Production device and process for die cutting and wire laminating of double-sided combined flexible circuit board

Abstract

The present invention relates to the field of flexible circuit board production, and particularly relates to a production device and process for die cutting and wire laminating of a double-sided combined flexible circuit board. The production device comprises a frame, and a die cutting head on the frame, used for die cutting a flexible circuit board to be processed. A wire laminating unit used for laminating wires on the flexible circuit board is provided on the side of the frame away from the die cutting head, and the die cutting head and the wire laminating unit work in conjunction with each other to achieve the effects of die cutting the front side of the flexible circuit board and laminating the wires on the back surface of the flexible circuit board. By implementing die cutting and wire laminating of a flexible circuit board on a single machine, the present invention effectively avoids the problems that materials need to be moved multiple times during use, and after the materials are moved multiple times, the relative position between the materials and the machine and the relative position of the materials need to be adjusted multiple times to ensure alignment, which affects the accuracy and consistency of a final circuit board.

Description

Double-sided combined flexible circuit board die cutting and back line production equipment and process TECHNICAL FIELD

[0001] The present application relates to the field of flexible circuit board production, in particular to a double-sided combined flexible circuit board die cutting and back line production equipment and process. BACKGROUND

[0002] Flexible circuit board, commonly known as FPC in the industry, is a printed circuit board made of flexible insulating substrate (mainly polyimide or polyester film). This material has high heat resistance, good dimensional stability, can be freely bent, wound and folded, and can move and stretch in three-dimensional space. It is widely used in LED light strip, lamp tube, panel light and other lighting decoration products.

[0003] Currently, in the production and processing of flexible circuit boards, die cutting and back line deposition are generally completed by multiple processes independently. Die cutting of flexible circuit boards usually uses numerical control punch presses, and back line deposition uses steam cleaning followed by spraying or blade coating technology. After completing one process, the processed flexible circuit board needs to be transported to the next device for processing of the next process. After multiple processes and multiple transportations, the production efficiency of the flexible circuit board is reduced, and the error accumulation of each process affects the accuracy and consistency of the final circuit board.

[0004] Therefore, in the above-mentioned view, there is still room for optimization in the existing technology for producing and processing flexible circuit boards.

[0005] SUMMARY

[0006] To solve the above problems, the present application provides a double-sided combined flexible circuit board die cutting and back line production equipment, which comprises a rack and a die cutting head on the rack for die cutting processing of the flexible board to be processed. A conveying channel is formed between the die cutting head and the rack for conveying the flexible circuit board. A back line unit is provided on the side of the rack away from the die cutting head for covering the wires on the flexible circuit board. The die cutting head and the back line unit cooperate to die cut the flexible circuit board on the front side and cover the wires on the back side of the flexible circuit board.

[0007] The back line unit comprises a mounting base plate for connecting a plurality of wire spools, a mounting side plate for connecting an insulating film, and a coater for covering the insulating film on the plurality of wires and then covering the covered insulating film and wires on the flexible circuit board. The mounting base plate, the mounting side plate and the coater are connected to the rack, and the insulating film and the plurality of wires are connected to the mounting side plate and the mounting base plate in a coiled manner.

[0008] Preferably, the laminator comprises electric telescopic rods symmetrically connected on the rack on the side away from the die-cutting head, a guide roller is arranged between the telescopic sections of the two electric telescopic rods, a rotating roller corresponding to the guide roller is arranged on the side of the rack close to the guide roller, and the relative position between the guide roller and the rotating roller is adjusted by the electric telescopic rods to allow the laminated insulation film and the wire to pass through.

[0009] Preferably, the rack is further provided with an auxiliary part for assisting the laminating of the wire and the insulation film, the auxiliary part comprises a horizontal pressing plate arranged on the rack corresponding to the mounting base, a drive screw is threadedly connected to the horizontal pressing plate, and a drive end connected to the rack is arranged on the drive screw to drive the horizontal pressing plate to slide in the vertical direction to assist the laminating of the wire and the insulation film on the adhesive side.

[0010] Preferably, a rotating shaft connected to the rack is arranged on the fixed section of the electric telescopic rod, a transmission shaft corresponding to the rotating shaft is symmetrically connected to the rack, and the transmission shaft and the rotating shaft are in meshing transmission connection through bevel gears.

[0011] Preferably, the end of the transmission shaft away from the bevel gear is also in meshing transmission connection with the drive screw through a bevel gear.

