Display device and electronic device having same

Abstract

Disclosed are a display device and an electronic device having same. The display device of the present disclosure may comprise: a housing; a display positioned inside the housing; a frame positioned inside the housing; a board having an element and spaced apart from the frame; a heat sink connected to the element and receiving heat from the element; a fan forming an airflow passing through the heat sink; and a heat pipe having one side connected to the heat sink and the other side connected to the frame.

Description

Display device and electronic device having the same

[0001] The present disclosure relates to a display device and an electronic device equipped with the same. More specifically, the present disclosure relates to an electronic device used in VR (virtual reality), AR (augmented reality), MR (mixed reality), etc.

[0002] Virtual reality (VR) refers to a specific environment or situation, or the technology itself, created using artificial technology such as computers that is similar to reality but is not actually real.

[0003] Augmented reality (AR) refers to a technology that superimposes virtual objects or information onto a real environment to make them appear as if they exist in the original environment.

[0004] Mixed Reality (MR) or Hybrid Reality refers to combining the virtual and real worlds to create new environments or information. In particular, the term Mixed Reality is used to describe a system that allows for real-time interaction between elements existing in the real and virtual worlds.

[0005] At this time, the created virtual environment or situation stimulates the user's five senses and enables spatial and temporal experiences similar to reality, thereby allowing the user to freely cross the boundary between reality and imagination. Furthermore, the user can not only simply immerse themselves in this environment but also interact with the elements implemented within it, such as by using actual devices to perform operations or issue commands.

[0006] Recently, active research is being conducted on the equipment (gear) used in these technology fields.

[0007] The present disclosure aims to solve the aforementioned problems and other problems.

[0008] Another purpose may be to provide a structure that dissipates heat generated from components on the display device board to the outside.

[0009] Another objective may be to provide a structure that can minimize the phenomenon of hot spots forming in specific parts of the display device.

[0010] Another purpose may be to provide a structure that dissipates the heat of the device to the heat sink and frame.

[0011] Another objective may be to provide a structure that uses a fan to form forced convection passing through the heat sink, and a structure that uses natural convection to release heat from the frame to the outside.

[0012] Another purpose may be to provide a vapor chamber that transfers heat from the device to the heat sink.

[0013] Another purpose may be to provide heat pipes that transfer heat from the heat sink to the frame.

[0014] Another objective may be to provide various examples of structures for cooling devices.

[0015] According to one aspect of the present disclosure for achieving the above or other purposes, a display device may comprise: a housing; a display located inside the housing; a frame located inside the housing; a board having an element and spaced apart from the frame; a heat sink connected to the element and receiving heat from the element; a fan forming an airflow passing through the heat sink; and a heat pipe, one end of which is connected to the heat sink and the other end of which is connected to the frame.

[0016] The electronic device may include: a display device; and a ring-shaped band connected to the display device.

[0017] The above display device can provide VR (virtual reality), AR (augmented reality), or MR (mixed reality) images.

[0018] The effects of the display device according to the present disclosure and the electronic device equipped with the same are described as follows.

[0019] According to at least one of the embodiments of the present disclosure, a structure for discharging heat generated in an element of a board of a display device to the outside can be provided.

[0020] According to at least one of the embodiments of the present disclosure, a structure can be provided that minimizes the phenomenon of a hot spot being formed in a specific part of a display device.

[0021] According to at least one of the embodiments of the present disclosure, a structure for dispersing heat from an element to a heat sink and a frame can be provided.

[0022] According to at least one of the embodiments of the present disclosure, a structure that forms forced convection passing through a heat sink using a fan and a structure that releases heat from a frame to the outside using natural convection can be provided.

[0023] According to at least one of the embodiments of the present disclosure, a vapor chamber that transfers heat of an element to a heat sink can be provided.

[0024] According to at least one of the embodiments of the present disclosure, a heat pipe that transfers heat from a heat sink to a frame can be provided.

[0025] According to at least one of the embodiments of the present disclosure, various examples of structures for cooling an element can be provided.

[0026] Further scopes of the applicability of the present disclosure will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present disclosure are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of the present disclosure, should be understood as being given merely as examples.

