Display device and electronic apparatus

Abstract

Provided is a display device comprising a plurality of light-emitting elements arrayed on a substrate and separated from each other. Each of the light-emitting elements includes lamination layers constituted by a first electrode, a light-emitting unit provided on the first electrode, and a second electrode provided on the light-emitting unit. Second electrodes that are adjacent to each other are electrically connected to each other by a wire extending on the second electrodes. A first auxiliary wire is provided between light-emitting elements that are adjacent to each other such that the first auxiliary wire comes into contact with the aforementioned wire. The first auxiliary wire includes a first conductive layer constituted by a material common to the second electrodes. At least a portion of the first conductive layer is located at the same heights as the lamination layers in a cross section obtained by cutting a light-emitting element in the lamination direction.

Description

Display device and electronic device

[0001] The present disclosure relates to a display device and an electronic device.

[0002] In recent years, development of display devices using electroluminescence (EL) elements as light-emitting elements has been progressing. In such a display device, for example, a plurality of light-emitting elements having a stacked structure composed of a lower electrode, a light-emitting layer stacked on the lower electrode, and an upper electrode stacked on the light-emitting layer are arranged on a substrate. Then, when a predetermined voltage is supplied to the lower electrode and the upper electrode, the light-emitting layer sandwiched between the lower electrode and the upper electrode emits light. For example, as an example of such a display device, the display device of the following patent document can be cited.

[0003] International Publication No. 2021 / 202144

[0004] In the prior art, a structure of a light-emitting element having a structure in which the light-emitting layer and the upper electrode are separated for each light-emitting element has been proposed. In such a structure, since the upper electrode of the light-emitting element is separated, in order to electrically connect the upper electrodes of each light-emitting element to each other, a wiring extending across a plurality of light-emitting elements is provided.

[0005] However, in the wiring provided so as to extend over the light-emitting element having a stacked structure, a portion where the wiring is locally thinned easily occurs, and there is a high probability that the resistance increases.

[0006] Therefore, the present disclosure proposes a display device and an electronic device capable of suppressing an increase in wiring resistance.

[0007] According to this disclosure, a display device is provided comprising a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate comprising a first electrode, a light-emitting portion provided on the first electrode, and a second electrode provided on the light-emitting portion, adjacent second electrodes are electrically connected to each other by wiring extending over each second electrode, and a first auxiliary wiring is provided between adjacent light-emitting elements so as to be in contact with the wiring, the first auxiliary wiring includes a first conductive layer made of a material common to the second electrodes, and at least a portion of the first conductive layer is located at the same height as the laminate in a cross-section obtained by cutting the light-emitting element along the lamination direction.

[0008] Furthermore, according to the present disclosure, there is an electronic device equipped with a display device having a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate consisting of a first electrode, a light-emitting portion provided on the first electrode, and a second electrode provided on the light-emitting portion, adjacent second electrodes are electrically connected to each other by wiring extending over each second electrode, a first auxiliary wiring is provided between adjacent light-emitting elements so as to be in contact with the wiring, the first auxiliary wiring includes a first conductive layer made of a material common to the second electrodes, and at least a portion of the first conductive layer is located at the same height as the laminate in a cross-section obtained by cutting the light-emitting element along the lamination direction.

[0009] This is a schematic diagram showing an example of the overall configuration of a display device according to an embodiment of the present disclosure. This is a schematic circuit diagram for explaining the wiring relationship in the sub-pixel of the mth row and nth column. This is a cross-sectional view for explaining an example of the configuration of a light-emitting element according to a comparative example. This is a cross-sectional view for explaining an example of the configuration of a light-emitting element according to the first embodiment of the present disclosure. This is an explanatory diagram (1) for explaining the manufacturing method of a light-emitting element according to the first embodiment of the present disclosure. This is an explanatory diagram (2) for explaining the manufacturing method of a light-emitting element according to the first embodiment of the present disclosure. This is an explanatory diagram (3) for explaining the manufacturing method of a light-emitting element according to the first embodiment of the present disclosure. This is an explanatory diagram (4) for explaining the manufacturing method of a light-emitting element according to the first embodiment of the present disclosure. This is an explanatory diagram (5) for explaining the manufacturing method of a light-emitting element according to the first embodiment of the present disclosure. This is an explanatory diagram for explaining the manufacturing method of a light-emitting element according to modification 1 of the first embodiment of the present disclosure. This is an explanatory diagram for explaining the manufacturing method of a light-emitting element according to modification 2 of the first embodiment of the present disclosure. This is a plan view for explaining an example of the configuration of a light-emitting element according to modification 3 of the first embodiment of the present disclosure. This is a cross-sectional view for explaining an example of the configuration of a light-emitting element according to a second embodiment of the present disclosure. This is an explanatory diagram (1) for explaining the manufacturing method of a light-emitting element according to the second embodiment of the present disclosure. This is an explanatory diagram (2) for explaining the manufacturing method of a light-emitting element according to the second embodiment of the present disclosure. This is an explanatory diagram (part 3) illustrating the method for manufacturing a light-emitting element according to the second embodiment of this disclosure. This is an explanatory diagram (part 4) illustrating the method for manufacturing a light-emitting element according to the second embodiment of this disclosure. This is an explanatory diagram (part 5) illustrating the method for manufacturing a light-emitting element according to the second embodiment of this disclosure. This is a cross-sectional view illustrating an example of the configuration of a light-emitting element according to the third embodiment of this disclosure. This is an explanatory diagram illustrating the method for manufacturing a light-emitting element according to the third embodiment of this disclosure. This is a cross-sectional view of a light-emitting element illustrating the background of the fourth embodiment of this disclosure. This is a cross-sectional view illustrating an example of the configuration of a light-emitting element according to the fourth embodiment of this disclosure. This is a cross-sectional view (part 1) illustrating an example of the configuration of a light-emitting element according to Modification 1 of the fourth embodiment of this disclosure. This is a cross-sectional view (part 2) illustrating an example of the configuration of a light-emitting element according to Modification 1 of the fourth embodiment of this disclosure.This is a cross-sectional view (part 3) illustrating an example of the configuration of a light-emitting element according to Modification 1 of the fourth embodiment of this disclosure. This is a cross-sectional view (part 4) illustrating an example of the configuration of a light-emitting element according to Modification 1 of the fourth embodiment of this disclosure. This is a cross-sectional view (part 5) illustrating an example of the configuration of a light-emitting element according to Modification 1 of the fourth embodiment of this disclosure. This is a cross-sectional view (part 6) illustrating an example of the configuration of a light-emitting element according to Modification 1 of the fourth embodiment of this disclosure. This is a cross-sectional view (part 7) illustrating an example of the configuration of a light-emitting element according to Modification 1 of the fourth embodiment of this disclosure. This is a cross-sectional view (part 8) illustrating an example of the configuration of a light-emitting element according to Modification 1 of the fourth embodiment of this disclosure. This is a plan view (part 1) illustrating an example of the configuration of a light-emitting element according to Modification 2 of the fourth embodiment of this disclosure. This is a plan view (part 2) illustrating an example of the configuration of a light-emitting element according to Modification 2 of the fourth embodiment of this disclosure. This is a plan view (part 3) illustrating an example of the configuration of a light-emitting element according to Modification 2 of the fourth embodiment of this disclosure. This is a plan view (part 4) illustrating an example of the configuration of a light-emitting element according to Modification 2 of the fourth embodiment of this disclosure. This is an explanatory diagram (part 1) illustrating a method for manufacturing a light-emitting element according to the fourth embodiment of this disclosure. This is an explanatory diagram (part 2) for illustrating the manufacturing method of a light-emitting element according to the fourth embodiment of this disclosure. This is a cross-sectional view illustrating an example of the configuration of a light-emitting element according to the fifth embodiment of this disclosure. This is a cross-sectional view (part 1) illustrating an example of the configuration of a light-emitting element according to a modified example of the fifth embodiment of this disclosure. This is a cross-sectional view (part 2) illustrating an example of the configuration of a light-emitting element according to a modified example of the fifth embodiment of this disclosure. This is an explanatory diagram (part 1) for illustrating the manufacturing method of a light-emitting element according to the fifth embodiment of this disclosure. This is an explanatory diagram (part 2) for illustrating the manufacturing method of a light-emitting element according to the fifth embodiment of this disclosure. This is a cross-sectional view of a light-emitting element illustrating the background of the sixth embodiment of this disclosure. This is a plan view illustrating an example of configuration 1 of a light-emitting element according to the sixth embodiment of this disclosure. This is a cross-sectional view illustrating an example of configuration 1 of a light-emitting element according to the sixth embodiment of this disclosure. This is an explanatory diagram (part 1) for illustrating the manufacturing method of a light-emitting element according to configuration 1 of the sixth embodiment of this disclosure. This is an explanatory diagram (part 2) for illustrating the manufacturing method of a light-emitting element according to configuration 1 of the sixth embodiment of this disclosure.This is an explanatory diagram (part 3) illustrating the method for manufacturing a light-emitting element of configuration 1 of the sixth embodiment of this disclosure. This is an explanatory diagram (part 4) illustrating the method for manufacturing a light-emitting element of configuration 1 of the sixth embodiment of this disclosure. This is a cross-sectional view illustrating an example of configuration 2 of a light-emitting element according to the sixth embodiment of this disclosure. This is an explanatory diagram illustrating the method for manufacturing a light-emitting element of configuration 2 of the sixth embodiment of this disclosure. This is a plan view illustrating an example of configuration 3 of a light-emitting element according to the sixth embodiment of this disclosure. This is a cross-sectional view illustrating an example of configuration 3 of a light-emitting element according to the sixth embodiment of this disclosure. This is an explanatory diagram (part 1) illustrating the method for manufacturing a light-emitting element of configuration 3 of the sixth embodiment of this disclosure. This is an explanatory diagram (part 2) illustrating the method for manufacturing a light-emitting element of configuration 3 of the sixth embodiment of this disclosure. This is an explanatory diagram (part 3) illustrating the method for manufacturing a light-emitting element of configuration 3 of the sixth embodiment of this disclosure. This is an explanatory diagram (part 4) illustrating the method for manufacturing a light-emitting element of configuration 3 of the sixth embodiment of this disclosure. This is a conceptual diagram (1) to explain the relationship between the normal vector LN passing through the center of the light-emitting part, the normal vector LN' passing through the center of the lens member, and the normal vector LN" passing through the center of the wavelength selection part. This is a conceptual diagram (2) to explain the relationship between the normal vector LN passing through the center of the light-emitting part, the normal vector LN' passing through the center of the lens member, and the normal vector LN" passing through the center of the wavelength selection part. This is a conceptual diagram (3) to explain the relationship between the normal vector LN passing through the center of the light-emitting part, the normal vector LN' passing through the center of the lens member, and the normal vector LN" passing through the center of the wavelength selection part. This is a conceptual diagram (4) to explain the relationship between the normal vector LN passing through the center of the light-emitting part, the normal vector LN' passing through the center of the lens member, and the normal vector LN" passing through the center of the wavelength selection part. This is a conceptual diagram (No. 5) illustrating the relationship between the normal vector LN passing through the center of the light-emitting part, the normal vector LN' passing through the center of the lens member, and the normal vector LN'' passing through the center of the wavelength-selecting part. This is a conceptual diagram (No. 6) illustrating the relationship between the normal vector LN passing through the center of the light-emitting part, the normal vector LN' passing through the center of the lens member, and the normal vector LN'' passing through the center of the wavelength-selecting part. This is a conceptual diagram (No. 7) illustrating the relationship between the normal vector LN passing through the center of the light-emitting part, the normal vector LN' passing through the center of the lens member, and the normal vector LN'' passing through the center of the wavelength-selecting part. This is a schematic cross-sectional view illustrating the first example of the resonator structure. This is a schematic cross-sectional view illustrating the second example of the resonator structure.This is a schematic cross-sectional view illustrating a third example of a resonator structure. This is a schematic cross-sectional view illustrating a fourth example of a resonator structure. This is a schematic cross-sectional view illustrating a fifth example of a resonator structure. This is a schematic cross-sectional view illustrating a sixth example of a resonator structure. This is a schematic cross-sectional view illustrating a seventh example of a resonator structure. This is a front view showing an example of the appearance of a digital still camera. This is a rear view showing an example of the appearance of a digital still camera. This is an external view of a head-mounted display. This is an external view of a see-through head-mounted display. This is an external view of a television system. This is an external view of a smartphone. This is a diagram (1) showing the internal configuration of an automobile. This is a diagram (2) showing the internal configuration of an automobile.

[0010] Preferred embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configuration will be denoted by the same reference numeral to avoid redundant explanation. In addition, in this specification and drawings, multiple components having substantially the same or similar functional configurations may be distinguished by adding a different alphabet after the same reference numeral. However, if there is no particular need to distinguish each of multiple components having substantially the same or similar functional configurations, only the same reference numeral will be used.

[0011] Furthermore, the drawings referenced in the following description are intended to illustrate and facilitate understanding of one embodiment of this disclosure, and for the sake of clarity, the shapes, dimensions, ratios, etc. shown in the drawings may differ from those of the actual product. In addition, the apparatus shown in the drawings may be modified in design as appropriate, taking into consideration the following description and known technology.

[0012] The descriptions of specific shapes in the following explanation do not refer only to geometrically defined shapes. More specifically, the descriptions of specific shapes in the following explanation include shapes that are similar to or have acceptable differences (errors and distortions) in light-emitting elements, display devices, their manufacturing processes, and their use and operation.

[0013] Furthermore, in the following descriptions of circuits (electrical connections), unless otherwise specified, "electrically connected" means connecting multiple elements in such a way that electricity (signals) can conduct through them. In addition, "electrically connected" in the following descriptions includes not only cases where multiple elements are directly and electrically connected, but also cases where they are indirectly and electrically connected through other elements.

[0014] The explanation will be given in the following order: 1. Overall configuration of the display device according to the embodiment of this disclosure 2. Background 3. First embodiment 3.1 Detailed configuration 3.2 Manufacturing method 3.3 Modification 4. Second embodiment 4.1 Detailed configuration 4.2 Manufacturing method 5. Third embodiment 5.1 Detailed configuration 5.2 Modification 6. Fourth embodiment 6.1 Background 6.2 Detailed configuration 6.3 Modification 1 6.4 Modification 2 6.5 Manufacturing method 7. Fifth embodiment 7.1 Detailed configuration 7.2 Modification 7.3 Manufacturing method 8. Sixth embodiment 8.1 Background 8.2 Detailed configuration 1 8.3 Detailed configuration 2 8.4 Detailed configuration 3 9. Summary 10. Modification 10.1 Modification 1 10.2 Modification 2 11. Application examples 12. Supplement

[0015] <<1. Overall Configuration of the Display Device According to the Embodiment of the Disclosure>> Referring to Figure 1, an example of the overall configuration of an organic EL (Electro-Luminescence) display device (display device) 10 (hereinafter simply referred to as "display device 10") according to the embodiment of the disclosure, which is used as a display device or lighting device, will be described. Figure 1 is a schematic diagram showing an example of the overall configuration of the display device 10 according to the embodiment of the disclosure.

[0016] The display device 10 is a device in which light-emitting elements such as OLEDs (Organic Light Emitting Diodes) or Micro-OLEDs are formed in an array. Such a display device 10 can be applied as a display device for VR (Virtual Reality), MR (Mixed Reality), or AR (Augmented Reality), an electronic viewfinder (EVF), or a small projector, etc. The display device 10 can also be applied to various lighting devices. Note that the display device 10 may use light-emitting elements made of inorganic materials instead of light-emitting elements made of organic materials such as OLEDs.

[0017] The display device 10 has a display area and a peripheral area provided around the periphery of the display area. As shown in Figure 1, within the display area of ​​the display device 10, for example, a plurality of subpixels 100R, 100G, and 100B are arranged in a matrix. Subpixel 100R can emit red light, subpixel 100G can emit green light, and subpixel 100B can emit blue light. In the following description, when subpixels 100R, 100G, and 100B are not specifically distinguished, they will be referred to as subpixel 100. In the embodiments of this disclosure, the subpixel 100 is not limited to being an element that emits red light, green light, and blue light, but may be an element that emits white light, for example.

[0018] Furthermore, in this embodiment, one pixel 20 is composed of, for example, three types of subpixels 100R, 100G, and 100B that emit different light. In this embodiment, the number and arrangement of each of the three types of subpixels 100R, 100G, and 100B included in one pixel 20 are not particularly limited. Also, in this embodiment, one pixel 20 is not limited to being composed of multiple subpixels 100 that emit different light as described above, but may be composed of multiple subpixels 100 that emit the same color light. Furthermore, a pixel 20 means the smallest unit (pixel) controlled when controlling the light emission of the display device 10, and is composed of multiple subpixels 100 that are treated as one unit during control. In other words, in this embodiment, the display device 10 has multiple pixels 20 arranged in a matrix on the substrate 40.

[0019] Furthermore, as shown in Figure 1, a horizontal drive circuit 11 and a vertical drive circuit 12 are provided in the peripheral area of ​​the display device 10.

[0020] The horizontal drive circuit 11 scans each sub-pixel 100 row by row (in Figure 1, the direction extending along the X direction is called the row direction) when writing a signal to each sub-pixel 100, and can sequentially supply a scan signal to each scan line SCLm. The horizontal drive circuit 11 can be configured, for example, by a shift register that sequentially shifts (transfers) start pulses in synchronization with the input clock pulse.

[0021] Furthermore, the vertical drive circuit 12 outputs the signal voltage of the signal corresponding to the brightness information supplied from the signal source (not shown) to the signal line DTL. ｎ It can be supplied to subpixels 100 selected in column units (in Figure 1, the direction extending along the Y direction is called the column direction) via this.

[0022] In the embodiments of this disclosure, the configuration of the display device 10 is not limited to the configuration shown in Figure 1. That is, the configuration shown in Figure 1 is merely an example, and the display device 10 according to the embodiments of this disclosure can take various configurations.

[0023] Next, referring to FIG. 2, the circuit configuration of the sub-pixel 100 at the m-th row and n-th column will be described. FIG. 2 is a schematic circuit diagram for explaining the connection relationship of the sub-pixel 100 at the m-th row and n-th column.

[0024] In the display device 10, as described above, the sub-pixel 100 including the light-emitting element ELP is connected to the scanning line SCL ｍ extending in the row direction (X direction in FIG. 1) ｎ and the signal line DTL extending in the column direction (Y direction in FIG. 1)

[0025] and arranged in a two-dimensional matrix. ｍ Furthermore, as shown in FIG. 2, the display device 10 has a power supply line PS1 ｍ for supplying a driving voltage to the sub-pixel 100 ＣＣ and a common power supply line PS2 commonly connected to all the sub-pixels 100. The power supply line PS1 Ｃａｔ is supplied with a predetermined driving voltage V

[0026] etc. from a power supply unit (not shown), and the common power supply line PS2 is supplied with a common voltage V ｍ For example, the ground potential). ｍ Here, let the number of scanning lines SCL and power supply lines PS1 be M each. The sub-pixel 100 in the m-th row (where m = 1, 2,..., P) is connected to the m-th scanning line SCL ｍ and the m-th power supply line PS1 ｍ and constitutes one display element row. In FIG. 2, only the scanning line SCL ｎ and the power supply line PS1 ｎ are shown. Also, let the number of signal lines DTL be N. The sub-pixel 100 in the n-th column (where n = 1, 2,..., N) is connected to the n-th signal line DTL

[0027] is shown. Hereinafter, the sub-pixel 100 located at the m-th row and n-th column may be referred to as the (n, m)-th sub-pixel 100.As explained earlier, the display device 10 is scanned sequentially row by row by the scanning signal from the horizontal drive circuit 11. More specifically, in the display device 10, M subpixels 100 arranged in the mth row are driven simultaneously. In other words, for the M subpixels 100 arranged along the row direction, the timing of their illumination / de-illumination is controlled on a row-by-row basis. For example, if the display frame rate of the display device 10 is FR (frames / second), the scanning period per row (the so-called horizontal scanning period) when the display device 10 is scanned sequentially row by row will be less than (1 / FR) × (1 / P) seconds.