[0012] Preferably, the mounting base and the mounting side plate are further connected with a limiting roller for limiting the position of the wire to make all the wires connected to the mounting base in the same plane.

[0013] Preferably, the mounting base is arranged in a bent shape, the wires are connected to the inner side of the bent section of the mounting base, a plurality of guide grooves are arranged on the side of the mounting base away from the wire coil, and the plurality of guide grooves correspond to the positions of the wires to guide and limit the sliding path of the wires.

[0014] Preferably, the lower end of the mounting base is further connected with a wire arranging roller for further guiding the position of the wire, a plurality of guide grooves corresponding to the wires are arranged on the wire arranging roller, and the plurality of wires are transitionally attached to the mounting base through the guide grooves on the wire arranging roller.

[0015] Preferably, a connecting ring is coaxially arranged on the outer side of the rotating roller, an opening is arranged on the connecting ring to allow part of the rotating roller to be exposed to be attached to the insulation film.

[0016] In addition, the present application also provides a production process of double-sided combined flexible circuit board die-cutting and back wire, comprising the following steps:

[0017] S1: The flexible circuit board of the roll material is attached to the rack for conveying, and is die-cut by the die-cutting head during conveying, and the insulating film and the plurality of wires are wound and formed to be connected on the side of the rack away from the die-cutting head, and the insulating film and the wires are connected on the rack with a spacing distance.

[0018] S2: The plurality of wires and the insulating film connected on the rack are sequentially pulled, so that the plurality of wires are evenly arranged and distributed on the same plane along the outer side of the mounting substrate, and then the adhesive side of the wire is laminated on all the wires to complete the lamination of the insulating film and the wire.

[0019] S3: After the lamination of the insulating film and the wire is completed, the laminated insulating film and wire are pulled again to pass through the laminator, and then the insulating film and the wire are laminated on the back of the flexible circuit board by the guidance of the laminator, forming the effect of processing and processing the flexible circuit board on both sides.

[0020] In summary, the present application includes at least one of the following beneficial technical effects:

[0021] Firstly, the present application realizes the die-cutting and back wire processing of the flexible circuit board on one machine, effectively avoiding the need to move the material multiple times during use, and after moving the material multiple times, the relative positions of the material and the machine and the material and the material need to be adjusted multiple times to align them with each other, which affects the precision and consistency of the final circuit board.

[0022] Secondly, the present application pulls one end of the flexible circuit board wound into a roll material and attaches it to the rack, so that when the flexible circuit board passes through the rack and the die-cutting head, the die-cutting head processes the passing flexible circuit board by punching, and then the flexible circuit board continues to attach to the rack and move forward, and at the same time, the back wire unit provided on the side of the rack away from the die-cutting head laminates the required wire on the back of the flexible circuit board after die-cutting, to complete the effect of die-cutting the flexible circuit board on the front and laminating the wire on the back of the flexible circuit board, effectively improving the efficiency of the flexible circuit board production and processing.

[0023] Thirdly, the present application controls the extension and contraction of the extension section of the electric telescopic rod to drive the connected guide roller to slide synchronously, thereby adjusting the relative position between the guide roller and the rotating roller on the rack, so as to adjust the position of the laminated insulating film and wire passing between the guide roller and the rotating roller to be flush with the back of the flexible circuit board, and at the same time, control the rotation of the rotating roller and the connecting ring to tear off the protective film on the side of the insulating film away from the wire, so that the adhesive surface of the insulating film is exposed to be laminated on the back of the flexible circuit board, completing the effect of back wire processing of the flexible circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0024] The application will be further described in conjunction with the accompanying drawings and embodiments.

[0025] Fig. 1 is a structural schematic diagram of the application.

[0026] Fig. 2 is a structural schematic diagram of the back wire unit of the application.

[0027] Fig. 3 is a structural schematic diagram of the laminator of the application.

[0028] Fig. 4 is a structural schematic diagram of the rotating roller of the application.

[0029] Fig. 5 is a structural schematic diagram of the auxiliary member of the application.

[0030] Fig. 6 is an enlarged view of A in Fig. 5 of the application.

[0031] Fig. 7 is a structural schematic diagram of the wire arranging roller of the application.

[0032] Fig. 8 is an enlarged view of B in Fig. 7 of the application.

[0033] Fig. 9 is a structural schematic diagram of the mounting base plate of the application.

