Injection mold device for forming product

Abstract

This injection mold device may comprise: an upper circular plate configured to move upward when a mold is opened and move downward when the mold is engaged; a lower circular plate configured to be separated from the upper circular plate when the mold is opened and to be coupled to the upper circular plate when the mold is engaged; an upper core coupled to the upper circular plate; a lower core coupled to the lower circular plate; a base substrate; an ejector plate disposed on the base substrate; and an ejector pin structure coupled to the ejector plate. The lower core may include a support surface and a protruding portion for forming a cavity for the product. The injection mold device may include a buffer member coupled to the protruding portion of the lower core. The ejector pin structure may comprise: a molding portion configured to form the cavity together with the upper core and the lower core; a connection portion which is coupled to the molding portion and is arranged to pass through the support surface of the lower core while being inclined with respect to a stacking direction toward the support surface; and a support portion coupled to the connection portion and disposed on the ejector plate.

Description

Injection mold device for forming a product

[0001] The present disclosure relates to an injection molding apparatus for forming a product.

[0002] A mold device is used as a device for forming products. A mold device is manufacturing process equipment used to mass-produce products of a specific shape, and can be configured to mold materials into a desired shape through methods such as casting, injection, and extrusion.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, an injection molding apparatus for forming a product is provided. The injection molding apparatus may include: an upper plate configured to move upward when opening the mold and downward when closing the mold; a lower plate configured to be separated from the upper plate when opening the mold and coupled to the upper plate when closing the mold; an upper core coupled to the upper plate; a lower core coupled to the lower plate, a base substrate; a push plate disposed on the base substrate; and a push pin structure coupled to the push plate. The lower core may include a support surface and a protruding portion for forming a cavity for the product. The injection molding apparatus may include a cushioning member coupled to the protruding portion of the lower core. The push pin structure may include a molding portion configured to form the cavity together with the upper core and the lower core; a connecting portion coupled to the molding portion and disposed to be inclined with respect to the stacking direction toward the support surface by penetrating the support surface of the lower core; and a supporting portion coupled to the connecting portion and disposed on the push plate. As the ejector pin structure moves in accordance with the movement of the ejector plate, the molded portion can be positioned to come closer to the protruding portion of the lower core. The cushioning member can be positioned between the molded portion and the protruding portion to face the molded portion in order to prevent at least a portion of the molded portion from contacting the protruding portion of the lower core.

[0005] In embodiments of the present disclosure, an injection mold device for forming a product may include: an upper plate configured to move upward when opening the mold and downward when closing the mold; a lower plate configured to be separated from the upper plate when opening the mold and coupled to the upper plate when closing the mold; an upper core coupled to the upper plate; a lower core coupled to the lower plate, a base substrate; a push plate disposed on the base substrate; and a plurality of push pin structures coupled to the push plate. The lower core may include a support surface and a protruding portion for forming a cavity for the product. The injection mold device may include cushioning members coupled to the protruding portion of the lower core. Each of the plurality of push pin structures may include a molding portion configured to form the cavity together with the upper core and the lower core; a connecting portion coupled to the molding portion and disposed to be inclined toward the stacking direction toward the support surface by penetrating the support surface of the lower core; and a supporting portion coupled to the connecting portion and disposed on the push plate.

[0006] Figures 1a and 1b show examples of injection mold devices.

[0007] Figure 2 shows an example of an exploded perspective view of a push pin structure.

[0008] Figure 3 shows an example of a perspective view of a push pin structure.

[0009] Figure 4 shows an example of a push pin structure.

[0010] Figures 5a and 5b show examples of the operating principle of a push pin structure.

[0011] Figures 6a and 6b show examples of fastening structures of the components of a push pin structure.

[0012] Figure 7a shows an example of the assembly of a core and a push pin structure.

[0013] Figure 7b shows an example of the assembly of the molded part and the connecting part of the ejector pin structure.

[0014] Figure 8 shows an example of components within a pocket of an injection mold device.

[0015] Figures 9a, 9b, and 9c show examples of cooling systems for a fin structure.

[0016] Figure 10 shows an example of an exploded perspective view of a fin structure having a cooling system.

[0017] Figures 11a and 11b show examples of injection mold devices including ejector pin structures.

[0018] FIGS. 12a, FIGS. 12b, and FIGS. 12c show examples of an injection molding device including a push pin structure and a product formed through the injection molding device.

[0019] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0020] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0021] Terms used in the following description to refer to parts in a mold (e.g., disc, fixed plate, upper plate, lower plate, ejector plate, upper ejector plate, lower ejector plate, core, upper core, lower core, ejector pin, ejector pin structure, rod), terms referring to the function of a part (e.g., cooling circuit, cooling tube, stop pin, locking, locking member, cooling ring, link pin, cooling ring, molding part, support part, connecting part, inclined ejector pin, head part, root part, leg part, leg part), and terms referring to the shape of a part (e.g., protrusion part, surface, ring, plunger, pin, nipple), etc., are examples provided for the convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Furthermore, terms such as '...part', '...machine', '...object', '...body', etc. used below may refer to at least one shape structure or a unit that processes a function.

[0022] Additionally, in the present disclosure, expressions of "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions of "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of elements from A (including A) to B (including B). Below, "C" and / or "D" refers to at least one of "C" or "D," i.e., including {"C", "D", "C" and "D"}. FIGS. 1a and 1b illustrate examples of injection molding devices.

[0023] Referring to FIG. 1a, the injection mold device (101) may include components that constitute a mold for molding a product (120). The injection mold device (101) may include a core for molding the product (120), a mold base for supporting the core, an ejector system for pushing out the molded product (120) from the mold, and a cooling system for removing heat from the mold to solidify the molded product (120). The injection mold device (101) may include a base substrate (105). The product (120) may be formed through a plurality of molding structures disposed on the base substrate (105). For example, the product (120) may be a frame (e.g., an external frame) of an electronic device (e.g., a smartphone, a tablet). For example, each molding structure may include an upper core (e.g., upper core (181)) for forming the exterior of the product (120), a lower core (e.g., lower core (182)) for forming the interior of the product (120), and / or four molding portions for forming the sides of the product (120) (e.g., a first molding portion (111) for the lower side of the product (120), a second molding portion (112) for the right side of the product (120), a third molding portion (113) for the upper side of the product (120), and a fourth molding portion (114) for the left side of the product (120). An injection molding device (101) according to embodiments of the present disclosure may include a molding pin structure (130) including molding portions for forming sides, instead of a slide core, to mitigate the problem of step-over occurring due to cumulative tolerance and / or thermal expansion amount management of the product (120). The ejector pin structure (130) is part of the ejector system and is used to eject the product (120) after molding, and can also form a cavity as an empty space where the product (120) is formed.

[0024] Referring to FIG. 1b, the components of an injection mold device (101) are described. The injection mold device (101) may include an upper fixing plate (151) and a lower fixing plate (152). For example, the lower fixing plate (152) may correspond to a part of the base substrate (105). The injection mold device (101) may include an upper plate (161) and a lower plate (162). The upper plate (161) may be coupled to the upper fixing plate (151). The lower plate (162) may be coupled to the lower fixing plate (152) via one or more legs (e.g., a first leg (190a) and a second leg (190b)). The injection mold device (101) may form a product (e.g., product (120)) through molding and eject the product after opening the mold. When the mold is closed, the upper plate (161) can move downward and be combined with the lower plate (162). When the mold is opened, the upper plate (161) can move upward and be separated from the lower plate (162). The injection mold device (101) may include an upper core (181) and a lower core (182). The upper core (181) can be combined with the upper plate (161). The lower core (182) can be combined with the lower plate (162). When the mold is opened, the upper plate (161) and the lower plate (162) are separated, and thus the upper core (181) and the lower core (182) can be separated. When the mold is closed, the upper plate (161) and the lower plate (162) are combined, and thus the upper core (181) and the lower core (182) can be combined. For example, the upper core (181) may be configured to form the exterior or upper part of the product (120). The lower core (182) may be configured to form the interior or lower part of the product (120).

