Camera module and electronic device

Abstract

The present application relates to a camera module (20) and an electronic device (10). The camera module (20) comprises an optical conducting element (23), a lens (21), an image sensor (22), and a first circuit element (24). The image sensor (22) and the lens (21) are arranged on the same side of the optical conducting element (23), and the image sensor (22) at least partially overlaps the lens (21) in the axial direction of the lens (21); the optical conducting element (23) is configured to guide at least some light beams emitted from the lens (21) to the image sensor (22). The first circuit element (24) comprises a connecting portion (241) and a wiring portion (242), wherein the connecting portion (241) is electrically connected to the image sensor (22) and is fixed relative to the image sensor (22), and the wiring portion (242) is electrically connected to the connecting portion (241) and is at least partially located between the lens (21) and the image sensor (22).

Description

Camera modules and electronic devices

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 2024115266143, filed on October 29, 2024, entitled "Camera Module and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of camera equipment technology, and in particular to a camera module and electronic device. Background Technology

[0004] With the rapid development of camera technology, more and more electronic devices such as smartphones, tablets, and e-readers are equipped with camera modules to achieve video recording functions. Among them, electronic devices with telephoto camera modules have emerged. Telephoto camera modules have a sufficiently long focal length, making it easy to capture distant subjects, reveal details of distant objects, and have strong background blur capabilities, meeting the needs of long-distance shooting. However, due to the long focal length, telephoto camera modules require a larger stabilization throw to achieve optical image stabilization, which tends to increase the size of the camera module and is not conducive to the miniaturization design of electronic devices. Summary of the Invention

[0005] On one hand, this application provides a camera module, including an optical transmission element, a lens, an image sensor, and a first circuit element. The image sensor and the lens are disposed on the same side of the optical transmission element, and at least partially overlap with the lens in the axial direction of the lens. The optical transmission element is configured to transmit at least a portion of the light emitted from the lens to the image sensor. The first circuit element includes a connecting portion and a routing portion. The connecting portion is electrically connected to the image sensor and fixed relative to the image sensor. The routing portion is electrically connected to the connecting portion and is at least partially located between the lens and the image sensor.

[0006] On the other hand, this application provides an electronic device including the aforementioned camera module. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the disclosed drawings without creative effort.

[0008] Figure 1 is a schematic diagram of the electronic device.

[0009] Figure 2 is a schematic diagram of the camera module structure in some embodiments.

[0010] Figure 3 is a structural schematic diagram of the camera module shown in Figure 2 from another angle.

[0011] Figure 4 is a cross-sectional view of the camera module shown in Figure 3 along the AA direction.

[0012] Figure 5 is a schematic diagram of the optical path of the camera module in some embodiments.

[0013] Figure 6 is an exploded view of the camera module shown in Figure 2.

[0014] Figure 7 is a schematic diagram of the camera module shown in Figure 2 with the cover omitted.

[0015] Figure 8 is a schematic diagram of the image stabilization bracket of the camera module shown in Figure 7.

[0016] Figure 9 is a schematic diagram of the camera module in some other embodiments.

[0017] Figure 10 is a schematic diagram of the structure of the first circuit element in the camera module shown in Figure 9.

[0018] Figure 11 is a schematic diagram of the camera module structure when the second corner is fixed on the anti-shake bracket in some embodiments.

[0019] Figure 12 is a schematic diagram of the camera module shown in Figure 11 with the cover omitted.

[0020] Figure 13 is a partially enlarged schematic diagram of the camera module shown in Figure 12 from another angle.

[0021] Figure 14 is a schematic diagram of the camera module shown in Figure 12 with the first circuit element omitted.

[0022] Figure 15 is a magnified view of a portion of the camera module shown in Figure 14 within the circular frame area.

[0023] Figure 16 is a schematic diagram of the camera module in some other embodiments.

[0024] Figure 17 is a schematic diagram of the structure of the first circuit element in the camera module shown in Figure 16.

[0025] Figure 18 is an exploded view of some components of the camera module shown in Figure 2.

[0026] Figure 19 is a schematic diagram of the image stabilization drive mechanism in the camera module shown in Figure 2.

[0027] Figure 20 is an exploded view of some components of the anti-shake drive mechanism shown in Figure 19.

[0028] Figure 21 is a schematic diagram of the camera module shown in Figure 11 with the connecting part omitted.

[0029] Figure 22 is an exploded view of some components of the camera module shown in Figure 21.

[0030] Figure 23 is a schematic diagram of the camera module in some embodiments.

[0031] Figure 24 is an exploded view of the camera module shown in Figure 23.

[0032] Figure 25 is a schematic diagram of the structure of some components of the camera module shown in Figure 23.

[0033] Figure 26 is a schematic diagram of the structure of a camera module with a stabilization circuit carrier in some embodiments.

[0034] Figure 27 is an exploded view of the camera module shown in Figure 26.

[0035] Figure 28 is a schematic diagram of the structure of some components of the camera module shown in Figure 26.

[0036] Figure 29 is an exploded view of some components of the camera module shown in Figure 28.

[0037] Figure 30 is a schematic diagram of the flexible support component in the camera module shown in Figure 26.

[0038] Figure 31 is a schematic diagram of the elastic conductive cantilever in the camera module shown in Figure 26.

[0039] Figure 32 is a schematic diagram showing that the electronic device in some embodiments also includes other components. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] As used herein, "electronic device" refers to, but is not limited to, a device capable of receiving and / or transmitting communication signals connected via any one or more of the following connection methods:

[0042] (1) Via wired connection, such as via Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, or direct cable connection;

[0043] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLANs), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0044] An electronic device configured to communicate via a wireless interface can be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0045] (1) Satellite phone or cellular phone;

[0046] (2) A personal communications system (PCS) terminal that can combine cellular radio telephone with data processing, fax and data communication capabilities;

[0047] (3) Radio telephone, pager, Internet / intranet access, web browser, notepad, calendar, personal digital assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0048] (4) Conventional above-knee and / or palm-sized receivers;

[0049] (5) Conventional knee-mounted and / or handheld wireless telephone transceivers, etc.

[0050] Please refer to Figures 1-4. In some embodiments of this application, a camera module 20 is provided. The camera module 20 can be applied to an electronic device 10, such as a smartphone, tablet computer, e-reader, or any other suitable electronic device 10. The camera module 20 includes a lens 21, an image sensor 22, and an optical transmission element 23. The lens 21 may include one or more lenses with optical power. The optical transmission element 23 may be a prism made of plastic or glass. The image sensor 22 includes, but is not limited to, a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS). The rear cover of the electronic device 10 may have a light-entry hole 11. The lens 21 is opposite to the light-entry hole 11 and collects ambient light through the light-entry hole 11. The optical transmission element 23 can transmit at least a portion of the light emitted from the lens 21 to the image sensor 22, so that the image sensor 22 can convert the light signal into an electrical signal and transmit it to the central processing unit or other control elements of the electronic device 10 to realize the shooting function.

[0051] Referring to Figures 4 and 5, in some embodiments, the image sensor 22 and the lens 21 are located on the same side of the optical transmission element 23, and at least partially overlap with the lens 21 in the axial direction. For example, the optical transmission element 23 has a light-transmitting surface 231, which has an incident light area 2311 and an exit light area 2312. The lens 21 is opposite to the incident light area 2311 of the light-transmitting surface 231, and the image sensor 22 is opposite to the exit light area 2312 of the lens 21. The optical transmission element 23 can reflect light incident from the incident light area 2311 multiple times and then emit it from the exit light area 2312 to transmit it to the image sensor 22. In other words, the optical transmission element 23 can deflect light by 180° through multiple reflections, achieving the effect of folding the optical path. This is beneficial for realizing the telephoto design of the camera module 20 and compressing the space occupied by the camera module 20 through the periscope design.

