Three-dimensional molding device, mounting device, manufacturing system, three-dimensional molding method, and mounting method

Abstract

A three-dimensional molding device according to the present disclosure comprises a molding control part that: uses reference information that includes the reference positional relationship between a conductive reference part of a reference body having a pedestal formed by discharging a structural fluid from a first discharge head to a reference part formation region and the conductive reference part formed by discharging a conductive fluid from a second discharge head to the pedestal, and a position reference part on a mounting member, to correct the position of application by an application unit; and applies a liquid material from an application head to an object in a molding region.

Description

3D Modeling Device, Mounting Device, Manufacturing System, 3D Modeling Method, and Mounting Method

[0001] This specification discloses a 3D modeling device, a mounting device, a manufacturing system, a 3D modeling method, and a mounting method.

[0002] Conventionally, as a 3D modeling device, for example, a photocurable liquid resin material is held in a container, a projector projects a first exposure image from an incident surface into the resin material, and another projector projects a second exposure image consecutive to the first exposure image from the incident surface into the resin material, and a control unit adjusts a boundary region on a projection surface between a first projection image obtained by projecting the first exposure image and a second projection image obtained by projecting the second exposure image (see, for example, Patent Document 1). In this 3D modeling device, it is stated that streaks in the shaping direction can be made difficult to form on the surface of the product shaped object in the boundary region of the projection region of the exposure image.

[0003] Japanese Patent Application Laid-Open No. 2017-165093

[0004] By the way, in the 3D modeling device of Patent Document 1, alignment of the projector is performed using an alignment reference plate, but it is not yet sufficient, and obtaining an accurate shaped object has been required.

[0005] The present disclosure has been made to solve such problems, and the main object is to provide a 3D modeling device, a mounting device, a manufacturing system, a 3D modeling method, and a mounting method capable of obtaining a more accurate shaped object.

[0006] The present disclosure has adopted the following means to achieve the above main object.

[0007] The three-dimensional molding apparatus of the present disclosure comprises: a support portion for supporting a mounting member having a molding region on which the molded object is placed, a reference portion forming region for forming a reference body, and a position reference portion that serves as a position reference for the mounting member; a first discharge unit having a first discharge head for discharging a structural fluid constituting the structure of the molded object onto an object on the molding region; a second discharge unit having a second discharge head for discharging a conductive fluid constituting a conductor onto the object; a coating unit having a coating head for coating a liquid onto the object; and a molding control unit that corrects the coating position by the coating unit using reference information including the reference position relationship between the conductive reference portion of the reference body having a base formed by discharging the structural fluid from the first discharge head into the reference portion forming region and a conductive reference portion formed by discharging the conductive fluid from the second discharge head onto the base, and the position reference portion on the mounting member described above, and coats the liquid onto the object in the molding region from the coating head.

[0008] In this 3D printing apparatus, reference bodies actually fabricated by the first and second ejection heads are used to correct the application position, allowing liquid material to be applied from the application head to the target object with greater accuracy. On the other hand, the position detection results of the conductive reference part formed from conductive fluid may change over time. In this 3D printing apparatus, reference information is used that is further based on the position reference part on the mounting member, so the influence of, for example, the position detection results of the conductive reference part can be prevented, and liquid material can be applied to a more accurate position. Therefore, this 3D printing apparatus can produce more accurate printed objects.

[0009] A schematic diagram showing an example of the manufacturing system 10. A diagram showing an example of the configuration of the manufacturing system 10. A diagram showing an example of the outline of the mounting device 12. A schematic diagram showing an example of the structure of the 3D molding device 11 viewed from the front at an angle. A diagram showing an example of the outline of each ejection unit and the moving unit 26. A diagram showing an example of the outline of the coating unit 40. A diagram showing an example of the outline of the pallet 60. A diagram showing an example of the outline of the inspection unit 70. A flowchart showing an example of a molded object production processing routine. A flowchart showing an example of a home position setting processing routine. A diagram showing an example of the outline of the home position setting processing of the first ejection head 32. A diagram showing an example of the outline of the home position setting processing of the coating head 42. A diagram showing an example of the outline of the molding process. A flowchart showing an example of a reference position acquisition processing routine. A diagram showing an example of acquiring and using a reference position relationship. A flowchart showing an example of a mounting processing routine. A diagram showing an example of the manufacturing system 10B. A flowchart showing an example of another molded object production processing routine.

[0010] This embodiment will be described below with reference to the drawings. Figure 1 is a schematic diagram showing an example of a manufacturing system 10, which is an example of the present disclosure. Figure 2 is a schematic diagram showing an example of the configuration of the manufacturing system 10. Figure 3 is a schematic diagram showing an example of a mounting device 12. Figure 4 is a schematic diagram showing an example of the structure of a three-dimensional molding device 11 viewed from the front at an angle. Figure 5 is a schematic diagram showing an example of a first discharge unit 30, a second discharge unit 35, and a moving unit 26. Figure 6 is a schematic diagram showing an example of a coating unit 40. Figure 7 is a schematic diagram showing an example of a pallet 60. Figure 8 is a schematic diagram showing an example of an inspection unit 70. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figures 1 to 8.

[0011] The manufacturing system 10 comprises a 3D printing device 11, a mounting device 12, and a management device 80. This manufacturing system 10 is configured as a production line in which multiple 3D printing devices 11 divide the work of creating a structure as a first process and forming conductive members on that structure as a second process, after which the mounting device 12 processes the mounting of the parts. The 3D printing device 11 may also form wiring (circuit) patterns as conductive material as a second process, or the mounting device 12 may perform the process of mounting parts P to predetermined positions on the conductive material. In addition to the mounting device 12, the manufacturing system 10 may also include one or more mounting-related devices from among a printing device for printing solder as a viscous fluid onto the printed object, a printing inspection device for inspecting the printing results, a mounting inspection device for inspecting the mounting results, and a transport device for transporting the printed object. In the manufacturing system 10 shown in Figure 1, there is one mounting device 12, but there may also be multiple mounting devices 12.

[0012] The mounting device 12 is a device for mounting parts P onto an object fabricated by the 3D printing device 11. As shown in Figures 2 and 3, the mounting device 12 comprises a control device 13, a transport processing unit 15, a parts supply unit 16, a parts imaging unit 17, a mounting unit 18, an operation panel 19, and a communication unit. The control device is configured as a microprocessor centered around a mounting control unit 14 such as a CPU, and is responsible for controlling the entire device. This control device outputs control signals to the transport processing unit 15, the parts supply unit 16, the parts imaging unit 17, the mounting unit 18, and the operation panel 19, and inputs signals from the transport processing unit 15, the parts supply unit 16, the parts imaging unit 17, the mounting unit 18, and the operation panel 19. The control device 13 includes a storage unit, which is a large-capacity storage medium such as flash memory. The storage unit stores mounting job information, which includes information on the parts P to be mounted, the arrangement order and position on the fabricated object, and the mounting position of the feeder 16a for picking up the parts. The transport processing unit 15 is responsible for loading, transporting, fixing at the mounting position, and unloading the pallet 60 on which the molded object is placed. A transport reference section 15a, which serves as the reference position on the mounting device 12 side, is formed in a structure near the transport processing unit 15. The transport reference section 15a may have the same structure as the conductive reference section 67 described later. The parts supply unit 16 is a unit that supplies parts P to the mounting unit 18. The parts supply unit 16 has a feeder 16a having a reel that holds parts attached to one or more mounting sections. The parts supply unit 16 may also include a tray unit that houses a tray on which parts P are placed. The parts imaging unit 17 is a parts camera that images the area above and images parts P held by the mounting head 18b of the mounting unit 18. The mounting unit 18 is a unit that takes parts P from the parts supply unit 16 and places the parts P on the object 69 placed on the molding area 61 of the pallet 60. The mounting unit 18 comprises a head moving unit 18a, a mounting head 18b, a sampling member 18c, and a mounting imaging unit 18d. The head moving unit 18a includes a slider that moves in the XY direction guided by a guide rail, and a motor that drives the slider. The mounting head 18b is detachably mounted on the slider and moves in the XY direction by the head moving unit 18a after sampling one or more parts. One or more sampling members 18c are detachably mounted on the lower surface of the mounting head 18b.The sampling member 18c may be a suction nozzle that uses negative pressure to collect parts, or a mechanical chuck that mechanically holds parts. The mounting imaging unit 18d is a mark camera that images the pallet 60 side as the mounting member. The mounting imaging unit 18d is located on the slider of the head movement unit 18a or on the mounting head 18b and moves together with the movement of the mounting head 18b. The operation panel 19 is a unit that receives input from the operator and presents information to the operator. This operation panel 19 includes a display unit which is a display and an operation unit which has a touch panel and buttons. The communication unit is an interface that exchanges information with external devices such as the 3D modeling device 11 and the management device 80.

