Method for manufacturing an electronic circuit for a chipped document

Abstract

The invention relates to a method for manufacturing an electronic circuit (100) for a chipped document, the electronic circuit comprising: an open main circuit (110) that comprises a plurality of electrical tracks (111); and a prefabricated secondary circuit (120) intended to be electrically connected to the main circuit (110) when it is assembled therewith. The method is essentially characterised by steps consisting in producing the main circuit (110) by: - thermally bonding a conductive film (500) onto a dielectric substrate (400) of the chipped document; - cutting the conductive film (500) that is thermally bonded along the contours of a predetermined solid shape into which the tracks of the main circuit (110) are inserted; - peeling the conductive film (500) that is not bonded according to a shape that is complementary to the predetermined solid shape, so as to leave on the substrate only the conductive film (500) corresponding to the predetermined solid shape.

Description

Method for manufacturing an electronic circuit for a chip-enabled document.

[0001] The present invention relates to the field of manufacturing a 100% resonant electronic circuit, for a chipped document.

[0002] The smart document can be a smart card, whether for banking, identity or security purposes, for example a debit or credit card, an access badge, a driver's license, a subscription card, etc. The smart document can also be an RFID tag.

[0003] For the sake of brevity, only the case of a smart card incorporating a communication antenna will be described here. Those skilled in the art will readily apply this complex teaching to other, simpler cases.

[0004] The "contactless" function of smart cards requires the presence of a large antenna, called "ID1", allowing efficient inductive coupling with a radio frequency (RF) reader.

[0005] This ID1 antenna is required regardless of the connection method between this ID1 antenna and a secure element (SE) of the smart card: whether by inductive coupling, which requires a circuit with a concentrator and a capacitor, by direct electrical contact (galvanic), or by capacitive coupling.

[0006] To date, to produce an ID1 antenna, there are mainly the following three technologies: a. Aluminum-based antennas, b. Sheathed and inlaid copper wire-based antennas, c. Printed antennas with conductive metallic ink, in silver or copper.

[0007] The present invention relates only to aluminum-based antennas.

[0008] It is known to produce aluminum-based antennas on PET, for example, by chemical etching.

[0009] However, this technique poses problems, particularly in terms of manufacturing (layout by anglicism), ecology and ghosting effects.

[0010] The present invention aims to enable the clever manufacturing of a 100 electronic circuit by allowing economies of scale.

[0011] To this end, according to a first of its objects, the invention relates to a method for manufacturing an electronic circuit 100 for a chip-enabled document, the chip-enabled document comprising a dielectric support 400, the electronic circuit 100 comprising a main circuit 110 and a secondary circuit 120, the main circuit 110 being preferably an open circuit comprising a plurality of electrical traces 111, the secondary circuit 120 being prefabricated and intended to be electrically connected to the main circuit 110 when assembled to it.

[0012] It is essentially characterized in that the process comprises steps consisting of producing the main circuit 110 by: a. Heat-bonding a conductive film 500 to the dielectric support 400 by depositing glue 520 on the dielectric support 400 in a shape that corresponds to a predetermined solid shape, b. Cutting the heat-bonded conductive film 500 according to the contours of the predetermined solid shape into which the tracks of the main circuit 110 are inserted, c. Peeling the unbonded conductive film 500, in a shape complementary to the predetermined solid shape, so as to leave fixed on the support only the bonded conductive film 500, corresponding to the predetermined solid shape.

[0013] The secondary circuit 120 is intended to be electrically connected to the main circuit 110 when assembled with it. By "electrically connected" we mean electrically connected, for example by galvanic connection, or electrically coupled, for example by capacitive or inductive coupling.

[0014] It can be foreseen that the step of cutting the contours of the predetermined solid shape of the conductive film 500 is implemented by at least one of the following steps: a. by pressing a mechanical cutting tool 300 onto the conductive film 500, said cutting tool being rotating or flat and comprising a set of blades forming a cutting impression of the predetermined solid shape; said cutting and the heat sealing 20 being able to be simultaneous; b. by laser cutting 30 of the conductive film 500.

