Optical module

Abstract

The present disclosure provides an optical module. A digital signal processing chip is connected to a driving chip, so that the digital signal processing chip regenerates and shapes an electrical signal sent by a superordinate computer, so as to compensate for signal attenuation between a switching chip of the superordinate computer and ports of the superordinate computer, such that optical eye diagrams outputted by optical modules at different ports are consistent. The digital signal processing chip is not connected to a transimpedance amplification chip, so that the loss of the optical module can be effectively reduced. A circuit board is provided with second pads and third pads, and pads of the transimpedance amplification chip are connected to the second pads or the third pads. A first signal line for connecting the second pads to a gold finger is not connected to the digital signal processing chip. A second signal line for connecting the third pads to the gold finger is connected to the digital signal processing chip. In the present disclosure, the digital signal processing chip is connected to the driving chip and is not connected to the transimpedance amplification chip, thereby ensuring that the optical eye diagrams outputted by the optical modules at different ports are consistent while reducing the power consumption of the optical module.

Description

Optical module

[0001] The present application claims priority to the application No. 202422241479.X filed on September 12, 2024 with the China Patent Office; the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to the field of optical fiber communication technology, in particular to an optical module. BACKGROUND

[0003] High-speed optical modules with a transmission rate of 50 Gbps or above have relatively high requirements for signals, and therefore, the high-speed optical modules have a DSP. The DSP has a large power consumption, which leads to a large power consumption of the optical module, which is a great challenge to the increasing interconnection capacity and power consumption of the machine room. In order to reduce the power consumption of the optical module, the optical module no longer has a DSP inside. SUMMARY

[0004] The present disclosure provides an optical module, comprising:

[0005] a circuit board having a gold finger formed at one end;

[0006] a digital signal processing chip disposed on the surface of the circuit board and connected to the gold finger;

[0007] a transimpedance amplification chip having a first pad;

[0008] wherein the surface of the circuit board has:

[0009] a second pad connected to the gold finger through a first signal line; the first signal line is not connected to the digital signal processing chip;

[0010] a third pad connected to the gold finger through a second signal line; the second signal line is connected to the digital signal processing chip;

[0011] the first pad is wire-bonded to the second pad or the third pad; the first pad is wire-bonded to the second pad, so that the transimpedance amplification chip is not connected to the digital signal processing chip but is directly connected to the gold finger; the first pad is wire-bonded to the third pad, so that the transimpedance amplification chip is connected to the digital signal processing chip. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0013] Figure 1 is a partial structure diagram of an optical communication system according to some embodiments;

[0014] Figure 2 is a partial structure diagram of a host computer according to some embodiments;

[0015] Figure 3 is a structure diagram of an optical module according to some embodiments;

[0016] Figure 4 is an exploded view of an optical module according to some embodiments;

[0017] Figure 5 is an internal structure schematic diagram of an optical module according to some embodiments;

[0018] Figure 6 is an internal structure diagram of another optical module according to some embodiments;

[0019] Figure 7 is an internal structure schematic diagram of another optical module according to some embodiments;

[0020] Figure 8 is a partial diagram of an internal structure of an optical module according to some embodiments;

[0021] Figure 9 is a partial diagram of an internal structure of an optical module according to some embodiments from another perspective;

[0022] Figure 10 is a use state diagram of a TIA according to some embodiments;

[0023] Figure 11 is a use state diagram of another TIA according to some embodiments;

[0024] Figure 12 is an internal structure schematic diagram of another optical module according to some embodiments;

[0025] Figure 13 is an internal structure schematic diagram of yet another optical module according to some embodiments;

[0026] Figure 14 is an internal structure schematic diagram of still another optical module according to some embodiments. DETAILED DESCRIPTION

[0027] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0028] Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an open, inclusive sense, as "including, but not limited to"; the terms "first", "second", etc., are used merely as identifiers not to imply or suggest a relative importance or a numerical order of the number; the term "a plurality" means two or more; the term "connected" is to be construed broadly using its ordinary meaning, for example, "connected" can be a fixed connection, or a detachable connection, or integral, or directly connected, or indirectly connected via intermediate media; the use of the terms "adapted to" or "configured to" means open and inclusive language that is not to be limited to devices adapted or configured to perform additional tasks or steps; the terms "parallel", "perpendicular", "same", "consistent", "flush", and the like are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges in practice, and also include differences based on the same design concept but caused by manufacturing reasons.

[0029] In optical communication technology, information transmission needs to be established between information processing devices. Information needs to be loaded onto light. Light can transmit information. Light loaded with information is called optical signal. Optical signal reduces optical power loss when transmitting in information transmission device, so that information transmission can achieve high speed, long distance and low cost. Information processing devices can recognize and process electrical signals. Information processing devices include optical network units (ONUs). Information processing devices include gateways. Information processing devices include routers. Information processing devices include switches. Information processing devices include mobile phones. Information processing devices include computers. Information processing devices include servers. Information processing devices include tablets. Information processing devices include televisions. Information transmission devices include optical fibers. Information transmission devices include optical waveguides.

