Display module and display device using same

Abstract

A display module and a display device using same are provided. The display module comprises: a substrate; a first electrode disposed along the edge of a first surface of the substrate; a second electrode disposed along the edge of a second surface opposite to the first surface of the substrate; a via electrode penetrating the substrate and electrically connecting the first electrode and the second electrode; a plurality of first pads for applying an antistatic voltage to the second electrode; and a plurality of second pads for measuring resistance values of the first electrode, the second electrode and the via electrode.

Description

Display module and display device using the same

[0001] The present disclosure relates to a display module and a display device using the same.

[0002] Self-emissive display devices display images without a backlight and can utilize self-luminous micro LEDs. Display modules can display various images by utilizing pixels or subpixels composed of these micro LEDs. The operation of each pixel or subpixel is controlled by a plurality of Thin Film Transistors (TFTs). The plurality of TFTs are arranged on a substrate, a glass substrate, or a plastic substrate, and this is referred to as a TFT substrate.

[0003] One side of such a TFT substrate is equipped with a micro LED, and the other side is equipped with various wiring or driver ICs for driving the micro LED. Accordingly, via electrodes penetrating the TFT substrate may be provided for electrical connection between components such as the driver IC on the rear side and the micro LED on the front side.

[0004] If external impact occurs during the production process of a display module containing a TFT substrate, cracks may form in via electrodes or various wiring. In particular, display modules using Micro LEDs can be produced in a bezel-less form; in this case, there is a very high risk of defects occurring due to the influence of static electricity or external impacts from the surroundings.

[0005] Therefore, the need for technology capable of preventing defects caused by static electricity or external shocks has emerged.

[0006] A display module according to one aspect of the present disclosure may include: a substrate; a first electrode disposed along the edge of a first surface of the substrate; a second electrode disposed along the edge of a second surface opposite to the first surface of the substrate; a via electrode penetrating the substrate and electrically connecting the first electrode and the second electrode; a plurality of first pads for applying an electrostatic discharge prevention voltage to the second electrode; and a plurality of second pads for measuring resistance values ​​of the first electrode, the second electrode and the via electrode.

[0007] A display device according to another aspect of the present disclosure comprises: a display module; and a processor; wherein the display module comprises: a substrate; a first electrode disposed along the edge of a first surface of the substrate; a second electrode disposed along the edge of a second surface opposite to the first surface of the substrate; a via electrode penetrating the substrate and electrically connecting the first electrode and the second electrode; a plurality of first pads for applying an electrostatic discharge prevention voltage to the second electrode; and a plurality of second pads for measuring resistance values ​​of the first electrode, the second electrode and the via electrode; and wherein the processor comprises

[0008] When the display device is turned on, the display module can be controlled so that the first electrode and the second electrode operate as an electrostatic barrier structure by the electrostatic prevention voltage.

[0009] FIG. 1 is a front view illustrating a display module according to one embodiment of the present disclosure.

[0010] FIG. 2 is a rear view illustrating a display module according to one embodiment of the present disclosure.

[0011] FIG. 3 is a front view illustrating a display module according to another embodiment of the present disclosure.

[0012] FIG. 4 is a rear view illustrating a display module according to another embodiment of the present disclosure.

[0013] FIG. 5 is a diagram illustrating a structure in which a plurality of via electrodes are arranged on a first surface of a substrate of a display module according to various embodiments of the present disclosure.

[0014] FIG. 6 is a drawing illustrating a structure in which a plurality of via electrodes are arranged on a second surface of a substrate of a display module according to various embodiments of the present disclosure.

[0015] FIG. 7 is a front view illustrating a display module according to another embodiment of the present disclosure.

[0016] FIG. 8 is a drawing illustrating, exemplarily, a first connecting electrode and a second connecting electrode of a display module according to another embodiment of the present disclosure.

[0017] FIGS. 9 and FIGS. 10 are schematic drawings illustrating the configuration of a display device according to one embodiment of the present disclosure.

[0018] FIG. 11 is a block diagram illustrating the configuration of a display module inspection system according to at least one embodiment of the present disclosure.

[0019] The embodiments described in this specification may be modified in various ways. Specific embodiments may be depicted in the drawings and described in detail in the detailed description. However, specific embodiments disclosed in the accompanying drawings are intended only to facilitate understanding of various embodiments. Accordingly, the technical concept is not limited by specific embodiments disclosed in the accompanying drawings, and it should be understood that it includes all equivalents or substitutions that fall within the spirit and scope of the invention.

[0020] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but these components are not limited by the aforementioned terms. The aforementioned terms are used solely for the purpose of distinguishing one component from another. In this specification, terms such as “comprising” or “having” are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0021] When it is stated that one component is "connected" or "joined" to another component, it should be understood that while it may be directly connected or joined to that other component, there may also be other components in between.

[0022] On the other hand, when it is stated that one component is "directly connected" or "directly coupled" to another component, it should be understood that there are no other components in between.

[0023] In this disclosure, the expression "identical" means not only complete agreement but also includes differences that account for a range of processing errors. Furthermore, in describing this disclosure, if it is determined that a detailed description of related known functions or configurations could unnecessarily obscure the essence of this disclosure, such detailed description is abbreviated or omitted.

[0024] In the present disclosure, a display module is a device comprising a plurality of light-emitting elements. A display module may display an image independently or may display an image in a combined state with another display module. In the present disclosure, a device in which a plurality of display modules are combined to display an image is described as a display device. Alternatively, the display module of the present disclosure may be described as a display device, and a device in which a plurality of display modules are combined may be described as a modular display device.

[0025] Although the light-emitting element may be implemented as a general LED, the various embodiments of the present disclosure are described based on the case where it is implemented as a micro-micro light-emitting diode (micro LED or μLED).

[0026] A display module composed of micro LEDs may include a plurality of inorganic light-emitting diodes (inorganic LEDs) having a size of about 100 micrometers or less.

