Power supply module, power supply system, and electronic device

Abstract

The present application relates to a power supply module, a power supply system, and an electronic device. The power supply module comprises a substrate and an integrated inductor; the integrated inductor is electrically connected to the substrate, and the integrated inductor comprises a magnetic core and at least two phases of windings; the magnetic core is arranged on the substrate, and the at least two phases of windings are spaced apart in the magnetic core; the windings include primary windings and secondary windings, the primary windings are coupled to the corresponding secondary windings, and the primary windings are configured to be electrically connected to a computing chip assembly in the power supply system; and the secondary windings of the at least two phases of windings are connected in series. The power supply module of the present application has good transient performance, can ensure fast response to voltage changes, and has a high current density, so that the power supply module has high regulation efficiency and stability, ensures safe and stable operation of electric devices, and can simultaneously meet transient requirements and current density requirements of a computing chip assembly in the power supply system for a power supply.

Description

A power module, power supply system and electronic equipment

[0001] This application claims priority to Chinese Patent Application No. 202411419595.4, filed on October 11, 2024, entitled "A Power Supply Module, Power Supply System and Electronic Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of power supply technology, specifically to a power supply module, power supply system, and electronic equipment. Background Technology

[0003] With the rapid growth of computing power in data centers, the area and power consumption of chips in electronic devices are constantly increasing, thus placing extremely high demands on the dynamic performance and current density of chip voltage regulator modules (VRMs). In related technologies, multiphase power supplies are widely used in high-power and high-current applications, and existing chip VRM power supply solutions generally adopt multiphase buck power supplies. A multiphase buck power supply is a step-down power supply, typically composed of power switching elements and inductors, capable of converting higher DC voltages into stable, lower voltage outputs to meet the power supply needs of different circuits. The multiphase buck topology has a very simple circuit, facilitating the design of magnetic components such as inductors. Related processes and control technologies are mature, resulting in high efficiency and the ability to provide high current output while exhibiting low current ripple. However, the inductance selection of a multiphase buck power supply can easily affect the circuit's performance and stability. Due to the influence of efficiency and ripple, the inductance of a multiphase buck power supply is difficult to reduce; therefore, its transient performance cannot meet the continuously increasing dynamic demands of computing chips.

[0004] Application content

[0005] In view of this, this application provides a power module, a power supply system, and an electronic device to solve the problem of low transient performance of power modules in the prior art.

[0006] A first aspect of this application provides a power module including a substrate and an integrated inductor. The integrated inductor is electrically connected to the substrate. The integrated inductor includes a magnetic core and at least two phase windings. The magnetic core is disposed on the substrate, and the at least two phase windings are spaced apart within the magnetic core. Each winding includes a primary winding and a secondary winding, and the primary winding and the secondary winding are coupled together. The primary winding is used for electrical connection with a computing chip component in a power supply system, and the secondary windings of the at least two phase windings are connected in series.

[0007] In this application, the primary winding of each phase winding serves as the output inductor of the power module. One end of the primary winding is electrically connected to the computing chip assembly, providing the output voltage to the computing chip assembly. The secondary windings of each phase winding are connected in series and can be connected in series with a compensation inductor to form a compensation inductor circuit. This compensation inductor circuit is coupled to all phase circuits, and the secondary windings of each phase winding are connected in series, so that the current ripple of each phase circuit is superimposed and reflected in the output voltage, thereby rapidly increasing the transient current response speed and improving the transient performance of the power module. In addition, in this embodiment, the multi-phase windings are magnetically integrated together through a single magnetic core to form an integrated inductor, which reduces the overall volume of the inductor within the power module, thereby increasing the current density of the power module. Therefore, the power module of this application has good transient performance, ensuring rapid response to voltage changes while having a high current density, giving the power module high regulation efficiency and stability, ensuring the safe and stable operation of electrical equipment, and simultaneously meeting the transient and current density requirements of the computing chip assembly in the power supply system.

[0008] In one possible design, the magnetic core is a one-piece molded structure, which can further reduce the number of manufacturing steps, improve manufacturing efficiency, reduce costs, and further reduce assembly gaps and the overall volume of magnetic components in the power module.

[0009] In one possible design, the magnetic core includes at least two core components, each core component forming an inductor component with one phase of the winding. The core components of two adjacent inductor components are interconnected, allowing the overall shape of the integrated inductor to be matched and designed according to actual needs, thus improving the design freedom of the integrated inductor.

[0010] In one possible design, the magnetic core has a groove on the side surface near the substrate, and the power module further includes a capacitor that is electrically connected to the substrate and is at least partially located within the groove.

[0011] In this structure, after the magnetic core 21 is connected to the substrate 1, a clearance space is formed between the magnetic core 21 and the substrate 1 at the position of the groove 213, so that at least part of the blocking device 4 on the substrate 1 can be located in the clearance space formed by the groove 213, thereby improving the space utilization rate on the substrate 1. In addition, this structure can increase the surface area of ​​the side of the magnetic core 21 away from the substrate 1, thereby increasing the heat dissipation area of ​​the magnetic core 21 and improving the heat dissipation efficiency of the power module 10.

[0012] In one specific embodiment, the substrate is provided with a first pin and a second pin, and the primary winding includes a voltage input terminal and a voltage output terminal. The voltage input terminal is electrically connected to the first pin, and the voltage output terminal is electrically connected to the second pin, thereby facilitating the electrical connection between the power module and the first circuit board in the power supply system.

[0013] In one possible design, the integrated inductor is disposed on one side surface of the substrate, and the first pin and the second pin are disposed on the side surface of the substrate opposite to the integrated inductor.

[0014] The structure is simple and allows the input and output voltages to be input or output along one side surface of the power module, facilitating electrical connection between the power module and other components in the power supply system.

[0015] In one possible design, the integrated inductor is embedded within the substrate, and the first pin and the second pin are disposed on the surface of the substrate.

[0016] In this structure, the integrated inductor is embedded inside the substrate, which can improve the protection of the integrated inductor and facilitate the connection between the primary winding and the first and second pins. This is beneficial for the integration and miniaturization of the power module, thus making it easier to arrange multiple power modules on the first circuit board or capacitor board of the power supply system.

[0017] In one possible design, the substrate includes a first plate and a second plate, which are electrically connected. Along the thickness direction of the power module, the first plate and the second plate are disposed on opposite sides of the integrated inductor. The first plate is provided with the first pin, and the second plate is provided with the second pin.

[0018] This structure enables the input and output voltages to be input or output along opposite sides of the power module in the thickness direction, making it easier for the power module to be stacked with other components in the thickness direction in vertical power supply scenarios, thereby further improving the current density of the power module.

[0019] In one possible design, the primary winding includes a first segment, a second segment, and a third segment. One end of the second segment is connected to the first segment, and the other end of the second segment is connected to the third segment. The first segment is provided with the voltage input terminal, and the third segment is provided with the voltage output terminal. Along the thickness direction of the power module, the first segment and the third segment are located on the same side of the second segment.

[0020] When the primary winding of this structure has a first pin and a second pin on the same side surface of the substrate, it is convenient to connect the voltage input terminal of the primary winding to the first pin, and also convenient to connect the voltage output terminal of the primary winding to the second pin.

[0021] In one possible design, the primary winding includes a first segment, a second segment, and a third segment. One end of the second segment is connected to the first segment, and the other end of the second segment is connected to the third segment. The first segment is provided with the voltage input terminal, and the third segment is provided with the voltage output terminal. Along the thickness direction of the power module, the first segment and the third segment are located on opposite sides of the second segment.

