Thermal head and thermal printer

Abstract

This thermal head comprises a substrate, an electrode, a pair of protective layers, a drive IC, and a sealing material. The electrode is positioned on the substrate. The pair of protective layers are positioned on the substrate and the electrode and face each other in the sub-scanning direction. The drive IC is positioned between the pair of protective layers and is electrically connected to the electrode. The sealing material is positioned between the pair of protective layers and seals the drive IC. The protective layers each have a first portion positioned on the substrate and the electrode, and a second portion positioned on the first portion.

Description

Thermal Head and Thermal Printer

[0001] The disclosed embodiments relate to a thermal head and a thermal printer.

[0002] Conventionally, various thermal heads have been proposed as printing devices such as facsimiles or video printers. For example, a thermal head in which the surface of an electrode or pad on which a drive IC is mounted is roughened is known.

[0003] Japanese Patent Application Laid-Open No. 2016-185675, Japanese Patent Application Laid-Open No. 7-186428

[0004] The thermal head according to one aspect of the embodiment includes a substrate, an electrode, a pair of protective layers, a drive IC, and a sealing material. The electrode is located on the substrate. The pair of protective layers are located on the substrate and the electrode and face each other in the sub-scanning direction. The drive IC is located between the pair of protective layers and is electrically connected to the electrode. The sealing material is located between the pair of protective layers and seals the drive IC. The protective layer has a first portion located on the substrate and the electrode, and a second portion located on the first portion.

[0005] FIG. 1 is a plan view showing an example of a thermal head according to an embodiment. FIG. 2 is a cross-sectional view taken along line A-A shown in FIG. 1. FIG. 3 is a cross-sectional view showing an example of a main part of the thermal head according to the embodiment. FIG. 4 is a cross-sectional view showing another example of the main part of the thermal head according to the embodiment. FIG. 5 is a cross-sectional view showing another example of the main part of the thermal head according to the embodiment. FIG. 6 is a schematic view showing an example of a thermal printer according to the embodiment.

[0006] Hereinafter, embodiments of the thermal head and thermal printer disclosed in the present application will be described with reference to the accompanying drawings. Note that the present disclosure is not limited by the following embodiments.

[0007] Conventionally, various thermal heads have been proposed as printing devices such as facsimiles or video printers. For example, a thermal head in which the surface of an electrode or pad on which a drive IC is mounted is roughened is known.

[0008] However, conventional thermal heads had room for improvement in the durability of the sealing material that encloses the drive IC. Therefore, there is a need for a technology that can solve the above problems and improve the durability of the sealing material.

[0009] [Embodiment] Figure 1 is a plan view showing an example of a thermal head according to this embodiment. The thermal head 10 according to this embodiment has a heater section 30 extending along the main scanning direction and a plurality of drive ICs 36 arranged along the main scanning direction. Here, the main scanning direction refers to the direction in which scanning in the line direction is performed when an image is divided into multiple lines and written (printed). In the thermal head 10, the heater section 30 writes (prints) an image for each line, so the heater section 30 extends along the main scanning direction. Also, after writing one line, the recording medium is moved to write the next line, and this movement to the next line is called a sub-scan, so the direction in which this sub-scan is performed is called the sub-scan direction. For example, as shown in Figure 6, the transport direction S in which the recording medium P is moved is the sub-scan direction. Therefore, the main scanning direction and the sub-scan direction are usually orthogonal to each other.

[0010] In Figure 1, for the sake of clarity, a three-dimensional Cartesian coordinate system including the Z-axis, with the vertically upward direction being positive, is shown. The primary scanning direction is along the X-axis, and the secondary scanning direction is along the Y-axis. This Cartesian coordinate system (right-handed system) may also be shown in other figures described later.

[0011] Figure 2 is a cross-sectional view taken along line A-A in Figure 1. The thermal head 10 according to this embodiment includes a substrate 12, a heat storage section 14, a glaze layer 16, a heating resistor 18, individual electrodes 20, a common electrode 21, a first coating layer 22, a second coating layer 24, a protective layer 32, a sealing material 34, a drive IC 36, and a wiring board 38.

