Backup pin arrangement support device, solder printer, backup pin arrangement support method, backup pin arrangement support program, and recording medium

Abstract

The position of a backup pin P held by the backup pin P of a push-up plate 421 (backup plate) and the position of a component E mounted on a lower surface Bl of a substrate B are acquired (steps S203, S207). Then, a distance evaluation value V indicating the distance between the component E mounted on the lower surface Bl of the substrate B stopped at a work position A and the backup pin P held by a pin holder H is calculated on the basis of the position of the backup pin P and the position of the component E (step S209). The possibility of interference between the component E and the backup pin P can therefore be confirmed on the basis of the distance evaluation value V. This makes it possible to confirm the possibility of interference between the component E and the backup pin P.

Description

Backup Pin Arrangement Support Device, Solder Printer, Backup Pin Arrangement Support Method, Backup Pin Arrangement Support Program, and Recording Medium

[0001] This invention relates to a technique for assisting in the arrangement of backup pins with respect to a backup plate having a plurality of pin holders capable of holding backup pins for supporting a substrate.

[0002] As shown in Patent Documents 1 and 2, in a solder printer that prints solder on a substrate stopped at a working position or a component mounter that mounts components on a substrate stopped at a working position, backup pins that support the substrate at the working position from below are used. At this time, in order to appropriately support the lower surface of the substrate with the backup pins, it is necessary to arrange the backup pins while suppressing displacement with respect to the substrate. In contrast, Patent Document 1 proposes a technique of adjusting the position of the substrate based on an image of the backup pins.

[0003] Japanese Patent Application Laid-Open No. 2015-002222 Japanese Patent Application Laid-Open No. 2023-064673

[0004] By the way, components may be mounted on the lower surface of the substrate stopped at the working position. In such a case, it is necessary to arrange the backup pins so that the backup pins that contact the lower surface of the substrate do not interfere with the components. Therefore, there has been a need to confirm the possibility of interference between the components and the backup pins. However, the above techniques have not sufficiently met such needs.

[0005] This invention has been made in view of the above problems, and an object thereof is to enable confirmation of the possibility of interference between components and backup pins.

[0006] The backup pin placement support device according to the present invention includes a pin position acquisition unit that acquires the positions of backup pins held in the pin holders of a backup plate having a plurality of pin holders capable of holding backup pins that support the substrate by contacting the lower surface of the substrate, which stops at a working position from below; a component position acquisition unit that acquires the positions of components mounted on the lower surface of the substrate; and a calculation unit that calculates a distance evaluation value indicating the distance between the components mounted on the lower surface of the substrate, which stops at a working position, and the backup pins held in the pin holders, based on the backup pin position information and the component positions.

[0007] The backup pin placement support method according to the present invention comprises the steps of: obtaining the position of backup pins held in the pin holders of a backup plate having a plurality of pin holders capable of holding backup pins that support a substrate by contacting the lower surface of the substrate, which stops at a working position, from below; obtaining the position of a component mounted on the lower surface of the substrate; and calculating a distance evaluation value indicating the distance between the component mounted on the lower surface of the substrate, which stops at a working position, and the backup pins held in the pin holders, based on the position of the pins and the position of the component.

[0008] The backup pin placement support program according to the present invention causes a computer to execute the above-described backup pin placement support method.

[0009] The recording medium according to the present invention records the above-mentioned backup pin placement support program in a way that is readable by a computer.

[0010] In the present invention (backup pin placement support device, backup pin placement support method, backup pin placement support program, and recording medium) configured as described above, the positions of the backup pins held in the pin holders of the backup plate and the positions of the components mounted on the underside of the circuit board are acquired. Then, a distance evaluation value indicating the distance between the component mounted on the underside of the circuit board, which stops at the working position, and the backup pins held in the pin holders is calculated based on the positions of the pins and the components. Therefore, the possibility of interference between the component and the backup pins can be confirmed based on the distance evaluation value. In this way, it becomes possible to confirm the possibility of interference between the component and the backup pins.

[0011] Furthermore, the backup pin placement support device may be configured such that the calculation unit calculates distance evaluation values ​​for each of several combinations in which at least one of the component and the pin holder is different, and calculates the minimum value among the distance evaluation values ​​for each of the several combinations as the margin evaluation value. In such a configuration, it becomes possible to check the possibility of interference between the component and the backup pin based on the margin evaluation value.

[0012] Furthermore, the backup pin placement support device may be configured such that the calculation unit performs a simulation to calculate the change in the margin evaluation value in response to a change in the relative position of the backup plate with respect to the work position, and determines the relative position of the backup plate with respect to the work position based on the simulation results. In such a configuration, the relative position of the backup plate with respect to the work position can be determined so that the component and the backup pins do not interfere with each other.

[0013] Furthermore, the backup pin placement support device may be configured such that the calculation unit changes the relative position of the backup plate with respect to the work position in multiple stages by changing it in predetermined unit intervals within a predetermined range of change during the simulation, and calculates a margin evaluation value for each of the multiple stages. In such a configuration, the relative position of the backup plate with respect to the work position can be determined so that the component and the backup pin do not interfere with each other.

[0014] Furthermore, the system may also include a unit interval receiving unit that accepts unit intervals input by the user, and the calculation unit may be configured to change the relative position of the backup plate with respect to the work position in the simulation by the unit intervals accepted by the unit interval receiving unit. In such a configuration, if the simulation takes a long time, the user can shorten the simulation time by widening the unit interval.

[0015] Furthermore, the backup pin placement support device may be configured such that the pin holders are arranged on the backup plate at a predetermined array pitch, and the range of variation is less than twice the array pitch, centered on the relative position of the backup plate with respect to the working position before the simulation is performed. By providing a range of variation for the array pitch in this way, the simulation can be performed rationally.

[0016] Alternatively, the backup pin placement support device may be configured such that the calculation unit determines the position where the maximum margin evaluation value is calculated as the optimal position and decides to position the backup plate in the optimal position relative to the work position. In such a configuration, the relative position of the backup plate with respect to the work position can be determined so that the component and the backup pins do not interfere with each other.

[0017] Furthermore, the backup pin placement support device may be configured to include an inquiry execution unit that queries the user, and the calculation unit instructs the inquiry execution unit to query whether or not to determine whether or not to position the backup plate in the optimal position relative to the work position. If the inquiry execution unit receives input from the user indicating that the decision is to reject the decision, the calculation unit discards the decision. In such a configuration, it is possible to prevent the adjustment to the optimal position from being performed against the user's intentions.

[0018] Furthermore, the calculation unit may configure the backup pin placement support device to change the relative position of the backup plate with respect to the work position in at least one of the following directions during simulation: the transport direction in which the substrate is transported and the width direction perpendicular to the transport direction. In such a configuration, the relative position of the backup plate with respect to the work position can be determined so that the components and backup pins do not interfere with each other.

[0019] Furthermore, the backup pin placement support device may be configured to include a notification unit that notifies the user, and the calculation unit may cause the notification unit to issue a notification prohibiting the placement of backup pins to pin holders for which distance evaluation values ​​below a predetermined threshold have been calculated, if the maximum value of the margin evaluation value calculated in the simulation is below a predetermined threshold. With such a configuration, interference between components and backup pins can be accurately prevented.

[0020] Furthermore, the calculation unit may be configured to cause the notification unit to notify it of the placement of backup pins in pin holders for which a distance evaluation value below a threshold was not calculated. In such a configuration, interference between components and backup pins can be accurately prevented while firmly supporting the substrate with sufficient backup pins.

[0021] Furthermore, the calculation unit may be configured to cause the notification unit to notify the minimum value of the distance evaluation calculated for the pin holder on which the backup pins are to be placed. In such a configuration, the user can confirm the possibility of interference between the backup pins placed on the proposed pin holder and the components based on the distance evaluation value.

[0022] The specific targets for calculating the distance evaluation value can vary. For example, the calculation unit may be configured to calculate the distance evaluation value for each of the multiple pin holders and the component. Alternatively, the calculation unit may be configured to calculate the distance evaluation value for some of the multiple pin holders and the component that have a predetermined positional relationship with the component. Or, the system may further include a pin placement information acquisition unit that acquires pin placement information indicating the target holders for which backup pins are to be placed, and the calculation unit may be configured to calculate the distance evaluation value for the target holders and the component.

[0023] Furthermore, the backup pin placement support device may be configured such that the calculation unit calculates the distance evaluation value using one of two calculation methods, a first calculation method and a second calculation method, which calculate the distance evaluation value using different methods, selected according to the type of component. In such a configuration, the distance evaluation value can be calculated using an appropriate calculation method according to the type of component, making it possible to accurately confirm the possibility of interference between the component and the backup pin based on the distance evaluation value.