[0022] When the primary winding of this structure has a first pin and a second pin respectively provided on opposite sides of the substrate, it is convenient to connect the voltage input terminal of the primary winding to the first pin, and also convenient to connect the voltage output terminal of the primary winding to the second pin.

[0023] In one possible design, the primary winding and the secondary winding are stacked along the thickness direction of the power module.

[0024] The stacked arrangement of the primary and secondary windings can reduce the horizontal size of the integrated inductor in the first or second direction, which is more conducive to the miniaturization design of the power supply module.

[0025] In one possible design, the primary winding and the secondary winding are arranged along a first direction of the power module, which is perpendicular to the thickness direction of the power module.

[0026] The primary and secondary windings are arranged along the first direction, which facilitates the sequential arrangement of multiphase windings in the magnetic core and reduces the difficulty of manufacturing integrated inductors.

[0027] In one possible design, the at least two-phase winding includes a first winding and a second winding. The first winding includes a first secondary winding, which includes a first connection terminal and a second connection terminal. The second winding includes a second secondary winding, which includes a third connection terminal and a fourth connection terminal. The substrate is provided with a third pin, a fourth pin, a fifth pin, and a sixth pin. The third pin is electrically connected to the first connection terminal, the fourth pin is electrically connected to the second connection terminal, the fifth pin is electrically connected to the third connection terminal, and the sixth pin is electrically connected to the fourth connection terminal. The first connection terminal is electrically connected to a compensation inductor, a reference ground, or an adjacent power module in the power supply system through the third pin. The second connection terminal and the third connection terminal are electrically connected on a first circuit board or capacitor board in the power supply system through the fourth and fifth pins. The fourth connection terminal is electrically connected to a compensation inductor, a reference ground, or another adjacent power module in the power supply system through the sixth pin.

[0028] This structure facilitates the series connection of the secondary windings of each phase of each power module in the power supply system to form a compensating inductor circuit. This rapidly increases the transient current response speed of each power module in the power supply system, thereby improving the transient performance of the power module. Specifically, the secondary windings of each winding in the power module can be connected in series on the first circuit board or capacitor board in the power supply system, facilitating unified electrical connection of each power module within the power supply system and improving manufacturing yield.

[0029] In one possible design, the at least two-phase winding includes a first winding and a second winding. The first winding includes a first secondary winding, which includes a first connection terminal and a second connection terminal. The second winding includes a second secondary winding, which includes a third connection terminal and a fourth connection terminal. The substrate is provided with a seventh pin and an eighth pin. The seventh pin is electrically connected to the first connection terminal, and the eighth pin is electrically connected to the fourth connection terminal. The first connection terminal is electrically connected to a compensation inductor, a reference ground, or an adjacent power module in the power supply system through the seventh pin. The substrate is provided with a connection circuit. The second connection terminal and the third connection terminal are electrically connected through the connection circuit. The fourth connection terminal is electrically connected to a compensation inductor, a reference ground, or another adjacent power module in the power supply system through the eighth pin.

[0030] This structure facilitates the series connection of the secondary windings of multiple power modules in a power supply system to form a compensating inductor circuit. This rapidly increases the transient current response speed of each power module in the power supply system, thereby improving the transient performance of the power module. The secondary windings of each winding in the power module can be connected in series on the substrate within the power module, thus improving the installation efficiency of the power module in the power supply system.

[0031] A second aspect of this application provides a power supply system comprising a first circuit board, a computing chip assembly, and a power module. The computing chip assembly is disposed on one surface of the first circuit board. The power module is the power module described in any of the above embodiments. The power module is disposed on the first circuit board and electrically connected to the computing chip assembly, for providing a power supply voltage to the computing chip assembly. Since the power module has the aforementioned technical effects, the power supply system including this power module should also possess corresponding technical effects, which will not be elaborated further here.

[0032] In one possible design, the computing chip assembly, the first circuit board, and the power module are stacked sequentially along the thickness direction of the power module.

[0033] This structure can further improve the current density of the power module and reduce the space occupied by the power module on the first circuit board, which is beneficial to the miniaturization design of the power supply system.

[0034] In one possible design, the power supply system further includes an input power supply for providing an input voltage to the power module; the input power supply is disposed on the surface of the first circuit board, and along the thickness direction of the power module, the power module has a first pin and a second pin on the side closer to the first circuit board, the first pin being electrically connected to the input power supply, and the second pin being electrically connected to the computing chip assembly.

[0035] This structure is simple, facilitates the electrical connection of each component, and can further improve the current density of the power supply module, which is beneficial to the miniaturization design of the power supply system.

[0036] In one possible design, the power supply system further includes an input power supply and a second circuit board. The second circuit board is disposed on the side of the power module away from the first circuit board. The input power supply is disposed on the second circuit board and is used to provide an input voltage to the power module. Along the thickness direction of the power module, a first pin is disposed on the side of the power module away from the first circuit board, and a second pin is disposed on the side of the power module close to the first circuit board. The first pin is electrically connected to the input power supply, and the second pin is electrically connected to the computing chip assembly.

[0037] This structure facilitates the input power supply to the power module and the power module to supply power to the computing chip components. Furthermore, this structure enhances the stacking effect of the power supply system, allowing some input capacitors and other resistors and capacitors to be surface-mounted or embedded on the second circuit board. This reduces the horizontal dimensions of the power supply system in the first and / or second directions, further increasing the current density and promoting system integration.

[0038] In one possible design, the power module and the computing chip assembly are each independently connected to one side of the first circuit board, which is simple in structure and facilitates the soldering of each component on the first circuit board.

[0039] A third aspect of this application provides an electronic device that includes the power supply system described in any of the above embodiments. Since the power supply system has the aforementioned technical effects, the electronic device including this power supply system should also possess the corresponding technical effects, and therefore, no limitation is made herein.

[0040] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0041] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 is a structural block diagram of a power supply system provided in this application;

[0043] Figure 2 is a circuit diagram of the power module provided in this application in a specific embodiment;

[0044] Figure 3 is an exploded view of the power supply provided in this application in a specific embodiment;

[0045] Figure 4 is a circuit diagram of a power module provided in this application;

[0046] Figure 5 is a cross-sectional view of an integrated inductor in the power module provided in this application.

[0047] Figure 6 is a schematic cross-sectional view of another integrated inductor in the power module provided in this application;

[0048] Figure 7 is a cross-sectional view of the power module provided in this application in a specific embodiment;

[0049] Figure 8 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0050] Figure 9 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0051] Figure 10 is a schematic diagram of the power supply system provided in this application in a specific embodiment;

[0052] Figure 11 is a schematic diagram of the power supply system provided in this application in another specific embodiment;

[0053] Figure 12 is a partial structural schematic diagram of the power supply system provided in this application;

[0054] Figure 13 is a schematic diagram of the power supply system provided in this application in another specific embodiment;

[0055] Figure 14 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0056] Figure 15 is a schematic diagram of the power supply system provided in this application in another specific embodiment;

[0057] Figure 16 is an exploded view of the integrated inductor in the power module provided in this application in a specific embodiment;

[0058] Figure 17 is an exploded view of the integrated inductor in the power module provided in this application in another specific embodiment;

[0059] Figure 18 is a side cross-sectional view of the integrated inductor in Figure 17;

[0060] Figure 19 is an exploded view of the integrated inductor in the power module provided in this application in another specific embodiment;

[0061] Figure 20 is a side cross-sectional view of the integrated inductor in Figure 19;

[0062] Figure 21 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0063] Figure 22 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0064] Figure 23 is a schematic diagram of a connection of the secondary winding in the power supply system provided in this application;

[0065] Figure 24 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0066] Figure 25 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0067] Figure 26 is a schematic diagram of another connection of the secondary winding in the power supply system provided in this application;

[0068] Figure 27 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0069] Figure 28 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0070] Figure 29 is a cross-sectional view of the power module provided in this application in another specific embodiment;

[0071] Figure 30 is a cross-sectional view of the power module provided in this application in a specific embodiment.

