Dot matrix display and preparation method therefor

Abstract

A dot matrix display and a preparation method therefor. The dot matrix display (10) comprises: an insulating substrate (11), a plurality of light-emitting units (12), a plurality of first encapsulants (13), a first light-shielding layer (14), a plurality of second encapsulants (15), and a second light-shielding layer (16). The plurality of light-emitting units (12) are provided on the insulating substrate (11) and are arranged in a matrix. Each first encapsulant (13) correspondingly encapsulates the outside of each light-emitting unit (12). The first light-shielding layer (14) is provided on the insulating substrate (11) and comprises a plurality of first through holes (141), and the first encapsulants (13) are located in the first through holes (141) of the first light-shielding layer (14). The second light-shielding layer (16) is provided on the first light-shielding layer (14) and comprises a plurality of second through holes (161), and each second encapsulant (15) encapsulates each first encapsulant (13) and is located in a second through hole (161) of the second light-shielding layer (16).

Description

Matrix screen and preparation method thereof

[0001] The present application claims priority to the Chinese patent application No. 2024113499632, filed on September 26, 2024, and entitled "Matrix screen and preparation method thereof", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of LED, in particular to a matrix screen and a preparation method thereof. BACKGROUND

[0003] The matrix screen is composed of multiple independent small LED display screen modules, each small module is an independent unit and can be controlled independently, and an image or text is formed by controlling the brightness or color of each unit. The matrix screen can be monochrome or full-color, static or dynamic.

[0004] However, as the resolution of images and videos is getting higher and higher, the display precision of the matrix screen is also increasing, and a matrix screen with high display precision is urgently needed. SUMMARY

[0005] The present application provides a matrix screen and a preparation method thereof, aiming to solve the problem that the display precision of the existing matrix screen cannot meet the resolution requirements of images and videos.

[0006] In a first aspect, the present application provides a matrix screen, comprising:

[0007] an insulating substrate;

[0008] a plurality of light emitting units, the light emitting units being arranged on the insulating substrate, the plurality of light emitting units being arranged in a matrix to form an LED array, each light emitting unit comprising a pin, a light emitting wafer arranged on the pin, and a driving chip for driving the light emitting wafer to emit light;

[0009] a plurality of first encapsulation gels, each first encapsulation gel being encapsulated outside each light emitting unit;

[0010] a first light shielding layer, the first light shielding layer being arranged on the insulating substrate, the first light shielding layer comprising a plurality of first through holes, and the first encapsulation gel being arranged in the first through holes;

[0011] a plurality of second encapsulation gels, each second encapsulation gel being encapsulated on each first encapsulation gel, wherein the area of the second encapsulation gel projected on the insulating substrate is larger than the area of the first encapsulation gel projected on the insulating substrate;

[0012] a second light shielding layer, the second light shielding layer being arranged on the first light shielding layer, the second light shielding layer comprising a plurality of second through holes, and the second encapsulation gel being arranged in the second through holes;

[0013] Wherein, when the plurality of light emitting units emit light, the first light shielding layer and the second light shielding layer can shield the light emitted by the light emitting units from being emitted from the side, and make the light emitted from the second through hole.

[0014] The matrix screen is first formed by arranging a plurality of light emitting units in a matrix to form an LED array, each light emitting unit comprising a light emitting wafer and a driving chip. Then the light emitting units are wrapped by a first layer and a second layer of encapsulation glue to play a protective role, and through the through hole design of the first and second light shielding layers, front light projection is realized. Finally, through the two layers of light shielding layers, it is ensured that the light is emitted from the through hole, and the scattering of the side light is reduced.

[0015] Further, the matrix screen provided by the application ensures that the light is only emitted from the front through the design of multiple light shielding layers and encapsulation glue, avoids the emission of light from the side, and improves the light emitting effect. At the same time, the two layers of light shielding layers block unnecessary light leakage from the side, reduce the light interference between different light emitting units, and optimize the display effect. Through the design of the light shielding layer, the light interference between the light emitting units is prevented, and the multi-layer encapsulation glue design protects the light emitting units, improves the stability and durability of the matrix screen.

[0016] In a second aspect, the embodiments of the present application provide a preparation method of a matrix screen, comprising:

[0017] An insulating substrate is provided, which comprises a plurality of light emitting units arranged in a matrix to form an LED array, each light emitting unit comprising a pin and a light emitting wafer disposed on the pin and a driving chip for driving the light emitting wafer to emit light;

[0018] First-time molding is performed on the insulating substrate to form a plurality of first encapsulation glues outside the plurality of light emitting units disposed on the insulating substrate;

[0019] Second-time molding is performed according to the shape and position of the first encapsulation glue to obtain a first light shielding layer, the first light shielding layer comprising a plurality of first through holes;

[0020] The first light shielding layer is disposed on the insulating substrate, and the first encapsulation glue is located in the first through hole;

[0021] Third-time molding is performed on the first light shielding layer to form a target glue layer on the first light shielding layer;

[0022] The target glue layer is cut to obtain a plurality of second encapsulation glues and a flow glue channel; wherein the plurality of second encapsulation glues are respectively disposed on the plurality of first encapsulation glues, and the area of the second encapsulation glue projected on the insulating substrate is greater than the area of the first encapsulation glue projected on the insulating substrate;

[0023] A second light shielding layer is disposed outside the second encapsulation glue through the flow glue channel, the second light shielding layer comprising a plurality of second through holes, and the second encapsulation glue being located in the second through hole.

[0024] The provided method first forms the first encapsulation glue, the first light shielding layer and the second encapsulation glue respectively through a three-time molding process, ensuring the accurate matching of the encapsulation and light shielding layers. Then the setting position of the second light shielding layer is accurately controlled using a flow channel, ensuring that the light is emitted positively from the through hole. Then the target glue layer forms the second encapsulation glue after cutting, and ensures that the area is larger than that of the first encapsulation glue, further optimizing the light control and protection of the light emitting unit. Finally, through the design of two layers of light shielding layers and two layers of encapsulation glue, the light is emitted from the front through the through hole structure, while avoiding the leakage of side light.