[0027] FIGS. 1 to 14 are drawings illustrating examples of a display device and an electronic device equipped with the same according to embodiments of the present disclosure.

[0028] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are given the same reference number, and redundant descriptions thereof will be omitted.

[0029] The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification, and do not inherently possess distinct meanings or roles.

[0030] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art may obscure the essence of the embodiments disclosed in this specification, such detailed description is omitted. Furthermore, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that they include all modifications, equivalents, and substitutions that fall within the concept and technical scope of this disclosure.

[0031] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0032] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0033] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0034] In this application, terms such as "comprising" or "having" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0035] The directional indications of Up (U), Down (D), Left (Le), Right (Ri), Front (F), and Rear (R) shown in the drawings are for convenience of explanation only and do not limit the technical concepts disclosed in this specification.

[0036]

[0037] Referring to FIG. 1, a user (P) may wear an electronic device (1) on their head. The display device (10) of the electronic device (1) may be positioned on the face of the user (P) and may provide an image (video) to the eyes of the user (P). The direction in which the display device (10) displays the image may be referred to as the rear (R), and the direction in which the user (P) looks at the image of the display device (10) may be referred to as the front (F, z). In this way, the directions of the electronic device (1)—up (U, y), down (D), left (Le, x), right (Ri), front (F, z), and rear (R)—can be defined based on the user (P) wearing the electronic device (1).

[0038] The display device (10) can provide VR (virtual reality), AR (augmented reality), or MR (mixed reality) to the user (P).

[0039] The electronic device (1) can be called a head-mounted display (HMD), a wearable display, a virtual reality (VR) device, an augmented reality (AR) device, a mixed reality (MR) device, or a display device.

[0040]

[0041] Referring to FIGS. 1 and 2, the electronic device (1) may include a display device (10), a box (20), and a band (30).

[0042] The display device (10) may include a housing (10H) and a display module (10D). The housing (10H) may form the exterior of the display device (10). The housing (10H) may have a tub shape overall and may be open toward the face of a user (P) wearing the electronic device (1). The housing (10H) may be referred to as a goggle frame (10H). The display module (10D) may be mounted inside the housing (10H) and may be directed toward the eyes of a user (P) wearing the electronic device (1). The display module (10D) may be any one of various types of display modules, such as an LCD (Liquid Crystal Display Device) module, an OLED (Organic Light Emitting Diode) module, or an LED (Light Emitting Diode) module. For example, the first display module (10Da) may be directed toward the left eye of the user (P), and the second display module (10Db) may be directed toward the right eye of the user (P). As another example, one display module (10D) may be directed toward both eyes of the user (P). The display device (10) may be referred to as a display unit (10). The display module (10D) may be referred to as a display (10D).

[0043] The box (20) may be opposite to the display device (10) with respect to the head of the user (P) wearing the electronic device (1). The box (20) may be directed toward the back of the head of the user (P). The box (20) may be referred to as a battery assembly (20), a battery pack (20), or a band adjustment unit (20).

[0044] The band (30) may extend along the circumference of the user (P)'s head. A portion of the band (30) may be positioned on the user (P)'s forehead. A portion of the band (30) may be positioned on the side of the user (P)'s head. The band (30) may be referred to as a headband (30). A box (20) may wrap around a portion of the band (30) and may be attached to the band (30). A display device (10) may be adjacent to one side of the band (30) and may be attached to the band (30). Accordingly, the band (30) may connect the box (20) and the display device (10).

[0045] A hinge (90) can connect a display device (10) and a band (30). One side of the hinge (90) can be fixed to the housing (10H) of the display device (10), and the other side of the hinge (90) can be fixed to the lower edge of the band (30). The display device (10) can rotate around a shaft of the hinge (90) that is parallel to the horizontal direction. Accordingly, the user can tilt the display device (10) located on the face upward, or tilt the display device (10) that has been tilted upward downward to position it on the face again.

[0046]

[0047] Referring to FIGS. 3 and 4, the display device (10) may include a plurality of components.

