Heat dissipation system and data center

Abstract

Embodiments of the present disclosure provide a heat dissipation system and a data center. An air-cooling branch and a liquid-cooling branch are provided between a primary-side liquid supply pipe and a primary-side liquid return pipe of the heat dissipation system. A cabinet body of a cabinet comprises a plurality of compartments for placing devices to be cooled. Delivery pipes and receiving pipes are in communication with cooling elements within the compartments, and are in communication with a secondary-side circulation loop. An air-cooling unit is coupled to the air-cooling branch. An air outlet side of the air-cooling unit is capable of delivering cold air to the plurality of compartments, and an air return side of the air-cooling unit is capable of receiving heat-exchanged return air from the plurality of compartments. A heat exchanger is coupled to the liquid-cooling branch and the secondary-side circulation loop, so as to enable heat exchange between the liquid-cooling branch and the secondary-side circulation loop.

Description

Heat dissipation system and data center

[0001] The present application claims priority to the Chinese patent application for invention, titled “Heat dissipation system and data center”, application number 202411266312.7, filed on September 10, 2024, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present disclosure generally relate to the field of cabinet heat dissipation, and in particular, to a heat dissipation system and a data center. BACKGROUND

[0003] With the development of high-power servers, high-power density also brings greater heat dissipation problems, and traditional air cooling technology gradually reveals limitations. Although closed cold and hot air ducts can improve air cooling efficiency, they are high in cost, long in heat dissipation path, and limited in heat dissipation efficiency. In some conventional server cabinets, liquid cooling combined with a cold distribution unit (CDU) can be used to dissipate heat from the equipment to be cooled, but this method still has problems of heat dissipation and energy efficiency. SUMMARY

[0004] In a first aspect of the present disclosure, a heat dissipation system is provided. The heat dissipation system comprises: an outdoor heat exchange unit; a primary side liquid supply pipe and a primary side liquid return pipe, which are in communication with the outdoor heat exchange unit, and a wind cooling branch and a liquid cooling branch are arranged between the primary side liquid supply pipe and the primary side liquid return pipe; a cabinet, comprising: a cabinet body comprising a plurality of layers for placing equipment to be cooled; a secondary side circulation loop; and a plurality of delivery pipes and a plurality of receiving pipes corresponding to the plurality of layers, respectively, and in communication with the secondary side circulation loop, the delivery pipes being adapted to deliver cooling medium in the secondary side circulation loop to cooling elements in the corresponding layers, and the receiving pipes being adapted to deliver cooling medium after heat exchange in the corresponding cooling elements to the secondary side circulation loop; and an air cooling unit coupled to the wind cooling branch and comprising an air outlet side and an air return side, the air outlet side being capable of delivering cold air to the plurality of layers, and the air return side being capable of receiving air after heat exchange in the plurality of layers; and a heat exchanger coupled to the liquid cooling branch and the secondary side circulation loop to exchange heat between the liquid cooling branch and the secondary side circulation loop.

[0005] In a second aspect of the present disclosure, a data center is provided. The data center comprises: a machine room; and the heat dissipation system of the first aspect of the present disclosure, the outdoor heat exchange unit of the heat dissipation system being arranged outside the machine room, and the cabinet of the heat dissipation system being arranged inside the machine room.

[0006] It should be understood that the content described in this part is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become apparent through the following description. BRIEF DESCRIPTION OF DRAWINGS

[0007] The above and other features, advantages, and aspects of embodiments of the present disclosure will become more apparent by describing in detail preferred embodiments thereof with reference to the accompanying drawings. In the drawings:

[0008] FIG. 1 shows a schematic diagram of a heat dissipation system according to a first embodiment of the present disclosure;

[0009] FIG. 2 shows a schematic diagram of a cabinet of a heat dissipation system according to a second embodiment of the present disclosure;

[0010] FIG. 3 shows a schematic diagram of a cabinet of a heat dissipation system according to a third embodiment of the present disclosure;

[0011] FIG. 4 shows a schematic diagram of a cabinet of a heat dissipation system according to a fourth embodiment of the present disclosure along a horizontal direction;

[0012] FIG. 5 shows a schematic diagram of a heat dissipation system according to a fifth embodiment of the present disclosure;

[0013] FIG. 6 shows a schematic diagram of a heat dissipation system according to a sixth embodiment of the present disclosure; and

[0014] FIG. 7 shows a schematic diagram of a data center according to the present disclosure.

[0015] Reference Signs: 100, heat dissipation system; 10, outdoor heat exchange unit; 20, primary side liquid supply pipe; 21, primary side liquid return pipe; 23, air cooling branch; 24, liquid cooling branch; 25, bypass branch; 26, first valve; 27, second valve; 28, flow divider; 30, cabinet; 31, cabinet body; 310, partition layer; 32, secondary side circulation loop; 321, delivery pipe; 322, receiving pipe; 33, cooling element; 34, front side air duct; 35, rear side air duct; 36, inlet and outlet air duct; 37, circulation pump; 38, compressor; 39, throttle valve; 40, air cooling unit; 41, fan module; 42, surface cooler; 50, heat exchanger; 60, heat dissipation cabin; 200, machine room. DETAILED DESCRIPTION

[0016] Preferred embodiments of the present disclosure will be described herein below with reference to the accompanying drawings. Although preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0017] As used herein, the term "includes" and its variants are intended to be open-ended, meaning that there is no limitation as to what the term covers. The term "or" is used in the inclusive sense, meaning that it is used to link items together, such that only one item need be present to satisfy the condition. The term "based on" means "based, at least in part, on." The terms "one example embodiment" and "an example embodiment" mean "at least one example embodiment." The term "another embodiment" means "at least one additional embodiment." The terms "a first," "a second," etc. can refer to different or the same objects.

[0018] As described above, in some conventional server cabinets, liquid cooling combined with cold distribution units (CDUs) can be used to cool the devices to be cooled, but this still has problems of heat dissipation and energy efficiency.

