Display device and method for manufacturing display device

Abstract

According to one embodiment of the present invention, a display device comprises: a display unit; a flexible substrate electrically connected to the display unit by a wire; and a reinforcing plate supporting the display unit and the flexible substrate.

Description

Display device and method for manufacturing a display device

[0001] This disclosure relates to a display device and a method for manufacturing a display device.

[0002] For example, a display device has been proposed in which a display unit, such as a display panel, and other components, such as a circuit board which are separate from the display unit, are electrically connected by wire bonding (see, for example, Patent Document 1).

[0003] Japanese Patent Publication No. 2019-45777

[0004] However, in the aforementioned display device, the wire connects the display unit to other components, making the wire susceptible to damage from external forces on the display unit or other components. This reduces the reliability of the wire, and therefore the reliability of the device.

[0005] Therefore, this disclosure proposes a display device and a method for manufacturing a display device that can improve the reliability of the device.

[0006] The display device according to this embodiment comprises a display unit, a flexible substrate electrically connected to the display unit by wires, and a reinforcing plate supporting the display unit and the flexible substrate.

[0007] A method for manufacturing a display device according to the embodiment includes providing a display unit and a flexible substrate on a reinforcing plate, and electrically connecting the display unit and the flexible substrate with wires.

[0008] This is a plan view showing an example configuration of the display device of Embodiment 1 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 1 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 2 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 3 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 4 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 5 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 6 according to the first embodiment. This is a plan view of the back side showing an example configuration of the display device of Embodiment 6 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 7 according to the first embodiment. This is a plan view showing an example configuration of the display device of Embodiment 7 according to the first embodiment. This is a plan view showing an example configuration of the display device of Embodiment 8 according to the first embodiment. This is a plan view showing an example configuration of the display device of Embodiment 9 according to the first embodiment. This is a plan view showing an example configuration of the display device of Embodiment 10 according to the first embodiment. This is a plan view showing an example configuration of the display device of Embodiment 11 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 12 according to the first embodiment. This is a cross-sectional view showing an example manufacturing process for the display device of Embodiment 1 according to the first embodiment. This is a cross-sectional view showing an example manufacturing process for the display device of Embodiment 8 according to the first embodiment. This is a cross-sectional view showing an example of the manufacturing process of the display device of Embodiment 12 according to the first embodiment. This is a plan view showing a detailed configuration example of the display device of Embodiment 12 according to the first embodiment. This is a first cross-sectional view showing a detailed configuration example of the display device of Embodiment 12 according to the first embodiment. This is a second cross-sectional view showing a detailed configuration example of the display device of Embodiment 12 according to the first embodiment. This is a plan view showing a detailed configuration example of the display device of Embodiment 8 according to the first embodiment. This is a first cross-sectional view showing a detailed configuration example of the display device of Embodiment 8 according to the first embodiment. This is a second cross-sectional view showing a detailed configuration example of the display device of Embodiment 8 according to the first embodiment. This is a plan view showing a detailed configuration example of the display device of Embodiment 9 according to the first embodiment. This is a first cross-sectional view showing a detailed configuration example of the display device of Embodiment 9 according to the first embodiment. This is a plan view showing a detailed configuration example of the display device of Embodiment 1 according to the first embodiment.This is a first cross-sectional view showing a detailed configuration example of the display device of Embodiment 1 according to the first embodiment. This is a second cross-sectional view showing a detailed configuration example of the display device of Embodiment 1 according to the first embodiment. This is a cross-sectional view showing a detailed manufacturing process example of the display device of Embodiment 12 according to the first embodiment. This is a cross-sectional view showing a detailed manufacturing process example of the display device of Embodiment 8 according to the first embodiment. This is a cross-sectional view showing a detailed manufacturing process example of the display device of Embodiment 9 according to the first embodiment. This is a diagram showing the characteristics of various potting resins according to the first embodiment. This is a diagram showing an example of the configuration of the display unit according to the first embodiment. This is a diagram showing an example of the configuration of the pixel circuit according to the first embodiment. This is a cross-sectional view showing an example of the configuration of the pixel according to the first embodiment. This is a plan view showing an example of the configuration of the display device of Embodiment 1 according to the second embodiment. This is a side view showing an example of the configuration of the display device of Embodiment 1 according to the second embodiment. This is a first cross-sectional view showing an example of the configuration of the display device of Embodiment 1 according to the second embodiment. This is a second cross-sectional view showing an example of the configuration of the display device of Embodiment 1 according to the second embodiment. This is a plan view showing an example of the configuration of the display device of Embodiment 2 according to the second embodiment. This is a cross-sectional view showing an example of the configuration of the display device of Embodiment 2 according to the second embodiment. This is a plan view showing an example of the configuration of the display device of Embodiment 3 according to the second embodiment. This is a plan view showing an example of the configuration of the display device of Embodiment 4 according to the second embodiment. This is a side view showing an example configuration of the display device of Embodiment 4 according to the second embodiment. This is a plan view showing an example configuration of the display device of Embodiment 5 according to the second embodiment. This is a side view showing an example configuration of the display device of Embodiment 5 according to the second embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 5 according to the second embodiment. This is a plan view showing an example configuration of the display device of Embodiment 6 according to the second embodiment. This is a side view showing an example configuration of the display device of Embodiment 6 according to the second embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 6 according to the second embodiment. This is a plan view showing an example configuration of the display device of Embodiment 7 according to the second embodiment. This is a side view showing an example configuration of the display device of Embodiment 7 according to the second embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 7 according to the second embodiment. This is a cross-sectional view showing an example manufacturing process for the display device of Embodiment 1 according to the second embodiment. This is a cross-sectional view showing an example manufacturing process for the display device of Embodiment 1 according to the second embodiment.This figure shows the amount of warping of potting resin only, the amount of warping without a rigid material, and the amount of warping with a rigid material according to the second embodiment. This figure illustrates the warping of potting resin only according to the second embodiment. This figure illustrates the warping with a rigid material according to the second embodiment. This figure illustrates the device structure without a rigid material according to the second embodiment. This figure shows the properties of the material for the reinforcing plate or rigid material according to the second embodiment. This figure shows the relationship between the reinforcing plate and the maximum principal stress of silicon according to the second embodiment, with potting resin only, without a rigid material, and with various rigid materials. This is a front view showing an example of the appearance of a digital still camera. This is a rear view showing an example of the appearance of a digital still camera. This figure shows an example of the appearance of a head-mounted display. This figure shows an example of the appearance of a see-through head-mounted display. This figure shows an example of the appearance of a television device. This figure shows an example of the appearance of a smartphone. This figure shows an example of the internal configuration of an automobile. This figure shows an example of the internal configuration of an automobile.

[0009] Embodiments of this disclosure will be described in detail below with reference to the drawings. Embodiments include examples and modifications. However, the technology relating to this disclosure is not limited by the embodiments. In addition, redundant descriptions are omitted by denoting the same reference numerals for essentially the same parts in the embodiments.

[0010] This disclosure will be described in the following order of items: 1. First Embodiment 1-1. Example of Display Device Configuration 1-2. Example of Display Device Manufacturing Process 1-3. Detailed Example of Display Device Configuration 1-4. Detailed Example of Display Device Manufacturing Process 1-5. Examples of Characteristics of Various Potting Resins 1-6. Example of Display Unit Configuration 2. Second Embodiment 2-1. Example of Display Device Configuration 2-2. Example of Display Device Manufacturing Process 2-3. Example of Reducing Warpage of Display Device 2-4. Examples of Materials for Reinforcement Plates and Rigid Materials 3. Overview 4. Other Embodiments 5. Application Examples 6. Notes

[0011] <1. First Embodiment> <1-1. Example of Display Device Configuration> Example of the configuration of the display device 1 in each of the first embodiment 1 to 12 will be described with reference to Figures 1 to 15.

[0012] (Example 1) Figure 1 is a plan view showing an example configuration of the display device 1 of Example 1 according to the first embodiment. Figure 2 is a cross-sectional view (cross-sectional view along line A1-A1 in Figure 1) showing an example configuration of the display device 1 of Example 1 according to the first embodiment.

[0013] As shown in Figures 1 and 2, the display device 1 of Embodiment 1 comprises a display unit 10, a flexible printed circuit board (FPC) 20, a reinforcing plate 30 (see Figure 2), and a sealing material 40. The display unit 10 and the flexible circuit board 20 are integrated by the reinforcing plate 30. The display device 1 is an example of a display module.

[0014] The display unit 10 comprises a substrate 11 and a light-transmitting substrate 12. This display unit 10 is, for example, a microdisplay including an OLED (organic light-emitting diode). The display unit 10 is an example of a display panel.

[0015] The substrate 11 is provided on the upper surface of the reinforcing plate 30 (see Figure 2). For example, the substrate 11 incorporates elements and wiring for displaying images. This substrate 11 is made of, for example, a semiconductor substrate.

[0016] Furthermore, the substrate 11 has a pad portion 11a (see Figure 2). The pad portion 11a functions as a member that realizes an electrical connection between the display unit 10 and the flexible substrate 20. The pad portion 11a is composed of, for example, a plurality of pads (a group of pads). These pads are, for example, provided in a row in a predetermined direction (for example, the Y-axis direction) at the edge of the upper surface of the substrate 11. The pads are an example of external electrodes.

[0017] The translucent substrate 12 is fixed to the upper surface of the substrate 11, avoiding the pad portion 11a on the substrate 11. This translucent substrate 12 functions as a protective member that protects the substrate 11. The translucent substrate 12 is made of, for example, glass or a resin substrate.

[0018] The flexible substrate 20 is positioned next to the display unit 10 on the reinforcing plate 30 and is provided on the upper surface of the reinforcing plate 30 (see Figure 2). This flexible substrate 20 functions as a pull-out substrate for wiring and the like. The flexible substrate 20 is made of, for example, polyimide, modified polyimide, liquid crystal polymer, or fluororesin.

[0019] Furthermore, the flexible substrate 20 has a connection portion 21 (see Figure 2) and a connector portion 22. The end of the flexible substrate 20 on the connection portion 21 side is fixed to the upper surface of the reinforcing plate 30.

[0020] The connection portion 21 is provided at the end of the flexible substrate 20 on the display unit 10 side of the upper surface. The connection portion 21 functions as a component that realizes an electrical connection between the display unit 10 and the flexible substrate 20. The connection portion 21 is composed of, for example, a plurality of connection terminals. These connection terminals are provided, for example, in a row in a predetermined direction (for example, the Y-axis direction) at the end of the upper surface of the flexible substrate 20.

[0021] The connector portion 22 is provided on the upper surface of the flexible substrate 20 at the end opposite to the display portion 10. The connector portion 22 functions as a component that enables electrical connection between the flexible substrate 20 and an external device. Various types of connectors can be used as the connector portion 22.

[0022] Furthermore, it is desirable that the wiring of the flexible substrate 20 is made of, for example, Cu, and that the surface of the wiring is coated with, for example, Ni and Au. For example, a Ni layer may be formed on the surface of the wiring, and an Au layer may be formed on the Ni layer.

[0023] The reinforcing plate 30 supports the display unit 10 and the flexible substrate 20. This reinforcing plate 30 functions as a reinforcing member that supports and reinforces the display unit 10 and the flexible substrate 20. The display unit 10 and a part of the flexible substrate 20 are fixed to the upper surface of the reinforcing plate 30 with an adhesive such as resin.

[0024] This reinforcing plate 30 is made of, for example, a metal plate such as Al or SUS, or a glass epoxy substrate, a ceramic plate, or an engineering plastic such as PEEK (polyether ether ketone) or PAI (polyamide imide).

[0025] Furthermore, for example, when the display unit 10 is performing a display, the display unit 10 generates heat. In order to efficiently dissipate this heat to the outside, it is desirable that the reinforcing plate 30 be made of a material with thermal resistance, such as a metal plate or ceramic. Also, considering the stress on the display unit 10 due to temperature cycles, it is desirable that the reinforcing plate 30 be made of an Fe / Ni alloy such as 42Alloy or a ceramic, which has a similar linear expansion to the display unit 10.

[0026] The planar area of ​​the reinforcing plate 30 (area in a plan view in the XY plane) should be larger than the planar area of ​​the display unit 10 and preferably include the planar area of ​​the edge of the flexible substrate 20 (for example, at least the planar area of ​​the connection portion 21 of the flexible substrate 20). Furthermore, the thickness of the reinforcing plate 30 (length in the Z-axis direction) should preferably be thinner than the display unit 10 (for example, the substrate 11) and thicker than the thickness of the flexible substrate 20.

[0027] Here, the display unit 10 and the flexible substrate 20 are electrically connected by wires 13. More specifically, the pad portion 11a of the display unit 10 and the connection portion 21 of the flexible substrate 20 are electrically connected by wires 13. Each pad of the pad portion 11a is electrically connected to each connection terminal of the connection portion 21 by wires 13. Therefore, multiple wires 13 exist along the extension direction (Y-axis direction) of the pad portion 11a and the connection portion 21, respectively. The wires 13 are made of metals such as Au, Al, Ag, and Cu.