[0052] Meanwhile, the optical transmission element 23 deflects the light by 180°, so that the lens 21 and the image sensor 22 are located on the same side of the optical transmission element 23. The image sensor 22 and the lens 21 at least partially overlap in the axial direction of the lens 21, which helps to reduce the space occupied by the lens 21 and the image sensor 22 in the height direction of the camera module 20, thereby compressing the size of the camera module 20 in the thickness direction of the electronic device 10, which is beneficial to the miniaturization design of the electronic device 10. Furthermore, in the light path propagation direction, the lens 21, the optical transmission element 23 and the image sensor 22 are arranged in sequence. When the camera module 20 is located inside the electronic device 10, the lens 21 can be opposite to the light-entry hole 11 of the electronic device 10, rather than the optical transmission element 23 being opposite to the light-entry hole 11. This allows the shape of the lens 21 to be adapted to make the light-entry hole 11 circular rather than square, which helps to adapt the shape of the light-entry hole 11 to the shape of other hole structures of the electronic device 10, improving the appearance integrity of the electronic device 10.

[0053] Referring to Figure 5, in some embodiments, the optical transmission element 23 can emit at least a portion of the light incident from the light-incident region 2311 through five reflections from the light-exit region 2312. For example, the optical transmission element 23 further includes a first reflective surface 232, a second reflective surface 233, and a bottom surface 234. The first reflective surface 232 is inclined opposite to the light-incident region 2311 of the light-transmitting surface 231, the second reflective surface 233 is inclined opposite to the light-exit region 2312 of the light-transmitting surface 231, and the bottom surface 234 is connected to the first reflective surface 232 and the second reflective surface 233 and is opposite to the light-transmitting surface 231. At least a portion of the light incident from the incident light region 2311 can be reflected by the first reflecting surface 232 onto the light-transmitting surface 231, then reflected by the light-transmitting surface 231 onto the bottom surface 234, and then reflected again by the bottom surface 234 onto the light-transmitting surface 231, and then reflected by the light-transmitting surface 231 onto the second reflecting surface 233, and then emitted from the light-exiting region 2312 after reflection by the second reflecting surface 233. Of course, the above five reflections are only an example of the optical transmission element 23 deflecting light in one embodiment. In other embodiments, depending on the size of the optical transmission element 23 and the angle between the light-transmitting surface 231 and the first reflecting surface 232 and the second reflecting surface 233, the light can also be emitted after two, three, or other numbers of reflections in the optical transmission element 23, as long as the optical transmission element 23 can deflect the light by 180° to transmit at least a portion of the light collected by the lens 21 to the image sensor 22. It is understandable that the more times light is reflected in the optical transmission element 23, the longer the equivalent optical path of light in the optical transmission element 23, which can accommodate the design of a lens 21 with a longer focal length. The specific number of reflections can be designed according to the focal length requirements of the camera module 20, and is not limited in this application.

[0054] Referring to Figures 4, 5, and 6, it can be seen that when the optical transmission element 23 reflects and refracts light multiple times, there is usually a gap between the light-incident area 2311 and the light-exit area 2312 to adapt to the light transmission path. That is, there is a gap between the lens 21 and the image sensor 22 to improve the utilization efficiency of the space between the lens 21 and the image sensor 22. In some embodiments, the camera module 20 also includes a first circuit element 24. The first circuit element 24 can be a flexible circuit board, or a rigid-flex board formed by connecting a flexible circuit board and a printed circuit board. The first circuit element 24 is used to realize the electrical connection between the image sensor 22 and external components, such as the image sensor 22 and the central processing unit of the electronic device 10, or the control chip in the electronic device 10 specifically used to realize communication with the image sensor 22. The first circuit element 24 includes a connecting portion 241 and a wiring portion 242. The connecting portion 241 is electrically connected to and fixed relative to the image sensor 22. The wiring portion 242 is electrically connected to the connecting portion 241 and is at least partially located between the lens 21 and the image sensor 22. This arrangement, with the wiring portion 242 at least partially located between the image sensor 22 and the lens 21, allows for full utilization of the space between the lens 21 and the image sensor 22 for wiring. The layout of the wiring portion 242 is adapted to the layout of the lens 21, the image sensor 22, and the optical transmission element 23, which improves the space utilization efficiency of the camera module 20 and further reduces the space occupied by the camera module 20.

[0055] In some embodiments, the camera module 20 further includes a stabilization drive mechanism 25 and a stabilization bracket 26. The stabilization bracket 26 is fixed relative to the optical transmission element 23. For example, the stabilization bracket 26 is directly fixed to the optical transmission element 23. Alternatively, the camera module 20 further includes a prism bracket 27 for accommodating the optical transmission element 23, and the stabilization bracket 26 is fixedly mounted on the prism bracket 27. The image sensor 22 is mounted on the stabilization drive mechanism 25, which is mounted on the stabilization bracket 26. The stabilization drive mechanism 25 is configured to drive the image sensor 22 to move relative to the optical transmission element 23 to achieve optical image stabilization. For example, the stabilization drive mechanism 25 can drive the image sensor 22 to move in at least one of a first direction 391 and a second direction 392 that are perpendicular to each other. The plane containing the first direction 391 and the second direction 392 is parallel to the light-transmitting surface 231, and the second direction 392 is parallel to the vertical line connecting the lens 21 and the image sensor 22. The image sensor 22 is driven by the image stabilization drive mechanism 25 to achieve optical image stabilization of the camera module 20. Since the size of the image sensor 22 in the axial direction of the lens 21 is usually smaller than the size of the lens 21, this setting allows the size of the image stabilization drive mechanism 25 in the axial direction of the lens 21 to also coincide with the size of the lens 21, thereby effectively reducing the space occupied by the image stabilization drive mechanism 25 in the axial direction of the lens 21. While achieving optical image stabilization, it is beneficial to reduce the size of the camera module 20 in the axial direction of the lens 21, thereby helping to reduce the thickness of the electronic device 10.

[0056] In some embodiments, the connecting portion 241 is fixedly disposed on the image stabilization drive mechanism 25 and electrically connected to the image sensor 22. At least the trace portion 242 of the first circuit element 24 is made of a flexible material, and at least a portion of the trace portion 242 can deform with the movement of the image stabilization drive mechanism 25 relative to the image stabilization bracket 26. For example, both the trace portion 242 and the connecting portion 241 are flexible circuit boards, or the trace portion 242 is a flexible circuit board, while the connecting portion 241 is a printed circuit board. This configuration can improve the reliability of the electrical connection between the connecting portion 241 and the image sensor 22. At the same time, the trace portion 242 can adapt to deformation with the movement of the image stabilization drive mechanism 25 relative to the image stabilization bracket 26 while being electrically connected to the connecting portion 241, making it less prone to damage during movement and improving the structural reliability of the first circuit element 24.

[0057] Referring to Figures 6 and 7, in some embodiments, the wiring section 242 includes a first wiring structure 2421 and a second wiring structure 2422 connected to each other. The first wiring structure 2421 is fixedly mounted on the image stabilization bracket 26 and located between the lens 21 and the image sensor 22. The two ends of the second wiring structure 2422 are respectively connected to the first wiring structure 2421 and the connecting portion 241. Thus, the two ends of the second wiring structure 2422 are limited by the first wiring structure 2421 and the connecting portion 241, making it less likely for the second wiring structure 2422 to detach from the image stabilization bracket 26 during deformation caused by the movement of the image stabilization drive mechanism 25, thereby improving the structural reliability of the wiring section 242.