[0034] In the drawings, 1 is a frame, 10 is a die-cutting head, 11 is a flexible circuit board, 12 is a wire, 13 is an insulating film, 2 is a back wire unit, 20 is a mounting base plate, 21 is a mounting side plate, 22 is a laminator, 220 is an electric telescopic rod, 221 is a guide roller, 222 is a rotating roller, 23 is an auxiliary member, 230 is a horizontal pressing plate, 231 is a driving screw, 232 is a driving end, 233 is a rotating shaft, 234 is a transmission shaft, 24 is a limiting roller, 25 is a connecting side plate, 250 is a guide groove, 26 is a wire arranging roller, and 27 is a connecting ring. DETAILED DESCRIPTION

[0035] The embodiments of the application will be described in detail in conjunction with the accompanying drawings 1 to 9. However, the application can be implemented in many different ways as defined and covered by the claims.

[0036] The embodiment of the application discloses a double-sided combined flexible circuit board die cutting and back line production equipment and process, and the double-sided combined flexible circuit board die cutting and back line production equipment and process are mainly applied to the production and processing of flexible circuit boards, and can realize die cutting and back line processing of the flexible circuit boards to be processed in technical effects; in particular, the die cutting and back line processing of the flexible circuit boards is realized on one machine, so that the problem of affecting the precision and consistency of the final circuit board caused by multiple material movements is effectively avoided; and the double-sided combined flexible circuit board die cutting and back line production equipment can also synchronously cover the required conductive wire on the back of the flexible circuit board after die cutting processing, so that the die cutting of the flexible circuit board on the front surface and the back line processing of the flexible circuit board on the back surface are realized.

[0037] Embodiment one: referring to FIG. 1 and FIG. 2, a double-sided combined flexible circuit board die cutting and back line production equipment, comprising a rack 1, a die cutting head 10 and a back line unit 2, the die cutting head 10 for die cutting processing of the flexible circuit board to be processed is arranged on the rack 1, a conveying channel is formed between the die cutting head 10 and the rack 1 for conveying the flexible circuit board 11, the back line unit 2 for covering the conductive wire 12 on the flexible circuit board 11 is arranged on the side of the rack 1 away from the die cutting head 10, and the die cutting head 10 and the back line unit 2 are matched to realize the die cutting of the flexible circuit board 11 on the front surface and the covering of the conductive wire 12 on the back surface of the flexible circuit board 11.

[0038] In use, one end of the flexible circuit board 11 wound into a roll is attached to the rack 1, the flexible circuit board 11 passes through the die cutting head 10 to be die cut and punched, then the flexible circuit board 11 continues to be attached to the rack 1 and moves forward, and the required conductive wire 12 is covered on the back surface of the die cut flexible circuit board 11 through the back line unit 2 arranged on the side of the rack 1 away from the die cutting head 10, so that the die cutting of the flexible circuit board 11 on the front surface and the covering of the conductive wire 12 on the back surface of the flexible circuit board 11 are realized, and the efficiency of the production and processing of the flexible circuit board is effectively improved.

[0039] It should be noted that the die cutting head 10 is a conventional prior art means, which mainly places the flexible circuit board 11 material on the rack 1 for conveying to the die cutting head 10 below, and then the control system of the die cutting machine is started to control the die cutting head 10 to descend, so that the cutter on the die cutting head 10 cuts according to the preset path and pressure, so as to die cut the required through hole and other shapes on the flexible circuit board 11.

[0040] Referring to Figs. 2 and 3, the back wiring unit 2 is used to cover the conductive wires 12 on the flexible circuit board 11; specifically, the back wiring unit 2 comprises a mounting base plate 20 for connecting the wire reels of the conductive wires 12, a mounting side plate 21 for connecting the insulation film 13, and a coverer 22 for covering the insulation film 13 on the conductive wires 12 and then covering the covered insulation film 13 and conductive wires 12 on the flexible circuit board 11, the mounting base plate 20, mounting side plate 21 and coverer 22 are connected with the frame 1, the insulation film 13 and conductive wires 12 are wound on the winding shafts, and the winding shafts are rotatably arranged on the mounting side plate 21 and mounting base plate 20.

[0041] In use, the winding shafts with the insulation film 13 are mounted on the mounting side plate 21, the winding shafts with the conductive wires 12 are rotatably arranged on the mounting base plate 20, and then the insulation film 13 and conductive wires 12 are pulled and stretched, so that the flexible circuit board 11, insulation film 13 and conductive wires 12 to be processed are stretched to form a position relationship of being stacked in turn, and the adhesive surface of the stretched insulation film 13 is opposite to the stretched conductive wires 12, so that the insulation film 13 is attached to the outer side of the conductive wires 12.