[0030] An optical module enables information transfer between an information processing device and an information transmission device. An optical module enables conversion between an optical signal and an electrical signal. For example, an optical signal input end of an optical module is connected to an optical fiber and at least one of an optical signal output pin of the optical module is connected to the optical fiber. At least one of an electrical signal input end of the optical module and an electrical signal output pin of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module. The optical module converts the first optical signal to a first electrical signal. The optical module transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module. The optical module converts the second electrical signal to a second optical signal. The optical module transmits the second optical signal to the optical fiber. A plurality of information processing devices transmit information through electrical signals. At least one of the plurality of information processing devices is directly connected to the optical module. It is not required that all of the information processing devices are directly connected to the optical module. An information processing device directly connected to the optical module is referred to as a host computer of the optical module. An optical signal input end of the optical module or an optical signal output pin of the optical module is referred to as an optical port. An electrical signal input end of the optical module or an electrical signal output pin of the optical module is referred to as an electrical port.

[0031] FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments. As shown in FIG. 1, the optical communication system includes a remote information processing device 1000. The optical communication system includes a local information processing device 2000. The optical communication system includes a host computer 100. The optical communication system includes an optical module 200. The optical communication system includes an optical fiber 101. The optical communication system includes a network cable 103.

[0032] An end of the optical fiber 101 extends towards the remote information processing device 1000. The other end of the optical fiber 101 is connected to an optical port of the optical module 200. An optical signal is totally reflected in the optical fiber 101. The optical signal can maintain original optical power when propagating in the direction of total reflection. An optical signal from the remote information processing device 1000 is transmitted to the optical fiber 101. The optical signal is transmitted to the optical module 200 through multiple total reflections in the optical fiber 101. The optical module 200 transmits the optical signal to the optical fiber 101. The optical signal is transmitted to the remote information processing device 1000 through multiple total reflections in the optical fiber 101. This transmission described in this paragraph enables long distance and low power loss information transfer.

[0033] The optical communication system can include one or more optical fibers 101. The optical fiber 101 is detachably connected or fixedly connected to the optical module 200. The host computer 100 provides a data signal to the optical module 200, or receives a data signal from the optical module 200, or monitors a working state of the optical module 200, or controls the working state of the optical module 200.

[0034] The host computer 100 includes a housing. The housing is roughly cuboid in shape. The host computer 100 includes a light module connection hole 102. The light module connection hole 102 is provided on the housing. The light module connection hole 102 is used to access the light module 200. The host computer 100 establishes an electrical signal connection with the light module 200 through the light module connection hole 102. The electrical signal connection can be a one-way connection or a two-way connection.

[0035] The host computer 100 includes an external electrical connection hole. The external electrical connection hole accesses an electrical signal network. For example, the external electrical connection hole includes a universal serial bus connection hole (USB) or a network cable connection hole 104. The network cable connection hole 104 accesses a network cable 103. The host computer 100 establishes an electrical signal connection with the network cable 103 through the network cable connection hole 104. The electrical signal connection can be a one-way connection. The electrical signal connection can be a two-way connection.

[0036] One end of the network cable 103 is connected to the local information processing device 2000. The other end of the network cable 103 is connected to the host computer 100. The local information processing device 2000 establishes an electrical signal connection with the host computer 100 through the network cable 103. For example, the local information processing device 2000 sends a third electrical signal. The third electrical signal is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal according to the third electrical signal. The host computer 100 transmits the second electrical signal to the light module 200. The light module 200 converts the second electrical signal into a second optical signal. The light module 200 transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 through the optical fiber 101. For example, the first optical signal of the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal is transmitted to the light module 200. The light module 200 converts the first optical signal into a first electrical signal. The light module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal according to the first electrical signal. The host computer 100 transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the light module is a tool for converting optical signals and electrical signals. The information does not change during the conversion process. The encoding or decoding method of the information can change.

[0037] In addition to including an optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network terminal (ONT), or a data center server, etc.

[0038] Figure 2 is a partial structure diagram of a host machine according to some embodiments. As shown in Figure 2, Figure 2 only shows the structure of the host machine 100 related to the optical module 200. The host machine 100 includes a circuit board 105, a cage 106, a heat sink 107, and an electrical connector. The PCB circuit board 105 is disposed in the housing. The cage 106 is disposed on the surface of the PCB circuit board 105. The heat sink 107 is disposed on the cage 106. The electrical connector is disposed inside the cage 106. The electrical connector is used to access the electrical port of the optical module 200. The heat sink 107 has a protruding structure. The protruding structure can be a fin. The protruding structure is used to increase the heat dissipation area.

[0039] The optical module 200 is inserted into the cage 106 of the host machine 100. The cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106. The heat is transferred from the cage 106 to the heat sink 107. The heat sink 107 diffuses the heat. The electrical port of the optical module 200 is connected to the electrical connector of the cage 106. The optical module 200 establishes a bidirectional electrical signal connection with the host machine 100 through the electrical connector. The optical port of the optical module 200 is connected to the optical fiber 101. The optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101 through the optical port.