[0028] The sealing material 40 comprises a dam resin 41 and a potting resin 42. This sealing material 40 functions as a sealing member that covers and seals each wire 13 that electrically connects the display unit 10 and the flexible substrate 20. In addition to the wires 13, the sealing material 40 also covers and seals the pad portion 11a and the connection portion 21.

[0029] The dam resin 41 is provided in a region including the pad portion 11a and the connection portion 21 on the upper surface of the substrate 11 of the display unit 10 and on the upper surface of the flexible substrate 20. The dam resin 41 is formed, for example, in an annular shape in plan view (see FIG. 1). In the example of FIG. 1, the dam resin 41 is formed in a rectangular annular shape. The dam resin 41 is an example of the first resin.

[0030] The potting resin 42 is provided in a region surrounded by the annular dam resin 41. For example, the potting resin 42 is supplied to and provided in a region surrounded by the annular dam resin 41. In the example of FIG. 1, the potting resin 42 is formed in a rectangular annular shape. The potting resin 42 is an example of the second resin.

[0031] As the dam resin 41 and the potting resin 42, various resins such as epoxy resins or silicone resins are used, for example. It is desirable that the dam resin 41 be a resin having a higher viscosity than the viscosity of the potting resin 42. Also, as the potting resin 42, it is desirable that a resin having a low viscosity be used so as to enter the gaps between the respective wires 13.

[0032] According to such Example 1, the display unit 10 and the flexible substrate 20 are supported by the same reinforcing plate 30 and integrated. Thereby, it is possible to suppress the wire 13 that electrically connects the display unit 10 and the flexible substrate 20 from being damaged by an external force or the like applied to the display unit 10 or the flexible substrate 20. Therefore, the reliability of the wire 13, that is, the reliability of the display device 1 (device reliability) can be improved. Also, since connection by wire bonding is used, the size of the pad portion 11a can be made smaller compared to connection by an anisotropic conductive film (ACF), and miniaturization of the display unit 10 and improvement of transmission characteristics (for example, improvement of transmission speed) can also be achieved.

[0033] Further, the dam resin 41 of the sealing material 40 is formed in an annular shape in plan view. Thereby, since the region where the potting resin 42 is applied is surrounded by the annular dam resin 41, a resin having a low viscosity can be used as the potting resin 42.

[0034] Note that the width in the short side direction of the straight line (length in the X-axis direction) of the annular dam resin 41 may or may not be constant. In the example of FIG. 1, in the rectangular dam resin 41, the width in the short side direction of the straight line extending in the Y-axis direction provided on the upper surface of the flexible substrate 20 is wider than the width in the short side direction of the straight line extending in the Y-axis direction provided on the upper surface of the substrate 11, but it is not limited thereto. Also, in the rectangular dam resin 41, the widths in the short side direction (length in the Y-axis direction) of the two sides extending in the X-axis direction are the same, but it is not limited thereto.

[0035] Also, although the dam resin 41 is formed so as to cover the pad portion 11a and the connection portion 21 (see FIG. 2), for example, it may be formed so as to cover only one of the pad portion 11a and the connection portion 21, or may be formed so as not to cover both the pad portion 11a and the connection portion 21. However, in the former case, the potting resin 42 will cover one of the pad portion 11a and the connection portion 21, and in the latter case, the potting resin 42 will cover both the pad portion 11a and the connection portion 21.

[0036] (Example 2) FIG. 3 is a cross-sectional view showing a configuration example of the display device 1 according to Example 2 of the first embodiment. The difference between this Example 2 and the aforementioned Example 1 (see FIG. 2) is that the display portion 10 is provided on the flexible substrate 20.

[0037] As shown in FIG. 3, in the display device 1 of Example 2, the display portion 10 is provided on the upper surface of the flexible substrate 20. That is, the flexible substrate 20 extends to the lower surface of the display portion 10.

[0038] According to such an Example 2, since the flexible substrate 20 exists between the display portion 10 and the reinforcing plate 30, the stress due to the difference in linear expansion between the display portion 10 and the reinforcing plate 30 can be suppressed.

[0039] Furthermore, the same effects as in Example 1 can be obtained in Example 2 (for example, improving the reliability of the device). The same applies to Examples 3 to 12 below, and the same effects as in Example 1 can be obtained in Examples 3 to 12.

[0040] (Example 3) Figure 4 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 3 according to the first embodiment. The difference between this Example 3 and the aforementioned Example 2 (see Figure 3) is the connection structure using wire bonding.

[0041] As shown in Figure 4, in the display device 1 of Embodiment 3, two pad portions 11a are provided on the upper surface of the substrate 11 so as to sandwich the translucent substrate 12 on the substrate 11. In addition, two connection portions 21 are provided on the upper surface of the flexible substrate 20 so as to sandwich the display portion 10 on the flexible substrate 20. Each pad portion 11a and each connection portion 21 are electrically connected by a plurality of wires 13. Each wire 13 is covered and sealed by a plurality of sealing materials 40.

[0042] According to this embodiment 3, for example, as a countermeasure against IR drop, it becomes possible to supply power from both sides of the display unit 10, thereby stabilizing the power supply to the display unit 10.

[0043] (Example 4) Figure 5 is a cross-sectional view showing an example of the configuration of the display device 1 according to Example 4 of the first embodiment. The difference between this Example 4 and the aforementioned Example 1 (see Figure 2) is the cross-sectional shape of the reinforcing plate 30.

[0044] As shown in Figure 5, in the display device 1 of Embodiment 4, the reinforcing plate 30 has a protrusion 31. The protrusion 31 is formed at the end of the reinforcing plate 30. In the example of Figure 5, the cross-sectional shape of the reinforcing plate 30 having the protrusion 31 is L-shaped. The end of the flexible substrate 20 on the connection portion 21 side is fixed to the upper surface of the protrusion 31.

[0045] The height position (position in the Z-axis direction) of the upper surface of the protrusion 31 is lower than the height position of the upper surface of the substrate 11 on the reinforcing plate 30. For example, in order to reduce the length of the wire 13, it is desirable that the height position of the upper surface of the flexible substrate 20 on the reinforcing plate 30 and the height position of the upper surface of the substrate 11 on the reinforcing plate 30 are the same.

[0046] In this embodiment 4, a protrusion 31 is formed on the reinforcing plate 30. This allows the end of the flexible substrate 20 on the connection portion 21 side to be placed on the upper surface of the protrusion 31, thereby shortening the distance between the connection portion 21 and the pad portion 11a. As a result, the length of the wire 13 can be reduced, thereby improving the transmission characteristics.

[0047] (Example 5) Figure 6 is a cross-sectional view showing an example of the configuration of the display device 1 according to Example 5 of the first embodiment. The difference between this Example 5 and the aforementioned Example 4 (see Figure 5) is the height position of the upper surface of the protrusion 31.

[0048] As shown in Figure 6, in the display device 1 of Embodiment 5, the height position (position in the Z-axis direction) of the upper surface of the flexible substrate 20 on the protrusion 31 is higher than the height position of the upper surface of the substrate 11 on the reinforcing plate 30. For example, the height position (position in the Z-axis direction) of the upper surface of the protrusion 31 is higher than the height position of the upper surface of the substrate 11 on the reinforcing plate 30.

[0049] According to this embodiment 5, the presence of the protrusion 31 allows for the same effects as in the above-described embodiment 4 (for example, improved transmission characteristics). Furthermore, if downward bonding (bonding from a high position to a low position) is appropriate in wire bonding, downward bonding can be achieved.

[0050] (Example 6) Figure 7 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 6 according to the first embodiment. Figure 8 is a plan view of the back side showing an example of the configuration of the display device 1 in Example 6 according to the first embodiment. The difference between this Example 6 and the aforementioned Example 1 (see Figure 2) is the planar size of the reinforcing plate 30.

[0051] As shown in Figures 7 and 8, in the display device 1 of Embodiment 6, the planar size of the reinforcing plate 30 is smaller than that of Embodiment 1, and only the end of the display unit 10 on the pad portion 11a side is provided on the upper surface of the reinforcing plate 30. In other words, only a part of the lower surface (back surface) of the display unit 10 is covered by the reinforcing plate 30, and the rest of that lower surface is not covered by the reinforcing plate 30.

[0052] In this embodiment 6, only a portion of the lower surface of the display unit 10 is covered by the reinforcing plate 30. This makes it possible to provide a heat dissipation member such as a heat sink in the area of ​​the lower surface of the display unit 10 that is not covered by the reinforcing plate 30, thereby improving heat dissipation.

[0053] (Example 7) Figure 9 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 7 according to the first embodiment. Figure 10 is a plan view of the back side showing an example of the configuration of the display device 1 in Example 7 according to the first embodiment. The difference between this Example 7 and the aforementioned Example 1 (see Figure 2) is the planar shape of the reinforcing plate 30.

[0054] As shown in Figures 9 and 10, in the display device 1 of Embodiment 7, the reinforcing plate 30 has an opening 32. The opening 32 is formed at a position facing the substrate 11 of the display unit 10. This opening 32 is a through hole. In the example of Figure 10, the planar shape of the opening 32 is rectangular. Only a part of the lower surface (back surface) of the display unit 10 is covered by the reinforcing plate 30, and the other part of the lower surface is not covered by the reinforcing plate 30. The other part is exposed by the opening 32.

[0055] According to this embodiment 7, the same effects as in the aforementioned embodiment 6 (for example, improved heat dissipation) can be obtained.

[0056] (Example 8) Figure 11 is a plan view showing an example of the configuration of the display device 1 in Example 8 according to the first embodiment. The difference between this Example 8 and the aforementioned Example 1 (see Figure 1) is the planar shape of the dam resin 41.

[0057] As shown in Figure 11, in the display device 1 of Embodiment 8, the dam resin 41 is provided on the upper surface of the substrate 11. This dam resin 41 is formed in a straight line shape that extends in the Y-axis direction.

[0058] According to this embodiment 8, the presence of the dam resin 41 can prevent the potting resin 42 from flowing out to the translucent substrate 12 side of the display unit 10. In addition, the width of the potting resin 42 in the X-axis direction can be reduced.

[0059] (Example 9) Figure 12 is a plan view showing an example of the configuration of the display device 1 in Example 9 according to the first embodiment. The difference between this Example 9 and the aforementioned Example 1 (see Figure 1) is the planar shape of the dam resin 41.

[0060] As shown in Figure 12, in the display device 1 of Embodiment 9, two dam resins 41 are provided on the upper surface of the substrate 11 and the upper surface of the flexible substrate 20. One dam resin 41 is provided on the upper surface of the substrate 11, and the other dam resin 41 is provided on the upper surface of the flexible substrate 20. Each of the two dam resins 41 is formed in a straight line shape extending in the Y-axis direction. In the example of Figure 12, the dam resins 41 are parallel.

[0061] According to this embodiment 9, the same effects as in the above-described embodiment 8 can be obtained. Furthermore, since it becomes possible to suppress the spreading of the potting resin 42 on the flexible substrate 20, the width of the potting resin 42 in the X-axis direction can be further reduced.

[0062] (Example 10) Figure 13 is a plan view showing an example of the configuration of the display device 1 in Example 10 according to the first embodiment. The difference between this Example 10 and the aforementioned Example 9 (see Figure 12) is the stretching direction of the two dam resins 41.

[0063] As shown in Figure 13, in the display device 1 of Embodiment 10, two dam resins 41 are provided across the upper surface of the substrate 11 and the upper surface of the flexible substrate 20. The two dam resins 41 are provided at both ends in the Y-axis direction on the upper surface of the substrate 11 and the upper surface of the flexible substrate 20. Each of these dam resins 41 is formed in a straight line shape extending in the X-axis direction. In the example of Figure 13, each dam resin 41 is parallel.

[0064] According to this embodiment 10, the presence of the two dam resins 41 prevents the potting resin 42 from flowing from the upper surface of the substrate 11 or the upper surface of the flexible substrate 20 to the lower surface of the substrate 11 or the lower surface of the flexible substrate 20 via their respective sides.

[0065] (Example 11) Figure 14 is a plan view showing an example of the configuration of the display device 1 in Example 11 according to the first embodiment. The difference between this Example 11 and the aforementioned Example 10 (see Figure 13) is the planar shape of the dam resin 41.

[0066] As shown in Figure 14, in the display device 1 of Example 11, the dam resin 41 is formed in a U-shape when viewed from above. In other words, Example 11 is a combination of the aforementioned Example 8 and Example 10.

[0067] According to this embodiment 11, the same effects as those of the aforementioned embodiment 8 and embodiment 10 can be obtained.

[0068] (Example 12) Figure 15 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 12 according to the first embodiment. The difference between this Example 12 and the aforementioned Example 1 (see Figure 2) is the configuration of the sealing material 40.

[0069] As shown in Figure 15, in the display device 1 of Embodiment 12, the sealing material 40 is composed solely of potting resin 42. The sealing material 40 covers the wire 13, as well as the pad portion 11a and the connecting portion 21.

