Non-contact power supply device and cooling unit

Abstract

Provided are a non-contact power supply device and a cooling unit in which power transmission / reception efficiency is improved by suppressing a temperature rise of a magnetic member due to heat generation of a coil. A non-contact power supply device (100) according to the present disclosure transmits or receives power in a non-contact manner, without providing a physical electrical connection with another device (second non-contact power supply device (200)), by utilizing a resonance phenomenon of a magnetic field or an electric field formed therebetween. The non-contact power supply device (100) is characterized by comprising: a coil (10) that transmits or receives power; and a magnetic member (20) disposed on the opposite side to the other device with respect to the coil (10), wherein a flow path (coolant flow path (F)) through which a coolant for cooling the coil (10) and the magnetic member (20) passes is formed, at least a part of the coil (10) is in contact with a wall part (coil cover (30)) forming the flow path, and at least a part of the coil (10) is exposed from the wall part forming the flow path.

Description

Non-contact power supply device and cooling unit

[0001] The present disclosure relates to a non-contact power supply device and a cooling unit.

[0002] Reducing greenhouse gas emissions has become an important global issue, and electric vehicles that do not emit carbon dioxide during driving are rapidly spreading. When using such electric vehicles, it is an issue to easily and quickly charge the rechargeable battery mounted on the vehicle, and the development of a non-contact power supply device that can charge the vehicle without using a charging cable has been promoted (for example, Patent Document 1). In this non-contact power supply device, a magnetic field is generated by supplying high-frequency power to a primary coil, and a magnetic field resonance method or an electromagnetic induction method in which high-frequency power is received non-contact on the secondary coil side by magnetic coupling between the primary coil and the secondary coil is generally adopted.

[0003] Japanese Patent Application Laid-Open No. 2012-228123

[0004] By the way, in a conventional non-contact power supply device, in order to suppress self-inductance when a current is supplied to a coil and a decrease in magnetic field due to a positional shift between the primary coil and the secondary coil, a magnetic member is arranged near the coil to concentrate the magnetic field generated in the coil and stabilize it in a state where the magnetic field is strong. However, in the configuration of Patent Document 1, since the cooling device is arranged on the side opposite to the ferrite core with respect to the coil, the temperature rise of the magnetic member due to the heat generation of the coil cannot be sufficiently suppressed. When the temperature of the magnetic member rises due to the heat generation of the coil, the energy loss in the magnetic member increases and the function of the magnetic member described above is lost, so there is still room for improvement in this regard.

[0005] Therefore, the present disclosure aims to solve such problems, and its purpose is to provide a non-contact power supply device and a cooling unit that suppress the temperature rise of a magnetic member due to heat generation of a coil or other members and improve the power transmission and reception efficiency.

[0006] To solve the above-mentioned problems, the contactless power supply device of the present disclosure is characterized in that: [1] a contactless power supply device that transmits or receives power to or from another device without contact, comprising: a coil for transmitting or receiving power; and a magnetic member disposed on the opposite side of the coil from the other device; a flow path is formed through which a coolant for cooling the coil and the magnetic member passes; at least a part of the coil is in contact with the wall forming the flow path; and at least a part of the coil is exposed from the wall forming the flow path.

[0007] Furthermore, in the contactless power supply device of the present disclosure, [2] in the configuration described in [1] above, it is preferable that the flow path is formed between the coil and the magnetic material member.

[0008] Furthermore, in the contactless power supply device of the present disclosure, [3] in the configuration described in [1] or [2] above, it is preferable that the coil dissipates heat by being exposed to the flow path and directly contacting the refrigerant, or by indirectly contacting the refrigerant through the second wall portion forming the flow path, and that the magnetic material member dissipates heat to the refrigerant through the wall portion forming the flow path.

[0009] Furthermore, in the contactless power supply device of the present disclosure, [4] in the configuration described in any of [1] to [3] above, it is preferable that the coil dissipates heat by directly contacting the refrigerant, and the magnetic material member dissipates heat to the refrigerant via other members.

[0010] Furthermore, in the contactless power supply device of the present disclosure, [5] in the configuration described in any of [1] to [4] above, it is preferable that the wall portion forming the flow path is made of a non-magnetic and insulating material.

[0011] Furthermore, in the contactless power supply device of the present disclosure, [6] in the configuration described in [5] above, it is preferable that the material includes a thermoplastic resin and / or a thermosetting resin.

[0012] Furthermore, in the contactless power supply device of the present disclosure, [7] in the configuration described in [5] or [6] above, it is preferable that the material includes a polyamide resin or a continuous fiber-reinforced resin composite material.

[0013] Furthermore, in the contactless power supply device of the present disclosure, [8] in the configuration described in any of [1] to [7] above, it is preferable that the refrigerant is a liquid that does not contain magnetic material.

[0014] Furthermore, in the contactless power supply device of the present disclosure, [9] in the configuration described in any of [1] to [8] above, the refrigerant is preferably LLC or a refrigerant mainly composed of oil.

[0015] Furthermore, in the contactless power supply device of the present disclosure,

[10] in the configuration described in any of [1] to [9] above, it is preferable that the refrigerant circulates within the flow path via an inlet and an outlet provided at the end of the flow path.

[0016] Furthermore, in order to solve the above-mentioned problems, the cooling unit of the present disclosure comprises

[11] a coil and a flow path through which a refrigerant for cooling the coil passes, wherein at least a portion of the coil is in contact with a wall portion forming the flow path, and at least a portion of the coil is exposed from the wall portion forming the flow path.

[0017] Furthermore, in the cooling unit of the present disclosure,

[12] in the configuration described in

[11] above, it is preferable that at least a portion of the wall portion forming the flow path includes a thermoplastic resin and / or a thermosetting resin.

[0018] Furthermore, in the cooling unit of the present disclosure,

[13] in the configuration described in

[11] or

[12] above, it is preferable that at least a portion of the wall portion forming the flow path includes a polyamide resin or a continuous fiber-reinforced resin composite material.

[0019] Furthermore, in the cooling unit of the present disclosure,

[14] in the configuration described in any of

[11] to

[13] above, it is preferable that the coil is in direct contact with the refrigerant.

[0020] Furthermore, in order to solve the above-mentioned problems, the contactless power supply device of the present disclosure includes a coil cover made of a continuous fiber-reinforced resin composite material comprising a continuous fiber-reinforced resin having a substantially circular cross-section and a synthetic resin, wherein the proportion of continuous reinforced fibers in the peripheral outer region formed from the periphery of the continuous reinforced fiber to a distance of one-tenth of the radius of the continuous reinforced fiber along the periphery at the polar interface between one of the continuous reinforced fibers and the synthetic resin in a cross-section perpendicular to the longitudinal direction of the continuous reinforced fibers is 10% or more of the total number of continuous reinforced fibers, and the synthetic resin impregnation rate in the continuous fiber-reinforced resin composite material is 99% or more.

[0021] According to this disclosure, it is possible to provide a non-contact power supply device and a cooling unit that suppress the temperature rise of the magnetic material component due to heat generation from the coil, thereby improving the power transmission and reception efficiency.

[0022] This figure shows an example of the configuration of a contactless power supply system for mobile devices using the contactless power supply device of the present disclosure. This is a right side cross-sectional view showing the configuration of the contactless power supply device according to the first embodiment of the present disclosure. This is an exploded perspective view of the contactless power supply device according to the first embodiment of the present disclosure. This is a detailed view of part A in Figure 2. This is a first modified example of the coil cover on which the coil is arranged in the contactless power supply device according to the first embodiment of the present disclosure. This is a second modified example of the coil cover on which the coil is arranged in the contactless power supply device according to the first embodiment of the present disclosure. This is a third modified example of the coil cover on which the coil is arranged in the contactless power supply device according to the first embodiment of the present disclosure. This is a right side cross-sectional view showing the configuration of the cooling unit according to the first embodiment of the present disclosure. This is a right side cross-sectional view showing the configuration of the contactless power supply device according to the second embodiment of the present disclosure. This is an exploded perspective view of the contactless power supply device according to the second embodiment of the present disclosure. This is a right side cross-sectional view showing the configuration of the cooling unit according to the second embodiment of the present disclosure. This is a right side cross-sectional view showing the configuration of the contactless power supply device according to the third embodiment of the present disclosure. This is a right side cross-sectional view showing the configuration of the cooling unit according to the third embodiment of the present disclosure. This diagram illustrates the "voids" and "porosity" that exist within the peripheral outer region (polar interface region) at a distance of one-tenth the radius of a single continuous reinforcing fiber, in the polar interface between a single continuous reinforcing fiber and a synthetic resin in a cross-section perpendicular to the longitudinal direction of the continuous reinforcing fiber.

[0023] The present disclosure will be described in more detail below with reference to the drawings.

[0024] (First Embodiment) Figure 1 shows an example of the configuration of a mobile contactless power supply system 500 using a contactless power supply device 100 according to the first embodiment of the present disclosure. The mobile contactless power supply system 500 includes a power transmission system 250 that transmits power to a vehicle 300 to be charged, and a power receiving system 150 that receives power from the power transmission system 250.

[0025] The power transmission system 250 includes an external power supply 230, a power transmission-side power converter 220 that converts power from the external power supply 230 into DC power of a predetermined voltage, and a second contactless power supply device 200 (other device) that transmits DC power from the power transmission-side power converter 220 to the power receiving system 150.

[0026] The power receiving system 150 includes a contactless power supply device 100 that receives power from the power transmission system 250, a power receiving side power converter 120 that converts the power received by the contactless power supply device 100 into DC power of a predetermined voltage, and a battery 130 that stores the DC power converted by the power receiving side power converter 120. The contactless power supply device 100, the power receiving side power converter 120, and the battery 130 that constitute the power receiving system 150 are located inside the vehicle 300 that is to be charged.

[0027] (Contactless Power Supply Device) In this disclosure, the contactless power supply device 100 and the second contactless power supply device 200 mean devices that transmit or receive power without contact by utilizing the resonance phenomenon of magnetic and electric fields formed between the transmitting and receiving sides, without providing a physical electrical connection between them.

[0028] In this embodiment, the contactless power supply device 100 on the power receiving system 150 side and the second contactless power supply device 200 on the power transmission system 250 side transmit and receive power using a magnetic field resonance method. The second contactless power supply device 200 transmits and receives power by passing an alternating current at a predetermined resonant frequency through the second coil 240, and then passing an alternating current through the coil 10 on the contactless power supply device 100 side, where the vibration of the magnetic field generated by the alternating current vibrates at the same resonant frequency. Therefore, it should be noted that the transmission and reception of power in this embodiment is a concept that includes cases where power from the power transmission system 250 is transmitted to the power receiving system 150 side via magnetic field vibrations, etc., and power is not necessarily transmitted directly from the power transmission system 250 to the power receiving system 150.

[0029] This also applies when the contactless power supply device 100 on the receiving system 150 side and the second contactless power supply device 200 on the transmitting system 250 side transmit and receive power using a magnetic field resonance method or other power supply method. When using the magnetic field resonance method, an alternating current is passed through the second coil on the transmitting system 250 side to vibrate the surrounding magnetic field, causing the coil on the receiving system 150 side to resonate, thereby passing an alternating current through the coil. Therefore, power is not directly transmitted from the transmitting system 250 to the receiving system 150.

[0030] As shown in Figures 2 to 4, the contactless power supply device 100 according to the first embodiment of this disclosure includes a coil 10 for receiving power, a magnetic material member 20 positioned on the opposite side (upper side in Figure 2) from the coil 10 to the other device (second contactless power supply device 200) (shown by a dashed line in Figure 2), a flow path forming member 40 made of thermoplastic resin positioned between the coil 10 and the magnetic material member 20, a coil cover 30 covering the coil 10 from the outside (lower side in Figure 2), and a magnetic material cover 50 covering the magnetic material member 20 from the outside (upper side in Figure 2). That is, a flow path (coolant flow path F) is formed between the coil 10 and the magnetic material member 20 through which a cooling liquid (sometimes referred to as "refrigerant" in this specification) for cooling the coil 10 and the magnetic material member 20 passes. Since the flow path is formed between the coil 10 and the magnetic material member 20, the coil 10 and the magnetic material member 20 can be cooled simultaneously, and the temperature rise of the magnetic material member 20 due to heat generated by the coil 10 can be suppressed to a high degree.

[0031] The flow path according to this embodiment is composed of a wall portion that forms the flow path (which may be referred to as "flow path wall" or "wall portion" in this specification). The flow path wall is a general term for a member that forms a flow path and comes into contact with the refrigerant. The flow path wall includes, for example, a flow path forming member 40 and a coolant conduit 60, and may also include a coil cover 30 or other members.

[0032] In this embodiment, two coolant conduits 60, spaced apart in the left-right direction (perpendicular to the plane of the paper in Figure 2), are sandwiched between the coil cover 30 and the magnetic material cover 50. One coolant conduit 60 introduces coolant (refrigerant) into the coolant flow path F formed by the flow path forming member 40, and discharges the coolant in the coolant flow path F to the outside through the other coolant conduit 60. The coolant circulates within the coolant flow path F via the inlet and outlet (two coolant conduits 60) provided at the front end of the coolant flow path F.

[0033] Figures 2 and 4 are both right-side cross-sectional views, specifically cross-sectional views taken through a coolant conduit 60 that is offset in the Y-axis direction from the center of the coil 10.

[0034] For the coolant, for example, cooling water, LLC (Long Life Coolant), or oil can be used.