[0040] Figure 3 is a structure diagram of an optical module according to some embodiments. Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300, and an optical transceiver component. The circuit board 300 is disposed in the housing. The optical transceiver component is disposed in the housing.

[0041] The housing includes an upper housing 201 and a lower housing 202. The upper housing 201 covers the lower housing 202 to form two openings 204 and 205. The outer contour of the housing is a square body.

[0042] In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022. The two lower side plates 2022 are located on both sides of the bottom plate 2021. The two lower side plates 2022 are perpendicular to the bottom plate 2021. The upper housing 201 includes a cover plate 2011. The cover plate 2011 covers the two lower side plates 2022 to form the housing.

[0043] In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022. The two lower side plates 2022 are located on both sides of the bottom plate 2021. The two lower side plates 2022 are perpendicular to the bottom plate 2021. The upper housing 201 includes a cover plate 2011. The upper housing 201 includes two upper side plates. The two upper side plates are located on both sides of the cover plate 2011. The two upper side plates are perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 combine to form the housing.

[0044] The connecting direction of the two openings 204 and 205 can be consistent with the length direction of the optical module 200. The connecting direction of the two openings 204 and 205 can also be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3). The opening 205 is located at the end of the optical module 200 (the left end of FIG. 3). Alternatively, the opening 204 is located at the end of the optical module 200. The opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port. The gold finger of the circuit board 300 extends from the electrical port. The gold finger is inserted into the electrical connector of the host computer 100. The opening 205 is an optical port. The optical port accesses the external optical fiber 101. The optical fiber 101 connects the optical transceiver component of the optical module 200.

[0045] The assembly of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300. The assembly of the upper shell 201 and the lower shell 202 facilitates the installation of the optical transceiver component. The shells encapsulate and protect the circuit board 300 and the optical transceiver component. The assembly of the upper shell 201 and the lower shell 202 facilitates the deployment of the positioning component, the heat dissipation component, and the electromagnetic shielding component, which is conducive to automated production.

[0046] In some embodiments, the upper shell 201 is made of a metal material. The lower shell 202 is made of a metal material. The metal material is conducive to electromagnetic shielding. The metal material is conducive to heat dissipation.

[0047] In some embodiments, the optical module 200 includes an unlocking component 600. The unlocking component 600 is located outside the shell. The unlocking component 600 enables the fixed connection of the optical module 200 with the host computer or the disconnection of the optical module 200 from the host computer.

[0048] For example, the unlocking component 600 is located outside the lower side plate 2022 of the lower shell 202. The unlocking component 600 includes a clamping component. The clamping component matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component fixes the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the clamping component moves with the unlocking component 600. The movement of the clamping component changes the connection relationship between the clamping component and the host computer. Pulling the unlocking component 600 releases the fixation of the optical module 200. The optical module 200 can be pulled out of the cage 106.

[0049] The circuit board 300 includes circuit traces. The circuit board 300 includes electronic components. The circuit board 300 includes chips. The circuit traces connect the electronic components and the chips. The circuit traces implement power supply functions. The circuit traces implement electrical signal transmission functions. The circuit traces implement ground functions. The electronic components include capacitors. The electronic components include resistors. The electronic components include transistors. The electronic components include Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips include Microcontroller Units (MCUs). The chips include laser driver chips. The chips include Transimpedance Amplifiers (TIAs). The chips include Limiting Amplifiers (LIAs). The chips include Clock and Data Recovery (CDR) chips. The chips include power management chips. The chips include Digital Signal Processing (DSP) chips.

[0050] The circuit board 300 can be a rigid circuit board. The rigid circuit board is hard in material. The rigid circuit board carries the electronic components. The rigid circuit board carries the chips. The rigid circuit board can be inserted into the electrical connector of the cage 106.

[0051] The circuit board 300 includes a gold finger. The gold finger is formed on the surface of the end of the circuit board 300. The gold finger is composed of multiple independent pins. When the circuit board 300 is inserted into the cage 106, the gold finger connects the electrical connector. The gold finger can be disposed only on the surface (e.g., the upper surface shown in FIG. 4) of one side of the circuit board 300. The gold finger can be disposed on the surfaces of both the upper and lower sides of the circuit board 300 to provide a larger number of pins. The multiple pins are suitable for occasions where a large number of pins are required. The gold finger establishes electrical connection with the host computer to implement power supply, ground, Inter-Integrated Circuit (I2C) signal transmission, data signal transmission, and the like. Some optical modules use flexible circuit boards. The flexible circuit board is used in cooperation with the rigid circuit board. The flexible circuit board serves as a supplement to the rigid circuit board.

[0052] In some embodiments, the optical transceiver component includes a light source 910 and an optical chip 920. The optical chip 920 is optically connected to the light source 910. The light source 910 emits light without data. The optical chip 920 modulates the light without data into an optical signal.

[0053] The optical chip 920 is a silicon optical chip or a lithium niobate chip, etc.

[0054] In some embodiments, the optical chip 920 comprises a beam splitter. The beam splitter is connected to the light source 910. The beam splitter splits the dataless light from the light source 910 into at least one dataless light. The optical chip 920 modulates the at least one dataless light into optical signals.

