Optical sensing device circuit, photoelectric sensor, lidar apparatus, and electronic device

Abstract

An optical sensing device circuit, a photoelectric sensor, a lidar apparatus, and an electronic device. The optical sensing device circuit (310) comprises an optical sensing device (312), at least one active sub-circuit (317), and at least one buffer sub-circuit (319). The optical sensing device (312) comprises a cathode and an anode opposite to each other, and is configured to undergo an avalanche effect in response to a photon and output an electrical signal having an abrupt change by means of the anode or the cathode. Each active sub-circuit (317) comprises at least one active device, and the active sub-circuit (317) is connected to the anode and / or the cathode of the optical sensing device (312). Each active sub-circuit (317) is correspondingly provided with one buffer sub-circuit (319), and the buffer sub-circuit (319) is configured to mitigate the abrupt change in the electrical signal transmitted to the corresponding active sub-circuit (317) when the optical sensing device (312) undergoes the avalanche effect.

Description

A light-sensing device circuit, a photoelectric sensor, a lidar device, and electronic equipment. Technical Field

[0001] This application relates to the field of ToF sensing technology, and in particular to optical sensing device circuits, photoelectric sensors, lidar devices and equipment for ToF sensing. Background Technology

[0002] ToF (Time of Flight) technology is a ranging technique that uses the principle of Time-Correlated Single-Photon Counting (TCSPC) to measure the distance to objects in a scene. LiDAR devices use photosensitive devices, such as Single-Photon Avalanche Diodes (SPADs), to perform single-photon counting, thereby applying the TSCPC principle for ranging.

[0003] SPADs can respond to a single photon and generate an avalanche effect, outputting an avalanche electrical signal to count the responding photons. However, with the increasing prevalence of lidar, it is becoming more common for lidars on different devices to shoot at each other during actual use. This causes severe overshoot in the avalanche electrical signal output by the SPAD under the illumination of a high-power beam, which can damage the active devices in the active circuit connected to the SPAD. Summary of the Invention

[0004] In view of this, this application provides a photosensitive device circuit, a photoelectric sensor, a lidar device, and an electronic device that can solve the above-mentioned technical problems.

[0005] To solve the above-mentioned technical problems, the first technical solution adopted in this application is: to provide a photosensitive device circuit, comprising:

[0006] A photosensitive device includes a cathode and an anode disposed opposite each other, the photosensitive device being configured to respond to a photon avalanche effect and output abrupt electrical signals through the cathode and anode;

[0007] At least one active sub-circuit, each active sub-circuit including at least one active device, the active sub-circuit being connected to the anode and / or cathode of the photosensitive device; and

[0008] At least one buffer sub-circuit is provided, and each active sub-circuit is provided with one buffer sub-circuit. The buffer sub-circuit is configured to mitigate the avalanche effect of the photosensitive device and the sudden change in the electrical signal transmitted to the corresponding active sub-circuit.

[0009] To solve the above-mentioned technical problems, the second technical solution adopted in this application is to provide a photoelectric sensor, which includes at least one of the above-mentioned photosensitive device circuits.

[0010] To solve the above-mentioned technical problems, the third technical solution adopted in this application is to provide a lidar device, including the light sensor as described above.

[0011] To solve the above-mentioned technical problems, the fourth technical solution adopted in this application is to provide an electronic device, including the lidar device as described above.

[0012] The beneficial effects of this application are as follows: Unlike the prior art, by setting a buffer sub-circuit between the photosensitive device and the active circuit, the avalanche electrical signal output by the photosensitive device during avalanche can be slowed down before it is transmitted to the active circuit, thereby reducing the damage to the active device in the active circuit caused by excessively high avalanche electrical signal fluctuations and improving the reliability of the photoelectric sensor and the entire lidar and electronic equipment. Attached Figure Description

[0013] Figure 1 is a schematic block diagram of the structure of an embodiment of the electronic device of this application;

[0014] Figure 2 is a schematic block diagram of the structure of an embodiment of the lidar device of this application;

[0015] Figure 3 is a schematic diagram of the circuit structure of an embodiment of the photoelectric sensor of this application;

[0016] Figure 4 is a schematic diagram of the circuit structure of a protection sub-circuit in the photosensitive device circuit of this application.

[0017] Figure 5 is a schematic diagram of the circuit structure of another embodiment of the protection sub-circuit in the photosensitive device circuit of this application.

[0018] Figure 6 is a schematic diagram of the circuit structure of an embodiment of the photosensitive device circuit of this application;

[0019] Figure 7 is a schematic diagram of the circuit structure of an embodiment of the photosensitive device circuit of this application;

[0020] Figure 8 is a schematic diagram of the circuit structure of a quenching sub-circuit in the photosensitive device circuit of this application;

[0021] Figure 9 is a schematic diagram of the circuit structure of another embodiment of the quenching sub-circuit in the photosensitive device circuit of this application;

[0022] Figure 10 is a schematic diagram of the circuit structure of another embodiment of the quenching sub-circuit in the photosensitive device circuit of this application;

[0023] Figure 11 is a schematic diagram of the circuit structure of an embodiment of the output sub-circuit in the photosensitive device circuit of this application;

[0024] Figure 12 is a schematic diagram of the circuit structure of another embodiment of the output sub-circuit in the photosensitive device circuit of this application;

[0025] Figure 13 is a schematic diagram of the circuit structure of another embodiment of the output sub-circuit in the photosensitive device circuit of this application.

[0026] Figure 14 is a schematic diagram of the circuit structure of a protection sub-circuit in the photosensitive device circuit of this application.

[0027] Figure 15 is a schematic diagram comparing the signals of the photosensitive device with and without a protection sub-circuit during the avalanche process.

[0028] Figure 16 is a schematic diagram of the circuit structure of another embodiment of the protection sub-circuit in the photosensitive device circuit of this application.

[0029] Figure 17 is a schematic diagram of the circuit structure of the photosensitive device circuit of this application, which includes a control sub-circuit.

[0030] Figure 18 is a schematic diagram of the circuit structure of one embodiment of the control sub-circuit described in Figure 17.

[0031] Figure 19 is a circuit diagram of an embodiment of the buffer sub-circuit in the photosensitive device circuit of this application.

[0032] Figure 20 is a circuit diagram of an embodiment of the buffer sub-circuit in the photosensitive device circuit of this application.

[0033] Figure 21 is a circuit diagram of an embodiment of the buffer sub-circuit in the photosensitive device circuit of this application.

[0034] Figure 22 is a circuit diagram of an embodiment of the buffer sub-circuit in the photosensitive device circuit of this application.

[0035] Figure 23 is a circuit diagram of an embodiment of the buffer sub-circuit in the photosensitive device circuit of this application.

[0036] Figure 24 is a circuit diagram of an embodiment of the buffer sub-circuit in the photosensitive device circuit of this application.

[0037] Figure 25 is a circuit diagram of an embodiment of the buffer sub-circuit in the photosensitive device circuit of this application.

[0038] Figure 26 is a circuit diagram of an embodiment of the buffer sub-circuit in the photosensitive device circuit of this application.

[0039] Figure 27 is a schematic diagram comparing the abrupt changes in the electrical signal output by the avalanche of the photosensitive device with and without a buffer sub-circuit in the photosensitive device circuit of this application. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0041] An embodiment of this application provides a photosensitive device circuit, characterized in that it includes:

[0042] A photosensitive device includes a cathode and an anode disposed opposite each other, the photosensitive device being configured to respond to a photon avalanche effect and output abrupt electrical signals through the cathode and anode;

[0043] At least one active sub-circuit, each active sub-circuit including at least one active device, the active sub-circuit being connected to the anode and / or cathode of the photosensitive device; and

[0044] At least one buffer sub-circuit is provided, and each active sub-circuit is provided with one buffer sub-circuit. The buffer sub-circuit is configured to mitigate the avalanche effect of the photosensitive device and the sudden change in the electrical signal transmitted to the corresponding active sub-circuit.

[0045] In some embodiments, the buffer sub-circuit includes at least one resistor and at least one capacitor. The resistor is connected in series on the circuit path that would cause a sudden change in electrical signal when the photosensitive device avalanche occurs. One end of the capacitor is connected to the line between the resistor and the corresponding active sub-circuit, and the other end of the capacitor is connected to an AC ground.

