing device; 31. Translation device two; 32. Lifting device two; 33. Mounting plate two; 34. Lifting device three; 35. Lower clamping arm; 36. Upper clamping arm; 37. Motor one; 38. Rotary block; 39. Blocking pin; 310. Mounting frame six; 311. Translation device twelve; 312. Mounting plate eight; 313. Translation device thirteen; 314. Spring; 315. Push rod;

[0090] 4. Laser coding device; 41. Laser coding machine; 42. Conveying line six;

[0091] 5. Code reading device; 51. Mounting frame two; 52. Code reader;

[0092] 6. Carrying device one; 61. Mounting frame three; 62. X-axis translation device; 63. Y-axis translation device; 64. Z-axis lifting device; 65. Motor two; 66. Suction nozzle one;

[0093] 7, punching and bending device; 71, mounting plate three; 72, lower runner; 73, lower limit pin; 74, runner slide plate; 75, translation device three; 76, upper runner; 77, upper limit pin; 78, lifting device four; 79, punching movable die; 710, punching stationary die; 711, lifting device five; 712, bending stationary die; 713, bending movable die; 714, lifting device six; 715, containing groove;

[0094] 8, shape detection device; 81, translation device four; 82, lifting device seven; 83, suction nozzle two; 84, translation device five; 85, lifting device eight; 86, mounting plate four; 87, suction nozzle three; 88, mounting plate five; 89, carrier one;

[0095] 810, Y-direction shaping mechanism; 8100, shaping plate; 8101, lifting device nine; 8102, mounting bracket four; 8103, translation device six; 8104, mounting bracket five; 8105, translation device seven; 8106, shaping block one; 8107, shaping block two; 8108, rotation device one; 8109, carrier two; 8110, shaping edge;

[0096] 811, X-direction shaping mechanism; 8111, translation device eight; 8112, translation device nine; 8113, shaping block three; 8114, shaping rack; 8115, shaping rack groove; 8116, rotation device two; 8117, carrier three;

[0097] 812, carrier four;

[0098] 813, visual detection mechanism; 8131, mounting plate six; 8132, lower visual camera; 8133, lower visual backlight light source; 8134, mounting plate seven; 8135, translation device ten; 8136, slide rail two; 8137, carrier five; 8138, side visual backlight light source; 8139, side visual camera;

[0099] 814, flatness detection mechanism; 8141, support; 8142, translation device eleven; 8143, three-dimensional laser line scanner; 8144, conveying line seven; 8145, carrier six;

[0100] 10, workbench; 11, carrying device two; 12, tray; 13, semiconductor module; 14, basket; 15, clip; 16, frame; 161, tie; 162, pin cut line; 163, connecting strip; 17, groove; 18, lever; 19, stop lever. DETAILED DESCRIPTION

[0101] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0102] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, motion condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0103] In the present application, unless otherwise explicitly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through an intermediate medium; can be internal connection of two elements or interaction relationship between two elements, unless otherwise explicitly limited. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0104] In addition, if the embodiments of the present application involve "first", "second", etc. description, the "first", "second", etc. description is only for description purpose, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features with "first", "second" can explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person of ordinary skill in the art can realize it, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope of the present application.

[0105] The present application provides a semiconductor module cutting and bending equipment, which performs Y-direction shaping, X-direction shaping, visual detection and flatness detection on the semiconductor module 13 after punching and bending the semiconductor module 13, so as to ensure that the manufactured semiconductor module 13 product meets the requirements of PIN needle angle ±1°, PIN needle position degree ±0.3mm, needle height ±0.3mm, flatness, etc., and the manufactured semiconductor module 13 product has high quality, high quality, so as to meet the high quality product quality requirements of customers.

[0106] Specifically, as shown in FIG. 1 and FIG. 2, the semiconductor module cutting and bending device includes a workbench 10, a feeding device 2, a module pushing device 3, a carrying device one 6, a punching and bending device 7, a shaping and detecting device 8, a carrying device two 11, and a discharging device 1. The feeding device 2 delivers a magazine 15 in which a frame 16 with semiconductor modules 13 is placed. The module pushing device 3 is used to push the frame 16 out of the magazine 15. Then the carrying device one 6 takes away the frame 16 and places it in the punching and bending device 7. The punching and bending device 7 punches and bends the semiconductor modules 13 in the frame 16 to obtain finished products of the semiconductor modules 13 and separate them from the frame 16. The shaping and detecting device 8 picks up the finished products of the semiconductor modules 13 to perform PIN needle shaping, visual detection, and flatness detection in the Y direction and the X direction. After the shaping and detecting, the carrying device two 11 sends the finished products of the semiconductor modules 13 to the discharging device 1 to complete discharging by tray and basket.

[0107] Further, as shown in FIG. 1 and FIG. 2, the semiconductor module cutting and bending device further includes a laser coding device 4 and a code reading device 5. The module pushing device 3 pushes the frame 16 out of the magazine 15 to the laser coding device 4 for laser coding. The frame 16 after laser coding is read by the code reading device 5. The frame 16 after code reading is taken away by the carrying device one 6.

[0108] Specifically, as shown in FIG. 3, the feeding device 2 includes a conveying line four 21 and a conveying line five 22 arranged directly above the conveying line four 21. The conveying line four 21 and the conveying line five 22 are horizontally arranged and parallel to each other and fixedly connected with the workbench 10. The conveying line four 21 and the conveying line five 22 can horizontally move the magazine 15. The moving direction is shown by the arrow in FIG. 3. A plurality of frames 16 with semiconductor modules 13 are horizontally and slidably inserted into the magazine 15 and stacked. The upper and lower two adjacent frames 16 do not contact each other. This design facilitates pushing the frame 16 out of the magazine 15.

[0109] Specifically, as shown in FIG. 4-FIG. 6, the module pushing device 3 is located on the same side of the conveying line four 21 and the conveying line five 22. The module pushing device 3 includes a translation device two 31, a lifting device two 32, a mounting frame six 310, a translation device thirteen 313, and a push rod 315. The translation device two 31 is fixedly connected with the workbench 10. The lifting device two 32 is connected with the translation device two 31. The lifting device two 32 is driven by the translation device two 31 to move horizontally close to or away from the conveying line four 21 and the conveying line five 22. The horizontal moving direction is the same as the conveying direction of the conveying line four 21 and the conveying line five 22.