[0025] In summary, the provided method accurately controls the encapsulation and light emission direction of the light emitting unit through multiple molding and the design of the flow channel, ensuring that the light is emitted from the front. At the same time, the molding process ensures the accurate positioning of the encapsulation and light shielding layers, reduces light interference and improves light emitting efficiency. The problem of accurate matching between the encapsulation glue and the light shielding layer is solved, and the leakage of light from the side is avoided, reducing the interference between the light emitting units.

[0026] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0028] Fig. 1 is a structural schematic diagram of a matrix screen provided by the embodiment of the present application;

[0029] Fig. 2 is a front view corresponding to the matrix screen provided by Fig. 1;

[0030] Fig. 3 is an exploded schematic diagram corresponding to the matrix screen provided by Fig. 1;

[0031] Fig. 4 is a structural schematic block diagram of a single light emitting unit corresponding to the matrix screen provided by Fig. 1;

[0032] Fig. 5 is a structural schematic block diagram of a first conductive sheet, a second conductive sheet and a signal input unit corresponding to the matrix screen provided by Fig. 1;

[0033] Fig. 6 is a structural schematic block diagram of a protection plate corresponding to the matrix screen provided by Fig. 1;

[0034] Fig. 7 is a structural schematic block diagram of a first light shielding layer and a first encapsulation glue corresponding to the matrix screen provided by Fig. 1;

[0035] Figure 8 is a schematic flow chart of the steps of the preparation method according to an embodiment of the present application.

[0036] Main elements and symbol explanation: 10, matrix screen. 11, insulating substrate; 111, conductive via. 12, light emitting unit; 121, driving chip; 122, light emitting wafer; 123, pin; 1231, ground pin; 1232, power pin; 1233, signal input pin; 1234, signal output pin. 13, first encapsulation glue. 14, first light shielding layer; 141, first via. 15, second encapsulation glue. 16, second light shielding layer; 161, second via. 17, first conductive sheet. 18, second conductive sheet. 19, patch board. 10a, conductive column. 10b, signal input unit; 10b1, signal input terminal; 10b2, signal input interface.

[0037] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and are not intended to limit the present application. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0039] The flow chart shown in the drawings is only an example and is not necessarily required to include all the contents and operations / steps, and is not necessarily required to be executed in the described order. For example, some operations / steps can be further divided, combined or partially merged, and thus the actual execution order can be changed according to the actual situation.

[0040] It should be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, unless otherwise clearly indicated by the context, the singular forms "a", "an" and "the" are intended to include the plural forms as well.

[0041] It should be understood that, in order to clearly describe the technical solutions in the embodiments of the present application, in the embodiments of the present application, the terms "first", "second" and the like are used to distinguish the same or similar items or elements with basically the same functions and effects. For example, the first encapsulation glue and the second encapsulation glue are only used to distinguish different support members and do not limit the sequence. Those skilled in the art can understand that the terms "first", "second" and the like do not limit the quantity and execution order, and the terms "first", "second" and the like do not necessarily mean different.

[0042] It should also be appreciated that the term "and / or" as used herein in the specification and in the claims, if any, means one or the other or both of the associated listed items, and is not intended to exclude any combination of one or more of the associated listed items.

[0043] The matrix screen is composed of multiple independent small LED display screen modules, each small module is an independent unit and can be controlled individually, and an image or text is formed by controlling the brightness or color of each unit. The matrix screen can be monochrome or full-color, and can be static or dynamic.

[0044] However, as the resolution of current images and videos is getting higher and higher, the display precision requirement of the matrix screen is also increasing, and a matrix screen with high display precision is urgently needed.

[0045] Please refer to FIGS. 1-7. The embodiment of the present application provides a matrix screen 10, which comprises an insulating substrate 11, a plurality of light emitting units 12, a plurality of first encapsulation gels 13, a first light shielding layer 14, a plurality of second encapsulation gels 15 and a second light shielding layer 16. The light emitting unit 12 is arranged on the insulating substrate 11, and the plurality of light emitting units 12 are arranged in a matrix to form an LED array. The light emitting unit 12 comprises a pin 123, a light emitting wafer 122 arranged on the pin 123 and a driving chip 121 for driving the light emitting wafer 122 to emit light. Each first encapsulation gel 13 is encapsulated outside each light emitting unit 12. The first light shielding layer 14 is arranged on the insulating substrate 11, and the first light shielding layer 14 comprises a plurality of first through holes 141, and the first encapsulation gel 13 is located in the first through hole 141. Each second encapsulation gel 15 is encapsulated on each first encapsulation gel 13, wherein the area of the second encapsulation gel 15 projected on the insulating substrate 11 is greater than the area of the first encapsulation gel 13 projected on the insulating substrate 11. The second light shielding layer 16 is arranged on the first light shielding layer 14, and the second light shielding layer 16 comprises a plurality of second through holes 161, and the second encapsulation gel 15 is located in the second through hole 161. When the plurality of light emitting units 12 emit light, the first light shielding layer 14 and the second light shielding layer 16 can shield the light emitted by the light emitting unit 12 from the side and make the light emit from the second through hole 161.

[0046] Specifically, the provided matrix screen 10 comprises an insulating substrate 11, a plurality of light-emitting units 12 (constituting an LED array), a plurality of first encapsulation adhesives 13, a first light-shielding layer 14, a plurality of second encapsulation adhesives 15, and a second light-shielding layer 16. The light-emitting units 12 comprise pins 123, light-emitting wafers 122, and driving chips 121 and are arranged in a matrix. Each light-emitting unit 12 is encapsulated by the first encapsulation adhesive 13, the second encapsulation adhesive 15 is encapsulated on the first encapsulation adhesive 13, and the projection area of the second encapsulation adhesive 15 on the insulating substrate 11 is larger. The first encapsulation adhesive 13 is located in a first through hole 141 of the first light-shielding layer 14, and the second encapsulation adhesive 15 is located in a second through hole 161 of the second light-shielding layer 16. The first light-shielding layer 14 and the second light-shielding layer 16 can shield the side light of the light-emitting unit 12, and the light mainly exits from the second through hole 161. By controlling the light exit direction, the clarity and contrast of the matrix screen 10 are improved. The scattering of light is reduced, and the light interference between screens is reduced. At the same time, the double-layer encapsulation and light-shielding design improves the protection effect and service life of the LED. By controlling the light direction, the loss of invalid light is reduced, and the energy utilization efficiency is also improved

[0047] In summary, the matrix screen 10 provided by the embodiment of the present application realizes precise control of LED light emission through multi-layer encapsulation and light-shielding structure, which is expected to improve display quality, reduce light pollution, and bring improvements in energy efficiency and service life.