[0072] Reference numerals: 100-Power supply system; 10-Power module; 1-Baseboard; 11-First pin; 12-Second pin; 13-Third pin; 14-Fourth pin; 15-Fifth pin; 16-Sixth pin; 17-Seventh pin; 18-Eighth pin; 19a-First board; 19b-Second board; 19c-Connection circuit; 2-Integrated inductor; 21-Magnetic core; 211-First magnetic core component; 212-Second magnetic core component; 213-Groove; 22-Winding; 221-Primary winding; 221a-First segment; 221b-Second segment; 221c-Third segment; 222-Secondary winding; 23-First winding; 231-First secondary winding; 231a-First connection terminal; 231b-Second connection terminal; 232-First primary winding; 24-Second winding; 241-Second secondary winding; 241a-Third connection terminal; 241b-Fourth connection terminal; 242-Second primary winding; 3-Power chip; 4-Rack and capacitor components; 6-Connector; 7-Compensating inductor; 20-First circuit board; 30-Computing chip assembly; 40-Input power supply; 50-Second circuit board; 60-Capacitor board; 601-Output capacitor; 70-Input capacitor; 80-Controller; 90a-Current sampling circuit; 90b-Voltage sampling circuit; X-First direction; Y-Second direction; Z-Thickness direction.

[0073] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0074] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0075] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0076] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0077] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0078] With the rapid growth of data center computing power, the area and power consumption of chips in electronic devices are constantly increasing, thus placing extremely high demands on the dynamic performance and current density of chip voltage regulator modules (VRMs). In related technologies, multiphase power supplies are widely used in high-power and high-current applications, and existing chip VRM power supply solutions generally adopt multiphase buck power supplies. A multiphase buck power supply is a step-down power supply, typically composed of power switching elements and inductors, capable of converting higher DC voltages into stable, lower voltage outputs to meet the power supply needs of different circuits. The multiphase buck topology circuit is very simple, facilitating the design of magnetic components such as inductors. Related processes and control technologies are mature, resulting in high efficiency and the ability to provide high current output while exhibiting low current ripple. However, the inductance selection of a multiphase buck power supply can easily affect the circuit's performance and stability. Due to the influence of efficiency and ripple, the inductance of a multiphase buck power supply is difficult to reduce, resulting in poor transient performance and an inability to meet the continuously growing dynamic demands of computing chips.

[0079] In other related technologies, chip VRM power supply solutions can also adopt a Trans-Inductor Voltage Regulator (TLVR) structure. TLVR power supplies can effectively reduce transient inductance and increase steady-state inductance, and utilize compensating inductor loops for coupling. The coupling coefficient of each phase circuit is highly consistent, facilitating the expansion of the number of coupled phases. Typically, TLVR power supply solutions are built using discrete components and are used in horizontal power supply scenarios. In a TLVR power supply circuit, each phase is connected to a transformer, and multiple phases are coupled together to form a loop through compensating inductors. The transformer is an inductor with primary and secondary windings. Therefore, although TLVR power supplies have good dynamic performance, the size of inductors and other magnetic components is relatively large, and the overall current density of the power supply solution is low, which cannot meet the continuously increasing current density requirements of computing chips.

[0080] In view of this, this application provides a power supply module to simultaneously improve the dynamic performance and current density of the power supply module. This power supply module can be applied in the power supply system of electronic devices, wherein the electronic devices can be ICT equipment or data center board-level DC-DC power supply modules used in the field of Information and Communication Technology (ICT), or can be mobile phones, tablets, desktop computers, laptops, handheld computers, notebook computers, ultra-mobile personal computers (UMPCs), netbooks, as well as cellular phones, personal digital assistants (PDAs), augmented reality (AR) devices, virtual reality (VR) devices, artificial intelligence (AI) devices, wearable devices, in-vehicle devices, smart home devices, supercomputing servers, antennas, routers, and / or smart city devices, etc. The embodiments of this application do not impose special limitations on the specific type of electronic device.

[0081] Please refer to Figure 1, which is a structural block diagram of a power supply system provided in this application.

[0082] As shown in Figure 1, the power supply system 100 includes an input power supply 40, an input capacitor 70, a power supply module 10, an output capacitor 601, a computing chip assembly 30, a current sampling circuit 90a, a voltage sampling circuit 90b, and a controller 80.

[0083] The computing chip component 30 can be a microprocessor unit such as a central processing unit (CPU), a graphics processing unit (GPU), a neural network processing unit (NPU), an application specific integrated circuit (ASIC), or a field programmable gate array (FPGA), and may also include components such as heat dissipation devices connected to the microprocessor unit, without limitation.

[0084] The input power supply 40 is used to provide input voltage to the power supply module 10.

[0085] The input capacitor 70 and the output capacitor 601 filter the input voltage and output voltage of the power module 10, respectively, to make the voltage input to the computing chip component 30 more stable.

[0086] Voltage sampling circuit 90b and current sampling circuit 90a respectively collect the output voltage of power module 10 and the output current of each phase, and feed the collected data back to controller 80 to generate corresponding control signals, thereby driving each phase circuit of power module 10.

[0087] Please refer to Figure 2, which is a circuit diagram of the power module provided in this application in a specific embodiment. The power module 10 has a length direction, a width direction, and a thickness direction Z. For ease of understanding, the length direction of the power module 10 is defined as the first direction X, and the width direction of the power module 10 is defined as the second direction Y.

[0088] As shown in Figure 2, the power module 10 includes a substrate 1 and an integrated inductor 2, which is electrically connected to the substrate 1. A resistor-capacitor component 4 may also be surface-mounted on the substrate 1. This component 4 can be an input capacitor or an output capacitor to reduce the space occupied by the input and output capacitors on the first circuit board of the power supply system. Of course, the resistor-capacitor component 4 can also be other resistors and capacitors disposed around the chip; the specific configuration can be determined according to actual needs and is not limited here.

[0089] Please refer to Figure 3, which is an exploded view of the power supply provided in this application in a specific embodiment. In the embodiment shown in Figure 3, the power supply module 10 is illustrated using a two-phase winding 22 as an example. Those skilled in the art will understand that in other embodiments, the power supply module 10 may also include more phases than those shown in Figure 3.

[0090] As shown in Figure 3, the integrated inductor 2 includes a magnetic core 21 and at least two phase windings 22. The magnetic core is disposed on the substrate 1, and the at least two phase windings 22 are disposed within the magnetic core 21. Each phase winding 22 includes a primary winding 221 and a secondary winding 222, and the primary winding 221 and the secondary winding 222 are coupled together.

[0091] Please refer to Figure 4, which is a circuit diagram of a power module provided in this application.