[0027] Compared to liquid crystal display (LCD) panels that require backlighting, micro LED display modules offer better contrast, response time, and energy efficiency. While both organic light-emitting diodes (OLEDs) and inorganic light-emitting devices like micro LEDs are energy-efficient, micro LEDs offer greater brightness, luminous efficiency, and a longer lifespan than OLEDs.

[0028] Micro LEDs can be semiconductor chips capable of emitting light on their own when power is supplied. Micro LEDs feature fast response speeds, low power consumption, and high brightness. Specifically, Micro LEDs have a higher efficiency in converting electricity into photons compared to conventional LCDs (liquid crystal displays) or OLEDs (Organic Light Emitting Diodes). They offer higher "brightness per watt" compared to conventional LCD or OLED displays.

[0029] Accordingly, Micro LEDs can achieve the same brightness with approximately half the energy compared to conventional LEDs (with widths, heights, and thicknesses each exceeding 100㎛) or OLEDs. In addition, Micro LEDs enable high resolution, excellent color, contrast, and brightness, allowing for accurate representation of a wide range of colors and the display of a clear image even in bright sunlight outdoors. Furthermore, Micro LEDs are resistant to burn-in and generate little heat, ensuring a long lifespan without deformation.

[0030] In the present disclosure, the front surface of a glass substrate may be divided into an active region and an inactive region. The active region may correspond to the area occupied by the TFT layer on the front surface of the glass substrate, and the inactive region may be the area excluding the area occupied by the TFT layer on the front surface of the glass substrate.

[0031] The glass substrate can be formed in a quadrangle type. Specifically, the glass substrate can be formed in a rectangle or a square, etc. The edge region of the glass substrate may include at least one of the four sides of the glass substrate.

[0032] In a display module, externally exposed electrodes and externally hidden electrodes are formed on a TFT substrate, thereby minimizing the inactive area and maximizing the active area on the front surface of the TFT substrate, which can make the module bezel-less and increase the mounting density of micro LEDs in the display module.

[0033] In the present disclosure, a display module that implements bezel-less design can provide a large-sized multi-display device that can maximize the active area when multiple modules are connected.

[0034] In this case, each display module can be formed to maintain the pitch between each pixel of adjacent display modules equal to the pitch between each pixel within a single display module by minimizing the inactive area.

[0035] Accordingly, it is possible to prevent seams from appearing at the connection portions between each display module. In the present disclosure, the display module includes a glass substrate on which a plurality of LEDs are mounted and side wiring is formed. Such a display module can be installed and applied as a single unit in wearable devices, portable devices, handheld devices, and electronic products or battlefields requiring various displays.

[0036] In addition, the display module can be applied to display devices such as PC (personal computer) monitors, high-resolution TVs, signage (or digital signage), and electronic displays through multiple assembly arrangements of a matrix type.

[0037] According to the present disclosure, damage to the substrate caused by static electricity can be prevented, and electrode defects (e.g., electrodes exposed outside the substrate and via hole electrode defects not exposed) can be easily identified.

[0038] In particular, electrode defect verification can be applied during each process of manufacturing the display module. Therefore, it is possible to prevent defective products from being fed into subsequent processes and undergoing further processing in advance.

[0039] Hereinafter, a display module (100) according to an embodiment of the present disclosure will be described with reference to the drawings. FIG. 1 is a front view illustrating a display module (100) according to an embodiment of the present disclosure. FIG. 2 is a rear view illustrating a display module (100) according to an embodiment of the present disclosure.

[0040] Referring to FIG. 1 and FIG. 2, a display module (100) according to one embodiment of the present disclosure may include a substrate (105), a first electrode (110), a second electrode (120), a via electrode (130), a first pad (140) and a second pad (150), and a driver IC (160). The substrate (105) may be a substrate (105) for mounting a micro LED.

[0041] In particular, the anode and cathode electrodes of the micro LED can be implemented as a flip chip structure in which the anode and cathode electrodes are formed on a first surface of the substrate (105) and the light-emitting surface is formed on a second surface located on the opposite side of the first surface.

[0042] Although not shown in FIGS. 1 and 2, a TFT layer having a Thin Film Transistor (TFT) circuit formed thereon may be disposed on the front surface of the substrate (105), and on the rear surface, a power supply circuit that supplies power to the TFT circuit, a data driving driver, a gate driving driver, and a timing controller (700) that controls each driving driver may be disposed thereon.

[0043] In addition, a plurality of pixels arranged on the TFT layer may be driven by a TFT circuit. Meanwhile, the first electrode (110) of the display module (100) may be arranged along the edge of the first surface (1) of the substrate (105). The second electrode (120) of the display module (100) may be arranged along the edge of the second surface (2) opposite the first surface (1) of the substrate (105).

[0044] In FIG. 1, the first electrode (110) is formed at a position slightly away from the outermost edge of the substrate (105), so that a portion of the outermost edge of the substrate (105) is exposed, but it is not necessarily limited to this and may be formed at a position that is in complete contact with the outermost edge.

[0045] Additionally, in FIG. 2, the second electrode (120) is shown to be formed close to the left and right and lower edge portions of the four edges of the substrate (105) and somewhat separated from the edge area where the driver IC (160) is placed, but this is not necessarily limited thereto, and it may also be formed in close contact with the outermost edge in the upper portion. In this case, the first and second pads may be formed to protrude inwardly toward the second surface of the substrate (105).

[0046] The via electrode (130) of the display module (100) penetrates the substrate (105). The first via electrode (1131, 1132) of the display module (100) penetrating the substrate (105) may be provided to electrically connect the first electrode (110) and the second electrode (120).