[0048] In some embodiments, as shown in FIGS. 2, 3, and 7, the shape of the first encapsulation adhesive 13 is adapted to the shape of the first through hole 141, and the shape of the second encapsulation adhesive 15 is adapted to the shape of the second through hole 161; wherein the shape of the first encapsulation adhesive 13 projected on the insulating substrate 11 is different from the shape of the second encapsulation adhesive 15 projected on the insulating substrate 11.

[0049] In the above embodiment, the first encapsulation adhesive 13 of the provided matrix screen 10 is adapted to the shape of the first through hole 141, and the second encapsulation adhesive 15 is adapted to the shape of the second through hole 161. By making the projection shapes of the first encapsulation adhesive 13 and the second encapsulation adhesive 15 on the substrate different, the design of the light-shielding layer and the through hole effectively blocks the light from emitting from the side, so that the light mainly exits from the second through hole 161, reducing the scattering of light, improving the directivity and uniformity of light emission, and improving the display effect. And through the design of double-layer encapsulation and different projection shapes, the light exit path is controlled, the display brightness and contrast are improved, and the interference or light pollution caused by light overflow is reduced. At the same time, the multi-layer structure of the first encapsulation adhesive 13 and the second encapsulation adhesive 15 provides better physical protection for the light-emitting unit 12, which helps to prolong the service life of the LED and enhance the ability to resist environmental influences. Through the innovative encapsulation and light-shielding design, the embodiment optimizes the light-emitting effect and service life of the LED matrix screen 10, and effectively improves the display quality.

[0050] As shown in FIG. 2, FIG. 3 and FIG. 7, the first encapsulation glue 13 projects a circular shape on the insulating substrate 11, and the second encapsulation glue 15 projects a rectangular shape on the insulating substrate 11. Furthermore, the matrix screen 10 provided by the combination of the circular shape and the rectangular shape of the first encapsulation glue 13 and the second encapsulation glue 15 respectively optimizes the diffusion and focusing effect of the light, and improves the uniformity and clarity of the display. The design of the rectangular shape inside the circular shape provides better light guiding and protection effect.

[0051] It should be noted that in some embodiments, the rectangular shape is inside the circular shape. The center of the rectangular shape coincides with the center of the circular shape. Furthermore, the center coincidence design ensures the symmetry of the light output of the matrix screen 10.

[0052] In some embodiments, the type of the first encapsulation glue 13 and the type of the second encapsulation glue 15 are different. The type of the first encapsulation glue 13 is any one of transparent glue or diffusion glue, and the type of the second encapsulation glue 15 is the other one of transparent glue or diffusion glue which is different from the type of the first encapsulation glue 13.

[0053] Transparent glue has high light transmittance, which can effectively transmit the light of the light emitting unit 12, and improve the brightness and color purity of the outgoing light. Diffusion glue can effectively scatter light, making the light more uniform, reducing bright or dark spots, and improving the uniformity of the display effect. By using different types of encapsulation glue, the high light transmittance of transparent glue and the uniform light distribution effect of diffusion glue can be combined, so that the light emitting unit 12 can perform its best under different levels of encapsulation, and the overall display effect is optimized. Different selection of the first encapsulation glue 13 and the second encapsulation glue 15 can more accurately control the light emission and scattering path in the design, increase the flexibility of the design, and help achieve the best display effect. Using different types of encapsulation glue also helps to improve the heat dissipation performance of the light emitting unit 12. Some glue has higher thermal conductivity, which can effectively dissipate heat and prolong the service life of the light emitting unit 12. At the same time, the combination of different types of encapsulation glue provides more design options, making engineers have more flexibility when designing and adjusting the optical performance. By reasonably selecting the types of transparent glue and diffusion glue, the light efficiency can be improved while reducing the light interference to the surrounding elements, further optimizing the overall performance of the optical system. The matrix screen 10 provided can adapt to different use scenarios and customer needs. In some cases, higher brightness of light output is required, while in other cases, more uniform light distribution is required. Through this measure, the product characteristics can be flexibly adjusted according to the needs.

[0054] In summary, by using different types of packaging glue (transparent glue and diffusion glue) in the design of the matrix screen 10, the optical performance of different levels is optimized, not only enhancing the display effect and optical performance of the LED matrix screen 10, but also providing greater design flexibility and adaptability. At the same time, it can effectively improve the reliability and service life of the product, and meet the needs of different application scenarios.

[0055] In some embodiments, the thickness of the first through-hole 141 is greater than or equal to the thickness of the first packaging glue 13. In turn, it ensures that the first packaging glue 13 is completely surrounded by the first through-hole 141, which helps to better control the initial diffusion and direction of light. And provides sufficient space for the first packaging glue 13 to prevent the packaging glue from overflowing or being squeezed, protecting the integrity of the light-emitting unit 12. By providing additional space for heat dissipation, it helps to improve the heat dissipation performance of the LED. Providing a certain fault tolerance space in the production process facilitates the injection and molding of the packaging glue.

[0056] In some embodiments, the thickness of the second through-hole 161 is greater than or equal to the thickness of the second packaging glue 15. In turn, it ensures that the second packaging glue 15 is completely located within the second through-hole 161, further accurately controlling the exit path and angle of light. And prevent the second packaging glue 15 from protruding from the surface of the second light-shielding layer 16, maintaining the flatness of the screen surface and improving display quality. At the same time, the second through-hole 161 completely covers the second packaging glue 15, maximizing the effect of the light-shielding layer and reducing light leakage. Providing sufficient space for the second packaging glue 15 enhances the stability and durability of the overall structure.