[0025] The injection mold device (101) may include an ejector system. The ejector system may be used to separate a molded product (120) from a core (182) through a material (e.g., plastic, metal) introduced into the cavity. The injection mold device (101) may include, as the ejector system, an ejector pin structure (130) for separating the product (120) and a plate on which the ejector pin structure (130) is placed (e.g., an upper plate (171) and a lower plate (172)). In the plate, the upper plate (171) and the lower plate (172) may be separated according to the stacking direction (e.g., the (+)z-axis). FIG. 2 shows an example of an exploded perspective view of an ejector pin structure (e.g., an ejector pin structure (130)). FIG. 3 shows an example of a perspective view of an ejector pin structure. The same reference numerals may be used for the same description.

[0026] Referring to FIG. 2, the ejector pin structure (130) may include a molding portion (211). The molding portion (211) may be an area for forming a cavity together with an upper core (e.g., upper core (181)) and a lower core (e.g., lower core (182)). A material (e.g., plastic, metal) may be introduced into the cavity formed through the upper core (181), lower core (182), and molding portion (211), and a product (e.g., product (120)) may be formed through the material. The molding portion (211) may be used to eject the product (120) according to the forward and / or backward movement of the ejector plate (e.g., upper ejector plate (171), lower ejector plate (172)). The molding portion (211) may be configured to be spaced apart from the undercut of the product (120) according to the advance and / or retraction of the molding plate (e.g., upper molding plate (171), lower molding plate (172)). For example, the undercut portion formed under the molding portion (211) through the material may be removed according to the movement of the ejector pin structure (130). In addition to the molding portion, the molding portion (211) may be referred to as a side molding portion, a slide molding portion, a slide portion, a slide insert, a slide insert portion, an insert portion, a side insert portion, a side insert, a side core portion, an ejector pin portion, an ejector pin head portion, and / or equivalent structural / technical terms.

[0027] The ejector pin structure (130) may include a connecting portion (212) (e.g., a first connecting portion (212a), a second connecting portion (212b)). For example, the ejector pin structure (130) may include a first connecting portion (212a) near a first end of the molding portion (210) for stable support and a second connecting portion (212b) near a second end located opposite to the first end (e.g., opposite side with respect to the longitudinal direction (e.g., x-axis)). The ejector pin structure (130) may be used instead of a slide core to form the side of the product (120). The molding portion (211) of the ejector pin structure (130) may be required to move in one direction (e.g., the (+)y-axis direction) to form the side of the product (120). Meanwhile, since the ejector pin structure (130) moves up and down along the stacking direction (e.g., (+)z-axis direction), an inclination may be required to convert the up and down movement into a horizontal movement. The forming portion (211) may include a connecting portion (212) connected to a support placed on the ejector plate. For example, the connecting portion (212) may move as the support moves in the opening direction (e.g., (-)z-axis direction). The connecting portion (212) may be positioned to be inclined with respect to the stacking direction (e.g., z-axis direction). The connecting portion (212) may move along a direction inclined at a certain angle (e.g., less than 90 degrees) with respect to the stacking direction (e.g., z-axis direction). As the connecting portion (212) moves, the forming portion (211) may move. The connecting portion (212) may be used to guide the movement of the forming portion (211) according to the movement of the ejector plate. The forming portion (211) can move in a direction inclined to the stacking direction (e.g., z-axis direction). For example, when the ejector pin is lowered, the movement of the forming portion (211) may include movement in the stacking direction (e.g., (-)z-axis direction) and movement in a direction parallel to the stacking direction (e.g., (+)y-axis direction).For example, as the support moves in the mating direction (e.g., the (+)z-axis direction), the connecting part (212) may move. As the connecting part (212) moves, the forming part (211) may move in another direction (e.g., the (-)y-axis direction). In addition to the connecting part, the connecting part (212) may be referred to as a fastening part, a fastening section, a power transmission part, a moving part, an inclined moving part, an inclined guide part, an inclined connecting part, a push pin connecting part, a push pin fastening part, a power transmission structure, an inclined fastening part, a push pin leg part, a push pin tail part, a push pin root part, and / or equivalent structural / technical terms.

[0028] The ejector pin structure (130) may include pin portions (213) (e.g., a first pin portion (213a), a second pin portion (213b)). For example, the ejector pin structure (130) may include a first pin portion (213a) located near a first end of the molding portion (210) for stable control and a second pin portion (213b) located opposite to the first end (e.g., opposite side with respect to the longitudinal direction (e.g., x-axis)). The pin portions (213) may be used to control the flow of the molding portion (211). For example, the pin portions (213) may be used to control the degree of displacement when the molding portion (211) moves horizontally. The pin portions (213) pass through a hole in the molding portion (211), and the ends of the pin portions (213) may be connected to a connecting portion (212). For example, the end of the first pin portion (213a) may be coupled with the first connecting portion (212a). The end of the second pin portion (213b) may be coupled with the second connecting portion (212b). A groove formed in the connecting portion (212) may be used to guide the movement of the pin portion (213) when the pin portion (213) moves due to contact between the molding portion (211) and the cushioning member (215). The pin portion (213) may be referred to as a stop pin, moving pin, push pin, adjustment pin, extrusion pin, sliding pin, adjustment pin, push adjustment pin, guide pin, control pin, and / or equivalent structural / technical terms other than pin portion.

[0029] The ejector pin structure (130) may include fastening parts (214) (e.g., a first fastening part (214a), a second fastening part (214b)). For example, the ejector pin structure (130) may include a first fastening part (214a) located near a first end of the molded portion (210) and a second fastening part (214b) located opposite to the first end (e.g., opposite side with respect to the longitudinal direction (e.g., x-axis)) for stable connection. The fastening parts (214) may be used to fasten the molded portion (211) and the connecting portion (212). The fastening parts (214) pass through a hole in the molded portion (211), and the end of the fastening parts (214) may be coupled to a recess formed in the connecting portion (212). For example, the first fastening part (214a) passes through the first hole of the molding part (211), and the end of the first fastening part (214a) may be joined to the first recess formed in the first connecting part (212a). The second fastening part (214b) passes through the second hole of the molding part (211), and the end of the second fastening part (214b) may be joined to the second recess formed in the second connecting part (212b). The recess may include an undercut portion for fixing the movement of the fastening part (214) in the stacking direction (e.g., z-axis direction) and a guide portion for the movement of the fastening part (214) on a plane perpendicular to the stacking direction (e.g., z-axis direction) (e.g., xy plane). The fastening part (214) may be referred to in addition to the fastening part as a fastening member, connecting member, fixing member, connecting component, link pin, link component, link member, fastening component, control element, control component, fastening element, fixing element, and / or equivalent structural / technical terms.