[0024] Furthermore, the backup pin placement support device may be configured such that the first calculation method calculates a distance evaluation value by subtracting a dimensional value corresponding to the dimensions of the backup pin and the component from the distance between the center of the backup pin and the center of the component. According to this first calculation method, the distance evaluation value can be calculated by a relatively simple calculation.

[0025] Furthermore, the backup pin placement support device may be configured such that the dimensional value is the sum of half the length of the diagonal of a component that has a rectangle in plan view and the radius of a backup pin that has a circle in plan view, or the sum plus a constant. According to this first calculation method, the distance evaluation value can be calculated by a relatively simple calculation.

[0026] Furthermore, the backup pin placement support device may be configured such that the second calculation method calculates the distance between the backup pin and a placement prohibition area, which is provided in a plan view that is wider than the component and includes the component, as a distance evaluation value. According to this second calculation method, a more accurate distance evaluation value can be calculated from the viewpoint of interference prevention.

[0027] Furthermore, the backup pin placement support device may be configured to include a suggestion unit that proposes the placement of backup pins to pin holders for which the calculation unit did not calculate a distance evaluation value below a predetermined threshold. In such a configuration, interference between components and backup pins can be accurately prevented while firmly supporting the substrate with sufficient backup pins.

[0028] The solder printing machine according to the present invention comprises a substrate transport unit that stops the substrate at a working position, a backup plate having a plurality of pin holders capable of holding backup pins that support the substrate by contacting the lower surface of the substrate stopped at the working position from below, a solder application unit that applies solder to the substrate stopped at the working position, and the above-mentioned backup pin placement support device. Therefore, it is possible to check for the possibility of interference between components and backup pins.

[0029] Furthermore, the soldering machine may be configured to include a position adjustment unit that changes the position of the backup plate relative to the working position. With such a configuration, interference between the component and the backup pin can be effectively prevented.

[0030] According to the present invention, it is possible to check for the possibility of interference between a component and a backup pin.

[0031] A schematic diagram of a soldering machine. A schematic perspective view of the push-up plate configuration. A schematic diagram of an example of a Y-position adjustment mechanism for adjusting the position of the push-up plate relative to the work position in the Y direction. A block diagram showing the electrical configuration of the soldering machine. A schematic diagram showing an example of the contents of pin position information and component position information. A flowchart showing an example of pin placement support. A flowchart showing an example of margin evaluation value calculation performed in the pin placement support of Figure 6. A schematic plan view showing the distance evaluation value calculation mode. A schematic plan view showing the distance evaluation value calculation mode. A schematic plan view showing the distance evaluation value calculation mode. A side view showing an example of the method for evaluating the dimensions of backup pins used in the calculation mode of Figure 8A. A side view showing an example of the method for evaluating the dimensions of backup pins used in the calculation modes of Figures 8B and 8C. A diagram showing the distance evaluation values ​​calculated for all combinations of components and backup pins in table format. A schematic plan view showing the contents of a simulation for calculating the change in margin evaluation value in response to changes in the relative position of the push-up plate relative to the work position. Figure 11 shows the results calculated by the simulation in table format. A schematic diagram of an example screen suggesting additional backup pins. A schematic diagram of an example screen prompting a change in the temporary placement position of backup pins. A schematic plan view showing a modified combination of the component to which the distance evaluation value is calculated and the backup pins. A schematic plan view showing a modified Y position adjustment mechanism.

[0032] Figure 1 is a schematic diagram of a soldering machine. In Figure 1, the horizontal direction (X), the horizontal direction perpendicular to the X direction (Y), and the vertical direction (Z) are shown as appropriate. The position in the X direction is referred to as the X-coordinate, and the position in the Y direction is referred to as the Y-coordinate.

[0033] The solder printing machine 1 comprises a mask holding unit 2 for holding a mask M, a substrate holding unit 4 positioned below the mask M, and a squeegee unit 6 positioned above the mask M. The solder printing machine 1 uses the substrate holding unit 4 to position the substrate B against the mask M from below, while sliding the lower end 611 (tip) of the squeegee 61 of the squeegee unit 6 in the Y direction across the upper surface of the mask M. As a result, the solder supplied to the upper surface of the mask M is printed onto the upper surface of the substrate B via a mask pattern that penetrates the mask M.

[0034] The mask holding unit 2 has a clamp member 21, and the mask M is detachably attached to the clamp member 21 via a frame 22 provided on its periphery. In this way, the flat-shaped mask M is held horizontally by the mask holding unit 2. The mask M has a rectangular shape in plan view and has through holes (mask pattern) in a shape corresponding to the printing pattern on the substrate B.

[0035] The substrate holding unit 4 is positioned below the mask M held by the mask holding unit 2 and is responsible for aligning the position of the substrate B with respect to the mask M. The substrate holding unit 4 includes a pair of conveyors 41 for transporting the substrate B, a substrate holding section 42 for holding the substrate B received from the conveyors 41, and a flat, movable table 43 that supports the conveyors 41 and the substrate holding section 42.

[0036] A pair of conveyors 41 are arranged parallel to the X direction with a gap between them in the Y direction, and their upper surfaces support both ends of the substrate B in the Y direction from below. Each conveyor 41 then transports the substrate B in the X direction, thereby loading or unloading the substrate B to or from the soldering machine 1.

[0037] The substrate holder 42 has a flat push-up plate 421 and a sliding column 422 that can slide in the Z direction relative to the movable table 43, with the push-up plate 421 supported at the upper end of the sliding column 422. Multiple backup pins P are erected in the Z direction on the upper surface of the push-up plate 421 and are arranged at intervals in the X and Y directions, and the push-up plate 421 functions as a mounting base on which the backup pins P are placed. When the sliding column 422 moves up and down, the backup pins P move up and down together with the push-up plate 421.

[0038] For example, when a circuit board B is loaded onto the conveyor 41, the upper end of each backup pin P is positioned below the upper surface of the conveyor 41. When the conveyor 41 loads the circuit board B directly above the backup pins P, the backup pins P rise, and their upper ends protrude above the upper surface of the conveyor 41. As a result, the upper ends of the backup pins P contact the lower surface Bl of the circuit board B, pushing the circuit board B upward and transferring the circuit board B from the upper surface of the conveyor 41 to the upper ends of each backup pin P.

[0039] Furthermore, the substrate holding section 42 has a pair of clamp plates 424 arranged above the pair of conveyors 41 with a gap in the X direction, and at least one of these clamp plates 424 is movable in the X direction. The upper surface of each clamp plate 424 is a plane parallel to the X and Y directions and is located at the same height. When the substrate B on the backup pins P rises to between the pair of clamp plates 424, one of the clamp plates 424 moves toward the other, and the substrate B is clamped by these clamp plates 424 from the X direction (horizontal direction).

[0040] In this way, the substrate B is fixed in the working position A in a plan view by the clamping of the pair of clamp plates 424 and positioned relative to the push-up plate 421. As will be described later, the relative positional relationship between the working position A and the push-up plate 421 is variable in the X and Y directions.

[0041] Furthermore, the substrate holding unit 4 has a table drive mechanism 44 for driving the movable table 43. This table drive mechanism 44 includes an X-axis table 441, a Y-axis table 442 attached to the upper surface of the X-axis table 441, an R-axis table 443 attached to the upper surface of the Y-axis table 442, and a ball screw 444 for raising and lowering the movable table 43 with respect to the R-axis table 443. By these components, the conveyor 41 and the substrate holding portion 42 arranged on the movable table 43 are driven in the X, Y, Z, and R directions. For example, when positioning the substrate B with respect to the mask M, the position of the substrate B clamped by the clamp plate 424 is adjusted in the X, Y, Z, and R directions, so that the upper surfaces of the clamp plate 424 and the substrate B are brought into contact with the lower surface of the mask M.

[0042] Thus, in the solder printer 1 shown in FIG. 1, the substrate B held by the substrate holding unit 4 faces the mask M from below. Then, the squeegee unit 6 moves the squeegee 61 in the Y direction while making the lower end 611 of the squeegee 61 contact the upper surface of the mask M. As a result, the lower end 611 of the squeegee 61 slides in the Y direction with respect to the upper surface of the mask M. Also, solder is placed on the upper surface of the mask M, and the squeegee 61 sliding in the Y direction prints the solder on the upper surface of the substrate B through the pattern of the mask M. At this time, the substrate B fixed at the working position A is supported from below by the backup pins P placed on the push-up plate 421.

[0043] FIG. 2 is a perspective view schematically showing the configuration of the push-up plate. Backup pins P are arranged on the push-up plate 421. The backup pins P extend parallel to the Z direction from the lower end Pl to the upper end Pu. More specifically, the backup pin P has a cylindrical portion Pd extending upward from the lower end Pl and a tapered conical portion Pn whose diameter decreases from the upper end of the cylindrical portion Pd toward the upper end Pu, and the upper end of the conical portion Pn corresponds to the upper end Pu of the backup pin P. Note that the upper end of the conical portion Pn (i.e., the upper end Pu of the backup pin P) may be rounded or chamfered flat.