[0035] The contactless power supply device 100 according to this embodiment is described as a device used on the power receiving system 150 side, but it can also be used as a device on the power transmission system 250 side. In Figures 1 and 2, a second contactless power supply device 200 on the power transmission system 250 side is positioned opposite the contactless power supply device 100 on the power receiving system 150 side. The second contactless power supply device 200 is, for example, embedded in the ground and transmits power to the contactless power supply device 100 on the power receiving system 150 side by magnetic resonance. The configuration of the second contactless power supply device 200 can be, for example, the same as the contactless power supply device 100 shown in Figure 2 but inverted (in Figure 2, only the second coil 240, which is positioned opposite the coil 10, is shown as a component of the second contactless power supply device 200 by a dashed line).

[0036] In this specification, claims, and drawings, the side of the non-contact power supply device 100 where the magnetic body cover 50 is located is defined as the upper side (upper side in Figure 2, positive Z-axis direction), and the side where the coil cover 30 is located is defined as the lower side (lower side in Figure 2, negative Z-axis direction). The side where the coolant conduit 60 is located is defined as the front side (left side in Figure 2, negative X-axis direction), and the side opposite to where the coolant conduit 60 is located is defined as the rear side (right side in Figure 2, positive X-axis direction). The left-right direction of the non-contact power supply device 100 is defined as the left-right direction when the non-contact power supply device 100 is viewed from the front, with the front side perpendicular to the plane of Figure 2 being the right side (negative Y-axis direction), and the back side perpendicular to the plane of Figure 2 being the left side (positive Y-axis direction). In other words, the upper, lower, front, rear, right, and left sides of the contactless power supply device 100 are independent of the mounting orientation of the contactless power supply device 100 to the vehicle 300, etc.

[0037] As shown in Figures 2 and 3, the coil 10 is formed in a plane parallel to the XY axis plane, and in this embodiment, it is insert-molded into the coil cover 30. As shown in the perspective view in Figure 3, the coil 10 is formed in a spiral shape from the radially outer side to the inner side, and is electrically connected to the control board 110.

[0038] For the coil 10, for example, an uncoated metal wire may be used, or the metal wire may be coated with a material such as polyimide, polyurethane, polyester, polyamide-imide, polyester-imide, or fluororesin.

[0039] In this embodiment, the refrigerant (coolant) is preferably an oil-based refrigerant. "Main component" means that the content of the component is 50% by mass or more of the total refrigerant by mass. By using an oil-based refrigerant, even when the coil 10 is in direct contact with the refrigerant, a decrease in power transmission efficiency due to corrosion of the coil 10 can be suppressed. When using lubricating oil or water used to lubricate other units as the coolant supplied to the coolant flow path F, it is preferable to coat the metal wire. Copper or aluminum can be used as the material for the metal wire.

[0040] As shown in Figure 3, the coil cover 30 comprises a coil arrangement section 31 having a substantially rectangular shape with a rounded chamfer in plan view, where the coil 10 is arranged by insert molding, and a circuit arrangement section 32 having a narrower width in the left-right direction than the coil arrangement section 31, where the control board 110 is arranged. On the upper surface of the coil arrangement section 31 of the coil cover 30, as shown in Figures 2 and 4, the coil 10, which is arranged in the coil recess 33a of the bottom wall 33 (the wall portion that forms the flow path), is exposed. In other words, the coil 10 is embedded in the coil recess 33a of the coil projection wall 33b that protrudes upward from the bottom wall 33. The coil projection wall 33b is provided in a spiral shape in plan view along the coil 10. In the illustrated example, the upper end surface of the coil 10 and the upper end surface of the coil projection wall 33b are flush (at the same height), and the upper end surface of the coil 10 is exposed from the bottom wall 33.

[0041] Furthermore, a bottom wall groove 33d that is recessed downwards is provided between the coil protrusions 33b. The coolant enters into this bottom wall groove 33d and cools the bottom wall 33, so the temperature rise of the bottom wall 33 due to the heat generated by the coil 10 can be effectively suppressed.

[0042] Furthermore, the cross-sectional shape of the coil 10 is not limited to a rectangular shape; various shapes can be adopted, including approximately circular shapes and flattened shapes including elliptical shapes.

[0043] When the coil 10 is formed of a metal wire without a coating, the metal wire is exposed on the upper surface of the coil cover 30. When the coil 10 is formed of a metal wire with a coating, the coating is exposed on the upper surface of the coil cover 30.

[0044] Note that the mode of providing the coil 10 on the bottom wall 33 is not limited to the shape shown in FIG. 4. For example, as shown in FIG. 5A, the upper end surface of the coil 10 may protrude upward from the upper end surface of the coil protruding wall 33b so as to improve the heat exchange efficiency between the coil 10 and the refrigerant. Further, as shown in FIG. 5B, a coil recess 33a may be provided on the side portion of the coil protruding wall 33b so that the coil 10 is embedded in the coil recess 33a. As a result, a part of the coil protruding wall 33b covers the coil 10 from above, so that the coil 10 can be more stably fixed to the bottom wall 33. Furthermore, as shown in FIG. 5C, the center of the coil 10 may be penetrated by a column portion 33c2 protruding upward from the bottom wall 33, and the coil 10 may be anchor-fixed by an umbrella portion 33c1 integrally formed on the upper portion of the column portion 33c2.

[0045] The non-contact power feeding device 100 in the present disclosure may further include an electronic member such as a control board 110. The location where the electronic member is arranged is not particularly limited. For example, by arranging the electronic member in the vicinity of the flow path, it becomes possible to cool the electronic member simultaneously with the coil 10 and the magnetic member 20, and it is possible to suppress a decrease in power transmission efficiency due to heat generation or heating of the electronic member.

[0046] As shown in FIG. 2, the coil cover 30 has a bottom wall 33 on which the coil 10 is arranged, a side wall 34 standing from the outer edge portion of the bottom wall 33, and a flange portion 35 extending outward from the upper end portion of the side wall 34. As shown in FIG. 3, the side wall 34 and the flange portion 35 surround the coil arrangement portion 31 and extend to the region of the circuit arrangement portion 32. By surrounding the outer edge portion of the coil cover 30 with the side wall 34 and the flange portion 35 in this way, the bending strength and the like of the coil cover 30 can be improved, so that the coil cover 30 can be easily formed of a lightweight thermoplastic resin or the like.

[0047] In this embodiment, the material used for the flow channel wall (wall portion) is preferably a material that has excellent refrigerant resistance (oil resistance when oil is used as a refrigerant) and impact resistance. From the viewpoint of being non-magnetic and insulating, a resin material is preferably used as the material, and the resin material preferably contains at least one of the following: polyamide resin, polyphenylene ether resin, polyphenylene sulfide resin, polyolefin resin, polyester resin, etc. Furthermore, from the viewpoint of oil resistance, the resin material is more preferably a polyamide resin or a continuous fiber reinforced resin composite material, and from the viewpoint of oil resistance and impact resistance, it is even more preferably a continuous fiber reinforced resin composite material.

[0048] <Polyamide Resins> Examples of polyamide resins include polyamides, polyamide copolymers, and mixtures thereof. Polyamide resins may include polymers obtained by self-condensation of aminocarboxylic acids, ring-opening polymerization of lactams, and polycondensation of diamines and dicarboxylic acids.

[0049] The polyamide resin may be a single type or a combination of two or more types.

[0050] Examples of polyamides include nylon 66, nylon 610, nylon 612, nylon 46, nylon 1212, nylon 6T (where T represents the terephthalic acid component), nylon 9T, nylon 6I (where I represents the isophthalic acid component), etc., obtained by polycondensation of diamines and dicarboxylic acids, and nylon 6, nylon 11, nylon 12, etc., obtained by ring-opening polymerization of lactams.

[0051] Examples of polyamide copolymers include nylon 6 / 66, nylon 66 / 6, nylon 66 / 610, nylon 66 / 612, nylon 66 / 6T, nylon 66 / 6I, nylon 6T / 6I, and the like.

[0052] Examples of polyamide resin mixtures include a mixture of nylon 66 and nylon 6, a mixture of nylon 66 and nylon 612, a mixture of nylon 66 and nylon 610, a mixture of nylon 66 and nylon 6I, a mixture of nylon 66 and nylon 6T, and a mixture of nylon 6 and nylon 6I / 6T.

[0053] <Continuous Fiber Reinforced Resin Composite Material> A continuous fiber reinforced resin composite material (hereinafter also simply referred to as "composite material") includes continuous reinforced fibers and a thermoplastic resin. The form of the continuous fiber reinforced resin composite material is not particularly limited, and various forms such as the following can be cited. For example, a form in which woven or knitted fabrics, braids, or pipe-shaped materials of continuous reinforced fibers are combined with a thermoplastic resin; a form in which continuous reinforced fibers aligned in one direction are combined with a thermoplastic resin; a form in which yarn made of continuous reinforced fibers and thermoplastic resin is aligned in one direction and shaped; and a form in which yarn made of continuous reinforced fibers and thermoplastic resin is shaped into woven fabrics, knitted fabrics, braids, or pipe-shaped materials.

[0054] The continuous fiber-reinforced resin composite material of this embodiment may be a flat plate, or a laminate including a layer of continuous reinforcing fibers and a layer of thermoplastic resin. For example, the longitudinal direction of the continuous reinforcing fibers may be arranged substantially parallel to the surface of the flat plate. The layer of continuous reinforcing fibers is a layer containing continuous reinforcing fibers (for example, a continuous reinforcing fiber substrate), and may be a layer in which thermoplastic resin is impregnated inside the continuous reinforcing fibers.

[0055] The form of the intermediate material before shaping of the continuous fiber-reinforced resin composite material is not particularly limited, and examples include a blended yarn of continuous reinforcing fibers and resin fibers, a coated yarn in which a bundle of continuous reinforcing fibers is covered with resin, continuous reinforcing fibers pre-impregnated with resin and made into a tape, continuous reinforcing fibers sandwiched between resin films, continuous reinforcing fibers with resin powder attached, a core material of continuous reinforcing fibers surrounded by a braided cord of resin fibers, reinforcing fibers pre-impregnated with resin, and a form in which continuous reinforcing fibers are in contact with molten resin.

[0056] Examples of continuous reinforcing fibers include, but are not limited to, glass fibers, carbon fibers, plant fibers, aramid fibers, ultra-high-strength polyethylene fibers, polybenzazole fibers, liquid crystal polyester fibers, polyketone fibers, metal fibers, and ceramic fibers.

[0057] From the viewpoints of mechanical properties, thermal properties, and versatility, glass fibers, carbon fibers, plant fibers, and aramid fibers are preferred, and from the viewpoint of productivity, glass fibers are preferred.

[0058] The continuous fibers described above may be used individually or in combination of two or more types.

[0059] The continuous fibers described above may be treated with a surface treatment agent.

[0060] The thermoplastic resins mentioned above are not limited to the following, but include, for example, polyolefin resins such as polyethylene and polypropylene; polyamide resins such as polyamide 6, polyamide 66, polyamide 46, polyamide 612, and polyamide 6I; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polytrimethylene terephthalate; polyacetal resins such as polyoxymethylene; polycarbonate resins; polyether resins such as polyether ketone, polyether ether ketone, polyether glycol, polypropylene glycol, and polytetramethylene ether glycol; polyether sulfone; polyphenylene sulfide; thermoplastic polyetherimide; thermoplastic fluorine resins such as tetrafluoroethylene-ethylene copolymer; polyurethane resins; acrylic resins; and modified thermoplastic resins obtained by modifying these.

[0061] Among these thermoplastic resins, polyolefin resins, polyamide resins, polyester resins, polyether resins, polyethersulfone, polyphenylene sulfide, thermoplastic polyetherimide, and thermoplastic fluorine resins are preferred. Polyolefin resins, modified polyolefin resins, polyamide resins, polyester resins, polyurethane resins, and acrylic resins are more preferred from the viewpoint of mechanical properties and versatility. When thermal properties are also considered, polyamide resins and polyester resins are even more preferred. Furthermore, polyamide resins are even more preferred from the viewpoint of durability against repeated loading.

[0062] As shown below, continuous fiber-reinforced resin composite materials have a small porosity, which gives them particularly excellent mechanical properties, including impact resistance. Furthermore, they have a low coefficient of thermal expansion, which suppresses deformation during heat generation. In addition, they are preferable because they can suppress the decrease in power supply efficiency due to localized discharge caused by air present in the gaps and disturbances in the magnetic field. Such continuous fiber-reinforced resin composite materials are particularly suitable for use in coil covers and / or flow path walls (walls) of non-contact power supply devices.

[0063] The continuous fiber-reinforced resin composite material consists of continuous reinforcing fibers with a substantially circular cross-section and a synthetic resin. Preferably, the proportion of continuous reinforcing fibers in which the porosity is 10% or less in the peripheral outer region formed from the periphery of the continuous reinforcing fiber to a distance of one-tenth the radius of the continuous reinforcing fiber along the periphery at the polar interface between one continuous reinforcing fiber and the synthetic resin in a cross-section perpendicular to the longitudinal direction of the continuous reinforcing fiber is 10% or more of the total number of continuous reinforcing fibers.

[0064] In other words, as shown in Figure 12, the continuous fiber-reinforced resin composite material is a continuous fiber-reinforced resin composite material consisting of continuous reinforcing fibers with a substantially circular cross-section and a synthetic resin, wherein there are continuous reinforcing fibers with a void ratio of 10% or less in the peripheral outer region (also called the polar interface region) indicated by the shaded area formed from the periphery of the continuous reinforcing fiber to a distance of one-tenth of the radius of the continuous reinforcing fiber along the periphery (i.e., r / 10) observed at the polar interface between one continuous reinforcing fiber and the synthetic resin in a cross-section perpendicular to the longitudinal direction of the continuous reinforcing fiber, and it is preferable that the proportion (number) of such continuous reinforcing fibers is 10% or more of the total number of continuous reinforcing fibers.