[0110] In the embodiment, as shown in FIG. 4 and FIG. 6, the lifting device two 32 is provided with a mounting plate two 33, the mounting plate two 33 is driven by the lifting device two 32 to move close to or away from the conveying line four 21 or the conveying line five 22, the mounting plate two 33 is provided with a lifting device three 34, a lower clamping arm 35 and a motor one 37, the lower clamping arm 35 is located at the lower end of the lifting device three 34, the upper end of the lifting device three 34 is connected with an upper clamping arm 36, when the lower clamping arm 35 moves close to the conveying line four 21 or the conveying line five 22 and is leveled with the conveying line four 21 or the conveying line five 22, the magazine 15 is translated and conveyed to the lower clamping arm 35 by the conveying line four 21 or the magazine 15 on the lower clamping arm 35 is taken away by the conveying line five 22, the upper clamping arm 36 is driven by the lifting device three 34 to move downward to cooperate with the lower clamping arm 35 to clamp and fix the magazine 15.

[0111] In the embodiment, as shown in FIG. 5, the motor one 37 is located beside the upper clamping arm 36, the lower end of the motor one 37 is drivingly connected with a rotary block 38, the rotary block 38 is driven by the motor one 37 to rotate around the vertical axis of the rotary block 38, the lower end of the rotary block 38 is provided with a pair of blocking pins 39 which are spaced apart and symmetrically distributed on both sides of the axis of the rotary block 38.

[0112] In the embodiment, as shown in FIG. 4 and FIG. 6, the mounting frame six 310 is fixedly connected with the workbench 10, the mounting frame six 310 is provided with a translating device twelve 311 and a mounting plate eight 312, the mounting plate eight 312 is horizontally slidably connected with the mounting frame six 310, the translating device twelve 311 is connected with the mounting plate eight 312 to drive the mounting plate eight 312 to horizontally slide on the mounting frame six 310, the sliding direction is the same as the translating direction of the translating device two 31; a translating device thirteen 313 is horizontally slidably mounted on the mounting plate eight 312, the sliding direction is perpendicular to the sliding direction of the mounting plate eight 312, the translating device thirteen 313 and the mounting plate eight 312 are connected with a spring 314, the extension direction of the spring 314 is the same as the sliding direction of the translating device thirteen 313; a push rod 315 is connected with the translating device thirteen 313, the push rod 315 is driven by the translating device thirteen 313 to horizontally move to push the frame 16 in the magazine 15 out, the horizontal moving direction of the push rod 315 is the same as the horizontal sliding direction of the translating device thirteen 313.

[0113] In the embodiment, the magazine 15 is open at both ends in the direction of translation of the push rod 315, one end of the push rod 315 enters the magazine 15 from one open end of the magazine 15, and the frame 16 extends out of the other open end of the magazine 15, the upper surface of the magazine 15 is provided with a groove 17 at both open ends, the groove 17 is provided with a rotating lever 18 that can rotate around a vertical axis, one end of the rotating lever 18 is connected to a stop lever 19, rotation of the rotating lever 18 drives the stop lever 19 to move away from or return to the open end of the magazine 15, when the stop lever 19 is at the open end of the magazine 15, the frame 16 cannot enter or exit the magazine 15, thereby protecting the safety of the frame 16 in the magazine 15 and preventing the frame 16 in the magazine 15 from falling out during movement of the magazine 15.

[0114] In the embodiment, when the translation device two 31 and the lifting device two 32 drive the lower clamping arm 35 to approach the conveying line four 21 and to be level with the conveying line four 21, the conveying line four 21 can horizontally move the magazine 15 on it to the lower clamping arm 35, then the lifting device three 34 drives the upper clamping arm 36 to descend to clamp and fix the magazine 15 in cooperation with the lower clamping arm 35, in the process of horizontally moving the magazine 15 on the conveying line four 21 to the lower clamping arm 35, the rotating block 38 moves horizontally into the groove 17, and a pair of stop pins 39 are located on both sides of the rotating lever 18, as shown in FIG. 5, the motor one 37 drives the rotating block 38 to rotate, the rotating lever 18 is driven to rotate by the pair of stop pins 39, the rotating lever 18 drives the stop lever 19 to move away from the open end of the magazine 15, then the translation device twelve 311 drives the push rod 315 to translate to a working position, then the translation device thirteen 313 drives the push rod 315 to horizontally move to push the frame 16 in the magazine 15 out, after pushing out one frame 16, the lifting device two 32 drives the next frame 16 to ascend to a position level with the push rod 315, then the push rod 315 continues to horizontally move to push the next frame 16 out, and the cycle is repeated until all the frames 16 in the magazine 15 are pushed out, then the lifting device two 32 drives the empty magazine 15 to ascend to a position level with the conveying line five 22 and the lower clamping arm 35, then the translation device two 31 drives the lower clamping arm 35 to approach the conveying line five 22, so that the empty magazine 15 is partially located on the conveying line five 22, then the conveying line five 22 starts to move the empty magazine 15 on the lower clamping arm 35 away, then the lifting device two 32 drives the lower clamping arm 35 to descend to a position level with the conveying line four 21, the conveying line four 21 conveys the next magazine 15 to the lower clamping arm 35, then the lifting device three 34 drives the upper clamping arm 36 to descend to clamp and fix the magazine 15 in cooperation with the lower clamping arm 35, then the translation device two 31 drives the lower clamping arm 35 to move away from the conveying line four 21, so as to prevent the lifting device two 32 from colliding with the conveying line four 21 and the conveying line five 22 during lifting of the magazine 15, then the aforementioned actions are repeated to push out the frames 16 in the magazine 15 layer by layer by the push rod 315.

[0115] In the embodiment, the spring 314 can avoid the push rod 315 from damaging the frame 16 or the push rod 315 and the spring clip 15 when the push rod 315 is not flush with the frame 16. When the push rod 315 is not flush with the frame 16, the translation of the push rod 315 will hit the spring clip 15 and cannot smoothly push out the frame 16. The spring clip 15 is fixed and cannot be moved. At this moment, the spring 314 will be stretched and drive the horizontal sliding device 313 to slide horizontally, buffer the impact of the push rod 315 on the spring clip 15, thereby avoiding the damage of the push rod 315 and the spring clip 15, and protecting the safety of the push rod 315 and the spring clip 15.

[0116] In the embodiment, as shown in FIG. 7, the laser coding device 4 includes a laser coding machine 41 and a conveying line six 42 arranged below the laser coding machine 41. The laser coding machine 41 and the conveying line six 42 are fixedly connected with the workbench 10. The push rod 315 pushes the frame 16 in the spring clip 15 out to the conveying line six 42. The conveying line six 42 conveys the frame 16 to below the laser coding machine 41 for laser coding. The laser coding machine 41 performs two-dimensional code imprinting on the semiconductor module 13 in the frame 16. The laser coding machine 41 performs coding on the semiconductor module 13 by compiling sequence code, date, logo and other patterns.

