Light-emitting substrate and lamp panel

Abstract

A light-emitting substrate, comprising a base, a pad unit, a ground wire, a ground jumper wire, and a lighting control wire, the pad unit, the ground wire, the ground jumper wire and the lighting control wire being located at one side of the base. The ground jumper wire and the lighting control wire are located in the same layer, and are located on the side of the ground wire facing away from the base. An orthographic projection of the ground wire onto the base is located on at least one side of an orthographic projection of the pad unit onto the base, the orthographic projections of the ground wire and the pad unit onto the base being arranged along a first direction, and the ground wire extending along a second direction. The pad unit comprises a first pad and a second pad, the first pad and the second pad being arranged along the second direction. The lighting control wire is electrically connected to the first pad, and the ground jumper wire is electrically connected to the second pad and the ground wire. The lighting control wire and the ground jumper wire are disposed at an interval along the second direction, the first direction and the second direction intersecting.

Description

Light-emitting substrate and lamp panel TECHNICAL FIELD

[0001] The embodiments of the present disclosure belong to the technical field of display, and particularly relate to a light-emitting substrate and a lamp panel. BACKGROUND

[0002] MiniLED is a kind of LED (Light-Emitting Diode) technology, and the size of a MiniLED chip is between 50-300 microns. The MiniLED lamp panel has been widely concerned due to its self-luminous, low power consumption, thinness, bright colors, high contrast, fast response rate and other advantages.

[0003] SUMMARY

[0004] In a first aspect, the embodiments of the present disclosure provide a light-emitting substrate, comprising a substrate, a pad unit, a ground wire, a switching ground wire and a light-emitting control wire, wherein the pad unit, the ground wire, the switching ground wire and the light-emitting control wire are located on one side of the substrate.

[0005] The switching ground wire and the light-emitting control wire are located on the same layer and on the side of the ground wire away from the substrate.

[0006] The orthographic projection of the ground wire on the substrate is located on at least one side of the orthographic projection of the pad unit on the substrate, the orthographic projection of the ground wire and the pad unit on the substrate is arranged along a first direction, and the ground wire extends along a second direction.

[0007] The pad unit comprises a first pad and a second pad, and the first pad and the second pad are arranged along the second direction.

[0008] The light-emitting control wire is electrically connected to the first pad.

[0009] The switching ground wire is electrically connected to the second pad and the ground wire.

[0010] The light-emitting control wire and the switching ground wire are arranged at intervals along the second direction.

[0011] The first direction and the second direction intersect.

[0012] In some embodiments, the first pad has at least one,

[0013] The light-emitting control wire has at least one,

[0014] The light-emitting control wire and the first pad are electrically connected one by one.

[0015] The second pad has at least one,

[0016] The first pad is located on the same side of the pad unit in orthographic projection on the substrate.

[0017] At least two ground wires are located on the same side of the pad unit in orthographic projection on the substrate.

[0018] In some embodiments, the first pad comprises at least a first first pad,

[0019] The second pad comprises at least a first second pad,

[0020] The light-emitting control line comprises a first control line, the first control line and the relay ground wire are arranged along the second direction, and the first control line is electrically connected to the first first pad.

[0021] The first control line comprises a first subpart and a second subpart, the first subpart and the second subpart are arranged in sequence along the first direction away from the first first pad, the first subpart extends along the second direction away from the first first pad and has one end electrically connected to the first first pad, and the second subpart extends along the first direction and is electrically connected to the other end of the first subpart.

[0022] The ground wire comprises a first ground wire and a second ground wire, the first ground wire and the second ground wire are located on the same side of the pad unit in orthographic projection on the substrate, and the first ground wire is located farther away from the pad unit in orthographic projection on the substrate than the second ground wire.

[0023] The relay ground wire comprises a first part and a second part, the first part and the second part are electrically connected,

[0024] The first part is located between the first ground wire and the second ground wire in orthographic projection on the substrate, and the first part is electrically connected to the first ground wire and the second ground wire respectively.

[0025] The second part is located between the second ground wire and the first second pad in orthographic projection on the substrate, or the second part is extended from between the second ground wire and the first second pad in orthographic projection on the substrate to between the first ground wire and the second ground wire in orthographic projection on the substrate, and the second part is electrically connected to the first second pad.

[0026] In some embodiments, the first pad further comprises a second first pad, a normal projection of the second first pad and the first first pad on the substrate is mirror-symmetrical with a normal projection of the first second pad on the substrate as a center of symmetry;

[0027] The light-emitting control line further comprises a second control line, the second control line is located on a side of the relay ground line away from the first control line, and the second control line is electrically connected to the second first pad;

[0028] The second control line comprises a third sub-portion, the third sub-portion extends along the first direction, and one end of the third sub-portion is electrically connected to the second first pad.

[0029] In some embodiments, the first portion extends along the first direction,

[0030] The second portion extends along a third direction,

[0031] The first direction is perpendicular to the second direction, and the third direction intersects the first direction at a first acute angle;

[0032] The second portion is located on a side of the first portion close to the third sub-portion;

[0033] The first sub-portion and the second portion have a minimum distance between the relay ground line and the light-emitting control line.

[0034] In some embodiments, a line width of the first portion is at least 2 times a line width of the second portion;

[0035] The first portion and the first ground line and the second ground line are electrically connected at positions provided with vias, a number of the vias at a position where the first portion is electrically connected to the first ground line is greater than a number of the vias at a position where the first portion is electrically connected to the second ground line;

[0036] A distance between the first portion and the third sub-portion is greater than a distance between the first portion and the second sub-portion.

[0037] In some embodiments, a line width of the first portion is equal to a line width of the second portion;

[0038] The first portion and the first ground line and the second ground line are electrically connected at positions provided with vias,

[0039] A number of the vias at a position where the first portion is electrically connected to the first ground line is greater than a number of the vias at a position where the first portion is electrically connected to the second ground line;

[0040] An absolute value of a difference between the distance between the first portion and the third sub-portion and the distance between the first portion and the second sub-portion is 20-100 μm.

[0041] In some embodiments, a line width of the first portion is equal to a line width of the second portion.

[0042] A position where the first portion is electrically connected with the first ground wire and the second ground wire is provided with a via hole,

[0043] A number of the via holes at the position where the first portion is electrically connected with the first ground wire is greater than a number of the via holes at the position where the first portion is electrically connected with the second ground wire.

[0044] The distance between the first portion and the third sub-portion is greater than the distance between the first portion and the second sub-portion.

[0045] In some embodiments, the first portion extends along the first direction, and the second portion extends along the first direction,

[0046] The distance between the second portion and the first sub-portion is equal to the distance between the second portion and the third sub-portion, and is a minimum distance between the transfer ground wire and the light-emitting control wire.

[0047] In some embodiments, the line width of the first portion is at least 2 times the line width of the second portion.

[0048] In some embodiments, the second portion is located at a side of the first portion close to the third sub-portion.

[0049] The distance between the first portion and the third sub-portion is greater than the distance between the first portion and the second sub-portion.

[0050] In some embodiments, the line width of the first portion is at least 3 times the line width of the second portion.

[0051] In some embodiments, the distance between the first portion and the third sub-portion is equal to the distance between the second portion and the third sub-portion.

[0052] And the distance between the first portion and the third sub-portion is less than the distance between the first portion and the second sub-portion.

[0053] In some embodiments, the first pad further comprises a third first pad, and the third first pad and the first first pad are arranged along the first direction.

[0054] The second pad further comprises a second second pad, the second second pad and the first second pad are arranged along the first direction;

[0055] The light-emitting control line further comprises a third control line, the third control line is electrically connected to the third first pad;

[0056] The third control line comprises a fourth sub-portion and a fifth sub-portion, the fourth sub-portion and the fifth sub-portion are electrically connected,

[0057] The fourth sub-portion and the first sub-portion are mirror-symmetric with the pad unit as a center of symmetry in orthographic projection on the substrate; the fifth sub-portion and the second sub-portion are mirror-symmetric with the pad unit as a center of symmetry in orthographic projection on the substrate;

[0058] The ground wire further comprises a third ground wire and a fourth ground wire, the third ground wire and the second ground wire are mirror-symmetric with the pad unit as a center of symmetry in orthographic projection on the substrate, the fourth ground wire and the first ground wire are mirror-symmetric with the pad unit as a center of symmetry in orthographic projection on the substrate;

[0059] The adapter ground wire further comprises a third portion and a fourth portion, the third portion and the fourth portion are electrically connected,

[0060] The third portion and the second portion are mirror-symmetric with the pad unit as a center of symmetry in orthographic projection on the substrate,

[0061] The third portion is electrically connected to the second second pad and the second portion respectively;

[0062] The fourth portion and the first portion are mirror-symmetric with the pad unit as a center of symmetry in orthographic projection on the substrate,

[0063] The fourth portion is electrically connected to the third ground wire and the fourth ground wire respectively.

[0064] In some embodiments, the first pad further comprises a fourth first pad, the fourth first pad and the third first pad are mirror-symmetric with the second second pad as a center of symmetry in orthographic projection on the substrate;

[0065] The light-emitting control line further comprises a fourth control line, the fourth control line comprises a sixth sub-portion, the sixth sub-portion is electrically connected to the fourth first pad,

[0066] The normal projection of the sixth sub-portion and the third sub-portion on the substrate is mirror-symmetrical with the normal projection of the pad unit on the substrate as a center.