[0048] The rear housing (11) can be opened forward and backward. The rear housing (11) may be referred to as a facial pad (11). The rear housing (11) may include a mount (11m) that is rotatably coupled to a hinge (90).

[0049] The front housing (12) may extend along the edge of the rear housing (11) and may be open forward and backward. The front housing (12) may be coupled to the front of the rear housing (11). The front housing (12) and the rear housing (11) may form the housing (10H) of the display device (10). The internal space (10S) of the housing (10H) may be formed by the front housing (12) and the rear housing (11). The front housing (12) may be referred to as the front cover (12).

[0050] The inner bracket (13) can be mounted in the internal space (10S) of the housing (10H). A display module (10D) can be coupled to the inner bracket (13). The display module (10D) can be referred to as the display (10D). The first inner bracket (13a) can be extended along the edge of the first display module (10Da), and the first display module (10Da) can be coupled to the first inner bracket (13a). The second inner bracket (13b) can be extended along the edge of the second display module (10Db), and the second display module (10Db) can be coupled to the second inner bracket (13b). The inner bracket (13) can be referred to as the inner front (13).

[0051] The cover frame (14) can be mounted in the internal space (10S) of the housing (10H) and can be coupled to the rear of the display module (10D). The cover frame (14) can extend along the edge of the display module (10D) and can cover the edge of the display module (10D). A first hole (14a) can be formed in the cover frame (14), and the display panel of the first display module (10Da) can face the first hole (14a). A second hole (14b) can be formed in the cover frame (14), and the display panel of the second display module (10Db) can face the second hole (14b). The cover frame (14) can be referred to as a rear cover (14).

[0052] The frame (15) can be mounted in the internal space (10S) of the housing (10H). The frame (15) may have the shape of a square plate overall. The frame (15) may form the skeleton of the display device (10). The front housing (12) may extend along the edge of the frame (15). The frame (15) may be located in front of the display module (10D). The frame (15) may include a metal material. The frame (15) may be referred to as a plate (15), a metal frame (15), a module cover (15), or a cover bottom (15).

[0053] The board (16) may be located in the internal space (10S) of the housing (10H) and may be positioned in front of the frame (15). The board (16) may be a Printed Circuit Board (PCB). The board (16) may be referred to as a substrate (16) or a main PCB (16). Components (elements, see FIG. 5) may be mounted on the board (16). The components may be mounted on one side (i.e., the front) of the board (16). The components may be mounted on both sides (i.e., the front and the back) of the board (16). The circuit pattern of the board (16) may be formed on both sides (i.e., the front and the back) of the board (16). The board (16) may be spaced apart from the frame (15). At least some of the components may be heat-generating elements that generate heat when current flows.

[0054] Cooling components (100) may be located in the internal space (10S) of the housing (10H) and may release heat generated from the board (16) to the outside of the housing (10H). Cooling components (100) may include a heat sink (101), a fan (102), a heat pipe (103), and a vapor chamber (104).

[0055] The bracket board (17) may be located in the internal space (10S) of the housing (10H) and may be positioned in front of the board (16). A Printed Circuit Board (PCB) may form part of the bracket board (17). The bracket board (17) may be referred to as a bracket PCB (17).

[0056] The camera module (18) may be located in the internal space (10S) of the housing (10H) and may be positioned in front of the bracket board (17). The camera module (18) may include a camera. The camera module (13) may be referred to as a front camera (13).

[0057] The window (19) can cover the front of the camera module (18) and can be coupled to the front of the front housing (12). The window (19) can cover the front opening of the front housing (12). The window (19) may include a hole (19h) facing the camera of the camera module (18). The window (19) may be referred to as the main window (19).

[0058]

[0059] Referring to FIGS. 5 and 6, the device (16A) may be mounted on the top of the board (16). The front of the board (16) may form the top of the board (16), and the rear of the board (16) may form the bottom of the board (16). The device (16A) may be a heat-generating device that generates heat when current flows through it. The device (16A) may be an IC (Integrated Circuit) chip. The device (16A) may be a SoC (System on Chip). The device (16A) may be an AP (Application Processor). The device (16A) may be the main chip of the board (16). The device (16A) may be referred to as a heat-generating device (16A), a chip (16A), or a processor (16A). For example, the component (16A) may be located in the center of the board (16) or near it.