[0065] The cross-section of the continuous reinforcing fiber is preferably approximately circular, but it may also be elliptical. In that case, the "radius" is defined as the shortest distance from the center of the fiber cross-section to the periphery. In this embodiment, "approximately circular cross-section" includes not only perfect circles but also any annular cross-section, such as elliptical or track-shaped cross-sections.

[0066] The void ratio in the peripheral outer region, located one-tenth the radius of the continuous reinforcing fiber, observed at the polar interface between a single continuous reinforcing fiber and the synthetic resin in a cross section perpendicular to the longitudinal direction of the continuous reinforcing fiber, is, for example, calculated by applying 400 g / cm² to the polished surface of a cross section perpendicular to the longitudinal direction of the continuous reinforcing fiber of a continuous fiber-reinforced resin composite material cut to a 1 cm square using a band saw or the like. ２The polishing table was rotated at 100 rpm to apply the required force, and the samples were polished in the following order: 10 minutes with #220 grit waterproof sandpaper, 2 minutes with #400 grit waterproof sandpaper, 5 minutes with #800 grit waterproof sandpaper, 10 minutes with #1200 grit waterproof sandpaper, 15 minutes with #2000 grit waterproof sandpaper, 15 minutes with 9 μm particle size silicon carbide film, 15 minutes with 5 μm particle size alumina film, 15 minutes with 3 μm particle size alumina film, 15 minutes with 1 μm particle size alumina film, and 10 minutes with 0.1 μm particle size colloidal silica (Baicalox 0.1CR) using foamed polyurethane buffing paper. Water was added at approximately 7 mL / min during each polishing step. The polished samples were observed with a scanning electron microscope (SEM), and image analysis was performed using software such as ImageJ to obtain the following formula: The porosity (%) can be calculated as follows: void ratio (%) = (area of ​​voids in the outer peripheral region at a distance of one-tenth the radius of the continuous reinforcing fiber from the periphery of the continuous reinforcing fiber) / (area of ​​the outer peripheral region at a distance of one-tenth the radius of the continuous reinforcing fiber from the periphery of the continuous reinforcing fiber) × 100.

[0067] First, the porosity in the peripheral outer region (also simply called the "region of one-tenth the diameter of the continuous reinforcing fiber" or the "polar interface region"), which is a distance of one-tenth the radius from the peripheral edge of a single continuous reinforcing fiber with an arbitrary approximately circular cross-section, is determined and observed for any 100 fibers. In the composite material of this embodiment, from the viewpoint of increasing the rigidity and strength of the composite material, at least 10 out of 100 fibers have a porosity of 10% or less in the region of one-tenth the diameter of the continuous reinforcing fiber, i.e., 10% or more, preferably 20% or more, more preferably 50% or more, even more preferably 70% or more, and most preferably 90% or more.

[0068] Furthermore, in the composite material of this embodiment, from the viewpoint of increasing the rigidity and strength of the composite material, the average porosity in the region of one-tenth the diameter of the continuous reinforcing fibers is preferably 10% or less, more preferably 5% or less, and even more preferably 2% or less.

[0069] In order for 10% or more of the continuous reinforcing fibers to have a void ratio of 10% or less in the region of one-tenth of the diameter of each fiber, for example, if the continuous reinforcing fibers are glass fibers, it is preferable to select a sizing agent (binder) that has good compatibility with the synthetic resin, where the μ-drop generation coefficient between the binder and the synthetic resin is 10 or more, and to select a molding method that can seal the inside of the mold during molding, such as an inlay mold, or a molding method using a double belt press with adjusted pressure, thereby preventing resin leakage, minimizing the change in the occupied volume (Vf, also called volume content) of the glass fibers in the continuous fiber-reinforced resin composite material before and after molding, and molding under temperature conditions suitable for the binder.

[0070] In the continuous fiber-reinforced resin composite material of this embodiment, the occupancy ratio (area ratio) of each thermoplastic resin within the peripheral outer region can be determined, for example, by cutting out a cross section in the thickness direction of the continuous fiber-reinforced resin composite material (a cross section perpendicular to the length direction of the continuous reinforcing fibers), embedding it in epoxy resin, polishing it while taking care not to damage the continuous reinforcing fibers, and then capturing a mapping image of the cross section with a laser Raman microscope. From the obtained image and spectrum, the types of resins contained in the fiber-reinforced resin can be identified, and the area of ​​each can be calculated by image processing using ImageJ.

[0071] Furthermore, the distribution of thermoplastic resin in the resin region other than the polar interface region of the fiber-reinforced resin composite material can be determined, for example, by cutting the cross-section of the continuous fiber-reinforced resin composite material (a cross-section perpendicular to the length direction of the continuous reinforcing fibers) into a thickness direction cross-section (a cross-section perpendicular to the length direction of the continuous reinforcing fibers) and measuring the distribution of thermoplastic resin at 125 g / cm² on the polished surface. ２To ensure sufficient force is applied, the sample is polished in the following order: 10 minutes with #220 grit waterproof sandpaper, 10 minutes with #1200 grit waterproof sandpaper, 5 minutes with #2000 grit waterproof sandpaper, 10 minutes with 9 μm particle silicon carbide film, 10 minutes with 5 μm particle alumina film, 5 minutes with 3 μm particle alumina film, 5 minutes with 1 μm particle alumina film, and 5 minutes with 0.1 μm particle colloidal silica (Baicalox 0.1CR) using foamed polyurethane buffing paper. Water is added at approximately 7 mL / min during each polishing step. The polished sample is then electron-stained with phosphotungstic acid, etc., observed with a scanning electron microscope (SEM), and the results can be determined by image analysis using software such as ImageJ. The proportion of thermoplastic resin can be determined by observing 10 arbitrary points and taking the average.

[0072] The volume ratio Vf of continuous reinforcing fibers to synthetic resin, such as thermoplastic resin, is such that the higher the Vf, the higher the strength of the composite material. Therefore, in this embodiment, the continuous fiber-reinforced resin composite material preferably has a volume content Vf of continuous reinforcing fibers of 40% or more, more preferably 45% or more, even more preferably 50% or more, even more preferably 55% or more, and most preferably 65% ​​or more. In conventional fiber-reinforced resin composite materials, even if Vf is high, the aforementioned void ratio is high, making it impossible to increase the tensile stress (tensile strength) and flexural modulus (flexural stiffness) of the molded product. However, in this embodiment, by reducing the void ratio, the continuous fiber-reinforced resin composite material simultaneously achieves a synthetic resin impregnation rate of 99% or more, a tensile stress of 525 MPa or more, and a flexural modulus of 27 GPa or more at Vf 50%, and a synthetic resin impregnation rate of 99% or more, a tensile stress of 600 MPa or more, and a flexural modulus of 35 GPa or more at Vf 65%.

[0073] When the continuous reinforcing fibers are glass fibers, the tensile stress of the continuous fiber-reinforced resin composite material is preferably 480 MPa or higher, more preferably 525 MPa or higher, even more preferably 600 MPa or higher, and most preferably 620 MPa or higher, based on the average value when tested in each direction in which the glass fibers are substantially oriented. The flexural modulus of the continuous fiber-reinforced resin composite material is preferably 22 GPa or higher, more preferably 27 GPa or higher, even more preferably 30 GPa or higher, and most preferably 35 GPa or higher, based on the average value when tested in each direction in which the glass fibers are substantially oriented. In this case, the tensile stress and flexural modulus are values ​​when the continuous reinforcing fibers contained in the continuous fiber-reinforced resin composite material are substantially oriented in two directions, and are the average values ​​of values ​​tested in two directions parallel to the continuous reinforcing fibers. In the case of a three-directional material, the stress or stiffness is preferably 2 / 3 times, and in the case of an n-directional material, the stress or stiffness is preferably 2 / n times.

[0074] When the continuous reinforcing fibers are glass fibers, the average tensile stress of the continuous fiber-reinforced resin composite material tested in each direction in which the glass fibers are substantially oriented, multiplied by the number of directions in which the glass fibers are substantially oriented, is preferably 960 MPa or higher, more preferably 1050 MPa or higher, even more preferably 1200 MPa or higher, and most preferably 1240 MPa or higher. Furthermore, the average bending stress of the continuous fiber-reinforced resin composite material tested in each direction in which the glass fibers are substantially oriented, multiplied by the number of directions in which the glass fibers are substantially oriented, is preferably 1260 MPa or higher, more preferably 1400 MPa or higher, even more preferably 1600 MPa or higher, and most preferably 1700 MPa or higher. Furthermore, the flexural modulus of the continuous fiber-reinforced resin composite material multiplied by the number of directions in which the glass fibers are substantially oriented is preferably 44 GPa or higher, more preferably 54 GPa or higher, even more preferably 60 GPa or higher, and most preferably 70 GPa or higher. Furthermore, for continuous fiber-reinforced resin composite materials, the elastic index defined by the following formula: Elastic index = (average value of the elastic modulus in the direction parallel to the direction in which the glass fibers are substantially oriented × number of directions in which the glass fibers are substantially oriented) / (Vf × elastic modulus of the glass fibers) is preferably 1.2 or higher, more preferably 1.3 or higher, even more preferably 1.4 or higher, even more preferably 1.5 or higher, and most preferably 1.58 or higher.

[0075] A method for producing a continuous fiber-reinforced resin composite material with a low porosity can be obtained by, for example, the following steps: a step of heating and pressing a continuous reinforcing fiber to which a sizing agent consisting of a coupling agent, a binding agent, and a lubricant is added, and a thermoplastic resin having terminal functional groups that are reactive with the coupling agent, to a temperature above the melting point of the thermoplastic resin; and a step of cooling the mixture to a temperature below the melting point of the thermoplastic resin to obtain a continuous fiber-reinforced resin composite material as a molded product.

[0076] From the viewpoint of adhesion between the thermoplastic resin and the continuous reinforcing fibers, it is preferable that the amount of terminal functional groups in the continuous fiber-reinforced resin composite material after heat pressing is less than the amount of terminal functional groups contained in the thermoplastic resin before heat pressing. More preferably, the amount of terminal functional groups in the continuous fiber-reinforced resin composite material after heat pressing is 90% or less of the amount of terminal functional groups contained in the thermoplastic resin before heat pressing, and even more preferably 85% or less.

[0077] From the viewpoint of the reactivity between the coupling agent of the sizing agent and the terminal functional groups of the thermoplastic resin, it is preferable that the flow rate of the thermoplastic resin during heating and pressing be 10% or less, more preferably 8% or less, even more preferably 5% or less, and most preferably 3% or less.

[0078] When polypropylene is used as the thermoplastic resin, the reactive end groups may be formed by grafting maleic acid or the like onto the main component, polypropylene resin.

[0079] The flow rate of thermoplastic resin during heating and pressing can be calculated as (weight of burrs of thermoplastic resin generated during heating and pressing) / (weight of thermoplastic resin before heating and pressing).

[0080] The method of heating and pressing is not particularly limited, but a heating and pressing method using a double belt press is preferred from the viewpoint of productivity. The base material may be fed into the double belt press device by feeding reinforcing fibers and thermoplastic resin from multiple rolls, or reinforcing fibers and thermoplastic resin cut to a desired size may be fed in a desired number of layers. At this time, guide sheets such as Teflon® sheets may be fed in at the front and back of the base material together.

[0081] In this embodiment, the coil cover 30 is preferably made of a glass fiber reinforced resin material, and a continuous fiber reinforced composite material is particularly preferred from the viewpoint of flame retardancy, mechanical strength, and weight reduction. Furthermore, it is preferable that the material used for the coil cover 30 is sealable with the material used for the flow path forming member 40. The sealing method is not particularly limited, but sealing by welding or rubber sealing (gasket sealing) is preferred. By easily sealing the coil cover 30 and the flow path forming member 40, the sealing performance of the flow path can be improved, and refrigerant leakage can be prevented. As the material for the coil cover 30, for example, "Rensen" (registered trademark) manufactured by Asahi Kasei Corporation can be suitably used. However, other resin materials that have high flame retardancy and can be sealed with the flow path forming member 40 may also be used for the coil cover 30.

[0082] The welding of the coil cover 30 and the flow path forming member 40 can be performed, for example, between the upper surface of the bottom wall 33 of the coil cover 30 and the lower surface of the peripheral wall 41 of the flow path forming member 40, as shown in Figure 2.

[0083] As shown in Figure 3, the magnetic material member 20 is a parallel plate-shaped member having a substantially rectangular shape with rounded corners in a plan view. In this embodiment, the magnetic material member 20 is made of ferrite (soft ferrite). In this embodiment, the ferrite magnetic material member 20 can concentrate the magnetic field generated in the coil 10 and stabilize it in a strong magnetic field state.

[0084] The magnetic material member 20 had a problem in that when its temperature rose above a certain predetermined temperature, its function as a soft ferrite deteriorated and core loss increased. In this embodiment, by flowing coolant through a coolant flow path F provided between the coil 10 and the magnetic material member 20, the heat generated in the coil 10, which generates the most heat in the non-contact power supply device 100, is discharged to the outside by the coolant, making it difficult for heat to be transferred to the magnetic material member 20. In other words, in this embodiment, the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be effectively suppressed. Furthermore, the heat generated by the magnetic material member 20 itself can be efficiently dissipated to the coolant via the horizontal wall 43 (wall portion) of the flow path forming member 40 (other member) that forms the coolant flow path F. Therefore, the power transmission and reception efficiency of the non-contact power supply device 100 can be increased without degrading the function of the magnetic material member 20.