[0028] Furthermore, as shown in Figure 2, the sub-pixel 100 is composed of a light-emitting element ELP and a drive circuit that drives it. The light-emitting element ELP consists of an organic electroluminescent light-emitting element or an inorganic electroluminescent light-emitting element. The drive circuit is a writing transistor TR Ｗ , and drive transistor TR Ｄ , and also, capacity section C １ It consists of the following: drive transistor TR Ｄ When current flows through the light-emitting element ELP, the ELP can emit light. Each transistor is composed of, for example, a p-channel field-effect transistor.

[0029] As shown in Figure 2, in the subpixel 100, the drive transistor TR Ｄ One of the source / drain regions is the capacitance section C １ One end and power supply line PS1 ｍ The two are electrically connected, and the other source / drain region is electrically connected to one end of the light-emitting element ELP (specifically, the anode electrode). The gate electrode of the drive transistor TRD is connected to the other source / drain region of the write transistor TRW, and the capacitance C １ It is electrically connected to the other end.

[0030] Also, as shown in Figure 2, the writing transistor TR Ｗ One of the source / drain regions is the signal line DTL ｎ It is electrically connected to the writing transistor TR ＷThe gate electrode is the scan line SCL ｍ It is electrically connected to it.

[0031] Furthermore, as shown in Figure 2, the other end of the light-emitting element ELP (specifically, the cathode electrode) is electrically connected to the common power supply line PS2. In addition, a predetermined cathode voltage V is supplied to the common power supply line PS2. Ｃａｔ This is supplied. Note that in Figure 2, the capacitance of the light-emitting element ELP is denoted by code C. ＥＬ It is represented as follows.

[0032] The overview of the driving of the subpixel 100 will be explained. In the subpixel 100, the signal line DTL is transmitted from the vertical drive circuit 12. ｎ With a voltage corresponding to the brightness of the image to be displayed supplied, the scanning signal from the horizontal drive circuit 11 triggers the writing transistor TR Ｗ When the capacitance C is in a conductive state, １ A voltage corresponding to the brightness is written to it. (Writing transistor TR) Ｗ After the capacitor is de-conducted, the capacitance part C １ The drive transistor TR operates according to the voltage held in Ｄ When an electric current flows through it, the light-emitting element ELP emits light.

[0033] In the embodiments of this disclosure, the configuration of the drive circuit that controls the light emission of the light-emitting element ELP is not limited to the configuration shown in Figure 2. Therefore, the configuration shown in Figure 2 is merely an example, and various configurations can be taken in the display device 10 according to the embodiments of this disclosure.

[0034] <<2. Background>> Next, before describing the details of the embodiments of this disclosure with reference to Figure 3, we will explain the background that led the inventors to create the embodiments of this disclosure. Figure 3 is a cross-sectional view illustrating an example of the configuration of a light-emitting element 150a according to a comparative example. Here, the comparative example refers to a light-emitting element 150a that the inventors had been studying before creating the embodiments of this disclosure.

[0035] As shown in Figure 3, the light-emitting elements 150a in the comparative example are separated from each other and provided on the substrate 300. Furthermore, each light-emitting element 150a has a laminate consisting of a first electrode (lower electrode) 102, an organic EL layer 104 provided on the first electrode 102, and a second electrode (upper electrode) 106 provided on the organic EL layer 104. In the comparative example, the first electrode 102, the organic EL layer 104, and the second electrode 106 are separated for each light-emitting element 150a. Furthermore, in the comparative example, protective films 200, 202, and 204 and wiring 110 are provided on the second electrode 106.

[0036] In detail, the first electrode 102 is provided on the substrate 300 individually for each light-emitting element 150, i.e., separated. The first electrode 102 can function as an anode, for example, and when a voltage is applied between the first electrode 102 and the second electrode 106 (described later), holes are injected from the first electrode 102 into the organic EL layer 104. When an electric field is applied to the organic EL layer 104, some of the holes injected from the first electrode 102 via the hole injection layer and the hole transport layer and some of the electrons injected from the second electrode 106 via the electron transport layer recombine to generate light. The second electrode 106 is provided on the organic EL layer 104. The second electrode 106 is provided individually for each light-emitting element 150, i.e., separated, similar to the first electrode 102. The second electrode 106 can function as a cathode, for example, and when a voltage is applied between the first electrode 102 and the second electrode 106, electrons are injected from the second electrode 106 into the organic EL layer 104.

[0037] Furthermore, the protective films 200, 202, and 204 are provided to suppress damage to the organic EL layer 104 and the like during the manufacturing process and contamination from the external environment. Specifically, the protective film 200 is provided so as to cover the outer circumference of the second electrode 106. In other words, the protective film 200 can be said to have an opening (contact hole) 210 that exposes the central part of the upper surface of the second electrode 106. The wiring 110 extends to cover at least a part of the inner wall of the opening 210, and further extends to cover at least a part of the upper surface of the protective film 200. In addition, the wiring 110 contacts the second electrode 106 exposed from the opening 210, thereby electrically connecting the second electrode 106 to the second electrode 106 of the adjacent light-emitting element 150.

[0038] Furthermore, as shown in Figure 3, in the comparative example, the planarization film 302 is provided so as to cover the upper surface of the protective film 204. Also, in this embodiment, as shown in Figure 3, a color filter 304 and an on-chip lens 306 are provided on the planarization film 302 for each light-emitting element 150.

[0039] Incidentally, the light-emitting element 150a described above can display high-quality and high-resolution images, and is therefore used not only in direct-view display devices such as monitors, but also in small display devices such as EVFs (Electronic View Finders) and HMDs (Head-Mounted Displays). In recent years, there has been a strong demand for even higher brightness and resolution in the display device 10, especially for use in AR (Augmented Reality) applications.

[0040] In order to increase the brightness and resolution of the display device 10, the following challenges arose. Specifically, in the conventional technology, in order to form the light-emitting elements 150a arranged on the substrate 300, a continuous organic EL layer 104 was formed across the upper surface of the substrate 300. In other words, in the conventional technology, each light-emitting element 150a was provided so as to share one organic EL layer 104. In such a structure, there was a problem of edge emission of the organic EL layer 104 due to the steps caused by the stacking of the light-emitting elements 150a arranged on the substrate 300. Furthermore, in the conventional technology, as the display device 10 was miniaturized, and the pixel pitch was reduced to a few microns, that is, the distance between the light-emitting elements 150a was narrowed, there was also the problem of light emission between the light-emitting elements 150a due to leakage at the interface and unintended light emission of adjacent light-emitting elements 150a.

[0041] Therefore, in order to resolve these issues, a structure has been proposed in which the organic EL layer 104 and the second electrode 106 are separated and provided for each light-emitting element 150a, as shown in Figure 3 of the comparative example light-emitting element 150a described above.

[0042] In the structure of this comparative example, since the light-emitting element 150a is divided, as shown in Figure 3, a contact hole (opening 210) for connecting to the second electrode 106 is formed in the protective film 200 on the second electrode 106, and wiring 110 is formed around the contact hole and on the inner wall. In the comparative example, each second electrode 106 is electrically connected by such wiring 110. In addition, in the comparative example, in order to obtain such a structure, the wiring 110 is formed in the narrow space between the stacked adjacent light-emitting elements 150a. However, because the spacing between the light-emitting elements 150a is narrow and the film that will become the wiring 110 is formed at a deep position when viewed from the upper surface (second electrode 106) of the stacked light-emitting elements 150a, there is a high probability that the wiring 110 will be locally thin. In other words, since the wiring 110 is formed at the bottom of a groove with a high aspect ratio formed by the stacked light-emitting elements 150a, the coverage of the wiring 110 deteriorates at the bottom of the groove. Furthermore, because the wiring 110 becomes thinner in certain areas, the resistance of the wiring 110 increases. As a result, some light-emitting elements 150a may have reduced brightness, or the overall power consumption of the display device 10 may increase.

[0043] Therefore, in view of these circumstances, the present inventors have created the embodiments of the present disclosure described below. In the embodiments of the present disclosure, auxiliary wiring is provided so as to be in contact with the wiring 110 located between the light-emitting elements 150, which are highly likely to become thinner, thereby avoiding an increase in the resistance of the wiring 110, that is, making the wiring 110 less resistive. Furthermore, in this embodiment, by manufacturing the auxiliary wiring simultaneously with the second electrode 106 of the light-emitting elements 150, it is possible to avoid significantly changing the manufacturing process. Furthermore, in this embodiment, the auxiliary wiring is located at the bottom surface of the groove formed by the lamination of the light-emitting elements 150, and since it raises the bottom surface of the groove, the aspect ratio of the groove can be lowered. Therefore, in this embodiment, when the wiring 110 is deposited in the groove, the material of the wiring 110 can easily enter the groove, improving the coverage of the wiring 110 at the bottom surface of the groove and further reducing the resistance of the wiring 110. The details of the embodiments of the present disclosure created by the present inventors will be described in order below.

[0044] <<3. First Embodiment>> <3.1 Detailed Configuration> First, with reference to Figure 4, the first embodiment of the present disclosure created by the present inventors will be described. Figure 4 is a cross-sectional view illustrating an example of the configuration of the pixel 20 according to this embodiment, and is a cross-sectional view when the light-emitting element 150 of the subpixel 100 is cut in a direction perpendicular to the plane of the substrate 300 (the stacking direction of the light-emitting element 150).

[0045] In this embodiment, the pixel 20 described above is composed of, for example, three types of subpixels 100R, 100G, and 100B that emit light of different colors. Here, subpixel 100R emits red light (for example, visible light with a wavelength of about 640 nm to 770 nm), subpixel 100G emits green light (for example, visible light with a wavelength of about 490 nm to 550 nm), and subpixel 100B emits blue light (for example, visible light with a wavelength of about 430 nm to 490 nm). In this embodiment as well, the number and arrangement of each of the three types of subpixels 100R, 100G, and 100B included in one pixel 20 are not limited. Furthermore, in this embodiment, the pixel 20 may have subpixels 100 that emit light other than red light, blue light, and green light. In addition, in this embodiment, each subpixel 100 included in the pixel 20 may emit light of the same color.

[0046] Furthermore, the display device (display device) 10 according to this embodiment has a top-emission type (upper surface light-emitting type), that is, a light-emitting element 150 that emits light upwards toward the substrate 300. More specifically, for example, a plurality of light-emitting elements 150 are arranged in a matrix in a predetermined area on the substrate 300. Each of the plurality of light-emitting elements 150 emits, for example, red (R), green (G), and blue (B) light, respectively, and corresponds to the sub-pixels 100R, 100G, and 100B described above. In other words, in this embodiment, each light-emitting element 150 is equivalent to the sub-pixels 100R, 100G, and 100B that are treated as a single unit during control.

[0047] As shown in Figure 4, the display device 10 according to this embodiment has a substrate 300 and a plurality of light-emitting elements 150 provided on the substrate 300. Each light-emitting element 150 is separated from each other, similar to the comparative example. In this embodiment, each light-emitting element 150 has a laminate consisting of a first electrode (e.g., anode electrode) 102 provided on the substrate 300, an organic EL layer (light-emitting part) 104 provided on the first electrode 102, and a second electrode (e.g., cathode electrode) 106 provided on the organic EL layer 104. In this embodiment, protective films 200, 202, and 204 and wiring 110 are provided on the second electrode 106. Furthermore, in this embodiment, the wiring 110 between adjacent light-emitting elements 150 is in contact with auxiliary wiring (first auxiliary wiring) 120. The details of each component of these light-emitting elements 150 will be described in order below.

[0048] (Substrate 300) The substrate 300 can be formed from a transparent material such as glass or a semiconductor material such as silicon. For example, a drive circuit for driving the light-emitting element 150 can be constructed by appropriately forming transistors, wiring, etc., within the substrate 300. The substrate 300 is provided with a first electrode 102, which will be described later. For example, a voltage can be applied to the first electrode 102 via a via (not shown) provided on the substrate 300.

[0049] In detail, the substrate 300 can be formed from a glass substrate such as high-strain point glass, soda glass, borosilicate glass, forsterite, lead glass, or quartz glass; a semiconductor substrate such as amorphous silicon or polycrystalline silicon; or a resin substrate such as polymethyl methacrylate, polyvinyl alcohol, polyvinylphenol, polyethersulfone, polyimide, polycarbonate, polyethylene terephthalate, or polyethylene naphthalate.

[0050] (First electrode 102) The first electrode 102 is provided on the substrate 300 individually for each light-emitting element 150, that is, separated from each other. The first electrode 102 can function as an anode, for example, and when a voltage is applied between the first electrode 102 and the second electrode 106 (described later), holes are injected from the first electrode 102 into the organic EL layer 104 (described later).

[0051] The first electrode 102 may be composed of, for example, a metal layer, a transparent conductive oxide layer, or a metal layer and a transparent conductive oxide layer.

[0052] The first electrode 102 may, for example, have functions not only as an electrode but also as a reflective layer. In such cases, it is preferable to use a metal film with the highest possible reflectivity and work function to improve the efficiency of light extraction. Examples of such metal films include those containing at least one of the elements and alloys of metals such as chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W), and silver (Ag). Specific examples of the alloys include aluminum (Al) alloys such as AlNi alloy or AlCu alloy, and silver (Ag) alloys such as MgAg alloy.

[0053] Furthermore, the first electrode 102 may be formed from, for example, a transparent conductive oxide. The transparent conductive oxide includes, for example, at least one selected from the group consisting of indium-containing transparent conductive oxides (hereinafter referred to as "indium-based transparent conductive oxide"), tin-containing transparent conductive oxides (hereinafter referred to as "tin-based transparent conductive oxide"), and zinc-containing transparent conductive oxides (hereinafter referred to as "zinc-based transparent conductive oxide").

[0054] Indium-based transparent conductive oxides include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), or fluorine-doped indium oxide (IFO). Among these transparent conductive oxides, indium tin oxide (ITO) is particularly preferred. Indium tin oxide (ITO) has a particularly low work function for the hole injection barrier into the organic EL layer 104, which allows for a particularly low driving voltage for the display device 10. Tin-based transparent conductive oxides include, for example, tin oxide, antimond-doped tin oxide (ATO), or fluorine-doped tin oxide (FTO). Zinc-based transparent conductive oxides include, for example, zinc oxide, aluminum-doped zinc oxide (AZO), boron-doped zinc oxide, or gallium-doped zinc oxide (GZO).

[0055] Furthermore, the first electrode 102 may be a multilayer film, for example, a structure in which a conductive oxide layer and a light-reflecting layer (e.g., a metal layer) having light reflectivity are laminated. When the first electrode 102 is composed of a metal layer and a transparent conductive oxide layer, from the viewpoint of having a layer with a high work function adjacent to the organic EL layer 104, it is preferable that the transparent conductive oxide layer be provided on the organic EL layer 104 side. More specifically, the first electrode 102 may be configured in which an aluminum alloy layer is used as the first layer (light-reflecting layer) and a transparent conductive layer such as indium tin oxide (ITO) or indium zinc oxide (IZO) is used as the second layer (conductive oxide layer).

[0056] Furthermore, the first electrode 102 can also have a structure in which an inorganic hole-injected layer and a light-reflecting layer are laminated. More specifically, the first electrode 102 may have an aluminum alloy layer as the first layer (light-reflecting layer) and titanium (Ti), titanium oxide (TiO), titanium nitride (TiN), molybdenum (Mo), molybdenum oxide (MoO) as the second layer (inorganic hole-injected layer) ３ It may also be a configuration in which an inorganic material layer such as ) is laminated.

[0057] Furthermore, from the viewpoint of improving crystal orientation, an inorganic material layer made of titanium (Ti), tantalum (Ta), titanium nitride (TiN), etc. may be provided below the first electrode 102 as an underlayer (not shown).

[0058] Furthermore, the outer circumference of the first electrode 102 is covered with an inter-pixel insulating portion 108 (see Figures 5A to 5E), and the central part of the upper surface of the first electrode 102 exposed through the opening (pixel aperture) of the inter-pixel insulating portion 108 functions as an electrode. In other words, the inter-pixel insulating portion 108 defines the light-emitting region by the pixel aperture. By providing the inter-pixel insulating portion 108 in this way, current leakage between adjacent light-emitting elements 150 can be suppressed. The inter-pixel insulating portion 108 is made of, for example, silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ), or silicon oxynitride (SiO ｘ N ｙ It can be formed from an inorganic insulating film such as ), or an organic insulating film such as a polyimide resin, acrylic resin, or novolac resin.

[0059] (Organic EL layer 104) In this embodiment, the organic EL layer 104 is formed on the first electrode 102. In the following description, the light-emitting element 150 according to this embodiment will be described as having an organic EL layer 104 made of an organic material as the light-emitting part, but this embodiment is not limited to this, and the light-emitting element 150 according to this embodiment may have an EL layer made of an inorganic material as the light-emitting part.

[0060] In this embodiment, the organic EL layer 104 can have a structure that emits white light, for example, by stacking three light-emitting layers of red, green, and blue. Alternatively, in this embodiment, the organic EL layer 104 may be a light-emitting layer that emits any of the three colors of light, such as red, green, and blue. Furthermore, in this embodiment, the organic EL layer 104 is provided individually for each light-emitting element 150, i.e., separated, similar to the comparative example.

[0061] In detail, the organic EL layer 104 has a structure in which, for example, a hole injection layer, a hole transport layer, a red light-emitting layer, a light-emitting separation layer, a blue light-emitting layer, a green light-emitting layer, and an electron transport layer are sequentially stacked from bottom to top, a so-called one-stack structure. Each light-emitting layer may be a multilayer structure in which different light-emitting materials that emit light of the same color are stacked. By layering light-emitting materials with different properties and separating their functions, localized degradation within the light-emitting layer is suppressed, and a highly efficient and long-life device can be obtained.

[0062] The hole-injection layer can be composed of, for example, hexaazatriphenylene (HAT).

[0063] The hall transport layer can be composed of, for example, α-NPD[N,N'-di(1-naphthyl)-N,N'-diphenyl-[1,1'-biphenyl]-4,4'-diamine].

[0064] The red light-emitting layer generates red light when an electric field is applied, as a portion of the holes injected from the first electrode 102 via the hole injection layer and hole transport layer recombine with a portion of the electrons injected from the second electrode 106 via the electron transport layer. The red light-emitting layer includes, for example, at least one of the following: a red light-emitting material, a hole transport material, an electron transport material, and a dual charge transport material. The red light-emitting material may be fluorescent or phosphorescent. Specifically, the red light-emitting layer can be composed of, for example, 4,4-bis(2,2-diphenylbinin)biphenyl (DPVBi) mixed with 30% by weight of 2,6-bis[(4'-methoxydiphenylamino)styryl]-1,5-dicyanonaphthalene (BSN).

[0065] The emission separation layer is a layer for adjusting the injection of carriers into the emission layers. By injecting electrons and holes into each emission layer via the emission separation layer, the emission balance of each color is adjusted. The emission separation layer can be composed of, for example, a 4,4'-bis[N-(1-naphthyl)-N-phenyl-amino]biphenyl derivative.

[0066] The blue light-emitting layer generates blue light when an electric field is applied, as a portion of the holes injected from the first electrode 102 via the hole injection layer, hole transport layer, and light emission separation layer recombine with a portion of the electrons injected from the second electrode 106 via the electron transport layer. The blue light-emitting layer includes, for example, at least one of the following: a blue light-emitting material, a hole transport material, an electron transport material, and a dual charge transport material. The blue light-emitting material may be fluorescent or phosphorescent. Specifically, the blue light-emitting layer can be composed of, for example, a mixture of DPVBi and 2.5% by weight of 4,4'-bis[2-{4-(N,N-diphenylamino)phenyl}vinyl]biphenyl (DPAVBi).