[0117] In the embodiment, as shown in FIG. 8, the code reading device 5 includes a mounting bracket two 51 and a code reader 52 arranged at the upper end of the mounting bracket two 51. The mounting bracket two 51 is fixedly connected with the workbench 10. The conveying line six 42 conveys the frame 16 after laser coding to below the code reader 52 for code reading. The code reader 52 performs two-dimensional code rating on the two-dimensional code product imprinted by the laser coding machine 41. The rating above B level is qualified.

[0118] In the embodiment, the carrying device one 6 and the carrying device two 11 are of the same structure, thus only the specific structure of the carrying device one 6 is described in detail. As shown in FIG. 9, the carrying device one 6 comprises a mounting frame three 61 and a three-axis translation mechanism arranged on the mounting frame three 61, and a motor two 65 is arranged on the three-axis translation mechanism. The motor two 65 is driven to translate along the XYZ three axes by the three-axis translation mechanism. The mounting frame three 61 is fixedly connected with the workbench 10. The three-axis translation mechanism comprises an X-axis translation device 62, a Y-axis translation device 63 and a Z-axis lifting device 64. The lower end of the motor two 65 is connected with a suction nozzle one 66. The suction nozzle one 66 is driven to rotate around a vertical axis by the motor two 65. The suction nozzle one 66 is used to suck the semiconductor module 13. Specifically, the carrying device one 6 sucks the semiconductor module 13 after code reading on the conveying line six 42 by the suction nozzle one 66. The qualified semiconductor module 13 is transferred to the punching and bending device 7. The unqualified semiconductor module 13 is transferred to an NG bin. The NG bin is arranged on the workbench 10. The carrying device two 11 sucks the semiconductor module 13 after flatness detection on the carrier six 8145 by the suction nozzle one 66. The qualified semiconductor module 13 is transferred to the feeding device 1. The unqualified semiconductor module 13 is transferred to the NG bin.

[0119] In the embodiment, as shown in FIG. 10, the punching and bending device 7 comprises a mounting plate three 71, a lower runner rod 72, a pair of runner sliding plates 74, a lifting device four 78, a translation device three 75, an upper runner rod 76, a punching die and a bending die. The mounting plate three 71 is fixedly connected with the workbench 10. The lower runner rod 72 is horizontally fixedly arranged on the mounting plate three 71. As shown in FIG. 12, a plurality of lower limiting nails 73 are arranged on the lower runner rod 72 at equal intervals along the length direction. The pair of runner sliding plates 74 are vertically slidably arranged on the mounting plate three 71 and symmetrically arranged on the two sides of the lower runner rod 72. The runner sliding plates 74 are horizontally arranged. The frame 16 with the semiconductor module 13 can be placed on the left end of the pair of runner sliding plates 74 by the carrying device one 6. As shown in FIG. 13, the lifting device four 78 is fixedly connected with the mounting plate three 71 and the runner sliding plates 74. The lifting device four 78 is used to drive the runner sliding plates 74 to lift and descend. When the runner sliding plates 74 descend, the frame 16 on the runner sliding plates 74 is in contact with the lower runner rod 72 and is limited by the lower limiting nails 73. As shown in FIG. 12, the design can arrange a plurality of frames 16 on the runner sliding plates 74 at equal intervals by the lower limiting nails 73, which facilitates subsequent punching and bending, thereby improving the punching and bending operation efficiency. Correspondingly, when the runner sliding plates 74 descend, the frame 16 with the semiconductor module 13 is transferred to the left end of the pair of runner sliding plates 74 by the carrying device one 6 and is directly limited by the leftmost lower limiting nail 73.

[0120] In the embodiment, as shown in FIG. 12, the translation device three 75 is fixedly connected with the workbench 10; the upper flow channel rod 76 is located directly above the lower flow channel rod 72, and a plurality of upper limiting nails 77 are arranged on the upper flow channel rod 76 at equal intervals along the length direction; the upper flow channel rod 76, the upper limiting nail 77, the lower flow channel rod 72 and the lower limiting nail 73 are arranged symmetrically, which facilitates the simultaneous and synchronous translation of the plurality of upper limiting nails 77 on a pair of flow channel sliding plates 74 along the length direction of the flow channel sliding plate 74, so as to realize the pipeline punching and bending operation, and improve the punching and bending operation efficiency. Specifically, as shown in FIG. 12, the upper flow channel rod 76 is connected with the translation device three 75, and the upper flow channel rod 76 is driven to move horizontally by the translation device three 75, and the moving direction is the same as the length direction of the lower flow channel rod 72; when the flow channel sliding plate 74 is raised, the frame 16 on the flow channel sliding plate 74 is separated from the lower flow channel rod 72 and the lower limiting nail 73, and at the same time, the frame 16 on the flow channel sliding plate 74 is in contact with the upper flow channel rod 76 and is limited by the upper limiting nail 77; at this time, the translation device three 75 drives all the frames 16 on a pair of flow channel sliding plates 74 to move horizontally, synchronously and simultaneously along the length direction of the lower flow channel rod 72 and the flow channel sliding plate 74.

[0121] In the embodiment, as shown in FIG. 10, the punching die includes a punching movable die 79, a punching fixed die 710 and a lifting device five 711; the punching fixed die 710 is located below the lower flow channel rod 72 and the flow channel sliding plate 74, and is fixedly connected with the mounting plate three 71; the punching movable die 79 is located above the flow channel sliding plate 74 and the upper flow channel rod 76, and is connected with the lifting device five 711; the lifting device five 711 is fixedly connected with the workbench 10, and drives the punching movable die 79 to descend and punch the frame 16 with the semiconductor module 13 in cooperation with the punching fixed die 710. Specifically, three work points are arranged at equal intervals on the punching movable die 79 and the punching fixed die 710 along the moving direction of the frame 16, which are respectively marked as point one, point two and point three; the point one is used for shaping the glue port on the frame 16 with the semiconductor module 13, which is a common knowledge in the injection molding industry; the point two is used for cutting the connecting rib 161 on the frame 16 with the semiconductor module 13; and the point three is used for cutting the needle foot on the frame 16 with the semiconductor module 13. The frame 16 with the semiconductor module 13 is shown in FIG. 14, the point two is used for cutting the connecting rib 161, and the point three is used for cutting the needle foot along the needle foot cutting line 162. The semiconductor module 13 after being punched by the point one, the point two and the point three is shown in FIG. 15, and at this time, the semiconductor module 13 is not completely separated from the frame 16, but is fixedly connected only through the connecting strip 163.