[0092] As shown in Figure 4, the primary winding 221 of each phase winding 22 serves as the output inductor of the power module 10. One end of the primary winding 221 is electrically connected to the computing chip assembly and provides the output voltage Vout to the computing chip assembly. The other end of the primary winding 221 is connected to the switching transistor of the controller, which is coupled to the input voltage Vin. The control signal generated by the controller drives the corresponding switching transistor to control each phase circuit. The secondary windings 222 of each phase winding 22 are connected in series and can be connected in series with the compensation inductor 7 to form a compensation inductor loop. This compensation inductor loop is coupled to all phase circuits, and the secondary windings 222 of each phase winding 22 are connected in series, so that the current ripple of each phase circuit is superimposed and reflected in the output voltage Vout, thereby rapidly increasing the transient current response speed and improving the transient performance of the power module 10.

[0093] In addition, compared with the separate inductors of each phase in the related technology TLVR power supply, which have a large assembly gap, the volume of magnetic components in the TLVR power supply will be further increased, thereby reducing the current density of the TLVR power supply. In the embodiment of this application, the multi-phase winding 22 is magnetically integrated together with a magnetic core 21 to form an integrated inductor 2, which can reduce the overall volume of the inductor in the power module 10, thereby increasing the current density of the power module 10.

[0094] Therefore, the power module 10 of this application has good transient performance, which can ensure rapid response to voltage changes, and at the same time has high current density, which makes the power module 10 have high regulation efficiency and stability, ensuring the safe and stable operation of electrical equipment, and can simultaneously meet the transient power requirements and current density requirements of the computing chip components in the power supply system.

[0095] In the above embodiments, the integrated inductor 2 can be achieved by assembling the magnetic core 21 and the winding 22, co-firing copper and iron, integral molding, or through magnetic encapsulation. Specifically, the material of the magnetic core 21 can be ferrite or other metallic magnetic materials, which are not limited here.

[0096] Please refer to Figure 5, which is a cross-sectional view of an integrated inductor in the power module provided in this application.

[0097] In one specific embodiment, the magnetic core 21 can be a one-piece molded structure. As shown in the specific embodiment in FIG5, the two-phase windings 22 are coupled together through a magnetic core 21 to form an integrated inductor 2, thereby further reducing the manufacturing steps, improving manufacturing efficiency, reducing costs, and further reducing assembly gaps and the overall volume of magnetic components in the power module 10.

[0098] Please refer to Figure 6, which is another cross-sectional view of the integrated inductor in the power module provided in this application.

[0099] In another specific embodiment, the magnetic core 21 includes at least two magnetic core components, each magnetic core component forming an inductor component with a phase winding 22, and the magnetic core components of two adjacent inductor components are interconnected. In the specific embodiment shown in FIG6, the two-phase integrated inductor 2 includes two inductor components, wherein the first magnetic core component 211 forms an inductor component with a phase winding 22, and the second magnetic core component 212 forms another inductor component with another phase winding 22. The first magnetic core component 211 and the second magnetic core component 212 of the two inductor components can be integrated into one unit by means of bonding, snap-fitting, etc., so that the overall shape of the integrated inductor 2 can be matched and designed according to actual needs, improving the design freedom of the integrated inductor 2.

[0100] Of course, the magnetic core 21 of the multiphase winding 22 in the integrated inductor 2 can also be integrated into one unit in other ways. The specific settings can be made according to actual needs, and no restrictions are imposed here.

[0101] Please refer to Figure 7, which is a cross-sectional view of the power module provided in this application in a specific embodiment.

[0102] In one specific embodiment, as shown in FIG7, a groove 213 may be provided on the surface of the magnetic core 21 near the substrate 1. After the magnetic core 21 is connected to the substrate 1, a clearance space is formed between the magnetic core 21 and the substrate 1 at the position of the groove 213. At least part of the blocking device 4 on the substrate 1 can be located in the clearance space formed by the groove 213, thereby improving the space utilization on the substrate 1. Moreover, this structure can increase the surface area of ​​the side of the magnetic core 21 away from the substrate 1, thereby increasing the heat dissipation area of ​​the magnetic core 21 and improving the heat dissipation efficiency of the power module 10.

[0103] The groove 213 can be provided in one or more ways. For example, as shown in FIG7, there can be two or more grooves 213, which can be located at the edge of the substrate 1 to facilitate the mounting of the retaining component 4. For example, there can also be only one groove 213 at its edge. The number of grooves 213 can be set according to specific needs and is not limited here.

[0104] Furthermore, the groove 213 may penetrate at least one side surface of the magnetic core 21 to further facilitate the installation of the blocking component 4. Exemplarily, as shown in FIG7, the groove 213 may be a through slot penetrating two opposite sides of the magnetic core 21 along the second direction Y and one side along the first direction X; exemplarily, the groove 213 may also penetrate only one side of the magnetic core 21 along the first direction X or the second direction; exemplarily, the groove 213 may also penetrate two adjacent sides. Of course, the groove 213 may also have other configurations, for example, the groove 213 may not penetrate the side surface of the magnetic core 21, as long as at least a portion of the blocking component 4 can be located within the groove 213. The specific configuration can be determined according to actual needs and is not limited here.

[0105] In addition, the side cross-sectional shape of the groove 213 can be rectangular, trapezoidal, semi-circular, etc., to further enhance the design freedom of the power module 10. The specific design can be set according to actual needs and is not limited here.

[0106] Please refer to Figure 8, which is a cross-sectional view of the power module provided in this application in another specific embodiment.

[0107] As shown in Figure 8, the power module 10 also includes a power chip 3 for regulating the voltage output, so that the power module 10 can provide a stable and appropriate operating voltage for the computing chip components in the power supply system. The number of power chips 3 can be one, two or more, or can be chips from other power devices. The specific setting can be determined according to actual needs and is not limited here.

[0108] The power chip 3 can be embedded inside the substrate 1 to form an embedded chip package (ECP) structure, which improves the protection of the power chip 3 and reduces the overall thickness of the power module 10, thus facilitating the miniaturization design of the power module 10. Simultaneously, some resistors and capacitors 4 can also be embedded in the substrate 1, further reducing the space occupied by input capacitors and / or output capacitors on the first circuit board of the power supply system.

[0109] As shown in Figure 8, the substrate 1 is provided with a first pin 11 and a second pin 12. The primary winding 221 includes a voltage input terminal and a voltage output terminal. The voltage input terminal is electrically connected to the first pin 11, and the voltage output terminal is electrically connected to the second pin 12, thereby facilitating the electrical connection between the power module 10 and the first circuit board in the power supply system.

[0110] In one specific embodiment, as shown in FIG8, along the thickness direction Z of the power module 10, the integrated inductor 2 can be surface-mounted on one side surface of the substrate 1, and the first pin 11 and the second pin 12 are disposed on the side surface of the substrate 1 opposite to the integrated inductor 2. This structure is simple and enables the input voltage Vin and the output voltage Vout to be input or output along one side surface of the power module 10, which facilitates the power module 10 to be electrically connected to other components in the power supply system.

[0111] Please refer to Figure 9, which is a cross-sectional view of the power module provided in this application in another specific embodiment.