[0044] The push-up plate 421 has an upper surface 421u that is held horizontally by a sliding support column 422. Multiple pin holders H are provided on the upper surface 421u of the push-up plate 421. The multiple pin holders H are arranged in a matrix with spacing in the X and Y directions. That is, Nx pin holders H are arranged parallel to the X direction with an arrangement pitch Tx, and Ny pin holders H are arranged parallel to the Y direction with an arrangement pitch Ty. In this example, the number of pin holders H arranged in the X direction Nx is 4, and the number of pin holders H arranged in the Y direction Ny is 3. However, the specific values ​​of the numbers Nx and Ny are not limited to this example. Also, the arrangement pitch Tx and the arrangement pitch Ty may be equal or different.

[0045] Each pin holder H is a hole that opens upward. The pin holder H is configured to hold the backup pins P. Specifically, the lower end Pl of the backup pin P fits into the pin holder H from above, thereby holding the backup pin P in place of the pin holder H. As a result, the backup pin P is erected above the upper surface 421u at the position of the pin holder H. The placement of the backup pins P on the pin holder H of the push-up plate 421 may be performed automatically by a mechanical mechanism provided in the soldering machine 1, or it may be performed manually by an operator. The upper end Pu of the backup pin P held in the pin holder H contacts the lower surface Bl of the substrate B at the working position A, supporting the substrate B from below.

[0046] Incidentally, components may be mounted on the lower surface Bl of the substrate B. Therefore, it is necessary to support the substrate B with the backup pins P while avoiding interference between the backup pins P and the components. To address this, the substrate holding unit 4 can adjust the relative positional relationship between the working position A and the push-up plate 421. Specifically, a pair of conveyors 41 (X position adjustment mechanism) moves the substrate B in the X direction, thereby relatively adjusting the position of the push-up plate 421 in the X direction with respect to the working position A where the substrate B stops. Further, the substrate holding unit 4 has a Y position adjustment mechanism 45. This Y position adjustment mechanism 45 relatively adjusts the position of the push-up plate 421 in the Y direction with respect to the working position A where the substrate B stops by moving the push-up plate 421 in the Y direction.

[0047] FIG. 3 is a diagram schematically showing an example of a Y position adjustment mechanism that adjusts the position of the push-up plate in the Y direction with respect to the working position. In the cross-sectional view of FIG. 3, the configuration below the horizontal cross-section of the push-up plate 421 is shown. In the partial enlarged view of FIG. 3, the Y position adjustment mechanism is shown enlarged.

[0048] The Y position adjustment mechanism 45 has a long hole 451 provided on the lower surface of the push-up plate 421. The long hole 451 extends parallel to the X direction and opens downward. Further, the long hole 451 has an eccentric cam 452 that fits into the long hole 451 from below and a rotating shaft 453 that extends in the Z direction, and the eccentric cam 452 is attached to the upper end portion of the rotating shaft 453. Therefore, when the rotating shaft 453 rotates, the eccentric cam 452 rotates about the rotating shaft 453, and the push-up plate 421 moves in the Y direction. As illustrated in FIG. 3, when the eccentric cam 452 rotates between the first rotation angle and the second rotation angle, the position of the push-up plate 421 moves by a distance ΔY in the Y direction.

[0049] Figure 4 is a block diagram showing the electrical configuration of a soldering machine. The substrate holding unit 4 of the soldering machine 1 includes a conveyor motor 411, a cam motor 454, and a motor control unit 46 that controls the conveyor motor 411 and the cam motor 454. The conveyor motor 411 drives the conveyor 41 in the X direction. The cam motor 454 rotates an eccentric cam 452 by rotating its rotating shaft 453. By driving the conveyor 41 with the conveyor motor 411, the motor control unit 46 can adjust the position of the substrate B supported by the conveyor 41 in the X direction. In other words, the motor control unit 46 can adjust the position of the push-up plate 421 relative to the work position A where the substrate B stops in the X direction. Furthermore, the motor control unit 46 can adjust the position of the push-up plate 421 in the Y direction by driving the eccentric cam 452 with the cam motor 454. In other words, the motor control unit 46 can adjust the position of the push-up plate 421 relative to the working position A where the substrate B stops, in the Y direction.

[0050] Furthermore, as shown in Figure 4, the soldering machine 1 is equipped with a pin placement support device 8 that assists in the placement of backup pins P on the push-up plate 421. The pin placement support device 8 is, for example, a computer and comprises an arithmetic unit 81, a storage unit 82, a communication unit 83, and a UI 84.

[0051] The arithmetic unit 81 is a processor such as a CPU (Central Processing Unit). The storage unit 82 is a storage device such as an SSD (Solid State Drive). The communication unit 83 performs communication between the pin assignment support device 8 and other devices. The UI 84 is a user interface and has input devices such as a keyboard and mouse and output devices such as a display. Note that the input devices and output devices do not need to be configured separately and may be configured as an integrated unit by a touch panel display or the like.

[0052] The calculation unit 81 executes a pin placement support program 821 that defines the pin placement support described later using Figure 6, thereby configuring a pin position acquisition unit 811, a component position acquisition unit 812, an information calculation unit 813, a position adjustment unit 814, and a UI control unit 815 within the calculation unit 81. The storage unit 82 stores the pin placement support program 821, pin position information 822, component position information 823, temporary pin placement information 824, and calculation mode information 825.

[0053] As described above, the pin placement support program 821 defines the operations that the calculation unit 81 performs in pin placement support (Figure 6). The pin placement support program 821 is downloaded by the communication unit 83 from, for example, a server computer (recording medium) located outside the soldering printer 1 and stored in the storage unit 82.

[0054] The pin position information 822 and component position information 823 define the information shown in Figure 5. Here, Figure 5 is a schematic diagram showing an example of the contents of the pin position information and component position information. In Figure 5, the positional relationship between multiple components E(1) to E(3) mounted on the lower surface Bl of the substrate B located at work position A and multiple backup pins P(1) to H(12) respectively arranged in multiple pin holders H of the push-up plate 421 is shown.

[0055] The pin position information 822 indicates the position (XY coordinates) of the backup pins P held by the pin holders H for all pin holders H provided on the push-up plate 421. That is, the pin position information 822 indicates the position (XY coordinates) of each of the multiple backup pins P(1) to P(12) held by the multiple pin holders H of the push-up plate 421. The component position information 823 indicates the position (XY coordinates) of each of the multiple components E(1) to E(3) mounted on the lower surface Bl of the substrate B. Note that the pin position information 822 indicates the position of each of the backup pins P(1) to P(12) relative to the push-up plate 421, and the component position information 823 indicates the position of each of the components E(1) to E(3) relative to the substrate B. These pin position information 822 and component position information 823 may, for example, be created by the calculation unit 81 in response to the user's input operation to the UI 84 and stored in the storage unit 82, or they may be created by calculations performed by the calculation unit 81 based on CAD (Computer Aided Design) data and stored in the storage unit 82.

[0056] The temporary pin placement information 824 indicates the position (XY coordinates) of the pin holder H of the push-up plate 421 that has been tentatively determined to be the location of the backup pin P. The temporary pin placement information 824 is created by the calculation unit 81 in response to, for example, the user's input operation to the UI 84 and stored in the storage unit 82. The calculation mode information 825 shows the calculation mode used to evaluate the distance between component E and the backup pin P in the pin placement support described later using Figure 6, for each of components E(1) to E(3).

[0057] Figure 6 is a flowchart showing an example of pin placement support, and Figure 7 is a flowchart showing an example of margin evaluation value calculation performed in the pin placement support of Figure 6. The pin placement support of Figure 6 is performed by the calculation unit 81 according to the pin placement support program 821.

[0058] In step S101 of the pin placement support shown in Figure 6, the margin evaluation value is calculated. As shown in Figure 7, in the margin evaluation value calculation, the component position acquisition unit 812 resets the component count value Ne (Ne = 0, 1, 2, 3) for identifying component E (Ne) to 0 (step S201), and then increments the component count value Ne by 1 (step S202).

[0059] In step S203, the component position acquisition unit 812 acquires the position of the Neth component E(Ne). Specifically, the component position acquisition unit 812 acquires the position (XY coordinates) of component E(Ne) indicated by the component position information 823. However, the position indicated by the component position information 823 is the position relative to the substrate B. In contrast, the X coordinate of the work position A where the substrate B stops depends on the X coordinate at which the conveyor 41 positions the substrate B. Therefore, the component position acquisition unit 812 acquires the X coordinate at which the conveyor 41 stops the substrate B based on the encoder output of the conveyor motor 411. Then, the component position acquisition unit 812 calculates the position of component E(Ne) based on the position indicated by the component position information 823 and the position (X coordinate) indicated by the encoder output of the conveyor motor 411.

