Display module manufacturing method, display module, and head-mounted display device

Abstract

The present application relates to the technical field of display. Disclosed are a display module manufacturing method, a display module, and a head-mounted display device. The display module manufacturing method comprises: manufacturing a first display backplane corresponding to a first display area and a second display backplane corresponding to a second display area; and bonding the first display backplane and the second display backplane to form a display module, wherein a pixel density of the first display area on the display module is greater than a pixel density of the second display area thereon, and the second display area surrounds the first display area. The present application reduces the manufacturing costs of a display module without compromising the viewing quality thereof experienced by a user.

Description

Display module manufacturing method, display module and head-mounted display device

[0001] The present application claims priority to the Chinese patent application No. 202411376543.3, filed on September 29, 2024, and entitled "Display module manufacturing method, display module and head-mounted display device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of display devices, and in particular to a display module manufacturing method, a display module and a head-mounted display device. BACKGROUND

[0003] With the rise of the metaverse, the innovation and progress of head-mounted display technology as a key entry have been greatly promoted. In order to improve the immersive experience of the virtual scene, generally, it is necessary to achieve it from two aspects. One is to increase the size of the display module to increase the FOV (Field of View) to provide a larger field of view for the wearer. The second is to improve the resolution and PPI (Pixels Per Inch) of the display module to reduce the influence of the screen effect and enhance the realism of the picture. That is, a display module with larger size and higher pixel density is needed.

[0004] However, the larger the size of the display module with higher pixel density, the higher the manufacturing cost. For example, although the pixel density of the current silicon-based OLED (Organic Light-Emitting Diode) micro display can reach more than 3500, since the silicon-based OLED micro display is manufactured by using semiconductor process, it is limited by the FOV of the semiconductor photolithography machine, and the size of the display module directly manufactured is small. If a large-size silicon-based OLED micro display is to be produced, the manufacturing cost of the display module will be greatly increased, which is unacceptable for consumer electronics. Therefore, it is a technical problem to be solved in the field that the manufacturing cost of the display module is reduced without affecting the observation quality of the user for the display module (i.e. the image quality observed by the user). SUMMARY

[0005] The main purpose of the present application is to provide a display module manufacturing method, a display module and a head-mounted display device, which aims to solve the technical problem of reducing the manufacturing cost of the display module without affecting the observation quality of the user for the display module.

[0006] To achieve the above-mentioned purpose, the present application provides a display module manufacturing method, which comprises:

[0007] The first display backboard corresponding to the first display area and the second display backboard corresponding to the second display area are manufactured.

[0008] The display module is formed after the first display backboard and the second display backboard are bonded.

[0009] In an embodiment, the step of manufacturing the first display backboard corresponding to the first display area comprises:

[0010] A silicon wafer with a first driving circuit layer is provided, wherein the first driving circuit layer comprises at least one first driving circuit region corresponding to the first display area.

[0011] A through-silicon via process is performed on the silicon wafer, so that the connection line of the first driving circuit layer is led to the back surface of the silicon wafer.

[0012] A thinning process is performed on the back surface of the silicon wafer, so that the lead-through hole of the lead-out connection line of the silicon wafer is exposed, and a silicon-based driving backboard is obtained as the first display backboard.

[0013] In an embodiment, the step of manufacturing the second display backboard corresponding to the second display area comprises:

[0014] A second driving circuit layer is manufactured on the glass substrate to obtain the second display backboard, wherein the second driving circuit layer comprises at least one second driving circuit region corresponding to the second display area, and the second driving circuit region surrounds the bonding region, and the bonding region has a bonding pin for connecting with the first driving circuit region.

[0015] In an embodiment, the step of forming the display module after the first display backboard and the second display backboard are bonded comprises:

[0016] The first display backboard is cut according to the corresponding size of the first display area, and then bonded with the second display backboard to obtain a display driving backboard.

[0017] A display layer is manufactured on the display driving backboard, and the display driving backboard with the manufactured display layer is subjected to a post-process treatment process to obtain a display module.

[0018] In an embodiment, the step of manufacturing the display layer on the display driving backboard, and the display driving backboard with the manufactured display layer is subjected to a post-process treatment process to obtain a display module comprises:

[0019] According to a predetermined OLED structure, an organic material light-emitting layer and a common cathode layer are evaporated on the display driving backboard to obtain the display driving backboard with the manufactured display layer.

[0020] After the display driving backboard with the display layer is made is packaged, a cover plate is attached, module cutting and bonding are performed, a display module is obtained.