[0085] As shown in Figures 2 to 4, the flow path forming member 40 is a substantially rectangular member with rounded corners in a plan view. As shown in Figures 2 and 4, the flow path forming member 40 comprises a horizontal wall 43 (wall portion) and a peripheral wall 41 that surrounds the outer edge of the horizontal wall 43 in a frame-like manner in a plan view. The magnetic material member 20 described above is placed in the space above the horizontal wall 43 and radially inward of the peripheral wall 41 in the flow path forming member 40. Furthermore, in the space below the horizontal wall 43 and radially inward of the peripheral wall 41 in the flow path forming member 40, a coolant flow path F is formed by covering the flow path forming member 40 from below with the coil cover 30 (see Figure 2).

[0086] In this embodiment, the coolant flow path F is a space partitioned by the horizontal wall 43 and peripheral wall 41 of the flow path forming member 40 and the bottom wall 33 of the coil cover 30. As described above, the coil 10 is exposed on the upper surface of the coil arrangement portion 31 of the bottom wall 33 of the coil cover 30, as shown in Figures 2 and 4. Therefore, the coil 10 is exposed on the lower surface of the coolant flow path F. If the coil 10 is made of uncoated metal wire, the metal wire is exposed to the coolant flow path F. If the coil 10 is made of coated metal wire, the coating is exposed to the coolant flow path F. It is also possible to configure the coil 10 so that it is not exposed to the coolant flow path F. In this embodiment, the state in which the uncoated metal wire of the coil 10, or the individual coated metal wires, are exposed to the coolant flow path F is described as "the state in which the coil 10 is exposed to the coolant flow path F". Furthermore, the state in which the uncoated metal wire of the coil 10, or the individual coated metal wires, are in contact with the refrigerant is described as "the state in which the coil 10 is in direct contact with the refrigerant".

[0087] In this embodiment, at least a portion of the coil 10 is in contact with the flow path wall, and at least a portion of the coil 10 is exposed from the flow path wall. "At least a portion of the coil 10 is in contact with the flow path wall" means that any form is acceptable as long as at least a portion of the coil 10 is in contact with the flow path wall. For example, a form in which a portion of the coil 10 is embedded in the flow path wall (Figure 4, Figure 5A, or Figure 5B) or a form in which a hole is drilled in the surface of the coil 10 and it is anchored and fixed (Figure 5C) is possible. By having at least a portion of the coil 10 in contact with the flow path wall, the cooling efficiency of the coil 10 by the refrigerant is improved, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree. By having at least a portion of the coil 10 exposed from the flow path wall, heat accumulation in the coil 10 is suppressed even when the flow path wall is made of a low thermal conductivity material, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree. Furthermore, by having the refrigerant flow path located close to the heat source coil 10, cooling becomes possible with a smaller refrigerant flow rate, enabling miniaturization and lower power output of components such as the pump that supplies the refrigerant.

[0088] In this embodiment, the coil 10 is exposed to the flow path and dissipates heat by directly contacting the refrigerant, while the magnetic material member 20 dissipates heat to the refrigerant via the wall portion (horizontal wall 43) that forms the flow path. That is, in this case, at least a portion of the coil 10 exposed from the flow path wall is in direct contact with the refrigerant. By the coil 10 directly contacting the refrigerant and dissipating heat, the cooling efficiency of the coil 10 by the refrigerant is improved, and the heat generation of the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generation of the coil 10 can be suppressed to a high degree. In addition, by the magnetic material member 20 dissipating heat to the refrigerant via the wall portion that forms the flow path, the magnetic material member 20 can be cooled while preventing corrosion and deterioration by the refrigerant. In this embodiment, since the coil 10 and the refrigerant are in the same space, cooling is possible with a smaller refrigerant flow rate.

[0089] In this embodiment, it is preferable that the channel walls be formed from a non-magnetic and insulating material. By forming the channel walls from a non-magnetic and insulating material, a decrease in power transmission efficiency can be prevented.

[0090] In this embodiment, a crystalline thermoplastic resin is preferred as the material used for the flow path forming member 40 from the viewpoint of heat resistance, mechanical strength, and weight reduction, and a polyamide resin is particularly preferred from the viewpoint of sealing with the coil cover 30. By using polyamide, the member can be made lighter while maintaining high heat resistance and mechanical strength. The sealing method is not particularly limited, but sealing by welding or rubber seal (gasket seal) is preferred. Polyamide is easily welded to the material constituting the coil cover 30 and is highly rigid, so sealing with a rubber seal is also easy. Therefore, by using polyamide, the sealing performance of the flow path can be improved, and leakage of refrigerant can be prevented. For example, as a crystalline thermoplastic resin, "Leona" (registered trademark) manufactured by Asahi Kasei Corporation can be used. Note that other resin materials having high heat resistance, mechanical strength, and adhesion to the coil cover 30 may be used for the flow path forming member 40.

[0091] When sealing the coil cover 30 and the flow path forming member 40 by welding, the welding method is not particularly limited as long as it is a known welding method, but from the viewpoint of welding strength, vibration welding, hot plate welding, or CVT welding is preferred.

[0092] In this embodiment, by using a resin material such as a thermoplastic resin for the flow path forming member 40, no metallic member is placed in the space where magnetic flux is generated from the coil 10 to the magnetic member 20. Therefore, the generation of eddy currents can be effectively suppressed.

[0093] In this embodiment, as shown in Figures 2 and 4, a coolant conduit 60 is positioned and fixed at the front end of the coolant flow path F, sandwiched from above and below between the coil cover 30 and a magnetic cover 50 (described later). As will be described later, the coolant conduit 60 supplies coolant to a battery 130 located inside the vehicle 300. That is, in this embodiment, the coolant introduced into the coolant flow path F through one coolant conduit 60 circulates within the coolant flow path F and is discharged from the other coolant conduit 60. The coolant discharged from the coolant flow path F is led to the battery 130, and after cooling the battery 130, it is introduced again into the coolant flow path F of the contactless power supply device 100 through the coolant conduit 60. The coolant repeatedly circulates between the contactless power supply device 100 and the battery 130 by the operation of a pump (not shown).

[0094] In addition to cooling oil, the coolant may also be a long-life coolant (LLC) mainly composed of ethylene glycol or propylene glycol (for example, an antifreeze as defined in JIS K2234:2018) diluted with water. Alternatively, lubricating oil used to lubricate other units or cooling water used for cooling may be used as the coolant. When using lubricating oil or water as the coolant, it is preferable to coat the metal wire. It is preferable that the coolant does not contain magnetic materials. By not using magnetic materials in the coolant, heat generation of the coolant itself can be prevented, and fluctuations in the inductance of the coil 10 can be suppressed, thereby improving power supply efficiency.

[0095] As shown in Figure 3, the magnetic cover 50 has an external shape that corresponds to the coil arrangement portion 31 and the circuit arrangement portion 32 of the coil cover 30 in a plan view.

[0096] As shown in Figure 3, the contactless power supply device 100 on the power receiving system 150 side includes a control board 110 in the circuit layout section 32. The control board 110 has a capacitor. The coil 10 on the power receiving system 150 side has a resonant frequency that matches that of the second coil 240 on the power transmission system 250 side. The vibration of the magnetic field generated by the alternating current flowing through the second coil 240 on the power transmission system 250 side is transmitted to the coil 10 on the contactless power supply device 100 side, causing an alternating current to flow.

[0097] The control board 110 is preferably placed near the coil 10 in order to improve power supply efficiency. In this embodiment, the control board 110 is placed on the same coil cover 30 as the coil 10.

[0098] The control board 110 can also be configured to include a control unit, such as a CPU (Central Processing Unit) and a DSP (Digital Signal Processor), and to control the storage battery 130 and the power receiving side power converter 120.

[0099] The power receiving system 150's power receiving device 120 includes, for example, an AC / DC converter that includes a rectifier circuit to convert the alternating current power flowing through the coil 10 into direct current power. The power receiving device 120 may further include a DC / DC converter that converts the converted direct current power into a voltage corresponding to a battery 130, a storage device such as a large-capacity capacitor, or a load on another vehicle 300.

[0100] The storage battery 130 is a secondary battery that stores the power received by the contactless power supply device 100 and supplies it to other loads such as the drive motor. For example, a lithium-ion battery or a nickel-metal hydride battery can be used for the storage battery 130.

[0101] The storage battery 130 is provided with a battery cooling channel (not shown), and coolant is supplied to the battery cooling channel from the contactless power supply device 100 through a coolant conduit 60. The coolant circulates within the battery cooling channel via an inlet and outlet provided at the end of the battery cooling channel. That is, the coolant circulates alternately through the coolant conduit 60 between the coolant channel F of the contactless power supply device 100 and the battery cooling channel of the storage battery 130.

[0102] In this embodiment, the contactless power supply device 100 is described as being located at the bottom of the vehicle 300, as shown in Figure 1, with the coil 10 facing the road, but the embodiment is not limited to this. The contactless power supply device 100 may be installed, for example, on the side of the vehicle 300, or on the front or rear of the vehicle 300, corresponding to the installation location of the second contactless power supply device 200 on the power transmission system 250 side.

[0103] Next, the power transmission system 250 will be described. The external power supply 230 of the power transmission system 250 may be a commercial AC power supply, or a renewable energy source such as a solar cell. When the power transmission side power converter 220 receives AC power from the external power supply 230, it may be equipped with an AC / DC converter that converts the AC power to DC power. Alternatively, when the power transmission side power converter 220 receives DC power from the external power supply 230, it may be equipped with a DC / DC converter that converts the DC power to DC power suitable for input to the second contactless power supply device 200, or the power transmission side power converter 220 may not be provided.

[0104] In this embodiment, the power transmission-side power converter 220 and the second contactless power supply device 200 are described as being embedded in the road as shown in Figure 1, but the embodiment is not limited to this. The power transmission-side power converter 220 may be installed, for example, on the side wall of the road, or on the lower wall, side wall, or transport plate of the parking area of ​​the vehicle 300 in a parking lot. The second contactless power supply device 200 may be installed at any location corresponding to the installation location of the contactless power supply device 100 in the vehicle 300 or other moving object.

[0105] The second contactless power supply device 200 (another device) transmits AC power from the power transmission side power converter 220 to the power receiving system 150. The vibration of the magnetic field generated by this AC current is transmitted to the coil 10 on the contactless power supply device 100 side, which vibrates at the same resonant frequency, and power is transmitted by flowing the AC current.

[0106] (Cooling Unit) As shown in Figure 6, the cooling unit 80 in this disclosure includes a coil 10 and a flow path (cooling liquid flow path F) through which a refrigerant that cools the coil 10 passes.

[0107] The aforementioned flow path is composed of walls (flow path walls) that form the flow path. Flow path walls are a general term for members that form the flow path and come into contact with the refrigerant. Flow path walls may include, for example, a flow path forming member 40 and a coolant conduit 60, and may also include a coil cover 30 or other members.

[0108] In the cooling unit 80 of this disclosure, at least a portion of the coil 10 is in contact with the flow path wall, and at least a portion of the coil 10 is exposed from the flow path wall. By having at least a portion of the coil 10 in contact with the flow path wall, the cooling efficiency of the coil 10 by the refrigerant is improved, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree. By having at least a portion of the coil 10 exposed from the flow path wall, heat accumulation in the coil 10 is suppressed even when the flow path wall is made of a low thermal conductivity material, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree.

[0109] In the cooling unit 80 of this disclosure, the coil 10 is exposed to the flow path and dissipates heat by directly contacting the refrigerant, and the magnetic material member 20 dissipates heat to the refrigerant through the wall portion forming the flow path. That is, in this case, at least a portion of the coil 10 exposed from the flow path wall is in direct contact with the refrigerant. By the coil 10 directly contacting the refrigerant and dissipating heat, the cooling efficiency of the coil 10 by the refrigerant is improved, and the heat generation of the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generation of the coil 10 can be suppressed to a high degree. In addition, by the magnetic material member 20 dissipating heat to the refrigerant through the wall portion forming the flow path, corrosion and deterioration of the magnetic material member 20 by the refrigerant can be prevented.

[0110] In the cooling unit 80 of this disclosure, it is preferable that the flow channel walls are formed from a non-magnetic and insulating material. By forming the flow channel walls from a non-magnetic and insulating material, a decrease in power transmission efficiency can be prevented.

[0111] In the cooling unit 80 of this disclosure, the refrigerant is preferably an oil-based refrigerant. "Main component" means that the content of the component is 50% by mass or more of 100% by mass of the total refrigerant. By using an oil-based refrigerant, even when the coil 10 is in direct contact with the refrigerant, a decrease in power transmission efficiency due to corrosion of the coil 10 can be suppressed.

[0112] In the cooling unit 80 of this disclosure, the material preferably has excellent refrigerant resistance (oil resistance in the case of oil as a refrigerant) and impact resistance. From the viewpoint of non-magnetic and insulating properties, a resin material is preferably used as the material, and the resin material preferably includes polyamide resins, polyphenylene ether resins, polyphenylene sulfide resins, polyolefin resins, polyester resins, etc. From the viewpoint of oil resistance, it is more preferable to include a polyamide resin or a continuous fiber reinforced resin composite material, and from the viewpoint of oil resistance and impact resistance, it is even more preferable to include a continuous fiber reinforced resin composite material. Detailed embodiments of the polyamide resin and the continuous fiber reinforced resin composite material are as described above.

[0113] The cooling unit 80 in this disclosure is applicable to devices equipped with a coil 10 that may generate heat. Examples of such devices include industrial cooling equipment such as cooling towers, air conditioners such as fan coil units and air conditioners, medical equipment such as MRI machines, and contactless power supply devices.