[0060] In step S204, the information calculation unit 813 confirms the calculation mode for calculating a distance evaluation value V to evaluate the distance between component E (Ne) and the backup pin P. Figures 8A to 8C are schematic plan views showing the calculation modes for the distance evaluation value. Figure 8A shows the calculation mode for extremely small components, Figure 8B shows the calculation mode for tall components, and Figure 8C shows the high-precision calculation mode. Figure 9A is a side view showing an example of the method for evaluating the dimensions of the backup pin used in the calculation mode of Figure 8A, and Figure 9B is a side view showing an example of the method for evaluating the dimensions of the backup pin used in the calculation modes of Figures 8B and 8C.

[0061] The calculation mode for extremely small components shown in Figure 8A is applied, for example, to a component E (Figure 9A) mounted on the lower surface Bl of the substrate B, where the lower end of the component E is located above the lower end of the conical portion Pn of the backup pin P. In this calculation mode for extremely small components, the distance between the center Ec of component E and the center Pc of the backup pin P is calculated as the center-to-center distance Lc. The center Ec of component E corresponds to the geometric centroid of component E in a plan view, and the center Pc of the backup pin P corresponds to the geometric centroid of the backup pin P in a plan view. Furthermore, a dimensional evaluation value S is calculated according to the dimensions of component E and backup pin P, respectively. This dimensional evaluation value S is given by the sum of half the length of the diagonal of component E, which has a rectangle in a plan view, Re, and the radius Rn of the conical portion Pn of the backup pin P (Figure 9A). Here, the radius Rn of the conical portion Pn is the radius of the conical portion Pn in a predetermined horizontal cross section Cn set between the lower end of component E and the lower end of the conical portion Pn. Then, the distance evaluation value V is calculated by subtracting the dimensional evaluation value S (= Re + Rn) from the distance Lc between centers. In other words, a circular prohibited area Da with a radius of length Re is set with center Ec of part E as the center. If the cone portion Pn in the horizontal cross section Cn is outside the prohibited area Da in the plan view, the distance evaluation value V is greater than 0. On the other hand, if at least a part of the cone portion Pn in the horizontal cross section Cn overlaps with the prohibited area Da in the plan view, the distance evaluation value V is less than or equal to 0.

[0062] The calculation mode for tall components shown in Figure 8B is applied, for example, to component E (Figure 9B) where the lower end of component E mounted on the lower surface Bl of the substrate B is located below the lower end of the conical portion Pn of the backup pin P, or to component E with large dimensional tolerances. In this calculation mode for tall components, the distance between the center Ec of component E and the center Pc of the backup pin P is calculated as the center-to-center distance Lc. Furthermore, a dimensional evaluation value S is calculated according to the dimensions of component E and backup pin P respectively. This dimensional evaluation value S is given by the sum of half the length of the diagonal of component E, which has a rectangle in plan view, the radius Rd of the cylindrical portion Pd of the backup pin P (Figure 9B), and a constant Rc greater than 0. Then, the distance evaluation value V is calculated by subtracting the dimensional evaluation value S (= Re + Rd + Rc) from the center-to-center distance Lc. In other words, a circular restricted area Db is set with the center Ec of component E as the center and a radius equal to the sum of the length Re and the constant Rc. Furthermore, if the cylindrical portion Pd is outside the prohibited area Da in a plan view, the distance evaluation value V is greater than 0. On the other hand, if at least a part of the cylindrical portion Pd overlaps with the prohibited area Da in a plan view, the distance evaluation value V is less than or equal to 0.

[0063] In the high-precision calculation mode shown in Figure 8C, a restricted area Dc is set along the outline of part E in a plan view. That is, for part E having a rectangular outline, a rectangular restricted area Dc is set. The outline of this restricted area Dc is set to include the entire outline of part E while maintaining a certain distance from the outline of part E, and has a rectangle composed of two sides Dcx at both ends in the X direction and two sides Dcy at both ends in the Y direction. In other words, in the X direction, part E is located between the two ends Dcx of the restricted area Dc, and a gap Cx is provided between each side Dcx and part E. Also, in the Y direction, part E is located between the two ends Dcy of the restricted area Dc, and a gap Cy is provided between each side Dcy and part E.

[0064] Furthermore, in the X direction, a primary adjacent range Fx is set on each side of the forbidden region Dc, and in the Y direction, a primary adjacent range Fy is set on each side of the forbidden region Dc. The primary adjacent range Fx is adjacent to edge Dcx from the X direction, and in the Y direction, both ends of the primary adjacent range Fx coincide with both ends of edge Dcx. The ends of this primary adjacent range Fx in the Y direction are straight lines parallel to the direction perpendicular to edge Dcx (the X direction). The primary adjacent range Fy is adjacent to edge Dcy from the Y direction, and in the X direction, both ends of the primary adjacent range Fy coincide with both ends of edge Dcy. The ends of this primary adjacent range Fy in the X direction are straight lines parallel to the direction perpendicular to edge Dcy (the Y direction). In addition, a secondary adjacent range Fxy is set in the area around the forbidden region Dc that is outside of both the primary adjacent range Fx and the primary adjacent range Fy. In other words, the secondary adjacent range Fxy is set for each of the four corners of the forbidden area Dc.

[0065] If the backup pin P does not overlap with the forbidden area Dc and the center Pc of the backup pin P is located within the primary adjacent area Fx, the distance Lx in the X direction between the backup pin P and the forbidden area Dc (i.e., the distance between the backup pin P and the forbidden area Dc in the X direction) is calculated as the distance evaluation value V. If the backup pin P does not overlap with the forbidden area Dc and the center Pc of the backup pin P is located within the primary adjacent area Fy, the distance Ly in the Y direction between the backup pin P and the forbidden area Dc (i.e., the distance between the backup pin P and the forbidden area Dc in the Y direction) is calculated as the distance evaluation value V. Furthermore, if the backup pin P does not overlap with the forbidden area Dc and the center Pc of the backup pin P is located within the secondary adjacent area Fxy, the distance Lxy between the backup pin P and the vertex of the forbidden area Dc that is closest to the backup pin P (i.e., the distance between the backup pin P and the forbidden area Dc) is calculated as the distance evaluation value V. Thus, if the backup pin P is outside the restricted area Dc and does not overlap with it, the distance between the backup pin P and the restricted area Dc is calculated as the distance evaluation value V. On the other hand, if the backup pin P and the restricted area Dc overlap at least partially, the distance evaluation value V is calculated as 0.

[0066] The calculation mode information 825 (Figure 4) indicates the mode for calculating the distance evaluation value V between component E and backup pin P for each component E. In step S204, the information calculation unit 813 confirms the calculation mode indicated by the calculation mode information 825 for component E (Ne).

[0067] Then, the pin position acquisition unit 811 resets the pin count value Np (Np = 0, 1, 2, ..., 11, 12) for identifying the backup pin P (Np) to 0 (step S205), and increments the count value Np by 1 (step S206).

[0068] In step S207, the pin position acquisition unit 811 acquires the position of the Np-th backup pin P(Np). Specifically, the pin position acquisition unit 811 acquires the position (XY coordinates) of the backup pin P(Np) indicated by the pin position information 822. However, the position indicated by the pin position information 822 is the position relative to the push-up plate 421. In contrast, the Y coordinate of the push-up plate 421 depends on the Y coordinate at which the eccentric cam 452 positions the push-up plate 421. Therefore, the pin position acquisition unit 811 acquires the Y coordinate at which the eccentric cam 452 positions the push-up plate 421 based on the encoder output of the cam motor 454. Then, the pin position acquisition unit 811 calculates the position of the backup pin P(Np) based on the position indicated by the pin position information 822 and the position (Y coordinate) indicated by the encoder output of the cam motor 454.

[0069] In step S208, the information calculation unit 813 calculates a distance evaluation value V using the calculation mode confirmed in step S204, based on the position of component E(Ne) acquired in step S203 and the position of backup pin P(Np) acquired in step S207. This calculates a distance evaluation value V corresponding to the distance between component E(Ne) and backup pin P(Np). Note that calculating the distance evaluation value V for backup pin P is equivalent to calculating the distance evaluation value V for the pin holder H that holds the backup pin P.