[0047] The first pad (140) of the display module (100) may be provided in a single or multiple number on the substrate (105) so as to apply an electrostatic discharge prevention voltage to the second electrode (120). The second pad (150) of the display module (100) may be provided for measuring the resistance values ​​of the first electrode (110), the second electrode (120), and the via electrode (130). The second pad (150) of the display module (100) may be provided in multiple numbers on the substrate (105).

[0048] The via electrode (130) can be electrically connected by contacting the first electrode (110) on the first surface and the second electrode (120) on the second surface, respectively. The via electrode (130) can be implemented in a form that connects the upper and lower parts by completely filling the interior of a via hole that penetrates the substrate (150) with a metallic material or by covering only the side wall portion of the via hole with a metallic material.

[0049] A pair of first pads (141, 142) and second pads (151, 152) are provided. The first pads (141, 142) and second pads (151, 152) are electrically connected to the second electrode (120). For convenience of explanation, the first pads (141, 142) may be distinguished as the first-1 pad (141) and the first-2 pad (142), and the second pads (151, 152) may be distinguished as the second-1 pad (151) and the second-2 pad (152).

[0050] The first pad (141, 142) is configured to apply an electrostatic discharge prevention voltage. The electrostatic discharge prevention voltage is a voltage applied to prevent external static electricity from flowing into the substrate (105). When the electrostatic discharge prevention voltage is applied to the first pad (141, 142), the first electrode (110), which is connected to the second electrode (120) through the via electrode (130), has the same potential. Accordingly, even if static electricity occurs, static electricity is not flowed into the interior due to the potential difference between the first electrode (110) and the second electrode (120). That is, the first electrode (110) acts as an electrostatic barrier that blocks the inflow of external static electricity on the first surface of the substrate (105), and the second electrode (120) acts as an electrostatic barrier on the second surface.

[0051] The second pad (151, 152) is configured for measuring resistance values. As described above, the first electrode (110) and the second electrode (120) are electrically connected by a via electrode (130), thereby forming a single load. Therefore, when a resistance measurement sensor is connected to the second pad (151, 152), a specific resistance value is measured. The resistance value may vary depending on the size, material, area, shape, etc. of the first electrode, the second electrode, and the via electrode, but the resistance value measured in the absence of cracks or damage remains the same within the error range. On the other hand, if at least one of the first electrode, the second electrode, or the via electrode is damaged or a crack occurs, the electrical connection relationship changes, and thus the resistance value changes. That is, if the measured value obtained through the second pad (151, 152) deviates from the reference range, it corresponds to a defective state.

[0052] The driver IC (160) of the display module (100) may be provided on the second surface (2) of the substrate (105). The driver IC (160) provided on the second surface (2) of the substrate (105) may be provided to be electrically connected to a plurality of first pads (140).

[0053] Meanwhile, the driver IC (160) of the display module (100) may be provided after the crack inspection of the first electrode (110), the second electrode (120), and the via electrode (130) on the substrate (105) is completed through the second pad (151, 152) on the substrate (105).

[0054] The first electrode (110) of the substrate (105) may be provided to surround the active area (A) on the first surface (1) of the substrate (105) without encroaching upon the active area where an image is displayed on the screen. The second electrode (120) of the substrate (105) may be provided to surround the central part (e.g., an area corresponding to the entire or at least a part of the active area (A)) on the second surface (2) of the substrate (105) without encroaching upon it.

[0055] In FIGS. 1 and 2, the case in which the first electrode and the second electrode are each composed of a single line is illustrated and described, but the first electrode and the second electrode may each be composed of multiple lines.

[0056] FIG. 3 is a front view illustrating a display module (100) according to another embodiment of the present disclosure. FIG. 4 is a rear view illustrating a display module (100) according to another embodiment of the present disclosure.

[0057] Referring to FIGS. 3 and 4, a display module (100) according to another embodiment of the present disclosure may include a substrate (105), a first electrode (110), a second electrode (120), a via electrode (130), a first pad (140), a second pad (150), and a driver IC (160). The first pad (140) may be provided with a first-1 pad (141) on one side and a first-2 pad (142) on the other side. The second pad (150) may also be provided with a second-1 pad (151) and a second-2 pad (152) on one side.

[0058] Additionally, the first electrode (110) may include a first external electrode (111), a first internal electrode (112), and a first connecting electrode (113). The first connecting electrode (113) may include a first-1 connecting electrode (1131) and a first-2 connecting electrode (1132).

[0059] The second electrode (120) may include a second external electrode (121), a second internal electrode (122), and a second connecting electrode (123). The second connecting electrode (113) may include a second-1 connecting electrode (1231) and a second-2 connecting electrode (1232).

[0060] The first electrode (110) of the display module (100) may be positioned along the edge of the first surface (1) of the substrate (105). Additionally, the second electrode (120) of the display module (100) may be positioned along the edge of the second surface (2) opposite to the first surface (1) of the substrate (105).

[0061] Meanwhile, the via electrode (130) of the display module (100) may be provided to penetrate the substrate (105) and electrically connect the first electrode (110) and the second electrode (120). The first pad (140) of the display module (100) may be provided to apply an electrostatic discharge prevention voltage to the second electrode (120).

[0062] These first pads (140) may be provided in multiple locations. The second pad (150) of the display module (100) may serve to measure the resistance values ​​of the first electrode (110), the second electrode (120), and the via electrode (130). That is, it serves as a medium for measuring the resistance values ​​of the first electrode (110), the second electrode (120), and the via electrode (130).

[0063] Here, the driver IC (160) of the display module (100) is placed on the second surface (2) of the substrate (105) and can be electrically connected to a plurality of first pads (140). In addition, the first external electrode (111) of the first electrode (110) can be arranged to form a closed curve along the edge of the first surface (1).

[0064] The first internal electrode (112) of the first electrode (110) may be arranged to form a closed curve of a predetermined shape at a position spaced apart from the first external electrode (111) on the first surface (1). The first internal electrode (112) of the display module (100) may be provided to be electrically connected to the via electrode (130).

