Three-dimensional imaging temperature measurement method, device and system, and product and medium

Abstract

A three-dimensional imaging temperature measurement method, device and system, and a product and a medium. The three-dimensional imaging temperature measurement method comprises: acquiring image data, temperature data and depth data of a target field of view (S101); reconstructing the image data on the basis of the depth data, so as to obtain three-dimensional image data (S103); correcting the temperature data by means of the depth data, so as to obtain reconstructed temperature field data of the image data (S105); and applying the reconstructed temperature field data to the three-dimensional image data for display (S107). Three-dimensional image data and temperature field data are reconstructed on the basis of depth data, such that accurate temperature measurement can be achieved for target objects at different distances within the same field of view or different parts of the same target object; and the reconstructed temperature field data is applied to the three-dimensional image data for display, such that an accurate temperature value of an imaging target can be displayed in the three-dimensional image data, thereby achieving the aim of accurate temperature measurement.

Description

Three-dimensional imaging temperature measurement method, device, system, product and medium

[0001] The present application claims priority to Chinese Patent Application No. 202411294791.3, filed on September 14, 2024, and entitled "Three-dimensional imaging temperature measurement method, device, system, product and medium", and Chinese Patent Application No. 202422264738.0, filed on September 14, 2024, and entitled "Infrared thermal imaging device", the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0002] The present application relates to the field of image processing, in particular to a three-dimensional imaging temperature measurement method, an infrared thermal imaging device, an imaging temperature measurement system, a computer program product and a computer readable storage medium. BACKGROUND

[0003] Industrial power industries have begun to take digitalization and entity deep integration as the direction, rely on data intelligent information technology, and establish virtual information space of objective world to empower large-scale industrial, power station grid and other industry operation and maintenance work. At present, the traditional monitoring technology and portable device are all in the form of image superposition temperature color by accessing infrared thermal imaging video stream. The planar imaging characteristics of the optical lens result in that the obtained infrared thermal image information can only be two-dimensional image thermal imaging.

[0004] However, the infrared thermal imaging image can only calculate the temperature field of all imaging objects in the same image based on a target distance, cannot effectively determine the distance between all imaging objects and the thermal imager, and cannot reflect the distance difference of the measured target in the image due to the three-dimensional characteristics, thereby resulting in inaccurate temperature field data, which needs to be corrected in the later analysis of the distance of the measured target. On the other hand, although some device technologies use binocular visible light cameras to establish a three-dimensional model, this is only three-dimensional image fusion, and the characteristics of various feature data have not been fully utilized to meet the needs of industries such as industry, power and other industries for scene analysis, mining, retrieval and other major applications. SUMMARY

[0005] To solve the existing technical problems, the present application provides a three-dimensional imaging temperature measurement method, an infrared thermal imaging device, an imaging temperature measurement system, a computer program product and a computer readable storage medium for obtaining accurate temperature field for accurate temperature display of the measured points of the imaging target in the image data.

[0006] In a first aspect, a three-dimensional imaging temperature measurement method is provided, comprising:

[0007] obtaining image data, temperature data and depth data of a target field of view;

[0008] reconstruct the image data based on the depth data to obtain three-dimensional image data;

[0009] correct the temperature data based on the depth data to obtain reconstructed temperature field data of the image data;

[0010] apply the reconstructed temperature field data to the three-dimensional image data for display.

[0011] In a second aspect, an infrared thermal imaging device is provided, comprising a memory, a processor, and a data acquisition module connected to the processor;

[0012] The data acquisition module is configured to acquire image data, temperature data, and depth data of a target field of view.

[0013] The memory stores a computer program.

[0014] When the computer program is executed by the processor, the temperature data is corrected based on the depth data, and the corrected temperature data is applied to the image data for display; and / or, the image data is reconstructed based on the depth data to obtain three-dimensional image data.

[0015] In a third aspect, an imaging and temperature measurement system is provided, comprising an imaging and temperature measurement device and a terminal device in communication connection with the imaging and temperature measurement device.

[0016] The imaging and temperature measurement device comprises a data acquisition module configured to acquire image data, temperature data, and depth data of a target field of view and send them to the terminal device.

[0017] The terminal device comprises a memory and a processor, and the memory stores a computer program. When the computer program is executed by the processor, the temperature data is corrected based on the depth data, and the corrected temperature data is applied to the image data for display; and / or, the image data is reconstructed based on the depth data to obtain three-dimensional image data.

[0018] In a fourth aspect, a computer program product is provided, comprising a computer program. When the computer program is executed by a processor, the three-dimensional imaging and temperature measurement method described in any of the embodiments of the present application is implemented.

[0019] In a fifth aspect, a computer-readable storage medium is provided, which stores a computer program. When the computer program is executed by a processor, the three-dimensional imaging and temperature measurement method described in any of the embodiments of the present application is implemented.

[0020] The three-dimensional imaging temperature measurement method provided in the above embodiments can obtain image data, temperature data and depth data of a target field of view, the depth data contains shooting distance information of all imaging targets in the image data, reconstructs three-dimensional image data based on the depth data, corrects the temperature data by using the depth data, corrects the temperature difference of the imaging targets with different relative distances in the image data according to the depth data, obtains the reconstructed temperature field data of the infrared image, so that the target objects with different distances in the same field of view or different parts of the same target object can achieve accurate temperature measurement, and the reconstructed temperature field data is applied to the three-dimensional image data for display, so that the accurate temperature value of the imaging target can be displayed in the three-dimensional image data, and the purpose of accurate temperature measurement is achieved.

[0021] The infrared thermal imaging device, the imaging temperature measurement system, the computer program product and the computer readable storage medium provided in the above embodiments belong to the same concept as the corresponding three-dimensional imaging temperature measurement method embodiments, and have the same technical effects as the corresponding three-dimensional imaging temperature measurement method embodiments, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0022] FIG. 1 is a schematic diagram of an optional application scenario of a three-dimensional imaging temperature measurement method.

[0023] FIG. 2 is a schematic diagram of another optional application scenario of a three-dimensional imaging temperature measurement method.

[0024] FIG. 3 is a flowchart of a three-dimensional imaging temperature measurement method in an embodiment.

[0025] FIG. 4 is a schematic diagram of the structure of a three-dimensional imaging temperature measurement device in an example.

[0026] FIG. 5 is a flowchart of a three-dimensional imaging temperature measurement method in an example.

[0027] FIG. 6 is a schematic diagram of the structure of an imaging temperature measurement device in an embodiment.

[0028] FIG. 7 is a schematic diagram of the structure of an imaging temperature measurement system in an embodiment.

[0029] FIG. 8 is a schematic diagram of the structure of an infrared thermal imaging device in a first embodiment.

[0030] FIG. 9 is a schematic diagram of the structure of an infrared thermal imaging device in a second embodiment.

[0031] FIG. 10 is a schematic diagram of the structure of an infrared thermal imaging device in a third embodiment.

[0032] FIG. 11 is a schematic diagram of the structure of an infrared thermal imaging device in a fourth embodiment.

