Mounting device and method for controlling mounting device

Abstract

A mounting device according to the present disclosure controls first and second heads and first and second movement units such that the first and second heads hold a component and move to a mounting position, executes approach control for controlling the first movement unit such that the first hea d approaches before an interference region where the first head interferes with the second head, and controls the first movement unit such that the absolute value of a speed parameter including at least one of the acceleration, deceleration, and speed of the first head in the approach control is smaller than the absolute value of at least one of the speed parameter of the first head and the speed parameter of the second head during normal control.

Description

Mounting Device and Control Method of Mounting Device

[0001] The invention disclosed in this specification relates to a mounting device and a control method of the mounting device.

[0002] Conventionally, as this type of mounting device, a mounting device has been proposed that moves first and second heads for holding components to a mounting position to mount the components on a substrate (see, for example, Patent Document 1). In this device, when the first head is located outside the interference region where the first head and the second head interfere and the second head is located inside the interference region, after moving the first head to a standby position near the interference region, the second head is retracted outside the interference region and the first head is moved to the mounting position inside the interference region with the same acceleration as the second head. Thereby, interference between the first and second heads is suppressed. Further, as this type of mounting device, a device has been proposed in which the first head adsorbs a component and moves to a standby position and waits during the operation of mounting the component by the second head (see, for example, Patent Document 2). In this device, the time for the first head to wait at the standby position is shortened to the minimum necessary, and the speed of the first head moving from the adsorption position to the standby position is slowed down. Thereby, power consumption is reduced.

[0003] Japanese Patent Application Laid-Open No. 2010-278187, Japanese Patent Application Laid-Open No. 2008-198737

[0004] However, in the mounting device described in Patent Document 1, since the first head and the second head are moved with the same acceleration, although interference between the first and second heads can be suppressed, power consumption cannot be reduced. In the mounting device described in Patent Document 2, when the operation of mounting a component by the second head is rapid, it becomes difficult to slow down the speed of the first head while ensuring the minimum necessary time for the first head to wait at the standby position, and power consumption cannot be reduced.

[0005] The main object of the mounting device of the present disclosure is to reduce power consumption.

[0006] The mounting device of the present disclosure has adopted the following means to achieve the above main object.

[0007] The present disclosure is a mounting apparatus for mounting components onto a substrate by moving first and second heads that hold components to a mounting position, comprising: a first moving unit for moving the first head; a second moving unit for moving the second head; and a moving control unit that controls the first and second heads and the first and second moving units so that the first and second heads hold components and move to the mounting position, and performs proximity control to control the first moving unit so that the first head approaches to the front of an interference region, and controls the first moving unit so that the absolute value of a velocity parameter including at least one of the acceleration, deceleration, and velocity of the first head in the proximity control is smaller than the absolute value of at least one of the velocity parameter of the first head and the velocity parameter of the second head in normal control.

[0008] In the mounting apparatus of this disclosure, the first and second heads and the first and second moving parts are controlled so that the first and second heads hold the component and move to the mounting position, and proximity control is performed to control the first moving part so that the first head approaches to the front of the interference area. The first moving part is controlled so that the absolute value of the velocity parameter of the first head, which includes at least one of the acceleration, deceleration, and velocity of the first head in proximity control, is smaller than the absolute value of at least one of the velocity parameter of the first head and the velocity parameter of the second head in normal control. As a result, in this mounting apparatus, power consumption is reduced during proximity control compared to an apparatus in which the absolute value of the velocity parameter of the first head is greater than or equal to the absolute value of the velocity parameter of the first head and the velocity parameter of the second head in normal control. As a result, power consumption can be reduced in this mounting apparatus.

[0009] Perspective view of the mounting device 10. Top view of the mounting device 10. Block diagram showing the electrical connection relationships of the mounting device 10. Flowchart showing an example of a component mounting process. Flowchart showing an example of a movement process. Explanatory diagram for explaining an example of the time change of the movement speed V. Explanatory diagram for explaining the direction of movement of the first head 31. Explanatory diagram for explaining the direction of movement of the first head 31. Explanatory diagram for explaining an example of the movement speed of the first and second heads 31 and 32. Explanatory diagram for an example of the movement speed of the first and second heads 31 and 32 in another embodiment. Explanatory diagram for an example of the movement speed of the first and second heads 31 and 32 in another embodiment.

[0010] Figure 1 is a perspective view of the mounting device 10. Figure 2 is a top view of the mounting device 10. Figure 3 is a block diagram showing the electrical connection relationships of the mounting device 10. The left-right direction (X-axis direction), front-back direction (Y-axis direction), and up-down direction (Z-axis direction) are as shown in Figures 1 and 2.

[0011] As shown in Figures 1 and 2, the mounting apparatus 10 of this embodiment picks up components supplied from a tape feeder 60 and mounts them onto a substrate S. The mounting apparatus 10 comprises a base B, a first head 31 and a second head 32 facing each other, a first head moving device 11 for moving the first head 31 horizontally, a second head moving device 12 for moving the second head 32 horizontally, and a control device 80. On both the left and right sides of the upper part of the base B, there are strip-shaped support bases 13 that extend in the front-rear direction.

