Infrared thermometer sensor structure

Abstract

An infrared thermometer sensor structure, which is applied to a thermometer (100). The infrared thermometer sensor structure comprises a thermopile sensor (1) and a heating element (2), wherein the thermopile sensor (1) is mounted in a housing (101) of the thermometer (100), and the thermopile sensor (1) comprises a body (11) and a pin (12), one end of the pin (12) being connected to the body (11), and the other end of the pin (12) being mounted on a circuit board (102) in the thermometer (100); and the heating element (2) is sleeved on the pin (12) and attached to the body (11), and the heating element (2) is electrically connected to the circuit board (102). By controlling the heating temperature range of the heating element (2), the ambient temperature sensed by the thermopile sensor (1) will be maintained within a stable range, thereby improving the accuracy of temperature measurement; and compared with the prior art, a copper sleeve (5') is eliminated, thereby avoiding various problems caused by the copper sleeve (5').

Description

Infrared thermometer sensor structure TECHNICAL FIELD

[0001] The utility model relates to temperature measuring instrument technical field especially, relates to an infrared thermometer sensor structure. BACKGROUND

[0002] The infrared temperature measurement of infrared thermometer adopts thermoelectric pile infrared sensor temperature measurement, and the core part is thermoelectric pile and thermistor, wherein the infrared thermal sensitive material of thermoelectric pile absorbs the infrared ray of target object and generates heat to make itself temperature rise, and the thermocouple generates voltage by the temperature difference of two ends, and a large number of thermocouple voltages are connected in series to generate voltage output, the voltage signal is input MCU after being amplified and AD digital-analog conversion, and the temperature difference AT of target object temperature and ambient temperature is obtained by calculation or table lookup; The temperature of the temperature measurement sensor package, that is, the temperature of the cold contact point, is determined by the ambient temperature Tamb of the temperature-resistance table through the method of MCU collecting the resistance value of thermistor. The target temperature (the temperature of target object) is the weighted sum of AT and Tamb.

[0003] The thermoelectric pile sensor is the core component of infrared thermometer, and its function is to perceive the infrared radiation emitted by the object and convert it into an electrical signal. The existence of ambient temperature inevitably affects the sensor temperature, which in turn leads to temperature measurement error. When the ambient temperature rises, the sensor temperature rises, resulting in high temperature measurement value; on the contrary, when the ambient temperature decreases, the sensor temperature decreases, resulting in low temperature measurement value. Therefore, there is a close relationship between the ambient temperature and the sensor temperature, and the environmental influence needs to be reduced by temperature compensation means. The infrared radiation of the object surface not only contains the radiation energy of the object itself, but also is affected by the ambient temperature. The existence of ambient temperature interferes with the infrared radiation of the object surface, which in turn affects the accuracy of temperature measurement. The effective temperature of the object surface measured by the thermal radiation infrared thermometer is affected by the ambient temperature.

[0004] The current infrared thermometer on the market lacks a clear technical solution in reducing the influence of ambient temperature. If the influence of ambient temperature still exists, the use of infrared thermometer will be more limited, such as needing to be placed for at least half an hour under similar ambient temperature before use. Otherwise, the temperature measurement result may have a large difference, and even may cause the risk of delayed treatment. As shown in FIG. 1 and FIG. 2 (FIG. 1 is a structural schematic diagram of a conventional temperature measurement instrument, and FIG. 2 is a partial structural schematic diagram of FIG. 1), in the current infrared temperature measurement instrument design, a copper sleeve 5' is sleeved on the thermoelectric pile sensor 1' to achieve rapid transmission of ambient temperature, so that the thermoelectric pile sensor 1' can quickly perceive the ambient temperature. However, the use of the copper sleeve 5' results in that once the thermoelectric pile sensor 1' and the copper sleeve 5' have structural or surface interference, causing uneven or not close contact, there will be a large error in the temperature conducted by the copper sleeve 5' to the thermoelectric pile sensor 1', which will affect the measured temperature, and because of the structural interference between the copper sleeve 5' and the thermoelectric pile sensor 1', the sensor may be damaged due to manufacturing problems during assembly.

[0005] Therefore, it is urgent to find a new design of infrared temperature measurement instrument that can resist the interference of ambient temperature.

[0006] Invention content

[0007] In view of the above problems existing in the prior art, the present application aims to provide an infrared temperature measurement instrument sensor structure.

[0008] The specific technical solutions are as follows:

[0009] An infrared temperature measurement instrument sensor structure is applied to a temperature measurement instrument, mainly comprising a thermoelectric pile sensor and a heating sheet.

[0010] The thermoelectric pile sensor is arranged in the shell of the temperature measurement instrument, and comprises a body and a pin, one end of the pin is connected with the body, the other end of the pin is arranged on a circuit board in the temperature measurement instrument, the heating sheet is sleeved on the pin and is arranged in close contact with the body, and the heating sheet is electrically connected with the circuit board.

[0011] In the above infrared temperature measurement instrument sensor structure, the heating sheet is electrically connected with the circuit board through a pin structure or a patch structure.

[0012] In the above infrared temperature measurement instrument sensor structure, a heat-conducting material is arranged between the body and the heating sheet.

[0013] In the above infrared temperature measurement instrument sensor structure, the heat-conducting material is one of heat-conducting silicone grease, heat-conducting silicone pad, heat-conducting glue, heat-conducting filling glue, or heat-conducting silicone glue.

[0014] The infrared thermometer sensor structure has the feature that the diameter of the heating sheet is greater than the diameter of the body.

[0015] The infrared thermometer sensor structure has the feature that the heating sheet is a ceramic heating sheet.