[0057] In some embodiments, the thickness of the first packaging glue 13 is greater than or equal to the thickness of the second packaging glue 15. In turn, the thicker first packaging glue 13 helps to preliminarily diffuse and homogenize light, while the thinner second packaging glue 15 can further finely control light emission. The thicker first packaging glue 13 provides better physical protection and insulation effect for the light-emitting unit 12. The thicker first packaging glue 13 helps to better disperse and manage heat, improving the life and performance of the LED. This thickness configuration provides more possibilities for optical design, which can optimize the light output characteristics by adjusting the thickness ratio of the two layers of packaging glue. Thicker first packaging glue 13 is easier to manufacture and form, while thinner second packaging glue 15 is beneficial for fine adjustment and surface treatment.

[0058] In summary, the above three embodiments can be combined as needed to not only optimize the optical performance and structural stability of the matrix screen 10, but also improve the manufacturability and durability of the product. Through the careful design of the thickness configuration, the present application achieves precise control of light output, while providing sufficient protection and heat dissipation conditions for the matrix screen 10.

[0059] In some embodiments, the insulating substrate 11 and the first light-blocking layer 14 are BT resin substrates. By using BT (Bismaleimide Triazine) resin as the material for the insulating substrate 11 and the first light-blocking layer 14. Due to the excellent heat resistance of BT resin, it can maintain stable performance in high temperature environment. At the same time, due to its low dielectric constant, it is beneficial to reduce signal interference and improve circuit performance. And it also has low hygroscopicity, which can reduce the influence of moisture on the circuit and improve the reliability of the product. It can also enhance the stability and durability of the overall structure and ensure effective isolation between circuit elements.

[0060] In some embodiments, the second light-blocking layer 16 is a light-blocking adhesive layer. By providing an adhesive layer, better adaptability and processing convenience are achieved. Unintended light scattering in unintended directions is effectively controlled, reducing light interference between devices.

[0061] For example, the color of the light-blocking adhesive layer is black. As shown in FIG. 1, the black material can effectively absorb light of various wavelengths, greatly reducing light leakage. The black background enhances the visual effect of LED light emission and improves display contrast.

[0062] It should be noted that in some embodiments, the insulating substrate 11 and the first light-blocking layer 14 are white. The white surface can reflect the light emitted by the LED, improving light utilization. At the same time, the reflection increases the overall brightness output of the matrix screen 10, improving the display effect. The white surface helps to reflect heat, improve heat distribution, and help to evenly diffuse light, improving display uniformity. It can also increase light output through reflection, improving overall energy efficiency.

[0063] The above embodiments create an efficient and high-contrast display system by combining as needed. The BT resin substrate provides good electrical and mechanical properties, the black light-blocking adhesive layer ensures precise light control and high contrast, and the white insulating substrate 11 and first light-blocking layer 14 optimize light utilization and heat management. This design not only improves display quality and energy efficiency, but also enhances the overall performance and reliability of the device.

[0064] In some embodiments, as shown in FIG. 3 and FIG. 4, the insulating substrate 11 includes opposite first and second surfaces, and a plurality of rows of pin groups 123 are spaced apart on the first surface of the insulating substrate 11, each row of pin groups 123 including a plurality of pin pairs 123, each pin pair 123 including a power pin 1232, a ground pin 1231, a signal input pin 1233, and a signal output pin 1234, the light emitting wafer 122 and the driving chip 121 being electrically connected to the power pin 1232, and the driving chip 121 being electrically connected to the ground pin 1231, the signal input pin 1233, and the signal output pin 1234, respectively; wherein the power pins 1232 of the plurality of pin pairs are integrally formed, and the ground pins 1231 of the plurality of pin pairs are integrally formed.

[0065] As shown in FIG. 3 and FIG. 4, the design of the provided pin groups 123 optimizes space utilization and improves integration. The integrally formed power and ground pins 123 simplify circuit layout, reduce resistance, improve power supply efficiency, and improve power distribution, which helps maintain a stable voltage supply. At the same time, the integrally formed pins 123 increase the heat conduction area, which helps dissipate heat. The use of independent signal input and output pins 123 helps reduce signal interference and improve signal integrity. The integrally formed pins 123 simplify the manufacturing and assembly process, improve production efficiency, and reduce the number of independent pins 123, which reduces the risk of connection failure. The simplified design reduces material and manufacturing costs. At the same time, the independent signal input and output pins 123 provide flexibility for different control schemes. The unified power and ground design helps reduce electromagnetic interference. This embodiment optimizes electrical connections and structural layout to improve the performance, reliability, and production efficiency of the matrix screen 10, while also providing convenience for future expansion and maintenance.

[0066] It should be noted that the number of light emitting wafers 122 and driving chips 121 in FIG. 3 is only illustrative, and whether the pins 123 are full or not depends on the time requirements, which are not limited by the embodiments of the present application.

[0067] For example, as shown in FIG. 3 and FIG. 5, the matrix screen 10 further includes a first conductive sheet 17 and a second conductive sheet 18 disposed on the second surface of the insulating substrate 11; the first conductive sheet 17 includes a first conductive strip along the extension direction of the power pin 1232 and a plurality of first electrode fingers spaced apart on the first conductive strip; the second conductive sheet 18 includes a second conductive strip along the extension direction of the ground pin 1231 and a plurality of second electrode fingers spaced apart on the second conductive strip; wherein the first and second conductive strips are oppositely disposed, the plurality of first electrode fingers and the plurality of second electrode fingers are alternately arranged, at least one first electrode finger is electrically connected to the power pin 1232, and at least one second electrode finger is electrically connected to the ground pin 1231.

[0068] The above embodiments provide greater contact area by providing comb-shaped conductive pieces, improving power and ground distribution. At the same time, the alternating arrangement of electrode fingers forms an interlocking structure, which helps to reduce electromagnetic interference. The special conductive piece design helps to optimize the impedance characteristics of the signal transmission line. The increased metal area helps to dissipate heat, improving overall heat dissipation performance. And reduces the distribution resistance of power and ground, improves electrical performance. Optimized power and ground distribution helps to maintain signal integrity. And the alternating design of the above embodiments improves space utilization efficiency. And the design of the electrode fingers provides flexibility for different connection needs, and multi-point connection increases the redundancy of the system, improves the overall reliability. The increased conductive area also improves the power handling capacity of the system, and the alternating arrangement structure produces a distributed capacitance effect, which helps to filter.