[0122] In the embodiment, as shown in Fig. 10, the bending die comprises a bending fixed die 712, a bending movable die 713 and a lifting device six 714. The bending fixed die 712 is located below the lower runner rod 72 and the runner slide plate 74 and is fixedly connected with the mounting plate three 71. The bending movable die 713 is located above the runner slide plate 74 and the upper runner rod 76 and is connected with the lifting device six 714. The lifting device six 714 is fixedly connected with the workbench 10. The bending movable die 713 is driven by the lifting device six 714 to descend and cooperate with the bending fixed die 712 to bend the PIN angle of the semiconductor module 13 and completely separate the semiconductor module 13 from the frame 16. The moving direction of the frame 16 on the pair of runner slide plates 74 is shown by arrows in Fig. 10. The frame 16 with the semiconductor module 13 moves horizontally on the pair of runner slide plates 74, passes through the punching die first and then the bending die. The bending fixed die 712 and the bending movable die 713 are equidistantly and spacedly arranged with three work positions along the moving direction of the frame 16, which are respectively marked as position four, position five and position six. The position four is used for pre-bending the PIN angle of the semiconductor module 13 by 45°. The position two is used for continuously bending the PIN angle of the semiconductor module 13 by 45°, so as to complete the work of bending the PIN angle by 90°. The position three is used for cutting the connecting strip 163 to completely separate the semiconductor module 13 from the frame 16.

[0123] In the embodiment, the translation device three 75 drives all equidistantly and spacedly arranged frames 16 to move horizontally and synchronously on the pair of runner slide plates 74 at the same time and in the same direction through the upper runner rod 76 and the upper limiting nail 77, and only one position is moved at a time. In this way, each frame 16 with the semiconductor module 13 can pass through the position one, the position two, the position three, the position four, the position five and the position six in turn to complete the processes of glue port shaping, connecting rib 161 cutting, pin cutting, PIN angle pre-bending by 45°, PIN angle continuous bending by 45°, connecting strip 163 cutting and completely separating the semiconductor module 13 from the frame 16, so as to realize the punching and bending operation in a pipeline mode and improve the punching and bending operation efficiency.

[0124] In the embodiment, as shown in Fig. 11, the lower surfaces of the punching movable die 79 and the bending movable die 713 are provided with accommodating grooves 715 for accommodating the upper runner rod 76 and the upper limiting nail 77 to prevent the upper runner rod 76 and the upper limiting nail 77 from affecting the punching and bending operation.

[0125] In the embodiment, as shown in FIG. 1, FIG. 2 and FIG. 16, the whole shaping detection device 8 comprises: translation device four 81, translation device five 84, carrier one 89, Y direction shaping mechanism 810, X direction shaping mechanism 811, carrier four 812, visual detection mechanism 813, flatness detection mechanism 814, as shown in FIG. 16, the translation device four 81 is fixedly connected with the workbench 10, and the lifting device seven 82 is arranged on the translation device four 81, the lifting device seven 82 is driven by the translation device four 81 to move horizontally, the suction nozzle two 83 is connected with the lifting device seven 82, the suction nozzle two 83 is driven by the lifting device seven 82 to lift, the suction nozzle two 83 is driven by the translation device four 81 and the lifting device seven 82 to go to the right end of the flow channel slide plate 74 in FIG. 10 to suck the frame 16 and the semiconductor module 13 after punching and bending, and the frame 16 is placed in the material box, and the semiconductor module 13 after bending is placed on the carrier one 89, and the material box is installed on the workbench 10.

[0126] In the embodiment, as shown in FIG. 16, the translation device five 84 is fixedly connected with the workbench 10, and the horizontal movement direction of the translation device five 84 is the same as that of the translation device four 81, the lifting device eight 85 is arranged on the translation device five 84, the lifting device eight 85 is driven by the translation device five 84 to move horizontally, the mounting plate four 86 is arranged on the lifting device eight 85, the mounting plate four 86 is driven by the lifting device eight 85 to lift, five suction nozzles three 87 are installed on the mounting plate four 86, the five suction nozzles three 87 are arranged in a straight line on the mounting plate four 86 along the horizontal movement direction of the translation device five 84, and are arranged at intervals, so that the semiconductor module 13 after bending can be placed on the carrier two 109, the carrier three 117, the carrier four 812, the carrier five 137 and the carrier six 145 in sequence from the carrier one 89, so that the semiconductor module 13 after bending can pass through Y direction shaping, X direction shaping, visual detection and flatness detection in sequence.

[0127] Specifically, as shown in FIG. 1, FIG. 2 and FIG. 16, the carrier one 89, the Y direction shaping mechanism 810, the X direction shaping mechanism 811, the carrier four 812, the visual inspection mechanism 813, the flatness inspection mechanism 814 are sequentially arranged below the suction nozzle two 83 and the suction nozzle three 87 along the moving direction of the translation device five 84, the carrier one 89, the Y direction shaping mechanism 810, the X direction shaping mechanism 811, the carrier four 812 are installed on the mounting plate five 88, the mounting plate five 88 is fixedly connected with the workbench 10, the visual inspection mechanism 813 and the flatness inspection mechanism 814 are fixedly connected with the workbench 10, in this way, the five suction nozzles three 87 are simultaneously moved by the translation device five 84 to move the bent semiconductor module 13 from the previous carrier to the next carrier, specifically, the first suction nozzle three 87 moves the bent semiconductor module 13 on the carrier one 89 to the carrier two 8109 under the drive of the translation device five 84 and the lifting device eight 85, the second suction nozzle three 87 moves the bent semiconductor module 13 on the carrier two 8109 to the carrier three 8117 under the drive of the translation device five 84 and the lifting device eight 85, the third suction nozzle three 87 moves the bent semiconductor module 13 on the carrier three 8117 to the carrier four 812 under the drive of the translation device five 84 and the lifting device eight 85, the fourth suction nozzle three 87 moves the bent semiconductor module 13 on the carrier four 812 to the carrier five 8137 under the drive of the translation device five 84 and the lifting device eight 85, the fifth suction nozzle three 87 moves the bent semiconductor module 13 on the carrier five 8137 to the carrier six 8145 under the drive of the translation device five 84 and the lifting device eight 85, the above-mentioned five suction nozzles three 87 are synchronously moved, so that the bent semiconductor module 13 is sequentially placed from the carrier one 89 to the carrier two 8109, the carrier three 8117, the carrier four 812, the carrier five 8137 and the carrier six 8145, so that the bent semiconductor module 13 sequentially passes through the Y direction shaping, the X direction shaping, the visual inspection and the flatness inspection, so that the shaping and inspection of the semiconductor module 13 is realized in a pipeline manner, and the shaping and inspection efficiency of the semiconductor module 13 is improved.