[0019] Embodiments of the present disclosure provide a heat dissipation system and a data center comprising the same. The heat dissipation system comprises an outdoor heat exchange unit, a cabinet, an air cooling unit, a heat exchanger, a primary side liquid supply pipe and a primary side liquid return pipe. An air cooling branch and a liquid cooling branch are arranged between the primary side liquid supply pipe and the primary side liquid return pipe. The air cooling branch can provide cold air to multiple layers in the cabinet. The liquid cooling branch can exchange heat with the devices to be cooled in the layers through cooling elements. The combination of air cooling and liquid cooling not only meets the heat dissipation requirement, but also improves the heat exchange efficiency. Meanwhile, the heat of the air cooling branch and the liquid cooling branch can be discharged to the outdoor through the outdoor heat exchange unit, which does not affect the indoor temperature.

[0020] The principles of the present disclosure will be described in detail below with reference to FIGS. 1-6, wherein FIG. 1 shows the structure of a heat dissipation system 100 of a first embodiment of the present disclosure, FIG. 2 shows the structure of a heat dissipation system 100 of a second embodiment of the present disclosure, FIG. 3 shows the structure of a heat dissipation system 100 of a third embodiment of the present disclosure, FIG. 4 shows the structure of a heat dissipation system 100 of a fourth embodiment of the present disclosure, FIG. 5 shows the structure of a heat dissipation system 100 of a fifth embodiment of the present disclosure, and FIG. 6 shows the structure of a heat dissipation system 100 of a sixth embodiment of the present disclosure. The principles of the heat dissipation system 100 of the first embodiment of the present disclosure will be described in detail with reference to FIG. 1.

[0021] As shown in FIG. 1, the heat dissipation system 100 comprises an outdoor heat exchange unit 10, a cabinet 30, an air cooling unit 40, a heat exchanger 50, a primary side liquid supply pipe 20 and a primary side liquid return pipe 21.

[0022] The outdoor heat exchange unit 10 can release the heat of the cooling medium in the primary side liquid return pipe 21 to the external environment, and can adjust the temperature in the physical space (for example, a machine room), thereby providing a comfortable working environment.

[0023] As an example, as shown in FIG. 1, the outdoor heat exchange unit 10 can be a cooling tower, which can use water evaporation to lower the temperature of the cooling medium. Hot water from the machine room is pumped to the top of the cooling tower. The hot water is evenly distributed over the fill by nozzles, which form fine droplets to increase the surface area of the water exposed to the air. Air passes over the fill and comes into contact with the water droplets. A naturally-drafted cooling tower relies on wind, while a mechanically-drafted cooling tower uses a fan to force air flow. As some of the water evaporates, it carries away a large amount of heat, which cools the remaining water. The cooled water flows into a collection basin at the bottom and is pumped back to the cooling system in the machine room for reuse.

[0024] It should be understood that the outdoor heat exchange unit 10 can be any structure that can exchange heat with the cooling medium, which can be selected according to specific requirements, space limitations, and efficiency requirements, and the present disclosure is not intended to be limited in this regard.

[0025] The primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21 are in communication with the outdoor heat exchange unit 10. The primary-side liquid supply pipe 20 is used to transport the cooled cooling medium from the outdoor heat exchange unit 10 to the heat exchange unit in the room, so that heat exchange is performed at the heat exchange unit. The primary-side liquid return pipe 21 is used to transport the high-temperature cooling medium after heat exchange to the outdoor heat exchange unit 10, so that heat exchange is performed at the outdoor heat exchange unit 10.

[0026] As shown in FIG. 1, the heat dissipation system 100 further includes two flow dividers 28, which are respectively installed on the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21, and the air-cooled branch 23 and the liquid-cooled branch 24 are arranged between the two flow dividers 28. In this way, the cooling medium between the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21 can be divided into two paths, respectively flow in the air-cooled branch 23 and the liquid-cooled branch 24, and heat exchange can be performed at the air-cooled branch 23 and the liquid-cooled branch 24.

[0027] As an example, a pipe connection, such as a "T" type connection or an "L" type connection, can be arranged on the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21, so that the air-cooled branch 23 and the liquid-cooled branch 24 are arranged between the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21 through the pipe connection.

[0028] As another example, the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21 are both two paths, one of which is in communication with the air-cooled branch 23, and the other of which is in communication with the liquid-cooled branch 24. In other embodiments, a refrigerator can also be arranged in the branch to adjust the temperature of the cooling medium in the air-cooled branch 23 and the liquid-cooled branch 24.

[0029] In some embodiments, the number of air cooling branches 23 and liquid cooling branches 24 can each be one. In other embodiments, the number of air cooling branches 23 and liquid cooling branches 24 can be set as needed, and the present disclosure is not intended to be limited in this regard.

[0030] As shown in FIG. 1, the cabinet 30 is widely used in data centers, telecommunication facilities, and other high-density electronic device applications. It not only provides physical protection for sensitive equipment, but also contains thermal management components to ensure that the equipment to be cooled operates at an optimal temperature. In embodiments of the present disclosure, the cabinet 30 includes a cabinet body 31, a secondary side circulation loop 32, a plurality of delivery pipes 321, and a plurality of receiving pipes 322.

[0031] The cabinet body 31 is the core area of the cabinet 30. The cabinet body 31 is internally provided with a plurality of partitions 310, and the partitions 310 can be used to place equipment to be cooled, such as servers, storage units, network devices, etc. The shape and size of the partitions 310 are set considering the size of the equipment to be cooled, the heat dissipation requirement, and the wiring convenience, etc. At the same time, the equipment to be cooled arranged in the partitions 310 will generate heat when working, and therefore a cooling element 33 can be integrated in each piece of equipment to be cooled.

[0032] As an example, a plurality of partitions are arranged in the cabinet body 31. The plurality of partitions have a preset distance therebetween, thereby separating a plurality of partitions 310 in the cabinet body 310 by the plurality of partitions. In use, the IT equipment such as servers is placed on the partitions to support the position of the electronic equipment.

[0033] As another example, a plurality of guide rails are arranged on the inner walls of both sides of the cabinet body 31, and the plurality of guide rails on both sides are correspondingly arranged. A sliding seat that can cooperate with the guide rails is arranged on the shell of the electronic equipment. The electronic equipment can be installed in or pulled out of the cabinet body 31 by pulling. In this way, the cabinet body 31 can be separated into a plurality of partitions 310 by adjusting the arrangement position and arrangement spacing of the plurality of guide rails.

