Liquid cooling apparatus, pulsed power supply power assembly, and wafer bearing apparatus

Abstract

Provided in the present application are a liquid cooling apparatus, a pulsed power supply power assembly, and a wafer bearing apparatus. The liquid cooling apparatus comprises: a thermally conductive body, provided with a flow guide channel for guiding a cooling liquid, the flow guide channel being formed from at least two interconnected channel segments; and a thermally conductive separation structure, at least provided in one channel segment and thermally connected to a wall surface of the channel segment, and used for splitting and / or guiding the cooling liquid. The present application achieves heat transfer between a cooling liquid and a thermally conductive body by means of contact between the cooling liquid and a thermally conductive separation structure, thereby increasing a heat exchange area and improving the heat exchange efficiency of the cooling liquid and the thermally conductive body. In addition, by using the thermally conductive separation structure to shunt and / or guide the cooling liquid, it is possible to cause the flow properties of the cooling liquid to become turbulent in the channel section. In this way, the heat exchange efficiency of the cooling liquid and the thermally conductive body can also be improved, thereby improving the cooling effect of the liquid cooling apparatus on an electronic component, and enabling the electronic components to work more efficiently.

Description

A liquid cooling device, a pulse power supply component, and a wafer carrier device. Technical Field

[0001] This application relates to the field of semiconductor equipment technology, specifically to a liquid cooling device, a pulse power supply component, and a wafer carrier device. Background Technology

[0002] In semiconductor process equipment, some electronic components, such as common-mode inductors and MOSFETs, generate a lot of heat during operation, so liquid cooling devices are needed to dissipate the heat. However, existing liquid cooling devices have poor heat dissipation effect on electronic components, which affects their working performance. Summary of the Invention

[0003] In view of this, this application provides a liquid cooling device that can improve the heat dissipation effect of electronic components. Furthermore, this application also provides a liquid cooling system having the above-mentioned liquid cooling device, and semiconductor process equipment having this liquid cooling system.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] A liquid cooling device, comprising:

[0006] The heat-conducting body is provided with a flow channel for guiding coolant, and the flow channel is formed by connecting at least two channel segments;

[0007] A thermally conductive partition structure is provided in at least one of the channel segments and is thermally connected to the wall of the channel segment for diverting and / or guiding the coolant.

[0008] In some embodiments, in the above-described liquid cooling device, the thermally conductive partition structure includes thermally conductive partition plates, and the thermally conductive partition plates disposed in the same channel segment include a plurality of parallel partition plates.

[0009] In some embodiments, in the above-described liquid cooling device, the thermally conductive partition structure includes at least one thermally conductive partition for dividing the channel segment into at least two parallel sub-channel segments.

[0010] In some embodiments, in the above-described liquid cooling device, the channel section includes an inlet section and an outlet section, and the thermally conductive partition structure is disposed in the inlet section and the outlet section.

[0011] In some embodiments, in the above-described liquid cooling device, the channel section includes an inlet section, an outlet section, and an intermediate section located between the inlet section and the outlet section, and the thermally conductive partition structure is disposed in the inlet section, the outlet section, and the intermediate section.

[0012] In some embodiments, in the above-described liquid cooling device, the thermally conductive partition is arranged in the channel section along the flow direction of the coolant to divert the coolant.

[0013] In some embodiments, in the above-described liquid cooling device, the thermally conductive separator includes multiple partitions with different heights, and the partitions of all the thermally conductive separators located at the same height form a partition layer, so that multiple partition layers are provided in the channel segment.

[0014] In some embodiments, in the above-described liquid cooling device, the thermally conductive partitions disposed in the channel section form an angle with the flow direction of the coolant in the channel section, and the thermally conductive partitions in the same channel section are divided into two groups. One group of thermally conductive partitions is thermally connected to one side of the opposite sides of the wall of the channel section, and the other group of thermally conductive partitions is thermally connected to the other side of the opposite sides of the wall of the channel section. The two groups of thermally conductive partitions are staggered one-to-one to guide the coolant to flow along a wavy path.