[0055] In some embodiments, the optical chip 920 comprises at least one modulation region. The modulation region is connected to the beam splitter. The modulation region receives the dataless light after splitting. The modulation region modulates the dataless light into optical signals under the action of a driving signal. Example: one modulation region modulates one dataless light into one optical signal under the action of one driving signal.

[0056] In some embodiments, the optical transceiver comprises a photodetector. The photodetector receives the optical signals transmitted by the optical fiber. The photodetector converts the optical signals into current signals.

[0057] The photodetector is arranged on the surface of the circuit board 300. The photodetector is integrated on the optical chip 920.

[0058] In some embodiments, the number of photodetectors is at least one. For example, the number of photodetectors is four.

[0059] In some embodiments, the circuit board 300 is provided with a TIA 303. The TIA 303 is connected to the photodetector. The TIA 303 converts the current signal into a voltage signal. In some embodiments, the TIA 303 is arranged on the surface of the optical chip 920.

[0060] In some embodiments, the circuit board 300 is provided with a driving chip 302. The driving chip 302 is connected to the optical chip 920. The driving chip 302 provides a driving signal to the optical chip 920. The optical chip 920 modulates the optical signal with the driving signal.

[0061] In some embodiments, the driving chip 302 integrates at least one driving circuit. One driving circuit is connected to one modulation region of the optical chip 920. The driving chip 302 provides at least one driving signal. Example: the driving chip 302 integrates four driving circuits and provides four driving signals.

[0062] In some embodiments, the circuit board 300 is provided with a DSP 301. The DSP has a digital clock recovery function. The DSP has a dispersion compensation function. The DSP removes noise. The DSP removes nonlinear interference. The DSP reduces distortion effects. The DSP 301 is connected to the golden finger. The DSP 301 receives the electrical signals transmitted by the host computer. The DSP 301 is connected to the driving chip 302. The DSP 301 transmits the shaped electrical signals to the driving chip 302. The DSP 301 is connected to the TIA 303. The DSP 301 processes the voltage signals from the TIA 303 and transmits them to the golden finger. In the embodiments of the present disclosure, the circuit board 300 can not be provided with the DSP 301.

[0063] The optical module in which the DSP 301 is internally disposed is referred to as a DSP-type optical module. In the DSP-type optical module, the DSP 301 is connected to the drive chip 302. In the DSP-type optical module, the DSP 301 is connected to the TIA 303.

[0064] The DSP has a large power consumption. The optical module has a large power consumption. The power consumption of the optical module poses a challenge. In some embodiments, the DSP is removed from inside the optical module. The gold finger is directly connected to the drive chip. The gold finger is directly connected to the TIA. The optical module without the DSP is referred to as a linear-drive pluggable optics (LPO)-type optical module.

[0065] The drive chip of the LPO-type optical module is a linear-drive chip. The linear-drive chip integrates the CTLE function. The linear-drive chip integrates the EQ function. The CTLE and the EQ compensate for the electrical signal of the host computer. The TIA of the LPO-type optical module integrates the AGC function. The TIA of the LPO-type optical module integrates the EQ function. The AGC and the EQ compensate for the electrical signal transmitted to the host computer.

[0066] However, since the host computer has multiple ports, the insertion loss between each port and the switching chip is different. The DSP inside the optical module does not regenerate and shape the electrical signal, resulting in a large difference in the optical eye diagram output by the optical modules of different ports, which affects the interconnection and intercommunication of the optical modules.

[0067] To solve this problem, in some embodiments, a DSP is disposed inside the optical module, but the DSP is only connected to the drive chip. The DSP is no longer connected to the TIA. The DSP regenerates and shapes the electrical signal. The regeneration and shaping compensate for the signal attenuation. After compensation, the optical eye diagrams of different ports are consistent. The consistent optical eye diagram ensures the interconnection and intercommunication. The DSP is not connected to the TIA, which reduces the power consumption. The optical module of the present disclosure ensures the consistency of the optical eye diagram at low power consumption. Such an optical module is referred to as a linear-drive receiving optics (LRO)-type optical module.

[0068] FIG. 5 is a schematic diagram of the internal structure of an optical module according to some embodiments. As shown in FIG. 5, in some embodiments, the optical module includes a DSP 301. One end of the DSP 301 is connected to a gold finger. The other end of the DSP 301 is connected to a drive chip 302. The drive chip 302 is connected to an optical chip 920. A photodetector is connected to one end of a TIA 303. The other end of the TIA 303 is directly connected to the gold finger.

[0069] FIG. 6 is a diagram of internal structure of another optical module according to some embodiments. FIG. 7 is a diagram of internal structure of another optical module according to some embodiments. As shown in FIG. 6 and FIG. 7, in some embodiments, the optical module includes a DSP 301. One end of the DSP 301 is connected to a gold finger. Another end of the DSP 301 is connected to a driver chip 302. The driver chip 302 is connected to a laser chip 410. A light receiving chip 510 is connected to one end of a TIA 303. Another end of the TIA 303 is directly connected to a gold finger. The TIA 303 can be disposed on a surface of a circuit board. The TIA 303 can also not be disposed on the surface of the circuit board.