[0034] As shown in FIG. 1, the cabinet 30 is provided with a plurality of delivery pipes 321 and a plurality of receiving pipes 322, which are respectively in communication with the secondary side circulation loop 32. Each partition 310 corresponds to at least one delivery pipe 321 and at least one receiving pipe 322. The delivery pipe 321 is used to deliver the cooling medium in the secondary side circulation loop 32 to the cooling element 33 in the corresponding partition 310. The receiving pipe 322 is used to deliver the cooling medium after heat exchange in the corresponding cooling element 33 to the secondary side circulation loop 32.

[0035] As an example, the delivery pipe 321 and the receiving pipe 322 each include a quick connector. A quick connector is connected to a quick connector interface provided on each cooling element 33 of the equipment to be cooled, thereby achieving the connection between the delivery pipe 321 and the receiving pipe 322 and the cooling element 33.

[0036] With this arrangement, the heat generated by the equipment to be cooled when in operation is transferred to the cooling medium in the cooling element 33. The secondary-side circulation loop 32 is a closed liquid circuit that can deliver the cooling medium after heat exchange in the plurality of cooling elements 33 to the heat exchanger 50 and deliver the cooled cooling medium to the plurality of cooling elements 33 again.

[0037] As an example, as shown in FIG. 1, the cooling element 33 can be a cold plate. The cold plate can protect the equipment to be cooled in the partition 310 from overheating damage and has a high cooling efficiency.

[0038] As shown in FIG. 1, the heat exchanger 50 is coupled to the liquid cooling branch 24 and the secondary-side circulation loop 32, and the liquid cooling branch 24 can exchange heat with the secondary-side circulation loop 32 through the heat exchanger 50. In this way, the heat generated by the equipment to be cooled when in operation can be transferred to the cooling medium in the secondary-side circulation loop 32 through the cold plate, and the heat in the secondary-side circulation loop 32 can be transferred to the liquid cooling branch 24 through the heat exchanger 50. When the outdoor heat exchanger unit 10 is running, the heat in the liquid cooling branch 24 can be released to the outdoor environment with the cooling medium.

[0039] As shown in FIG. 1, the heat dissipation system 100 further includes an air cooling unit 40. The air cooling unit 40 is coupled to the air cooling branch 23. The air cooling unit 40 includes an air outlet side and an air inlet side, and the air outlet side of the air cooling unit 40 can deliver cold air to the plurality of partitions 310, and the air return side of the air cooling unit 40 can receive air after heat exchange in the plurality of partitions 310.

[0040] As an example, as shown in FIG. 1, the air cooling unit 40 includes a fan module 41 and a surface cooler 42. The shell of the surface cooler 42 can be made of a corrosion-resistant material such as stainless steel or carbon steel to protect the internal components. There are inlet and outlet connecting pipes on the shell of the surface cooler 42 for connection to the air cooling branch 23. The surface cooler 42 has a tube bundle composed of a plurality of parallel copper or steel tubes. After the cooling medium in the air cooling branch 23 flows into the tube bundle, the cooling medium in contact with the tube wall is cooled. The outer surface of the tube bundle can be provided with fins to increase the heat exchange area of the tube bundle and thus improve the heat exchange efficiency. The fan module 41 is provided on one side of the surface cooler 42 and can drive air to flow through the surface cooler 42, thereby accelerating the heat exchange between the air and the cooling medium in the tube bundle.

[0041] With this arrangement, the air cooling branch 23 between the primary side liquid supply pipe 20 and the primary side liquid return pipe 21 can provide cold air to multiple floors 310 of the cabinet 30, and the liquid cooling branch 24 can exchange heat with the devices to be cooled through the secondary side circulation loop 32 and the cooling element 33. The air cooling unit 40 can be used to cool low-power-density electronic components, such as small servers, network devices, etc., and the fan module 41 drives cold air to flow through the low-power devices to carry away the heat generated by the low-power devices. The liquid cooling branch 24 can be used to cool high-power-density electronic components, such as high-performance computing nodes, graphics processing units (GPUs), large storage arrays, etc.

[0042] In this way, air cooling and liquid cooling can be combined in the cabinet 30, with air cooling used to handle lower-power electronic components and liquid cooling used to cool high-power electronic components, thereby ensuring that cooling needs are met while minimizing energy consumption as much as possible. At the same time, the heat from both the air cooling branch 23 and the liquid cooling branch 24 can be discharged to the outside of the machine room by the outdoor heat exchange unit 10, without affecting the ambient temperature in the machine room.

[0043] In some embodiments, as shown in FIG. 1, multiple air ducts can be provided in the cabinet 30, which are used to deliver cold air to the multiple floors 310 and receive hot air after heat exchange in the multiple floors 310.

[0044] As shown in FIG. 1, the cabinet 30 is provided with a front side air duct 34, a rear side air duct 35, and an in-out air duct 36. The front side air duct 34 is located on one side of the interior of the cabinet 30 close to the front door, and is used to deliver cold air to the devices to be cooled in the interior of the cabinet 30. The front side air duct 34 is in communication with the multiple floors 310, so that the cold air can directly reach the devices to be cooled in each floor 310, thereby improving cooling efficiency. The rear side air duct 35 is located on one side of the interior of the cabinet 30 close to the rear door, and is used to receive hot air discharged from the multiple floors 310. The rear side air duct 35 is also in communication with each floor 310, so as to ensure that the hot air flows from around the devices to be cooled to the air cooling unit 40.

[0045] As shown in FIG. 1, the in-out air duct 36 is in communication with the front side air duct 34 and the rear side air duct 35, and can guide cold air into the multiple floors 310 and extract hot air from the multiple floors 310. The in-out air duct 36 can ensure that the cold air and the hot air are isolated, thereby avoiding air flow short circuit and improving cooling efficiency. The air cooling unit 40 is arranged in the in-out air duct 36, and can deliver cold air to the multiple floors 310 through the front side air duct 34 and receive hot air after heat exchange in the multiple floors 310 through the rear side air duct 35.

[0046] With this arrangement, the hot air in the multiple compartments 310 is cooled by the air cooling unit 40, and then is sent into the front air duct 34 through the inlet / outlet air duct 36, and is then distributed to each compartment 310 from the front air duct 34 to cool the equipment. The hot air generated by the equipment during operation is collected by the rear air duct 35, and is finally returned to the air cooling unit 40 through the inlet / outlet air duct 36. The hot air exchanges heat with the surface cooler 42 of the air cooling unit 40, and is ready for the next cycle.