[0046] In some embodiments, the resistor is connected in series in the line between the active sub-circuit and the anode or cathode of the photosensitive device.

[0047] In some embodiments, the product of the resistance value of the resistor and the capacitance value of the capacitor in the buffer sub-circuit is set within a preset range.

[0048] In some embodiments, the capacitor is the parasitic capacitance of the circuit.

[0049] In some embodiments, the capacitor is a physical capacitor.

[0050] In some embodiments, the active sub-circuit is an output circuit used to output the abrupt electrical signal generated when the photosensitive device undergoes an avalanche; the active device in the output circuit includes logic gate elements.

[0051] In some embodiments, the active sub-circuit is a switch control circuit used to select the photosensitive device, and the active device in the switch control circuit includes a MOSFET.

[0052] In some embodiments, the active sub-circuit is a charging circuit used to reset the photosensitive device after an avalanche, and the active device in the charging circuit includes a current mirror and / or a MOSFET.

[0053] In some embodiments, at least one active sub-circuit includes a first active sub-circuit connected to the anode of the photosensitive device and a second active sub-circuit connected to the cathode of the photosensitive device; at least one buffer sub-circuit includes a first buffer sub-circuit corresponding to the first active sub-circuit and a second buffer sub-circuit corresponding to the second active sub-circuit, wherein the first buffer sub-circuit is configured to mitigate the abrupt change in the transmission of the electrical signal output by the photosensitive device to the first active sub-circuit when an avalanche effect occurs, and the second buffer sub-circuit is configured to mitigate the abrupt change in the transmission of the electrical signal output by the photosensitive device to the second active sub-circuit when an avalanche effect occurs.

[0054] In some embodiments, the first buffer sub-circuit includes a first resistor and a first capacitor, and the second buffer sub-circuit includes a second resistor and a second capacitor. The first resistor and the second resistor are both connected in series on the circuit path that will cause a sudden change in electrical signal when the photosensitive device avalanches. One end of the first capacitor is connected to the line between the first resistor and the first active sub-circuit, and the other end of the first capacitor is connected to an AC ground. One end of the second capacitor is connected to the line between the second resistor and the second active sub-circuit, and the other end of the second capacitor is connected to an AC ground.

[0055] In some embodiments, the first resistor is connected in series in the line between the first active sub-circuit and the anode of the photosensitive device, and the second resistor is connected in series in the line between the second active sub-circuit and the cathode of the photosensitive device.

[0056] In some embodiments, the first buffer sub-circuit includes a first capacitor, the second buffer sub-circuit includes a second capacitor, the first buffer sub-circuit and the second buffer sub-circuit share the same resistor, the resistor is connected in series on the circuit path that will cause a sudden change in electrical signal when the photosensitive device avalanche occurs, one end of the first capacitor is connected to the line between the shared resistor and the first active sub-circuit, and the other end of the first capacitor is connected to an AC ground, one end of the second capacitor is connected to the line between the shared resistor and the second active sub-circuit, and the other end of the second capacitor is connected to an AC ground.

[0057] In some embodiments, a common resistor is connected in series on the line between the first active sub-circuit and the anode of the photosensitive device or on the line between the second active sub-circuit and the cathode of the photosensitive device.

[0058] In some embodiments, the buffer sub-circuit's mitigation effect on abrupt changes in the electrical signal includes reducing the amplitude of the signal change and extending the duration of the signal change process.

[0059] This application also provides a photoelectric sensor, including at least one photosensitive device circuit as described above.

[0060] This application also provides a lidar device that includes the photoelectric sensor as described above.

[0061] The lidar device includes a transmitting component, a receiving component, and a processing module. The transmitting component is configured to emit sensing light signals to the measurement scene according to a preset time sequence. The receiving component includes the photoelectric sensor, used to sense light signals from the measurement scene and output corresponding avalanche light signals as photosensitive signals. The processing circuit connects the transmitting component and the receiving component, used to process the photosensitive signals to obtain three-dimensional information of external objects.

[0062] As shown in FIG1, this application also provides an electronic device 100, including the lidar device 200 as described above. Further, the electronic device 100 also includes a processor 110 and a memory 120, the lidar device 200 and the memory 120 being coupled to the processor 110, the processor 110 being used to control the lidar device 200.

[0063] The lidar device 200 can be used for three-dimensional (3D) information sensing or spatial distance measurement. Specifically, it can be used for identity recognition, gesture recognition, posture or action recognition, autonomous driving, machine vision, building surveying, scene recognition and modeling, augmented reality (AR) / virtual reality (VR), ranging, proximity sensing, simultaneous localization and mapping (SLAM), or 3D mapping. The electronic device 100 can be a smartphone, tablet, computer, smart wearable device, smart lock, motor vehicle, drone, medical device, aviation device, or any other device or apparatus requiring three-dimensional (3D) information sensing capabilities.

[0064] The lidar device 200 can perform three-dimensional information sensing based on the direct time-of-flight (dToF), indirect time-of-flight (iToF), or frequency-modulated continuous wave (FMCW) principles. Among these, dToF technology is a ranging method based on time-correlated single photon counting (TCSPC) to measure the distance to objects in a scene. TCSPC can obtain relevant three-dimensional information of the target object reflecting the sensing light signal by statistically analyzing the time information of photon events (such as the process of a single photon from emission to reception) through repeated transmission and reception of sensing light signals.

[0065] The following describes an exemplary structure of the electronic device 100:

[0066] As shown in Figure 1, the electronic device 100 may include a processor 110 and a memory 120, with the processor 110 coupled to the memory 120.

[0067] Processor 110 can be used to control the operation of electronic device 100. Processor 110 can also be referred to as a Central Processing Unit (CPU). Processor 110 can be an integrated circuit chip with signal processing capabilities. Processor 110 can also be a general-purpose processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), image processor (ISP), field-programmable gate array (FPGA), or other programmable logic device, discrete gate or transistor logic device, or discrete hardware component. The general-purpose processor can be a microprocessor, or processor 110 can be any conventional processor.

[0068] The memory 120 can be used to store computer programs, such as random access memory (RAM), read-only memory (ROM), or other types of storage devices. Specifically, the memory 120 may include one or more computer-readable storage media, which may be non-transitory. In some embodiments, the non-transitory computer-readable storage media in the memory 120 are used to store at least one line of program code. The computer program stored in the memory 120 can be executed by the processor 110, thereby controlling the operation of the electronic device 100 and realizing related operations and functions.

[0069] Of course, read-only memory (ROM) can be, for example, programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Random access memory (RAM), which is used as an external cache, can be, for example, static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct memory bus RAM (DRRAM).

[0070] In some embodiments, the electronic device 100 may further include a peripheral device interface 130 and at least one peripheral device. The processor 110, memory 120, and peripheral device interface 130 may be connected via a bus or signal line. Each peripheral device may be connected to the peripheral device interface 130 via a bus, signal line, or circuit board. For example, the peripheral device may include one or more of the following: radio frequency circuitry 140, display screen 150, audio circuitry 160, and power supply 170.

[0071] Peripheral device interface 130 can be used to connect at least one I / O (Input / Output) related peripheral device to processor 110 and memory 120. In some embodiments, processor 110, memory 120 and peripheral device interface 130 can be integrated on the same chip or circuit board. In some other embodiments, any one or two of processor 110, memory 120 and peripheral device interface 130 can be implemented on separate chips or circuit boards, which is not limited in this embodiment.

[0072] The radio frequency (RF) circuit 140 is used to receive and transmit radio frequency (RF) signals, also known as electromagnetic signals. The RF circuit 140 communicates with communication networks and other communication devices via electromagnetic signals. Optionally, the RF circuit 140 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, etc. The RF circuit 140 can communicate with other terminals through at least one wireless communication protocol. This wireless communication protocol includes, but is not limited to: the World Wide Web, metropolitan area networks, intranets, various generations of mobile communication networks (2G, 3G, 4G, and 5G), wireless local area networks, and / or Wireless Fidelity (Wi-Fi) networks. In some embodiments, the RF circuit 140 may also include circuitry related to Near Field Communication (NFC), which is not limited in this application.