[0069] In summary, this design optimizes the distribution structure of power and ground, improves electrical performance, heat dissipation effect and signal integrity, and also provides convenience for manufacturing and future expansion. This structure is specially designed for the high-performance, high-integration matrix screen 10 application.

[0070] It should be noted that in some embodiments, a plurality of first electrode fingers are electrically connected to the power pin 1232, and a plurality of first electrode fingers electrically connected to the power pin 1232 are arranged at equal intervals; a plurality of second electrode fingers are electrically connected to the ground pin 1231, and a plurality of second electrode fingers electrically connected to the ground pin 1231 are arranged at equal intervals.

[0071] By setting the first and second conductive pieces 17 and 18 on the second surface of the insulating substrate 11, combined with the alternating arrangement of electrode fingers, the power distribution, heat dissipation, signal integrity and other aspects of the entire system are significantly optimized. This layout not only improves electrical performance, but also enhances electromagnetic interference and heat dissipation ability, while providing better support for manufacturing processes and equipment reliability. These technical features work together to make the overall performance of the matrix screen 10 more efficient, stable and reliable.

[0072] It should be noted that, as shown in FIG. 3, the insulating substrate 11 includes a plurality of conductive vias 111, and the provided matrix screen 10 also includes a plurality of conductive pillars 10a (such as copper pillars). By setting the conductive pillars 10a in the conductive vias 111, the electrical connection between the first electrode fingers and the power pin 1232 can be achieved.

[0073] As shown in FIGS. 3, 4 and 5, the matrix screen 10 further comprises: a signal input unit 10b arranged on one side of the second surface of the insulating substrate 11, the signal input unit 10b comprising a plurality of signal input terminals 10b1 and a signal input interface 10b2 arranged on the second surface, the signal input interface 10b2 being electrically connected with the plurality of signal input terminals 10b1; a patch board 19 arranged on the second surface of the insulating base, the patch board 19 comprising an input slot, and the signal input unit 10b is located in the input slot; wherein the signal input pins 1233 on one side of the insulating substrate 11 are electrically connected with the signal input terminals 10b1, in each pin 123 group, the signal input pins 1233 and the signal output pins 1234 of the adjacent pin 123 pair are integrally formed, the control signal is input to the signal input pins 1233 through the signal input unit 10b, and each drive chip 121 controls the corresponding light-emitting wafer 122 to emit light according to the control signal.

[0074] The above embodiment simplifies the signal transmission path by concentrating the signal input through the signal input unit 10b, improves the stability and efficiency of signal transmission. The patch board design makes the signal input unit 10b stable and occupies less space, which helps to improve the integration of the system and reduce complex wiring. The design of the signal input pins 1233 and the output pins 123 integrally formed reduces the connection nodes in signal transmission, thereby reducing signal interference and helping to maintain signal integrity. The design of the patch board and the input slot makes the installation and fixation of the signal input unit 10b more simple, which is convenient for the assembly and maintenance of the equipment. At the same time, each drive chip 121 independently controls the light-emitting unit 12 according to the input control signal, which provides accurate control of the light-emitting state and improves the display effect of the matrix screen 10. By reducing the separate pins 123 connection, the integrally formed design reduces the risk of disconnection or poor contact, improving the reliability of the equipment. The integrally formed pin 123 design simplifies the manufacturing process, reduces the number of required components, and reduces production costs. In summary, the above signal input and transmission design not only simplifies the system structure, but also improves the efficiency, stability and reliability of signal transmission, which is suitable for high-performance LED matrix screen 10 application scenarios.

[0075] The matrix screen provided by the embodiment of the present application has at least the following beneficial effects:

[0076] a) Light control: the first light shielding layer and the second light shielding layer can shield the side light of the light-emitting unit; the light mainly exits from the second through hole,

[0077] b) Improve display effect: by controlling the light exit direction, improve the clarity and contrast of the display.

[0078] c) Prevent light pollution: reduce the scattering of light and reduce the light interference between screens.

[0079] d) Structure optimization: Double-layer packaging and light-shielding design improve the protection effect and service life of LEDs.

[0080] e) Energy efficiency improvement: By controlling the direction of light, the loss of ineffective light is reduced, improving energy efficiency.

[0081] In summary, the matrix screen design provided by the present application realizes precise control of LED light emission through multi-layer packaging and light-shielding structure, which is expected to improve display quality, reduce light pollution, and bring improvements in energy efficiency and service life.

[0082] Referring to FIG. 8, FIG. 8 is a schematic flow chart of the steps of the preparation method provided by the embodiment of the present application. The method provided is used to prepare the matrix screen corresponding to any of the embodiments of FIGS. 1-7. As shown in FIG. 8, the method provided includes steps S201 to S207.

[0083] Step S201. Provide an insulating substrate including a plurality of light-emitting units arranged in a matrix to form an LED array, each light-emitting unit including a pin, a light-emitting wafer disposed on the pin, and a driving chip for driving the light-emitting wafer to emit light.

[0084] Specifically, an insulating substrate with a plurality of light-emitting units is provided. The light-emitting units are arranged in a matrix to form an LED array. Each light-emitting unit includes a pin, a light-emitting wafer, and a driving chip. The provision of the initial substrate builds the foundation for the entire preparation process, ensuring the standardization and consistency of the array through the pre-arranged light-emitting units.

[0085] Step S202. First molding is performed on the insulating substrate to form a plurality of first encapsulation gels on the outer side of the plurality of light-emitting units disposed on the insulating substrate.

[0086] Specifically, first molding is performed on the insulating substrate to form a plurality of first encapsulation gels on the outer side of the plurality of light-emitting units. Through the first molding process, each light-emitting unit is encapsulated to protect it from environmental pollution and mechanical damage, improving the durability and reliability of the light-emitting units.

[0087] Step S203. Second molding is performed according to the shape and position of the first encapsulation gels to obtain a first light-shielding layer including a plurality of first through holes.

[0088] Specifically, second molding is performed according to the position and shape of the first encapsulation gels to form a first light-shielding layer including a plurality of first through holes. The precise molding process ensures that the through hole position and size of the first light-shielding layer match the first encapsulation gels, not only improving the light-shielding effect, but also reducing side light leakage.