[0112] In another specific embodiment, as shown in FIG9, the integrated inductor 2 can also be embedded in the substrate 1, and the first pin 11 and the second pin 12 can be disposed on the surface of the substrate 1. In this structure, the integrated inductor 2 is embedded inside the substrate 1, which can improve the protection of the integrated inductor 2 and facilitate the connection between the primary winding 221 and the first pin 11 and the second pin 12. This is beneficial to the integrated and miniaturized design of the power module 10, thereby facilitating the arrangement of multiple power modules 10 on the first circuit board or capacitor board of the power supply system.

[0113] Furthermore, as shown in Figure 9, the first pin 11 and the second pin 12 can be disposed on one side surface of the substrate 1, so that the input voltage Vin and the output voltage Vout are input or output along one side surface of the power module 10, which facilitates the power module 10 to be electrically connected to other components in the power supply system.

[0114] As shown in Figure 9, the resistive capacitor 4 and the power chip 3 can be surface-mounted on the side of the substrate 1 facing away from the first pin 11 and the second pin 12, so that the integrated inductor 2 can be embedded in the substrate 1. Connectors 6, such as copper pillars, copper blocks, connecting wires, or metallized vias, can be provided in the substrate 1, so that the surface-mount resistive capacitor 4 and the power chip 3 can be electrically connected to the reference ground, the first pin 11, the second pin 12, or other power or signal pins through the connectors 6. Of course, some of the power chip 3 and the resistive capacitor 4 can also be embedded in the substrate 1 to further reduce the size of the power module 10. The specific design can be made according to actual needs and is not limited here.

[0115] Specifically, as shown in Figure 9, in the power module 10, the reference ground, the connection pin of the secondary winding 222, and other power or signal pins can be disposed on the same side surface of the substrate 1 as the first pin 11 and the second pin 12, so that the power module 10 can be electrically connected to other components on the first circuit board of the power supply system, and the connection reliability of the power module 10 in the power supply system can also be improved.

[0116] Of course, in the power module 10, the reference ground, the connection pin of the secondary winding 222, and other power or signal pins may not all be located on the same side surface of the substrate 1 as the first pin 11 and the second pin 12, thereby increasing the design freedom of the power module 10. The specific settings can be made according to actual needs, and no restrictions are imposed here.

[0117] Please refer to Figure 10, which is a schematic diagram of the power supply system provided in this application in a specific embodiment.

[0118] As shown in Figure 10, when the first pin 11 and the second pin 12 of the power module 10 are disposed on one side surface of the substrate 1, the power module 10 can be used in a power supply system in a vertical power supply scenario or in a power supply system in a horizontal power supply scenario. The power supply system 100 includes a first circuit board 20, an input power supply 40, a computing chip assembly 30, a capacitor plate 60 composed of multiple output capacitors 601, an input capacitor 70, and the power module 10 electrically connected to the first circuit board 20.

[0119] The first circuit board 20 can be a printed circuit board (PCB), a flexible printed circuit board (FPC), or a rigid-flex board, etc., and there are no restrictions on it.

[0120] In one specific embodiment, as shown in FIG10, when the power module 10 is applied to the power supply system 100 in a vertical power supply scenario, the chip assembly 30, the first circuit board 20 and the power module 10 are stacked sequentially along the thickness direction Z of the power module 10, thereby further improving the current density of the power module 10 and reducing the space occupied by the power module 10 on the first circuit board 20, which is beneficial to the miniaturization design of the power supply system 100.

[0121] In the specific embodiment shown in Figure 10, the power module 10 has a first pin and a second pin on the side near the first circuit board 20. The input power supply 40 can be disposed on the surface of the first circuit board 20. The input power supply 40 is electrically connected to the power module 10 on the first circuit board 20 through the first pin to provide an input voltage Vin to the power module 10. The power module 10 is electrically connected to the computing chip assembly 30 through the second pin to provide a suitable power supply voltage to the computing chip assembly 30 through an output voltage Vout. This structure is simple, facilitates the electrical connection of various components, and can further improve the current density of the power module 10, which is beneficial for the miniaturization design of the power supply system.

[0122] As shown in Figure 10, the input capacitor 70 and other resistive components can be surface-mounted on the first circuit board 20. A capacitor board 60 composed of multiple output capacitors 601 can also be placed between the first circuit board 20 and the power module 10 to further reduce the space occupied by the resistive components on the first circuit board 20.

[0123] In the power supply system 100, there may be one, two or more power modules 10. The specific configuration can be set according to actual needs and is not limited here.

[0124] For example, as shown in FIG10, a power supply module 10 is provided in the power supply system 100 to reduce the structural complexity of the power supply module 10.

[0125] For example, please refer to Figure 11, which is a schematic diagram of the power supply system provided in this application in another specific embodiment. As shown in Figure 11, in the power supply system 100, there may be two or more power modules 10. The two or more power modules 10 are arranged sequentially on the capacitor plate 60 or the first circuit board 20 along the first direction X and / or the second direction Y to further improve the voltage regulation effect in the power supply system 100.

[0126] Please refer to Figure 12, which is a partial structural schematic diagram of the power supply system provided in this application. As shown in Figure 12, in addition to the resistor-capacitor component 4 disposed on the substrate 1 of the power module 10, when the power module 10 is used in a power supply system 100 in a vertical power supply scenario, the power module 10 can be stacked and integrated with the capacitor board 60 to further improve the integration of the power supply system 100. Of course, the power module 10 and the capacitor board 60 can also be disposed separately on the circuit board to reduce the overall thickness of the power supply system 100 in the thickness direction Z. The specific configuration can be determined according to actual needs and is not limited here.

[0127] In another specific embodiment, please refer to Figure 13, which is a schematic diagram of the power supply system provided in this application in another specific embodiment. As shown in Figure 10, when the power module 10 is applied to the power supply system 100 in a horizontal power supply scenario, the power module 10 and the computing chip assembly 30 are independently connected to one side surface of the first circuit board 20. The power module 10 and the computing chip assembly 30 are separately arranged on the surface of the first circuit board 20, which is simple in structure and facilitates the soldering of each component on the first circuit board 20.

[0128] As shown in Figure 13, the capacitor board 60, which consists of the input power supply 40, the input capacitor 70, and the output capacitor 601, can also be set separately from the power supply module 10 and the computing chip assembly 30 on the first circuit board 20 to further reduce the structural complexity of the power supply system 100.

[0129] Furthermore, at least some of the input capacitors 70 and / or capacitor plates 60 can be disposed on opposite sides of the first circuit board 20, respectively, with the power supply module 10, to improve the integration of the power supply system 100. Of course, the capacitor plates 60 can also be stacked and integrated with the power supply module 10, and the specific configuration can be determined according to actual needs, without limitation here.

[0130] Please refer to Figure 14, which is a cross-sectional view of the power module provided in this application in another specific embodiment.

[0131] As shown in Figure 14, in one specific embodiment, the substrate 1 includes a first plate 19a and a second plate 19b, which are electrically connected. Along the thickness direction Z of the power module 10, the first plate 19a and the second plate 19b are disposed on opposite sides of the integrated inductor 2. The first plate 19a is provided with a first pin 11, and the second plate 19b is provided with a second pin 12. This allows the input voltage Vin and the output voltage Vout to be input or output along opposite sides of the power module 10 in the thickness direction Z, facilitating the stacking of the power module 10 with other components in a vertical power supply scenario, thereby further improving the current density of the power module 10.

