High frequency package

Abstract

This high frequency package comprises: a container (101) that is constituted by a conductive material; a connector (102) that is provided to a side wall (101a) of the container (101); a substrate (103) that comprises a dielectric which is placed on the bottom surface of the container (101); and a ground component (105) that is constituted by a conductive material. The ground component (105) is provided with a leg part (105a) that connects to two parts of ground wiring (104b), at an end part of the substrate (103) toward the side wall (101a), and is provided so as to be in contact with an inner side surface of the side wall (101a) at an upper part of a through hole (102a).

Description

High-frequency package

[0001] The present invention relates to a high-frequency package.

[0002] In recent years, due to the increase in the volume of data traffic flowing through the network, the bandwidth of each component constituting the transceiver has been continuously widened. For example, in the front end of a transmitter used in optical communication, optical modulators and modulator drivers with a bandwidth exceeding 100 GHz have been reported. Furthermore, the measuring instruments for confirming the performance of these devices have also been widened beyond the progress of the broadbanding of the components used in communication. In optical communication and measuring instruments, in order to handle signals in a very wide bandwidth range from near DC to near the above 100 GHz, each component used is connected in a coaxial structure, and an interface with a finer 0.8 mm connector than a 1 mm connector has also been commercialized, and the upper limit of the bandwidth exceeds 150 GHz.

[0003] When actually used in a system or a measuring instrument, it is necessary to house a broadband device in a module having a broadband interface. However, compound semiconductors are often used for broadband devices, and the package constituting the module is required to achieve both airtightness and broadband performance. As a package that achieves both airtightness and broadband performance, a form in which a conductive material such as metal is used as the housing material, a broadband connector is provided on the side wall of the housing, and a substrate on which a device is mounted is housed inside is often used.

[0004] An example of this package will be described with reference to FIGS. 11A, 11B, and 11C. Note that FIGS. 11A, 11B, and 11C show a part of the package. This package includes a container 101 made of a conductive material, a connector 102, and a substrate 103 made of a dielectric housed in the container. The container 101 can have, for example, a rectangular parallelepiped outer shape.

[0005] The connector 102 is formed by penetrating the side wall 101a of the container 101, and consists of a coaxial line in which the wall surface of the through hole 102a penetrating the side wall 101a is the outer conductor, and the core wire 102b located in the center of the through hole 102a is the inner conductor. The core wire 102b is fixed inside the through hole 102a by a dielectric bead 102c.

[0006] The substrate 103 is placed on the bottom surface of the container 101, and a device equipped with a high-frequency circuit is mounted in an area not shown. The substrate 103 also has a grounded coplanar line that connects to the device and extends to the end face on the side wall 101a of the substrate 103, where the signal wiring 104a is connected to the core wire 102b. The core wire 102b is electrically connected to the signal wiring 104a via a conductive material 106. The grounded coplanar line includes grounding wires 104b formed at two locations on either side of the signal wiring 104a, and a back-surface grounding wire 104c provided on the back surface of the substrate 103.

[0007] The package described above is an effective mounting configuration when there is only one connector 102 on the side wall 101a, or when relatively low-speed operation, such as below 100 GHz, is required. This is because, when there is only one connector 102, the circuit board 103 on which the device is mounted can be pressed against the side wall 101a, and the metallization of the side wall of the circuit board 103 enables connection between the side wall 101a and the grounding wire 104b, thus preventing degradation of frequency characteristics due to discontinuities in the grounding wire 104b. Furthermore, even if a gap occurs, if the operation is at a low speed, no degradation of characteristics will be observed in the desired bandwidth, so the impact is also minimal.

[0008] In the package described above, if the circuit board 103 has multiple ports and cannot be divided, for example, if the circuit board 103 is designed for a flip-chip, it is necessary to design the circuit board 103 to be smaller than the internal dimensions of the container 101. However, this creates a gap between the side wall 101a and the circuit board 103. As mentioned above, this gap degrades the characteristics. This has a particularly significant impact on modules that require a bandwidth of 100 GHz or higher.

[0009] As a structure that eliminates the aforementioned gap and suppresses characteristic degradation, there is a structure described in Non-Patent Document 1. In this structure, as shown in Figures 12A, 12B, and 12C, a block-shaped grounding conductor 205 is placed between the side wall 101a on which the connector 102 is located and the connection part of the grounding wiring 104b, with the core wire 102b in between. The grounding conductor 205 is electrically connected to the grounding wiring 104b via a conductive material 106. By adopting this structure, the discontinuity between the coaxial connector 102 and the grounding wiring 104b of the coplanar line formed on the substrate 103 is eliminated, and the effect of suppressing characteristic degradation can be expected.

