Optical element, method for manufacturing optical element, and photodetector

Abstract

An optical element (10) according to an embodiment of the present disclosure comprises: a resin layer (11); and at least one structure (12) provided inside the resin layer (11) and formed of a material different from that of the resin layer (11). A method for manufacturing an optical element (10) according to an embodiment of the present disclosure comprises: forming a resin layer (11) having at least one recess; and filling the at least one recess of the resin layer (11) with a material different from that of the resin layer (11) to form at least one structure (12).

Description

Optical Element, Method for Manufacturing Optical Element, and Photodetection Device

[0001] The present disclosure relates to an optical element, a method for manufacturing the same, and a photodetection device including the optical element.

[0002] For example, in Patent Document 1, a dielectric metasurface provided with a plurality of nanostructures on a substrate has been proposed. This dielectric metasurface can be obtained by forming an opening in a resist layer on the substrate by pattern processing, filling the opening with TiO2, and then removing the resist layer.

[0003] Japanese Patent Translation Publication No. 2018 - 536204

[0004] By the way, an optical element having a metasurface structure has one or more pillars provided on a substrate.

[0005] Further, in the manufacturing process of an optical element having a metasurface structure, lithography and etching are required. Therefore, the manufacture of an optical element having a fine structure requires a large number of steps and time.

[0006] Therefore, an optical element that can be easily manufactured, a method for manufacturing the same, and a photodetection device including such an optical element are desired.

[0007] An optical element according to an embodiment of the present disclosure includes a resin layer having a first surface and one or more structures provided inside the resin layer and formed of a material different from the material forming the resin layer.

[0008] A method for manufacturing an optical element according to an embodiment of the present disclosure includes forming a resin layer having one or more recesses and forming one or more structures by embedding a material different from the material forming the resin layer in the one or more recesses of the resin layer.

[0009] A photodetection device according to an embodiment of the present disclosure includes an optical element, and as the optical element, has the optical element according to the embodiment of the present disclosure described above.

[0010] In one embodiment of the optical element and one embodiment of the photodetector, the substrate is not used, and the structure is placed inside the resin layer, thereby enabling thinning and weight reduction.

[0011] In one embodiment of the present disclosure, a method for manufacturing an optical element is used to form one or more structures without an etching process.

[0012] Figure 1 is a schematic diagram showing an example of a cross-sectional configuration of an optical element according to one embodiment of the present disclosure. Figure 2 is a schematic diagram showing an example of a planar configuration of the optical element shown in Figure 1. Figure 3 is a block diagram showing an example of the schematic configuration of an imaging device, which is an example of a photodetector according to one embodiment of the present disclosure. Figure 4 is a schematic diagram showing an example of a pixel section of an imaging device according to one embodiment of the present disclosure. Figure 5 is a schematic diagram showing an example of the pixel configuration of an imaging device according to one embodiment of the present disclosure. Figure 6 is a schematic diagram showing an example of a cross-sectional configuration of an imaging device according to one embodiment of the present disclosure. Figure 7A is a schematic cross-sectional diagram illustrating an example of a manufacturing process for the optical element shown in Figure 1. Figure 7B is a schematic cross-sectional diagram showing the process following Figure 7A. Figure 7C is a schematic cross-sectional diagram showing the process following Figure 7B. Figure 7D is a schematic cross-sectional diagram showing the process following Figure 7C. Figure 8 is a schematic diagram showing an example of a cross-sectional configuration of an optical element according to Modification 1 of the present disclosure. Figure 9 is a schematic diagram showing an example of a cross-sectional configuration of an optical element according to Modification 2 of the present disclosure. Figure 10 is a schematic diagram showing an example of a planar configuration of an optical element according to Modification 3 of the present disclosure. Figure 11 is a schematic diagram showing an example of a cross-sectional configuration of an optical element according to Modification 4 of the present disclosure. Figure 12A is a schematic diagram showing an example of a cross-sectional configuration of an optical element according to Modification 5 of the present disclosure. Figure 12B is a schematic diagram showing another example of a cross-sectional configuration of an optical element according to Modification 5 of the present disclosure. Figure 13 is a schematic diagram showing an example of a cross-sectional configuration of an optical element according to Modification 6 of the present disclosure. Figure 14 is a schematic diagram showing an example of a cross-sectional configuration of an optical element according to Modification 7 of the present disclosure. Figure 15A is a schematic cross-sectional diagram illustrating an example of a manufacturing process for an optical element according to Modification 8 of the present disclosure. Figure 15B is a schematic cross-sectional diagram showing a process following Figure 15A. Figure 16 is a block diagram showing an example of the configuration of an electronic device having an imaging device. Figure 17 is a block diagram showing an example of a schematic configuration of a vehicle control system. Figure 18 is an explanatory diagram showing an example of the installation position of an external information detection unit and an imaging unit. Figure 19 is a diagram showing an example of a schematic configuration of an endoscopic surgery system. Figure 20 is a block diagram showing an example of the functional configuration of the camera head and CCU.

[0013] Hereinafter, one embodiment of the present disclosure will be described in detail with reference to the drawings. The following description is a specific example of the present disclosure, and the present disclosure is not limited to the following embodiment. Furthermore, the present disclosure is not limited to the arrangement, dimensions, dimensional ratios, etc., of each component shown in each figure. The order of description is as follows: 1. Embodiment (Example of a photodetector with an optical element containing a microstructure inside a resin layer) 1-1. Configuration of the optical element 1-2. Configuration of the photodetector 1-3. Method of manufacturing the optical element 1-4. Operation and effect 2. Modifications 2-1. Modification 1 2-2. Modification 2 2-3. Modification 3 2-4. Modification 4 2-5. Modification 5 2-6. Modification 6 2-7. Modification 7 2-8. Modification 8 3. Application examples 4. Application examples

[0014] <1. Embodiments> [1-1. Configuration of Optical Element] Figure 1 schematically shows an example of the cross-sectional configuration of an optical element 10 according to one embodiment of the present disclosure. Figure 2 schematically shows an example of the planar configuration of the optical element 10 shown in Figure 1.

[0015] The optical element 10 is an optical component utilizing metamaterial (metasurface) technology. The optical element 10 has a resin layer 11 and one or more structures 12. Figures 1 and 2 illustrate an example where the optical element 10 has multiple structures 12.

[0016] The resin layer 11 extends along the XY planes and has opposing surfaces 11S1 and 11S2 in the Z-axis direction perpendicular to the XY planes. The resin layer 11 is formed using, for example, a thermoplastic, thermosetting, or UV-curable resin. Examples of thermosetting resins include PS (polystyrene) resin, AS (acrylonitrile styrene) resin, PET (polyethylene phthalate), PMMA (polymethyl methacrylic) resin, and other acrylic resins, as well as PC (polycarbonate) resin. Examples of thermosetting resins include epoxy resin. Examples of UV-curable resins include acrylic resin. Surface 11S1 corresponds to a specific example of the "first surface" as one aspect of this disclosure. Surface 11S2 corresponds to a specific example of the "second surface" as one aspect of this disclosure. The "Z-axis direction" corresponds to a specific example of the "first direction" as one aspect of this disclosure.

[0017] Each of the one or more structures 12 is, for example, a columnar body with its longitudinal direction in the Z-axis direction. Each of the one or more structures 12 has a first end face 12S1 and a second end face 12S2 that extend along the XY plane and face each other in the Z-axis direction. Each of the one or more structures 12 has a height H which is a dimension in the Z-axis direction perpendicular to the surface 11S1 of the resin layer 11, and a diameter D which is a dimension in the direction parallel to the surface 11S1. The height H of each of the one or more structures 12 is the maximum dimension of each of the one or more structures 12 in the Z-axis direction. The diameter D of each of the one or more structures 12 is the maximum dimension in the cross-section along each of the one or more structures 12 along the surface 11S1. Here, the first end face 12S1 corresponds to a specific example of the "top surface" as one aspect of this disclosure.