[0015] In some embodiments, in the above-described liquid cooling device, the spacing between adjacent thermally conductive partitions is 0.5 mm to 1 mm, and the number of thermally conductive partitions is 6 to 18.

[0016] In some embodiments, in the above-described liquid cooling device, the heat-conducting body is a heat-conducting block, and the surface of the block body is provided with grooves for mounting ceramic plates.

[0017] In some embodiments, in the above-described liquid cooling device, the heat-conducting body includes:

[0018] The third part includes a channel cavity and a second mounting groove and a third mounting groove communicating with the channel cavity. The second mounting groove and the third mounting groove are located on both sides of the channel cavity. The heat-conducting partition plate enters the channel cavity through the second mounting groove and / or the third mounting groove and is installed in the channel cavity.

[0019] The first part and the second part are respectively installed in the second mounting groove and the third mounting groove to block the channel cavity and form the flow channel.

[0020] A pulse power supply component includes a circuit board and the aforementioned liquid cooling device, wherein the liquid cooling device is connected to at least one side of the circuit board to cool electronic components disposed on the circuit board.

[0021] In some embodiments, in the above-mentioned pulse power supply component, the electronic components include a common-mode inductor, and the liquid cooling device is thermally connected to the common-mode inductor via a ceramic plate.

[0022] A wafer carrier device includes the liquid cooling device described above, or includes the pulse power supply component described above.

[0023] The liquid cooling device provided in this application has a flow guiding channel on the heat-conducting body. The flow guiding channel is formed by connecting at least two channel segments, and a heat-conducting partition structure is provided in at least one channel segment, which is thermally connected to the wall of the channel segment. This heat-conducting partition structure is used to divert and / or guide the coolant flowing in the channel segment. By providing a heat-conducting partition structure in the flow guiding channel, on the one hand, heat conduction between the coolant and the heat-conducting body can be achieved through the contact between the coolant and the heat-conducting partition structure, thereby increasing the heat exchange area and improving the heat exchange efficiency between the coolant and the heat-conducting body. On the other hand, by diverting and / or guiding the coolant, the flow properties of the coolant can be changed to turbulence in the channel segment with the heat-conducting partition structure, which can also improve the heat exchange efficiency between the coolant and the heat-conducting body, thereby improving the cooling effect of the liquid cooling device on electronic components, enabling the electronic components to operate more efficiently. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0025] Figure 1 is a schematic diagram of the PWM signal generator and its related components arranged in the chuck space;

[0026] Figure 2 is a front view of the liquid cooling device provided in an embodiment of this application;

[0027] Figure 3 is a side view of the liquid cooling device;

[0028] Figure 4 is a top view of the liquid cooling device;

[0029] Figure 5 is a cross-sectional view AA of Figure 2;

[0030] Figure 6 is a BB cross-sectional view of Figure 3;

[0031] Figure 7 is a schematic diagram of a heat-conducting partition plate with a partition section;

[0032] Figure 8 is a schematic diagram of the structure in which the heat-conducting partition is set in the channel section and has an angle with the flow direction of the coolant;

[0033] Figure 9 is a schematic diagram of the liquid cooling system provided in an embodiment of this application.

[0034] In Figure 1: 01-PWM signal generator, 02-pulse power supply component, 03-pulse output component, 04-chuck base, 05-electrostatic chuck; In Figures 2-9: 1-heat-conducting body, 2-flow channel, 3-heat-conducting separator, 4-electronic components, 5-board; 101-first part, 102-second part, 103-third part, 104-first mounting groove, 105-second mounting groove, 106-third mounting groove, 107-channel cavity; 201-inlet section, 202-outlet section, 203-liquid inlet, 204-liquid outlet, 205-intermediate section; 301-separator, 302-separator layer, 303-opening. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] In semiconductor process equipment, the bias system of a semiconductor etching machine has a single-peak ion energy power supply to provide bias voltage, and requires a multi-channel synchronously adjustable PWM signal generator to generate multiple complementary pulse waves with a maximum frequency of 50MHz, a minimum pulse width of 5ns, adjustable phase between different channels, pulse width and phase adjustment accuracy of less than 1ns, and controllable envelope pulses. The PWM signal generator and its related components need to be deployed and installed as small components in the chuck space of the semiconductor etching machine, so one of its requirements is small size. Furthermore, the single-peak ion energy power supply generates significant electromagnetic interference, therefore it also needs to have anti-interference capabilities.