[0073] Display screen 150 is used to display a user interface (UI). This UI may include graphics, text, icons, videos, and any combination thereof. When display screen 150 is a touch display screen, it also has the ability to collect touch signals on or above its surface. These touch signals can be input as control signals to processor 110 for processing. In this case, display screen 150 can also be used to provide virtual buttons and / or a virtual keyboard, also known as soft buttons and / or a soft keyboard. In some embodiments, there may be one display screen 150, disposed on the front panel of electronic device 100. In other embodiments, there may be at least two display screens 150, disposed on different surfaces of electronic device 100 or in a folded design; in still other embodiments, display screen 150 may be a flexible display screen, disposed on a curved or folded surface of electronic device 100. Furthermore, display screen 150 may be configured as a non-rectangular irregular shape, i.e., a non-rectangular screen. Display screen 150 may be made of materials such as Liquid Crystal Display (LCD) or Organic Light-Emitting Diode (OLED).

[0074] The audio circuit 160 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, and convert the sound waves into electrical signals that are input to the processor 110 for processing, or input to the radio frequency circuit 140 to realize voice communication. In some embodiments, the audio circuit 160 may also include a headphone jack.

[0075] Power supply 170 is used to supply power to various components in electronic device 100. Power supply 170 can be alternating current, direct current, a disposable battery, or a rechargeable battery. When power supply 170 includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. A wired rechargeable battery is a battery that is charged via a wired line, while a wireless rechargeable battery is a battery that is charged via a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0076] The lidar device 200 can be connected to the processor 110 and memory 120 via the peripheral device interface 130. Alternatively, the lidar device 200 can also interact directly with the processor 110 and memory 120 via the internal bus of the electronic device 100.

[0077] In some embodiments, the lidar device 200 senses three-dimensional (3D) information of external objects in the measurement scene based on the dToF principle. For a description of the lidar device 200 in the above-described embodiments of the electronic device of this application, please refer to the following detailed description of the lidar device embodiments of this application.

[0078] As shown in Figure 2, the lidar device 200 provided in this embodiment may include a transmitting component 210, a receiving component 220, and a processing circuit 230. The processing circuit 230 may be coupled to the processor 110, the transmitting component 210, and the receiving component 220.

[0079] The transmitting component 210 can be used to transmit a sensing light signal to the measurement scene, a portion of which is reflected back by external objects in the measurement scene and received by the receiving component 220. The transmitting component 210 is configured to transmit the sensing light signal according to a preset time sequence. Optionally, the sensing light signal can be a light pulse with a preset frequency. Optionally, the sensing light signal can be, for example, visible light, infrared light, or near-infrared light, with a wavelength range, for example, 390 nm-780 nm, 700 nm-1400 nm, or 800 nm-1000 nm.

[0080] Optionally, in some embodiments, the emitting component 210 may include a light source 211, a driving circuit 212, and an emitting optics 213. The light source 211 is used to emit light pulses and includes at least one light-emitting unit. The light-emitting unit may be, for example, a vertical cavity surface-emitting laser (VCSEL), an edge-emitting laser (EEL), a light-emitting diode (LED), a laser diode (LD), or other light-emitting devices. The edge-emitting laser may be a Fabry Perot (FP) laser, a distributed feedback (DFB) laser, an electro-absorption modulated (EML) laser, etc., and this embodiment is not limited thereto. The driving circuit 212 is connected to the light source 211 and to the processing circuit 230. The driving circuit 212 can drive the light source 211 to emit a sensing light signal according to the driving signal from the processing circuit 230.

[0081] The emitting optics 213 can be used to modulate the light beam emitted by the light source 211 to form a sensing light signal emitted to the measurement scene. The emitting optics 213 may include, for example, diffractive optical elements (DOE), cylindrical lenses, spherical lenses, light deflection devices, microlens arrays, and other optical devices, and this application does not limit it to these.

[0082] At least a portion of the sensing light signal emitted by the transmitting component 210 is reflected back by an external object in the measurement scene and can be received and sensed by the receiving component 220. The time difference between the emission time and the reception time of the sensing light signal reflected back by the external object is called the flight time t of the sensing light signal. By calculating the distance traveled by the reflected sensing light signal sensed by the receiving component 220 within the flight time t, the distance information of the external object reflecting the sensing beam can be obtained as D = (c*t) / 2, where c is the speed of light. The flight time t of the sensing light signal can be obtained by statistically analyzing the time count distribution of the photosensitive signal generated by the photons sensed by the receiving component 220.

[0083] The receiving component 220 includes a photoelectric sensor 221. Optionally, the photoelectric sensor 221 may include a single photosensitive pixel 300 or a pixel array formed by multiple photosensitive pixels 300. The photosensitive pixel 300 is used to sense light signals from the measurement scene and output a corresponding light-sensing signal. It should be understood that the light signals from the measurement scene include photons of ambient light and photons of the sensed light signals reflected back. The photosensitive pixel 300 includes at least one light-sensing device. Optionally, the light-sensing device is, for example, an avalanche photodiode (APD), a single-photon avalanche diode (SPAD), a silicon photomultiplier (SiPM) with multiple SPADs connected in parallel, and / or other suitable light-sensing devices. The multiple photosensitive pixels 300 may be arranged regularly, for example, in an array; the multiple photosensitive pixels 300 may also be arranged irregularly, which is not limited in this application. In one embodiment, the light-sensing device is a SPAD, and the multiple photosensitive pixels 300 are arranged in an array; correspondingly, the photoelectric sensor 221 is an area array SPAD chip.

[0084] The receiving component 220 may also include a receiving optics 222 for modulating, for example collimating or converging, the light signal from the measurement scene and transmitting it to the corresponding photosensitive pixel.

[0085] Processing circuit 230 is used to process the photosensitive signal generated corresponding to the light signal received by receiving component 220 to obtain three-dimensional information of an external object. In some embodiments, processing circuit 230 may be configured to process the photosensitive signal based on TCSPC technology to obtain the time when the echo of the sensing beam was sensed by constructing a photon counting histogram. Furthermore, processing circuit 230 is further configured to obtain three-dimensional information of the external object based on the time difference between the emission time and the time when the reflected beam was sensed.

[0086] Alternatively, in some other embodiments, the processing circuit 230 may also be configured to process the light-sensing signal based on the indirect time of flight (iToF) measurement principle, and obtain the three-dimensional information of the external object by comparing the phase difference between when the sensing beam is emitted and when it is reflected back and received.

[0087] Optionally, in some other embodiments, the processing circuit 230 may also be configured to process the photosensitive signal based on the frequency modulated continuous wave (FMCW) measurement principle. By interfering the returned light and the emitted light, and using frequency mixing detection technology to measure the frequency difference between the transmitted and received light, the three-dimensional information of the external object is calculated from the frequency difference.

[0088] It should be understood that the transmitting component 210 and the receiving component 220 can be arranged side by side, with the light-emitting surface of the transmitting component 210 and the light-incident surface of the receiving component 220 both facing the same side of the lidar device 200. The distance between the transmitting component 210 and the receiving component 220 can range from, for example, 2 millimeters (mm) to 20 millimeters. Since the transmitting component 210 and the receiving component 220 are relatively close, although the emission path of the sensed light signal from the transmitting component 210 to the external object and the return path after reflection from the external object to the receiving component 220 are not exactly equal, both are much greater than the distance between the transmitting component 210 and the receiving component 220, and can be considered approximately equal. Therefore, the distance information between the external object and the lidar device 200 can be calculated based on the product of half the flight time t of the sensed light signal reflected back from the object and the speed of light c.

[0089] The processing circuit 230 can be an integrated circuit chip with signal processing capabilities. The processing circuit 230 can also include a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), an image processor (ISP), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor can be a microprocessor. Of course, the processing circuit 230 can also be other types of circuits currently used for ToF sensing, control, and processing, without limitation. The LiDAR device 200 can also include a memory 240, which can be coupled to or integrated within the processing circuit 230. A description of the memory 240 of the LiDAR device 200 can be found in the description of the memory 120 of the electronic device 100, and will not be repeated here.

[0090] It is understood that, in some embodiments, the driving circuit 212 and / or processing circuit 230 may be integrated inside the photoelectric sensor 221, and this application does not limit this. In this case, the photoelectric sensor 221 can be used to control the emission of the light source 211 and process the light-sensing signals output by the photosensitive pixels to output three-dimensional information.