[0012] The substrate 12, when viewed from above, is rectangular in shape with a longer length along the main scanning direction. The substrate 12 is formed of, for example, an electrically insulating material such as alumina ceramics or a semiconductor material such as single-crystal silicon. For the sake of explanation, the surface of the substrate 12 on the side where each component is arranged, i.e., the surface on the positive Z-axis side, may be referred to as the "top surface" of the substrate 12. Similarly, when using the components arranged on the top surface side of the substrate 12 as a reference, the positive Z-axis side may be referred to as "up" or "above".

[0013] The heat storage portion 14 is raised in the thickness direction of the substrate 12. In other words, the heat storage portion 14 protrudes from the upper surface of the substrate 12 in the positive Z-axis direction.

[0014] The heat storage unit 14 extends along the main scanning direction. The heat storage unit 14 may have a roughly semi-elliptical cross-section. This makes it easier for the heater unit 30 located on the surface of the thermal head 10 to come into contact with the recording medium P (see Figure 6) to be printed on.

[0015] The heat storage section 14 is made of, for example, glass with low thermal conductivity, and temporarily stores a portion of the heat generated by the heat-generating section 28, which will be described later. As a result, the time required to raise the temperature of the heat-generating section 28 can be shortened, and the thermal response characteristics of the thermal head 10 can be improved.

[0016] The heat storage section 14 may be formed, for example, by applying a predetermined glass paste obtained by mixing glass powder with a suitable organic solvent to the upper surface of the substrate 12 by screen printing or the like, firing it, and then etching it as necessary.

[0017] The glaze layer 16 is positioned to cover the substrate 12. The glaze layer 16 may also be positioned to cover the substrate 12 and the heat storage section 14. The material of the glaze layer 16 may be the same as or different from the material of the heat storage section 14. The glaze layer 16 may be formed by thin-film deposition techniques such as sputtering or CVD (Chemical Vapor Deposition). Alternatively, the glaze layer 16 may be formed by thick-film deposition techniques, such as screen printing, which involves forming a coating film of material paste and then firing it. In any case, the glaze layer 16 may also be formed by etching as needed. The glaze layer 16 may be in contact with or separated from the heat storage section 14. The glaze layer 16 may be located on top of the heat storage section 14. Furthermore, the thermal head 10 does not need to have a glaze layer 16 on the substrate 12.

[0018] The heating resistor 18 is located above the heat storage unit 14 and the individual electrodes 20. The individual electrodes 20 are located between the heat storage unit 14 and the heating resistor 18. The individual electrodes 20 are arranged in the main scanning direction according to the resolution of the print, and are located above the heat storage unit 14, spaced apart from each other in the main scanning direction and the sub-scanning direction. The position of the individual electrodes 20 between the heat storage unit 14 and the heating resistor 18 creates exposed regions of the heating resistor 18 between the individual electrodes 20 aligned in the main scanning direction. The exposed regions of the heating resistor 18 are arranged along the main scanning direction, and each exposed region constitutes a heating element of the heating unit 28. The configuration of the heating elements is not limited to that shown in the figures. Furthermore, an insulating layer (not shown) may be interposed between the individual electrodes 20 and the heating resistor 18 and the glaze layer 16 as needed.

[0019] The heating resistor 18 is formed from a material with relatively high electrical resistance, such as a TaN-based, TaSiO-based, TaSiNO-based, TiSiO-based, TiSiCO-based, or NbSiO-based material. Therefore, when a voltage is applied to the heating resistor 18 via the individual electrodes 20, the heating portion 28 generates heat through Joule heating. The heating resistor 18 may be etched as needed.

[0020] The individual electrodes 20 electrically connect the heating element 28 and the drive IC 36. The heating elements constituting the heating element 28 are divided into multiple groups, and the individual electrodes 20 electrically connect each heating element of the heating element 28 constituting each group to the drive IC 36 corresponding to each group.

[0021] Furthermore, the individual electrodes 20 electrically connect the drive IC 36 and the wiring board 38. Each of the multiple individual electrodes 20 connected to the drive IC 36 is composed of multiple wires having different functions.

[0022] The individual electrodes 20 are formed from a conductive material. The material of the individual electrodes 20 may be, for example, one of the metals Al, Au, Ag, and Cu, or an alloy thereof.

[0023] The individual electrodes 20 can be formed, for example, by laminating the material layers constituting each electrode onto the substrate 12, the heat storage section 14, and the glaze layer 16 using a thin-film molding technique such as sputtering, and then processing them into a predetermined pattern using photoetching or the like. Alternatively, the individual electrodes 20 may be manufactured by methods such as screen printing, flexographic printing, gravure printing, or gravure offset printing.