[0065] In addition, the first connecting electrode (113) of the first electrode (110) can connect the first external electrode (111) and the first internal electrode (112) on both sides centered on the connection position between the via electrode (130) and the first internal electrode (112).

[0066] The first connecting electrode (113) may be provided in multiple numbers, such as the first-1 connecting electrode (1131) and the first-2 connecting electrode (1132). The second external electrode (121) of the second electrode (120) may be arranged to form a closed curve of a predetermined shape along the edge of the second surface (2).

[0067] The second inner electrode (122) of the second electrode (120) may be arranged to form a closed curve of a predetermined shape at a position spaced inward from the second outer electrode (121) on the second surface (2). This second inner electrode (122) may be provided to be electrically connected to the via electrode (130).

[0068] In addition, the second connecting electrode (123) of the second electrode (120) may be provided on both sides centered on the connection location between the via electrode (130) and the second internal electrode (122). These second connecting electrodes (123) may be provided in multiple numbers to connect the second external electrode (121) and the second internal electrode (122).

[0069] In FIGS. 3 and 4, a via electrode is formed near the side edge opposite to the position where the driver IC (160) is placed within the substrate (105) and is shown in contact with the internal electrodes (112, 122), but the position of the via electrode can be varied.

[0070] For example, the via electrode (130) may be located at the corner portion of the first internal electrode (112) and the second internal electrode (122). In this case, a pair of connecting electrodes around it may be formed on different sides of the first external electrode (111) and the first internal electrode (112), and on different sides of the second external electrode (121) and the second internal electrode (122), respectively. Additionally, the via electrode (130) does not necessarily have to be formed at a position in direct contact with the internal electrode, but may be formed at a position in direct contact with the external electrode.

[0071] In the above description, a structure is illustrated in which one via electrode (130) and a pair of connecting electrodes, namely a first-1 connecting electrode (1131) and a first-2 connecting electrode (1132) or a second-1 connecting electrode (1231) and a second-2 connecting electrode (1232), but the number of via electrodes and the number of connecting electrodes are not limited thereto and can be varied in many ways. FIGS. 5 and 6 illustrate a case in which a plurality of via electrodes are formed.

[0072] FIG. 5 is a drawing illustrating a variation in which via electrodes (130) are positioned at various locations on a first surface (1) of a display module (100) according to another embodiment of the present disclosure. FIG. 6 is a drawing illustrating a variation in which via electrodes (130) are positioned at various locations on a second surface (2) of a display module (100) according to another embodiment of the present disclosure.

[0073] Referring to FIGS. 5 and 6, the via electrodes (130) of the display module (100) may be provided in multiple numbers to penetrate the first surface (1) and the second surface (2) of the substrate (105). Based on the fact that the substrate (105) of the display module (100) has a square or square shape, the via electrodes (110) and the second electrode (120) may be provided along the shape of the first electrode (110) and the second electrode (120). For example, the via electrodes (130) may be formed at positions such as the bottom, left, right, and top relative to the active area (A) of the first surface (1) of the substrate (105).

[0074] External impact on the substrate (105) can occur from various directions. Therefore, when an external impact is applied in one direction while multiple via electrodes are arranged in dispersed locations, the via electrode closest to that direction is most likely to be damaged. Since the electrical connection relationship between the first electrode, the second electrode, and the via electrode changes depending on the location of damage to the via electrode, the resistance value is also measured differently. That is, there may be a difference between the resistance value when the via electrode at the upper left corner of FIG. 6 is damaged and the resistance value when the via electrode at the lower center is damaged.

[0075] When a plurality of micro LEDs are distributed within a substrate (105), LED via electrodes for connecting each micro LED and the components on the back surface are formed at each location within the substrate (105). Therefore, if at least one of the plurality of via electrodes connected to the first electrode and the second electrode is damaged, it is highly likely that the surrounding LED via electrodes are also damaged.

[0076] Based on these facts, it can be assumed that the surrounding LED or LED via electrode and other wiring are also damaged based on the location of the damaged via electrode or electrode (110, 120). Meanwhile, regardless of the number of via holes, the number and formation location of the connecting electrodes can also be varied.

[0077] FIG. 7 is a front view illustrating a display module (100) according to another embodiment of the present disclosure. Referring to FIG. 7, the display module (100) according to another embodiment of the present disclosure may be provided such that a separate first-3 connecting electrode (1133) and a first-4 connecting electrode (1134) form a pair, just as a first-1 connecting electrode (1131) and a first-2 connecting electrode (1132) form a pair on a first surface (1) of a substrate (105).

[0078] In addition, separate first-5 connecting electrodes (1135) and first-6 connecting electrodes (1136) may be provided on the first surface (1) of the substrate (105) to connect the first internal electrode (112) and the first external electrode (111) independently.

[0079] Of course, on the second surface (2) of the substrate, electrodes of the same or similar shape as the first-1 connecting electrode (1131), first-2 connecting electrode (1132), first-3 connecting electrode (1133), first-4 connecting electrode (1134), first-5 connecting electrode (1135) and first-6 connecting electrode (1136) on the first surface (1) may also be provided.

[0080] As illustrated in FIG. 7, when a plurality of first connecting electrodes (1131 to 1136) are formed at various locations between the first external electrode (111) and the first internal electrode (112), a plurality of cells surrounded by electrodes are formed as the plurality of first connecting electrodes (1131 to 1136) connect the first external electrode (111) and the first internal electrode (112). If one of the plurality of sides constituting these cells is damaged or a crack occurs, a change in the total resistance value occurs. Based on this change in resistance, the damaged part can be precisely located throughout the substrate (105).

[0081] In FIG. 7, the first surface of the substrate (105), that is, the front portion, is shown, but a connecting electrode may also be formed at the same location on the second surface. However, this is not limited thereto, and while connecting electrodes are arranged at various locations as in FIG. 7 on the first surface, it may be implemented so that only a pair of connecting electrodes are arranged around the via electrode (130) on the second surface.