[0030] The ejector pin structure (130) may come into contact with a buffer member (215) (e.g., first buffer member (215a), second buffer member (215b)). The buffer member (215) may be coupled to a core (e.g., core (182)). The buffer member (215) may be positioned to face the molding portion (211). When the ejector plate moves downward, the buffer member (215) may be positioned to push the molding portion (211) so that the protruding part of the molding portion (211) does not get damaged by coming into contact with the core (182). As the ejector pin structure (130) moves while the ejector plate moves downward, the molding portion (211) may be positioned to come close to a part of the core. To avoid contact between one side of the molded portion (211) (e.g., the side facing the y-axis direction) and the lower core (182), the cushioning member (215) may be positioned to face the molded portion (211) between the molded portion (211) and one part of the lower core (182). In addition to being a cushioning member, the cushioning member (215) may be referred to as a cushioning part, bumper member, flange, cushioning flange, stopping member, pressure-preventing member, protective member, relief member, protective pad, protective part, protective flange, ball flange, ball plunger, protective ball, and / or equivalent structural / technical terms.

[0031] The ejector pin structure (130) may include a guide bolt (221) and a rotation prevention bolt (222). The guide bolt (221) may be used to guide the vertical movement of the pin portion (213). For example, the ejector pin structure (130) may include a first guide bolt (221a) and a second guide bolt (221b). The rotation prevention bolt (222) may be used to prevent the fastening part (214) from rotating and wearing out on a plane (e.g., the xy plane). For example, the ejector pin structure (130) may include a first rotation prevention bolt (221a) and a second rotation prevention bolt (221b).

[0032] Although various components for the ejector pin structure (130) are described in FIGS. 2 and 3, embodiments of the present disclosure are not limited thereto. As a non-limiting example, some components may be omitted. For example, at least part of the pin portion (213), guide bolt (221), and / or anti-rotation bolt (222) may be omitted. As a non-limiting example, some components of the ejector pin structure (130) may be included in more than two or only one. For example, the ejector pin structure (130) may include one connecting portion and one fastening part. As a non-limiting example, the ejector pin structure (130) may come into contact with three or more cushioning members. FIG. 4 illustrates an example of an ejector pin structure (e.g., ejector pin structure (130)). The ejector pin structure (130) of the injection mold device (101) according to embodiments of the present disclosure may have an inclined ejector pin structure. Through an inclined ejector pin structure, clearances caused by thermal expansion and / or machining tolerances can be reduced, product step heights can be lowered, and flash (e.g., material layer resulting from molding material leaking through gaps in the mold) can be reduced. The ejector pin structure (130) may include a connecting part (e.g., connecting part (212)) for controlling inclined movement and a forming part (e.g., forming part (211)) for forming the side of a product (e.g., product (120)). The inclined ejector pin structure may be an integral inclined ejector pin structure or a separate inclined ejector pin structure. An integral inclined ejector pin structure represents a structure in which the connecting part (212) and the forming part (211) are formed integrally. A separate inclined ejector pin structure represents a structure in which the connecting part (212) for controlling inclined movement and the forming part (211) are separated. The ejector pin structure (130) according to embodiments of the present disclosure is a separable inclined ejector pin structure and may include a fastening part (e.g., the fastening part (214) of FIG. 2 and FIG. 3) for joining the molded part (211) and the connecting part (212). The same reference numerals may be used for the same description.

[0033] Referring to FIG. 4, the ejector pin structure (130) can be combined with the lower core (182). The ejector pin structure (130) may include a molding portion (211) and a connecting portion (212). The lower core (182) may include a support surface (405a) and a protruding portion (405b). The connecting portion (212) may penetrate the support surface (405a) and be flexibly positioned along the slope within the lower core (182). The protruding portion (405b) may be used to form a cavity for a product (e.g., product (120)) together with the upper core (e.g., upper core (181)) and the molding portion (211).

[0034] The forming part (211) and the connecting part (212) are connected so that when the connecting part (212) moves downward along the slope, the forming part (211) can also move downward along the slope. When the forming part (211) moves downward along the slope, the part (411) protruding in one direction among the forming part (211) can come close to the protruding part (405b) of the core (182). If the part (411) comes into contact with the protruding part (405b) of the core (182), shear stress may be applied to the part (411) in one direction (e.g., in the (+)z-axis direction). Due to the shear stress, the part (411) may be damaged or worn out, which may reduce the efficiency of product production. Accordingly, the ejector pin structure (130) according to embodiments of the present disclosure may include a cushioning member (e.g., cushioning member (150)) to prevent a part of the molding portion (211) (e.g., part (411)) from contacting the protruding part (405b) of the lower core (182). The specific operating principle of the cushioning member is described in detail through FIGS. 5A and 5B. FIGS. 5A and 5B illustrate examples of the operating principle of the ejector pin structure (e.g., ejector pin structure (130)). FIG. 5A illustrates a series of arrangements of components within an injection mold device (101) according to the lowering of a support portion connected to the ejector plate in the ejector pin structure (130). FIG. 5B illustrates an example in which the cushioning member (215) is placed on the molding portion (211) rather than the lower core (182). The same reference numerals may be used for the same description.

[0035] Referring to FIG. 5a, the ejector pin structure (130) may include a forming portion (211), a connecting portion (212), a pin portion (213), and a fastening part (not shown) (e.g., a fastening part (214)). The connecting portion (212) may be coupled with a supporting portion (517). The supporting portion (517) may also be understood as a component of the ejector pin structure (130). Example (501) indicates that the ejector plate is in a raised (or advanced) state. In Example (501), the forming portion (211) may not be completely fixed to the connecting portion (212) in one plane (e.g., the xy plane). Thus, the forming portion (211) may be movably positioned on the one plane. The pin portion (213) may be used to control the amount of movement of the forming portion (211). The support portion (517) can be placed on a mold plate (e.g., upper mold plate (171) and lower mold plate (172)). The support portion (517) can move in a vertical direction (e.g., z-axis direction). When the support portion (517) moves in a vertical direction, the connecting portion (212) can move in a direction inclined with respect to the vertical direction (hereinafter, inclined movement). Depending on the inclined movement of the connecting portion (212), the molding portion (211) can also move in a direction inclined with respect to the vertical direction. As the support portion (517) moves downward, the arrangement of the mold pin structure (130) and the lower core (182) can be changed from example (501) to example (502).

[0036] Example (502) indicates a state where the mold plate is lowered (or retracted). In Example (502), the molding portion (211) may be brought close to the lower core (182). The molding portion (211) may come into contact with the buffer member (215). Due to the buffer member (215), the molding portion (211) may be positioned at a certain gap from the protruding portion (405b) of the lower core (182). For example, the portion (411) of the molding portion (211) may not come into contact with the protruding portion (405b) of the lower core (182).

[0037] Example (503) shows a cross-section of an injection mold device (101) during molding. The injection mold device (101) may include a core (182) and a locking member (599). The locking member (599) may be used to support the molded part (211) so that the molded part (211) is not pushed in one direction (e.g., (-)y-axis direction) due to injection pressure. The step can be adjusted through the locking member (599). Through the locking member (599), the molded part (211) is subjected to pressure in one direction (e.g., (+)y-axis direction), and the part (411) can be prevented from breaking through compressive stress in one direction (e.g., (+)y-axis direction).

[0038] Referring to FIG. 5b, a cushioning member (215) may be placed on the molded portion (211). A portion of the molded portion (211) may be joined to the cushioning member (215). The molded portion (211) may be brought close to the lower core (182). The lower core (182) may come into contact with the cushioning member (215). Due to the cushioning member (215), the molded portion (211) may be spaced apart from the protruding portion (405b) of the lower core (182) by a certain gap. For example, a portion (411) of the molded portion (211) may not come into contact with the protruding portion (405b) of the lower core (182). FIG. 6a and FIG. 6b illustrate examples of fastening structures of components of a push pin structure (e.g., push pin structure (130)). The same reference numerals may be used for the same description.