[0128] Specifically, as shown in FIG. 16 and FIG. 17, the Y direction shaping mechanism 810 includes: a rotating device one 8108, a lifting device nine 8101, a translation device six 8103, a mounting frame five 8104, the rotating device one 8108 is fixedly connected with the mounting plate five 88, the upper end of the rotating device one 8108 is provided with a carrier two 8109, the carrier two 8109 is driven by the rotating device one 8108 to rotate around the vertical axis to adjust the direction of the folded semiconductor module 13, and the compatibility requirement is improved; the lifting device nine 8101 is fixedly connected with the mounting plate five 88, the upper end of the lifting device nine 8101 is fixedly installed with the mounting frame four 8102, the mounting frame four 8102 is fixedly installed with the translation device six 8103, and the translation device six 8103 is driven by the lifting device nine 8101 to lift; the mounting frame five 8104 is connected with the translation device six 8103, the mounting frame five 8104 is driven by the translation device six 8103 to move horizontally, the mounting frame five 8104 is provided with a shaping block one 8106 and a translation device seven 8105, the upper end of the shaping block one 8106 is fixedly installed with a shaping plate 8100 vertically, the translation device seven 8105 is connected with a shaping block two 8107, the shaping block two 8107 is driven by the translation device seven 8105 to move horizontally to approach or away from the shaping plate 8100, the horizontal movement direction of the translation device seven 8105 is same as that of the translation device six 8103, as shown in FIG. 17, the upper end of the shaping plate 8100 and the side of the shaping block two 8107 close to the shaping plate 8100 are both provided with shaping edges 8110 which are parallel to each other and have same height, when the semiconductor module 13 is placed on the carrier two 8109, the folded PIN angle of the semiconductor module 13 extends into a pair of shaping edges 8110, and the PIN angle folded by 90 degrees is in contact with the shaping edges 8110 at the upper end of the shaping plate 8100, accordingly, if the PIN angle is not folded in place, it is not in contact with the shaping edges 8110 at the upper end of the shaping plate 8100, therefore, a pair of shaping edges 8110 is driven by the lifting device nine 8101 and the translation device six 8103 to move to a shaping position, then the translation device seven 8105 drives a pair of shaping edges 8110 to approach each other to Y direction shape the PIN angle, so that the PIN angle is folded in place, which can ensure that the PIN angle is folded by 90 degrees, and ensure that the folding angle of the PIN angle meets the requirement of 90°±1°.

[0129] Specifically, as shown in FIGS. 16 and 18, the X direction shaping mechanism 811 includes: a rotating device two 8116, a translation device eight 8111, a translation device nine 8112, a shaping block three 8113, the rotating device two 8116 is fixedly connected with the mounting plate five 88, an upper end of the rotating device two 8116 is provided with a carrier three 8117, the carrier three 8117 is driven by the rotating device two 8116 to rotate around a vertical axis; the translation device eight 8111 is fixedly connected with the mounting plate five 88, a direction of a translation action of the translation device eight 8111 is perpendicular to a direction of a translation action of the translation device six 8103; the translation device nine 8112 is connected with the translation device eight 8111, the translation device nine 8112 is driven by the translation device eight 8111 to move horizontally, a direction of a translation action of the translation device nine 8112 is same as the direction of the translation action of the translation device six 8103; the shaping block three 8113 is connected with the translation device nine 8112, the shaping block three 8113 is driven by the translation device nine 8112 to move horizontally to approach or move away from the carrier three 8117, as shown in FIG. 18, a side of the shaping block three 8113 close to the carrier three 8117 is provided with a shaping rack 8114, a plurality of shaping tooth grooves 8115 are arranged on the shaping rack 8114, the shaping block three 8113 moving horizontally to approach the carrier three 8117 can make the bent PIN corners of the semiconductor module 13 on the carrier three 8117 extend into each shaping tooth groove 8115, the bent PIN corners are shaped in the X direction by means of the shaping tooth groove 8115, the bent PIN corners are prevented from being inclined, the bent PIN corners are ensured to be vertical, and the positional accuracy of the PIN corners in the X direction is ensured to meet the accuracy requirement of ±0.3MM.

[0130] Specifically, as shown in FIGS. 19 and 20, the visual inspection mechanism 813 comprises a mounting plate six 8131, a translation device ten 8135, a lower visual backlight light source 8133 and a side visual backlight light source 8138, a lower visual camera 8132 and a side visual camera 8139 in this embodiment. The mounting plate six 8131 is fixedly connected with the workbench 10. The mounting plate seven 8134 is horizontally slidably installed on the mounting plate six 8131 through a slide rail two 8136. The carrier five 8137 is arranged on the mounting plate seven 8134. The translation device ten 8135 is fixedly installed on the lower surface of the mounting plate six 8131 and connected with the mounting plate seven 8134, so as to drive the mounting plate seven 8134 to horizontally slide. The lower visual backlight light source 8133 and the side visual backlight light source 8138 are both above the carrier five 8137 and fixedly connected with the mounting plate six 8131. The lower visual camera 8132 is directly below the lower visual backlight light source 8133 and fixedly connected with the lower surface of the mounting plate six 8131. The side visual camera 8139 is arranged on the mounting plate six 8131. After the semiconductor module 13 is placed on the carrier five 8137, the translation device ten 8135 drives the carrier five 8137 to horizontally slide along the slide rail two 8136 to a lower visual inspection position. Then, the lower visual camera 8132 and the lower visual backlight light source 8133 cooperate with each other to take a photo of the semiconductor module 13 and transmit the shooting information to a computer for identification, analysis and processing. Whether the position of the PIN angle of the semiconductor module 13 in the X direction meets the ±0.3MM precision requirement is visually detected. After that, the translation device ten 8135 drives the carrier five 8137 to horizontally slide along the slide rail two 8136 to a side visual inspection position. The side visual camera 8139 and the side visual backlight light source 8138 cooperate with each other to take a photo of the semiconductor module 13 and transmit the shooting information to the computer for identification, analysis and processing. Whether the bending angle of the PIN angle of the semiconductor module 13 meets the requirement of 90°±1° and whether the height of the PIN meets the requirement of ±0.3mm are visually detected.

[0131] Specifically, as shown in FIG. 21, the flatness detection mechanism 814 includes: a translation device eleven 8142, a three-dimensional laser line scanner 8143, a conveying line seven 8144, the translation device eleven 8142 is fixedly installed on a support 8141, the support 8141 is made of marble, the support 8141 is fixedly connected with the worktable 10, the three-dimensional laser line scanner 8143 is connected with the translation device eleven 8142, and the three-dimensional laser line scanner 8143 is driven by the translation device eleven 8142 to move horizontally; the conveying line seven 8144 is located below the three-dimensional laser line scanner 8143 and is fixedly connected with the worktable 10, a conveying direction of the conveying line seven 8144 is perpendicular to a translation direction of the translation device eleven 8142, the conveying line seven 8144 is provided with a carrier six 8145, and the conveying line seven 8144 is used to drive the carrier six 8145 to move horizontally from below the three-dimensional laser line scanner 8143. The flatness of the semiconductor module 13 on the carrier six 8145 is detected by the three-dimensional laser line scanner 8143, the three-dimensional laser line scanner 8143 irradiates the entire detection surface of the semiconductor module 13 with line laser, height data detection and feedback are performed, and whether the flatness of the semiconductor module 13 is qualified is determined by comparing the required value.