[0021] In an embodiment, the step of forming the display module after the first display backboard and the second display backboard are bonded comprises:

[0022] The first display layer is made on the first display backboard and is packaged;

[0023] After the packaged first display backboard is cut according to the size corresponding to the first display area, the first display backboard is bonded with the second display backboard, and a display driving backboard is obtained.

[0024] The second display layer is made on the second display area of the display driving backboard, and the display driving backboard with the second display layer is processed to obtain a display module.

[0025] In an embodiment, the step of making the second display layer on the second display area of the display driving backboard comprises:

[0026] The orientation layer is obtained by performing orientation processing on the second display area of the display driving backboard.

[0027] After the liquid crystal material is dropped on the orientation layer, the frame is sealed to form a liquid crystal cell layer as the second display layer.

[0028] In addition, to achieve the above-mentioned purpose, the present application also provides a display module, which comprises: a display driving backboard and a display layer integrally formed on the display driving backboard.

[0029] The display driving backboard is bonded by a first display backboard corresponding to a first display area and a second display backboard corresponding to a second display area.

[0030] The display layer comprises a first display layer in the first display area and a second display layer in the second display area; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area, and the first display layer and the second display layer are integrally formed.

[0031] In addition, to achieve the above-mentioned purpose, the present application also provides a head-mounted display device, which is configured with the display module.

[0032] The one or more technical solutions provided by the present application have at least the following technical effects:

[0033] This application forms a display module by fabricating a first display backplate corresponding to a first display area and a second display backplate corresponding to a second display area, and bonding the first and second display backplates together. The pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area. Therefore, this application can produce a display module with different display areas. Although the human eye has a large field of view, photoreceptor cells are mainly distributed near the fovea, and the clear field of view is much smaller than this range. Therefore, this application can use a display area with a higher pixel density in the clear field of view, and a display area with a lower pixel density outside this clear field of view. Thus, the display module produced by this application only needs to fabricate a component with a higher pixel density within the first display area corresponding to the clear field of view, without needing to fabricate an entire display module with a higher pixel density. This greatly reduces the cost of the display module without affecting the user's observation quality. Furthermore, since the display module in this application uses a drive backplate that first bonds different display areas, on the one hand, the display module manufacturing method of this application can be applied to the combination of different display structures; on the other hand, compared with the method of simply splicing two prepared display panels, this application can effectively reduce splicing seams and even achieve seamless splicing, which effectively improves the user's observation quality of the display module. Attached Figure Description

[0034] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 is a schematic diagram of the field of vision of the human eye in the horizontal plane;

[0037] Figure 2 is a flowchart illustrating the module manufacturing method provided in Embodiment 1 of this application.

[0038] Figure 3 is a structural schematic diagram of the display module involved in the embodiment of this application in the main viewing direction;

[0039] Figure 4 is another structural schematic diagram of the display module involved in the embodiment of this application in the main viewing direction;

[0040] Figure 5 is a schematic diagram of the display module involved in the embodiment of this application in the side view direction;

[0041] FIG. 6 is a flow diagram of a second embodiment of the display module manufacturing method of the present application;

[0042] FIG. 7 is a flow diagram of a third embodiment of the display module manufacturing method of the present application;

[0043] FIG. 8 is a structural diagram of a display module manufactured according to an embodiment of the present application;

[0044] FIG. 9 is another structural diagram of a display module manufactured according to an embodiment of the present application.

[0045] The purposes, functional features and advantages of the present application will be further explained in conjunction with the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0046] It should be understood that the specific embodiments described herein are merely intended to explain the technical solutions of the present application, and are not intended to limit the present application.

[0047] In order to better understand the technical solutions of the present application, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments.

[0048] The main solution of the embodiments of the present application is to manufacture a first display backboard corresponding to a first display area and a second display backboard corresponding to a second display area; and to form a display module by bonding the first display backboard and the second display backboard. The pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area.

[0049] Since the display module with high pixel density in the prior art has a larger size, its manufacturing cost will also be higher. For example, although the pixel density of the current silicon-based OLED micro display can reach more than 3500, since the silicon-based OLED micro display is manufactured by using semiconductor process, it is limited by the FOV of the semiconductor photolithography machine, and the size of the display module directly manufactured is small. If a large-size silicon-based OLED micro display is to be produced, the manufacturing cost of the display module will be greatly increased, which is unacceptable for consumer electronics.