[0114] As described above, this embodiment is a non-contact power supply device 100 that transmits or receives power without physical contact by utilizing the resonance phenomenon of magnetic and electric fields formed between two parties, without providing a physical electrical connection. The device comprises a coil 10 for transmitting or receiving power and a magnetic member 20 positioned on the opposite side of the coil 10 from other devices. A flow path (cooling liquid flow path F) is formed between the coil 10 and the magnetic member 20 through which a coolant that cools the coil 10 and the magnetic member 20 passes. By adopting this configuration, the coil 10, which is a heat-generating element, can be cooled by the cooling liquid to suppress the temperature rise of the coil 10. In addition, the cooling liquid flow path F blocks heat conduction from the coil 10, which generates the most heat in the non-contact power supply device 100, to the magnetic member 20, and also dissipates heat generated by the magnetic member 20 itself through the cooling liquid, thereby suppressing the temperature rise of the magnetic member 20. Therefore, the power transmission and reception efficiency of the non-contact power supply device 100 can be increased.

[0115] Furthermore, in this embodiment, the coil 10 dissipates heat by directly or indirectly contacting the refrigerant via another second member, and the magnetic member 20 is configured to dissipate heat to the refrigerant via another member. By adopting this configuration, the heat from the coil 10, which generates the most heat in the non-contact power supply device 100, can be efficiently dissipated to the coolant, thereby cooling the coil 10 more effectively. In addition, by preventing the magnetic member 20 from directly contacting the refrigerant, the occurrence of rust on the magnetic member 20 can be effectively suppressed while still providing the necessary cooling.

[0116] Furthermore, in this embodiment, the coil 10 is exposed to the flow path (coolant flow path F) and dissipates heat by directly contacting the refrigerant, while the magnetic material member 20 is configured to dissipate heat to the refrigerant through the wall portion (horizontal wall 43) that forms the flow path. By adopting this configuration, the coil 10 can be effectively cooled with a simple configuration of placing the flow path forming member 40 between the coil 10 and the magnetic material member 20, and the necessary cooling can be performed while suppressing the occurrence of rust on the magnetic material member 20.

[0117] Furthermore, in this embodiment, the flow path (coolant flow path F) is positioned between the coil 10 and the magnetic material member 20 and is configured to be demarcated by a molded member made of thermoplastic resin. By adopting this configuration, since no metal is placed between the coil 10 and the magnetic material member 20, the generation of eddy currents can be suppressed when a high-frequency current flows through the coil 10. Therefore, heat generation within the non-contact power supply device 100 can be effectively suppressed.

[0118] Furthermore, in this embodiment, the refrigerant (coolant) is configured to be a liquid that does not contain magnetic material. By adopting such a configuration, it is possible to prevent heat generation from the coolant itself, and further suppress fluctuations in the self-inductance of the coil 10, thereby improving power supply efficiency.

[0119] Furthermore, in this embodiment, the refrigerant (coolant) is configured to be oil. By adopting this configuration, the heat generated by contact with the coolant can be effectively dissipated without providing a coating to the coil 10. In addition, the occurrence of rust can be suppressed throughout the entire flow path of the coolant.

[0120] Long-life coolant (LLC) may be used as the refrigerant (coolant). If LLC is used as the refrigerant, the copper wires constituting the coil 10 may rust if the LLC comes into direct contact with the coil 10. Therefore, it is preferable to adopt a structure in which the coil 10 and the LLC come into indirect contact, as in the second embodiment described below. By adopting such a configuration, when LLC is used as the refrigerant to cool the surrounding components, it is possible to form a flow path that is integrated with the surrounding components.

[0121] Furthermore, in this embodiment, the refrigerant (cooling liquid) is configured to circulate within the flow path via an inlet and outlet provided at the ends of the flow path. By adopting this configuration, the movement of the cooling liquid within the non-contact power supply device 100 can be promoted, thereby increasing the heat dissipation efficiency from the coil 10 and magnetic member 20 to the cooling liquid.

[0122] Furthermore, in this embodiment, the magnetic member 20 is configured to be made of ferrite. By adopting this configuration, since ferrite has a higher resistivity compared to other metallic magnetic materials, the generation of eddy currents in the magnetic member 20 is suppressed, the temperature rise of the magnetic member 20 is suppressed, and the power transmission and reception efficiency can be improved.

[0123] Furthermore, this embodiment is a non-contact power supply device 100 that transmits or receives power to or from another device without contact, comprising a coil 10 for transmitting or receiving power, and a magnetic material member 20 positioned on the opposite side of the coil 10 from the other device, with a flow path (coolant flow path F) formed through which a coolant that cools the coil 10 and the magnetic material member 20 passes, and at least a part of the coil 10 is in contact with the wall forming the flow path, and at least a part of the coil 10 is exposed from the wall forming the flow path. By adopting this configuration, at least a part of the coil 10 is in contact with the wall forming the flow path, the cooling efficiency of the coil 10 is improved, and the heat generation of the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generation of the coil 10 can be suppressed to a high degree.

[0124] Furthermore, in this embodiment, the flow path (coolant flow path F) is configured to be formed between the coil 10 and the magnetic material member 20. By adopting this configuration, the coolant flow path F blocks heat conduction from the coil 10, which generates the most heat in the non-contact power supply device 100, to the magnetic material member 20, and also dissipates heat generated by the magnetic material member 20 itself through the coolant, thereby suppressing the temperature rise of the magnetic material member 20. Consequently, the power transmission and reception efficiency of the non-contact power supply device 100 can be improved.

[0125] Furthermore, in this embodiment, the coil 10 dissipates heat by directly contacting the refrigerant, while the magnetic material member 20 dissipates heat to the refrigerant via other components. By adopting this configuration, the coil 10, which generates the most heat in the non-contact power supply device 100, and the refrigerant are in the same space, making it possible to cool the coil 10 with a smaller refrigerant flow rate. In other words, since the heat from the coil 10 can be dissipated directly to the coolant without going through other components, the coil 10 can be cooled more effectively. In addition, by preventing the magnetic material member 20 from directly contacting the refrigerant, the occurrence of rust on the magnetic material member 20 can be effectively suppressed while the necessary cooling can be performed.

[0126] Furthermore, in this embodiment, the walls forming the flow path are constructed from a non-magnetic and insulating material. By adopting such a configuration, the generation of eddy currents can be effectively suppressed, and a decrease in power transmission efficiency can be prevented.

[0127] Furthermore, in this embodiment, the material is configured to include a thermoplastic resin and / or a thermosetting resin. By adopting such a configuration, it is possible to contribute to reducing the weight of the contactless power supply device 100, and at the same time, it is possible to effectively suppress the generation of eddy currents and prevent a decrease in power transmission efficiency.

[0128] Furthermore, in this embodiment, the material is configured to include a polyamide resin or a continuous fiber-reinforced resin composite material. By adopting such a configuration, even when using a refrigerant containing oil, deterioration of the flow path wall due to the refrigerant can be effectively suppressed.

[0129] Furthermore, in this embodiment, the refrigerant is configured to be either LLC (Long Life Coolant) or an oil-based refrigerant. By adopting such a configuration, if an LLC-based refrigerant is used, the refrigerant (LLC) responsible for cooling other units can also be used to cool the non-contact power supply device 100, thus simplifying the cooling system. Also, if an oil-based refrigerant is used, the heat generated by contact with the coolant can be effectively dissipated without providing a coating to the coil 10. In addition, the occurrence of rust in the entire flow path through which the coolant flows can be suppressed.

[0130] Furthermore, this embodiment includes a coil 10 and a flow path (coolant flow path F) through which a coolant that cools the coil 10 passes. At least a portion of the coil 10 is in contact with the wall portion (bottom wall 33 of the coil cover 30) that forms the flow path, and at least a portion of the coil 10 is exposed from the wall portion that forms the flow path. By adopting this configuration, at least a portion of the coil 10 is in contact with the wall portion that forms the flow path, the cooling efficiency of the coil 10 is improved, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree.

[0131] Furthermore, in this embodiment, at least a portion of the wall portion forming the flow path is configured to include a thermoplastic resin and / or a thermosetting resin. By adopting such a configuration, it is possible to contribute to reducing the weight of the non-contact power supply device 100, and at the same time, the generation of eddy currents can be effectively suppressed, preventing a decrease in power transmission efficiency.

[0132] Furthermore, in this embodiment, at least a portion of the wall portion forming the flow path is configured to include a polyamide resin or a continuous fiber-reinforced resin composite material. By adopting such a configuration, even when using a refrigerant containing oil, deterioration of the flow path wall due to the refrigerant can be effectively suppressed.

[0133] Furthermore, in this embodiment, the coil 10 is configured to be in direct contact with the refrigerant. By adopting this configuration, the coil 10, which generates the most heat in the non-contact power supply device 100, and the refrigerant are in the same space, making it possible to cool the coil 10 with a smaller refrigerant flow rate. In other words, the heat from the coil 10 can be directly dissipated to the coolant without going through other components, so the coil 10 can be cooled more effectively. In addition, the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree.

[0134] (Second Embodiment) Next, a non-contact power supply device 400 according to the second embodiment, which is suitable when water is used as a refrigerant, will be described in detail with reference to the drawings. In this embodiment, parts that are similar in configuration to the first embodiment may be omitted from the description. Also, parts that have the same configuration and function as the first embodiment will be described using the same reference numerals.

[0135] When using the contactless power supply device 400 according to this embodiment within a contactless power supply system 500 for mobile devices, the contactless power supply device 100 in Figure 1 can be replaced with the contactless power supply device 400 according to this embodiment, and a refrigerant such as long-life coolant (LLC) can be circulated between it and the storage battery 130 through the circulation channel 460, which will be described later.

[0136] (Contactless Power Supply Device) As shown in Figures 7 and 8, the contactless power supply device 400 according to this embodiment includes a coil 10 for receiving power, a magnetic material member 20 positioned on the opposite side (upper side in Figure 7) from the coil 10 to the other device (second contactless power supply device 200) (shown by a dashed line in Figure 7), a flow channel forming member 440 and a partition wall 70 made of thermoplastic resin positioned between the coil 10 and the magnetic material member 20, a coil cover 430 covering the coil 10 from the outside (lower side in Figure 7), and a magnetic material cover 50 covering the magnetic material member 20 from the outside (upper side in Figure 7). In addition, in this embodiment, two circulation channels 460 are provided, spaced apart in the left-right direction (perpendicular to the plane of the paper in Figure 7). As shown in Figure 8, the circulation passages 460 are provided by cutting out two places in the peripheral wall 41 of the passage forming member 440, and by providing the circulation passages 460, the passage recess 443a that forms the coolant passage F is connected to the outside. One circulation passage 460 introduces coolant (refrigerant) into the coolant passage F formed by the passage forming member 440 and the partition wall 70, and discharges the coolant in the coolant passage F to the outside through the other circulation passage 460. In other words, the coolant circulates within the coolant passage F via the inlet and outlet (two circulation passages 460) provided at the rear end of the coolant passage F.

[0137] In this embodiment, the coil 10 dissipates heat by indirectly contacting the refrigerant through the horizontal wall 443 (second wall portion), which is part of the wall portion forming the flow path, and the magnetic material member 20 dissipates heat to the refrigerant through the wall portion forming the flow path. That is, in this case, at least a portion of the coil 10 is in contact with the outside of the flow path wall and is exposed to a cavity adjacent to the flow path (a cavity formed between the coil cover 430 and the flow path forming member 440 in Figure 7). Because at least a portion of the coil 10 is exposed from the flow path wall, heat accumulation in the coil 10 is suppressed even when the flow path wall is made of a low thermal conductivity material, and the heat generation of the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generation of the coil 10 can be suppressed to a high degree.

[0138] In this embodiment, it is preferable that the channel walls be formed from a non-magnetic and insulating material. By forming the channel walls from a non-magnetic and insulating material, a decrease in power transmission efficiency can be prevented.

[0139] In this embodiment, the material preferably has excellent impact resistance. From the viewpoint of being non-magnetic and insulating, a resin material is preferably used as the material, and the resin material preferably includes polyamide resins, polyphenylene ether resins, polyphenylene sulfide resins, polyolefin resins, polyester resins, etc. From the viewpoint of impact resistance, it is more preferable to include a polyamide resin or a continuous fiber reinforced resin composite material, and even more preferable to include a continuous fiber reinforced resin composite material.

[0140] Figure 7 is a right-side cross-sectional view, specifically a cross-sectional view taken through a circulation channel 460 that is offset in the Y-axis direction from the center of the coil 10.

[0141] In this embodiment, it is preferable to use, for example, long-life coolant (LLC) as the coolant.

[0142] The contactless power supply device 400 according to this embodiment is described as a device used on the power receiving system 150 side, but it can also be used as a device on the power transmission system 250 side. In Figure 7, a second contactless power supply device 200 on the power transmission system 250 side is positioned opposite the contactless power supply device 400 on the power receiving system 150 side. The second contactless power supply device 200 is, for example, embedded in the ground and transmits power to the contactless power supply device 400 on the power receiving system 150 side by magnetic resonance. The configuration of the second contactless power supply device 200 can be, for example, the same as the contactless power supply device 400 shown in Figure 7 but inverted (in Figure 7, only the second coil 240, which is positioned opposite the coil 10, is shown as a component of the second contactless power supply device 200 by a dashed line).

[0143] In this specification, claims, and drawings, the side of the non-contact power supply device 400 where the magnetic material cover 50 is located is considered the upper side, and the side where the coil cover 430 is located is considered the lower side. The side where the circulation channel 460 is located is considered the rear side, and the side opposite to where the circulation channel 460 is located is considered the front side. The left-right direction of the non-contact power supply device 400 is the left-right direction when the non-contact power supply device 400 is viewed from the front, with the front side perpendicular to the plane of Figure 7 being the right side and the back side perpendicular to the plane of Figure 7 being the left side.