[0042] After the insulation film 13 and conductive wires 12 are pulled and stretched, the sliding path of the stretched insulation film 13 and conductive wires 12 is limited and guided by the coverer 22, so that all the conductive wires 12 are attached to one side of the adhesive surface of the insulation film 13 and are at the same horizontal height, and then the attached insulation film 13 and conductive wires 12 are covered on the back of the flexible circuit board 11 after die cutting, it should be noted that the adhesive surface of the insulation film 13 is covered on the conductive wires 12, and the other side of the insulation film 13 opposite to the adhesive surface is opposite to the flexible circuit board 11.

[0043] Referring to Figs. 3 and 4, the coverer 22 is used to cover the insulation film 13 on the conductive wires 12 and then cover the covered insulation film 13 and conductive wires 12 on the flexible circuit board 11; specifically, the coverer 22 comprises electric telescopic rods 220, a guide roller 221 and a rotating roller 222, the frame 1 is symmetrically connected with the electric telescopic rods 220 away from the die cutting head 10, the guide roller 221 is rotatably arranged between the telescopic sections of the two electric telescopic rods 220, and the rotating roller 222 corresponding to the guide roller 221 is rotatably arranged on the side of the frame 1 close to the guide roller 221, the relative position between the guide roller 221 and rotating roller 222 is adjusted by the electric telescopic rods 220, so that the covered insulation film 13 and conductive wires 12 pass through.

[0044] In use, the telescopic section of the electric telescopic rod 220 is controlled to extend or retract, and the telescopic section of the electric telescopic rod 220 is extended or retracted to drive the guide roller 221 connected thereto to slide synchronously, so as to adjust the relative position between the guide roller 221 and the rotating roller 222 on the rack 1, so as to re-laminate the laminated wires 12 and the insulating film 13 on the back of the flexible circuit board 11, and complete the effect of processing the flexible circuit board 11 on both sides.

[0045] Referring to FIGS. 5 to 8, the rack 1 is further provided with an auxiliary part 23 for assisting the wires 12 and the insulating film 13 to be laminated together, the auxiliary part 23 comprises a horizontal pressing plate 230, a driving screw 231 and a driving end 232, the horizontal pressing plate 230 is provided on the rack 1 corresponding to the mounting base plate 20, and two driving screws 231 are symmetrically connected to the length direction of the horizontal pressing plate 230 by threads, and the driving end 232 connected to the rack 1 is connected to any one of the driving screws 231, so as to drive the horizontal pressing plate 230 to slide in the vertical direction to assist the wires 12 and the insulating film 13 to be laminated on the glue side. It should be noted that the driving end 232 is a conventional motor technology, and the driving end 232 can drive the driving screw 231 to rotate forward and reverse, which will not be described here. When the horizontal pressing plate 230 is installed, the position of the mounting base plate 20 should be corresponding, so that there is space between the horizontal pressing plate 230 and the rack 1, so that the extended wires 12 and the insulating film 13 can pass through, that is, the horizontal pressing plate 230 is located below the extended wires 12 and the insulating film 13, and the relative position of the horizontal pressing plate 230, the wires 12, the insulating film 13 and the flexible circuit board 11 is formed.

[0046] In use, the driving end 232 drives the driving screw 231 connected thereto to rotate, and the horizontal pressing plate 230 slides in the vertical direction through the threads of the driving screw 231 after the driving screw 231 rotates, when the driving screw 231 rotates forward, the horizontal pressing plate 230 slides in the direction close to the rack 1, when the driving screw 231 rotates reversely, the horizontal pressing plate 230 moves away from the rack 1 and is out of contact with the wires 12, so as to continue to pass through the wires 12, so as to adjust the position of the horizontal pressing plate 230, the wires 12 and the insulating film 13, so that the horizontal pressing plate 230 is attached to the lower side of the wires 12, and the extended wires 12 and the insulating film 13 are pressed tightly, so that the glue surfaces of the wires 12 and the insulating film 13 are further laminated.