[0050] The present application provides a solution, as shown in FIG. 1, the light blue line segment is the standard visual line 0°; the purple line segment is the visual field limit of the left eye, and the included angle formed is the monocular visual field of the left eye; the dark blue line segment is the visual field limit of the right eye, and the included angle formed is the monocular visual field of the right eye; the yellow line segment forms the best eye rotation area; and the green line segment forms the binocular visual field in which the left eye and the right eye can clearly see objects. Therefore, for a single human eye, although the visual field range of the human eye is large (generally more than 120°), the photoreceptor cells are mainly distributed near the fovea, and the clear visual field of the human eye is much smaller than the visual field range, generally about 15°. Therefore, the present application can use a display area with a higher pixel density in the clear visual field, and use a display area with a lower pixel density outside the clear visual field, so that the display module produced by the present application only needs to produce a component with a higher pixel density in the first display area corresponding to the clear visual field, without producing a display module with a higher pixel density throughout, so as to greatly reduce the cost of the display module while not affecting the observation quality of the user. In addition, in the present application, the display module uses a driving back plate bonded with different display areas, on the one hand, the display module production method of the present application can be applied to the combination of different display structures, and on the other hand, compared with the way of simply splicing two prepared display panels, the present application can effectively reduce the splicing seam, and even realize seamless splicing, thereby effectively improving the observation quality of the user for the display module.

[0051] Based on this, the present application embodiment produces a display module production method, as shown in FIG. 2, which is a flowchart of the first embodiment of the display module production method of the present application.

[0052] In this embodiment, the display module production method includes steps S10-S40:

[0053] Step S10, producing a first display back plate corresponding to the first display area and a second display back plate corresponding to the second display area;

[0054] It should be noted that the pixel density of the first display area is greater than the pixel density of the second display area, and the second display area surrounds the first display area. Due to the difference in pixel density, the driving circuit will also be different, therefore, the first display back plate includes a substrate with a first driving circuit layer adapted to the pixel density of the first display area, and the second display back plate includes a substrate with a second driving circuit layer adapted to the pixel density of the second display area.

[0055] Since the clear vision field of the human eye corresponds to the center position of the display module, the pixel density of the first display area is greater than the pixel density of the second display area in the embodiment, and the second display area surrounds the first display area. By manufacturing the first driving circuit layer on the first substrate, a first display backplate is obtained, wherein the first driving circuit layer includes at least one first driving circuit area corresponding to the pixel density of the first display area. The second driving circuit layer is manufactured on the second substrate to obtain a second display backplate, wherein the second driving circuit layer includes at least one second driving circuit area corresponding to the pixel density of the second display area, and the second driving circuit area in the second driving circuit layer surrounds the bonding area, and the bonding area has a bonding pin for connecting with the first driving circuit area, for subsequent bonding between the first display backplate and the second display backplate. The first substrate and the second substrate can be silicon wafers, glass, plastic, etc. The material of the substrate can be selected according to the process requirements.

[0056] As an example, the embodiment can use a standard CMOS process to manufacture transistors and other circuit elements on a silicon wafer to obtain a silicon wafer with a first driving circuit layer. Then, the silicon wafer with the first driving circuit layer is subjected to a through-silicon via process to lead the connection lines of the first driving circuit layer to the back of the silicon wafer, and the back of the silicon wafer is thinned to expose the lead-through holes of the lead-out connection lines of the silicon wafer to obtain a silicon-based driving backplate as the first display backplate. The second driving circuit layer of the LTPS-TFT array is deposited on the glass substrate to obtain a glass-based driving backplate as the first display backplate, wherein the second driving circuit layer includes at least one second driving circuit area corresponding to the pixel density of the second display area, and the second driving circuit area surrounds the bonding area.

[0057] In a feasible implementation, the step of manufacturing the first display backplate corresponding to the first display area in step S10 can include steps S11-S12:

[0058] Step S11, providing a silicon wafer with a first driving circuit layer, wherein the first driving circuit layer includes at least one first driving circuit area corresponding to the first display area;

[0059] Step S12, performing a through-silicon via process on the silicon wafer to lead the connection lines of the first driving circuit layer to the back of the silicon wafer;

[0060] Step S13, thinning the back of the silicon wafer to expose the lead-through holes of the lead-out connection lines of the silicon wafer to obtain a silicon-based driving backplate as the first display backplate.

[0061] Since the silicon wafer can be used as a substrate to make better flatness and smaller surface roughness, it is beneficial to accurately arrange the pixel points, and the silicon wafer can be manufactured into a fine structure of microns or even nanometers by means of a semiconductor processing technology, so that extremely small pixel points can be manufactured to achieve higher pixel density. Therefore, in the embodiment, the first display backboard is a driving backboard with a silicon wafer as a substrate, and the embodiment provides a silicon wafer with a first driving circuit layer, wherein the first driving circuit layer includes at least one first driving circuit region corresponding to the first display region, and then a through-silicon via process is performed on the silicon wafer with the first driving circuit layer, so that the connection line of the first driving circuit layer is led to the back surface of the silicon wafer, wherein the first driving circuit layer includes at least one first display region corresponding to the first driving circuit region; and then a thinning process is performed on the back surface of the silicon wafer to expose the lead-through hole of the lead-out connection line of the silicon wafer, to obtain a silicon-based driving backboard as the first display backboard.