[0058] In some embodiments, one end of the second circuit structure 2422 is connected to one edge of the two opposing edges of the connecting portion 241 in the first direction 391, and the other end is connected to the first circuit structure 2421 between the lens 21 and the image sensor 22, such that the second circuit structure 2422 has at least one corner 2423 in the extending direction, and the first direction 391 is perpendicular to the axial direction of the lens 21 and the perpendicular line connecting the lens 21 and the image sensor 22. That is, the second circuit structure 2422 has at least a portion extending along the first direction 391 and a portion extending along the second direction 392. In the embodiment shown in FIG7, the second circuit structure 2422 is composed of two portions extending along the first direction 391 and the second direction 392 respectively, and the corner 2423 is formed between the two portions. Therefore, when the image sensor 22 is moved relative to the image stabilization bracket 26 along the first direction 391 by the image stabilization drive mechanism 25, the portion of the second circuit structure 2422 extending along the second direction 392 will deform in the first direction 391. This portion of the second circuit structure 2422 extending along the first direction 391 serves as a support structure for the second circuit structure 2422. Furthermore, when the image sensor 22 is moved relative to the image stabilization bracket 26 along the second direction 392 by the image stabilization drive mechanism 25, the portion of the second circuit structure 2422 extending along the second direction 392 will deform, causing the portion extending along the first direction 391 to deform. Thus, by rationally planning the shape of the second circuit structure 2422, the stability and reliability of the second circuit structure 2422 moving with the image stabilization drive mechanism 25 in the first and second directions 391 and 392 can be improved, reducing the risk of damage to the second circuit structure 2422.

[0059] Referring to Figures 6, 7, and 8, in some embodiments, the image stabilization bracket 26 includes a base 261, a first housing 262, and an isolator 263. The base 261 is disposed on the optical transmission element 23. The first housing 262 is disposed on the base 261 and surrounds the image sensor 22 circumferentially. The second circuit structure 2422, the image sensor 22, and the image stabilization drive mechanism 25 can all be located within the space enclosed by the first housing 262. The isolator 263 is disposed on the base 261 and located within the space enclosed by the first housing 262. The isolator 263 is located between the lens 21 and the image sensor 22, and at least one end of the isolator 263 is spaced apart from the first housing 262 in the first direction 391, and the isolator 263 is also spaced apart from the first housing 262 in the second direction 392. The portion of the second circuit structure 2422 extending along the second direction 392 passes through the gap between the end of the isolator 263 and the first housing 262. The remaining portion of the second circuit structure 2422, including the portion with the corner 2423, is located between the first housing 262 and the isolator 263 in the second direction 392. This arrangement allows the gap between the end of the isolator 263 and the first housing 262 to guide and limit the sliding of the portion of the second circuit structure 2422 passing through this gap in the second direction 392, and also to limit the sliding of this portion in the first direction 391, making it less likely to disengage from the gap between the end of the isolator 263 and the first housing 262. The space formed by the isolator 263 and the second housing in the second direction 392 can limit the main body of the second circuit structure 2422, making it less likely for the main body of the second circuit structure 2422 to disengage from this space during deformation. This helps to prevent damage to or interference with the image sensor 22's vibration during deformation, improving the structural reliability of the camera module 20.

[0060] Referring again to Figures 6 and 7, in some embodiments, the wiring portion 242 includes two second wiring structures 2422, both of which are connected to the first wiring structure 2421, and are respectively connected to the two opposite edges of the connecting portion 241 in the first direction 391. Therefore, providing two second wiring structures 2422 can meet the wiring travel requirements of the first wiring element 24, reducing the difficulty of setting up the first wiring element 24. Simultaneously, during the movement of the image sensor 22 driven by the image stabilization drive mechanism 25, the two second wiring structures 2422 can exert forces on the connecting portion 241 at its opposite edges in the first direction 391, maintaining the force balance on the two edges of the connecting portion 241, thereby improving the stability of the image sensor 22's movement relative to the optical transmission element 23, which is beneficial for improving the accuracy of optical image stabilization. It is understandable that when the wiring section 242 is provided with two second wiring structures 2422, the two opposite ends of the isolation member 263 are spaced apart from the first shell 262 in the first direction 391, and the two second wiring structures 2422 pass through the gaps between the two ends of the isolation member 263 and the first shell 262 respectively.

[0061] Referring to Figures 9 and 10, in some embodiments, the wiring section 242 may only have one second wiring structure 2422, which simplifies the structural arrangement of the first wiring element 24. In the embodiment shown in Figure 9, the second wiring structure 2422 has two corners 2423. One corner 2423 is formed between the two portions extending along the first direction 391 and the second direction 392, and the other corner 2423 is formed between the two portions extending along the second direction 392. Thus, while providing one second wiring structure 2422, the wiring path of the second wiring structure 2422 can be extended to meet the wiring stroke requirements. The setting of two corners 2423 also helps to improve the reliability of the second wiring structure 2422 when it deforms with the movement of the anti-shake drive mechanism 25.

[0062] In some embodiments, the camera module 20 further includes a reinforcing structure 28, which is fitted onto the corner 2423 of the second circuit structure 2422. The reinforcing structure 28 can be a flexible plastic support structure. The reinforcing structure 28 provides enhanced support for the second circuit structure 2422 at the corner 2423, reducing tensile stress during deformation and thus preventing damage to the second circuit structure 2422 during deformation. In some embodiments, both the second circuit structure 2422 and the connecting portion 241 are made of flexible materials, and the stiffness of the second circuit structure 2422 is less than the stiffness of the connecting portion 241. For example, the stiffness of the second circuit structure 2422 can be made less than the stiffness of the connecting portion 241 by reducing the width of the second circuit structure 2422 or reducing the thickness of the substrate layer or copper layer in the layered structure of the second circuit structure 2422. This not only improves the reliability of the electrical connection between the connector 241 and the image sensor 22, but also makes the second circuit structure 2422 more easily deformable with the movement of the anti-shake drive mechanism 25, reducing the interference of the second circuit structure 2422 on the anti-shake movement of the image sensor 22, and improving the sensitivity and accuracy of anti-shake.

[0063] Referring to Figures 11 and 12, in some embodiments, the wiring portion 242 omits the first wiring structure 2421, and the second wiring structure 2422 includes a first wiring portion 2425, a second wiring portion 2426, and a third wiring portion 2427 connected in sequence. The end of the first wiring portion 2425 away from the second wiring portion 2426 is connected to the connecting portion 241, and the end of the third wiring portion 2427 away from the second wiring portion 2426 is connected to the winding portion 2424. The first wiring portion 2425 extends along a second direction 392, while the second wiring portion 2426 and the third wiring portion 2427 both extend along a first direction 391. The second wiring structure 2422 forms two corners 2423, namely a first corner 2428 and a second corner 2429. The first corner 2428 is formed at the connection between the first wiring portion 2425 and the second wiring portion 2426, and the second corner 2429 is formed at the connection between the second wiring portion 2426 and the third wiring portion 2427. The second corner 2429 is fixed on the image stabilization bracket 26. The first circuit part 2425 and the second circuit part 2426 are movably disposed on the image stabilization bracket 26 and are limited to the second corner 2429 and the connecting part 241.

[0064] Understandably, during the movement of the image stabilization drive mechanism 25 relative to the image stabilization bracket 26, the first circuit portion 2425 and the second circuit portion 2426 of the second circuit structure 2422 can deform with the movement of the image stabilization drive mechanism 25, allowing the first circuit element 24 to adapt to the movement of the image stabilization drive mechanism 25, reducing the risk of damage during movement, and improving the structural reliability of the first circuit element 24. Specifically, the first circuit portion 2425 extending along the second direction 392 provides the first circuit portion 2425 and the second circuit portion 2426 with a deformation degree of freedom along the first direction 391, while the second circuit portion 2426 extending along the first direction 391 provides the first circuit portion 2425 and the second circuit portion 2426 with a deformation degree of freedom along the second direction 392, thereby adapting to the movement of the image stabilization drive mechanism 25 in the first direction 391 and the second direction 392. The second corner 2429 is fixed on the anti-shake bracket 26, which can provide a limiting function for the first circuit part 2425 and the second circuit part 2426, preventing the first circuit part 2425 and the second circuit part 2426 from falling off or deviating excessively as the anti-shake drive mechanism 25 moves, which is beneficial to improving the structural reliability of the first circuit element 24.