[0037] As shown in Figure 1, the components related to the PWM signal generator 01 include the pulse power supply component 02 and the pulse output component 03. The PWM signal generator 01 generates a high-frequency pulse square wave, which has a large number of high-order harmonics after Fourier expansion (for example, 1MHz expands to 2MHz, 4MHz, 20MHz, 200MHz, etc.). The entire pulse circuit, including the electronic components such as the pulse power supply component 02 and the pulse output component 03, has a certain parasitic inductance. If it is placed outside the chuck space of the semiconductor etching machine, the inductive reactance of different frequencies will be different, and the attenuation will be different, which will cause waveform distortion and interfere with the process. Therefore, these components need to be placed in the chuck space of the semiconductor etching machine. Specifically, these components are set in the cavity formed by the chuck base 04 and the electrostatic chuck 05 of the semiconductor etching machine, and are located directly below the electrostatic chuck. This can significantly reduce parasitic inductance. However, it will put the sensitive element (i.e., the PWM signal generator 01) and the interference source (i.e., the pulse power supply component 02) in the same environment. In the same environment, high-frequency noise will interfere with the normal operation of the PWM signal generator 01 along the signal coaxial cable. Therefore, anti-interference measures need to be taken, i.e., filtering components need to be set up.

[0038] The filter component in the pulse power supply assembly 02 can be a common-mode inductor. A common-mode inductor is an inductor that filters out the influence of high-frequency, high-voltage pulses on the drive circuit. Because high-frequency noise has extremely high energy, the common-mode inductor absorbs this noise energy and dissipates it as heat, resulting in significant heat generation. Under 200V bus voltage conditions, the surface temperature of the common-mode inductor can reach a maximum of 130℃, and the temperature will continue to rise as the voltage increases. The core of the common-mode inductor is a temperature-sensitive material. When the temperature is too high, the permeability of the core changes, gradually decreasing from high to low. Therefore, excessively high temperatures cause a decrease in the permeability of the common-mode inductor core, leading to a decrease in the inductive reactance and consequently a deterioration in the filtering effect. Therefore, cooling is necessary for the common-mode inductor. However, current cooling devices for common-mode inductors have limitations, resulting in less than ideal cooling performance.

[0039] As shown in Figures 2-9, this application embodiment provides a liquid cooling device for cooling electronic components 4 in semiconductor process equipment. The liquid cooling device mainly includes a heat-conducting body 1 and a heat-conducting partition structure. The heat-conducting body 1 is the main structure of the entire liquid cooling device and has good thermal conductivity. When cooling the electronic components 4, the heat-conducting body 1 contacts the electronic components 4 or their heat-conducting structure to transfer cooling energy to the electronic components 4. The material of the heat-conducting body 1 is, for example, a metal with good thermal conductivity, such as copper, aluminum, silver, or stainless steel. The heat-conducting body 1 is provided with a flow channel 2 for... The coolant, which can be cooling water, cooling oil, or refrigerant, flows through the flow channel 2, providing cooling to the heat-conducting body 1. The entire flow channel 2 is formed by sequentially connecting at least two channel segments (a channel segment refers to a shorter channel). A heat-conducting partition structure is disposed within each channel segment, and at least one channel segment is disposed within it; that is, the heat-conducting partition structure can be disposed within one, two, more, or all of the channel segments. By distributing the heat-conducting partition structure within the flow channel 2, the coolant can be diverted and / or guided as it flows through the partition structure. The heat-conducting partition structure is thermally connected to the wall of the channel segment, allowing it to transfer the cooling capacity of the coolant to the heat-conducting body 1. Specifically, to ensure good cooling performance of the liquid cooling device and for ease of assembly, the heat-conducting partition structure and the heat-conducting body 1 can be made of the same metal material and assembled by welding.