[0039] Referring to FIG. 6a, the ejector pin structure (130) may include a molding portion (211), a connecting portion (212), a pin portion (213), and a fastening portion (214). The ejector pin structure (130) may include a first connecting portion (212a) and a second connecting portion (212b) for stable support. The ejector pin structure (130) may include a first pin portion (213a) and a second pin portion (213b) for stable control. The ejector pin structure (130) may include a first fastening portion (214a) and a second fastening portion (214b) for stable connection. The ejector pin structure (130) may include a guide bolt (221) and an anti-rotation bolt (222). For example, the ejector pin structure (130) may include a first guide bolt (221a) and a second guide bolt (221b). For example, the ejector pin structure (130) may include a first anti-rotation bolt (221a) and a second anti-rotation bolt (221b). For the description of each component of the ejector pin structure (130), FIGS. 2, FIGS. 3, FIGS. 4, FIGS. 5a, and FIGS. 5b may be referenced.

[0040] The ejector pin structure (130) according to the embodiments of the present disclosure may have a separable ejector pin structure. The separable inclined ejector pin structure represents a structure in which a connecting portion (212) and a forming portion (211) for controlling inclined movement are separated. The ejector pin structure (130) may include a fastening part (214) for joining the forming portion (211) and the connecting portion (212) as a separable inclined ejector pin structure. Hereinafter, a fastening structure in an area adjacent to one end of the forming portion (211) is described, but the description of the fastening structure may be applied to a fastening structure joined at a different location from the forming portion (211).

[0041] The movement of the molding portion (211) can be controlled through the first pin portion (213a). The first pin portion (213a) can pass through the hole of the molding portion (211) and be received in the groove of the first connecting portion (212a). The groove formed in the first connecting portion (212a) can be used to guide the movement of the first pin portion (213a) when the first pin portion (213a) moves due to contact between the molding portion (211) and the cushioning member (215). For example, the first pin portion (213a) can be used to control the degree of displacement when the molding portion (211) moves horizontally. The first guide bolt (221a) can be used to guide the vertical movement of the first pin portion (213a). The first guide bolt (221a) can be inserted into the hole of the molded portion (211) and come into contact with a part (e.g., the head portion) of the first pin portion (213a).

[0042] The molded portion (211) can be joined to the first connecting portion (212a) through the first fastening part (214a). The first fastening part (214a) can be joined to the first connecting portion (212a) by passing through a hole in the molded portion (211). One end of the first fastening part (214a) can be received in a recess formed in the first connecting portion (212a). Due to the first fastening part (214a), the position can be fixed in the stacking direction (e.g., z-axis direction). As the magnitude of the shear stress exemplified in FIG. 4 is reduced, the risk of failure of the portion (411) can be reduced. As an example, but not limited to, the first fastening part (214a) can function as a rail in the z-axis direction. A first anti-rotation bolt (222a) can be used to prevent the first fastening part (241a) from rotating in a plane. The first anti-rotation bolt (222a) is inserted into a hole in the molded portion (211) and can come into contact with a part (e.g., a head portion) of the first fastening part (214a). Due to this contact, the rotation of the first fastening part (214a) may be restricted. Due to the first fastening part (214a), torque caused by the screw threads may not be generated.

[0043] Referring to FIG. 6b, an example of a fastening structure using a first fastening part (214a) is described. A molded portion (211) can be combined with a first connecting portion (212a) through the first fastening part (214a). A molded portion (211) can be combined with a second connecting portion (212b) through a second fastening part (214b). Hereinafter, a fastening structure using the first fastening part (214a) of the molded portion (211) is described, but the description of the fastening structure may also be applied to a fastening structure using the second fastening part (214b) at a location different from the molded portion (211). The first fastening part (214a) may include a receiving portion (631), a column portion (632), and a head portion (633). The receiving portion (631), the column portion (632), and the head portion (633) may be formed integrally. The receiving portion (631) may correspond to the end of the first fastening part (214a). The receiving portion (631) may be coupled with a recess (699) formed in the first connecting portion (212a). The recess (699) may include a guide portion (699a) for the receiving portion (631) and an undercut portion (699b) for restricting movement of the receiving portion (631) in the stacking direction (e.g., z-axis direction). The area of ​​the column portion (632) exposed above the undercut portion (699b) may be smaller than the area of ​​the receiving portion (631) (e.g., area in the xy plane). Even if the first fastening part (214a) moves upward, the first fastening part (214a) may be caught on the undercut portion (699b), thereby restricting the vertical movement of the molded portion (211) coupled with the first fastening part (214a). FIG. 7a shows an example of the assembly of a core (e.g., core (182)) and a push pin structure (e.g., push pin structure (130)). The same reference numbers may be used for the same description.

[0044] Referring to FIG. 7a, the ejector pin structure (130) can be combined with the lower core (182). For example, the first connecting portion (212a) of the ejector pin structure (130) can be placed on a slot in the support surface (405a) of the lower core (182). The second connecting portion (212b) of the ejector pin structure (130) can be placed on a slot in the support surface (405b) of the lower core (182). The molding portion (211) of the ejector pin structure (130) can be moved in one direction (e.g., the (+)y-axis direction)) to be connected to the first connecting portion (212a) and the second connecting portion (212b). As a non-limiting example, a jig may be used when assembling the molded portion (211) and the connecting portion (212) (e.g., first connecting portion (212a), second connecting portion (212b)) for precise fit verification. According to one embodiment, the connecting portion (212) may include bosses (712). The bosses (712) may be coupled to the receiving groove (777) of the molded portion (211). The bosses (712) may be designed to be movable within the receiving groove (777). Although not shown in FIG. 7a, after the connecting portion (212) and the molded portion (211) are connected through the bosses (712), the fastening part (214) may penetrate the hole of the molded portion (211) and cross between the bosses (712) to be coupled to the recess (e.g., recess (699)) of the connecting portion (212). FIG. 7b shows an example of the assembly of a molded part (e.g., molded part (211)) and a connecting part (e.g., connecting part (212)) of a push pin structure (e.g., push pin structure (130)). The same reference numbers may be used for the same description.

[0045] Referring to FIG. 7b, the ejector pin structure (130) can be combined with a core (182). The molding portion (211) of the ejector pin structure (130) can be combined with a connecting portion (212). The bosses (712) of the connecting portion (212) can be combined with a receiving groove (777) of the molding portion (211). The bosses (712) can be designed to be movable within the receiving groove (777). The injection mold device (101) may include a cooling system. The cooling system is used to stably control the temperature in the injection mold device (101), and it is required that a cooling medium be provided to the molding portion (211). Meanwhile, if the molding portion (211) is formed integrally with the connecting portion (212), it may not be easy to inject the cooling medium. The ejector pin structure (130) according to embodiments of the present disclosure may have a separable ejector pin structure. As the molding portion (211) and the connecting portion (212) are separated, it may be easy for the cooling medium to flow into the cooling point (799).

[0046] The ejector pin structure (130) may come into contact with a buffer member (215) (e.g., a first buffer member (215a), a second buffer member (215b)). The buffer member (215) may be coupled to a lower core (e.g., a lower core (182)). The buffer member (215) may be positioned to face the molding portion (211). When the ejector plate moves downward, the buffer member (215) may be positioned to push the molding portion (211) so that the protruding part of the molding portion (211) does not come into contact with the lower core (182) and be damaged. FIG. 8 illustrates an example of components within a pocket of the injection mold device (101). For the components, the descriptions of FIG. 1a through FIG. 7b may be referenced. The same reference numerals may be used for the same descriptions.