[0070] In step S209, the information calculation unit 813 checks whether the count value Np has reached the maximum value Npx. The maximum value Npx corresponds to the total number of pin holders H on the push-up plate 421, which is 12 in the example shown in Figure 5. If the count value Np is less than the maximum value Npx (if "NO" is returned in step S209), the process returns to step S206. Steps S206 to S208 are repeated in this manner until the count value Np reaches the maximum value Npx (until "YES" is returned in step S209). As a result, a distance evaluation value V corresponding to the distance between component E (Ne) and backup pin P (Np) is calculated for each of the backup pins P (Np).

[0071] In step S210, the information calculation unit 813 checks whether the component count value Ne has reached the maximum value Nex. The maximum value Nex corresponds to the total number of components E mounted on the lower surface Bl of the substrate B, which is 3 in the example shown in Figure 5. If the component count value Ne is less than the maximum value Nex (if "NO" is returned in step S210), the process returns to step S202. Steps S202 to S209 are repeated in this manner until the component count value Ne reaches the maximum value Nex (until "YES" is returned in step S210). As a result, a distance evaluation value V corresponding to the distance between each component E (Ne) and each backup pin P (Np) is calculated for each of the backup pins P (Np) and each of the components E (Ne).

[0072] In other words, in steps S201 to S210, a combination (E(Ne), P(Np)) consisting of a component E(Ne) and a backup pin P(Np) is set, and a distance evaluation value V is calculated according to the distance between the component E(Ne) and the backup pin P(Np) related to that combination. As shown in Figure 10, this distance evaluation value V is calculated for each of all combinations in which at least one of the component E(Ne) and the backup pin P(Np) is different from each other. Here, Figure 10 is a diagram showing the distance evaluation values ​​calculated for all combinations of components and backup pins in table format. Figure 10 shows, for example, that a distance evaluation value V11 has been calculated for the combination of component E(1) and backup pin P(1).

[0073] In step S211, the information calculation unit 813 confirms the position of the temporary backup pins P whose temporary placement on the push-up plate 421 has been determined, based on the temporary pin placement information 824, from among the multiple backup pins P for which a distance evaluation value V has been calculated in steps S201 to S210. The position of the temporary backup pins P corresponds to the position of the pin holder H indicated by the temporary pin placement information 824 when the placement of the backup pins P has been temporarily determined. In step S212, the information calculation unit 813 calculates the minimum value among the distance evaluation values ​​V calculated for each of the temporary backup pins P as the margin evaluation value Vm. Then, the calculation of the margin evaluation value in Figure 7 is completed, and the process returns to step S102 of the pin placement support in Figure 6.

[0074] In step S102, the information calculation unit 813 checks whether the margin evaluation value Vm is greater than the evaluation threshold Vt. Here, the evaluation threshold Vt is, for example, 0. However, the evaluation threshold Vt can be set to any value greater than or equal to 0. If the margin evaluation value Vm is greater than the evaluation threshold Vt (if "YES" is answered in step S102), the pin placement support shown in Figure 6 is terminated. In this way, it can be confirmed that interference between the backup pin P and component E, as indicated by the pin temporary placement information 824, has been avoided once the temporary placement has been determined.

[0075] If the margin evaluation value Vm is less than or equal to the evaluation threshold Vt (if the answer is "NO" in step S102), the information calculation unit 813 performs a simulation to calculate the change in the margin evaluation value Vm by changing the relative position of the push-up plate 421 with respect to the work position A (steps S103 to S105).

[0076] Figure 11 is a schematic plan view illustrating the simulation process for calculating the change in margin evaluation value in response to changes in the relative position of the push-up plate with respect to the working position. In Figure 11, the (+X) and (-X) sides in the X direction are shown, and the (+Y) and (-Y) sides in the Y direction are shown. Here, the (+X) side and the (-X) side face opposite directions, and the (+X) side and the (-X) side face opposite directions. Figure 12 is a table showing the results calculated by the simulation in Figure 11.

[0077] As shown in Figure 11, in the simulation, a unit interval dx (= Tx / 4) obtained by dividing the array pitch Tx and a unit interval dy (= Ty / 4) obtained by dividing the array pitch Ty are set. Then, the position of Kx stage (X position) is set by shifting by a unit interval dx within a variable X range from a predetermined distance (= Tx - dx) on the (-X) side to a predetermined distance (= Tx - dx) on the (+X) side (Kx = 7). Similarly, the position of Ky stage (X position) is set by shifting by a unit interval dy within a variable Y range from a predetermined distance (= Ty - dy) on the (-Y) side to a predetermined distance (= Ty - dy) on the (+Y) side (Ky = 7). As a result, XY positions of Kx × Ky stages, which are different from each other, are set.

[0078] In step S103, the position of the push-up plate 421 relative to the work position A is changed to one of the XY positions in the Kx × Ky stage. Then, the information calculation unit 813 calculates the margin evaluation value Vm by performing the margin evaluation value calculation shown in Figure 7, under the condition that the push-up plate 421 is located at the said XY position relative to the work position A (step S104). In step S105, the information calculation unit 813 checks whether the calculation of the margin evaluation value Vm has been completed for all XY positions in the Kx × Ky stage. If the calculation of the margin evaluation value Vm has not been completed (if "NO" is returned in step S105), the process returns to step S103. Steps S103 to S105 are repeated in this manner until the calculation of the margin evaluation value Vm has been completed for all XY positions in the Kx × Ky stage (until "YES" is returned in step S105).

[0079] As a result, as shown in Figure 12, a margin evaluation value Vm is calculated for each position when the position of the push-up plate 421 relative to the work position A is displaced in the X direction by a unit interval dx within a predetermined range (-3 / 4 × Tx to +3 / 4 × Tx) and in the Y direction by a unit interval dy within a predetermined range (-3 / 4 × Ty to +3 / 4 × Ty). In other words, a margin evaluation value Vm is calculated for each position when the position of the push-up plate 421 relative to the work position A is changed in Kx × Ky steps. Note that in Figure 12, the position where the position in the X direction is 0 and the position in the Y direction is 0 (XY coordinates) corresponds to the work position A.

[0080] In step S106, the information calculation unit 813 calculates the maximum value of the Kx × Ky margin evaluation values ​​Vm calculated in this way as the maximum margin evaluation value Vmx. In step S107, the information calculation unit 813 determines whether the maximum margin evaluation value Vmx is greater than the evaluation threshold Vt.

[0081] If the maximum margin evaluation value Vmx is greater than the evaluation threshold Vt (if the answer is "YES" in step S107), the information calculation unit 813 acquires the XY position where the maximum margin evaluation value Vmx was calculated as the margin evaluation value Vm as the optimal position (step S108). In other words, the XY position corresponding to the maximum value among the multiple margin evaluation values ​​Vm shown in Figure 12 is acquired as the optimal position.

[0082] In step S109, the position adjustment unit 814 commands the motor control unit 46 to adjust to the optimal position. The motor control unit 46 controls the conveyor motor 411 and the cam motor 454 in accordance with the command to adjust the relative position of the push-up plate 421 with respect to the work position A to the optimal position.

[0083] In step S110, the information calculation unit 813 and the UI control unit 815 perform a suggestion to the user regarding additional backup pins P. Specifically, the information calculation unit 813 extracts empty pin holders H from among the multiple pin holders H, where the temporary pin placement information 824 does not indicate the temporary placement of backup pins P. The information calculation unit 813 also refers to the distance evaluation value V calculated for each of the multiple backup pins P, under the condition that the push-up plate 421 is in the optimal position relative to the work position A. The information calculation unit 813 then calculates the pin holders H where backup pins P for which a distance evaluation value V of less than or equal to the evaluation threshold Vt was calculated are placed as candidate pin holders H. In other words, candidate pin holders H are pin holders H where backup pins P for which the minimum value of the distance evaluation value V calculated between each component E is greater than the evaluation threshold Vt are placed. The information calculation unit 813 then extracts the empty pin holders H from among the candidate pin holders H as target pin holders H. Once the target pin holder H is extracted, the UI control unit 815 displays a screen on the UI 84's display indicating that it is possible to add backup pins P to the target pin holder H. Then, the pin placement assistance shown in Figure 6 is completed.

[0084] Figure 13 schematically shows an example of a screen that suggests additional backup pins. This pin addition suggestion screen 88 is displayed on the UI control unit 815's display in step S110. The pin addition suggestion screen 88 includes a text message 881 indicating that in step S109, the position of the push-up plate 421 relative to the working position A was adjusted to the optimal position, resulting in the creation of backup pins P that can be newly placed on the push-up plate 421.