[0091] In some embodiments, a SPAD is used as a photosensitive pixel to sense light signals from the measurement scene. When a working voltage exceeding the reverse breakdown voltage is applied across the SPAD, it enters Geiger mode. In this mode, photons entering the SPAD have a certain probability of triggering an avalanche effect, resulting in a multiplied avalanche current as the photosensitive signal. After an avalanche, the SPAD needs to be quenched by a quenching circuit to prevent further damage from continuous avalanche. After quenching, the SPAD cannot sense photons and outputs a photosensitive signal. It needs to be reset to gradually restore the voltage across the SPAD to a working voltage exceeding the reverse breakdown voltage before it can re-enter the Geiger state and continue sensing photons. The duration of this quenching and resetting process is the dead time during which the SPAD cannot sense photons.

[0092] As shown in Figure 3, the photoelectric sensor 221 may include multiple photosensitive pixels 300, which may be arranged in an array. Each photosensitive pixel 300 includes at least one photosensitive device 312. A corresponding photosensitive device circuit 310 may be configured for each photosensitive device 312. The photosensitive device circuit 310 is configured to drive and control the corresponding photosensitive device 312 to sense photons and output a corresponding photosensitive signal. In some embodiments, the photosensitive device 312 may be a SPAD. The photosensitive device circuit 310 is configured to drive the SPAD into a photon-sensing Geiger state, quench and reset the SPAD after a photon triggers an avalanche to allow the SPAD to re-enter the Geiger state, and output the avalanche current generated by the SPAD.

[0093] The photosensitive device circuit 310 includes a photosensitive device 312, at least one subsequent sub-circuit 311, and a protection sub-circuit 316. The photosensitive device 312 includes an anode and a cathode disposed opposite each other and is configured to output an avalanche current in response to a photon avalanche effect. The subsequent sub-circuit 311 can be connected to the anode and / or cathode of the photosensitive device 312 and is configured to cooperate with the photosensitive device 312 to achieve a corresponding function. The protection sub-circuit 316 is disposed between the cathode and / or anode of the photosensitive device 312 and the corresponding subsequent sub-circuit 311, and is configured to reduce the impact of sudden changes in the external output voltage caused by avalanche of the photosensitive device 312 on the subsequent sub-circuit 311.

[0094] The photosensitive device circuit 310 may include multiple subsequent sub-circuits 311, which are connected in parallel to the cathode or anode of the photosensitive device 312. A protection sub-circuit 316 is disposed in the circuit between the multiple subsequent sub-circuits 311 connected in parallel and the cathode and / or anode of the photosensitive device 312. In this case, the protection sub-circuit 311 provides overall protection for the multiple subsequent sub-circuits 311. For example, in the embodiment shown in FIG. 4, the multiple subsequent sub-circuits 311 are connected in parallel to a circuit connection point 40. The circuit connection point 40 is connected to the cathode of the photosensitive device 312 and can serve as the external output terminal of the photosensitive device 312. The protection sub-circuit 316 is disposed between the circuit connection point 40 and the cathode of the photosensitive device 312 to provide overall protection to all subsequent sub-circuits 311 connected in parallel to the cathode of the photosensitive device 312.

[0095] For example, in the embodiment shown in FIG6, multiple downstream sub-circuits, including a quenching sub-circuit 314 and an output sub-circuit 315, are connected in parallel to a circuit connection point 40 connected to the anode of the photosensor 312. The protection sub-circuit 316 is disposed between the circuit connection point 40 and the anode of the photosensor 312 to provide overall protection to the quenching sub-circuit 314 and the output sub-circuit 315.

[0096] For example, in the embodiment shown in FIG7, both the first circuit connection point 401 connected to the cathode of the photosensitive device 312 and the second circuit connection point 402 connected to the anode of the photosensitive device 312 have multiple downstream sub-circuits connected in parallel. The protection sub-circuit 316 includes a first protection sub-circuit 3161 and a second protection sub-circuit 3162. The first protection sub-circuit 3161 is disposed between the first circuit connection point 401 and the cathode of the photosensitive device 312 to provide overall protection for the multiple downstream sub-circuits connected in parallel to the cathode of the photosensitive device 312. The second protection sub-circuit 3162 is disposed between the second circuit connection point 402 and the anode of the photosensitive device 312 to provide overall protection for the multiple downstream sub-circuits connected in parallel to the anode of the photosensitive device 312.

[0097] The protection sub-circuit 316 can also be set in any one or more of the subsequent sub-circuits 311 in the circuit before they are connected in parallel. In this case, the protection sub-circuit 316 provides protection for each of its respective subsequent sub-circuits 311. For example, in the embodiment shown in FIG5, multiple subsequent sub-circuits 311 are connected in parallel to the circuit connection point 40, which is connected to the cathode of the photosensitive device 312 and serves as the external output terminal of the photosensitive device 312. Each of the three subsequent sub-circuits 311 has a protection sub-circuit 316 in its respective branch before being connected in parallel. The protection sub-circuit 316 is set between the corresponding subsequent sub-circuit 311 in its respective branch and the circuit connection point 40, providing protection for the corresponding subsequent sub-circuit 311 in its branch.

[0098] The photosensitive device circuit 310 includes a power supply sub-circuit 313. The power supply sub-circuit 313 is connected to the anode and cathode of the photosensitive device 312 to provide an operating voltage to the photosensitive device 312. In some embodiments, the photosensitive device 312 can be a SPAD, and the power supply sub-circuit 313 includes a first power line 3131 and a second power line 3132. The cathode and anode of the SPAD are correspondingly connected to the first power line 3131 and the second power line 3132. The first power line 3131 provides a first potential V1, and the second power line 3132 provides a second potential V2. The voltage difference between the first potential V1 and the second potential V2 provides a preset operating voltage for the SPAD.

[0099] The subsequent sub-circuit may include a quenching sub-circuit configured to quench and reset the photosensitive device triggered by photon avalanche, preventing damage from continuous high avalanche current output by the photosensitive device. The quenching sub-circuit is disposed between the photosensitive device and the power supply sub-circuit. For example, in the embodiment shown in FIG3, the quenching sub-circuit 314 may be disposed between the cathode of the photosensitive device 312 and the first power line 3131 of the power supply sub-circuit 313. For example, in the embodiment shown in FIG6, the quenching sub-circuit 314 may also be disposed between the anode of the photosensitive device 312 and the second power line 3132 of the power supply sub-circuit 313.

[0100] Optionally, the anode and cathode of the photosensitive device can both be connected to the power supply sub-circuit via corresponding quenching sub-circuits. For example, in the embodiment shown in FIG7, the photosensitive device circuit 310 may include a first quenching sub-circuit 3141 and a second quenching sub-circuit 3142. The first quenching sub-circuit 3141 is disposed between the anode of the photosensitive device 312 and the first power supply line 3131 of the power supply sub-circuit 313, and the second quenching sub-circuit 3142 is disposed between the cathode of the photosensitive device 312 and the second power supply line 3132 of the power supply sub-circuit 313. The photosensitive device circuit 310 may further include a first output sub-circuit 3151 corresponding to the first quenching sub-circuit 3141, and the first output sub-circuit 3151 and the first quenching sub-circuit 3141 are connected in parallel to the cathode of the photosensitive device 312. The photosensitive device circuit 310 may further include a first protection sub-circuit 3161 corresponding to the first quenching sub-circuit 3141, the first protection sub-circuit 3161 being disposed between the first quenching sub-circuit 3141 and the cathode of the photosensitive device 312. The photosensitive device circuit 310 may further include a second output sub-circuit 3152 corresponding to the second quenching sub-circuit 3142, the first output sub-circuit 3152 being connected in parallel with the first quenching sub-circuit 3142 to the anode of the photosensitive device 312. The photosensitive device circuit 310 may further include a second protection sub-circuit 3162 corresponding to the second quenching sub-circuit 3142, the second protection sub-circuit 3162 being disposed between the second quenching sub-circuit 3142 and the anode of the photosensitive device 312.

