Electronic device and manufacturing method therefor

Abstract

An electronic device according to one embodiment of the present disclosure comprises: a housing including a front surface, a rear surface facing the direction opposite to the front surface, and a side surface surrounding the space between the front surface and the rear surface; and a display including a display area visible from the outside through a portion of the front surface and a non-display area located on an outer periphery of the display area, the display including a window and a display panel disposed under the window, wherein, when the display is visible from the front surface, the display area of the display overlaps the window, and the non-display area of the display can be covered by a portion of the housing so as not to be visible from the outside.

Description

Electronic device and method of manufacturing the same

[0001] The embodiments of the present disclosure relate to an electronic device and a method for manufacturing the same.

[0002] As the information society develops, the demand for display devices included in electronic devices is increasing in various forms. Display devices may be flat panel display devices such as Liquid Crystal Displays, Field Emission Displays, and Light Emitting Displays. Light emitting display devices may include organic light emitting display devices comprising organic light emitting diode elements as light emitting elements, or light emitting diode display devices comprising inorganic light emitting diode elements such as LEDs as light emitting elements.

[0003] A display device may include a display area where pixels for displaying an image are arranged and around the display area, and a non-display area (or bezel area) where wiring for driving the pixels is arranged. Recently, research and development on electronic devices including bezel-less display devices has been ongoing in order to maximize the area of ​​the display area.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] A display device included in an electronic device may be referred to as a "display." A display may include a window and a display panel positioned beneath the window. When the display is viewed from the front of the electronic device, the window may be positioned to overlap the display area and the non-display area located outside the display area. A portion of the window that overlaps with the non-display area of ​​the display may be coated in black to prevent light from passing through. Such a window is a component that can be easily damaged when the electronic device is subjected to external impact. Therefore, technology may be required to protect the window from damage due to external impact and to enhance the quality and durability during the assembly process.

[0006] The embodiments of the present disclosure can provide an electronic device and a method for manufacturing the same that can protect a window from damage due to external shock and increase the quality and durability in the assembly process.

[0007] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below.

[0008] An electronic device according to one embodiment of the present disclosure comprises a housing including a front, a rear facing opposite to the front, and a side surrounding the space between the front and the rear, and a display including a display area visible from the outside through a part of the front and a non-display area located at the outer edge of the display area, the display including a window and a display panel disposed below the window, wherein when the display is viewed from the front, the display area of ​​the display overlaps with the window, and the non-display area of ​​the display may be covered by a part of the housing and not visible from the outside.

[0009] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include the steps of: obtaining a display panel including a display area and a non-display area by cutting a display original substrate; attaching a polarizing film to the display panel; attaching a window having an area corresponding to the display area of ​​the display panel to the display panel including the polarizing film; separately manufacturing a side frame and a bracket; combining the side frame with the display panel to which the window is attached; placing the bracket below the display panel and combining the bracket with the side frame; and placing a rear plate below the bracket and combining the rear plate with the side frame and the bracket. When the display panel is viewed from the front facing the window, the display area overlaps with the window, and the non-display area is covered by a part of the side frame so as not to be seen from the outside.

[0010] According to the embodiments of the present disclosure, damage to the window can be protected from external impact, and the quality and durability can be improved during the assembly process.

[0011] According to the embodiments of the present disclosure, product reliability and waterproofing design can be easily achieved.

[0012] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0013] Other aspects, features, and advantages according to specific embodiments of the present disclosure will become more apparent from the accompanying drawings and description.

[0014] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0015] FIG. 2 is a front perspective view of an electronic device (e.g., mobile electronic device) according to various embodiments of the present disclosure.

[0016] FIG. 3 is a perspective view of the rear of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0017] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments shown in FIG. 2 and FIG. 3.

[0018] FIG. 5 is an unfolded perspective view of a display according to various embodiments shown in FIG. 2.

[0019] FIG. 6 is a cross-sectional view of a portion of an electronic device according to various embodiments shown in FIG. 2 and FIG. 3.

[0020] FIGS. 7 to 11 are conceptual diagrams for explaining the manufacturing and assembly processes of electronic devices according to various embodiments.