[0067] The green light-emitting layer generates green light when an electric field is applied, as a portion of the holes injected from the first electrode 102 via the hole injection layer, hole transport layer, and light emission separation layer recombine with a portion of the electrons injected from the second electrode 106 via the electron transport layer. The green light-emitting layer includes, for example, at least one of the following: a green light-emitting material, a hole transport material, an electron transport material, and a dual charge transport material. The green light-emitting material may be fluorescent or phosphorescent. Specifically, the green light-emitting layer can be composed of, for example, a mixture of DPVBi with 5% by weight of coumarin 6.

[0068] Examples of electron transport layers include BCP (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Alq3 (aluminum quinolinol), and Bphen (basophenanthroline). The electron transport layer consists of at least one layer and may include an electron transport layer doped with an alkali metal or alkaline earth metal.

[0069] An electron transport layer doped with an alkali metal or alkaline earth metal can be constructed by co-depositing, for example, 0.5 to 15% by weight, of an alkali metal such as lithium (Li), sodium (Na), potassium (K), rubidium (Rb), or cesium (Cs), or an alkaline earth metal such as magnesium (Mg), calcium (Ca), strontium (Sr), or barium (Ba), as a host material.

[0070] Furthermore, an electron injection layer may be provided between the electron transport layer and the second electrode 106. The electron injection layer is for increasing electron injection from the cathode and can be composed of an alkali metal or alkaline earth metal in its elemental form, a compound containing them, or a mixture containing them. For example, the electron injection layer can be composed of lithium (Li) or lithium fluoride (LiF), etc.

[0071] Furthermore, a buffer layer may be provided between the electron transport layer and the second electrode 106. The buffer layer is intended to mitigate process damage during film formation of the second electrode 106. The buffer layer may be made of, for example, Mg, magnesium silver alloy (MgAg), Ca, Li, LiF, lithium carbonate (Li ２ CO ３ ), Cs, Cesium carbonate (Cs ２ CO ３ It can be composed of elements of alkali metals or alkaline earth metals, compounds containing them, or mixtures containing them, such as )

[0072] (Second electrode 106) The second electrode 106 is provided on the organic EL layer 104. The second electrode 106 is provided individually for each light-emitting element 150, i.e., separated, similar to the first electrode 102. The second electrode 106 can function as a cathode, for example, and when a voltage is applied between the first electrode 102 and the second electrode 106, electrons are injected from the second electrode 106 into the organic EL layer 104.

[0073] The second electrode 106 is preferably made of a transparent conductive material that has good light transmittance to visible light (for example, visible light with wavelengths of about 360 nm to 780 nm) and a small work function. For example, the second electrode 106 can be formed from a metal film containing at least one of the elements and alloys of metals such as aluminum (Al), magnesium (Mg), calcium (Ca), sodium (Na), and silver (Ag). Specific examples of alloys include aluminum (Al) alloys such as MgAg alloy or AlLi alloy, and silver (Ag) alloys. Furthermore, the second electrode 106 may be made from a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO). The second electrode 106 is composed of a laminated film of a metal layer and a conductive oxide layer. When the second electrode 106 is composed of a laminated film, the metal layer may be provided on the organic EL layer 104 side, or the transparent conductive oxide layer may be provided on the organic EL layer 104 side.

[0074] Furthermore, in this embodiment, the second electrode 106 is electrically connected to the second electrode 106 of an adjacent light-emitting element 150 by wiring 110, which will be described later.

[0075] (Protective films 200, 202, 204) Protective films 200, 202, and 204 are provided to suppress damage to the organic EL layer 104 and the like during the manufacturing process and contamination from the external environment. It is preferable that the protective films 200, 202, and 204 are formed from a material that is light-transmitting to visible light, for example.

[0076] More specifically, the protective film (first protective film) 200 is provided so as to cover the outer circumference of the second electrode 106. In other words, the protective film 200 can be said to have an opening (contact hole) 210 that exposes the central part of the upper surface of the second electrode 106. Furthermore, the wiring 110, which will be described later, extends to cover at least a part of the inner wall of the opening 210, and further extends to cover at least a part of the upper surface of the protective film 200. In addition, the wiring 110 contacts the second electrode 106 exposed from the opening 210, thereby electrically connecting the second electrode 106 to the second electrode 106 of the adjacent light-emitting element 150.

[0077] In this embodiment, the protective film 202 is provided such that it covers the central part of the second electrode 106, covers the inner wall of the opening 210 of the protective film 200 and the upper surface of the protective film 200, and also covers the wiring 110. The protective film 202 has an opening that communicates with the opening 210.

[0078] Furthermore, in this embodiment, the protective film (second protective film) 204 is provided so as to cover the upper surface of the protective film 202 and to fill the opening 210. The upper surface of the protective film 204 is flat, and the planarization film 302, color filter 304, etc., are laminated on it.

[0079] The protective films 200, 202, and 204 are preferably formed from, for example, inorganic and organic materials that have low hygroscopicity and light transmittance to visible light. Furthermore, the protective films 200, 202, and 204 may have a single-layer structure or a multi-layer structure. For example, as an inorganic material, silicon oxide (SiO₂) ｘ ), silicon nitride (SiN ｘ ), silicon oxide nitride (SiO ｘ N ｙ ), titanium oxide (TiO ｘ ) and aluminum oxide (AlO ｘ Examples of organic materials include thermosetting resins and photosensitive resins. Photosensitive resins include, for example, UV-curable resins. Specifically, examples of organic materials include acrylic resins, polyimide resins, novolac resins, epoxy resins, norbornene resins, and parylene resins. Furthermore, protective films 200, 202, and 204 may be ALD (Atomic Layer Deposition) layers to enhance the effect of suppressing moisture penetration.

[0080] (Wiring 110) As described above, the wiring 110 electrically connects the second electrodes 106 of each adjacent light-emitting element 150 to one another. The wiring 110 can be formed from, for example, a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO). Furthermore, the wiring 110 may be composed of, for example, a metal layer, or a metal layer and a transparent conductive oxide layer.

[0081] More specifically, as shown in Figure 4, in this embodiment, the wiring 110 extends to cover at least a portion of the inner wall of the opening 210 of the protective film 200, and further extends to cover at least a portion of the upper surface of the protective film 200. The wiring 110 also contacts the second electrode 106 exposed from the opening 210, thereby connecting the second electrode 106 to the second electrode 106 of the adjacent light-emitting element 150.

[0082] Furthermore, as shown in Figure 4, in this embodiment, the wiring 110 extends between adjacent light-emitting elements 150 and is in contact with the auxiliary wiring 120, which will be described later, between the adjacent light-emitting elements 150.

[0083] (Auxiliary Wiring 120) As explained earlier, in this embodiment, auxiliary wiring 120 is provided between each adjacent light-emitting element 150 so as to be in contact with the wiring 110. In this embodiment, by providing such auxiliary wiring 120 to the wiring 110, it is possible to avoid increasing the resistance of the wiring 110, that is, to reduce the resistance of the wiring 110.

[0084] In detail, the auxiliary wiring 120 is located at the same height as the stacking of the light-emitting elements 150 and includes a conductive layer (first conductive layer) 116 made of the same material as the second electrode 106. Since the conductive layer 116 is made of the same material as the second electrode 106, it can be manufactured simultaneously with the second electrode 106, as will be described later. Therefore, according to this embodiment, it is possible to avoid significantly changing the conventional manufacturing process. In this embodiment, it is sufficient that at least a portion of the conductive layer 116 is located at the same height as the stacking of the light-emitting elements 150.

[0085] Furthermore, in this embodiment, the auxiliary wiring 120 is located at the bottom of the groove formed by the stacking of light-emitting elements 150, and since it raises the bottom of the groove itself, the aspect ratio of the groove can be lowered. Therefore, in this embodiment, when the wiring 110 is deposited in the groove, the material for the wiring 110 can easily penetrate the groove, and the coverage of the wiring 110 at the bottom of the groove can be improved. Therefore, according to this embodiment, the resistance of the wiring 110 itself can also be reduced.

[0086] Furthermore, in this embodiment, it is preferable that the conductive layer 116 is made of the same material as the organic EL layer 104 and is provided on top of the light-emitting material layer 114 located at the same height as the stacking of the light-emitting elements 150. By doing so, the bottom surface of the groove formed by the stacking of the light-emitting elements 150 is raised, thereby lowering the aspect ratio of the groove. Therefore, in this embodiment, when the wiring 110 is formed in the groove, the material of the wiring 110 can easily penetrate the groove, improving the coverage of the wiring 110 at the bottom surface of the groove and further reducing the resistance of the wiring 110 itself. In addition, since the light-emitting material layer 114 is made of the same material as the organic EL layer 104, it can be manufactured simultaneously with the organic EL layer 104, as will be described later. Therefore, according to this embodiment, it is possible to avoid significantly changing the conventional manufacturing process. In this embodiment, it is sufficient that at least a part of the light-emitting material layer 114 is located at the same height as the stacking of the light-emitting elements 150.

[0087] The conductive layer 116, like the second electrode 106, can be formed from a metal film containing at least one elemental or alloyed metal such as aluminum (Al), magnesium (Mg), calcium (Ca), sodium (Na), or silver (Ag). Specific examples of alloys include aluminum (Al) alloys such as MgAg alloy or AlLi alloy, and silver (Ag) alloys. Furthermore, the conductive layer 116, like the second electrode 106, may be formed from a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO).

[0088] The light-emitting material layer 114 can be formed from an organic or inorganic material, similar to the organic EL layer 104.

[0089] Furthermore, in this embodiment, the planarization film 302 is provided so as to cover the upper surface of the protective film 204. The planarization film 302, like the protective films 200, 202, and 204, is formed from, for example, an inorganic material or organic material that has low hygroscopicity and light transmittance to visible light.

[0090] Furthermore, in this embodiment, as shown in Figure 4, a color filter 304 and an on-chip lens 306 are provided on the planarization film 302 for each light-emitting element 150.

[0091] In detail, the color filter 304 can be formed from a color filter that transmits red wavelength components, a color filter that transmits green wavelength components, or a color filter that transmits blue wavelength components. For example, the color filter 304 can be formed from a material with a refractive index of about 1.6 to 1.7, and specifically, it can be formed from a material in which a pigment or dye is dispersed in a transparent binder such as silicone. In this embodiment, the color filter 304 may not be provided.

[0092] Furthermore, the on-chip lens 306 can be formed from a styrene resin, an acrylic resin, a styrene-acrylic copolymer resin, or a siloxane resin, etc.

[0093] Furthermore, in this embodiment, the shape of each light-emitting element 150 when viewed from above the substrate 300 (plan view) is, for example, approximately square (see Figure 5B, etc.). In addition, in this plan view, the auxiliary wiring 120 is provided around at least a portion of the light-emitting element 150, and may be provided so as to surround the light-emitting element 150 (see Figure 5B).

[0094] In this embodiment, the shape of the light-emitting element 150 in plan view is not limited to a rectangular shape such as a square, but may be a polygon (more specifically, a hexagon, etc.), a circle, an ellipse, etc.

[0095] As described above, in this embodiment, by providing auxiliary wiring 120 between adjacent light-emitting elements 150 so as to be in contact with the wiring 110, it is possible to avoid increasing the resistance of the wiring 110, that is, to reduce the resistance of the wiring 110. Furthermore, by forming the auxiliary wiring 120 to include a conductive layer 116 made of the same material as the second electrode 106, the conductive layer 116 can be manufactured simultaneously with the second electrode 106. Moreover, in this embodiment, by providing at least a portion of the conductive layer 116 on a light-emitting material layer 114 made of the same material as the organic EL layer 104 so as to be at the same height as the stacking of the light-emitting elements 150, the light-emitting material layer 114 can be manufactured simultaneously with the organic EL layer 104.Therefore, according to this embodiment, it is possible to avoid significantly changing the conventional manufacturing process.In addition, in this embodiment, the auxiliary wiring 120 is located at the bottom surface of the groove formed by the stacking of light-emitting elements 150, and since it raises the bottom surface of the groove itself, the aspect ratio of the groove can be reduced. Therefore, in this embodiment, when the wiring 110 is deposited in the groove, the material for the wiring 110 can easily penetrate the groove, improving the coverage of the wiring 110 at the bottom of the groove. As a result, according to this embodiment, the resistance of the wiring 110 itself can be reduced.

[0096] <3.2 Manufacturing Method> Next, an example of a manufacturing method for the light-emitting element 150 of this embodiment will be described with reference to Figures 5A to 5E. Figures 5A to 5E are explanatory diagrams for explaining the manufacturing method of the light-emitting element 150 of the display device 10 of this embodiment, with the upper section showing a cross-sectional view of the light-emitting element 150 in each manufacturing process and the lower section showing a plan view of the light-emitting element 150 in each manufacturing process.

[0097] First, a first electrode 102 is formed on the substrate 300. Specifically, for example, an Al film (e.g., with a thickness of 200 nm) can be deposited by sputtering or the like, and then patterned using lithography and dry etching to form the first electrode 102. Next, a SiOx film (e.g., with a thickness of 300 nm) is deposited on the entire surface of the substrate 300 including the first electrode 102 as an insulating material layer constituting the inter-pixel insulating portion 108. Furthermore, the central part of the upper surface of the first electrode 102 is exposed using patterning techniques such as lithography and etching. Next, an organic EL layer 104 is formed by sequentially stacking a hole injection layer, a hole transport layer, a red light emission layer, a light emission separation layer, a blue light emission layer, a green light emission layer, an electron transport layer, an electron injection layer, etc., on the entire surface of the substrate 300 including the first electrode 102 and the inter-pixel insulating portion 108. For example, the organic EL layer 104 can be formed by using a vapor deposition method.

[0098] Then, as the second electrode 106, for example, IZO (for example, with a film thickness of 60 nm) is deposited over the entire surface of the substrate 300 by sputtering. On the second electrode 106, as the protective film 200, for example, a SiN film (for example, with a film thickness of 1 nm μm) is deposited over the entire surface of the substrate 300 by CVD (Chemical Vapor Deposition) or the like. Furthermore, a resist mask 400 is formed on the protective film 200 so as to cover the areas that will become the light-emitting element 150 and the areas that will become the auxiliary wiring 120. In this way, the configuration shown in Figure 5A can be obtained.

[0099] Next, for example, by dry etching, the protective film 200, the second electrode 106, the organic EL layer 104, the interpixel insulating portion 108, and the first electrode 102 are removed along the pattern of the resist mask 400, and then the resist mask 400 is removed. In this way, the light-emitting element 150 and the auxiliary wiring 120 are created as shown in Figure 5B. Note that, as shown in the lower part of Figure 5B, the auxiliary wiring 120 is provided so as to surround the area that will become the light-emitting element 150.

[0100] Thus, in this embodiment, by providing auxiliary wiring 120 between adjacent light-emitting elements 150 so as to be in contact with the wiring 110, the resistance of the wiring 110 can be reduced. Furthermore, in this embodiment, the conductive layer 116 of the auxiliary wiring 120 can be manufactured simultaneously with the second electrode 106, and the light-emitting material layer 114 of the auxiliary wiring 120 can be manufactured simultaneously with the organic EL layer 104. Therefore, according to this embodiment, it is possible to avoid significantly changing the conventional manufacturing process.

[0101] Furthermore, as a protective film 200, for example, a SiN film is deposited over the entire surface of the substrate 300 by CVD or the like. Then, a resist mask 402 is formed on the protective film 202 so as to cover the area that will be the outer periphery of the light-emitting element 150. In this way, the configuration shown in Figure 5C can be obtained.

[0102] Next, for example, by dry etching, the protective film 200 is removed along the pattern of the resist mask 402, exposing the upper surfaces of the second electrode 106 and the conductive layer 116. In this way, the configuration shown in Figure 5D can be obtained.

[0103] Then, an IZO film, which will become the wiring 110, is formed on the front surface of the substrate 300. In this way, the configuration shown in Figure 5E can be obtained. In this embodiment, the conductive layer 116 and the light-emitting material layer 114 of the auxiliary wiring 120 raise the bottom surface of the groove formed by the stacking of light-emitting elements 150, thereby lowering the aspect ratio of the groove. Therefore, in this embodiment, when forming the IZO film, which will become the wiring 110, in the groove, the material for the wiring 110 can easily penetrate into the groove, improving the coverage of the wiring 110 at the bottom surface of the groove. As a result, according to this embodiment, the resistance of the wiring 110 itself can be reduced.

[0104] Furthermore, the light-emitting element 150 of the display device 10 can be manufactured by patterning the IZO film that will become the wiring 110, and by forming protective films 202, 204, a color filter 304, etc.

[0105] In the embodiments of this disclosure, the light-emitting element 150 is not limited to the form shown in Figure 4, but can be transformed into various forms.

[0106] <3.3 Modified Examples> (Modified Example 1) Next, with reference to Figure 6, the detailed configuration of the light-emitting element 150 according to Modified Example 1 of this embodiment will be described. Figure 6 is an explanatory diagram for explaining the manufacturing method of the light-emitting element 150 of Modified Example 1 of this embodiment, and in detail corresponds to the manufacturing stage diagram of Figure 5B which explains the manufacturing method of this embodiment. Here, Modified Example 1 is a modified example of the planar configuration of the auxiliary wiring 120, and in order to make the modified example of the planar configuration of the auxiliary wiring 120 easier to understand, it will be explained with reference to Figure 6, which is a diagram of the display device 10 in the process of being manufactured.

[0107] In this modified example, when viewed from above (plan view) of the substrate 300, the auxiliary wiring 120 is provided so as to extend vertically between adjacent light-emitting elements 150 in Figure 6. In this modified example, the auxiliary wiring 120 may also be provided so as to extend horizontally between adjacent light-emitting elements 150 in the figure.

[0108] In this modified example, by shaping the planar configuration of the auxiliary wiring 120 in this way, the spacing between the light-emitting elements 150 can be narrowed, thereby reducing the display surface area of ​​the display device 10.

[0109] (Modification 2) Next, with reference to Figure 7, the detailed configuration of the light-emitting element 150 according to Modification 2 of this embodiment will be described. Figure 7 is an explanatory diagram for explaining the manufacturing method of the light-emitting element 150 of Modification 2 of this embodiment, and in detail corresponds to the manufacturing stage diagram of Figure 5B which explains the manufacturing method of this embodiment. Here, this Modification 2 is also a modification of the planar configuration of the auxiliary wiring 120, and in order to make the modification of the planar configuration of the auxiliary wiring 120 easier to understand, it will be explained with reference to Figure 7, which is a diagram of the display device 10 in the process of manufacturing.

[0110] In this modified example, by changing the planar shape of the auxiliary wiring 120 in this way, the spacing between the light-emitting elements 150 can be narrowed, thereby reducing the area of ​​the display surface of the display device 10. Furthermore, according to this modified example, by changing the planar shape of the auxiliary wiring 120 in this way, the planar shape and layout of the light-emitting elements 150 on the display surface of the display device 10 can be selected more freely.

[0111] (Modification 3) Next, with reference to Figure 8, the detailed configuration of the light-emitting element 150 according to Modification 3 of this embodiment will be described. Figure 8 is a plan view illustrating an example of the configuration of the light-emitting element 150 according to Modification 3 of this embodiment.

[0112] As described above, the planar shape of the light-emitting element 150 according to this embodiment is not limited to being approximately square, but can be modified in various ways. For example, the light-emitting element 150 can be rectangular, as shown in the upper part of Figure 8. In this case, each light-emitting element 150 may be arranged in a stripe pattern, and their sizes may differ from one another.

[0113] In this modified example, the shape of the light-emitting element 150 may be, for example, a hexagonal polygon, as shown in the middle section of Figure 8. In this case, each light-emitting element 150 may be arranged in a delta array (more specifically, each light-emitting element 150 is located at the position of each vertex of a triangle).

[0114] Furthermore, in this modified example, the shape of the light-emitting element 150 may be, for example, circular or elliptical, as shown in the lower part of Figure 8. In this case, each light-emitting element 150 may be arranged in a square (more specifically, each light-emitting element 150 is located at the position of each vertex of a square).