[0013] The 3D printing apparatus 11 is a 3D printing apparatus that extrudes a fluid onto an object to create and manufacture a molded object having a base material, conductive material, etc. The molded object includes, for example, a base material, a conductive material formed on and / or within the base material, and components arranged on and / or within the base material. The object is initially the pallet 60, and once the base material, circuit, conductive material, etc. are formed on the pallet 60, it refers to that formed object. The material to be molded is not particularly limited and can be resin, ceramics, etc. As shown in Figures 2 and 4, the 3D modeling apparatus 11 includes a control device 20, a storage unit 22, a moving unit 26, a flattening unit 29, a first ejection unit 30, a first maintenance unit 33, a first curing unit 34, a second ejection unit 35, a second maintenance unit 38, a second curing unit 39, a coating unit 40, a pressing unit 45, an inspection unit 70, an operation panel 48, and a communication unit 49. The 3D modeling apparatus 11 also includes a first gantry 51, a second gantry 52, a third gantry 53, and a housing 54 as part of its apparatus structure. Here, the 3D modeling apparatus 11 will be mainly described in which the first ejection unit 30 creates, for example, a base material for a modeled object that acts as an insulator, and the second ejection unit 35 performs a process to form conductive material such as a wiring pattern on the created insulator. Furthermore, the first discharge unit 30 and the second discharge unit 35 are collectively referred to simply as "discharge units," the first discharge head 32 and the second discharge head 37 are collectively referred to simply as "discharge heads," the first maintenance unit 33 and the second maintenance unit 38 are collectively referred to simply as "maintenance units," the first curing unit 34 and the second curing unit 39 are collectively referred to simply as "curing units," and the nozzles 32a and 37a are collectively referred to simply as "nozzles."

[0014] The control device 20 is configured as a microprocessor centered around a molding control unit 21 such as a CPU, and controls the entire 3D molding apparatus 11. The control device 20 exchanges information with the storage unit 22 and each unit. The storage unit 22 is a large-capacity storage medium such as flash memory. The storage unit 22 stores molding job information 23 and reference information 25. The molding job information 23 is information that includes, for example, the shape and size of the molded object to be manufactured, and information on conductive materials such as wiring patterns formed on the substrate. The reference information 25 includes information on the position of reference parts that are necessary when discharging fluid from the first discharging unit 30 and the second discharging unit 35, when applying liquid material from the coating unit 40, and when the mounting unit 18 places parts P. The reference information 25 includes the reference position relationship between the conductive reference part 67 formed on the fiducial mark 65 and the position reference part 68 of the pallet 60. The reference information 25 may be stored in the storage unit 22 by the molding control unit 21 when the fiducial mark 65 is formed as a reference body. The 3D molding apparatus 11 performs the molding process based on the information stored in the storage unit 22.

[0015] As shown in Figures 1 to 3, the mobile unit 26 is a stage that moves the pallet 60, which is the object from which the fluid is discharged. This mobile unit 26 comprises a support section 27 and a support movement section 28. The support section 27 supports and fixes the pallet 60 on which the molded object is placed in the molding area 61. The support section 27 supports the pallet 60 brought in from other devices attached to the machine, such as the 3D molding machine 11 or the mounting machine 12. The support section 27 is also provided with a maintenance section (not shown) having a material such as a sponge, and the coating head 42 is cleaned and maintained using this maintenance section. The support movement section 28 is a drive unit that moves the support section 27 along the printing passage in the front-rear direction in the center of the housing 54, and moves the distance between the discharge head and the object by raising and lowering the support section 27. The support movement section 28 may have a linear drive section, which is configured by a linear motor or a ball screw mechanism.

[0016] The pallet 60 is a mounting member having an area for forming a molded object. As shown in Figure 7, the pallet 60 has a molding area 61, a reference area 62, a receiving area 63, and a position reference area 68. A removable film is attached to the upper surface of the pallet 60, and by replacing this film, it is possible to manufacture the next molded object. The molding area 61 is a printing area where a structure is formed by the first ejection unit 30, and a printing area where a predetermined pattern is formed on the structure by the second ejection unit 35. The reference area 62 is an area where a fiducial mark 65 is formed as a reference body that serves as the reference position of the object on the pallet 60. The reference area 62 is provided as multiple areas outside the molding area 61. In this pallet 60, reference area 62 is formed in four locations. The fiducial mark 65 has a base 66 and a conductive reference area 67. The base 66 is formed by discharging structural fluid from the first discharge head 32 into the reference part formation region 62. This base 66 is formed in a stepped manner in each region of the reference part formation region 62 at a height corresponding to the hierarchy of the structure formed by the structural fluid in the build region 61. This base 66 is formed at a predetermined position in the reference part formation region 62 at the same height as the structure when the structure is formed in the build region 61. The conductive reference part 67 is a mark that identifies the coordinates of the fiducial mark 65. The conductive reference part 67 is formed by discharging conductive fluid from the second discharge head 37 into the base 66. The conductive reference part 67 is formed by conductive fluid on the upper surface of each hierarchy of the base 66. This conductive reference part 67 is formed at a predetermined position on the base 66 at the same height as the conductor when a conductor is formed by the conductive fluid on the structure on the build region 61. The shape of the conductive reference part 67 is not particularly limited as long as it is a shape that can identify coordinates, but examples include circles, rectangles, polygons, and star shapes, of which circles are more preferred. The receiving area 63 is an area that receives unwanted fluids and liquids discharged from the first discharge head 32, the second discharge head 37, and the coating head 42. The position reference section 68 is a reference mark that serves as the position reference for the pallet 60.The position reference portion 68 only needs to have a shape that can be clearly detected in the captured image, and may be, for example, a through hole or formed from resin or the like. The shape of the position reference portion 68 may be, for example, the same as that of the conductive reference portion 67. The position reference portion 68 may be formed on the outer periphery of the molding area 61 on the pallet 60. These position reference portions 68 are formed at the four corners on the outer periphery of the pallet 60. After one molding process, the pallet 60 is removed from the support portion 27 and cleaned.

[0017] The first discharge unit 30 is a unit that discharges a structural fluid, which forms the structure of the molded object, onto the build area 61 of the pallet 60. The first discharge unit 30 is movably disposed to the left of the first gantry 51, which is fixed to the front region in the Y-axis direction of the housing 54 of the 3D printing apparatus 11. The first discharge unit 30 comprises a first moving unit 31, a first discharge head 32, and a first fluid processing unit. The first moving unit 31 comprises a slider that moves along the X-axis direction guided by a guide rail, and a motor that drives the slider. The first discharge head 32 is mounted on the slider, and the first discharge head 32 moves along the X-axis direction as the slider moves. The first moving unit 31 moves the first discharge head 32 between a standby position and a discharge position on the pallet 60. The first discharge head 32 is a structural fluid discharge head that discharges the fluid that forms the molded object from a nozzle 32a onto an object such as the pallet 60 to create the molded object. The first discharge head 32 has a nozzle 32a and a discharge drive unit. Multiple nozzles 32a are formed on a nozzle plate. This first nozzle is an opening that discharges the fluid supplied from the first fluid processing unit to the pallet 60. The discharge drive unit discharges the fluid toward the pallet 60, for example, and could be a piezoelectric element. The fluid discharged by the first discharge head 32 can be a liquid such as a liquid curable resin (e.g., UV curable resin, thermosetting resin, two-component mixed curable resin, etc.), a thermoplastic resin, or a slurry obtained by mixing a solvent with a solid substance such as an inorganic substance. The first fluid processing unit is a fluid supply unit that includes a first supply tank containing fluid and a first recovery tank containing recovered fluid.

[0018] The first maintenance unit 33 is a unit that seals and protects the first discharge head 32 and performs discharge maintenance based on the discharge state of the first discharge head 32. The first maintenance unit 33 includes, for example, a first cap that seals the first discharge head 32, a first discharge receiving section that receives the fluid discharged from the first discharge head 32, and a first cleaning section that cleans the first discharge head 32. Discharge maintenance includes, for example, performing a flushing process and performing a process to wipe and clean the nozzle plate of the first discharge head 32.

[0019] The first curing unit 34 is a unit that performs a predetermined process on the fluid discharged from the first discharge head 32 onto the pallet 60 or onto the molded object that has been cured on the pallet 60, and then cures it. The first curing unit 34 may also cure the fluid discharged into the molding area 61 by irradiating it with light of a predetermined wavelength, such as ultraviolet light. Alternatively, the first curing unit 34 may also be a unit that performs drying and firing depending on the material of the fluid. For example, each time a layer of fluid is formed on the molding area 61 by the first discharge head 32, the pallet 60 is moved downwards and the fluid is cured.

[0020] The second discharge unit 35 is a unit that discharges conductive fluid onto a structure to form conductive materials such as wiring inside or on the surface of a molded object. The second discharge unit 35 is movably disposed to the right of the first gantry 51, which is fixed to the front region of the housing 54 in the Y-axis direction. The second discharge unit 35 comprises a second moving unit 36, a second discharge head 37, and a second fluid processing unit. The second moving unit 36 ​​comprises a slider that moves along the X-axis direction guided by a guide rail, and a motor that drives the slider. The second discharge head 37 is mounted on the slider, and the second discharge head 37 moves along the X-axis direction as the slider moves. The second moving unit 36 ​​moves the second discharge head 37 between a standby position and a discharge position on the pallet 60. The second discharge head 37 is a conductive fluid discharge head that discharges fluid onto an object such as the pallet 60 to form conductive materials. The second discharge head 37 has a nozzle 37a and a discharge drive unit, similar to the first discharge head 32. The second discharge head 37 has the same structure and function as the first discharge head 32, so a detailed explanation of it will be omitted. The fluid discharged by the second nozzle may be a liquid, such as a mixture of a solvent and a solid, or a solution of a solvent in which a resin is dissolved. This fluid may be a conductive paste or a metal ink conductive fluid, for example, in which metal particles are dispersed in a resin that hardens upon heating. For example, in a conductive paste, when the resin hardens and shrinks, the metal particles dispersed in the resin come into contact with it. As a result, the conductive paste exhibits conductivity. The resin in the conductive paste may be an organic adhesive, which exhibits adhesive strength upon hardening.

[0021] The second maintenance unit 38 is a unit that seals and protects the second discharge head 37 and performs discharge maintenance based on the discharge state of the second discharge head 37. The second maintenance unit 38 includes, for example, a second cap that seals the second discharge head 37, a second discharge receiving section that receives the fluid discharged from the second discharge head 37, and a second cleaning section that cleans the second discharge head 37. Discharge maintenance includes the flushing and cleaning processes described above.