[0021] FIG. 12 is an exemplary cross-sectional view of an electronic device in which the shape of the window frame is processed.

[0022] FIG. 13 is an exemplary cross-sectional view of an electronic device having a window with a stacked structure.

[0023] Each of the embodiments described with reference to the drawings of the present disclosure may be configured independently as a single embodiment. For example, the embodiment of FIG. 1 and the embodiment of FIG. 2 may each be configured independently of each other. Each of the embodiments described with reference to the drawings of the present disclosure may operate independently as a single embodiment. For example, the embodiment of FIG. 1 and the embodiment of FIG. 2 may each operate independently of each other.

[0024] At least two of the embodiments described with reference to the drawings of the present disclosure may be combined. For example, at least a part of the embodiment of FIG. 1 and at least a part of the embodiment of FIG. 2 may be combined with each other. At least two of the embodiments described with reference to the drawings of the present disclosure may be combined and operated. For example, at least a part of the embodiment of FIG. 1 and at least a part of the embodiment of FIG. 2 may be combined and operated with each other.

[0025] When at least two of the embodiments described with reference to the drawings of the present disclosure are combined, at least some of the configurations and / or at least some of the operations included in each embodiment may be omitted. For example, when the embodiment of FIG. 1 and the embodiment of FIG. 2 are combined, at least some of the configurations and / or at least some of the operations included in the embodiment of FIG. 1 may be omitted, and at least some of the configurations and / or at least some of the operations included in the embodiment of FIG. 2 may be omitted.

[0026] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0027] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0028] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0029] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0030] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0031] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0032] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0033] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0034] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0035] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0036] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0037] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0039] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0040] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0041] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0042] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0043] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0044] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0045] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0046] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0047] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0048] The electronic device according to the various embodiments disclosed in this disclosure may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this disclosure is not limited to the devices described above.

[0049] The various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In the present disclosure, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” each may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0050] The term “module” as used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0051] Various embodiments of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0052] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0053] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0054] FIG. 2 is a front perspective view of an electronic device (101) (e.g., mobile electronic device) according to various embodiments of the present disclosure. FIG. 3 is a rear perspective view of the electronic device (101) of FIG. 1 according to various embodiments of the present disclosure.

[0055] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In another embodiment, the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C). According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., glass or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. The side (210C) is positioned to surround the space between the front plate (202) and the rear plate (211) and may be joined to the front plate (202) and the rear plate (211). The side (210C) may be formed by a side bezel structure (218) (or "side member," or "side frame (220)") comprising metal and / or polymer. As described below, the side frame (220) may form part of the side (210C) and the first face (or front) (210A). For example, a part of the side frame (220) can cover a part of the non-display area of ​​the display (201) (e.g., the non-display area (NDA) of FIG. 6) when the display (201) is viewed on the first side (or front) (210A), so that the non-display area of ​​the display (201) (e.g., the non-display area (NDA) of FIG. 6) is not visible from the outside.

[0056] In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metallic material such as aluminum).

[0057] According to one embodiment, as shown in FIG. 3, the rear plate (211) may include a second region (210E) that is curved from the second surface (210B) toward the front plate (202) and seamlessly extended at both ends of the long edge.

[0058] According to one embodiment, the electronic device (101) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), an input device (203), an audio output device (207) (e.g., the audio output module (155) of FIG. 1), a sensor module (219) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., the camera module (180) of FIG. 1), a key input device (217), an indicator, and a connector (208). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the key input device (217), or the indicator) or additionally include other components.

[0059] According to one embodiment, the display (201) may be exposed, for example, through the upper portion of the front plate (202). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0060] According to one embodiment, the input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones arranged to detect the direction of sound. The sound output device (207) may include a speaker.

[0061] According to one embodiment, the sensor module (219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (219) may include at least one of a sensor module not illustrated, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0062] According to one embodiment, the camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (101), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101).

[0063] According to one embodiment, the connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0064] According to one embodiment, some of the camera modules (205, 212), or some camera modules (205) or indicators may be positioned to be exposed through a display (201). For example, the camera modules (205) or indicators may be positioned in the internal space of the electronic device (101) to come into contact with the external environment through a through hole drilled up to the front plate (202) of the display (201).