[0040] The liquid cooling device described above, by setting a heat-conducting partition structure in the flow channel 2, allows the coolant to contact both the inner wall of the flow channel 2 and the heat-conducting partition structure. Since the heat-conducting partition structure itself is thermally conductive and thermally connected to the heat-conducting body 1, this arrangement increases the contact area between the coolant and the liquid cooling device, improving the cooling efficiency and effect of the coolant on the electronic components 4. Furthermore, the heat-conducting partition structure in the flow channel 2 can also divert and / or guide the coolant, causing the flow properties of the coolant to change to turbulence in the channel section with the heat-conducting partition structure. The coolant can flow more randomly in the flow channel 2, thus making more thorough contact with the inner wall of the flow channel 2 and the heat-conducting partition structure, thereby enabling more thorough heat exchange and further improving the cooling efficiency and effect on the electronic components 4.

[0041] In some embodiments, the thermally conductive partition structure includes thermally conductive partition plates 3. To better achieve flow diversion and / or guidance, multiple thermally conductive partition plates 3 arranged in parallel are configured within the same channel segment. Simultaneously, the thermally conductive partition plates 3 themselves possess good thermal conductivity, and their edges are thermally connected to the wall of the channel segment, thereby enabling the thermally conductive partition plates 3 to transfer the cooling capacity of the coolant to the thermally conductive body 1. Specifically, to ensure good cooling performance of the liquid cooling device and for ease of assembly, the thermally conductive partition plates 3 and the thermally conductive body 1 can be made of the same metal material and assembled and connected by welding.

[0042] In other embodiments, the thermally conductive partition structure includes at least one thermally conductive partition for dividing the channel segment into at least two parallel sub-channel segments. Parallel sub-channel segments mean that the inlet ends of at least two sub-channel segments converge and are connected, and the outlet ends of at least two sub-channel segments converge and are connected. Coolant can simultaneously enter each sub-channel segment from its inlet end and then flow out from its outlet end, thereby achieving coolant diversion and / or guidance.

[0043] As shown in Figure 5, the channel section includes an inlet section 201 and an outlet section 202, and a thermally conductive partition structure (e.g., including multiple thermally conductive partition plates 3 or at least one thermally conductive partition body) is disposed in the inlet section 201 and the outlet section 202. The inlet section 201 is the channel section of the flow guide channel 2 that is close to and connected to the liquid inlet. Similarly, the outlet section 202 is the channel section of the flow guide channel 2 that is close to and connected to the liquid outlet. A heat-conducting partition structure is set in these two parts to divert and / or guide the coolant. That is, the heat-conducting partition structure and the walls on different sides of the flow guide channel 2 form different flow paths (different flow paths can be independent paths that are not connected, or different sections of the same path that are connected). The coolant is diverted to flow in these paths. Each path has a large contact area with the coolant in it, and the multiple streams of coolant after diversion are guided by multiple paths, which can better optimize the flow properties of the coolant. Compared with the existing structure without a heat-conducting partition structure, it can significantly improve the cooling effect of the liquid cooling device. Furthermore, setting a heat-conducting partition structure only in these two parts can simplify the structure of the liquid cooling device as much as possible, making it easier to manufacture and assemble the liquid cooling device.

[0044] In addition, other methods can be used to set the heat-conducting partition structure (e.g., including multiple heat-conducting partition plates 3 or at least one heat-conducting partition body), as shown in Figure 5. The channel section includes an inlet section 201, an outlet section 202, and an intermediate section 205 located between the inlet section 201 and the outlet section 202. The heat-conducting partition structure is set in the inlet section 201, the outlet section 202, and the intermediate section 205. In this method, by distributing the heat-conducting partition structure throughout the entire flow channel 2, the coolant can be in contact with the heat-conducting partition plates 3 throughout its entire flow path in the flow channel 2. Furthermore, by completely dispersing the coolant into multiple streams, each stream of coolant can have a larger contact area and heat exchange area with the heat-conducting partition plates 3 or the wall of the flow channel 2, thereby maximizing the heat exchange efficiency. Moreover, this arrangement can also more effectively guide each stream of coolant, allowing each stream of coolant to flow more fully in a turbulent manner, thereby maximizing the cooling effect.