[0022] The second curing unit 39 is a unit that performs a predetermined process on the fluid discharged from the second discharge head 37 onto the molding area 61 of the pallet 60 or onto the molded object that has been cured on the pallet 60, thereby curing it. The second curing unit 39 may also cure the fluid discharged onto the molding area 61 by irradiating it with light of a predetermined wavelength, such as infrared light. Alternatively, the second curing unit 39 may also be a unit that performs drying and firing depending on the material of the fluid. For example, each time a layer of fluid is formed on the pallet 60 by the second discharge head 37, the pallet 60 is moved downwards and the fluid is cured.

[0023] The flattening unit 29 is a unit that flattens the surface of the fluid discharged onto the pallet 60 and / or the molded object using a flattening member. The flattening member includes, for example, a flattening roller that rotates with relative movement to the molded object, or a flat flattening blade.

[0024] The coating unit 40 is a unit having a coating head 42 for coating an object on a pallet 60 with a liquid substance. As shown in Figures 2 and 6, the coating unit 40 is movably mounted on a second gantry 52 fixed to the central region in the Y-axis direction of the housing 54 of the 3D printing apparatus 11. The coating unit 40 is mounted on a transport passage for loading and unloading the pallet 60 to and from the mounting apparatus 12, and is configured to perform not only coating processing by the dispenser 43, but also loading and unloading processing of the pallet 60, coating amount detection processing, imaging processing, height measurement processing, etc. The coating unit 40 consists of a coating movement unit 41, a coating head 42, and a coating amount detection unit 58. The coating head 42 of the coating unit 40 is equipped with a work unit 50 including a molding imaging unit 55, a height detection unit 56, and an inter-device transport unit 57. The coating movement unit 41 includes a slider that moves along the X-axis direction guided by a guide rail installed on the second gantry 52, and a motor that drives the slider. A coating head 42 is mounted on the slider, and the coating head 42 moves along the X-axis direction as the slider moves. As shown in Figure 1, the coating movement unit 41 moves the coating head 42 between a coating position which is the top of the pallet 60 in the central region along the X-axis of the housing 54, an loading / unloading position on the left side of the housing 54, and a retracted position on the right side of the housing 54. The coating head 42 is equipped with a dispenser 43, such as one for applying conductive paste or one for applying filler. The dispenser 43 has a discharge port for dispensing liquid and is equipped with a syringe for containing the liquid. The syringe is a columnar member containing the liquid, and the liquid is discharged from a discharge port provided at the lower end by pressure applied from above. Examples of liquid materials include resins in which conductive materials are dispersed, and resins with insulating properties, as well as multiple types of resins with different viscosity and conductivity. Here, the first discharge unit 30, the second discharge unit 35, and the coating unit 40, which perform fluid discharge and liquid material application, are collectively referred to as the molding unit 59.

[0025] The molding imaging unit 55 is a camera that images the area below, which is the pallet 60 side. The molding imaging unit 55 images, for example, the molded object on the molding area 61, the inspection area 71 of the inspection unit 70, etc. The height detection unit 56 is configured as a sensor that moves the contact terminal at its tip downward and determines the height of the object it has contacted based on the position where it contacts the object. The inter-device transport unit 57 is used when transporting the pallet 60 to the adjacent device side, which is an area outside the printing passage, and transporting the pallet 60 from the adjacent device. The inter-device transport unit 57 has a rod structure that can be extended downward, and moves the pallet 60 by contacting its tip with the edge of the pallet 60 and pushing it out or hooking and pulling it in. The coating amount detection unit 58 detects the weight of the liquid substance dispensed from the dispenser 43. The coating amount detection unit 58 applies an arbitrary pressure to the dispenser 43 and measures the amount of liquid substance dispensed from the syringe per unit time. Using these measured values, the control device 20 controls the discharge rate of the liquid to an appropriate value.

[0026] The pressing unit 45 is a unit that presses the molded object on the pallet 60, or a liquid applied to the pallet 60 or the molded object. The pressing unit 45 is installed in a third gantry 53 fixed to the rear region in the Y-axis direction of the housing 54 of the 3D printing apparatus 11. This pressing unit 45 may also heat and press the object 69. The pressing unit 45 consists of a pressing section that presses the object 69 with a pressing member 46, a heating section that heats the pressing section, and a pressing transport section 47 that loads and unloads the pallet 60. The pressing member 46 is a member that contacts and pressurizes the object 69. When the pressing unit 45 is equipped with a heating section, the pressing member 46 is a member that contacts and pressurizes the object 69 and also heats it. The pressing and conveying unit 47 is responsible for loading and unloading pallets 60 to and from a pressing unit 45 located off the moving lane of the moving unit 26. The pressing and conveying unit 47 may be mechanically similar to the inter-device conveying unit 57 of the work unit 50.

[0027] The inspection unit 70 is used in a printing apparatus having a discharge head that discharges fluid, and inspects the discharge state of the fluid. The inspection unit 70 is installed on a support section 27 that supports the pallet 60 of the moving unit 26, and moves along with the movement of the support section 27 by the support moving section 28. As shown in Figures 2, 4, and 8, the inspection unit 70 includes an inspection area 71 and a delivery section 74. The inspection area 71 includes a mark substrate 72 and an inspection reference section 73. The inspection unit 70 deposits droplets of fluid or liquid onto the surface of a film 77 fixed on the mark substrate 72, and then delivers the film 77, thereby eliminating the need for cleaning the mark substrate 72 and enabling efficient discharge inspections multiple times. The film 77 is preferably a transparent resin film, and its material and film thickness can be appropriately determined to facilitate discharge inspections.

[0028] The mark substrate 72 is an area for performing discharge inspection of the first discharge head 32 and the second discharge head 37, and marks are formed on it according to the nozzle pitch of the first discharge head 32 and the second discharge head 37. The mark substrate 72 is a plate-like body on which an inspection reference section 73 is formed. This mark substrate 72 may be formed of a transparent material, for example, a glass plate or a resin plate. The marks serve as a reference for the position and amount of fluid discharged from the first nozzle of the first discharge head 32 and the second nozzle of the second discharge head 37. The inspection reference section 73 is provided on the mark substrate 72 and serves as the reference position for the inspection unit 70. The shape of the inspection reference section 73 may be, for example, the same as that of the conductive reference section 67. The control device 20 can determine whether the fluid discharge state at the nozzle is normal or not based on the positional relationship between the fluid discharge position and the marks on the inspection reference section 73 and / or the inspection reference section 73, as well as the discharge area.

[0029] The feeding unit 74 feeds the film 77 on the mark substrate 72 along a predetermined feeding direction D. This feeding unit 74 comprises a feeding roller 75, an intermediate roller, a winding roller 76, and a drive unit (not shown). The feeding roller 75 is a roller around which the film 77 is wound and is a driven roller that feeds the film 77 in accordance with the rotation of the winding roller 76. The intermediate roller is a driven roller disposed between the feeding roller 75 and the winding roller 76 and supports the film 77. The winding roller 76 is rotationally driven by a drive unit such as a drive motor and is a roller that winds up the film 77 that has been fed out from the feeding roller 75 and from which the fluid has been discharged. The feeding roller 75 is replaced with a new one when all of the film 77 has been wound onto the winding roller 76.

[0030] The control panel 48 is a unit that receives input from the operator and presents information to the operator. This control panel 48 comprises a display unit, which is a display, and an operation unit with a touch panel and buttons. The communication unit 49 is an interface for exchanging information with external devices such as the mounting device 12 and the management device 80.

[0031] The management device 80 is configured as a management server that manages the manufacturing system 10. This management device 80 includes a management control unit 81, a storage unit 82, a communication unit 89, a display unit, and an input device. The management control unit 81 has a CPU and is responsible for controlling the entire device. The storage unit 82 is a large-capacity storage device such as flash memory. The storage unit 82 stores molding job information 83, mounting job information 84, reference information 85, etc. The communication unit 89 exchanges information with external devices such as the 3D molding device 11 and the mounting device 12 via a network such as a LAN. Based on requests from the 3D molding device 11 and the mounting device 12, the management control unit 81 sets the molding job information 83, mounting job information 84, etc., and transmits them via the communication unit 89. The display unit is a display that shows images. The input device includes a keyboard and mouse that accept input from the user.

[0032] Next, the three-dimensional molding process of the three-dimensional molding apparatus 11 configured in this way will be described. Figure 9 is a flowchart showing an example of a molding production processing routine executed by the molding control unit 21 of the control device 20. This routine is stored in the memory unit 22 and executed by the control device 20 after the operator W inputs a production processing execution command. In the manufacturing system 10, the molding process can be divided and executed by multiple three-dimensional molding apparatuses 11. For example, the first three-dimensional molding apparatus 11 performs loading of the pallet 60, pre-printing of the receiving hole, generation of the receiving hole layer, and via base formation. The second apparatus performs one-layer circuit formation, receiving hole silver paste formation, resin formation between the first and second layers, and via base formation. The third apparatus performs two-layer circuit formation, via filling, resin formation between the second and third layers, and via base formation. The fourth apparatus performs three-layer circuit formation, via filling, resin formation between the third and fourth layers, and via base formation. The fifth device performs four-layer circuit formation, Pin hole / resist formation, cavity formation, Pin hole formation, silver paste electrode formation, bump formation, and first underfill formation. The mounting device 12 mounts the component P. Then, the sixth device performs press heating and second underfill formation, and unloads the pallet 60. In this way, the manufacturing system 10 allows each device to share the molding process and component mounting. When this routine is started, the molding control unit 21 of the control device 20 first reads and acquires the molding job information 23 from the storage unit 22 (S100). The molding control unit 21 may also acquire the molding job information 83 as the molding job information 23 from the management device 80 via the network.