[0070] According to this embodiment 12, the structure of the sealing material 40 can be simplified.

[0071] <1-2. Example of Manufacturing Process for Display Device> An example of the manufacturing process for the display device 1 according to the first embodiment will be described with reference to Figures 16 to 18.

[0072] (Example of manufacturing process for the display device of Example 1) Figure 16 is a cross-sectional view showing an example of the manufacturing process for the display device 1 (see Figure 2) of Example 1 according to the first embodiment.

[0073] As shown in Figure 16, in step S11, the flexible substrate 20 is fixed to the upper surface of the reinforcing plate 30 with an adhesive such as resin. For example, the end of the flexible substrate 20 on the connection portion 21 side is fixed to the upper surface of the reinforcing plate 30.

[0074] In step S12, the display unit 10 is fixed to the upper surface of the reinforcing plate 30 by die bonding material, avoiding the flexible substrate 20 on the reinforcing plate 30. The die bonding material may be, for example, a paste or a film.

[0075] Furthermore, when using a Si substrate as the substrate 11 of the display unit 10 and a metal plate as the reinforcing plate 30, it is desirable that the elastic modulus of the die bond material be 0.01 GPa or less in order to reduce the stress caused by the difference in linear expansion between the display unit 10 and the reinforcing plate 30.

[0076] In step S13, the display unit 10 on the reinforcing plate 30 is electrically connected to the flexible substrate 20 on the reinforcing plate 30 by wire bonding. For example, the pad portion 11a of the display unit 10 and the connection portion 21 of the flexible substrate 20 are electrically connected by a wire 13.

[0077] Here, the bonding direction can be either downward (bonding from a high position to a low position) or upward (bonding from a low position to a high position). However, in order to shorten the distance between the pad portion 11a on the substrate 11 and the translucent substrate 12 (for example, to miniaturize the device), it is preferable for the bonding direction to be upward. Also, from the viewpoint of coverage by the potting resin 42, it is preferable that the height position of the wire loop 13 be 150 μm or less from the top surface of the substrate 11.

[0078] In step S14, the dam resin 41 is applied to the upper surfaces of the display unit 10 and the flexible substrate 20 so as to surround a predetermined area of ​​the display unit 10 and the flexible substrate 20 on the reinforcing plate 30. The dam resin 41 is applied in a ring shape when viewed from above.

[0079] In step S15, potting resin 42 is supplied to a predetermined area surrounded by the ring-shaped dam resin 41, and curing (heating) is performed. The supply of potting resin 42 forms a sealing material 40, and the wire 13 is covered and sealed with the sealing material 40 together with the pad portion 11a and the connecting portion 21. This completes the display device 1 of Embodiment 1.

[0080] Furthermore, the flow of the potting resin 42 may be suppressed or adjusted by the planar shape of the dam resin 41. For example, by partially drawing the dam resin 41 in predetermined areas of the display unit 10 and the flexible substrate 20, the flow of the potting resin 42 may be suppressed only in the necessary areas.

[0081] (Example of manufacturing process for the display device of Example 8) Figure 17 is a cross-sectional view showing an example of the manufacturing process for the display device 1 of Example 8 (see Figure 11) according to the first embodiment. This example of the manufacturing process includes the steps S11 to S13 described above, but in the example of Figure 17, steps S21 to S22 from step S13 onwards are shown.

[0082] As shown in Figure 17, in step S21, the dam resin 41 is applied to the upper surface of the display unit 10 on the reinforcing plate 30 so as to cover the pad portion 11a of the display unit 10. The dam resin 41 is applied in a straight line in the Y-axis direction.

[0083] In step S22, potting resin 42 is supplied to the upper surface of the flexible substrate 20 on the reinforcing plate 30 so as to cover the wire 13, and curing (heating) is performed. The supply of potting resin 42 forms a sealing material 40, and the wire 13 is covered and sealed with the sealing material 40 together with the pad portion 11a and the connecting portion 21. This completes the display device 1 of Example 8.

[0084] (Example of manufacturing process for the display device of Example 12) Figure 18 is a cross-sectional view showing an example of the manufacturing process for the display device 1 of Example 12 (see Figure 15) according to the first embodiment. This example of the manufacturing process includes the steps S11 to S13 described above, but in the example of Figure 18, step S31 is shown from step S13 onwards.

[0085] As shown in Figure 18, in step S31, potting resin 42 is supplied to a predetermined area on the upper surface of the substrate 11 and the flexible substrate 20, and curing (heating) is performed. The supply of potting resin 42 forms a sealing material 40, and the wire 13 is covered and sealed with the sealing material 40 together with the pad portion 11a and the connection portion 21. This completes the display device 1 of Example 12.

[0086] <1-3. Detailed Configuration Example of Display Device> A detailed configuration example of the display device 1 according to the first embodiment will be described with reference to Figures 19 to 30.

[0087] (Detailed Configuration Example of the Display Device of Example 12) Figure 19 is a plan view showing a detailed configuration example of the display device 1 of Example 12 according to the first embodiment. Figure 20 is a first cross-sectional view (cross-sectional view along line B1-B1 in Figure 19) showing a detailed configuration example of the display device 1 of Example 12 according to the first embodiment. Figure 21 is a second cross-sectional view (cross-sectional view along line B2-B2 in Figure 19) showing a detailed configuration example of the display device 1 of Example 12 according to the first embodiment.

[0088] As shown in Figure 19, the pad portion 11a and the connecting portion 21 are connected by a plurality of wires 13. These wires 13 are covered with a sealing material 40. This sealing material 40 is made of potting resin 42. In addition to the wires 13, the pad portion 11a and the connecting portion 21 are also covered with the sealing material 40.

[0089] As shown in Figure 20, the display unit 10 is fixed to the reinforcing plate 30 by a die bond material 10a. The flexible substrate 20 is fixed to the reinforcing plate 30 by an adhesive 20a. Various resins can be used as the die bond material 10a and the adhesive 20a, for example.

[0090] Here, the substrate 11 of the display unit 10 and the flexible substrate 20 are separated by a predetermined distance (for example, several hundred micrometers). Therefore, the sealing material 40 (for example, potting resin 42) is in contact with the upper surface of the reinforcing plate 30. This structure is similar in other embodiments as well.

[0091] The sealing material 40, i.e., the potting resin 42, does not come into contact with the translucent substrate 12 and is separated from it. This prevents the deterioration of the image quality and reliability of the display device 1 due to contact between the potting resin 42 and the translucent substrate 12.

[0092] Furthermore, it is possible to separate the potting resin 42 and the translucent substrate 12 from each other by adjusting the viscosity of the potting resin 42, or by controlling the wettability of the surface of the pad portion 11a and the surface of the substrate 11 through plasma treatment or chemical surface modification treatment.

[0093] As shown in Figure 21, both ends of the potting resin 42 in the Y-axis direction (both ends in the longitudinal direction) are formed to be curved surfaces M1. In the example in Figure 21, the wire 13 is not shown. The curved surface M1 is, for example, a curved surface that curves outward from the potting resin 42. Because the corners of the sealing material 40 are rounded by this curved surface M1, the stress on the sealing material 40 can be reduced.

[0094] Furthermore, the potting resin 42 does not protrude from the reinforcing plate 30, and the length (width) of the potting resin 42 in the Y-axis direction is less than or equal to the length (width) of the upper surface of the reinforcing plate 30 in the Y-axis direction (see Figure 21). In other words, the potting resin 42 is located inside the upper surface of the reinforcing plate 30.

[0095] (Detailed Configuration Example of the Display Device of Example 8) Figure 22 is a plan view showing a detailed configuration example of the display device 1 of Example 8 according to the first embodiment. Figure 23 is a first cross-sectional view (cross-sectional view along line C1-C1 in Figure 22) showing a detailed configuration example of the display device 1 of Example 8 according to the first embodiment. Figure 24 is a second cross-sectional view (cross-sectional view along line C2-C2 in Figure 22) showing a detailed configuration example of the display device 1 of Example 8 according to the first embodiment.

[0096] As shown in Figure 22, the pad portion 11a and the connecting portion 21 are connected by a plurality of wires 13, as described above. These wires 13 are covered with a sealing material 40. The sealing material 40 is composed of dam resin 41 and potting resin 42. The dam resin 41 is provided on the upper surface of the substrate 11 and is formed in a straight line shape extending in the Y-axis direction. In addition to the wires 13, the pad portion 11a and the connecting portion 21 are also covered with the sealing material 40.

[0097] As shown in Figure 23, the display unit 10 is fixed to the reinforcing plate 30 by die bond material 10a, as described above. The flexible substrate 20 is fixed to the reinforcing plate 30 by adhesive 20a. Various resins can be used as the die bond material 10a and adhesive 20a, for example.

[0098] The sealing material 40, i.e., the dam resin 41, does not come into contact with the translucent substrate 12 and is spaced apart from it. This prevents a decrease in the image quality and reliability of the display device 1 due to contact between the dam resin 41 and the translucent substrate 12.

[0099] Furthermore, it is desirable that the height position (position in the Z-axis direction) of the dam resin 41 be higher than the height position of the upper end of the wire 13, for example, and lower than or equal to the height position of the upper surface of the translucent substrate 12.

[0100] As shown in Figure 24, both ends of the potting resin 42 in the Y-axis direction are formed to be curved surfaces M1, as described above. In the example in Figure 24, the wire 13 is not shown. The curved surface M1 is, for example, a curved surface that curves outward from the potting resin 42. Similar to the potting resin 42, both ends of the dam resin 41 in the Y-axis direction are also formed to be curved surfaces. As a result, the corners of the sealing material 40 are rounded, which reduces the stress on the sealing material 40.

[0101] Although both ends of the potting resin 42 and the dam resin 41 are formed to be curved, it is also possible for only one end of the potting resin 42 or the dam resin 41 to be curved.

[0102] (Detailed Configuration Example of the Display Device of Example 9) Figure 25 is a plan view showing a detailed configuration example of the display device 1 of Example 9 according to the first embodiment. Figure 26 is a first cross-sectional view (cross-sectional view along line D1-D1 in Figure 25) showing a detailed configuration example of the display device 1 of Example 9 according to the first embodiment. Figure 27 is a second cross-sectional view (cross-sectional view along line D2-D2 in Figure 25) showing a detailed configuration example of the display device 1 of Example 9 according to the first embodiment.

[0103] As shown in Figure 25, the pad portion 11a and the connecting portion 21 are connected by a plurality of wires 13, as described above. These wires 13 are covered with a sealing material 40. The sealing material 40 is composed of two dam resins 41 and a potting resin 42. One dam resin 41 is provided on the upper surface of the substrate 11, and the other dam resin 41 is provided on the upper surface of the flexible substrate 20. Each of the two dam resins 41 is formed in a straight line shape extending in the Y-axis direction. In addition to the wires 13, the pad portion 11a and the connecting portion 21 are also covered with the sealing material 40.

[0104] As shown in Figure 26, the display unit 10 is fixed to the reinforcing plate 30 by die bond material 10a, as described above. The flexible substrate 20 is fixed to the reinforcing plate 30 by adhesive 20a. Various resins can be used as the die bond material 10a and adhesive 20a, for example.

[0105] The sealing material 40, i.e., the dam resin 41, does not come into contact with the translucent substrate 12 and is spaced apart from it. This prevents a decrease in the image quality and reliability of the display device 1 due to contact between the dam resin 41 and the translucent substrate 12.

[0106] As shown in Figure 27, both ends of the potting resin 42 in the Y-axis direction are formed to be curved surfaces M1, as described above. In the example in Figure 27, the wire 13 is not shown. The curved surface M1 is, for example, a curved surface that curves outward from the potting resin 42. Similar to the potting resin 42, both ends of the dam resin 41 in the Y-axis direction are also formed to be curved surfaces. As a result, the corners of the sealing material 40 are rounded, which reduces the stress on the sealing material 40.

[0107] The viscosity of the dam resin 41 applied to the display unit 10 and the viscosity of the dam resin 41 applied to the flexible substrate 20 may be the same or different. For example, the viscosity of the dam resin 41 applied to the flexible substrate 20 may be higher than the viscosity of the dam resin 41 applied to the display unit 10.

[0108] Furthermore, the width in the short direction (length in the X-axis direction) of the dam resin 41 applied to the display unit 10 and the width in the short direction of the dam resin 41 applied to the flexible substrate 20 may be the same or different. For example, the width (thickness) in the short direction of the dam resin 41 applied to the flexible substrate 20 may be wider than the width in the short direction of the dam resin 41 applied to the display unit 10.

[0109] Furthermore, the height (length in the Z-axis direction) of the dam resin 41 applied to the display unit 10 and the height of the dam resin 41 applied to the flexible substrate 20 may be the same or different. For example, the height of the dam resin 41 applied to the flexible substrate 20 may be higher than the height of the dam resin 41 applied to the display unit 10.