[0015] In addition, a step can be provided for producing the electrical tracks 111 of the main circuit 110 in the predetermined solid shape by at least one of the following steps: a. by pressing a mechanical cutting tool 300 onto the conductive film 500, said cutting tool being rotating or flat and comprising a set of blades forming a cutting impression of the electrical tracks 111 in the predetermined solid shape; the pressing for producing the electrical tracks 111 can be simultaneous with the cutting of the contours of the predetermined solid shape; b. by laser cutting 30 of the 500 conductive film.

[0016] It can be foreseen that said laser cutting step 30 of the electrical tracks 111 is implemented according to one of the following sequences: i. After the heat-sealing step 20 and before the peeling step 50, ii. After the heat-sealing step 20 and after the peeling step 50, the heat-sealing step 20 being able to be prior to or simultaneous with the predetermined solid shape cutting step.

[0017] A further step may be provided consisting of pre-cutting a set of at least one recess in the predetermined solid shape, prior to the heat-sealing step 20, said pre-cutting of at least one recess being carried out by at least one of the following steps: i. by pressing a mechanical pre-cutting tool onto the conductive film 500, said pre-cutting tool being rotating or flat and comprising a set of blades forming a pre-cutting imprint of at least one recess; ii. by laser cutting 30; said pre-cutting step being prior to or simultaneous with the step of cutting the contours of the solid shape.

[0018] An additional step can be provided consisting of arranging the electrical tracks 111 of the main circuit 110 on the support so as to realize all or part of at least one of the following: a. A communication antenna allowing radio frequency communication with a reader, b. Interconnection tracks between two electronic components or two modules, c. an electrical resistor, d. a capacitor, e. A ground plane, f. A graphic representation, g. An electromagnetic shield, h. An inductive antenna allowing power supply or communication with an electronic component 130 assembled subsequently.

[0019] An additional step of assembling the main circuit 110 and the secondary circuit 120 may be provided, by one of the steps consisting of: i. Depositing the secondary circuit 120 onto the main circuit 110, in particular in the form of a patch and ii. Transferring onto the main circuit 110 at least one semiconductor component comprising the secondary circuit 120, then by a step of joining the main circuit 110 and the secondary circuit 120, in particular by gluing or by crimping 140, the process preferably also comprising a step of laminating the assembled electronic circuit 100.

[0020] According to another of its objects, the invention relates to an electronic circuit 100 for a chip-bearing document, comprising a dielectric support 400, the electronic circuit 100 comprising a main circuit 110 and a secondary circuit 120, the main circuit 110 being an open circuit comprising a plurality of electrical tracks 111, the secondary circuit 120 being electrically connected to the main circuit 110 and assembled to it in particular by gluing or crimping 140, The electronic circuit 100 being capable of being manufactured by the process according to the invention, in which the main circuit 110 comprises: a. a conductive film 500 cut and deposited on the dielectric support 400 in a predetermined solid shape, fixed on the dielectric support 400 by hot pressing, the electrical tracks 111 of the main circuit 110 being arranged in the predetermined solid shape; and in which the secondary circuit 120 is at least one of: b. a patch deposited on the main circuit 110, said patch being able to have a single or double-sided aluminium / PET / aluminium structure, c. a semiconductor component transferred onto the main circuit 110.

[0021] The carryover is known by the English term "flip-chip".

[0022] According to another of its objects, the invention relates to a chip document comprising the electronic circuit 100 of the invention.

[0023] It can be expected that the smart document, in particular a smart card, will also include at least one electronic device from among the following: a. A DCVD screen, b. A security element, c. A microcontroller, d. A biometric sensor, e. A concentrator with or without a capacitor, f. A passive electronic component 130, in particular a resistor or a capacitor; the electronic circuit 100 being electrically connected to said electronic device.

[0024] Thanks to the present invention, it is possible to manufacture separately a main circuit 110, indistinguishably primary circuit; and a secondary circuit 120, and then to assemble them to form an electronic circuit 100, in particular a resonant circuit.

[0025] For example, as explained later, the main circuit 110 can be all or part of a communication antenna enabling radio frequency communication with a reader. This type of circuit is called "low resolution" and can be manufactured simply, using non-chemical processes, which notably allows for economies of scale.

[0026] The 120 secondary circuit is described as "high resolution". It is more complex to manufacture and can be produced as a patch.