[0144] As shown in Figures 7 and 8, the coil 10 is formed in a plane parallel to the XY axis plane, and in this embodiment, it is insert-molded within the flow path forming member 440. As shown in the perspective view in Figure 8, the coil 10 is formed in a spiral shape from the radially outer side to the inner side, and is electrically connected to the control board 110.

[0145] For the coil 10, for example, an uncoated metal wire may be used, or the metal wire may be coated with a material such as polyimide, polyurethane, polyester, polyamide-imide, polyester-imide, or fluororesin. If the coil 10 is exposed to air on the lower surface of the flow path forming member 440, it is preferable to coat the metal wire from the viewpoint of rust prevention, etc. Copper or aluminum can be used as the material for the metal wire.

[0146] As shown in Figure 8, the coil cover 430 is positioned to overlap with the coil 10 in a plan view and includes a coil arrangement section 31 having a roughly rectangular shape with rounded edges, and a circuit arrangement section 32 having a narrower width in the left-right direction than the coil arrangement section 31, on which the control board 110 is located. In this embodiment, unlike the first embodiment, the coil 10 is not provided inside the coil cover 430, and in a plan view, the coil 10 provided on the flow path forming member 440 overlaps with the coil arrangement section 31. The coil cover 430 covers the coil 10 exposed on the lower surface of the flow path forming member 440 from the outside (downwards in Figure 7).

[0147] As shown in Figure 7, the coil cover 430 has a bottom wall 33 that covers the coil 10 from the outside, a side wall 34 that rises from the outer edge of the bottom wall 33, and a flange portion 35 that extends horizontally outward from the upper end of the side wall 34. As shown in Figure 8, the side wall 34 and the flange portion 35 surround the coil arrangement portion 31 and extend to the area of ​​the circuit arrangement portion 32. By surrounding the outer edge of the coil cover 430 with the side wall 34 and the flange portion 35 in this way, the bending strength of the coil cover 430 can be improved, making it easier to form the coil cover 430 from a lightweight thermoplastic resin or the like.

[0148] In this embodiment, the coil cover 430 is preferably formed of a glass fiber reinforced resin material, similar to the first embodiment, and a continuous fiber reinforced resin composite material is particularly preferred from the viewpoint of flame retardancy, mechanical strength, and weight reduction. Furthermore, it is preferable that the material used for the coil cover 430 is weldable to the material used for the flow path forming member 440.

[0149] As shown in Figure 8, the magnetic material member 20 is a parallel plate-shaped member having a substantially rectangular shape with rounded corners in a plan view. Since the magnetic material member 20 of this embodiment has the same shape, material, and function as the magnetic material member 20 of the first embodiment, a detailed explanation is omitted here.

[0150] In this embodiment, the magnetic material member 20 is attached to the upper surface of the horizontal wall 443 of the flow channel forming member 440, which will be described later, via a partition wall 70 made of synthetic resin. As shown in Figure 8, the partition wall 70 has substantially the same shape as the magnetic material member 20 in a plan view.

[0151] As shown in Figures 7 and 8, the flow path forming member 440 is a member having a substantially rectangular shape with rounded corners in a plan view. As shown in Figure 7, the flow path forming member 440 comprises a horizontal wall 443 and a peripheral wall 41 that surrounds the outer edge of the horizontal wall 443 in a frame-like manner in a plan view. The magnetic material member 20 described above is placed and fixed in the space above the horizontal wall 443 and radially inward of the peripheral wall 41 in the flow path forming member 440 via a partition wall 70. Furthermore, as shown in Figures 7 and 8, a flow path recess 443a is provided on the upper surface of the horizontal wall 443 in the flow path forming member 440 to partition and form the coolant flow path F. As shown in Figure 8, the flow path recess 443a is provided so that the coolant flowing in from one circulation flow path 460 circulates within the coolant flow path F partitioned by the flow path recess 443a, which is roughly shaped like a coil in a plan view, and flows out to the outside from the other circulation flow path 460. The bottom and sides of the flow channel recess 443a form the bottom and sides of the coolant flow channel F. Furthermore, notches may also be provided in the coil cover 430 and magnetic cover 50 at circumferential positions corresponding to the circulation channel 460, as shown in Figures 7 and 8, to allow the supply and discharge of refrigerant through the circulation channel 460 to occur through these notches.

[0152] In the flow path forming member 440, the coil 10, which is located within the horizontal wall 443, is exposed downwards on the lower surface of the horizontal wall 443. In this embodiment, the coil 10 is insert-molded within the flow path forming member 440 and is located within the coil recess 443b of the horizontal wall 443.

[0153] In this embodiment, the coolant flow path F is a space partitioned by the bottom and side surfaces of the flow path recess 443a provided in the horizontal wall 443 of the flow path forming member 440 and the partition wall 70 covering the lower surface of the magnetic material member 20. In this embodiment, the flow path recess 443a provided on the upper surface of the horizontal wall 443 of the flow path forming member 440 partitions the coolant flow path F, and the coil 10 is positioned so that it is exposed on the lower surface of the horizontal wall 443. That is, the coil 10 and the coolant flow path F are separated by the horizontal wall 443. Therefore, the coil 10 is not exposed in the coolant flow path F as in the first embodiment. Thus, even if LLC or the like is used as the refrigerant flowing through the coolant flow path F, corrosion of the coil 10 due to exposure to the refrigerant can be effectively suppressed.

[0154] In this embodiment, as shown in Figure 7, the coil 10 is separated from the coolant flow path F by a horizontal wall 443 (second wall portion) other than the coating that covers the individual metal wires. Therefore, the coil 10 dissipates heat to the coolant by indirectly contacting it through the horizontal wall 443 (second wall portion). Thus, a state in which the metal wires of the coil 10 without coating, or the individual metal wires with coating, do not directly contact the coolant, but instead contact the coolant through the horizontal wall 443 (second wall portion) of the flow path forming member 440 (another second member), is an example of "a state in which the coil 10 is indirectly in contact with the coolant."

[0155] In this embodiment, the horizontal wall 443 (second wall portion) of the flow path forming member 440 (another second member) that transfers heat from the coil 10 to the refrigerant, and the partition wall 70 (another member) (wall portion) that transfers heat from the magnetic material member 20 to the refrigerant, are arranged to face each other vertically with the coolant flow path F in between.

[0156] In this embodiment, the area enclosed by the bottom wall 33 of the coil cover 430 and the peripheral wall 41 and horizontal wall 443 of the flow path forming member 440 can be sealed by welding the lower surface of the peripheral wall 41 of the flow path forming member 440 to the upper surface of the bottom wall 33 of the coil cover 430. This configuration makes it possible to suppress corrosion of the coil 10 exposed to air or the like on the lower surface of the horizontal wall 443.

[0157] In this embodiment, as with the first embodiment, a crystalline thermoplastic resin is preferred as the material used for the flow channel forming member 440 from the viewpoint of heat resistance, mechanical strength and weight reduction of the member, and a polyamide resin is particularly preferred from the viewpoint of adhesion to the coil cover 430.

[0158] Furthermore, in this embodiment, it is preferable that the partition wall 70 fixed to the upper surface of the horizontal wall 443 of the flow channel forming member 440 also be made of the same type of crystalline thermoplastic resin as the flow channel forming member 440. From the viewpoint of adhesion to the flow channel forming member 440, it is particularly preferable to use a polyamide resin for the material of the partition wall 70.

[0159] By fixing the partition wall 70 to the upper surface of the horizontal wall 443, the coolant flow path F is partitioned by the bottom and side surfaces of the flow path recess 443a in the horizontal wall 443, as well as the partition wall 70. With this configuration, the magnetic material member 20 fixed to the upper surface of the partition wall 70 does not come into direct contact with the coolant, and can dissipate heat to the coolant through the partition wall 70 (other members) (wall portion).

[0160] In this embodiment, by using a resin material such as thermoplastic resin for the flow path forming member 440 and the partition wall 70, no metallic members are placed in the space where magnetic flux is generated from the coil 10 to the magnetic member 20. Therefore, the generation of eddy currents can be effectively suppressed.

[0161] As shown in Figure 8, the contactless power supply device 400 on the power receiving system 150 side includes a control board 110 within the circuit layout section 32. The configuration of the control board 110 is the same as in the first embodiment, so further explanation is omitted here.

[0162] (Cooling Unit) As shown in Figure 9, the cooling unit 480 in this disclosure includes a coil 10 and a flow path (cooling liquid flow path F) through which a refrigerant that cools the coil 10 passes.

[0163] The aforementioned flow path is composed of wall portions (flow path walls) that form the flow path. The flow path walls are a general term for members that form the flow path and come into contact with the refrigerant. The flow path walls may include, for example, a flow path forming member 440, and may also include a partition wall 70 or other members.

[0164] In the cooling unit 480 of this disclosure, at least a portion of the coil 10 is in contact with the flow path wall, and at least a portion of the coil 10 is exposed from the flow path wall. However, unlike the first embodiment, the coil 10 is not in direct contact with the refrigerant and is exposed from the lower surface of the horizontal wall 443. By having at least a portion of the coil in contact with the flow path wall, the cooling efficiency of the coil 10 by the refrigerant is improved, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree. By having at least a portion of the coil 10 exposed from the flow path wall, heat accumulation in the coil 10 is suppressed even when the flow path wall is made of a low thermal conductivity material, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree.

[0165] In the cooling unit 480 of this disclosure, the coil 10 indirectly dissipates heat to the refrigerant through the wall portion (horizontal wall 443) that forms the flow path, and the magnetic material member 20 dissipates heat to the refrigerant through the wall portion (partition wall 70). By the coil 10 indirectly dissipating heat to the refrigerant, the cooling efficiency of the coil 10 by the refrigerant is improved, and the heat generation of the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generation of the coil 10 can be suppressed to a high degree. Furthermore, by the coil 10 and the magnetic material member 20 dissipating heat to the refrigerant through the wall portion that forms the flow path, corrosion and deterioration of the coil 10 and the magnetic material member 20 by the refrigerant can be prevented.

[0166] In the cooling unit 480 of this disclosure, it is preferable that the flow channel walls are formed of a non-magnetic and insulating material. By forming the flow channel walls of a non-magnetic and insulating material, a decrease in power transmission efficiency can be prevented.

[0167] In the cooling unit 480 of this disclosure, it is preferable to use, for example, a long-life coolant (LLC) as the coolant. In this embodiment, since the coil 10 does not come into direct contact with the coolant, there is a low possibility that the coil 10 will corrode and deteriorate even if LLC is used. The coolant may also be mainly composed of oil.

[0168] In the cooling unit 480 of this disclosure, the material preferably has excellent refrigerant resistance and impact resistance. From the viewpoint of being non-magnetic and insulating, a resin material is preferably used as the material, and the resin material preferably includes polyamide resins, polyphenylene ether resins, polyphenylene sulfide resins, polyolefin resins, polyester resins, etc. From the viewpoint of oil resistance, it is more preferable to include a polyamide resin or a continuous fiber reinforced resin composite material, and from the viewpoint of oil resistance and impact resistance, it is even more preferable to include a continuous fiber reinforced resin composite material.

[0169] The cooling unit 480 in this disclosure is applicable to devices equipped with a coil 10 that may generate heat. Examples of such devices include industrial cooling equipment such as cooling towers, air conditioners such as fan coil units and air conditioners, medical equipment such as MRI machines, and contactless power supply devices.

[0170] As described above, in this embodiment, the coil 10 dissipates heat by indirectly contacting the refrigerant via another second member (flow channel forming member 440), and the magnetic material member 20 dissipates heat to the refrigerant via another member (partition wall 70). By adopting this configuration, heat from the coil 10 can be dissipated to the coolant via the other second member, effectively suppressing corrosion of the coil 10 by direct contact with the refrigerant. Furthermore, by preventing the magnetic material member 20 from directly contacting the refrigerant, necessary cooling can be performed while effectively suppressing the occurrence of rust on the magnetic material member 20.

[0171] Furthermore, in this embodiment, the coil 10 dissipates heat by indirectly contacting the refrigerant through a second wall portion (horizontal wall 443) that forms a flow path (coolant flow path F), and the magnetic material member 20 is configured to dissipate heat to the refrigerant through a wall portion (partition wall 70) that forms a flow path. By adopting this configuration, the coil 10 can be effectively cooled with a simple configuration of arranging the flow path forming member 440 and partition wall 70 between the coil 10 and the magnetic material member 20, and the necessary cooling can be performed while suppressing the occurrence of rust on the magnetic material member 20.

[0172] (Third Embodiment) Next, the contactless power supply device 600 according to the third embodiment will be described in detail with reference to the drawings. In this embodiment, parts that are similar in configuration to those of the first and second embodiments may be omitted from the description. Also, parts that have the same configuration and function as those of the first and second embodiments will be described using the same reference numerals.

[0173] When using the contactless power supply device 600 according to this embodiment within a contactless power supply system 500 for mobile devices, the contactless power supply device 100 in Figure 1 can be replaced with the contactless power supply device 600 according to this embodiment, and a coolant such as oil can be circulated between it and the storage battery 130 through the coolant conduit 60, which will be described later.