[0033] FIG. 12 is a schematic diagram of the structure of an infrared thermal imaging device in a fifth embodiment.

[0034] Fig. 13 is a schematic diagram of the structure of the infrared thermal imaging device in the sixth embodiment. DETAILED DESCRIPTION

[0035] The technical solutions of the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0036] In order to make the purposes, technical solutions and advantages of the present application more clear, the present application will be further described in detail below in combination with the drawings, and the described embodiments should not be regarded as limitations to the present application. All other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0037] In the following description, the expression "some embodiments" describes a subset of all possible embodiments, and it should be noted that "some embodiments" can be the same subset or different subsets, and can be combined with each other without conflict.

[0038] It should also be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "inner", "outer", "left", "right", and similar expressions used herein are intended to be used in connection with the embodiments shown in the drawings and are not intended to be limiting.

[0039] Referring to Fig. 1, it is a schematic diagram of an optional application scenario of the three-dimensional imaging temperature measurement method provided by the embodiments of the present application. The three-dimensional imaging temperature measurement method is applied to an imaging temperature measurement device 20, such as a handheld infrared thermal imager designed for power inspection, intelligent machine room monitoring, power distribution room monitoring and other application scenarios, to identify high temperature risks by taking infrared images of target devices in real time for temperature measurement. The imaging temperature measurement device 20 includes a data acquisition module 21, a storage 22 and a processor 23. The imaging temperature measurement device 20 can be loaded with a computer program for executing the three-dimensional imaging temperature measurement method provided by the embodiments of the present application. The data acquisition module 21 is used to acquire image data, temperature data and depth data of a target field. In the process of acquiring image data in real time, the original temperature data of the imaging target in the image data is corrected by obtaining the depth data corresponding to the image data, to obtain reconstructed temperature field data that can eliminate the temperature difference of the imaging target caused by the object distance difference, and to obtain the accurate temperature value of each imaging target in the image data. The depth data is used to perform three-dimensional reconstruction on the image data to obtain three-dimensional image data, and the reconstructed temperature field data is applied to the three-dimensional image data for display, so that the accurate temperature value of the imaging target can be displayed in the three-dimensional image data.

[0040] Optionally, referring to FIG. 2, the three-dimensional imaging temperature measurement method can be applied to a terminal device 30 in communication connection with the imaging temperature measurement device 20', such as a handheld infrared thermal imager designed for power inspection, intelligent machine room monitoring, power distribution room monitoring and other application scenarios to identify high temperature risks by taking infrared images of target devices in real time for temperature measurement. The terminal device 30 can be a computer device, a mobile terminal, a cloud terminal or other intelligent devices with storage and computing functions in communication connection with the imaging temperature measurement device 20'. The terminal device 30 can be loaded with a computer program for executing the three-dimensional imaging temperature measurement method provided by the embodiments of the present application. In the use process of the imaging temperature measurement device 20' for real-time image acquisition, the image data, temperature data and depth data are sent to the terminal device 30, the terminal device 30 performs three-dimensional reconstruction on the image based on the depth data, and corrects the original temperature data of the imaging target in the image data according to the depth data, to obtain reconstructed temperature field data that can eliminate temperature differences of the imaging target caused by object distance differences, and obtain accurate temperature values of each imaging target in the image data. The reconstructed temperature field data can be returned to the imaging temperature measurement device 20' for temperature display of the imaging target in the image data acquired in real time, or can be displayed on the terminal device 30 for temperature display of the imaging target in the three-dimensional image data obtained by three-dimensional reconstruction of the data image acquired in real time by the imaging temperature measurement device 20'.

[0041] It should be noted that in the following embodiments provided by the present application, the three-dimensional imaging temperature measurement method is mainly applied to the imaging temperature measurement device (i.e., the imaging temperature measurement device is the execution subject) as an example for illustration, but this does not limit the present application.

[0042] Referring to FIG. 3, the three-dimensional imaging temperature measurement method provided by an embodiment includes the following steps:

[0043] S101, obtaining image data, temperature data and depth data of a target field of view.

[0044] The image data can be a visible light image, an infrared image or both a visible light image and an infrared image.

[0045] S103, reconstructing the image data based on the depth data to obtain three-dimensional image data.

[0046] The depth data can reflect the shooting distance of the imaging target in the image data, and can provide geometric depth information of the object surface of the imaging target in the image data. The three-dimensional model of the imaging target can be calculated and constructed through the geometric depth information.

[0047] In an optional example, reconstructing the image data based on the depth data to obtain three-dimensional image data mainly includes:

[0048] The mapping point v of point p in the world coordinate system under the camera coordinate system is obtained from the camera pose matrix of the depth data, and the corresponding pixel point x in the depth image is obtained by back-projecting the v point from the camera intrinsic matrix, and the depth value of the pixel point x is value(x), and the distance of the point v to the camera coordinate origin is distance(v).

[0049] The signed distance function value of p is sdf(p) = value(x) - distance(v).

[0050] The tsdf(p) is calculated, and the truncated distance u is within the tsdf(p) = sdf(p) / |u|, otherwise, if sdf(p) > 0, tsdf(p) = 1, sdf(p) < 0, tsdf(p) = -1.

[0051] The calculation formula of the weight w(p) is: w(p) = cos(θ) / distance(v); wherein θ is the included angle of the projection light and the surface normal vector, and the three-dimensional image is constructed by using the multi-frame data fusion of the weights w(p).

[0052] Specifically, in the embodiment, the method for reconstructing three-dimensional image data can include the following steps:

[0053] S1, the position of the voxel x in the physical coordinate is calculated. The coordinates (Vx, Vy, Vz) of the voxel x on the TSDF (Truncated Signed Distance Function, truncated signed distance function) map are recorded, and the position of the corresponding pixel point x in the physical world coordinate system is shown in the following formula 1. Px, wrd = (X0 + Vx*voxel.x, y0 + Vy*voxel.y, z0 + Vz*voxel.z); (Formula 1)

[0054] S2, the position of the voxel x in the camera coordinate system is calculated.

[0055] Suppose the pose of the camera relative to the physical coordinate system is R and T, and the position of the voxel x in the camera coordinate system is shown in the following formula 2. Px, cam = RPx, wrd + T; (Formula 2)

[0056] S3, the depth camz(x) of the voxel x relative to the camera is calculated. According to the camera imaging model, it is shown in the following formula 3: camz(x) * Ix = KPx, cam; (Formula 3)

[0057] Wherein K represents the intrinsic matrix of the camera, and Ix represents the pixel coordinates of the voxel x projected on the camera imaging plane.

[0058] A straight line is drawn along the optical center of the camera and the voxel x, which will intersect the cross section of the object at a point P. The depth of P is denoted as dp. Denote the current depth map as D, and in actual calculation, dp=D(Ix). Then the sdf value of voxel x can be calculated using the following formula 4: sdf(x)=dp-dx=D(Ix)-camz(x); (formula 4)

[0059] The depth value of the pixel point x is D(Ix), and the distance of point x to the origin of the camera coordinate is camz(x).