[0047] In some embodiments, as shown in FIG. 1, the inlet / outlet air duct 36 can be arranged at the top of the cabinet 31. In this way, the hot air generated by the equipment to be cooled during operation flows upward into the inlet / outlet air duct 36 through the rear air duct 35, and exchanges heat with the surface cooler 42 of the air cooling unit 40 to be cooled. The cold air flows downward along the front air duct 34 and is distributed into the multiple compartments 310.

[0048] It should be understood that in other embodiments, the inlet / outlet air duct 36 can also be arranged at the bottom of the cabinet 31 or any other appropriate position.

[0049] In some embodiments, as shown in FIG. 1, the heat exchanger 50 can be arranged in the inlet / outlet air duct 36. In this way, the use of space in the cabinet 30 can be optimized, and the installation cost of the equipment can also be reduced.

[0050] In some embodiments, a flow valve can be arranged on the air cooling branch 23. During operation of the heat dissipation system 100, if the heat generated by the low-power devices and the heat generated by the high-power devices changes, the flow ratio of the cooling medium in the air cooling branch 23 and the liquid cooling branch 24 can also be adjusted by adjusting the opening of the flow valve, so as to meet the cooling requirements of the equipment to be cooled in the cabinet 30 under different conditions.

[0051] In some alternative embodiments, a flow valve can also be arranged on the liquid cooling branch 24 to adjust the flow of the cooling liquid in the liquid cooling branch 24.

[0052] In other embodiments, the flow resistance ratio of the air cooling branch 23 and the liquid cooling branch 24 is a preset value, so as to adjust the flow ratio of the cooling medium in the air cooling branch 23 and the liquid cooling branch 24. It should be understood that the flow distribution in the air cooling branch 23 and the liquid cooling branch 24 can also be achieved by other means, and the present disclosure is not intended to be limited in this regard.

[0053] In some embodiments, as shown in FIG. 1, the cooling element 33 of the heat dissipation system 100 can include a cold plate, and the heat exchanger 50 can include a plate heat exchanger. The secondary side circulation loop 32 can be filled with a single-phase cooling medium, such as deionized water, PG / EG water solution, etc.

[0054] As shown in FIG. 1, the heat dissipation system 100 further comprises a circulating pump 37. The circulating pump 37 is coupled to the secondary circulation loop, and can drive the flow of the single-phase cooling medium in the secondary-side circulation loop 32. With this arrangement, the liquid cooling branch 24 exchanges heat with the secondary-side circulation loop 32 through the plate heat exchanger. Under the driving of the circulating pump 37, the heat generated by the equipment to be cooled during operation can be transferred to the single-phase cooling medium in the secondary-side circulation loop 32 through the cold plate, and the heat of the cooling medium in the secondary-side circulation loop 32 can be transferred to the liquid cooling branch 24 through the plate heat exchanger.

[0055] The principle of the heat dissipation system 100 of the second embodiment of the present disclosure will be described in detail below in conjunction with FIG. 2. The structure of the heat dissipation system 100 of the second embodiment is similar to that of the first embodiment described in conjunction with FIG. 1 in some aspects. In the following, the differences between them will be mainly described, and the same parts will not be described again.

[0056] As shown in FIG. 2, the inlet and outlet air duct 36 can be arranged in the middle of the cabinet body 31. With this arrangement, independent circulating air paths can be formed on the upper and lower sides of the inlet and outlet air duct 36, which helps to evenly distribute the cold air within the height range of the cabinet 30, and can ensure that the equipment to be cooled located in the upper and lower parts of the inlet and outlet air duct 36 obtains consistent cooling effect, avoiding local overheating. Secondly, this arrangement can improve the air flow organization inside the cabinet 30, reducing the mixing of cold and hot air, thereby improving the heat exchange efficiency. The upper and lower equipment can independently receive cold air from the front side, while the rear side is used for discharging hot air, reliably separating the cold and hot air. Furthermore, when the inlet and outlet air duct 36 is arranged in the middle of the cabinet body 31, it can provide greater flexibility for the arrangement of the equipment. For example, it allows electronic devices with different power densities to be installed at different heights of the cabinet body 31 without affecting the overall thermal management.

[0057] In some embodiments, as shown in FIG. 2, the length of the inlet and outlet air duct 36 is less than half of the height of the cabinet body 31. With this arrangement, the cold air can flow along the predetermined path, directly cooling the electronic devices, and then being discharged back to the rear air duct 35, reducing the possibility of turbulence and air short circuit. Secondly, the shortening of the length of the inlet and outlet air duct 36 can reduce the frictional resistance in the air flow, and the fan module 41 can push the air flow at a lower pressure, thereby reducing energy consumption while maintaining sufficient air flow velocity to ensure effective heat exchange.

[0058] The principle of the heat dissipation system 100 of the third embodiment of the present disclosure will be described in detail below in conjunction with FIG. 3. The structure of the heat dissipation system 100 of the third embodiment is similar to that of the first embodiment described in conjunction with FIG. 1 in some aspects. In the following, the differences between them will be mainly described, and the same parts will not be described again.

[0059] As shown in FIG. 3, the heat dissipation system 100 further comprises a first valve 26, a second valve 27 and a bypass branch 25. The first valve 26 is coupled to the air cooling branch 23 between the air cooling unit 40 and the primary side return liquid pipe 21. The first valve 26 can control the on-off of the air cooling branch 23. One end of the bypass branch 25 is in communication with the air cooling branch 23 between the air cooling unit 40 and the first valve 26. The other end of the bypass branch 25 is in communication with the liquid cooling branch 24 between the heat exchanger 50 and the primary side supply liquid pipe 20. The second valve 27 is coupled to the bypass branch 25. The second valve 27 can control the on-off of the bypass branch 25.

[0060] When the first valve 26 is open and the second valve 27 is closed, the air cooling branch 23 and the liquid cooling branch 24 are arranged in parallel between the primary side return liquid pipe 21 and the primary side supply liquid pipe 20. The cooled medium in the air cooling branch 23 after heat exchange directly flows to the primary side return liquid pipe 21 and then flows to the outdoor heat exchange unit 10 for cooling.