[0033] Next, the molding control unit 21 has the inter-device transport unit 57 carry out the loading process of the pallet 60 (S110), and determines whether it is time for inspection and maintenance of the molding unit 59, which includes the first discharge unit 30, the second discharge unit 35, and the coating unit 40 (S120). This timing may be, for example, the start of a new production, when a predetermined number of molded objects such as 5 or 10 have been produced, or when a predetermined time such as 30 minutes or 1 hour has elapsed. If it is currently time for inspection and maintenance of the molding unit 59, the molding control unit 21 performs inspection and maintenance processing of the first discharge head 32, the second discharge head 37, and the coating head 42 (S130). In this process, the molding control unit 21 uses the first maintenance unit 33 and the second maintenance unit 38 to perform maintenance processing of the discharge heads, uses the maintenance unit provided on the support unit 27 to perform maintenance processing of the coating head 42, and uses the inspection unit 70 to perform inspection processing.

[0034] After S130, or if it is not inspection / maintenance timing in S120, the molding control unit 21 determines whether the origin position O on the pallet 60 has been acquired and set (S140). The origin position O is the reference position for discharging fluids and liquids onto the molding area 61. In the manufacturing system 10, each 3D molding device 11 is responsible for the molding process, and the process of overlapping and forming structures and conductive materials is performed based on the origin position O. If the origin position O has not been acquired and set, the molding control unit 21 performs the origin position setting process (S150).

[0035] Here, the origin position acquisition process will be explained. Figure 10 is a flowchart showing an example of an origin position setting process routine executed by the molding control unit 21 of the control device 20. This routine is stored in the memory unit 22 and executed by the control device 20 in S150 of the molded object production process routine. When this routine is started, the molding control unit 21 of the control device 20 first determines whether or not to set the origin position O of the discharge head based on whether or not the origin position O has already been set (S300). When setting the origin position O of the discharge head, the molding control unit 21 discharges fluid from the discharge head to a predetermined position in the inspection area 71 of the inspection unit 70 (S310). Here, the origin position O is set for both the first discharge unit 30 and the second discharge unit 35. Next, the molding control unit 21 has the pallet 60 and the inspection unit 70 imaged by the molding imaging unit 55 and acquires each reference position from the obtained image (S320). The molding control unit 21 acquires the fluid discharge position from the discharge head, the inspection reference unit 73, and the position reference unit 68 by image analysis.

[0036] Next, the molding control unit 21 sets the origin position O using the center of gravity position G of the position reference unit 68 and stores it in the storage unit 22 (S330). Figure 11 is an explanatory diagram showing an example of the outline of the origin setting process for the first discharge head 32. As shown in Figure 11, the molding control unit 21 first acquires the standby position relationship between the reference position of the standby position of the first discharge head 32 and the position of the droplets of structural fluid received in the inspection area 71 (1). Next, the molding control unit 21 acquires the inspection position relationship between the position of the droplets of structural fluid and the inspection reference unit 73 (2). Subsequently, the molding control unit 21 acquires the mounting position relationship between the inspection reference unit 73 and the position of the pallet 60 based on the position reference unit 68 (3). Here, the molding control unit 21 uses the center of gravity position G on the molding area 61 obtained from a plurality of position reference units 68 as the position of the pallet 60. Then, the molding control unit 21 sets the origin position O from which the fluid is discharged from the first discharge head 32 based on the positional relationship of the design value between the center of gravity position G and the origin position O (4). In this way, the molding control unit 21 can set the origin position O based on the position where the droplet is actually discharged from the discharge head to the target position, using the aforementioned positional relationships based on the positions of the inspection reference unit 73 and the position reference unit 68. Although the explanation is omitted here, the origin position O of the second discharge head 37 can also be set in the same way as the first discharge head 32.

[0037] If the origin position O of the discharge head is not set after S330, or if it is not set in S300, the molding control unit 21 determines whether or not to set the origin position O of the coating head 42 based on whether or not the origin position O has already been set (S340). When setting the origin position O of the coating head 42, the molding control unit 21 discharges fluid from the dispenser 43 of the coating head 42 to a predetermined position in the inspection area 71 of the inspection unit 70 (S350). If there are multiple dispensers 43, the molding control unit 21 sets the origin position O for each dispenser 43. Next, the molding control unit 21 has the pallet 60 and the inspection unit 70 imaged by the molding imaging unit 55, and obtains each reference position from the obtained image (S360). The molding control unit 21 obtains the discharge position of the liquid from the coating head 42, the position of the inspection reference unit 73, and the position reference unit 68 by image analysis. Next, the molding control unit 21 sets the origin position O of the coating head 42 based on the position reference unit 68, stores it in the storage unit 22 (S370), and terminates this routine.

[0038] Figure 12 is an explanatory diagram showing an example of the outline of the origin setting process for the coating head 42. As shown in Figure 12, the molding control unit 21 first acquires the standby position relationship between the reference position of the dispenser 43 at the standby position of the coating head 42 and the position of the liquid droplets received in the inspection area 71 (1). Next, the molding control unit 21 acquires the inspection position relationship between the position of the liquid droplets and the inspection reference unit 73 (2). Subsequently, the molding control unit 21 acquires the mounting position relationship between the inspection reference unit 73 and the position of the pallet 60 based on the position reference unit 68 (3). Here, the molding control unit 21 uses the centroid position G on the molding area 61 obtained from a plurality of position reference units 68 as the position of the pallet 60. Then, the molding control unit 21 sets the origin position O from which the fluid of the first discharge head 32 is discharged based on the position relationship of the design value between the centroid position G and the origin position O (4).

[0039] In the 3D printing apparatus 11, for example, when setting the origin position O based on the design positional relationship (5) between the inspection reference unit 73 and the origin position O, as shown in Figures 11 and 12, the inspection unit 70 and the pallet 60 are separate components, and if mounting position misalignment occurs, it may not be possible to accurately set the origin position O. In particular, in the manufacturing system 10, since the pallet 60 is removed from the moving unit 26 and moved to an adjacent device, such positional misalignment is more likely to occur. In this manufacturing system 10, the positions of the positional reference unit 68 and the inspection reference unit 73 are directly confirmed from the image captured by the printing imaging unit 55, so the misalignment of the origin position O that may occur due to such positional misalignment can be further suppressed. Furthermore, the printing control unit 21 sets the origin position O using the aforementioned positional relationships based on the position where droplets are actually ejected from the ejection head or coating head 42 to the target position, so that a more accurate origin position O can be set for each device. Furthermore, by using the center of gravity position G based on the position reference unit 68, the molding control unit 21 can set the origin position O more accurately than the position of the palette 60 which depends on only one position reference unit 68, such as the inclination of the molding area 61.

[0040] Now, returning to the explanation of the molding production processing routine, after setting the origin position O in S150, or if the origin position O has already been set in S140, the molding control unit 21 executes the molding process from S160 to S220. Now, let's explain the molding process. The 3D molding apparatus 11 is capable of producing multi-layered molded objects, but for the sake of explanation, we will describe a single-layer molded object here. Figure 13 is an explanatory diagram showing an example of the outline of the molding process, where Figure 13A is the printing process of the substrate S, Figure 13B is the printing process of wiring E such as wiring, Figure 13C is the printing process of the cavity C, Figure 13D is the coating process of conductive material B and underfill U, Figure 13E is the mounting process of component P, and Figure 13F is the coating process of filler F. In the molding process, the molding control unit 21 prints and hardens the substrate S (Figure 13A), prints and hardens the wiring E on the substrate S (Figure 13B), prints and hardens the cavity C on top of that (Figure 13C), applies conductive material B and underfill U (Figure 13D), mounts the component P (Figure 13E), fills with filler material F (Figure 13F), and, as appropriate, presses and heats with the pressing unit 45 to fix the component P. In addition, in this molding process, additional substrate S may be printed and hardened as needed, and the component P may be mounted in multiple layers. The 3D molding apparatus 11 manufactures the molded object M through this molding process. The substrate S and cavity C may be made of the same material or different materials. The wiring E and conductive material B may be made of the same material or different materials. The underfill U and filler material F may be made of the same material or different materials.

[0041] Next, the molding control unit 21 checks which molding process to execute based on the molding job information 23 (S160). If the process to be executed is the extrusion process of structural material, the molding control unit 21 executes the first printing process using the first extrusion head 32 (S170). Based on the printed image of the molded object, the molding control unit 21 executes a process to extrude the structural fluid into the molding area 61, performs a flattening process with the flattening unit 29, and hardens the structural fluid with the first hardening unit 34. At the same time, the molding control unit 21 also performs a process to form a base 66 in the reference part formation area 62, which has the same formation height (layer) as the structural material. Based on the printed image of the base 66, the molding control unit 21 executes a process to print the structural fluid, performs a flattening process with the flattening unit 29, and hardens the structural fluid with the first hardening unit 34. Through this process, a structure is formed in the molding area 61 and a base 66 is formed in the reference part formation area 62. Furthermore, when the process executed in S160 is the discharge process of conductive material, the molding control unit 21 executes a second printing process using the second discharge head 37 (S180). In the second printing process as well, the molding control unit 21 executes a process to print conductive fluid onto the object based on the printed image of the molded object, and then executes a curing process. At this time, the molding control unit 21 also performs in parallel a process to form a conductive reference section 67 on a base 66 that has the same formation height (layer) as the wiring E. The molding control unit 21 executes a process to discharge conductive fluid onto the base 66 based on the printed image of the conductive reference section 67, and the conductive fluid is cured by the second curing unit 39. Through this process, a molded object with wiring E is formed in the molding region 61 and a fiducial mark 65 is formed in the reference section formation region 62.