[0024] The common electrode 21 electrically connects the multiple heating elements constituting the heating section 28 to the wiring board 38. The material of the common electrode 21 may be, for example, one of the metals Al, Au, Ag, and Cu, or an alloy thereof, similar to the material of the individual electrodes 20.

[0025] The first coating layer 22 covers, for example, the heating resistor 18 including the heating element 28 and the individual electrodes 20. The first coating layer 22 may also cover the common electrode 21. The first coating layer 22 protects the covered portion from corrosion due to the adhesion of moisture contained in the atmosphere or wear due to contact with the recording medium P on which the image is printed. Examples of materials for the first coating layer 22 include SiN, SiO, and SiO. ２ SiAlON, TiN, TiON, TiCrN, TiAlON, etc. can be used.

[0026] The second coating layer 24 covers the glaze layer 16, the heating resistor 18 including the heating element 28, and the individual electrodes 20. The second coating layer 24 may also cover the common electrode 21 and / or the first coating layer 22. The second coating layer 24 protects the covered portion from oxidation due to contact with the atmosphere, corrosion due to the adhesion of moisture contained in the atmosphere, or abrasion due to contact with the recording medium P on which the image is printed. As for the second coating layer 24, for example, SiN, SiO, SiO, similar to the first coating layer 22, may be used. ２ SiAlON, TiN, TiON, TiCrN, TiAlON, etc. can be used.

[0027] The protective layer 32 is provided to partially cover the individual electrodes 20, the first coating layer 22, and the second coating layer 24. The protective layer 32 protects the covered areas of the individual electrodes 20, the first coating layer 22, and the second coating layer 24 from oxidation due to contact with the atmosphere or corrosion due to the adhesion of moisture contained in the atmosphere. In addition, the protective layer 32, which is placed on the first coating layer 22 and the second coating layer 24, covers the edges of the first coating layer 22 and the second coating layer 24, making it difficult for the first coating layer 22 and the second coating layer 24 to peel off from the protected object, such as the heating element 28 or the individual electrodes 20.

[0028] The protective layer 32 is located between the heat storage unit 14 and the drive IC 36. Furthermore, the protective layer 32 is located between the drive IC 36 and the wiring board 38. In other words, the protective layer 32 is located facing the drive IC 36 in the sub-scanning direction. Details of the protective layer 32 will be described later.

[0029] The protective layer 32 has openings (not shown) to expose the individual electrodes 20 connected to the drive IC 36. The individual electrodes 20 are connected to the drive IC 36 through these openings. The drive IC 36 is sealed by the sealing material 34 while connected to the individual electrodes 20.

[0030] The sealing material 34 seals the drive IC 36 while it is connected to the individual electrodes 20. The sealing material 34 protects the drive IC 36 and the connection between the drive IC 36 and the individual electrodes 20. For the sealing material 34, a resin material such as epoxy resin or silicone resin can be used.

[0031] The drive IC 36 is positioned between a pair of protective layers 32 aligned in the sub-scanning direction. The drive IC 36 is positioned along the arrangement direction of the heating unit 28 so as to correspond to each heating element of the heating unit 28 assigned to each drive IC 36. The drive IC 36 is electrically connected to the individual electrodes 20 via a conductive bonding material 37. The drive IC 36 electrically connects each heating element of the heating unit 28 to the wiring board 38 via the individual electrodes 20, and supplies power to the heating unit 28 to individually heat each heating element of the heating unit 28 according to an electrical signal supplied from the outside. As the drive IC 36, for example, a switching member having a plurality of switching elements inside can be used.

[0032] The wiring board 38 is electrically connected to the individual electrodes 20 and the common electrode 21, and is a wiring board that has the function of supplying current and electrical signals to the heating element 28 and the drive IC 36. The wiring board 38 has a configuration in which, for example, multiple patterned printed wirings (not shown) are provided inside an insulating resin layer (not shown). The wiring board 38 has connectors that electrically connect the individual electrodes 20 and / or the common electrode 21 to the outside.