[0070] FIG. 8 is a diagram of a partial view of internal structure of an optical module according to some embodiments. FIG. 9 is a diagram of a partial view of internal structure of an optical module according to some embodiments. As shown in FIG. 4, FIG. 8 and FIG. 9, in some embodiments, a DSP 301 is disposed on a surface of a circuit board 300. The DSP 301 is connected to a gold finger 314. The DSP 301 acquires an electrical signal of the gold finger 314. The DSP 301 transmits the electrical signal to the gold finger 314.

[0071] In some embodiments, a first pad 331 is disposed on a surface of the TIA 303.

[0072] In some embodiments, a second pad 305 is disposed on a surface of the circuit board 300. The second pad 305 is connected to the gold finger 314. The connection is achieved through a first signal line 316. The first signal line 316 is not connected to the DSP 301.

[0073] The first signal line 316 can be disposed on a surface of the circuit board 300. The first signal line 316 can be disposed inside the circuit board 300. When the first signal line 316 is inside, the length of the wire is shortened. Shortening the length of the wire can improve signal integrity.

[0074] The second pad 305 is connected to the first pad 331. This connection makes the TIA 303 not connected to the DSP 301. The TIA 303 is directly connected to the gold finger 314. Therefore, the optical module becomes an LRO type optical module. The LRO type optical module reduces power consumption.

[0075] In some embodiments, a third pad 304 is disposed on a surface of the circuit board 300. The third pad 304 is connected to the gold finger 314. The connection is achieved through a second signal line 318. The second signal line 318 is connected to the DSP 301.

[0076] The second signal line 318 can be disposed on a surface of the circuit board 300. The second signal line 318 can be disposed inside the circuit board 300. When the second signal line 318 is on the surface, the length of the wire is shortened. Shortening the length of the wire can improve signal integrity.

[0077] The second signal line 318 includes a first sub-signal line. The first sub-signal line first end is connected to the gold finger 314. The first sub-signal line second end is connected to one end of the DSP 301.

[0078] The second signal line 318 includes a second sub-signal line. The second sub-signal line first end is connected to another end of the DSP 301. The second sub-signal line second end is connected to the third pad 304.

[0079] The third pad 304 is connected to the first pad 331. This connection makes the TIA 303 connected to the DSP 301. Therefore, the optical module becomes a DSP type optical module. The DSP type optical module reduces signal distortion.

[0080] In other structures, the LRO type optical module has lower power consumption than the DSP type optical module. The near distance port of the host computer has lower loss. The far distance port of the host computer has higher loss. The LRO type optical module is inserted into the near distance port to reduce the power consumption of the optical module. The DSP type optical module is inserted into the far distance port to reduce signal distortion and improve signal quality. Example: the port of the host computer with a distance between the port and the switching chip of the host computer less than or equal to a first preset distance is a first port. The port of the host computer with a distance between the port and the switching chip of the host computer greater than the first preset distance is a second port. The LRO type optical module is inserted into the first port. The DSP type optical module is inserted into the second port.

[0081] In other words, when the TIA 303 is connected to the DSP 301, the optical module is inserted into the far distance port. When the TIA 303 is not connected to the DSP 301, the optical module is inserted into the near distance port. This configuration reduces the total power consumption of the host computer.

[0082] The second pad 305 and the third pad 304 can be arranged at the edge of the circuit board 300. The second pad 305 and the third pad 304 can be arranged in the middle of the circuit board 300.

[0083] As shown in FIG. 9, in some embodiments, the circuit board 300 includes a first surface layer 311. The circuit board 300 includes a second surface layer 313. The first surface layer 311 is an upper surface layer of the circuit board 300. The second surface layer 313 is a lower surface layer of the circuit board 300. The first surface layer 311 is provided with the gold finger 314. The first surface layer 311 is provided with the TIA 303. The TIA 303 is provided with the first pad 331.

[0084] In some embodiments, the second pad 305 and the third pad 304 are arranged on the first surface layer 311. The first pad 331 can be wire-connected to the second pad 305. The first pad 331 can be wire-connected to the third pad 304. This configuration makes the optical module an LRO type or a DSP type.

[0085] In some embodiments, the second pad 305 is flush with the first pad 331. The third pad 304 is flush with the first pad 331. The flush design shortens the wire distance. The shortened distance improves signal integrity.

[0086] In some embodiments, the second pad 305 is closer to the first pad 331 than the third pad 304. In this case, the first wire 307 (from the second pad 305 to the first pad 331) is shorter than the second wire 306 (from the third pad 304 to the first pad 331). The short wire improves LRO type signal integrity. Meanwhile, the signal line crossing is avoided.

[0087] In some embodiments, the circuit board 300 includes a middle layer 312. The middle layer 312 is between the first surface layer 311 and the second surface layer 313. The upper surface of the middle layer 312 is connected to the first surface layer 311 through a medium. The lower surface of the middle layer 312 is connected to the second surface layer 313 through a medium. The first signal line 316 is disposed on the middle layer 312.