[0060] A heat sink (101) may be connected to a component (16A) of a board (16). The heat sink (101) may be coupled to or attached to the component (16A). The heat sink (101) may come into direct or indirect contact with the component (16A). The component(s) of the board (16), excluding the component (16A), may be spaced apart from the heat sink (101). The heat sink (101) may be made of a metal material such as aluminum or copper. The heat sink (101) may be provided with fins (101F).

[0061] A fan (102) may be adjacent to a heat sink (101). The fan (102) may be coupled to a front housing (12). The fan (102) may form an airflow through the heat sink (101). That is, air drawn into the fan (102) may be discharged toward the heat sink (101). The air may pass between the fins (101F) of the heat sink (101).

[0062] A heat pipe (103) may be located between the board (16) and the frame (15). The heat pipe (103) may include a pipe and a fluid (refrigerant) inside the tube. The fluid may evaporate due to heat transferred to the heat pipe (103). As the heat of the evaporated fluid is transferred to the outside of the heat pipe (103), the fluid may condense. The condensed fluid may return to its original position by capillary action or gravity and repeat the aforementioned process. That is, within the internal space of the heat pipe (103), the fluid may convect as it evaporates into a gaseous state or condenses into a liquid state. For example, the fluid may be water.

[0063] One side of the heat pipe (103) may be connected to the heat sink (101), and the other side of the heat pipe (103) may be connected to the frame (15). The heat pipe (103) may be spaced apart from the board (16). The heat pipe (103) may have an overall "U" or square bracket ([, square bracket) shape. The heat pipe (103) may include a top part (103A) and a bottom part (103B). The top part (103A) may be connected to the heat sink (101) and may be adjacent to but spaced apart from the side (e.g., top side) of the board (16). The bottom part (103B) may be formed by pressing from the top part (103A) toward the frame (15) and may be connected to the frame (15). The bottom part (10B) can be located between the board (16) and the frame (15) and can be spaced apart from the board (16).

[0064] The top part (103A) can form the central part of the heat pipe (103) and can extend to the left and right. The first bottom part (103Ba) can be bent downward from the left end of the top part (103A) and can form a step that lowers backward from the top part (103A). The second bottom part (103Bb) can be bent downward from the right end of the top part (103A) and can form a step that lowers backward from the top part (103A).

[0065] The groove (15G) may be recessed from one side (i.e., the front) of the frame (15) facing the board (16). The groove (15G) may extend along the bottom part (103B) of the heat pipe (103), and the bottom part (103B) may be located on the groove (15G). Accordingly, the groove (15G) may guide the connection between the heat pipe (103) and the frame (15).

[0066]

[0067] Referring to FIGS. 7 and 8, a vapor chamber (104) may be located between a board (16) and a heat sink (101). The vapor chamber (104) may include two plates joined together and a fluid (refrigerant) located in the space between the plates (i.e., the internal space of the vapor chamber (104). The fluid may be evaporated by heat transferred to the vapor chamber (104). As the heat of the evaporated fluid is transferred to the outside of the vapor chamber (104), the fluid may condense. The condensed fluid may return to its original position by capillary action or gravity and repeat the process described above. That is, within the internal space of the vapor chamber (104), the fluid may convect as it evaporates into a gaseous state or condenses into a liquid state. For example, the fluid may be water.

[0068] The first surface (1041) may form one side of the vapor chamber (104) and may face the component (16A) of the board (16). The first surface (1041) may be the rear side of the vapor chamber (104). The vapor chamber (104) may contact the component (16A) directly or indirectly through a thermal pad (105). The thermal pad (105) may include a material with excellent thermal conductivity. The thermal pad (105) may function as double-sided tape. Accordingly, heat from the component (16A) can be easily transferred to the vapor chamber (104). Alternatively, the vapor chamber (104) may be omitted, in which case the component (16A) may be directly connected to the heat sink (101).