[0132] In the embodiment, the suction nozzle two 83 places the sucked semiconductor module 13 on the carrier one 89 under the action of the translation device four 81 and the lifting device seven 82, the five suction nozzles three 87 place the semiconductor module 13 on the carrier one 89 on the carrier two 8109, the carrier three 8117, the carrier four 812, the carrier five 8137 and the carrier six 8145 in turn under the action of the translation device five 84 and the lifting device eight 85, so that the semiconductor module 13 sequentially passes through Y-direction shaping, X-direction shaping, visual detection and flatness detection.

[0133] In the embodiment, as shown in FIG. 22, the blanking device 1 includes: a mounting plate one 101, a conveying line one 105 and a conveying line two 106, and a lifting device one 107, the mounting plate one 101 is fixedly connected with the worktable 10, the mounting plate one 101 is provided with a translation device one 102 and a sliding rail one 104, the translation device one 102 is connected with a clamping hand 103, the clamping hand 103 is driven by the translation device one 102 to move horizontally, the clamping hand 103 clamps a tray 12, the tray 12 is horizontally and slidingly installed on the sliding rail one 104, the sliding rail one 104 is fixedly connected with the mounting plate one 101, the tray 12 is driven by the translation device one 102 to slide horizontally on the sliding rail one 104 through the clamping hand 103, the carrying device two 11 picks up the semiconductor module 13 on the carrier six 8145 that passes the detection and places it on the tray 12, and the carrying device two 11 picks up the semiconductor module 13 on the carrier six 8145 that fails to pass the detection and places it in an NG bin.

[0134] In the embodiment, as shown in Fig. 22, the conveying line one 105 and the conveying line two 106 are arranged on the same side of the mounting plate one 101 and fixedly connected with the workbench 10. The conveying line one 105 and the conveying line two 106 are horizontally arranged and parallel to each other. The conveying line two 106 is located directly above the conveying line one 105. The basket 14 is arranged on the conveying line one 105 and the conveying line two 106. A plurality of stacked trays 12 are slidingly inserted into the basket 14 in a horizontal manner. The upper and lower two adjacent trays 12 are not in contact.The lifting device one 107 is arranged at the same side of the conveying line one 105 and the conveying line two 106, as shown in FIG. 23, and the conveying line three 108 is arranged on the lifting device one 107, and the conveying line three 108 is lifted by the lifting device one 107, and the conveying line three 108 is horizontally arranged, and the conveying direction of the conveying line three 108 is the same as the conveying direction of the conveying line one 105 and the conveying line two 106, when the conveying line three 108 is lifted to the same height as the conveying line one 105 or the conveying line two 106 by the lifting device one 107, the conveying line one 105 can horizontally move the baskets 14 on the conveying line one 105 to the conveying line three 108, or the conveying line three 108 horizontally moves the baskets 14 on the conveying line three 108 to the conveying line two 106, and the horizontal moving direction of the baskets 14 on the conveying line one 105 and the conveying line two 106 is shown by arrows in FIG. 22, and the horizontal moving direction is just opposite, and the lifting of the conveying line three 108 by the lifting device one 107 can make each layer of the trays 12 in the baskets 14 on the conveying line three 108 be at the same height as the slide rail one 104, and the design can make the clamping hand 103 horizontally move to the baskets 14 under the drive of the horizontal moving device one 102, clamp the trays 12 at the same height as the slide rail one 104 on the conveying line three 108, and drive the trays 12 to horizontally move to the slide rail one 104, when the baskets 14 are filled with the semiconductor modules 13, the clamping hand 103 horizontally moves under the drive of the horizontal moving device one 102, and pushes the trays 12 to horizontally move along the slide rail one 104 into the baskets 14 on the conveying line three 108, then the lifting of the conveying line three 108 by the lifting device one 107 makes the next layer of the trays 12 be at the same height as the slide rail one 104, then the clamping hand 103 horizontally moves under the drive of the horizontal moving device one 102 to the baskets 14, clamps the next layer of the trays 12, and pulls the trays 12 to the slide rail one 104, the carrying device two 11 continues to place the semiconductor modules 13 on the trays 12, when the trays 12 are filled, the trays 12 are sent back to the baskets 14, and the cycle is repeated until all the trays 12 in the baskets 14 are filled with the semiconductor modules 13, then the lifting of the conveying line three 108 by the lifting device one 107 makes the baskets 14 on the conveying line three 108 be at the same height as the conveying line two 106, and the conveying line three 108 conveys the baskets 14 to the conveying line two 106 and sends away, then the lifting of the conveying line three 108 by the lifting device one 107 makes the conveying line three 108 be at the same height as the conveying line one 105, and the conveying line one 105 conveys the baskets 14 on the conveying line one 105 to the conveying line three 108, then the lifting of the conveying line three 108 by the lifting device one 107 makes each layer of the trays 12 in the baskets 14 on the conveying line three 108 be at the same height as the slide rail one 104, and the above-mentioned actions are repeated to place the semiconductor modules 13 in each layer of the trays 12 in the baskets 14, and the cycle is repeated until the semiconductor modules 13 are placed in the baskets 14, and the unloading work is completed.

[0135] In the embodiment, as shown in FIG. 22, FIG. 24 and FIG. 25, the gripper 103 comprises a mounting frame 1031, a push-pull device 1032, a fixed clamping arm 1033, a movable clamping arm 1034, a pivot 1035 and a pivot 1036. The mounting frame 1031 is fixedly connected with the translation device 102. The push-pull device 1032 and the fixed clamping arm 1033 are fixedly connected with the mounting frame 1031. The movable clamping arm 1034 is pivotally connected with the mounting frame 1031 through the pivot 1035. The push-pull device 1032 is hingedly connected with the movable clamping arm 1034 through the pivot 1036. As shown in FIG. 24 and FIG. 25, after the translation device 102 drives the gripper 103 to approach the tray 12 in the basket 14, the push-pull device 1032 drives the movable clamping arm 1034 to pivot around the pivot 1035 to approach the fixed clamping arm 1033, so that the movable clamping arm 1034 clamps the tray 12 together with the fixed clamping arm 1033. Conversely, the push-pull device 1032 drives the movable clamping arm 1034 to pivot in the opposite direction around the pivot 1035, so that the movable clamping arm 1034 releases the clamping of the tray 12.