[0082] Meanwhile, in FIGS. 3 and 4, the first-1 connecting electrode (1131) and the first-2 connecting electrode (1132) and the second-1 connecting electrode (1231) and the second-2 connecting electrode (1232) are shown as being formed in a symmetrical structure with respect to each other, but are not necessarily limited thereto, and at least one of the various characteristics such as length, width, and height may be designed to be different from each other.

[0083] FIG. 8 is a front view illustrating a display module (100) according to another embodiment of the present disclosure. Referring to FIG. 8, the first-1 connecting electrode (1131) of the first connecting electrode (113) may be provided on one side centered on the via electrode (130). FIG. 8 illustrates a case where the first-1 connecting electrode (1131) and the first-2 connecting electrode (1132) are formed in an asymmetric structure. Specifically, the width (W1) of the first-1 connecting electrode (1131) and the width (W2) of the first-2 connecting electrode (1132) may be designed to be different from each other. Although FIG. 8 shows that only the width is designed to be different, various numerical values ​​such as length and thickness may be designed to be different in addition to the width.

[0084] In this way, if a pair of connecting electrodes are manufactured in an asymmetrical form, the resistance value when one of the pair of connecting electrodes is damaged differs from the resistance value when the other connecting electrode is damaged, so the damaged area can be identified based on the resistance value.

[0085] According to the various embodiments of the present disclosure as described above, defects can be quickly determined and addressed during the production process of the substrate (105) used in the display module (100). In the past, it was difficult to detect defects after via electrodes, etc., were manufactured on the substrate (105). Therefore, since defects were determined only after all subsequent processes were completed and testing of the display module (100) was conducted, there was a problem of consuming unnecessary resources and time; however, according to the various embodiments of the present disclosure, this problem can be solved. In addition, if an anti-static voltage is applied to some of the pads provided on the electrodes, damage caused by static electricity can be prevented. Static electricity can be a problem not only during the production process but also during the use process of the display module (100).

[0086] Accordingly, even after the production of the display module (100) or the display device (1000) described below is completed, an anti-static voltage can be applied to the pad at all times or periodically to prevent damage caused by static electricity. A display module (100) including a substrate (105) of the structure described in the various embodiments above can be combined with another display module (100) to form a single display device (1000), that is, a module (100) and a display device (1000). FIGS. 9 and 10 are schematic drawings illustrating the configuration of a display device (1000) according to an embodiment of the present disclosure. Referring to FIGS. 9 and 10, the display device (1000) may include a display module (100), a processor (200), a speaker (300), an input unit (400), a communication unit (500), and a memory (600).

[0087] A display module (100) of a display device (1000) may include a substrate (105), a first electrode (110), a second electrode (120), a via electrode (130), a first pad (140), a second pad (150), and a driver IC (160). Here, the first electrode (110) may include a first external electrode (111), a first internal electrode (112), and a first connecting electrode (113). The first connecting electrode (113) may include a first-1 connecting electrode (1131) and a first-2 connecting electrode (1132).

[0088] Additionally, the second electrode (120) may include a second external electrode (121), a second internal electrode (122), and a second connecting electrode (123). The first connecting electrode (113) may include a first-1 connecting electrode (1131) and a first-2 connecting electrode (1132).

[0089] The first electrode (110) of the display module (100) may be positioned along the edge of the first surface (1) of the substrate (105). Additionally, the second electrode (120) of the display module (100) may be positioned along the edge of the second surface (2) opposite the first surface (1) of the substrate (105). The via electrode (130) of the display module (100) may be provided to penetrate the substrate (105) and electrically connect the first electrode (110) and the second electrode (120).

[0090] The first pad (140) of the display module (100) may be provided to apply an electrostatic discharge prevention voltage to the second electrode (120). The first pad (140) may be provided in multiple locations. The second pad (150) of the display module (100) may serve to measure the resistance values ​​of the first electrode (110), the second electrode (120), and the via electrode (130). It serves as a medium for measuring the resistance values ​​of the second electrode (120) and the via electrode (130).

[0091] Here, the driver IC (160) of the display module (100) is placed on the second surface (2) of the substrate (105) and can be electrically connected to a plurality of first pads (140). In addition, the first external electrode (111) of the first electrode (110) can be arranged to form a closed curve along the edge of the first surface (1).

[0092] The first internal electrode (112) of the first electrode (110) may be arranged to form a closed curve of a predetermined shape at a position spaced apart from the first external electrode (111) on the first surface (1). The first internal electrode (112) of the display module (100) may be provided to be electrically connected to the via electrode (130).

[0093] In addition, the first connecting electrode (113) of the first electrode (110) can connect the first external electrode (111) and the first internal electrode (112) on both sides centered on the connection position between the via electrode (130) and the first internal electrode (112).

[0094] The first connecting electrode (113) may be provided in multiple numbers, such as the first-1 connecting electrode (1131) and the first-2 connecting electrode (1132). The second external electrode (121) of the second electrode (120) may be arranged to form a closed curve of a predetermined shape along the edge of the second surface (2).

[0095] The second inner electrode (122) of the second electrode (120) may be arranged to form a closed curve of a predetermined shape at a position spaced inward from the second outer electrode (121) on the second surface (2). This second inner electrode (122) may be provided to be electrically connected to the via electrode (130).

[0096] In addition, the second connecting electrode (123) of the second electrode (120) may be provided on both sides centered on the connection location between the via electrode (130) and the second internal electrode (122). These second connecting electrodes (123) may be provided in multiple numbers to connect the second external electrode (121) and the second internal electrode (122).

[0097] The display module (100) of the display device (1000) can be assembled and arranged as a single display module (100) or a plurality of display modules (100-1 to 100-N) of a matrix type.