[0069] A first surface (1041) facing the element (16A) may face the heat pipe (103). The first surface (1041) may contact the heat pipe (103) directly or indirectly through a thermal pad (105). The thermal pad (105) may include a material with excellent thermal conductivity. The thermal pad (105) may function as double-sided tape. One thermal pad (105) may contact the element (16A) and the heat pipe (103). Alternatively, a first thermal pad (105a) may contact the element (16A), and a second thermal pad (105b), spaced apart from the first thermal pad (105a), may contact the heat pipe (103). Accordingly, heat from the vapor chamber (104) can be easily transferred to the heat pipe (103). Alternatively, the heat pipe (103) may be directly connected to the heat sink (101). In this case, the heat pipe (103) may be separated from the vapor chamber (104), or the vapor chamber (104) may be omitted.

[0070] The second surface (1042) may form the other surface of the vapor chamber (104) and may face the heat sink (101). The second surface (1042) may be the front surface of the vapor chamber (104). The vapor chamber (104) may come into direct contact with the heat sink (101) or indirect contact with the heat sink (101) through a thermal pad. The thermal pad may include a material with excellent thermal conductivity. The thermal pad may function as double-sided tape. Accordingly, heat from the vapor chamber (104) can be easily transferred to the heat sink (101).

[0071] The second surface (1042) facing the heat sink (101) may face the fan (102). For example, the component (16A) of the board (16) may be positioned in a portion corresponding to the fan (102) and the heat sink (101). The vapor chamber (104) may be in direct contact with the fan (102) or indirectly in contact with the fan (102) through a thermal pad. The thermal pad may include a material with excellent thermal conductivity. The thermal pad may function as double-sided tape. Accordingly, heat from the vapor chamber (104) can be easily transferred to the fan (102).

[0072] The part of the vapor chamber (104) facing the element (16A) may be called the heat-absorbing part (104a), and the fluid in the vapor chamber (104) may evaporate in the heat-absorbing part (104a). The part of the vapor chamber (104) between the heat sink (101) and the heat pipe (103) may be called the heat-dissipating part (104b), and the fluid in the vapor chamber (104) may condense in the heat-dissipating part (104b). The part of the heat pipe (103) facing the vapor chamber (104), i.e., the top part (103A), may be opposite to the heat sink (101) with respect to the vapor chamber (104). The heat-dissipating part (104b) may be located above the heat-absorbing part (104a). The heat dissipation portion (104b) may be formed at the top of the vapor chamber (104), and the heat absorption portion (104a) may be formed at the center or bottom of the vapor chamber (104). A portion of the heat sink (101) and the top part (103A) of the heat pipe (103) may be adjacent to the top of the vapor chamber (104). This may take into account the characteristic that a relatively high-temperature fluid tends to move upwards compared to a relatively low-temperature fluid.

[0073] A duct (106) may be adjacent to a heat sink (101). The duct (106) may be coupled to a front housing (12). The duct (106) may include a first cover (106a) and a second cover (106b) spaced apart from each other. The first cover (106a) may cover the front of the heat sink (101). The first cover (106a) may be curved along the corner of the window (19) and the front housing (12). The second cover (106b) may be opposite to the first cover (106a) with respect to the heat sink (101). The second cover (106b) may be curved along the first cover (106a). Air passing through the heat sink (101) can pass through the space between the first cover (106a) and the second cover (106b), that is, the path (106P, path) of the duct (106).

[0074]

[0075] Referring to FIGS. 8 and 9, the heat pipe (103) may come into direct contact with the frame (15) or indirectly through a thermal pad (107). The thermal pad (107) may include a material with excellent thermal conductivity. The thermal pad (107) may function as double-sided tape. Accordingly, heat from the heat pipe (103) can be easily transferred to the frame (15). That is, heat from the heat pipe (103) can spread to the frame (15).

[0076] A plurality of holes (10P) may be formed in the housing (10H) of the display device (10). The hole (10P) may be a hole formed by penetrating the housing (10H). The hole (10P) may be a gap between the housing (10H) and a component (e.g., a button, etc.) mounted on the housing (10H). The plurality of holes (10Pi, 10Pe, 10P1, 10P2) may be spaced apart from each other.