[0132] As shown in Figure 14, some of the resistors and capacitors 4 and the power chip 3 can be embedded in the first board 19a to form an embedded chip package (ECP) structure, which improves the protection of the power chip 3 and reduces the overall thickness of the power module 10, thus facilitating the miniaturization design of the power module 10. Other resistors and capacitors 4 can also be surface-mounted on the side of the first board 19a where the integrated inductor 2 is located, thereby fully utilizing the space between the first board 19a and the second board 19b, which is beneficial for the integrated design of the power module 10.

[0133] Furthermore, as shown in Figure 14, the first board 19a and the second board 19b can be electrically connected by a connector 6, such as a copper pillar, copper block, connecting wire or metallized via, so that the surface-mount resistor and capacitor 4 and the power chip 3 can be electrically connected to the reference ground, the first pin 11, the second pin 12 or other power or signal pins through the connector 6.

[0134] In this process, epoxy resin, PP and other materials can be filled into the gap between the first plate 19a and the second plate 19b, so that the first plate 19a, connector 6, second plate 19b, integrated inductor 2 and surface-mount resistor and capacitor 4 are molded together to form a whole, thereby improving the structural stability of the power module 10.

[0135] Furthermore, as shown in Figure 14, in the power module 10, the reference ground, the connection pin of the secondary winding 222, and other power or signal pins can be jointly disposed on the second board 19b with the second pin 12, so that the power module 10 can be electrically connected to other components on the first circuit board of the power supply system.

[0136] Of course, the reference ground, the connection pin of the secondary winding 222, and other power or signal pins in the power module 10 can also be configured in other ways on the first board 19a or the second board 19b, thereby increasing the design freedom of the power module 10. The specific settings can be made according to actual needs, and no restrictions are imposed here.

[0137] Please refer to Figure 15, which is a schematic diagram of the power supply system provided in this application in another specific embodiment.

[0138] As shown in Figure 15, in the power supply system 100 of the vertical power supply scenario, when the first pin 11 and the second pin 12 of the power module 10 are disposed on opposite sides of the substrate 1, that is, along the thickness direction Z of the power module 10, the power module 10 has a first pin on the side away from the first circuit board 20 and a second pin on the side of the power module 10 close to the first circuit board 20, the power supply system 100 can also be provided with a second circuit board 50. The second circuit board 50 can be electrically connected to the side of the power module 10 away from the first circuit board 20. At the same time, the input power supply 40 can also be disposed on the second circuit board 50, so that the input power supply 40 can easily provide input voltage to the power module 10, and also facilitate the power module 10 to provide power supply voltage to the computing chip assembly 30. Furthermore, this structure can further enhance the stacking effect of the power supply system 100, allowing some input capacitors 70 and other resistors and capacitors to be surface-mounted or embedded on the second circuit board 50, shortening the horizontal dimension of the power supply system 100 in the first direction X and / or the second direction Y, further increasing the current density in the power supply system 100, which is beneficial to the integration of the power supply system 100.

[0139] The second circuit board 50 can be a printed circuit board (PCB), a flexible printed circuit board (FPC), or a rigid-flex board, etc., and there are no restrictions on it.

[0140] Of course, when the first pin 11 and the second pin 12 of the power module 10 are disposed on opposite sides of the substrate 1, it can also be applied in the scenario of horizontal power supply. That is, the power module 10, the capacitor board 60 and the computing chip assembly 30 can also be disposed separately on the first circuit board 20. The specific configuration can be made according to actual needs, and no restrictions are imposed here.

[0141] Please refer to Figure 16, which is an exploded view of the integrated inductor in the power module provided in this application in a specific embodiment.

[0142] In one specific embodiment, as shown in FIG16, in each phase winding 22, the primary winding 221 and the secondary winding 222 can be arranged sequentially along the first direction X or the second direction Y of the power module 10. The structure is simple and facilitates the sequential arrangement of the multi-phase windings 22 in the magnetic core 21, reducing the difficulty of fabricating the integrated inductor 2.

[0143] Please refer to Figure 17, which is an exploded view of the integrated inductor in the power module provided in this application in another specific embodiment.

[0144] In another specific embodiment, as shown in FIG17, in each phase winding 22, the primary winding 221 and the secondary winding 222 can also be stacked along the thickness direction Z of the power module 10, thereby reducing the horizontal dimension of the integrated inductor 2 in the first direction or the second direction Y, which is more conducive to the miniaturization design of the power module 10.

[0145] Please refer to Figure 18, which is a side sectional view of the integrated inductor in Figure 17.

[0146] As shown in Figure 18, the primary winding 221 includes a first segment 221a, a second segment 221b and a third segment 221c. One end of the second segment 221b is connected to the first segment 221a, and the other end of the second segment 221b is connected to the third segment 221c. The first segment 221a is provided with a voltage input terminal, and the third segment 221c is provided with a voltage output terminal.

[0147] In one specific embodiment, as shown in FIG18, along the thickness direction Z of the power module 10, the first segment 221a and the third segment 221c are disposed on the same side of the second segment 221b.

[0148] As shown in Figure 18, in this structure, the voltage input terminal and voltage output terminal of the primary winding 221 are located on the same side of the second segment 221b along the thickness direction Z. This allows the voltage input terminal of the primary winding 221 to be electrically connected to the first pin and the voltage output terminal of the primary winding 221 to be electrically connected to the second pin when the first pin and the second pin are provided on the same side surface of the substrate.

[0149] Please refer to Figures 19 and 20. Figure 19 is an exploded view of the integrated inductor in the power module provided in this application in another specific embodiment, and Figure 20 is a side sectional view of the integrated inductor in Figure 19.

[0150] In another specific embodiment, as shown in Figures 19 and 20, along the thickness direction Z of the power module 10, the first segment 221a and the third segment 221c are located on opposite sides of the second segment 221b.

[0151] As shown in Figure 20, in this structure, the voltage input terminal and voltage output terminal of the primary winding 221 are located on opposite sides of the second segment 221b along the thickness direction Z. This allows the voltage input terminal of the primary winding 221 to be electrically connected to the first pin when the first pin and the second pin are respectively provided on the opposite side surfaces of the substrate. It also facilitates the voltage output terminal of the primary winding 221 to be electrically connected to the second pin.

[0152] The cross-section of the first segment 221a and / or the third segment 221c of the primary winding 221 can be L-shaped as shown in Figure 18 or rectangular as shown in Figure 20. The specific cross-section can be set according to actual needs to facilitate electrical connection between the primary winding 221 and the input power supply and capacitor board; no restrictions are imposed here. Of course, the cross-section of the first segment 221a and / or the third segment 221c of the primary winding 221 can also be set according to actual needs; no restrictions are imposed here.

[0153] It should be noted that, regardless of whether the first segment 221a and the third segment 221c of the primary winding 221 are located on opposite sides of the second segment 221b, or whether the first segment 221a and the third segment 221c are located on the same side of the second segment 221b, the primary winding 221 and the secondary winding 222 can be arranged side by side in sequence along the first direction X or the second direction Y, or stacked in layers along the thickness direction Z. The first pin and the second pin can be located on one side of the power module 10, or they can be located on opposite sides of the power module 10. The specific settings can be made according to actual needs, and no restrictions are imposed here.

[0154] In addition, as shown in FIG20 in the above embodiments, in order to meet the insulation requirements of the primary winding 221 and the secondary winding 222 of each phase winding 22 in the integrated inductor 2, the primary winding 221 and the secondary winding 222 can be made of enameled wire, for example; an isolation layer can be provided between the primary winding 221 and the secondary winding 222, for example; and a covering film layer can also be provided on the surface of the primary winding 221 and the secondary winding 222. The specific configuration can be made according to actual needs and is not limited here.