[0045] In embodiments where the thermally conductive partition structure includes multiple thermally conductive partition plates 3, as shown in Figures 2, 5, and 6, the thermally conductive partition plates 3 are arranged in parallel. This allows adjacent thermally conductive partition plates 3 to form a flow path, and the two thermally conductive partition plates 3 located on the outer side of all the partition plates 3 also form flow paths with the walls of different sides of the flow channel 2, thereby increasing the number of flow paths, expanding the heat exchange area, and enhancing the flow diversion and guiding effects.

[0046] In addition, the heat-conducting partition structure can also be set only in the inlet section 201, only in the outlet section 202, or only in the middle section 205, which can also improve the cooling effect of the liquid cooling device.

[0047] In embodiments where the thermally conductive partition structure includes multiple thermally conductive partition plates 3, the arrangement direction of the thermally conductive partition plates 3 in the flow channel 2 can be selected in several different ways, as shown in Figures 2, 5, and 6. In the first option, the thermally conductive partition plates 3 can be arranged along the flow direction of the coolant in the channel segment to divide the coolant. By arranging different parts of the thermally conductive partition plates 3 along the flow direction of the coolant in each channel segment, on the one hand, the flow properties of the coolant can be better optimized, making it easier and more sufficient for the coolant to transform into a turbulent flow mode; on the other hand, multiple independent and parallel flow paths can be formed, thereby dividing the coolant into multiple streams and achieving higher heat exchange efficiency.

[0048] As shown in Figure 7, based on the thermally conductive partition 3 being arranged along the flow direction of the coolant, the thermally conductive partition 3 may also include multiple partition sections 301 of different heights, the height direction being parallel to the X-axis in Figure 7. All partition sections 301 at the same height of the thermally conductive partition 3 form a partition layer 302, so that multiple partition layers 302 are provided in the channel section. In this scheme, the heat-conducting partition 3 is no longer a complete sheet or plate structure. Instead, multiple openings 303 are made on the heat-conducting partition 3 so that each heat-conducting partition 3 includes multiple strips with spacing, connected or not connected. These strips are the partition portions 301. All parallel heat-conducting partitions 3 adopt this structure, and the corresponding partition portions 301 of each heat-conducting partition 3 are aligned in the height direction. That is, the uppermost partition portions 301 of all heat-conducting partitions 3 are aligned, the partition portions 301 at the second height are aligned, and so on, until the lowermost partition portion 301 is aligned, thereby forming multiple partition layers 302 distributed along the height direction. Each partition layer 302 exchanges heat with the coolant and diverts and guides the coolant, while the gap between adjacent partition portions 301 allows the coolant to flow through. This reduces the resistance of the heat-conducting partition 3 to the coolant, increases the flow rate of the coolant in the guide channel 2, and thus improves the cooling effect of the liquid cooling device.

[0049] In the second option, as shown in Figure 8, the heat-conducting partitions 3 disposed in the channel section form an angle with the flow direction of the coolant in the channel section (this cooling direction is indicated by the solid arrow in Figure 8), and any two adjacent heat-conducting partitions 3 are respectively connected to two opposite parts of the wall of the channel section. That is, the heat-conducting partitions 3 in the same channel section are divided into two groups. One group of heat-conducting partitions 3 is thermally connected to one side of the opposite sides of the wall of the channel section, and the other group of heat-conducting partitions 3 is thermally connected to the other side of the opposite sides of the wall of the channel section. The two groups of heat-conducting partitions are staggered one-to-one to guide the coolant to flow along a wavy path (as shown by the dashed arrow in Figure 8). By setting it up in this way, the flow path of the coolant can be extended, allowing the coolant to exchange heat with the heat-conducting partitions 3 and the heat-conducting body 1 for a longer time and more fully, thereby improving the heat exchange effect. To maximize the length of the flow path, the heat-conducting partition 3 can be positioned perpendicular to the coolant flow direction, meaning the angle between the heat-conducting partition 3 and the coolant flow direction is a right angle; alternatively, to reduce the resistance of the heat-conducting partition 3, it can be tilted towards the coolant flow direction, meaning the angle between the heat-conducting partition 3 and the coolant flow direction is an obtuse angle. This configuration also improves the cooling effect of the liquid cooling system.