[0047] Further, in order to make the rotation steps of the two driving screws 231 consistent, so that the horizontal pressing plate 230 can always keep horizontal and parallel to the rack 1 when sliding along the driving screws 231 through the threads on the driving screws 231, as an optional embodiment, a synchronous pulley is further sleeved on the two driving screws 231, and the two synchronous pulleys are connected by a synchronous belt, when the driving end 232 drives the connected driving screw 231 to rotate, the driving screw 231 drives the connected synchronous pulley to rotate, and the synchronous belt drives the other synchronous pulley and the driving screw 231 to rotate, thereby realizing the synchronous rotation effect between the two driving screws 231, so that the horizontal pressing plate 230 always keeps horizontal and parallel to the rack 1.

[0048] Referring to FIGS. 5-8, the fixed section of the electric telescopic rod 220 is provided with a rotating shaft 233 connected with the rack 1, and the rack 1 is symmetrically connected with a transmission shaft 234 corresponding to the rotating shaft 233, and the transmission shaft 234 and the rotating shaft 233 are connected by bevel gears. In use, the transmission shaft 234 is rotated to drive the rotating shaft 233 to rotate synchronously through the connected bevel gears, so that the electric telescopic rod 220 drives the connected guide roller 221 to rotate at an angle, so as to further adjust the relative position between the guide roller 221 and the rotating roller 222, thereby facilitating the overlapping of the wires 12 and the insulating film 13 and the lamination with the back of the flexible circuit board 11.

[0049] Referring to FIGS. 5-8, the end of the transmission shaft 234 away from the bevel gear is connected with the driving screw 231 by a bevel gear.

[0050] It should be noted that the bevel gear transmission is a conventional technical means, which mainly realizes the synchronous rotation effect between the driving screw 231 and the transmission shaft 234 and between the transmission shaft 234 and the rotating shaft 233 through the meshing transmission between the two meshing bevel gears.

[0051] Referring to FIG. 5 to FIG. 8, the limiting roller 24 for limiting the position of the wire 12 is also connected between the mounting substrate 20 and the mounting side plate 21, so that all the wires 12 connected to the mounting substrate 20 are in the same plane. In use, the wire 12 on the mounting substrate 20 is pulled to slide along the surface of the mounting substrate 20 and then passes between the mounting substrate 20 and the limiting roller 24. When the wire 12 passes through the limiting roller 24, the surface of the limiting roller 24 contacts and generates a frictional force, which drives the limiting roller 24 to rotate, so that the wire 12 continues to slide along the surface of the mounting substrate 20. At the same time, the limiting roller 24 abuts all the wires 12 in contact, so that the wires 12 are attached to the surface of the mounting substrate 20, and all the wires 12 are kept at the same horizontal height and attached to the adhesive surface of the insulating film 13, thereby improving the accuracy and consistency of the back wire of the flexible circuit board 11.

[0052] Further, referring to FIG. 7 to FIG. 9, the mounting substrate 20 is arranged in a bent shape. The horizontal section of the mounting substrate 20 is connected to the connecting side plate 25 connected to the rack 1 to mount the mounting substrate 20. The mounting substrate 20 and the rack 1 are spaced apart by a gap to allow the insulating film 13 and the wire 12 to pass through. The mounting substrate 20 has a plurality of guide grooves 250 on the side away from the wire 12 spool, and the plurality of guide grooves 250 correspond to the positions of the wires 12 to guide and limit the sliding path of the wires 12. In use, the plurality of wires 12 are embedded in the corresponding guide grooves 250 on the mounting substrate 20. When extending along the guide grooves 250, all the wires 12 are kept at the same horizontal height by the abutment of the limiting roller 24. It should be noted that the wire 12 used in this embodiment is preferably a flat wire 12, so that the wire 12 is more easily kept at the same horizontal height and covered by the insulating film 13.

[0053] Referring to FIG. 7 to FIG. 9, the lower end of the mounting substrate 20 is also connected to the wire arranging roller 26 for further guiding the guide position. The wire arranging roller 26 also has a plurality of guide grooves 250 corresponding to the positions of the wires 12, and the plurality of wires 12 are transitionally attached to the mounting substrate 20 via the guide grooves 250 on the wire arranging roller 26. In use, the wire 12 is pulled through the guide grooves 250 at the wire arranging roller 26, so that the wire 12 is more easily attached to the guide grooves 250 on the side of the mounting substrate 20 close to the rack 1. When the wire 12 is pulled through the wire arranging roller 26, the wire arranging roller 26 is driven to rotate by the frictional stress between the wire 12 and the wire arranging roller 26, so as to reduce the friction between the wire 12 and the mounting substrate 20 when the wire 12 slides along the outer side of the mounting substrate 20, thereby avoiding the problem of surface damage of the wire 12 due to excessive friction.