[0012] In addition, the mounting device 10 also includes a first beam member 23 that supports the first head 31 and a second beam member 24 that supports the second head 32. The first beam member 23 and the second beam member 24 are elongated members that extend in the left-right direction, supporting the first head 31 and the second head 32 so that they can move in the left-right direction and are also movable in the front-rear direction. The mounting device 10 also includes a first part camera 41 and a second part camera 42 that can image parts from below. Furthermore, the mounting device 10 also includes a substrate transport device 70 that has a pair of front and rear conveyor belts and a motor that drives the conveyor belts in a circular motion, and transports the substrate S on the conveyor belts from left to right by driving the conveyor belts with the motor.

[0013] The first head 31 and the second head 32 are for adsorbing and holding parts. The first head 31 and the second head 32 have one or more nozzles for adsorbing parts. The first head 31 and the second head 32 are each equipped with a lifting device 33 for raising and lowering the nozzles. The first head 31 and the second head 32 can adsorb parts by applying negative pressure to the suction port of the nozzle by connecting a negative pressure source to the suction port. The first head 31 and the second head 32 can release the adsorption of parts by applying positive pressure to the suction port of the nozzle by connecting a positive pressure source to the suction port of the nozzle. As shown in Figures 1 and 2, the first head 31 is supported on the opposing surface 23a of the first beam member 23, which is the side surface facing the second beam member 24. The second head 32 is supported on the opposing surface 24a of the second beam member 24, which is the side surface facing the opposing surface 23a of the first beam member 23. In an XY plane view, the first head 31 and the second head 32 have a length in the front-to-back direction that is longer than their length in the left-to-right direction.

[0014] The first head moving device 11 includes a first Y-axis moving device 51 that moves the first head 31 in the front-rear direction together with the first beam member 23, and a first X-axis moving device 21 that moves the first head 31 in the left-right direction relative to the first beam member 23.

[0015] As shown in Figures 2 and 3, the first Y-axis moving device 51 includes a pair of left and right Y-axis linear guides 53 and Y-axis linear motors 54 provided on the left and right sides, respectively. The pair of left and right Y-axis linear guides 53 are arranged so as to extend in the front-rear direction on the upper surfaces of the left and right support bases 13. The Y-axis linear motor 54 includes a Y-axis stator 55 fixed to the support base 13 so as to extend in the front-rear direction, and a Y-axis movable element 56 fixed to the first beam member 23 and supported by the Y-axis linear guide 53 so as to face the Y-axis stator 55 at a predetermined vertical distance. The position of the first head 31 in the Y-axis direction is detected by the first Y-axis linear encoder 57.

[0016] As shown in Figures 2 and 3, the first X-axis moving device 21 includes a pair of upper and lower X-axis linear guides 26 and an X-axis linear motor 27. The pair of upper and lower X-axis linear guides 26 are arranged to extend in the left-right direction on the opposing surface 23a of the first beam member 23. The X-axis linear motor 27 includes an X-axis stator (not shown) fixed to the opposing surface 23a of the first beam member 23 so as to extend in the left-right direction, and an X-axis movable element 28 supported by the X-axis linear guide 26 so as to face the X-axis stator at a predetermined distance in the front-rear direction. The first head 31 is attached to the side of the X-axis movable element 28 that is opposite to the first beam member 23. The position of the first head 31 in the X-axis direction is detected by the first X-axis linear encoder 37.

[0017] The second head moving device 12 includes a second Y-axis moving device 52 that moves the second head 32 in the front-rear direction together with the second beam member 24, and a second X-axis moving device 22 that moves the second head 32 in the left-right direction relative to the second beam member 24.

[0018] As shown in Figures 2 and 3, the second Y-axis moving device 52 has a pair of left and right Y-axis linear guides 53 and Y-axis linear motors 54 provided on the left and right sides, respectively. The second Y-axis moving device 52 also shares the pair of left and right Y-axis linear guides 53 and the Y-axis stator 55 of the Y-axis linear motor 54 with the first Y-axis moving device 51. The second Y-axis moving device 52 also has a Y-axis movable element 56 that is fixed to the second beam member 24 and supported by the Y-axis linear guides 53. The position of the second head 32 in the Y-axis direction is detected by the second Y-axis linear encoder 58.

[0019] As shown in Figures 2 and 3, the second X-axis moving device 22 includes a pair of upper and lower X-axis linear guides 26 and an X-axis linear motor 27. The second X-axis moving device 22 has the same configuration as the first X-axis moving device 21, except that the pair of upper and lower X-axis linear guides 26 are positioned on the opposing surface 24a of the second beam member 24, and the second head 32 is attached to the side of the X-axis movable element 28 opposite to the second beam member 24. The position of the second head 32 in the X-axis direction is detected by the second X-axis linear encoder 38.

[0020] The first head 31 and the second head 32 are each movable horizontally by a combination of the drive of the X-axis linear motor 27 and the drive of the Y-axis linear motor 54, and therefore have a rectangular range of motion. The range of motion of the first head 31 covers the area from the position where the front tape feeder 60 supplies components in Figure 2 to the entire area on the substrate S. The range of motion of the second head 32 covers the area from the position where the rear tape feeder 60 supplies components in Figure 2 to the entire area on the substrate S. The first Y-axis moving device 51 and the second Y-axis moving device 52 share a Y-axis linear guide 53 and a Y-axis stator 55. Furthermore, the first head 31 and the second head 32 mount components on the same substrate S. For this reason, the range of motion of the first head 31 and the range of motion of the second head 32 overlap in the area directly above the substrate S.