[0060] S4, calculate the tsdf value.

[0061] sdf(x)>0 indicates that the voxel x is between the camera and the surface of the object; sdf(x)<0 indicates that the voxel x is behind the surface of the object. According to the sdf value of the voxel x, its tsdf value can be calculated as shown in the following formula 5: tsdf(x)=max[-1,min(1,sdf(x) / t)]; (formula 5)

[0062] Wherein sdf(x) / t, that is, the meaning of Truncated is:

[0063] When -t≤sdf(x)≤t, tsdf(x)=sdf(x) / t∈[-1,1];

[0064] When sdf(x)>t or sdf(x)<-t, tsdf(x)=1 or -1.

[0065] Where t can be regarded as a threshold value of the depth difference between voxel x and the corresponding point P of the cross section. When the voxel is very close to the surface, the tsdf value is close to zero; when the voxel is very far from the surface, the tsdf value tends to 1 or -1. When initialized, the tsdf value of all voxels is set to 1, which is equivalent to that there is no surface in the TSDF map.

[0066] S5, calculate the TSDF weight of the current frame.

[0067] Traverse all voxels (1~p), and take a voxel in the world coordinate system as an example. The calculation formula of the weight w(p) is: w(x)=cos(θ) / camz(x), wherein θ is the included angle between the projection light and the surface normal vector, that is, the tsdf value and the weight value of all voxels of this frame are calculated.

[0068] S6, fuse the current frame with the global fusion result.

[0069] If the current frame is the first frame, the first frame is the result, otherwise, the current frame needs to be fused with the previous fusion result.

[0070] TSDF(p) represents the fusion TSDF value of the voxel p, W(p) is the fusion weight value, tsdf(p) is the current TSDF value of the voxel p, and w(p) is the current frame weight value. The TSDF(p) is updated by tsdf(p), as shown in the following formula 6 and formula 7: W(p) = W(p) + w(p); (formula 7)

[0071] S7, rgb value calculation.

[0072] Let the RGB image corresponding to the depth map be RGB, then rgb(x) = RGB(Ix).

[0073] The three-dimensional image data is obtained by reconstructing the image data based on the depth data, including but not limited to key frame selection, depth map estimation, real-time three-dimensional reconstruction and other processing steps. The key frame selection aims to ensure that the fields of view corresponding to adjacent key frames are as close as possible. The depth map trajectory is based on the obtained depth data, and the depth value of each pixel point is calculated and estimated to form a depth map. Real-time three-dimensional reconstruction is to construct a three-dimensional model of an object according to the depth map and other related information. The implementation process of three-dimensional reconstruction using depth data to obtain three-dimensional image data can be realized by selecting known algorithms under the technical guidance of the present application, and the present application does not limit this.

[0074] S105, correcting the temperature data of the image data by the depth data to obtain the reconstructed temperature field data of the image data.

[0075] The temperature data of the image data of the target field of view can be obtained by collecting and recording by the infrared detector when collecting the infrared image, or by processing and analyzing the infrared image that has been collected. It is the original temperature data required for the imaging of the infrared image corresponding to the target field of view, so that the temperature data and the image data of the infrared image have a one-to-one correspondence. The imaging of the infrared image is usually the temperature of all imaging targets in the infrared image calculated based on a fixed target distance. Therefore, the difference in relative distance between different imaging targets and the shooting device in the same target field of view will affect the imaging display of the imaging target in the infrared image, that is, the same imaging target will present temperature difference and color difference in the infrared image obtained by shooting at different distances relative to the shooting device. Therefore, the temperature data of the infrared image cannot reflect the distance difference of the imaging target in the infrared image due to the three-dimensional characteristics, thereby affecting the accuracy of the temperature data value of the imaging target in the infrared image, and affecting the temperature measurement precision in various application scenarios of using the infrared image to measure the temperature of the target object.

[0076] The depth data corresponding to the image data includes the shooting distances of all imaging targets in the image data. The temperature data is corrected by the depth data. The temperature difference of the target object caused by the distance difference at different shooting distances is corrected by the depth data of each imaging target in the image data, so as to obtain the reconstructed temperature field data of the image data. The target object at different distances in the same field of view or different parts of the same target object can achieve accurate temperature measurement. The correction of the temperature data by the depth data can be a linear proportion correction mode determined by measuring the temperature difference caused by the known distance difference according to the shooting distance of different imaging targets. Or the temperature data set can be corrected by using the known data correction or compensation mode under the guidance of the technical concept of the present application. The present application does not limit this.

[0077] S107, applying the reconstructed temperature field data to the three-dimensional image data for display.

[0078] The three-dimensional image data is obtained by reconstructing the image data based on the depth data. It can be understood that the image data here can refer only to visible light images, three-dimensional visible light images obtained by three-dimensional reconstruction based on depth data; only infrared images, three-dimensional infrared images obtained by reconstruction based on depth data; or dual-light fusion images of visible light images and infrared images, three-dimensional dual-light fusion images obtained by reconstruction based on depth data. The reconstructed temperature field data is applied to the three-dimensional image data for display, and the data temperature value of the measured point of the imaging target with three-dimensional shape and structure in the three-dimensional image data is determined based on the reconstructed temperature field data.

[0079] The three-dimensional imaging temperature measurement method provided in the above embodiments acquires image data, temperature data and depth data of a target field of view. The depth data contains shooting distance information of all imaging targets in the image data. The image data is reconstructed based on the depth data to obtain three-dimensional image data. The temperature data is corrected by the depth data. The temperature difference of the imaging target at different relative distances is corrected according to the depth data. The reconstructed temperature field data of the infrared image is obtained, so that the target object at different distances in the same field of view or different parts of the same target object can achieve accurate temperature measurement. The reconstructed temperature field data is applied to the three-dimensional image data for display. The accurate temperature value of the imaging target can be displayed in the three-dimensional image data to achieve the purpose of accurate temperature measurement.

[0080] In some embodiments, the image data includes visible light images and infrared images; the step S103 includes:

[0081] The visible light images are reconstructed based on the depth data to obtain three-dimensional visible light images;

[0082] The infrared image is registered and fused with the three-dimensional visible light image to obtain a three-dimensional dual-light fused image.

[0083] In the embodiment, the image data includes an infrared image and a visible light image. The image data is reconstructed based on the depth data to obtain three-dimensional image data, which first includes reconstructing the visible light image based on the depth data to obtain a three-dimensional visible light image, and then registering and fusing the infrared image with the three-dimensional visible light image to obtain a three-dimensional dual-light fused image. The data in the depth data and the data in the visible light image have a one-to-one corresponding relationship, and three-dimensional reconstruction using the depth data and the visible light image can eliminate the registration processing step and is also more conducive to the quality of the reconstructed three-dimensional image. The registration and fusion of the infrared image and the three-dimensional visible light image involve more spatial information and dimensions relative to the registration between two-dimensional images, and can be implemented using known registration techniques. One of the following can be used: first, a registration method based on feature point matching, which extracts key points in the infrared image and the three-dimensional visible light image, calculates feature descriptors of the key points, and then uses the feature descriptors to match and implement registration. The feature points can be image edges, corner points or marker points; second, a registration method based on phase correlation, which uses Fourier transform to transform the infrared image and the three-dimensional visible light image into the frequency domain, calculates the cross-correlation function of the two, and realizes image registration by maximizing the cross-correlation function; third, a registration method based on projection transformation, which realizes image registration by translation, rotation, scaling and other transformations of the image based on the geometric shape features of the image, etc.