[0136] The above description is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation, direct / indirect application in other related technical fields based on the inventive concept of the present application and the content of the specification and drawings are included in the patent protection scope of the present application.

Claims

1. A semiconductor module lead cutting and bending device, characterized in that, The device comprises a workbench, a feeding device, a module pushing device, a carrying device one, a punching and bending device, a shaping and detecting device, a carrying device two and a discharging device.

2. The apparatus according to claim 1, wherein The device further comprises a laser coding device and a code reading device.

3. The apparatus according to claim 2, wherein the apparatus is characterized by: The feeding device comprises a conveying line four and a conveying line five arranged above the conveying line four.

4. The apparatus according to claim 3, wherein the apparatus is characterized by: The module pushing device comprises a translation device two, a lifting device two, a lifting device three, a lower clamping arm, a motor one and a rotating block. The device further comprises a mounting frame six, a translation device twelve and a mounting plate eight. ​ ​ The translation device thirteen is horizontally slidably installed on the mounting plate eight, and the sliding direction is perpendicular to the sliding direction of the mounting plate eight, a spring is connected between the translation device thirteen and the mounting plate eight, and the extension direction of the spring is the same as the sliding direction of the translation device thirteen; The push rod is connected with the translation device thirteen, and the push rod is driven by the translation device thirteen to horizontally move to push the frame in the magazine out; The magazine is open at both ends in the push rod translation direction, one end of the push rod enters the one end opening of the magazine, and then pushes the frame to extend out of the other end opening of the magazine, the upper surface of the magazine is provided with a groove at both ends of the opening, the groove is provided with a rotating lever which can rotate around a vertical axis, one end of the rotating lever is connected with a stop lever, and the rotating lever drives the stop lever to move away from or return to the opening end of the magazine, when the stop lever is located at the opening end of the magazine, the frame cannot enter or exit the magazine; When the magazine is translated to the lower clamping arm, the rotating block moves horizontally into the groove, and a pair of stop pins are located on both sides of the rotating lever, the motor drives the rotating block to rotate, and the rotating lever is driven to rotate through the pair of stop pins. The laser coding device comprises a laser coding machine and a conveying line six arranged below the laser coding machine, the laser coding machine and the conveying line six are fixedly connected with the workbench, the push rod pushes the frame in the magazine out to the conveying line six, and the frame is conveyed to below the laser coding machine by the conveying line six to be laser coded.

5. The apparatus according to claim 4, wherein the apparatus is characterized by: The code reading device comprises a mounting frame two and a code reader arranged at the upper end of the mounting frame two, the mounting frame two is fixedly connected with the workbench, and the conveying line six conveys the frame after laser coding to below the code reader to read the code.

6. A semiconductor module dicing and bending apparatus according to claim 5, wherein The carrying device one and the carrying device two are the same in structure; 7. The apparatus according to claim 6, wherein the apparatus is characterized by: The carrying device one comprises a mounting frame three and a three-axis translation mechanism arranged on the mounting frame three, a motor two is arranged on the three-axis translation mechanism, the motor two is driven by the three-axis translation mechanism to translate along the XYZ three axes, a suction nozzle one is connected to the lower end of the motor two, the suction nozzle one is driven by the motor two to rotate around a vertical axis, and the suction nozzle one is used for sucking the semiconductor module. The punching and bending device comprises:

8. The apparatus according to claim 7, wherein the apparatus is characterized by: A mounting plate three is fixedly connected with the workbench; A lower flow channel rod is horizontally and fixedly installed on the mounting plate three, a plurality of lower limiting nails are arranged on the lower flow channel rod at equal intervals along the length direction; A pair of flow channel sliding plates are vertically and slidably installed on the mounting plate three and symmetrically arranged on both sides of the lower flow channel rod, the flow channel sliding plates are horizontally arranged, and the frame with the semiconductor module can be placed on the pair of flow channel sliding plates by the carrying device one; A lifting device four is fixedly connected with the mounting plate three and the flow channel sliding plates, and is used for driving the flow channel sliding plates to lift, when the flow channel sliding plates descend, the frame on the flow channel sliding plates contacts the lower flow channel rod and is limited by the lower limiting nails; A translation device three is fixedly connected with the workbench; ​ The upper flow channel rod is located directly above the lower flow channel rod, a plurality of upper limiting pins are arranged on the upper flow channel rod at equal intervals along the length direction, the upper flow channel rod, the upper limiting pins, the lower flow channel rod and the lower limiting pins are arranged symmetrically, the upper flow channel rod is connected with the third translation device, the upper flow channel rod is driven to move horizontally by the third translation device, the moving direction is the same as the length direction of the lower flow channel rod, when the flow channel slide plate rises, the frame on the flow channel slide plate is in contact with the upper flow channel rod and is limited by the upper limiting pins, at this time, the third translation device drives the frame on the flow channel slide plate to move horizontally along the length direction of the lower flow channel rod and the flow channel slide plate through the upper flow channel rod and the upper limiting pins; The die-cutting mold comprises a die-cutting movable mold, a die-cutting fixed mold and a fifth lifting device, the die-cutting fixed mold is located below the lower flow channel rod and the flow channel slide plate and is fixedly connected with the third mounting plate, the die-cutting movable mold is located above the flow channel slide plate and the upper flow channel rod and is connected with the fifth lifting device, the fifth lifting device is fixedly connected with the workbench, the die-cuting movable mold is driven to descend by the fifth lifting device and cooperates with the die-cutting fixed mold to cut the frame with the semiconductor module The bending mold comprises a bending fixed mold, a bending movable mold and a sixth lifting device, the bending fixed mold is located below the lower flow channel rod and the flow channel slide plate and is fixedly connected with the third mounting plate, the bending movable mold is located above the flow channel slide plate and the upper flow channel rod and is connected with the sixth lifting device, the sixth lifting device is fixedly connected with the workbench, the bending movable mold is driven to descend by the sixth lifting device and cooperates with the bending fixed mold to bend the PIN angle of the semiconductor module and separates the semiconductor module from the frame; The frame with the semiconductor module moves horizontally on the flow channel slide plate, passes through the die-cutting mold first and then passes through the bending mold. The shape detection device comprises:

9. The apparatus according to claim 8, wherein the apparatus is characterized by: The fourth translation device is fixedly connected with the workbench, the fourth translation device is provided with a seventh lifting device, the fourth translation device drives the seventh lifting device to move horizontally, the seventh lifting device is connected with a suction nozzle two, the seventh lifting device drives the suction nozzle two to ascend and descend, the suction nozzle two is driven by the fourth translation device and the seventh lifting device to go to the end of the flow channel slide plate to suck the frame and the semiconductor module; The fifth translation device is fixedly connected with the workbench, the horizontal movement direction of the fifth translation device is the same as that of the fourth translation device, the fifth translation device is provided with an eighth lifting device, the fifth translation device drives the eighth lifting device to move horizontally, the eighth lifting device is provided with a fourth mounting plate, the eighth lifting device drives the fourth mounting plate to ascend and descend, the fourth mounting plate is installed with five suction nozzles three, the five suction nozzles three are arranged in a straight line on the fourth mounting plate along the horizontal movement direction of the fifth translation device and are arranged at intervals; The carrier one, the Y-direction shaping mechanism, the X-direction shaping mechanism, the carrier four and the visual detection mechanism are sequentially arranged below the suction nozzle two and the suction nozzle three along the horizontal movement direction of the fifth translation device, The flatness detection mechanism, the carrier one, the Y-direction shaping mechanism, the X-direction shaping mechanism and the carrier four are installed on the fifth mounting plate, the fifth mounting plate is fixedly connected with the workbench, the visual detection mechanism and the flatness detection mechanism are fixedly connected with the workbench; The Y-direction shaping mechanism comprises: ​ The rotating device one is fixedly connected with the mounting plate five, and the upper end of the rotating device one is provided with a carrier two, which is driven by the rotating device one to rotate around a vertical axis; The lifting device nine is fixedly connected with the mounting plate five; The translation device six is connected with the lifting device nine, and the translation device six is lifted by the lifting device nine; The mounting frame five is connected with the translation device six, and the mounting frame five is horizontally moved by the translation device six, and the mounting frame five is provided with a shaping block one and a translation device seven, the upper end of the shaping block one is vertically and fixedly provided with a shaping plate, the translation device seven is connected with a shaping block two, and the shaping block two is horizontally moved by the translation device seven to approach or move away from the shaping plate, the horizontal movement direction of the translation device seven is the same as that of the translation device six, and the upper end of the shaping plate and the side of the shaping block two close to the shaping plate are provided with shaping edges which are parallel to each other and have the same height, when the semiconductor module is placed on the carrier two, the bent PIN angle of the semiconductor module extends into a pair of shaping edges, and the bent 90-degree PIN angle is in contact with the shaping edge of the upper end of the shaping plate; The X-direction shaping mechanism comprises: The rotating device two is fixedly connected with the mounting plate five, and the upper end of the rotating device two is provided with a carrier three, which is driven by the rotating device two to rotate around a vertical axis; The translation device eight is fixedly connected with the mounting plate five, and the horizontal movement direction of the translation device eight is perpendicular to that of the translation device six; The translation device nine is connected with the translation device eight, and the translation device nine is horizontally moved by the translation device eight, and the horizontal movement direction of the translation device nine is the same as that of the translation device six; The shaping block three is connected with the translation device nine, and the shaping block three is horizontally moved by the translation device nine to approach or move away from the carrier three, and the side of the shaping block three close to the carrier three is provided with a shaping rack, and the shaping rack is provided with a plurality of shaping tooth grooves, and the horizontal movement of the shaping block three close to the carrier three can make the bent PIN angle of the semiconductor module on the carrier three extend into each shaping tooth groove; The visual detection mechanism comprises: The mounting plate six is fixedly connected with the workbench, and the mounting plate seven is horizontally and slidably installed on the mounting plate six, and the mounting plate seven is provided with a carrier five; The translation device ten is fixedly installed on the lower surface of the mounting plate six and connected with the mounting plate seven, and is used for driving the mounting plate seven to horizontally slide; The lower visual backlight light source and the side visual backlight light source are located above the carrier five and are fixedly connected with the mounting plate six; The lower visual camera is located directly below the lower visual backlight light source and is fixedly connected with the lower surface of the mounting plate six; The side visual camera is arranged on the mounting plate six; The flatness detection mechanism comprises: The translation device eleven is fixedly connected with the workbench; The three-dimensional laser line scanner is connected with the translation device eleven and is horizontally moved by the translation device eleven; The conveying line seven is located below the three-dimensional laser line scanner and is fixedly connected with the workbench, and The conveying direction of the conveying line seven is perpendicular to the translation direction of the translation device eleven, the conveying line seven is provided with a carrier six, and the conveying line seven is used for driving the carrier six to horizontally move. The suction nozzles two place the sucked semiconductor modules on the carrier one under the driving of the translation device four and the lifting device seven, and the five suction nozzles three place the semiconductor modules on the carrier one on the carrier two, the carrier three, the carrier four, the carrier five and the carrier six in turn under the driving of the translation device five and the lifting device eight, so that the semiconductor modules pass through the Y-direction shaping, the X-direction shaping, the visual inspection and the flatness inspection in turn.

10. The apparatus according to claim 9, wherein the apparatus is characterized by: The blanking device comprises: The mounting plate one is fixedly connected with the workbench, the translation device one and the slide rail one are arranged on the mounting plate one, the clamping hand is connected with the translation device one, the clamping hand is driven to move horizontally by the translation device one, the tray is clamped by the clamping hand, the tray is horizontally slidably arranged on the slide rail one, the tray is driven to slide horizontally on the slide rail one by the clamping hand, the carrying device two picks up the semiconductor modules on the carrier six and places them on the tray; The conveying line one and the conveying line two are arranged on the same side of the mounting plate one and are fixedly connected with the workbench, the conveying line one and the conveying line two are horizontally arranged and parallel to each other, the conveying line two is located directly above the conveying line one, the basket is arranged on the conveying line one and the conveying line two, a plurality of stacked trays are horizontally slidably inserted into the basket, and the upper and lower adjacent two trays are not in contact; The lifting device one is arranged on the same side of the conveying line one and the conveying line two, the conveying line three is arranged on the lifting device one, the conveying line three is driven to lift by the lifting device one, the conveying line three is horizontally arranged, the conveying direction of the conveying line three is the same as that of the conveying line one and the conveying line two, when the lifting device one drives the conveying line three to be lifted to a position at the same height as the conveying line one or the conveying line two, the conveying line one can translate and convey the basket thereon to the conveying line three, or the conveying line three can translate and convey the basket thereon to the conveying line two, the horizontal moving direction of the basket on the conveying line one and the conveying line two is opposite, the lifting of the conveying line three by the lifting device one can make each layer of the tray in the basket on the conveying line three be at the same height as the slide rail one, the clamping hand clamps the tray in the basket on the conveying line three which is at the same height as the slide rail one and drives the tray to move horizontally to the slide rail one under the driving of the translation device one, after the tray is filled with semiconductor modules, the clamping hand drives the tray to move horizontally along the slide rail one into the basket on the conveying line three under the driving of the translation device one. ​

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