[0021] The control device 80 is responsible for controlling the entire mounting device 10. As shown in Figure 3, the control device 80 is a computer having a CPU 81, ROM 82, RAM 83, and storage 84. The storage 84 is configured as a data storage device, such as an HDD or SSD. The storage 84 stores speed parameters including acceleration when moving the first head 31 and the second head 32, deceleration when stopping them, and upper limit speed, which is the upper limit of the movement speed. The control device 80 outputs control signals to the tape feeder 60, the substrate transport device 70, the first head 31, the second head 32, the Y-axis linear motors 54 of the first Y-axis moving device 51 and the second Y-axis moving device 52, the X-axis linear motors 27 of the first X-axis moving device 21 and the second X-axis moving device 22, the first part camera 41, the second part camera 42, and the like. Furthermore, the control device 80 receives pulse signals from the first Y-axis linear encoder 57, the second Y-axis linear encoder 58, the first X-axis linear encoder 37, the second X-axis linear encoder 38, and image signals from the first part camera 41, the second part camera 42, and the like.

[0022] In the mounting apparatus 10 configured in this way, the first and second heads 31 and 32, the first head moving device 11 and the second head moving device 12 are controlled so that the first and second heads 31 and 32 hold the components and move to the mounting position P1, and a component mounting process is performed in which components are mounted on a single substrate S using the first head 31 and the second head 32. As described above, the movement range of the first head 31 and the movement range of the second head 32 overlap in the area directly above the substrate S, so there is a risk that the first head 31 and the second head 32 may interfere with each other when moving. Therefore, in the component mounting process, as part of the normal control, the CPU 81 performs mutual exclusion control to control the first head moving device 11 and the second head moving device 12 so that when mounting a component held by the first head 31 to the mounting position, the second head 32 is moved backward, i.e., away from the first head 31, and when mounting a component held by the second head 32 to the mounting position, the first head 31 is moved forward, i.e., away from the second head 32, thereby suppressing interference between the first head 31 and the second head 32. In the mutual exclusion control, when the second head 32 is moved away from the first head 31 when mounting a component to the mounting position with the first head 31, the CPU 81 reads the velocity parameters of the second head 32 in the mutual exclusion control from the storage 84. The velocity parameters of the second head 32 include acceleration αl2, deceleration βl2, and upper limit velocity Vmaxl2. Here, acceleration αl2 and upper limit velocity Vmaxl2 are positive values, and deceleration βl2 is a negative value. Furthermore, acceleration αl2, deceleration βl2, and upper limit velocity Vmaxl2 are predetermined as the upper limit of acceleration, the lower limit of deceleration, and the upper limit of velocity when the second head 32 is not holding a component. The CPU 81 controls the second head moving device 12 so that the second head 32 accelerates with acceleration αl2, moves at a constant speed when the moving speed reaches the upper limit velocity Vmaxl2, and decelerates with deceleration βl2. When the first head 31 is moved away from the second head 32 to mount a component in the mounting position with the second head 32, the CPU 81 reads the velocity parameters of the first head 31 in exclusive control from the storage 84. The velocity parameters of the first head 31 include acceleration αl1, deceleration βl1, and upper limit velocity Vmaxl1.Here, acceleration αl1 and upper limit velocity Vmaxl2 are positive values, and deceleration βl2 is a negative value. Acceleration αl1, deceleration βl1, and upper limit velocity Vmaxl1 are predetermined as the upper limit of acceleration, the lower limit of deceleration, and the upper limit of velocity when the second head 32 is not holding a part. The CPU 81 then controls the first head moving device 11 so that the first head 31 accelerates with acceleration αl1, moves at a constant speed when the moving speed reaches the upper limit velocity Vmaxl1, and decelerates with deceleration βl1.

[0023] Next, the operation of the mounting device 10, in particular, mutual exclusion control, will be described. Figure 4 is a flowchart of an example of component mounting processing. Figure 5 is a flowchart of an example of movement processing. Figure 6 is an explanatory diagram for illustrating an example of the time change of movement speed. Figure 7 is an explanatory diagram for illustrating the direction of movement of the first head 31 when the mounting position P1 of the first head 31 is outside the planned mounting area Am. Figure 8 is an explanatory diagram for illustrating the direction of movement of the first head 31 when the mounting position P1 of the first head 31 is within the planned mounting area Am and the first head 31 approaches the front of the interference area Ai. Figure 9 is an explanatory diagram for illustrating the direction of movement of the first head 31 when the mounting position P1 of the first head 31 is within the planned mounting area Am and the second head 32 starts moving away from the first head 31. The component mounting processing is repeatedly executed by the CPU 81 of the control device 80 after the instruction to start production is input.

[0024] When the component mounting process begins, the CPU 81 first controls the X-axis linear motor 27 of the first X-axis moving device 21 and the Y-axis linear motor 54 of the first Y-axis moving device 51 of the first head moving device 11 to move the first head 31 to the component suction position (S100). Next, the CPU 81 controls the lifting device 33 of the first head 31 to pick up the component supplied from the tape feeder 60 (S110). Specifically, the CPU 81 applies negative pressure to the suction port of the suction nozzle and controls the lifting device 33 so that the suction nozzle descends until the suction port of the nozzle contacts the component, thereby picking up the component with the nozzle. Subsequently, the CPU 81 images the component picked up by the first head 31 and processes the image to determine whether the component has been picked up correctly, measure the amount of deviation in the suction position, and correct the mounting position P1 (S120). Specifically, in imaging of a part, the CPU 81 controls the first head moving device 11 to move the first head 31 above the first part camera 41, and controls the first part camera 41 to image the part that has been attracted by the first head 31.