[0098] The speaker (300) of the display device (1000) can output sound on the display device (1000). The speaker (300) may be provided in a part of the display device (1000), or it may be provided separately and physically separated from the display device (1000).

[0099] The input section (400) of the display device (1000) may include a button or a touch pad provided in one area of ​​the display device (1000). In addition, if the display panel is implemented as a touch screen, the input section (400) may include a touch pad provided on the front of the display panel.

[0100] The input unit (400) of the display device (1000) may also include a remote controller (700). The input unit (400) can receive various commands from a user to control the display device (1000), such as turning the power on / off, adjusting the volume, adjusting the channel, adjusting the screen, and changing various settings.

[0101] The communication unit (500) of the display device (1000) enables the display device (1000) to communicate with an external device. The communication unit (500) can communicate with a relay server or other electronic device to exchange necessary data.

[0102] The communication unit (500) of the display device (1000) may employ at least one of various wireless communication methods such as 3G (3rd Generation), 4G (4th Generation), Wireless LAN, Wi-Fi, Bluetooth, Zigbee, WFD (Wi-Fi Direct), UWB (Ultra wideband), infrared communication (IrDA; Infrared Data Association), BLE (Bluetooth Low Energy), NFC (Near Field Communication), and Z-Wave. In addition, it is also possible to employ wired communication methods such as PCI (Peripheral Component Interconnect), PCI-express, and USB (Universe Serial Bus).

[0103] Meanwhile, according to FIG. 9, display modules are arranged in four rows each in the horizontal and vertical directions, showing a state composed of a total of 16 display modules (100). The display device (1000) may display a single screen using all display modules (100), or may display multiple screens simultaneously by separating them by content or by area.

[0104] The processor (200) controls the overall operation of the display device (1000). The processor (200) can control the operation of each display module (100) when a plurality of display modules (100) are combined to form a single display device (1000). For example, when the display device (1000) is turned on, the processor (200) controls each display module so that the first electrode and the second electrode provided in each display module (100) can operate as an electrostatic barrier structure by means of an electrostatic prevention voltage. The electrostatic prevention voltage is applied through the first pad (140) described in the various embodiments described above, and can be applied to the first and second electrodes (110, 120) in total through via electrodes. The electrostatic prevention voltage can be applied by a driver IC (160) that is in electrical contact with the first pad (140) under the control of the processor (200), but is not necessarily limited thereto. That is, if an external pad electrically connected to the first pad (140) is provided in the driver IC (160), it may be applied according to the control of the processor (200) in an external control circuit that electrically contacts the external pad.

[0105] The timing controller (700) of the display device (1000) is linked with the processor (200) to control a plurality of display modules (100). The processor (200) and the timing controller (700) may be provided with at least one memory for storing a program and various data for performing the operation described later, and for executing the stored program.

[0106] The image data and control signals output from the processor (200) can be transmitted to the timing controller (700). The timing controller (700) converts the image data transmitted from the processor (200) into image data that can be processed by the driver IC (160). In addition, it can generate various control signals, such as timing control signals, necessary to display the image data on the display device (1000).

[0107] Referring to FIG. 10, the display device (1000) may include various configurations such as a display module (100), a processor (200), as well as a speaker (300), an input unit (400), a communication unit (500), and a memory (600).

[0108] As described above, since the display module (100) can be combined in various shapes and numbers, the processor (200) can adjust the aspect ratio of the image and scale it to correspond to the total number and shape of the display module (100) to generate a full screen image, and then display it through each display module.

[0109] The processor (200) can be implemented in various configurations such as a CPU (central processing unit), GPU (graphics processing unit), APU (accelerated processing unit), MIC (many integrated core), DSP (digital signal processor), NPU (neural processing unit).

[0110] The processor (200) can perform processing on image data. For example, the processor (200) may include an image decoder that performs decoding on image data and can perform various processing on the image data, such as scaling, noise filtering, frame rate conversion, resolution conversion, etc.

[0111] The processor (200) may be electrically connected to at least one timing controller (700) to control a plurality of display modules (100). The timing controller (700) is configured to control a plurality of display modules (100) in conjunction with the processor (200).

[0112] The processor (200) can transmit various data, such as video data and various control signals, to multiple display modules. Each display module (100) can display a large screen by displaying multiple divided images based on the video data. A driver IC provided in the display module (100) controls the driving state of each micro LED mounted on the substrate (105) on a video frame basis, according to the control of the timing controller (700).

[0113] The speaker (300) is configured to output an audio signal included in the content. The processor (200) demultiplexes the content to obtain audio data and decodes the audio data to obtain an audio signal. The processor (200) can control the speaker (300) to output an audio signal synchronized with the display timing of the video frame.

[0114] The communication unit (500) is configured to perform communication with various external sources that provide content to be displayed. The communication interface (500) includes circuitry. The external sources can be various, such as a web server, set-top box, PC, game player, media player, broadcasting station, etc.

[0115] The communication unit (500) may include a wireless communication module or a wired communication module. Each communication module may be implemented in the form of at least one hardware chip. For example, the wireless communication module may include at least one of a Wi-Fi module, a Bluetooth module, or an infrared communication module. However, it is not limited to this example, and the wireless communication module may include a communication module that communicates according to various wireless communication standards such as LTE (Long Term Evolution), LTE-A (LTE Advanced), 4G (4th Generation), 5G (5th Generation), etc.

[0116] The wired communication module may include at least one of a LAN (Local Area Network) module and an Ethernet module. Additionally, the wired communication module may include at least one wired interface among HDMI (High Definition Multimedia Interface), USB (Universal Serial Bus), USB Type-C, and DP (Display Port).