[0042] Furthermore, when the process to be executed in S160 is a coating process, the molding control unit 21 determines whether or not the reference position relationship between the conductive reference unit 67 and the position reference unit 68 has already been acquired (S190). In the manufacturing system 10, multiple 3D molding devices 11 share the molding process, so fiducial marks 65 may have already been completed on machines other than its own, and the reference position relationship may have been acquired and stored as reference information 25. Also, since the 3D molding device 11 performs the coating process based on the fiducial marks 65, the fiducial marks 65 have already been created when the coating process is executed in S160. If the reference position relationship has not been acquired, the molding control unit 21 performs the reference position acquisition process (S200).

[0043] Here, the reference position acquisition process will be explained. Figure 14 is a flowchart showing an example of a reference position acquisition process routine executed by the molding control unit 21 of the control device 20. This routine is stored in the memory unit 22 and executed by the control device 20 in S200 of the molded object production processing routine. When this routine is started, the molding control unit 21 of the control device 20 causes the pallet 60 to be imaged by the molding imaging unit 55 (S400), determines the positions of the conductive reference unit 67 and the position reference unit 68 by image analysis, and acquires their reference position relationship (S410). The reference position relationship may be the coordinate values ​​of the X and Y axes, the difference value of the coordinate values ​​(X, Y), or the difference between direction and distance. The molding control unit 21 may determine this reference position relationship for each of the conductive reference units 67 formed on each layer of the base 66. The molding control unit 21 then stores the reference information 25, including the obtained reference positional relationship, in the storage unit 22 and outputs the reference information 25 to an external device such as the management device 80 (S420), and terminates this routine.

[0044] FIG. 15 is an explanatory diagram (FIG. 15A) for obtaining a reference position relationship and an explanatory diagram (FIG. 15B) showing an example of using the reference position relationship. As shown in FIG. 15A, the shaping control unit 21 stores the positional relationship between the conductive reference portion 67 and the position reference portion 68 in the reference information 25 as a reference position relationship. The fiducial mark 65 is formed of a conductive fluid by the second ejection head 37. The conductive fluid is, for example, silver ink or the like, and may deteriorate over time like the conductive reference portion 67B shown in FIG. 15B. Further, the surface of the fiducial mark 65 may be chipped or wavy depending on the state of the second ejection head 37 and the state of the pedestal 66. When the fiducial mark 65 is imaged, if the conductive reference portion 67 is black, the pixel values on the mark may partially skip white. If the conductive reference portion 67 is white, it may be blacked out. Also, the camera resolution and the like may differ between devices, and the way the mark appears may differ between devices. Therefore, when the conductive reference portion 67 is imaged by each device and its position is grasped, the detection position of the fiducial mark 65, which is the reference for bump coating and component mounting performed in the coating process, may shift. In the manufacturing system 10, after the formation of the conductive reference portion 67, the reference position relationship is obtained at the earliest possible stage, and the position of the conductive reference portion 67 is replaced with the position of the position reference portion 68 that can be stably detected by each device, thereby preventing possible positional shifts between devices (FIG. 15B). In the manufacturing system 10, after the fiducial mark 65 is completed, in the three-dimensional shaping device 11 that executes the shaping process and the mounting device 12 that executes the mounting process, the correction of the coating position is executed using the position of the position reference portion 68 and the reference information 25 without grasping the position of the conductive reference portion 67.

[0045] Now, returning to the explanation of the molding production processing routine, after S200, or if the reference position relationship has already been acquired in S190, the molding control unit 21 reads and acquires this reference position relationship from the reference information 25 (S210). The molding control unit 21 acquires the reference information 25 created by its own machine or another device and acquires the reference position relationship. Next, the molding control unit 21 executes the coating process by the coating head 42 (S220). In the coating process, the molding control unit 21 uses the above reference position relationship to perform a coating position correction process for the underfill U, the coating of conductive material B such as bumps, and the coating of filler F, and has the dispenser 43 apply them. At this time, the molding control unit 21 corrects the coating position of the liquid using the reference position correspondence relationship between the conductive reference part 67 formed on the base 66 corresponding to the height at which the coating head 42 applies the liquid and the position reference part 68. The molding control unit 21 also has the pressing unit 45 perform a hardening process for the liquid.

[0046] After steps S170 to S220, the molding control unit 21 determines whether all production processes have been completed (S230). If all production processes have not been completed, the molding control unit 21 executes the processes from S120 onward. On the other hand, if the production processes are completed in S230, the inter-device transport unit 57 executes the pallet 60 unloading process (S240), and this routine ends. In this way, the molding control unit 21 sets an origin position O for each device and shares reference information 25 among the devices to ensure positional accuracy when applying liquid material from the coating unit 40.

[0047] Next, the process by which the mounting device 12 mounts parts P onto objects 69 on the pallet 60 will be described. Figure 16 is a flowchart showing an example of a mounting process routine executed by the control device 13 of the mounting device 12. This routine is stored in the memory unit and executed by the control device 13 after receiving a command to load the pallet 60 from the adjacent 3D modeling device 11. When the mounting control unit 14 of the control device 13 starts this routine, it acquires mounting job information 84 and reference information 85 from the management device 80. The mounting control unit 14 may acquire the mounting job information 84 and reference information 85 in advance and store them in the memory unit, and then read them from the memory unit. Next, the mounting control unit 14 loads the pallet 60 using the transport processing unit 15 (S510) and executes the origin position setting process (S520). The origin position O of the mounting device 12 can be set in the same way as in the 3D modeling device 11. That is, the mounting control unit 14 first images the pallet 60 and the transport reference unit 15a with the mounting imaging unit 18d. Next, the mounting control unit 14 obtains the position of the transport reference unit 15a and the position of the position reference unit 68 from the captured image through image analysis. Subsequently, the mounting control unit 14 obtains the positional relationship of the transport unit between the transport reference unit 15a, which is the reference position of the mounting device 12, and the position of the pallet 60 based on the position reference unit 68. Here, the molding control unit 21 uses the centroid position G on the molding area 61, which is determined from the multiple position reference units 68, as the position of the pallet 60. Then, the mounting control unit 14 sets the origin position O, which is the reference position when the mounting unit 18 places the parts P, based on the positional relationship of the centroid position G and the origin position O based on the design values.

[0048] Next, the mounting control unit 14 causes the component supply unit 16 to collect the component P and supply it to the mounting unit 18 (S530), and arranges the component P at the arrangement position based on the reference information 85 (S540). At this time, the mounting control unit 14 uses the reference position relationship between the conductive reference portion 67 and the position reference portion 68 included in the reference information 85 to correct the deviation of the arrangement position with respect to the origin position O, and arranges the component P on the object 69 formed on the pallet 60. Then, the mounting control unit 14 determines whether all the components P have been arranged (S550). When not all the components P have been arranged, the processes after S530 are executed. On the other hand, when all the components P have been arranged in S550, the pallet 60 is carried out to the next three-dimensional shaping apparatus 11 (S560), and this routine is terminated. As described above, the mounting apparatus 12 can suppress the erroneous detection of the position of the conductive reference portion 67 based on the position of the position reference portion 68 by using the reference information 85. Further, the mounting apparatus 12 can perform position deviation correction based on the conductive reference portion 67 by using the position reference portion 68, and can arrange the component P at a more accurate position.

[0049] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The three-dimensional molding apparatus 11 of this embodiment is an example of the three-dimensional molding apparatus of the present disclosure, the pallet 60 is an example of a mounting member, the support part 27 is an example of a support part, the first discharge unit 30 is an example of a first discharge unit, the first discharge head 32 is an example of a first discharge head, the second discharge unit 35 is an example of a second discharge unit, the second discharge head 37 is an example of a second discharge head, the coating unit 40 is an example of a coating unit, the coating head 42 is an example of a coating head, the molding imaging unit 55 is an example of a molding imaging unit, the inspection unit 70 is an example of an inspection unit, and the molding control unit 21 is an example of a molding control unit. Furthermore, the molding area 61 is an example of a molding area, the reference part formation area 62 is an example of a reference part formation area, the fiducial mark 65 is an example of a reference body, the base 66 is an example of a base, the conductive reference part 67 is an example of a conductive reference part, the position reference part 68 is an example of a position reference part, the inspection reference part 73 is an example of an inspection reference part, and the reference information 25 and reference information 85 are examples of reference information. In addition, the manufacturing system 10 is an example of a manufacturing system, the mounting device 12 is an example of a mounting device, the mounting imaging unit 18d is an example of a mounting imaging unit, and the mounting control unit 14 is an example of a mounting control unit. In this embodiment, by explaining the operation of the 3D molding apparatus 11, examples of the 3D molding method, the manufacturing method of the molded object, the control method of the 3D molding apparatus 11, and the mounting method of the 3D molding apparatus 11 of this disclosure are also clarified.