[0101] Optionally, the quenching sub-circuit includes a current mirror. The current mirror may include, for example, a metal-oxide-semiconductor field-effect transistor (MOS transistor). For example, in the embodiment shown in FIG8, the photosensor 312 is, for example, a SPAD, and the current mirror is disposed between the cathode of the SPAD and the first power line 3131 of the power supply sub-circuit 313. When the SPAD experiences avalanche, a relatively large avalanche current flows through the SPAD, reducing the equivalent resistance of the SPAD. The pull-down current of the SPAD is greater than the pull-up current of the current mirror, causing the voltage difference applied to the SPAD to rapidly decrease to less than the reverse breakdown voltage, thus quenching the SPAD and removing it from the avalanche state. As mentioned earlier, referring to FIG6, the quenching sub-circuit 314 including the current mirror can also be disposed between the anode of the SPAD and the second power line 3132 of the power supply sub-circuit 313.

[0102] Optionally, the quenching sub-circuit 314 includes a switch control circuit. The switch control circuit is configured to disconnect the photosensitive device from the power supply sub-circuit when an avalanche occurs, and to restore the connection between the photosensitive device and the power supply sub-circuit after a preset time interval. For example, in the embodiment shown in FIG9, the switch control circuit 314 includes a switch device 3142 and an avalanche feedback circuit 3144. The switch device 3142 is configured to connect the photosensitive device 312 and the power supply sub-circuit 313. The avalanche feedback circuit 3144 is configured to control the switching device 3142 to disconnect the connection between the photosensitive device 312 and the power supply sub-circuit 313 based on the avalanche current output when an avalanche occurs in the photosensitive device 312. This causes the photosensitive device 312 to lose the applied operating voltage and quench. After a preset time interval of disconnection, the photosensitive device 312 has completed quenching. At this time, the switching device 3142 is then controlled to reconnect the photosensitive device 312 and the power supply sub-circuit 313 to gradually restore the operating voltage applied to the photosensitive device 312, allowing the photosensitive device 312 to return to a Geiger state capable of sensing photons. The time interval for disconnecting the switching device 3142 is set according to the length of time required for the photosensitive device 312 to quench. Specifically, the photosensitive device 312 is, for example, a SPAD, the switching device 3142 is disposed between the cathode of the SPAD and the first power line 3131 of the power supply sub-circuit 313, and the avalanche feedback circuit 3144 is connected to the anode of the SPAD and the control terminal of the switching device 3142 to control the switching device 3142 on and off according to the change in output current of the SPAD during the avalanche to quenching process. It should be understood that, in other embodiments, the switching device 3142 may also be disposed between the anode of the SPAD and the second power line 3132 of the power supply sub-circuit 313.

[0103] Optionally, the quenching sub-circuit may include a quenching resistor. As shown in FIG10, in some embodiments, the photosensitive device 312 is, for example, a SPAD, and the quenching resistor Rq is disposed between the cathode of the SPAD and the first power supply line 3131 of the power supply sub-circuit 313. When the SPAD experiences avalanche, the SPAD outputs a relatively large avalanche current, causing the quenching resistor Rq to divert a large voltage, thereby pulling down the voltage applied to the SPAD below the operating voltage, and the SPAD exits the avalanche state, thus achieving quenching. As mentioned above, referring to FIG6, the quenching resistor Rq may also be disposed between the anode of the SPAD and the second power supply line 3132 of the power supply sub-circuit 313.

[0104] It should be understood that, in the embodiment where both the anode and cathode of the photosensitive device 312 are connected to the power supply sub-circuit 313 through corresponding quenching sub-circuit 314, the first quenching sub-circuit 3141 connected to the cathode and the second quenching sub-circuit 3142 connected to the anode can be the same type of quenching sub-circuit 314 or different types of quenching sub-circuit 314. This application does not make any specific limitation in this regard.

[0105] The subsequent sub-circuit may include an output sub-circuit. The output sub-circuit is connected to the anode or cathode of the photosensitive device and is configured to output the avalanche current generated by the photosensitive device. Optionally, as shown in FIG11, the output sub-circuit 315 and the quenching sub-circuit 314 are connected in parallel to a circuit connection point 40 on the anode or cathode side of the photosensitive device 312. The output sub-circuit 315 includes a shaping circuit 3153, which includes an input terminal and an output terminal. The shaping circuit 3153 is connected via its input terminal to the circuit connection point 40 between the quenching sub-circuit 314 and the photosensitive device to receive the avalanche current generated by the photosensitive device 312. The shaping circuit 3153 is configured to shape the received analog avalanche current into a digital avalanche current signal and output it via its output terminal. Optionally, the input sub-circuit 315 may further include an isolation device 3154, through which the input terminal of the shaping circuit 3153 is connected between the quenching sub-circuit 314 and the photosensor 312. The isolation device 3154 is configured to isolate the influence of DC voltage on the shaping circuit 3153. In some embodiments, the isolation device 3154 is, for example, a capacitor.

[0106] Optionally, the shaping circuit may include inverters connected in series. For example, in the embodiment shown in FIG12, the shaping circuit 3153 may be a pair of inverters connected in series, with the input terminal of the first inverter 3153a serving as the input terminal of the shaping circuit 3153, the input terminal of the second inverter 3153b connected to the output terminal of the first inverter 3153a, and the output terminal of the second inverter 3153b serving as the output terminal of the shaping circuit 3153.

[0107] Optionally, the shaping circuit may include a comparator. For example, in the embodiment shown in FIG13, the shaping circuit 3153 is a comparator, which includes a first input terminal, a second input terminal, and a comparison output terminal. The first input terminal serves as the input terminal of the shaping circuit 3153 and is connected between the quenching sub-circuit 314 and the photosensitive device 312. The second input terminal is used to receive a reference voltage signal, and the comparison output terminal serves as the output terminal of the shaping circuit 3153.

[0108] The protection subcircuit can be connected to the anode or cathode of the photosensitive device and is configured to reduce the impact of voltage surges caused by photosensitive avalanche on other circuits connected to the photosensitive device. Optionally, the protection subcircuit includes a protection resistor. For example, in the embodiment shown in FIG14, the protection subcircuit 316 includes a protection resistor Rp, and the connection terminal of the output subcircuit 315 is connected to the circuit connection point 40 between the quenching subcircuit 314 and the photosensitive device, whereby the circuit connection point 40 corresponds to the output node of the photosensitive device 312 to the subsequent subcircuit, and the protection resistor Rp is disposed between the circuit connection point 40 and the cathode of the photosensitive device 312. Referring also to FIG14 and FIG15, when the photosensitive device 312 is not triggered by avalanche, the resistance of the photosensitive device 312 is approximately infinite, and no current flows through it. At this time, the current flowing through the quenching sub-circuit 314 and the protection resistor Rp is also basically zero. The voltage on the cathode of the photosensitive device 312 is equal to the first potential V1 provided by the first power line 3131, so that the voltage applied to the photosensitive device 312 meets the preset operating voltage and is in the Geiger state that can sense photons. When the photosensitive device 312 is triggered to avalanche, the internal resistance of the photosensitive device 312 decreases, and a large avalanche current Ispad flows through the photosensitive device 312. Without the protection resistor Rp, the output voltage Vout on the cathode of the photosensitive device 312 drops rapidly to Vmin. At this time, the voltage difference across the photosensitive device 312 is lower than the operating voltage, thus exiting the avalanche state and achieving quenching. With the protection resistor Rp, the avalanche current Ispad flows through the photosensitive device 312 and also through the protection resistor Rp, generating a partial voltage division on the protection resistor Rp, which can increase the voltage Vout output by the photosensitive device 312 at the circuit connection point 40 to Vmin. R Compared to the first voltage V1 provided by the first power line 3131, the drop is smaller, and it is higher than Vmin when there is no protective resistor Rp. The difference between the two is V. R -Vmin=Ispad·Rp. In this case, the voltage fluctuation amplitude caused by avalanche at the circuit connection point 40 of the photosensitive device 312 is reduced, which can reduce the impact on the subsequent circuit connected to the photosensitive device 312.

[0109] Optionally, the protection resistor Rp can be a polysilicon resistor, a metal wire resistor, or a via resistor formed between different metal layers in the chip. The resistance value of the protection resistor Rp can be set lower than the resistance value of the quenching resistor Rq. For example, the resistance value of the quenching resistor Rq can be 300K ohms to 600K ohms, and the resistance value of the protection resistor Rp can be 500 ohms to 1K ohms.