[0018] One or more structures 12 are provided inside the resin layer 11. This statement, "One or more structures 12 are provided inside the resin layer 11," is not limited to a configuration in which the one or more structures 12 are embedded in the resin layer 11 and not exposed to the outside. The first end face 12S1 and the second end face 12S2 of each of the one or more structures 12 may be exposed to at least one of the surfaces 11S1 and 11S2 of the resin layer 11. Even in such a configuration, the concept that one or more structures 12 are provided inside the resin layer 11 is still encompassed.

[0019] As shown in Figure 1, the first end face 12S1 of each of the one or more structures 12 may coincide with the surface 11S1 of the resin layer 11. The height H of each of the one or more structures 12 is greater than the diameter D of each of the one or more structures 12. That is, each of the one or more structures 12 has a shape with a high aspect ratio. The aspect ratio of each of the one or more structures 12 is, for example, 1 μm or more. As shown in Figure 2, in plan view, each of the one or more structures 12 has a roughly circular shape.

[0020] Each of the one or more structures 12 is made of a material different from the material forming the resin layer 11. The refractive index of each of the one or more structures 12 is different from the refractive index of the resin layer 11. Each of the one or more structures 12 is made using at least one of oxides and nitrides. The oxide used in the one or more structures 12 is, for example, titanium oxide (TiO2). ２ ), niobium oxide (Nb ２ O ５ Examples of nitrides include silicon nitride (SiN).

[0021] [1-2. Configuration of the Light Detection Device] Figure 3 schematically shows an example of the general configuration of an imaging device 1, which is an example of a light detection device according to one embodiment of the present disclosure. Figure 4 schematically shows an example of the pixel section of an imaging device according to one embodiment of the present disclosure. Figure 5 schematically shows an example of the pixel configuration of an imaging device according to one embodiment of the present disclosure. Figure 6 schematically shows an example of the cross-sectional configuration of an imaging device according to one embodiment of the present disclosure.

[0022] A light detection device is a device capable of detecting incident light. The imaging device 1, which is a light detection device, has a plurality of pixels P each having a photoelectric conversion unit (photoelectric conversion element), and is configured to generate a signal by photoelectric conversion of incident light. The imaging device 1 captures an image by receiving light from a subject, photoelectric conversion, and generating an image signal. The imaging device 1 is a so-called global shutter type back-illuminated image sensor, such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0023] The imaging device 1 (light detection device) can generate a signal by receiving light transmitted through an optical system (not shown) including an optical lens. The photoelectric conversion unit of each pixel P of the imaging device 1 is, for example, a photodiode (PD) and is configured to convert light into photoelectric energy. The imaging device 1 has an imaging area (pixel section 100) in which a plurality of pixels P are arranged in a matrix in two dimensions. The pixel section 100 is a pixel array in which a plurality of pixels P are arranged, and can also be called a light-receiving area.

[0024] The imaging device 1 captures incident light (image light) from the subject through an optical system including an optical lens. The imaging device 1 captures an image of the subject formed by the optical lens. The imaging device 1 can generate pixel signals by photoelectric conversion of the received light.

[0025] The imaging device 1, which is a light detection device, is a device capable of receiving incident light and generating a signal, and can also be called a light receiving device. The imaging device 1 can be used in electronic devices such as digital still cameras, video cameras, and mobile phones, as an example.

[0026] (Outline configuration of the imaging device) As shown in the example in Figure 3, the imaging device 1 has, for example, a pixel driving unit 111, a signal processing unit 112, a control unit 113, a processing unit 114, etc. in the peripheral area of ​​the pixel unit 100 (pixel array). The imaging device 1 is also provided with a plurality of control lines L1 and a plurality of signal lines L2.

[0027] Control line L1 is a signal line capable of transmitting signals to control pixels P, and is connected to the pixel drive unit 111 and the pixels P of the pixel unit 100. In the example shown in Figure 3, in the pixel unit 100, multiple control lines L1 are wired for each pixel row, which is composed of multiple pixels P arranged horizontally (in the row direction). Control line L1 is configured to transmit control signals for reading signals from pixels P.

[0028] The multiple control lines L1 for each pixel row of the imaging device 1 include, for example, wiring that transmits signals to control the transfer transistor, wiring that transmits signals to control the selection transistor, wiring that transmits signals to control the reset transistor, etc. The control lines L1 can also be called drive lines (pixel drive lines) that transmit signals to drive the pixels P.

[0029] The signal line L2 is a signal line capable of transmitting signals from pixels P, and is connected to the pixels P of the pixel unit 100 and the signal processing unit 112. For example, the signal line L2 is wired to each pixel column of the pixel unit 100, which is composed of multiple pixels P arranged vertically (in the column direction). The signal line L2 is a vertical signal line and is configured to transmit signals output from pixels P.

[0030] The pixel drive unit 111 is configured to drive each pixel P of the pixel unit 100. The pixel drive unit 111 is a drive circuit and is composed of multiple circuits, such as a buffer, a shift register, and an address decoder. The pixel drive unit 111 generates a signal for driving the pixels P and outputs it to each pixel P of the pixel unit 100 via the control line L1. The pixel drive unit 111 is controlled by the control unit 113 and controls the pixels P of the pixel unit 100.

[0031] The pixel drive unit 111 generates signals for controlling pixels P, such as signals for controlling the transfer transistor of a pixel P, signals for controlling the selection transistor, and signals for controlling the reset transistor, and supplies these signals to each pixel P via the control line L1. The pixel drive unit 111 can perform control to read out pixel signals from each pixel P. The pixel drive unit 111 can also be described as a pixel control unit configured to control each pixel P. The pixel drive unit 111 and the control unit 113 together can also be called a pixel control unit.

[0032] The signal processing unit 112 is configured to perform signal processing on the input pixel signals. The signal processing unit 112 is a signal processing circuit and includes, for example, a load circuit, an AD (Analog Digital) conversion unit, a horizontal selection switch, etc. The signal processing unit 112 may also have an amplification circuit configured to amplify the signal read from the pixel P via the signal line L2.

[0033] The signals output from each pixel P selected and scanned by the pixel driving unit 111 are input to the signal processing unit 112 via the signal line L2. The signal processing unit 112 can perform signal processing such as AD conversion and CDS (Correlated Double Sampling) of the signals of the pixels P. The signals of each pixel P transmitted through each of the signal lines L2 are processed by the signal processing unit 112 and output to the processing unit 114.

[0034] The processing unit 114 is configured to perform signal processing on the input signal. The processing unit 114 is a signal processing circuit and is composed of, for example, a circuit that performs various signal processing on the pixel signal. The processing unit 114 may also include a processor and memory. The processing unit 114 performs signal processing on the pixel signal input from the signal processing unit 112 and outputs the processed pixel signal. The processing unit 114 can perform various signal processing, such as noise reduction processing and gradation correction processing.

[0035] The control unit 113 is configured to control each part of the imaging device 1. The control unit 113 receives data such as a clock and operating mode commands from an external source, and can output data such as internal information of the imaging device 1. The control unit 113 is a control circuit and, for example, has a timing generator configured to generate various timing signals.

[0036] The control unit 113 controls the operation of the pixel drive unit 111 and the signal processing unit 112, etc., based on various timing signals (pulse signals, clock signals, etc.) generated by the timing generator. The control unit 113 and the processing unit 114 may be configured as an integrated unit.