[0061] When the first valve 26 is closed and the second valve 27 is open, the cooled medium in the air cooling branch 23 after heat exchange flows into the liquid cooling branch 24.

[0062] With this arrangement, the air cooling and the liquid cooling are not operated independently. Under the control of the first valve 26 and the second valve 27, the two can work cooperatively. When the second valve 27 is open, the cooled medium in the air cooling branch 23 after heat exchange can flow into the liquid cooling branch 24. The liquid cooling branch 24 is in direct contact with the high-power device and can more effectively take away heat. When the cooled medium in the air cooling branch 23 is introduced into the liquid cooling branch 24 after heat exchange, this part of the cooled medium undergoes two heat exchange processes in one cycle. The first is in the air cooling stage, and the second is in the liquid cooling stage. In this way, more heat can be absorbed from the high-power device, thereby improving the heat exchange efficiency of the entire system. Secondly, the burden of the liquid cooling branch 24 directly dealing with high-temperature cooled medium is reduced, and the utilization efficiency of the cooling resource is improved.

[0063] The principle of the heat dissipation system 100 of the fourth embodiment of the present disclosure will be described in detail below in conjunction with FIG. 4. The structure of the heat dissipation system 100 of the fourth embodiment is similar to part of the structure of the first embodiment described in conjunction with FIG. 1. In the following, the differences between them will be mainly described, and the same parts will not be described again.

[0064] As shown in FIG. 4, the heat exchanger 50 of the heat dissipation system 100 is arranged outside the cabinet 30. In this way, the space inside the cabinet body 31 can be released, so as to provide installation positions for more devices to be cooled, and the device density of the server cabinet 30 is improved. In addition, the heat exchanger 50 is arranged outside the cabinet body 31, so as to be conveniently connected with the outdoor heat exchange unit 10 (for example, a cooling tower), and the installation and maintenance efficiency is improved.

[0065] In some embodiments, as shown in FIG. 4, the cabinet 30 further comprises a heat dissipation cabin 60. The heat dissipation cabin 60 is arranged at one side of the cabinet body 31, and an air inlet and outlet passage 36 is arranged in the heat dissipation cabin 60. The air inlet and outlet passage 36 is in communication with the front side air passage 34 and the rear side air passage 35, and heat exchange can be performed through air flow.

[0066] As shown in FIG. 4, the heat dissipation cabin 60 can be arranged at the left side or the right side of the cabinet body 31. The space inside the heat dissipation cabin 60 can form the air inlet and outlet passage 36. The air inlet and outlet passage 36 is in communication with the front side air passage 34 and the rear side air passage 35, and can guide cold air into the multiple compartments 310 and extract hot air from the multiple compartments 310. The air inlet and outlet passage 36 can ensure that the cold air and the hot air are isolated, so as to avoid air flow short circuit, and the cooling efficiency is improved. The air-cooled unit 40 is arranged in the air inlet and outlet passage 36, and can deliver cold air to the multiple compartments 310 through the front side air passage 34 and receive return air in the multiple compartments 310 after heat exchange through the rear side air passage 35.

[0067] With this arrangement, no additional space needs to be reserved inside the cabinet body 31 to install the air-cooled unit 40 and the heat exchanger 50, and the space inside the cabinet body 31 can be fully utilized. When the air-cooled unit 40 or the heat exchanger 50 needs to be repaired or replaced, the heat dissipation cabin 60 can be opened, and other devices inside the cabinet 30 will not be disturbed. In addition, the air-cooled unit 40 and the heat exchanger 50 can be flexibly arranged in the heat dissipation cabin 60, and the air flow path of the heat dissipation system 100 can be optimized.

[0068] The principle of the heat dissipation system 100 of the fifth embodiment of the present disclosure will be described in detail below with reference to FIG. 5. The structure of the heat dissipation system 100 of the fifth embodiment is similar to that of the first embodiment described with reference to FIG. 1 in some aspects. In the following, the differences between them will be mainly described, and the same parts will not be described again.

[0069] As shown in FIG. 5, the secondary side circulation loop 32 in the cabinet 30 adopts phase change of a two-phase cooling medium to perform heat exchange. The multiple cooling elements 33 arranged in the cabinet 30 can be evaporators, and the heat exchanger 50 can comprise a condenser. The secondary side circulation loop 32 is filled with a two-phase cooling medium, for example, R-134a.

[0070] As shown in FIG. 5, the heat dissipation system 100 further includes a compressor 38 coupled to the secondary side circulation loop 32 between the evaporator and the condenser, and a throttling valve 39 coupled to the secondary side circulation loop 32 between the condenser and the evaporator.

[0071] The evaporator is installed in the compartment 310 of the cabinet 30 and can absorb heat generated by high-power devices of the IT equipment. When the two-phase cooling medium (e.g., R-134a) flows through the evaporator, it changes from liquid to gas and absorbs heat in the process, so that the cooling medium becomes high-temperature and low-pressure steam. The condenser is located in the cabinet 30 and is used to cool the high-temperature steam flowing out of the evaporator and convert it back to liquid. In this process, the cooling medium releases the heat absorbed before, which is transferred to the outdoor heat exchanger 10 through the liquid cooling branch 24 and then released to the external environment. The compressor 38 is located in the secondary side circulation loop 32 and can increase the pressure and temperature of the cooling medium, so that it changes from high-temperature and low-pressure steam to high-temperature and high-pressure steam, and then enters the condenser. The compressor 38 is the power source of the entire refrigeration cycle. The throttling valve 39 is located on the pipeline between the condenser and the evaporator, and the throttling valve 39 can reduce the pressure of the cooling medium, so that the cooling medium becomes low-temperature and low-pressure before entering the evaporator. When the cooling medium flows through the evaporator again, it can absorb more heat.

[0072] With this arrangement, inside the cabinet 30, the cooling medium (in a low-temperature and low-pressure state) flowing through the evaporator can absorb heat generated by the server and change into high-temperature and low-pressure steam. The high-temperature and low-pressure steam is compressed by the compressor 38 into high-temperature and high-pressure gas. The high-temperature and high-pressure gas flows through the condenser, releases heat to the liquid cooling branch 24, and cools to become low-temperature and high-pressure liquid. The low-temperature and high-pressure liquid passes through the throttling valve 39, the pressure is reduced, and it becomes low-temperature and low-pressure liquid, and enters the evaporator again to circulate. In this way, the heat dissipation system 100 can continuously provide cooling for the server and ensure its stable operation.