[0084] In the above embodiment, the implementation method is provided, which first reconstructs a three-dimensional image from the visible light image and the obtained depth data, and then registers and fuses the infrared image with the three-dimensional image to obtain a three-dimensional dual-light fused image, which can simplify the reconstruction processing flow of the three-dimensional image of the multi-type image data including the infrared image and improve the quality of the reconstructed three-dimensional dual-light fused image.

[0085] In some embodiments, step S107 comprises:

[0086] The three-dimensional dual-light fused image is rendered and displayed based on the reconstructed temperature field data.

[0087] The three-dimensional image data is a three-dimensional dual-light fusion image obtained by three-dimensional reconstruction of the visible light image and the infrared image based on the depth data. The three-dimensional dual-light fusion image and the reconstructed temperature field data are rendered on a display interface for display. A user can intuitively obtain the three-dimensional dual-light fusion image and the temperature display. It should be noted that the three-dimensional image data can also refer to a three-dimensional visible light image obtained by three-dimensional reconstruction of the visible light image based on the depth data, or can refer to a three-dimensional infrared image obtained by reconstruction of the infrared image based on the depth data. A three-dimensional imaging temperature measurement device applying the three-dimensional imaging temperature measurement method provided in this application can include various temperature measurement display modes: first, a visible light display mode, in which the reconstructed temperature field data is applied to the three-dimensional visible light image for display; second, an infrared display mode, in which the reconstructed temperature field data is applied to the three-dimensional infrared image for display; and third, a fusion image display mode, in which the reconstructed temperature field data is applied to the three-dimensional dual-light fusion image for display. The three-dimensional imaging temperature measurement device switches to a target temperature measurement display mode selected by a user according to a selection instruction of the user, and displays the three-dimensional visible light image and the temperature data value of the measured point, the three-dimensional infrared image and the temperature data value of the measured point, or the three-dimensional dual-light fusion image and the temperature data value of the measured point in the display interface.

[0088] In some embodiments, step S105 comprises:

[0089] The temperature data value of the target point is corrected by a temperature correction function according to the depth data value of the target point in the depth data, to obtain a corrected temperature data value of the target point.

[0090] The reconstructed temperature field data of the infrared image is obtained according to the corrected temperature data value of the target point constituting each target object in the infrared image.

[0091] The depth data can be registered with the infrared image or the temperature data of the infrared image to ensure one-to-one correspondence between the data in the depth data and the temperature. The target point can be any pixel point in the infrared image. The temperature correction function can be a correction function for compensating the temperature data value by a certain proportion according to the relative relationship between the imaging distance of the target in the infrared image and the actual object distance. In this embodiment, the temperature correction function can be obtained by using known data statistical methods under the guidance of the technical concept of correcting the depth data proposed in this application. As long as the temperature data of the imaging target at different distances can be compensated to a certain extent by using the corresponding distance value, the accuracy of the reconstructed temperature field data can be improved to a certain extent, which is not limited in this application.

[0092] In the above embodiment, for the temperature data value of each target point in the image, the corresponding depth data value of the target point is used to calculate the corrected temperature data value through the set temperature correction function, which can simplify the correction calculation.

[0093] In order to have a more overall understanding of the three-dimensional imaging temperature measurement method provided by the embodiments of the present application, please refer to FIG. 4 and FIG. 5, and take the three-dimensional imaging temperature measurement device applied to the multi-sensor combination of the high-performance processor as an example for illustration. The three-dimensional imaging temperature measurement device includes a main processing unit 83, a depth sensor 85, a visible light module 82, an infrared module 81, and a display screen 86. The main processing unit 83 is a high-performance mobile processor platform, which can access and process various sensor data, including CPU, GPU and NPU for data processing and software running, and is used to execute the three-dimensional imaging temperature measurement method described in the embodiments of the present application. The depth sensor 85 can be a three-dimensional point cloud information acquisition module, which is used for collecting three-dimensional space information of the object surface and distance data. The visible light module 82 can acquire the visible light image of the target object. The infrared module 81 is used to acquire the infrared image and temperature data set of the target object. The display screen 86 is used to visually display the data processed by the main processing unit, or the three-dimensional imaging temperature measurement device can be visually displayed through PC communication connection, or directly processed and visualized by PC.

[0094] The three-dimensional imaging temperature measurement method includes the following steps:

[0095] S11, acquiring depth data of a target object by a depth sensor. The depth data mainly refers to three-dimensional point cloud space information.

[0096] S12, acquiring infrared image data by an infrared module.

[0097] S13, acquiring infrared temperature data by the infrared module.

[0098] S14, acquiring a visible light image by a visible light module.

[0099] S15, the main processing unit performs image fusion on the visible light image and the three-dimensional point cloud space information by using a reconstruction and image fusion algorithm to obtain a three-dimensional visible light image; wherein the image fusion mainly includes data preprocessing, registration and fusion algorithm.

[0100] S16, the main processing unit performs registration and fusion on the infrared image data and the three-dimensional visible light image by using an image registration and image fusion algorithm to obtain a three-dimensional dual-light fusion image.

[0101] S17, the main processing unit corrects the infrared temperature data based on the depth data by using a temperature correction algorithm to obtain reconstructed temperature field data.

[0102]

[0102] S18, the main processing unit renders the three-dimensional dual-light fusion image and the reconstructed temperature field data on a display interface for display. A user can intuitively obtain the three-dimensional dual-light fusion image and the accurate temperature display of the measured point.

[0103] The three-dimensional imaging temperature measurement method provided by the embodiments of the present application fully utilizes the feature data and characteristic features of various image data, reconstructs high-quality three-dimensional images and high-precision temperature field data by using the depth data obtained during image data acquisition, and is used for intuitive display of high-precision temperature data of the measured point of the imaging target in the three-dimensional image, so that the needs of the industry, power and other industries for equipment operation and maintenance and other major applications can be met.

[0104] Another aspect of the embodiments of the present application, please refer to Figure 6, also provides an imaging temperature measurement device 20, comprising a memory 22, a processor 23 and a data acquisition module 21 connected with the processor 23. The data acquisition module 21 is used for acquiring image data, temperature data and depth data of a target field of view; the memory 22 has a computer program stored thereon; the computer program is executed by the processor 23 to realize the three-dimensional imaging temperature measurement method of any embodiment of the present application.