[0115] <<4. Second Embodiment>> <4.1 Detailed Configuration> Next, with reference to Figure 9, the detailed configuration of the light-emitting element 150 according to the second embodiment of the present disclosure will be described. Figure 9 is a cross-sectional view illustrating an example of the configuration of the light-emitting element 150 according to the present embodiment.

[0116] As shown in Figure 9, in this embodiment, similar to the first embodiment described above, the wiring 110 extends between adjacent light-emitting elements 150 and is in contact with the auxiliary wiring 120a, which will be described later, between adjacent light-emitting elements 150. In this embodiment as well, by providing such auxiliary wiring 120a to the wiring 110, it is possible to avoid increasing the resistance of the wiring 110, that is, to reduce the resistance of the wiring 110.

[0117] Furthermore, in this embodiment, unlike the first embodiment, the auxiliary wiring 120a consists of a laminate of a conductive layer 116, a light-emitting material layer 114, and a conductive layer (second conductive layer) 112. Specifically, the conductive layer 116 is located at the same height as the second electrode 106 of the light-emitting element 150 and is made of the same material as the second electrode 106. The light-emitting material layer 114 is located at the same height as the organic EL layer 104 of the light-emitting element 150 and is made of the same material as the organic EL layer 104. Furthermore, the conductive layer 112 is located at the same height as the first electrode 102 of the light-emitting element 150 and is made of the same material as the first electrode 102. In this embodiment, it is sufficient that at least a portion of the conductive layer 116 is located at the same height as the second electrode 106 of the light-emitting element 150, and that at least a portion of the light-emitting material layer 114 is located at the same height as the organic EL layer 104 of the light-emitting element 150.

[0118] The conductive layer 112, like the first electrode 102, is made of a material containing, for example, chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W), silver (Ag), indium (In), tin (Sn), zinc (Zn), etc.

[0119] In this embodiment, since the components are made of common materials, as will be described later, the conductive layer 116 can be manufactured simultaneously with the second electrode 106, the light-emitting material layer 114 can be manufactured simultaneously with the organic EL layer 104, and the conductive layer 112 can be manufactured simultaneously with the first electrode 102. Therefore, according to this embodiment, auxiliary wiring 120a can be created while avoiding significant changes to the conventional manufacturing process. Furthermore, in this embodiment, the auxiliary wiring 120a is composed of a laminate of the conductive layer 116, the light-emitting material layer 114, and the conductive layer (second conductive layer) 112. As a result, the auxiliary wiring 120a is located at the bottom of the groove formed by the lamination of the light-emitting element 150, and since the bottom of the groove is raised, the aspect ratio of the groove can be made lower. Therefore, in this embodiment, when the wiring 110 is deposited in the groove, the material of the wiring 110 can easily penetrate the groove, improving the coverage of the wiring 110 at the bottom of the groove and further reducing the resistance of the wiring 110.

[0120] In this embodiment, the light-emitting element 150 is not limited to the form shown in Figure 9, but can be transformed into various forms.

[0121] <4.2 Manufacturing Method> Next, an example of a manufacturing method for the light-emitting element 150 of this embodiment will be described with reference to Figures 10A to 10E. Figures 10A to 10E are explanatory diagrams for explaining the manufacturing method of the light-emitting element 150 of the display device 10 of this embodiment, with the upper section showing a cross-sectional view of the light-emitting element 150 in each manufacturing process and the lower section showing a plan view of the light-emitting element 150 in each manufacturing process.

[0122] First, in this embodiment, as in the first embodiment, the first electrode 102 is formed on the substrate 300. Specifically, for example, the first electrode 102 can be formed by depositing an Al film by sputtering or the like, and then patterning it using lithography and dry etching. In this case, the difference from the first embodiment described above is that not only the first electrode 102 but also the conductive layer 112 included in the auxiliary wiring 120a is formed. Furthermore, for example, a SiOx film is deposited on the entire surface of the substrate 300 including the first electrode 102 and the conductive layer 112 as an insulating material layer constituting the inter-pixel insulating portion 108. Furthermore, the central part of the upper surface of the first electrode 102 is exposed using patterning techniques such as lithography and etching. Next, an organic EL layer 104 is laminated on the entire surface of the substrate 300 including the first electrode 102, the inter-pixel insulating portion 108, and the conductive layer 112.

[0123] Then, as the second electrode 106, for example, IZO is deposited over the entire surface of the substrate 300 by sputtering. On the second electrode 106, as the protective film 200, for example, a SiN film is deposited over the entire surface of the substrate 300. Furthermore, a resist mask 400 is formed on the protective film 200 so as to cover the areas that will become the light-emitting element 150 and the areas that will become the auxiliary wiring 120a. In this way, the configuration shown in Figure 10A can be obtained.

[0124] Next, etching is performed along the pattern of the resist mask 400 to remove the protective film 200, the second electrode 106, the organic EL layer 104, the interpixel insulating portion 108, and the first electrode 102, and then the resist mask 400 is removed. In this way, the light-emitting element 150 and the auxiliary wiring 120a are created as shown in Figure 10B. Note that, as shown in the lower part of Figure 10B, the auxiliary wiring 120a is provided so as to surround the area that will become the light-emitting element 150.

[0125] Thus, in this embodiment, by providing auxiliary wiring 120a between adjacent light-emitting elements 150 so as to be in contact with the wiring 110, the resistance of the wiring 110 can be reduced. Furthermore, in this embodiment, the conductive layer 112 of the auxiliary wiring 120a can be manufactured simultaneously with the first electrode 102. Therefore, according to this embodiment, it is possible to avoid significantly changing the conventional manufacturing process.

[0126] Furthermore, a SiN film is formed as a protective film 200 over the entire surface of the substrate 300. Then, a resist mask 402 is formed on the protective film 202 so as to cover the outer periphery of the light-emitting element 150. In this way, the configuration shown in Figure 10C can be obtained.

[0127] Next, for example, by dry etching, the protective film 200 is removed along the pattern of the resist mask 402, exposing the upper surface of the second electrode 106 and the conductive layer 116. In this way, the form shown in Figure 10D can be obtained. Then, for example, an IZO film that will become the wiring 110 is formed on the front surface of the substrate 300. In this way, the form shown in Figure 10E can be obtained. Furthermore, by patterning the IZO film that will become the wiring 110, and forming protective films 202, 204, a color filter 304, etc., the light-emitting element 150 of the display device 10 can be manufactured.

[0128] <<5. Third Embodiment>> <5.1 Detailed Configuration> Next, with reference to Figure 11, the detailed configuration of the light-emitting element 150 according to the third embodiment of the present disclosure will be described. Figure 11 is a cross-sectional view illustrating an example of the configuration of the light-emitting element 150 according to the present embodiment.

[0129] As shown in Figure 11, in this embodiment, similar to the first embodiment described above, the wiring 110 extends between adjacent light-emitting elements 150 and is in contact with the auxiliary wiring 120, which will be described later, between adjacent light-emitting elements 150. In this embodiment as well, by providing such auxiliary wiring 120 to the wiring 110, it is possible to avoid increasing the resistance of the wiring 110, that is, to reduce the resistance of the wiring 110. Furthermore, in this embodiment, similar to the first embodiment, the auxiliary wiring 120 consists of a laminate of a conductive layer 116 and a light-emitting material layer 114.

[0130] Furthermore, in this embodiment, unlike the first embodiment, the length W1 of the auxiliary wiring 120 in the left-right direction in Figure 11 is longer than the length W2 of the portion of the wiring 110 that is in contact with the auxiliary wiring 120 in the left-right direction in Figure 11.

[0131] In this embodiment, by making the left-right length W1 of the auxiliary wiring 120 longer than the left-right length W2 of the portion of the wiring 110 that is in contact with the auxiliary wiring 120, even if the wiring 110 is misaligned during the mass production of the display device 10, the auxiliary wiring 120 and the wiring 110 can be manufactured to ensure reliable contact. This suppresses fluctuations in the contact area due to misalignment, thus avoiding fluctuations in the resistance of the wiring 110.

[0132] In this embodiment, the light-emitting element 150 is not limited to the form shown in Figure 11, but can be transformed into various forms.

[0133] <5.2 Manufacturing Method> Next, an example of a manufacturing method for the light-emitting element 150 of this embodiment will be described with reference to Figure 12. Figure 12 is an explanatory diagram for explaining the manufacturing method for the light-emitting element 150 of this embodiment, with the upper section showing a cross-sectional view of the light-emitting element 150 in each manufacturing process, and the lower section showing a plan view of the light-emitting element 150 in each manufacturing process. Note that Figure 12 is a cross-sectional view and a plan view of a process corresponding to one of the manufacturing processes according to the first embodiment shown in Figure 5C.

[0134] In this embodiment, the manufacturing method according to the first embodiment shown in Figures 5A to 5B is carried out. Furthermore, as a protective film 200, for example, a SiN film is formed over the entire surface of the substrate 300 by CVD or the like. Furthermore, a resist mask 402 is formed on the protective film 202 so as to cover the outer periphery of the light-emitting element 150 and the outer periphery of the auxiliary wiring 120. At this time, the resist mask 402 is embedded in the trench 404 between the protective film 200 covering the light-emitting element 150 and the protective film 200 covering the auxiliary wiring. Furthermore, in this embodiment, as shown in Figure 12, the width of the opening of the resist mask 402 over the auxiliary wiring 120 is made smaller than the length of the auxiliary wiring.

[0135] The subsequent steps are the same as those described in the first embodiment shown in Figures 5D to 5E, so the explanation will be omitted here.

[0136] <<6. Fourth Embodiment>> <6.1 Background> Before describing the details of the fourth embodiment of the present disclosure with reference to Figure 13, the background to the invention of the fourth embodiment will be described. Figure 13 is a cross-sectional view of a light-emitting element 150a for explaining the background of the fourth embodiment of the present disclosure, and more specifically, is a schematic diagram of an example of the configuration of a light-emitting element 150a according to a comparative example.

[0137] As explained earlier, in the comparative example, as shown in Figure 13, each light-emitting element 150a is separated from each other, and the second electrode 106 of each light-emitting element 150a is electrically connected by wiring 110 that extends across each light-emitting element 150a. In the comparative example, the protective film 200 between the light-emitting elements 150a has narrowly spaced trenches, and the film that will become the wiring 110 is formed at a deep position when viewed from the upper surface of the protective film 200, which is the bottom of the trenches. Therefore, in the comparative example, there is a high probability that the wiring 110 will be locally thinned. In other words, because the wiring 110 is formed at the bottom of trenches with a high aspect ratio, the coverage of the wiring 110 deteriorates at the bottom of the trenches (in detail, the area enclosed by the ellipse in Figure 13). And because the wiring 110 is locally thinned, the resistance of the wiring 110 increases. As a result, in the comparative example, there are light-emitting elements 150a with low brightness (shading), and the overall power consumption of the display device 10 increases.

[0138] Therefore, in light of these circumstances, the inventors have created the fourth embodiment described below. The details of the fourth embodiment created by the inventors will be described in order below.

[0139] <6.2 Detailed Configuration> First, a fourth embodiment will be described with reference to Figure 14. Figure 14 is a cross-sectional view illustrating an example of the configuration of the light-emitting element 150 according to this embodiment, and is a cross-sectional view when the light-emitting element 150 of the subpixel 100 is cut in a direction perpendicular to the plane of the substrate 300 (not shown in Figure 14) (the stacking direction of the light-emitting element 150). In Figure 14, the line A-A' is shown, and the details of the planar configuration when the light-emitting element 150 is cut along the line A-A' will be described later as Modification 2.

[0140] In this embodiment, as shown in Figure 14, each light-emitting element 150 is provided on a substrate 300 (not shown in Figure 14) and is separated from adjacent light-emitting elements 150. More specifically, in this embodiment as well, the light-emitting element 150 has a laminate consisting of a first electrode (e.g., anode electrode) 102, an organic EL layer (light-emitting portion) 104 provided on the first electrode 102, and a second electrode (e.g., cathode electrode) 106 provided on the organic EL layer 104. In this embodiment as well, a protective film (first protective film) 200, a protective film 202, and wiring 110 are provided on the second electrode 106. The protective film 200 has an opening 210 that exposes the central part of the upper surface of the second electrode 106, and the wiring 110 extends to cover at least a part of the inner wall of the opening 210, and further extends to cover at least a part of the upper surface of the protective film 200. In addition, the wiring 110 comes into contact with the second electrode 106 exposed through the opening 210. Therefore, the wiring 110 can electrically connect the second electrode 106 to the second electrode 106 of an adjacent light-emitting element 150.

[0141] Furthermore, in this embodiment, as shown in Figure 14, a separation layer 160 is embedded in the protective film 200 located between adjacent light-emitting elements 150 to separate them. The wiring 110 described above extends over the upper surface of the separation layer 160. In this embodiment, unlike the comparative example light-emitting element 150a shown in Figure 13, the wiring 110 extends over the flat upper surface of the separation layer 160 between adjacent light-emitting elements 150. In addition, in this embodiment, the upper surface of the separation layer 160 and the upper surface of the protective film 200 are flush, that is, they are made up of continuous flat surfaces. Therefore, according to this embodiment, since the wiring 110 is formed to extend over such a flat surface, deterioration of the coverage of the wiring 110 can be suppressed. Accordingly, in this embodiment, it is possible to avoid the wiring 110 becoming locally thin and the resistance of the wiring 110 becoming large.

[0142] In this embodiment, the separation layer 160 is, for example, silicon oxide (SiO ｘ ) and silicon nitride (SiN ｘIt is formed from an insulating material such as ) or a light-shielding material such as a metal material. Furthermore, in this embodiment, it is preferable to form the separation layer 160 from a light-shielding material. By using such a material, it is possible to suppress the incidence of light emitted from the organic EL layer 104 onto the adjacent light-emitting element 150, thereby suppressing the occurrence of color mixing and the like.

[0143] Furthermore, in this embodiment, as shown in Figure 14, an auxiliary wiring (second auxiliary wiring) 130 may be provided below the wiring 110 and extending over the upper surface of the separation layer 160. The auxiliary wiring 130 functions integrally with the wiring 110 and electrically connects the second electrode 106 to the second electrode 106 of the adjacent light-emitting element 150. By forming the auxiliary wiring 130 from, for example, a metal material, the wiring resistance between the second electrodes 106 can be further reduced. Furthermore, since the auxiliary wiring 130 can block the light emitted from the organic EL layer 104, it is possible to suppress the incidence of such light on the adjacent light-emitting element 150 and avoid the occurrence of color mixing. More specifically, in this embodiment, as shown in Figure 14, it is preferable that the end face of the auxiliary wiring 130 on the light-emitting element 150 side and the end face of the opening 210 are flush. In this way, the wiring 110 and the auxiliary wiring 130 can be brought into contact and electrically connected near the second electrode 106. In this embodiment, the metal material may be a material containing at least one element such as Cr, Au, Pt, Ni, Cu, Mo, Ti, Ta, Al, Mg, Fe, W, Ag, In, Sn, and Zn. Furthermore, in this embodiment, the auxiliary wiring 130 may be provided on the wiring 110.

[0144] As described above, in this embodiment, by providing the wiring 110 so as to extend on the flat upper surface of the separation layer 160 that separates adjacent light-emitting elements 150, deterioration of the coverage of the wiring 110 can be suppressed. Therefore, in this embodiment, it is possible to avoid the wiring 110 becoming locally thin and its resistance increasing. Furthermore, in this embodiment, by providing auxiliary wiring 130 below the wiring 110, the wiring resistance between the second electrodes 106 can be further reduced. Moreover, in this embodiment, by forming the auxiliary wiring 130 from a metallic material, it is possible to block the light emitted from the organic EL layer 104 and suppress the incidence of such light on adjacent light-emitting elements 150.

[0145] In this embodiment, the light-emitting element 150 is not limited to the form shown in Figure 14, but can take on various forms.

[0146] <6.3 Modification 1> Next, the detailed configuration of the light-emitting element 150 according to Modification 1 of this embodiment will be described with reference to Figures 15 to 22. Figures 15 to 22 are cross-sectional views illustrating an example of the configuration of the light-emitting element 150 according to Modification 1 of this embodiment, and are cross-sectional views when the light-emitting element 150 is cut in a direction perpendicular to the plane of the substrate 300 (not shown in Figures 15 to 22) (the stacking direction of the light-emitting element 150).

[0147] First, in the modified example shown in Figure 15, unlike the embodiment described above, the auxiliary wiring 130 may not be provided. In the modified example shown in Figure 15 as well, by providing the wiring 110 so as to extend onto the flat upper surface of the separation layer 160, it is possible to suppress deterioration of the coverage of the wiring 110.

[0148] Next, in the modified example shown in Figure 16, unlike the embodiment described above, the separation layer 162 is formed from a material with a lower refractive index than the protective film 200. For example, such materials include acrylic resin, silicon oxide, magnesium fluoride (MgF), and calcium fluoride (CaF). ２Examples include resins containing nanoparticles formed from ). By using such materials, the light emitted from the organic EL layer 104 can be refracted and focused on the upper front of the light-emitting element 150. As a result, according to the modified example shown in Figure 16, the light extraction efficiency can be improved and the incidence of the light on adjacent light-emitting elements 150 can be suppressed.

[0149] Furthermore, in the modified example shown in Figure 17, unlike the embodiment described above, the separation layer 164 is formed from a metallic material. By using such a material, the light emitted from the organic EL layer 104 can be reflected by the separation layer 164 and focused on the upper front of the light-emitting element 150. As a result, according to the modified example shown in Figure 17, the light extraction efficiency can be improved, and the incidence of the light on adjacent light-emitting elements 150 can be suppressed. In this modified example, the metallic material can be a material containing at least one element such as Cr, Au, Pt, Ni, Cu, Mo, Ti, Ta, Al, Mg, Fe, W, Ag, In, Sn, and Zn.

[0150] Furthermore, in the modified example shown in Figure 18, unlike the modified example in Figure 17 described above, the auxiliary wiring 130 does not need to be provided.

[0151] Furthermore, in the modified example shown in Figure 19, the separation layer 160 may be a laminate of a separation layer 162 made of a material with a lower refractive index than the protective film 200 and a separation layer 164 made of a metal material. In this modified example, the separation layer 160 may have a structure in which two or more layers are laminated along the lamination direction of the light-emitting element 150, or it may have a structure in which two or more layers are laminated along the planar direction of the substrate 300 (not shown in Figure 19). Furthermore, in this modified example, the order in which the layers are laminated is not limited to the form shown in Figure 19.

[0152] In the modified example shown in Figure 20, unlike the embodiment described above, a protective film (second protective film) 240 is embedded in the opening 210. The protective film 240 is formed from a material with a higher refractive index than the protective film 200. Such a material is titanium oxide (TiO2). ｘ ), zinc oxide (ZnOｘ Examples include resins containing fillers. According to this modified example, by using such a material, the light emitted from the organic EL layer 104 can be focused on the upper front of the light-emitting element 150, thereby improving the light extraction efficiency.

[0153] In the modified example shown in Figure 21, unlike the modified example shown in Figure 17, a protective film (second protective film) 240 is embedded in the opening 210. The protective film 240 is made of a material with a higher refractive index than the protective film 200. Furthermore, in this modified example, by providing an on-chip lens 306 above the light-emitting element 150, light can be efficiently collected in front of the light-emitting element 150. In addition, in this modified example, a color filter 304 may be provided above the light-emitting element 150 to improve color purity.

[0154] In the modified example shown in Figure 22, unlike the embodiment described above, the auxiliary wiring 130 is provided on a light-shielding film 134 extending over the upper surface of the separation layer 160. In this modified example, by further providing such a light-shielding film 134, the effect of blocking light from the auxiliary wiring 130 can be further enhanced. For example, the light-shielding film 134 can be a stack of multiple types of color filters 304 (for example, a black matrix).