[0025] Next, the CPU 81 determines whether the mounting position P1 of the first head 31 is located within the planned mounting area Am of the second head 32 (S130). The planned mounting area Am is a part of the movement range of the second head 32 and is a predetermined area where the second head 32 plans to mount components during the pick-and-place cycle, which is the period during which the first head 31 holds a component and moves to the mounting position P1. As shown in Figure 7, the planned mounting area Am is, for example, the upper area near the center of the substrate S. When the mounting position P1 of the first head 31 is within the planned mounting area Am, moving the first head 31 to the mounting position P1 may cause interference with the second head 32, which is located within the planned mounting area Am for mounting components. Therefore, S130 is a process to determine whether there is a possibility of interference between the first head 31 and the second head 32.

[0026] In S130, the CPU 81 determines that if the mounting position P1 of the first head 31 is outside the planned mounting area Am, there is no possibility of interference between the first head 31 and the second head 32 even if the first head 31 is immediately moved to the mounting position P1, and executes the mounting movement control in S210 to S240 as a control included in normal control. In the mounting movement control, the CPU 81 sets the mounting position P1 of the first head 31 to the target position (S210). Next, the CPU 81 reads the mounting movement velocity parameters from the storage 84 (S220). The mounting movement velocity parameters include the acceleration α1, deceleration β1, and upper limit velocity Vmax1 when moving the first head 31 toward the mounting position P1. Here, acceleration α1 and upper limit velocity Vmax1 are positive values, and deceleration β1 is a negative value. Acceleration α1, deceleration β1, and upper limit velocity Vmax1 are set to the upper limit of acceleration, the lower limit of deceleration, and the upper limit of vehicle speed, respectively, that allow the first head 31 to move without dropping the component while it is holding it in place. The absolute values ​​of acceleration α1, deceleration β1, and upper limit velocity Vmax1 are set to be smaller than the absolute values ​​of acceleration αl1, deceleration βl1, and upper limit velocity Vmaxl1. Next, the CPU 81 repeatedly executes the movement process shown in Figure 5 at predetermined time intervals Δt (for example, several ms) using the mounting movement speed parameters read in S210 (S230, S240). The movement process will be described later. Then, the CPU 81 mounts the component onto the substrate S (S250) and terminates this process. Specifically, the CPU 81 controls the lifting device 33 to press the component held by the nozzle against the substrate S, and simultaneously applies positive pressure to the tip of the nozzle to mount the component onto the substrate S. Now, let's explain the movement process.

[0027] When the CPU 81 starts the movement process, it calculates the distance L to the target position set in the component mounting process in Figure 4 (S300). Specifically, the CPU 81 calculates the XY coordinate values ​​of the position of the first head 31 based on the pulse signals from the first X-axis linear encoder 37 and the first Y-axis linear encoder 57, and calculates the distance L based on the XY coordinate values ​​of the position of the first head 31 and the XY coordinate values ​​of the target position. Next, the CPU 81 substitutes the values ​​of the movement speed V and deceleration β into the threshold setting function f shown in the following equation (1), and calculates the distance required for the first head 31 to stop (movement speed V becomes 0) assuming that the first head 31 is decelerated by the deceleration β from the current movement speed V, and sets the calculated distance as the distance threshold D (S310).

[0028] f(V,β)=(V^2 / (2×β))…(1)

[0029] Next, the CPU 81 determines whether the distance L is longer than the distance threshold D (S320). If the CPU 81 determines that the distance L is longer than the distance threshold D, it determines that the movement section of the first head 31 is not a deceleration section and determines whether the movement speed V is less than its upper limit, the upper limit speed Vmax (S330). If the CPU 81 determines that the movement speed V is less than the upper limit speed Vmax, it determines that the movement section of the first head 31 is an acceleration section as shown in Figure 6 and performs acceleration control with acceleration α (S340). Specifically, the CPU 81 calculates a current command value such that the movement speed V of the first head 31 is the smaller of the speed obtained by adding the sum of the movement speed V, acceleration α, and time Δt, as shown in the following equation (2), and the upper limit speed Vmax, generates a drive command based on the current command value, and outputs it to the first head moving device 11. On the other hand, when the CPU 81 determines that the movement speed V is at the upper limit speed Vmax, it determines that the movement section of the first head 31 is a constant-velocity section as shown in Figure 6, and controls the first head moving device 11 so that the first head 31 moves at the upper limit speed Vmax.

[0030] V=min(V+α×Δt, Vmax)…(2)

[0031] On the other hand, when the CPU 81 determines that the distance L is less than or equal to the distance threshold D, it determines that the movement section of the first head 31 is a deceleration section as shown in Figure 6, and controls deceleration with deceleration β (S360). Specifically, the CPU 81 calculates a current command value so that the movement speed V of the first head 31 becomes the larger of the speed obtained by adding the sum of the movement speed V, deceleration β, and predetermined time Δt, as shown in the following equation (3), and the value 0. Based on the current command value, it generates a drive command and outputs it to the first head moving device 11. In the movement process, when the distance L to the target position is relatively short, the movement may go from an acceleration section to a deceleration section without going through a constant speed section.