[0027] Other features and advantages of the present invention will become more apparent from the following description, given by way of illustrative and non-limiting example and made with reference to the accompanying figures.

[0028] [Fig. 1] illustrates one embodiment of the process according to the invention, [Fig. 2] illustrates one embodiment of the process according to the invention, [Fig. 3] illustrates one embodiment of the process according to the invention, [Fig. 4] illustrates 3 embodiments of a secondary circuit 120 according to the invention, [Fig. 5] illustrates an embodiment of assembling an electronic circuit 100 according to the invention, [Fig. 6] illustrates six embodiments of an electronic circuit 100 according to the invention, [Fig. 7] illustrates one embodiment of the process according to the invention, [Fig. 8] illustrates one embodiment of the process according to the invention, [Fig. 9] illustrates one embodiment of the process according to the invention, [Fig. 10] illustrates two mechanical cutting tools, [Fig. 11] illustrates four main circuits according to the invention, [Fig. 12] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention, [Fig. 13] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention, [Fig. 14] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention, [Fig. 15] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention [Fig. 16] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention, [Fig. 17] illustrates an embodiment of an electronic circuit 100 according to the invention, [Fig. 18] illustrates a 600 heated press according to the invention. Detailed description

[0029] For the purposes of this invention, a smart document is a smart card, an RFID tag, or a passport. The smart card can be a bank or identity card, state-issued (identity card, driver's license, etc.) or private (subscription card, transport pass, etc.).

[0030] Figure 17 illustrates an embodiment of an electronic circuit 100 according to the invention, for example a resonant circuit. It comprises a main circuit 110 assembled with a secondary circuit 120. In Figure 17, each arrow of the secondary circuit 120 points to a respective electrical trace 111.

[0031] The main circuit 110 is an open circuit comprising a plurality of electrical tracks 111. It is said to be "low resolution" and can be manufactured simply and in mass, typically from a sheet of conductive material, in particular a metal, for example from a layer or film of copper and in particular a layer or film of aluminum.

[0032] In particular, the main circuit 110 is all or part of: a. a communication antenna, notably referred to as "ID1", well known to those skilled in the art in the field of smart cards, b. interconnection traces between two electronic components or between two modules, c. an electrical resistor, d. a capacitor, e. a ground plane, f. a graphic representation drawn by the electrical traces 111, g. electromagnetic shielding, h. an inductive antenna enabling power supply or communication with a subsequently assembled electronic component 130.

[0033] For example, Figure 11 illustrates several forms of the main circuit 110, specifically when viewing Figure 11 from top to bottom: as an antenna, as a resistor, as a capacitor, and as interconnecting traces. In Figure 11, the electrical traces 111 of the main circuit 110 are shown in gray.

[0034] Several embodiments of a main circuit 110 are possible, and illustrated in the figures described below.

[0035] According to the invention, the following are provided: a. a step of heat-sealing 20 of a conductive film 500 on a dielectric support 400; b. a step of cutting, or even pre-cutting, of the conductive film 500, and c. a step of peeling 50 of the unheat-sealed conductive film 500.

[0036] The dielectric support 400, or indistinctly substrate, is presented for example in the form of a coil.

[0037] Conductive film 500, for example, comes in the form of a reel.

[0038] The heat-sealing process 20 is typically implemented by depositing adhesive 520 onto the dielectric substrate 400 in a shape that corresponds to the predetermined solid form. The conductive film 500 is deposited onto the dielectric substrate 400, including, when necessary, onto the adhesive 520.

[0039] The step of cutting the conductive film 500 essentially consists of cutting the conductive film 500 according to the contours of a predetermined solid shape into which the tracks of the main circuit 110 are inserted.

[0040] The pre-cutting step of the conductive film 500 essentially consists of pre-cutting a set of at least one recess inside the predetermined solid shape of the conductive film 500, prior to the heat-sealing step 20.

[0041] The peeling step 50 of the conductive film 500 essentially consists of removing the non-heat-bonded conductive film 500 so as to leave fixed on the dielectric support 400 only the conductive film 500 corresponding to the predetermined solid shape.