[0033] The printed circuit board 38 is connected to the individual electrodes 20 and / or the common electrode 21 via a conductive bonding material (not shown). This electrically connects the individual electrodes 20 and / or the common electrode 21 to the circuit board 38. Examples of materials for the conductive bonding material include solder material or an anisotropic conductive film (ACF) in which conductive particles are mixed into an electrically insulating resin.

[0034] The wiring board 38 may include a reinforcing plate (not shown) whose main component is a resin such as phenolic resin, polyimide resin, or glass epoxy resin. Although an example using the wiring board 38 as a wiring substrate has been shown, a rigid wiring substrate may be used instead of the flexible wiring board 38. Examples of rigid printed circuit boards include substrates formed from resins such as glass epoxy substrates or polyimide substrates. Alternatively, a connector (not shown) may be provided without the wiring board 38.

[0035] Next, the main parts of the thermal head 10 according to this embodiment will be further described with reference to Figures 2 and 3. Figure 3 is a cross-sectional view showing an example of the main parts of the thermal head 10 according to this embodiment.

[0036] The thermal head 10 has a glaze layer 16 located on the substrate 12, individual electrodes 20 located on the glaze layer 16, and a pair of protective layers 32 located on the glaze layer 16 and the individual electrodes 20. The individual electrodes 20 are an example of electrodes.

[0037] The thermal head 10 has an IC placement section 33 between a pair of protective layers 32 aligned in the sub-scanning direction, and a drive IC 36 is placed in the IC placement section 33. The drive IC 36 placed in the IC placement section 33 is electrically connected to the individual electrodes 20 via a bonding material 37. The drive IC 36 is sealed by a sealing material 34 located between the pair of protective layers 32.

[0038] The protective layer 32 has a first portion 32a and a second portion 32b located above the first portion 32a. This makes it easier to secure a greater height for the IC placement portion 33 compared to the case where the protective layer 32 is a single layer, and makes it easier to properly seal the drive IC 36 using the sealing material 34. As a result, according to the thermal head 10 of this embodiment, for example, the durability of the sealing material 34 is improved, and the durability of the drive IC 36 sealed with the sealing material 34 is improved. In addition, for example, the arrangement and shape of the protective layer 32 can be controlled according to the dimensions of the drive IC 36, so the amount of sealing material 34 used can be controlled.

[0039] The second portion 32b of the protective layer 32 may have a smooth surface. This makes it less likely for the recording medium P to be damaged by friction even when it comes into contact with the second portion 32b.

[0040] The first part 32a and the second part 32b may be resin materials made of a resin. That is, the first part 32a and the second part 32b may have resin as the main component. Thereby, for example, when the thermal head 10 is heated, the first part 32a and the second part 32b plastically deform, so that the stress generated in the sealing material 34 can be relieved. Further, due to the plastic deformation of the first part 32a and the second part 32b caused by the temperature rise of the thermal head 10, the stress generated in the first coating layer 22 and / or the second coating layer 24 located between the protective layer 32 and the individual electrode 20 can be relieved. For this reason, the durability of the thermal head 10 is improved. The material of the first part 32a and / or the second part 32b may be, for example, an ultraviolet curable resin, or may be a thermosetting resin, a visible light curable resin, or the like.

[0041] When the first part 32a and the second part 32b have resin as the main component, the material of the first part 32a may be, for example, an epoxy resin. Also, the material of the second part 32b may be, for example, a phenolic resin, a bisphenol resin, a polyimide resin, or the like.

[0042] Further, the first part 32a and the second part 32b may be resin materials made of the same material. That is, the first part 32a and the second part 32b may have resin of the same composition as the main component. Thereby, the adhesion between the first part 32a and the second part 32b is improved, and the durability of the protective layer 32 is improved. Note that even if there are differences in the degree of manufacturing errors, the same composition may be used.

[0043] When the first part 32a and the second part 32b have resin of the same composition as the main component, the first part 32a and the second part 32b may be, for example, an epoxy resin, a phenolic resin, a bisphenol resin, a polyimide resin, or the like.

[0044] Also, the first part 32a and the drive IC 36 may be located apart from each other. Thereby, the bonding reliability through the bonding material 37 between the drive IC 36 and the individual electrode 20 is improved.