[0110] Optionally, in some embodiments, the protection sub-circuit 316 may be located between the anode or cathode of the photosensitive device and the quenching sub-circuit 314 and the output sub-circuit. For example, in the embodiment shown in FIG. 14, the quenching sub-circuit 314 and the output sub-circuit 315 are connected in parallel to the cathode of the photosensitive device 312 through an intersecting circuit connection point 40, and the protection sub-circuit 316 is located between the circuit connection point 40 and the cathode of the photosensitive device 312; in the embodiment shown in FIG. 16, the quenching sub-circuit 314 and the output sub-circuit 315 are connected to the anode of the photosensitive device 312 through an intersecting circuit connection point 40, and the protection sub-circuit 316 is located between the circuit connection point 40 and the anode of the photosensitive device 312.

[0111] Optionally, as shown in FIG17, the subsequent sub-circuit may further include a control sub-circuit 318. The control sub-circuit 318 is configured to select whether to activate the photosensitive device 312 in the photosensitive device circuit 310 according to a control signal. It should be understood that the control signal may come from an external circuit or from within the photosensitive device circuit 310.

[0112] As shown in Figure 18, in some embodiments, the control subcircuit 318 may include, for example, a switching device 3182 and a voltage source 3186. The voltage source 3186 is configured to provide a preset stable voltage and is connected to the anode or cathode of the photosensitive device 312 via the switching device 3182. When the switching device 3182 is controlled to connect the photosensitive device 312 and the voltage source 3186, the voltage difference applied across the photosensitive device 312 is pulled down to less than the preset operating voltage, thereby causing the photosensitive device 312 to stop operating. When the switching device 3182 is controlled to disconnect the photosensitive device 312 from the voltage source 3186, the photosensitive device 312 is activated and operates under the operating voltage provided by the power supply subcircuit 313. Optionally, the voltage source 3186 may be, for example, a ground terminal to provide a stable zero potential.

[0113] The switching device 3182 may include a first connection terminal, a second connection terminal, and a control terminal. The first connection terminal and the second connection terminal are respectively connected to the photosensitive device 312 and the voltage source 3186. The control terminal connects or disconnects the first connection terminal and the second connection terminal according to a received control signal. As shown in Figure 18, the switching device 3182 may be, for example, a MOSFET, with the source and drain of the MOSFET being the first connection terminal and the second connection terminal, respectively, and the gate of the MOSFET being the control terminal.

[0114] The photosensitive device circuit provided in this application reduces the voltage fluctuations of the photosensitive device output to external circuits during avalanche by setting a protection circuit connected to the anode or cathode of the photosensitive device. This protects the downstream circuits connected to the photosensitive device from the effects of voltage fluctuations and improves the reliability of the photoelectric sensor and the entire lidar and electronic equipment.

[0115] In some embodiments, the subsequent sub-circuit is an active sub-circuit, and the corresponding protection sub-circuit is a buffer sub-circuit. The photosensitive device circuit includes a photosensitive device, at least one active sub-circuit, and at least one buffer sub-circuit. The photosensitive device includes a cathode and an anode disposed opposite each other, and the photosensitive device is configured to respond to the avalanche effect of photons and output a sudden electrical signal through the cathode and anode. As shown in Figures 19-26, the photosensitive device 312 is, for example, a SPAD. The cathode of the SPAD is connected to a first power line 3131, and the anode of the SPAD is connected to a second power line 3132. The first potential V1 provided by the first power line 3131 is greater than the second potential V2 provided by the second power line 3132, so as to apply a reverse bias voltage to the SPAD during operation, so that the SPAD is in Geiger mode. At this time, a single photon can trigger the SPAD to generate an avalanche effect and output a sudden electrical signal, which can also be called an avalanche electrical signal. Optionally, the second power line 3132 can be grounded, and the provided second potential V2 is zero.

[0116] Each active subcircuit includes at least one active device connected to the anode and / or cathode of the photosensitive device. Each active subcircuit is correspondingly provided with a buffer subcircuit configured to mitigate abrupt changes in the electrical signal transmitted to the corresponding active subcircuit during avalanche of the photosensitive device. In some embodiments, the buffer subcircuit includes at least one resistor and at least one capacitor. The resistor of the buffer subcircuit is connected in series in the circuit path that would cause abrupt changes in the electrical signal during avalanche of the photosensitive device; for example, the resistor of the buffer subcircuit is connected in series in the line between the corresponding active subcircuit and the anode or cathode of the photosensitive device. One end of the capacitor is connected to the line between the resistor and the corresponding active subcircuit, and the other end of the capacitor is connected to AC ground.

[0117] In some embodiments, the photosensitive device circuit includes an active sub-circuit connected to the cathode of the photosensitive device, and the buffer sub-circuit is configured to mitigate the abrupt change in the avalanche electrical signal output from the cathode during a photosensitive device avalanche before it is transmitted to the active sub-circuit.

[0118] Furthermore, the active sub-circuit is connected to the circuit connection point between the cathode of the photosensitive device and the first power line. The circuit paths that cause a sudden change in electrical signal when the photosensitive device experiences avalanche include at least three circuit paths: between the cathode of the photosensitive device and the circuit connection point, between the circuit connection point and the active sub-circuit, and between the anode of the photosensitive device and the second power line. Therefore, the resistor of the buffer sub-circuit can be connected in series with any one of the three circuit paths; or, the buffer sub-circuit includes two or more resistors, each connected in series with any two or more different combinations of the three circuit paths. The buffer sub-circuit includes at least one capacitor corresponding to at least one of the resistors, with one end of the capacitor connected between the corresponding resistor and the corresponding active sub-circuit, and the other end connected to AC ground. That is, each capacitor in the buffer sub-circuit corresponds to one resistor, and the buffer sub-circuit can have one capacitor for each resistor; or, only one or several resistors can have one capacitor for each.

[0119] For example, in the embodiment shown in Figure 19, the active sub-circuit 317 is connected to the circuit connection point B between the cathode of the photosensitive device 312 and the first power line 3131. The buffer sub-circuit 315 includes a resistor 320, which is connected in series in the circuit path between the cathode of the photosensitive device 312 and the circuit connection point B of the active sub-circuit 317. The buffer sub-circuit 319 also includes a capacitor 330 corresponding to the resistor 320. One end of the capacitor 330 is connected to an AC ground, and the other end is connected to the circuit path between the corresponding resistor 320 and the active sub-circuit 317, for example, between the corresponding resistor 320 and the circuit access point B of the active sub-circuit 317. It should be understood that in other embodiments, the other end of the capacitor 330 may also be connected at least between the circuit access point B of the active sub-circuit 317 and the active sub-circuit 317.

[0120] In the embodiment shown in Figure 20, the active sub-circuit 317 is connected to the circuit connection point B between the cathode of the photosensitive device and the first power line 3131. The buffer sub-circuit 319 includes a resistor 320, which is connected in series in the circuit path between the circuit connection point B of the active sub-circuit 317 and the active sub-circuit 317. The buffer sub-circuit 319 also includes a capacitor 330 corresponding to the resistor 320. One end of the capacitor 330 is connected to an AC ground, and the other end is connected between the corresponding resistor 320 and the active sub-circuit 317.

[0121] In the embodiment shown in Figure 21, the active sub-circuit 317 is connected to the circuit connection point B between the cathode of the photosensitive device and the first power line 3131. The buffer sub-circuit 319 includes a resistor 320, which is connected in series in the circuit path between the anode of the photosensitive device 312 and the second power line 3132. The buffer sub-circuit 319 also includes a capacitor 330 corresponding to the resistor 320. One end of the capacitor 330 is connected to an AC ground, and the other end is connected to the circuit path between the corresponding resistor 320 and the active sub-circuit 317, for example, between the corresponding resistor 320 and the anode of the photosensitive device 312. It should be understood that in other embodiments, the other end of the capacitor 330 may also be connected at least between the cathode of the photosensitive device 312 and the circuit connection point B of the active sub-circuit 317, or between the circuit connection point B of the active sub-circuit 317 and the active sub-circuit 317.

[0122] In some embodiments, the photosensitive device circuit includes an active sub-circuit connected to the anode of the photosensitive device, and the buffer sub-circuit is configured to mitigate the abrupt change in the avalanche electrical signal output from the anode during avalanche of the photosensitive device before it is transmitted to the active sub-circuit.