[0067] In some embodiments, the first acute angle is in the range of arctanF / D≤α≤15°;

[0068] wherein α is the first acute angle; F is the maximum distance between the side of the first portion close to the third sub-portion and the side of the second portion close to the third sub-portion; and D is the distance between the side of the first portion away from the first sub-portion and the first sub-portion.

[0069] In some embodiments, the third portion extends in a fourth direction, and the fourth direction intersects the first direction to form a second acute angle;

[0070] The fourth sub-portion and the third portion have the minimum distance therebetween;

[0071] The second acute angle is in the range of arctanF' / E≤α'≤15°;

[0072] wherein α' is the second acute angle; F' is the maximum distance between the side of the fourth portion close to the sixth sub-portion and the side of the third portion close to the sixth sub-portion; and E is the distance between the side of the fourth portion away from the fourth sub-portion and the fourth sub-portion.

[0073] In some embodiments, α=α' and F=F';

[0074] When D>E, arctanF / D≤α≤15°;

[0075] When D=E, arctanF / D≤α≤15°;

[0076] When D

[0077] In some embodiments, the minimum distance between the normal projection of the light-emitting control line and the normal projection of the adapter ground line on the substrate is 0.5-0.8 times the width dimension of the first pad or the second pad.

[0078] In some embodiments, the minimum distance is in the range of 86-89 μm.

[0079] In some embodiments, the pad unit, the adapter ground line and the light-emitting control line are located in the same layer,

[0080] The light-emitting substrate further comprises a first insulating layer located on a side of the pad unit, the adapter ground line and the light-emitting control line away from the substrate;

[0081] A plurality of openings are formed in the first insulating layer, a part of the openings have a projection on the substrate within a projection area of the light-emitting control line on the substrate, the light-emitting control line is exposed at the part of the openings and the exposed part serves as the first pad;

[0082] Another part of the openings have a projection on the substrate within a projection area of the adapter ground line on the substrate, the adapter ground line is exposed at the part of the openings and the exposed part serves as the second pad;

[0083] The width of the area where the light-emitting control line located at the four edges of the first pad and the first insulating layer have a projection on the substrate is more than 10 μm;

[0084] The width of the area where the adapter ground line located at the four edges of the second pad and the first insulating layer have a projection on the substrate is more than 10 μm.

[0085] In some embodiments, the distance between the first part and the third subpart ranges from 267 μm to 327 μm;

[0086] The distance between the first part and the second subpart ranges from 129 μm to 157 μm;

[0087] The line width of the first part ranges from 370 μm to 478 μm.

[0088] In some embodiments, the distance between the first part and the third subpart ranges from 267 μm to 327 μm;

[0089] The distance between the first part and the second subpart ranges from 307 μm to 367 μm;

[0090] The line width of the first part ranges from 160 μm to 280 μm.

[0091] In some embodiments, the distance between the first part and the third subpart ranges from 477 μm to 537 μm;

[0092] The distance between the first part and the second subpart ranges from 129 μm to 157 μm;

[0093] The line width of the first part ranges from 160 μm to 280 μm.

[0094] In some embodiments, the distance between the first part and the second subpart ranges from 307 μm to 367 μm;

[0095] The line width of the first portion ranges from 398 to 458 μm.

[0096] In some embodiments, the distance between the first portion and the second sub-portion ranges from 129 to 157 μm;

[0097] The line width of the first portion ranges from 576 to 668 μm.

[0098] In some embodiments, further comprising a power line, a first clock line, a second clock line and a data line, which are located in the same layer as the ground lines;

[0099] The power line, the first clock line, the second clock line and the data line respectively extend along the second direction,

[0100] The orthogonal projection of the power line on the substrate is located between the orthogonal projections of the first ground line and the second ground line on the substrate;

[0101] The orthogonal projection of the first clock line on the substrate is located between the orthogonal projections of the second ground line and the pad unit on the substrate;

[0102] The orthogonal projection of the second clock line on the substrate is located between the orthogonal projections of the pad unit and the third ground line on the substrate;

[0103] The orthogonal projection of the data line on the substrate is located between the orthogonal projections of the third ground line and the fourth ground line on the substrate;

[0104] The pad unit further comprises a third pad, a fourth pad, a fifth pad and a sixth pad, which are located on the side of the orthogonal projection of the first pad on the substrate away from the orthogonal projection of the second pad on the substrate;

[0105] The power line is electrically connected to the third pad,

[0106] The first clock line is electrically connected to the fourth pad,

[0107] The second clock line is electrically connected to the fifth pad,

[0108] The data line is electrically connected to the sixth pad.

[0109] In some embodiments, the line width of the first ground line is greater than the line width of the second ground line;

[0110] The line width of the fourth ground line is greater than the line width of the third ground line;

[0111] The line width of the third ground line is greater than the line width of the second ground line.

[0112] In a second aspect, the present disclosure also provides a lamp panel, comprising the light-emitting substrate as described above.

[0113] The lamp panel further comprises a driving circuit and at least one lamp area, the driving circuit being electrically connected to the pad unit in the light-emitting substrate, and the lamp area being electrically connected to the light-emitting control line and the light-emitting control bus in the light-emitting substrate.

[0114] The driving circuit comprises at least one first driving end,

[0115] The lamp area comprises a plurality of lamp beads, and the light-emitting control line is connected in series to the plurality of lamp beads in the lamp area.

[0116] One end of the light-emitting control line is electrically connected to the first driving end, and the other end is electrically connected to the light-emitting control bus. BRIEF DESCRIPTION OF DRAWINGS

[0117] The accompanying drawings are included to provide a further understanding of embodiments of the present disclosure and are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and serve to explain the principles of the present disclosure, and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent from the detailed description of the specific embodiments described below, taken in conjunction with the accompanying drawings, in which:

[0118] FIG. 1a is a schematic diagram of the wiring of a MiniLED lamp panel near a driving chip in the related art.

[0119] FIG. 1b is a schematic diagram of the cross section of double-layer copper wiring in the related art.

[0120] FIG. 1c is a schematic diagram of corrosion occurring at the edges of adjacent LED wiring and GND wiring in the related art.

[0121] FIG. 2a is a wiring diagram around a pad unit in a light-emitting substrate according to an embodiment of the present disclosure.

[0122] FIG. 2b is an enlarged top view of part A in FIG. 2a.

[0123] FIG. 2c is a structural cross-sectional view along the BB' section line in FIG. 2b.

[0124] FIG. 2d is an enlarged top view of the position of a pad unit in a light-emitting substrate according to an embodiment of the present disclosure.

[0125] FIG. 2e is a structural cross-sectional view along the CC' section line in FIG. 2a.

[0126] FIG. 3 is another wiring diagram around a pad unit in a light-emitting substrate according to an embodiment of the present disclosure.

[0127] FIG. 4 is still another wiring diagram around a pad unit in a light-emitting substrate according to an embodiment of the present disclosure.

[0128] FIG. 5a is another wiring diagram around the pad unit in the light-emitting substrate according to an embodiment of the present disclosure.

[0129] FIG. 5b is another wiring diagram around the pad unit in the light-emitting substrate according to an embodiment of the present disclosure.

[0130] FIG. 5c is another wiring diagram around the pad unit in the light-emitting substrate according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0131] In order for those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, a light-emitting substrate and a lamp panel provided by the embodiments of the present disclosure are further described in detail below with reference to the drawings and specific embodiments.

[0132] The embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, but the embodiments shown can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0133] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configuration formed based on the manufacturing process. Therefore, the regions exemplified in the drawings have a schematic property, and the shape of the regions shown in the drawings exemplifies the specific shape of the regions, but is not intended to be restrictive.

[0134] In the related art, one driving chip (IC) in a MiniLED lamp panel drives multiple lamp regions, and multiple MiniLED lamps are connected in series in one lamp region. The MiniLED lamp panel usually adopts a single-layer copper wiring design, but for a glass-based MiniLED lamp panel with a narrow frame and high partition (i.e., a large number of lamp regions), due to the limited in-plane space, a double-layer copper wiring process needs to be used to manufacture the in-plane driving lines. Referring to FIG. 1a, it is a wiring schematic diagram of a MiniLED lamp panel in the related art near the driving chip; the wiring near the driving chip of the MiniLED lamp panel is relatively dense, and during multiple product reliability tests, it is found that the current wiring design still has defects, and the product reliability capability is insufficient.

[0135] Referring to FIG. 1b, it is a cross-sectional schematic diagram of a double-layer copper wiring; the MiniLED lamp panel with double-layer copper wiring is provided with Cu1 and Cu2 layers of wiring on the substrate. The Cu2 layer of wiring is located at the upper layer, and only the topmost PVX protective layer (part of the product is the PVX protective layer and the OC layer) covers it, and its reliability capability is directly related to the thickness of the topmost PVX protective layer. When the thickness of the PVX protective layer is constant, it is found in the reliability test that the PVX protective layer cannot completely isolate water vapor, and the entry of water vapor will cause corrosion of the Cu2 layer of wiring.