[0050] In some configurations, when the heat-conducting partitions 3 are arranged along the flow direction of the coolant in the channel section, the spacing between adjacent heat-conducting partitions 3 is 0.5mm to 1mm, and the number of heat-conducting partitions 3 is 6 to 18. The spacing between adjacent heat-conducting partitions 3 is chosen to be 0.5mm to 1mm. This arrangement facilitates the transition of coolant flow from turbulent to laminar flow in each flow path, while also preventing the flow path from becoming too narrow and significantly increasing flow resistance, thus ensuring good flow performance of the coolant in the guide channel 2. With the spacing remaining constant, the number of thermally conductive partition plates 3 arranged in the flow channel 2 is also limited. The thickness of a single thermally conductive partition plate 3 can be changed by varying the number. For example, the thickness of the thermally conductive partition plate 3 can be set to 0.3 mm, in which case 11 thermally conductive partition plates 3 are arranged in parallel in the flow channel 2; or the thickness can be set to 0.8 mm, in which case 7-8 thermally conductive partition plates 3 are arranged in parallel in the flow channel 2; or the thickness can be set to 1 mm, in which case 6-7 thermally conductive partition plates 3 are arranged in parallel in the flow channel 2. Different thicknesses of thermally conductive partition plates 3 will result in different flow resistances, thus affecting the flow rate of the coolant. Therefore, by linking the thickness and number of thermally conductive partition plates 3, the cooling effect of the liquid cooling device can be maximized.

[0051] As shown in Figures 2-4, the heat-conducting body 1 is a heat-conducting block, and a first mounting groove 104 for mounting a ceramic plate is formed on the surface of the block-shaped heat-conducting body 1. The ceramic plate is used to achieve a thermally conductive connection between the liquid cooling device and the common-mode inductor of the electronic component 4. In some embodiments, the heat-conducting body 1 is set as a cuboid-shaped heat-conducting block, and a U-shaped flow channel 2 is provided in the heat-conducting block so that the liquid inlet 203 and the liquid outlet 204 of the flow channel 2 are located on the same side of the heat-conducting block (this side is, for example, the surface with the smallest area of ​​the cuboid), which is beneficial for the installation of the liquid cooling device in a narrow space and minimizes interference between the liquid cooling device and the electronic component 4. Furthermore, in some embodiments, the flow cross-section of the U-shaped guide channel 2 is circular, with a diameter of 10mm to 16mm. The lengths of the inlet section 201 and the outlet section 202 are both 5mm to 15mm, and the length of the middle section 205 (or the distance between the inlet section 201 and the outlet section 202) is 5mm to 15mm. The minimum inner bending radius of the connection between the inlet section 201, the outlet section 202 and the middle section 205 is 0.5mm, and the maximum outer bending radius is 12mm. The length of the heat-conducting block is 50mm, the width is 60mm, and the height is 20mm.