[0117] The memory (600) may store data necessary for the display device (1000) to operate according to an embodiment of the present disclosure. One or more instructions may be stored in the memory (600). For example, instructions set to apply an electrostatic discharge protection voltage at a preset timing may be stored. Additionally, programs, applications, and data for operating the modular display device (100) may be stored in the memory (600). Depending on the purpose of data storage, the memory (600) may be implemented as a memory embedded in the display device (1000) (e.g., volatile memory, non-volatile memory, hard drive, or solid-state drive, etc.) or as a memory that can be attached to and detached from the display device (1000) (e.g., memory card, external memory, etc.).

[0118] Although the display device has been illustrated and described above as being equipped with one processor (200) and one memory (600), the number of processors (200) and memory (600) may vary, and the two components may be integrated into a single component. Additionally, a processor and memory may be embedded in each display module.

[0119] FIG. 11 is a block diagram illustrating the configuration of a display module inspection system (2000) according to one embodiment of the present disclosure. FIG. 12 and FIG. 13 are drawings illustrating the operation of a display module inspection system (2000) according to one embodiment of the present disclosure.

[0120] FIG. 11 is a block diagram illustrating the configuration of a display module inspection system (2000) according to one embodiment of the present disclosure. FIG. 12 and FIG. 13 are drawings illustrating the operation of a display module inspection system (2000) according to one embodiment of the present disclosure.

[0121] The display module inspection system (2000) of FIG. 11 may be provided together with various production facilities in a factory and other production environment that produces the display module (100). Referring to FIG. 11, FIG. 12 and FIG. 13, the display inspection system (2000) may include a first processing unit (1100), an inspection unit (1200), a second processing unit (1300), a handling unit (1600), and a processor (1400).

[0122] The first processing unit (1100) and the second processing unit (1300) are configured to sequentially or in parallel integrate electrode patterns, via electrodes, micro LEDs, driver ICs, and various components on a substrate (105).

[0123] The handling unit (1600) is configured to perform operations such as gripping an object to be processed and moving its position or changing its posture. The handling unit (1600) may include a conveyor belt, a robot arm, a gripper, a jig, etc.

[0124] In each processing step, the substrate (105) can be moved by the handling unit (1600). For convenience of explanation, two processing units (1100, 1300) are shown, but the number of processing units may vary. The processor (1400) can control each processing unit to produce a display module (100).

[0125] Specifically, when the first processing unit (1100) receives the object (50), i.e., the substrate (105), it stacks and patterns a metal material to produce the first electrode (110), the second electrode (120), the second-1 pad (151), and the second-2 pad (152), and produces a via electrode (130) that penetrates the substrate (105). A detailed description and illustration of the manufacturing process of each component is omitted.

[0126] The processed product produced by the first processing unit (1100) is provided to the second processing unit (1300). The second processing unit (1300) can perform processes such as integrating a driver IC (160), an optical film, etc.

[0127] After various electrodes and via electrodes are manufactured by the first processing unit (1100), an inspection operation can be performed to determine whether the electrodes are damaged.

[0128] The inspection unit (1200) is configured to perform inspection work. The inspection work may be performed immediately after the work of the first processing unit (1100) is completed, or it may be performed after the work of the second processing unit (1300) is completed.

[0129] The inspection unit (1200) includes a resistance measurement sensor. The resistance measurement sensor includes two measurement pins. The inspection unit (1200) contacts the measurement pins to the second pads (151, 152) on the substrate (105) that has been processed in the first processing unit (1100) or the second processing unit (1300). For example, if the structure is such that various processing operations are performed while the substrate (105) is loaded onto a conveyor belt and moved, the measurement pins can be moved to the location where the second pads (151, 152) are placed during the movement process to automatically make contact. However, this is not limited thereto, and the measurement pins can also be made to the second pads (151, 152) of the substrate (105) using a robot arm, etc. Alternatively, personnel in charge of inspection may manually make contact with the measurement pins. The resistance measurement sensor detects the resistance between the two measurement pins. Resistance detection can be performed in various ways. For example, a voltage of a certain magnitude can be applied using two measuring pins, and the magnitude of the current output through the measuring pins can be sensed to calculate the resistance value, but this is not necessarily limited to this.

[0130] The inspection unit (120) provides the inspection result to the processor (1400). The processor (1400) compares the inspection result, that is, the measured resistance value, with the resistance value recorded in a previously stored database. The database records resistance values ​​measured for various states, such as the resistance value measured for a substrate in a normal state, the resistance value measured when a specific part of the first electrode is damaged, the resistance value measured when a specific part of the second electrode is damaged, and the resistance value measured when the via electrode is damaged, and can be stored in a memory provided integrally with the processor (1400) or in an external memory.

[0131] If the measured resistance value matches the resistance value measured for a substrate in a normal state within an error range, the processor (1400) recognizes it as a normal situation and can continue the production process. On the other hand, if the resistance value matches the resistance value measured for a non-normal state within an error range, it can be determined that a specific part of the substrate (105) currently being inspected is damaged. Accordingly, the processor (1400) can pick up and discard the substrate (105). Meanwhile, if the damaged part can be easily repaired, the processor (1400) may pick up the substrate (105) and control the first processing unit (1100), the second processing unit (1300), or other processing units to perform a repair process. Alternatively, if it is determined that the part does not significantly affect the performance of the display module, the processor (1400) may continue the process on the substrate (105).

[0132] Meanwhile, if the inspection unit (1200) is not merely a configuration containing only a resistance measurement sensor, but is a terminal device equipped with a memory and a processor that store the aforementioned database, the state may be determined by comparing the resistance value directly measured by the inspection unit (1200) with the values ​​in the database. In this case, if the inspection unit (1200) determines that the state is not normal, it transmits an error signal to the processor (1400). When the processor (1400) receives the error signal, it may pick up the corresponding board and discard or repair it as described above.

[0133] Meanwhile, although the above embodiment describes an operation to inspect for damage using the second pad, an electrostatic discharge prevention voltage may be continuously applied using the first pad while the production or inspection process is being performed. In this case, damage caused by static electricity that may occur during the production or inspection process can be prevented in advance.