[0136] Referring to FIG. 1a, the LED trace (a trace for controlling the light area switch) and the GND trace (a ground trace) are both Cu2 layer traces and adjacent to each other, the Data trace and the Clock trace are also both Cu2 layer traces and connected in series between the driving chips (ICs) in the same column, and the VDD is a Cu2 layer trace and supplies power to the driving chips (ICs) in the same column (the driving chips in the same column are connected in parallel to the VDD). The minimum distance e between the LED trace and the GND trace is 51 microns, the distance is small, there is a great risk of Cu corrosion migration short circuit, and part of the corrosion will occur at the edges of the adjacent LED trace and the GND trace. Referring to FIG. 1c, it is a schematic diagram of the corrosion occurring at the edges of the adjacent LED trace and the GND trace in the related art. Because there is a large potential difference between the GND trace and the LED trace and the trace distance is small (the current distance is 51 microns), the corrosion will be aggravated and migration will occur, which will eventually lead to a short circuit between the GND trace and the LED trace, and further lead to the Mini LED lamp panel having a light area explosion failure.

[0137] In order to solve the problem of corrosion migration short circuit caused by the small distance and large potential difference between the GND trace and the LED trace in the same layer in the related art, in a first aspect, the embodiments of the present disclosure provide a light-emitting substrate. Referring to FIGS. 2a, 2b and 2c, FIG. 2a is a wiring diagram around a pad unit in the light-emitting substrate, FIG. 2b is an enlarged top view schematic diagram of part A in FIG. 2a, and FIG. 2c is a structural sectional view along the BB' section line in FIG. 2b. The light-emitting substrate includes a substrate 1, a pad unit 2, a ground wire 3, a switching ground wire 4 and a light-emitting control wire 5. The pad unit 2, the ground wire 3, the switching ground wire 4 and the light-emitting control wire 5 are located on one side of the substrate 1. The switching ground wire 4 and the light-emitting control wire 5 are located on the same layer and on the side of the ground wire 3 away from the substrate 1. The orthogonal projection of the ground wire 3 on the substrate 1 is located on at least one side of the orthogonal projection of the pad unit 2 on the substrate 1. The orthogonal projections of the ground wire 3 and the pad unit 2 on the substrate 1 are arranged along a first direction X, and the ground wire 3 extends along a second direction Y. The pad unit 2 includes a first pad 20 and a second pad 21, and the first pad 20 and the second pad 21 are arranged along the second direction Y. The light-emitting control wire 5 is electrically connected to the first pad 20. The switching ground wire 4 is electrically connected to the second pad 21 and the ground wire 3. The light-emitting control wire 5 and the switching ground wire 4 are arranged at intervals along the second direction Y. The first direction X and the second direction Y intersect.

[0138] In some embodiments, the minimum distance between the orthogonal projections of the light-emitting control wire 5 and the switching ground wire 4 on the substrate 1 is 0.5-0.8 times the width dimension of the first pad 20 or the second pad 21.

[0139] In some embodiments, referring to FIG. 2a, the pad unit 2 is a set of pads (e.g., the first pad 20 and the second pad 21) for electrically connecting a driving circuit (i.e., a driving chip IC, not shown in the figure) and circuit traces (e.g., the ground line 3, the relay ground line 4, and the light-emitting control line 5). The pad unit 2 includes a plurality of pads. The pad is an electrode for electrically connecting the driving circuit and the circuit traces. The light-emitting substrate includes at least one light area 6, and a plurality of light-emitting elements 60 in each light area 6 are connected in series. The light-emitting control line 5 includes at least one, and each light-emitting control line 5 is electrically connected to all the light-emitting elements 60 in one light area 6. One end of the light-emitting control line 5 is electrically connected to the first pad 20, and the other end of the light-emitting control line 5 is electrically connected to the light-emitting control bus 7. The driving circuit controls the opening and closing of each light area 6 through the light-emitting control line 5, and the driving circuit is electrically connected to the ground line 3 through the relay ground line 4.

[0140] In some embodiments, the relay ground line 4 and the light-emitting control line 5 are located in the same layer, which means that the relay ground line 4 and the light-emitting control line 5 are formed at the same time through a one-time patterning process, or the relay ground line 4 and the light-emitting control line 5 are located on the same film layer in the direction perpendicular to the substrate 1.

[0141] In some embodiments, the width dimension of the first pad 20 or the second pad 21 refers to the dimension of the first pad 20 or the second pad 21 along the second direction Y. The dimension of the first pad 20 or the second pad 21 along the second direction Y is less than or equal to the dimension of the first pad 20 or the second pad 21 along the first direction X.

[0142] In some embodiments, the width dimension of the first pad 20 or the second pad 21 ranges from 120 μm to 156 μm. In some embodiments, the minimum distance between the orthographic projection of the light-emitting control line 5 and the relay ground line 4 on the substrate 1 ranges from 60 μm or more.

[0143] In some embodiments, the minimum distance between the orthographic projection of the light-emitting control line 5 and the relay ground line 4 on the substrate 1 ranges from 86 μm to 89 μm.

[0144] In some embodiments, referring to FIG. 2c, the pad unit 2, the adapter ground line 4 and the light-emitting control line 5 are located on the same layer, and the light-emitting substrate further comprises a first insulating layer 8 located on a side of the pad unit 2, the adapter ground line 4 and the light-emitting control line 5 away from the substrate 1; a plurality of openings 80 are formed in the first insulating layer 8, a part of the openings 80 has a projection on the substrate 1 located in a projection area of the light-emitting control line 5 on the substrate 1, and the light-emitting control line 5 is exposed at the part of the openings 80 and the exposed part serves as a first pad 20; another part of the openings 80 has a projection on the substrate 1 located in a projection area of the adapter ground line 4 on the substrate 1, and the adapter ground line 4 is exposed at the part of the openings 80 and the exposed part serves as a second pad 21.

[0145] In some embodiments, referring to FIG. 2c, the pad unit 2, the adapter ground line 4 and the light-emitting control line 5 are located on the same layer, and the light-emitting substrate further comprises a first insulating layer 8 located on a side of the pad unit 2, the adapter ground line 4 and the light-emitting control line 5 away from the substrate 1; a plurality of openings 80 are formed in the first insulating layer 8, a part of the openings 80 has a projection on the substrate 1 located in a projection area of the light-emitting control line 5 on the substrate 1, and the light-emitting control line 5 is exposed at the part of the openings 80 and the exposed part serves as a first pad 20; another part of the openings 80 has a projection on the substrate 1 located in a projection area of the adapter ground line 4 on the substrate 1, and the adapter ground line 4 is exposed at the part of the openings 80 and the exposed part serves as a second pad 21.

[0146] In some embodiments, referring to FIG. 2d, an enlarged top view of the position of the pad unit in the light-emitting substrate of the embodiment of the present disclosure is shown; the width a of the area where the light-emitting control line 5 located at the four edges of the first pad 20 and the first insulating layer 8 overlap on the substrate 1 is greater than 10 μm; the width b of the area where the adapter ground line 4 located at the four edges of the second pad 21 and the first insulating layer 8 overlap on the substrate 1 is greater than 10 μm.

[0147] In some embodiments, referring to FIG. 2d, the width a of the area where the light-emitting control line 5 located at the four edges of the first pad 20 and the first insulating layer 8 overlap on the substrate 1 is 29 μm; the width b of the area where the adapter ground line 4 located at the four edges of the second pad 21 and the first insulating layer 8 overlap on the substrate 1 is 29 μm.

[0148] In some embodiments, referring to FIG. 2e, a structure sectional view along the CC' cutting line in FIG. 2a is shown; the light-emitting substrate further comprises a second insulating layer 9 located between the adapter ground line 4 and the ground line 3, and a first via hole 91 is formed in the second insulating layer 9, and the adapter ground line 4 is electrically connected to the ground line 3 through the first via hole 91.

[0149] In some embodiments, referring to FIG. 2e, the second insulating layer 9 is also located between the light-emitting control line 5 and the light-emitting control bus 7, and a second via hole 92 is formed in the second insulating layer 9, and the light-emitting control line 5 is electrically connected to the light-emitting control bus 7 through the second via hole 92.

[0150] In some embodiments, the shape of the first via hole 91 comprises a rectangle, and the size of the first via hole 91 is 140 μm*140 μm.

[0151] In some embodiments, the line width of the light-emitting control line 5 and the adapter ground line 4 is narrowed, such as each of the opposite edges of the line width of the light-emitting control line 5 and the adapter ground line 4 is narrowed by 19 μm, that is, the line width of the light-emitting control line 5 and the adapter ground line 4 is narrowed by 38 μm. In this way, the distance between the adjacent light-emitting control line 5 and the adapter ground line 4 can be increased, such as compared with the minimum distance (51 μm) between the GND trace and the LED trace in the related art, the minimum distance between the adjacent light-emitting control line 5 and the adapter ground line 4 in the present embodiment can be increased to 89 μm (i.e. 51+19+19 μm), so that the line short circuit between the adapter ground line 4 and the light-emitting control line 5 caused by the trace corrosion migration in the product reliability test can be avoided, and then the lamp area of the light-emitting substrate can be prevented from exploding lamp failure.