[0073] The principle of the heat dissipation system 100 of the sixth embodiment of the present disclosure will be described in detail below in conjunction with FIG. 6. The structure of the heat dissipation system 100 of the sixth embodiment is similar to part of the structure of the fifth embodiment described in conjunction with FIG. 5. In the following, the differences between them will be mainly described, and the same parts will not be described again.

[0074] As shown in FIG. 6, the secondary side circulation loop 32 in the cabinet 30 uses the phase change of the two-phase cooling medium to perform heat exchange. The plurality of cooling elements 33 provided in the cabinet 30 can be evaporators, and the heat exchanger 50 can include a condenser.

[0075] As shown in FIG. 6, the two-phase cooling medium does not need to be driven by a compressor 38 and the pressure is adjusted by a throttle valve 39 during circulation. A delivery pipe 321 and a receiving pipe 322 are provided between each evaporator and the secondary loop, and the receiving pipe 322 is connected to the evaporator at a position higher than the position at which the delivery pipe 321 is connected to the evaporator, and the condenser is positioned higher than the plurality of evaporators.

[0076] The delivery pipe 321 is used to deliver the condensed cooling medium (liquid state) to the evaporator. The delivery pipe 321 is connected to the evaporator at a lower position, ensuring that the liquid cooling medium can flow smoothly into the evaporator. The receiving pipe 322 is used to deliver the steam (gaseous state) generated in the evaporator to the condenser. The receiving pipe 322 is connected to the evaporator at a higher position, and the steam can naturally rise and enter the condenser through the receiving pipe 322. The condenser is positioned higher than the plurality of evaporators, and the steam can naturally flow from the evaporator to the condenser. In this way, the natural rising tendency of the steam and the natural falling tendency of the liquid cooling medium can be utilized, so that no additional power device is needed to push the cooling medium to flow.

[0077] In the evaporator inside the partition 310, the cooling medium absorbs the heat generated by the high-power devices of the IT equipment, causing the cooling medium to evaporate into steam. In this process, the density of the cooling medium decreases. Because the density of the steam is less than that of the liquid, the steam naturally rises, while the liquid falls due to gravity. The steam rises along the pipeline to the condenser and releases heat to the liquid cooling branch 24 at the condenser, and the steam becomes liquid at the condenser. The condenser is usually placed at a higher position so that the steam can naturally rise.

[0078] With this arrangement, the secondary loop 32 can constitute a self-driven liquid return heat exchange system. The self-driven liquid return heat exchange system utilizes the phase change characteristics of the cooling medium to transfer heat, not only having good heat dissipation effect, but also not needing external pumping devices. There are no moving parts inside the heat exchange system, reducing the possibility of mechanical failure, while reducing energy consumption and operating noise. In addition, the self-driven liquid return heat exchange system has a compact structure, which helps to save space in the cabinet 30, thereby helping to improve the equipment arrangement density in the server.

[0079] In some embodiments, the self-driven liquid return heat exchange system can be a loop thermosyphon system. In other embodiments, the self-driven liquid return heat exchange system can be a loop heat pipe system. It should be understood that the self-driven liquid return heat exchange system can also be any other implementation, and the present disclosure is not intended to be limited in this regard.

[0080] In a second aspect of the disclosure, a data center is provided. As shown in FIG. 7, the data center includes a machine room 200 and any one of the heat dissipation systems 100 as described above, wherein the outdoor heat exchange unit 10 of the heat dissipation system 100 is disposed outside the machine room, and the cabinet 30 of the heat dissipation system 100 is disposed inside the machine room 200.

[0081] In the data center, the air cooling branch 23 between the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21 of the heat dissipation system 100 can provide cold air to multiple floors 310 of the cabinet 30, and the liquid cooling branch 24 can exchange heat with the equipment to be cooled through the secondary-side circulation loop 32 and the cooling element 33. The air cooling unit 40 can be used to cool low-to-medium power density electronic components, such as small servers, network devices, etc., and the fan module 41 drives cold air to flow through the equipment to remove the heat generated by the equipment. The liquid cooling branch 24 can be used to cool high power density devices, such as high-performance computing nodes, graphics processing units (GPUs), large storage arrays, etc., and the liquid cooling branch 24 can meet the heat dissipation requirements of these electronic devices.

[0082] With this arrangement, air cooling and liquid cooling can be combined in the cabinet 30, air cooling is used to handle lower power devices, and liquid cooling is used to cool high power devices, ensuring that the cooling requirements are met while minimizing energy consumption as much as possible. At the same time, the heat of the air cooling branch 23 and the liquid cooling branch 24 can be discharged to the outside of the machine room through the outdoor heat exchange unit 10, without affecting the indoor ambient temperature.

[0083] In some embodiments, as shown in FIG. 7, the number of outdoor heat exchange units 10 can be configured according to the total heat generating power of the cabinets 30 in the data center. For example, multiple outdoor heat exchange units 10 are connected to multiple cabinets 30 through the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21. Here, the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21 serve as a total ring network pipe, and the heat dissipation system 100 can meet the heat dissipation requirements of a large number of cabinets 30 in the data center.

[0084] Embodiments of the disclosure are also embodied in the following examples.

[0085] Example 1. A heat dissipation system, comprising:

[0086] an outdoor heat exchange unit;

[0087] a primary-side liquid supply pipe and a primary-side liquid return pipe in communication with the outdoor heat exchange unit, and an air cooling branch and a liquid cooling branch disposed between the primary-side liquid supply pipe and the primary-side liquid return pipe;

[0088] a cabinet, comprising:

[0089] a cabinet body including multiple floors for placing equipment to be cooled;

[0090] a secondary side circulation loop; and

[0091] a plurality of delivery pipes and a plurality of receiving pipes, respectively corresponding to the plurality of layers and respectively communicating with the secondary side circulation loop, the delivery pipes being adapted to deliver the cooling medium in the secondary side circulation loop to the cooling elements in the corresponding layers, and the receiving pipes being adapted to deliver the cooling medium after heat exchange in the corresponding cooling elements to the secondary side circulation loop; and

[0092] an air cooling unit coupled to the air cooling branch and comprising an air outlet side and an air return side, the air outlet side being capable of delivering cold air to the plurality of layers, and the air return side being capable of receiving the return air after heat exchange in the plurality of layers; and

[0093] a heat exchanger coupled to the liquid cooling branch and the secondary side circulation loop to enable heat exchange between the liquid cooling branch and the secondary side circulation loop.