[0065] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments shown in FIG. 2 and FIG. 3.

[0066] The electronic device (101) of FIG. 4 may be at least partially similar to the electronic device (101) of FIG. 2 and FIG. 3, or may include other embodiments of the electronic device.

[0067] Referring to FIG. 4, an electronic device (101) (e.g., the electronic device (101) of FIG. 2 and FIG. 3) may include a side frame (220), a bracket (230) coupled to the side frame (220), a display (201) supported by the bracket (230), and a rear plate (211) disposed below the display (201) and coupled to the side frame (220) and the bracket (230). The electronic device (101) may additionally include other components in addition to the components shown in FIG. 4. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and redundant descriptions are omitted below.

[0068] According to one embodiment, the electronic device (101) may include a housing (e.g., housing (210) of FIG. 2) comprising a front (e.g., first surface (210A) of FIG. 2), a rear surface (e.g., second surface (210B) of FIG. 3) facing in the opposite direction to the front (210A), and a side surface (e.g., side surface (210C) of FIG. 2) surrounding the space between the front (210A) and the rear surface (210B). The housing (210) may include a side frame (220) (e.g., side frame (220) of FIG. 2) forming part of the side surface (210C) and the front (210A), and a rear plate (211) (e.g., rear plate (211) of FIG. 3) coupled to the side frame (220) and forming the rear surface (210B). According to one embodiment, the front (210A) of the housing (210) may be formed by a part of the window (202) of the display (201) and the side frame (220) which serve as a front plate (e.g., the front plate (202) of FIG. 2).

[0069] According to one embodiment, the assembly method of the electronic device (101) may include the following processes. The side frame (220) and the bracket (230) may be manufactured separately. The side frame (220) may be assembled first with the display (201). Once the display (201) is assembled to the side frame (220), the bracket (230) may be placed below the display (201) to combine the side frame (220) and the bracket (230). After combining the side frame (220) and the bracket (230), a rear plate (211) may be placed below the bracket (230) to combine the rear plate (211) with the side frame (220) and the bracket (230).

[0070] FIG. 5 is an unfolded perspective view of a display according to various embodiments shown in FIG. 2.

[0071] The display of FIG. 5 may be at least partially similar to the display of FIG. 2, or may include other embodiments of the display.

[0072] Referring to FIG. 5, a display (201) according to one embodiment (e.g., the display (201) of FIG. 2 may include a window (202) (e.g., a front plate, a glass plate, or a cover member), a polarizer (432) (e.g., a polarizing film) placed below the window (202), a touch panel (432) placed below the polarizer (433), a display panel (431) placed below the touch panel (432), and at least one auxiliary material layer (440) placed below the display panel (431).

[0073] According to one embodiment, the window (202) may comprise glass. For example, the window (202) may comprise ultra-thin glass (UTG). In some embodiments, the window (202) may comprise a polymer. For example, the window (202) may comprise polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, the window (202) may be a plurality of laminated windows (202). In some embodiments, one layer of the plurality of windows (202) may be placed by an adhesive that has weaker adhesion or is thinner than the adhesive (or adhesive) of the other layer so that one layer of the plurality of windows (202) can be easily separated from the other layer. According to one embodiment, the adhesive may include optical clear adhesive (OCA), pressure sensitive adhesive (PSA), heat-reactive adhesive, photoreactive adhesive, general adhesive, and / or double-sided tape.

[0074] According to one embodiment, the touch panel (432) may be placed on the POL (433), unlike the illustrated example.

[0075] According to one embodiment, the POL (433) may be attached to the back surface of the window (202) by an adhesive member. According to one embodiment, the adhesive member may include an optical clear adhesive (OCA), a pressure-sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or double-sided tape.

[0076] According to one embodiment, the display panel (431), POL (433), and touch panel (432) may be formed integrally.

[0077] According to one embodiment, the display panel (431) and the POL (433) may be formed integrally.

[0078] According to one embodiment, the touch panel (432) can be combined with the display panel (431) in any one of an in-cell method, an on-cell method, and / or an add-on method.