[0155] <6.4 Modification 2> Next, the detailed configuration of the light-emitting element 150 according to Modification 2 of this embodiment will be described with reference to Figures 23 to 26. Figures 23 to 26 are plan views illustrating an example of the configuration of the light-emitting element 150 according to Modification 2 of this embodiment, and in detail correspond to the cross-section when the light-emitting element 150 is cut along the line A-A' shown in Figure 14.

[0156] As shown in the upper part of Figure 23, in this modified example 2, the pixel 20 includes, for example, circular light-emitting elements 150r, 150g, and 150b that emit red (R), green (G), and blue (B) light. In this case, each light-emitting element 150r, 150g, and 150b may be arranged in a delta array (more specifically, each light-emitting element 150 is located at the position of each vertex of a triangle). Furthermore, in this modified example 2, as shown in the lower left part of Figure 23, an annular separation layer 160 may be provided so as to surround the second electrode 106 and the opening 210. Alternatively, in this modified example 2, as shown in the lower right part of Figure 23, a hexagonal separation layer 160 may be provided so as to surround the second electrode 106 and the opening 210. In addition, in this modified example, auxiliary wiring 130 is not shown, but may be provided so as to surround each light-emitting element 150.

[0157] Furthermore, as shown on the left side of Figure 24, in this modified example 2, the pixel 20 includes, for example, light-emitting elements 150r, 150g, and 150b that emit stripe-shaped (striped) red (R), green (G), and blue (B) light. In this case, each light-emitting element 150 is arranged parallel to each other (striped arrangement). In this modified example 2, as shown on the right side of Figure 24, a rectangular frame-shaped separation layer 160 may be provided so as to surround the second electrode 106 and the opening 210. Also, in this modified example, although not shown, auxiliary wiring 130 may be provided so as to surround each light-emitting element 150.

[0158] Furthermore, as shown on the left side of Figure 25, in this modified example 2, the pixel 20 includes, for example, rectangular light-emitting elements 150r, 150g, and 150b of different sizes that emit red (R), green (G), and blue (B) light. In this modified example 2, as shown on the right side of Figure 25, a rectangular frame-shaped separation layer 160 may be provided so as to surround the second electrode 106 and the opening 210. Also, in this modified example, although not shown, auxiliary wiring 130 may be provided so as to surround each light-emitting element 150.

[0159] As shown in the upper part of Figure 26, in this modified example 2, the pixel 20 includes, for example, light-emitting elements 150r, 150g, and 150b that emit circular red (R), green (G), and blue (B) light. In this case, each light-emitting element 150 may be arranged in a square (more specifically, each light-emitting element 150 is located at the position of each vertex of a square). Furthermore, in this modified example 2, as shown in the lower left part of Figure 26, an annular separation layer 160 may be provided so as to surround the second electrode 106 and the opening 210. Alternatively, in this modified example 2, as shown in the lower right part of Figure 26, a rectangular frame-shaped separation layer 160 may be provided so as to surround the second electrode 106 and the opening 210. In addition, in this modified example, auxiliary wiring 130 may be provided so as to surround each light-emitting element 150, although this is not shown in the figure.

[0160] <6.5 Manufacturing Method> Next, an example of a manufacturing method for the light-emitting element 150 of this embodiment will be described with reference to Figures 27A and 27B. Figures 27A and 27B are explanatory diagrams for explaining the manufacturing method of the light-emitting element 150 of this embodiment, and show cross-sectional views of the light-emitting element 150 at each manufacturing step. Figure 27B is an enlarged cross-sectional view of the area enclosed by the dashed line in the lower part of Figure 27A.

[0161] First, as shown in the upper part of Figure 27A, a patterned first electrode 102 is deposited on a substrate 300 (not shown), and then an organic EL layer 104, a second electrode 106, and a protective film 200 are formed over the entire surface of the substrate 300. Then, as shown in the second row from the top of Figure 27A, a resist mask 406 is formed on the protective film 200 to cover the area that will become the light-emitting element 150. Subsequently, for example, by dry etching, the protective film 200, the second electrode 106, and the organic EL layer 104 are etched along the pattern of the resist mask 406, and then the resist mask 406 is removed. In this way, a stacked structure of the light-emitting element 150, as shown in the third row from the top of Figure 27A, can be obtained.

[0162] Furthermore, the protective film 200 is further deposited over the entire surface of the substrate 300. Then, by forming trenches 408 between the light-emitting elements 150 of the protective film 200, the configuration shown in the lower part of Figure 27A and the upper left part of Figure 27B can be obtained.

[0163] Next, as shown in the middle left of Figure 27B, the separation layer 160 is embedded in the trench 408. Furthermore, as shown in the lower left of Figure 27B, auxiliary wiring 130 is formed on the upper surfaces of the separation layer 160 and the protective film 200. Subsequently, the auxiliary wiring 130 and the protective film 200 are etched, for example, by a dry etching method, to form an opening 210 that exposes the upper surface of the second electrode 106. In this way, the configuration shown in the upper right of Figure 27B can be obtained.

[0164] Then, as shown in the middle right section of Figure 27B, the wiring 110 is formed as a film over the entire surface of the substrate 300. Furthermore, by forming a protective film 202 or the like on the wiring 110, a light-emitting element 150 as shown in the lower right section of Figure 27B can be manufactured.

[0165] <<7. Fifth Embodiment>> <7.1 Detailed Configuration> Next, a fifth embodiment will be described with reference to Figure 28. Figure 28 is a cross-sectional view illustrating an example of the configuration of the light-emitting element 150 according to this embodiment, and is a cross-sectional view when the light-emitting element 150 of the subpixel 100 is cut in a direction perpendicular to the plane of the substrate 300 (the stacking direction of the light-emitting element 150).

[0166] In this embodiment as well, as shown in Figure 28, each light-emitting element 150 is provided on a substrate 300 and separated from adjacent light-emitting elements 150. More specifically, in this embodiment as well, the light-emitting element 150 has a laminate consisting of a first electrode 102, an organic EL layer 104 provided on the first electrode 102, and a second electrode 106 provided on the organic EL layer 104. In this embodiment as well, a protective film (first protective film) 200 and wiring 110 are provided on the second electrode 106. The protective film 200 has an opening 210 that exposes the central part of the upper surface of the second electrode 106, and the wiring 110 extends to cover at least a part of the inner wall of the opening 210 and further extends to cover at least a part of the upper surface of the protective film 200. In addition, the wiring 110 is in contact with the second electrode 106 exposed from the opening 210. Therefore, the wiring 110 can electrically connect the second electrode 106 to the second electrode 106 of the adjacent light-emitting element 150.

[0167] Furthermore, in this embodiment, as shown in Figure 28, a separation layer 166 is embedded in the trench 410 of the protective film 200 located between adjacent light-emitting elements 150 to separate the adjacent light-emitting elements 150. Also, the wiring 110 described above extends over the upper surface of the separation layer 166. Furthermore, in this embodiment, unlike the fourth embodiment, auxiliary wiring (third auxiliary wiring) 132 is provided so as to extend over the side and bottom surfaces of the separation layer 166. The auxiliary wiring 132 functions in conjunction with the wiring 110 and electrically connects the second electrode 106 to the second electrode 106 of the adjacent light-emitting element 150. Also in this embodiment, by forming the auxiliary wiring 132 from, for example, a metal material, the wiring resistance between the second electrodes 106 can be further reduced. In addition, in this embodiment as well, since the light emitted from the organic EL layer 104 can be blocked, the incidence of such light on adjacent light-emitting elements 150 can be suppressed, and the occurrence of color mixing can be avoided. More specifically, in this embodiment, as shown in Figure 28, it is preferable that the end face of the auxiliary wiring 132 on the light-emitting element 150 side and the end face of the opening 210 are flush. In this way, the wiring 110 and the auxiliary wiring 132 can be brought into contact and electrically connected near the second electrode 106. In this embodiment, the metal material can be a material containing at least one element such as Cr, Au, Pt, Ni, Cu, Mo, Ti, Ta, Al, Mg, Fe, W, Ag, In, Sn, and Zn.

[0168] As described above, in this embodiment, by providing auxiliary wiring 132 extending along the side and bottom surfaces of the separation layer 166, the auxiliary wiring 132 functions integrally with the wiring 110, thereby reducing the wiring resistance between the second electrodes 106. Furthermore, in this embodiment, by forming the auxiliary wiring 132 from a metallic material, it is possible to block the light emitted from the organic EL layer 104 and suppress the incidence of such light on the adjacent light-emitting element 150.

[0169] In this embodiment, the light-emitting element 150 is not limited to the form shown in Figure 28, but can take on various forms.

[0170] <7.2 Modified Examples> Next, the detailed configuration of the light-emitting element 150 according to a modified example of this embodiment will be described with reference to Figures 29 and 30. Figures 29 and 30 are cross-sectional views illustrating an example of the configuration of the light-emitting element 150 according to a modified example of this embodiment, and are cross-sectional views of the light-emitting element 150 when cut in a direction perpendicular to the plane of the substrate 300 (the stacking direction of the light-emitting element 150).

[0171] In the modified example shown in the upper part of Figure 29, unlike the embodiment described above, a protective film (second protective film) 172 is embedded in the opening 210. The protective film 172 is formed from a material with a higher refractive index than the protective film 200. Examples of such materials include titanium oxide, zinc oxide, and resins containing fillers. According to this modified example, by using such a material, the light emitted from the organic EL layer 104 can be focused on the upper front of the light-emitting element 150, thereby improving the light extraction efficiency.

[0172] In the modified example shown in the middle of Figure 29, unlike the embodiment described above, the upper surface of the separation layer 166 and the upper surface of the protective film 200 are not flush; that is, the upper surface of the separation layer 166 and the upper surface of the protective film 200 are not continuous flat surfaces. In this modified example, since the upper surface of the separation layer 166 and the upper surface of the protective film 200 are at different heights, the wiring 110 extends over an uneven surface. Therefore, in this modified example, the contact area between the auxiliary wiring 132 extending along the side surface of the separation layer 166 and the wiring 110 is increased, and the electrical connection between the wiring 110 and the auxiliary wiring 132 can be stabilized.

[0173] In the modified example shown in the lower part of Figure 29, unlike the embodiment described above, the upper surface of the auxiliary wiring 132 is covered with a protective film (third protective film) 202. The protective film 202 is formed from a material with a higher refractive index than the protective film 200. Examples of such materials include titanium oxide, zinc oxide, and resins containing fillers. In this modified example, by using such a material, the light emitted from the organic EL layer 104 can be confined to the center of the light-emitting element 150. Furthermore, in this modified example, the light-emitting element 150 and the wiring 110 can be effectively protected from external contamination.

[0174] In the modified example shown in the upper part of Figure 30, unlike the embodiment described above, a planarization film 302, a color filter 304, and an on-chip lens 306 are provided on the wiring 110. In this modified example, the use of the color filter 304 can further improve color purity. Furthermore, in this modified example, the use of the on-chip lens 306 allows the light emitted from the organic EL layer 104 to be focused on the upper front of the light-emitting element 150, thereby improving the light extraction efficiency.

[0175] In the modified example shown in the middle of Figure 30, unlike the embodiment described above, the auxiliary wiring 132 is provided so as to extend over a part of the upper surface of the substrate 300. That is, in the example shown in the middle of Figure 30, a part of the auxiliary wiring 132 is located at the same height as the first electrode 102. By doing so, in this modified example, the auxiliary wiring 132 can be laid on a flat surface, resulting in a higher quality film and reduced wiring resistance.

[0176] In the modified example shown in the lower part of Figure 30, unlike the embodiment described above, the auxiliary wiring 132 has a multilayer structure composed of multiple auxiliary wirings 132a and 132b with a separation layer 166a in between. By doing so, the wiring resistance of the auxiliary wiring 132 can be reduced in this modified example.

[0177] <7.3 Manufacturing Method> Next, an example of a manufacturing method for the light-emitting element 150 of this embodiment will be described with reference to Figures 31A and 31B. Figures 31A and 31B are explanatory diagrams for illustrating the manufacturing method for the light-emitting element 150 of this embodiment, and show cross-sectional views of the light-emitting element 150 at each manufacturing step.

[0178] First, as shown in the upper left of Figure 31A, a patterned first electrode 102 is deposited on the substrate 300, and then an organic EL layer 104, a second electrode 106, and a protective film 200 are formed over the entire surface of the substrate 300. Then, as shown in the second row from the top on the left side of Figure 31A, the protective film 200, the second electrode 106, and the organic EL layer 104 are processed, for example, by a dry etching method, to obtain a stacked structure of the light-emitting element 150. Furthermore, by depositing the protective film 200 over the entire surface of the substrate 300, the configuration shown in the lower left of Figure 31A can be obtained.

[0179] Next, as shown in the upper right section of Figure 31A, auxiliary wiring 132 is formed on the protective film 200. Furthermore, as shown in the lower right section of Figure 31A, a separation layer 166 is formed on the auxiliary wiring 132.

[0180] Next, the upper surface of the separation layer 166 is flattened, for example, by CMP (Chemical Mechanical Polishing), to obtain the form shown in the upper left of Figure 31B. Then, as shown in the lower left of Figure 31B, a resist mask 412 is formed that has an opening that exposes the center of the light-emitting element 150.

[0181] Then, as shown in the upper right section of Figure 31B, an opening 210 is formed to expose the upper surface of the second electrode 106 using etching or the like. Then, as shown in the lower right section of Figure 31B, the wiring 110 is deposited on the entire surface of the substrate 300, and a protective film 202 or the like is formed on the wiring 110, thereby manufacturing the light-emitting element 150.

[0182] <<8. Sixth Embodiment>> <8.1 Background> Next, before describing the details of the sixth embodiment of the present disclosure with reference to Figure 32, we will explain the background that led the inventors to create the sixth embodiment. Figure 32 is a cross-sectional view illustrating the background of the sixth embodiment of the present disclosure.

[0183] As explained earlier, in the comparative example 150a shown in Figure 13, each light-emitting element 150a is separated, so as shown in Figure 32, stacks of light-emitting elements 150r, 150b, and 150g are sequentially fabricated. Furthermore, in the comparative example, a contact hole (opening 210) for connecting the wiring 110 to the second electrode 106 is formed in the protective film 200 on the second electrode 106, and the wiring 110 is formed around the contact hole and on the inner wall. In the comparative example, in order to obtain such a structure, the wiring 110 is formed in a narrow area between the stacks of adjacent light-emitting elements 150a. In the example shown in Figure 32, a deep recess with a vertical wall made of the protective film 200 is located between the second light-emitting element 150b and the third light-emitting element 150g. Furthermore, when attempting to fabricate wiring 110 in such a narrow and deep recess, it is difficult to uniformly deposit the film on the wall surface, and as shown in the enlarged view of the lower right of Figure 32, there is a high probability that the wiring 110 will become locally thin (areas enclosed by dashed lines). When the wiring 110 becomes locally thin, the wiring resistance of the wiring 110 increases. As a result, there may be light-emitting elements 150a with reduced brightness (shading), or the overall power consumption of the display device 10 may increase.

[0184] Therefore, in light of these circumstances, the inventors have created the sixth embodiment described below. The details of the sixth embodiment created by the inventors will be described in order below.

[0185] <8.2 Detailed Configuration 1> (Configuration) Next, the detailed configuration of the light-emitting element 150 according to Configuration 1 of the sixth embodiment of the present disclosure will be described with reference to Figures 33A and 33B. Figure 33A is a plan view illustrating an example of Configuration 1 of the light-emitting element 150 according to this embodiment, and in detail, is a cross-sectional view when the light-emitting element 150 is cut in a direction parallel to the plane of the substrate 300. Figure 33B is a cross-sectional view illustrating an example of Configuration 1 of the light-emitting element 150 according to this embodiment, and corresponds to the cross-section when the light-emitting element 150 is cut along the line B-B' shown in Figure 33A.

[0186] In configuration 1 of this embodiment, as shown in Figure 33A, for example, a hexagonal light-emitting element (third light-emitting element) 150r, a light-emitting element (first light-emitting element) 150b, and a light-emitting element (second light-emitting element) 150g are provided on a substrate 300. These light-emitting elements 150r, 150b, and 150g are separated from each other. Furthermore, the light-emitting element 150g has an auxiliary wiring 136 between it and adjacent light-emitting elements 150b and 150r. In configuration 1 of this embodiment, the auxiliary wiring (fourth auxiliary wiring) 136 is electrically connected to the wiring 110 and functions together with the wiring 110, thereby reducing the wiring resistance between the second electrodes 106.

[0187] In detail, in configuration 1, as shown in Figure 33B, the light-emitting element 150r, light-emitting element 150b, and light-emitting element 150g have a laminated structure consisting of a first electrode 102, an organic EL layer 104 (specifically, organic EL layers 104r, 104b, and 104g) provided on the first electrode 102, a second electrode 106 provided on the organic EL layer 104, and a protective film (first protective film) 220 provided on the second electrode 106. Furthermore, in configuration 1, the sides of the laminated structure of the light-emitting element 150r are covered with protective films (sidewall films) 222, 224, and 226. Also, the sides of the laminated structure of the light-emitting element 150b are covered with protective films (sidewall films) 224, protective film 226, and organic EL layer 104g. Furthermore, the sides of the laminated structure of the light-emitting element 150g are covered with protective films 222, 224, and organic EL layer 104g. In this embodiment, the protective films 220, 222, 224, and 226 are, for example, silicon oxide (SiO₂). ｘ ), silicon nitride (SiNｘ ), silicon oxide nitride (SiO ｘ N ｙ ), titanium oxide (TiO ｘ ) and aluminum oxide (AlO ｘ They can be formed from inorganic materials such as ) or organic materials such as thermosetting resins and photosensitive resins.

[0188] Furthermore, in configuration 1, the protective film 220 has an opening that exposes the central part of the upper surface of the second electrode 106, and the wiring 110 extends to cover at least a portion of the inner wall of the opening, and further extends to cover at least a portion of the upper surface of the protective film 220. In addition, the wiring 110 can electrically connect the second electrode 106 to the second electrode 106 of an adjacent light-emitting element 150 by contacting the second electrode 106 exposed from the opening 210.

[0189] In addition, in configuration 1, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g is located above the upper surfaces of the protective films 220 and 226 of the laminated structure of the light-emitting elements 150b and 150g. More specifically, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g extends over the upper surfaces of the protective films 220 and 226. Furthermore, the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r is located above the upper surfaces of the protective films 220 and 226 of the laminated structure of the light-emitting elements 150g and 150r. More specifically, the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r extends over the upper surfaces of the protective films 220 and 226. In other words, in configuration 1, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g, and the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r, do not extend into narrow and deep recesses as in the comparative example. Specifically, since the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g, and the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r are provided on the upper surfaces of the protective films 220 and 226, it is possible to avoid the wiring 110 becoming locally thin. As a result, in configuration 1, it is possible to avoid the wiring 110 becoming locally thin and the wiring resistance of the wiring 110 becoming large.

[0190] Furthermore, an auxiliary wiring (fourth auxiliary wiring) 136 extends from the second electrode 106 of the light-emitting element 150g so as to ride on the protective films 222, 224, and 226 on the sides of the laminated structure of the light-emitting elements 150b and 150r. The auxiliary wiring 136 is not only electrically connected to the second electrode 106 of the light-emitting element 150g, but is also electrically connected to the wiring 110 in the region between the light-emitting elements 150b and 150g, and in the region between the light-emitting elements 150g and 150r. Therefore, in configuration 1, the auxiliary wiring 136 functions in conjunction with the wiring 110, making it possible to further reduce the wiring resistance between the second electrodes 106.

[0191] Furthermore, in configuration 1, as shown in Figure 33B, the organic EL layer 104g of the light-emitting element 150g is extended so as to overlap the protective films 222, 224, and 226 on the sides of the light-emitting elements 150b and 150r. In addition, in configuration 1, a planarization film 230 and an on-chip lens 306 are provided on the light-emitting elements 150r, 150b, and 150g.