[0062] In the embodiment, a through-silicon via process is performed on the silicon wafer with the first driving circuit layer, so that the connection line of the first driving circuit layer is led to the back surface of the silicon wafer, wherein the first driving circuit layer includes at least one first display region corresponding to the first driving circuit region; and a thinning process is performed on the back surface of the silicon wafer to expose the lead-through hole of the lead-out connection line of the silicon wafer, to obtain a silicon-based driving backboard as the first display backboard, to prepare for the bonding between the first display backboard and the second display backboard.

[0063] In a feasible embodiment, the step of manufacturing the second display backboard corresponding to the second display region in step S10 can include step S13:

[0064] Step S13: manufacturing a second driving circuit layer on the glass substrate to obtain a second display backboard corresponding to the second display region, wherein the second driving circuit layer includes at least one second driving circuit region corresponding to the second display region, and the second driving circuit region surrounds the bonding region, and the bonding region has a bonding pin for connecting with the first driving circuit region;

[0065] It should be noted that the bonding region has a bonding pin for connecting with the first driving circuit region.

[0066] In the embodiment, the second driving circuit layer is manufactured on the glass substrate, and the second driving circuit layer includes at least one second driving circuit region corresponding to the pixel density of the second display region. In the embodiment, the second driving circuit region surrounds the bonding region, so as to bond the first display backboard with higher pixel density in the central region of the second driving substrate, so as to provide higher pixel density for the clear field of view of the user.

[0067] Step S20, forming a display module after bonding the first display backboard and the second display backboard; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area.

[0068] It should be noted that the bonding can adopt eutectic bonding, low-temperature bonding and other bonding processes, and the selection of the specific bonding process can be selected according to specific needs.

[0069] Taking the same display mechanism of the first display backboard and the second display backboard on the display driving backboard as an example, in this embodiment, the first display backboard is cut according to the corresponding size of the first display area to obtain each first display unit. The first display unit and the second display backboard are bonded together to obtain a display driving backboard; the display layer is made on the display driving backboard, and the display driving backboard with the display layer made is subjected to a post-process treatment process to obtain a display module.

[0070] However, in a real production scenario, the first display backboard and the second display backboard may also adopt different light-emitting display mechanisms. In this embodiment, the first display layer is made on the first display backboard and encapsulated; the encapsulated first display backboard is cut according to the corresponding size of the first display area to obtain each first display unit. The first display unit and the second display backboard are bonded together to obtain a display driving backboard; the second display layer is made on the second display area of the display driving backboard, and the display driving backboard with the second display layer made is subjected to a post-process treatment process to obtain a display module.

[0071] Taking eutectic bonding as an example of the bonding process, in this embodiment, eutectic bonding materials can be coated on the back surface of the first display unit and the bonding area of the second display backboard by sputtering, silk printing or other physical vapor deposition methods, wherein common eutectic bonding material systems include Au-Si, Au-Ge, Al-Ge, Au-Sn and Au-In, etc. Then, by adjusting the relative position of the first display unit and the second display backboard, the lead through hole on the back surface of the first display unit matches the lead position of the bonding pin in the bonding area. Then, heating is performed to make the eutectic bonding materials coated on the back surface of the first display unit and the bonding area of the second display backboard undergo eutectic reaction. And after the eutectic reaction is completed, cooling is performed to complete the bonding of the first display backboard and the second display backboard, and obtain a display driving backboard.

[0072] For example, the low-temperature bonding process is low-temperature bonding by anisotropic conductive adhesive (ACF). The anisotropic conductive adhesive can be applied on the bonding area of the back surface of the first display unit and the second display back plate by a dispensing machine, stencil printing, screen printing or the like. Then, the relative position of the first display unit and the second display back plate is adjusted so that the lead through hole on the back surface of the first display unit matches the lead position of the bonding pin in the bonding area. Then, the back surface of the first display unit and the bonding area of the second display back plate are bonded under appropriate temperature and pressure. The first display back plate and the second display back plate after bonding are cured to complete the bonding of the first display back plate and the second display back plate, and a display driving back plate is obtained.