[0037] The pixel driving unit 111, signal processing unit 112, control unit 113, processing unit 114, etc., may be provided on a single semiconductor substrate or may be provided on multiple semiconductor substrates. The imaging device 1 may have a structure (stacked structure) formed by stacking multiple substrates.

[0038] (Pixel Configuration) Each pixel P includes a photoelectric conversion unit 32 (photoelectric conversion element) and a readout circuit 20. The photoelectric conversion unit 32 is configured to receive light and generate a signal. The readout circuit 20 is configured to output a signal based on the photoelectrically converted charge.

[0039] The photoelectric conversion unit 32 is a light receiving unit (light receiving element) and is configured to generate electric charge through photoelectric conversion. In the example shown in Figure 5, the photoelectric conversion unit 32 is a photodiode (PD) that converts incident light into electric charge. The photoelectric conversion unit 32 performs photoelectric conversion to generate an electric charge corresponding to the amount of light received.

[0040] The readout circuit 20, as an example, includes a transfer transistor 33, a floating diffusion (FD) 34, an amplification transistor 35, a selection transistor 36, and a reset transistor 37. The transfer transistor 33, amplification transistor 35, selection transistor 36, and reset transistor 37 are MOS transistors (MOSFETs) each having gate, source, and drain terminals.

[0041] In the example shown in Figure 5, the transfer transistor 33, the amplification transistor 35, the selection transistor 36, and the reset transistor 37 are each composed of NMOS transistors. The transistor for pixel P may be composed of a PMOS transistor.

[0042] The transfer transistor 33 is configured to transfer the charge photoelectrically converted in the photoelectric conversion unit 32 to the FD 34. As shown in Figure 5, the transfer transistor 33 is controlled by the signal TRG to electrically connect or disconnect the photoelectric conversion unit 32 and the FD 34. The transfer transistor 33 can transfer the charge photoelectrically converted and stored in the photoelectric conversion unit 32 to the FD 34.

[0043] FD34 is an accumulation unit and is configured to be able to accumulate the transferred charges. FD34 can accumulate the charges photoelectrically converted by the photoelectric conversion unit 32. FD34 can also be said to be a holding unit that can hold the transferred charges. FD34 accumulates the transferred charges and converts them into a voltage corresponding to the capacity of FD34.

[0044] The amplification transistor 35 is configured to generate and output a signal based on the charges accumulated in FD34. As shown in FIG. 5, the gate of the amplification transistor 35 is electrically connected to FD34, and the voltage converted by FD34 is input thereto.

[0045] The drain of the amplification transistor 35 is connected to a power supply line to which the power supply voltage VDD is supplied, and the source of the amplification transistor 35 is connected to the signal line L2 via the selection transistor 36. The amplification transistor 35 can generate a signal based on the charges accumulated in FD34, that is, a signal based on the voltage of FD34, and output it to the signal line L2.

[0046] The selection transistor 36 is configured to be able to control the output of the pixel signal. The selection transistor 36 is controlled by the signal SEL and is configured to be able to output the signal from the amplification transistor 35 to the signal line L2.

[0047] The selection transistor 36 can control the output timing of the pixel signal. Note that the selection transistor 36 may be provided between the power supply line to which the power supply voltage VDD is applied and the amplification transistor 35. Also, if necessary, the selection transistor 36 may be omitted.

[0048] The reset transistor 37 is configured to be able to reset the voltage of FD34. In the example shown in FIG. 5, the reset transistor 37 is electrically connected to the power supply line to which the power supply voltage VDD is applied and is configured to reset the charges of the pixel P.

[0049] The reset transistor 37 is controlled by the signal RST and can reset the charges accumulated in FD34 and reset the voltage of FD34. Note that the reset transistor 37 can discharge the charges accumulated in the photoelectric conversion unit 32 via the transfer transistor 33.

[0050] The pixel driving unit 111 (see Figure 3) supplies control signals to the gates of each pixel P, such as the transfer transistor 33, selection transistor 36, and reset transistor 37, via the control line L1 described above, to turn the transistors on (conductive) or off (non-conductive).

[0051] The multiple control lines L1 of the imaging device 1 include, for example, wiring that transmits the signal T RG which controls the transfer transistor 33, wiring that transmits the signal SEL which controls the selection transistor 36, wiring that transmits the signal RST which controls the reset transistor 37, and so on.

[0052] The readout circuit 20 may be configured to allow changing the conversion efficiency (gain) when converting charge to voltage. For example, the readout circuit 20 may have a switching transistor used to set the conversion efficiency. The switching transistor may be provided, as an example, between the FD34 and the reset transistor 37.

[0053] In the readout circuit 20, when the switching transistor is turned on, the capacitance added to the FD 14 of the pixel P increases, and the conversion efficiency is switched. The switching transistor can change the conversion efficiency by switching the capacitance connected to the gate of the amplification transistor 35.

[0054] The transfer transistor 33, selection transistor 36, reset transistor 37, and switching transistors are controlled on and off by the pixel drive unit 111. The pixel drive unit 111 controls the readout circuit 20 of each pixel P to output a pixel signal from each pixel P to the signal line L2. The pixel drive unit 111 can control the reading of the pixel signal from each pixel P to the signal line L2.

[0055] (Configuration of the imaging device) In the imaging device 1, one or more optical elements 10 are provided for each pixel P or for each set of pixels P.

[0056] The imaging device 1, for example as shown in Figure 6, has a configuration in which an optical element 10, an insulating layer 50, a semiconductor layer 30, and a multilayer wiring layer 90 are stacked in the Z-axis direction.

[0057] The optical element 10 is provided such that the surface 11S1 of the resin layer 11 faces the surface 30S1 of the semiconductor layer 30. The optical element 10 is provided on the side into which light from the optical system is incident.

[0058] As shown in Figure 6, the semiconductor layer 30 has two opposing surfaces 30S1 and 30S2. The semiconductor layer 30 is made of a semiconductor substrate, such as a Si (silicon) substrate. Surface 30S1 of the semiconductor layer 30 is the light-receiving surface (light incident surface). Surface 30S2 of the semiconductor layer 30 is the element formation surface on which elements such as transistors are formed. A gate electrode, gate oxide film, etc., may be provided on surface 30S2 of the semiconductor layer 30.

[0059] In the semiconductor layer 30, a plurality of photoelectric conversion units 32 (photoelectric conversion elements) are provided along surfaces 30S1 and 30S2. For example, a plurality of photoelectric conversion units 32 are embedded in the semiconductor layer 30. The semiconductor layer 30 may be an SOI (Silicon On Insulator) substrate, a SiGe (silicon germanium) substrate, a SiC (silicon carbide) substrate, or it may be composed of a compound semiconductor material of group III-V.

[0060] The insulating layer 50 is provided on the surface 30S1 side of the semiconductor layer 30. The insulating layer 50 is provided between the semiconductor layer 30 and the optical element 10. The insulating layer 50 is laminated on the semiconductor layer 30 and is located on the surface 30S1 of the semiconductor layer 30. The insulating layer 50 is formed using an insulating film such as an oxide film, a nitride film, or an oxynitride film.

[0061] The insulating layer 50 may be composed of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), or other insulating materials. The insulating layer 50 can also be called a planarization layer (planarization film).

[0062] The light-shielding portion 55 (light-shielding film) is composed of a light-blocking material and is provided at the boundary between a plurality of adjacent pixels P. The light-shielding portion 55 (light-shielding material) is formed, for example, within or on the insulating layer 50 on the surface 30S1 side of the semiconductor layer 30. In the example shown in Figure 6, the light-shielding portion 55 is located above the separation portion 60.