[0192] As described above, in configuration 1 of this embodiment, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g, and the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r, are located above the upper surfaces of the protective films 220 and 226. Therefore, in configuration 1 of this embodiment, it is possible to avoid the wiring 110 becoming locally thin in the region between the light-emitting element 150b and the light-emitting element 150g, and in the region between the light-emitting element 150g and the light-emitting element 150r. As a result, in configuration 1, it is possible to avoid the wiring 110 becoming locally thin and the wiring resistance of the wiring 110 becoming large.

[0193] Furthermore, in configuration 1 of this embodiment, auxiliary wiring 136 is provided so as to rest on the protective films 222, 224, and 226 on the sides of the stacked structure of the light-emitting elements 150b and 150r, and by connecting the auxiliary wiring 136 to the wiring 110, the wiring resistance between the second electrodes 106 can be further reduced.

[0194] In this embodiment, the light-emitting element 150 is not limited to the form shown in Figures 33A and 33B, but can take on various forms. For example, the color of light corresponding to each light-emitting element 150 is not limited to the example described above.

[0195] (Manufacturing Method) Next, an example of a manufacturing method for the component 1 of the light-emitting element 150 of this embodiment will be described with reference to Figures 34A to 34D. Figures 34A to 34D are explanatory diagrams for explaining the manufacturing method for the component 1 of the light-emitting element 150 of this embodiment, and show cross-sectional views of the light-emitting element 150 in each manufacturing process.

[0196] First, in configuration 1, a first electrode 102 is formed on the substrate 300, and then, for example, an organic EL layer 104r that emits red light is laminated over the entire surface of the substrate 300 including the first electrode 102, using a vapor deposition method. Then, the second electrode 106 and protective film 220 of the light-emitting element 150r are laminated. Then, the above lamination is processed using photolithography or etching. Furthermore, a protective film 222 is formed over the entire surface of the substrate 300. In this way, the form shown in the upper part of Figure 34A can be obtained. Next, as shown in the second part from the top of Figure 34A, for example, the protective film 222 is removed from other parts of the laminated structure of the light-emitting element 150r, leaving the protective film 222 on the sides.

[0197] Next, an organic EL layer 104b that emits blue light, a second electrode 106, and a protective film 220 are sequentially laminated over the entire surface of the substrate 300, which includes the laminated structure of the light-emitting element 150r. Then, as shown in the third row from the top in Figure 34A, a resist mask 416 is formed to cover the area on the protective film 222 that will become the light-emitting element 150b. Subsequently, as shown in the bottom row of Figure 34A, the protective film 220, the second electrode 106, and the organic EL layer 104b are processed together along the pattern of the resist mask 416, and then the resist mask 416 is removed.

[0198] Next, as shown in the upper part of Figure 34B, a protective film 224 is further laminated over the entire surface of the substrate 300, which includes the laminated structure of the light-emitting elements 150r and 150b and the first electrode 102. Then, as shown in the second part from the top of Figure 34B, the protective film 224 is removed from the other areas, leaving the protective film 224 on the sides of the laminated structure of the light-emitting elements 150r and 150b.

[0199] Next, using the same procedure as before, an organic EL layer 104g that emits green light, a second electrode 106, and a protective film 220 are sequentially laminated over the entire surface of the substrate 300, which includes the stacked structure of light-emitting elements 150r and 150b and the first electrode 102. Furthermore, a resist mask 418 is formed to cover the areas on the protective film 220 that will become the light-emitting elements 150g. In this way, the configuration shown in the third row from the top of Figure 34B can be obtained.

[0200] Next, the protective film 220, the second electrode 106, and the organic EL layer 104g are processed together along the resist mask 418, and then the resist mask 418 is removed. In this way, the form shown in the lower part of Figure 34B can be obtained. In configuration 1, auxiliary wiring 136 is formed by leaving a portion extending from the outer circumference of the second electrode 106 of the light-emitting element 150g.

[0201] Next, a protective film 226 is further laminated over the entire surface of the substrate 300, which includes the laminated structure of light-emitting elements 150r, 150b, and 150g. In this way, the configuration shown in the upper part of Figure 34C can be obtained. Furthermore, as shown in the second part from the top of Figure 34C, a resist mask 420 is formed on the protective film 226. Next, as shown in the third part from the top of Figure 34C, the upper surface of the resist mask 420 is flattened so that it remains only between the light-emitting elements 150. Then, as shown in the lower part of Figure 34C, a resist mask 422 is formed with openings that expose the central upper surfaces of the light-emitting elements 150r, 150b, and 150g.

[0202] Next, as shown in the upper part of Figure 34D, a portion of the protective films 226 and 220 is removed along the pattern of the resist mask 422 to form an opening 210 that exposes the central part of the upper surface of the first electrode 102. Then, a transparent conductive film, for example, which will become the wiring 110, is deposited on the protective films 226 and 220 by sputtering or the like. In this way, the form shown in the middle part of Figure 34D can be obtained. Furthermore, by patterning the wiring 110 or depositing a protective film 228, the form shown in the lower part of Figure 34D can be obtained.

[0203] <8.3 Detailed Configuration 2> (Configuration) Next, the detailed configuration of the light-emitting element 150 according to configuration 2 of this embodiment will be described with reference to Figure 35. Figure 35 is a cross-sectional view for illustrating an example of configuration 2 of the light-emitting element 150 according to this embodiment, and corresponds to the cross-section when the light-emitting element 150 is cut along the line B-B' shown in Figure 33A. In configuration 2 of this embodiment, the light-emitting element 150 has a planar configuration similar to the planar configuration of configuration 1 described with reference to Figure 33A.

[0204] In configuration 2, as shown in Figure 35, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g is located above the upper surfaces of the protective films 220 and 226 of the laminated structure of the light-emitting elements 150b and 150g. Furthermore, the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r is located above the upper surfaces of the protective films 220 and 226 of the laminated structure of the light-emitting elements 150g and 150r. In other words, in configuration 2 as well, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g, and the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r, do not extend into narrow and deep recesses as in the comparative example. Specifically, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g, and the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r, are provided on the upper surfaces of the protective films 220 and 226, thus preventing the wiring 110 from becoming locally thin. As a result, in configuration 2, it is possible to avoid the wiring 110 becoming locally thin and the wiring resistance of the wiring 110 becoming large.

[0205] Furthermore, in configuration 2, an auxiliary wiring (fourth auxiliary wiring) 136 extends from the second electrode 106 of the light-emitting element 150g so as to ride on the protective films 222, 224, and 226 on the sides of the laminated structure of the light-emitting elements 150b and 150r. However, unlike configuration 1, in configuration 2, the auxiliary wiring 136 is not electrically connected to the wiring 110.

[0206] Furthermore, in configuration 2, as shown in Figure 35, the organic EL layer 104g of the light-emitting element 150g is extended so as to overlap the protective films 222, 224, and 226 on the sides of the light-emitting elements 150b and 150r.

[0207] As described above, in configuration 2 of this embodiment, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g, and the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r, are located above the upper surfaces of the protective films 220 and 226. Therefore, in configuration 2 of this embodiment, it is possible to avoid the wiring 110 becoming locally thin in the region between the light-emitting element 150b and the light-emitting element 150g, and in the region between the light-emitting element 150g and the light-emitting element 150r. As a result, in configuration 2, it is possible to avoid the wiring 110 becoming locally thin and the wiring resistance of the wiring 110 becoming large.

[0208] In this embodiment, the light-emitting element 150 is not limited to the form shown in Figure 35, but can take on various forms. For example, the color of light corresponding to each light-emitting element 150 is not limited to the example described above.

[0209] (Manufacturing Method) Next, with reference to Figure 36, an example of a manufacturing method for the component 2 of the light-emitting element 150 of this embodiment will be described. Figure 36 is an explanatory diagram for explaining the manufacturing method for the component 2 of the light-emitting element 150 of this embodiment, and shows a cross-sectional view of the light-emitting element 150 in each manufacturing process.

[0210] First, in configuration 2, the same manufacturing process as in configuration 1, as described with reference to the upper parts of Figures 34A, 34B, and 34C, is carried out. By doing so, the form shown in the upper part of Figure 36 can be obtained.

[0211] Then, a portion of the protective films 226 and 220 is removed to form an opening 210 that exposes the central part of the upper surface of the first electrode 102. Next, a transparent conductive film, for example, which will become the wiring 110, is formed on the protective films 226 and 220. Furthermore, by patterning the wiring 110 or forming a protective film 228, the configuration shown in the lower part of Figure 36 can be obtained.

[0212] As described above, in the manufacturing method of configuration 2, some steps of the manufacturing method of configuration 1 can be omitted, thereby suppressing an increase in manufacturing time.

[0213] <8.4 Detailed Configuration 3> (Configuration) Next, the detailed configuration of the light-emitting element 150 according to configuration 3 of this embodiment will be described with reference to Figures 37A and 37B. Figure 37A is a plan view illustrating an example of configuration 3 of the light-emitting element 150 according to this embodiment, and in detail, it is a cross-sectional view when the light-emitting element 150 is cut in a direction parallel to the plane of the substrate 300. Figure 37B is a cross-sectional view illustrating an example of configuration 3 of the light-emitting element 150 according to this embodiment, and corresponds to the cross-section when the light-emitting element 150 is cut along the line B-B' shown in Figure 37A.

[0214] In configuration 3 of this embodiment, as shown in Figure 37A, for example, hexagonal light-emitting elements 150r, 150b, and 150g are provided on the substrate 300. These light-emitting elements 150r, 150b, and 150g are separated from each other. Furthermore, the light-emitting element 150g has an auxiliary wiring 136 between it and adjacent light-emitting elements 150b and 150r. In addition, in configuration 3, the light-emitting element 150b has an auxiliary wiring 136 between it and adjacent light-emitting elements 150r. In configuration 3 of this embodiment, the auxiliary wiring 136 is electrically connected to the wiring 110, thereby reducing the wiring resistance between the second electrodes 106.

[0215] Furthermore, in configuration 3, as shown in Figure 37B, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g is located above the upper surfaces of the protective films 220 and 226 of the laminated structure of the light-emitting elements 150b and 150g. More specifically, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g extends over the upper surfaces of the protective films 220 and 226. In addition, the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r is located above the upper surfaces of the protective films 220 and 226 of the laminated structure of the light-emitting elements 150g and 150r. More specifically, the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r extends over the upper surfaces of the protective films 220 and 226. In addition, in configuration 3, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150r is located above the upper surfaces of the protective films 220 and 226 of the laminated structure of the light-emitting elements 150b and 150r. More specifically, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150r extends over the upper surfaces of the protective films 220 and 226. That is, in configuration 3, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g, the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r, and the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150r do not extend within narrow and deep recesses as in the comparative example. Specifically, since the wiring 110 located in the above regions is provided on the upper surfaces of the protective films 220 and 226, it is possible to avoid the wiring 110 becoming locally thin. As a result, in configuration 3, it is possible to avoid the wiring 110 becoming locally thinner and the wiring resistance of the wiring 110 becoming large.

[0216] Furthermore, in configuration 3, the auxiliary wiring 136 extends from the second electrode 106 of the light-emitting element 150g so as to ride on the protective films 222, 224, and 226 on the side surface of the laminated structure of the light-emitting elements 150b and 150r. In addition, in configuration 3, the auxiliary wiring 136a extends from the second electrode 106 of the light-emitting element 150b so as to ride on the protective film 222 on the side surface of the laminated structure of the light-emitting element 150r. The auxiliary wiring 136a is not only electrically connected to the second electrode 106 of the light-emitting element 150b, but is also electrically connected to the wiring 110 in the region between the light-emitting elements 150b and 150r. Therefore, in configuration 3, the auxiliary wiring 136a functions in conjunction with the wiring 110, making it possible to further reduce the wiring resistance between the second electrodes 106.

[0217] Furthermore, in configuration 3, as shown in Figure 37B, the organic EL layer 104b of the light-emitting element 150b is extended so as to ride on the protective film 222 on the side surface of the light-emitting element 150r.

[0218] As described above, in configuration 3 of this embodiment, the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150g, the wiring 110 located in the region between the light-emitting element 150g and the light-emitting element 150r, and the wiring 110 located in the region between the light-emitting element 150b and the light-emitting element 150r are located above the upper surfaces of the protective films 220 and 226. Therefore, in configuration 3 of this embodiment, it is possible to avoid the wiring 110 becoming locally thin in the region between the light-emitting element 150b and the light-emitting element 150g, the region between the light-emitting element 150g and the light-emitting element 150r, and the region between the light-emitting element 150g and the light-emitting element 150r. As a result, in configuration 3, it is possible to avoid the wiring 110 becoming locally thin and the wiring resistance of the wiring 110 becoming large.

[0219] Furthermore, in configuration 3 of this embodiment, auxiliary wiring 136, 136a is provided, and the auxiliary wiring 136, 136a is connected to the wiring 110, thereby further reducing the wiring resistance between the second electrodes 106.

[0220] In this embodiment, the light-emitting element 150 is not limited to the form shown in Figures 37A and 37B, but can take on various forms. For example, the color of light corresponding to each light-emitting element 150 is not limited to the example described above.

[0221] (Manufacturing Method) Next, an example of a manufacturing method for component 3 of the light-emitting element 150 of this embodiment will be described with reference to Figures 38A to 38D. Figures 38A to 38D are explanatory diagrams for explaining the manufacturing method for component 3 of the light-emitting element 150 of this embodiment, and show cross-sectional views of the light-emitting element 150 in each manufacturing process.

[0222] First, in configuration 3, the manufacturing method is carried out in the same way as in configuration 1, which was described with reference to Figure 34A. Then, a resist mask 424 is formed so as to cover the area on the protective film 220 that will become the light-emitting element 150b. By doing so, the form shown in the upper part of Figure 38A can be obtained.

[0223] Next, the protective film 220, the second electrode 106, and the organic EL layer 104b are processed together along the resist mask 424. In this way, the configuration shown in the middle of Figure 38A can be obtained. In configuration 3, the second electrode 106 becomes the second electrode 106 and auxiliary wiring 136 in a subsequent process. Then, the protective film 224 is further laminated over the entire surface of the substrate 300, which includes the laminated structure of the light-emitting elements 150r and 150b. In this way, the configuration shown in the lower part of Figure 38A can be obtained.

[0224] Then, as shown in the upper part of Figure 38B, the protective film 224 is removed from other areas, leaving the protective film 224 on the sides of the stacked structure of the light-emitting elements 150r and 150b, and on the sides of the protective film 220. Furthermore, the organic EL layer 104g that emits green light, the second electrode 106, and the protective film 220 are sequentially stacked on the entire surface of the substrate 300. Next, a resist mask 426 is formed to cover the areas on the protective film 220 that will become the light-emitting elements 150g. In this way, the configuration shown in the middle part of Figure 38B can be obtained.

[0225] Next, the protective film 220, the second electrode 106, and the organic EL layer 104g are processed together along the resist mask 426, and then the resist mask 426 is removed. In this way, the form shown in the lower part of Figure 38B can be obtained. A portion of the processed second electrode 106 becomes the auxiliary wiring 136.

[0226] Next, a protective film 226 is further laminated over the entire surface of the substrate 300. In this way, the configuration shown in the upper part of Figure 38C can be obtained. Furthermore, as shown in the middle part of Figure 38C, a resist mask 428 is formed on the protective film 226. Then, as shown in the lower part of Figure 38C, the upper surface of the resist mask 428 is flattened so that it remains only between the light-emitting elements 150.

[0227] Furthermore, as shown in the upper part of Figure 38D, a resist mask 430 is formed with an opening that exposes the central upper surface of the light-emitting elements 150r, 150b, and 150g. Subsequently, as shown in the middle part of Figure 38D, a portion of the protective film 220, etc., is removed along the pattern of the resist mask 430 to form an opening 210 that exposes the central upper surface of the first electrode 102. Then, a transparent conductive film, for example, which will become the wiring 110, is formed. Furthermore, by patterning the wiring 110 or forming a protective film 228, the configuration shown in the lower part of Figure 38D can be obtained.

[0228] <<9. Summary>> As described above, in the embodiments of this disclosure, it is possible to suppress the increase in the wiring resistance of the wiring 110.

[0229] More specifically, in the embodiments of this disclosure, auxiliary wiring 120 is provided between adjacent light-emitting elements 150 so as to be in contact with the wiring 110, thereby avoiding an increase in the resistance of the wiring 110, that is, reducing the resistance of the wiring 110.

[0230] Furthermore, in this embodiment, by forming the auxiliary wiring 120 to include a conductive layer 116 made of the same material as the second electrode 106, the conductive layer 116 can be manufactured simultaneously with the second electrode 106. Moreover, in this embodiment, by providing at least a portion of the conductive layer 116 on top of a light-emitting material layer 114 made of the same material as the organic EL layer 104, at the same height as the stacking of the light-emitting element 150, the light-emitting material layer 114 can be manufactured simultaneously with the organic EL layer 104.Therefore, according to this embodiment, it is possible to avoid significantly changing the conventional manufacturing process.

[0231] Furthermore, in this embodiment, the auxiliary wiring 120 is located at the bottom of the groove formed by the stacking of light-emitting elements 150, and since it raises the bottom of the groove itself, the aspect ratio of the groove can be lowered. Therefore, in this embodiment, when the wiring 110 is deposited in the groove, the material for the wiring 110 can easily penetrate the groove, and the coverage of the wiring 110 at the bottom of the groove can be improved. As a result, according to this embodiment, the resistance of the wiring 110 itself can also be reduced.

[0232] Furthermore, in the embodiments of this disclosure, the coverage of the wiring 110 can be improved by forming the wiring 110 between adjacent light-emitting elements 150 on a flat surface or above the upper surface of the protective film of the laminated structure of the light-emitting elements 150. As a result, according to these embodiments, the resistance of the wiring 110 can also be reduced.

[0233] Furthermore, the embodiments of this disclosure are not limited to those shown in the figures, and can be modified in various ways and combined with each other.

[0234] Furthermore, the display device 10 according to the embodiment of this disclosure can be applied to, for example, display devices for VR (Virtual Reality), MR (Mixed Reality), or AR (Augmented Reality), display devices for smartphones, television equipment, electronic viewfinders (EVF), or small projectors. The display device 10 can also be applied to various lighting devices.

[0235] Furthermore, as previously described, the display device 10 according to the embodiment of this disclosure can be manufactured using methods, apparatus, and conditions commonly used in the manufacture of semiconductor devices. In other words, the display device 10 according to this embodiment can be manufactured using existing semiconductor device manufacturing methods.

[0236] Examples of the methods mentioned above include PVD (Physical Vapor Deposition), CVD, and ALD (Atomic Layer Deposition). PVD methods include vacuum deposition, EB (electron beam) deposition, various sputtering methods (magnetron sputtering, RF (Radio Frequency)-DC (Direct Current) coupled bias sputtering, ECR (Electron Cyclotron Resonance) sputtering, opposing target sputtering, high-frequency sputtering, etc.), ion plating, laser ablation, molecular beam epitaxy (MBE (Molecular Beam Epitaxy)), and laser transfer. Furthermore, CVD methods include plasma CVD, thermal CVD, metal-organic (MO) CVD, and photo-CVD. Other methods include electrolytic plating, electroless plating, spin coating, immersion, casting, microcontact printing, drop casting, various printing methods such as screen printing, inkjet printing, offset printing, gravure printing, and flexographic printing, as well as stamping, spraying, air doctor coater, blade coater, rod coater, knife coater, squeeze coater, reverse roll coater, transfer roll coater, gravure coater, kiss coater, cast coater, spray coater, slit orifice coater, and calender coater. Patterning methods include chemical etching such as shadow masks, laser transfer, and photolithography, as well as physical etching using ultraviolet light or lasers. In addition, planarization techniques include CMP (Chemical Mechanical Polishing), laser planarization, and reflow.