[0079] According to one embodiment, at least one auxiliary material layer (440) may include at least one polymer member (441, 442) disposed on the back surface of a display panel (431), at least one functional member (443) disposed on the back surface of at least one polymer member (441, 442), and a conductive member (444) disposed on the back surface of at least one functional member (443). According to one embodiment, at least one polymer member (441, 442) may include an embossing layer (441) for removing bubbles that may occur between the display panel (431) and its lower attachments, and / or a cushion layer (442) disposed for shock absorption. According to one embodiment, at least one functional member (443) may include a graphite sheet for heat dissipation, an added display, a force touch FPCB, a fingerprint sensor FPCB, a communication antenna radiator, a heat dissipation sheet, a conductive / non-conductive tape, or an open cell sponge. According to one embodiment, the conductive member (444) is a metal plate and can be used to help reinforce the rigidity of an electronic device (e.g., electronic device (101) of FIG. 2), shield ambient noise, and dissipate heat emitted from surrounding heat dissipation components. According to one embodiment, the conductive member (444) may comprise Cu, Al, SUS, or CLAD (e.g., a laminated member in which SUS and Al are alternately arranged). In another embodiment, the display (201) may further comprise a detection member (445) for detecting input by an electromagnetic induction type writing member (e.g., an electronic pen). According to one embodiment, the detection member (445) may comprise a digitizer. According to one embodiment, the detection member (445) may be placed between at least one polymer member (442) and a functional member (443). In another embodiment, the detection member (445) may be placed between a display panel (431) and at least one polymer member (441).

[0080] According to one embodiment, the auxiliary material layer (440) may include openings (4411, 4421, 4451, 4441) formed at a position overlapping with the camera (e.g., camera (205) of FIG. 2). According to one embodiment, the openings (4411, 4421, 4451, 4441) may be formed by removing a portion of the auxiliary material layer (440) that overlaps with the camera (205). For example, the openings (4411, 4421, 4451, 4441) may be formed such that the positions of the openings (4411, 4421, 4451, 4441) are aligned with the camera (205).

[0081] FIG. 6 is a cross-sectional view of a portion of an electronic device according to various embodiments shown in FIG. 2 and FIG. 3.

[0082] The electronic device (101) of FIG. 6 may be at least partially similar to the electronic device (101) of FIG. 2 and FIG. 3, or may include other embodiments of the electronic device. The display panel (431) of FIG. 6 may be at least partially similar to the display panel (431) of FIG. 5, or may further include other embodiments of the display panel.

[0083] Referring to FIG. 6, the electronic device (101) may include a housing (e.g., housing (210) of FIG. 2) comprising a front (e.g., first surface (210A) of FIG. 2), a rear surface (e.g., second surface (210B) of FIG. 3) facing in the opposite direction to the front (210A), and a side surface (e.g., side surface (210C) of FIG. 2) surrounding the space between the front (210A) and the rear surface (210B).

[0084] According to one embodiment, the electronic device (101) may further include a display (e.g., display (201) of FIG. 2) including a display panel (431) and a POL (433), a battery (189) placed below the display panel (202) (e.g., battery (189) of FIG. 1), and a rear plate (211) placed below the battery (189) (e.g., rear plate (211) of FIG. 3).

[0085] A display (201) according to one embodiment may include a display area (DA) and a non-display area (NDA). The display area (DA) of the display (201) may be an area visible from the outside through the front of the electronic device (101) (e.g., the first surface (210A) of FIG. 2). The non-display area (NDA) may be an area located outside the display area (DA).

[0086] According to one embodiment, the display (201) may include a window (202) (e.g., the window (202) of FIG. 5)) and a display panel (431) (e.g., the display panel (431) of FIG. 5) disposed below the window (202). A POL (433) (e.g., the POL (433) of FIG. 5) may be disposed between the window (202) and the display panel (431). Although not illustrated, at least one auxiliary material layer (e.g., the auxiliary material layer (440) of FIG. 5) may be disposed below the display panel.