[0047] Referring to FIG. 8, the upper plate (161) and lower plate (162) of the injection mold device (101) may form a pocket. At least a portion of the upper core (181), lower core (182), molding portion (211), and connecting portion (212), and a locking member (599) may be placed within the pocket. As the locking member (599) is placed inside the pocket, machining tolerances and / or tolerances due to thermal expansion may be reduced. For example, in the case of a molding method using a slide core, the locking member and slide body for moving the slide core may be located outside the pocket. This may increase the size of the part and thus increase the tolerance. By placing components (e.g., the locking member (599)) inside the pocket and forming the lower core (182), portions of the upper core (181), and molding portion (211), the number of components for manufacturing the mold may be reduced. Accordingly, tolerances can be reduced. FIGS. 9a, 9b, and 9c illustrate examples of cooling systems for ejector pin structures (e.g., ejector pin structures (130)). In an injection molding device (101), a cooling system is essential to maintain the quality of a product (e.g., product (120)) by effectively managing the temperature of the mold during the molding process. Proper cooling ensures that the molded product hardens evenly and can prevent deformation or shrinkage. Additionally, it can extend the lifespan of the injection molding device (101) by preventing overheating of the mold. Identical reference numbers may be used for identical descriptions.

[0048] Referring to FIG. 9a, the injection mold device (101) may include a cooling circuit (900) in a mold plate (e.g., lower mold plate (172)). The cooling circuit (900) may receive a cooling medium through an input terminal (901). The cooling circuit (900) may discharge the cooling medium through an output terminal (902). The injection mold device (101) may include a first connection structure (905) and a second connection structure (906) in a mold plate (e.g., upper mold plate (171), lower mold plate (172)). The injection mold device (101) may include a first cooling tube (911) and a second cooling tube (912). The first connection structure (905) may connect the cooling circuit (900) and the first cooling tube (911). The first cooling tube (911) may be positioned in a direction parallel to the stacking direction (e.g., z-axis direction). In other words, the first cooling tube (911) may be positioned according to a vertical cooling structure. The first cooling tube (911) may be configured to deliver a cooling medium from the cooling circuit (900) to the molding part (211) through the first connecting structure (905). The first cooling tube (911) may be referred to as an input cooling tube, an input cooling path, and / or an input path. The second cooling tube (912) may be positioned in a direction parallel to the stacking direction (e.g., z-axis direction). In other words, the second cooling tube (912) may be positioned according to a vertical cooling structure. The second cooling tube (912) may be configured to deliver a cooling medium from the molding part (211) to the cooling circuit (900) through the second connecting structure (906). The second cooling tube (912) may be referred to as an output cooling tube, an output cooling path, and / or an output path.

[0049] The molding portion (211) may have a cooling circuit design (930) for controlling heat spread across regions of the molding portion (211). The molding portion (211) may obtain a cooling medium from a first cooling tube (911) through a first fastening structure (921). For example, the first fastening structure (921) may include a cooling ring and / or a nipple. The cooling medium may be distributed to each region within the molding portion (211). The molding portion (211) may deliver the cooling medium to a second cooling tube (911) through a second fastening structure (922). For example, the second fastening structure (922) may include a cooling ring and / or a nipple.

[0050] Referring to FIG. 9b, each cooling structure may include a number of components. Hereinafter, a first connection structure (905) of a first cooling tube is described as an example, but the descriptions of the connection structure (905) may also apply to a second connection structure (906) of a second cooling tube. The first connection structure (905) may include a cooling ring (951) for connecting the cooling circuit (900) and the first cooling tube (911), an O-ring (952) for preventing cooling leakage, and / or a sleeve (953) for preventing bending of the first cooling tube (911). The overall size of the injection mold device (101) may be reduced through the cooling ring (951). As an example, but not limited to, the cooling ring (951) may have a one-touch joint structure. Because assembly and / or disassembly are easy due to the one-touch joint method, the cooling tube can be reused.

[0051] Referring to FIG. 9c, a vertical molding plate cooling system may require uniform cooling application to the lower plate (162) and the lower molding plate (172). If uniform cooling is not applied within the injection molding device (101), problems may arise in the formation of the product being injected (e.g., product (120)) due to uneven temperature during mold opening and / or mold closing, which may result in reduced production efficiency. An injection molding device (101) according to embodiments of the present disclosure may have a cooling system for delivering a cooling medium from a cooling circuit (900) in the lower molding plate (172) to the lower plate (162). According to one embodiment, the circuit structure may be connected to the cooling circuit (900) through at least one of a molding portion (211), a first cooling tube (911), a second cooling tube (912), or a separate cooling tube (not shown). According to one embodiment, the lower plate (162) may have a circuit structure for dispersing the cooling medium to regions within the lower plate (162). FIG. 10 shows an example of an exploded perspective view of a fin structure (e.g., fin structure (130)) having a cooling system. The same reference numerals may be used for the same description.

[0052] Referring to FIG. 10, the injection mold device (101) may include an ejector pin structure (130). The ejector pin structure (130) may include a molding portion (211), a connecting portion (212), a pin portion (213), and a fastening part (214). The ejector pin structure (130) may include a first connecting portion (212a) and a second connecting portion (212b) for stable support. The ejector pin structure (130) may include a first pin portion (213a) and a second pin portion (213b) for stable control. The ejector pin structure (130) may include a first fastening part (214a) and a second fastening part (214b) for stable coupling. The ejector pin structure (130) may include a guide bolt (221) and an anti-rotation bolt (222). For example, the ejector pin structure (130) may include a first guide bolt (221a) and a second guide bolt (221b). For example, the ejector pin structure (130) may include a first anti-rotation bolt (221a) and a second anti-rotation bolt (221b). For the description of each component of the ejector pin structure (130), FIGS. 2, FIGS. 3, FIGS. 4, FIGS. 5a, and FIGS. 5b may be referenced.

[0053] The ejector pin structure (130) may include a support portion (517). The support portion (517) may be placed on an ejector plate (e.g., an upper ejector plate (171) and a lower ejector plate (172)). For example, the ejector pin structure (130) may include a first support portion (517a) and a second support portion (517b). The first support portion (517a) may move in a vertical direction (e.g., in the z-axis direction). The first support portion (517a) may be coupled with a first connecting portion (212a). When the first support portion (517a) moves in a vertical direction, the first connecting portion (212a) may move in a direction inclined with respect to the vertical direction (hereinafter, inclined movement). Depending on the inclined movement of the first connecting portion (212a), the forming portion (211) may also move in a direction inclined with respect to the vertical direction. The second support part (517b) can move in a vertical direction (e.g., z-axis direction). The second support part (517b) can be combined with the second connecting part (212b). When the second support part (517b) moves in a vertical direction, the second connecting part (212b) can move in a direction inclined with respect to the vertical direction (hereinafter, inclined movement). Depending on the inclined movement of the second connecting part (212b), the molding part (211) can also move in a direction inclined with respect to the vertical direction.

[0054] The injection mold device (101) may include a plurality of cushioning members. For example, the plurality of cushioning members may include a first cushioning member (215a), a second cushioning member (215b), and / or a third cushioning member (1015). Each cushioning member may be positioned to face the molding portion (211). When the molding plate moves downward, the cushioning members may be positioned to push the molding portion (211) so that the protruding portion of the molding portion (211) does not come into contact with the lower core (182) and be damaged. Although three cushioning members are shown in FIG. 10, embodiments of the present disclosure are not limited thereto. To improve the cushioning effect, four or more cushioning members may be positioned on a portion of the molding portion (211) and a portion of the lower core (not shown) (e.g., a protruding portion (405b)).

[0055] The injection mold device (101) may include a locking member (599). The locking member (599) may be used to support the molded part (211) so that the molded part (211) is not pushed in one direction (e.g., (-)y-axis direction) due to the injection pressure.