[0052] In an embodiment where the thermally conductive partition structure includes multiple thermally conductive partition pieces 3, for ease of manufacturing and assembly, as shown in FIG6, the thermally conductive body 1 includes: a third part 103, which has a channel cavity 107 and a second mounting groove 105 and a third mounting groove 106 communicating with the channel cavity 107. The second mounting groove 105 and the third mounting groove 106 are respectively located on both sides of the channel cavity 107. The thermally conductive partition piece 3 enters the channel cavity 107 through the second mounting groove 105 and / or the third mounting groove 106 and is installed in the channel cavity 107; a first part 101 and a second part 102 are respectively installed in the second mounting groove 105 and the third mounting groove 106 to block the channel cavity 107 and form a flow channel 2. In this structure, for example, the heat-conducting body 1 comprises three parts. The first part 101 and the second part 102 have the same shape, both being plate-shaped, and these two parts are located at the aligned positions of the two largest surfaces of the cuboid. Specifically, the second mounting groove 105 and the second mounting groove 105 are respectively formed at the aligned positions of the two largest surfaces of the cuboid. The remaining part of the cuboid is the third part 103, on which a channel cavity 107 is formed. This channel cavity 107 is the guide cavity of the guide channel 2. The second mounting groove 105 and the second mounting groove 105 are both connected to the channel cavity 107. When the first part 101 and the second mounting groove 102 are aligned, the heat-conducting body 103 is connected to the heat-conducting body 104. When part 102 is not assembled into part 103, the flow channel 2 is exposed on part 103. In this state, the heat-conducting partition 3 can be installed into the flow channel 2 through the second mounting groove 105 and / or the third mounting groove 106. Then, part 101 and part 102 are assembled into part 103 (i.e., installed into the second mounting groove 105 and the second mounting groove 105 respectively). This allows part 101 and part 102 to seal the open portion of the channel cavity 107. Part 101, part 102, and part 103 together form the flow channel 2, thus forming the liquid cooling device. The assembly method of heat-conducting partition 3, part 103, part 102, and part 101 is, for example, welding. Specifically, solder (strip, powder, or sheet) is placed on the interface of heat-conducting partition 3, part 103, part 102, and part 101, and then placed in a welding furnace for high-temperature treatment.

[0053] The ceramic sheet possesses both excellent thermal conductivity and insulation properties. Therefore, using the ceramic sheet to conduct heat between the metal heat-conducting body 1 and the electronic component 4 not only allows for better cooperation between the liquid cooling device and the electronic component 4 but also reduces the space required for assembly. To further enhance the fit and facilitate faster and more convenient assembly of the liquid cooling device and the electronic component 4, grooves are cut into the heat-conducting body 1 to more precisely and securely assemble the ceramic sheet. This also increases the contact area between the heat-conducting body 1 and the ceramic sheet, thereby improving the heat conduction effect.

[0054] Based on the aforementioned liquid cooling device, as shown in Figure 9, this application embodiment also provides a pulse power supply component, which can be disposed in the cavity formed by the chuck base and the electrostatic chuck of a semiconductor etching machine, and includes a circuit board 5, electronic components 4 disposed on the circuit board 5, and a liquid cooling device for cooling the electronic components 4. This liquid cooling device is the aforementioned liquid cooling device. This liquid cooling device is disposed on at least one side of the circuit board 5 and is in contact with the electronic components 4 disposed on the circuit board 5 and located on that side to cool the electronic components 4. Specifically, the electronic components 4 include a MOS transistor disposed on one side of the circuit board 5 and a common-mode inductor disposed on the other side of the circuit board 5.

[0055] In order to reduce the size and facilitate the placement of the pulse power supply components in the cavity enclosed by the chuck base and the electrostatic chuck, a liquid cooling device can be used to cool the two boards 5. That is, a liquid cooling device is placed between the two parallel boards 5 and is thermally connected to the electronic components 4 on the two boards 5.

[0056] Specifically, the electronic component 4 cooled by the liquid cooling device includes a common-mode inductor, which is thermally connected to the common-mode inductor via a ceramic sheet. Because the part of the liquid cooling device that contacts the electronic component is a metal heat-conducting body, a ceramic sheet made primarily of beryllium oxide is preferred to achieve insulation and good cooling performance, thus enabling heat conduction between the liquid cooling device and the electronic component. To improve the bonding performance of the beryllium oxide, soldering (specifically tin soldering) is used. Tin soldering generally requires the temperature to reach its melting point, both the soldering and the workpiece to be soldered to be metals, and their chemical reactivity cannot be too poor. Therefore, a layer of metal needs to be deposited on the surface of the beryllium oxide. Silver, which has good thermal conductivity and reactivity, is the preferred metal. A dense layer of silver is deposited on the surface of the beryllium oxide using a deposition method. After deposition, the adhesion between the silver and the beryllium oxide is greatly enhanced, achieving a tight connection.