[0050] The three-dimensional molding apparatus 11 of this embodiment described above includes a support unit 27 that supports a pallet 60 having a molding area 61 on which the molded object M is placed, a reference area 62 for forming a fiducial mark 65 as a reference body, and a position reference area 68 that serves as a position reference for the pallet 60 as a mounting member; a first discharge unit 30 having a first discharge head 32 that discharges structural fluid constituting the structure of the molded object onto the object 69 on the molding area 61; a second discharge unit 35 having a second discharge head 37 that discharges conductive fluid constituting a conductor onto the object 69; and a liquid discharge unit 30 that discharges liquid onto the object 69. The 3D printing apparatus 11 includes a coating unit 40 having a coating head 42 for applying a liquid substance, and a molding control unit 21 that corrects the coating position by the coating unit 40 using reference information 25 including the reference position relationship between the conductive reference part 67 of a fiducial mark 65, which has a base 66 formed by discharging structural fluid from a first discharge head 32 into a reference part forming region 62, and a conductive reference part 67 formed by discharging conductive fluid from a second discharge head 37 into the base 66, and a position reference part 68 on a pallet 60, and causes the coating head 42 to apply the liquid substance to the object 69 in the molding region 61. In this 3D printing apparatus 11, the fiducial mark 65 actually created by the first discharge head 32 and the second discharge head 37 is used to correct the coating position, so that the liquid substance can be applied from the coating head 42 to the position of the object 69 more accurately. On the other hand, the position detection result of the conductive reference part 67 formed of conductive fluid may change over time. In this 3D printing apparatus 11, reference information 25 is used, which is based on a position reference unit 68 on the pallet 60. This prevents the influence of, for example, the position detection result of the conductive reference unit 67, and allows for the application of liquid material to a more accurate position. Therefore, this 3D printing apparatus 11 can produce a more accurate printed object M.

[0051] Furthermore, the 3D printing apparatus 11 is used in a manufacturing system 10 that includes a 3D printing apparatus for printing an object M and a mounting apparatus 12 for mounting parts P onto the object M. The printing control unit 21 outputs reference information 25 to the mounting apparatus 12, for example, via a management device 80, and allows the use of the reference position relationship for part mounting. In this 3D printing apparatus 11, by allowing the mounting apparatus 12 to use the reference information 25, differences in the position detection results of the conductive reference section 67 that may occur between different devices can be prevented, the accuracy of the placement position of the parts P can be further improved, and consequently, a more accurate printed object M can be obtained. In addition, the printing control unit 21 forms one or more bases 66 of height corresponding to the hierarchy of the structure, and corrects the liquid application position using the reference position correspondence relationship between the conductive reference section 67 formed on the base 66 corresponding to the height at which the coating head 42 applies the liquid, and the position reference section 68. In this 3D printing apparatus 11, the accuracy of liquid application can be further improved according to the hierarchy of the structure. Furthermore, the 3D modeling apparatus 11 is equipped with a modeling imaging unit 55 that images the pallet 60 side, and the modeling control unit 21 determines the reference position relationship between the conductive reference unit 67 and the position reference unit 68 based on the image captured by the modeling imaging unit 55. With this 3D modeling apparatus 11, a more accurate model can be obtained by using the reference position relationship obtained by imaging with the modeling imaging unit 55. Moreover, before applying liquid material from the coating head 42 to the object 69, the modeling control unit 21 discharges structural fluid from the first discharge head 32 into the reference unit formation region 62 to form a base 66, and discharges conductive fluid from the second discharge head 37 onto the base 66 to form the conductive reference unit 67. With this 3D modeling apparatus 11, since the conductive reference unit 67 on the base 66 is formed by discharging structural fluid and conductive fluid with the discharge heads, the accuracy of liquid material application can be further improved.

[0052] Furthermore, the 3D printing apparatus 11 includes an inspection unit 70 having an inspection area 71 for receiving droplets ejected from a printing unit 59 which includes one or more of the first ejection unit 30, the second ejection unit 35, and the coating unit 40, and an inspection reference unit 73 which serves as the reference position for the inspection unit 70. The printing control unit 21 sets the origin position O used by the printing unit 59 in the printing area 61 using the inspection position relationship between the position of the droplet received in the inspection area 71 and the inspection reference unit 73, and the placement position relationship between the inspection reference unit 73 and the position of the pallet 60 based on the position reference unit 68. In this 3D printing apparatus 11, the position relationship between the position of the droplet and the position of the pallet 60 can be associated using the inspection position relationship and the placement position relationship. Therefore, even if, for example, the position of the pallet 60 on the support unit 27 is shifted, a more accurate position can be set as the origin position O used by the printing unit 59. Consequently, this 3D printing apparatus can produce more accurate printed objects.

[0053] Alternatively, the 3D printing apparatus 11 includes a support section 27 that supports a pallet 60 having a printing area 61 on which the printed object is placed and a position reference section 68 that serves as a position reference for the pallet 60, a first discharge unit having a first discharge head 32 that discharges a structural fluid constituting the structure of the printed object M onto the object 69 on the printing area 61, a second discharge unit having a second discharge head that discharges a conductive fluid constituting a conductor onto the object, and a coating unit 40 having a coating head 42 that applies a liquid to the object 69, and the first discharge The 3D printing apparatus 11 includes an inspection unit 70 having an inspection area 71 for receiving droplets ejected from a molding unit 59 which includes one or more of the ejection unit 30, a second ejection unit 35, and a coating unit 40, and an inspection reference unit 73 which serves as the reference position of the inspection unit 70; and a molding control unit 21 which sets the origin position O used by the molding unit 59 in the molding area 61 using the inspection position relationship between the position of the droplet received in the inspection area 71 and the inspection reference unit 73, and the mounting position relationship between the inspection reference unit 73 and the position of the mounting member based on the position reference unit. In this 3D printing apparatus 11, the positional relationship between the position of the droplet and the position of the palette 60 can be associated using the inspection position relationship and the mounting position relationship. For example, even if the position of the mounting member on the support unit 27 is shifted, a more correct position can be set as the origin position O used by the molding unit 59. Therefore, this 3D printing apparatus 11 can produce more accurate molded objects.

[0054] Furthermore, the 3D printing apparatus 11 is used in a manufacturing system 10 that includes multiple 3D printing apparatuses 11 for printing objects M and a mounting apparatus 12 for mounting parts P onto the objects M. The support section 27 supports a pallet 60 brought in from another apparatus attached to the machine. In this 3D printing apparatus 11, which moves between each apparatus and whose positional relationship with the inspection area 71 and the pallet 60 may change, the origin position O used by the printing section 59 can be set to a more accurate position. Therefore, this 3D printing apparatus 11 can obtain a more accurate object M. Moreover, the printing control unit 21 uses the center of gravity position G on the printing area 61, which is determined by the position reference unit 68, as the position of the pallet 60 based on the position reference unit 68. In this 3D printing apparatus 11, by using the center of gravity position G based on the position reference unit 68, it is possible to respond to changes in position detection results, such as the tilt of the pallet 60, and obtain a more accurate object. Furthermore, in the 3D printing apparatus 11, one or more position reference units 68 are provided on the outer periphery of the printing area 61. In this 3D printing apparatus 11, a more accurate printed object M can be obtained by using the position reference units 68 provided outside the printing area 61.

[0055] Furthermore, the mounting device 12 is a device used in a manufacturing system 10 that includes a three-dimensional molding device 11 for molding an object M and a mounting device 12 for mounting components P onto the molded object M. The mounting device 12 includes a mounting unit 18 that places a part P on an object 69 placed on the mounting area 61 of a pallet 60 which has a mounting area 61 on which a molded object M is placed, a reference area 62 for forming a fiducial mark 65 as a reference body, and a position reference area 68 which serves as a position reference for the pallet 60; a mounting imaging unit 18d that images the pallet 60 side; a conductive reference area 67 of the fiducial mark 65 which has a base 66 formed by discharging structural fluid into the reference area 62 and a conductive reference area 67 formed by discharging conductive fluid into the base 66, and a position reference area 68 on the pallet 60; a mounting control unit 14 that acquires reference information 25 including the reference position relationship of the conductive reference area 67 of the fiducial mark 65 which has a base 66 formed by discharging structural fluid into the reference area 62 and a conductive reference area 67 formed by discharging conductive fluid into the base 66, and the position reference area 68 on the pallet 60 from the 3D molding device 11 via a management device 80; and corrects the placement position of the part P using the position of the position reference area 68 obtained using the image of the pallet 60 captured by the mounting imaging unit 18d and the acquired reference information 85, and causes the mounting unit 18 to place the part P on the object 69. In this mounting device 12, by acquiring and utilizing reference information 25 from the 3D printing device 11, differences in the position detection results of the conductive reference section 67 that may occur between different devices can be prevented, and the accuracy of the placement position of the component P can be further improved. Therefore, in this mounting device 12, a more accurate molded object M can be obtained. Furthermore, the mounting control unit 14 does not use the reference position relationship between the position reference section 68 and the conductive reference section 67 to perform the process of determining the position of the conductive reference section 67 from the captured image. In this mounting device 12, since the position of the conductive reference section 67 based on the captured image captured by the mounting imaging unit 18d is not used, differences in the position detection results of the conductive reference section 67 that may occur between different devices can be prevented. The mounting control unit 14 then uses the transport section position relationship between the transport reference section 15a formed on the component side of the mounting device 12 and the position of the pallet 60 based on the position reference section 68 of the pallet 60 to set the origin position O that the mounting unit 18 uses to place the component P in the molding area 61. In this mounting device 12, the origin position O of the mounting process can be set using the position reference section 68 formed on the pallet 60.The components of the mounting device include the housing of the mounting device 12, structural elements such as columns, a transport processing unit 15 that moves the pallet 60, and a component supply unit 16 that supplies the components P.

[0056] Furthermore, the manufacturing system 10 includes a three-dimensional molding apparatus 11 as described above and a mounting apparatus 12 as described above. Because this manufacturing system 10 includes the three-dimensional molding apparatus 11 and mounting apparatus 12 described above, it is possible to obtain more accurate molded objects in the same way as these.