[0155] Furthermore, in the above embodiments, the cross-section of the secondary winding 222 can be a C-shaped structure as shown in Figure 18, a U-shaped structure as shown in Figure 20, or other structures approximating U-shape and C-shape. Its opening can face the substrate, resulting in a simple structure and facilitating connection of the secondary winding 222 to corresponding pins on one side of the substrate. This allows for series connection of the secondary windings 222 in each phase winding 22 on the substrate, the first circuit board, or the capacitor board. Of course, the secondary winding 222 can also have other shapes, which can be set according to actual needs and are not limited here.

[0156] The following description uses the integrated inductor 2 of the power module 10 as an example of a two-phase winding. Those skilled in the art will understand that in other embodiments, the power module 10 may also have more phases, but the connection method of each secondary winding is the same as that of the two-phase winding, and is not limited here.

[0157] In one specific embodiment, the secondary windings of each winding in the power module 10 can be connected in series on the first circuit board or capacitor board in the power supply system.

[0158] Please refer to Figures 21 and 22. Figure 21 is a cross-sectional view of the power module provided in this application in another specific embodiment, and Figure 22 is a cross-sectional view of the power module provided in this application in another specific embodiment. Figure 21 shows the structure in which the first primary winding 232 and the first secondary winding 231 of the first winding 23 are stacked along the thickness direction Z, and the second primary winding 242 and the second secondary winding 241 of the second winding 24 are stacked along the thickness direction Z. Figure 22 shows the structure in which the first primary winding 232 and the first secondary winding 231 of the first winding 23 are arranged side-by-side along the first direction X, and the second primary winding 242 and the second secondary winding 241 of the second winding 24 are arranged side-by-side along the first direction X.

[0159] As shown in Figures 21 and 22, the first secondary winding 231 includes a first connecting terminal 231a and a second connecting terminal 231b, and the second secondary winding 241 includes a third connecting terminal 241a and a fourth connecting terminal 241b. The substrate 1 has four pins corresponding to the secondary windings, namely, a third pin 13, a fourth pin 14, a fifth pin 15, and a sixth pin 16. The third pin 13 is electrically connected to the first connecting terminal 231a, the fourth pin 14 is electrically connected to the second connecting terminal 231b, the fifth pin 15 is electrically connected to the third connecting terminal 241a, and the sixth pin 16 is electrically connected to the fourth connecting terminal 241b.

[0160] Please also refer to Figure 23, which is a schematic diagram of a connection of the secondary winding in the power supply system provided in this application.

[0161] As shown in Figures 21 to 23, the first connection terminal 231a can be electrically connected to the compensation inductor 7, reference ground, or adjacent power module 10 in the power supply system 100 through the third pin 13. The second connection terminal 231b and the third connection terminal 241a can be electrically connected to the first circuit board or capacitor board (not shown in the figure) in the power supply system 100 through the fourth pin 14 and the fifth pin 15. The fourth connection terminal 241b can be electrically connected to the compensation inductor 7, reference ground, or another adjacent power module 10 in the power supply system 100 through the sixth pin 16, so as to realize the series connection of the secondary windings of each phase of multiple power modules 10 in the power supply system 100 to form a compensation inductor circuit, thereby rapidly increasing the transient current response speed of each power module 10 in the power supply system 100 and improving the transient performance of the power module 10. In this power module 10, the secondary windings of each winding can be connected in series on the first circuit board or capacitor board in the power supply system 100, which facilitates the unified electrical connection of each power module 10 in the power supply system 100 and improves the manufacturing yield.

[0162] In another specific embodiment, the secondary windings of each winding in the power module 10 can be connected in series on the substrate 1 within the power module 10.

[0163] Please refer to Figures 24 and 25. Figure 24 is a cross-sectional view of the power module provided in this application in another specific embodiment, and Figure 25 is a cross-sectional view of the power module provided in this application in another specific embodiment. Figure 24 shows the structure in which the first primary winding 232 and the first secondary winding 231 of the first winding 23 are stacked along the thickness direction Z, and the second primary winding 242 and the second secondary winding 241 of the second winding 24 are stacked along the thickness direction Z. Figure 25 shows the structure in which the first primary winding 232 and the first secondary winding 231 of the first winding 23 are arranged side-by-side along the first direction X, and the second primary winding 242 and the second secondary winding 241 of the second winding 24 are arranged side-by-side along the first direction X.

[0164] As shown in Figures 24 and 25, the first secondary winding 231 includes a first connecting terminal 231a and a second connecting terminal 231b, and the second secondary winding 241 includes a third connecting terminal 241a and a fourth connecting terminal 241b. The substrate 1 has two pins corresponding to the secondary windings, namely, a seventh pin 17 and an eighth pin 18. The seventh pin 17 is electrically connected to the first connecting terminal 231a, and the eighth pin 18 is electrically connected to the fourth connecting terminal 241b.

[0165] Please also refer to Figure 26, which is another connection diagram of the secondary winding in the power supply system provided in this application.

[0166] As shown in Figures 24-26, the first connection terminal 231a is electrically connected to the compensation inductor 7, reference ground, or an adjacent power module 10 in the power supply system 100 via the seventh pin 17. A connection circuit 19c is provided on the substrate 1. The second connection terminal 231b and the third connection terminal 241a are electrically connected via the connection circuit 19c. The fourth connection terminal 241b is electrically connected to the compensation inductor 7, reference ground, or another adjacent power module 10 in the power supply system 100 via the eighth pin 18. This facilitates the series connection of the secondary windings of each phase of multiple power modules 10 in the power supply system 100 to form a compensation inductor circuit, thereby rapidly increasing the transient current response speed of each power module 10 in the power supply system 100 and improving the transient performance of the power module 10. The secondary windings of each winding in the power module 10 can be connected in series on the substrate 1 within the power module 10, thereby improving the installation efficiency of the power module 10 in the power supply system 100.

[0167] Further, please refer to Figures 27, 28, and 29. Figure 27 is a cross-sectional view of the power module provided in this application in another specific embodiment; Figure 28 is a cross-sectional view of the power module provided in this application in another specific embodiment; and Figure 29 is a cross-sectional view of the power module provided in this application in another specific embodiment. In Figures 27 to 29, the primary winding 221 and secondary winding 222 of each phase winding 22 of the power module 10 are arranged side by side along the first direction X. The primary winding 221 and secondary winding 222 enclosed by the dashed lines in the figures constitute one phase winding 22.

[0168] Taking the power module 10 with 2 phases shown in Figure 27 as an example, the power module 10 with 2 phases in Figure 27 can be expanded one-dimensionally along the first direction X to form a power module 10 with 4 phases as shown in Figure 28. Alternatively, it can be expanded one-dimensionally along the first direction X to form a power module 10 with 5, 6, 7, or 8 phases or more. Similarly, the power module 10 with 2 phases in Figure 27 can be expanded two-dimensionally along the second direction Y to form a power module 10 with 4 phases as shown in Figure 29. Alternatively, it can be expanded two-dimensionally along the second direction Y to form a power module 10 with 5, 6, 7, or 8 phases or more. Of course, the phase expansion can also be performed simultaneously along both the first direction X and the second direction Y. The specific configuration can be determined according to actual needs and is not limited here.