[0073] The first embodiment of the present application provides a display module manufacturing method. The display module is manufactured by manufacturing a first display back plate corresponding to a first display area and a second display back plate corresponding to a second display area, and then bonding the first display back plate and the second display back plate. The pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area. Thus, the display module with different display areas can be manufactured. Although the human eye has a large field of view, the photoreceptor cells are mainly distributed near the fovea, and the clear field of view of the human eye is much smaller than the field of view. Therefore, the display module manufactured by the embodiment can use a display area with a higher pixel density in the clear field of view, and a display area with a lower pixel density outside the clear field of view. Thus, the display module manufactured by the embodiment only needs to manufacture a higher pixel density component in the first display area corresponding to the clear field of view, without manufacturing a whole display module with a higher pixel density, so as to greatly reduce the cost of the display module while not affecting the observation quality of the user. In addition, the display module in the embodiment is bonded with the driving back plates of different display areas. On the one hand, the display module manufacturing method of the embodiment can be applied to the combination of different display structures. On the other hand, compared with simply splicing two prepared display panels, the embodiment can effectively reduce the splicing seam, even achieve seamless splicing, and effectively improve the observation quality of the user.

[0074] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as the above embodiment one can be referred to the above description, and will not be repeated hereinafter. On this basis, please refer to FIG. 6, step S20 includes steps S21-S22:

[0075] In step S21, the first display back plate is cut according to the size corresponding to the first display area, and then bonded with the second display back plate to obtain a display driving back plate.

[0076] In step S22, the display layer is manufactured on the display driving backboard, and the display driving backboard with the manufactured display layer is subjected to a post-process procedure to obtain a display module.

[0077] It should be noted that the post-process procedure is a process procedure after the display layer is manufactured, and the post-process procedure at least includes packaging, cover plate attachment, module cutting and bonding. According to the difference of specific requirements, the post-process procedure can further include more processing steps, for example, for the display driving backboard with a WOLED structure, a Color Filter processing step is needed to be added before the cover plate attachment to realize full-color display. For example, the LCD (Liquid Crystal Display) display driving backboard needs to be attached with a polarizer and assembled with a backlight source and the like. Of course, it can also include aging test, calibration and the like.

[0078] In this embodiment, the first display backboard is cut according to the corresponding size of the first display area, and is bonded with the second display backboard to obtain a display driving backboard. Further, in order to improve the manufacturing quality of the display layer, the display driving backboard can be cut according to a predetermined target size to obtain at least two new display driving backboards, wherein the predetermined target size is the size required by the process for manufacturing the display layer. Taking evaporation as an example, in the case that the size of the display driving backboard is too large, it can be difficult to manufacture a fine metal mask, and the evaporation uniformity and precision can not be guaranteed. Further, the display layer is manufactured on the display driving backboard, and the display driving backboard with the manufactured display layer is subjected to a post-process procedure to obtain a display module. Taking the example that the first display backboard and the second display backboard of the display driving backboard both adopt an OLED display process, this embodiment can deposit an organic material light-emitting layer and a common cathode layer on the display driving backboard according to a predetermined OLED structure to obtain a display driving backboard with a manufactured display layer, and further can obtain a display module after packaging, cover plate attachment, module cutting and bonding of the display driving backboard with the manufactured display layer. The deposition of the organic material light-emitting layer and the common cathode layer can be realized by physical vapor deposition, chemical vapor deposition, inkjet printing and the like. It can be understood that this embodiment can also cut the second display backboard first, and then bond the first display backboard and the second display backboard. That is, this embodiment can cut the second display backboard according to a predetermined target size to obtain at least two new second display backboards. Further, the first display backboard is cut according to the corresponding size of the first display area, and is bonded with the second display backboard to obtain a display driving backboard. Further, the display layer is manufactured on the display driving backboard, and the display driving backboard with the manufactured display layer is subjected to a post-process procedure to obtain a display module.

[0079] The display module prepared can refer to FIG. 3, FIG. 4 and FIG. 5. FIG. 3 is a structural schematic diagram of the display module in the main view direction according to the embodiment of the present application. FIG. 4 is another structural schematic diagram of the display module in the main view direction according to the embodiment of the present application. FIG. 5 is a structural schematic diagram of the display module in the side view direction according to the embodiment of the present application. The display module has a display area with high pixel density in the center and a display area with low pixel density outside the center. The display area with high pixel density can be in the shape of rectangle, circle or lamp.

[0080] In a possible implementation, the step S22 comprises steps A10-A20.

[0081] In step A10, the organic material light-emitting layer and the common cathode layer are evaporated on the display driving backplane according to the predetermined OLED structure, to obtain the display driving backplane with the display layer prepared.

[0082] In step A20, the display module is obtained after the display driving backplane with the display layer prepared is encapsulated, the cover plate is attached, the module is cut and the bonding is performed.