[0237] <<10. Modifications>> <10.1 Modification 1> Next, as a modification of the embodiment of the present disclosure, a modification concerning the relationship between the normal LN passing through the center of a subpixel 100 (more specifically, the center of a plurality of light-emitting elements 150 included in one subpixel 100), the normal LN' passing through the center of a lens member (more specifically, an on-chip lens 306), and the normal LN" passing through the center of a wavelength selection unit (more specifically, a color filter 304) will be described with reference to Figures 39A to 39G. Figures 39A to 39G are conceptual diagrams for explaining the relationship between the normal LN passing through the center of the light-emitting unit, the normal LN' passing through the center of the lens member, and the normal LN" passing through the center of the wavelength selection unit. In the following description, the center of the subpixel 100 will be referred to as the center of the light-emitting unit.

[0238] In embodiments of this disclosure, the size of the wavelength selection section (e.g., color filter 304) may be appropriately changed in response to the light emitted by the subpixel 100. Furthermore, if a light absorption layer (black matrix layer) is provided between the wavelength selection section (e.g., color filter 304) of an adjacent subpixel 100, the size of the light absorption layer (black matrix layer) may be appropriately changed in response to the light emitted by the subpixel 100. In addition, the size of the wavelength selection section (e.g., color filter 304) may be adjusted based on the distance (offset amount) d between the normal vector passing through the center of the subpixel 100 and the normal vector passing through the center of the color filter 304. ０ Depending on the circumstances, these may be changed as appropriate. The planar shape of the wavelength selection section (e.g., color filter 304) may be the same as, similar to, or different from the planar shape of the lens component (e.g., on-chip lens 306).

[0239] For example, as shown in Figure 39A, the normal vector LN passing through the center of the light-emitting part, the normal vector LN'' passing through the center of the wavelength selection part, and the normal vector LN' passing through the center of the lens member may be made to coincide. In other words, the distance (offset amount) D between the normal vector passing through the center of the light-emitting part and the normal vector passing through the center of the lens member. ０ The distance (offset amount) d between the normal vector passing through the center of the light-emitting part and the normal vector passing through the center of the wavelength-selecting part. ０ This is equivalent to 0 (zero).

[0240] Furthermore, for example, as shown in Figure 39B, the normal vector LN passing through the center of the light-emitting part and the normal vector LN'' passing through the center of the wavelength-selecting part coincide, but the normal vector LN passing through the center of the light-emitting part and the normal vector LN'' passing through the center of the wavelength-selecting part do not have to coincide with the normal vector LN' passing through the center of the lens member. In other words, D ０ ≠d ０ It may also be equal to 0.

[0241] Furthermore, for example, as shown in Figure 39C, the normal vector LN passing through the center of the light-emitting part, the normal vector LN'' passing through the center of the wavelength-selecting part, and the normal vector LN' passing through the center of the lens member do not coincide, but the normal vector LN'' passing through the center of the wavelength-selecting part and the normal vector LN' passing through the center of the lens member may coincide. In other words, D ０ = d ０ It can also be 0.

[0242] Furthermore, as shown in Figure 39D, for example, the normal vector LN passing through the center of the light-emitting part, the normal vector LN'' passing through the center of the wavelength-selecting part, and the normal vector LN' passing through the center of the lens member do not coincide, and the normal vector LN' passing through the center of the lens member does not coincide with the normal vector LN passing through the center of the surface of the light-emitting part and the normal vector LN'' passing through the center of the wavelength-selecting part. Here, it is preferable that the center of the wavelength-selecting part (shown as a black circle in Figure 39D) is located on a straight line LL connecting the center of the surface of the light-emitting part and the center of the lens member (shown as a black circle in Figure 39D). Specifically, the distance from the center of the surface of the light-emitting part in the thickness direction to the center of the wavelength-selecting part is LL. １ The distance from the center of the wavelength selection area in the thickness direction to the center of the lens material is LL ２ In that case, D ０ >d ０ > 0, and considering manufacturing variations, d ０ : D ０ =LL １ : (LL １ +LL ２ It is preferable that the following conditions be met.

[0243] Furthermore, the stacking relationship between the wavelength tip and the lens member may be reversed. In such a case, for example, as shown in Figure 39E, the normal LN passing through the center of the light-emitting part, the normal LN'' passing through the center of the wavelength-selecting part, and the normal LN' passing through the center of the lens member may be made to coincide. In other words, D ０ = d ０ It may also be equal to 0.

[0244] Furthermore, for example, as shown in Figure 39F, the normal vector LN passing through the center of the light-emitting part, the normal vector LN'' passing through the center of the wavelength-selecting part, and the normal vector LN' passing through the center of the lens member do not coincide, but the normal vector LN'' passing through the center of the wavelength-selecting part and the normal vector LN' passing through the center of the lens member may coincide. In other words, D ０ = d ０ It can also be 0.

[0245] Furthermore, as shown in the conceptual diagram Figure 39G, the normal vector LN passing through the center of the surface of the light-emitting part, the normal vector LN'' passing through the center of the wavelength-selecting part, and the normal vector LN' passing through the center of the lens member do not coincide, and the normal vector LN' passing through the center of the lens member does not coincide with the normal vector LN passing through the center of the surface of the light-emitting part and the normal vector LN'' passing through the center of the wavelength-selecting part. Here, it is preferable that the center of the wavelength-selecting part is located on the straight line LL connecting the center of the surface of the light-emitting part and the center of the lens member. Specifically, the distance from the center of the surface of the light-emitting part in the thickness direction to the center of the wavelength-selecting part (shown as a black circle in Figure 39G) is LL. １ The distance from the center of the wavelength selection area in the thickness direction to the center of the lens member (shown as a black circle in Figure 39G) is LL ２ When that happens, d ０ >D ０ > 0, and considering manufacturing variations, D ０ :d ０ =LL ２ : (LL １ +LL ２ It is preferable that the following conditions be met.

[0246] <10.2 Modification 2> The subpixel 1100 (specifically, the light-emitting element 150) used in the display device according to the embodiment of the present disclosure described above may be configured to have a resonator structure that resonates the light generated in the light-emitting section (organic EL layer 104). The resonator structure will be described below with reference to Figures 40 to 46. Figure 40 is a schematic cross-sectional view illustrating the first example of the resonator structure, Figure 41 is a schematic cross-sectional view illustrating the second example of the resonator structure, and Figure 42 is a schematic cross-sectional view illustrating the third example of the resonator structure. Furthermore, Figure 43 is a schematic cross-sectional view illustrating the fourth example of the resonator structure, and Figure 44 is a schematic cross-sectional view illustrating the fifth example of the resonator structure. Furthermore, Figure 45 is a schematic cross-sectional view illustrating the sixth example of the resonator structure, and Figure 46 is a schematic cross-sectional view illustrating the seventh example of the resonator structure.

[0247] (Resonator Structure: First Example) Figure 40 is a schematic cross-sectional view illustrating the first example of a resonator structure. In the first example, the first electrode (e.g., anode electrode) 1202 is formed with a common film thickness in each subpixel 1100. The same applies to the second electrode (e.g., cathode electrode) 1206.

[0248] As shown in Figure 40, a reflector 1401 is positioned below the first electrode 1202 of the subpixel 1100, with an optical adjustment layer 1402 in between. A resonator structure is formed between the reflector 1401 and the second electrode 1206 to resonate the light generated by the organic layer (specifically, the light-emitting part) 1204.

[0249] The reflector 1401 is formed with a common film thickness for each subpixel 1100. The film thickness of the optical adjustment layer 1402 differs depending on the color that the subpixel 1100 is to display. By having optical adjustment layers 1402R, 1402G, and 1402B with different film thicknesses, it is possible to set the optical distance that produces the optimal resonance for the wavelength of light corresponding to the color to be displayed.

[0250] In the example shown in FIG. 14, the upper surfaces of the reflector 1401 in the sub-pixels 1100R, 1100G, and 1100B are arranged to be flush. As described above, since the film thickness of the optical adjustment layer 1402 is different depending on the color to be displayed by the sub-pixel 1100, the position of the upper surface of the second electrode 1206 differs depending on the type of the sub-pixels 1100R, 1100G, and 1100B.

[0251] The reflector 1401 can be formed using, for example, a metal such as aluminum (Al), silver (Ag), copper (Cu), or an alloy having these as a main component.

[0252] The optical adjustment layer 1402 can be configured using an inorganic insulating material such as silicon nitride (SiN ｘ ), silicon oxide (SiO ｘ ), silicon oxynitride (SiO ｘ N ｙ ), or an organic resin material such as an acrylic resin or a polyimide resin. The optical adjustment layer 1402 may be a single layer or a laminated film of these plurality of materials. Also, the number of laminations may differ depending on the type of the sub-pixel 1100.

[0253] The first electrode 1202 can be formed using, for example, a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO).

[0254] The second electrode 1206 preferably functions as a semi-transmissive reflective film. The second electrode 1206 can be formed using magnesium (Mg), silver (Ag), or a magnesium-silver alloy (MgAg) having these as a main component, or further an alloy containing an alkali metal or an alkaline earth metal.

[0255] (Resonator structure: Second example) FIG. 42 is a schematic cross-sectional view for explaining a second example of the resonator structure. Also in the second example, the first electrode 1202 and the second electrode 1206 are formed with a common film thickness in each sub-pixel 1100.

[0256] In the second example as well, a reflector 1401 is placed beneath the first electrode 1202 of the subpixel 1100, with an optical adjustment layer 1402 in between. A resonator structure is formed between the reflector 1401 and the second electrode 1206 to resonate the light generated by the organic layer 1204. Similar to the first example, the reflector 1401 is formed with a common film thickness for each subpixel 1100, while the film thickness of the optical adjustment layer 1402 differs according to the color that the subpixel 1100 should display.

[0257] In the first example shown in Figure 40, the upper surfaces of the reflectors 1401 for subpixels 1100R, 1100G, and 1100B were aligned, while the position of the upper surface of the second electrode 1206 differed depending on the type of subpixel 1100R, 1100G, and 1100B.

[0258] In contrast, in the second example shown in Figure 41, the upper surface of the second electrode 1206 is arranged to align with the subpixels 1100R, 1100G, and 1100B. In order to align the upper surfaces of the second electrode 1206, the upper surface of the reflector 1401 is arranged differently for the subpixels 1100R, 1100G, and 1100B, depending on the type of subpixel. As a result, the lower surface of the reflector 1401 has a stepped shape depending on the type of subpixel 1100R, 1100G, and 1100B.

[0259] The materials and other components constituting the reflector 1401, the optical adjustment layer 1402, the first electrode 1202, and the second electrode 1206 are the same as those described in the first example, so their explanation will be omitted.

[0260] (Resonator structure: Third example) Figure 42 is a schematic cross-sectional view illustrating a third example of the resonator structure. In this third example as well, the first electrode 1202 and the second electrode 1206 are formed with a common film thickness in each subpixel 1100.

[0261] In the third example, the reflector 1401 is positioned below the first electrode 1202 of the subpixel 1100, with the optical adjustment layer 1402 in between. A resonator structure is formed between the reflector 1401 and the second electrode 1206 to resonate the light generated by the organic layer 1204. Similar to the first and second examples, the thickness of the optical adjustment layer 1402 varies depending on the color that the subpixel 1100 should display. And, similar to the second example, the upper surface of the second electrode 1206 is positioned so that it aligns with the subpixels 1100R, 1100G, and 1100B.

[0262] In the second example shown in Figure 41, the lower surface of the reflector 1401 had a stepped shape corresponding to the type of sub-pixel 1100R, 1100G, and 1100B in order to align the upper surface of the second electrode 1206.

[0263] In contrast, in the third example shown in Figure 42, the film thickness of the reflector 1401 is set to differ depending on the type of sub-pixel 1100R, 1100G, and 1100B. More specifically, the film thickness is set so that the lower surfaces of the reflectors 1401R, 1401G, and 1401B are aligned.

[0264] The materials constituting the reflector 1401, the optical adjustment layer 1402, the first electrode 1202, and the second electrode 1206 are the same as those described in the first example, so their explanation will be omitted.

[0265] (Resonator structure: 4th example) Figure 43 is a schematic cross-sectional view illustrating the 4th example of a resonator structure.

[0266] In the first example shown in Figure 40, the first electrode 1202 and the second electrode 1206 of the subpixel 1100 are formed with a common film thickness. A reflector 1401 is placed below the first electrode 1202 of the subpixel 1100, with an optical adjustment layer 1402 in between.

[0267] In contrast, in the fourth example shown in Figure 43, the optical adjustment layer 1402 is omitted, and the film thickness of the first electrode 1202 is set to differ depending on the type of subpixel 1100R, 1100G, and 1100B.

[0268] The reflector 1401 is formed with a common film thickness for each subpixel 1100. The film thickness of the first electrode 1202 differs depending on the color that the subpixel 1100 is to display. By having the first electrodes 1202R, 1202G, and 1202B have different film thicknesses, it is possible to set the optical distance that produces the optimal resonance for the wavelength of light corresponding to the color to be displayed.

[0269] The materials constituting the reflector 1401, the first electrode 1202, and the second electrode 1206 are the same as those described in the first example, so their explanation will be omitted.

[0270] (Resonator structure: Fifth example) Figure 44 is a schematic cross-sectional view illustrating the fifth example of a resonator structure.

[0271] In the first example shown in Figure 40, the first electrode 1202 and the second electrode 1206 are formed with a common film thickness in each subpixel 1100. A reflector 1401 is placed below the first electrode 1202 of the subpixel 1100, with an optical adjustment layer 1402 in between.

[0272] In contrast, in the fifth example shown in Figure 44, the optical adjustment layer 1402 was omitted, and instead, an oxide film 1404 was formed on the surface of the reflector 1401. The thickness of the oxide film 1404 was set to differ depending on the type of subpixel 1100R, 1100G, and 1100B.

[0273] The thickness of the oxide film 1404 varies depending on the color that the subpixel 1100 is to display. By having oxide films 1404R, 1404G, and 1404B with different thicknesses, it is possible to set the optical distance that produces the optimal resonance for the wavelength of light corresponding to the color to be displayed.

[0274] The oxide film 1404 is a film obtained by oxidizing the surface of the reflector 1401, and is composed of, for example, aluminum oxide, tantalum oxide, titanium oxide, magnesium oxide, zirconium oxide, etc. The oxide film 1404 functions as an insulating film for adjusting the optical path length (optical distance) between the reflector 1401 and the second electrode 1206.

[0275] The oxide film 1404, which has a different thickness depending on the type of subpixel 1100R, 1100G, and 1100B, can be formed, for example, as follows.

[0276] First, the container is filled with electrolyte, and the substrate on which the reflector 1401 is formed is immersed in the electrolyte. Then, electrodes are positioned opposite the reflector 1401.

[0277] Then, a positive voltage is applied to the reflector 1401 with the electrode as the reference, and the reflector 1401 is anodized. The thickness of the oxide film formed by anodization is proportional to the voltage value applied to the electrode. Therefore, anodization is performed on each of the reflectors 1401R, 1401G, and 1401B with a voltage corresponding to the type of sub-pixel 1100R, 1100G, and 1100B applied. This makes it possible to form oxide films 1404 of different thicknesses all at once.

[0278] The materials constituting the reflector 1401, the first electrode 1202, and the second electrode 1206 are the same as those described in the first example, so their explanation will be omitted.

[0279] (Resonator Structure: Sixth Example) Figure 45 is a schematic cross-sectional view illustrating the sixth example of a resonator structure. In the sixth example, the subpixel 1100 is constructed by stacking a first electrode 1202, an organic layer 1204, and a second electrode 1206. However, in the sixth example, the first electrode 1202 is formed to serve both as an electrode and a reflector. The first electrode (and reflector) 1202 is made of a material having optical constants selected according to the type of subpixel 1100R, 1100G, and 1100B. By different phase shifts caused by the first electrode (and reflector) 1202, it is possible to set an optical distance that produces optimal resonance for the wavelength of light corresponding to the color to be displayed.

[0280] The first electrode (and reflector) 1202 can be made from a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu), or from an alloy mainly composed of these metals. For example, the first electrode (and reflector) 1202R of the subpixel 1100R can be made of copper (Cu), and the first electrode (and reflector) 1202G of the subpixel 1100G and the first electrode (and reflector) 1202B of the subpixel 1100B can be made of aluminum.

[0281] The materials and other components constituting the second electrode 1206 are the same as those described in the first example, so we will omit further explanation.

[0282] (Resonator Structure: Seventh Example) Figure 46 is a schematic cross-sectional view illustrating the seventh example of the resonator structure. The seventh example basically applies the sixth example to sub-pixels 1100R and 1100G, and the first example to sub-pixel 1100B. In this configuration as well, it is possible to set the optical distance that produces optimal resonance for the wavelength of light corresponding to the color to be displayed.

[0283] The first electrodes (which also serve as reflectors) 1202R and 1202G used in the sub-pixels 1100R and 1100G can be made from elemental metals such as aluminum (Al), silver (Ag), gold (Au), and copper (Cu), or alloys in which these metals are the main components.

[0284] The materials constituting the reflector 1401B, optical adjustment layer 1402B, and first electrode 1202B used in the subpixel 1100B are the same as those described in the first example, so their explanation will be omitted.

[0285] <<11. Application Examples>> For example, the technology relating to this disclosure may be applied to the display units of various electronic devices. Therefore, examples of electronic devices to which this technology can be applied will be described below.

[0286] (Specific Example 1) Figure 47A is a front view showing an example of the external appearance of the digital still camera 500, and Figure 47B is a rear view showing an example of the external appearance of the digital still camera 500. This digital still camera 500 is a single-lens reflex type with interchangeable lenses, and has an interchangeable shooting lens unit (interchangeable lens) 512 located approximately in the center of the front of the camera body 511, and a grip portion 513 for the photographer to hold on the left side of the front.

[0287] A monitor 514 is provided on the back of the camera body 511, slightly to the left of the center. An electronic viewfinder (eyepiece) 515 is provided above the monitor 514. The photographer can determine the composition by looking through the electronic viewfinder 515 and visually confirming the light image of the subject guided by the shooting lens unit 512. The display device 10 according to the embodiment of this disclosure can be used as the monitor 514 and the electronic viewfinder 515.

[0288] (Specific Example 2) Figure 48 is an external view of a head-mounted display 600. The head-mounted display 600 has, for example, an eyeglass-shaped display unit 611 and ear hooks 612 on both sides for attachment to the user's head. In this head-mounted display 600, the display device 10 according to the embodiment of this disclosure can be used as the display unit 611.

[0289] (Specific Example 3) Figure 49 is an external view of the see-through head-mounted display 634. The see-through head-mounted display 634 consists of a main body 632, an arm 633, and a lens barrel 631.

[0290] The main body 632 is connected to the arm 633 and the eyeglasses 630. Specifically, the long end of the main body 632 is connected to the arm 633, and one side of the main body 632 is connected to the eyeglasses 630 via a connecting member. The main body 632 may also be directly attached to the head of a person.

[0291] The main body 632 houses a control board for controlling the operation of the see-through head-mounted display 634 and a display unit. The arm 633 connects the main body 632 to the lens barrel 631 and supports the lens barrel 631. Specifically, the arm 633 is connected to the end of the main body 632 and the end of the lens barrel 631, respectively, and fixes the lens barrel 631 in place. The arm 633 also houses signal lines for communicating image-related data provided from the main body 632 to the lens barrel 631.

[0292] The lens barrel 631 projects image light, provided from the main body 632 via the arm 633, through the eyepiece lens towards the eyes of the user wearing the see-through head-mounted display 634. In this see-through head-mounted display 634, the display device 10 according to the embodiment of this disclosure can be used in the display section of the main body 632.

[0293] (Specific Example 4) Figure 50 shows an example of the appearance of a television device 710. This television device 710 has, for example, a video display screen section 711 including a front panel 712 and a filter glass 713, and this video display screen section 711 is configured by a display device 10 according to the embodiment of this disclosure.

[0294] (Specific Example 5) Figure 51 shows an example of the appearance of a smartphone 800. The smartphone 800 has a display unit 802 that displays various information, and an operation unit consisting of buttons, etc. that accept user input. The display unit 802 may be the display device 10 according to this embodiment.