[0085] Furthermore, the pin addition suggestion screen 88 includes a pin arrangement display unit 882 that shows the arrangement of backup pins P on the push-up plate 421, and a pin status display unit 883 that shows the status of the backup pins P displayed on the pin arrangement display unit 882 (safe, addable, or interfering). The information calculation unit 813 calculates the minimum value of the distance evaluation value V calculated for the backup pins P (minimum distance evaluation value V) and displays the result on the pin status display unit 883 as appropriate. Backup pins P(1) to P(5), P(7) to P(10), and P(12), which are displayed as white circles, are safe backup pins P (i.e., backup pins P that do not interfere with component E) for which a value of 1 or greater is calculated as the minimum distance evaluation value V. Backup pin P(11), which is displayed as a circle with dot hatching, is a backup pin P for which a value of 0 or less is calculated as the minimum distance evaluation value V, and indicates that placing this backup pin P(11) will cause interference with component E. Backup pins P(6) indicated by circles with diagonal hatching represent backup pins P that were determined to be additional in step S110.

[0086] In step S107, if the maximum margin evaluation value Vmx is less than or equal to the evaluation threshold Vt and the result is determined to be "NO", the UI control unit 815 displays a screen on the UI 84 display prompting a change in the temporary placement position of the backup pin P (step S111).

[0087] Figure 14 schematically shows an example of a screen prompting a change in the temporary placement position of the backup pin. This temporary placement change warning screen 89 is displayed on the UI control unit 815's display in step S111. The temporary placement change warning screen 89 includes a text message 891 indicating that the placement position of the backup pin P should be changed or deleted due to interference with component E.

[0088] Furthermore, the temporary placement change warning screen 89 includes a pin placement display unit 892 that shows the placement of backup pins P on the push-up plate 421, and a pin status display unit 893 that shows the status of backup pins P (safe, can be added, or interferes) displayed on the pin placement display unit 892. The information calculation unit 813 calculates the minimum value of the distance evaluation value V calculated for the backup pins P (minimum distance evaluation value V) and displays the result on the pin status display unit 893 as appropriate. Backup pins P(2) to P(10) and P(12) displayed as white circles indicate safe backup pins P (i.e., backup pins P that do not interfere with component E) for which a value greater than or equal to a predetermined value (1) is calculated as the minimum distance evaluation value V. Backup pin P(1) displayed as a circle with faint dot hatching indicates a backup pin P for which a value greater than 0 and less than 1 is calculated as the minimum distance evaluation value V, and indicates that there is a risk of interference with component E if this backup pin P(11) is placed. Backup pins P(11) indicated by circles with dark dot hatching represent backup pins P for which a distance evaluation value V is calculated to be 0 or less, indicating that placing these backup pins P(11) will cause interference with component E.

[0089] In the following step S112, the information calculation unit 813 and the UI control unit 815 perform a suggestion to the user regarding additional backup pins P. Specifically, the information calculation unit 813 extracts empty pin holders H from among the multiple pin holders H in which the temporary pin placement information 824 does not indicate the temporary placement of backup pins P. It also refers to the distance evaluation value V calculated for each of the multiple backup pins P in step S101. The information calculation unit 813 then calculates the pin holders H in which backup pins P for which no distance evaluation value V below the evaluation threshold Vt was calculated are placed as candidate pin holders H. In other words, candidate pin holders H are pin holders H in which backup pins P for which the minimum value of the distance evaluation value V calculated between each component E is greater than the evaluation threshold Vt are placed. The information calculation unit 813 then extracts the empty pin holders H from among the candidate pin holders H as target pin holders H. Once the target pin holder H is extracted, the UI control unit 815 displays a screen on the UI 84's display indicating that it is possible to add a backup pin P to the target pin holder H. This screen is the same as the pin addition suggestion screen 88 shown in Figure 13, except for the content of the text message 881.

[0090] In step S113, the UI control unit 815 determines whether the UI 84 has received a user operation to change the temporary position of the backup pin P. If the UI 84 has received the operation (YES in step S113), the information calculation unit 813 updates the pin position information 822 to indicate the temporary position of the backup pin P corresponding to the operation, and returns to step S101.

[0091] In the embodiment described above, the position of the backup pin P held by the backup pin P of the push-up plate 421 (backup plate) and the position of the component E mounted on the lower surface Bl of the substrate B are obtained (steps S203, S207). Then, a distance evaluation value V, which indicates the distance between the component E mounted on the lower surface Bl of the substrate B, which stops at the working position A, and the backup pin P held by the pin holder H, is calculated based on the position of the backup pin P and the position of the component E (step S209). Therefore, the possibility of interference between the component E and the backup pin P can be confirmed based on the distance evaluation value V. In this way, it becomes possible to confirm the possibility of interference between the component E and the backup pin P.

[0092] Furthermore, the information calculation unit 813 (calculation unit) calculates a distance evaluation value V for each of several combinations in which at least one of the component E and the pin holder H (in other words, the backup pin P temporarily placed on the pin holder H) is different (steps S201 to S210). The information calculation unit 813 then calculates the minimum value among the distance evaluation values ​​V for each of the several combinations as the margin evaluation value Vm. With this configuration, it becomes possible to check the possibility of interference between the component E and the backup pin P based on the margin evaluation value Vm.

[0093] Furthermore, the information calculation unit 813 performs a simulation to calculate the change in the margin evaluation value Vm in response to a change in the relative position of the push-up plate 421 with respect to the work position A (steps S103 to S105). Then, the information calculation unit 813 determines the relative position of the push-up plate 421 with respect to the work position A based on the results of the simulation (steps S103 to S105) (steps S106 to S108). With this configuration, the relative position of the backup pin P with respect to the work position A can be determined so that the component E and the backup pin P do not interfere with each other.

[0094] Furthermore, in the simulation (steps S103 to S105), the information calculation unit 813 changes the relative position of the push-up plate 421 with respect to the work position A in multiple stages by changing the unit interval dx and unit interval dy (unit interval) within the X variable range and Y variable range (change range). The information calculation unit 813 then calculates a margin evaluation value Vm at each of the multiple stages. With this configuration, the relative position of the push-up plate 421 with respect to the work position A can be determined so that the component E and the backup pin P do not interfere with each other.

[0095] Furthermore, the pin holders H are arranged on the push-up plate 421 with array pitches Tx and Ty. In contrast, the X variable range (change range) has a width in the X direction of less than twice the array pitch Tx, centered on the relative position of the push-up plate 421 with respect to the work position A before the simulation (steps S103 to S105) is performed. Similarly, the Y variable range (change range) has a width in the Y direction of less than twice the array pitch Ty, centered on the relative position of the push-up plate 421 with respect to the work position A before the simulation (steps S103 to S105) is performed. By providing X variable ranges and Y variable ranges with respect to array pitches Tx and Ty in this way, the simulation (steps S103 to S105) can be performed rationally.

[0096] Furthermore, the information calculation unit 813 determines the position where the maximum margin evaluation value Vmx, which is the maximum distance evaluation value V, is calculated as the optimal position (step S109). Then, the information calculation unit 813 decides to position the push-up plate 421 at the optimal position relative to the work position A. In this configuration, the relative position of the backup pin P with respect to the work position A can be determined so that the component E and the backup pin P do not interfere with each other.

[0097] Furthermore, in the simulation (steps S103 to S105), the information calculation unit 813 changes the relative position of the push-up plate 421 with respect to the work position A in at least one of the X direction (transport direction) in which the substrate B is transported and the Y direction (width direction) perpendicular to the X direction. With this configuration, the relative position of the push-up plate 421 with respect to the work position A can be determined so that the component E and the backup pin P do not interfere with each other.

[0098] Furthermore, a UI 84 (notification unit) is provided to notify the user. If the maximum value of the margin evaluation value Vm calculated in the simulation (steps S103 to S105) (maximum margin evaluation value Vmx) is less than or equal to the evaluation threshold Vt (if "NO" is displayed in step S107), the information calculation unit 813 causes the UI 84 to display (notify) a temporary placement change warning screen 89 that prohibits the placement of the backup pin P to the pin holder H for which a distance evaluation value V less than or equal to the evaluation threshold Vt has been calculated (step S112, Figure 14). With this configuration, interference between component E and backup pin P can be accurately prevented.

[0099] Furthermore, the information calculation unit 813 causes the UI 84 to display (notify) a pin addition suggestion screen 88 that suggests the placement of backup pins P to pin holders H for which a distance evaluation value V below the evaluation threshold Vt was not calculated (step S110, Figure 13). With this configuration, interference between component E and backup pins P can be accurately prevented, while the substrate B can be firmly supported with sufficient backup pins P.

[0100] Furthermore, the information calculation unit 813 calculates the distance evaluation value V using one of several calculation methods (Figures 8A to 8C) that calculate the distance evaluation value V in different ways, selected according to the type of component E (steps S204, S208). With this configuration, the distance evaluation value V can be calculated using an appropriate calculation method according to the type of component E, making it possible to accurately confirm the possibility of interference between component E and backup pin P based on the distance evaluation value V.