[0094] Example 2. The heat dissipation system of example 1, wherein the cabinet further comprises:

[0095] a front side air duct arranged at a front side of the plurality of layers and communicating with the plurality of layers;

[0096] a rear side air duct arranged at a rear side of the plurality of layers and communicating with the plurality of layers; and

[0097] an air inlet and outlet duct communicating with the front side air duct and the rear side air duct, and the air cooling unit being arranged in the air inlet and outlet duct to deliver cold air to the plurality of layers via the front side air duct and to receive the return air after heat exchange in the plurality of layers via the rear side air duct.

[0098] Example 3. The heat dissipation system of example 2, wherein the air inlet and outlet duct is arranged at a top or a bottom of the cabinet.

[0099] Example 4. The heat dissipation system of example 2, wherein the air inlet and outlet duct is arranged at a middle portion of the cabinet to form a circulating air path at both sides of the air inlet and outlet duct.

[0100] Example 5. The heat dissipation system of example 3, wherein a length of the air inlet and outlet duct is less than half of a height of the cabinet.

[0101] Example 6. The heat dissipation system of example 2, wherein the heat exchanger is arranged in the air inlet and outlet duct.

[0102] Example 7. The heat dissipation system of any one of examples 1 to 6, further comprising:

[0103] a first valve coupled to the air cooling branch between the air cooling unit and the primary side liquid return pipe to adjust the on-off of the air cooling branch;

[0104] a bypass branch, one end of the bypass branch being in communication with the air cooling branch between the air cooling unit and the first valve, and the other end of the bypass branch being in communication with the liquid cooling branch between the heat exchanger and the primary side liquid supply pipe; and

[0105] a second valve coupled to the bypass branch to adjust the on-off of the bypass branch.

[0106] Example 8. The heat dissipation system according to any one of examples 1 to 6, wherein the air cooling branch and / or the liquid cooling branch is provided with a flow valve to adjust the flow ratio of the cooling medium in the air cooling branch and the liquid cooling branch.

[0107] Example 9. The heat dissipation system according to any one of examples 1 to 6, wherein the flow resistance ratio of the air cooling branch and the liquid cooling branch is a preset value.

[0108] Example 10. The heat dissipation system according to any one of examples 1 to 6, wherein the cooling element in the partition layer comprises a cold plate, the heat exchanger comprises a plate heat exchanger, and the secondary side circulation loop is capable of being filled with a single-phase cooling medium, and the heat dissipation system further comprises:

[0109] a circulation pump coupled to the secondary side circulation loop, the circulation pump being capable of driving the single-phase cooling medium in the secondary side circulation loop to flow.

[0110] Example 11. The heat dissipation system according to any one of examples 1 to 5, wherein the heat exchanger is arranged outside the cabinet.

[0111] Example 12. The heat dissipation system according to example 11, wherein the number of the cabinets is multiple, and the secondary side circulation loops of the multiple cabinets are all coupled to the heat exchanger, so that the liquid cooling branch exchanges heat with the secondary side circulation loops in the multiple cabinets via the heat exchanger.

[0112] Example 13. The heat dissipation system according to any one of examples 1 to 5, wherein the cabinet further comprises:

[0113] a heat dissipation cabin arranged at one side of the cabinet body, and the heat dissipation cabin is provided with the air inlet and outlet duct.

[0114] Example 14. The heat dissipation system of any one of examples 1 to 6, wherein the cooling element within the partition comprises an evaporator, the heat exchanger comprises a condenser, and the secondary side circulation loop is capable of being filled with a two-phase cooling medium to exchange heat via phase change of the two-phase cooling medium within the condenser and within the evaporator.

[0115] Example 15. The heat dissipation system of example 14, further comprising:

[0116] a compressor coupled to the secondary side circulation loop between the evaporator and the condenser; and

[0117] a throttling valve coupled to the secondary side circulation loop between the condenser and the evaporator.

[0118] Example 16. The heat dissipation system of example 14, wherein the receiving tube is connected to the evaporator at a position higher than a position at which the delivery tube is connected to the evaporator, and the condenser is positioned higher than the plurality of evaporators.

[0119] Example 17. The heat dissipation system of any one of examples 1 to 6, wherein the air cooling unit comprises:

[0120] a fan module; and

[0121] a surface cooler disposed on a side of the fan module and coupled to the air cooling branch.

[0122] Example 18. The heat dissipation system of any one of examples 1 to 6, wherein the outdoor heat exchange unit comprises a cooling tower.

[0123] Example 19. The heat dissipation system of any one of examples 1 to 6, further comprising:

[0124] two shunt valves respectively coupled to the primary side liquid supply pipe and the primary side liquid return pipe, the air cooling branch and the liquid cooling branch being disposed between the two shunt valves.

[0125] Example 20. A data center comprising:

[0126] a machine room; and

[0127] the heat dissipation system of any one of examples 1 to 19, the outdoor heat exchange unit of the heat dissipation system being disposed outside the machine room, and the cabinet of the heat dissipation system being disposed inside the machine room.

[0128] Having described above several embodiments of the disclosure, any modifications and variations that fall within the scope of the described embodiments are also contemplated by the inventor(s). As such, the foregoing description is not intended to limit the scope of the disclosure, and it is recognized that modifications can be made by one of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The word "comprising" is used herein to mean "including" but not necessarily "consisting of" or "composed of." The word "comprising" therefore does not exclude other elements from the compositions or methods described herein.