[0087] According to one embodiment, the POL (433) may be attached to the back surface of the window (202) by an adhesive member (610). According to one embodiment, the adhesive member (610) may include an optical clear adhesive (OCA), a pressure-sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or double-sided tape.

[0088] According to one embodiment, when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2), the display area (DA) of the display (201) overlaps with the window (202), and the non-display area (NDA) of the display (201) may be covered by a part of the housing (210) so as not to be seen from the outside. For example, when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2), the non-display area (NDA) of the display (201) may be covered by a part of the side frame (220) so as not to be seen from the outside.

[0089] According to one embodiment, the housing (210) may include a side frame (220) forming part of the side and front (e.g., the first side (210A) of FIG. 2), and a rear plate (211) that is coupled to the side frame (220) and forms the rear (e.g., the second side (210B) of FIG. 3).

[0090] According to one embodiment, the side frame (220) may include a first part (2201) forming a side (e.g., the side (210C) of FIG. 2), and a second part (2202) extending from the first part (2201) and positioned to overlap at least a portion of the non-display area (NDA) of the display (201) when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2). For example, when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2), the non-display area (NDA) of the display (201) may be covered by the second part (2202) of the side frame (220) and may not be visible from the outside. According to one embodiment, as the second part (2202) of the side frame (220) covers at least a portion of the non-display area (NDA) of the display (201), the area requiring tolerance matching between the window (202) and the side frame (220) during the assembly process of the electronic device (101) can be reduced, and the ease and accuracy of assembly can be improved. Additionally, according to one embodiment, as the second part (2202) of the side frame (220) covers at least a portion of the non-display area (NDA) of the display (201), the waterproof design between the window (202) and the side frame (220) can be facilitated, and product reliability can be increased.

[0091] According to one embodiment, a second part (2202) of a side frame (220) covering at least a portion of a non-display area (NDA) of a display (201) may include a front frame portion (2202b) and an extension portion (2202a) extending from the front frame portion (2202b).

[0092] According to one embodiment, the front frame portion (2202b) may overlap with the first portion (2201) when the display (201) is viewed from the front (e.g., the first surface (210A) of FIG. 2).

[0093] According to one embodiment, the extension (2202a) may overlap with at least a portion of the non-display area (NDA) of the display (201) when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2). The back surface of the extension (2202a) of the side frame (220) may be attached to the non-display area (NDA) of the display (201) by double-sided tape (621).

[0094] According to one embodiment, the side frame (220) may include a metal material.

[0095] According to one embodiment, the side frame (220) may include a non-metallic polymer material.

[0096] According to one embodiment, the side frame (220) may be joined to at least part of the rear plate (211) by double-sided tape (622).

[0097] According to one embodiment, when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2), the height of the surface of the second part (2202) of the side frame (220) may be substantially the same as the height of the surface of the window (202). According to one embodiment, since the height of the surface of the second part (2202) of the side frame (220) is designed to be the same as the height of the surface of the window (202), damage to the window (202) from external impact can be protected, and the completeness and durability in the assembly process can be increased. For example, if the window (202) is formed of glass, the rigidity of the side frame (220) is superior to the rigidity of the glass, so the rigidity of the front of the electronic device (101) (e.g., the first side (210A) of FIG. 2) can be improved.

[0098] According to one embodiment, a second portion (2202) of the side frame (220) may include a conductive portion comprising a metal material. For example, when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2), the second portion (2202) of the side frame (220) covering the non-display area (NDA) may include a metal material.

[0099] According to one embodiment, the second portion (2202) of the side frame (220) may include a non-conductive portion comprising a non-metallic material. For example, when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2), the second portion (2202) of the side frame (220) covering the non-display area (NDA) may include a non-metallic material.

[0100] According to one embodiment, the window (202) may include glass. For example, the window (202) may include ultra-thin glass (UTG). In some embodiments, the window (202) may include a polymer. For example, the window (202) may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, the window (202) may be a plurality of stacked windows (202) (e.g., a plurality of stacked glasses).

[0101] FIGS. 7 to 11 are conceptual diagrams for explaining the manufacturing process of an electronic device according to various embodiments. For example, FIGS. 7 to 11 may be diagrams showing parts of the manufacturing and assembly process of an electronic device according to various embodiments in sequence.