[0089] Step S204. A first light shielding layer is disposed on the insulating substrate, and the first encapsulation glue is located in the first through hole.

[0090] Specifically, by disposing the first light shielding layer on the insulating substrate, it is ensured that the first encapsulation glue is located in the first through hole. By disposing the first light shielding layer, non-forward emitted light is effectively shielded, and the light output efficiency and display effect of the LED array are improved.

[0091] Step S205. Thirdly, the first light shielding layer is molded to form a target glue layer on the first light shielding layer.

[0092] Specifically, by thirdly molding the first light shielding layer, the target glue layer is formed. The third molding further encapsulates and protects the underlying components while forming a new encapsulation layer, preparing for the subsequent cutting step.

[0093] Step S206. The target glue layer is cut to obtain a plurality of second encapsulation glues and a flow glue channel; wherein the plurality of second encapsulation glues are respectively disposed on the plurality of first encapsulation glues, and the area of the second encapsulation glue projected on the insulating substrate is greater than the area of the first encapsulation glue projected on the insulating substrate.

[0094] Specifically, by cutting the target glue layer, a plurality of second encapsulation glues and a flow glue channel are obtained. The second encapsulation glues are respectively disposed on the first encapsulation glues, and the projection area of the second encapsulation glues on the insulating substrate is greater than that of the first encapsulation glues. Through precise cutting, the area and position of each second encapsulation glue are ensured, the protection performance and light emission direction control are enhanced, and the preparation for further setting of the light shielding layer is prepared.

[0095] Step S207. A second light shielding layer is disposed outside the second encapsulation glue through the flow glue channel, and the second light shielding layer comprises a plurality of second through holes, and the second encapsulation glue is located in the second through hole.

[0096] Specifically, by disposing the second light shielding layer outside the second encapsulation glue through the flow glue channel, the second light shielding layer comprises a plurality of second through holes, and the second encapsulation glue is located in the second through hole. Through the setting of the second light shielding layer, the light emitted from the side is further shielded, ensuring that the light is only emitted from the second through hole, improving the directionality and uniformity of light output, and enhancing the anti-interference ability of the device. The method provided by the application encapsulates and protects the light emitting unit layer by layer through multiple molding and light shielding layer setting, effectively improves the structural integrity, optical performance and durability of the LED array. By precisely controlling the position and size of the encapsulation glue and the light shielding layer, the effective emission direction of the light is ensured, the display effect is optimized, and good environmental adaptability and anti-interference ability are provided. The entire process realizes high integration and automation, which helps to improve production efficiency and yield, and reduce manufacturing cost.

[0097] In some embodiments, the shape of the first encapsulation glue is adapted to the shape of the first via, and the shape of the second encapsulation glue is adapted to the shape of the second via; wherein the shape of the first encapsulation glue projected on the insulating substrate is different from the shape of the second encapsulation glue projected on the insulating substrate.

[0098] In the above embodiments, the first encapsulation glue of the provided matrix screen is adapted to the shape of the first via, and the second encapsulation glue is adapted to the shape of the second via. By making the projection shapes of the first encapsulation glue and the second encapsulation glue on the substrate different, the design of the light shielding layer and the via effectively blocks the light from emitting from the side, so that the light mainly emits from the second via, reduces the scattering of light, improves the directivity and uniformity of light emission, and improves the display effect. And through the design of double-layer encapsulation and different projection shapes, the emission path of the light is controlled, the display brightness and contrast are improved, and the interference or light pollution caused by light overflow is reduced. At the same time, the multi-layer structure of the first encapsulation glue and the second encapsulation glue provides better physical protection for the light-emitting unit, which helps to prolong the service life of the LED and enhance the ability to resist environmental influences. This embodiment optimizes the light-emitting effect and service life of the LED matrix screen through innovative encapsulation and light shielding design, effectively improving the display quality.

[0099] For example, the shape of the first encapsulation glue projected on the insulating substrate is circular, and the shape of the second encapsulation glue projected on the insulating substrate is rectangular. Further, the provided matrix screen optimizes the diffusion and focusing effect of light by adopting the combination design of circular and rectangular for the first encapsulation glue and the second encapsulation glue, respectively, to improve the uniformity and clarity of display. The design of the rectangle inside the circle provides better light guiding and protection effect.

[0100] It should be noted that in some embodiments, the rectangle is inside the circle. The center of the rectangle coincides with the center of the circle. Further, the center coincidence design ensures the symmetry of the light output of the matrix screen.

[0101] In some embodiments, the type of the first encapsulation glue is different from the type of the second encapsulation glue, the type of the first encapsulation glue is any one of transparent glue or diffusion glue, and the type of the second encapsulation glue is the other one of transparent glue or diffusion glue different from the type of the first encapsulation glue.

[0102] The transparent glue has high light transmittance, which can effectively transmit the light of the light-emitting unit and improve the brightness and color purity of the outgoing light. The diffusion glue can effectively scatter light, making the light more uniform, reducing bright or dark spots, and improving the uniformity of the display effect. By using different combinations of packaging glue, the high light transmittance of transparent glue and the uniform light distribution effect of diffusion glue can be combined to make the light-emitting unit perform its best at different levels of packaging, optimizing the overall display effect. Different choices of first and second packaging glue can more accurately control the emission and scattering path of light in the design, increasing the flexibility of the design and helping to achieve the best display effect. Using different types of packaging glue also helps to improve the heat dissipation performance of the light-emitting unit. Certain glues have higher thermal conductivity, which can effectively dissipate heat and prolong the life of the light-emitting unit. The combination of different types of packaging glue provides more design options, allowing engineers to have more flexibility when designing and adjusting optical performance. By reasonably selecting the types of transparent and diffusion glue, the light efficiency can be improved while reducing light interference to surrounding elements, further optimizing the overall performance of the optical system. The matrix screen provided can adapt to different use scenarios and customer needs. In some cases, higher brightness light output is required, while in other cases, more uniform light distribution is required. This measure allows for flexible adjustment of product characteristics according to demand.

[0103] In summary, by using different types of packaging glue (transparent glue and diffusion glue) in the design of the matrix screen to optimize the optical performance at different levels, not only the display effect and optical performance of the LED matrix screen are enhanced, but also greater design flexibility and adaptability are provided. At the same time, the reliability and service life of the product can be effectively improved to meet the needs of different application scenarios.