[0152] In some embodiments, referring to FIG. 2b, the first pad 20 is at least one, the light-emitting control line 5 is at least one, and the light-emitting control line 5 and the first pad 20 are electrically connected one by one; the second pad 21 is at least one, and the orthographic projection of the first pad 20 on the substrate 1 is located on at least one side of the orthographic projection of the second pad 21 on the substrate 1; and the orthographic projection of the at least two ground lines 3 on the substrate 1 is located on the same side of the orthographic projection of the pad unit 2 on the substrate 1.

[0153] In some embodiments, referring to FIG. 2b, the first pad 20 at least includes a first first pad 201, the second pad 21 includes a first second pad 211, the light-emitting control line 5 includes a first control line 51, the first control line 51 and the adapter ground line 4 are arranged along the second direction Y, and the first control line 51 is electrically connected to the first first pad 201.

[0154] The first control line 51 includes a first sub-portion 511 and a second sub-portion 512, the first sub-portion 511 and the second sub-portion 512 are arranged in sequence along the first direction X away from the first first pad 201, the first sub-portion 511 extends along the second direction Y away from the first first pad 201 and one end thereof is electrically connected to the first first pad 201, and the second sub-portion 512 extends along the first direction X and is electrically connected to the other end of the first sub-portion 511.

[0155] The ground line 3 includes a first ground line 31 and a second ground line 32, the orthographic projection of the first ground line 31 and the second ground line 32 on the substrate 1 is located on the same side of the orthographic projection of the pad unit 2 on the substrate 1, and the orthographic projection of the first ground line 31 on the substrate 1 is farther away from the orthographic projection of the pad unit 2 on the substrate 1 than the orthographic projection of the second ground line 32 on the substrate 1.

[0156] The transition ground line 4 comprises a first part 41 and a second part 42, the first part 41 and the second part 42 are electrically connected, the orthographic projection of the first part 41 on the substrate 1 is located between the orthographic projections of the first ground line 31 and the second ground line 32 on the substrate 1, and the first part 41 is electrically connected with the first ground line 31 and the second ground line 32 respectively; the orthographic projection of the second part 42 on the substrate 1 is located between the orthographic projections of the second ground line 32 and the first second pad 201 on the substrate 1, and the second part 42 is electrically connected with the first second pad 211.

[0157] In some embodiments, the orthographic projection of the second part 42 on the substrate 1 also extends between the orthographic projections of the second ground line 32 and the first second pad 201 on the substrate 1 to between the orthographic projections of the first ground line 31 and the second ground line 32 on the substrate 1.

[0158] In some embodiments, referring to FIG. 2b, the first pad 20 further comprises a second first pad 202, and the orthographic projections of the second first pad 202 and the first first pad 201 on the substrate 1 are mirror symmetric with the orthographic projection of the first second pad 211 on the substrate 1 as the center of symmetry.

[0159] The light-emitting control line 5 further comprises a second control line 52, the second control line 52 is located on the side of the transition ground line 4 away from the first control line 51, and the second control line 52 is electrically connected with the second first pad 202; the second control line 52 comprises a third sub-portion 521, the third sub-portion 521 extends along the first direction X, and one end thereof is electrically connected with the second first pad 202.

[0160] In some embodiments, referring to FIG. 2b, the first part 41 extends along the first direction X, the second part 42 extends along the third direction Z, the first direction X is perpendicular to the second direction Y, and the third direction Z intersects the first direction X to form a first acute angle α; the second part 42 is located on the side of the first part 41 close to the third sub-portion 521; the first sub-portion 511 and the second part 42 have a minimum distance c between the transition ground line 4 and the light-emitting control line 5.

[0161] In some embodiments, the distance between the first sub-portion 511 and the second part 42 at positions other than the minimum distance c is greater than the minimum distance c. The spacing between the adjacent side edges of the first sub-portion 511 and the second part 42 is h, h>c; c=h*cos α, and the spacing h between the adjacent side edges of the first sub-portion 511 and the second part 42 is 89 μm. To ensure that the minimum distance c≥86 μm, according to c=cos α*89 μm, the angle control range of the first acute angle α is 0<α≤15°.

[0162] In some embodiments, referring to FIG. 2b, the line width d1 of the first portion 41 is at least 2 times the line width d2 of the second portion 42; the positions where the first portion 41 is electrically connected with the first ground wire 31 and the second ground wire 32 are provided with vias (i.e., the first vias 91), the number of vias at the positions where the first portion 41 is electrically connected with the first ground wire 31 is greater than the number of vias at the positions where the first portion 41 is electrically connected with the second ground wire 32; the distance s1 between the first portion 41 and the third sub-portion 521 is greater than the distance s2 between the first portion 41 and the second sub-portion 512.

[0163] In some embodiments, referring to FIG. 2b, the first portion 41 is electrically connected with the first ground wire 31 through two rows of three columns of vias, and the first portion 41 is electrically connected with the second ground wire 32 through two rows of one column of vias. The row direction of the vias is along the first direction X, and the column direction of the vias is along the second direction Y.

[0164] In some embodiments, referring to FIG. 2b, the distance s1 between the first portion 41 and the third sub-portion 521 ranges from 267 to 327 μm; the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 129 to 157 μm; and the line width d1 of the first portion 41 ranges from 370 to 478 μm. The minimum distance c between the first sub-portion 511 and the second portion 42 is 86 μm. The area between the first portion 41 and the third sub-portion 521 is the area with the highest risk of corrosion short circuit, and the trace spacing of the area with the highest risk of corrosion short circuit is greater than 86 μm.

[0165] In the related art, the distance between the GND trace on the left side of the pad and the LED trace on the lower side thereof in FIG. 1a is 51 μm (minimum distance), and the area between the GND trace on the left side of the pad and the LED trace on the lower side thereof is the area with the highest risk of corrosion short circuit. In the embodiment of FIG. 2b, the distance s1 between the first portion 41 and the third sub-portion 521 is increased from 51 μm to 267-327 μm, so that the distance between the first portion 41 and the third sub-portion 521 in the area with the highest risk of corrosion short circuit is further increased, thereby greatly improving the reliability and service life of the light-emitting substrate. In the embodiment of FIG. 2b, the minimum distance c between the first sub-portion 511 and the second portion 42 is increased from 51 μm to 86 μm. In the related art, the distance between the GND trace on the left side of the pad and the LED trace on the upper side thereof in FIG. 1a is 91 μm. In the embodiment of FIG. 2b, the distance s2 between the first portion 41 and the second sub-portion 512 is increased from 91 μm to 129-157 μm. In the related art, the GND trace on the left side of the pad is electrically connected to the GND bus on the Cu1 layer through nine vias in three rows and three columns. In the embodiment of FIG. 2b, the number of vias for electrical connection between the first portion 41 and the first ground line 31 is reduced from nine to six vias in two rows and three columns. In the related art, the line width of the portion with a larger line width of the GND trace on the left side of the pad is 674 μm. In the embodiment of FIG. 2b, the line width d1 of the first portion 41 is controlled to be 370-478 μm. The above settings in the embodiment of the present disclosure can not only meet the electrical and process requirements of the light-emitting control line 5 and the switching ground line 4 around the pad unit 2, but also greatly improve the corrosion migration problem between the light-emitting control line 5 and the switching ground line 4 in the light-emitting substrate due to the entry of water vapor and a large potential difference, thereby avoiding short circuit and lamp explosion between the light-emitting control line 5 and the switching ground line 4.

[0166] In some embodiments, referring to FIG. 3, another wiring diagram around the pad unit in the light-emitting substrate according to the embodiment of the present disclosure is shown. In the embodiment, the line width d1 of the first portion 41 is equal to the line width d2 of the second portion 42. The position where the first portion 41 is electrically connected to the first ground line 31 and the second ground line 32 is provided with a via (i.e., the first via 91). The number of vias at the position where the first portion 41 is electrically connected to the first ground line 31 is greater than the number of vias at the position where the first portion 41 is electrically connected to the second ground line 32. The absolute value of the difference between the distance s1 between the first portion 41 and the third sub-portion 521 and the distance s2 between the first portion 41 and the second sub-portion 512 is 20-100 μm.

[0167] In the embodiment, the line width d1 of the first portion 41 is equal to the line width d2 of the second portion 42. The line width d1 of the first portion 41 and the line width d2 of the second portion 42 can be completely equal in the absolute sense, or the difference between the line width d1 of the first portion 41 and the line width d2 of the second portion 42 can be within ±10 μm.

[0168] In some embodiments, referring to FIG. 3, the first portion 41 and the first ground wire 31 are electrically connected through three vias arranged along the first direction X, and the first portion 41 and the second ground wire 32 are electrically connected through one via.

[0169] In some embodiments, referring to FIG. 3, the distance s1 between the first portion 41 and the third sub-portion 521 ranges from 267 to 327 μm, the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 307 to 367 μm, and the line width d1 of the first portion 41 ranges from 160 to 280 μm. The minimum distance c between the first sub-portion 511 and the second portion 42 is 86 μm. The area between the first portion 41 and the third sub-portion 521 is the area with the highest risk of etching short circuit, and by increasing the distance s1 between the first portion 41 and the third sub-portion 521 from 51 μm to 267 to 327 μm, the distance between them is further increased, thereby greatly improving the reliability and service life of the light-emitting substrate.