[0056] The injection mold device (101) may include a cooling system. The injection mold device (101) may include a first cooling tube (911), a second cooling tube (912), a first fastening structure (921) (e.g., cooling ring, nipple), and a second fastening structure (922) (e.g., cooling ring, nipple) as components for providing a cooling medium to a molding part (211) among the cooling systems. The first cooling tube (911) corresponds to a path for delivering the cooling medium to the molding part (211), and the second cooling tube (912) may correspond to a path for delivering the cooling medium from the molding part (211).

[0057] The first cooling tube (911) can be combined with the first cooling ring (1053a) and the first nipple (1054a). The first cooling ring (1053a) can be used to connect the cooling system (e.g., cooling circuit (900)) of the sealing plate (e.g., upper sealing plate (171), lower sealing plate (172)) and the cooling system (e.g., first cooling tube (911), second cooling tube (912)) of the sealing pin structure (130). The first cooling ring (1053a) can be assembled after being connected to the first nipple (1054a) and after dimensioning. As an example, but not limited to, the first cooling ring (1053a) can be connected using a one-touch joint method. Accordingly, the first cooling tube (911) may be reusable. The second cooling tube (912) can be combined with the second cooling ring (1053b) and the second nipple (1054b). The second cooling ring (1053b) can be used to connect the cooling system (e.g., cooling circuit (900)) of the ejector plate (e.g., upper ejector plate (171), lower ejector plate (172)) and the cooling system (e.g., second cooling tube (911), second cooling tube (912)) of the ejector pin structure (130). The second cooling ring (1053b) can be assembled after being connected to the second nipple (1054b) and after dimensioning. As an example, but not limited to, the second cooling ring (1053b) can be connected using a one-touch joint method. Accordingly, the second cooling tube (911) may be reusable. A structure including a cooling ring may be used for ease of assembly and to reduce the mold size. FIGS. 11a and FIGS. 11b illustrate examples of an injection mold device (e.g., injection mold device (101)) including an ejector pin structure (e.g., ejector pin structure (130)). The injection mold device (101) may have an inclined ejector pin structure (1100). The injection mold device (101) may have a vertical cooling system (1150) for the inclined ejector pin structure (1100).In FIG. 11a and FIG. 11b, the inclined ejector pin structure (1100) and the cooling system (1150) are depicted independently, but this depiction is for convenience and both the inclined ejector pin structure (1100) and the cooling system (1150) may be applied to a single ejector pin structure. The same reference numerals may be used for the same description.

[0058] Referring to FIGS. 11a and 11b, an injection mold device (101) may include an ejector pin structure (130). The ejector pin structure (130) may include a molding portion (211), a connecting portion (212), a pin portion (213), and a fastening part (214). The ejector pin structure (130) may include a first connecting portion (212a) and a second connecting portion (212b) for stable support. The ejector pin structure (130) may include a first pin portion (213a) and a second pin portion (213b) for stable control. The ejector pin structure (130) may include a first fastening part (214a) and a second fastening part (214b) for stable coupling. The ejector pin structure (130) may include a guide bolt (221) and an anti-rotation bolt (222). For example, the ejector pin structure (130) may include a first guide bolt (221a) and a second guide bolt (221b). For example, the ejector pin structure (130) may include a first anti-rotation bolt (221a) and a second anti-rotation bolt (221b). The ejector pin structure (130) may include a first support portion (517a) and a second support portion (517b). The first support portion (517a) and the second support portion (517b) may be placed on an ejector plate (e.g., an upper ejector plate (171) and a lower ejector plate (172)). Reference may be made to FIGS. 2 through 10 for the description of each component of the ejector pin structure (130). The injection mold device (101) may include a plurality of buffer members (not shown). Reference may be made to FIGS. 2 through 10 for the description of each buffer member.

[0059] The injection mold device (101) may include various components for a vertical cooling system (1150). For example, the injection mold device (101) may include a first cooling tube (911), a first connecting structure (905) for connecting the first cooling tube (911) and a cooling circuit (e.g., cooling circuit (900)), a first fastening structure (921) for providing a cooling medium from the first cooling tube (911) to a molding part (211), a second cooling tube (912), a second connecting structure (906) for connecting the second cooling tube (912) and a cooling circuit (e.g., cooling circuit (900)), and / or a second fastening structure (922) for providing a cooling medium from the second cooling tube (912) to a molding part (211).

[0060] FIG. 11a illustrates the arrangement of components in the mold-closed state (or mold-closed state) of the injection mold device (101). The gap between the upper plate (161) and the lower plate (162) may be less than a certain gap. The upper core (181) coupled to the upper plate (161) and the lower core (182) coupled to the lower plate (162) may form a cavity together with a molding portion (211) (e.g., including a first molding portion (211a) and a second molding portion (211b) due to the cross-section). Material may be introduced into the cavity and a product (e.g., product (120))) may be manufactured through an injection process.

[0061] FIG. 11b illustrates the arrangement of components in the open state of the injection mold device (101). The gap between the upper plate (161) and the lower plate (162) may be greater than a certain gap. The upper core (181) coupled to the upper plate (161) may move in an upward direction (e.g., in the (+)z-axis direction). The lower core (182) coupled to the lower plate (162) may be separated from the upper core (181). After the open state, the ejector plate (e.g., upper ejector plate (171), lower ejector plate (172)) may move to separate the product (120) from the lower core (182). As the ejector plate moves, the ejector pin structure (130) may move. As the ejector plate moves, the first support part (517a) and the second support part (517b) placed on the ejector plate may move upward. As the first support portion (517a) moves upward, the first connecting portion (212a) coupled to the first support portion (517a) may move in a direction inclined to the stacking direction (e.g., z-axis direction). As the second support portion (517b) moves upward, the second connecting portion (212b) coupled to the first support portion (517a) may move in a direction inclined to the stacking direction (e.g., z-axis direction). As the first connecting portion (212a) and the second connecting portion (212b) move, the molding portion (211) coupled to the first connecting portion (212a) and the second connecting portion (212b) may move at an angle. When the above-mentioned plate moves upward, the molding portion (211) may move away from a part (e.g., protruding portion (405b)) of the core (e.g., core (182)) through the angled movement. When the above-mentioned mold plate moves downward, the molding portion (211) may come close to a part (e.g., protruding portion (405b)) of the lower core (e.g., lower core (182)) through inclined movement. FIGS. 12a, 12b, and 12c illustrate an injection mold device including a mold pin structure (e.g., mold pin structure (130)) and examples of products formed through said injection mold device.The same reference number can be used for the same description.

[0062] Referring to FIG. 12a, for manufacturing a product (1220), a pin structure (130) having an inclined pin structure according to embodiments of the present disclosure may be used. For example, the product (1220) may be a front cover. If there is an undercut on the outer edge of the product during injection molding, the pin structure (130) may be used to remove the undercut. Through the pin structure (130), the step difference can be reduced and flash (e.g., a layer of material that occurs when molding material leaks through a gap in the mold) can be reduced.

[0063] Referring to FIG. 12b, for the manufacture of a product (1250), a pin structure (130) having an inclined pin structure according to embodiments of the present disclosure may be used. For example, the product (1250) may be a case for earbuds. The side of the exterior of the case may be formed through two molded portions (e.g., a first molded portion (1261), a second molded portion (1262)). Even if there is no undercut on the outer edge of the product during injection molding, the pin structure (130) can reduce the step height and reduce flash (e.g., a layer of material that occurs when molding material leaks through a gap in the mold).