[0032] V=max(V+β×Δt,0)…(3)

[0033] In S230, the CPU 81 executes the movement process using the acceleration α, deceleration β, and upper limit velocity Vmax in the movement process shown in Figure 5 as acceleration α1, deceleration β1, and upper limit velocity Vmax1, respectively, which are included in the movement velocity parameters, to move the first head 31 to the mounting position P1. After that, the CPU 81 mounts the component onto the substrate S (S250) and terminates this process. Specifically, the CPU 81 controls the lifting device 33 to press the component attracted to the nozzle against the substrate S and applies positive pressure to the tip of the nozzle to mount the component onto the substrate S.

[0034] In S130, the CPU 81 determines that if the mounting position P1 is within the planned mounting area Am, there is a possibility that the first head 31 and the second head 32 may interfere if the first head 31 is immediately moved to the mounting position P1, and executes proximity control in S140 to S200. In proximity control, the CPU 81 sets the waiting position P2 in front of the interference area Ai as the target position (S140). The interference area Ai is set as a rectangular area located on the side of the second head 32 to the first head 31, within a predetermined distance range in the left-right direction and within a predetermined distance range in the front-back direction, as shown in Figure 8, when the second head 32 is located within the planned mounting area Am. The interference area Ai moves with the movement of the second head 32 when the second head 32 is located within the planned mounting area Am, and is not set when the second head 32 is located outside the planned mounting area Am. Next, the CPU 81 reads the proximity velocity parameters from the storage 84 (S150). The approach velocity parameters include the acceleration α2, deceleration β2, and upper limit velocity Vmax2 when the first head 31 approaches the front of the interference region Ai. Here, acceleration α2 and upper limit velocity Vmax2 are positive values, and deceleration β2 is a negative value. The absolute values ​​of acceleration α2, deceleration β2, and upper limit velocity Vmax2 are set to be smaller than the absolute values ​​of acceleration α1, deceleration β1, and upper limit velocity Vmax1 of the implemented movement velocity parameters. Subsequently, the CPU 81 executes the movement processing shown in Figure 5 using the approach velocity parameters read in S150 until the first head 31 reaches the standby position P2 or the second head 32 begins to move away from the first head 31 (S160, S170, S180). In S160, the CPU 81 executes the movement process using acceleration α, deceleration β, and upper limit velocity Vmax, which are included in the approach velocity parameters, respectively, as acceleration α2, deceleration β2, and upper limit velocity Vmax2, respectively, for the movement process shown in Figure 5. As a result, the first head 31 moves toward the standby position P2, as shown in Figure 8.

[0035] When the first head 31 reaches the target position, standby position P2, in S170, the CPU 81 keeps the first head 31 waiting at standby position P2 until the second head 32 begins moving away from the first head 31 (S190). When the second head 32 begins moving away from the first head 31, the CPU 81 performs the normal control in S210 to S240. As a result, the first head 31 moves toward standby position P2. Then, in S240, when the first head 31 reaches the mounting position P1, the CPU 81 mounts the component onto the board S (S250) and terminates this process.

[0036] When the CPU 81 detects in S180 that the second head 32 has started moving away from the first head 31 before the first head 31 reaches the target position, standby position P2, in S170, it executes the normal control from S210 to S240. As a result, the first head 31 moves toward the mounting position P1, as shown by the solid arrow in Figure 9. Then, when the first head 31 reaches the mounting position P1 in S240, the CPU 81 mounts the component onto the substrate S (S250) and terminates this process.

[0037] Here, the movement speeds of the first and second heads 31 and 32 in the processing of S130 to S240 will be explained. Figure 10 is an explanatory diagram illustrating an example of the time change in the movement speeds of the first and second heads 31 and 32 when the second head 32 starts moving away from the first head 31 before the first head 31 reaches the standby position P2. Figure 11 is an explanatory diagram illustrating an example of the time change in the movement speeds of the first and second heads 31 and 32 when the first head 31 reaches the standby position P2 before the second head 32 starts moving away from the first head 31.

[0038] When the CPU 81 is located at the mounting position P1 of the first head 31 within the planned mounting area Am, it sets the standby position P2 as the target position and moves the first head 31 to the standby position P2 using a movement process based on the approach velocity parameter (S140-S180). As a result, the first head 31 begins to move towards the standby position P2 while accelerating with an acceleration α2, as shown in Figures 10 and 11 (time t0).