[0170] In some embodiments, referring to FIG. 4, another wiring diagram around the pad unit in the light-emitting substrate according to an embodiment of the present disclosure is shown, wherein the line width d1 of the first portion 41 is equal to the line width d2 of the second portion 42, the positions where the first portion 41 is electrically connected to the first ground wire 31 and the second ground wire 32 are provided with vias (i.e., the first vias 91), the number of vias at the position where the first portion 41 is electrically connected to the first ground wire 31 is greater than the number of vias at the position where the first portion 41 is electrically connected to the second ground wire 32, and the distance s1 between the first portion 41 and the third sub-portion 521 is greater than the distance s2 between the first portion 41 and the second sub-portion 512.

[0171] In some embodiments, referring to FIG. 4, another wiring diagram around the pad unit in the light-emitting substrate according to an embodiment of the present disclosure is shown, wherein the line width d1 of the first portion 41 is equal to the line width d2 of the second portion 42, the positions where the first portion 41 is electrically connected to the first ground wire 31 and the second ground wire 32 are provided with vias (i.e., the first vias 91), the number of vias at the position where the first portion 41 is electrically connected to the first ground wire 31 is greater than the number of vias at the position where the first portion 41 is electrically connected to the second ground wire 32, and the distance s1 between the first portion 41 and the third sub-portion 521 is greater than the distance s2 between the first portion 41 and the second sub-portion 512.

[0172] In some embodiments, referring to FIG. 4, the first portion 41 and the first ground wire 31 are electrically connected through three vias arranged along the first direction X, and the first portion 41 and the second ground wire 32 are electrically connected through one via. The vias where the first portion 41 is electrically connected to the first ground wire 31 and the second ground wire 32 are arranged along the first direction.

[0173] In some embodiments, referring to FIG. 4, the distance s1 between the first portion 41 and the third sub-portion 521 ranges from 477 to 537 μm; the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 129 to 157 μm; and the line width d1 of the first portion 41 ranges from 160 to 280 μm. The minimum distance c between the first sub-portion 511 and the second portion 42 is 86 μm. The area between the first portion 41 and the third sub-portion 521 is the area with the highest risk of corrosion short circuit, and by increasing the distance s1 between the first portion 41 and the third sub-portion 521 from 51 μm to 477-537 μm, the distance between them is further increased, thereby greatly improving the reliability and lifetime of the light-emitting substrate.

[0174] In some embodiments, referring to FIG. 5a, FIG. 5b, and FIG. 5c, another wiring diagram around the pad unit in the light-emitting substrate according to an embodiment of the present disclosure is shown. In the wiring diagram, the first portion 41 extends along the first direction X, and the second portion 42 extends along the first direction X. The distance h between the second portion 42 and the first sub-portion 511 is equal to the distance h1 between the second portion 42 and the third sub-portion 521, and is the minimum distance c between the relay ground line 4 and the light-emitting control line 5.

[0175] In some embodiments, the distance h between the second portion 42 and the first sub-portion 511 and the distance h1 between the second portion 42 and the third sub-portion 521 can be absolutely equal, or the difference between the distance h and the distance h1 can be within ±10 μm.

[0176] In some embodiments, referring to FIG. 5a and FIG. 5b, the line width d1 of the first portion 41 is at least 2 times the line width d2 of the second portion 42.

[0177] In some embodiments, referring to FIG. 5a and FIG. 5b, the first portion 41 and the first ground line 31 are electrically connected through two rows of three columns of vias, and the first portion 41 and the second ground line 32 are electrically connected through two rows of one column of vias. The row direction of the via arrangement is along the first direction X, and the column direction of the via arrangement is along the second direction Y.

[0178] In some embodiments, referring to FIG. 5a, the second portion 42 is located on the side of the first portion 41 close to the third sub-portion 521, and the distance s1 between the first portion 41 and the third sub-portion 521 is greater than the distance s2 between the first portion 41 and the second sub-portion 512.

[0179] In some embodiments, referring to FIG. 5a, the distance s1 between the first portion 41 and the third sub-portion 521 ranges from 267 to 327 μm; the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 129 to 157 μm; and the line width d1 of the first portion 41 ranges from 370 to 478 μm. The minimum distance c between the first sub-portion 511 and the second portion 42 is 89 μm. The area between the first portion 41 and the third sub-portion 521 is the area with the highest risk of corrosion short circuit. In this embodiment, the distance s1 between the first portion 41 and the third sub-portion 521 is increased from 51 μm to more than 89 μm, and the distance between the first portion 41 of the area with the highest risk of corrosion short circuit and the third sub-portion 521 is further increased, thereby greatly improving the reliability and lifetime of the light-emitting substrate.

[0180] In some embodiments, referring to FIG. 5b and FIG. 5c, the distance s1 between the first portion 41 and the third sub-portion 521 is equal to the distance h1 between the second portion 42 and the third sub-portion 521; and the distance s1 between the first portion 41 and the third sub-portion 521 is less than the distance s2 between the first portion 41 and the second sub-portion 512.

[0181] In some embodiments, referring to FIG. 5b, the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 307 to 367 μm; and the line width d1 of the first portion 41 ranges from 398 to 458 μm.

[0182] In some embodiments, referring to FIG. 5c, the line width d1 of the first portion 41 is at least 3 times the line width d2 of the second portion 42.

[0183] In some embodiments, referring to FIG. 5c, the first portion 41 and the first ground wire 31 are electrically connected through three rows and three columns of vias, and the first portion 41 and the second ground wire 32 are electrically connected through three rows and one column of vias. The row direction of the via arrangement is along the first direction X, and the column direction of the via arrangement is along the second direction Y.

[0184] In some embodiments, referring to FIG. 5c, the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 129 to 157 μm; and the line width d1 of the first portion 41 ranges from 576 to 668 μm.

[0185] In some embodiments, referring to FIG. 2b, FIG. 3 and FIG. 4, the first pad 20 further comprises a third first pad 203, and the third first pad 203 and the first first pad 201 are arranged along the first direction X; and the second pad 21 further comprises a second second pad 212, and the second second pad 212 and the first second pad 211 are arranged along the first direction X.

[0186] The light-emitting control line 5 further comprises a third control line 53 electrically connected to the third first pad 203; the third control line 53 comprises a fourth sub-portion 531 and a fifth sub-portion 532, the fourth sub-portion 531 and the fifth sub-portion 532 are electrically connected, the fourth sub-portion 531 and the first sub-portion 511 are mirror-symmetrical with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1; the fifth sub-portion 532 and the second sub-portion 512 are mirror-symmetrical with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1.

[0187] The ground wire 3 further comprises a third ground wire 33 and a fourth ground wire 34, the third ground wire 33 and the second ground wire 32 are mirror-symmetrical with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1, the fourth ground wire 34 and the first ground wire 31 are mirror-symmetrical with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1.

[0188] The adapter ground wire 4 further comprises a third portion 43 and a fourth portion 44, the third portion 43 and the fourth portion 44 are electrically connected, the third portion 43 and the second portion 42 are mirror-symmetrical with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1, the third portion 43 is electrically connected to the second second pad 212 and the second portion 42 respectively; the fourth portion 44 and the first portion 41 are mirror-symmetrical with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1, the fourth portion 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34 respectively.

[0189] In some embodiments, referring to FIG. 2b, the first pad 20 further comprises a fourth first pad 204, the fourth first pad 204 and the third first pad 203 are mirror-symmetrical with the second second pad 212 in the base 1 as the center of symmetry in the orthographic projection on the base 1.

[0190] The light-emitting control line 5 further comprises a fourth control line 54, the fourth control line 54 comprises a sixth sub-portion 541, the sixth sub-portion 541 is electrically connected to the fourth first pad 204, the sixth sub-portion 541 and the third sub-portion 521 are mirror-symmetrical with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1.

[0191] Wherein, the two structures mirror-symmetrical with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1 can be absolutely symmetrical in size and shape, or can be only symmetrical in position with the pad unit 2 in the base 1 as the center of symmetry in the orthographic projection on the base 1, and the two structures can have slight differences in size and shape, such as a difference of ±10μm in width and / or length.

[0192] In some embodiments, referring to FIG. 2b, the line width d4 of the fourth portion 44 is at least 2 times the line width d3 of the third portion 43; the positions where the fourth portion 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34 are provided with vias (i.e., the first vias 91), the number of vias at the positions where the fourth portion 44 is electrically connected to the fourth ground wire 34 is greater than the number of vias at the positions where the fourth portion 44 is electrically connected to the third ground wire 33; the distance s3 between the fourth portion 44 and the sixth sub-portion 541 is greater than the distance s4 between the fourth portion 44 and the fifth sub-portion 532.

[0193] In some embodiments, referring to FIG. 2b, the fourth portion 44 is electrically connected to the fourth ground wire 34 through two rows of three vias and is electrically connected to the third ground wire 33 through two rows of two vias. The row direction of the vias is along the first direction X, and the column direction of the vias is along the second direction Y.