[0101] Furthermore, the calculation mode for extremely small parts or the calculation mode for tall parts (first calculation method) calculates a distance evaluation value V by subtracting a dimensional evaluation value S corresponding to the dimensions of the backup pin P and part E from the center-to-center distance Lc between the center Pc of the backup pin P and the center Ec of part E (Figures 8A and 8B). With this calculation method, the distance evaluation value can be calculated by a relatively simple calculation.

[0102] Furthermore, the dimensional evaluation value S is the sum of half the length of the diagonal of a rectangular component E in plan view (Re) and the radius (radii Rn, Rd) of a circular backup pin P in plan view (Rd), or the sum plus a constant Rc. According to this calculation method, the distance evaluation value V can be calculated by a relatively simple calculation.

[0103] Furthermore, the high-precision calculation mode (second calculation method) calculates the distance between the backup pin P and the prohibited area Dc (placement prohibited area), which is provided in a wider area than component E so as to include component E in a plan view, as the distance evaluation value V (Figure 8C). According to this calculation method, a more accurate distance evaluation value V can be calculated from the viewpoint of interference prevention.

[0104] Furthermore, the system includes a UI 84 (proposal unit) that suggests the placement of backup pins P on pin holders H for which the information calculation unit 813 did not calculate a distance evaluation value V below the evaluation threshold Vt. With this configuration, interference between component E and backup pins P can be accurately prevented, while the substrate B can be firmly supported with sufficient backup pins P.

[0105] Furthermore, the soldering machine 1 is equipped with a conveyor 41 and a Y-position adjustment mechanism 45 that change the relative position of the push-up plate 421 with respect to the work position A. With this configuration, interference between the component E and the backup pin P can be effectively prevented.

[0106] In the above embodiment, the working position A corresponds to an example of the "working position" of the present invention, the substrate B corresponds to an example of the "substrate" of the present invention, the bottom surface Bl corresponds to an example of the "bottom surface" of the present invention, the backup pin P corresponds to an example of the "backup pin" of the present invention, the pin holder H corresponds to an example of the "pin holder" of the present invention, the push-up plate 421 corresponds to an example of the "backup plate" of the present invention, the pin position acquisition unit 811 corresponds to an example of the "pin position acquisition unit" of the present invention, the component E corresponds to an example of the "component" of the present invention, the component position acquisition unit 812 corresponds to an example of the "component position acquisition unit" of the present invention, the distance evaluation value V corresponds to an example of the "distance evaluation value" of the present invention, the information calculation unit 813 corresponds to an example of the "calculation unit" of the present invention, the pin placement support device 8 corresponds to an example of the "backup pin placement support device" of the present invention, and the margin evaluation value Vm corresponds to the "margin" of the present invention. The following is a description of the present invention: the "evaluation value" corresponds to an example of the present invention; the array pitch Tx and array pitch Ty correspond to an example of the "array pitch" of the present invention; the X direction corresponds to an example of the "transport direction" of the present invention; the Y direction corresponds to an example of the "width direction" of the present invention; UI 84 corresponds to an example of the "notification unit" of the present invention; the prohibited area Dc corresponds to an example of the "placement prohibited area" of the present invention; UI 84 corresponds to an example of the "proposal unit" of the present invention; the conveyor 41 corresponds to an example of the "substrate transport unit" of the present invention; the squeegee unit 6 corresponds to an example of the "solder application unit" of the present invention; the solder printing machine 1 corresponds to an example of the "solder printing machine" of the present invention; the conveyor 41 and Y position adjustment mechanism 45 correspond to an example of the "position adjustment unit" of the present invention; the pin placement support program 821 corresponds to an example of the "backup pin placement support program" of the present invention; and the storage unit 82 or the above-mentioned server computer corresponds to an example of the "recording medium" of the present invention.

[0107] It should be noted that the present invention is not limited to the embodiments described above, and various modifications can be made to those described above without departing from the spirit of the invention. For example, various specific targets for calculating the distance evaluation value V can be envisioned. In the above example, the information calculation unit 813 calculates the distance evaluation value V for each of the pin holders H provided on the push-up plate 421 and the component E. However, the information calculation unit 813 may calculate the distance evaluation value V for some of the pin holders H that have a predetermined positional relationship with the component E and the component E (Figure 15).

[0108] Figure 15 is a schematic plan view showing a modified example of a combination of components and backup pins for which distance evaluation values ​​are to be calculated. In this modified example, the information calculation unit 813 sets target ranges G(1), G(2), and G(3) for each of the components E(1), E(2), and E(3). Target range G(1) is set to include component E(1) with E(1) as the center, target range G(2) is set to include component E(2) with E(2) as the center, and target range G(3) is set to include component E(3) with E(3) as the center. The distance evaluation value V for evaluating the distance between component E(1) and each of the backup pins P(1), P(2), P(5), and P(6) located within the target range G(1) centered on component E(1) is calculated for component E(1). The distance evaluation value V is calculated similarly for components E(2) and E(3).

[0109] Alternatively, in another modification, the information calculation unit 813 (pin placement information acquisition unit) acquires temporary pin placement information 824 (pin placement information) indicating the pin holder H (placement target holder) where the backup pin P will be placed, out of all the pin holders H of the push-up plate 421. The information calculation unit 813 then calculates a distance evaluation value V between the backup pin P and the component E, which the temporary placement information 824 indicates. In other words, the distance evaluation value V is not calculated for pin holder H where the temporary placement of the backup pin P is not indicated.

[0110] Furthermore, in another modified configuration, the UI control unit 815 displays an image on the UI 84's display showing the pin holder H of the push-up plate 421 or the backup pins P held by the pin holder H. When the UI control unit 815 confirms that the UI 84 has performed an operation to select some of the backup pins P displayed on the display, the information calculation unit 813 calculates a distance evaluation value V for the selected backup pins P and the component E.

[0111] Furthermore, the unit interval dx and unit interval dy may be modified to be configurable by the user. In this modified example, the UI control unit 815 (unit interval reception unit) displays a screen on the UI 84's display that accepts the setting operation of the unit interval dx and unit interval dy. The UI control unit 815 also accepts the setting of the unit interval dx and unit interval dy in response to the operation on the input device of the UI 84. Then, in the simulation (steps S103 to S105), the information calculation unit 813 changes the relative position of the push-up plate 421 with respect to the work position A using the unit interval dx and unit interval dy accepted by the UI control unit 815. In this configuration, if the simulation (steps S103 to S105) takes a long time, the user can shorten the time required for the simulation (steps S103 to S105) by widening the unit interval dx and unit interval dy.

[0112] Furthermore, the system may be modified to confirm with the user whether or not to adjust to the optimal position before step S109, which adjusts the relative position of the push-up plate 421 to the optimal position relative to the work position A. In this modified example, the UI control unit 815 (inquiry execution unit) displays a screen on the UI 84 display asking whether or not to decide to position the push-up plate 421 to the optimal position relative to the work position A. When the UI control unit 815 receives input from the user indicating that they reject this decision, it discards the decision. Therefore, step S109 is not executed. With this configuration, it is possible to prevent the adjustment to the optimal position from being performed against the user's intention.

[0113] Furthermore, the information calculation unit 813 may cause the UI 84 to notify the minimum value of the distance evaluation value V calculated for the pin holder H that proposes the placement of the backup pin P. Specifically, the minimum value of the distance evaluation value V may be displayed in the pin status display unit 883 of the pin addition proposal screen 88 below the notation "Additional possible". In this configuration, the user can confirm the possibility of interference between the backup pin P placed in the proposed pin holder H and the component E based on the distance evaluation value V.

[0114] Furthermore, the specific value calculated as the distance evaluation value V is not limited to the example above. For example, in the above example, the distance evaluation value V is calculated as a distance, but it may be modified so that the distance evaluation value V is calculated as a ratio. According to this modification, in the calculation mode shown in Figures 8A and 8B, the value obtained by dividing the center-to-center distance Lc by the dimension evaluation value S (Lc / S) is calculated as the distance evaluation value V.

[0115] On the other hand, in the calculation mode shown in Figure 8C, if the backup pin P does not overlap with the forbidden area Dc and the center Pc of the backup pin P is located within the primary adjacent range Fx, the distance Lx in the X direction between the backup pin P and the forbidden area Dc is divided by the interval Cx (= Lx / Cx) and this value is calculated as the distance evaluation value V. If the backup pin P does not overlap with the forbidden area Dc and the center Pc of the backup pin P is located within the primary adjacent range Fy, the distance Ly in the Y direction between the backup pin P and the forbidden area Dc is divided by the interval Cy (= Ly / Cy) and this value is calculated as the distance evaluation value V. Furthermore, if the backup pin P does not overlap with the forbidden area Dc and the center Pc of the backup pin P is located within the secondary adjacent range Fxy, the distance Lxy between the backup pin P and the vertex of the forbidden area Dc closest to the backup pin P is divided by the root mean square of the intervals Cx and Cy (= Lxy / (Cx ２ +Cy ２ ) １／２ The distance evaluation value V is calculated as follows. Furthermore, if the backup pin P and the forbidden area Dc overlap at least partially, the distance evaluation value V is calculated as 0.