[0169] Further, please refer to Figure 30, which is a cross-sectional view of the power module provided in this application in a specific embodiment.

[0170] In the above embodiments, for example, the cross-sectional shape of the magnetic core 21 can be a rectangle as shown in Figure 29; for example, the cross-sectional shape of the magnetic core 21 can also be an irregular shape formed by combining multiple circles as shown in Figure 30. Of course, the cross-sectional shape of the magnetic core 21 can also be other shapes such as triangle, circle, ellipse, polygon, etc., to further improve the design freedom of the power module 10. The specific design can be set according to actual needs and is not limited here.

[0171] In addition, in the above embodiments, when the material of the magnetic core 21 is ferrite, an air gap can be appropriately increased between the two magnetic circuits in the magnetic core 21 by mechanical cutting or circuit control to improve the stability of the magnetic permeability of the magnetic core 21, thereby ensuring the normal operation of the magnetic circuit.

[0172] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

[0173] The above descriptions are merely specific implementations of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A power supply module, characterized in that, include: substrate; An integrated inductor is electrically connected to the substrate. The integrated inductor includes a magnetic core and at least two phase windings. The magnetic core is disposed on the substrate, and the at least two phase windings are spaced apart within the magnetic core. The winding includes a primary winding and a secondary winding, the primary winding and the secondary winding being coupled together; the primary winding is used for electrical connection with a computing chip component in the power supply system, and the secondary windings of at least two phases of the winding are connected in series.

2. The power module according to claim 1, characterized in that, The magnetic core is a one-piece molded structure.

3. The power supply module according to claim 1, characterized in that, The magnetic core includes at least two magnetic core components, each magnetic core component forming an inductor component with one phase of the winding; The magnetic core components of two adjacent inductor components are interconnected.

4. The power supply module according to any one of claims 1 to 3, characterized in that, The magnetic core has a groove on the side surface near the substrate; The power module further includes a resistor-capacitor component, which is electrically connected to the substrate and is at least partially located within the groove.

5. The power supply module according to any one of claims 1 to 4, characterized in that, The substrate is provided with a first pin and a second pin. The primary winding includes a voltage input terminal and a voltage output terminal. The voltage input terminal is electrically connected to the first pin, and the voltage output terminal is electrically connected to the second pin.

6. The power supply module according to claim 5, characterized in that, The integrated inductor is disposed on one side surface of the substrate, and the first pin and the second pin are disposed on the side surface of the substrate opposite to the integrated inductor.

7. The power supply module according to claim 5, characterized in that, The integrated inductor is embedded in the substrate, and the first pin and the second pin are disposed on the surface of the substrate.

8. The power supply module according to claim 5, characterized in that, The substrate includes a first plate and a second plate, which are electrically connected. Along the thickness direction of the power module, the first plate and the second plate are disposed on opposite sides of the integrated inductor. The first board is provided with the first pin, and the second board is provided with the second pin.

9. The power supply module according to any one of claims 5 to 8, characterized in that, The primary winding includes a first segment, a second segment, and a third segment. One end of the second segment is connected to the first segment, and the other end of the second segment is connected to the third segment. The first segment is provided with the voltage input terminal, and the third segment is provided with the voltage output terminal. Along the thickness direction of the power module, the first segment and the third segment are located on the same side of the second segment.

10. The power supply module according to any one of claims 5 to 8, characterized in that, The primary winding includes a first segment, a second segment, and a third segment. One end of the second segment is connected to the first segment, and the other end of the second segment is connected to the third segment. The first segment is provided with the voltage input terminal, and the third segment is provided with the voltage output terminal. Along the thickness direction of the power module, the first segment and the third segment are located on opposite sides of the second segment.

11. The power supply module according to any one of claims 1 to 10, characterized in that, Along the thickness direction of the power module, the primary winding and the secondary winding are stacked.

12. The power supply module according to any one of claims 1 to 10, characterized in that, The primary winding and the secondary winding are arranged along the first direction of the power module; The first direction is perpendicular to the thickness direction of the power module.

13. The power supply module according to any one of claims 1 to 12, characterized in that, The at least two-phase winding includes a first winding and a second winding. The first winding includes a first secondary winding, which includes a first connecting end and a second connecting end. The second winding includes a second secondary winding, which includes a third connecting end and a fourth connecting end. The substrate is provided with a third pin, a fourth pin, a fifth pin, and a sixth pin. The third pin is electrically connected to the first connection terminal, the fourth pin is electrically connected to the second connection terminal, the fifth pin is electrically connected to the third connection terminal, and the sixth pin is electrically connected to the fourth connection terminal. The first connection terminal is electrically connected to the compensation inductor, reference ground, or adjacent power module in the power supply system via the third pin; The second connection terminal and the third connection terminal are electrically connected on the first circuit board or capacitor board in the power supply system through the fourth pin and the fifth pin; The fourth connection terminal is electrically connected to the compensation inductor, reference ground, or another adjacent power module in the power supply system via the sixth pin.

14. The power supply module according to any one of claims 1 to 12, characterized in that, The at least two-phase winding includes a first winding and a second winding. The first winding includes a first secondary winding, which includes a first connecting end and a second connecting end. The second winding includes a second secondary winding, which includes a third connecting end and a fourth connecting end. The substrate is provided with a seventh pin and an eighth pin, the seventh pin being electrically connected to the first connection terminal, and the eighth pin being electrically connected to the fourth connection terminal; The first connection terminal is electrically connected to the compensation inductor, reference ground, or adjacent power module in the power supply system via the seventh pin; A connection circuit is provided on the substrate, and the second connection terminal and the third connection terminal are electrically connected through the connection circuit. The fourth connection terminal is electrically connected to the compensation inductor, reference ground, or another adjacent power module in the power supply system via the eighth pin.

15. A power supply system, characterized in that, The power supply system includes: First circuit board; A computing chip assembly is disposed on one side surface of the first circuit board; A power supply module, wherein the power supply module is any one of claims 1 to 14, the power supply module is disposed on the first circuit board and electrically connected to the computing chip assembly, and is used to provide power supply voltage to the computing chip assembly.

16. The power supply system according to claim 15, characterized in that, Along the thickness direction of the power module, the computing chip assembly, the first circuit board, and the power module are stacked sequentially.

17. The power supply system according to claim 16, characterized in that, The power supply system also includes an input power source, which is used to provide an input voltage to the power module; the input power source is disposed on the surface of the first circuit board. Along the thickness direction of the power module, a first pin and a second pin are provided on the side of the power module near the first circuit board. The first pin is electrically connected to the input power supply, and the second pin is electrically connected to the computing chip assembly.

18. The power supply system according to claim 16, characterized in that, The power supply system also includes an input power supply and a second circuit board. The second circuit board is disposed on the side of the power module opposite to the first circuit board. The input power supply is disposed on the second circuit board and is used to provide input voltage to the power module. Along the thickness direction of the power module, a first pin is provided on the side of the power module away from the first circuit board, and a second pin is provided on the side of the power module closer to the first circuit board. The first pin is electrically connected to the input power supply, and the second pin is electrically connected to the computing chip assembly.

19. The power supply system according to claim 15, characterized in that, The power module and the computing chip assembly are each independently connected to one side of the first circuit board.

20. An electronic device, characterized in that, The electronic device includes a power supply system as described in any one of claims 14 to 19.

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