[0110] (Detailed Configuration Example of the Display Device of Example 1) Figure 28 is a plan view showing a detailed configuration example of the display device 1 of Example 1 according to the first embodiment. Figure 29 is a first cross-sectional view (cross-sectional view along line E1-E1 in Figure 28) showing a detailed configuration example of the display device 1 of Example 1 according to the first embodiment. Figure 30 is a second cross-sectional view (cross-sectional view along line E2-E2 in Figure 28) showing a detailed configuration example of the display device 1 of Example 1 according to the first embodiment.

[0111] As shown in Figure 28, the pad portion 11a and the connecting portion 21 are connected by a plurality of wires 13, as described above. These wires 13 are covered with a sealing material 40. The sealing material 40 is composed of dam resin 41 and potting resin 42. The dam resin 41 is provided in a predetermined area including a part of the upper surface of the substrate 11, the flexible substrate 20, and the reinforcing plate 30. The dam resin 41 is formed in a rectangular ring shape in plan view. In addition to the wires 13, the pad portion 11a and the connecting portion 21 are also covered with the sealing material 40.

[0112] As shown in Figure 29, the display unit 10 is fixed to the reinforcing plate 30 by die bond material 10a, as described above. The flexible substrate 20 is fixed to the reinforcing plate 30 by adhesive 20a. Various resins can be used as the die bond material 10a and adhesive 20a, for example.

[0113] The sealing material 40, or dam resin 41, does not come into contact with the translucent substrate 12, as described above, and is spaced apart from the translucent substrate 12. This prevents a decrease in the image quality and reliability of the display device 1 due to contact between the dam resin 41 and the translucent substrate 12.

[0114] As shown in Figure 30, both ends of the dam resin 41 in the Y-axis direction are formed to be curved surfaces M1, as described above. In the example of Figure 30, the wire 13 is not shown. The curved surface M1 is, for example, a curved surface that curves outward from the dam resin 41. Because the corners of the sealing material 40 are rounded by this curved surface M1, the stress on the sealing material 40 can be reduced.

[0115] As described in each of the above-mentioned embodiments 1 to 12, the sealing material 40 is composed of, for example, one type (potting resin 42) or two types of resin (dam resin 41 and potting resin 42), but it may also be composed of three or more types of resin. For example, the dam resin 41 may be composed of several types of resin, and the potting resin 42 may also be composed of several types of resin.

[0116] <1-4. Detailed Manufacturing Process Example of the Display Device> A detailed manufacturing process example of the display device 1 according to the first embodiment will be described with reference to Figures 31 to 33.

[0117] (Detailed manufacturing process example of the display device of Example 12) Figure 31 is a cross-sectional view showing a detailed manufacturing process example of the display device 1 of Example 12 (see Figure 20) according to the first embodiment.

[0118] As shown in Figure 31, in step S41, the flexible substrate 20 is fixed to the upper surface of the reinforcing plate 30 by adhesive 20a. For example, the end of the flexible substrate 20 on the connection portion 21 side is fixed to the upper surface of the reinforcing plate 30 via adhesive 20a. Various resins can be used as the adhesive 20a.

[0119] In step S42, the display unit 10 is fixed to the upper surface of the reinforcing plate 30 by die bond material 10a, avoiding the flexible substrate 20 on the reinforcing plate 30. Various resins can be used as the die bond material 10a.

[0120] In step S43, the display unit 10 on the reinforcing plate 30 is electrically connected to the flexible substrate 20 on the reinforcing plate 30 by wire bonding. For example, the pad portion 11a of the display unit 10 and the connection portion 21 of the flexible substrate 20 are electrically connected by a wire 13.

[0121] In step S44, potting resin 42 is supplied to a predetermined area including a portion of the upper surface of the substrate 11, flexible substrate 20, and reinforcing plate 30 so as to cover the wire 13, and curing (heating) is performed. The supply of potting resin 42 forms a sealing material 40, and the wire 13 is covered and sealed with the sealing material 40 together with the pad portion 11a and the connection portion 21. This completes the display device 1 of Example 12.

[0122] (Detailed Manufacturing Process Example of the Display Device of Example 8) Figure 32 is a cross-sectional view showing a detailed manufacturing process example of the display device 1 of Example 8 (see Figure 23) according to the first embodiment. This manufacturing process example includes the steps S41 to S43 described above, but in the example of Figure 32, steps S51 to S52 from step S43 onwards are shown.

[0123] As shown in Figure 32, in step S51, the dam resin 41 is applied to the upper surface of the substrate 11 of the display unit 10 so as to cover the pad portion 11a of the display unit 10 on the reinforcing plate 30. The dam resin 41 is applied in a straight line in the Y-axis direction.

[0124] In step S52, potting resin 42 is supplied to a predetermined area including a portion of the upper surface of the flexible substrate 20 and the reinforcing plate 30 so as to cover the wire 13, and curing (heating) is performed. The supply of potting resin 42 forms a sealing material 40, and the wire 13 is covered and sealed with the sealing material 40 together with the pad portion 11a and the connecting portion 21. This completes the display device 1 of Example 8.

[0125] (Detailed Manufacturing Process Example of the Display Device of Example 9) Figure 33 is a cross-sectional view showing a detailed manufacturing process example of the display device 1 of Example 9 (see Figure 26) according to the first embodiment. This manufacturing process example includes the steps S41 to S43 described above, but in the example of Figure 33, steps S61 to S62 after step S43 described above are shown.

[0126] As shown in Figure 33, in step S61, the dam resin 41 is applied to the upper surface of the substrate 11 of the display unit 10 so as to cover the pad portion 11a of the display unit 10 on the reinforcing plate 30, and the dam resin 41 is applied to the upper surface of the flexible substrate 20 so as to be located next to the connection portion 21 of the flexible substrate 20 on the reinforcing plate 30. Each of the two dam resins 41 is applied in a straight line in the Y-axis direction.

[0127] In step S62, potting resin 42 is supplied to a predetermined area sandwiched between two dam resins 41, and curing (heating) is performed. The supply of potting resin 42 forms a sealing material 40, and the wire 13 is covered and sealed with the sealing material 40 together with the pad portion 11a and the connecting portion 21. This completes the display device 1 of Example 9.

[0128] Furthermore, the various manufacturing process examples described above can be applied to the manufacturing process of each of the above-mentioned embodiments 1 to 12 of the display device 1. Basically, although the presence or absence of the dam resin 41 and the planar shape of the dam resin 41 differ, the various manufacturing process examples described above can be used as appropriate.

[0129] <1-5. Examples of the properties of various potting resins> Examples of the properties of various potting resins P1 to P3 used in the sealing material 40 according to the first embodiment will be described with reference to Figure 34. Figure 34 is a diagram showing the properties of various potting resins P1 to P3 according to the first embodiment.

[0130] For resin leakage evaluation, for example, an evaluation TEG (Test Element Group) was prepared in which multiple wires 13 were adjacent at an 88 μm pitch. This evaluation TEG was then applied to the display device 1 of Example 12 (damless structure without dam resin 41), and resin leakage evaluation was performed on the display device 1 of Example 12.

[0131] As shown in Figure 34, potting resin P1 has a thixotropy ratio of 1.2 and a contact angle of 34 degrees on the device surface. Potting resin P2 has a thixotropy ratio of 4.2 and a contact angle of 49 degrees on the device surface. Potting resin P3 has a thixotropy ratio of 7.0 and a contact angle of 72 degrees on the device surface. In this way, it can be seen that with the various potting resins P1 to P3 having a contact angle of 30 degrees or more, there is no resin leakage even when using a damless structure, and the resin shape after coating can be maintained. These various potting resins P1 to P3 may also be used as the aforementioned potting resin 42.

[0132] For example, in order to prevent the potting resin 42 from penetrating the display unit 10 after application, it is desirable to set the contact angle of the potting resin 42 on the device surface (e.g., the surface of the flexible substrate 20, the surface of the substrate 11) to 30 degrees or more. Similarly, it is desirable to set the contact angle of the dam resin 41 on the device surface (e.g., the surface of the flexible substrate 20, the surface of the substrate 11) to 30 degrees or more. In this case, it is possible to form a dam with a high aspect ratio that can prevent the potting resin 42 from leaking out.

[0133] In the potting resin 42 or dam resin 41, it is desirable that the viscosity of the resin be 100 Pa·s or higher in order to achieve a contact angle of 30 degrees or more. It is also desirable that the resin be thixotropic. For example, the thixotropy ratio is preferably between 1.1 and 9.0, and more preferably between 1.5 and 7.0. Alternatively, the contact angle of the resin may be made 30 degrees or more by modifying the surface of the apparatus using chemical surface treatment or plasma treatment.

[0134] The potting resin 42 and dam resin 41 may be, for example, epoxy resin, silicone resin, acrylic resin, urethane resin, etc., and may be either thermosetting resin or photocuring resin. The potting resin 42 and dam resin 41 may be the same material or different materials.

[0135] For example, when using a photocurable resin, irradiating it with light immediately after application can suppress the wetting and spreading of the resin, thus enabling the sealing of the wire 13 in a smaller area without the resin coming into contact with the translucent substrate 12. Furthermore, when using a thermosetting resin, for example, by heating a syringe filled with resin at a temperature higher than the heating stage while applying it, good embedding properties of the wire 13 can be achieved, and the sealing of the wire 13 in a smaller area can be achieved without the resin coming into contact with the translucent substrate 12.

[0136] <1-6. Example of Display Unit Configuration> An example of the configuration of the display unit 10 according to the first embodiment will be described with reference to Figures 35 to 37.

[0137] (Display Unit) Figure 35 shows an example of the configuration of the display unit 10 according to the first embodiment.

[0138] As shown in Figure 35, the display unit 10 comprises a pixel array unit 151, a horizontal drive circuit 152, and a vertical drive circuit 153. These pixel array unit 151, horizontal drive circuit 152, and vertical drive circuit 153 are provided, for example, on the aforementioned substrate 11 (see Figure 2, etc.).

[0139] The pixel array section 151 has a plurality of pixels 100. Each of the pixels 100 functions as a light-emitting element. The pixel array section 151 is, for example, a panel capable of displaying color. In the example in Figure 35, the pixels 100 that emit red light are denoted by the code R, the pixels 100 that emit green light are denoted by the code G, and the pixels 100 that emit blue light are denoted by the code B.

[0140] The pixel array section 151 further includes a plurality of scan lines SCL and a plurality of signal lines DTL. Each scan line SCL extends in the row direction (X-axis direction in Figure 35) and is a line for scanning each pixel 100. Each signal line DTL extends in the column direction (Y-axis direction in Figure 35) and is a line for supplying voltage to each pixel 100.

[0141] The pixels 100 are arranged in a two-dimensional matrix, for example, M pixels in the row direction and N pixels in the column direction, for a total of M × N pixels. These pixels 100 are connected to each scan line SCL and each signal line DTL. A single pixel 100 may function as a single pixel, or a single pixel 100 may function as a sub-pixel, and a predetermined number (e.g., three, four, etc.) of sub-pixels may function as a single pixel.

[0142] The horizontal drive circuit 152 and the vertical drive circuit 153 are circuits for driving each of the pixels 100. In the example shown in Figure 35, the horizontal drive circuit 152 and the vertical drive circuit 153 are located at the edge of the display unit 10, but their arrangement is not particularly limited.

[0143] The horizontal drive circuit 152 sequentially supplies scan signals to each scan line SCL in order to scan each pixel 100 row by row when writing a signal to each pixel 100. The horizontal drive circuit 152 is composed of, for example, a shift register that sequentially shifts (transfers) start pulses in synchronization with the input clock pulse.

[0144] The vertical drive circuit 153 supplies a signal voltage (for example, a signal voltage corresponding to brightness information) supplied from a signal source (not shown) to each pixel 100 selected in a column-by-column unit via the signal line DTL.

[0145] Such a display unit 10 can be used in various displays such as televisions, personal computers, VR (Virtual Reality), MR (Mixed Reality), and AR (Augmented Reality), as well as in EVFs (Electronic View Finders) and small projectors.

[0146] It should be noted that the configuration of the display unit 10 is not limited to the configuration shown in Figure 35. In other words, the configuration shown in Figure 35 is merely an example, and the display unit 10 according to the first embodiment can take various configurations.

[0147] For example, it is possible to apply various color arrays (color arrays) of pixels 100 of different colors to the display unit 10. As color arrays (color patterns), various patterns can be used, such as RGB stripe arrays, RGB delta arrays or square arrays, Bayer arrays (e.g., RGBG, GRGB, RGBB, etc.), and RGB mosaic arrays. In addition to RGB primary colors, various complementary colors can also be used.

[0148] (Example of Pixel Circuit Configuration) Figure 36 is a diagram showing an example of the circuit configuration of a pixel 100 according to the first embodiment. In the example of Figure 36, the wiring relationship for one pixel 100 is shown.

[0149] As shown in Figure 36, the pixel 100 includes a light-emitting unit 101 and a drive circuit 102. The drive circuit 102 is a circuit that controls the light emission of the light-emitting unit 101. The drive circuit 102 includes, for example, a writing transistor TR Ｗ or drive transistor TR Ｄ , capacity C Ｓ It has, among other things, a writing transistor TR. Ｗ and drive transistor TR Ｄ For example, a p-channel field-effect transistor is one such example.