[0065] In some embodiments, the second corner 2429 and the third line portion 2427 are both fixed on the image stabilization bracket 26, which will not affect the deformation of the first line portion 2425 and the second line portion 2426, and can also provide a limit for the first line portion 2425 and the second line portion 2426, making the setting of the first line element 24 on the image stabilization bracket 26 more stable and reliable.

[0066] Referring to Figures 12, 13, and 14, in some embodiments, the image stabilization bracket 26 includes a base 261 and a mounting portion 265 disposed on the base 261. The mounting portion 265 is located on the side of the base 261 facing away from the optical transmission element 23 and is situated between the image sensor 22 and the lens 21. The mounting portion 265 can be an integral structure with the base 261, or it can be fixed to the base 261 by any applicable fixing method such as threaded connection or fastening. The second circuit portion 2426 and the third circuit portion 2427 are respectively disposed on opposite sides of the mounting portion 265. The second corner 2429 is fixed to the end of the mounting portion 265, and the third circuit portion 2427 is fixed to the side of the mounting portion 265 facing away from the second circuit portion 2426. The mounting portion 265 provides fixing and support for the second corner 2429 and the third circuit portion 2427, which simplifies the fixing of the first circuit element 24 and improves the structural reliability of the first circuit element 24.

[0067] In some embodiments, the side of the third circuit portion 2427 facing the second circuit portion 2426 is bonded to the side of the mounting portion 265 facing away from the second circuit portion 2426 by means of an adhesive or other component. The second corner 2429 is bonded to the end of the mounting portion 265 by means of an adhesive structure 267, which may be formed by curing an adhesive or other structure.

[0068] Furthermore, in some embodiments, a stepped groove 268 is provided at the end of the mounting portion 265, and at least a portion of the adhesive structure 267 fills the stepped groove 268 to adhere the second corner 2429 to the mounting portion 265. When the first circuit element 24 is disposed on the anti-shake bracket 26, such that the second corner 2429 is opposite to the end of the mounting portion 265, the second corner 2429 is fixed by applying adhesive in the space formed by the stepped groove 268. The stepped groove 268 can increase the placement space of the adhesive structure 267, thereby increasing the bonding area between the adhesive structure 267 and the mounting portion 265 and the second corner 2429, which is beneficial to improving the bonding strength of the second corner 2429.

[0069] Furthermore, referring to Figure 15, in some embodiments, the image stabilization bracket 26 further includes a reinforcing portion 266 connected to the mounting portion 265 and protruding into the stepped groove 268. The reinforcing portion 266 can be an integral structure with the mounting portion 265. The reinforcing portion 266 divides the stepped groove 268 into two spaces, and the adhesive structure 267 covers the surface of the reinforcing portion 266. This helps to increase the coverage area of ​​the adhesive structure 267 on the image stabilization bracket 26, thereby further increasing the bonding area between the adhesive structure 267 and the mounting portion 265, and improving the bonding strength of the first circuit element 24 on the image stabilization bracket 26.

[0070] Referring again to Figures 6 and 7, in some embodiments, the image stabilization drive mechanism 25 is disposed on the base 261 and located within the space enclosed by the first housing 262. The first wiring structure 2421 is connected to the second wiring structure 2422 on the side of the first housing 262 facing the image sensor 22, and extends from the side of the first housing 262 facing the image sensor 22 along the first housing 262 to the side of the first housing 262 facing away from the image sensor 22. That is, the first wiring structure 2421 extends out of the first housing 262 from the position between the lens 21 and the image sensor 22. The image stabilization bracket 26 may also include a cover 264, which covers the first housing 262 and covers the image stabilization drive mechanism 25, the second wiring structure 2422, and the image sensor 22 to provide protection for the components inside the image stabilization bracket 26. A gap may be reserved between the cover 264 and the first housing 262 for the first wiring structure 2421 to extend out.

[0071] In some embodiments, the first circuit element 24 further includes a winding portion 2424, which is connected to the first circuit structure 2421 on the side of the first housing 262 facing away from the image sensor 22. One end of the winding portion 2424, extending away from the first circuit structure 2421, is led out from the camera module 20 to be bound to other circuit structures, thereby enabling electrical connection between the image sensor 22 and external components such as the central processing unit. In some embodiments, the winding portion 2424 is wound around the lens 21 circumferentially to the side of the lens 21 facing away from the image sensor 22, and its end is led out from the side of the lens 21 facing away from the image sensor 22. By using structural components such as the lens barrel of the lens 21, or by using the outer peripheral surface of the housing 331 of the focusing drive mechanism 33 used to drive the lens 21 to move axially to achieve optical focusing, the winding portion 2424 can be wound, thereby improving the space utilization efficiency of the camera module 20 and reducing the space occupied by the camera module 20. At the same time, the winding portion 2424 is wound to the side of the lens 21 opposite to the image sensor 22, and the first circuit element 24 does not occupy the space of the camera module 20 in the first direction 391, which is conducive to reducing the size of the camera module 20 in the first direction 391 and improving the flexibility of the camera module 20 in the electronic device 10. Referring to Figures 16 and 17, in some embodiments, the winding portion 2424 can also be wound along the side of the first housing 262 opposite to the image sensor 22 to one of the opposite sides of the first housing 262 in the first direction 391, and the winding is performed using the outer peripheral surface of the first housing 262, which is also conducive to reducing the size of the camera module 20.

[0072] Referring to Figures 6, 18, 19, and 20, in some embodiments, the image stabilization drive mechanism 25 includes a first carrier 251, a second carrier 252, a first drive component 253, and a second drive component 254. The image sensor 22 is disposed on the first carrier 251, the first carrier 251 is disposed on the second carrier 252, and the second carrier 252 is disposed on the image stabilization bracket 26. The first drive component 253 is used to drive the first carrier 251 and the second carrier 252 to move together relative to the optical transmission element 23 in a second direction 392, thereby driving the image sensor 22 to move relative to the optical transmission element 23 in the second direction 392. The second drive component 254 is used to drive the first carrier 251 to move relative to the second carrier 252 in the first direction 391, thereby driving the image sensor 22 to move relative to the optical transmission element 23 in the first direction 391.

[0073] In some embodiments, both the first driving assembly 253 and the second driving assembly 254 include magnetic elements and electromagnetic elements. The magnetic elements include, but are not limited to, magnets, and the electromagnetic elements include, but are not limited to, coils. One of the magnetic elements and electromagnetic elements of the first driving assembly 253 and one of the magnetic elements and electromagnetic elements of the second driving assembly 254 are fixedly disposed on the first carrier 251, and the other of the magnetic elements and electromagnetic elements of the first driving assembly 253 and the other of the magnetic elements and electromagnetic elements of the second driving assembly 254 are fixedly disposed on the base 261. The first carrier 251 has a first groove 2511 extending along a first direction 391 on the side facing the second carrier 252, and the second carrier 252 has a second groove 2521 extending along a second direction 392 on the side facing the base 261. The first carrier 251 and the second carrier 252 may also be provided with limiting structures 255 respectively. The limiting structure 255 on one of the first carrier 251 and the second carrier 252 is embedded in the limiting structure 255 of the other, so that the first carrier 251 and the second carrier 252 can be mutually limited in the second direction 392. In the embodiment shown in FIG. 20, the limiting structure 255 on the first carrier 251 can be a groove structure recessed towards the second carrier 252, and the limiting structure 255 on the second carrier 252 can be a protrusion structure protruding towards the first carrier 251. The limiting structure 255 on the second carrier 252 is embedded within the limiting structure 255 on the first carrier 251. The anti-shake drive mechanism 25 may also include a sliding support 256, which may include, but is not limited to, a ball bearing. The sliding support 256 is disposed one-to-one on the first groove 2511 and the second groove 2521. The two opposite sides of the sliding support 256 disposed on the first groove 2511 are respectively slidably engaged with the first carrier 251 and the second carrier 252. The two opposite sides of the sliding support 256 disposed on the second groove 2521 are respectively slidably engaged with the second carrier 252 and the base 261.