[0105] Optionally, the data acquisition module 21 includes an infrared module 212 and a depth data acquisition module 211. The infrared module 212 is used for acquiring infrared images and corresponding temperature data of the target field of view. The depth data acquisition module 211 includes one of the following:

[0106] The depth data acquisition module 211 includes a depth sensor, and the depth sensor is used for acquiring corresponding depth data of the target field of view, and applying the reconstructed temperature field data to the three-dimensional infrared image for display;

[0107] The depth data acquisition module 211 includes a visible light and depth data acquisition device, and the visible light and depth data acquisition device is used for acquiring visible light images and corresponding depth data of the target field of view. The display mode of the reconstructed temperature field data includes one of the following: applying the reconstructed temperature field data to the three-dimensional infrared image for display; applying the reconstructed temperature field data to the registered three-dimensional visible light image for display; applying the reconstructed temperature field data to the three-dimensional dual-light fusion image for display;

[0108] The depth data acquisition module 211 comprises a visible light module and a depth sensor, the depth sensor is used for acquiring depth data corresponding to the infrared image, and the visible light sensor is used for acquiring a visible light image of the target field of view; the display mode of the reconstructed temperature field data comprises one of the following: the reconstructed temperature field data is applied to a three-dimensional infrared image for display; the reconstructed temperature field data is applied to a registered three-dimensional visible light image for display; and the reconstructed temperature field data is applied to a three-dimensional dual-light fusion image for display.

[0109] Optionally, the depth sensor mainly refers to a point cloud sensor, which can be selected from one of the following: a TOF sensor, a laser ranging sensor, and a radar ranging sensor. The visible light and depth data acquisition device can be selected from one of the following: a TOF camera, a structured light / coded light camera, and a stereo vision camera. The TOF sensor, the laser ranging sensor, and the radar ranging sensor can be further divided into a dot matrix sensor and a surface array sensor.

[0110] Optionally, the infrared module 212 is selected from one of the following: a short-wave infrared module, a medium-wave infrared module, and a long-wave infrared module.

[0111] Optionally, the infrared module 212 is selected from one of the following: a refrigeration infrared module and a non-refrigeration infrared module.

[0112] Optionally, the three-dimensional imaging temperature measurement device is a handheld infrared device.

[0113] Optionally, the three-dimensional imaging temperature measurement device further comprises a communication module, and the three-dimensional imaging temperature measurement device is in communication connection with the terminal device through the communication module, so that the reconstructed temperature field data and the three-dimensional image data can be sent to the terminal device for display.

[0114] In another aspect of the embodiments of the present application, referring to FIG. 7, an imaging temperature measurement system is further provided, which comprises an imaging temperature measurement device 20' and a terminal device 30 in communication connection with the imaging temperature measurement device 20'. The imaging temperature measurement device 20' comprises a data acquisition module 21, which is used for acquiring image data, temperature data, and depth data of a target field of view and sending the data to the terminal device 30; the terminal device 30 comprises a memory 31 and a processor 32, the memory 31 stores a computer program, and the computer program is executed by the processor 32 to implement the three-dimensional imaging temperature measurement method of any embodiment of the present application.

[0115] Optionally, the imaging temperature measurement device 20' further comprises a display module 213; the imaging temperature measurement device 20' is further configured to receive the reconstructed temperature field data and the three-dimensional image data returned by the terminal device 30, and display the reconstructed temperature field data on the display module 213 in one of the following display modes: applying the reconstructed temperature field data to the three-dimensional infrared image for display; applying the reconstructed temperature field data to the registered three-dimensional visible light image for display; applying the reconstructed temperature field data to the three-dimensional dual-light fusion image for display.

[0116] It should be noted that under the technical teaching of the three-dimensional imaging temperature measurement method provided in the embodiments of the present application, the skilled in the art can make changes to the technical solution, such as after obtaining the image data, temperature data and depth data of the target field of view, only correcting the temperature data by the depth data to obtain the reconstructed temperature field data corresponding to the image data, and displaying the reconstructed temperature field data on the image data; or, only reconstructing the image data by the depth data to obtain the three-dimensional image data.

[0117] In the step of applying the reconstructed temperature field data to the image data for display, the image data can be two-dimensional or three-dimensional image data, and can be any one or any fusion of multiple fusion image data of infrared image data, visible light image data, and micro-light image data.

[0118] In the step of reconstructing the image data by the depth data to obtain the three-dimensional image data, the image data can be any one or any fusion of multiple fusion image data of infrared image data, visible light image data, and micro-light image data.

[0119] Based on the above possible changes to the technical solution made by the skilled in the art, the imaging temperature measurement device 20 can be an infrared thermal imaging device that only corrects the temperature data by the depth data to obtain the reconstructed temperature field data corresponding to the image data, and displays the reconstructed temperature field data on the image data; or, only reconstructs the image data by the depth data to obtain the three-dimensional image data. The imaging temperature measurement system can also be an imaging temperature measurement system that only corrects the temperature data by the depth data to obtain the reconstructed temperature field data corresponding to the image data, and displays the reconstructed temperature field data on the image data; or, only reconstructs the image data by the depth data to obtain the three-dimensional image data.

[0120] Please refer to FIG. 8 to FIG. 13, the embodiment of the application further provides an infrared thermal imaging device, comprising a main processing unit 83 and a data acquisition unit 81' electrically connected with the main processing unit 83; the data acquisition unit 81' comprises an infrared module 81 and a depth sensor 85. The infrared module 81 is used for acquiring infrared image data and a temperature data set corresponding to the infrared image data; the depth sensor 85 is used for acquiring a corresponding depth data set. The main processing unit 83 corrects the temperature data set by using the depth data set, and displays the corrected temperature data set applied to the image data.

[0121] Among them, the infrared thermal imaging device includes various devices using infrared radiation detection technology, which converts the temperature distribution image of an object into a visible image through signal processing and photoelectric conversion, such as a handheld infrared thermal imager widely used in power temperature measurement, floor heating leakage detection, fault detection, security monitoring, fire prevention and other fields, a mobile phone thermal imager, a thermal imaging camera, a red thermal imaging temperature measurement camera, a dual-spectrum thermal imaging camera, a temperature measurement camera, an explosion-proof infrared thermal imaging temperature measurement instrument, etc. In the embodiment of the application, the infrared thermal imaging device mainly refers to a handheld infrared device applied to industrial detection.

[0122] It can be understood that in the embodiment in which the infrared thermal imaging device acquires image data, temperature data and depth data of a target field of view, simultaneously performs the steps of reconstructing three-dimensional image data from the image data by using the depth data, and correcting the temperature data by using the depth data to obtain reconstructed temperature field data of the image data, and displays the reconstructed temperature field data applied to the image data, the infrared thermal imaging device is the imaging temperature measurement device 20 described in the foregoing embodiments. In these embodiments, the processor of the infrared thermal imaging device can implement the three-dimensional imaging temperature measurement method described in any of the foregoing embodiments of the application by executing a computer program.