[0010] T. Jyo et al., "Over 200-GHz-Bandwidth InP DHBT Baseband Amplifier ICs and Ultrabroadband Modules With 1- / 0.8-mm Coaxial Connectors", IEEE Transactions on Microwave Theory and Techniques, vol. 72, no. 9, pp. 5297-5308, 2024.

[0011] However, in the conventional technology described above, it is necessary to precisely arrange the grounding conductor 205 to achieve a predetermined characteristic impedance. However, it is not easy to place (tiny) grounding conductor 205 blocks of the same dimensions and shape at the same distance from the signal wiring 104a (core wire 102b) for each of the two grounding wires 104b (ends). When broadband characteristics are required, the grounding conductor 205 may be as small as 1 mm or less, making it even more difficult.

[0012] This invention was made to solve the above-mentioned problems, and aims to make it easier to suppress performance degradation even when a gap occurs between the side wall of the container and the substrate.

[0013] The high-frequency package according to the present invention comprises a container made of a conductive material, a connector made of a coaxial line in which the wall surface of a through-hole formed through the side wall of the container is an external conductor and a core wire positioned in the center of the through-hole is an internal conductor, a substrate made of a dielectric placed on the bottom surface of the container, a device having a high-frequency circuit mounted on the substrate, a coplanar line formed on the substrate and connected to the device, extending to the end face on the side wall side of the substrate, at the end on the side wall side of the substrate where the signal wiring is connected to the core wire, and a grounding component made of a conductive material which has legs that are in contact with the inner side surface of the side wall above the through-hole and connected to each of the grounding wires of the coplanar line formed at two locations on either side of the signal wiring at the end on the side wall side of the substrate.

[0014] As described above, according to the present invention, since the grounding component has legs in two places, even if a gap occurs between the side wall of the container and the substrate, performance degradation can be suppressed more easily.

[0015] Figure 1A is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 1 of the present invention. Figure 1B is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 1 of the present invention. Figure 1C is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 1 of the present invention. Figure 2A is a characteristic diagram showing the characteristics of a high-frequency package according to Embodiment 1 of the present invention. Figure 2B is a characteristic diagram showing the characteristics of a high-frequency package according to Embodiment 1 of the present invention. Figure 3A is a characteristic diagram showing the characteristics of a conventional high-frequency package. Figure 3B is a characteristic diagram showing the characteristics of a high-frequency package according to Embodiment 1 of the present invention. Figure 4 is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 2 of the present invention. Figure 5A is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 3 of the present invention. Figure 5B is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 3 of the present invention. Figure 6 is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 4 of the present invention. Figure 7 is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 5 of the present invention. Figure 8A is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 6 of the present invention. Figure 8B is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 6 of the present invention. Figure 8C is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 6 of the present invention. Figure 9 is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 7 of the present invention. Figure 10A is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 8 of the present invention. Figure 10B is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 8 of the present invention. Figure 10C is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 8 of the present invention. Figure 10D is a cross-sectional view showing a part of the configuration of a high-frequency package according to Embodiment 8 of the present invention. Figure 11A is a cross-sectional view showing a part of a conventional high-frequency package. Figure 11B is a cross-sectional view showing a part of a conventional high-frequency package. Figure 11C is a cross-sectional view showing a part of a conventional high-frequency package. Figure 12A is a cross-sectional view showing a part of a conventional high-frequency package. Figure 12B is a cross-sectional view showing a part of a conventional high-frequency package.Figure 11C is a cross-sectional view showing a partial configuration of a conventional high-frequency package.

[0016] The following describes a high-frequency package according to an embodiment of the present invention.

[0017] [Embodiment 1] First, a high-frequency package according to Embodiment 1 of the present invention will be described with reference to Figures 1A, 1B, and 1C. Figure 1B shows a cross-section of the line aa' in Figure 1A. Figures 1A, 1B, and 1C show a part of the high-frequency package.

[0018] This high-frequency package comprises a container 101 made of a conductive material, a connector 102 provided on the side wall 101a of the container 101, and a substrate 103 made of a dielectric material placed on the bottom surface of the container 101.

[0019] The connector 102 is composed of a coaxial line in which the wall surface of the through-hole 102a, formed by penetrating the side wall 101a of the container 101, serves as the outer conductor, and the core wire 102b, positioned in the center of the through-hole 102a, serves as the inner conductor. The core wire 102b is fixed on the central axis of the through-hole 102a by a dielectric bead 102c.