[0295] (Specific Example 6) Figures 52A and 52B show the internal configuration of an automobile having a display device 10 according to the present disclosure as a display device. More specifically, Figure 52A shows the interior of the automobile from the rear to the front, and Figure 52B shows the interior of the automobile from the diagonally rear to the diagonally front.

[0296] The automobile shown in Figures 52A and 52B includes a center display 911, a console display 912, a head-up display 913, a digital rear mirror 914, a steering wheel display 915, and a rear entertainment display 916. Some or all of these displays can be fitted with the display device 10 according to the embodiment of this disclosure.

[0297] The center display 911 is positioned on the center console 907, facing the driver's seat 901 and the passenger seat 902. Figures 52A and 52B show an example of a horizontally elongated center display 911 extending from the driver's seat 901 to the passenger seat 902, but the screen size and placement of the center display 911 are arbitrary. The center display 911 can display information detected by various sensors (not shown). As a specific example, the center display 911 can display images captured by an image sensor, distance images to obstacles in front of or to the side of the vehicle measured by a ToF (Time of Flight) sensor, and the body temperature of passengers detected by an infrared sensor. The center display 911 can be used to display, for example, at least one of safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information.

[0298] Safety-related information includes information such as drowsiness detection, distraction detection, detection of mischief by a passenger, seatbelt fastening status, and detection of an unattended occupant. This information is detected, for example, by a sensor (not shown) placed on top of the back of the center display 911. Operation-related information is detected by sensing occupant gestures using sensors. The detected gestures may include the operation of various equipment in the vehicle. For example, the sensor detects the operation of air conditioning equipment, navigation systems, AV (Audio / Visual) systems, lighting systems, etc. Lifelogs include lifelogs of all occupants. For example, lifelogs include records of each occupant's actions while riding in the vehicle. By acquiring and saving lifelogs, it is possible to confirm the state of the occupants at the time of an accident. Health-related information is detected by sensing the occupant's body temperature using a temperature sensor and inferring the occupant's health status based on the detected body temperature. Alternatively, an image sensor may be used to capture the occupant's face, and the occupant's health status may be inferred from the facial expression captured. Furthermore, the system may engage in automated voice conversations with the occupants and infer their health status based on their responses. Authentication / identification-related information includes keyless entry functions that use sensors for facial recognition and functions that automatically adjust seat height and position based on facial recognition. Entertainment-related information includes functions that use sensors to detect information on how the occupants operate the AV equipment and functions that use sensors to recognize the occupants' faces and provide content suitable for the occupants through the AV equipment.

[0299] The console display 912 can be used, for example, to display life log information. The console display 912 is located near the shift lever 908 on the center console 907 between the driver's seat 901 and the passenger seat 902. The console display 912 can also display information detected by various sensors (not shown). In addition, the console display 912 may display an image of the area around the vehicle captured by an image sensor, or it may display an image showing the distance to obstacles around the vehicle.

[0300] The head-up display 913 is virtually displayed behind the windshield 904 in front of the driver's seat 901. The head-up display 913 can be used to display at least one of the following: safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information. Because the head-up display 913 is often virtually positioned in front of the driver's seat 901, it is suitable for displaying information directly related to the operation of the vehicle, such as the vehicle's speed and fuel (battery) level.

[0301] The digital rearview mirror 914 can not only display the area behind the vehicle but also show the condition of the passengers in the rear seat. By placing a sensor (not shown) on top of the back of the digital rearview mirror 914, it can be used, for example, to display life log information.

[0302] The steering wheel display 915 is positioned near the center of the steering wheel 906 of the automobile. The steering wheel display 915 can be used to display at least one of the following: safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the steering wheel display 915 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, or information related to the operation of AV equipment, air conditioning equipment, etc.

[0303] The rear entertainment display 916 is mounted on the back of the driver's seat 901 and the passenger seat 902, and is intended for viewing by rear-seat passengers. The rear entertainment display 916 can be used to display at least one of the following: safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the rear entertainment display 916 is in front of the rear-seat passengers, it displays information relevant to the rear-seat passengers. For example, it may display information related to the operation of AV equipment or air conditioning equipment, or it may display the results of measurements of the rear-seat passengers' body temperature, etc., taken by a temperature sensor (not shown).

[0304] <<12. Supplementary Information>> Although preferred embodiments of the present disclosure have been described in detail above with reference to the attached drawings, the technical scope of the present disclosure is not limited to such examples. It is clear that a person with ordinary skill in the art of the present disclosure may conceive of various modifications or alterations within the scope of the technical ideas described in the claims, and these will naturally also be understood to fall within the technical scope of the present disclosure.

[0305] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that will be apparent to those skilled in the art from the description herein, in addition to or in lieu of the effects described herein.

[0306] Furthermore, this technology can also take the following configurations: (1) A display device comprising a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate consisting of a first electrode, a light-emitting part provided on the first electrode, and a second electrode provided on the light-emitting part, adjacent second electrodes are electrically connected to each other by wiring extending over each second electrode, a first auxiliary wiring is provided between adjacent light-emitting elements so as to be in contact with the wiring, the first auxiliary wiring includes a first conductive layer made of the same material as the second electrodes, and at least a part of the first conductive layer is located at the same height as the laminate in a cross-section obtained by cutting the light-emitting element along the lamination direction. (2) The display device according to (1) above, wherein the first conductive layer is provided on a light-emitting material layer made of the same material as the light-emitting part. (3) The display device according to (2) above, wherein the light-emitting material layer is made of an organic material or an inorganic material. (4) The display device according to (2) or (3) above, wherein at least a portion of the first conductive layer is located at the same height as the second electrode in a cross-section obtained by cutting the light-emitting element along the stacking direction. (5) The display device according to (4) above, wherein at least a portion of the light-emitting material layer is located at the same height as the light-emitting portion in a cross-section obtained by cutting the light-emitting element along the stacking direction. (6) The display device according to (5) above, wherein at least a portion of the light-emitting material layer is made of the same material as the first electrode and is provided on a second conductive layer located at the same height as the first electrode in a cross-section obtained by cutting the light-emitting element along the stacking direction. (7) The display device according to (6) above, wherein the second conductive layer contains at least one element selected from the group consisting of Cr, Au, Pt, Ni, Cu, Mo, Ti, Ta, Al, Mg, Fe, W, Ag, In, Sn, and Zn. (8) The display device according to any one of (1) to (7) above, wherein the first conductive layer comprises at least one element selected from the group consisting of Al, Mg, Ca, Na, Ag, In, and Zn. (9) The display device according to any one of (1) to (8) above, wherein the length of the first auxiliary wiring is longer than the length of the portion of the wiring in contact with the first auxiliary wiring.(10) The display device according to any one of (1) to (9) above, wherein when the display device is viewed from above the substrate, the first auxiliary wiring is provided around at least a portion of each of the light-emitting elements. (11) The display device according to (10) above, wherein when the display device is viewed from above the substrate, the first auxiliary wiring is provided to extend between adjacent light-emitting elements. (12) The display device according to (10) above, wherein when the display device is viewed from above the substrate, the first auxiliary wiring is provided to surround each of the light-emitting elements. (13) The display device according to (10) above, wherein when the display device is viewed from above the substrate, the first auxiliary wiring is provided to surround the corners of the plurality of adjacent light-emitting elements. (14) The display device according to any one of (1) to (13) above, wherein when the display device is viewed from above the substrate, the light-emitting elements have a rectangular, polygonal, circular, or elliptical shape. (15) The display device according to any one of (1) to (14), wherein each light-emitting element further comprises a first protective film provided on the second electrode, the first protective film having an opening that exposes the central part of the upper surface of the second electrode, and the wiring is provided to extend over at least a portion of the inner wall of the opening. (16) The display device according to (15), wherein the wiring is provided to extend over at least a portion of the upper surface of the first protective film. (17) The display device according to (15) or (16), wherein a second protective film is embedded in the opening. (18) A display device comprising a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a stack comprising a first electrode, a light-emitting part provided on the first electrode, and a second electrode provided on the light-emitting part, a separation layer is embedded between adjacent light-emitting elements to separate them, and adjacent second electrodes are electrically connected to each other by wiring extending above the upper surface of the separation layer. (19) The display device according to (18), wherein the upper surface of the separation layer is a flat surface.(20) The display device according to (18) or (19), wherein the wiring, together with a second auxiliary wiring extending above the upper surface of the separation layer, electrically connects each adjacent second electrode. (21) The display device according to (20), wherein the second auxiliary wiring includes a metallic material. (22) The display device according to (20) or (21), wherein the second auxiliary wiring is provided below the wiring. (23) The display device according to (22), wherein the second auxiliary wiring is provided on a light-shielding film extending above the upper surface of the separation layer. (24) The display device according to any one of (20) to (23), wherein each light-emitting element further comprises a first protective film provided on the second electrode, the first protective film having an opening that exposes the central part of the upper surface of the second electrode, the wiring being provided to extend over at least a portion of the inner wall of the opening, the separation layer being provided to be embedded in the first protective film, and the end face of the second auxiliary wiring being flush with the end face of the opening of the opening. (25) The display device according to (24), wherein a second protective film is embedded in the opening, the second protective film being formed from a material with a higher refractive index than the first protective film. (26) The display device according to any one of (18) to (25), wherein the separation layer is formed from an insulating material, a metallic material, or a light-shielding material. (27) The display device according to (26), wherein the metallic material comprises at least one element selected from the group consisting of Cr, Au, Pt, Ni, Cu, Mo, Ti, Ta, Al, Mg, Fe, W, Ag, In, Sn, and Zn. (28) The display device according to (24) or (25), wherein the separation layer is formed from a material having a lower refractive index than the first protective film. (29) The display device according to (18) or (19), wherein the wiring, together with a third auxiliary wiring provided below the separation layer, electrically connects each of the adjacent second electrodes. (30) The display device according to (29), wherein the third auxiliary wiring is provided to extend along the side and bottom surfaces of the separation layer. (31) The display device according to (30), wherein the third auxiliary wiring is provided to extend along the substrate.(32) The display device according to (29) above, wherein the upper surface of the third auxiliary wiring is covered with a third protective film. (33) The display device according to any one of (29) to (32) above, wherein each light-emitting element further has a first protective film provided on the second electrode, the first protective film has an opening that exposes the central part of the upper surface of the second electrode, the wiring is provided to extend over at least a part of the inner wall of the opening, the separation layer is provided to be embedded in the first protective film, the end face of the third auxiliary wiring and the end face of the opening of the opening are flush, and the third auxiliary wiring is electrically connected to the wiring at the end face of the opening of the opening. (34) The display device according to any one of (29) to (33) above, wherein the third auxiliary wiring is formed of a metallic material. (35) The display device according to any one of (29) to (34) above, wherein the third auxiliary wiring has a multilayer structure. (36) A display device comprising a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate comprising a first electrode, a light-emitting portion provided on the first electrode, a second electrode provided on the light-emitting portion, and a first protective film provided on the second electrode, wherein adjacent second electrodes are electrically connected to each other by wiring extending over the plurality of light-emitting elements, the first protective film has an opening that exposes the central part of the upper surface of the second electrode, the wiring is provided to extend over at least a part of the inner wall of the opening, the plurality of light-emitting elements include adjacent first and second light-emitting elements, and the first region of the wiring located between the first and second light-emitting elements is located above the upper surface of the first protective film of the first and second light-emitting elements. (37) The display device according to (36), wherein the first light-emitting element has a first sidewall film covering the side surface of the stack of the first light-emitting element, and the second electrode of the second light-emitting element is electrically connected to a fourth auxiliary wiring extending on the first sidewall film. (38) The display device according to (37), wherein the wiring, together with the fourth auxiliary wiring, electrically connects the second electrode of the first light-emitting element and the second electrode of the second light-emitting element.(39) The light-emitting portion of the second light-emitting element extends on the first sidewall film, the display device according to (38) above. (40) The display device according to any one of (36) to (39) above, wherein the plurality of light-emitting elements include a third light-emitting element adjacent to the first light-emitting element and located on the opposite side of the second light-emitting element, and the second region of the wiring located between the first light-emitting element and the third light-emitting element is located above the upper surface of the first protective film of the first light-emitting element and the third light-emitting element. (41) The display device according to (40) above, wherein the third light-emitting element has a second sidewall film covering the side surface of the laminate of the third light-emitting element, the second electrode of the first light-emitting element is electrically connected to a fifth auxiliary wiring extending on the second sidewall film, and the wiring, together with the fifth auxiliary wiring, electrically connects the second electrode of the first light-emitting element and the second electrode of the third light-emitting element. (42) The display device according to (41) above, wherein the light-emitting portion of the first light-emitting element extends on the second sidewall film. (43) An electronic device equipped with a display device comprising a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate consisting of a first electrode, a light-emitting portion provided on the first electrode, and a second electrode provided on the light-emitting portion, adjacent second electrodes are electrically connected to each other by wiring extending on each second electrode, a first auxiliary wiring is provided between adjacent light-emitting elements so as to be in contact with the wiring, the first auxiliary wiring includes a first conductive layer made of a material common to the second electrodes, and at least a portion of the first conductive layer is located at the same height as the laminate in a cross-section obtained by cutting the light-emitting element along the lamination direction.

[0307] 10 Display device 11 Horizontal drive circuit 12 Vertical drive circuit 20 Pixels 40, 300 Substrate 100, 100B, 100G, 100R, 1100, 1100B, 1100G, 1100R Subpixels 102, 1202, 1202B, 1202G, 1202R First electrode 104, 104b, 104g, 104r Organic EL layer 106, 1206 Second electrode 108 Interpixel insulating part 120, 120a Auxiliary wiring 112, 116 Conductive layer 114 Light-emitting material layer 110 Wiring 130, 132, 132a, 132b, 136, 136a Auxiliary wiring 134 Light-shielding film 150, 150a, 150b, 150g, 150r Light-emitting element 160, 162, 164, 166, 166a Separation layer 172, 200, 202, 204, 220, 222, 224, 226, 228, 240 Protective film 210 Aperture 230, 302 Planarization film 304 Color filter 306 On-chip lens 400, 402, 406, 412, 416, 418, 420, 422, 424, 426, 428, 430 Resist mask 404, 408, 410 Trench 500 Digital still camera 511 Camera body 512 Imaging lens unit 513 Grip 514 Monitor 515 Electronic viewfinder 600 Head-mounted display 611, 802 Display unit 612 Ear hook unit 630 Glasses 631 Lens barrel 632 Main unit 633 Arm 634 See-through head-mounted display 710 Television device 711 Video display screen unit 712 Front panel 713 Filter glass 800 Smartphone 901 Driver's seat 902 Passenger seat 904 Windshield 906 Steering wheel 907 Center console 908 Shift lever 911 Center display 912 Console display 913 Head-up display 914 Digital rearview mirror915 Steering wheel display 916 Rear entertainment display 1204 Organic layer 1401, 1401B, 1401G, 1401R Reflector 1402, 1402B, 1402G, 1402R Optical adjustment layer 1404, 1404B, 1404G, 1404R Oxide film C1 Capacitance section CEL Capacitance DTLn Signal line ELP Light-emitting element PS1m Power supply line PS2 Common power supply line SCLm Scan line TR Ｗ Programming transistor TR Ｄ Driving transistor

Claims

1. A display device comprising a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate comprising a first electrode, a light-emitting portion provided on the first electrode, and a second electrode provided on the light-emitting portion, adjacent second electrodes are electrically connected to each other by wiring extending over each second electrode, a first auxiliary wiring is provided between adjacent light-emitting elements so as to be in contact with the wiring, the first auxiliary wiring includes a first conductive layer made of a material common to the second electrodes, and at least a portion of the first conductive layer is located at the same height as the laminate in a cross-section obtained by cutting the light-emitting element along the lamination direction.

2. The display device according to claim 1, wherein the first conductive layer is provided on a light-emitting material layer made of the same material as the light-emitting portion.

3. The display device according to claim 2, wherein at least a portion of the first conductive layer is located at the same height as the second electrode in a cross-section obtained by cutting the light-emitting element along the stacking direction.

4. The display device according to claim 3, wherein at least a portion of the light-emitting material layer is located at the same height as the light-emitting portion in a cross-section obtained by cutting the light-emitting element along the stacking direction.

5. The display device according to claim 4, wherein at least a portion of the light-emitting material layer is made of a material common to the first electrode and is provided on a second conductive layer located at the same height as the first electrode in a cross-section obtained by cutting the light-emitting element along the stacking direction.

6. A display device comprising a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate consisting of a first electrode, a light-emitting portion provided on the first electrode, and a second electrode provided on the light-emitting portion, a separation layer is embedded between adjacent light-emitting elements to separate them, and adjacent second electrodes are electrically connected to each other by wiring extending above the upper surface of the separation layer.

7. The display device according to claim 6, wherein the upper surface of the separation layer is a flat surface.

8. The display device according to claim 6, wherein the wiring, together with a second auxiliary wiring extending above the upper surface of the separation layer, electrically connects each adjacent second electrode.

9. The display device according to claim 8, wherein the second auxiliary wiring comprises a metallic material.

10. The display device according to claim 8, wherein each light-emitting element further comprises a first protective film provided on the second electrode, the first protective film having an opening that exposes the central part of the upper surface of the second electrode, the wiring being provided to extend over at least a portion of the inner wall of the opening, the separation layer being provided to be embedded in the first protective film, and the end face of the second auxiliary wiring being flush with the end face of the opening of the opening.

11. The display device according to claim 6, wherein the separation layer is formed from an insulating material, a metallic material, or a light-shielding material.

12. The display device according to claim 10, wherein the separation layer is formed from a material having a lower refractive index than the first protective film.

13. The display device according to claim 6, wherein the wiring, together with a third auxiliary wiring provided below the separation layer, electrically connects each adjacent second electrode.

14. The display device according to claim 13, wherein the third auxiliary wiring is provided so as to extend from the side and bottom surfaces of the separation layer.

15. The display device according to claim 13, wherein each light-emitting element further comprises a first protective film provided on the second electrode, the first protective film having an opening that exposes the central part of the upper surface of the second electrode, the wiring being provided to extend over at least a portion of the inner wall of the opening, the separation layer being provided to be embedded in the first protective film, the end face of the third auxiliary wiring being flush with the end face of the opening of the opening, and the third auxiliary wiring being electrically connected to the wiring at the end face of the opening of the opening.

16. A display device comprising a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate comprising a first electrode, a light-emitting portion provided on the first electrode, a second electrode provided on the light-emitting portion, and a first protective film provided on the second electrode, wherein adjacent second electrodes are electrically connected to each other by wiring extending over the plurality of light-emitting elements, the first protective film has an opening that exposes the central part of the upper surface of the second electrode, the wiring is provided to extend over at least a part of the inner wall of the opening, the plurality of light-emitting elements include adjacent first and second light-emitting elements, and the region of the wiring located between the first and second light-emitting elements is located above the upper surface of the first protective film of the first and second light-emitting elements.

17. The display device according to claim 16, wherein the first light-emitting element has a sidewall film covering the side surface of the stack of the first light-emitting element, and the second electrode of the second light-emitting element is electrically connected to a fourth auxiliary wiring extending on the sidewall film.

18. The display device according to claim 17, wherein the wiring, together with the fourth auxiliary wiring, electrically connects the second electrode of the first light-emitting element and the second electrode of the second light-emitting element.

19. The display device according to claim 18, wherein the light-emitting portion of the second light-emitting element extends along the side wall film.

20. Electronic device equipped with a display device having a plurality of light-emitting elements arranged on a substrate and separated from each other, wherein each light-emitting element has a laminate consisting of a first electrode, a light-emitting portion provided on the first electrode, and a second electrode provided on the light-emitting portion, adjacent second electrodes are electrically connected to each other by wiring extending over each second electrode, a first auxiliary wiring is provided between adjacent light-emitting elements so as to be in contact with the wiring, the first auxiliary wiring includes a first conductive layer made of a material common to the second electrodes, and at least a portion of the first conductive layer is located at the same height as the laminate in a cross-section obtained by cutting the light-emitting element along the lamination direction.

Images