[0123] Optionally, the main processing unit 83 further comprises reconstructing three-dimensional image data from the image data by using the depth data set. By performing three-dimensional reconstruction by using the depth data set, the temperature data can be applied to the three-dimensional image data for display, which can achieve more intuitive temperature display and temperature measurement purposes. It should be noted that the implementation process of reconstructing three-dimensional image data from the image data by using the depth data can be realized by selecting known algorithms, which are not limited in the application.

[0124] Optionally, the main processing unit 83 can respectively correct the temperature data set by using the depth data set, and perform three-dimensional reconstruction on the image data, and display the corrected temperature data set applied to the three-dimensional image data obtained by three-dimensional reconstruction.

[0125] In the above embodiments, the infrared thermal imaging device includes the infrared module 81 and the depth sensor 85. When the infrared module 81 is used to collect infrared image data and a temperature data set corresponding to the infrared image data, the depth sensor 85 is used to collect a corresponding depth data set. The depth data includes the shooting distance of all imaging targets in the image. The temperature data corresponding to each imaging target in the synchronously collected infrared image data is corrected by using the depth data set, so that the temperature difference of the target objects in the infrared image data caused by the shooting distance difference can be compensated, thereby improving the accuracy of the temperature data of each target object in the image. In this way, the accuracy of the temperature field data in the image can be improved, and the application requirements of the temperature measurement scene with higher temperature measurement accuracy can be met.

[0126] Referring to FIG. 9, the infrared thermal imaging device includes a visible light module 82 for collecting corresponding visible light image data. In this embodiment, the collection of the depth data set and the visible light image data can be completed synchronously or asynchronously. When the infrared thermal imaging device collects the infrared image data and the corresponding temperature data set and the visible light image data by using the infrared module 81 and the visible light module 82 respectively, the depth data set corresponding to the visible light image data is collected by using the depth sensor 85. This can provide more application forms for the type of the temperature data set applied to the image data for display after correction.

[0127] Referring to FIG. 10, in some embodiments, the infrared thermal imaging device includes a main housing 25, and the infrared module 81 and the visible light module 82 are integrally arranged in the main housing 25. The infrared module 81 can be a known accessory module for collecting infrared images that is suitable for various imaging devices, and the visible light module 82 can be a known accessory module for collecting visible light images that is suitable for various imaging devices. The infrared module 81 and the visible light module 82 are the main components of the data collection unit 81' in the infrared thermal imaging device. By selecting a known standard accessory module, the product maintainability and reliability of the infrared thermal imaging device can be improved. In an optional specific example, the infrared module 81 includes an infrared objective lens 813 arranged at the front of the main housing 25, an infrared detector 812 arranged at the rear of the infrared objective lens 813, and an image processor 815 electrically connected to the infrared detector 812; the visible light module 82 includes a visible light objective lens 822 arranged at the front of the main housing 25 and a visible light detector 821 arranged at the rear of the visible light objective lens 822. The image processor 815 and the visible light detector 821 are usually electrically connected to the processor in the main processing unit 83. The processor processes the electrical signals converted by the visible light detector 821 to form corresponding images, and performs fusion processing on the visible light image and the infrared image according to the requirements of image display, and the like.

[0128] Optionally, the depth sensor 85 can be selected from independent products dedicated to measuring object distance information. Among them, the depth sensor mainly includes a point cloud sensor, which is a sensor that measures a set of point data of the appearance surface of the imaging target, and can be further divided into a heat dissipation type point cloud sensor and a surface array type point cloud sensor. The current mainstream point cloud sensor includes a TOF (Time-of-Flight) sensor, a laser ranging sensor, and a radar ranging sensor. In the present embodiment, the infrared thermal imaging device can be formed by selecting known modular accessories, such as the depth sensor 85, the infrared module 81, and the visible light module 82, and collectively integrating them in the main shell 25 to form the main part of the infrared thermal imaging device, which can simplify the design and assembly of the infrared thermal imaging device.

[0129] Optionally, the infrared thermal imaging device further comprises a display screen 33 arranged on the main shell 25; the display screen 33 is fixedly arranged on the main shell 25; or the display screen 33 is relatively rotatably arranged on the main shell 25. Among them, the infrared thermal imaging device is provided with the display screen 33, and the temperature field after the temperature data is corrected can be directly applied to the currently collected image data for display. The display screen 33 can be arranged to be relatively flipped relative to the main shell 25, and the user can adjust the angle of the display screen 33 as needed to facilitate real-time viewing during image shooting.

[0130] Referring to FIG. 11, in some embodiments, the infrared thermal imaging device comprises a visible light and depth data acquisition device; the visible light and depth data acquisition device is integrally arranged with the infrared module 81, and the visible light and depth data acquisition device mainly comprises a visible light detector 821 and the depth sensor 85. Wherein, the infrared module 81 can comprise a body 816 and an infrared imaging assembly arranged in the body 816, and in an optional specific example, the infrared imaging assembly comprises an infrared objective 813 arranged in front of the body 816, an infrared detector 812 arranged behind the infrared objective 813, and an image processor 815 electrically connected with the infrared detector 812. The visible light and depth data acquisition device and the infrared module 81 are integrally arranged with the infrared module 81. It should be noted that the collection of visible light image data and depth data corresponding to the visible light image data set can optionally use known modular products, and here, the visible light and depth data acquisition device refers to a modular product selected from known products capable of collecting visible light image data, and simultaneously collecting depth data corresponding to each imaging target in the imaging field of view, such as a depth camera 26 capable of measuring the shooting distance of objects in the imaging scene. In this embodiment, the infrared thermal imaging device can form the main part of the infrared thermal imaging device with temperature data correction of the present application by selecting and adding known modular products, such as the visible light and depth data acquisition device, on the basis of the currently known infrared products only having a single infrared image data acquisition function, which can simplify the design and assembly of the infrared thermal imaging device. Wherein, the visible light and depth data acquisition device comprises a display screen 33, and the main processing unit 83 applies the corrected temperature data set to the image data displayed on the display screen 33. Wherein, the infrared thermal imaging device can reuse the display screen 33 of the visible light and depth data acquisition device, and for the existing known infrared products only having a single infrared image data acquisition function and not having a display screen 33, the depth camera 26 comprising the display screen 33 can be selected to upgrade, so as to obtain the infrared thermal imaging device with temperature data correction of the present application.

[0131] In some embodiments, the visible light and depth data acquisition device is selected from one of the following: a TOF camera, a structured light camera, a stereo vision camera. Among them, the TOF (Time of Flight) camera uses the principle of time of flight method to acquire depth data, which means calculating the distance of an object by measuring the time of flight of light, emitting processed light, measuring the time of light reflected back after hitting the object, and calculating the distance using the known speed of light and the wavelength of the modulated light. The structured light camera uses the principle of structured light to acquire depth data, which means using a specific wavelength of invisible laser as a light source to emit a coded light beam onto an object, and calculating the position and depth information of the object by calculating the distortion of the returned coded pattern. The binocular stereo vision camera uses the principle of stereo vision to acquire depth data, which means using the principle of parallax to obtain two images of the measured object from different positions by using imaging equipment, and obtaining three-dimensional information of the object by calculating the positional deviation between the corresponding points of the images. Among them, the visible light and depth data acquisition device is a known modular product, which is convenient to upgrade the existing known infrared product with only single infrared image data acquisition function.