[0104] In some embodiments, the thickness of the first through-hole is greater than or equal to the thickness of the first packaging glue. This ensures that the first packaging glue is completely surrounded by the first through-hole, which helps to better control the initial diffusion and direction of light. It also provides sufficient space for the first packaging glue, preventing it from overflowing or being squeezed, and protecting the integrity of the light-emitting unit. By providing additional space for heat dissipation, it helps to improve the heat dissipation performance of the LED. It provides a certain fault tolerance space during production, facilitating the injection and molding of the packaging glue.

[0105] In some embodiments, the thickness of the second through-hole is greater than or equal to the thickness of the second packaging glue. This ensures that the second packaging glue is completely located within the second through-hole, further accurately controlling the outgoing path and angle of light. It also prevents the second packaging glue from protruding from the surface of the second light-blocking layer, maintaining the flatness of the screen surface and improving display quality. At the same time, the second through-hole completely covers the second packaging glue, maximizing the effect of the light-blocking layer and reducing light leakage. It provides sufficient space for the second packaging glue, enhancing the stability and durability of the overall structure.

[0106] In some embodiments, the thickness of the first encapsulation glue is greater than or equal to the thickness of the second encapsulation glue. The thicker first encapsulation glue helps to preliminarily diffuse and homogenize the light, while the thinner second encapsulation glue can further finely control the light emission. The thicker first encapsulation glue provides better physical protection and insulation effect for the light-emitting unit. The thicker first encapsulation glue helps to better disperse and manage heat, improving the service life and performance of the LED. This thickness configuration provides more possibilities for optical design, which can optimize the light output characteristics by adjusting the thickness ratio of the two layers of encapsulation glue. The thicker first encapsulation glue is easier to manufacture and form, while the thinner second encapsulation glue is beneficial for fine adjustment and surface treatment.

[0107] In summary, the above three embodiments can be combined as needed to not only optimize the optical performance and structural stability of the matrix screen, but also improve the manufacturability and durability of the product. Through the careful design of the thickness configuration, the present application achieves precise control of light output while providing sufficient protection and heat dissipation conditions for the matrix screen.

[0108] In some embodiments, the insulating substrate and the first light-shielding layer are BT resin substrates. By using BT (Bismaleimide Triazine) resin as the material of the insulating substrate and the first light-shielding layer. Since BT resin has excellent heat resistance, it can maintain stable performance in high temperature environments. At the same time, due to its low dielectric constant, it is beneficial to reduce signal interference and improve circuit performance. Moreover, it also has low moisture absorption, which can reduce the influence of moisture on the circuit and improve the reliability of the product. It can also enhance the stability and durability of the overall structure and ensure effective isolation between circuit elements.

[0109] In some embodiments, the second light-shielding layer is a light-shielding glue layer. By providing a glue layer, better adaptability and processing convenience are achieved. Unintended light scattering in unintended directions is effectively controlled, reducing light interference between devices.

[0110] For example, the color of the light-shielding glue layer is black. As shown in FIG. 1, black material can effectively absorb light of various wavelengths, greatly reducing light leakage. The black background enhances the visual effect of LED light emission and improves display contrast.

[0111] It should be noted that in some embodiments, the color of the insulating substrate and the first light-shielding layer is white. The white surface can reflect the light emitted by the LED, improving light utilization. At the same time, the reflection increases the overall brightness output of the matrix screen, improving the display effect. The white surface helps to reflect heat, improve heat distribution, and help to uniformly diffuse light, improving display uniformity. It can also increase light output through reflection, improving overall energy efficiency.

[0112] The above embodiments create a high-efficiency, high-contrast display system by combining requirements. The BT resin substrate provides good electrical and mechanical properties, the black light-shielding adhesive layer ensures precise light control and high contrast, and the white insulating substrate and first light-shielding layer optimize light utilization and heat management. This design not only improves display quality and energy efficiency, but also enhances the overall performance and reliability of the device.

[0113] In the description of the present application, it should be noted that unless specifically defined and limited otherwise, the terms "mounting", "connected", "connection" should be interpreted broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected. It can be a mechanical connection, or an electrical connection. It can be directly connected, or indirectly connected through an intermediate medium, or it can be an internal communication of two elements or an interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0114] The above disclosure provides many different implementations or examples for implementing the different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples. Such repetition is for the purpose of simplification and clarity, and in itself does not indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0115] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A matrix screen, comprising: an insulating substrate; a plurality of light emitting units arranged on the insulating substrate, the plurality of light emitting units arranged in a matrix to form an LED array, each of the light emitting units comprising a pin, a light emitting wafer arranged on the pin, and a driving chip for driving the light emitting wafer to emit light; a plurality of first encapsulants, each of the first encapsulants encapsulating an outer portion of each of the light emitting units; a first light shielding layer arranged on the insulating substrate, the first light shielding layer comprising a plurality of first through holes, the first encapsulants being arranged in the first through holes; a plurality of second encapsulants, each of the second encapsulants encapsulating each of the first encapsulants, wherein an area of the second encapsulants projected on the insulating substrate is greater than an area of the first encapsulants projected on the insulating substrate; a second light shielding layer arranged on the first light shielding layer, the second light shielding layer comprising a plurality of second through holes, the second encapsulants being arranged in the second through holes; wherein, when the plurality of light emitting units emit light, the first light shielding layer and the second light shielding layer can shield the light emitted by the light emitting units from being emitted from a side, and the light is emitted from the second through holes.

2. The matrix screen of claim 1, wherein, The shape of the first encapsulants is adapted to the shape of the first through holes, and the shape of the second encapsulants is adapted to the shape of the second through holes; wherein the shape of the first encapsulants projected on the insulating substrate is different from the shape of the second encapsulants projected on the insulating substrate.

3. The matrix screen of claim 2, wherein, The shape of the first encapsulants projected on the insulating substrate is circular, and the shape of the second encapsulants projected on the insulating substrate is rectangular.

4. The matrix screen of claim 3, wherein, The rectangle is located in the circle. The center of the rectangle coincides with the center of the circle.