[0057] It goes without saying that the control device 20, the three-dimensional molding apparatus 11, and the manufacturing system 10 of this disclosure are not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0058] For example, in the embodiment described above, the 3D modeling apparatus 11 sets the origin position O using the position reference unit 68 and corrects the coating position of the coating head 42 using the reference information 25. However, it is not limited to this, and one of the processes may be omitted, or one of the processes may be performed by another method.

[0059] In the embodiment described above, the mounting device 12 acquires reference information 25 and the other 3D modeling device 11 and mounting device 12 utilize this reference information 25. However, the embodiment is not limited to this, and the reference information 25 may be used only by the 3D modeling device 11, only by the mounting device 12, or by other mounting-related devices.

[0060] In the above-described embodiment, the 3D printing apparatus 11 forms a stepped base 66 of different heights, but it is not limited to this, and the base 66 may be formed according to the layers in which the coating process of the coating head 42 is performed, rather than being stepped. Also, in the above embodiment, the 3D printing apparatus 11 forms fiducial marks 65 together with the molding process of the object 69, but it is not limited to this, and the formation of fiducial marks 65 may be performed separately from the molding process of the molded object.

[0061] In the embodiment described above, the centroid position G obtained from the position reference unit 68 is used when setting the origin position O. However, the method is not limited to this, as long as the position of the position reference unit 68 is used, a position other than the centroid position G, such as the position of the position reference unit 68 itself, may be used. In this 3D printing apparatus 11, a more accurate position can be used as the origin position used by the printing unit, thereby improving the accuracy of the printing process.

[0062] In the embodiment described above, the position reference section 68 is provided on the outer periphery of the molding area 61 of the pallet 60, but the invention is not limited to this, and the position reference section 68 may be provided inside the molding area 61. Also, in the embodiment described above, the pallet 60 is provided with four position reference sections 68, but the invention is not limited to this, and there may be one to three or five or more of them.

[0063] In the embodiment described above, the manufacturing system 10 is described as having several 3D printing devices 11 and one mounting device 12, with the printing process being divided and executed by each device. However, it is not limited to this, and the printing process may be performed by a single 3D printing device 11. Figure 17 is an explanatory diagram showing an example of another manufacturing system 10B. Figure 18 is a flowchart showing an example of another molded product production processing routine executed by the 3D printing device 11 of the manufacturing system 10B. The manufacturing system 10B is equipped with one 3D printing device 11 and one mounting device 12, and performs the printing process and the mounting process by moving the pallet 60 between them. The molding control unit 21 of the 3D printing device 11 executes the molded product processing routine in Figure 18. In this routine, the same step numbers are used for processes similar to those in the routine in Figure 9 described above, and a detailed explanation is omitted. In S160, the molding control unit 21, when the process to be executed is the mounting process of parts P, causes the inter-device transport unit 57 of the work unit 50 to perform the loading and unloading processes of the pallet 60 to the mounting device 12 (S225). When the mounting device 12 loads the pallet 60, it executes the placement process of parts P based on the mounting job information. Here, the mounting device 12 uses the reference information 25 to correct the placement position and places the parts P on the object 69. When the mounting process is completed and the object 69 with the parts P placed on it is loaded into the 3D molding device 11, the molding control unit 21 executes the processes from S230 onwards. In this manufacturing system 10B as well, the mounting device 12 can place the parts P in a more accurate position by sharing the reference information 25, for example, preventing the influence of the position detection results of the conductive reference unit 67. Furthermore, since the molding process continues using the position reference section 68 as a reference based on the reference information 25, the influence of changes in the conductive reference section 67 over time is prevented, and the liquid can be applied to a more accurate position. Therefore, the manufacturing system 10B can produce more accurate molded objects.

[0064] In the above-described embodiment, the discharge head includes a first discharge head 32 which is a structural fluid discharge head and a second discharge head 37 which is a conductive fluid discharge head, but it is not limited to this, and either one may be omitted, or other discharge heads may be included. Also, in the above-described embodiment, the coating head 42 has a dispenser 43 for coating liquid substances, but it is not limited to this, and a coating head other than the dispenser 43 may be used.

[0065] In the embodiments described above, the disclosure was explained as a manufacturing system 10, but it is not limited thereto, and it may be just a 3D printing apparatus 11, or just a mounting apparatus 12. Also, in the embodiments described above, it was described as a manufacturing system 10, a 3D printing apparatus 11, and a mounting apparatus 12, but it may also be described as a 3D printing method, a method for manufacturing a printed object, a control method for the 3D printing apparatus 11, a printing method, a mounting method, a control method for the mounting apparatus, or a program therefor.

[0066] This disclosure may be structured as follows: For example, the three-dimensional molding method of the present disclosure is a three-dimensional molding method executed by a computer using a three-dimensional molding apparatus comprising: a support part for supporting a mounting member having a molding area on which the molded object is placed, a reference part forming area for forming a reference body, and a position reference part that serves as a position reference for the mounting member; a first discharge unit having a first discharge head for discharging a structural fluid constituting the structure of the molded object onto an object on the molding area; a second discharge unit having a second discharge head for discharging a conductive fluid constituting a conductor onto the object; and a coating unit having a coating head for coating the object with a liquid, the method comprising: correcting the coating position by the coating unit using reference information including the reference position relationship between the conductive reference part of the reference body having a base formed by discharging the structural fluid from the first discharge head into the reference part forming area and a conductive reference part formed by discharging the conductive fluid from the second discharge head onto the base, and the position reference part on the mounting member described above, and coating the object with the liquid from the coating head onto the object in the molding area.

[0067] In this 3D fabrication method, similar to the 3D fabrication apparatus described above, reference information is used that is further based on a position reference part on the mounting member. Therefore, for example, the influence of the position detection result of the conductive reference part can be prevented, allowing liquid material to be applied to a more accurate position, and a more accurate fabricated object can be obtained. In this 3D fabrication method, various embodiments of the 3D fabrication apparatus described above may be adopted, or steps that realize each of the functions of the 3D fabrication apparatus described above may be added.

[0068] Alternatively, the three-dimensional molding method of the present disclosure is a three-dimensional molding method executed by a computer using a three-dimensional molding apparatus comprising: a support portion for supporting a mounting member having a molding area on which the molded object is placed and a position reference portion which serves as a position reference for the mounting member; a first discharge unit having a first discharge head for discharging a structural fluid constituting the structure of the molded object onto an object on the molding area; a second discharge unit having a second discharge head for discharging a conductive fluid constituting a conductor onto the object; a coating unit having a coating head for coating a liquid onto the object; and an inspection unit having an inspection area for receiving droplets discharged from a molding section including one or more of the first discharge unit, the second discharge unit, and the coating unit, and an inspection reference portion which serves as a reference position for the inspection unit, the method comprising setting an origin position used by the molding section in the molding area using an inspection position relationship between the position of the droplets received in the inspection area and the inspection reference portion, and a mounting section position relationship between the inspection reference portion and the position of the mounting member based on the position reference portion.

[0069] In this 3D printing method, similar to the 3D printing apparatus described above, a more accurate position can be used as the origin position for the printing unit, resulting in a more precise printed object. In this 3D printing method, various embodiments of the 3D printing apparatus described above may be adopted, or steps that realize each of the functions of the 3D printing apparatus described above may be added.

[0070] The implementation method of the present disclosure is a computer-operated implementation method used in a computer-operated implementation device of a manufacturing system which includes a three-dimensional molding apparatus for molding an object and a implementation device for mounting a component onto an object, the

[0071] In this implementation method, similar to the implementation device described above, reference information is acquired and used from the 3D printing device, thereby preventing discrepancies in the position detection results of the conductive reference part that may occur between different devices, and further improving the accuracy of the placement position of the parts. Therefore, this implementation device can produce more accurate printed objects. In addition, various embodiments of the implementation device described above may be adopted in this implementation method, or steps that realize each of the functions of the implementation device described above may be added.

[0072] This specification describes the technical concept in which, in the original claim 4, "the three-dimensional molding apparatus described in claim 1 or 2" was changed to "the three-dimensional molding apparatus described in any one of claims 1 to 3", the technical concept in the original claim 5, "the three-dimensional molding apparatus described in claim 1 or 2" was changed to "the three-dimensional molding apparatus described in any one of claims 1 to 4", the technical concept in the original claim 6, "the three-dimensional molding apparatus described in claim 1 or 2" was changed to "the three-dimensional molding apparatus described in any one of claims 1 to 5", and the original claim 9, "the three-dimensional molding apparatus described in claim 1 or 2 Technical concepts are also disclosed, including changing "original molding device" to "three-dimensional molding device according to any one of claims 1 to 8", changing "three-dimensional molding device according to claim 1 or 7" in the original claim 10 to "three-dimensional molding device according to any one of claims 1 to 9", and changing "three-dimensional molding device according to claim 1 or 2" in the original claim 14 to "three-dimensional molding device according to any one of claims 1 to 10", and changing "mounting device according to claim 11 or 12" to "mounting device according to any one of claims 11 to 13".

[0073] This disclosure is applicable to the technical field of apparatus for manufacturing objects by discharging fluids.