[0016] The technical scheme has the following beneficial effects:

[0017] The infrared thermometer sensor structure has the feature that the diameter of the heating sheet is greater than the diameter of the body. BRIEF DESCRIPTION OF DRAWINGS

[0018] Fig. 1 is a structural schematic diagram of a conventional thermometer;

[0019] Fig. 2 is a partial structural schematic diagram of Fig. 1;

[0020] Fig. 3 is a structural schematic diagram of a thermometer according to the present application;

[0021] Fig. 4 is a partial structural schematic diagram of Fig. 3.

[0022] In the drawings: 100, thermometer; 101, housing; 102, circuit board; 1, thermoelectric pile sensor; 11, body; 12, pin; 2, heating sheet; 1', thermoelectric pile sensor; 5', copper sleeve. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below with reference to the embodiments and the drawings. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0024] The serial numbers of components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and have no technical meaning. Unless otherwise specified, the "connection" and "coupling" in this application include direct and indirect connections (couplings). In the description of the utility model, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0025] In the utility model, unless otherwise specified and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature can be above, above and above the second feature, or only the first feature can be higher than the second feature in horizontal height. The first feature can be below, below and below the second feature, or only the first feature can be lower than the second feature in horizontal height.

[0026] Please refer to FIG. 3 and FIG. 4, show a preferred embodiment, the utility model discloses an infrared thermometer sensor structure, be applied to the thermometer 100, wherein, the specific structure of thermometer 100 is not repeated here, this infrared thermometer sensor structure includes: thermoelectric pile sensor 1 and heating sheet 2;

[0027] The thermoelectric pile sensor 1 is installed in the shell 101 of the thermometer 100, the thermoelectric pile sensor 1 includes a body 11 and a pin 12, one end of the pin 12 is connected with the body 11, the other end of the pin 12 is installed on the circuit board 102 in the thermometer 100, the heating sheet 2 is sleeved on the pin 12 and is attached to the body 11, and the heating sheet 2 is electrically connected with the circuit board 102.

[0028] The infrared temperature measuring instrument sensor structure provided by the utility model, the MCU of the circuit board 102 of the temperature measuring instrument 100 controls the heating sheet 2 to generate heat, the heat generated by the heating sheet 2 will be conducted to the thermoelectric pile sensor 1 with extremely high transmission efficiency, the heating temperature range of the heating sheet 2 is controlled, and the ambient temperature perceived by the thermoelectric pile sensor 1 will be maintained in a stable range, and it can be known through the infrared temperature measuring principle that the ambient temperature in a stable range will greatly improve the accuracy of temperature measurement, compared with the prior art, the copper sleeve is cancelled, and various problems caused by the copper sleeve are avoided.

[0029] Optionally, as a preferred embodiment, the heating sheet 2 is electrically connected with the circuit board 102 through a pin structure or a patch structure. The pin structure can refer to the pin 12 of the thermoelectric pile sensor 1, and details are not described herein. The patch structure can be a flexible metal sheet or a flexible circuit board, and the patch structure can be a Z-shaped sheet structure. One end of the patch structure is welded on the circuit board 102, and the other end of the patch structure is electrically connected with the heating sheet 2.

[0030] Preferably, a heat-conducting material is arranged between the body 11 and the heating sheet 2. Optionally, the heat-conducting material can be one of heat-conducting silicone grease, heat-conducting silicone pad, heat-conducting glue, heat-conducting filling glue or heat-conducting silicone glue.

[0031] Optionally, the diameter of the heating sheet 2 is greater than the diameter of the body 11.

[0032] Optionally, the heating sheet 2 is a ceramic heating sheet. The heating sheet 2 can reach a preset temperature range through the control of the circuit board 102.

[0033] Optionally, in the embodiment, the thermoelectric pile sensor 1 and the heating sheet 2 are bonded through heat-conducting silicone grease.

[0034] The infrared temperature measuring instrument sensor structure provided by the utility model, the heating sheet 2 can generate a stable heat source through the control of the circuit board 102, and does not need to rely on the high-precision temperature sensor (thermistor) of the thermoelectric pile sensor 1 to perceive the ambient temperature. For manufacturers, the function can be realized to obtain a wider sensor source.

[0035] The technical features of the above embodiments can be combined arbitrarily, and to make the description concise, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, it should be considered that the combinations are within the scope of the present application.

[0036] The above-described embodiments only express several implementation manners of the present application, the description is relatively specific and detailed, but cannot be understood as a limitation on the patent scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. An infrared thermometer sensor structure applied to a thermometer, characterized in that, The application relates to a thermocouple sensor and a heating sheet. The thermocouple sensor is arranged in the shell of the temperature measuring instrument, the thermocouple sensor comprises a body and a pin, one end of the pin is connected with the body, the other end of the pin is arranged on a circuit board in the temperature measuring instrument, the heating sheet is sleeved on the pin and is arranged in close contact with the body, and the heating sheet is electrically connected with the circuit board. The heating sheet is electrically connected with the circuit board through a pin structure or a patch structure.

2. The infrared thermometer sensor structure of claim 1, wherein, A heat-conducting material is arranged between the body and the heating sheet.

3. The infrared thermometer sensor structure according to any one of claims 1 and 2, characterized in that, The heat-conducting material is one of heat-conducting silicone grease, heat-conducting silicone pad, heat-conducting glue, heat-conducting filling glue and heat-conducting silica gel.

4. The infrared thermometer sensor structure of claim 3, wherein, The diameter of the heating sheet is greater than the diameter of the body.

5. The infrared thermometer sensor structure according to any one of claims 1 and 2, characterized in that, The heating sheet is a ceramic heating sheet.

6. The infrared thermometer sensor structure according to any one of claims 1 and 2, characterized in that, ​

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