[0039] If the second head 32 starts moving away from the first head 31 before the first head 31 reaches the standby position P2, the CPU 81 sets the mounting position P1 as the target position and executes movement processing based on the mounting movement velocity parameter (S210-S240). Cases in which the second head 32 starts moving away from the first head 31 before the first head 31 reaches the standby position P2 include cases where the second head 32 starts moving while the first head 31 is moving while accelerating at an acceleration α2, cases where the second head 32 starts moving while moving at the upper limit velocity Vmax2, and cases where the second head 32 starts moving while the first head 31 is moving while decelerating at a deceleration β just before the interference region Ai. If the second head 32 starts moving while the first head 31 is moving while accelerating at an acceleration α2, as shown in Figure 10, the first head 31 starts moving toward the mounting position P1 with an acceleration α1 higher than the acceleration α2 without stopping (time t1). Similarly, if the second head 32 starts moving while the first head 31 is moving at the upper limit speed Vmax2, or if the second head 32 starts moving while the first head 31 is moving while decelerating at a deceleration rate β before reaching the interference region Ai, the first head 31 will start moving toward the implementation position P1 with an acceleration α1 higher than the acceleration α2 without stopping, either while moving at the upper limit speed Vmax2 or while decelerating at a deceleration rate β. Subsequently, when the first head 31's moving speed reaches the upper limit speed Vmax1 (time t2), it will move at a constant speed at the upper limit speed Vmax, and when the distance L to the implementation position P1 becomes less than the distance threshold D (time t3), it will decelerate at a deceleration rate β1 and stop at the implementation position P1 (time t4). The absolute values ​​of acceleration α2, deceleration β2, and upper limit velocity Vmax2 when moving towards the standby position P2 in front of the interference region Ai are smaller than the absolute values ​​of acceleration α1, deceleration β1, and upper limit velocity Vmax1 when moving towards the implementation position P1. Therefore, compared to the case where the absolute values ​​of acceleration α2, deceleration β2, and upper limit velocity Vmax2 are greater than or equal to the absolute values ​​of acceleration α1, deceleration β1, and upper limit velocity Vmax1, power consumption can be reduced.Furthermore, if the second head 32 starts moving away from the first head 31 before the first head 31 reaches the standby position P2, the CPU 81 moves the first head 31 toward the mounting position P1 without stopping it. This reduces the time required to move to the mounting position P1 compared to the case where the first head 31 is stopped before the interference region Ai, thereby improving the efficiency of component mounting. Moreover, the absolute values ​​of the acceleration α1, deceleration β1, and upper limit velocity Vmax1 when the first head 31 moves toward the mounting position P1 are smaller than the absolute values ​​of the acceleration αl2, deceleration βl2, and upper limit velocity Vmaxl2 when the second head 32 moves away from the first head 31, thus avoiding interference between the first head 31 and the second head 32.

[0040] If the first head 31 reaches the standby position P2 before the second head 32 begins to move away from the first head 31, the first head 31 stops at the standby position P2 until the second head 32 begins to move away from the first head 31 (S170, S190, S200). Then, when the second head 32 begins to move away from the first head 31 (time t5), the first head 31 begins to move toward the mounting position P1 with an acceleration α1 that is higher than the acceleration α2. Then, when the distance L to the mounting position P1 becomes less than the distance threshold D (time t6), it decelerates with a deceleration β1 and stops at the mounting position P1 (time t7). Here, the absolute values ​​of acceleration α2, deceleration β2, and upper limit velocity Vmax2 when moving toward the standby position P2 in front of the interference region Ai are smaller than the absolute values ​​of acceleration α1, deceleration β1, and upper limit velocity Vmax1 when moving toward the implementation position P1. Therefore, compared to the case where the absolute values ​​of acceleration α2, deceleration β2, and upper limit velocity Vmax2 are greater than or equal to the absolute values ​​of acceleration α1, deceleration β1, and upper limit velocity Vmax1, power consumption can be reduced. Also, if the first head 31 reaches the standby position P2 before the second head 32 starts moving toward the first head 31, the first head 31 is stopped at the standby position P2 in front of the interference region Ai, thus avoiding interference between the first head 31 and the second head 32. Furthermore, the absolute values ​​of the acceleration α1, deceleration β1, and upper limit velocity Vmax1 when the first head 31 moves toward the mounting position P1 are smaller than the absolute values ​​of the acceleration αl2, deceleration βl2, and upper limit velocity Vmaxl2 when the second head 32 moves away from the first head 31, respectively. Therefore, interference between the first head 31 and the second head 32 can be avoided.

[0041] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The mounting device 10 of this embodiment is an example of the mounting device of the present disclosure, the first head moving device 11 is an example of the first moving unit, the second head moving device 12 is an example of the second moving unit, and the CPU 81 is an example of the moving control unit. In addition, in this embodiment, an example of the control method of the present disclosure is also clarified by describing the operation of the mounting device 10.

[0042] According to the mounting device 10 of the present embodiment described above, in the mounting device 10, the first and second heads 31 and 32 are controlled by the first head moving device 11 and the second head moving device 12 to hold components and move to the mounting position P1. At the same time, approach control is executed to control the first head moving device 11 so that the first head 31 approaches to the front of the interference region Ai. By controlling the first head moving device 11 such that the absolute value of the approach speed parameter including the acceleration α2, deceleration β2, and upper limit speed Vmax2 of the first head 31 in the approach control is smaller than the absolute value of the mounting movement speed parameter in the mounting movement control of the first head 31 and the absolute value of the speed parameter in the exclusive control of the second head 32, power consumption can be reduced.

[0043] In addition, in the mounting device 10, when the mounting position P1 of the first head 31 is included in the mounting planned region Am where the second head 32 plans to mount components in the pick-and-place cycle when controlling the first head moving device 11 so that the first head 31 holds components and moves to the mounting position P1, approach control is executed. When the second head 32 starts to move away from the first head 31 during the approach control, the approach control is aborted and the first head moving device 11 is controlled so that the first head 31 moves to the mounting position P1 as normal control, thereby reducing power consumption.