[0057] Furthermore, embodiments of this application also provide a wafer carrier device, which includes the liquid cooling device described above, or includes the pulse power supply component described above.

[0058] Since this wafer carrier includes the aforementioned liquid cooling device or pulse power supply component, the beneficial effects of the liquid cooling device or pulse power supply component on the wafer carrier can be found in the above description and will not be repeated here.

[0059] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0060] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0061] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0062] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0063] It should be understood that the qualifiers “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0064] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A liquid cooling device, characterized in that, include: The heat-conducting body is provided with a flow channel for guiding coolant, and the flow channel is formed by connecting at least two channel segments; A thermally conductive partition structure is provided in at least one of the channel segments and is thermally connected to the wall of the channel segment for diverting and / or guiding the coolant.

2. The liquid cooling device according to claim 1, characterized in that, The thermally conductive partition structure includes thermally conductive partition sheets, and the thermally conductive partition sheets arranged in the same channel segment include multiple sheets arranged in parallel.

3. The liquid cooling device according to claim 1, characterized in that, The thermally conductive partition structure includes at least one thermally conductive partition for dividing the channel segment into at least two parallel sub-channel segments.

4. The liquid cooling device according to claim 1, characterized in that, The channel segment includes an inlet segment and an outlet segment, and the heat-conducting separation structure is disposed in the inlet segment and the outlet segment.

5. The liquid cooling device according to claim 1, characterized in that, The channel segment includes an inlet segment, an outlet segment, and an intermediate segment located between the inlet segment and the outlet segment, and the heat-conducting separation structure is disposed in the inlet segment, the outlet segment, and the intermediate segment.

6. The liquid cooling device according to claim 2, characterized in that, The thermally conductive separator is arranged in the channel section along the flow direction of the coolant to divert the coolant.

7. The liquid cooling device according to claim 6, characterized in that, The thermally conductive separator includes multiple separators of different heights. All separators at the same height form a separator layer, so that multiple separator layers are provided in the channel segment.

8. The liquid cooling device according to claim 2, characterized in that, The heat-conducting partitions disposed in the channel section form an angle with the flow direction of the coolant in the channel section, and the heat-conducting partitions in the same channel section are divided into two groups. One group of heat-conducting partitions is thermally connected to one side of the opposite side of the wall of the channel section, and the other group of heat-conducting partitions is thermally connected to the other side of the opposite side of the wall of the channel section. The two groups of heat-conducting partitions are staggered one-to-one to guide the coolant to flow along a wavy path.

9. The liquid cooling device according to claim 6, characterized in that, The spacing between adjacent thermally conductive partitions is 0.5mm to 1mm, and the number of thermally conductive partitions is 6 to 18.

10. The liquid cooling device according to claim 1, characterized in that, The heat-conducting body is a heat-conducting block, and the surface of the block-shaped heat-conducting body is provided with a first mounting groove for mounting ceramic plates.

11. The liquid cooling device according to any one of claims 2, 4-10, characterized in that, The heat-conducting body includes: The third part includes a channel cavity and a second mounting groove and a third mounting groove communicating with the channel cavity. The second mounting groove and the third mounting groove are located on both sides of the channel cavity. The heat-conducting partition plate enters the channel cavity through the second mounting groove and / or the third mounting groove and is installed in the channel cavity. The first part and the second part are respectively installed in the second mounting groove and the third mounting groove to block the channel cavity and form the flow channel.

12. A pulse power supply component, characterized in that, The invention includes a circuit board and a liquid cooling device according to any one of claims 1-11, the liquid cooling device being connected to at least one side of the circuit board to cool electronic components disposed on the circuit board.

13. The pulse power supply component according to claim 12, characterized in that, The electronic components include a common-mode inductor, and the liquid cooling device is thermally connected to the common-mode inductor via a ceramic plate.

14. A wafer carrier device, characterized in that, It includes the liquid cooling device according to any one of claims 1-11, or the pulse power supply component according to claim 12 or claim 13.

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