[0150] The light-emitting section 101 is composed of, for example, an organic electroluminescent light-emitting element (organic EL element) such as an OLED (organic light-emitting diode). The light-emitting section 101 is, for example, a current-driven light-emitting section in which the luminescence changes according to the current value.

[0151] One end of the light-emitting portion 101 (for example, the anode electrode) is electrically connected to the power supply line PS1 via the driving transistor TR Ｄ . The other end of the light-emitting portion 101 (for example, the cathode electrode) is electrically connected to the common power supply line PS2. In the example of FIG. 36, the capacitance of the light-emitting portion 101 is represented by the symbol C ＥＬ .

[0152] The power supply line PS1 is a line connected to one pixel 100. The common power supply line PS2 is a line commonly connected to all the pixels 100. These power supply line PS1 and common power supply line PS2 are provided in the pixel array portion 151. A predetermined driving voltage V ｃｃ is supplied to the power supply line PS1, and a common voltage V Ｃat (for example, the ground potential) is supplied to the common power supply line PS2

[0153] One source / drain region of the driving transistor TR Ｄ is electrically connected to one end of the capacitor C Ｓ and the power supply line PS1, and the other source / drain region is electrically connected to one end of the light-emitting portion `101 (for example, the anode electrode). The gate electrode of the driving transistor TR Ｄ is electrically connected to one source / drain region of the writing transistor TR Ｗ and the other end of the capacitor C Ｓ . Also, the other source / drain region of the writing transistor TR Ｗ is electrically connected to the signal line DTL, and the gate electrode of the writing transistor TR Ｗ is electrically connected to the scanning line SCL

[0154] In such a pixel 100, when the voltage corresponding to the luminance of the image to be displayed is supplied from the vertical drive circuit 153 to the signal line DTL and the writing transistor TR Ｗ is turned on by the scanning signal from the horizontal drive circuit 152, the voltage corresponding to the luminance is written into the capacitor C Ｓ . After the writing transistor TR Ｗ is turned off, the capacitor C ＳDepending on the voltage held, the drive transistor TR Ｄ When an electric current flows through it, the light-emitting part 101 emits light.

[0155] (Example of Pixel Configuration) Figure 37 is a cross-sectional view showing an example of the configuration of a pixel 100 according to the first embodiment.

[0156] As shown in Figure 37, the pixel 100 includes a substrate 110, an emissive layer (light-emitting element layer) 120, a color filter layer 130, and a lens layer 140. The substrate 110, emissive layer 120, color filter layer 130, and lens layer 140 are stacked in the order described. This stack is included in the aforementioned substrate 11 (see Figure 2, etc.). Note that the lens layer 140 may be omitted.

[0157] The substrate 110 is formed on a semiconductor substrate, such as a Si substrate. This substrate 110 supports the light-emitting layer 120, etc. The material of the substrate 110 is, for example, SiO ２ The substrate may be an insulating material such as SiN or SiON. Furthermore, a circuit element (e.g., a transistor, wiring, etc.) for driving the light-emitting layer 120 is provided on the surface of the substrate 110 opposite to the light-emitting layer 120. This circuit element is electrically connected to the light-emitting layer 120, for example, via a contact plug.

[0158] The light-emitting layer 120 is provided on the substrate 110. The light-emitting layer 120 is, for example, an organic EL element, but it may also be an LED (Light Emitting Diode) element or the like. The light-emitting layer 120 corresponds to the light-emitting section 101 described above.

[0159] This light-emitting layer 120 includes an electrode layer 121, an organic layer 122, an electrode layer 123, a protective layer 124, and a planarization layer 125. The electrode layer 121, organic layer 122, electrode layer 123, protective layer 124, and planarization layer 125 are laminated in the order described.

[0160] The electrode layer 121 is provided on the substrate 110. This electrode layer 121 has an electrode 121a for each pixel 100. An insulating layer 121b is provided between the respective edges of each electrode 121a and the organic layer 122. The insulating layer 121b functions as an electrode edge film. As a result, each adjacent electrode 121a is electrically isolated. Furthermore, the portion of the electrode 121a covered by the insulating layer 121b is electrically isolated from the organic layer 122, and the light emission of the organic layer 122 corresponding to this portion is suppressed.

[0161] The organic layer 122 is provided on the electrode layer 121. For example, the organic layer 122 may be configured to emit light of a different color for each pixel 100 (e.g., red light, green light, blue light, etc.), or to emit light of the same color for all pixels 100 (e.g., white light). Alternatively, the organic layer 122 may have a laminated structure in which multiple layers emitting light of each color are stacked.

[0162] The electrode layer 123 is provided on the organic layer 122. The electrode layer 123 is provided in common across each pixel 100. In the example of Figure 37, it is provided in common across the red pixel 100, the green pixel 100, and the blue pixel 100. The electrode layer 123 is formed of, for example, a material that is light-transmitting and conductive (for example, a conductive transparent material).

[0163] The protective layer 124 is provided on the electrode layer 123. The protective layer 124 is formed of, for example, a light-transmitting material (e.g., a transparent material). The material of the protective layer 124 is, for example, SiN, SiON, Al ２ O3, TiO ２ And so on.

[0164] The planarization layer 125 is provided on the protective layer 124, that is, between the protective layer 124 and the color filter layer 130. The material of the planarization layer 125 is, for example, a base material made of acrylic resin with TiO ２ A base material consisting of a material to which TiO has been added, and the same material as the color filter layer 130 (excluding pigments). ２ These are materials to which certain substances have been added.

[0165] The color filter layer 130 is provided on the planarization layer 125, i.e., the light-emitting layer 120. The color filter layer 130 includes one of the color filters 130R, 130G, or 130B for each pixel 100. The red color filter 130R allows red light from the light-emitting layer 120 to pass through. The green color filter 130G allows green light from the light-emitting layer 120 to pass through. The blue color filter 130B allows blue light from the light-emitting layer 120 to pass through. The material of the color filter layer 130 is various materials, such as color resist material.

[0166] The lens layer 140 is provided on the color filter layer 130. The lens layer 140 includes a plurality of lenses 141 and a protective layer 142. Each lens 141 is provided on the color filter layer 130 for every pixel 100. For example, each lens 141 is arranged in an array in the planar direction of the lens layer 140. The lenses 141 are, for example, microlenses. The protective layer 142 is provided on each lens 141. The protective layer 142 is formed of, for example, a light-transmitting material (for example, a transparent material).

[0167] It should be noted that the configuration of the pixel 100 described above is not limited to the configuration shown in Figure 36 or Figure 37. In other words, the configuration shown in Figure 36 or Figure 37 is merely an example, and various configurations are possible for the pixel 100 according to the first embodiment.

[0168] <2. Second Embodiment> <2-1. Example of Display Device Configuration> Example of the configuration of the display device 1 in each of the 1 to 7 embodiments of the second embodiment will be described with reference to Figures 38 to 55.

[0169] (Example 1) Figure 38 is a plan view showing an example configuration of the display device 1 of Example 1 according to the second embodiment. Figure 39 is a side view showing an example configuration of the display device 1 of Example 1 according to the second embodiment. Figure 40 is a first cross-sectional view (cross-sectional view along line F1-F1 in Figure 38) showing an example configuration of the display device 1 of Example 1 according to the second embodiment. Figure 41 is a second cross-sectional view (cross-sectional view along line F2-F2 in Figure 38) showing an example configuration of the display device 1 of Example 1 according to the second embodiment.

[0170] As shown in Figures 38 to 41, in the display device 1 of Embodiment 1, the sealing material 40 is composed of the aforementioned potting resin 42 and a rigid material 45. The potting resin 42 functions as a sealing resin. In the example shown in Figures 39 to 41, the aforementioned pixel array section 151 is provided on the upper surface of the substrate 11.

[0171] The rigid material 45 is formed in the shape of a housing that surrounds and covers the potting resin 42, and houses the potting resin 42. This rigid material 45 is fixed to the upper surfaces of the substrate 11, the flexible substrate 20, and the reinforcing plate 30, for example, by adhesive 46. The rigid material 45 functions, for example, as a stiffener. In the example of Figure 38, the rigid material 45 is formed in a rectangular shape in plan view, and the adhesive 46 is formed in a rectangular frame shape in plan view. The rigid material 45 covers, for example, two corners (two of the four corners) of the substrate 11.

[0172] The rigid material 45 has an injection port 45a and an exhaust port 45b. The injection port 45a is an opening for injecting potting resin 42 into the interior of the rigid material 45. The exhaust port 45b is an opening for releasing gas (e.g., air) inside the rigid material 45 to the outside. The potting resin 42 is supplied into the interior of the rigid material 45 from the injection port 45a and fills the interior of the rigid material 45 without any gaps (or almost without gaps). At this time, the potting resin 42 supplied into the interior of the rigid material 45 discharges the gas inside the rigid material 45 to the outside of the rigid material 45 from the exhaust port 45b. The potting resin 42 filled inside the rigid material 45 covers each wire 13, pad portion 11a and connecting portion 21.

[0173] The inlet 45a is formed on one end of the upper surface of the rigid member 45. The upper surface of the rigid member 45 is the side opposite to the reinforcing plate 30. The exhaust port 45b is formed on the other end of the upper surface of the rigid member 45. In the example of Figure 38, the inlet 45a is formed on the left end of the upper surface of the rigid member 45, and the exhaust port 45b is formed on the right end of the upper surface of the rigid member 45. The inlet 45a and exhaust port 45b are formed, for example, in a square shape in plan view. Note that the planar shapes of the inlet 45a and exhaust port 45b may not be square, but may be, for example, round, elliptical, rectangular, triangular, etc.

[0174] The rigid material 45 is formed, for example, by a mold or a 3D printer. The material used for the rigid material 45 may include metals such as alloys or aluminum, ceramics, or resins.

[0175] Here, a decrease in reliability due to contact of the potting resin 42 with the translucent substrate 12, and a decrease in reliability due to exposure of the corners of the substrate 11, can become problematic, and the formation of a stable encapsulant 40 is required. However, due to the heat resistance temperature of EL (electroluminescence), the potting resin 42 applied to the display device 1 needs to be low-temperature curable, and as an encapsulation method, the use of the molding method, which allows for easy control of the encapsulation shape, is difficult, and the potting method, which makes it difficult to control the encapsulation shape, is used.

[0176] On the other hand, in the display device 1 of Example 1, a rigid material 45 is used in part of the sealing material 40. This makes it possible to form the sealing material 40 in a stable shape even with the potting method. Therefore, it becomes possible to seal the wire 13 and the like with a sealing material 40 in a stable shape, thereby improving the reliability of the device. In addition, since it is possible to form the sealing material 40 in a stable shape using the rigid material 45, the width of the potting resin 42 that spreads towards the flexible substrate 20 can be reduced, thereby achieving miniaturization. Furthermore, by utilizing the rigidity of the rigid material 45, it is possible to suppress the warping of the display device 1 due to resin cooling shrinkage during TC (temperature cycle), thereby suppressing stress on the substrate 11, and thus improving the reliability of the device.

[0177] (Example 2) Figure 42 is a plan view showing an example configuration of the display device 1 of Example 2 according to the second embodiment. Figure 43 is a cross-sectional view (cross-sectional view along line G1-G1 in Figure 42) showing an example configuration of the display device 1 of Example 2 according to the second embodiment.

[0178] As shown in Figures 42 and 43, in the display device 1 of Embodiment 2, the inlet 45a is formed in a shape that is elongated in one direction (groove shape). In the example of Figure 42, the inlet 45a is formed in a shape that is elongated in the Y-axis direction, that is, rectangular in plan view, and the rigid material 45 is formed in a frame shape. The inlet 45a functions as an opening for injecting potting resin 42 into the rigid material 45, and also functions as an opening (exhaust port 45b) for releasing gas (e.g., air) inside the rigid material 45 to the outside of the rigid material 45.

[0179] According to Example 2, the injection port 45a is formed in a shape that is elongated in one direction (for example, in the Y-axis direction). This makes it possible to fill the inside of the rigid material 45 with potting resin 42 by moving the needle that supplies the potting resin 42, thereby shortening the time required to fill the inside of the rigid material 45 with potting resin 42. Example 2 is highly compatible with high-viscosity potting resin 42.

[0180] (Example 3) Figure 44 is a plan view showing an example of the configuration of the display device 1 according to Example 3 of the second embodiment.

[0181] As shown in Figure 44, the display device 1 of Embodiment 3 is provided with one inlet 45a and multiple exhaust ports 45b. In the example of Figure 44, two exhaust ports 45b are provided, and the inlet 45a and each exhaust port 45b are formed in a square shape in plan view.

[0182] The injection port 45a is located in the center of the upper surface of the rigid member 45. One exhaust port 45b is formed on the left end of the upper surface of the rigid member 45, and the other exhaust port 45b is formed on the right end of the upper surface of the rigid member 45. Each exhaust port 45b is located on the upper surface of the rigid member 45, facing the injection port 45a in between. This arrangement of the injection port 45a and each exhaust port 45b is illustrative, and other arrangements may be used.