[0045] FIG. 4 and FIG. 5 are cross-sectional views showing another example of the main part of the thermal head 10 according to the embodiment. As shown in FIG. 4, the second part 32b may be located inside the contour of the first part 32a when viewed in plan. Thereby, it becomes easier to control the position of the second part 32b by the first part 32a. Further, in the step of positioning the second part 32b on the first part 32a, the material of the second part 32b having fluidity is less likely to flow to the individual electrode 20 located in the IC arrangement part 33, and the bonding reliability through the bonding material 37 between the driving IC 36 and the individual electrode 20 is improved.

[0046] Further, the protective layer 32 may be such that the thickness t2 of the second part 32b is larger than the thickness t1 of the first part 32a. By increasing the thickness t2 of the second part 32b located on the first part 32a, the spread of the material of the sealing material 34 having fluidity in the sub-scanning direction can be controlled, and the amount of the sealing material 34 used can be reduced.

[0047] Here, the thickness t1 of the first part 32a refers to the height of the first part 32a protruding in the positive Z-axis direction from the upper end of the first coating layer 22 located under the first part 32a. Such a thickness t1 can be, for example, 5 μm or more and 15 μm or less.

[0048] Further, the thickness t2 of the second part 32b refers to the height of the second part 32b protruding in the positive Z-axis direction from the upper end of the first part 32a located under the second part 32b. Such a thickness t2 can be, for example, 7 μm or more and 17 μm or less.

[0049] Further, as shown in FIG. 5, the first part 32a may have a plurality of convex portions on its surface. Thereby, since the sealing material 34 enters and adheres to the gaps between the convex portions, the adhesion between the protective layer 32 and the sealing material 34 is improved. Also, it becomes easier to control the position of the second part 32b by the convex portions of the first part 32a.

[0050] The plurality of convex portions located on the surface of the first part 32a may be aligned, for example, in the main scanning direction and / or the sub-scanning direction. Such a plurality of convex portions may have, for example, an average height of 3 μm or more and 5 μm or less.

[0051] [Thermal Printer] Next, a thermal printer having a thermal head 10 will be described with reference to Figure 6. Figure 6 is a schematic diagram showing an example of a thermal printer according to the embodiment.

[0052] The thermal printer 100 according to this embodiment includes the thermal head 10, a transport mechanism 40, a platen roller 50, a power supply unit 60, and a control device 70. The thermal head 10 is mounted on the mounting surface 80a of a mounting member 80 located on the housing (not shown) of the thermal printer 100. The thermal head 10 is mounted on the mounting member 80 such that the longitudinal direction of the substrate 12 and the direction in which the heater unit 30 extends are aligned with the main scanning direction, which is perpendicular to the transport direction S. A heat sink (not shown) may also be placed between the thermal head 10 and the mounting member 80.

[0053] The transport mechanism 40 includes a drive unit (not shown) and transport rollers 43, 45, 47, and 49. The transport mechanism 40 transports the recording medium P, such as thermal paper or image receiving paper onto which ink is transferred, along the transport direction S indicated by the arrow onto the heater section 30 of the thermal head 10, which is protected by the second coating layer 24. The drive unit includes, for example, a motor (not shown) and drives the transport rollers 43, 45, 47, and 49. The transport rollers 43, 45, 47, and 49 may be cylindrical shafts 43a, 45a, 47a, and 49a made of a metal such as stainless steel, covered with elastic members 43b, 45b, 47b, and 49b made of butadiene rubber or the like. When the recording medium P is image receiving paper onto which ink is transferred, an ink film (not shown) is transported together with the recording medium P between the recording medium P and the second coating layer 24 of the thermal head 10. The transport mechanism 40 is an example of a moving part that moves the thermal head 10 and the recording medium P relative to each other. The moving part may also be one that moves the thermal head 10 relative to the recording medium P.

[0054] The platen roller 50 presses the recording medium P onto the second coating layer 24 located on the heater portion 30 of the thermal head 10. The platen roller 50 is arranged to extend in a direction perpendicular to the transport direction S, i.e., along the main scanning direction, and both ends are supported and fixed so that it can rotate while pressing the recording medium P onto the heater portion 30. The platen roller 50 can be constructed, for example, by covering a cylindrical metal shaft 50a, such as stainless steel, with an elastic member 50b mainly composed of butadiene rubber.