[0088] In some embodiments, the first end of the first signal line 316 is connected to the first via 315. The first via 315 is connected to the gold finger 314. The second end of the first signal line 316 is connected to the second via 317. The second via 317 is connected to the second pad 305. This structure shortens the wire distance. The shortened distance improves signal integrity.

[0089] FIG. 10 is a use state diagram of a TIA according to some embodiments. As shown in FIG. 10, the first pad 331 is connected to the second pad 305 through the first wire 307. This connection makes the optical module an LRO type.

[0090] FIG. 11 is another use state diagram of a TIA according to some embodiments. As shown in FIG. 11, the first pad 331 is connected to the third pad 304 through the second wire 306. This connection makes the optical module a DSP type.

[0091] FIGS. 10 and 11 show the structure of the DSP 301. The driving chip 302 is connected to the DSP 301. The first pad 331 can be connected to the second pad 305 or the third pad 304. The selection determines whether the TIA is directly connected to the gold finger or connected through the DSP.

[0092] For the case that the DSP 301 is disposed in the optical module, the driving chip 302 is not connected to the DSP 301, and the driving chip 302 is directly connected to the gold finger 314, the connection relationship between the first pad 331 and the second pad 305 or the third pad 304 is also applicable.

[0093] When the optical module does not contain the DSP 301, the pad connection structure is not applicable. At this time, the driving chip 302 is directly connected to the gold finger. To solve the problem of the difference in the optical eye diagram output by the optical module of different ports, in some embodiments, the module in which the driving chip is directly connected to the gold finger is configured with an MCU. The MCU is connected to the driving chip. The MCU adjusts the gain voltage of the driving chip according to the preset voltage and the output voltage of the driving chip. This adjustment makes the output voltage equal to the preset value. The stable output voltage makes the optical eye diagrams of different ports consistent.

[0094] FIG. 12 is a schematic diagram of the internal structure of another optical module according to some embodiments. As shown in FIG. 12, in some embodiments, the driving chip is directly connected to the gold finger. The driving chip obtains the input signal of the host computer from the gold finger. The driving chip is connected to the laser chip or the light chip. The output signal of the driving chip controls the generation of the optical signal. For example, the laser chip emits an optical signal, and the light chip modulates the light without carrying data into an optical signal.

[0095] In some embodiments, the driving chip contains an input pin. The input pin is connected to the gold finger. The driving chip obtains the signal input by the host computer through the input pin.

[0096] In some embodiments, the driving chip contains a first output pin. The first output pin can output an output signal. The output signal can be a driving signal.

[0097] In some embodiments, the driving chip contains a second output pin. The second output pin is connected to the laser chip or the light chip. The driving signal causes the laser chip to emit an optical signal. The driving signal causes the light chip to modulate the light without carrying data into an optical signal.

[0098] In some embodiments, the driving chip includes a control pin. The control pin receives a gain voltage. The gain voltage adjusts the level amplitude of the output signal. The level amplitude of the output signal can be calculated to obtain the output voltage, so the level amplitude of the output signal can be considered as the output voltage.

[0099] The gain voltage, also known as voltage gain, refers to the proportional relationship between the input signal and the output signal in a circuit. The size of the gain voltage determines the amplification degree of the output signal relative to the input signal. The operational amplifier circuit amplifies / reduces the signal according to the gain value. The amplification degree affects the output voltage of the driving chip.

[0100] As shown in FIG. 12, in some embodiments, the optical module contains an MCU. The MCU is connected to the driving chip. The MCU monitors the output voltage of the driving chip. The MCU adjusts the gain voltage output to the driving chip according to the output voltage, thereby adjusting the output voltage of the driving chip.

[0101] In some embodiments, the MCU comprises an input pin. The input pin is connected to the first output pin of the driver chip to monitor the output voltage of the first output pin of the driver chip. For example, the input pin of the MCU can be an ADC pin. The ADC pin of the MCU is connected to the first output pin of the driver chip to enable the MCU to connect to the driver chip through the ADC / DAC serial port.

[0102] The ADC pin of the MCU is equipped with a detector. The detector measures the output voltage. The detector converts the analog signal into a digital signal so that the MCU can process and analyze.

[0103] In some embodiments, the MCU comprises an output pin. The output pin is connected to the control pin of the driver chip to output the gain voltage to the driver chip. For example, the output pin of the MCU can be a DAC pin. The DAC pin of the MCU is connected to the control pin of the driver chip to enable the MCU to connect to the driver chip through the ADC / DAC serial port.

[0104] In some embodiments, the MCU comprises a register. The register stores a preset voltage. The MCU compares the output voltage with the preset voltage. According to the comparison result, the gain voltage is adjusted: when the output voltage is less than the preset voltage in the register, the gain voltage is increased until the output voltage equals the preset voltage; when the output voltage is greater than the preset voltage in the register, the gain voltage is decreased until the output voltage equals the preset voltage; when the output voltage equals the preset voltage in the register, the gain voltage remains unchanged.