[0102] Referring to FIG. 7, a cell process can be performed to obtain a display panel to be used in an electronic device (101). The cell process may include removing unnecessary parts from a large-sized display original substrate (700) made by sequentially undergoing a fabrication process, a thin-film transistor process, a deposition process, and an encapsulation process, and cutting it into an appropriate size for the final product use.

[0103] According to one embodiment, when the display original substrate (700) that has undergone the fab manufacturing process is completed, the cell process can perform a cutting process to cut out dozens to hundreds of display panels (431) for use in large-sized laptop devices, tablets, or smartphones.

[0104] According to one embodiment, the cutting process may utilize a wheel with sharp edges or a laser. In FIG. 7, the symbol CL indicates a cutting line where the cutting process is performed. When cutting a display original substrate (700) made of a hard glass material, such as a rigid substrate, a wheel made of diamond material may be used. Alternatively, when cutting a display original substrate (700) having flexible characteristics, a laser may be used.

[0105] According to one embodiment, by performing a cutting process, each of the plurality of display panels (431) separated from the display source substrate (700) including the plurality of display panels (431) can be obtained. One display panel (431) cut from the display source substrate (700) can be applied to an individual product, for example, the electronic device (101) of FIGS. 2 and FIGS. 3.

[0106] Referring to FIG. 8, a POL (433) can be attached to a display panel (431) cut from a display original substrate (700) by an attachment process.

[0107] Referring to FIG. 9, after attaching the POL (433) to the display panel (431), the window (202) can be attached using an adhesive member. According to one embodiment, the display panel (431) and the POL (433) may be formed integrally. When the display panel (431) and the POL (433) are formed integrally, the process of attaching the POL (433) to the display panel (431) may be omitted.

[0108] According to one embodiment, a window (202) is provided, and a display panel (431) including a POL (433) can be attached to the back surface of the window (202) using an adhesive member (610). The adhesive member (610) may include an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a thermoreactive adhesive, a general adhesive, or double-sided tape. The area of ​​the window (202) may be smaller than the area of ​​the display panel (431). According to one embodiment, the area of ​​the window (202) may substantially be the same as or similar to the area of ​​the display area (DA). According to one embodiment, the window (202) may be attached to the POL (433) to correspond to the display area (DA) using an adhesive member (610).

[0109] Referring to FIG. 10, the side frame (220) and the bracket (230) may be manufactured separately. According to one embodiment, the side frame (220) may be assembled with the display (201) first. According to one embodiment, the side frame (220) may include an extension (2202a) that overlaps with at least a portion of the non-display area (NDA) of the display (201) when the display (201) is viewed from the front (e.g., the first side (210A) of FIG. 2). The back surface of the extension (2202a) of the side frame (220) may be attached to the non-display area (NDA) of the display (201) by double-sided tape (621).

[0110] Referring to FIG. 11, when a display (201) is assembled to a side frame (220), a bracket (230) can be placed below the display (201) to combine the side frame (220) and the bracket (230). For example, after combining the side frame (220) and the bracket (230), a rear plate (211) can be placed below the bracket (230) to combine the rear plate (211) with the side frame (220) and the bracket (230). According to one embodiment, the side frame (220) can be joined to at least a portion of the rear plate (211) by means of double-sided tape (622).

[0111] FIG. 12 is an exemplary cross-sectional view of an electronic device in which the shape of the window frame is processed.

[0112] The window (202) illustrated in FIG. 12 may be similar in at least part to the window (202) of FIG. 6 or may include other embodiments of the window (202). Hereinafter, only the embodiment of FIG. 12 that differs from the embodiment of FIG. 6 will be described. Accordingly, features not described in FIG. 12 will be replaced by the description of the embodiment of FIG. 6.

[0113] Referring to FIG. 12, a window (202) according to one embodiment may be shaped such that the end of the window (202) in contact with the side frame (220) forms a step.