[0063] The light-shielding portion 55 is made of, for example, a light-shielding metal material (aluminum (Al), tungsten (W), copper (Cu), etc.). The light-shielding portion 55 may also be made of a light-absorbing material. The light-shielding portion 55 is provided around the photoelectric conversion portion 32 to suppress light leakage to surrounding pixels.

[0064] The multilayer wiring layer 90 is provided on the surface 30S2 side of the semiconductor layer 30. The multilayer wiring layer 90 is provided on the side opposite to the side from which light is incident. The imaging device 1 is a so-called back-illuminated imaging device. The multilayer wiring layer 90 includes, for example, a conductive film and an insulating film, and has a plurality of wirings and vias (VIAs). The multilayer wiring layer 90 includes, for example, two or more layers of wiring. The multilayer wiring layer 90 has a configuration in which a plurality of wirings are laminated with insulating films in between. The insulating film of the multilayer wiring layer 90 can also be called an interlayer insulating film (interlayer insulating layer).

[0065] The wiring of the multilayer wiring layer 90 is formed using metallic materials such as aluminum (Al), copper (Cu), and tungsten (W). The wiring of the multilayer wiring layer 90 may also be made using polysilicon (Poly-Si) or other conductive materials. The interlayer insulating film is formed using, for example, silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), etc.

[0066] For example, the readout circuit 20 (see Figure 5) described above is provided on the semiconductor layer 30 and the multilayer wiring layer 90. The pixel driving unit 111, signal processing unit 112, control unit 113, and processing unit 114, etc. (see Figure 3) described above are provided on a substrate separate from the semiconductor layer 30, or on the semiconductor layer 30 and the multilayer wiring layer 90.

[0067] The imaging device 1 is provided with a separation section 60 between a plurality of adjacent photoelectric conversion units 32. The separation section 60 separates the photoelectric conversion units 32. The separation section 60 has a trench (groove) provided at the boundary between adjacent pixels P (or photoelectric conversion units 32). The separation section 60 is provided, for example, in the semiconductor layer 30 so as to surround the photoelectric conversion units 32.

[0068] The separation portion 60 is provided so as to penetrate the semiconductor layer 30, for example, as shown in the example in Figure 6. An insulating film, such as a silicon oxide film, is provided in the trench of the separation portion 60, as an example. Polysilicon, a metal material, or the like may be embedded in the trench of the separation portion 60.

[0069] The separation portion 60 may be formed using other dielectric materials having a low refractive index. For example, a void (cavity) may be provided within the trench of the separation portion 60. By providing the separation portion 60, light leakage to the surrounding pixels P is suppressed. Unwanted light leakage to the surroundings is suppressed, and for example, color mixing can be suppressed.

[0070] The imaging device 1 may have a fixed charge film and an anti-reflective film. The fixed charge film and the anti-reflective film are provided, for example, between the semiconductor layer 30 and the insulating layer 50. The fixed charge film is, for example, made of a metal compound (metal oxide, metal nitride, etc.). The fixed charge film is, for example, a film having a negative fixed charge, and suppresses the generation of dark current at the interface of the semiconductor layer 30.

[0071] The anti-reflective film is constructed using, for example, an insulating material such as silicon nitride (SiN) or silicon oxide (SiO). The anti-reflective film is provided, for example, on the surface 30S1 side of the semiconductor layer 30 to reduce reflection. The insulating layer 50 may be composed of at least one of a fixed charge film and an anti-reflective film.

[0072] [1-3. Method for Manufacturing Optical Elements] The optical element 10 of this embodiment can be manufactured, for example, as follows. Figures 7A to 7D show an example of the manufacturing process for the optical element 10. Here, we illustrate the case in which the resin layer 11 is produced by injection molding using an injection molding machine.

[0073] First, a stamper 71 having one or more protrusions 711 is prepared, as shown in Figure 7A. The stamper 71 is formed from, for example, nickel (Ni). Next, a sealed space is formed by abutting the stamper 71 against the mold of an injection molding machine. At this time, the side of the stamper 71 with the protrusions 711 is positioned facing the sealed space. After that, a thermoplastic resin heated and melted by the injection unit of the injection molding machine is injected into the sealed space.

[0074] Furthermore, after the thermoplastic resin injected into the sealed space is cooled, the cooled thermoplastic resin is removed from the mold together with the stamper 71, thereby forming a resin layer 11 that covers one or more protrusions 711 of the stamper 71, as shown in Figure 7B. After that, the resin layer 11 is peeled off from the stamper 71. The peeled resin layer 11 has one or more recesses 110 corresponding to each of the one or more protrusions 711 of the stamper 71, as shown in Figure 7C.

[0075] Next, as shown in Figure 7D, one or more structures 12 are formed by filling each of the one or more recesses 110 in the resin layer 11 with a material different from the material used to form the resin layer 11, for example, by sputtering. This completes the optical element 10 shown in Figure 1.

[0076] [1-4. Function and Effects] The optical element 10 of this embodiment comprises a resin layer 11 and one or more structures 12 provided inside the resin layer 11 and made of a material different from the material forming the resin layer 11. The optical element 10 does not include a support substrate, and each of the one or more structures 12 is included inside the resin layer 11, which enables thinning and weight reduction. This will be explained below.

[0077] A typical optical element used in a light detection device comprises a pillar on a support substrate, such as glass, and a protective layer covering the pillar. The pillar is formed using a material with a refractive index higher than that of the protective layer.

[0078] In contrast, the optical element 10 of this embodiment does not include a support substrate in its configuration. Furthermore, one or more structures 12 are provided inside the resin layer 11, rather than in glass or the like. As mentioned above, "provided inside" here includes cases where, for example, a part of each of the one or more structures 12 is exposed from the resin layer. By adopting the above configuration, the optical element 10 can be made thinner and lighter. Furthermore, an improvement in light transmittance can be expected by reducing interfacial reflection.

[0079] The manufacturing method for the optical element 10 of this embodiment includes forming a resin layer 11 having one or more recesses 110, and forming one or more structures 12 by embedding a material different from the material used to form the resin layer 11 into one or more recesses 110 of the resin layer 11. This allows for the formation of one or more structures in the manufacturing method of the optical element 10 without an etching process. This will be explained below.

[0080] In a typical manufacturing method for optical elements used in photodetectors, an oxide film is deposited on a support substrate, and then a resist pattern is formed on the oxide film by lithography. Subsequently, a raised portion is formed by reflow heat treatment, and then the material is cooled and hardened. Next, pillars are formed from the oxide film by etching using the resist pattern as a mask. Finally, a protective film is formed to cover the oxide film pillars, thereby obtaining the optical element.

[0081] In contrast, in the manufacturing method of the optical element 10 of this embodiment, as described above, one or more structures 12 are formed by embedding a material different from the material forming the resin layer 11 into one or more recesses 110 of the resin layer 11. Compared to a general optical element manufacturing method, the number of steps in the manufacturing method of the optical element 10 is reduced. Therefore, the time required to manufacture the optical element 10 can be reduced compared to the time required to manufacture a general optical element.

[0082] As described above, the manufacturing method for the optical element 10 of this embodiment forms one or more structures 12 without an etching process. This makes it possible to form one or more structures 12 using materials that are difficult to etch, thus improving the degree of design freedom. Furthermore, when pillars are formed by an etching process, it is difficult to maintain a high aspect ratio of the pillars. For this reason, the height of typical pillars is limited to 1 μm or less. In contrast, with the optical element 10, the above manufacturing method makes it possible for one or more structures 12 to maintain a height of 1 μm or more.