[0077] An intake hole (10Pi) may be formed in the front housing (12) and may supply air to the fan (102). The intake hole (10Pi) may be referred to as an intake port (10Pi, intake), an intake hole (10Pi), or a first hole (10Pi). The intake hole (10Pi) may be adjacent to the fan (102) and may be formed in the lower part of the front housing (12). For example, the intake hole (10Pi) may be a slit formed long from left to right. Alternatively, the intake hole (10Pi) may be a collection of holes spaced apart from each other. When the fan (102) is driven, air (Ai) from outside the housing (10H) may pass through the intake hole (10Pi) and flow into the fan (102). The fan (102) may discharge air toward the heat sink (101). Air passing through the heat sink (101) can pass through the pass (106P) of the duct (106).

[0078] An exhaust hole (10Pe) may be formed in the front housing (12) and may face the pass (106P) of the duct (106). The exhaust hole (10Pe) may be referred to as an exhaust port (10Pe, exhaust), a discharge hole (10Pe), a discharge hole (10Pe), or a second hole (10Pe). The exhaust hole (10Pe) may be adjacent to the duct (106) and may be formed on the upper part of the front housing (12). For example, the exhaust hole (10Pe) may be a slit extending horizontally along the pass (106P). Alternatively, the exhaust hole (10P3) may be a collection of holes spaced apart from each other. Air (Ae) passing through the pass (106P) of the duct (106) may be discharged to the outside of the housing (10H) through the exhaust hole (10Pe).

[0079] Accordingly, heat from the component (16P) of the board (16) can be transferred to the heat sink (101) through the vapor chamber (104), and the airflow generated by the fan (102) can cool the heat sink (101). That is, heat from the heat sink (101) can be released as air that is drawn into the intake hole (10Pi) by the fan (102) and discharged through the exhaust hole (10Pe).

[0080] A hole (10P) may be formed in the front housing (12) and / or the rear housing (11). The hole (10P) may be referred to as a vent hole (10P). The internal space (10S) of the housing (10H) may be in communication with the external space of the housing (10H) through the first and second holes (10P1, 10P2). The first hole (10P1) may be formed in the lower part of the housing (10H), and the second hole (10P2) may be formed in the upper part of the housing (10H). The first and second holes (10P1, 10P2) may be adjacent to the frame (15). Either the first hole (10P1) or the second hole (10P2) may be omitted. Alternatively, at least one additional hole may be formed in the housing (10H) in addition to the first hole (10P1) and the second hole (10P2).

[0081] Accordingly, heat from the element (16P) of the board (16) can be diffused into the frame (15) through the vapor chamber (104) and the heat pipe (103), and (natural) convection passing through the hole(s) of the housing (10H) can cool the frame (15). That is, heat from the frame (15) can be transferred to the air surrounding the frame (15), and the air, whose temperature has risen due to the heat from the frame (15), can be discharged to the outside through the first hole (10P1) and / or the second hole (10P2).

[0082]

[0083] Referring to FIGS. 10 and 11, heat from the heat pipe (103) can be diffused into the frame (15). The frame (15) may be made of a metal material. A plurality of grooves (15N) may be formed on the lateral side of the frame (15) and may be spaced apart from each other along said lateral side. The grooves (15N) may be arranged along said lateral side of the frame (15). First grooves (15Na) may be arranged along the upper side of the frame (15). Second grooves (15Nb) may be arranged along the lower side of the frame (15). Third grooves (15Nc) may be arranged along the left side of the frame (15). Fourth grooves (15Nd) may be arranged along the right side of the frame (15). The grooves (15N) may be referred to as notches (15N).