[0134] Although various embodiments of the present disclosure have been described individually above, each embodiment is not required to be implemented alone, and the configuration and operation of each embodiment may be implemented in combination with at least one other embodiment.

[0135] Furthermore, although preferred embodiments of the present disclosure have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications can be made by those skilled in the art without departing from the gist of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical spirit or perspective of the present disclosure.

Claims

1. Substrate; A first electrode disposed along the edge of the first surface of the substrate; A second electrode disposed along the edge of a second surface opposite to the first surface of the substrate; A via electrode penetrating the substrate and electrically connecting the first electrode and the second electrode; A plurality of first pads for applying an electrostatic discharge prevention voltage to the second electrode; and A display module comprising: a plurality of second pads for measuring the resistance values ​​of the first electrode, the second electrode, and the via electrode.

2. In Paragraph 1, A display module further comprising a driver IC disposed on the second surface of the substrate and electrically connected to the plurality of first pads.

3. In Paragraph 1, The first electrode above is, A first external electrode positioned to form a closed curve along the edge of the first surface; A first internal electrode disposed to form a closed curve at a position spaced inwardly from the first external electrode on the first surface and electrically connected to the via electrode; and A display module comprising: a first connecting electrode connecting the first external electrode and the first internal electrode.

4. In Paragraph 3, The second electrode above is, A second external electrode positioned to form a closed curve along the edge of the second surface; A second internal electrode disposed to form a closed curve at a position spaced inwardly from the second external electrode on the second surface and electrically connected to the via electrode; and A display module comprising: a second connecting electrode connecting the second external electrode and the second internal electrode.

5. In Paragraph 4, A display module comprising a plurality of via electrodes distributed along the first internal electrode and the second internal electrode.

6. In Paragraph 5, The plurality of first connecting electrodes includes a first-1 connecting electrode and a first-2 connecting electrode arranged on both sides centered on the connection position between the via electrode and the first internal electrode, and The above plurality of second connecting electrodes are, A display module comprising a second-1 connecting electrode and a second-2 connecting electrode arranged on both sides centered on the connection position between the via electrode and the second internal electrode.

7. In Paragraph 6, At least one of the length, width, and thickness of the above-mentioned first-1 connecting electrode is different from the above-mentioned first-2 connecting electrode, and A display module in which at least one of the length, width, and thickness of the above-mentioned 2-1 connecting electrode is different from the above-mentioned 2-2 connecting electrode.

8. In Paragraph 4, The first connecting electrode comprises a plurality of first connecting electrodes that electrically connect a plurality of points of the first external electrode and a plurality of points of the first internal electrode, respectively. The second connecting electrode comprises a plurality of second connecting electrodes that electrically connect a plurality of points of the second external electrode and a plurality of points of the second internal electrode, respectively. A display module in which the resistance value between the plurality of second pads is changed differently depending on the damage state of the first electrode, the second electrode, the first connecting electrode, the second connecting electrode and the via electrode.

9. In a display device, Display module; and Includes a processor; The above display module is, Substrate; A first electrode disposed along the edge of the first surface of the substrate; A second electrode disposed along the edge of a second surface opposite to the first surface of the substrate; A via electrode penetrating the substrate and electrically connecting the first electrode and the second electrode; A plurality of first pads for applying an electrostatic discharge prevention voltage to the second electrode; It includes a plurality of second pads for measuring the resistance values ​​of the first electrode, the second electrode, and the via electrode; The above processor is, A display device that controls the display module so that when the display device is turned on, the first electrode and the second electrode operate as an electrostatic barrier structure by the electrostatic prevention voltage.

10. In Paragraph 9, The above display module is, Further comprising a driver IC disposed on the second surface of the substrate and electrically connected to the plurality of first pads; A display device in which the above driver IC applies the electrostatic discharge prevention voltage to the plurality of first pads according to the control of the above processor.

11. In Paragraph 9, The first electrode above is, A first external electrode positioned to form a closed curve along the edge of the first surface; A first internal electrode disposed to form a closed curve at a position spaced inwardly from the first external electrode on the first surface and electrically connected to the via electrode; and It includes a first connecting electrode that connects the first external electrode and the first internal electrode, and The second electrode above is, A second external electrode positioned to form a closed curve along the edge of the second surface; A second internal electrode disposed to form a closed curve at a position spaced inwardly from the second external electrode on the second surface and electrically connected to the via electrode; and A display device comprising a second connecting electrode that connects the second external electrode and the second internal electrode.

12. In Paragraph 11, A display device comprising a plurality of via electrodes distributed along the first internal electrode and the second internal electrode.

13. In Paragraph 12, The first connecting electrode above is, It includes a first-1 connecting electrode and a first-2 connecting electrode arranged on both sides centered on the connection position of the via electrode and the first internal electrode, and The second connecting electrode above is, A display device comprising a second-1 connecting electrode and a second-2 connecting electrode arranged on both sides centered on the connection position of the via electrode and the second internal electrode.

14. In Paragraph 13, At least one of the length, width, and thickness of the above-mentioned first-1 connecting electrode is different from the above-mentioned first-2 connecting electrode, and A display device in which at least one of the length, width, and thickness of the above-mentioned 2-1 connecting electrode is different from the above-mentioned 2-2 connecting electrode.

15. In Paragraph 11, The first connecting electrode comprises a plurality of first connecting electrodes that electrically connect a plurality of points of the first external electrode and a plurality of points of the first internal electrode, respectively. The second connecting electrode comprises a plurality of second connecting electrodes that electrically connect a plurality of points of the second external electrode and a plurality of points of the second internal electrode, respectively. A display device in which the resistance value between the plurality of second pads is changed differently depending on the damage state of the first electrode, the second electrode, the first connecting electrode, the second connecting electrode and the via electrode.

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