Claims

A heat dissipation system (100) comprising: an outdoor heat exchange unit (10); a primary-side liquid supply pipe (20) and a primary-side liquid return pipe (21) in communication with the outdoor heat exchange unit (10), and a wind cooling branch (23) and a liquid cooling branch (24) being provided between the primary-side liquid supply pipe (20) and the primary-side liquid return pipe (21); a cabinet (30) comprising: a cabinet body (31) comprising a plurality of compartments (310) for placing devices to be cooled; a secondary-side circulation loop (32); and a plurality of delivery pipes (321) and a plurality of receiving pipes (322) corresponding to the plurality of compartments (310) respectively, and in communication with the secondary-side circulation loop (32) respectively, the delivery pipes being adapted to deliver cooling medium in the secondary-side circulation loop (32) to cooling elements (33) in the corresponding compartments (310), and the receiving pipes being adapted to deliver cooling medium after heat exchange in the corresponding cooling elements (33) to the secondary-side circulation loop (32); and a wind cooling unit (40) coupled to the wind cooling branch (23) and comprising an air outlet side and an air return side, the air outlet side being capable of delivering cold air to the plurality of compartments (310), and the air return side being capable of receiving air after heat exchange in the plurality of compartments (310); and a heat exchanger (50) coupled to the liquid cooling branch (24) and the secondary-side circulation loop (32) to enable heat exchange between the liquid cooling branch (24) and the secondary-side circulation loop (32). The heat dissipation system (100) according to claim 1, wherein the cabinet (30) further comprises: a front-side air duct (34) provided at a front side of the plurality of compartments (310) and in communication with the plurality of compartments (310); a back-side air duct (35) provided at a back side of the plurality of compartments (310) and in communication with the plurality of compartments (310); and an air inlet and outlet duct (36) in communication with the front-side air duct (34) and the back-side air duct (35), and the air cooling unit (40) being provided in the air inlet and outlet duct (36) to deliver cold air to the plurality of compartments (310) via the front-side air duct (34) and to receive air after heat exchange in the plurality of compartments (310) via the back-side air duct (35). The heat dissipation system (100) according to claim 2, wherein the air inlet and outlet duct (36) is provided at a top or a bottom of the cabinet body (31). The heat dissipation system (100) according to claim 2, wherein the air inlet and outlet duct (36) is provided at a middle portion of the cabinet body (31) to form circulating air paths at upper and lower sides of the air inlet and outlet duct (36) respectively. The heat dissipation system (100) according to claim 4, wherein a length of the air inlet and outlet duct (36) is less than half of a height of the cabinet body (31). The heat dissipation system (100) according to claim 2, wherein the heat exchanger (50) is provided in the air inlet and outlet duct (36). The heat dissipation system (100) according to any one of claims 1 to 6, further comprising: a first valve (26) coupled to the air cooling branch (23) between the air cooling unit (40) and the primary side liquid return pipe (21) to adjust the on-off of the air cooling branch (23); a bypass branch (25) in communication with the air cooling branch (23) between the air cooling unit (40) and the first valve (26) at one end, and in communication with the liquid cooling branch (24) between the heat exchanger (50) and the primary side liquid supply pipe (20) at the other end; and a second valve (27) coupled to the bypass branch (25) to adjust the on-off of the bypass branch (25). The heat dissipation system (100) according to any one of claims 1 to 6, wherein the air cooling branch (23) and / or the liquid cooling branch (24) is provided with a flow valve to adjust the flow ratio of the cooling medium in the air cooling branch (23) and the liquid cooling branch (24). The heat dissipation system (100) according to any one of claims 1 to 6, wherein the flow resistance ratio of the air cooling branch (23) and the liquid cooling branch (24) is a preset value. The heat dissipation system (100) according to any one of claims 1 to 6, wherein the cooling element (33) in the partition layer (310) comprises a cold plate, the heat exchanger (50) comprises a plate heat exchanger, and the secondary side circulation loop (32) is capable of being filled with a single-phase cooling medium, and the heat dissipation system (100) further comprises: a circulation pump (37) coupled to the secondary side circulation loop (32), capable of driving the single-phase cooling medium in the secondary side circulation loop (32) to flow. The heat dissipation system (100) according to any one of claims 1 to 5, wherein the heat exchanger (50) is arranged outside the cabinet (30). The heat dissipation system (100) according to claim 11, wherein the number of the cabinets (30) is multiple, and the secondary side circulation loops (32) of the multiple cabinets (30) are all coupled to the heat exchanger (50) to make the liquid cooling branch (24) exchange heat with the secondary side circulation loops (32) in the multiple cabinets (30) via the heat exchanger (50). The heat dissipation system (100) according to claim 2, wherein the cabinet (30) further comprises: a heat dissipation cabin (60) arranged at one side of the cabinet body (31), and the heat dissipation cabin (60) is provided with the air inlet and outlet duct (36). The heat dissipation system (100) according to any one of claims 1 to 6, wherein the cooling element (33) in the partition layer (310) comprises an evaporator, the heat exchanger (50) comprises a condenser, and the secondary side circulation loop (32) is capable of being filled with a two-phase cooling medium to exchange heat via the phase change of the two-phase cooling medium in the condenser and the evaporator. The heat dissipation system (100) according to claim 14, further comprising: a compressor (38) coupled to the secondary side circulation loop (32) between the evaporator and the condenser; and a throttle valve (39) coupled to the secondary side circulation loop (32) between the condenser and the evaporator. The heat dissipation system (100) according to claim 14, wherein the receiving pipe (322) is connected to the evaporator at a position higher than the position at which the delivery pipe (321) is connected to the evaporator, and the condenser is positioned higher than the evaporators. The heat dissipation system (100) according to any one of claims 1 to 6, wherein the air cooling unit (40) comprises: a fan module (41); and a surface cooler (42) disposed on one side of the fan module (41) and coupled to the air cooling branch (23). The heat dissipation system (100) according to any one of claims 1 to 6, wherein the outdoor heat exchange unit (10) comprises a cooling tower. The heat dissipation system (100) according to any one of claims 1 to 6, further comprising: two flow dividers (28) coupled to the primary side liquid supply pipe (20) and the primary side liquid return pipe (21) respectively, and the air cooling branch (23) and the liquid cooling branch (24) are disposed between the two flow dividers (28). A data center, comprising: a machine room; and The heat dissipation system (100) according to any one of claims 1 to 19, wherein the outdoor heat exchange unit (10) of the heat dissipation system (100) is disposed outside the machine room, and the cabinet (30) of the heat dissipation system (100) is disposed inside the machine room. ​ ​

Images