[0084] For example, the groove (15N) may be a rectangular groove. The portion of the frame (15) forming the groove (15N) may include a first surface (15N1), a second surface (15N2), and a third surface (15N3). The first surface (15N1) may form the bottom of the groove (15N), and the second and third surfaces (15N2, 15N3) may form the side walls of the groove (15N). In a specific portion (15A) of the frame (15) having the groove (15N), the cross-sectional area in contact with air may be equal to the sum of the areas of the first to third surfaces (15N1, 15N2, 15N3) and the sum of the areas of the fourth and fifth surfaces (15N4, 15N5). In comparison, if a specific part (15A) does not have a groove (15N), the cross-sectional area in contact with air may be equal to the sum of the area of ​​the first surface (15N1) and the areas of the fourth and fifth surfaces (15N4, 15N5).

[0085] Accordingly, the cross-sectional area of ​​the frame (15) having grooves (15N) can be increased, and as a result, the amount of heat discharged from the frame (15) to the air surrounding the frame (15) can be increased.

[0086]

[0087] Referring to FIG. 12, as described above with reference to FIG. 1 to 11, the heat of the element (16P) of the board (16) can be dispersed not only to the heat sink (101) through which the airflow of the fan (102) passes, but also to the frame (15) through which natural convection passes. Accordingly, the temperature rise of the air discharged through the exhaust hole (10Pe) can be suppressed. In addition, the temperature rise of the heat sink (101) or the part (10Hh) of the housing (10H) adjacent to the heat sink (101) can be reduced. That is, the phenomenon of a hot spot being formed in the part (10Hh) of the housing (10H) around the exhaust hole (10Pe) can be reduced. For example, the temperature of the part (10Hh) of the housing (10H) in FIG. 12 may be about 4°C lower than the temperature of the part (10Hh) of the housing (10H) in FIG. 14, which will be described later.

[0088] Referring to FIGS. 13 and 14, unlike the above description with reference to FIGS. 1 to 12, the heat of the element (16P) of the board (16) can be transferred only to the heat sink (101) through which the airflow of the fan (102) passes, and can be discharged outside the housing (10H). In this case, the temperature of the air discharged outside the housing (10H) can be significantly increased. Also, the temperature of the heat sink (101) or the part (10Hh) of the housing (10H) adjacent to the heat sink (101) can be significantly increased, and a hot spot may be formed.

[0089]

[0090] Referring to FIGS. 1 to 14, a display device (10) may include: a housing (10H); a display (10D) located inside the housing (10H); a frame (15) located inside the housing (10H); a board (16) having an element (16A) and spaced apart from the frame (15); a heat sink (101) connected to the element (16A) and receiving heat from the element (16A); a fan (102) forming an airflow passing through the heat sink (101); and a heat pipe (103) having one end connected to the heat sink (101) and the other end connected to the frame (15).

[0091] The above frame (15) may include a metal material.

[0092] The board (16) may be located between the heat sink (101) and the frame (15), and a portion of the heat pipe (103) may be located between the board (16) and the frame (15) and spaced apart from the board (16).

[0093] The above display device (10) may further include a vapor chamber (104) located between the element (16A) of the board (16) and the heat sink (101), and one side (1041) of the vapor chamber (104) may be in contact with the element (16A) of the board (16), and the other side (1042) of the vapor chamber (104) may be in contact with the heat sink (101).

[0094] The fan (102) may be adjacent to the heat sink (101), and the other surface (1042) of the vapor chamber (104) may be in contact with the fan (102).

[0095] The above vapor chamber (104) may be located between the one side of the heat pipe (103) and the heat sink (101), and the one surface (1041) of the above vapor chamber (104) may be in contact with the one side of the heat pipe (103).

[0096] The portion of the vapor chamber (104) between the heat pipe (103) and the heat sink (101) may be located above the portion of the vapor chamber (104) facing the element (16A) of the board (16).

[0097] The above display device (10) may further include a thermal pad (105) located between the one side (1041) of the vapor chamber (104) and the element (16A) of the board (16), and the thermal pad (105) may be located between the one side (1041) of the vapor chamber (104) and the one side of the heat pipe (103).

[0098] The heat pipe (103) may include: a top part (103A) connected to the heat sink (101); and a bottom part (103B) pressed from the top part (103A) toward the frame (15) and connected to the frame (15).