[0123] Furthermore, the active sub-circuit is connected to the circuit connection point between the anode of the photosensitive device and the second power line. The circuit path that causes a sudden change in electrical signal when the photosensitive device experiences an avalanche includes at least three circuit paths: from the anode of the photosensitive device to this circuit connection point, from this circuit connection point to the active sub-circuit, and from the cathode of the photosensitive device to the first power line. Therefore, the resistor of the buffer sub-circuit is connected in series with any one of the three circuit paths; or, the buffer sub-circuit includes two or more resistors, each connected in series with any two or more different combinations of the three circuit paths. The buffer sub-circuit includes at least one capacitor corresponding to at least one of the resistors, with one end of the capacitor connected between the corresponding resistor and the corresponding active sub-circuit, and the other end connected to AC ground. That is, each capacitor in the buffer sub-circuit corresponds to one resistor, and the buffer sub-circuit can have one capacitor for each resistor; or, only one or several resistors can have one capacitor for each.

[0124] For example, in the embodiment shown in Figure 22, the active sub-circuit 317 is connected to the circuit connection point A between the anode of the photosensitive device 312 and the second power line 3132. The buffer sub-circuit 319 includes a resistor 320, which is connected in series in the circuit path between the anode of the photosensitive device 312 and the circuit connection point A. The buffer sub-circuit 319 also includes a capacitor 330 corresponding to the resistor 320. One end of the capacitor 330 is connected to an AC ground, and the other end is connected to the circuit path between the corresponding resistor 320 and the active sub-circuit 317, for example, between the corresponding resistor 320 and the circuit access point A of the active sub-circuit 317. It should be understood that in other embodiments, the other end of the capacitor 330 may also be connected at least between the circuit access point A of the active sub-circuit 317 and the active sub-circuit 317 itself.

[0125] In the embodiment shown in Figure 23, the active sub-circuit 317 is connected to the circuit connection point A between the anode of the photosensitive device 312 and the second power line 3132. The buffer sub-circuit 319 includes a resistor 320, which is connected in series in the circuit path between the circuit connection point A and the active sub-circuit 317. The buffer sub-circuit 319 also includes a capacitor 330 corresponding to the resistor 320. One end of the capacitor 330 is connected to an AC ground, and the other end is connected between the corresponding resistor 320 and the active sub-circuit 317.

[0126] In the embodiment shown in Figure 24, the active sub-circuit 317 is connected to circuit connection point A between the anode of the photosensitive device 312 and the second power line 3132. The buffer sub-circuit 319 includes a resistor 320 connected in series in the circuit path between the cathode of the photosensitive device 312 and the first power line 3131. The buffer sub-circuit 319 also includes a capacitor 330 corresponding to the resistor 320. One end of the capacitor is connected to an AC ground, and the other end is connected to the circuit path between the corresponding resistor 320 and the active sub-circuit 317, for example, between the corresponding resistor 320 and the cathode of the photosensitive device 312. It should be understood that in other embodiments, the other end of the capacitor 330 may also be connected at least between the anode of the photosensitive device 312 and circuit connection point A of the active sub-circuit 317, or between circuit connection point A of the active sub-circuit 317 and the active sub-circuit 317.

[0127] In some embodiments, the photosensitive device circuit includes two active sub-circuits, namely a first active sub-circuit and a second active sub-circuit. The first active sub-circuit is connected to the anode of the photosensitive device, and the second active sub-circuit is connected to the cathode of the photosensitive device. The photosensitive device circuit also includes a first buffer sub-circuit corresponding to the first active sub-circuit and a second buffer sub-circuit corresponding to the second active sub-circuit. The first buffer sub-circuit is configured to mitigate the abrupt change in the avalanche signal output from the anode of the photosensitive device before it is transmitted to the first active sub-circuit during an avalanche. The second buffer sub-circuit is configured to mitigate the abrupt change in the avalanche electrical signal output from the cathode of the photosensitive device before it is transmitted to the second active sub-circuit during an avalanche.

[0128] Furthermore, the first buffer sub-circuit includes a first resistor and a first capacitor, and the second buffer sub-circuit includes a second resistor and a second capacitor. Both the first and second resistors are connected in series in the circuit path that would cause a sudden change in electrical signal during avalanche of the photosensitive device. For example, the first resistor is connected in series in the line between the first active sub-circuit and the anode of the photosensitive device, and the second resistor is connected in series in the line between the second active sub-circuit and the cathode of the photosensitive device. One end of the first capacitor is connected to the line between the first resistor and the first active sub-circuit, and the other end of the first capacitor is connected to AC ground. One end of the second capacitor is connected to the line between the second resistor and the second active sub-circuit, and the other end of the second capacitor is connected to AC ground.

[0129] For example, in the embodiment shown in FIG25, the first active sub-circuit 3171 is connected to the circuit connection point C between the anode of the photosensitive device 312 and the second power line 3132, and the second active sub-circuit is connected to the circuit connection point D between the cathode of the photosensitive device 312 and the first power line 3131.

[0130] The first resistor 3201 of the first buffer sub-circuit 3191 is connected in series between the circuit connection point C of the first active sub-circuit 3171 and the first active sub-circuit 3171. One end of the first capacitor 3301 of the first buffer sub-circuit 3191 is connected between the first resistor 3201 and the first active sub-circuit 3171, and the other end is connected to an AC ground. It should be understood that, in other embodiments, the first resistor 3201 may also be connected in series between the circuit connection point C of the first active sub-circuit 3171 and the cathode of the photosensitive device 312, with one end of the corresponding first capacitor 3301 connected between the first resistor 3201 and the circuit connection point C or between the circuit connection point C and the first active sub-circuit 3171, and the other end connected to an AC ground; the first resistor 3201 may also be connected in series between the anode of the photosensitive device 312 and the first power line 3131, with one end of the corresponding first capacitor 3301 connected between the first resistor 3201 and the anode of the photosensitive device 312, between the cathode of the photosensitive device 312 and the circuit connection point C or between the circuit connection point C and the first active sub-circuit 3171, and the other end connected to an AC ground.

[0131] The second resistor 3202 of the second buffer sub-circuit 3192 is connected in series with the circuit connection point D of the second active sub-circuit 3172. One end of the second capacitor 3202 of the second buffer sub-circuit 3192 is connected between the second resistor 3202 and the second active sub-circuit 3172, and the other end is connected to an AC ground. It should be understood that, in other embodiments, the second resistor 3202 may also be connected in series between the circuit connection point D of the second active sub-circuit 3172 and the cathode of the photosensitive device 312, with one end of the corresponding second capacitor 3302 connected between the second resistor 3202 and the circuit connection point D or between the circuit connection point D and the second active sub-circuit 3172, and the other end connected to an AC ground; the second resistor 3202 may also be connected in series between the anode of the photosensitive device 312 and the second power line 3132, with one end of the corresponding second capacitor 3302 connected between the second resistor 3202 and the anode of the photosensitive device, between the cathode of the photosensitive device and the circuit connection point D, or between the circuit connection point D and the second active sub-circuit 3172.

[0132] Furthermore, in some other embodiments, the first buffer sub-circuit may share a resistor with the second buffer sub-circuit. The first buffer sub-circuit includes a first capacitor and the shared resistor, and the second buffer sub-circuit includes a second capacitor and the shared resistor. The shared resistor is connected in series in the circuit path where the electrical signal will change abruptly when the photosensitive device avalanche occurs. One end of the first capacitor is connected to the line between the shared resistor and the first active sub-circuit, and the other end of the first capacitor is connected to an AC ground. One end of the second capacitor is connected to the line between the shared resistor and the second active sub-circuit, and the other end of the second capacitor is connected to an AC ground.

[0133] For example, in the embodiment shown in Figure 26, the first active sub-circuit 3171 is connected to the circuit connection point C between the anode of the photosensitive device 312 and the second power line 3132, and the second active sub-circuit 3172 is connected to the circuit connection point D between the cathode of the photosensitive device 312 and the first power line 3131. The resistor 320 shared by the first buffer sub-circuit 3191 and the second buffer sub-circuit 3192 is connected in series in the line between the first active sub-circuit 3171 and the anode of the photosensitive device 312, or between the second active sub-circuit 3172 and the cathode of the photosensitive device 312. For example, it can be connected in series between the first active sub-circuit 3171 and the circuit connection point C, between the circuit connection point C and the anode of the photosensitive device 312, between the second active sub-circuit 3172 and the circuit connection point D, or between the circuit connection point D and the cathode of the photosensitive device 312. The embodiment in Figure 26 uses the shared resistor 320 connected in series between the circuit connection point D and the cathode of the photosensitive device 312 as an example. Correspondingly, one end of the first capacitor 3301 of the first buffer sub-circuit 3191 is connected between the anode of the optoelectronic device 312 and the circuit connection point C, and the other end is connected to an AC ground. One end of the second capacitor 3302 of the second buffer sub-circuit 3192 is connected between the circuit connection point D of the second active sub-circuit 3172 and the second active sub-circuit 3172, and the other end is connected to an AC ground.