[0105] In some embodiments, the register stores an initial gain voltage. The initial gain voltage is the gain voltage required by the driver chip of most optical modules. The MCU is used to first transmit the initial gain voltage to the driver chip to determine whether the output voltage of the driver chip under the initial gain voltage equals the preset voltage; when the output voltage is less than the preset voltage, the gain voltage is increased step by step on the basis of the initial gain voltage until the output voltage equals the preset voltage; when the output voltage is greater than the preset voltage, the gain voltage is decreased step by step on the basis of the initial gain voltage until the output voltage equals the preset voltage; when the output voltage equals the preset voltage, the initial gain voltage remains unchanged.

[0106] In some embodiments, the register stores a gain voltage threshold. The gain voltage threshold is the upper limit of the gain voltage that the MCU can output. When the gain voltage is greater than or equal to the gain voltage threshold and the output voltage is less than the preset voltage, it indicates that there is no electrical signal input to the optical module, therefore, the MCU reports a Loss of Signal Alarm (LOS) signal to the host computer. When the gain voltage is less than the gain voltage threshold and the output voltage is not equal to the preset voltage, the gain voltage is continuously adjusted according to the output voltage and the preset voltage to make the output voltage reach the preset voltage.

[0107] FIG. 13 is an internal structure schematic diagram of yet another optical module, according to some embodiments. As shown in FIG. 13, in some embodiments, a driving chip is connected to a gold finger. The driving chip acquires input signals from a host computer. The driving chip is connected to a laser chip or an optical chip. The driving chip outputs driving signals. The driving signals control the laser chip to emit light signals. The driving signals control the optical chip to modulate light signals.

[0108] In some embodiments, the driving chip includes an input pin. The input pin is connected to the gold finger. The input pin acquires input signals transmitted from the host computer.

[0109] In some embodiments, the driving chip includes a first output pin. The first output pin outputs output signals, which can be the driving signals.

[0110] In some embodiments, the driving chip includes a second output pin. The second output pin is connected to the laser chip. The driving signals cause the laser chip to emit light. The second output pin is connected to the optical chip. The driving signals cause the optical chip to modulate light signals.

[0111] In some embodiments, the driving chip includes a control pin. The control pin receives a gain voltage. The gain voltage adjusts the level amplitude of the output signals. The level amplitude is the output voltage.

[0112] As shown in FIG. 13, in some embodiments, the optical module internally includes an operational amplifier. The operational amplifier is connected to the driving chip. The operational amplifier acquires the output voltage of the driving chip. The operational amplifier compares the output voltage with a reference voltage. The operational amplifier outputs the comparison result.

[0113] In some embodiments, the operational amplifier includes a non-inverting input pin. The non-inverting input pin is connected to the first output pin of the driving chip. The non-inverting input pin acquires the output voltage.

[0114] In some embodiments, the operational amplifier includes an inverting input pin. The inverting input pin is connected to a preset voltage. The preset voltage is provided by a power supply chip. The preset voltage can also be provided by an MCU. The inverting input pin can be connected to the power supply chip. The inverting input pin can also be connected to the MCU.

[0115] In some embodiments, the operational amplifier includes an output pin. The output pin outputs a comparison result of the output voltage and the preset voltage. When the output voltage is greater than the preset voltage, the output pin of the operational amplifier outputs a number greater than zero; when the output voltage is less than the preset voltage, the output pin of the operational amplifier outputs a number less than zero; when the level of the output signal is equal to the preset voltage, the output pin of the operational amplifier outputs zero. As shown in FIG. 13, in some embodiments, the optical module includes an MCU. The MCU is connected to the output pin of the operational amplifier. The MCU obtains the comparison result. The MCU adjusts the gain voltage according to the result. When the comparison result of the operational amplifier is a number greater than zero, the MCU decreases the gain voltage; when the comparison result of the operational amplifier is a number less than zero, the MCU increases the gain voltage; when the comparison result of the operational amplifier is zero, the MCU keeps the gain voltage unchanged. The MCU can be connected to the control pin of the driving chip for outputting the gain voltage to the driving chip.

[0116] In some embodiments, the MCU includes an input pin. The input pin is connected to the output pin of the operational amplifier. The input pin obtains the comparison result.

[0117] In some embodiments, the MCU includes an output pin. The output pin is connected to the control pin of the driving chip. Example: the output pin is a DAC pin.

[0118] In some embodiments, the MCU includes a register. The register stores an initial gain voltage. The initial value is a value required by most driving chips. The MCU first sends the initial gain voltage. The comparison result of the operational amplifier under the initial gain voltage is read. When the comparison result of the operational amplifier is a low level, the gain voltage is increased step by step on the basis of the initial gain voltage until the output voltage is equal to the preset voltage; when the comparison result of the operational amplifier is a high level, the gain voltage is decreased step by step on the basis of the initial gain voltage until the output voltage is equal to the preset voltage; when the comparison result of the operational amplifier is zero level, the initial gain voltage is kept unchanged.