[0020] The substrate 103 has a device with a high-frequency circuit mounted in an area not shown. The substrate 103 also has a grounded coplanar line connected to this device, extending to the end face on the side wall 101a of the substrate 103, where the signal wiring 104a is connected to the core wire 102b. The core wire 102b is electrically connected to the signal wiring 104a via a conductive material 106. The grounded coplanar line includes two grounding wires 104b positioned on either side of the signal wiring 104a, and a back-surface grounding wire 104c formed on the back surface of the substrate 103.

[0021] Furthermore, this high-frequency package includes a grounding component 105 made of a conductive material. The grounding component 105 is provided in contact with the inner surface of the upper side wall 101a of the through hole 102a. In addition, the grounding component 105 has legs 105a that connect to each of the two grounding wires 104b at the end of the side wall 101a of the substrate 103. The legs 105a are electrically connected to the grounding wires 104b via a conductive material 106. Each of the two legs 105a provided on the grounding component 105 is electrically connected.

[0022] The conductive material 106 can be made of, for example, conductive paste or solder material. Here, a pattern 107 made of an insulator is provided around the conductive material 106, which can function as a dam for molten solder. This configuration makes it possible to easily align the legs 105a of the grounding component 105.

[0023] In the above description, a grounded coplanar was formed on the substrate 103, but a coplanar line can be formed using only the signal wiring 104a and the ground wiring 104b. Alternatively, a grounded coplanar or coplanar line can be provided near the connection point with the connector 102, and a microstrip line (MSL) can be formed with the mode conversion section in between.

[0024] The grounding component 105 can be formed by processing a conductive material, such as by cutting. Alternatively, the grounding component 105 can be manufactured by processing a metal material using a 3D printer. Furthermore, the grounding component 105 can have a surface composed of a conductive material. In this case, the grounding component 105 can be manufactured by molding the shape using a resin agent with a 3D printer and then forming a conductive film on the surface by plating or other means. Using a 3D printer makes it possible to create more complex structures.

[0025] As described above, by using a grounding component 105 equipped with legs 105a in two locations, the discontinuity between the connector 102 and the grounding wiring 104b of the substrate 103 provided inside the container 101 can be eliminated, thereby improving mountability and manufacturability while ensuring broadband characteristics. This effect will be explained with reference to Figures 12A and 12B. Conventional structure 1, explained using Figures 11A, 11B, and 11C, is shown with a dotted line, and conventional structure 2, explained using Figures 12A, 12B, and 12C, is shown with a dashed line. Embodiments are shown with solid lines.

[0026] In conventional structure 1, both the reflection characteristics (return loss) and transmission characteristics (insertion loss) deteriorate in the region above 90 GHz. In contrast, conventional structure 2 shows improved characteristics. The structure of the embodiment also achieves the same effect as conventional structure 2, indicating that the embodiment provides broadband characteristics. Furthermore, it is clear that the embodiment offers superior mountability and manufacturability compared to conventional structure 2.

[0027] Furthermore, Figures 3A and 3B show the results illustrating the effect of the embodiment on the mounting tolerance of the grounding component 105. The conventional structure 2, which was explained using Figures 12A, 12B, and 12C, is shown in Figure 3A, and the embodiment is shown in Figure 3B.

[0028] The conventional structure 2 compares the frequency characteristics when the block-shaped grounding conductor is misaligned by approximately 30% of its dimensions relative to the connector's core wire (assuming a misalignment of approximately 0.03 mm for a width of 0.16 mm) from its ideal mounting position, with the frequency characteristics when there is no misalignment. The case with misalignment is shown with a dashed line, and the case without misalignment is shown with a solid line. In this embodiment, the two legs 105a are integrally constructed, resulting in less variation in characteristics due to misalignment and improved manufacturing yield.

[0029] [Embodiment 2] Next, a high-frequency package according to Embodiment 3 of the present invention will be described with reference to Figure 4. Figure 4 shows a part of the high-frequency package. This package comprises a container 101, a connector 102, and a substrate 103. The substrate 103 is provided with a grounded coplanar line having signal wiring 104a, ground wiring 104b, and back-surface ground wiring 104c. A device equipped with a high-frequency circuit is mounted in an area of ​​the substrate 103 that is not shown. These configurations are the same as those of Embodiment 1 described above.