[0194] In some embodiments, referring to FIG. 2b, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 ranges from 267 to 327 μm; the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 129 to 157 μm; and the line width d4 of the fourth portion 44 ranges from 370 to 478 μm. The minimum distance c between the fourth sub-portion 531 and the third portion 43 is 86 μm. The area between the fourth portion 44 and the sixth sub-portion 541 is the area with the highest risk of corrosion short circuit, and the pitch of the traces in the area with the highest risk of corrosion short circuit is greater than 86 μm.

[0195] In some embodiments, referring to FIG. 3, the line width d4 of the fourth portion 44 is equal to the line width d3 of the third portion 43; the positions where the fourth portion 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34 are provided with vias (i.e., the first vias 91), the number of vias at the positions where the fourth portion 44 is electrically connected to the fourth ground wire 34 is greater than the number of vias at the positions where the fourth portion 44 is electrically connected to the third ground wire 33; and the absolute value of the difference between the distance s3 between the fourth portion 44 and the sixth sub-portion 541 and the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 20 to 100 μm.

[0196] In some embodiments, referring to FIG. 3, the line width d4 of the fourth portion 44 is equal to the line width d3 of the third portion 43; the positions where the fourth portion 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34 are provided with vias (i.e., the first vias 91), the number of vias at the positions where the fourth portion 44 is electrically connected to the fourth ground wire 34 is greater than the number of vias at the positions where the fourth portion 44 is electrically connected to the third ground wire 33; and the absolute value of the difference between the distance s3 between the fourth portion 44 and the sixth sub-portion 541 and the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 20 to 100 μm.

[0197] In some embodiments, referring to FIG. 3, the fourth portion 44 is electrically connected to the fourth ground wire 34 through three vias arranged along the first direction X and is electrically connected to the third ground wire 33 through two vias.

[0198] In some embodiments, referring to FIG. 3, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 ranges from 267 to 327 μm; the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 307 to 367 μm; the line width d4 of the fourth portion 44 ranges from 160 to 280 μm. The minimum distance c between the fourth sub-portion 531 and the third portion 43 is 86 μm. The area between the fourth portion 44 and the sixth sub-portion 541 is the area with the highest risk of corrosion short circuit, and by increasing the distance s3 between the fourth portion 44 and the sixth sub-portion 541 from 51 μm to 267 to 327 μm, the distance between the fourth portion 44 and the sixth sub-portion 541 is further increased, thereby greatly improving the reliability and service life of the light-emitting substrate.

[0199] In some embodiments, referring to FIG. 4, the line width d4 of the fourth portion 44 is equal to the line width d3 of the third portion 43; the position where the fourth portion 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34 is provided with a via (i.e., the first via 91), the number of vias at the position where the fourth portion 44 is electrically connected to the fourth ground wire 34 is greater than the number of vias at the position where the fourth portion 44 is electrically connected to the third ground wire 33; the distance s3 between the fourth portion 44 and the sixth sub-portion 541 is greater than the distance s4 between the fourth portion 44 and the fifth sub-portion 532.

[0200] In some embodiments, referring to FIG. 4, the line width d4 of the fourth portion 44 is equal to the line width d3 of the third portion 43; the position where the fourth portion 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34 is provided with a via (i.e., the first via 91), the number of vias at the position where the fourth portion 44 is electrically connected to the fourth ground wire 34 is greater than the number of vias at the position where the fourth portion 44 is electrically connected to the third ground wire 33; the distance s3 between the fourth portion 44 and the sixth sub-portion 541 is greater than the distance s4 between the fourth portion 44 and the fifth sub-portion 532.

[0201] In some embodiments, referring to FIG. 4, the fourth portion 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34 through three vias arranged along the first direction X, and the fourth portion 44 is electrically connected to the third ground wire 33 through two vias. The vias through which the fourth portion 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34 are arranged along the first direction.

[0202] In some embodiments, referring to FIG. 4, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 ranges from 477 to 537 μm; the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 129 to 157 μm; the line width d4 of the fourth portion 44 ranges from 160 to 280 μm. The minimum distance c between the fourth sub-portion 531 and the third portion 43 is 86 μm. The area between the fourth portion 44 and the sixth sub-portion 541 is the area with the highest risk of corrosion short circuit, and by increasing the distance s3 between the fourth portion 44 and the sixth sub-portion 541 from 51 μm to 477 to 537 μm, the distance between the fourth portion 44 and the sixth sub-portion 541 is further increased, thereby greatly improving the reliability and service life of the light-emitting substrate.

[0203] In some embodiments, referring to FIG. 2b, FIG. 3 and FIG. 4, the third portion 43 extends along a fourth direction Z' intersecting the first direction X at a second acute angle a'; the fourth sub-portion 531 has a minimum distance c with the third portion 43; the second acute angle a' ranges from arctanF' / E≤a'≤15°; where a' is the second acute angle; F' is the maximum distance between the side of the fourth portion 44 close to the sixth sub-portion 541 and the side of the third portion 43 close to the sixth sub-portion 541; and E is the distance between the side of the fourth portion 44 away from the fourth sub-portion 531 and the fourth sub-portion.

[0204] In some embodiments, referring to FIG. 2b, FIG. 3 and FIG. 4, the first acute angle a ranges from arctanF / D≤a≤15°; where a is the first acute angle; F is the maximum distance between the side of the first portion 41 close to the third sub-portion 521 and the side of the second portion 42 close to the third sub-portion 521; and D is the distance between the side of the first portion 41 away from the first sub-portion 511 and the first sub-portion 511.

[0205] In some embodiments, referring to FIG. 2b, FIG. 3 and FIG. 4, a=a'; F=F'; when D>E, arctanF / D≤a≤15°; when D=E, arctanF / D≤a≤15°; and when D

[0206] In some embodiments, referring to FIG. 4, the line width d1 of the first portion 41 can be controlled within 160-280 μm, in which case the F value ranges from 388-448 μm, and the distance s1 between the first portion 41 of the highest risk area of short circuit corrosion and the third sub-portion 521 can all be greater than 89 μm. When F=F', D=2184 μm and E=2110 μm, the first acute angle a and the second acute angle a' are subject to tan a=F / E, in which case a≈10.43°, so 10.43°≤a≤15°.

[0207] In some embodiments, considering the schemes in FIG. 2b, FIG. 3, FIG. 4, FIG. 5a, FIG. 5b and FIG. 5c as a whole, the line width d1 of the first portion 41 can be varied or moved up and down (i.e. moved away from or close to the third sub-portion 521), and in the case of ensuring that the minimum distance c between the adapter ground line 4 and the light-emitting control line 5 is greater than or equal to 89 μm, the range of F or F' can be defined as 0≤F≤448 μm, and then 0≤a≤15°.

[0208] In some embodiments, referring to FIG. 5a and FIG. 5b, the line width d4 of the fourth portion 44 is at least 2 times the line width d3 of the third portion 43.

[0209] In some embodiments, referring to FIGS. 5a and 5b, the fourth portion 44 is electrically connected to the fourth ground 34 by two rows of three columns of vias, and the fourth portion 44 is electrically connected to the third ground 33 by two rows of two columns of vias. The row direction of the via arrangement is along the first direction X, and the column direction of the via arrangement is along the second direction Y.

[0210] In some embodiments, referring to FIG. 5a, the third portion 43 is located on one side of the fourth portion 44 close to the sixth sub-portion 541, and the distance s3 between the fourth portion 44 and the sixth sub-portion 541 is greater than the distance s4 between the fourth portion 44 and the fifth sub-portion 532.

[0211] In some embodiments, referring to FIG. 5a, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 ranges from 267 to 327 μm, the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 129 to 157 μm, and the line width d4 of the fourth portion 44 ranges from 370 to 478 μm. The minimum distance c between the fourth sub-portion 531 and the third portion 43 is 89 μm. The distance s3 between the fourth portion 44 and the sixth sub-portion 541 is the area with the highest risk of corrosion short circuit, and in this embodiment, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 is increased from 51 μm to more than 89 μm, and the distance between the fourth portion 44 and the sixth sub-portion 541 in the area with the highest risk of corrosion short circuit is further increased, thereby greatly improving the reliability and life of the light-emitting substrate.

[0212] In some embodiments, referring to FIGS. 5b and 5c, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 is equal to the distance h2 between the third portion 43 and the sixth sub-portion 541, and the distance s3 between the fourth portion 44 and the sixth sub-portion 541 is less than the distance s4 between the fourth portion 44 and the fifth sub-portion 532.

[0213] In some embodiments, referring to FIG. 5b, the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 307 to 367 μm, and the line width d4 of the fourth portion 44 ranges from 398 to 458 μm.

[0214] In some embodiments, referring to FIG. 5c, the line width d4 of the fourth portion 44 is at least 3 times the line width d3 of the third portion 43.

[0215] In some embodiments, referring to FIG. 5c, the fourth portion 44 is electrically connected to the fourth ground 34 by three rows of three columns of vias, and the fourth portion 44 is electrically connected to the third ground 33 by three rows of two columns of vias. The row direction of the via arrangement is along the first direction X, and the column direction of the via arrangement is along the second direction Y.

[0216] In some embodiments, referring to FIG. 5c, the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 129 to 157 μm; and the line width d4 of the fourth portion 44 ranges from 576 to 668 μm.