[0114] According to one embodiment, the boundary of the side frame (220) and the adjacent window (202) may include a step on which a second part (2202) of the side frame (220) rests. According to one embodiment, as the second part (2202) of the side frame (220) rests on the step of the window (202), the height of the upper surface of the second part (2202) may be substantially the same as the height of the upper surface of the window (202).

[0115] FIG. 13 is an exemplary cross-sectional view of an electronic device having a window with a stacked structure.

[0116] The window (202) illustrated in FIG. 13 may be similar in at least part to the window (202) of FIG. 6 or may include other embodiments of the window (202). Hereinafter, only the embodiment of FIG. 13 that differs from the embodiment of FIG. 6 will be described. Accordingly, features not described in FIG. 13 will be replaced by the description of the embodiment of FIG. 6.

[0117] Referring to FIG. 13, the window (202) may be a plurality of stacked windows (202). According to one embodiment, the area of ​​one layer among the plurality of windows (202) may differ from the area of ​​another layer. According to one embodiment, one layer among the plurality of windows (202) may be placed by an adhesive that has weaker adhesive strength or is thinner than the adhesive (or adhesive) of the other layer so that it can be easily separated from the other layer. According to one embodiment, the adhesive may include OCA (optical clear adhesive), PSA (pressure sensitive adhesive), thermal adhesive, photosensitive adhesive, general adhesive, and / or double-sided tape.

[0118] According to one embodiment, the window (202) may include a first window (1910) and a second window (1920) placed on the first window (1910).

[0119] According to one embodiment, the area of ​​the first window (1910) may be larger than the area of ​​the second window (1920). For example, the first window (1910) may correspond to the display area (DA) and the non-display area (NDA) and have a first area. For example, the second window (1920) may correspond to the display area (DA) and have a second area smaller than the first area.

[0120] According to one embodiment, as the area of ​​the first window (1910) is formed to be larger than the area of ​​the second window (1920), the end of the window (202) in contact with the side frame (220) may form a step. According to one embodiment, the second part (2202) of the side frame (220) may be seated on the border boundary of the first window (1910) corresponding to the non-display area (NDA). According to one embodiment, the border boundary of the window (202) adjacent to the side frame (220) may include a step on which the second part (2202) of the side frame (220) is seated. According to one embodiment, as the second part (2202) of the side frame (220) is seated on the step of the window (202), the height of the upper surface of the second part (2202) may be substantially the same as the height of the upper surface of the window (202).

[0121] An electronic device according to one embodiment of the present disclosure comprises a housing including a front, a rear facing opposite to the front, and a side surrounding the space between the front and the rear, and a display including a display area visible from the outside through a part of the front and a non-display area located at the outer edge of the display area, the display including a window and a display panel disposed below the window, wherein when the display is viewed from the front, the display area of ​​the display overlaps with the window, and the non-display area of ​​the display may be covered by a part of the housing and not visible from the outside.

[0122] The above housing may include a side frame forming part of the side and the front, and a rear plate coupled to the side frame and forming the rear.

[0123] The above side frame may include a first part forming the side, and a second part extending from the first part and positioned to overlap at least a portion of the non-display area of ​​the display when the display is viewed from the front.

[0124] When the above display is viewed from the front, the height of the surface of the second part may be substantially the same as the height of the surface of the window.

[0125] The above window may include glass.

[0126] The second portion of the side frame covers at least a portion of the non-display area of ​​the display when the display is viewed from the front, and may include a conductive portion comprising a metal material.

[0127] The second portion of the side frame covers at least a portion of the non-display area of ​​the display when the display is viewed from the front, and may include a non-conductive portion comprising a non-metallic material.

[0128] The boundary of the window adjacent to the side frame may include a step on which the second part of the side frame is seated.

[0129] The above window includes a first window having a first area corresponding to the display area and the non-display area, and a second window having a second area corresponding to the display area disposed on the first window, wherein the first area may be larger than the second area.

[0130] The second portion of the above-mentioned side frame can be seated on the border boundary of the first window corresponding to the above-mentioned non-display area.