[0174] (Non-contact power supply device) As shown in Figure 10, the non-contact power supply device 600 according to this embodiment includes a coil 10 for receiving power, a magnetic material member 20 positioned on the opposite side (upper side in Figure 10) from the other device (second non-contact power supply device 200) (shown by a dashed line in Figure 10) relative to the coil 10, a flow path forming member 640 positioned below the coil 10 and made of thermoplastic resin, a coil cover 630 covering the coil 10 from the outside (lower side in Figure 10), and a magnetic material cover 50 covering the magnetic material member 20 from the outside (upper side in Figure 10). In addition, in this embodiment, two coolant conduits 60 are provided, spaced apart in the left-right direction (perpendicular to the plane of the paper in Figure 10) (the coolant conduits 60 are shown only in the cooling unit 680 in Figure 11). The coolant conduits 60 are sandwiched between the coil cover 30 and the magnetic material cover 50. The coolant conduit 60 is provided to connect the coolant flow path F to the outside. One coolant conduit 60 introduces coolant (refrigerant) into the coolant flow path F formed by the flow path forming member 640 and the coil cover 630, and discharges the coolant in the coolant flow path F to the outside through the other coolant conduit 60. In other words, the coolant circulates within the coolant flow path F via the inlet and outlet (two coolant conduits 60) provided at the front end of the coolant flow path F.

[0175] In this embodiment, the coil 10 dissipates heat by directly contacting the refrigerant, and the magnetic member 20 dissipates heat to the refrigerant via the wall portion forming the flow path. That is, in this case, at least a portion of the coil 10 is in contact with the flow path wall and is exposed from the wall portion forming the flow path. The coil 10 is exposed within the coolant flow path F. Because at least a portion of the coil 10 is exposed from the flow path wall, heat accumulation in the coil 10 is suppressed even when the flow path wall is made of a low thermal conductivity material, and the heat generation of the coil 10 and the temperature rise of the magnetic member 20 due to the heat generation of the coil 10 can be suppressed to a high degree. In this embodiment, since the coil 10 is exposed within the coolant flow path F and therefore in direct contact with the refrigerant, heat dissipation from the coil 10 to the refrigerant can be further promoted.

[0176] In this embodiment, it is preferable that the channel walls be formed from a non-magnetic and insulating material. By forming the channel walls from a non-magnetic and insulating material, a decrease in power transmission efficiency can be prevented.

[0177] In this embodiment, the material preferably has excellent impact resistance. From the viewpoint of being non-magnetic and insulating, a resin material is preferably used as the material, and the resin material preferably includes polyamide resins, polyphenylene ether resins, polyphenylene sulfide resins, polyolefin resins, polyester resins, etc. From the viewpoint of impact resistance, it is more preferable to include a polyamide resin or a continuous fiber reinforced resin composite material, and even more preferable to include a continuous fiber reinforced resin composite material.

[0178] In this embodiment, the refrigerant (coolant) is preferably an oil-based refrigerant. "Main component" means that the content of the component is 50% by mass or more of the total refrigerant by mass. By using an oil-based refrigerant, even when the coil 10 is in direct contact with the refrigerant, a decrease in power transmission efficiency due to corrosion of the coil 10 can be suppressed. When using lubricating oil or water used to lubricate other units as the coolant supplied to the coolant flow path F, it is preferable to coat the metal wire. Copper or aluminum can be used as the material for the metal wire.

[0179] The contactless power supply device 600 according to this embodiment is described as a device used on the power receiving system 150 side, but it can also be used as a device on the power transmission system 250 side. In Figure 10, a second contactless power supply device 200 on the power transmission system 250 side is positioned opposite the contactless power supply device 600 on the power receiving system 150 side. The second contactless power supply device 200 is, for example, embedded in the ground and transmits power to the contactless power supply device 600 on the power receiving system 150 side by magnetic resonance. The configuration of the second contactless power supply device 200 can be, for example, the same as the contactless power supply device 400 shown in Figure 10 but inverted (in Figure 10, only the second coil 240, which is positioned opposite the coil 10, is shown as a component of the second contactless power supply device 200 by a dashed line).

[0180] In this specification, claims, and drawings, the side of the non-contact power supply device 600 where the magnetic body cover 50 is located is considered the upper side, and the side where the coil cover 630 is located is considered the lower side. The side where the coolant conduit 60 is located is considered the front side (left side in Figure 10, negative X-axis direction), and the side opposite to where the coolant conduit 60 is located is considered the rear side (right side in Figure 10, positive X-axis direction). The left-right direction of the non-contact power supply device 600 is the left-right direction when the non-contact power supply device 600 is viewed from the front, with the front side perpendicular to the plane of Figure 10 being the right side and the back side perpendicular to the plane of Figure 10 being the left side.

[0181] As shown in Figure 10, the coil 10 is formed in a plane parallel to the XY axis plane, and in this embodiment, it is insert-molded within the flow path forming member 640. The coil 10 is formed in a spiral shape from the radially outer side to the inner side.

[0182] For the coil 10, for example, an uncoated metal wire may be used, or the metal wire may be coated with a material such as polyimide, polyurethane, polyester, polyamide-imide, polyester-imide, or fluororesin. If the coil 10 is exposed to LLC or the like on the lower surface of the flow path forming member 440, it is preferable to coat the metal wire from the viewpoint of rust prevention. Copper or aluminum can be used as the material for the metal wire.

[0183] The coil cover 630 has the same external shape as the first embodiment in a plan view, and as shown in Figure 3, it comprises a coil arrangement section 31 which is provided in a position that overlaps with the coil 10 in a plan view and has a substantially rectangular shape with rounded edges, and a circuit arrangement section 32 which has a narrower width in the left-right direction than the coil arrangement section 31 and on which the control board 110 is arranged.

[0184] As shown in Figure 10, the coil cover 630 has a bottom wall 33 that covers the coil 10 from the outside (bottom side in the figure), a side wall 34 that rises from the outer edge of the bottom wall 33, and a flange portion 35 that extends horizontally outward from the upper end of the side wall 34. The side wall 34 and the flange portion 35 surround the coil arrangement portion 31 and extend to the area of ​​the circuit arrangement portion 32. By surrounding the outer edge of the coil cover 630 with the side wall 34 and the flange portion 35 in this way, the bending strength of the coil cover 630 can be improved, making it easier to form the coil cover 630 from a lightweight thermoplastic resin or the like.

[0185] In this embodiment, the coil cover 630 is preferably made of a glass fiber reinforced resin material, similar to the first embodiment, and a continuous fiber reinforced resin composite material is particularly preferred from the viewpoint of flame retardancy, mechanical strength, and weight reduction. Furthermore, it is preferable that the material used for the coil cover 630 is weldable to the material used for the flow path forming member 640.

[0186] The magnetic material member 20 is a parallel plate-shaped member having a substantially rectangular shape with rounded corners when viewed from above. Since the magnetic material member 20 of this embodiment has the same shape, material, and function as the magnetic material member 20 of the first embodiment, a detailed explanation is omitted here.

[0187] In this embodiment, the magnetic material member 20 is attached to the upper surface of the horizontal wall 43 of the flow path forming member 640.

[0188] The flow path forming member 640 is a member having a substantially rectangular shape with rounded corners in a plan view. As shown in Figure 10, the flow path forming member 640 comprises a horizontal wall 43 and a peripheral wall 41 that surrounds the outer edge of the horizontal wall 43 in a frame-like manner in a plan view. The magnetic material member 20 described above is placed and fixed in the space above the horizontal wall 43 and radially inward of the peripheral wall 41 in the flow path forming member 640. Furthermore, as shown in Figure 10, a coolant flow path F is partitioned below the horizontal wall 43 in the flow path forming member 640. As shown in Figures 10 and 11, the coolant flow path F is provided so that the refrigerant flowing in from one coolant conduit 60 circulates within the coolant flow path F, which is roughly shaped like a coil in a plan view, and flows out to the outside from the other coolant conduit 60.

[0189] In the flow path forming member 640, the coil 10, which is located within the horizontal wall 43, is exposed downwards on the lower surface of the horizontal wall 43. In this embodiment, the coil 10 is insert-molded within the flow path forming member 40.

[0190] In this embodiment, the coolant flow path F is a space partitioned by the horizontal wall 43 and peripheral wall 41 of the flow path forming member 640 and the bottom wall 33 of the coil cover 630. In this embodiment, as in the first embodiment, the coil 10 is exposed in the coolant flow path F. Therefore, since the coil 10 is in direct contact with the refrigerant, the temperature rise of the coil 10 can be effectively suppressed.

[0191] In this embodiment, as shown in Figure 10, the coil 10 dissipates heat to the refrigerant by directly contacting it, which is an example of "a state in which the coil 10 is directly in contact with the refrigerant".

[0192] In this embodiment, since the coil 10 is located in the upper part of the coolant flow path F, the cooling effect of the coil 10 will decrease if the coolant flow path F is not filled to a high enough density so that the coil 10 is sufficiently immersed in the coolant. By inverting the non-contact power supply device 600 of this embodiment and using it as a second non-contact power supply device 200 (shown by a dashed line in Figure 10), the coil 10 is located in the lower part of the coolant flow path F, so even with the non-contact power supply device 600 of this embodiment, a high filling density of the coolant in the coolant flow path F is not required. Therefore, it is preferable to arrange the non-contact power supply device 600 as the second non-contact power supply device 200 below the non-contact power supply devices 100 and 400 according to the first or second embodiment.

[0193] In this embodiment, heat from the magnetic material member 20 is dissipated to the coolant through the horizontal wall 43 of the flow path forming member 640.

[0194] In this embodiment, the area enclosed by the bottom wall 33 of the coil cover 630 and the peripheral wall 41 and horizontal wall 443 of the flow path forming member 640 can be sealed by welding the lower surface of the peripheral wall 41 of the flow path forming member 640 to the upper surface of the bottom wall 33 of the coil cover 630. This configuration effectively suppresses the leakage of refrigerant from the coolant flow path F.

[0195] In this embodiment, as with the first embodiment, a crystalline thermoplastic resin is preferred as the material used for the flow channel forming member 640 from the viewpoint of heat resistance, mechanical strength and weight reduction of the member, and a polyamide resin is particularly preferred from the viewpoint of adhesion to the coil cover 630.

[0196] In this embodiment, by using a resin material such as a thermoplastic resin for the flow path forming member 640, no metallic member is placed in the space where magnetic flux is generated from the coil 10 to the magnetic member 20. Therefore, the generation of eddy currents can be effectively suppressed.

[0197] The contactless power supply device 600 on the power receiving system 150 side includes a control board 110 in the circuit arrangement section 32, as shown in Figure 3, similar to the first embodiment. The configuration of the control board 110 is the same as in the first embodiment, so further explanation is omitted here.

[0198] (Cooling Unit) As shown in Figure 11, the cooling unit 680 in this disclosure includes a coil 10 and a flow path (cooling liquid flow path F) through which a refrigerant that cools the coil 10 passes.

[0199] The aforementioned flow path is composed of walls that form the flow path (flow path walls). The flow path walls are a general term for members that form the flow path and come into contact with the refrigerant. The flow path walls may include, for example, a flow path forming member 640, a coil cover 630, a coolant conduit 60, or other members.

[0200] In the cooling unit 680 of this disclosure, at least a portion of the coil 10 is in contact with the flow path wall, and at least a portion of the coil 10 is exposed from the flow path wall. Similar to the first embodiment, the coil 10 is exposed to the coolant flow path F and in direct contact with the refrigerant. By at least a portion of the coil 10 being in contact with the flow path wall, the cooling efficiency of the coil 10 by the refrigerant is improved, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be highly suppressed. Because at least a portion of the coil 10 is exposed from the flow path wall, heat accumulation in the coil 10 is suppressed even when the flow path wall is made of a low thermal conductivity material, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be highly suppressed. In this embodiment, further exposure of the coil 10 to the coolant flow path F and direct contact with the refrigerant can effectively suppress the heat generated by the coil 10.

[0201] In the cooling unit 680 of this disclosure, the coil 10 is exposed to the coolant flow path F and dissipates heat to the coolant by directly contacting it, and the magnetic material member 20 dissipates heat to the coolant via the horizontal wall 43. By the coil 10 directly dissipating heat to the coolant, the cooling efficiency of the coil 10 by the coolant is improved, and the heat generated by the coil 10 and the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 can be suppressed to a high degree. In addition, by the magnetic material member 20 dissipating heat to the coolant via the wall portion that forms the flow path, corrosion and deterioration of the magnetic material member 20 by the coolant can be prevented.

[0202] In the cooling unit 680 of this disclosure, it is preferable that the flow channel walls are formed from a non-magnetic and insulating material. By forming the flow channel walls from a non-magnetic and insulating material, a decrease in power transmission efficiency can be prevented.

[0203] In the cooling unit 680 of this disclosure, it is preferable to use, for example, oil as the coolant. In this embodiment, since the coil 10 is in direct contact with the coolant, using oil as the coolant can reduce the possibility of corrosion and deterioration of the coil 10.

[0204] In the cooling unit 680 of this disclosure, the material preferably has excellent coolant resistance and impact resistance. From the viewpoint of being non-magnetic and insulating, a resin material is preferably used as the material, and the resin material preferably includes polyamide resins, polyphenylene ether resins, polyphenylene sulfide resins, polyolefin resins, polyester resins, etc. From the viewpoint of oil resistance, it is more preferable to include a polyamide resin or a continuous fiber reinforced resin composite material, and from the viewpoint of oil resistance and impact resistance, it is even more preferable to include a continuous fiber reinforced resin composite material.

[0205] The cooling unit 680 in this disclosure is applicable to devices equipped with a coil 10 that may generate heat. Examples of such devices include industrial cooling equipment such as cooling towers, air conditioners such as fan coil units and air conditioners, medical equipment such as MRI machines, and contactless power supply devices.

[0206] While this disclosure has been described based on the drawings and embodiments, it should be noted that those skilled in the art will find it easy to make various modifications or alterations based on this disclosure. Therefore, it should be noted that these modifications or alterations fall within the scope of the present invention. For example, the functions included in each component can be rearranged in a logically consistent manner, and multiple components can be combined into one or separated.