[0030] Furthermore, in Embodiment 2, the grounding component 105 is provided with legs 105a at two locations. In addition, in Embodiment 2, the grounding component 105 is provided with a notch 105b at the upper position of the through hole 102a. By providing the notch 105b, it becomes easier to grasp the grounding component 105, improving mounting efficiency.

[0031] [Embodiment 3] Next, a high-frequency package according to Embodiment 3 of the present invention will be described with reference to Figures 5A and 5B. Figure 5B shows a cross-section of line aa' in Figure 5A. Figures 5A and 5B show a part of the high-frequency package. This package comprises a container 101, a connector 102, and a substrate 103. The substrate 103 is provided with a grounded coplanar line having signal wiring 104a, ground wiring 104b, and back-surface ground wiring 104c. A device equipped with a high-frequency circuit is mounted in an area of ​​the substrate 103 that is not shown. Embodiment 3 also includes a grounding component 105 with legs 105a in two locations. These configurations are the same as those of Embodiment 1 described above.

[0032] In the third embodiment, a positioning structure 101b is provided on the inner surface of the upper side wall 101a of the through hole 102a. The positioning structure 101b can be, for example, a guide pin formed on the inner surface of the side wall 101a. The grounding component 105 is provided with a hole 105c in the upper part of the through hole 102a that fits into the positioning structure 101b.

[0033] In this way, by providing the positioning structure 101b and the hole 105c, the grounding component 105 can be mounted more precisely, characteristic degradation caused by misalignment of the grounding component 105 is suppressed, and the yield in module manufacturing is improved. The grounding component 105 can also be configured to have a recess that fits into the convex positioning structure 101b.

[0034] [Embodiment 4] Next, a high-frequency package according to Embodiment 4 of the present invention will be described with reference to Figure 6. Figure 6 shows a part of the high-frequency package. This package comprises a container 101, a connector 102, and a substrate 103. The substrate 103 is provided with a grounded coplanar line having signal wiring 104a, ground wiring 104b, and back-surface ground wiring 104c. A device equipped with a high-frequency circuit is mounted in an area of ​​the substrate 103 that is not shown. Embodiment 4 also includes a grounding component 105 with legs 105a in two locations. These configurations are the same as those of Embodiment 1 described above.

[0035] Furthermore, Embodiment 4 includes a positioning structure 101b formed on the inner side surface of the upper side wall 101a of the through hole 102a. This configuration is the same as that of Embodiment 3 described above. In Embodiment 4, the grounding component 105 has a hole 105d that fits into the positioning structure 101b at the top of the through hole 102a and is elongated vertically in the direction normal to the bottom surface. For example, the shape of the hole 105d can be oval. With this configuration, the degree of freedom of the grounding component 105 in the direction normal to the bottom surface is increased, which can absorb variations due to the thickness tolerance of the substrate 103 and the manufacturing tolerance of the container 101, and enables a more stable placement of the grounding component 105.

[0036] [Embodiment 5] Next, a high-frequency package according to Embodiment 5 of the present invention will be described with reference to Figure 7. Figure 7 shows a part of the high-frequency package. This package comprises a container 101, a connector 102, and a substrate 103. The substrate 103 is provided with a grounded coplanar line having signal wiring 104a, ground wiring 104b, and back-surface ground wiring 104c. A device equipped with a high-frequency circuit is mounted in an area of ​​the substrate 103 that is not shown. Embodiment 5 also includes a grounding component 105 with legs 105a in two locations. These configurations are the same as those of Embodiment 1 described above.

[0037] In Embodiment 5, sets of positioning structures 101b on the inner side surface of the side wall 101a and holes 105c in the grounding component 105 are provided at multiple locations. By positioning multiple positioning structures 101b, the grounding component 105 can be positioned more precisely.

[0038] [Embodiment 6] Next, a high-frequency package according to Embodiment 6 of the present invention will be described with reference to Figures 8A, 8B, and 8C. Figure 8B shows a cross-section of line aa' in Figure 8A. Figures 8A, 8B, and 8C show a part of the high-frequency package. This package comprises a container 101, a connector 102, and a substrate 103. The substrate 103 is provided with a grounded coplanar line having signal wiring 104a, ground wiring 104b, and back-surface ground wiring 104c. A device equipped with a high-frequency circuit is mounted in an area of ​​the substrate 103 that is not shown. Embodiment 6 also includes a grounding component 105 with legs 105a in two locations. These configurations are the same as those of Embodiment 1 described above.