[0042] The predetermined solid shape of the heat-sealed conductive film 500 is obtained, for example, by pressing a mechanical cutting tool 300 onto the conductive film 500. The mechanical cutting tool 300 comprises a set of cutting blades 310 which form a cutting impression of the Predetermined solid shape. The 300 mechanical cutting tool can be rotary or flat.

[0043] An example of a 300 rotary mechanical cutting tool is shown on the left side of Figure 10, and an example of a 300 flat mechanical cutting tool is shown on the right side of Figure 10, each tool comprising a set of 310 cutting blades.

[0044] The cutting blades 310 form a cutting imprint of at least one of: a. the contours of a predetermined solid shape into which the tracks of the main circuit 110 are inserted; b. electrical tracks 111 in the predetermined solid shape; c. the set of at least one recess.

[0045] In Figure 10 (left and right), the inner 310 cutting blades form a cut imprint of a recess and the outer 310 cutting blades form a cut imprint of the contour of the predetermined solid shape.

[0046] The predetermined solid shape of the heat-bonded conductive film 500 can also be obtained by laser cutting 30 of the contours, either alternatively or in combination with mechanical cutting 40 of the heat-bonded conductive film 500. Similarly, the assembly of at least one recess can also be obtained by laser cutting 30.

[0047] Electrical tracks 111, for example illustrated in figure 11, can also be obtained by laser cutting 30 (figure 2, figure 3) or by cutting blades 310 (figure 1).

[0048] The pressing of a mechanical cutting tool 300 can be simultaneous with the cutting, whether it is the cutting of the contours of the predetermined solid shape or of the whole of at least one recess.

[0049] The heat-sealing 20 and cutting can be simultaneous, for example as illustrated in Figure 18, thanks to a heated press 600 applied to the mechanical cutting tool 300; the dielectric support 400 being deposited on a support called an "anvil 610".

[0050] In one embodiment, see Figure 1, the mechanical cutting tool 300 is rotating. The predetermined solid shape into which the tracks of the main circuit 110 are inserted is an open shape, in this case C-shaped. In this embodiment, the cutting tool includes cutting blades 310 for cutting the contours of the predetermined solid shape. finished, including a central recess, and cutting blades 310 for cutting electrical tracks 111 of the main circuit 110, which allows simultaneous cutting of the contours of the predetermined solid shape and the electrical tracks 111 of the main circuit 110, and in this case also a recess. In this case, the mechanical cutting 40 of the contours of the predetermined shape, the mechanical cutting 41 of a recess, and the mechanical cutting 42 of the electrical tracks of the main circuit take place substantially simultaneously. Then, the conductive film 500 is peeled off after the contours of the predetermined solid shape, including a central recess, and the electrical tracks 111 of the main circuit 110 have been cut.

[0051] In one embodiment, see Figure 2, the mechanical cutting tool 300 is rotating. The predetermined solid shape into which the tracks of the main circuit 110 are inserted is identical to that shown in Figure 1, i.e., an open shape, in this case C-shaped. In this embodiment, the cutting tool comprises only cutting blades 310 for cutting the contours of the predetermined solid shape, including a central recess. The electrical tracks 111 of the main circuit 110 are cut by a laser 200. The conductive film 500 is peeled off after the contours of the predetermined solid shape, including the central recess, and before the electrical tracks 111 of the main circuit 110 are cut.

[0052] Another view of the embodiment of figure 2 is illustrated in figure 7. In figure 7, the impression of glue 520 for the heat bonding 20 and the superposition of a conductive film 500 on the dielectric support 400 have been shown. In this case, the conductive film 500 and the dielectric support 400 are unwound from a respective reel (not shown).

[0053] In one embodiment, see Figure 3, the mechanical cutting tool 300 is rotating. The predetermined solid shape into which the tracks of the main circuit 110 are inserted is a closed shape, in this case an O shape. In this embodiment, the cutting tool comprises only cutting blades 310 for cutting the contours of the predetermined solid shape, in this case including a central recess. The electrical tracks 111 of the main circuit 110 are cut by a laser 200. The conductive film 500 is peeled off after the contours of the predetermined solid shape, including a central recess, and before the laser cutting 30 of the electrical tracks 111. Main circuit 110.