[0044] Furthermore, in the mounting device 10, in the approach control, when the second head 32 has not started to move away from the first head 31 when the first head 31 reaches the standby position P2 in front of the interference region Ai, the first head moving device 11 is controlled to standby at the standby position P2, thereby avoiding interference between the first head 31 and the second head 32.

[0045] And in the mounting device 10, by controlling the first head moving device 11 such that the absolute value of the speed parameter of the first head 31 in the mounting movement control is smaller than the absolute value of the speed parameter when the second head 32 moves away from the first head 31, interference between the first head 31 and the second head 32 can be avoided.

[0046] Furthermore, in the mounting device 10, interference between the first head 31 and the second head 32 can be avoided by making the interference region Ai a rectangular region located on the first head 31 side of the second head 32.

[0047] Furthermore, in the mounting device 10, the normal control includes mounting movement control, which controls the first head moving device 11 so that the first head 31 moves to the mounting position P1, and mutual exclusion control, which controls the first head moving device 11 and the second head moving device 12 so that when mounting a component held by the first head 31 to the mounting position the second head 32 moves backward, i.e., away from the first head 31, and when mounting a component held by the second head 32 to the mounting position the first head 31 moves forward, i.e., away from the second head 32. Therefore, in approach control, the velocity parameter of the first head 31 can be made smaller compared to the velocity parameter in mounting movement control and mutual exclusion control.

[0048] In the above-described embodiment, the speed parameters during mounting movement include the acceleration α1, the deceleration β1, and the upper limit speed Vmax1, and the speed parameters during approach include the acceleration α2, the deceleration β2, and the upper limit speed Vmax2. However, these speed parameters only need to include at least one of the acceleration, the deceleration, and the upper limit speed. For example, when the approach speed parameters include the acceleration α2 and the deceleration β2 but do not include the upper limit speed Vmax2, as shown in FIGS. 12 and 13, the CPU 81 may move the first head 31 while accelerating at the acceleration α2 for a predetermined time Δt0 during approach control, and then move it while decelerating at the deceleration β2 for a predetermined time Δt0. And when the second head 32 starts to move while the first head 31 is moving while accelerating at the acceleration α2 (time t11), as shown in FIG. 12, the first head 31 moves toward the mounting position P1 at an acceleration α1 whose absolute value is larger than that of the acceleration α2 for a predetermined time Δt1 without stopping (time t11 to t12), then moves at a constant speed for a predetermined time Δt2 (time t12 to t13), and then decelerates at a deceleration β1 whose absolute value is larger than that of the deceleration β2 for a predetermined time Δt3 so as to stop at the mounting position P1 (time t13 to t14), and the first head moving device 11 may be controlled. Also, when the first head 31 reaches the standby position P2 before the second head 32 starts to move in the direction away from the first head 31, as shown in FIG. 13, it stops at the standby position P2 until the second head 32 starts to move in the direction away from the first head 31 (time t0 to t15). And it may control the first head moving device 11 so that it moves toward the mounting position P1 at an acceleration α1 whose absolute value is larger than that of the acceleration α2 for a predetermined time Δt11 (time t15 to t16), and then decelerates at a deceleration β1 whose absolute value is larger than that of the deceleration β2 for a predetermined time Δt12 so as to stop at the mounting position P1 (time t16 to t17). Also, when the approach speed parameters include the acceleration α2 and the upper limit speed Vmax2 but do not include the deceleration β2, the CPU 81 may control the first head moving device 11 so that the first head 31 decelerates at a deceleration β2 having an absolute value equal to the absolute value of the acceleration α2.

[0049] In the above embodiment, the CPU 81 sets the interference region Ai as a rectangular region located on the first head 31 side of the second head 32, within a predetermined distance range in the left-right direction and within a predetermined distance range in the front-back direction. However, the CPU 81 may set the interference region Ai as a region with a shape different from a rectangle, for example, a circular region within a radius L2 from the center of the second head 32. Also, the CPU 81 sets the interference region Ai as a region that is not set when the second head 32 is located outside the planned mounting area Am. However, the CPU 81 may set the interference region Ai as a region that is set regardless of whether the second head 32 is located within the planned mounting area Am or not.

[0050] The above-described embodiment explains the process for moving the first head 31. However, the process for moving the second head 32 is the same. That is, the CPU 81 executes a second approach control to control the second head moving device 12 so that the second head 32 approaches to the front of the interference region Ai2 located on the second head 32 side of the first head 31. The second head moving device 12 should be controlled so that the absolute values ​​of the approach velocity parameters, including the acceleration α3, deceleration β3, and upper limit velocity Vmax3 of the second head 32 in the second approach control, are smaller than the absolute values ​​of the velocity parameters in the mounting movement control of the second head 32 and the velocity parameters in the exclusive control of the first head 31.

[0051] In the above-described embodiment, implementation movement control and mutual exclusion control are given as examples of controls included in normal control. However, the controls included in normal control only need to be at least one of implementation movement control and mutual exclusion control; for example, mutual exclusion control alone may be included.

[0052] The implementation device of this disclosure may be configured as follows.

[0053] The present disclosure provides a control method for a mounting apparatus, comprising first and second heads for holding components, a first moving unit for moving the first head, and a second moving unit for moving the second head, for mounting components onto a substrate by moving the first and second heads to a mounting position, wherein the control method involves controlling the first and second heads and the first and second moving units so that the first and second heads hold components and move to the mounting position, and performing proximity control to control the first moving unit so that the first head approaches to the front of an interference region, and controlling the first moving unit in the proximity control so that the absolute value of a velocity parameter including at least one of the acceleration, deceleration, and velocity of the first head is smaller than the absolute value of at least one of the velocity parameter of the first head and the velocity parameter of the second head in normal control.