[0083] Furthermore, in the manufacturing method of the optical element 10 of this embodiment, as described above, one or more recesses 110 are formed by injection molding using a stamper 71 on the resin layer 11. By repeatedly using the stamper 71 to manufacture the optical element 10, the reproducibility of the optical element 10 is improved.

[0084] <2. Modifications> [2-1. Modification 1] Figure 8 schematically shows an example of the cross-sectional configuration of the optical element 10A according to Modification 1 of the present disclosure.

[0085] In the above embodiment, an example was shown in which the diameter D of each of the one or more structures 12 is substantially the same, but the present disclosure is not limited thereto. In the optical element 10A of this modified example, one or more structures 12a have a first structure 12a1 and a second structure 12a2 adjacent to each other along the surface 11S1 of the resin layer 11. The diameter D1 of the first structure 12a1, which is a dimension parallel to the surface 11S1, is different from the diameter D2 of the second structure 12a2, which is a dimension parallel to the surface 11S1.

[0086] Except for the points mentioned above, the configuration of the optical element 10A is substantially the same as that of the optical element 10 in the above embodiment. The same effects as those of the optical element 10 in the above embodiment can be obtained even with such a configuration of the optical element 10A. Furthermore, by having a first structure 12a1 and a second structure 12a2 with different diameters, the optical element 10A can accommodate optical designs that exhibit optical effects according to the required optical performance.

[0087] [2-2. Modification 2] Figure 9 schematically shows an example of the cross-sectional configuration of the optical element 10B according to Modification 2 of the present disclosure.

[0088] In the above embodiment, an example was shown in which the heights H of one or more structures 12 are substantially the same, but the present disclosure is not limited thereto. In the modified optical element 10B, one or more structures 12b have a first structure 12b1 and a second structure 12b2 adjacent to each other along the surface 11S1 of the resin layer 11. The height H1 of the first structure 12b1, which is the dimension in the Z-axis direction perpendicular to the surface 11S1, is different from the height H2 of the second structure 12b2, which is the dimension in the Z-axis direction perpendicular to the surface 11S1.

[0089] Except for the points mentioned above, the configuration of the optical element 10B is substantially the same as that of the optical element 10 in the above embodiment. The same effects as those of the optical element 10 in the above embodiment can be obtained even with an optical element 10B having such a configuration. Furthermore, by having a first structure 12b1 and a second structure 12b2 of different heights, the optical element 10B can accommodate optical designs that exhibit optical effects according to the required optical performance.

[0090] [2-3. Modification 3] Figure 10 schematically shows an example of a planar configuration of the optical element 10C according to Modification 3 of the present disclosure.

[0091] In the above embodiment, an example was shown in which the shape of each of the one or more structures 12 is substantially circular in plan view, but the present disclosure is not limited thereto. The one or more structures 12 may have two or more shapes. For example, as shown in Figure 10, in the optical element 10C of this modified example, each of the one or more structures 12c is substantially elliptical or substantially quadrilateral in plan view.

[0092] Except for the points mentioned above, the configuration of the optical element 10C is substantially the same as the configuration of the optical element 10 in the above embodiment. The same effects as the optical element 10 in the above embodiment can be obtained even with an optical element 10C having such a configuration.

[0093] [2-4. Modification 4] Figure 11 schematically shows an example of the cross-sectional configuration of the optical element 10D according to Modification 4 of the present disclosure.

[0094] The optical element 10D of this modified example further includes one or more lenses 13 on the surface 11S2 of the resin layer 11.

[0095] Except for the points mentioned above, the configuration of the optical element 10D is substantially the same as the configuration of the optical element 10 in the above embodiment. The same effects as those of the optical element 10 in the above embodiment can be obtained even with an optical element 10D having such a configuration.

[0096] [2-5. Modification 5] Figure 12A schematically shows an example of the cross-sectional configuration of optical element 10E-1 according to Modification 5 of the present disclosure. Figure 12B schematically shows another example of the cross-sectional configuration of optical element 10E-2 according to Modification 5 of the present disclosure.

[0097] The optical elements 10E-1 and 10E-2 of this modified example include a plurality of optical elements 10. As shown in Figure 12A, optical element 10E-1 has a laminated structure in which the surface 11S2 of the resin layer 11 of any optical element 10 is bonded to the surface 11S2 of the resin layer 11 of another optical element 10. As shown in Figure 12B, optical element 10E-1 has a laminated structure in which the surface 11S1 of the resin layer 11 of any optical element 10 is bonded to the surface 11S1 of the resin layer 11 of another optical element 10.

[0098] Except for the points mentioned above, the configurations of optical elements 10E-1 and 10E-2 are substantially the same as those of optical element 10 in the above embodiment. The same effects as those of optical element 10 in the above embodiment can be obtained with optical elements 10E-1 and 10E-2 having such configurations.

[0099] [2-6. Modification 6] Figure 13 schematically shows an example of the cross-sectional configuration of the optical element 10F according to Modification 6 of the present disclosure.

[0100] The optical element 10F of this modified example further includes a protective film 14 that covers the surface 11S1 of the resin layer 11. The protective film 14 is formed of, for example, an inorganic material. The protective film 14 suppresses the expansion of the optical element 10 in volume due to rising temperature.

[0101] Except for the points mentioned above, the configuration of the optical element 10F is substantially the same as the configuration of the optical element 10 in the above embodiment. The same effects as the optical element 10 in the above embodiment can be obtained even with an optical element 10F having such a configuration.

[0102] [2-7. Modification 7] Figure 14 schematically shows an example of the cross-sectional configuration of the optical element 10G according to Modification 7 of the present disclosure.

[0103] In the above embodiment, an example was shown in which the diameter D of each of the one or more structures 12 is uniform along the Z-axis direction, but the present disclosure is not limited thereto. In the modified optical element 10G, each of the one or more structures 12g has a monotonically changing cross-sectional area parallel to the surface 11S1 along the Z-axis direction perpendicular to the surface 11S1 of the resin layer 11. Furthermore, each of the one or more structures 12g has a tapered portion including a side surface inclined with respect to the surface 11S1. This makes it less likely for gaps or joints to occur in the one or more structures 12g.

[0104] Except for the points mentioned above, the configuration of the optical element 10G is substantially the same as the configuration of the optical element 10 in the above embodiment. The same effects as those of the optical element 10 in the above embodiment can be obtained even with an optical element 10G having such a configuration.

[0105] [2-8. Modification 8] In the above embodiment, the optical element 10 of this embodiment is shown as being formed by injection molding using a stamper 71 in the step of forming the resin layer 11, but the disclosure is not limited thereto. For example, the resin layer 11 can be formed by a casting process. Figures 15A and 15B show an example of the manufacturing process of the optical element 10H.

[0106] First, as shown in Figure 15A, a template 72 having one or more protrusions 721 is manufactured, for example, by imprinting. The template 72 is made of, for example, glass.

[0107] Next, a liquid resin (thermosetting resin or UV-curable resin) is poured into a container of a predetermined shape and size, and then, as shown in Figure 15B, a mold plate 72 is pressed onto the resin. At this time, the surface of the mold plate 72 on which the protrusions 721 are provided is in contact with the resin. Subsequently, the resin is cured by irradiating it with UV light or by heating the resin. Next, after peeling off the mold plate 72, a resin layer 11 is obtained having one or more recesses 110 corresponding to each of the mold plate 72 having one or more protrusions 721, as shown in Figure 7C. The subsequent steps are the same as the manufacturing method of the optical element 10 in the above embodiment.

[0108] The same effects as those obtained in the manufacturing method of the optical element 10 in the above embodiment can be obtained even with this method of manufacturing the optical element 10H.