[0119] In some embodiments, the register stores a gain voltage threshold. The gain voltage threshold is an upper limit of the gain voltage that can be output by the MCU. When the gain voltage is greater than or equal to the gain voltage threshold and the output voltage is less than the preset voltage, it indicates that there is no electrical signal input to the optical module, therefore, the MCU reports a LOS signal to the host computer. When the gain voltage is less than the gain voltage threshold and the output voltage is equal to the preset voltage, the gain voltage is continuously adjusted according to the output voltage and the preset voltage so as to make the output voltage reach the preset voltage.

[0120] FIG. 14 is a schematic diagram of the internal structure of still another optical module according to some embodiments. As shown in FIG. 14, in some embodiments, the driving chip includes an input pin. The input pin is connected to the gold finger. The input pin obtains the input signal.

[0121] In some embodiments, the driver chip includes an output pin. The output pin is connected to the laser chip. The driver chip provides a driving signal. The laser chip emits light according to the signal. The output pin is connected to the light chip. The light chip modulates a light signal according to the signal.

[0122] In some embodiments, the driver chip includes an input / output pin. The driver chip monitors the output voltage by itself. The driver chip stores the output voltage. The driver chip stores a gain voltage. The gain voltage includes an original value and an adjusted value.

[0123] In some embodiments, the driver chip includes a first register. The first register stores the output voltage. The first register stores the corresponding gain voltage.

[0124] As shown in FIG. 14, in some embodiments, the light module includes an MCU. The MCU is connected to the driver chip. The MCU reads the output voltage. The MCU reads the original gain voltage.

[0125] In some embodiments, the MCU includes an input / output pin. The input / output pin of the MCU is connected to the input / output pin of the driver chip, so as to facilitate the MCU to read the output voltage and the gain voltage. Example: The input / output pin of the MCU can be an I2C pin. The I2C pin of the MCU is connected to the I2C pin of the driver chip. The MCU communicates with the driver chip through the I2C protocol.

[0126] The I2C protocol uses two lines: a serial data line and a serial clock line. The data line transmits data. The clock line synchronizes the signal.

[0127] In some embodiments, the MCU includes a second register. The second register stores a preset voltage. The MCU compares the output voltage with the preset value and adjusts the gain voltage in the first register. When the output voltage is less than the preset voltage, the MCU can increase the gain voltage in the first register until the output voltage equals the preset voltage; when the output voltage is greater than the preset voltage, the MCU can decrease the gain voltage in the first register until the output voltage equals the preset voltage; when the output voltage equals the preset voltage, the MCU can keep the gain voltage in the first register. In some embodiments, the MCU directly modifies the gain voltage of the first register to adjust the gain voltage in the first register. Example: The MCU writes the adjusted first gain value into the first register. The first gain value replaces the original value. This replacement realizes the adjustment of the gain voltage in the first register, wherein the first gain voltage is the gain voltage adjusted by the MCU according to the comparison result.

[0128] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A light module comprising: a circuit board, one end of which is formed with a golden finger; a digital signal processing chip, disposed on a surface of the circuit board, connected with the golden finger; a transimpedance amplification chip, having a first pad; wherein the surface of the circuit board is formed with: a second pad, connected with the golden finger through a first signal line, the first signal line not being connected with the digital signal processing chip; a third pad, connected with the golden finger through a second signal line, the second signal line being connected with the digital signal processing chip; the first pad being wire-bonded with the second pad or the third pad; the first pad being wire-bonded with the second pad so that the transimpedance amplification chip is not connected with the digital signal processing chip but directly connected with the golden finger; the first pad being wire-bonded with the third pad so that the transimpedance amplification chip is connected with the digital signal processing chip. 2.The light module of claim 1, further comprising a driving chip, the driving chip being connected with the digital signal processing chip.

3. The optical module according to claim 2, wherein the transimpedance amplification chip not being connected with the digital signal processing chip, the light module being inserted into a host computer at a port close to a switching chip in the host computer; the transimpedance amplification chip being connected with the digital signal processing chip, the light module being inserted into the host computer at a port far from the switching chip.

4. The optical module according to claim 2, wherein a distance between the second pad and the first pad is less than a distance between the third pad and the first pad.

5. The optical module of claim 2, wherein, the second pad and the third pad are flush with the first pad respectively.

6. The optical module of claim 2, wherein, the first signal line being located inside the circuit board, one end of the first signal line being connected with the golden finger through a via, the other end of the first signal line being connected with the second pad through a via.

7. The optical module according to claim 2, wherein the second signal line being located on the surface of the circuit board, the second signal line comprising a first sub-signal line and a second sub-signal line, one end of the first sub-signal line being connected with the golden finger, the other end of the first sub-signal line and one end of the second sub-signal line being connected with the digital signal processing chip, the other end of the second sub-signal line being connected with the third pad. 8.The light module of claim 2, further comprising: a light source, configured to emit light without carrying data; a light chip, optically connected with the light source to receive the light emitted by the light source without carrying data; the light chip being connected with the driving chip to receive a driving signal provided by the driving chip, the light chip modulating the light without carrying data into an optical signal under the action of the driving signal. 9.The light module of claim 2, further comprising: a laser chip, connected with the driving chip to receive a driving signal provided by the driving chip; the laser chip emitting an optical signal under the action of the driving signal.

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