[0083] It should be noted that the predetermined OLED structure is a preselected OLED light-emitting mode, such as RGB Side-by-Side structure (RGB side-by-side structure, i.e., each pixel is composed of three independent light-emitting units of red (Red), green (Green) and blue (Blue) arranged side by side) and WOLED structure (i.e., each pixel point has only one white light-emitting diode, and the red, green and blue light is formed visually through the RGB color filter).

[0084] In the embodiment, the organic material light-emitting layer and the common cathode layer are evaporated on the display driving backplane according to the predetermined OLED structure, to obtain the display driving backplane with the display layer prepared. Taking the RGB Side-by-Side structure as an example, in a high-vacuum environment, the red, green and blue light-emitting materials are placed in the evaporation source respectively, and are evaporated into a gaseous state by heating. Then, the fine metal mask is accurately aligned with the display driving backplane, to ensure that the hole pattern on the fine metal mask corresponds to the pixel position on the display driving backplane. Then, one color of light-emitting material is evaporated each time, and the gaseous light-emitting material is deposited on the display driving backplane through the holes on the fine metal mask, to form the organic material light-emitting layers of red, green and blue. Then, the display module is obtained after the display driving backplane with the display layer prepared is encapsulated, the cover plate is attached, the module is cut and the bonding is performed.

[0085] The second embodiment of the present application provides a display module manufacturing method. In the embodiment, the first display backboard is cut according to the size corresponding to the first display area, and then bonded with the second display backboard to obtain a display driving backboard. The display layer is manufactured on the display driving backboard, and the display driving backboard with the manufactured display layer is subjected to a post-process treatment procedure to obtain a display module. Since the first display backboard and the second display backboard are bonded, and the display layer is manufactured as a whole, the embodiment does not have a splicing seam on the display layer, that is, seamless splicing is achieved, and the observation quality of the display module by the user is effectively improved.

[0086] Based on the first embodiment of the present application, in the third embodiment of the present application, the same or similar contents as the above embodiment one can be referred to the above description, and will not be described in detail. On this basis, referring to FIG. 7, step S20 further includes steps S23-S25:

[0087] Step S23, manufacturing the first display layer on the first display backboard and packaging;

[0088] Step S24, cutting the packaged first display backboard according to the size corresponding to the first display area, and then bonding the first display backboard with the second display backboard to obtain a display driving backboard;

[0089] Step S25, manufacturing the second display layer on the second display area of the display driving backboard, and subjecting the display driving backboard with the manufactured second display layer to a post-process treatment procedure to obtain a display module.

[0090] It should be noted that the post-process treatment procedure is a process procedure after the display layer is manufactured, and the post-process treatment procedure at least includes packaging, cover plate attachment, module cutting and bonding. According to the difference of specific requirements, the post-process treatment procedure can further include more processing steps, for example, for the display driving backboard with a WOLED structure, a Color Filter (color filter) processing step is needed before the cover plate attachment to achieve full-color display. For the LCD (Liquid Crystal Display) display driving backboard, processing steps such as attaching a polarizing plate and assembling a backlight source are needed. Of course, aging test, calibration and other processing steps can also be included.

[0091] In the real production scenario, the first display backboard and the second display backboard can also adopt different light-emitting display mechanisms, and in this case, it is difficult to directly integrate the display layer production. Therefore, before bonding, the first display layer is produced on the first display backboard and encapsulated. For example, taking the first display layer as an OLED layer, the first display backboard with the first display layer produced can be obtained by depositing the organic material light-emitting layer and the common cathode layer on the first display backboard according to the predetermined OLED structure, and then the first display backboard with the first display layer produced can be encapsulated. Then, after the encapsulated first display backboard is cut according to the size corresponding to the first display area, each first display unit is obtained. The first display unit and the second display backboard are bonded together to obtain a display driving backboard. Since the production and encapsulation of the first display layer on the first display backboard have been completed in advance in this embodiment, the production of the second display layer on the second display area of the display driving backboard can be performed in this embodiment, and the display module can be obtained by performing the post-process treatment process on the display driving backboard with the second display layer produced. For example, taking the second display backboard adopting the OLED display mechanism, the display driving backboard with the second display layer produced can be obtained by depositing the organic material light-emitting layer and the common cathode layer on the second display area according to the predetermined OLED structure, and then the display module can be obtained by encapsulating, attaching the cover plate, cutting and bonding the display driving backboard with the second display layer produced. The deposition of the organic material light-emitting layer and the common cathode layer can be realized by physical vapor deposition, chemical vapor deposition, inkjet printing and the like. For example, taking the second display backboard adopting the LCD display mechanism, the display driving backboard with the orientation layer can be obtained by performing orientation treatment on the second display area of the display driving backboard, and then the display module with the second display layer produced can be obtained by dripping the liquid crystal material on the orientation layer and then performing frame sealing to form the liquid crystal unit layer as the second display layer.