[0109] <3. Application Examples> (Application Example 1) The above-mentioned imaging device 1 can be applied to any type of electronic device equipped with an imaging function, such as camera systems like digital still cameras and video cameras, or mobile phones with imaging capabilities. Figure 16 shows a schematic configuration of the electronic device 1000.

[0110] The electronic device 1000 includes, for example, a lens group 1001, an imaging device 1, a DSP (Digital Signal Processor) circuit 1002, a frame memory 1003, a display unit 1004, a recording unit 1005, an operation unit 1006, and a power supply unit 1007, all of which are interconnected via a bus line 1008.

[0111] The lens group 1001 captures incident light (image light) from the subject and forms an image on the imaging surface of the imaging device 1. The imaging device 1 converts the amount of incident light formed on the imaging surface by the lens group 1001 into an electrical signal on a pixel-by-pixel basis and supplies it as a pixel signal to the DSP circuit 1002.

[0112] The DSP circuit 1002 is a signal processing circuit that processes signals supplied from the imaging device 1. The DSP circuit 1002 outputs image data obtained by processing the signals from the imaging device 1. The frame memory 1003 temporarily holds the image data processed by the DSP circuit 1002 in frame units.

[0113] The display unit 1004 consists of a panel-type display device such as a liquid crystal panel or an organic EL (Electroluminescent) panel, and records the video or still image data captured by the imaging device 1 onto a recording medium such as a semiconductor memory or a hard disk.

[0114] The operation unit 1006 outputs operation signals for various functions possessed by the electronic device 1000 in accordance with user operations. The power supply unit 1007 appropriately supplies various power sources to the DSP circuit 1002, frame memory 1003, display unit 1004, recording unit 1005, and operation unit 1006.

[0115] <6. Application Examples> (Application Examples to Mobile Devices) The technology relating to this disclosure (this technology) can be applied to various products. For example, the technology relating to this disclosure may be realized as a device mounted on any type of mobile device such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, and robots.

[0116] Figure 17 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technology described herein may be applied.

[0117] The vehicle control system 12000 comprises a plurality of electronic control units connected via a communication network 12001. In the example shown in Figure 17, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. The functional configuration of the integrated control unit 12050 is shown in the figure, which includes a microcomputer 12051, an audio / image output unit 12052, and an in-vehicle network interface 12053.

[0118] The drivetrain control unit 12010 controls the operation of devices related to the vehicle's drivetrain according to various programs. For example, the drivetrain control unit 12010 functions as a control device for a drivetrain generating device that generates driving force for the vehicle, such as an internal combustion engine or a drive motor; a drivetrain transmission mechanism that transmits driving force to the wheels; a steering mechanism that adjusts the steering angle of the vehicle; and a braking device that generates braking force for the vehicle.

[0119] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window system, or various lamps such as headlights, reverse lights, brake lights, turn signals, or fog lights. In this case, the body system control unit 12020 may receive radio waves transmitted from a portable device that replaces a key or signals from various switches. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock system, power window system, lamps, etc.

[0120] The external information detection unit 12030 detects information from outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the external information detection unit 12030. The external information detection unit 12030 causes the imaging unit 12031 to capture images of the outside of the vehicle and receives the captured images. Based on the received images, the external information detection unit 12030 may perform object detection processing such as detecting people, cars, obstacles, signs, or characters on the road surface, or distance detection processing.

[0121] The imaging unit 12031 is a light sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0122] The in-vehicle information detection unit 12040 detects information inside the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver status detection unit 12041 that detects the driver's state. The driver status detection unit 12041 includes, for example, a camera that images the driver, and the in-vehicle information detection unit 12040 may calculate the driver's level of fatigue or concentration, or determine whether the driver is drowsy, based on the detection information input from the driver status detection unit 12041.

[0123] The microcomputer 12051 can calculate control target values ​​for the drive force generator, steering mechanism, or braking device based on information inside and outside the vehicle acquired by the external information detection unit 12030 or the internal information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing ADAS (Advanced Driver Assistance System) functions, including vehicle collision avoidance or impact mitigation, following driving based on distance between vehicles, maintaining vehicle speed, vehicle collision warning, or vehicle lane departure warning.

[0124] Furthermore, the microcomputer 12051 can perform cooperative control for purposes such as autonomous driving, where the vehicle drives autonomously without driver intervention, by controlling the drive force generating device, steering mechanism, or braking device, etc., based on information about the vehicle's surroundings acquired by the external information detection unit 12030 or the internal information detection unit 12040.

[0125] Furthermore, the microcomputer 12051 can output control commands to the body system control unit 12020 based on external information acquired by the external information detection unit 12030. For example, the microcomputer 12051 can control the headlights according to the position of a preceding or oncoming vehicle detected by the external information detection unit 12030, and perform coordinated control aimed at reducing glare, such as switching from high beams to low beams.

[0126] The audio-image output unit 12052 transmits at least one of audio and image output signals to an output device capable of visually or audibly notifying information to the vehicle's occupants or to those outside the vehicle. In the example shown in Figure 17, the output devices include an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an onboard display and a head-up display.

[0127] Figure 18 shows an example of the installation position of the imaging unit 12031.

[0128] In Figure 18, the vehicle 12100 has imaging units 12101, 12102, 12103, 12104, and 12105 as the imaging unit 12031.

[0129] The imaging units 12101, 12102, 12103, 12104, and 12105 are installed, for example, on the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle 12100. The imaging unit 12101 installed on the front nose and the imaging unit 12105 installed on the upper part of the windshield inside the vehicle mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 installed on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 installed on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The forward images acquired by imaging units 12101 and 12105 are mainly used for detecting preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, or lanes.

[0130] Figure 18 shows an example of the imaging range of imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of imaging unit 12101 located on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of imaging units 12102 and 12103 located on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of imaging unit 12104 located on the rear bumper or back door. For example, by superimposing the image data captured by imaging units 12101 to 12104, an overhead view image of the vehicle 12100 can be obtained.

[0131] At least one of the imaging units 12101 to 12104 may have a function for acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera consisting of multiple image sensors, or an image sensor having pixels for phase difference detection.

[0132] For example, the microcomputer 12051, based on distance information obtained from the imaging units 12101 to 12104, can determine the distance to each object within the imaging range 12111 to 12114 and the temporal change of this distance (relative speed to the vehicle 12100). In particular, it can extract the closest object on the vehicle 12100's path that is traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or more) as the preceding vehicle. Furthermore, the microcomputer 12051 can set a predetermined distance to be maintained in front of the preceding vehicle and perform automatic braking control (including follow-and-stop control) and automatic acceleration control (including follow-and-start control), etc. In this way, cooperative control aimed at autonomous driving, etc., that drives autonomously without driver operation, can be performed.

[0133] For example, the microcomputer 12051 can use distance information obtained from imaging units 12101 to 12104 to classify and extract three-dimensional object data related to three-dimensional objects, such as motorcycles, passenger cars, large vehicles, pedestrians, utility poles, and other three-dimensional objects, and use this data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle. If the collision risk is above a set value and there is a possibility of collision, the microcomputer 12051 can provide driving assistance to avoid collisions by outputting a warning to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or evasive steering via the drive system control unit 12010.

[0134] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light. For example, the microcomputer 12051 can recognize pedestrians by determining whether or not pedestrians are present in the images captured by the imaging units 12101 to 12104. Such pedestrian recognition is performed, for example, by a procedure to extract feature points from the images captured by the imaging units 12101 to 12104 as infrared cameras, and a procedure to perform pattern matching on a series of feature points that indicate the contour of an object to determine whether or not it is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the imaging units 12101 to 12104 and recognizes a pedestrian, the audio-image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio-image output unit 12052 may also control the display unit 12062 to display an icon indicating a pedestrian at a desired position.