[0039] Embodiment 6 includes a retaining wall-like support portion 108 made of a conductive material, which is installed between the leg portion 105a of the grounding component 105 and the grounding wiring 104b. The support portion 108 is formed on the grounding wiring 104b via a conductive material 106. The support portion 108 is provided in two locations, overlapping the positions of the two leg portions 105a. By providing the support portion 108, the grounding component 105 becomes self-supporting, and furthermore, the electrical connection area between the grounding wiring 104 and the grounding component 105 can be increased. By providing the support portion 108, the joining process of the grounding component 105 can be made more stable.

[0040] [Embodiment 7] Next, a high-frequency package according to Embodiment 7 of the present invention will be described with reference to Figure 9. Figure 9 shows a part of the high-frequency package. This package comprises a container 101, a connector 102, and a substrate 103. The substrate 103 is provided with a grounded coplanar line having signal wiring 104a, ground wiring 104b, and back-surface ground wiring 104c. A device equipped with a high-frequency circuit is mounted in an area of ​​the substrate 103 that is not shown. Embodiment 7 also includes a grounding component 105' with legs 105'a in two locations. These configurations are the same as those of Embodiment 1 described above.

[0041] In Embodiment 7, the grounding component 105' includes an arched opening 105'b formed in an arch shape with the leg portion 105'a as a base. The arch shape of the arched opening 105'b is formed such that the characteristic impedance of the cross-sectional structure formed by the grounding component 105', the core wire 102b, and the coplanar line in a plane parallel to the side surface of the side wall 101a where the grounding component 105' is placed is 50Ω or a desired characteristic impedance.

[0042] As described above, by adopting an arch shape, impedance matching can be achieved compared to Embodiment 1, leading to a reduction in discontinuities and an expected improvement in characteristics.

[0043] [Embodiment 8] Next, a high-frequency package according to Embodiment 8 of the present invention will be described with reference to FIGS. 10A, 10B, 10C, and 10D. FIG. 10B shows a cross-section taken along line aa' of FIG. 10A. Further, FIG. 10C schematically shows a cross-section of the grounding component 105" along line bb' of FIG. 10B, and FIG. 10D schematically shows a cross-section of the grounding component 105" along line cc' of FIG. 10B. Note that FIGS. 10A, 10B, 10C, and 10D show a part of the high-frequency package.

[0044] This package includes a container 101, a connector 102, and a substrate 103. The substrate 103 is provided with a grounded coplanar waveguide line including a signal wiring 104a, a ground wiring 104b, and a back surface ground wiring 104c. Also, a device including a high-frequency circuit is mounted in a region of the substrate 103 not shown. Also, in Embodiment 8, a grounding component 105' having leg portions 105'a at two locations is provided. These configurations are the same as those of Embodiment 1 described above.

[0045] In Embodiment 8, the grounding component 105" includes an arch opening 105"b formed in an arch shape with the leg portion 105"a as a pedestal. In Embodiment 8, the grounding component 105" has a greater thickness in the direction away from the side wall 101a and is in a state where it is integrated with the support portion of Embodiment 6 described above. By increasing the thickness, the conductive material 106 that connects the core wire 102b and the signal wiring 104a is configured to be covered by the grounding component 105". The height of the arch opening 105"b of the grounding component 105" formed thick in this way is gradually increased from the center portion side of the container 101 toward the side wall 101a.

[0046] With the above configuration, when a high-frequency signal migrates from the core wire 102b to the signal wiring 104a, a desired impedance can be obtained. By gradually increasing the height of the arch opening 105"b from the center portion side of the container 101 toward the side wall 101a, the characteristic impedance from the core wire 102b to the signal wiring 104a can be smoothly changed, unnecessary electromagnetic radiation can be suppressed, and the characteristics can be improved.

[0047] As described above, according to the embodiment of the present invention, since the grounding component includes legs at two locations, even if a gap occurs between the side wall of the container and the substrate, characteristic degradation can be more easily suppressed.

[0048] Some or all of the above embodiments are also described as follows in the appended claims, but are not limited thereto.

[0049] [Appended Claim 1] A high-frequency package including: a container made of a conductive material; a coaxial line in which the wall surface of a through-hole formed through the side wall of the container serves as an external conductor and a core wire disposed at the center of the through-hole serves as an internal conductor; a substrate made of a dielectric placed on the bottom surface of the container; a device including a high-frequency circuit mounted on the substrate; a coplanar line formed on the substrate and connected to the device, extended to the end surface on the side of the side wall of the substrate, and at the end on the side of the side wall of the substrate, the signal wiring is connected to the core wire; and a grounding component made of a conductive material, having legs that contact the inner side surface of the side wall above the through-hole and are connected to each of the grounding wirings of the coplanar line formed at two locations sandwiching the signal wiring at the end on the side of the side wall of the substrate.