[0054] Meanwhile, the guide groove 250 arranged on the wire arranging roller 26 can effectively guide the sliding path of the plurality of wires 12, so that the wires 12 slide along the guide groove 250 on the wire arranging roller 26 and are combed to pass through the gap between the mounting base plate 20 and the limiting roller 24 in an orderly manner, so that all the wires 12 are in the same plane and then are laminated with the adhesive surface of the insulating film 13.

[0055] Referring to FIGS. 3 and 4, the outer side of the rotating roller 222 is coaxially sleeved with a connecting ring 27, and the connecting ring 27 is provided with an opening for exposing the rotating roller 222 to be laminated with the insulating film 13. Since the connecting ring 27 is sleeved on the outer side of the rotating roller 222, a step difference is formed between the opening of the connecting ring 27 and the outer side of the rotating roller 222. During use, when the insulating film 13 is pulled to pass through the gap between the guide roller 221 and the rotating roller 222, the rotating roller 222 on the frame 1 is driven to rotate by using the existing motor technology (not shown in the figure), and the rotating roller 222 drives the connecting ring 27 to rotate. Since the step difference is formed between the opening of the connecting ring 27 and the outer side of the rotating roller 222, the opening of the connecting ring 27 is continuously scraped against the protective film on the upper side of the insulating film 13 as the connecting ring 27 rotates, so as to exert a counterforce on the insulating film 13 laminated on the outer side of the rotating roller 222 and the connecting sleeve in the opposite direction when the insulating film 13 passes through the gap between the rotating roller 222 and the guide roller 221, so as to tear the protective film on the upper side of the insulating film 13 by the rotation of the connecting ring 27, and make the adhesive surface on the side of the insulating film 13 away from the flexible circuit board 11 also leak out.

[0056] After the protective film on the insulating film 13 is torn, the guide roller 221 is driven to move close to the rotating roller 222 by the electric telescopic rod 220, so as to adjust the position and angle of the insulating film 13 with the protective film torn on the upper side, so as to laminate the adhesive surface on the upper side of the insulating film 13 on the back of the flexible circuit board 11. After the insulating film 13 is laminated on the flexible circuit board 11, the insulating film 13 is continuously stretched by the conveying of the flexible circuit board 11 and the adhesion between the adhesive surface of the insulating film 13 and the flexible circuit board 11.

[0057] Further, in order to tear the protective film on the upper side of the insulating film 13 and make the adhesive surface on the other side of the insulating film 13 leak out, the rotating roller 222 is preferably a hot roller with a certain heating function. The insulating film 13 is laminated on the hot roller by the guide roller 221, the hot roller conducts heat to the protective film on the insulating film 13, so as to soften the adhesive between the protective film and the adhesive surface on the insulating film 13, thereby reducing the adhesion between the protective film and the adhesive surface. At this time, the counterforce is exerted on the protective film by the connecting ring 27, so as to tear the protective film on the insulating film 13.

[0058] At the same time, the contact area of the rotating roller 222 and the flexible circuit board 11 is effectively reduced by the connecting ring 27 sleeved outside the rotating roller 222, and heat conduction of the rotating roller 222 to the flexible circuit board 11 is avoided. After the protective film on the insulating film 13 is torn off, due to the temperature difference between the outer side of the flexible circuit board 11 and the insulating film 13, the adhesive on the adhesive surface of the insulating film 13 is quickly cooled and adhered to the back of the flexible circuit board 11 after contacting the flexible circuit board 11, so as to drive the insulating film 13 and the wire 12 after lamination to continue to be stretched by the adhesion between the flexible circuit board 11 and the insulating film 13, and the effect of laminating the wire 12 on the back of the flexible circuit board 11 is achieved.

[0059] In the embodiment, the flat wire 12 required can be directly purchased in the market, but due to the large number of models of the flat wire 12 required, the difficulty and cost of procurement are greatly increased. In order to effectively reduce the difficulty and cost of procurement, the horizontal pressing plate 230 is arranged to be directly connected with the horizontal section of the mounting base plate 20. Similarly, the connecting side plate 25 connected with the rack 1 on the mounting base plate 20 is arranged in an up-down telescopic structure, and the mounting base plate 20 is connected with the telescopic section of the connecting side plate 25.