[0217] In some embodiments, referring to FIGS. 2b, 3, 4, 5a, 5b and 5c, the light-emitting substrate further comprises a power supply line 10, a first clock line 11, a second clock line 12 and a data line 13, which are located at the same layer as the ground lines 3; the power supply line 10, the first clock line 11, the second clock line 12 and the data line 13 extend along the second direction Y respectively, and the orthogonal projection of the power supply line 10 on the base 1 is located between the orthogonal projections of the first ground line 31 and the second ground line 32 on the base 1; the orthogonal projection of the first clock line 11 on the base 1 is located between the orthogonal projections of the second ground line 32 and the pad unit 2 on the base 1; the orthogonal projection of the second clock line 12 on the base 1 is located between the orthogonal projections of the pad unit 2 and the third ground line 33 on the base 1; the orthogonal projection of the data line 13 on the base 1 is located between the orthogonal projections of the third ground line 33 and the fourth ground line 34 on the base 1; the pad unit 2 further comprises a third pad 22, a fourth pad 23, a fifth pad 24 and a sixth pad 25, which are located on the side of the orthogonal projection of the first pad 20 on the base 1 away from the orthogonal projection of the second pad 21 on the base 1; the power supply line 10 is electrically connected to the third pad 22, the first clock line 11 is electrically connected to the fourth pad 23, the second clock line 12 is electrically connected to the fifth pad 24, and the data line 13 is electrically connected to the sixth pad 25.

[0218] The power supply line 10 provides power supply for the driving circuit (i.e. a driving chip IC, not shown in the figures) electrically connected to the pad unit 2. The first clock line 11 and the second clock line 12 provide clock signals when the driving circuit drives each light area 6 to display. The data line 13 provides data signals when the driving circuit drives each light area 6 to display. The ground lines 3 provide ground signals or low-voltage signals for the driving circuit and each light area 6.

[0219] In some embodiments, the line width of the first ground line 31 is greater than the line width of the second ground line 32; the line width of the fourth ground line 34 is greater than the line width of the third ground line 33; and the line width of the third ground line 33 is greater than the line width of the second ground line 32. The line width of each ground line 3 refers to the dimension of each ground line 3 along the first direction X.

[0220] In some embodiments, referring to FIGS. 2b, 3, 4, 5a, 5b and 5c, the orthogonal projections of the first ground line 31 and the fourth ground line 34 on the base 1 are mirror-symmetrical with the orthogonal projection of the pad unit 2 on the base 1 as the center of symmetry.

[0221] In some embodiments, referring to FIG. 2a, the two light-emitting control buses 7 have their orthographic projections on the substrate 1 located on the side away from the orthographic projection of the pad unit 2 on the substrate 1, with respect to the orthographic projections of the first ground wire 31 and the fourth ground wire 34 on the substrate 1, respectively; and the orthographic projections of the two light-emitting control buses 7 on the substrate 1 are mirror-symmetric with respect to the orthographic projection of the pad unit 2 on the substrate 1 as the center.

[0222] The light-emitting substrate provided in the embodiments of the present disclosure is mainly applied to a MiniLED lamp panel. Compared with an LCD (liquid crystal) panel or an OLED (organic electroluminescent) panel, only the insulating layer covers the circuit traces in the MiniLED light-emitting substrate, while the entire MiniLED light-emitting substrate is exposed to the outside, and the external water vapor and oxygen are more likely to enter the MiniLED light-emitting substrate and cause corrosion to the circuit traces in the MiniLED light-emitting substrate, thereby causing material migration of the circuit traces and short circuit between the lines. The circuit traces in the LCD (liquid crystal) panel or the OLED (organic electroluminescent) panel are designed to be sealed by vacuum lamination, and the external water vapor and oxygen are not easy to enter the sealed space, so the circuit traces in the LCD panel or the OLED panel are not easy to be corroded and are not easy to be short-circuited. Therefore, the trace design and trace spacing design in the embodiments of the present disclosure can better avoid short circuit between the light-emitting control lines 5 and the adapter ground wires 4 located in the same layer in the MiniLED light-emitting substrate, thereby avoiding the problem of lamp explosion failure of the MiniLED lamp panel. At the same time, in the MiniLED light-emitting substrate, the Cu1 layer in which the ground wire 3 is located has a relatively thick trace thickness, and the Cu2 layer in which the adapter ground wire 4 and the light-emitting control line 5 are located has a relatively thin trace thickness. The trace design and trace spacing design in the embodiments of the present disclosure can better avoid short circuit between the light-emitting control lines 5 and the adapter ground wires 4 located in the same layer in the MiniLED light-emitting substrate, thereby avoiding the problem of lamp explosion failure of the MiniLED lamp panel.

[0223] The distance between the light-emitting control lines 5 and the adapter ground wires 4 in the light-emitting substrate provided in the embodiments of the present disclosure is obviously increased compared with the spacing between the GND traces and the LED traces in the related art. By narrowing the line width or changing the trace shape to increase the spacing between the adapter ground wires 4 and the light-emitting control lines 5, the line short circuit between the adapter ground wires 4 and the light-emitting control lines 5 caused by trace corrosion migration in product reliability tests can be avoided, thereby avoiding the lamp explosion failure of the lamp area of the light-emitting substrate, and further significantly improving the corrosion resistance and product life of the light-emitting substrate.

[0224] In a second aspect, the embodiments of the present disclosure provide a lamp panel, which comprises the light-emitting substrate in the above embodiments; further comprises a driving circuit and at least one lamp area, the driving circuit is electrically connected with the pad unit in the light-emitting substrate; the lamp area is electrically connected with the light-emitting control line and the light-emitting control bus in the light-emitting substrate; the driving circuit comprises at least one first driving end, the lamp area comprises a plurality of lamp beads, the light-emitting control line is connected in series with the plurality of lamp beads in the lamp area; one end of the light-emitting control line is electrically connected with the first driving end, and the other end is electrically connected with the light-emitting control bus.

[0225] The driving circuit is an IC (integrated circuit). The lamp bead can be a Mini LED.

[0226] In some embodiments, the lamp panel can be used as a backlight source in a display product. In some embodiments, the lamp panel can also directly display, that is, the lamp panel displays a picture as a display panel.

[0227] The lamp panel provided by the embodiments of the present disclosure can improve the corrosion resistance and service life of the lamp panel by using the light-emitting substrate in the above embodiments.

[0228] It can be understood that the above embodiments are only exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also considered as the protection scope of the present disclosure.

Claims

1. A light-emitting substrate, wherein, The substrate, the pad unit, the ground wire, the relay ground wire and the light-emitting control wire are located on one side of the substrate; The relay ground wire and the light-emitting control wire are located on the same layer and on the side of the ground wire away from the substrate; The orthogonal projection of the ground wire on the substrate is located on at least one side of the orthogonal projection of the pad unit on the substrate, and the orthogonal projection of the ground wire and the pad unit on the substrate is arranged along a first direction, and the ground wire extends along a second direction; The pad unit comprises a first pad and a second pad, and the first pad and the second pad are arranged along the second direction; The light-emitting control wire is electrically connected to the first pad; The relay ground wire is electrically connected to the second pad and the ground wire; The light-emitting control wire and the relay ground wire are arranged at intervals along the second direction; The first direction and the second direction intersect.

2. The light-emitting substrate according to claim 1, wherein The first pad has at least one, The light-emitting control wire has at least one, The light-emitting control wire and the first pad are electrically connected one by one; The second pad has at least one, The orthogonal projection of the first pad on the substrate is located on at least one side of the orthogonal projection of the second pad on the substrate; The orthogonal projection of at least two ground wires on the substrate is located on the same side of the orthogonal projection of the pad unit on the substrate.

3. The light-emitting substrate of claim 2, wherein, The first pad comprises at least a first first pad, The second pad comprises a first second pad, The light-emitting control wire comprises a first control wire, the first control wire and the relay ground wire are arranged along the second direction, and the first control wire is electrically connected to the first first pad; The first control wire comprises a first subpart and a second subpart, the first subpart and the second subpart are arranged in sequence along the first direction away from the first first pad, the first subpart extends along the second direction away from the first first pad and one end thereof is electrically connected to the first first pad, and the second subpart extends along the first direction and is electrically connected to the other end of the first subpart; The ground wire comprises a first ground wire and a second ground wire, the orthogonal projection of the first ground wire and the second ground wire on the substrate is located on the same side of the orthogonal projection of the pad unit on the substrate, and the orthogonal projection of the first ground wire on the substrate is farther away from the orthogonal projection of the pad unit on the substrate than the orthogonal projection of the second ground wire on the substrate; The relay ground wire comprises a first part and a second part, the first part and the second part are electrically connected, The orthogonal projection of the first part on the substrate is located between the orthogonal projection of the first ground wire and the second ground wire on the substrate, and the first part is electrically connected to the first ground wire and the second ground wire respectively; The second part is located between the orthogonal projection of the second ground wire and the first second pad on the substrate, or the orthogonal projection of the second part on the substrate extends from between the orthogonal projection of the second ground wire and the first second pad to between the orthogonal projection of the first ground wire and the second ground wire on the substrate, and the second part is electrically connected to the first second pad.