[0054] An alternative to the embodiment shown in Figure 3 is illustrated in Figure 8. Figure 8 shows the adhesive imprint 520 for heat-sealing 20 and the application of a conductive film 500 onto the dielectric support 400. In this embodiment, the conductive film 500 and the dielectric support 400 are unwound from their respective reels (not shown). In this embodiment, a recess is pre-cut in the conductive film 500 before heat-sealing 20. In this embodiment, the conductive film 500 is peeled off after the contours of the predetermined solid shape have been cut, and after the electrical traces 111 of the main circuit 110 have been laser-cut 30.

[0055] An alternative to the embodiment shown in Figure 8 is illustrated in Figure 9. Figure 9 shows the adhesive imprint 520 for heat-sealing 20 and the application of a conductive film 500 onto the dielectric support 400. In this embodiment, the conductive film 500 and the dielectric support 400 are unwound from their respective reels (not shown). In this embodiment, a recess is pre-cut in the conductive film 500 before heat-sealing 20. In this embodiment, the conductive film 500 is peeled off after the contours of the predetermined solid shape have been cut, and before the laser cutting 30 of the electrical traces 111 of the main circuit 110.

[0056] In an embodiment not shown, and based on the combination of Figure 1 and Figure 3, the mechanical cutting tool 300 is rotary or flat. The predetermined solid shape into which the tracks of the main circuit 110 are inserted is a closed shape, in this case an O shape. In this embodiment, the cutting tool includes cutting blades 310 for cutting the contours of the predetermined solid shape, including a central recess, and cutting blades 310 for cutting a portion of the electrical tracks 111 of the main circuit 110. The remaining electrical tracks 111 of the main circuit 110 are then cut by a laser 200.

[0057] The sequence of steps in the main circuit 110 can therefore vary depending on the embodiment.

[0058] As illustrated in Figure 6, at least the following six variants are possible, shown by line in Figure 6. Figure 6 does not show the possible mechanical cut 42 of the electrical tracks of the main circuit.

[0059] In Figure 6, laser cutting 30 primarily concerns the cutting of electrical traces 111. These variations are not exhaustive; in fact, the cutting of electrical traces 111 can be carried out by laser 200 or by tool mechanical, the same for cutting the contours and the same for cutting the recess.

[0060] In all variants of Figure 6, the first step is that of unwinding 10 of the conductive film 500 and the dielectric support 400.

[0061] In a first variant, first line from the top of figure 6, after unwinding 10, and heat-sealing 20 of the predetermined shape of the conductive film 500, a laser cutter 30 cuts at least the contours of the predetermined solid shape, similar to the mechanical cutting tool illustrated in figure 2 or figure 3. Preferably, the laser cutter 30 also cuts the electrical tracks 111. The conductive film 500 can then be peeled off and the conductive film 500 and the dielectric support 400 rewound.

[0062] In a second variant, second row from the top of Figure 6, after unwinding 10, heat-sealing 20 and cutting of the contours of the predetermined shape of the conductive film 500 occur simultaneously, in this case including a central cutout. The conductive film 500 can then be peeled back and a laser cutter 30 can be used to cut the electrical traces 111 into the predetermined heat-sealed shape. The conductive film 500 and the dielectric support 400 can then be rewound.

[0063] In a third variant, the third line from the top of Figure 6, after unwinding step 10, the predetermined shape of the conductive film 500 is heat-sealed. Next, the contours, and in this case simultaneously a central recess, of the predetermined shape of the conductive film 500 are mechanically cut. The conductive film 500 can then be peeled off, and a laser cutter 30 is used to cut the electrical traces 111 within the predetermined heat-sealed shape. The conductive film 500 and the dielectric support 400 can then be rewound.

[0064] In a fourth variant, fourth line from the top of Figure 6, after unwinding step 10, a recess is mechanically pre-cut in the conductive film 500. Next, the predetermined shape of the conductive film 500 is heat-sealed, and then a laser cutter 30 is used to cut the electrical traces 111 within the heat-sealed predetermined shape. The conductive film 500 can then be peeled off, and the conductive film 500 and the dielectric support 400 can be rewound.