[0183] According to Example 3, one inlet 45a and multiple exhaust ports 45b are provided on the upper surface of the rigid material 45. This allows the fluidity of the potting resin 42 to be utilized, shortening the time required to fill the inside of the rigid material 45 with the potting resin 42. Example 3 is highly compatible with low-viscosity potting resin 42.

[0184] (Example 4) Figure 45 is a plan view showing an example configuration of the display device 1 of Example 4 according to the second embodiment. Figure 46 is a side view showing an example configuration of the display device 1 of Example 4 according to the second embodiment.

[0185] As shown in Figures 45 and 46, in the display device 1 of Embodiment 4, the rigid material 45 is formed to cover the potting resin 42, and further, the potting resin 42 is exposed from both sides M11 and M12 of the sealing material 40 (see Figure 46). In other words, the potting resin 42 is exposed from both sides M11 and M12 of the sealing material 40.

[0186] For example, as shown in Figure 46, the rigid member 45 is composed of a ceiling portion 45A extending in the Y-axis direction and two side walls 45B, each extending in the Y-axis direction. The two side walls 45B are aligned in the X-axis direction and face each other with the potting resin 42 in between. These side walls 45B are the side walls on both sides of the rigid member 45 in the X-axis direction.

[0187] On the other hand, the side walls on both sides in the Y-axis direction of the rigid material 45 are removed, for example, by a subsequent process such as dicing. For example, when multiple display devices 1 on a wafer are cut out by dicing, the side walls on both sides in the Y-axis direction of the rigid material 45 for each display device 1 are removed by the dicing (cutting of both ends). As a result, the potting resin 42 is exposed from both sides M11 and M12 of the sealing material 40.

[0188] In Example 4, the potting resin 42 is exposed from both sides M11 and M12 of the sealing material 40. In other words, the rigid material 45 is formed so that the potting resin 42 is exposed from both sides M11 and M12 of the sealing material 40. As a result, the side walls on both sides in the Y-axis direction of the rigid material 45 are eliminated, so the length (width) of the rigid material 45 in the Y-axis direction can be shortened. Therefore, the display device 1 can be miniaturized.

[0189] The rigid material 45 is formed so that the potting resin 42 is exposed from both sides M11 and M12 of the sealing material 40, but it is not limited to this, and for example, it may be formed so that the resin is exposed from only one of the sides M11 and M12 of the sealing material 40.

[0190] (Example 5) Figure 47 is a plan view showing an example configuration of the display device 1 of Example 5 according to the second embodiment. Figure 48 is a side view showing an example configuration of the display device 1 of Example 5 according to the second embodiment. Figure 49 is a cross-sectional view (cross-sectional view along line G2-G2 in Figure 47) showing an example configuration of the display device 1 of Example 5 according to the second embodiment.

[0191] As shown in Figures 47 to 49, in the display device 1 of Embodiment 5, the cross-sectional shape (longitudinal cross-sectional shape) of the rigid material 45 has a shape that includes three or more bends. A bend is a portion (bent part) where the rigid material 45 bends. In the example of Figure 49, the cross-sectional shape of the rigid material 45 has a shape that includes four bends. The rigid material 45 includes two inclined surfaces (inclined parts) M21 and M22. These inclined surfaces M21 and M22 are inclined in the X-axis direction and extend without inclining in the Y-axis direction. For example, a polygonal mold can be used as a mold to form such a rigid material 45.

[0192] According to Example 5, the cross-sectional shape of the rigid material 45 is made to include three or more bends. This makes it possible to reduce the volume of the rigid material 45 compared to Example 1 (shape including two bends), and thus the amount of sealing resin in the potting resin 42 can be reduced. As a result, for example, the cooling shrinkage of the potting resin 42 during molding can be suppressed.

[0193] (Example 6) Figure 50 is a plan view showing an example configuration of the display device 1 of Example 6 according to the second embodiment. Figure 51 is a side view showing an example configuration of the display device 1 of Example 6 according to the second embodiment. Figure 52 is a cross-sectional view (cross-sectional view along line G3-G3 in Figure 50) showing an example configuration of the display device 1 of Example 6 according to the second embodiment.

[0194] As shown in Figures 50 to 52, in the display device 1 of Embodiment 6, the cross-sectional shape (longitudinal cross-sectional shape) of the rigid material 45 is curved (dome-shaped). In the example of Figure 52, the cross-sectional shape of the rigid material 45 is a curved arc. The rigid material 45 includes a curved surface M31. This curved surface M31 is curved in the X-axis direction and extends without curving in the Y-axis direction. For example, a dome-shaped mold can be used to form such a rigid material 45.

[0195] According to Example 6, the cross-sectional shape of the rigid material 45 is curved. This makes it possible to reduce the volume of the rigid material 45 compared to Example 1 (shape including two bends), and thus the amount of sealing resin in the potting resin 42 can be reduced. Therefore, for example, the cooling shrinkage of the potting resin 42 during molding can be suppressed.

[0196] (Example 7) Figure 53 is a plan view showing an example configuration of the display device 1 of Example 7 according to the second embodiment. Figure 54 is a side view showing an example configuration of the display device 1 of Example 7 according to the second embodiment. Figure 55 is a cross-sectional view (cross-sectional view along line G4-G4 in Figure 53) showing an example configuration of the display device 1 of Example 7 according to the second embodiment.

[0197] As shown in Figures 53 to 55, the display device 1 of Example 7 does not have a reinforcing plate 30. For example, the display device 1 of Example 1 is manufactured, and then the reinforcing plate 30 in the display device 1 of Example 1 is removed to manufacture the display device 1 of Example 7. The adhesive 46 functions as a temporary adhesive. This adhesive 46 is removed, and the reinforcing plate 30 is also removed.

[0198] In Example 7, the reinforcing plate 30 is not provided. This makes the display device 1 a small and lightweight device. After the removal of the reinforcing plate 30, the rigid material 45 plays the role of maintaining the shape of the display device 1.

[0199] <2-2. Example of Manufacturing Process for Display Device> An example of the manufacturing process for the display device 1 according to the second embodiment will be described with reference to Figures 56 and 57. Figures 56 and 57 are cross-sectional views showing an example of the manufacturing process for the display device 1 (see Figure 40) of Embodiment 1 according to the second embodiment.

[0200] As shown in Figure 56, in step S71, the flexible substrate 20 is fixed to the upper surface of the reinforcing plate 30 by adhesive 20a. For example, the end of the flexible substrate 20 on the connection portion 21 side is fixed to the upper surface of the reinforcing plate 30 via adhesive 20a. As the adhesive 20a, various resins such as epoxy resin, silicone resin, acrylic resin, urethane resin, thermosetting resin, and photocuring resin can be used. The form of this adhesive 20a may be, for example, a paste or a film. As the reinforcing plate 30, for example, metals such as 42 alloy, aluminum, and stainless steel, as well as ceramics, organic substrates, and glass can be used.

[0201] In step S72, the display unit 10 is fixed to the upper surface of the reinforcing plate 30 by a die bond material 10a, avoiding the flexible substrate 20 on the reinforcing plate 30. As the die bond material 10a, various resins such as epoxy resin, silicone resin, acrylic resin, urethane resin, thermosetting resin, and photocuring resin can be used. The form of this die bond material 10a may be, for example, a paste or a film.

[0202] In step S73, the display unit 10 on the reinforcing plate 30 is electrically connected to the flexible substrate 20 on the reinforcing plate 30 by wire bonding. For example, the pad portion 11a of the display unit 10 and the connection portion 21 of the flexible substrate 20 are electrically connected by a wire 13. For example, metals such as Au, Al, Cu, and Ag can be used as the wire 13.

[0203] As shown in Figure 57, in step S74, the coating device 61 is used to supply adhesive 46 in a frame shape in plan view to a predetermined area surrounding the wire 13, pad portion 11a, and connecting portion 21, etc., that is, a predetermined area including a part of the upper surface of the substrate 11, flexible substrate 20, and reinforcing plate 30. As the adhesive 46, various resins such as epoxy resin, silicone resin, acrylic resin, urethane resin, thermosetting resin, and photocuring resin can be used. The form of this adhesive 46 may be, for example, a paste or a film.

[0204] In step S75, the rigid material 45 is laminated on the adhesive 46 and fixed by the adhesive 46 to a predetermined area including a portion of the upper surface of each of the substrate 11, flexible substrate 20, and reinforcing plate 30. Specifically, the rigid material 45 is laminated on the adhesive 46 so as to cover a predetermined area including a portion of the upper surface of each of the substrate 11, flexible substrate 20, and reinforcing plate 30, that is, so as to cover the wire 13, pad portion 11a, and connecting portion 21. For example, the rigid material 45 is formed in advance by a mold or a 3D printer. As the rigid material 45, for example, metals such as 42 alloy or aluminum, or ceramics or resins can be used.

[0205] In step S76, a potting device 62 is used, and potting resin 42 is supplied to the inside of the rigid material 45 from the injection port 45a of the rigid material 45, filling the inside of the rigid material 45. The supply of potting resin 42 forms a sealing material 40, and the wire 13 is covered and sealed with the sealing material 40 together with the pad portion 11a and the connecting portion 21. After that, the potting resin 42 hardens. This completes the display device 1 of Example 1. As the potting resin 42, various resins such as epoxy resin, silicone resin, acrylic resin, urethane resin, thermosetting resin, and photocuring resin can be used.

[0206] <2-3. Examples of reducing the amount of warping of the display device> Examples of reducing the amount of warping of the display device 1 according to the second embodiment will be described with reference to Figures 58 to 60. Figure 58 is a diagram showing the amount of warping of the potting resin 42 alone, the amount of warping without the rigid material 45, and the amount of warping with the rigid material 45 according to the second embodiment. Figure 59 is a diagram for explaining the warping of the potting resin 42 alone according to the second embodiment. Figure 60 is a diagram for explaining the warping with the rigid material 45 according to the second embodiment. Figure 61 is a diagram for explaining the device structure (no warping) without the rigid material 45 according to the second embodiment. The reinforcing plate 30 or rigid material 45 is formed of, for example, ceramic.

[0207] In the example in Figure 58, the warpage amounts for "potting," "no stiffener," and "with stiffener" are the warpage amounts of the display device 1, for example, the warpage of the reinforcing plate 30. The warpage amount is observed, for example, in a temperature range from 85°C (stress-free) to -40°C. "Potting" is a state in which the sealing material 40 is composed only of potting resin 42 from the beginning, as shown in Figure 59. "With stiffener" is a state in which the sealing material 40 is composed of potting resin 42 and stiffener 45, as shown in Figure 60. "No stiffener" is a state in which the sealing material 40 is composed only of potting resin 42, as shown in Figure 61. "No stiffener" is a state in which the stiffener 45 has been removed after the sealing material 40 was composed of potting resin 42 and stiffener 45.

[0208] Furthermore, the amount of potting resin 42 in "potting" (see Figure 59) is greater than the amount of potting resin 42 in "without rigid material" and "with rigid material" respectively (see Figures 60 and 61). The amount of potting resin 42 is the same in "without rigid material" and "with rigid material".

[0209] As shown in Figure 58, the amount of warping during "potting" is approximately -8 μm. The shape of this warping during "potting" is a downward convex shape, as shown in Figure 59 (see mark M51 in Figures 58 and 59). The amount of warping without rigid material is approximately -3 μm. The shape of this warping without rigid material is a downward convex shape (see mark M52 in Figure 58). The amount of warping with rigid material is approximately +5.0 μm. The shape of this warping with rigid material is an upward convex shape, as shown in Figure 60 (see mark M53 in Figures 58 and 60). Note that the amount of warping without rigid material is less than the amount of warping during "potting". This is because the amount of resin in the potting resin 42 without rigid material is less than the amount of resin in the potting resin 42 during "potting", and the amount of cooling shrinkage of the resin is suppressed, thereby reducing the warping of the display device 1.

[0210] As shown in Figures 59 and 60, the point H2 where the stress is maximum when the curvature is convex upward is located further out on the substrate 11 than the point H1 where the stress is maximum when the curvature is convex downward. This makes it possible to suppress cracks and the like from forming inward on the substrate 11, thus suppressing damage to, for example, the pixel array portion 151 located inside the substrate 11. Each of the points H1 and H2 where the stress is maximum corresponds to, for example, the point of the maximum principal stress of silicon (the maximum principal stress of the substrate 11).

[0211] According to this example of warping reduction, the amount of warping with a rigid material is less than the amount of warping with potting. In other words, by using a rigid material 45 in part of the sealing material 40, the amount of warping of the display device 1 (for example, the reinforcing plate 30) can be suppressed. Furthermore, by using the rigid material 45, the amount of resin in the potting resin 42 (amount of sealing resin) can be reduced, and the warped shape can be made upward convex. For example, by reducing the amount of sealing resin, it is possible to suppress the warping of the display device 1 by suppressing the cooling shrinkage of the resin. Also, by making the warped shape upward convex, it is possible to position the point H2 where the stress is maximum further out on the substrate 11 than the point H1 where the stress is maximum. This makes it possible to suppress cracks and the like from forming inwards on the substrate 11, and improves the reliability of the display device 1.