[0074] It is understandable that the magnetic force generated by the magnetic and electromagnetic elements of the first driving assembly 253, in conjunction with each other, can drive the first carrier 251 to move the image sensor 22 relative to the optical transmission element 23 in the second direction 392. Due to the limiting structure 255, the first carrier 251 and the second carrier 252 are mutually limited in the second direction 392. Therefore, when the first driving assembly 253 drives the first carrier 251 to move relative to the optical transmission element 23 in the second direction 392, the second carrier 252 will move synchronously with the first carrier 251 along the second direction 392, thus sliding relative to the base 261 under the configuration of the sliding support 256 and the second groove 2521. The magnetic force generated by the magnetic and electromagnetic elements of the second driving assembly 254 can drive the first carrier 251 to move the image sensor 22 relative to the second carrier 252 in the first direction 391. The first carrier 251 slides relative to the second carrier 252 under the configuration of the sliding support 256 and the first groove 2511. The aforementioned image stabilization drive mechanism 25 features tight cooperation between its components and a compact structure, effectively reducing the size of the camera module 20 while improving the sensitivity, accuracy, and reliability of optical image stabilization. Of course, multiple first grooves 2511 and second grooves 2521 can be provided to enhance the stability of the relative sliding of the first carrier 251, the second carrier 252, and the base 261. In the embodiment shown in Figure 20, two first grooves 2511 are provided, distributed at the two corners of the first carrier 251, and three second grooves 2521 are provided, distributed on the two sides of the second carrier 252.

[0075] Furthermore, in some embodiments, the first driving component 253 is located between the image sensor 22 and the lens 21. Utilizing the space between the image sensor 22 and the lens 21 to accommodate the first driving component 253 is beneficial to improving the space utilization efficiency of the camera module 20, thereby further compressing the size of the camera module 20.

[0076] Referring to Figures 18 and 20, in some embodiments, the electromagnetic elements of both the first driving assembly 253 and the second driving assembly 254 are generally annular and are both disposed on the first carrier 251. The first driving assembly 253 further includes a first control chip 257, and the second driving assembly 254 further includes a second control chip 258. The first control chip 257 and the second control chip 258 are electrically connected to the connection portion 241. The first control chip 257 is located within the area enclosed by the electromagnetic elements of the first driving assembly 253, and the second control chip 258 is located within the area enclosed by the electromagnetic elements of the second driving assembly 254. The first control chip 257 and the second control chip 258 can both be IC chips, used to control the first driving assembly 253 and the second driving assembly 254 in a one-to-one correspondence, thereby controlling the movement of the anti-shake driving mechanism 25. By placing the first control chip 257 and the second control chip 258 within the range defined by the electromagnetic elements of the first drive assembly 253 and the second drive assembly 254, the internal space of the electromagnetic elements can be utilized to improve the structural compactness of the anti-shake drive mechanism 25 and reduce the space occupied by the anti-shake drive mechanism 25.

[0077] Please refer to Figures 21 and 22. In some embodiments, the first control chip 257 and the second control chip 258 are both disposed outside the electromagnetic elements of the first drive assembly 253 and the second drive assembly 254. For example, the first control chip 257, the second control chip 258, and the electromagnetic elements of the first drive assembly 253 and the second drive assembly 254 are all disposed within the groove of the first carrier 251. The first control chip 257 and the second control chip 258 are located on the same side of the image sensor 22 in the second direction 392. The electromagnetic element of the first drive assembly 253 is disposed on one side of the image sensor 22 in the first direction 391, and the electromagnetic element of the second drive assembly 254 is located on the side of the image sensor 22 in the second direction 392 away from the first control chip 257. This configuration makes full use of the space around the image sensor 22 where the first carrier 251 is located, isolating the first control chip 257 and the second control chip 258 from the electromagnetic components. This helps to reduce the impact of the magnetic fields generated by the first drive assembly 253 and the second drive assembly 254 on the first control chip 257 and the second control chip 258, thereby improving the performance and reliability of the image stabilization drive mechanism 25.

[0078] Referring to Figure 22, in some embodiments, the second carrier 252 includes a connecting arm 2523 and at least two sliding seats 2522. The sliding support 256 is slidably engaged with the sliding seats 2522, and the connecting arm 2523 is connected to two adjacent sliding seats 2522. For example, the second carrier 252 may include three sliding seats 2522 and two connecting arms 2523, wherein the two sliding seats 2522 are spaced apart in a first direction 391 and are correspondingly positioned in a second direction 392, wherein the two sliding seats 2522 are spaced apart in the second direction 392 and are correspondingly positioned in the first direction 391, wherein one connecting arm 2523 extends along the first direction 391 and its two ends are respectively connected to the two sliding seats 2522 spaced apart in the first direction 391, and the other connecting arm 2523 extends along the second direction 392 and its two ends are respectively connected to the two sliding seats 2522 spaced apart in the second direction 392.

[0079] In some embodiments, the magnetic element of the first driving assembly 253 is disposed on the base 261 and located within the space formed by the connecting arm 2523 extending along the second direction 392 and two sliding seats 2522 spaced apart along the second direction 392. The magnetic element of the second driving assembly 254 is disposed on the side of the connecting arm 2523 extending along the first direction 391 facing the first carrier 251. This arrangement allows for a reasonable configuration of the structural layout of the components of the image stabilization driving mechanism 25 and the image stabilization bracket 26, improving structural compactness and reducing the space occupied.

[0080] Please refer to Figures 23, 24, and 25. In some embodiments, when the image stabilization bracket 26 is mounted on the prism bracket 27 for accommodating the optical transmission element 23, the image stabilization bracket 26 has a slot 2611 opposite to the optical transmission element 23. The slot 2611 can be formed on the base 261, and the optical transmission element 23 protrudes from the slot 2611. One of the magnetic element and the electromagnetic element of the first driving assembly 253 is mounted on the image stabilization driving mechanism 25, and the other is mounted on the optical transmission element 23 and positioned corresponding to the slot 2611. This improves the structural compactness of the camera module 20, saves space occupied by the base 261 and the first driving assembly 253 along the axial direction of the lens 21, and, combined with the first driving assembly 253 being positioned between the lens 21 and the image sensor 22, further reduces the size of the camera module 20.