[0132] Please refer to FIG. 12, in some embodiments, the infrared thermal imaging device further comprises a low-light module 87 for acquiring corresponding low-light image data. Low-light refers to the general term of weak light such as moonlight, starlight and atmospheric glow existing at night. Among them, when the infrared thermal imaging device acquires infrared image data and corresponding temperature data set through the infrared module 81, acquires corresponding low-light image data through the low-light module 87, and acquires corresponding depth data set through the depth sensor 85, it can provide more application forms for the type of subsequent corrected temperature data set applied to image data for display.

[0133] Optionally, the infrared module 81 can be selected from one of the following: a short-wave infrared module, a medium-wave infrared module, and a long-wave infrared module. Short-wave, medium-wave, and long-wave respectively refer to a waveband range in the infrared spectrum, and infrared products of different waveband ranges can be adapted to the characteristics of different application fields. The short-wave infrared waveband has the characteristics of short wavelength, such as between 1.4 microns and 3 microns, and higher energy, and is commonly used in fields such as medicine. The medium-wave infrared waveband is usually 3 microns to 8 microns, and is commonly used in fields such as astronomy and military. The long-wave infrared waveband is usually 8 microns to 14 microns, and is commonly used in product fields such as night vision devices, thermal imagers, and security monitoring systems. In this embodiment, the infrared module 81 in the infrared thermal imaging device can select various known infrared imaging modules of any waveband, which can be applied to correct the temperature field in the infrared image by synchronously acquiring depth data sets to improve the accuracy of the temperature data of each imaging target in the image.

[0134] Optionally, the infrared module 81 is selected from one of the following: a refrigeration infrared module, a non-refrigeration infrared module. Among them, the refrigeration infrared module refers to the need for a low-temperature refrigeration device to reduce the temperature of the imaging detector, so that it works at very low temperature, thereby improving the sensitivity, accuracy and detection temperature range. The non-refrigeration infrared module does not need a low-temperature refrigeration device, and the power consumption is relatively high compared with the refrigeration infrared module, and the service life is longer. Usually, the mid-wave infrared module and the long-wave infrared module will select the refrigeration infrared detector containing the low-temperature refrigeration device. In this embodiment, the infrared module 81 in the infrared thermal imaging equipment can select various known refrigeration infrared imaging modules or non-refrigeration infrared imaging modules, which can be applied to correct the temperature field in the infrared image by using the synchronous acquisition of the depth data set, so as to improve the accuracy of the temperature data of each imaging target in the image.

[0135] In some embodiments, the infrared thermal imaging device further comprises a mode selection unit electrically connected to the main processing unit 83; the mode selection unit switches the current display mode according to the mode selection operation; in different display modes, the temperature data set is respectively applied to different image data for display. Different image data can be one of the following: separate infrared image data, separate visible light image data, separate low-light image data, fusion image data of infrared image data and visible light image data, fusion image data of infrared image data and low-light image data, fusion image data of visible light image data, infrared image data and low-light image data. Correspondingly, the display module includes an infrared mode for applying the corrected temperature data set to the infrared image data for display, a visible light mode for applying the corrected temperature data set to the visible light image data for display, a low-light mode for applying the corrected temperature data set to the low-light image data for display, a fusion mode for applying the corrected temperature data set to the dual-light fusion image data of the fusion of the infrared image data and the visible light image data for display, etc. The mode selection unit can be a control panel provided on the outside of the infrared thermal imaging device, and the control panel provides one or more keys for the user to select the current display mode. It can be understood that the mode selection unit can be various forms known to the user for switching the display mode, and the present application does not limit this. In the present application, the infrared thermal imaging device collects image data at the same time, and uses synchronous depth data to correct the temperature data relied on by infrared imaging. The corrected temperature data can more accurately correspond to the temperature values at each temperature measurement point of each imaging target in the image. The temperature values can be applied to the visible light image for display (i.e. visible light mode), applied to the infrared image for display (i.e. infrared mode), applied to the low-light image for display (i.e. low-light mode), or applied to the dual-light fusion image of the fusion of the visible light image and the infrared image for display (i.e. fusion mode). It should be noted that the fusion mode can be further divided into multiple modes to correspond to different combinations of fusion of the visible light image, the infrared image and the low-light image. The user can select the current display mode of the infrared thermal imaging device according to the actual application requirements.

[0136] In some embodiments, the infrared thermal imaging device further comprises a communication module; the main processing unit 83 is in communication connection with the terminal device through the communication module, and the corrected temperature data set is applied to the image data and sent to the terminal device for display. In this embodiment, the infrared thermal imaging device can establish a communication connection with the terminal device, such as a mobile phone terminal, and send the real-time collected image data and temperature data set to the terminal device for display, so that the user can directly view the real-time data on the mobile phone terminal.

[0137] In some embodiments, referring to FIG. 13, the main processing unit 83 is a multi-processor module composed of the central processor 811, the image processor 815 and the digital chip processor 814. The main processing unit 83 adopts a high-performance multi-processor module composed of the central processor 811, the image processor 815 and the digital chip processor 814, can provide computing hardware resource support for the infrared thermal imaging device for processing of the real-time collected image data and correction of the temperature data, and improve the computing efficiency.

[0138] In another aspect of the embodiments of the present application, a computer program product is provided, which includes a computer program. When the computer program is executed by a processor, the three-dimensional imaging temperature measurement method according to any of the embodiments of the present application is implemented.

[0139] In another aspect of the embodiments of the present application, a computer readable storage medium is also provided, which stores a computer program. When the computer program is executed by a processor, the processes of the three-dimensional imaging temperature measurement method embodiments are implemented, and the same technical effects are achieved. To avoid repetition, details are not described herein. The computer readable storage medium includes a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0140] It should be noted that in this document, the term "comprising" or "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or apparatus including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or apparatus. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or apparatus including the element.

[0141] From the above description of the embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be realized by means of software and necessary general hardware platforms, of course, they can also be realized by hardware, but in many cases the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes a plurality of instructions for making a terminal (which can be a mobile phone, computer, server, infrared thermal imager or network device, etc.) execute the methods described in the embodiments of the present application.

[0142] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, and all should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A three-dimensional imaging thermometry method, characterized by, The method comprises: acquiring image data, temperature data and depth data of a target field of view; reconstructing the image data based on the depth data to obtain three-dimensional image data; correcting the temperature data based on the depth data to obtain reconstructed temperature field data of the image data; applying the reconstructed temperature field data to the three-dimensional image data for display.