[0135] The above describes an example of a mobile object control system to which the technology of this disclosure may be applied. The technology of this disclosure can be applied to, for example, the imaging unit 12031 of the configuration described above. Specifically, for example, the imaging device 1 can be applied to the imaging unit 12031. By applying the technology of this disclosure to the imaging unit 12031, high-definition captured images can be obtained, and high-precision control using the captured images can be performed in the mobile object control system.

[0136] (Examples of application to endoscopic surgical systems) The technology disclosed herein (this technology) can be applied to various products. For example, the technology disclosed herein may be applied to endoscopic surgical systems.

[0137] Figure 19 is a diagram showing an example of a schematic configuration of an endoscopic surgical system to which the technology described herein (the technology) may be applied.

[0138] Figure 19 illustrates a surgeon (physician) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgical system 11000. As shown in the figure, the endoscopic surgical system 11000 consists of an endoscope 11100, other surgical instruments 11110 such as a pneumoperitoneum tube 11111 and an energy treatment device 11112, a support arm device 11120 for supporting the endoscope 11100, and a cart 11200 equipped with various devices for endoscopic surgery.

[0139] The endoscope 11100 consists of a barrel 11101, the tip of which is inserted into the body cavity of the patient 11132 for a predetermined length, and a camera head 11102 connected to the base end of the barrel 11101. In the illustrated example, the endoscope 11100 is shown as a so-called rigid endoscope having a rigid barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible endoscope having a flexible barrel.

[0140] An opening into which an objective lens is fitted is provided at the tip of the microscope tube 11101. A light source device 11203 is connected to the endoscope 11100, and the light generated by the light source device 11203 is guided to the tip of the microscope tube by a light guide extending inside the microscope tube 11101, and is irradiated through the objective lens towards the object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a straight-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0141] The camera head 11102 contains an optical system and an image sensor. Reflected light from the object being observed (observation light) is focused onto the image sensor by the optical system. The image sensor converts the observation light into electrical signals, generating an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. This image signal is transmitted as RAW data to the camera control unit (CCU) 11201.

[0142] The CCU 11201 is composed of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and other components, and comprehensively controls the operation of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102 and performs various image processing operations on that image signal, such as development processing (demosaic processing), to display the image based on that image signal.

[0143] The display device 11202 displays an image based on an image signal that has been processed by the CCU 11201, under control from the CCU 11201.

[0144] The light source device 11203 consists of a light source such as an LED (Light Emitting Diode) and supplies illumination light to the endoscope 11100 when photographing the surgical area, etc.

[0145] The input device 11204 is an input interface for the endoscopic surgical system 11000. The user can input various types of information and instructions to the endoscopic surgical system 11000 via the input device 11204. For example, the user can input instructions to change the imaging conditions (type of light, magnification, focal length, etc.) of the endoscope 11100.

[0146] The treatment instrument control device 11205 controls the drive of the energy treatment instrument 11112 for purposes such as tissue cauterization, incision, or blood vessel sealing. The insufflation device 11206 injects gas into the body cavity of the patient 11132 via the insufflation tube 11111 to inflate the body cavity for the purpose of securing a field of view by the endoscope 11100 and securing the operator's workspace. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device capable of printing various information related to the surgery in various formats such as text, images, or graphs.

[0147] The light source device 11203 that supplies illumination light to the endoscope 11100 when photographing the surgical area can be configured as a white light source consisting of, for example, an LED, a laser light source, or a combination thereof. When the white light source is configured as a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, so the white balance of the captured image can be adjusted in the light source device 11203. In this case, it is also possible to capture images corresponding to each of the RGB colors in time-division by irradiating the observation target with laser light from each of the RGB laser light sources in time-division and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter on the image sensor.

[0148] Furthermore, the light source device 11203 may be controlled to change the intensity of the light it outputs at predetermined time intervals. By controlling the drive of the image sensor of the camera head 1102 in synchronization with the timing of the change in light intensity, images can be acquired in time-division order, and these images can be combined to generate high dynamic range images without so-called black crushing and white clipping.

[0149] Furthermore, the light source device 11203 may be configured to supply light in a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in body tissue and irradiating with narrow-band light compared to the irradiation light used in normal observation (i.e., white light), so-called narrow-band imaging is performed to image predetermined tissues such as blood vessels on the surface of mucosa with high contrast. Alternatively, in special light observation, fluorescence observation may be performed to obtain an image from fluorescence generated by irradiation with excitation light. In fluorescence observation, excitation light is irradiated onto body tissue and fluorescence from the body tissue is observed (autofluorescence observation), or a reagent such as indocyanine green (ICG) is injected into body tissue and excitation light corresponding to the fluorescence wavelength of the reagent is irradiated onto the body tissue to obtain a fluorescence image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0150] Figure 20 is a block diagram showing an example of the functional configuration of the camera head 11102 and CCU 11201 shown in Figure 19.

[0151] The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other via a transmission cable 11400 so that they can communicate with each other.

[0152] The lens unit 11401 is an optical system provided at the connection point with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and then incident on the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses, including a zoom lens and a focus lens.

[0153] The imaging unit 11402 is composed of image sensors. The imaging unit 11402 may consist of one image sensor (a so-called single-chip type) or multiple image sensors (a so-called multi-chip type). If the imaging unit 11402 is composed of multiple chips, for example, each image sensor may generate image signals corresponding to RGB, and these may be combined to obtain a color image. Alternatively, the imaging unit 11402 may be configured to have a pair of image sensors for acquiring image signals for the right eye and left eye, respectively, corresponding to 3D (Dimensional) display. By performing 3D display, the surgeon 11131 can more accurately grasp the depth of the biological tissue in the surgical area. In addition, if the imaging unit 11402 is composed of multiple chips, multiple lens units 11401 may also be provided corresponding to each image sensor.

[0154] Furthermore, the imaging unit 11402 does not necessarily have to be located on the camera head 11102. For example, the imaging unit 11402 may be located inside the lens barrel 11101, directly behind the objective lens.

[0155] The drive unit 11403 is composed of actuators and, under control from the camera head control unit 11405, moves the zoom lens and focus lens of the lens unit 11401 along the optical axis by a predetermined distance. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted as appropriate.

[0156] The communication unit 11404 is composed of communication devices for sending and receiving various types of information with the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.

[0157] Furthermore, the communication unit 11404 receives a control signal from the CCU 11201 to control the drive of the camera head 11102 and supplies it to the camera head control unit 11405. The control signal includes information about imaging conditions, such as information to specify the frame rate of the captured image, information to specify the exposure value at the time of imaging, and / or information to specify the magnification and focus of the captured image.

[0158] The imaging conditions such as frame rate, exposure value, magnification, and focus may be specified by the user as appropriate, or they may be automatically set by the control unit 114 13 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 will be equipped with so-called AE (Auto Expose), AF (Auto Focus), and AWB (Auto White Balance) functions.

[0159] The camera head control unit 11405 controls the drive of the camera head 11102 based on the control signal received from the CCU 1120 1 via the communication unit 11404.

[0160] The communication unit 11411 is comprised of a communication device for sending and receiving various types of information with the camera head 11102. The communication unit 11411 receives image signals transmitted from the camera head 11102 via the transmission cable 11400.

[0161] Furthermore, the communication unit 11411 transmits a control signal to the camera head 11102 to control the driving of the camera head 11102. Image signals and control signals can be transmitted by telecommunications, optical communications, etc.