[0050] [Appended Claim 2] The high-frequency package according to Appended Claim 1, wherein the grounding component includes a notch at the upper part of the through-hole. [[ID=eleven]]

[0051] [Appended Claim 3] The high-frequency package according to Appended Claim 1 or 2, including a positioning structure formed on the inner side surface of the side wall above the through-hole, and the grounding component includes a hole or a recess that fits into the positioning structure at the upper part of the through-hole.

[0052] [Appended Claim 4] The high-frequency package according to Appended Claim 2, wherein the shape of the hole that fits into the positioning structure is vertically long in the normal direction of the bottom surface.

[0053] [Appended Claim 5] The high-frequency package according to Appended Claim 2, including the positioning structure formed at a plurality of locations on the inner side surface of the side wall above the through-hole.

[0054] [Appendix 6] A high-frequency package according to any one of the appendices 1 to 5, comprising a bracing wall-like support portion made of a conductive material and installed between the legs of the grounding component and each of the grounding wires.

[0055] [Appendix 7] A high-frequency package according to any one of Appendix 1 to 6, wherein the grounding component is formed in an arch shape with the legs as a base, and the arch shape is formed such that the characteristic impedance of the cross-sectional structure formed by the grounding component, the core wire, and the coplanar line in a plane parallel to the side surface of the side wall at the location where the grounding component is placed is 50 Ω or a desired characteristic impedance.

[0056] [Appendix 8] A high-frequency package according to any one of the appendices 1 to 6, wherein the grounding component is formed in an arch shape with the leg portion as a placket, and the height of the arch opening is gradually increased from the center of the container to the side wall.

[0057] It should be noted that the present invention is not limited to the embodiments described above, and it is clear that many modifications and combinations can be implemented within the technical concept of the present invention by those with ordinary skill in the art.

[0058] 101...Container, 101a...Side wall, 102...Side wall, 102a...Through hole, 102b...Core wire, 102c...Bead, 103...Substrate, 104a...Signal wiring, 104b...Grounding wiring, 104c...Backside grounding wiring, 105...Grounding component, 105a...Legs, 106...Conductive material, 107...Pattern.

Claims

1. A high-frequency package comprising: a container made of a conductive material; a connector made of a coaxial line in which the wall surface of a through-hole formed through the side wall of the container is an external conductor and a core wire positioned in the center of the through-hole is an internal conductor; a substrate made of a dielectric material placed on the bottom surface of the container; a device having a high-frequency circuit mounted on the substrate; a coplanar line formed on the substrate and connected to the device, extending to the end face of the substrate on the side wall side, and at the end of the substrate on the side wall side, the signal wiring is connected to the core wire; and a grounding component made of a conductive material, having legs that are in contact with the inner side surface of the side wall above the through-hole and connected to each of the grounding wires of the coplanar line formed at two locations on either side of the signal wiring at the end of the substrate on the side wall side.

2. The high-frequency package according to claim 1, wherein the grounding component has a notch at the top of the through hole.

3. A high-frequency package according to claim 1, comprising a positioning structure formed on the inner side surface of the side wall above the through hole, wherein the grounding component has a hole or recess above the through hole that fits into the positioning structure.

4. A high-frequency package according to claim 2, wherein the shape of the hole that fits into the positioning structure is elongated vertically in the direction normal to the bottom surface.

5. A high-frequency package according to claim 2, comprising the positioning structure formed at multiple locations on the inner side surface of the side wall above the through hole.

6. A high-frequency package according to claim 1, comprising a bracing wall-like support portion made of a conductive material and installed between the legs of the grounding component and each of the grounding wires.

7. A high-frequency package according to claim 1, wherein the grounding component is formed in an arch shape with the legs as a base, and the arch shape is formed such that the characteristic impedance of the cross-sectional structure formed by the grounding component, the core wire, and the coplanar line in a plane parallel to the side surface of the side wall at the location where the grounding component is placed is 50 Ω or a desired characteristic impedance.

8. A high-frequency package according to claim 1, wherein the grounding component is formed in an arch shape with the legs as a base, and the height of the arch opening is gradually increased from the center of the container towards the side wall.

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