[0064] Referring to FIG. 12c, for manufacturing a product (1280), a pin structure (130) having an inclined pin structure according to embodiments of the present disclosure may be used. For example, the product (1280) may be a case for an electronic device (e.g., a smartphone, a tablet). The side of the exterior of the case may be formed through four molding portions (e.g., a first molding portion (111) for the lower side of the product (120), a second molding portion (112) for the right side of the product (1280), a third molding portion (113) for the upper side of the product (120), and a fourth molding portion (114) for the left side of the product (1280)). Even if there is no undercut on the outer edge of the product during injection molding, the pin structure (130) can reduce the step height and reduce flash (e.g., a layer of material that occurs when molding material leaks through a gap in the mold). In embodiments of the present disclosure, an injection mold device (101) for forming a product is provided. The injection mold device (101) may include: an upper plate (161) configured to move upward when opening the mold and downward when closing the mold; a lower plate (162) configured to be separated from the upper plate (161) when opening the mold and coupled to the upper plate (161) when closing the mold; an upper core (181) coupled to the upper plate (161); a lower core (182) coupled to the lower plate (162), a base substrate; a push plate placed on the base substrate; and a push pin structure (130) coupled to the push plate. The lower core (182) may include a support surface and a protruding portion for forming a cavity for the product. The injection mold device (101) may include a cushioning member (150) coupled to the protruding portion of the lower core (182).The above-described ejector pin structure (130) may include: a molding portion (211) configured to form the cavity together with the upper core (181) and the lower core (182); a connecting portion (212) coupled to the molding portion (211) and positioned to be inclined toward the stacking direction toward the supporting surface by penetrating the supporting surface of the lower core (182); and a supporting portion (517) coupled to the connecting portion (212) and positioned on the ejector plate. As the ejector pin structure (130) moves according to the movement of the ejector plate, the molding portion (211) may be positioned to be close to the protruding portion of the lower core (182). The cushioning member (150) may be positioned between the molding portion (211) and the protruding portion toward the molding portion (211) to prevent at least a portion of the molding portion (211) from contacting the protruding portion of the lower core (182).

[0065] For example, the above-described ejector pin structure (130) may include a fastening part (214) for joining the molded part (211) and the connecting part (212). At least a portion of the fastening part (214) may pass through a hole in the molded part (211). One end of the fastening part (214) may be joined to a recess formed in the connecting part (212).

[0066] For example, the recess formed in the connecting portion (212) may include an undercut portion for fixing the movement of the fastening part (214) in the stacking direction and a guide portion for the movement of the fastening part (214) on a plane perpendicular to the stacking direction.

[0067] For example, the above-described ejector pin structure (130) may include a bolt to prevent rotation of the fastening part (214) within the recess. The bolt may be coupled to the molded part (211).

[0068] For example, the above-described pin structure (130) may include a pin portion (213). At least a portion of the pin portion (213) may pass through a hole in the molding portion (211). One end of the pin portion (213) may be coupled with a groove formed in the connecting portion (212). The groove formed in the connecting portion (212) may have a shape to guide the movement of the pin portion (213) due to contact between the cushioning member (150) and the molding portion (211).

[0069] For example, the injection mold device (101) may include a locking member to prevent the molding portion (211) from being pushed in the opposite direction toward the protruding portion of the lower core (182). The upper plate (161) and the lower plate (162) may form a pocket. At least a portion of the connecting portion (212), the molding portion (211), the upper core, the lower core, and the locking member may be disposed within the pocket.

[0070] For example, the molded portion (211) may include a portion protruding toward the protruding portion of the lower core (182). The portion may be spaced apart from the protruding portion of the lower core (182).

[0071] For example, the above-described ejector pin structure (130) may include: a second connecting portion (212) which is coupled to the molding portion (211) and is positioned so as to be inclined toward the stacking direction toward the supporting surface by penetrating the supporting surface of the core (182); a second supporting portion (517) which is coupled to the second connecting portion (212) and is positioned on the ejector plate; and a second fastening portion (214) for coupling the molding portion (211) and the second connecting portion (212). At least a portion of the second fastening portion (214) may pass through a second hole of the molding portion (211). One end of the second fastening portion (214) may be coupled to a second recess formed in the second connecting portion (212).

[0072] For example, the second recess formed in the second connecting part (212) may include a second undercut part for fixing the movement of the second fastening part (214) in the stacking direction and a second guide part for moving the fastening part (214) on a plane perpendicular to the stacking direction.

[0073] For example, the injection mold device (101) may include a cooling circuit disposed within the mold plate; a first cooling tube disposed in a direction parallel to the stacking direction and connected to the molding portion (211); and a second cooling tube disposed in a direction parallel to the stacking direction and connected to the molding portion (211). The first cooling tube may be configured to transfer a cooling medium from the cooling circuit to the molding portion (211) through a first connection structure in the mold plate. The second cooling tube may be configured to transfer cooling media from the molding portion (211) to the cooling circuit through a second connection structure in the mold plate.

[0074] For example, the injection mold device (101) may include a first connecting structure comprising a first O-ring for preventing cooling leakage, a first sleeve for preventing bending of the first cooling tube, and a first cooling ring for connecting the cooling circuit and the first cooling tube. The second connecting structure may include a second O-ring for preventing cooling leakage, a second sleeve for preventing bending of the second cooling tube, and a second cooling ring for connecting the cooling circuit and the second cooling tube.

[0075] For example, the first cooling ring can be connected to the first cooling tube through a first nipple. The second cooling ring can be connected to the second cooling tube through a second nipple.

[0076] For example, the molding portion (211) may include a first portion into which a cooling medium from the first cooling tube is input, a second portion into which a cooling medium from the first cooling tube is output, and a third portion for delivering the cooling medium between the first portion and the second portion. The first portion may be adjacent to the first end of the molding portion (211) and a second end different from the first end, based on the longitudinal direction of the molding portion (211). The second portion may be adjacent to the second end of the molding portion (211) and the first end, based on the longitudinal direction of the molding portion (211).

[0077] For example, the lower plate (162) may include a circuit structure for dispersing a cooling medium from the cooling circuit. The circuit structure may be connected to the cooling circuit through the molded portion (211), the first cooling tube, the second cooling tube, or a separate cooling tube.

[0078] For example, the upper core (181) may be configured to form the shape of the upper side of the product. The lower core (182) may be configured to form the shape of the lower side of the product. The protruding portion may be configured to form the shape of the side of the product. In embodiments of the present disclosure, an injection mold device (101) for forming a product may include: an upper plate (161) configured to move upward when the mold opens and move downward when the mold closes; a lower plate (162) configured to be separated from the upper plate (161) when the mold opens and combined with the upper plate (161) when the mold closes; an upper core (181) combined with the upper plate (161); a lower core (182) combined with the lower plate (162); a base substrate; a push plate placed on the base substrate; and a plurality of push pin structures (130) combined with the push plate. The lower core (182) may include a protruding portion for forming a support surface and a cavity for the product. The injection mold device (101) may include cushioning members (150) coupled to the protruding portion of the lower core (182). Each of the plurality of ejector pin structures (130) may include a molding portion (211) configured to form the cavity together with the upper core (181) and the lower core (182); a connecting portion (212) coupled to the molding portion (211) and positioned to be inclined toward the stacking direction toward the support surface by penetrating the support surface of the lower core (182); and a supporting portion (517) coupled to the connecting portion (212) and positioned on the ejector plate.

[0079] As the push pin structure (130) moves in accordance with the movement of the push plate, the molded portion (211) can be positioned to be close to the protruding portion of the lower core (182). Among the cushioning members (150), the cushioning member (150) can be positioned to face the molded portion (211) between the molded portion (211) and the protruding portion to prevent at least a portion of the molded portion (211) from contacting the protruding portion of the lower core (182).