[0131] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include the steps of: obtaining a display panel including a display area and a non-display area by cutting a display original substrate; attaching a polarizing film to the display panel; attaching a window having an area corresponding to the display area of ​​the display panel to the display panel including the polarizing film; separately manufacturing a side frame and a bracket; combining the side frame with the display panel to which the window is attached; placing the bracket below the display panel and combining the bracket with the side frame; and placing a rear plate below the bracket and combining the rear plate with the side frame and the bracket. When the display panel is viewed from the front facing the window, the display area overlaps with the window, and the non-display area is covered by a part of the side frame so as not to be seen from the outside.

[0132] The above side frame may include a first part forming a side of the electronic device, and a second part extending from the first part and positioned to overlap at least a portion of the non-display area when the display panel is viewed from the front.

[0133] When the above display is viewed from the front, the height of the surface of the second part may be substantially the same as the height of the surface of the window.

[0134] The second part of the above-mentioned side frame may include a conductive part comprising a metal material.

[0135] The above window may include glass.

Claims

1. In an electronic device, A housing comprising a front, a rear facing in the opposite direction to the front, and a side surrounding the space between the front and the rear; and A display comprising a display area visible from the outside through a portion of the front surface and a non-display area located at the outer edge of the display area, Windows; The display including a display panel positioned below the above window, and When the above display is viewed from the front, the display area of ​​the above display overlaps with the window, and the non-display area of ​​the above display is covered by a part of the housing so as not to be seen from the outside. Electronic device.

2. In Paragraph 1, The above housing is A side frame forming part of the above side and the above front; and A rear plate that is combined with the above-mentioned side frame and forms the above-mentioned rear surface, Electronic device.

3. In Paragraph 2, The above side frame is A first part forming the above-mentioned side, and A second portion extending from the first portion and positioned to overlap at least a portion of the non-display area of ​​the display when the display is viewed from the front, Electronic device.

4. In Paragraph 3, When the above display is viewed from the front, the height of the surface of the second part is substantially the same as the height of the surface of the window. Electronic device.

5. In Paragraph 1, The above window includes glass, Electronic device.

6. In Paragraph 3, The second part of the above side frame When the above display is viewed from the front, it covers at least a portion of the above non-display area of ​​the above display, and including a conductive part including a metal material, Electronic device.

7. In Paragraph 3, The second part of the above side frame When the above display is viewed from the front, it covers at least a portion of the above non-display area of ​​the above display, and including a non-conductive portion comprising a non-metallic material, Electronic device.

8. In Paragraph 3, The boundary of the window adjacent to the side frame includes a step on which the second part of the side frame is seated. Electronic device.

9. In Paragraph 3, The above window is A first window having a first area corresponding to the above display area and the above non-display area; and It includes a second window disposed on the first window and having a second area corresponding to the display area, The above first area is larger than the above second area, Electronic device.

10. In Paragraph 9, The second portion of the above-mentioned side frame is seated on the border boundary of the first window corresponding to the above-mentioned non-display area, Electronic device.

11. In a method for manufacturing an electronic device, A step of obtaining a display panel including a display area and a non-display area by cutting a display original substrate; A step of attaching a polarizing film to the above display panel; A step of attaching a window having an area corresponding to the display area of ​​the display panel to the display panel including the polarizing film; Step of manufacturing the side frame and bracket separately; A step of combining the above side frame with the display panel to which the above window is attached; A step of placing the bracket below the display panel and combining the bracket with the side frame; and The method includes the step of placing a rear plate below the bracket and combining the rear plate, the side frame, and the bracket. When the display panel is viewed from the front facing the window, the display area overlaps with the window, and the non-display area is covered by a part of the side frame so as not to be seen from the outside, the step comprising Manufacturing method.

12. In Paragraph 11, The above side frame is A first part forming a side of the electronic device, and A second portion extending from the first portion and positioned to overlap at least a portion of the non-display area when the display panel is viewed from the front, Manufacturing method.

13. In Paragraph 12, When the above display is viewed from the front, the height of the surface of the second part is substantially the same as the height of the surface of the window. Manufacturing method.

14. In Paragraph 12, The second part of the above side frame including a conductive part including a metal material, Manufacturing method.

15. In Paragraph 11, The above window includes glass, Manufacturing method.

Images