[0065] In a fifth variant, fifth line from the top of figure 6, after unwinding 10, a hollow is mechanically pre-cut The conductive film 500 is then simultaneously heat-sealed to the predetermined shape of the conductive film 500 and its contours are mechanically cut. Next, the conductive film 500 is peeled off, and a laser cutter 30 is used to cut the electrical traces 111 within the heat-sealed predetermined shape. Finally, the conductive film 500 and the dielectric support 400 are rewound.

[0066] In a sixth variant, the last line from the top of Figure 6, after unwinding step 10, a recess is mechanically pre-cut in the conductive film 500. Next, the predetermined shape of the conductive film 500 is heat-sealed, and its contours are then mechanically cut. The conductive film 500 is then peeled off, and a laser cutter 30 is used to cut the electrical traces 111 within the predetermined heat-sealed shape. Finally, the conductive film 500 and the dielectric support 400 are rewound.

[0067] The secondary circuit 120 is called "high resolution" because it is more complex.

[0068] The secondary circuit 120 of Figure 17 is illustrated, for example, in Figure 4, from left to right according to the assembly sequence. The left side of Figure 4 shows the high-resolution secondary circuit 120. The central part of Figure 4 shows the secondary circuit 120 with an electronic component 130 mounted on it, for example, a DCVD screen, a security element, a biometric sensor, or a concentrator (possibly with a capacitor). The right side of Figure 4 shows the secondary circuit 120 ready to be assembled to the main circuit 110 with a crimp 140.

[0069] The assembly of the main circuit 110 and the secondary circuit 120 can be carried out in several ways.

[0070] Assembly

[0071] The assembly of the main circuit 110 and the secondary circuit 120 can be carried out in several ways.

[0072] For example, as illustrated in Figure 5, the secondary circuit 120 is manufactured in series and comes in the form of labels or patches. Each label can be individually detached from its backing and assembled to the main circuit 110, for example by gluing, for example using an electrically conductive adhesive 520, or by crimping 140 (the crimping 140 is also illustrated in Figure 17).

[0073] Similarly, the main circuit 110 is advantageously manufactured in series and can also be presented in the form of individual labels.

[0074] In Figure 5, the main circuit 110 is open; and the secondary circuit 120 includes an electronic component 130. In this example, assembling the secondary circuit 120 onto the main circuit 110 allows the latter to be closed.

[0075] Other assembly methods are illustrated in figures 12 to 16.

[0076] In Figure 12, part A illustrates the docking of a double-sided secondary circuit 120 onto a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0077] In Figure 13, part A illustrates the docking of a single-sided secondary circuit 120 free of electronic component 130 onto a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0078] In Figure 14, part A illustrates the docking of a single-sided secondary circuit 120 with an electronic component 130 on a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0079] In Figure 15, part A illustrates the docking of a single-film secondary circuit 120 without substrate onto a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0080] In Figure 16, part A illustrates the docking of a secondary circuit 120 in the form of an electronic component 130 onto a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0081] Nomenclature 10. Unwinding of the 500 conductive film and the 400 dielectric support 11. Rewinding of the conductive film 500 and the dielectric support 400 20. Heat-bonding of the conductive film 500 onto the dielectric support 400 30 laser cutting 40. Mechanical cutting of the contours of the predetermined shape 41. Mechanical cutting of a recess peeling of the conductive film 500 electronic circuit main circuit electrical trace of the main circuit 110 secondary circuit electronic component laser crimping mechanical cutting tool cutting blades dielectric support conductive film hollowing glue heated press anvil laminate

Claims

Demands 1. Method for manufacturing an electronic circuit (100) for a chip-bearing document, the chip-bearing document comprising a dielectric support (400), the electronic circuit (100) comprising a main circuit (110) and a secondary circuit (120), the main circuit (110) being preferably an open circuit comprising a plurality of electrical tracks (111), the secondary circuit (120) being prefabricated and intended to be electrically connected to the main circuit (110) when assembled therewith, Characterized in that the process comprises steps consisting of constructing the main circuit (110) by: • To heat-bond a conductive film (500) to the dielectric support (400) by depositing adhesive (520) onto the dielectric support (400) in a shape that corresponds to a predetermined solid form, • Cut the heat-sealed conductive film (500) according to the contours of the predetermined solid shape into which the tracks of the main circuit (110) are inserted, • Peel the unglued conductive film (500) according to a shape complementary to the predetermined solid shape, so as to leave fixed on the support only the glued conductive film (500), corresponding to the predetermined solid shape.