[0212] <2-4. Examples of materials for reinforcing plates and rigid members> Examples of materials for the reinforcing plate 30 or rigid member 45 according to the second embodiment will be described with reference to Figures 62 and 63. Figure 62 is a diagram showing the properties of the material for the reinforcing plate 30 or rigid member 45 according to the second embodiment. Figure 63 is a diagram showing the relationship between the reinforcing plate 30 and the maximum principal stress of silicon, with only the potting resin 42, without the rigid member 45, and with various rigid members 45 according to the second embodiment.

[0213] As shown in Figure 62, for example, 42 alloy, ceramic, aluminum, and resin can be used as materials for the reinforcing plate 30 or rigid material 45. 42 alloy is an alloy of iron with nickel added. For example, the CTE (coefficient of thermal expansion) of 42 alloy is 5.5 (ppm / K), the CTE of ceramic is 7.0 (ppm / K), the CTE of aluminum is 23 (ppm / K), and the CTE of resin is 37 (ppm / K). Also, for example, the elastic modulus of 42 alloy is 145 (GPA), the elastic modulus of ceramic is 370 (GPA), the elastic modulus of aluminum is 72 (GPA), and the elastic modulus of resin is 10 (GPA).

[0214] In the example shown in Figure 63, the maximum principal stress of silicon is observed, for example, in a temperature range from 85°C (stress-free) to -40°C. Hereafter, the maximum principal stress of silicon will simply be referred to as the maximum principal stress. "Potting" is the state in which the encapsulant 40 is composed solely of potting resin 42 from the beginning, and "no component" is the state in which the encapsulant 40 is composed of potting resin 42 and a rigid material 45, and then the rigid material 45 is removed. "Ceramic component" is the state in which the encapsulant 40 is composed of potting resin 42 and a ceramic rigid material 45, "aluminum component" is the state in which the encapsulant 40 is composed of potting resin 42 and an aluminum rigid material 45, and "resin component" is the state in which the encapsulant 40 is composed of potting resin 42 and a resin rigid material 45.

[0215] As shown in Figure 63, when the reinforcing plate 30 is made of 42 alloy, the maximum principal stress for "potting" is 117 (MPa), the maximum principal stress for "no component" is 110 (MPa), the maximum principal stress for "ceramic component" is 74 (MPa), the maximum principal stress for "aluminum component" is 68 (MPa), and the maximum principal stress for "resin component" is 99 (MPa).

[0216] When the reinforcing plate 30 is ceramic, the maximum principal stress in the "potting" case is 137 (MPa), the maximum principal stress in the "no component" case is 131 (MPa), the maximum principal stress in the "ceramic component" case is 77 (MPa), the maximum principal stress in the "aluminum component" case is 94 (MPa), and the maximum principal stress in the "resin component" case is 121 (MPa).

[0217] When the reinforcing plate 30 is aluminum, the maximum principal stress for "potting" is 195 (MPa), the maximum principal stress for "no component" is 195 (MPa), the maximum principal stress for "ceramic component" is 162 (MPa), the maximum principal stress for "aluminum component" is 194 (MPa), and the maximum principal stress for "resin component" is 188 (MPa).

[0218] According to this example of materials, regardless of the materials (composition) of the reinforcing plate 30 and the rigid member 45, the maximum principal stress is smaller when the rigid member 45 is present compared to "potting" and "no member". Therefore, the maximum principal stress can be reduced by using the rigid member 45 in part of the sealing material 40. Furthermore, there is almost no difference in the maximum principal stress between "potting" and "no member".

[0219] Here, in order to suppress warping of the display device 1 due to resin cooling shrinkage during TC (temperature cycle), the CTE of the reinforcing plate 30 is preferably 50 ppm / K or less, and more preferably 1 to 25 ppm / K, as shown in Figures 62 and 63. Furthermore, in order to suppress warping of the display device 1 due to resin cooling shrinkage during TC, the CTE of the rigid material 45 is preferably 50 ppm / K or less, and more preferably 1 to 40 ppm / K, as shown in Figures 62 and 63. Moreover, the elastic modulus of the rigid material 45 is preferably 5 GPa or more, and more preferably 10 GPa or more.

[0220] <3. Overview> As described above, the display device 1 according to this embodiment comprises a display unit 10, a flexible substrate 20 electrically connected to the display unit 10 by wires 13, and a reinforcing plate 30 that supports the display unit 10 and the flexible substrate 20 (see Figures 1 and 2, etc.). As a result, the display unit 10 and the flexible substrate 20 are supported and integrated by the reinforcing plate 30. Therefore, it is possible to suppress damage to the wires 13 due to external forces on the display unit 10 and the flexible substrate 20, thereby improving the reliability (device reliability) of the display device 1.

[0221] Furthermore, the display unit 10 and the flexible substrate 20 may be provided on one side (for example, the top surface) of the reinforcing plate 30 (see Figures 1 and 2, etc.). This ensures that the display unit 10 and the flexible substrate 20 are securely integrated.

[0222] Furthermore, the reinforcing plate 30 may have a protrusion 31, and the flexible substrate 20 may be provided on the protrusion 31 (see Figures 5 and 6). This makes it possible to adjust the height position of the flexible substrate 20 relative to the display unit 10, so that, for example, the length of the wire 13 can be reduced. Therefore, the transmission characteristics (for example, transmission speed) can be improved.

[0223] Furthermore, the reinforcing plate 30 may have an opening 32, which may be formed at a position opposite the display unit 10 (see Figure 9). As a result, only a portion of the lower surface of the display unit 10 is covered by the reinforcing plate 30. Therefore, it becomes possible to provide a heat dissipation member such as a heat sink in the opening area on the lower surface of the display unit 10 that is not covered by the reinforcing plate 30, thereby improving heat dissipation.

[0224] Furthermore, the reinforcing plate 30 may be formed from metal, glass epoxy, or ceramics (see Figures 1 and 2, etc.). This ensures reliable reinforcement of the display unit 10 and the flexible substrate 20.

[0225] Furthermore, the wire 13 may be made of Au, Cu, Ag, or Al (see Figures 1 and 2, etc.). This ensures reliable electrical connection between the display unit 10 and the flexible substrate 20.

[0226] Furthermore, the wire 13 may be covered with a sealing material 40 (see Figures 1 and 2, etc.). This allows the wire 13 to be sealed and protected.

[0227] Furthermore, the display unit 10 includes a substrate 11 provided on the reinforcing plate 30 and a translucent substrate 12 laminated on the substrate 11, and the sealing material 40 and the translucent substrate 12 may be spaced apart (see Figures 19 to 30, etc.). This makes it possible to suppress a decrease in the image quality and reliability of the display device 1 due to the sealing material 40 coming into contact with the translucent substrate 12.

[0228] Furthermore, the sealing material 40 may have curved surfaces M1 at both ends (for example, at one or both ends in the longitudinal and transverse directions of the sealing material 40) (see Figures 19 to 30, etc.). This makes the corners of the sealing material 40 rounded, thereby reducing stress on the sealing material 40.

[0229] Furthermore, the sealing material 40 may be made of a single type of resin (for example, potting resin 42) (see Figures 19 to 21, etc.). This makes it easy to form the sealing material 40.

[0230] Furthermore, the sealing material 40 may be composed of two or more types of resin (for example, dam resin 41, potting resin 42) (see Figures 22 to 30, etc.). This allows the sealing material 40 to be formed appropriately.

[0231] Furthermore, the two or more resins may include a first resin (e.g., dam resin 41) and a second resin (e.g., potting resin 42) that comes into contact with the first resin (see Figures 1, 11 to 14, 22 to 30, etc.). This makes it possible to suppress the outflow of one or both of the first and second resins.

[0232] Furthermore, the first resin may be formed so as to be adjacent to the second resin in a straight line when viewed from above (see Figures 11, 22 to 24, etc.). This helps to suppress the outflow of the second resin.

[0233] Furthermore, the first resin may be formed so that it forms two straight lines sandwiching the second resin in a plan view (see Figures 12 to 13, 25 to 27, etc.). This can suppress the outflow of the second resin.

[0234] Furthermore, the first resin may be formed in a U-shape that surrounds the second resin in a plan view (see Figure 14). This helps to suppress the outflow of the second resin.

[0235] Furthermore, the first resin may be formed in a ring shape that surrounds the second resin in a plan view (Figures 1, 28 to 30). This helps to suppress the outflow of the second resin.

[0236] Furthermore, the display unit 10 may include a Si substrate (for example, substrate 11) (see Figures 35 to 37, etc.). Even with such a configuration, the reliability of the display device 1 can be improved, and the degree of design freedom can be increased.

[0237] Furthermore, the display unit 10 may include an organic light-emitting diode (see Figures 35 to 37, etc.). Even with such a configuration, the reliability of the display device 1 can be improved, and the degree of design flexibility can be increased.

[0238] Furthermore, the flexible substrate 20 may be formed from polyimide, modified polyimide, liquid crystal polymer, or fluororesin (see Figures 1 and 2, etc.). Even with such a configuration, the reliability of the display device 1 can be improved, and the degree of design freedom can be increased.

[0239] Furthermore, the sealing material 40 may be composed of a resin (for example, a potting resin 42) and a rigid material 45 located around the resin (see Figures 38 to 41, etc.). This allows the sealing material 40 to be formed in a stable shape. Therefore, it becomes possible to seal the wire 13 and the like with a sealing material 40 in a stable shape, thereby improving the reliability of the device.

[0240] Furthermore, the rigid member 45 may have two or more openings (for example, an inlet 45a and an exhaust port 45b), and the two or more openings may be formed on the upper surface of the rigid member 45 (for example, the surface of the rigid member 45 opposite to the reinforcing plate 30 side) (see Figures 38 to 41, etc.). This makes it possible to form the sealing material 40 in a stable shape.

[0241] Furthermore, the rigid material 45 may be formed to surround and cover the resin (for example, potting resin 42) (see Figures 38 to 41, etc.). This allows the sealing material 40 to be formed in a stable shape.

[0242] Furthermore, the rigid material 45 may be formed so as to cover the resin (for example, potting resin 42), and the resin may be further exposed from the sides M11 and M12 of the sealing material 40 (see Figures 45 and 46). This makes it possible to shorten the width of the rigid material 45 (for example, the length in the Y-axis direction), thereby enabling miniaturization of the display device 1.

[0243] Furthermore, the shape of the longitudinal cross-section of the rigid material 45 may include three or more bends or bends (see Figures 47 to 52, etc.). This makes it possible to reduce the volume of the rigid material 45, thereby reducing the amount of sealing resin in the potting resin 42, and for example, it is possible to suppress the cooling shrinkage of the potting resin 42 during molding.

[0244] <4. Other Embodiments> The configurations and processes described in the above-described embodiments (including examples and modifications) may be implemented in various other forms besides those described above. For example, the configurations and processes may be in various forms, not limited to the examples described above. Also, for example, the configurations, processing procedures, specific names, and information including various data and parameters shown in the above document and drawings may be changed at will unless otherwise specified.

[0245] Furthermore, the configurations and processes described in the above-mentioned embodiments (including examples and modifications) do not necessarily have to be physically configured as shown in the figures. In other words, the specific forms of distribution and integration of each configuration and process are not limited to those shown in the figures, and all or part of them may be functionally or physically distributed and integrated in any unit depending on various usage conditions and loads.

[0246] Furthermore, the various configurations and processes described in the above-mentioned embodiments (including examples and modifications) may be combined as appropriate. For example, at least a part of an embodiment may be combined with at least a part of another embodiment as appropriate. Also, the effects described in the embodiments are merely illustrative and not limiting, and other effects may also occur.

[0247] <5. Examples of Application> The technology relating to this disclosure may be applied, for example, to the display units (display devices) of various electronic devices. Examples of electronic devices to which this technology can be applied are described below. However, the specific examples given here are merely examples and are not limited to them.

[0248] (First Specific Example) Figure 64 is a front view showing an example of the external appearance of the digital still camera 400. Figure 65 is a rear view showing an example of the external appearance of the digital still camera 400. This digital still camera 400 is a single-lens reflex type with interchangeable lenses, and has an interchangeable shooting lens unit (interchangeable lens) 412 located approximately in the center of the front of the camera body 411, and a grip portion 413 for the photographer to hold on the left side of the front.

[0249] A monitor 414 is located slightly to the left of the center of the back of the camera body 411. An electronic viewfinder (eyepiece) 415 is provided above the monitor 414. The photographer can determine the composition by looking through the electronic viewfinder 415 and visually confirming the light image of the subject guided by the shooting lens unit 412. The aforementioned display device 1 can be applied to the monitor 414 and the electronic viewfinder 415.