[0060] In use, the conventional round wire 12 in the market is normally purchased, wound and connected with the inner side of the mounting base plate 20, and then the round wire 12 is pulled through the wire arranging roller 26 and the limiting roller 24. At this time, the driving end 232 drives the driving screw 231 connected therewith to rotate forward, the driving screw 231 drives the horizontal pressing plate 230 to drive the mounting base plate 20 to slide towards the rack 1, the mounting base plate 20 drives the connecting side plate 25 connected therewith to shrink after moving, and the relative distance between the mounting base plate 20 and the limiting roller 24 is also reduced after moving. The mounting base plate 20 is driven to slide towards the rack 1 again, so that the mounting base plate 20 and the limiting roller 24 can flatten the passing round wire 12, and the flattened round wire 12 is embedded in the guide groove 250 of the mounting base plate 20.

[0061] After the flattening of the round wire 12 is completed, the round wire 12 is pulled forward again to make the flattened round wire 12 contact the adhesive surface of the insulating film 13, so that the flattened round wire 12 is laminated on the adhesive surface of the insulating film 13.

[0062] It should be noted that in the present embodiment, the insulating film 13 needs to be pulled in advance to be combined on the back of the flexible circuit board 11, at this time, the flexible circuit board 11 after being combined drives the insulating film 13 to extend, after the round wire 12 is flattened and contacted with the adhesive surface of the insulating film 13, the insulating film 13 drives the round wire 12 to continue to extend, so as to complete the effect of combining the round wire 12 on the back of the flexible circuit board 11.

[0063] In addition, the present application also provides a production process of double-sided combined flexible circuit board die cutting and back line, comprising the following steps:

[0064] S1: The flexible circuit board 11 of the roll material is attached on the rack 1 for conveying, and the die cutting head 10 is used for die cutting in the conveying process, and the insulating film 13 and the plurality of round wires 12 are wound and connected on the side of the rack 1 away from the die cutting head 10, and the insulating film 13 and the round wires 12 are connected on the rack 1 with a spacing distance.

[0065] S2: The plurality of round wires 12 and the insulating film 13 connected on the rack 1 are pulled in turn, so that the plurality of round wires 12 are evenly arranged and distributed on the same plane along the outer side of the mounting substrate 20, and then the adhesive surface of the round wire 12 is combined on all the round wires 12, so as to complete the combination of the insulating film 13 and the round wire 12.

[0066] S3: After the combination of the insulating film 13 and the round wire 12 is completed, the combined insulating film 13 and round wire 12 are pulled again to drive them to pass through the combiner 22, and then the insulating film 13 and the round wire 12 are combined on the back of the flexible circuit board 11 through the guidance of the combiner 22, so as to form the effect of processing and processing the double-sided combined flexible circuit board 11.

[0067] It is apparent to those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, and the scope of the present application should be defined by the appended claims rather than the foregoing description, and it is intended to include all changes falling within the meaning and scope of equivalents of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

[0068] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments which can be understood by those skilled in the art.

Claims

1. A production equipment for die-cutting and back-line fabrication of double-sided flexible printed circuit boards, comprising a frame (1) and a die-cutting head (10) on the frame (1) for die-cutting the flexible printed circuit board (11) to be processed, characterized in that: The die-cutting head (10) and the rack (1) form a conveying channel for the flexible circuit board (11) to be conveyed, and the rack (1) is provided with a back wire unit (2) on the side away from the die-cutting head (10) for laminating the wires (12) on the back of the flexible circuit board (11), and the die-cutting head (10) and the back wire unit (2) cooperate to form the effect of die-cutting the front of the flexible circuit board (11) and laminating the wires (12) on the back of the flexible circuit board (11), wherein: The back wire unit (2) comprises a mounting base plate (20) for connecting a plurality of wire spools (12), a mounting side plate (21) for connecting an insulating film (13), and a laminator (22) for laminating the insulating film (13) on the plurality of wires (12) and then laminating the laminated insulating film (13) and wires (12) on the flexible circuit board (11), the mounting base plate (20), the mounting side plate (21) and the laminator (22) are connected to the rack (1), and the insulating film (13) and the plurality of wires (12) are connected to the mounting side plate (21) and the mounting base plate (20) in a coiled manner, respectively.