2. The three-dimensional imaging thermography method of claim 1, wherein, The image data comprises visible light images and infrared images; the reconstructing the image data based on the depth data to obtain three-dimensional image data comprises: reconstructing the visible light images based on the depth data to obtain three-dimensional visible light images; registering and fusing the infrared images with the three-dimensional visible light images to obtain three-dimensional dual-light fusion images.

3. The three-dimensional imaging thermography method of claim 2, wherein, The applying the reconstructed temperature field data to the three-dimensional image data for display comprises: rendering and displaying the three-dimensional dual-light fusion images based on the reconstructed temperature field data.

4. The three-dimensional imaging thermography method of claim 1, wherein, The correcting the temperature data based on the depth data to obtain reconstructed temperature field data of the image data comprises: for a temperature data value of a target point, correcting the temperature data value of the target point based on a depth data value of the target point in the depth data by a temperature correction function to obtain a corrected temperature data value of the target point; obtaining reconstructed temperature field data of the infrared images based on the corrected temperature data values of the target points constituting each target object in the infrared images.

5. An infrared thermal imaging apparatus, characterized by comprising: The device comprises a memory, a processor and a data acquisition module connected to the processor; the data acquisition module is configured to acquire image data, temperature data and depth data of a target field of view; the memory stores a computer program; when the computer program is executed by the processor, the processor is configured to correct the temperature data based on the depth data, and apply the corrected temperature data to the image data for display; and / or reconstruct the image data based on the depth data to obtain three-dimensional image data.

6. The infrared imaging device of claim 5, wherein, The data acquisition module comprises an infrared module and a depth data acquisition module; the infrared module is configured to acquire infrared images and corresponding temperature data of the target field of view; the processor is configured to reconstruct the image data based on the depth data to obtain three-dimensional image data, correct the temperature data based on the depth data to obtain reconstructed temperature field data of the image data, and apply the reconstructed temperature field data to the three-dimensional image data for display; the depth data acquisition module comprises one of the following: the depth data acquisition module comprises a depth sensor configured to acquire corresponding depth data of the target field of view, and apply the reconstructed temperature field data to three-dimensional infrared images for display; The depth data acquisition module comprises a visible light and depth data acquisition device, which is configured to acquire visible light images and corresponding depth data of the target field of view, and the display mode of the reconstructed temperature field data comprises one of the following: applying the reconstructed temperature field data to a three-dimensional infrared image for display; applying the reconstructed temperature field data to a three-dimensional visible light image after registration for display; applying the reconstructed temperature field data to a three-dimensional dual-light fusion image for display. The depth data acquisition module comprises a visible light module and a depth sensor, the depth sensor is configured to acquire depth data corresponding to the infrared image, and the visible light module is configured to acquire visible light images of the target field of view; the display mode of the reconstructed temperature field data comprises one of the following: applying the reconstructed temperature field data to a three-dimensional infrared image for display; applying the reconstructed temperature field data to a three-dimensional visible light image after registration for display; applying the reconstructed temperature field data to a three-dimensional dual-light fusion image for display.

7. The infrared imaging device of claim 6, wherein, The depth sensor is selected from one of the following: a TOF sensor, a laser ranging sensor, and a radar ranging sensor. The visible light and depth data acquisition device is selected from one of the following: a TOF camera, a structured light / coded light camera, and a stereo vision camera.

8. The infrared imaging device of claim 6, wherein, The infrared module is selected from one of the following: a short-wave infrared module, a medium-wave infrared module, and a long-wave infrared module.

9. The infrared imaging device of claim 6, wherein, The infrared module is selected from one of the following: a refrigeration infrared module and a non-refrigeration infrared module.

10. The infrared imaging device of claim 5, wherein, Further comprising a communication module, the infrared thermal imaging device is a three-dimensional imaging temperature measurement device, the three-dimensional imaging temperature measurement device is in communication connection with a terminal device through the communication module, and the reconstructed temperature field data and three-dimensional image data are sent to the terminal device for display.

11. The infrared imaging device of claim 5, wherein, The infrared thermal imaging device is a handheld infrared device.

12. The infrared imaging device of claim 5, wherein, The processor is further configured to switch the current display mode according to a mode selection operation, and in different display modes, the temperature data is applied to different image data for display.

13. The infrared imaging device of claim 12, wherein, The infrared thermal imaging device further comprises a visible light module for acquiring corresponding visible light image data, and the processor reconstructs three-dimensional visible light images from the visible light image data through the depth data; and / or, The infrared thermal imaging device further comprises a low-light module for acquiring corresponding low-light image data, and the processor reconstructs three-dimensional low-light images from the low-light image data through the depth data.

14. An imaging thermometry system, characterized by, The imaging temperature measurement device and a terminal device in communication connection with the imaging temperature measurement device are included. The imaging temperature measurement device comprises a data acquisition module configured to acquire image data, temperature data, and depth data of a target field of view and send them to the terminal device. The terminal device comprises a memory and a processor, the memory has a computer program stored thereon, and the computer program is executed by the processor to correct the temperature data through the depth data and apply the corrected temperature data to image data for display; and / or, reconstruct three-dimensional image data from image data through the depth data.

15. The imaging thermography system of claim 14, wherein, The processor is configured to implement reconstruction of the image data based on the depth data to obtain three-dimensional image data, correct the temperature data based on the depth data to obtain reconstructed temperature field data of the image data, and display the three-dimensional image data to which the reconstructed temperature field data is applied.

16. The imaging thermography system of claim 15, wherein, The image data includes visible light image data and infrared image data. The processor is configured to implement reconstruction of the image data based on the depth data to obtain three-dimensional image data, correct the temperature data based on the depth data to obtain reconstructed temperature field data of the image data, and display the three-dimensional image data to which the reconstructed temperature field data is applied. The processor is configured to implement reconstruction of the image data based on the depth data to obtain three-dimensional image data, correct the temperature data based on the depth data to obtain reconstructed temperature field data of the image data, and display the three-dimensional image data to which the reconstructed temperature field data is applied.

17. The imaging thermography system of claim 15, wherein, The processor is configured to implement reconstruction of the image data based on the depth data to obtain three-dimensional image data, correct the temperature data based on the depth data to obtain reconstructed temperature field data of the image data, and display the three-dimensional image data to which the reconstructed temperature field data is applied.

18. The imaging thermography system of claim 15, wherein, The imaging temperature measurement device further includes a display module. The imaging temperature measurement device is further configured to receive the reconstructed temperature field data and the three-dimensional image data returned by the terminal device, and display the reconstructed temperature field data on the display module in one of the following display modes: display the reconstructed temperature field data on a three-dimensional infrared image; display the reconstructed temperature field data on a registered three-dimensional visible light image; and display the reconstructed temperature field data on a three-dimensional dual-light fusion image.

19. A computer program product comprising a computer program, characterized in that, The computer program is executed by the processor to implement the three-dimensional imaging temperature measurement method of any one of claims 1 to 4.

20. A computer-readable storage medium, characterized in that, The computer program is stored on the computer readable storage medium and is executed by the processor to implement the three-dimensional imaging temperature measurement method of any one of claims 1 to 4.

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