[0207] For example, in the first to third embodiments, the contactless power supply devices 100, 400, and 600 were described as power supply devices used on the power receiving system 150 side, but the embodiment is not limited to this. The contactless power supply devices 100, 400, and 600 of this embodiment can also be used as a second contactless power supply device 200 used on the power transmission system 250 side. In that case, for example, the contactless power supply devices 100, 400, and 600 shown in Figures 2 and 7 may be inverted vertically and arranged as the second contactless power supply device 200, and the second coil 240 may be used facing the coil 10 of the contactless power supply devices 100, 400, and 600. In that case, the control circuit is modified to use AC power from the power transmission side power converter 220 to supply an AC current of a predetermined resonant frequency to the second coil 240.

[0208] Furthermore, although the first to third embodiments described the contactless power supply devices 100, 400, and 600 as receiving power from a power transmission system 250 and supplying power to a vehicle 300 such as an electric vehicle, the invention is not limited to these embodiments. The contactless power supply devices 100, 400, and 600 can be used to supply power in a contactless manner to various other mobile objects that use electricity, such as vehicles other than electric vehicles, such as plug-in hybrid vehicles, ships, aircraft, trains, drones, or spacecraft. They can also be used to supply power from a mobile external power source to fixed electrical equipment where commercial power is unavailable.

[0209] In the first to third embodiments, the cooling liquid for cooling the battery 130 is also supplied to the contactless power supply devices 100, 400, and 600, but the system is not limited to this configuration. The system may also be configured to supply cooling liquid for cooling other vehicle drive motors, inverters, or power converters such as DC / DC converters to the contactless power supply devices 100, 400, and 600.

[0210] In the first to third embodiments, it was explained that the temperature rise of the magnetic material member 20 due to heat generated in the coil 10 can be suppressed, but it is also possible that the temperature rise of the magnetic material member 20 due to heat from heat sources other than the coil 10, such as the control board 110 or the external heat sources of the non-contact power supply devices 100, 400, 600, which are located below the cooling liquid flow path F, can also be effectively suppressed.

[0211] (Fourth Embodiment) As a fourth embodiment, an example in which a continuous fiber-reinforced resin composite is used for the coil cover will be described. The coil cover using the continuous fiber-reinforced resin composite in this embodiment has the same shape as the coil cover 30 of the first embodiment shown in Figures 1 to 4. In addition, the non-contact power supply device according to this embodiment uses the same components as the first embodiment for components other than the coil cover. The coil cover using the continuous fiber-reinforced resin composite according to this embodiment can be used not only for the non-contact power supply device of the first embodiment, but also for the non-contact power supply devices of the second and third embodiments. Furthermore, the coil cover using the continuous fiber-reinforced resin composite according to this embodiment can be used not only for the cooling unit of the first embodiment, but also for the cooling unit of the third embodiment.

[0212] First, let's explain the measurement method. [Void ratio in the peripheral outer region of continuous reinforced fibers] A continuous fiber-reinforced resin molded body is cut with a band saw, and the cut test piece is polished using a polishing machine (small precision sample preparation system IS-POLISHER ISPP-1000 (Ikegami Seiki Co., Ltd.)) and 400 g / cm³ is applied to the polished surface. ２ The samples were polished under the specified force. Polishing was performed in the following order: 10 minutes with waterproof sandpaper #220, 2 minutes with waterproof sandpaper #400, 5 minutes with waterproof sandpaper #800, 10 minutes with waterproof sandpaper #1200, 15 minutes with waterproof sandpaper #2000, 15 minutes with silicon carbide film with a particle size of 9 μm, 15 minutes with alumina film with a particle size of 5 μm, 15 minutes with alumina film with a particle size of 3 μm, 15 minutes with alumina film with a particle size of 1 μm, and 10 minutes with colloidal silica (Baicalox 0.1CR) with a particle size of 0.1 μm using foamed polyurethane buffing paper. Water was added at approximately 7 mL / min during each polishing step. The polished samples were observed using SEM (S-4700, Hitachi High-Technologies Corporation), and the porosity of a region one-tenth the radius of a single continuous reinforcing fiber was calculated from the obtained images. Observations were conducted on 100 arbitrarily selected continuous reinforcing fibers, and the average porosity of a region one-tenth the radius of each continuous reinforcing fiber and the percentage of fibers with a porosity of 10% or less were determined.

[0213] [Impregnation Rate] A cross-section of the molded body was cut out, embedded in epoxy resin, and polished carefully to avoid damaging the continuous reinforcing fibers. Observed with a microscope, the occupied area of ​​the continuous reinforcing fiber bundle, synthetic resin, and voids was determined from the obtained images, and the ratio of the void area to the total area of ​​the continuous reinforcing fiber bundle was determined. The impregnation rate (%) was calculated using the following formula: Impregnation rate (%) = {1 - (void area / continuous reinforcing fiber bundle area)} × 100.

[0214] The continuous fiber-reinforced resin composite used will be described below. [Continuous Reinforcement Fibers] Glass fibers with a fineness of 11500 dtex and 2000 single filaments were manufactured by attaching 0.45% by mass of a sizing agent. The winding method was DWR, and the average single filament diameter was 17 μm.

[0215] The glass fiber scrubber was prepared by copolymerizing 0.5% by mass of γ-aminopropyltriethoxysilane (hereinafter referred to as aminosilane) KBE-903 (manufactured by Shin-Etsu Chemical Co., Ltd.), 1% by mass of carnauba wax, 2% by mass of polyurethane resin Y65-55 (manufactured by ADEKA Corporation), 40% by mass of maleic anhydride, 50% by mass of methyl acrylate, and 10% by mass of methyl methacrylate, and then preparing the copolymer with deionized water so that the copolymer compound with a weight-average molecular weight of 20,000 was 3% by mass and the aqueous solution of the copolymer compound was 3% by mass.

[0216] [Thermoplastic resin] Polyamide resin: Polyamide 66 (Leona 1300S (Asahi Kasei Corporation)), melting point 265°C, difference between melting peak temperature and cooling crystallization peak temperature (Tm-Tc) = 53°C, carboxyl terminal group count was 70 μmol / g, amino terminal group count was 32 μmol / g.

[0217] [Polyamide film] A film was obtained by molding the thermoplastic resin using a T-die extrusion molding machine (manufactured by Soken Co., Ltd.). The thickness of the film was 190 μm.

[0218] [Glass Cloth] Glass cloth was manufactured by weaving using a rapier loom (weaving width 2m) with the aforementioned glass fibers as warp and weft threads. The resulting glass cloth had a 2-2 twill weave, a weave density of 6.5 threads / 25mm, and a weight of 600g / m².２ That was the case.

[0219] [Particulate Additive] A masterbatch containing carbon black (Asahi Kasei Corporation) was used as the particulate additive. The carbon black content was 3 wt%.

[0220] [Manufacturing of Continuous Fiber Reinforced Resin Composites] A hydraulic molding machine (Shoji Co., Ltd.) with a maximum clamping force of 50 tons was used as the molding machine. Two 300 mm square SUS plates were prepared, a release agent was applied, and they were baked. Then, seven 280 mm square glass cloths and eight 250 mm square polyamide resin films were alternately layered between the SUS plates. This was placed on the molding machine, which had been preheated to 330°C, and the mold was clamped with a clamping force of 5 MPa to perform compression molding. As the resin was heated and melted, the pressure was released and then repressurized, so after 90 seconds the pressure from the molding machine was released, and the product was moved to a cooling press machine for 10 minutes of cooling.

[0221] The resulting continuous fiber-reinforced resin composite had a porosity of 10% or less, with 87% of the continuous reinforcing fibers being porosity of 10%, and a resin impregnation rate of 100%.

[0222] The continuous fiber-reinforced resin composite obtained as described above exhibited very high tensile stress, bending stress, flexural modulus, impact resistance, and a low coefficient of linear expansion. The coil cover formed from this continuous fiber-reinforced resin composite showed high impact resistance and was suitable for use as a coil cover in a contactless power supply device.

[0223] As described above, this embodiment includes a coil cover made of a continuous fiber-reinforced resin composite material consisting of a continuous fiber-reinforced resin with a substantially circular cross-section and a synthetic resin. At the polar interface between one of the continuous fiber-reinforced fibers and the synthetic resin in a cross-section perpendicular to the longitudinal direction of the continuous fiber, the proportion of continuous fiber-reinforced fibers with a void ratio of 10% or less in the peripheral outer region formed from the periphery of the continuous fiber to a distance of one-tenth the radius of the continuous fiber-reinforced fiber along the periphery is 10% or more of the total number of continuous fiber-reinforced fibers, and the synthetic resin impregnation rate in the continuous fiber-reinforced resin composite material is 99% or more. By adopting such a configuration, the coil cover, which holds the main component, the coil and also serves as the housing for the non-contact power supply device, can be given properties such as high tensile stress, bending stress, bending modulus, impact resistance, and a low coefficient of linear expansion, thereby providing the non-contact power supply device with high impact resistance.

[0224] This disclosure relates to contactless power supply devices 100, 400, and 600 for supplying power to a vehicle 300 or the like without contact, which suppress the temperature rise of the magnetic material member 20 due to the heat generated by the coil 10 and improve the power transmission and reception efficiency.

[0225] 10 Coil 20 Magnetic material member 30 Coil cover (wall section) 31 Coil arrangement section 32 Circuit arrangement section 33 Bottom wall 33a Coil recess 33b Coil protrusion 33c1 Umbrella section 33c2 Column section 33d Bottom wall groove 34 Side wall 35 Flange section 40 Flow path forming member (other member) 41 Peripheral wall 43 Horizontal wall (wall section) 50 Magnetic material cover 60 Cooling liquid conduit (inlet and outlet) 70 Partition wall (other member) (wall section) 80 Cooling unit 100 Non-contact power supply device 110 Control board (electronic component) 120 Power receiving side power converter 130 Storage battery 150 Power receiving system 200 Second non-contact power supply device (other device) 220 Power transmitting side power converter 230 External power supply 240 Second coil 250 Power transmission system 300 Vehicle (mobile body) 400 Contactless power supply device 430 Coil cover 440 Flow path forming member (other second member) 443 Horizontal wall (second wall section) 443a Flow path recess 443b Coil recess 443c Coil protrusion 443d Bottom wall groove 460 Circulation flow path (inlet and outlet) 480 Cooling unit 500 Contactless power supply system for mobile body 600 Contactless power supply device 630 Coil cover 640 Flow path forming member (other second member) 643b Coil recess 643c Coil protrusion 643d Bottom wall groove 680 Cooling unit F Coolant flow path

Claims

1. A contactless power supply device for transmitting or receiving power to or from another device without contact, comprising: a coil for transmitting or receiving power; and a magnetic member disposed on the opposite side of the coil from the other device; a flow path for a coolant to cool the coil and the magnetic member is formed therein; at least a portion of the coil is in contact with the wall forming the flow path; and at least a portion of the coil is exposed from the wall forming the flow path.

2. The contactless power supply device according to claim 1, wherein the flow path is formed between the coil and the magnetic material member.

3. The contactless power supply device according to claim 1 or 2, wherein the coil dissipates heat by being exposed to the flow path and directly contacting the refrigerant, or by indirectly contacting the refrigerant through the second wall portion forming the flow path, and the magnetic member dissipates heat to the refrigerant through the wall portion forming the flow path.

4. The contactless power supply device according to claim 1 or 2, wherein the coil dissipates heat by directly contacting the refrigerant, and the magnetic material member dissipates heat to the refrigerant via other members.

5. The contactless power supply device according to claim 1 or 2, wherein the wall portion forming the flow path is made of a non-magnetic and insulating material.

6. The contactless power supply device according to claim 5, wherein the material comprises a thermoplastic resin and / or a thermosetting resin.

7. The contactless power supply device according to claim 5, wherein the material comprises a polyamide resin or a continuous fiber-reinforced resin composite material.

8. The contactless power supply device according to claim 1 or 2, wherein the refrigerant is a liquid that does not contain magnetic material.

9. The contactless power supply device according to claim 1 or 2, wherein the refrigerant is LLC or a refrigerant mainly composed of oil.

10. The non-contact power supply device according to claim 1 or 2, wherein the refrigerant circulates within the flow path via an inlet and an outlet provided at the end of the flow path.

11. A cooling unit comprising a coil and a flow path through which a refrigerant for cooling the coil passes, wherein at least a portion of the coil is in contact with a wall forming the flow path, and at least a portion of the coil is exposed from the wall forming the flow path.

12. The cooling unit according to claim 11, wherein at least a portion of the wall portion forming the flow path includes a thermoplastic resin and / or a thermosetting resin.

13. The cooling unit according to claim 11, wherein at least a portion of the wall portion forming the flow path includes a polyamide resin or a continuous fiber-reinforced resin composite material.

14. The cooling unit according to claim 11 or 12, characterized in that the coil is in direct contact with the refrigerant.

15. A non-contact power supply device comprising a coil cover using a continuous fiber-reinforced resin composite material consisting of a continuous fiber-reinforced resin having a substantially circular cross-section and a synthetic resin, characterized in that, at the polar interface between one of the continuous fiber-reinforced fibers and the synthetic resin in a cross-section perpendicular to the longitudinal direction of the continuous fiber, the proportion of continuous fiber-reinforced fibers in the peripheral outer region formed from the periphery of the continuous fiber to a distance of one-tenth the radius of the continuous fiber-reinforced fiber along the periphery is 10% or less of the total number of continuous fiber-reinforced fibers, and the synthetic resin impregnation rate in the continuous fiber-reinforced resin composite material is 99% or more.

Images