[0081] Referring to Figures 4 and 18, in some embodiments, the camera module 20 further includes a second circuit element 29, a filter 31, and a sensor bracket 32. The image sensor 22 is disposed on and electrically connected to the second circuit element 29. A connection portion 241 is electrically connected to the second circuit element 29. The second circuit element 29 can be a printed circuit board of the image sensor 22, used to realize signal transmission to the second circuit element 29. The sensor bracket 32 ​​is disposed on the second circuit element 29 and surrounds the image sensor 22. The filter 31 is located on the side of the image sensor 22 facing the optical transmission element 23 and is disposed on the sensor bracket 32. The filter 31 includes, but is not limited to, an infrared filter element, used to filter out interference light such as infrared light in the light emitted from the light emission area 2312, preventing interference light from hitting the image sensor 22 and affecting the image quality. In some embodiments, the second circuit element 29, the filter 31, the sensor bracket 32, and the image sensor 22 are integrated on the first carrier 251. During the fabrication of the camera module 20, the second circuit element 29, the filter 31, the sensor bracket 32, and the image sensor 22 can be integrated into a single structure first, and then this integrated structure can be placed on the first carrier 251. This simplifies the fabrication process of the camera module 20, reduces the fabrication difficulty and cost, and also improves the assembly accuracy of the image sensor 22 with other components such as the filter 31, thereby improving the imaging quality. At the same time, during the assembly process, the image sensor 22 and the filter 31 can be supported and protected by the sensor bracket 32 ​​and the second circuit element 29, reducing the risk of damage to the image sensor 22 and the filter 31, and improving the reliability of the structure.

[0082] Referring again to Figures 4 and 6, in some embodiments, the lens 21 includes a first lens group 211 and a second lens group 212 arranged sequentially along the optical path propagation direction. Both the first lens group 211 and the second lens group 212 include one or more lenses with optical power. The first lens group 211 and the second lens group 212 are coaxially arranged. The light collected by the lens 21 is directed onto the optical transmission element 23 after being adjusted sequentially by the first lens group 211 and the second lens group 212. The camera module 20 also includes a focusing drive mechanism 33, which includes, but is not limited to, a voice coil motor. The focusing drive mechanism 33 includes a housing 331 and a moving part 332. The moving part 332 is disposed within the housing 331 and can move relative to the housing 331 along the axial direction of the lens 21 by means of a magnetic field. The first lens group 211 is fixedly mounted on the housing 331, and the second lens group 212 is connected to the moving part 332. When the moving part 332 moves relative to the housing 331, it can drive the second lens group 212 to move relative to the first lens group 211 and the optical transmission element 23, so as to change the focal length of the lens group and realize the optical focusing function. Therefore, the camera module 20 divides the lens 21 into two lens groups. Optical focusing is achieved by driving the second lens group 212 to move, which helps to reduce the load on the focusing drive mechanism 33, thereby reducing the volume of the focusing drive mechanism 33 and the size of the camera module 20. At the same time, by using the second lens group 212 located between the first lens group 211 and the optical transmission element 23 in the optical path propagation direction to achieve moving focus, the movement of the second lens group 212 and at least part of the size of the focusing drive mechanism 33 can utilize the space between the first lens group 211 and the optical transmission element 23, which helps to further reduce the travel of the camera module 20 in the axial direction of the lens 21. In addition, the first lens group 211 is fixedly mounted on the housing 331 of the focusing drive mechanism 33. The use of the focusing drive mechanism 33 to simultaneously support the first lens group 211 and the second lens group 212 also helps to improve the structural compactness of the camera module 20 and further reduce the size of the camera module 20. Furthermore, the arrangement of the focusing drive mechanism 33 driving the second lens group 212 and the image stabilization drive mechanism 25 driving the image sensor 22 allows for the separation of the focusing and image stabilization mechanisms. This ensures that at least a portion of the dimensions of the focusing drive mechanism 33 and the image stabilization drive mechanism 25 overlap along the lens 21 axis, which helps to compress the size of the camera module 20 along the lens 21 axis. It also avoids crosstalk during focusing and image stabilization movements, improving the operational stability and reliability of the camera module 20. The independent arrangement of the image stabilization drive mechanism 25 and the focusing drive mechanism 33 also helps to increase the focusing and image stabilization travel. The internal focusing design also allows the second lens group 212 to achieve focus to macro distance with minimal movement, improving the applicability and shooting quality of the camera module 20.

[0083] In some embodiments, the number of lenses in the second lens group 212 is less than the number of lenses in the first lens group 211. Optical focusing is achieved by moving the second lens group 212, which has fewer lenses, a smaller size, and a lighter weight. This helps to further reduce the load on the focusing drive mechanism 33 and compress the space occupied by the camera module 20. The number of lenses in the first lens group 211 and the second lens group 212 is not limited and can be set according to the imaging requirements of the camera module 20. For example, in some embodiments, the first lens group 211 includes one glass lens and two plastic lenses arranged sequentially along the optical path, and the second lens group 212 includes one plastic lens.

[0084] Please refer to Figures 26, 27, 28, and 29. In some embodiments, the camera module 20 further includes a stabilization circuit carrier 34, a flexible support 35, and a drive module 36. The flexible support 35 is disposed on the stabilization circuit carrier 34, and the image sensor 22 is disposed on the flexible support 35 and electrically connected to the stabilization circuit carrier 34. The drive module 36 is used to drive the image sensor 22 to move relative to the stabilization circuit carrier 34 in at least one direction, namely a first direction 391 and a second direction 392, to achieve optical image stabilization. Figures 26-29 provide another method for driving the image sensor 22 to move in order to achieve optical image stabilization. In this embodiment, the image stabilization circuit carrier 34 is used to realize communication between external components such as the central processing unit and the image sensor 22. The camera module 20 can be electrically connected to external components through a flexible circuit board directly led out from the image stabilization circuit carrier 34. Of course, the flexible circuit board in this embodiment can also be replaced by the first circuit element 24 described in any of the above embodiments. By using the first circuit element 24 in the space between the lens 21 and the image sensor 22, the space utilization efficiency of the camera module 20 can be improved and the size of the camera module 20 can be reduced.

[0085] Referring to Figures 29 and 30, in some embodiments, the flexible support 35 includes a deformable portion 351 and a supporting portion 352. The deformable portion 351 is fixedly disposed on the image stabilization circuit carrier 34, and the supporting portion 352 is connected to the deformable portion 351 and suspended on the image stabilization circuit carrier 34. The image sensor 22 is supported on the supporting portion 352. When the driving module 36 drives the image sensor 22 to move relative to the optical transmission element 23, the image sensor 22 will drive the supporting portion 352 to move, thereby driving the deformable portion 351 to deform and move with the image sensor 22.

[0086] In some embodiments, the deformation part 351 includes a deformation body 3511 and a fixing structure 3512. The deformation body 3511 is disposed axially around the image sensor 22. The fixing structure 3512 is connected to the inner side of the deformation body 3511 and fixedly connected to the image stabilization circuit carrier 34. The deformation body 3511 is located at a distance from the image stabilization circuit carrier 34 on the outer part of the fixing structure 3512. The bearing part 352 is connected to the inner side of the deformation body 3511. With this configuration, the deformation body 3511 can provide effective support for the image sensor 22, improving the structural reliability of the camera module 20. At the same time, the connection area between the deformation body 3511 and the image stabilization circuit carrier 34 is small, allowing it to deform with the movement of the image sensor 22, which is beneficial for the realization of the image stabilization function. In addition, the movement of the image sensor 22 is less likely to interfere with the image stabilization circuit carrier 34.

[0087] The flexible support 35 can be made of any suitable material, including but not limited to titanium-copper alloy, stainless steel, etc., that can provide support for the image sensor 22 and has flexible deformation capabilities. The integrated flexible support 35 provides support for the image sensor 22, and the deformable body 3511 is positioned around the image sensor 22. This also helps reduce the number of parts in the image stabilization mechanism, simplifies its structure, lowers its manufacturing cost, and effectively reduces the size of the camera module 20.