[0250] (Second Specific Example) Figure 66 shows an example of the appearance of a head-mounted display 500. The head-mounted display 500 has, for example, a glasses-shaped display unit 511 and ear hooks 512 on both sides for being attached to the user's head. In this head-mounted display 500, the display device 1 described above can be applied to the display unit 511.

[0251] (Third Specific Example) Figure 67 shows an example of the external appearance of the see-through head-mounted display 600. The see-through head-mounted display 600 consists of a main body 612, an arm 613, and a lens barrel 611.

[0252] The main body 612 is connected to the arm 613 and the eyeglasses 614. Specifically, the long end of the main body 612 is connected to the arm 613, and one side of the main body 612 is connected to the eyeglasses 614 via a connecting member. The main body 612 may also be directly attached to the head of a person.

[0253] The main body 612 houses a control board for controlling the operation of the see-through head-mounted display 600, as well as a display unit. The arm 613 connects the main body 612 to the lens barrel 611 and supports the lens barrel 611. Specifically, the arm 613 is connected to the end of the main body 612 and the end of the lens barrel 611, respectively, to fix the lens barrel 611 in place. The arm 613 also houses signal lines for communicating image data provided from the main body 612 to the lens barrel 611.

[0254] The microscope tube 611 projects image light, provided from the main body 612 via the arm 613, through the eyepiece lens towards the eyes of the user wearing the see-through head-mounted display 600. In this see-through head-mounted display 600, the display device 1 described above can be applied to the display unit of the main body 612.

[0255] (Fourth Specific Example) Figure 68 shows an example of the external appearance of a television device 700. This television device 700 has, for example, a video display screen section 711 including a front panel 712 and a filter glass 713. The display device 1 described above can be applied to this video display screen section 711.

[0256] (Fifth Specific Example) Figure 69 shows an example of the external appearance of a smartphone 800. The smartphone 800 has a display unit 811 that displays various information, and an operation unit consisting of buttons, etc. that accept user input. The display device 1 described above can be applied to the display unit 811.

[0257] (Sixth Specific Example) Figures 70 and 71 show the internal configuration of an automobile having the display device 1 according to the embodiment. More specifically, Figure 70 shows the interior of the automobile from the rear to the front, and Figure 71 shows the interior of the automobile from the diagonally rear to the diagonally front.

[0258] The automobile shown in Figures 70 and 71 has a center display 911, a console display 912, a head-up display 913, a digital rear mirror 914, a steering wheel display 915, and a rear entertainment display 916. Some or all of these displays can be fitted with the aforementioned display device 1.

[0259] The center display 911 is located on the center console 907, facing the driver's seat 901 and the passenger seat 902. Figures 70 and 71 show examples of horizontally elongated center displays 911 (911C, 911L, 911R) extending from the driver's seat 901 to the passenger seat 902, but the screen size and location of the center display 911 are arbitrary. The center display 911 can display information detected by various sensors (not shown). As a specific example, the center display 911 can display images captured by an image sensor, distance images to obstacles in front of and to the side of the vehicle measured by a ToF (Time of Flight) sensor, and the body temperature of passengers detected by an infrared sensor. The center display 911 can be used to display at least one of the following: safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information.

[0260] Safety-related information includes information such as drowsiness detection, distraction detection, detection of mischief by a passenger, seat belt fastening status, and detection of an unattended occupant. This information is detected, for example, by a sensor (not shown) placed on top of the back of the center display 911. Operation-related information is detected by sensing occupant gestures using sensors. The detected gestures may include the operation of various equipment in the vehicle. For example, the operation of air conditioning equipment, navigation system, AV (Audio / Visual) system, lighting system, etc., is detected. Lifelogs include the lifelogs of all occupants. For example, lifelogs include records of each occupant's actions while riding in the vehicle. By acquiring and saving lifelogs, it is possible to confirm the state of the occupants at the time of an accident. Health-related information is detected by sensing the occupant's body temperature using a temperature sensor and inferring the occupant's health status based on the detected body temperature. Alternatively, the occupant's face may be captured using an image sensor, and the occupant's health status may be inferred from the captured facial expression. Furthermore, the system may engage in automated voice conversations with the occupants and infer their health status based on their responses. Authentication / identification-related information includes keyless entry functions that use sensors for facial recognition, and functions that automatically adjust seat height and position based on facial recognition. Entertainment-related information includes functions that use sensors to detect information on how the occupants operate the AV equipment, and functions that use sensors to recognize the occupants' faces and provide content suitable for the occupants through the AV equipment.

[0261] The console display 912 can be used, for example, to display life log information. The console display 912 is located near the shift lever 908 on the center console 907 between the driver's seat 901 and the passenger seat 902. The console display 912 can also display information detected by various sensors (not shown). In addition, the console display 912 may display images of the vehicle's surroundings captured by an image sensor, or distance images to obstacles around the vehicle.

[0262] The head-up display 913 is virtually displayed behind the windshield 904 in front of the driver's seat 901. The head-up display 913 can be used to display at least one of the following: safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information. Because the head-up display 913 is often virtually positioned in front of the driver's seat 901, it is suitable for displaying information directly related to the operation of the vehicle, such as the vehicle's speed and fuel (battery) level.

[0263] The digital rearview mirror 914 can not only display the area behind the vehicle but also show the condition of the passengers in the rear seat. By placing a sensor (not shown) on top of the back of the digital rearview mirror 914, it can be used, for example, to display life log information.

[0264] The steering wheel display 915 is positioned near the center of the steering wheel 906 of the automobile. The steering wheel display 915 can be used to display at least one of the following: safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the steering wheel display 915 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, or information related to the operation of AV equipment, air conditioning equipment, etc.

[0265] The rear entertainment display 916 is mounted on the back of the driver's seat 901 and the passenger seat 902, and is intended for viewing by rear-seat passengers. The rear entertainment display 916 can be used to display at least one of the following: safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the rear entertainment display 916 is in front of the rear-seat passengers, it displays information relevant to the rear-seat passengers. For example, it may display information related to the operation of AV equipment or air conditioning equipment, or it may display the results of measurements of the rear-seat passengers' body temperature etc., taken by a temperature sensor (not shown).

[0266] As described above, by placing a sensor on top of the back of the display, the distance to surrounding objects can be measured. Optical distance measurement methods can be broadly divided into passive and active types. Passive methods measure distance by receiving light from an object without projecting light from the sensor onto the object. Passive methods include the lens focusing method, stereo method, and monocular method. Active methods measure distance by projecting light onto an object and receiving the reflected light from the object with a sensor. Active methods include optical radar, active stereo, illuminance difference stereo, moiré topography, and interferometry. The display device 1 according to this embodiment is applicable to any of these distance measurement methods. By using a sensor placed on top of the back of the display device 1 according to this embodiment, the passive or active distance measurement described above can be performed.

[0267] It should be noted that the electronic devices to which the aforementioned display device 1 may be applied are not limited to the examples given above. The aforementioned display device 1 can be applied to the display units of electronic devices in various fields. In other words, the technology relating to this disclosure can be applied to a variety of products. For example, the aforementioned display device 1 may be used in the display units of various mobile devices other than automobiles, such as motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, robots, construction machinery, and agricultural machinery (tractors). Furthermore, the aforementioned display device 1 may be used in the display units of, for example, endoscopic surgery systems and microsurgical systems.

[0268] <6. Addendum> The technology can also be configured as follows: (1) A display device comprising: a display unit; a flexible substrate electrically connected to the display unit by wires; and a reinforcing plate supporting the display unit and the flexible substrate. (2) The display device according to (1), wherein the display unit and the flexible substrate are provided on one surface of the reinforcing plate. (3) The display device according to (2), wherein the reinforcing plate has a protrusion, and the flexible substrate is provided on the protrusion. (4) The display device according to (2) or (3), wherein the reinforcing plate has an opening, and the opening is formed at a position opposite to the display unit. (5) The display device according to any one of (1) to (4), wherein the wires are covered with a sealing material. (6) The display device according to (5), wherein the display unit comprises: a substrate provided on the reinforcing plate; and a translucent substrate laminated on the substrate, and the sealing material and the translucent substrate are spaced apart. (7) The display device according to (6), wherein the sealing material has curved surfaces at both ends. (8) The display device according to (6) or (7), wherein the sealing material is made of one type of resin. (9) The display device according to (6) or (7), wherein the sealing material is made of two or more types of resin. (10) The display device according to (9), wherein the two or more types of resin include a first resin and a second resin that contacts the first resin. (11) The display device according to (10), wherein the first resin is formed to be a straight line adjacent to the second resin in a plan view. (12) The display device according to (10), wherein the first resin is formed to be two straight lines sandwiching the second resin in a plan view. (13) The display device according to (10), wherein the first resin is formed to be U-shaped surrounding the second resin in a plan view. (14) The display device according to (10), wherein the first resin is formed to be ring-shaped surrounding the second resin in a plan view. (15) The display device according to any one of (5) to (7), wherein the sealing material is composed of a resin and a rigid material located around the resin.(16) The rigid material has two or more openings, the two or more openings are formed on the upper surface of the rigid material, the display device according to (15). (17) The rigid material is formed to surround and cover the resin, the display device according to (15) or (16). (18) The rigid material is formed to cover the resin, and further to expose the resin from the side surface of the sealing material, the display device according to (15) or (16). (19) The shape of the longitudinal cross-section of the rigid material is a shape including three or more bends or a curved shape, the display device according to any one of (15) to (18). (20) The reinforcing plate is formed of metal, glass epoxy or ceramics, the display device according to any one of (1) to (19). (21) The wire is formed of Au, Cu, Ag or Al, the display device according to any one of (1) to (20). (22) The display device according to any one of (1) to (21), wherein the display unit includes a Si substrate. (23) The display device according to any one of (1) to (22), wherein the display unit includes an organic light-emitting diode. (24) The display device according to any one of (1) to (23), wherein the flexible substrate is formed of polyimide, modified polyimide, liquid crystal polymer, or fluororesin. (25) A method for manufacturing a display device, comprising: providing the display unit and the flexible substrate on a reinforcing plate; and electrically connecting the display unit and the flexible substrate with wires. (26) An electronic device comprising the display device according to any one of (1) to (24). (27) A method for manufacturing a display device, comprising manufacturing the display device according to any one of (1) to (24).

[0269] 1 Display device 10 Display unit 10a Die bond material 11 Substrate 11a Pad unit 12 Translucent substrate 13 Wire 20 Flexible substrate 20a Adhesive 21 Connection unit 22 Connector unit 30 Reinforcement plate 31 Protrusion 32 Opening 40 Sealing material 41 Dam resin 42 Potting resin 45 Rigid material 45A Ceiling unit 45B Side wall 45a Inlet 45b Exhaust port 46 Adhesive M1 Curved surface M11 Side surface M12 Side surface M21 Inclined surface M22 Inclined surface M31 Curved surface

Claims

1. A display device comprising: a display unit; a flexible substrate electrically connected to the display unit by wires; and a reinforcing plate supporting the display unit and the flexible substrate.

2. The display device according to claim 1, wherein the display unit and the flexible substrate are provided on one surface of the reinforcing plate.

3. The display device according to claim 2, wherein the reinforcing plate has a protrusion, and the flexible substrate is provided on the protrusion.

4. The display device according to claim 2, wherein the reinforcing plate has an opening, and the opening is formed at a position opposite to the display portion.

5. The display device according to claim 1, wherein the wire is covered with a sealing material.

6. The display device according to claim 5, wherein the display unit comprises a substrate provided on the reinforcing plate and a translucent substrate laminated on the substrate, and the sealing material and the translucent substrate are spaced apart.

7. The display device according to claim 6, wherein the sealing material has curved surfaces at both ends.

8. The display device according to claim 6, wherein the sealing material is composed of one type of resin.

9. The display device according to claim 6, wherein the sealing material is composed of two or more types of resin.

10. The display device according to claim 9, wherein the two or more resins include a first resin and a second resin that contacts the first resin.

11. The display device according to claim 10, wherein the first resin is formed to be in a straight line adjacent to the second resin in a plan view.

12. The display device according to claim 10, wherein the first resin is formed so as to be two straight lines that sandwich the second resin in a plan view.

13. The display device according to claim 10, wherein the first resin is formed to have a U-shape that surrounds the second resin in a plan view.

14. The display device according to claim 10, wherein the first resin is formed to have a ring shape surrounding the second resin in a plan view.

15. The display device according to claim 5, wherein the sealing material is composed of a resin and a rigid material located around the resin.

16. The display device according to claim 15, wherein the rigid material has two or more openings, and the two or more openings are formed on the upper surface of the rigid material.

17. The display device according to claim 15, wherein the rigid material is formed to surround and cover the resin.

18. The display device according to claim 15, wherein the rigid material is formed to cover the resin, and further to expose the resin from the side surface of the sealing material.

19. The display device according to claim 15, wherein the shape of the longitudinal section of the rigid material is a shape that includes three or more bends or a curved shape.

20. A method for manufacturing a display device, comprising: providing a display unit and a flexible substrate on a reinforcing plate; and electrically connecting the display unit and the flexible substrate with wires.

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