[0055] As described above, the power supply unit 60 supplies current to generate heat in the heat-generating part 28 (see Figure 2) of the thermal head 10 and current to operate the drive IC 36 of the thermal head 10. As described above, the control device 70 supplies a control signal to the drive IC 36 to control the operation of the drive IC 36 in order to selectively generate heat in the heat-generating part 28 of the thermal head 10.

[0056] The thermal printer 100 presses the recording medium P against the heater section 30 of the thermal head 10 using the platen roller 50, while transporting the recording medium P onto the heater section 30 using the transport mechanism 40. While transporting the recording medium P onto the heater section 30, the thermal printer 100 selectively heats the heating section 28 using the power supply unit 60 and the control unit 70 to print a predetermined image on the recording medium P. If the recording medium P is image receiving paper or the like, the ink from an ink film (not shown) transported together with the recording medium P is thermally transferred to the recording medium P to print an image on the recording medium P.

[0057] In Figure 6, a thermal printer 100 having the thermal head 10 shown in Figure 2 is illustrated as an example, but the thermal printer 100 may have a thermal head 10 according to other embodiments.

[0058] Although embodiments of the present disclosure have been described above, the present disclosure is not limited to the embodiments described above, and various modifications are possible without departing from the spirit thereof.

[0059] In one embodiment, (1) the thermal head comprises a substrate, an electrode located on the substrate, a pair of protective layers located on the substrate and the electrode and facing each other in the subscanning direction, a drive IC located between the pair of protective layers and electrically connected to the electrode, and a sealing material located between the pair of protective layers and sealing the drive IC, wherein the protective layer has a first portion located on the substrate and the electrode, and a second portion located on the first portion.

[0060] (2) In the thermal head described in (1) above, the second portion may be located inside the contour of the first portion when viewed from above.

[0061] (3) In the thermal head described in (2) above, the thickness of the second portion of the protective layer may be greater than the thickness of the first portion.

[0062] (4) In any one of the thermal heads described in (1) to (3) above, the second portion may have a smooth surface.

[0063] (5) In any one of the thermal heads described in (1) to (4) above, the first portion may have a plurality of protrusions on its surface.

[0064] (6) In any one of the thermal heads described in (1) to (5) above, the first part and the second part may be mainly composed of resin.

[0065] (7) In any one of the thermal heads described in (1) to (6) above, the first portion and the second portion may be mainly composed of a resin of the same composition.

[0066] (8) In any one of the thermal heads described in (1) to (7) above, the first portion and the drive IC may be located separately.

[0067] (9) A thermal printer may have a thermal head as described in any one of (1) to (8) above, and a moving part that moves the thermal head and the recording medium relative to each other.

[0068] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of this disclosure are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents.

[0069] 10 Thermal head 12 Substrate 14 Heat storage section 16 Glaze layer 18 Heating resistor 20 Individual electrodes 21 Common electrode 22 First coating layer 24 Second coating layer 28 Heating section 30 Heater section 32 Protective layer 32a First section 32b Second section 34 Encapsulating material 36 Drive IC 38 Wiring board 40 Transport mechanism (example of moving section) 100 Thermal printer P Recording medium

Claims

1. A thermal head comprising: a substrate; an electrode located on the substrate; a pair of protective layers located on the substrate and the electrode and facing each other in the subscanning direction; a drive IC located between the pair of protective layers and electrically connected to the electrode; and a sealing material located between the pair of protective layers and sealing the drive IC, wherein the protective layer has a first portion located on the substrate and the electrode and a second portion located on the first portion.

2. The thermal head according to claim 1, wherein the second portion is located inside the contour of the first portion when viewed from above.

3. The thermal head according to claim 2, wherein the thickness of the second portion of the protective layer is greater than the thickness of the first portion.

4. The thermal head according to any one of claims 1 to 3, wherein the second portion has a smooth surface.

5. The thermal head according to any one of claims 1 to 4, wherein the first portion has a plurality of protrusions on its surface.

6. The thermal head according to any one of claims 1 to 5, wherein the first and second parts are mainly composed of resin.

7. The thermal head according to any one of claims 1 to 6, wherein the first part and the second part are mainly composed of a resin of the same composition.

8. The thermal head according to any one of claims 1 to 7, wherein the first part and the drive IC are located separately.

9. A thermal printer having a thermal head according to any one of claims 1 to 8, and a moving unit for moving the thermal head and a recording medium relative to each other.

Images