[0092] In a feasible embodiment, the step of producing the second display layer on the second display area of the display driving backboard in step S25 includes steps C10-C20:

[0093] Step C10: performing orientation treatment on the second display area of the display driving backboard to obtain a display driving backboard with an orientation layer;

[0094] Step C20: dripping liquid crystal material on the orientation layer and then performing frame sealing to form a liquid crystal unit layer as the second display layer.

[0095] The second display area on the display driving backboard can be oriented in the embodiment, and a display driving backboard with an orientation layer is obtained. For example, the second display area is immersed in a solution containing a silane coupling agent, or a silane layer is formed on the surface of the second display area by a vapor deposition method. The silane coupling agent forms a uniform siloxane network structure on the surface of the second display area through a hydrolysis and condensation reaction. The display driving backboard is then heat-cured to enhance the adhesion between the silane layer and the second display area, and an ordered orientation structure is formed, so that the display driving backboard with the orientation layer is obtained. For example, a polyimide (PI) solution is coated on the second display area, and the PI layer is cured by baking. The PI layer is then mechanically rubbed (rubbing) after curing. A cloth wheel or a flannel is used to rub in one direction at a certain pressure and speed. The rubbing process forms micro scratches and orientations on the surface of the PI layer. The orientations, including the scratches, guide the arrangement of liquid crystal molecules, so that the display driving backboard with the orientation layer is obtained.

[0096] The liquid crystal cell layer is then manufactured by vacuum injection or liquid crystal drop-down. For example, the vacuum injection mainly includes vacuum treatment, liquid crystal filling, sealing and curing, and the like. For example, the liquid crystal drop-down (ODF) mainly includes liquid crystal drop-down, substrate frame adhesive coating, vacuum lamination, UV irradiation, heating, and the like.

[0097] The second display area on the display driving backboard is oriented in the embodiment, and the display driving backboard with the orientation layer is obtained. The liquid crystal material is then dropped on the orientation layer, and the frame is sealed to form the liquid crystal cell layer as the second display layer, so that the second display layer on the second display backboard of the LCD display mechanism is manufactured.

[0098] The third embodiment of the present application provides a display module manufacturing method. The first display layer is manufactured on the first display backboard, and the first display backboard is packaged. The packaged first display backboard is cut according to the size of the first display area, and is bonded with the second display backboard to obtain a display driving backboard. The second display layer is manufactured on the second display area of the display driving backboard, and the display driving backboard with the second display layer is processed to obtain a display module. The display module with different display areas can be manufactured in the embodiment, and the embodiment is more suitable for the scene that different display areas adopt different display mechanisms. Therefore, the combination of more different types of display areas can be adapted, and different display requirements of the display module can be met more effectively.

[0099] It should be noted that the above examples are only for understanding the present application and do not constitute a limitation on the display module manufacturing method of the present application. More forms of simple changes based on the technical concept are within the protection scope of the present application.

[0100] In addition, the present application also provides a display module, which comprises a display driving backboard and a display layer integrally formed on the display driving backboard; the display driving backboard is formed by bonding a first display backboard corresponding to a first display area and a second display backboard corresponding to a second display area; the display layer comprises a first display layer in the first display area and a second display layer in the second display area; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area. It can be understood that, in the case that the first display layer and the second display layer adopt the same display mechanism, the first display layer and the second display layer can be integrally formed by using the same display layer manufacturing process. The first display backboard of the first display area on the display driving backboard is used to drive the first display layer to display an image, and the second display backboard of the second display area is used to drive the second display layer to display an image. The pixel density of the first display area is greater than the pixel density of the second display area, and the second display area surrounds the first display area, so that the first display area serves as a display area corresponding to a clear area of a visual field of a human eye, so as to guarantee a higher display quality in the clear area of the visual field. The structure of the display module can be referred to FIG. 8, wherein the display driving backboard comprises a glass-based driving backboard and a silicon-based driving circuit bonded at the center of the glass-based driving backboard, and an anode is deposited on the display driving backboard. The first display layer in the first display area and the second display layer in the second display area are both OLED layers, and a cathode is deposited on the OLED layer. Since a WOLED structure is adopted, a color filter needs to be attached, and then a glass cover plate is attached to protect the layers below.