[0162] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data transmitted from the camera head 11102.

[0163] The control unit 11413 performs various controls related to imaging the surgical area, etc., by the endoscope 11100, and the display of the images obtained from imaging the surgical area, etc. For example, the control unit 11413 generates a control signal to control the driving of the camera head 11102.

[0164] Furthermore, the control unit 11413 displays the captured image showing the surgical area, etc., on the display device 11202 based on the image signal processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical instruments such as forceps, specific biological sites, bleeding, mist when using the energy treatment device 111 12, etc., by detecting the shape and color of the edges of objects included in the captured image. When the control unit 11413 displays the captured image on the display device 11202, it may use the recognition results to superimpose various surgical support information onto the image of the surgical area. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced, and the surgeon 11131 can proceed with the surgery reliably.

[0165] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable compatible with electrical signal communication, an optical fiber compatible with optical communication, or a composite cable thereof.

[0166] In the illustrated example, communication was performed via a wired connection using a transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may be performed wirelessly.

[0167] The above describes an example of an endoscopic surgical system to which the technology of this disclosure may be applied. The technology of this disclosure can be suitably applied to, for example, the imaging unit 11402 provided on the camera head 11102 of the endoscope 11100, among the configurations described above. By applying the technology of this disclosure to the imaging unit 11402, the sensitivity of the imaging unit 11402 can be increased, and a high-definition endoscope 11100 can be provided.

[0168] The present technology has been described above with reference to embodiments, modifications 1 to 8, application examples, and application examples. However, the present technology is not limited to the above embodiments, and various modifications are possible. For example, it is not necessary to have all of the components described in the above embodiments, and conversely, other components may be included. In addition to the above application examples, the present technology may also be applied to resin light guide plates where it is difficult to achieve both a pattern shape for the metasurface structure and parallelism of the plate.

[0169] Furthermore, although the above embodiments have described the components constituting the imaging device 1, etc., it is not necessary to include all components, and other components may also be included.

[0170] Furthermore, the above-mentioned modifications 1 to 8 can be combined in any way.

[0171] Furthermore, the effects described herein are merely examples and are not limited to those described; other effects may also occur.

[0172] The present disclosure can also take the following configurations. According to the present disclosure with the following configurations, thinning and weight reduction are possible because a support substrate is not included and one or more structures are included inside the resin layer. Furthermore, an improvement in light transmittance can be expected by reducing interfacial reflection. In addition, the manufacturing method of the optical element of the present disclosure can reduce the number of processes and time required for manufacturing. (1) An optical element comprising a resin layer having a first surface, and one or more structures provided inside the resin layer and formed of a material different from the material forming the resin layer. (2) The optical element according to (1), wherein each of the one or more structures has a height which is a dimension in a first direction perpendicular to the first surface and a diameter which is a dimension in a direction parallel to the first surface, and the height of each of the one or more structures is greater than the diameter of each of the one or more structures. (3) The optical element according to (1) or (2), wherein the refractive index of each of the one or more structures is different from the refractive index of the resin layer. (4) The optical element according to any one of (1) to (3), wherein each of the one or more structures is formed using at least one of an oxide and a nitride. (5) The optical element according to any one of (1) to (4), wherein the upper surface of each of the one or more structures is the same as the first surface of the resin layer. (6) The optical element according to any one of (1) to (5), wherein the one or more structures have adjacent first and second structures along the first surface. (7) The optical element according to (6), wherein the first diameter of the first structure, which is a dimension parallel to the first surface, is different from the second diameter of the second structure, which is a dimension parallel to the first surface. (8) The optical element according to (6) or (7), wherein the first height of the first structure, which is a dimension in a first direction perpendicular to the first surface, is different from the second height of the second structure, which is a dimension in the first direction. (9) The optical element according to any one of (1) to (8), wherein each of the one or more structures has a tapered portion including a side surface that is inclined with respect to the first surface, and the area of ​​the cross-section parallel to the first surface changes monotonically along a first direction perpendicular to the first surface.(10) The optical element according to any one of (1) to (9), further comprising one or more lenses provided on a second surface of the resin layer opposite to the first surface. (11) The optical element according to any one of (1) to (10), further comprising a protective film provided so as to cover the first surface of the resin layer. (12) A method for manufacturing an optical element, comprising forming a resin layer having one or more recesses, and forming one or more structures by embedding a material different from the material used to form the resin layer in the one or more recesses of the resin layer. (13) The method for manufacturing an optical element according to (12), comprising forming the resin layer by injection molding using a stamper, wherein the one or more recesses are formed in accordance with the shape of the stamper. (14) The method for manufacturing an optical element according to (12), further comprising forming the resin layer by a casting process. (15) The method for manufacturing an optical element according to (12) or (14), further comprising curing the resin layer. (16) A light detection device comprising an optical element, wherein the optical element comprises a resin layer having a first surface, and one or more microstructures provided inside the resin layer and made of a material different from the material forming the resin layer.

[0173] This application claims priority based on Japanese Patent Application No. 2024-185418, filed with the Japan Patent Office on 21 October 2024, and all contents of that application are incorporated herein by reference.

[0174] Those skilled in the art will understand that various modifications, combinations, subcombinations, and changes can be conceived depending on design requirements and other factors, and that these fall within the scope of the attached claims and their equivalents.

Claims

A resin layer having a first surface, One or more structures are provided inside the resin layer and are made of a material different from the material forming the resin layer. An optical element that is equipped with it. 　 Each of the one or more structures has a height which is a dimension in a first direction perpendicular to the first surface, and a diameter which is a dimension in a direction parallel to the first surface. The height of each of the one or more structures is greater than the diameter of each of the one or more structures. The optical element according to claim 1. 　 The optical element according to claim 1, wherein the refractive index of each of the one or more structures is different from the refractive index of the resin layer. 　 Each of the one or more structures is formed using at least one of an oxide and a nitride. The optical element according to claim 1. 　 The optical element according to claim 1, wherein the upper surface of each of the one or more structures coincides with the first surface of the resin layer. 　 The one or more structures mentioned above have a first structure and a second structure adjacent to each other along the first surface. The optical element according to claim 1. 　 The first diameter, which is a dimension parallel to the first surface in the first structure, is different from the second diameter, which is a dimension parallel to the first surface in the second structure. The optical element according to claim 6. 　 The first height, which is the dimension in the first direction perpendicular to the first surface of the first structure, is different from the second height, which is the dimension in the first direction of the second structure. The optical element according to claim 6. 　 Each of the one or more structures has a tapered portion in which the area of ​​the cross-section parallel to the first surface changes monotonically along a first direction perpendicular to the first surface, and which includes a side surface inclined with respect to the first surface. The optical element according to claim 1. 　 The resin layer further comprises one or more lenses provided on the second surface opposite to the first surface. The optical element according to claim 1. 　 The optical element according to claim 1, further comprising a protective film provided so as to cover the first surface of the resin layer. 　 To form a resin layer having one or more recesses, One or more structures are formed by embedding a material different from the material forming the resin layer in the one or more recesses of the resin layer. A method for manufacturing optical elements including [specific element]. 　 The process includes forming the resin layer by injection molding using a stamper, wherein the one or more recesses are formed in accordance with the shape of the stamper. A method for manufacturing an optical element according to claim 12. 　 A method for manufacturing an optical element according to claim 12, comprising forming the resin layer by a casting process. 　 The method for manufacturing an optical element according to claim 14, wherein the casting process includes curing the resin layer. 　 It comprises an optical element, and the optical element is A resin layer having a first surface, One or more structures are provided inside the resin layer and are made of a material different from the material forming the resin layer. A light detection device having the following features.

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