2. The double-sided combined flexible wiring board die-cutting and back wiring production apparatus according to claim 1, characterized by: The laminator (22) comprises two electric telescopic rods (220) symmetrically connected to the rack (1) away from the die-cutting head (10), a guide roller (221) is arranged between the telescopic sections of the two electric telescopic rods (220), a rotating roller (222) corresponding to the guide roller (221) is arranged on the rack (1) close to the guide roller (221), and the relative position between the guide roller (221) and the rotating roller (222) is adjusted by the electric telescopic rod (220) to allow the laminated insulating film (13) and wires (12) to pass through.

3. The double-sided combined flexible wiring board die-cutting and back wiring production apparatus according to claim 1, characterized by: The rack (1) is further provided with an auxiliary part (23) for assisting the lamination of the wires (12) and the insulating film (13), the auxiliary part (23) comprises a horizontal pressing plate (230) arranged on the rack (1) corresponding to the mounting base plate (20), a drive screw (231) is threadedly connected to the horizontal pressing plate (230), a drive end (232) connected to the rack (1) is connected to the drive screw (231) to drive the horizontal pressing plate (230) to slide in the vertical direction and assist the lamination of the adhesive side of the wires (12) and the insulating film (13).

4. The production apparatus of the double-sided combined flexible wiring board die cut and back wiring according to claim 2, characterized by: The fixed section of the electric telescopic rod (220) is provided with a rotating shaft (233) connected to the rack (1), and a transmission shaft (234) corresponding to the rotating shaft (233) is symmetrically connected to the rack (1), and the transmission shaft (234) and the rotating shaft (233) are connected through a bevel gear meshing transmission.

5. The double-sided combined flexible wiring board die-cutting and back wiring production apparatus according to claim 4, characterized by: The end of the transmission shaft (234) away from the bevel gear is also connected to the drive screw (231) through a bevel gear meshing transmission.

6. The double-sided combined flexible wiring board die-cutting and back wiring production apparatus according to claim 1, characterized by: The mounting base plate (20) and the mounting side plate (21) are further connected with a limiting roller (24) for limiting the position of the wires (12) to make all the wires (12) connected to the mounting base plate (20) in the same plane.

7. The double-sided combined flexible wiring board die-cutting and back wiring production apparatus according to claim 1, characterized by: The mounting base plate (20) is arranged in a bent shape, a plurality of wires (12) are connected to the inner side of the bent section of the mounting base plate (20), a plurality of guide grooves (250) are formed on the side of the mounting base plate (20) away from the wire coil of the wire (12), and the plurality of guide grooves (250) correspond one-to-one to the positions of the wires (12) to guide and limit the sliding path of the wires (12).

8. The double-sided combined flexible wiring board die-cutting and back wiring production apparatus according to claim 7, characterized by: The lower end of the mounting base plate (20) is also connected to a wire arranging roller (26) for further guiding the guide position, and the wire arranging roller (26) is also provided with a plurality of guide grooves (250) corresponding to the wires (12), and the plurality of wires (12) are transitionally attached to the mounting base plate (20) through the guide grooves (250) on the wire arranging roller (26).

9. The production apparatus of the double-sided combined flexible wiring board die cut and back wiring according to claim 2, characterized by: The outer side of the rotating roller (222) is also coaxially sleeved with a connecting ring (27), and the connecting ring (27) is provided with an opening for partially exposing the rotating roller (222) to attach to the insulating film (13).

10. A production process of a double-sided build-up flexible wiring board die cutting and back wiring using the production apparatus of the double-sided build-up flexible wiring board die cutting and back wiring according to any one of claims 1 to 9, characterized in that, The production process comprises the following steps: S1: The flexible circuit board (11) of the roll material is attached to the rack (1) for conveying, and is subjected to die cutting treatment by the die cutting head (10) during conveying, and the insulating film (13) and the plurality of wires (12) are wound and formed to be connected to the side of the rack (1) away from the die cutting head (10), and the insulating film (13) and the wires (12) are connected to the rack (1) with a spacing distance; S2: The plurality of wires (12) and the insulating film (13) connected to the rack (1) are sequentially pulled, so that the plurality of wires (12) are evenly arranged and distributed on the same plane along the outer side of the mounting base plate (20), and then the adhesive side of the wire (12) is laminated on all the wires (12) to complete the lamination of the insulating film (13) and the wire (12); S3: After completing the lamination of the insulating film (13) and the wire (12), the laminated insulating film (13) and wire (12) are pulled again to pass through the laminator (22), and then the laminator (22) guides the insulating film (13) and the wire (12) to be laminated on the back of the flexible circuit board (11), forming a double-sided combination to process and manufacture the flexible circuit board (11).

Images