[0134] In some embodiments, the active sub-circuit can be an output circuit for outputting the abrupt electrical signal generated when the photosensitive device undergoes an avalanche. The active device in the output circuit includes logic gate elements, such as inverters, NOR gates, etc.

[0135] In some embodiments, the active sub-circuit may be a switch control circuit for selecting the photosensitive device, and the active device in the switch control circuit includes a MOSFET.

[0136] In some embodiments, the active sub-circuit is a charging circuit used to reset the photosensitive device after an avalanche, and the active device in the charging circuit includes a current mirror and / or a MOSFET.

[0137] Optionally, the capacitor in the buffer sub-circuit can be a parasitic capacitance in the circuit. This parasitic capacitance can be achieved by increasing the overlap area between different layers of circuits at the location of the capacitor in the circuit, or by extending the parallel length of traces within the same layer and reducing the parallel spacing between traces within the same layer. The capacitor in the buffer sub-circuit can also be a physical capacitor, such as a metal-insulator-metal (MIM) capacitor or a metal-oxide-metal (MOM) capacitor.

[0138] The resistor in the buffer sub-circuit serves two purposes: firstly, it limits the current increase in the circuit path connected in series with the buffer sub-circuit; secondly, it diverts a portion of the voltage, thus reducing the voltage change amplitude of the avalanche signal transmitted to the corresponding active sub-circuit. The capacitor in the buffer sub-circuit, in conjunction with the corresponding resistor, delays the avalanche signal's abrupt change time. Therefore, the buffer sub-circuit's mitigation effect on signal abrupt changes includes reducing the amplitude of the signal change and extending the duration of the signal change process. As shown in Figure 27, after the abruptly changing signal output by the photosensitive device during an avalanche passes through the resistor and capacitor of the buffer sub-circuit, the amplitude of the signal change is suppressed and reduced; and thirdly, the duration of the signal change process is lengthened. That is, the abrupt change time t1 with the buffer sub-circuit in Figure 27 is greater than the abrupt change time t2 without the buffer sub-circuit, making the change curve of the abruptly changing signal smoother and the slope of the curve smaller, thus preventing damage to the active devices in the active sub-circuit connected to the photosensitive device. Meanwhile, in order to ensure that the abrupt change in the electrical signal output by the photosensitive device during avalanche can be identified in subsequent circuits, the abrupt change in the electrical signal after passing through the buffer sub-circuit cannot be too small. Therefore, the product of the resistance value of the resistor and the capacitance value of the capacitor in the buffer sub-circuit is set within a preset range so that the abrupt change in the electrical signal still has a suitable degree of change after being slowed down by the buffer sub-circuit.

[0139] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A photosensitive device circuit, characterized in that, include: A photosensitive device includes a cathode and an anode disposed opposite each other, the photosensitive device being configured to respond to a photon avalanche effect and output abrupt electrical signals through the cathode and anode; At least one active sub-circuit, each active sub-circuit including at least one active device, the active sub-circuit being connected to the anode and / or cathode of the photosensitive device; and At least one buffer sub-circuit is provided, and each active sub-circuit is provided with one buffer sub-circuit. The buffer sub-circuit is configured to mitigate the avalanche effect of the photosensitive device and the sudden change in the electrical signal transmitted to the corresponding active sub-circuit.

2. The photosensitive device circuit as described in claim 1, characterized in that, The buffer sub-circuit includes at least one resistor and at least one capacitor. The resistor is connected in series on the circuit path that will cause a sudden change in electrical signal when the photosensitive device avalanches. One end of the capacitor is connected to the line between the resistor and the corresponding active sub-circuit, and the other end of the capacitor is connected to an AC ground.

3. The photosensitive device circuit as described in claim 2, characterized in that, The resistor is connected in series in the line between the active sub-circuit and the anode or cathode of the photosensitive device.

4. The photosensitive device circuit as described in claim 2, characterized in that, The product of the resistance value of the resistor and the capacitance value of the capacitor in the buffer sub-circuit is set within a preset range.

5. [Amended according to Rule 26, 25.03.2025] The photosensitive device circuit as described in claim 2 is characterized in that, The capacitor is the parasitic capacitance of the circuit.

6. The photosensitive device circuit as described in claim 2, characterized in that, The capacitor is a physical capacitor.

7. The photosensitive device circuit as described in claim 1, characterized in that, The active sub-circuit is an output circuit used to output the sudden electrical signal generated when the photosensitive device undergoes an avalanche; the active devices in the output circuit include logic gate elements.

8. The photosensitive device circuit as described in claim 1, characterized in that, The active sub-circuit is a switch control circuit used to select the photosensitive device. The active device in the switch control circuit includes a MOSFET.

9. The photosensitive device circuit as described in claim 1, characterized in that, The active sub-circuit is a charging circuit used to reset the photosensitive device after an avalanche. The active devices in the charging circuit include a current mirror and / or a MOSFET.

10. The photosensitive device circuit as described in claim 1, characterized in that, At least one active sub-circuit includes a first active sub-circuit connected to the anode of the photosensitive device and a second active sub-circuit connected to the cathode of the photosensitive device; at least one buffer sub-circuit includes a first buffer sub-circuit corresponding to the first active sub-circuit and a second buffer sub-circuit corresponding to the second active sub-circuit, wherein the first buffer sub-circuit is configured to mitigate the abrupt change in the transmission of the electrical signal output by the photosensitive device to the first active sub-circuit when an avalanche effect occurs, and the second buffer sub-circuit is configured to mitigate the abrupt change in the transmission of the electrical signal output by the photosensitive device to the second active sub-circuit when an avalanche effect occurs.

11. The photosensitive device circuit as described in claim 10, characterized in that, The first buffer sub-circuit includes a first resistor and a first capacitor, and the second buffer sub-circuit includes a second resistor and a second capacitor. The first resistor and the second resistor are both connected in series on the circuit path that will cause a sudden change in electrical signal when the photosensitive device avalanches. One end of the first capacitor is connected to the line between the first resistor and the first active sub-circuit, and the other end of the first capacitor is connected to an AC ground. One end of the second capacitor is connected to the line between the second resistor and the second active sub-circuit, and the other end of the second capacitor is connected to an AC ground.

12. The photosensitive device circuit as described in claim 11, characterized in that, The first resistor is connected in series in the line between the first active sub-circuit and the anode of the photosensitive device, and the second resistor is connected in series in the line between the second active sub-circuit and the cathode of the photosensitive device.

13. The photosensitive device circuit as described in claim 10, characterized in that, The first buffer sub-circuit includes a first capacitor, and the second buffer sub-circuit includes a second capacitor. The first buffer sub-circuit and the second buffer sub-circuit share the same resistor, which is connected in series on the circuit path that will cause a sudden change in electrical signal when the photosensitive device avalanches. One end of the first capacitor is connected to the line between the shared resistor and the first active sub-circuit, and the other end of the first capacitor is connected to an AC ground. One end of the second capacitor is connected to the line between the shared resistor and the second active sub-circuit, and the other end of the second capacitor is connected to an AC ground.

14. The photosensitive device circuit as described in claim 13, characterized in that, A common resistor is connected in series on the line between the first active sub-circuit and the anode of the photosensitive device or on the line between the second active sub-circuit and the cathode of the photosensitive device.

15. The photosensitive device circuit as described in claim 1, characterized in that, The buffer sub-circuit mitigates abrupt changes in electrical signals by reducing the amplitude of the signal change and extending the duration of the signal change process.

16. A photoelectric sensor, characterized in that, It includes at least one photosensitive device circuit as described in any one of claims 1-15.

17. A lidar device, characterized in that, Including the photoelectric sensor as described in claim 16.

18. An electronic device, characterized in that, Includes the lidar device as described in claim 17.

Images