[0088] In some embodiments, the flexible support 35 has two support portions 352, which are respectively connected to two opposite parts of the deformable body 3511 in the second direction 392. The deformable body 3511 has two fixing structures 3512, which are respectively connected to two opposite parts of the deformable body 3511 in the first direction 391. This reduces the connection area between the flexible support 35 and the image stabilization circuit carrier 34 while improving the reliability of the flexible support 35 on the image stabilization circuit carrier 34. Simultaneously, the two support portions 352 can effectively support the image sensor 22, improving the structural reliability of the camera module 20. In some embodiments, the camera module 20 further includes a second circuit element 29, on which the image sensor 22 is disposed and electrically connected. The second circuit element 29 is disposed on the support portion 352 of the flexible support 35 and electrically connected to the image stabilization circuit carrier 34.

[0089] In some embodiments, the camera module 20 further includes a stabilization mount 37, which is disposed on the optical transmission element 23. A stabilization circuit carrier 34 covers the stabilization mount 37. The second circuit element 29, the flexible support 35, and the image sensor 22 are all located within the space formed by the stabilization circuit carrier 34 and the stabilization mount 37. The stabilization mount 37 and the stabilization circuit carrier 34 can provide protection for components such as the image sensor 22, the second circuit element 29, and the flexible support 35. The drive module 36 includes a magnetic element and an electromagnetic element disposed opposite to each other. One of the magnetic element and the electromagnetic element is disposed on the stabilization mount 37, and the other is disposed on the second circuit element 29. The magnetic field force generated by the magnetic element and the electromagnetic element can drive the second circuit element 29 to move the image sensor 22 relative to the optical transmission element 23 to achieve optical image stabilization. In some embodiments, the driving module 36 may be provided in two sets, one set of driving modules 36 is used to drive the image sensor 22 to move relative to the optical transmission element 23 in the first direction 391, and the other set of driving modules 36 is used to drive the image sensor 22 to move relative to the optical transmission element 23 in the second direction 392.

[0090] Referring to Figures 29 and 31, in some embodiments, the camera module 20 further includes an elastic conductive cantilever 38. The elastic conductive cantilever 38 is connected to and electrically connected to the second circuit element 29 and the image stabilization circuit carrier 34. The elastic conductive cantilever 38 can deform with the movement of the second circuit element 29 relative to the image stabilization circuit carrier 34. The elastic conductive cantilever 38 establishes an electrical connection between the second circuit element 29 and the image stabilization circuit carrier 34. The elastic conductive cantilever 38 can elastically deform during the movement of the image sensor 22 relative to the optical transmission element 23, thereby maintaining the stability of the electrical connection between the second circuit element 29 and the image stabilization circuit carrier 34 during the movement of the image sensor 22. The material of the elastic conductive cantilever 38 includes, but is not limited to, silicon wire. For example, it can be a multilayer material composed of silicon and metal materials, as long as it can elastically deform with the movement of the second circuit element 29 and has sufficient strength to prevent breakage or damage during movement.

[0091] In this embodiment, during the assembly of the camera module 20, the image stabilization circuit carrier 34, the second circuit element 29, the image sensor 22, the flexible support 35, and the elastic conductive cantilever 38 can be integrated first and then installed onto the image stabilization mount 37. This also helps to reduce the assembly difficulty of the camera module 20, improve the assembly accuracy, and avoid damage to the image sensor 22, the elastic conductive cantilever 38, and the flexible support 35 during the assembly process.

[0092] Referring to FIG32, FIG32 is a schematic diagram of the structure of an electronic device 10 provided in an embodiment of this application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless Fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509, etc. Those skilled in the art will understand that the structure of the electronic device 10 shown in FIG32 does not constitute a limitation on the electronic device 10, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0093] The radio frequency (RF) circuit 501 can be used to send and receive information, or to receive and send signals during a call. Specifically, it receives downlink information from the base station and hands it over to one or more processors 508 for processing; additionally, it sends uplink data to the base station. Typically, the RF circuit 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a low-noise amplifier (LNA), a duplexer, etc. Furthermore, the RF circuit 501 can also communicate wirelessly with networks and other devices. This wireless communication can use any communication standard or protocol, including but not limited to GSM, GPRS, CDMA, WCDMA, LTE, email, and SMS.

[0094] Memory 502 can be used to store applications and data. The applications stored in memory 502 contain executable code. Applications can be composed of various functional modules. Processor 508 executes various functional applications and data processing by running the applications stored in memory 502. Memory 502 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, applications required for at least one function (such as sound playback, image playback, etc.), etc.; the data storage area may store data created based on the use of electronic device 10 (such as audio data, phonebook, etc.). Furthermore, memory 502 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, memory 502 may also include a memory controller to provide access to memory 502 for processor 508 and input unit 503.

[0095] Input unit 503 can be used to receive input numbers, character information, or user characteristic information (such as fingerprints), and to generate keyboard, mouse, joystick, optical, or trackball signal inputs related to user settings and function control. Specifically, in one embodiment, input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display or touchpad, can collect touch operations performed by the user on or near it (such as operations performed by the user using a finger, stylus, or any suitable object or accessory on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include two parts: a touch detection device and a touch controller. The touch detection device detects the user's touch orientation and the signal generated by the touch operation, transmitting the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into touch point coordinates, sends it to the processor 508, and can receive and execute commands from the processor 508.

[0096] Display unit 504 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of electronic device 10. These graphical user interfaces can be composed of graphics, text, icons, video, and any combination thereof. Display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD), organic light-emitting diode (OLED), or the like. Further, a touch-sensitive surface can cover the display panel. When the touch-sensitive surface detects a touch operation on or near it, it transmits the information to processor 508 to determine the type of touch event. Subsequently, processor 508 provides corresponding visual output on the display panel according to the type of touch event. Although in FIG. 32, the touch-sensitive surface and the display panel are implemented as two separate components to realize input and output functions, in some embodiments, the touch-sensitive surface and the display panel can be integrated to realize input and output functions.

[0097] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor. The ambient light sensor can adjust the brightness of the display panel according to the ambient light level, and the proximity sensor can turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, a gravity acceleration sensor can detect the magnitude of acceleration in various directions (generally three axes). When stationary, it can detect the magnitude and direction of gravity and can be used for applications that recognize the phone's posture (such as landscape / portrait switching, related games, magnetometer posture calibration), vibration recognition-related functions (such as pedometer, tapping), etc. Other sensors that may be configured in the electronic device 10, such as gyroscopes, barometers, hygrometers, thermometers, and infrared sensors, will not be described in detail here.

[0098] Audio circuit 506 provides an audio interface between the user and electronic device 10 via a speaker and microphone. Audio circuit 506 converts received audio data into electrical signals, transmits them to the speaker, and the speaker outputs them as sound signals. Conversely, the microphone converts collected sound signals into electrical signals, which are then received by audio circuit 506, converted back into audio data, and processed by processor 508. The audio data is then transmitted via radio frequency circuit 501 to, for example, another electronic device 10, or output to memory 502 for further processing. Audio circuit 506 may also include a headphone jack to facilitate communication between peripheral headphones and electronic device 10.

[0099] Wi-Fi is a short-range wireless transmission technology. Electronic device 10, through Wi-Fi module 507, can help users send and receive emails, browse web pages, and access streaming media, providing users with wireless broadband internet access. Although Figure 32 shows Wi-Fi module 507, it is understood that it is not a necessary component of electronic device 10 and can be omitted as needed without changing the essence of the invention.

[0100] The processor 508 is the control center of the electronic device 10. It connects various parts of the electronic device 10 via various interfaces and lines. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it performs various functions and processes data of the electronic device 10, thereby providing overall monitoring of the electronic device 10. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into the processor 508.