[0054] In the control method for the mounting apparatus of this disclosure, the first and second heads and the first and second moving parts are controlled so that the first and second heads hold the components and move to the mounting position, and proximity control is performed to control the first moving part so that the first head approaches to the front of the interference area. The first moving part is controlled so that the absolute value of the velocity parameter of the first head, which includes at least one of the acceleration, deceleration, and velocity of the first head in proximity control, is smaller than the absolute value of at least one of the velocity parameter of the first head and the velocity parameter of the second head in normal control. As a result, in this control method for the mounting apparatus, power consumption is reduced during proximity control compared to a control where the absolute value of the velocity parameter of the first head is greater than or equal to the absolute value of the velocity parameter of the first head or the velocity parameter of the second head in normal control.

[0055] This specification also discloses technical concepts in which "the mounting device described in claim 2" is changed to "the mounting device described in claim 2 or 3" in the original claim 4, technical concepts in which "the mounting device described in claim 1 or 2" is changed to "the mounting device described in any one of claims 1 to 4" in the original claim 5, and technical concepts in which "the mounting device described in claim 1 or 2" is changed to "the mounting device described in any one of claims 1 to 5" in the original claim 6.

[0056] This disclosure can be used in industries such as the manufacturing of mounting equipment.

[0057] 10 Mounting device, 11 First head moving device, 12 Second head moving device, 13 Support base, 21 First X-axis moving device, 22 Second X-axis moving device, 23 First beam member, 23a Opposing surface, 24 Second beam member, 24a Opposing surface, 26 X-axis linear guide, 27 X-axis linear motor, 28 X-axis movable element, 31 First head, 32 Second head, 37 First X-axis linear encoder, 38 Second X-axis linear encoder, 41 First part camera, 42 Second part camera, 51 First Y-axis moving device, 52 Second Y-axis moving device, 53 Y-axis linear guide, 54 Y-axis linear motor, 55 Y-axis stator, 56 Y-axis movable element, 57 First Y-axis linear encoder, 58 Second Y-axis linear encoder, 60 Tape feeder, 70 Substrate transport device, 80 Control device, 81 CPU, 82 ROM, 83 RAM, 84 storage, B base, S board.

Claims

1. A mounting apparatus for mounting components onto a substrate by moving first and second heads that hold components to a mounting position, comprising: a first moving unit for moving the first head; a second moving unit for moving the second head; and a moving control unit that controls the first and second heads and the first and second moving units so that the first and second heads hold components and move to the mounting position, and performs proximity control by controlling the first moving unit so that the first head approaches to the front of an interference region where it interferes with the second head, and controls the first moving unit so that the absolute value of a velocity parameter including at least one of the acceleration, deceleration, and velocity of the first head in the proximity control is smaller than the absolute value of at least one of the velocity parameter of the first head and the velocity parameter of the second head in normal control.

2. A mounting apparatus according to claim 1, wherein the movement control unit performs proximity control when the mounting position of the first head is included within a planned mounting area where the second head is scheduled to mount a component, during a pick-and-place cycle in which the movement control unit controls the first movement unit to move the first head to the mounting position while holding a component, and when the second head starts moving away from the first head during the proximity control, the proximity control is canceled and mounting movement control is performed as normal control, controlling the first movement unit to move the first head to the mounting position.

3. An mounting apparatus according to claim 1 or 2, wherein the movement control unit controls the first movement unit to wait at the standby position when the first head has reached a standby position in front of the interference area and the second head has not started moving away from the first head during the approach control.

4. A mounting apparatus according to claim 2, wherein the movement control unit controls the first movement unit such that the absolute value of the velocity parameter of the first head in the mounting movement control is smaller than the absolute value of the velocity parameter when the second head is moving away from the first head.

5. An mounting apparatus according to claim 1 or 2, wherein the movement control unit performs a second approach control that controls the second moving unit so that the second head approaches to the front of the interference region, and controls the second moving unit so that the absolute value of the velocity parameter of the second head in the second approach control is smaller than the absolute value of at least one of the velocity parameter of the first head and the velocity parameter of the second head during normal control.

6. A mounting apparatus according to claim 1 or 2, wherein the interference region is a rectangular or circular region located on the first head side of the second head.

7. A mounting apparatus according to claim 1, wherein the normal control includes at least one of mounting movement control, which controls the first moving part so that the first head moves to a mounting position, and exclusive control, which controls the first moving part so that the second head moves away from the first head.

8. A control method for a mounting apparatus that mounts components onto a substrate by moving the first and second heads to a mounting position, comprising: first and second heads for holding components; first moving unit for moving the first head; and second moving unit for moving the second head, the method comprising: controlling the first and second heads and the first and second moving units so that the first and second heads hold components and move to the mounting position; performing proximity control to control the first moving unit so that the first head approaches to the front of an interference region; and controlling the first moving unit in the proximity control so that the absolute value of a velocity parameter including at least one of the acceleration, deceleration, and velocity of the first head is smaller than the absolute value of at least one of the velocity parameter of the first head and the velocity parameter of the second head during normal control.

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