[0101] In addition, the first display layer and the second display layer can also adopt different display mechanisms. The present application further provides a display module, which comprises a display driving backboard and a display layer on the display driving backboard; the display driving backboard is formed by bonding a first display backboard corresponding to a first display area and a second display backboard corresponding to a second display area; the display layer comprises a first display layer in the first display area and a second display layer in the second display area; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area, and the first display layer and the second display layer adopt different display mechanisms. For example, the first display layer can be an organic material light-emitting layer, and the second display layer can be a liquid crystal unit layer for displaying an image. In FIG. 9, the display driving backboard comprises a glass-based driving backboard and a silicon-based driving circuit bonded at the center of the glass-based driving backboard, and an anode is deposited on the display driving backboard. The first display layer in the first display area is an OLED layer, and the second display layer in the second display area is a liquid crystal unit layer. A cathode is deposited on the OLED layer. Since a WOLED structure is adopted, a color filter needs to be attached, and then a glass cover plate is attached to protect the layers below.

[0102] In addition, the present application further provides a head-mounted display device, which is configured with the above display module. For example, the head-mounted display device can be a virtual reality glasses, a virtual reality helmet, a mixed reality helmet, etc.

[0103] It should be understood that various parts of the present application can be realized by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0104] The above merely describes some embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0105] The above merely describes some embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A display module manufacturing method, characterized by, The application relates to a display module manufacturing method. The method comprises the following steps: manufacturing a first display backboard corresponding to a first display area and a second display backboard corresponding to a second display area; 2. The display module manufacturing method of claim 1, wherein, bonding the first display backboard and the second display backboard to form a display module; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area. The step of manufacturing the first display backboard corresponding to the first display area comprises the following steps: providing a silicon wafer with a first driving circuit layer, wherein the first driving circuit layer comprises at least one first driving circuit area corresponding to the first display area; performing a through-silicon via (TSV) treatment on the silicon wafer to lead connecting lines of the first driving circuit layer to the back of the silicon wafer; 3. The method of claim 2, wherein the display module is made by the steps of: performing a thinning treatment on the back of the silicon wafer to expose lead-through holes of the connecting lines of the silicon wafer, thereby obtaining a silicon-based driving backboard as the first display backboard. ​ The step of manufacturing the second display backboard corresponding to the second display area comprises the following steps:

4. The method for manufacturing a display module as described in claim 1, characterized in that, manufacturing a second driving circuit layer on a glass substrate to obtain a second display backboard, wherein the second driving circuit layer comprises at least one second driving circuit area corresponding to the second display area, and the second driving circuit area surrounds a bonding area provided with bonding pins for connecting with the first driving circuit area. The step of bonding the first display backboard and the second display backboard to form a display module comprises the following steps: cutting the first display backboard according to the size corresponding to the first display area, and then bonding the first display backboard and the second display backboard together to obtain a display driving backboard; 5. The method for manufacturing a display module as described in claim 4, characterized in that, performing display layer manufacturing on the display driving backboard, and then performing a post-process treatment procedure on the display driving backboard with the manufactured display layer to obtain a display module. The step of performing display layer manufacturing on the display driving backboard, and then performing a post-process treatment procedure on the display driving backboard with the manufactured display layer to obtain a display module comprises the following steps: performing evaporation of an organic material light-emitting layer and a common cathode layer on the display driving backboard according to a predetermined OLED structure to obtain the display driving backboard with the manufactured display layer; 6. The method for manufacturing a display module as described in claim 1, characterized in that, performing encapsulation, cover plate attachment, module cutting and bonding on the display driving backboard with the manufactured display layer to obtain a display module. The step of bonding the first display backboard and the second display backboard to form a display module further comprises the following steps: performing first display layer manufacturing on the first display backboard and then performing encapsulation; cutting the encapsulated first display backboard according to the size corresponding to the first display area, and then bonding the first display backboard and the second display backboard together to obtain a display driving backboard; 7. The display module manufacturing method of claim 6, wherein, performing second display layer manufacturing on the second display area of the display driving backboard, and then performing a post-process treatment procedure on the display driving backboard with the manufactured second display layer to obtain a display module. The step of performing second display layer manufacturing on the second display area of the display driving backboard comprises the following steps: performing orientation treatment on the second display area of the display driving backboard to obtain a display driving backboard with an orientation layer; After the liquid crystal material is dropped on the orientation layer, a frame is sealed to form a liquid crystal cell layer as a second display layer.

8. A display module, characterized by The display module comprises a display driving backboard and a display layer integrally formed on the display driving backboard. The display driving backboard is formed by bonding a first display backboard corresponding to a first display area and a second display backboard corresponding to a second display area. The display layer comprises a first display layer in the first display area and a second display layer in the second display area; wherein a pixel density of the first display area on the display module is greater than a pixel density of the second display area, and the second display area surrounds the first display area, and the first display layer and the second display layer are integrally formed.

9. A head-mounted display device, comprising: The head-mounted display device is configured with the display module of claim 8.

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