[0116] Furthermore, the specific method for calculating the margin evaluation value Vm can be changed as appropriate, and the margin evaluation value Vm can be calculated without referring to the pin temporary placement information 824. In this modified example, in step S212, the information calculation unit 813 obtains the minimum value among the distance evaluation values ​​V calculated for all of the pin holders H provided on the push-up plate 421 as the margin evaluation value Vm, without referring to the pin temporary placement information 824.

[0117] Furthermore, various modifications can be made to the specific mechanism for adjusting the position of the push-up plate 421 relative to the work position A. Figure 16 is a schematic plan view showing a modified example of the Y-position adjustment mechanism. The Y-position adjustment mechanism 47 shown in Figure 16 is a ball screw. That is, the Y-position adjustment mechanism 47 has a screw 471 arranged parallel to the Y direction and a nut 472 that screws onto the screw 471. The pair of conveyors 41 are fixed to the nut 472 and move in the Y direction along with the nut 472. Therefore, the motor control unit 46 can move the pair of conveyors 41 in the Y direction by rotating the nut 472 with a motor that drives the nut 472. As a result, the position of the push-up plate 421 relative to the work position A is adjusted in the Y direction.

[0118] Furthermore, the pin placement support device 8 is not limited to the soldering machine 1, but can also be used to support the placement of backup pins P. This component mounting machine mounts components E onto a circuit board B that has been brought into the work position A. In this case, backup pins P may be placed on a push-up plate 421 as described above in order to support the circuit board B from below. Therefore, the pin placement support device 8 can be used to support the placement of these backup pins P.

[0119] 1...Solder printing machine 41...Conveyor 421...Push-up plate 45...Y position adjustment mechanism 6...Squeegee unit 8...Pin placement support device 811...Pin position acquisition unit 812...Component position acquisition unit 813...Information calculation unit 82...Storage unit 821...Pin placement support program 84...UI A...Work position B...Circuit board Bl...Bottom surface Dc...Forbidden area E...Component H...Pin holder P...Backup pin Tx...Array pitch Ty...Array pitch V...Distance evaluation value Vm...Margin evaluation value

Claims

1. A backup pin placement support device comprising: a pin position acquisition unit that acquires the position of backup pins held in the pin holders of a backup plate having a plurality of pin holders capable of holding backup pins that support the substrate by contacting the lower surface of the substrate from below when the substrate is stopped at a working position; a component position acquisition unit that acquires the position of a component mounted on the lower surface of the substrate; and a calculation unit that calculates a distance evaluation value indicating the distance between the component mounted on the lower surface of the substrate when the substrate is stopped at the working position and the backup pins held in the pin holders, based on the position of the backup pins and the position of the component.

2. The backup pin placement support device according to claim 1, wherein the calculation unit calculates the distance evaluation value for each of a plurality of combinations in which at least one of the component and the pin holder is different, and calculates the minimum value among the distance evaluation values ​​for each of the plurality of combinations as the margin evaluation value.

3. The backup pin placement support device according to claim 2, wherein the calculation unit performs a simulation to calculate the change in the margin evaluation value in response to a change in the relative position of the backup plate with respect to the work position, and determines the relative position of the backup plate with respect to the work position based on the results of the simulation.

4. The backup pin placement support device according to claim 3, wherein the calculation unit changes the relative position of the backup plate with respect to the work position in a predetermined range of change by predetermined unit intervals in the simulation, and calculates the margin evaluation value in each of the plurality of stages.

5. The backup pin placement support device according to claim 4, further comprising a unit interval receiving unit that receives the unit interval input by user operation, wherein the calculation unit changes the relative position of the backup plate with respect to the work position by the unit interval received by the unit interval receiving unit in the simulation.

6. The backup pin placement support device according to claim 4 or 5, wherein the pin holders are arranged on the backup plate at a predetermined array pitch, and the range of variation has a width of less than twice the array pitch, centered on the relative position of the backup plate with respect to the working position before the execution of the simulation.

7. The backup pin placement support device according to any one of claims 3 to 6, wherein the calculation unit determines the position where the maximum margin evaluation value is calculated as the optimal position and decides to position the backup plate at the optimal position relative to the work position.

8. The backup pin placement support device according to claim 7, further comprising an inquiry execution unit that makes inquiries to the user, wherein the calculation unit causes the inquiry execution unit to make an inquiry regarding whether or not it is possible to determine that the backup plate should be positioned at the optimal position relative to the work position, and when the inquiry execution unit receives input from the user indicating that the determination is to be rejected, the determination is discarded.

9. The backup pin placement support device according to any one of claims 3 to 8, wherein the calculation unit changes the relative position of the backup plate with respect to the work position in at least one of the transport direction in which the substrate is transported and the width direction perpendicular to the transport direction in the simulation.

10. A backup pin placement support device according to any one of claims 3 to 9, further comprising a notification unit that notifies the user, wherein the calculation unit causes the notification unit to notify the user that the placement of the backup pins to the pin holder for which the distance evaluation value calculated in the simulation is below a predetermined threshold if the maximum value of the margin evaluation value calculated in the simulation is below a predetermined threshold.

11. The backup pin placement support device according to claim 10, wherein the calculation unit causes the notification unit to perform notification of the placement of the backup pins to the pin holder for which the calculated distance evaluation value was not below the threshold.

12. The backup pin placement support device according to claim 11, wherein the calculation unit causes the notification unit to notify the minimum value of the distance evaluation value calculated for the pin holder that proposes the arrangement of the backup pins.

13. The backup pin placement support device according to any one of claims 1 to 12, wherein the calculation unit calculates the distance evaluation value for each of the plurality of pin holders and the component.

14. The backup pin placement support device according to any one of claims 1 to 12, wherein the calculation unit calculates the distance evaluation value for some of the pin holders among the plurality of pin holders that have a predetermined positional relationship with the component and the component.

15. The backup pin placement support device according to any one of claims 1 to 12, further comprising a pin placement information acquisition unit that acquires pin placement information indicating a target holder for which the backup pins are placed among the plurality of pin holders, wherein the calculation unit calculates the distance evaluation value between the target holder and the component.

16. The backup pin placement support device according to any one of claims 1 to 15, wherein the calculation unit calculates the distance evaluation value by a calculation method selected from a first calculation method and a second calculation method, which calculate the distance evaluation value in different ways, according to the type of component.

17. The backup pin placement support device according to claim 16, wherein the first calculation method calculates the distance evaluation value by subtracting a dimensional value corresponding to the dimensions of the backup pin and the component from the distance between the center of the backup pin and the center of the component.

18. The backup pin placement support device according to claim 17, wherein the dimensional correspondence value is the sum of half the length of the diagonal of the component having a rectangle in plan view and the radius of the backup pin having a circle in plan view, or the sum plus a constant.

19. The backup pin placement support device according to claim 16, wherein the second calculation method calculates the distance between the backup pin and a placement prohibition area provided in a wider area than the component so as to include the component in a plan view, as the distance evaluation value.

20. The backup pin placement support device according to any one of claims 1 to 19, further comprising a suggestion unit that suggests the placement of the backup pins to the pin holder for which the calculation unit did not calculate a distance evaluation value below a predetermined threshold.

21. A soldering machine comprising: a substrate transport unit for stopping a substrate at a work position; a backup plate having a plurality of pin holders capable of holding backup pins that support the substrate by contacting the lower surface of the substrate stopped at the work position from below; a soldering unit for applying solder to the substrate stopped at the work position; and a backup pin placement support device according to any one of claims 1 to 20.

22. The soldering printer according to claim 21, further comprising a position adjustment unit for relatively changing the position of the backup plate with respect to the work position.

23. A backup pin placement support method comprising: a step of obtaining the position of the backup pins held in the pin holders of a backup plate having a plurality of pin holders capable of holding backup pins that support the substrate by contacting the lower surface of the substrate from below when the substrate is stopped at a working position; a step of obtaining the position of a component mounted on the lower surface of the substrate; and a step of calculating a distance evaluation value indicating the distance between the component mounted on the lower surface of the substrate when the substrate is stopped at the working position and the backup pins held in the pin holders, based on the position of the backup pins and the position of the component.

24. A backup pin placement support program that causes a computer to execute the backup pin placement support method described in claim 23.

25. A recording medium for recording the backup pin placement support program described in claim 24 in a way that is readable by a computer.

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