[0074] 10, 10B Manufacturing system, 11 3D molding device, 12 Mounting device, 13 Control device, 14 Mounting control unit, 15 Transport processing unit, 15a Transport reference unit, 16 Parts supply unit, 16a Feeder, 17 Parts imaging unit, 18 Mounting unit, 18a Head movement unit, 18b Mounting head, 18c Sampling material, 18d Mounting imaging unit, 19 Operation panel, 20 Control device, 21 Printing control unit, 22 Storage unit, 23 Molding job information, 24 Detection result information, 25 Reference information, 26 Movement unit, 27 Support unit, 28 Support movement unit, 29 Flattening unit, 30 First discharge unit, 32 First discharge head, 32a Nozzle, 33 First maintenance unit, 34 First curing unit, 35 Second discharge unit, 37 Second discharge head, 37a Nozzle, 38 Second maintenance unit, 39 40 Second curing unit, 41 Coating unit, 42 Coating transfer unit, 43 Coating head, 44 Dispenser, 44 Imaging unit, 45 Pressing unit, 46 Pressing member, 47 Pressing transport unit, 48 Operation panel, 49 Communication unit, 50 Work unit, 51 First gantry, 52 Second gantry, 53 Third gantry, 54 Housing, 55 Imaging unit, 56 Height detection unit, 57 Inter-device transport unit, 58 Coating amount detection unit, 59 Molding unit, 60 Pallet, 61 Molding area, 62 Reference area, 63 Receiving area, 65 Fiducial mark, 66 Base, 67 Reference area, 68 Position reference area, 69 Object, 70 Inspection unit, 71 Inspection area, 72 Mark substrate, 73 Reference mark, 74 Sending unit, 75 Sending roller, 76 Winding roller, 77 Film, 78, 78a, 78b; Discharged material, 80; Management device, 81; Management control unit, 82; Storage unit, 83; Molding job information, 84; Assembly job information, 85; Reference information, 89; Communication unit, B; Conductive material, C; Cavity, D; Feed direction, E; Wiring, F; Filler, M; Molded object, O; Origin position, P; Parts, S; Substrate, U; Underfill, W; Operator.

Claims

1. A three-dimensional molding apparatus comprising: a support for a mounting member having a molding area on which a molded object is placed, a reference area for forming a reference body, and a position reference area that serves as a position reference for the mounting member; a first discharge unit having a first discharge head for discharging a structural fluid constituting the structure of the molded object onto an object on the molding area; a second discharge unit having a second discharge head for discharging a conductive fluid constituting a conductor onto the object; a coating unit having a coating head for coating a liquid onto the object; and a molding control unit that corrects the coating position by the coating unit using reference information including the reference position relationship between the conductive reference area of ​​the reference body having a base formed by discharging the structural fluid from the first discharge head into the reference area and a conductive reference area formed by discharging the conductive fluid from the second discharge head onto the base, and the position reference area on the mounting member described above, and coats the liquid onto the object in the molding area from the coating head.

2. The three-dimensional molding apparatus is used in a manufacturing system that includes a three-dimensional molding apparatus for molding an object and a mounting apparatus for mounting components onto the object, wherein the molding control unit outputs the reference information to the mounting apparatus and causes the reference positional relationship to be used for mounting the components, as described in claim 1.

3. The three-dimensional molding apparatus according to claim 1 or 2, wherein the molding control unit causes one or more bases to be formed at a height corresponding to the hierarchy of the structure, and corrects the application position of the liquid using the reference position correspondence relationship between the conductive reference part formed on the base at a height corresponding to the height at which the coating head applies the liquid and the position reference part.

4. A three-dimensional molding apparatus according to claim 1 or 2, comprising a molding imaging unit for imaging the mounting member, wherein the molding control unit determines the reference position relationship between the conductive reference unit and the position reference unit based on the image captured by the molding imaging unit.

5. The three-dimensional molding apparatus according to claim 1 or 2, wherein, before the molding control unit causes the liquid substance to be applied to the object from the coating head, the structural fluid is discharged from the first discharge head into the reference portion forming region to form the base, and the conductive fluid is discharged from the second discharge head onto the base to form the conductive reference portion.

6. A three-dimensional molding apparatus according to claim 1 or 2, comprising: an inspection unit having an inspection area for receiving droplets ejected from a molding section including one or more of the first ejection unit, the second ejection unit, and the coating unit, and an inspection reference section which is the reference position of the inspection unit, wherein the molding control unit sets the origin position used by the molding section in the molding area using the inspection position relationship between the position of the droplets received in the inspection area and the inspection reference section, and the placement position relationship between the inspection reference section and the position of the placement member based on the position reference section.

7. A three-dimensional molding apparatus comprising: a support section for supporting a mounting member, having a molding area on which a molded object is placed and a position reference section that serves as a position reference for the mounting member; a first discharge unit having a first discharge head for discharging a structural fluid constituting the structure of the molded object onto an object on the molding area; a second discharge unit having a second discharge head for discharging a conductive fluid constituting a conductor onto the object; a coating unit having a coating head for coating a liquid onto the object; an inspection unit having an inspection area for receiving droplets discharged from a molding section including one or more of the first discharge unit, the second discharge unit, and the coating unit, and an inspection reference section that serves as a reference position for the inspection unit; and a molding control unit that sets the origin position used by the molding section in the molding area using the inspection position relationship between the position of the droplets received in the inspection area and the inspection reference section, and the mounting section position relationship between the inspection reference section and the position of the mounting member based on the position reference section.

8. The three-dimensional molding apparatus is used in a manufacturing system that includes a plurality of three-dimensional molding apparatuses for molding objects and a mounting apparatus for mounting components onto the molded objects, and the support portion supports the mounting member described above, which is brought in from another apparatus attached to the machine, according to claim 7.

9. The three-dimensional molding apparatus according to claim 1 or 2, wherein the molding control unit uses the position of the centroid on the molding region determined by the position reference unit as the position of the aforementioned molding member based on the position reference unit.

10. The three-dimensional molding apparatus according to claim 1 or 7, wherein one or more position reference sections are provided on the outer periphery of the molding area.

11. A mounting device used in a manufacturing system including a three-dimensional molding apparatus for molding an object and a mounting device for mounting parts onto the molded object, comprising: a mounting unit for placing parts onto an object placed on the molding area of ​​a mounting member having a molding area for placing the molded object, a reference part forming area for forming a reference body, and a position reference part that serves as a position reference for the mounting member; a mounting imaging unit for imaging the mounting member; and a mounting control unit that acquires reference information from the three-dimensional molding apparatus, including the reference position relationship between the conductive reference part of the reference body having a base formed by discharging a structural fluid into the reference part forming area and a conductive reference part formed by discharging a conductive fluid into the base, and the position reference part on the mounting member described above; and corrects the placement position of the parts using the position of the position reference part obtained using the image of the mounting member captured by the mounting imaging unit and the acquired reference information, and places the parts onto the object using the mounting unit.

12. The mounting apparatus according to claim 11, wherein the mounting control unit does not perform a process to determine the position of the conductive reference unit from the captured image using the reference position relationship between the position reference unit and the conductive reference unit.

13. The mounting apparatus according to claim 11 or 12, wherein the mounting control unit sets the origin position used by the mounting unit for arranging the components in the molding area using the positional relationship of the transport unit, the position of the aforementioned mounting member based on the position reference unit of the aforementioned mounting member, and the position of the aforementioned mounting member.

14. A manufacturing system comprising a three-dimensional molding apparatus according to claim 1 or 2, and a mounting apparatus according to claim 11 or 12.

15. A three-dimensional molding method executed by a computer using a three-dimensional molding apparatus comprising: a support part for supporting a mounting member having a molding area on which a molded object is placed, a reference part forming area for forming a reference body, and a position reference part that serves as a position reference for the mounting member; a first discharge unit having a first discharge head for discharging a structural fluid constituting the structure of the molded object onto an object on the molding area; a second discharge unit having a second discharge head for discharging a conductive fluid constituting a conductor onto the object; and a coating unit having a coating head for coating a liquid onto the object, the method comprising the steps of correcting the coating position by the coating unit using reference information including a reference position relationship between a conductive reference part of a reference body having a base formed by discharging the structural fluid from the first discharge head into the reference part forming area and a conductive reference part formed by discharging the conductive fluid from the second discharge head onto the base, and the position reference part on the mounting member described above, and coating the liquid onto the object in the molding area from the coating head.

16. A three-dimensional molding method executed by a computer using a three-dimensional molding apparatus comprising: a support part for supporting a mounting member having a molding area on which a molded object is placed and a position reference part that serves as a position reference for the mounting member; a first discharge unit having a first discharge head for discharging a structural fluid constituting the structure of the molded object onto an object on the molding area; a second discharge unit having a second discharge head for discharging a conductive fluid constituting a conductor onto the object; a coating unit having a coating head for coating a liquid onto the object; and an inspection unit having an inspection area for receiving droplets discharged from a molding unit including one or more of the first discharge unit, the second discharge unit, and the coating unit, and an inspection reference part that serves as a reference position for the inspection unit, the method comprising the step of setting the origin position used by the molding unit in the molding area using an inspection position relationship between the position of the droplets received in the inspection area and the inspection reference part, and a mounting unit position relationship between the inspection reference part and the position of the mounting member based on the position reference part.

17. A mounting method used in a mounting device of a manufacturing system, which includes a three-dimensional molding apparatus for molding an object and a mounting device for mounting parts onto an object, and which comprises a mounting area for mounting an object, a mounting unit for mounting parts onto an object placed on the mounting area of ​​a mounting member having a molding area for mounting an object, a mounting unit for mounting parts onto an object placed on the molding area of ​​a mounting member, and a mounting imaging unit for imaging the mounting member, the mounting method being executed by a computer, and comprising the steps of: acquiring reference information from the three-dimensional molding apparatus, including a reference position relationship between the conductive reference part of a reference body having a base formed by discharging a structural fluid into the base and a conductive reference part formed by discharging a conductive fluid into the base, and the position reference part on the mounting member; correcting the placement position of the part using the position of the position reference part obtained using an image of the mounting member captured by the mounting imaging unit and the acquired reference information, and causing the mounting unit to place the part onto the object.

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