2. A method according to claim 1, wherein the step of cutting the contours of the predetermined solid shape of the conductive film (500) is implemented by at least one of the following steps: • by pressing a mechanical cutting tool (40) onto the conductive film (500), said cutting tool being rotating or flat and comprising a set of blades forming a cutting impression of the predetermined solid shape; said cutting and heat sealing (20) being able to be simultaneous; • by laser cutting (30) of the conductive film (500).

3. A method according to any one of the preceding claims, further comprising a step of realizing the electrical tracks (111) of the main circuit (110) in the solid form predetermined by at least one of the following steps: • by pressing a mechanical cutting tool (300) onto the conductive film (500), said cutting tool being rotating or flat and comprising a set of blades forming a cutting impression of the electrical tracks (111) in the predetermined solid shape; said pressing for the creation of the electrical tracks (111) being able to be simultaneous with the cutting of the contours of the predetermined solid shape; • by laser cutting (30) of the conductive film (500).

4. Method according to claim 3, wherein said laser cutting step (30) of the electrical tracks (111) is carried out according to one of the following sequences: i. After the heat-sealing step (20) and before the peeling step (50), ii. After the heat-sealing step (20) and after the peeling step (50), the heat-sealing step (20) being able to be prior to or simultaneous with the cutting step of the predetermined solid shape.

5. A method according to any one of the preceding claims, further comprising a step of pre-cutting a set of at least one recess (510) in the predetermined solid shape, prior to the heat-sealing step (20), said pre-cutting of at least one recess (510) being carried out by at least one of the following steps: i. by pressing a mechanical pre-cutting tool onto the conductive film (500), said pre-cutting tool being rotating or flat and comprising a set of blades forming a pre-cutting imprint of at least one recess (510); ii. by laser cutting (30); said pre-cutting step being prior to or simultaneous with the step of cutting the contours of the solid shape.

6. A method according to any one of the preceding claims, further comprising a step of arranging the electrical tracks (111) of the main circuit (110) on the support so as to achieve all or part of at least one of the following: • A communication antenna enabling radio frequency communication with a reader, • Interconnection traces between two electronic components or between two modules, • an electrical resistance, • a capacitor, • A site plan, • A graphical representation, • Electromagnetic shielding, • An inductive antenna enabling power supply or communication with a subsequently assembled electronic component (130).

7. A method according to any one of the preceding claims, further comprising a step of assembling the main circuit (110) and the secondary circuit (120), by one of the steps of: i. Depositing the secondary circuit (120) onto the main circuit (110), in particular in the form of a patch and ii. Transferring onto the main circuit (110) at least one semiconductor component comprising the secondary circuit (120), then by a step of joining the main circuit (110) and the secondary circuit (120), in particular by gluing or crimping (140), the method preferably further comprising a step of laminating (700) the assembled electronic circuit (100).

8. Electronic circuit (100) for chip document, comprising a dielectric support (400), the electronic circuit (100) comprising a main circuit (110) and a secondary circuit (120), the main circuit (110) being an open circuit comprising a plurality of electrical tracks (111), the secondary circuit (120) being electrically connected to the main circuit (110) and assembled to it in particular by gluing or crimping (140), The electronic circuit (100) being capable of being manufactured by the process according to any one of the preceding claims, wherein the main circuit (110) comprises: • a conductive film (500) cut and deposited on the dielectric support (400) in a predetermined solid shape, fixed to the dielectric support (400) by hot pressing, the electrical tracks (111) of the main circuit (110) being arranged in the predetermined solid shape; and wherein the secondary circuit (120) is at least one of: • a patch placed on the main circuit (110), said patch being able to have a single or double-sided aluminium / PET / aluminium structure, • a semiconductor component placed on the main circuit (110).

9. Chip-on document comprising the electronic circuit (100) according to claim 8.

10. A smart document according to claim 9, in particular a smart card, further comprising at least one electronic device from: • A DCVD screen, • A secure element, • A microcontroller, • A biometric sensor, • A concentrator with or without a capacitor • A passive electronic component (130), in particular a resistor or a capacitor; the electronic circuit (100) being electrically connected to said electronic device.

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