5. The matrix screen of claim 1, wherein, The type of the first encapsulants is different from the type of the second encapsulants, the type of the first encapsulants is any one of transparent glue or diffusion glue, and the type of the second encapsulants is another one of transparent glue or diffusion glue different from the type of the first encapsulants.

6. The matrix screen of claim 1, wherein, The thickness of the first through holes is greater than or equal to the thickness of the first encapsulants; and / or, The thickness of the second through holes is greater than or equal to the thickness of the second encapsulants; and / or, The thickness of the first encapsulants is greater than or equal to the thickness of the second encapsulants; and / or, The insulating substrate and the first light shielding layer are BT resin substrates; and / or, The second light shielding layer is a light shielding glue layer.

7. The matrix screen of claim 6, wherein, The color of the light shielding glue layer is black.

8. The matrix screen of claim 7, wherein, The color of the insulating substrate and the first light shielding layer is white.

9. The matrix screen of claim 1, wherein, The insulating substrate comprises opposite first and second surfaces, a plurality of rows of pin groups are arranged on the first surface of the insulating substrate, and each row of the pin groups comprises a plurality of pin pairs. Each of the pin pairs comprises a power pin, a ground pin, a signal input pin, and a signal output pin, the light emitting wafer and the driving chip are electrically connected to the power pin, and the driving chip is electrically connected to the ground pin, the signal input pin, and the signal output pin, respectively; wherein the power pins of the plurality of pin pairs are integrally formed, and the ground pins of the plurality of pin pairs are integrally formed.

10. The matrix screen of claim 9, wherein, The matrix screen further comprises: The first conductive sheet and the second conductive sheet are arranged on the second surface of the insulating substrate; The first conductive sheet comprises a first conductive strip along the extension direction of the power pin and a plurality of first electrode fingers arranged on the first conductive strip at intervals; The second conductive sheet comprises a second conductive strip along the extension direction of the ground pin and a plurality of second electrode fingers arranged on the second conductive strip at intervals; The first conductive strip and the second conductive strip are oppositely arranged, the plurality of first electrode fingers and the plurality of second electrode fingers are alternately arranged, at least one first electrode finger is electrically connected with the power pin, and at least one second electrode finger is electrically connected with the ground pin.

11. The matrix screen of claim 10, wherein, The plurality of first electrode fingers are electrically connected with the power pin, and the plurality of first electrode fingers electrically connected with the power pin are arranged at equal intervals. The plurality of second electrode fingers are electrically connected with the ground pin, and the plurality of second electrode fingers electrically connected with the ground pin are arranged at equal intervals.

12. The matrix screen of claim 9, wherein, The matrix screen further comprises: A signal input unit arranged on one side of the second surface of the insulating substrate, the signal input unit comprising a plurality of signal input terminals arranged on one side of the second surface and a signal input interface, the signal input interface being electrically connected with the plurality of signal input terminals; A patch plate arranged on the second surface of the insulating seat, the patch plate comprising an input slot, and the signal input unit being located in the input slot; The signal input pin located on one side of the insulating substrate is electrically connected with the signal input terminal, in each pin group, the signal input pins and the signal output pins of the adjacent pin pairs are integrally formed, the control signal is input to the signal input pin through the signal input unit, and each driving chip controls the corresponding light-emitting wafer to emit light according to the control signal.

13. A preparation method of a matrix screen, comprising: providing an insulating substrate, the insulating substrate comprising a plurality of light-emitting units, the plurality of light-emitting units being arranged in a matrix to form an LED array, each light-emitting unit comprising a pin, a light-emitting wafer arranged on the pin, and a driving chip for driving the light-emitting wafer to emit light; firstly performing mold pressing on the insulating substrate to form a plurality of first encapsulation gels outside the plurality of light-emitting units arranged on the insulating substrate; secondly performing mold pressing according to the shape and position of the first encapsulation gels to obtain a first light-shielding layer, the first light-shielding layer comprising a plurality of first through holes; arranging the first light-shielding layer on the insulating substrate, and arranging the first encapsulation gels in the first through holes; thirdly performing mold pressing on the first light-shielding layer to form a target gel layer on the first light-shielding layer; cutting the target gel layer to obtain a plurality of second encapsulation gels and a flow channel, wherein the plurality of second encapsulation gels are arranged on the plurality of first encapsulation gels respectively, and the area of the second encapsulation gels projected on the insulating substrate is greater than the area of the first encapsulation gels projected on the insulating substrate; A second light shielding layer is arranged outside the second encapsulation adhesive through the flow channel, the second light shielding layer comprises a plurality of second through holes, and the second encapsulation adhesive is arranged in the second through holes.

14. The method of claim 13, wherein, The shape of the first encapsulation adhesive is matched with the shape of the first through holes, and the shape of the second encapsulation adhesive is matched with the shape of the second through holes; wherein the shape of the first encapsulation adhesive projected on the insulating substrate is different from the shape of the second encapsulation adhesive projected on the insulating substrate.

15. The method of claim 14, wherein, The shape of the first encapsulation adhesive projected on the insulating substrate is a circle, and the shape of the second encapsulation adhesive projected on the insulating substrate is a rectangle.

16. The method of claim 15, wherein, The rectangle is located in the circle, and the center of the rectangle is coincided with the center of the circle.

17. The method of claim 13, wherein, The type of the first encapsulation adhesive is different from the type of the second encapsulation adhesive, the type of the first encapsulation adhesive is any one of transparent adhesive or diffusion adhesive, and the type of the second encapsulation adhesive is another one of transparent adhesive or diffusion adhesive which is different from the type of the first encapsulation adhesive; and / or, The thickness of the first through holes is greater than or equal to the thickness of the first encapsulation adhesive; and / or, The thickness of the second through holes is greater than or equal to the thickness of the second encapsulation adhesive; and / or, The thickness of the first encapsulation adhesive is greater than or equal to the thickness of the second encapsulation adhesive.

18. The method of claim 13, wherein, The insulating substrate and the first light shielding layer are BT resin substrates; and / or, the second light shielding layer is a light shielding adhesive layer.

19. The method of claim 18, wherein, The color of the light shielding adhesive layer is black.

20. The method of claim 19, wherein, The color of the insulating substrate and the first light shielding layer is white.

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