4. The light-emitting substrate of claim 3, wherein, The first pad further comprises a second first pad, and the orthogonal projection of the second first pad and the first first pad on the substrate is mirror-symmetrical with the orthogonal projection of the first second pad on the substrate as the center of symmetry. The light-emitting control line further comprises a second control line, the second control line is located on the side of the relay ground wire away from the first control line, and the second control line is electrically connected to the second first pad. The second control line comprises a third sub-part, the third sub-part extends along the first direction, and one end thereof is electrically connected to the second first pad.

5. The light-emitting substrate of claim 4, wherein, The first part extends along the first direction, The second part extends along a third direction, The first direction is perpendicular to the second direction, and the third direction intersects the first direction at a first acute angle. The second part is located on the side of the first part close to the third sub-part. The first sub-part and the second part have a minimum distance between the relay ground wire and the light-emitting control line.

6. The light-emitting substrate of claim 5, wherein, The line width of the first part is at least 2 times the line width of the second part. The position where the first part is electrically connected to the first ground wire and the second ground wire is provided with a via hole, The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part.

7. The light-emitting substrate of claim 5, wherein, The line width of the first part is equal to the line width of the second part. The position where the first part is electrically connected to the first ground wire and the second ground wire is provided with a via hole, The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part. The line width of the first part is equal to the line width of the second part.

8. The light-emitting substrate of claim 5, wherein, The position where the first part is electrically connected to the first ground wire and the second ground wire is provided with a via hole, The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part. The line width of the first part is equal to the line width of the second part. The position where the first part is electrically connected to the first ground wire and the second ground wire is provided with a via hole, 9. The light-emitting substrate of claim 4, wherein, The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part. The first part extends along the first direction, and the second part extends along the first direction, The distance between the second part and the first sub-part is equal to the distance between the second part and the third sub-part, and is the minimum distance between the adapter ground wire and the light-emitting control wire.

10. The light-emitting substrate of claim 9, wherein, The line width of the first part is at least 2 times the line width of the second part.

11. The light-emitting substrate of claim 10, wherein, The second part is located on one side of the first part close to the third sub-part. The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part.

12. The light-emitting substrate of claim 9, wherein, The line width of the first part is at least 3 times the line width of the second part.

13. The light-emitting substrate according to claim 10 or 12, wherein The distance between the first part and the third sub-part is equal to the distance between the second part and the third sub-part. The distance between the first part and the third sub-part is less than the distance between the first part and the second sub-part.

14. The light emitting substrate of claim 5, wherein, The first pad further comprises a third first pad, and the third first pad and the first first pad are arranged along the first direction; The second pad further comprises a second second pad, and the second second pad and the first second pad are arranged along the first direction; The light-emitting control wire further comprises a third control wire, and the third control wire is electrically connected to the third first pad; The third control wire comprises a fourth sub-part and a fifth sub-part, and the fourth sub-part and the fifth sub-part are electrically connected, The fourth sub-part and the first sub-part are mirror symmetrical with the pad unit on the substrate as the center of symmetry; and the fifth sub-part and the second sub-part are mirror symmetrical with the pad unit on the substrate as the center of symmetry. The ground wire further comprises a third ground wire and a fourth ground wire, and the third ground wire and the second ground wire are mirror symmetrical with the pad unit on the substrate as the center of symmetry; and the fourth ground wire and the first ground wire are mirror symmetrical with the pad unit on the substrate as the center of symmetry. The adapter ground wire further comprises a third part and a fourth part, and the third part and the fourth part are electrically connected, The third part and the second part are mirror symmetrical with the pad unit on the substrate as the center of symmetry, The third part is electrically connected to the second second pad and the second part respectively; The fourth part and the first part are mirror symmetrical with the pad unit on the substrate as the center of symmetry, The fourth part is electrically connected to the third ground wire and the fourth ground wire respectively. The first pad further comprises a fourth first pad, and the fourth first pad and the third first pad are mirror symmetrical with the second second pad on the substrate as the center of symmetry; 15. The light-emitting substrate of claim 14, wherein, The light-emitting control wire further comprises a fourth control wire, and the fourth control wire comprises a sixth sub-part, and the sixth sub-part is electrically connected to the fourth first pad, The sixth sub-part and the third sub-part are mirror symmetrical with the pad unit on the substrate as the center of symmetry. ​ 16. The light emitting substrate of claim 15, wherein, The first acute angle is in the range of arctanF / D≤α≤15°; Wherein, α is the first acute angle; F is the maximum distance between the side of the first part close to the third subpart and the side of the second part close to the third subpart; D is the distance between the side of the first part away from the first subpart and the first subpart. The third part extends in a fourth direction, which intersects the first direction to form a second acute angle; 17. The light emitting substrate of claim 16, wherein, The fourth subpart and the third part have the minimum distance; The second acute angle is in the range of arctanF' / E≤α'≤15°; Wherein, α' is the second acute angle; F' is the maximum distance between the side of the fourth part close to the sixth subpart and the side of the third part close to the sixth subpart; E is the distance between the side of the fourth part away from the fourth subpart and the fourth subpart. α=α'; F=F'; 18. The light-emitting substrate of claim 17, wherein, When D>E, arctanF / D≤α≤15°; When D=E, arctanF / D≤α≤15°; When D The minimum distance between the orthographic projection of the light-emitting control line and the orthographic projection of the adapter ground line on the substrate is 0.5-0.8 times the width dimension of the first pad or the second pad.

19. The light-emitting substrate according to claim 9 or 17, wherein, The minimum distance is in the range of 86-89 μm.

20. The light-emitting substrate of claim 19, wherein, The pad unit, the adapter ground line and the light-emitting control line are located in the same layer, 21. The light emitting substrate of claim 1, wherein, The light-emitting substrate further comprises a first insulating layer located on the side of the pad unit, the adapter ground line and the light-emitting control line away from the substrate; A plurality of openings are formed in the first insulating layer, a part of the openings have orthographic projections on the substrate located in the orthographic projection area of the light-emitting control line, the light-emitting control line is exposed at the part of the openings and the exposed part serves as the first pad; Another part of the openings have orthographic projections on the substrate located in the orthographic projection area of the adapter ground line, the adapter ground line is exposed at the part of the openings and the exposed part serves as the second pad; The width of the area where the light-emitting control line located at the four peripheral edges of the first pad and the first insulating layer overlap in the orthographic projection on the substrate is more than 10 μm; The width of the area where the adapter ground line located at the four peripheral edges of the second pad and the first insulating layer overlap in the orthographic projection on the substrate is more than 10 μm. The distance between the first part and the third subpart is in the range of 267-327 μm; The distance between the first part and the second subpart is in the range of 129-157 μm; 22. The light emitting substrate of claim 6 or 11, wherein, The line width of the first part is in the range of 370-478 μm. The distance between the first part and the third subpart is in the range of 267-327 μm; The distance between the first part and the second subpart is in the range of 307-367 μm; 23. The light emitting substrate of claim 7, wherein, The line width of the first part is in the range of 160-280 μm. ​ ​ 24. The light emitting substrate of claim 8, wherein, The distance between the first part and the third sub-part ranges from 477 to 537 μm; The distance between the first part and the second sub-part ranges from 129 to 157 μm; The line width of the first part ranges from 160 to 280 μm.

25. The light emitting substrate of claim 13, wherein, The distance between the first part and the second sub-part ranges from 307 to 367 μm; The line width of the first part ranges from 398 to 458 μm.

26. The light emitting substrate of claim 13, wherein, The distance between the first part and the second sub-part ranges from 129 to 157 μm; The line width of the first part ranges from 576 to 668 μm.

27. The light emitting substrate of claim 14, wherein, The power line, the first clock line, the second clock line and the data line are located in the same layer as the ground line; The power line, the first clock line, the second clock line and the data line respectively extend along the second direction, The orthogonal projection of the power line on the substrate is between the orthogonal projections of the first ground line and the second ground line on the substrate; The orthogonal projection of the first clock line on the substrate is between the orthogonal projections of the second ground line and the pad unit on the substrate; The orthogonal projection of the second clock line on the substrate is between the orthogonal projections of the pad unit and the third ground line on the substrate; The orthogonal projection of the data line on the substrate is between the orthogonal projections of the third ground line and the fourth ground line on the substrate; The pad unit further comprises a third pad, a fourth pad, a fifth pad and a sixth pad, which are located on the side of the orthogonal projection of the first pad on the substrate away from the orthogonal projection of the second pad on the substrate; The power line is electrically connected to the third pad, The first clock line is electrically connected to the fourth pad, The second clock line is electrically connected to the fifth pad, The data line is electrically connected to the sixth pad.

28. The light-emitting substrate of claim 27, wherein, The line width of the first ground line is greater than that of the second ground line; The line width of the fourth ground line is greater than that of the third ground line; The line width of the third ground line is greater than that of the second ground line.

29. A light panel, wherein, The light-emitting substrate of any one of claims 1-28 is included; Further comprising a driving circuit and at least one light area, the driving circuit is electrically connected to the pad unit in the light-emitting substrate; the light area is electrically connected to the light-emitting control line and the light-emitting control bus in the light-emitting substrate; The driving circuit comprises at least one first driving end, The light area comprises a plurality of lamp beads, and the light-emitting control line is connected in series to the plurality of lamp beads in the light area; One end of the light-emitting control line is electrically connected to the first driving end, and the other end is electrically connected to the light-emitting control bus.

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