[0080] For example, the above-described ejector pin structure (130) may include a fastening part (214) for joining the molded part (211) and the connecting part (212). At least a portion of the fastening part (214) may pass through a hole in the molded part (211). One end of the fastening part (214) may be joined to a recess formed in the connecting part (212). The recess formed in the connecting part (212) may include an undercut portion for fixing the movement of the fastening part (214) in the stacking direction and a guide portion for the movement of the fastening part (214) on a plane perpendicular to the stacking direction.

[0081] For example, the plurality of ejector pin structures (130) may include a first ejector pin structure (130) for the upper side of the product, a second ejector pin structure (130) for the lower side of the product, a third ejector pin structure (130) for the left side of the product, and a fourth ejector pin structure (130) for the right side of the product.

[0082] For example, the injection mold device (101) may include: a cooling circuit disposed within the mold plate; a first set of cooling tubes disposed parallel to the stacking direction and connected to the molding portion (211) of the first mold pin structure (130) and connected to the cooling circuit; a second set of cooling tubes disposed parallel to the stacking direction and connected to the molding portion (211) of the second mold pin structure (130) and connected to the cooling circuit; a third set of cooling tubes disposed parallel to the stacking direction and connected to the molding portion (211) of the third mold pin structure (130) and connected to the cooling circuit; and a fourth set of cooling tubes disposed parallel to the stacking direction and connected to the molding portion (211) of the fourth mold pin structure (130) and connected to the cooling circuit.

[0083] For example, the product formed above may correspond to the external frame of an electronic device. The upper core (181) may be configured to form the shape of the upper side of the product. The lower core (182) may be configured to form the shape of the lower side of the product. The protruding portion may be configured to form the shape of the side of the product. The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, an electronic device, or a home appliance. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0084] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0085] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0086] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an injection mold device for forming a product, Upper plate configured to move upward when opening and downward when closing; A lower plate configured to be separated from the upper plate when the mold opens and combined with the upper plate when the mold closes; Upper core combined with the upper plate above; A lower core coupled to the lower plate, wherein the lower core includes a support surface and a protruding portion for forming a cavity for the product; Base substrate; A pressure plate disposed on the above base substrate; A push pin structure coupled to the above push plate; and It includes a cushioning member coupled to the protruding part of the above-mentioned Hacore, and The above-mentioned ejector pin structure is: A molding portion configured to form the cavity together with the upper core and the lower core; A connecting portion that is combined with the above-mentioned molded portion and is positioned to be inclined with respect to the stacking direction toward the support surface by penetrating the support surface of the above-mentioned core; It includes a support portion that is coupled to the above connecting portion and disposed on the above seal plate, and As the ejector pin structure moves according to the movement of the above-mentioned ejector plate, the molded portion is positioned to be closer to the protruding portion of the above-mentioned core, and The above buffer member is positioned to face the molded portion between the molded portion and the protruding portion to prevent at least a portion of the molded portion from contacting the protruding portion of the core. Injection mold device.

2. In Claim 1, The above-described ejector pin structure includes a fastening component for joining the molded portion and the connecting portion, and At least a portion of the above-mentioned fastening part passes through a hole in the above-mentioned molded part, and One end of the above-mentioned fastening part is coupled to a recess formed in the above-mentioned connecting part, Injection mold device.

3. In Claim 2, The recess formed in the above-mentioned connecting portion includes an undercut portion for fixing the movement of the fastening component in the stacking direction and a guide portion for the movement of the fastening component on a plane perpendicular to the stacking direction. Injection mold device.

4. In Claim 2, The above-mentioned ejector pin structure includes a bolt for preventing rotation of the fastening part within the recess, and The above bolt is coupled to the above molded part, Injection mold device.

5. In Claim 1, The above-mentioned ejector pin structure includes a pin portion, and At least a portion of the above pin portion passes through the hole of the above molded portion, and One end of the above pin portion is coupled with a groove formed in the above connecting portion, and The groove formed in the above-mentioned connecting portion has a shape for guiding the movement of the pin portion due to contact between the cushioning member and the molded portion. Injection mold device.

6. In Claim 1, The above-mentioned molded portion further includes a locking member to prevent it from being pushed in the opposite direction to the protruding portion of the above-mentioned core, and The upper plate and the lower plate form a pocket, and At least a portion of the connecting part, the molded part, the upper core, the lower core, and the locking member are disposed within the pocket. Injection mold device.

7. In Claim 1, The above-mentioned molded portion includes a portion protruding toward the protruding portion of the above-mentioned core, and The above part is spaced apart from the protruding part of the above core, Injection mold device.

8. In Claim 1, The above-mentioned ejector pin structure is: A second connecting portion that is combined with the above-mentioned molding portion and is positioned to be inclined with respect to the stacking direction toward the support surface by penetrating the support surface of the above-mentioned core; A second support portion coupled to the second connecting portion and disposed on the above-mentioned plate; and It further includes a second fastening part for combining the molded portion and the second connecting portion, At least a portion of the second fastening part passes through the second hole of the molded part, and One end of the second fastening part is coupled to a second recess formed in the second connecting part. Injection mold device.

9. In Claim 8, The second recess formed in the second connecting portion comprises a second undercut portion for fixing the movement of the second fastening component in the stacking direction and a second guide portion for the movement of the fastening component on a plane perpendicular to the stacking direction. Injection mold device.

10. In Claim 1, A cooling circuit disposed within the above-mentioned sealing plate; A first cooling tube arranged in a direction parallel to the stacking direction and connected to the molding portion; and It includes a second cooling tube arranged in a direction parallel to the stacking direction and connected to the molding portion, The first cooling tube is configured to deliver a cooling medium from the cooling circuit to the molding part through a first connection structure in the mold plate, and The second cooling tube is configured to deliver cooling media from the molding portion to the cooling circuit through a second connection structure in the mold plate. Injection mold device.

11. In Claim 10, The first connection structure comprises a first O-ring for preventing cooling leakage, a first sleeve for preventing bending of the first cooling tube, and a first cooling ring for connecting the cooling circuit and the first cooling tube. The second connecting structure comprises a second O-ring for preventing cooling leakage, a second sleeve for preventing bending of the second cooling tube, and a second cooling ring for connecting the cooling circuit and the second cooling tube. Injection mold device.

12. In Claim 11, The first cooling ring is connected to the first cooling tube through a first nipple, and The second cooling ring is coupled to the second cooling tube through a second nipple, Injection mold device.

13. In Claim 10, The above-mentioned molding portion includes a first portion into which a cooling medium from the first cooling tube is input, a second portion into which a cooling medium from the first cooling tube is output, and a third portion for delivering the cooling medium between the first portion and the second portion. The first portion is adjacent to the first end among the first end of the molded portion and the second end different from the first end, based on the longitudinal direction of the molded portion, and The second portion is adjacent to the second end among the first end and the second end, based on the longitudinal direction of the molded portion. Injection mold device.

14. In Claim 10, The above lower plate includes a circuit structure for dispersing a cooling medium from the cooling circuit, and The above circuit structure is connected to the cooling circuit through the molded portion, the first cooling tube, the second cooling tube, or a separate cooling tube. Injection mold device.

15. In Claim 1, The above-mentioned upper core is configured to form the shape of the upper side of the product, and The above-mentioned Hacore is configured to form the shape of the lower side of the above-mentioned product, and The above protruding portion is configured to form the shape of the side of the product, Injection mold device.

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