[0099] The above frame (15) may include a groove (15G) that is recessed from one side of the frame (15) toward the bottom part (103B), extends along the bottom part (103B), and is located at the bottom part (103B).

[0100] The above housing (10H) may include: an intake hole (10Pi) formed in the housing (10H) and providing air to the fan (102); and an exhaust hole (10Pe) formed in the housing (10H) through which air passing through the heat sink (101) passes.

[0101] The display device (10) may further include a duct (106) located around the heat sink (101) and providing a path (106P) toward the exhaust hole (10Pe).

[0102] The above frame (15) may include a plurality of grooves (15N) formed on the lateral side of the frame (15) and arranged along the lateral side.

[0103] The above housing (10H) may include at least one hole (10P) formed in the housing (10H) and adjacent to the frame (15).

[0104] The electronic device (1) may include: a display device (10); and a ring-shaped band (30) connected to the display device (10).

[0105] The above display device (10) can provide VR (virtual reality), AR (augmented reality), or MR (mixed reality) images.

[0106]

[0107] Some or other embodiments of the present disclosure described above are not exclusive or distinct from one another. Some or other embodiments of the present disclosure described above may be used in combination or combined for their respective configurations or functions.

[0108] For example, this means that configuration A described in a specific embodiment and / or drawing and configuration B described in another embodiment and / or drawing can be combined. That is, even if the combination between configurations is not directly described, it means that combination is possible, except in cases where it is described that combination is impossible.

[0109] The foregoing detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of the invention shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the invention are included within the scope of the invention.

Claims

1. Housing; A display located inside the above housing; A frame located inside the above housing; A board having an element and spaced apart from the frame; A heat sink connected to the above element and receiving heat from the above element; A fan that forms an airflow passing through the above heat sink; and, A display device comprising a heat pipe, one side of which is connected to the heat sink and the other side of which is connected to the frame.

2. In Paragraph 1, The above frame is a display device comprising a metal material.

3. In Paragraph 1, The above board is, Located between the heat sink and the frame, Part of the above heat pipe, A display device located between the board and the frame and spaced apart from the board.

4. In Paragraph 1, It further includes a vapor chamber located between the element of the board and the heat sink, and One side of the above vapor chamber contacts the element of the above board, and The other side of the above vapor chamber is a display device in contact with the heat sink.

5. In Paragraph 4, The above fan is adjacent to the heat sink, and The other surface of the above vapor chamber is a display device in contact with the fan.

6. In Paragraph 4, The above vapor chamber is, Located between the one side of the heat pipe and the heat sink, One side of the above vapor chamber is, A display device in contact with one side of the heat pipe.

7. In Paragraph 6, The portion of the vapor chamber between the heat pipe and the heat sink is, A display device located above the portion of the vapor chamber facing the element of the board.

8. In Paragraph 6, It further includes a thermal pad located between the one surface of the above vapor chamber and the element of the above board, and The above thermal pad is, A display device located between the one side of the above vapor chamber and the one side of the above heat pipe.

9. In Paragraph 1, The above heat pipe is: A top part connected to the above heat sink; and, A display device comprising a bottom part that is pressed from the top part toward the frame and connected to the frame.

10. In Paragraph 9, The above frame is: A display device comprising a groove that is recessed from one side of the frame toward the bottom part, extends along the bottom part, and is located at the bottom part.

11. In Paragraph 1, The above housing is: An intake hole formed in the above housing and providing air to the fan; and, A display device comprising an exhaust hole formed in the housing and through which air passing through the heat sink passes.

12. In Paragraph 11, A display device further comprising a duct located around the heat sink and providing a path toward the exhaust hole.

13. In Paragraph 1, The above frame is: A display device comprising a plurality of grooves formed on the lateral side of the frame and arranged along the lateral side.

14. In Paragraph 1, The above housing is: A display device comprising at least one hole formed in the housing and adjacent to the frame.

15. Display device of claim 1; and, It includes a ring-shaped band connected to the above-mentioned display device, The above display device is, An electronic device that provides VR (virtual reality), AR (augmented reality), or MR (mixed reality) images.

Images