[0101] The electronic device 10 also includes a power supply 509 that supplies power to the various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, thereby enabling functions such as charging, discharging, and power consumption management through the power management system. The power supply 509 may also include one or more DC or AC power supplies, recharging systems, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0102] Although not shown in Figure 32, the electronic device 10 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or they can be arbitrarily combined and implemented as the same or several entities. For the specific implementation of the above modules, please refer to the previous method embodiments, which will not be described in detail here.

[0103] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0104] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A camera module, comprising: Optical transmission elements; Lens; An image sensor, wherein the image sensor and the lens are disposed on the same side of the optical transmission element and at least partially overlap with the lens in the axial direction of the lens, the optical transmission element being configured to transmit at least a portion of the light emitted from the lens to the image sensor; and, The first circuit element includes a connector and a wiring portion. The connector is electrically connected to the image sensor and fixed relative to the image sensor. The wiring portion is electrically connected to the connector and is at least partially located between the lens and the image sensor.

2. The camera module according to claim 1, wherein, The camera module also includes a stabilization drive mechanism and a stabilization bracket. The stabilization bracket is fixed relative to the optical transmission element. The image sensor is mounted on the stabilization drive mechanism, which is mounted on the stabilization bracket and can drive the image sensor to move relative to the optical transmission element to achieve optical image stabilization.

3. The camera module according to claim 2, wherein, The connecting part is fixedly disposed on the anti-shake drive mechanism. At least the wiring part of the first circuit element is made of flexible material, and at least a portion of the wiring part can deform with the movement of the anti-shake drive mechanism relative to the anti-shake bracket.

4. The camera module according to claim 3, wherein, The wiring section includes a first wiring structure and a second wiring structure that are interconnected. The first wiring structure is fixedly mounted on the image stabilization bracket and located between the lens and the image sensor. The two ends of the second wiring structure are respectively connected to the first wiring structure and the connecting part.

5. The camera module according to claim 4, wherein, One end of the second circuit structure is connected to one of the two opposite edges of the connection portion in a first direction, and the other end is connected to the first circuit structure between the lens and the image sensor, such that the second circuit structure has at least one corner in the extension direction, and the first direction is perpendicular to the axis of the lens and the perpendicular line connecting the lens and the image sensor.

6. The camera module according to claim 5, wherein, The wiring section includes two second wiring structures, which are respectively connected to the two opposite edges of the connection section in the first direction.

7. The camera module according to claim 5, wherein, The image stabilization bracket includes a first housing and an isolator. The first housing is disposed circumferentially around the image sensor. The isolator is disposed between the image sensor and the first housing. At least one end of the isolator is spaced apart from the first housing in a first direction. The isolator is also spaced apart from the first housing in a second direction. A second wiring structure passes between the end of the isolator and the first housing. The corner portion of the second wiring structure is located between the first housing and the isolator in the second direction. The second direction is parallel to the vertical line connecting the lens and the image sensor and is perpendicular to the first direction.

8. The camera module according to claim 4, wherein, The camera module also includes a reinforcement structure, which is fitted onto the corner of the second circuit structure.

9. The camera module according to claim 4, wherein, Both the second circuit structure and the connecting part are made of flexible materials, and the stiffness of the second circuit structure is less than that of the connecting part.

10. The camera module according to claim 4, wherein, The image stabilization bracket includes a base and a first housing. The base is disposed on the optical transmission element, and the image stabilization drive mechanism is disposed on the base. The first housing is connected to the base and is arranged circumferentially around the image sensor. The first circuit structure is connected to the second circuit structure on the side of the first housing facing the image sensor, and extends from the side of the first housing facing the image sensor along the first housing to the side of the first housing facing away from the image sensor.

11. The camera module according to claim 10, wherein, The first circuit element further includes a winding portion, which is connected to the first circuit structure on the side of the first housing facing away from the image sensor, and the end of the winding portion that extends away from the first circuit structure in the extension direction is led out from the camera module.

12. The camera module according to claim 11, wherein, The winding portion is wound around the lens circumferentially to the side of the lens facing away from the image sensor, and the end is led out from the side of the lens facing away from the image sensor.

13. The camera module according to claim 11, wherein, The winding portion winds around the side of the first housing opposite to the image sensor to one side of the two opposite sides of the first housing in a first direction, the first direction being perpendicular to the axis of the lens and the perpendicular line connecting the lens and the image sensor.

14. The camera module according to claim 3, characterized in that, The wiring section includes a first wiring section, a second wiring section, and a third wiring section connected in sequence. The end of the first wiring section away from the second wiring section is connected to the connecting section. The extension direction of the first wiring section intersects with the extension directions of the second wiring section and the third wiring section. A first corner is formed between the first wiring section and the second wiring section, and a second corner is formed between the second wiring section and the third wiring section. The second corner is fixed to the image stabilization bracket.

15. The camera module according to claim 14, characterized in that, The image stabilization bracket includes a base and a mounting portion disposed on the base. The mounting portion is located between the image sensor and the lens. The second circuit portion and the third circuit portion are disposed on opposite sides of the mounting portion. The second corner is fixed to the end of the mounting portion, and the third circuit portion is fixed to the side of the mounting portion opposite to the second circuit portion.

16. The camera module according to claim 15, characterized in that, The mounting portion has a stepped groove at its end, and the camera module also includes an adhesive structure, at least part of which fills the stepped groove to adhere the second corner to the mounting portion.

17. The camera module according to claim 16, characterized in that, The anti-shake bracket also includes a reinforcing part connected to the mounting part and protruding into the stepped groove. The reinforcing part divides the stepped groove into two grooves, and the adhesive structure covers the surface of the reinforcing part.

18. The camera module according to claim 2, wherein, The image stabilization drive mechanism includes a first carrier, a second carrier, a first drive component, and a second drive component. The image sensor is mounted on the first carrier, the first carrier is mounted on the second carrier, and the second carrier is mounted on the image stabilization bracket. The first drive component is used to drive the first carrier and the second carrier to move together relative to the optical transmission element in a second direction. The second drive component is used to drive the first carrier to move relative to the second carrier in a first direction. The second direction is parallel to the vertical line connecting the lens and the image sensor, and the first direction is perpendicular to the axis of the lens and the second direction.

19. The camera module according to claim 18, wherein, The first driving component is located between the image sensor and the lens.

20. The camera module according to claim 18, wherein, The image stabilization bracket has a hollowed-out slot opposite to the optical transmission element. The first driving component includes a magnetic element and an electromagnetic element. One of the magnetic element and the electromagnetic element is disposed on the first carrier or the second carrier, and the other is disposed on the optical transmission element and is arranged corresponding to the hollowed-out slot.

21. The camera module according to claim 18, wherein, The camera module further includes a second circuit element, a filter, and a sensor bracket. The image sensor is disposed on the second circuit element, and the sensor bracket is disposed on the second circuit element and arranged around the image sensor. The filter is located on the side of the image sensor facing the optical transmission element and is disposed on the sensor bracket. The second circuit element, the filter, the sensor bracket, and the image sensor are integrated on the first carrier.

22. The camera module according to claim 18, wherein, The first driving component includes an electromagnetic element and a first control chip, and the second driving component includes an electromagnetic element and a second control chip. The electromagnetic elements of the first driving component and the second driving component are both disposed on the first carrier, and the first control chip and the second control chip are both located outside the electromagnetic elements of the first driving component and the second driving component.

23. The camera module according to claim 22, wherein, The first control chip and the second control chip are located on the same side of the image sensor in the second direction, the first driving component is located on one side of the image sensor in the first direction, and the second driving component is located on the side of the image sensor away from the first control chip and the second control chip in the second direction.

24. The camera module according to claim 18, wherein, The second carrier includes a connecting arm and at least two sliding seats. The opposite sides of the sliding seats are slidably engaged with the first carrier and the anti-shake bracket through sliding supports. The connecting arm is connected to two adjacent sliding seats. The magnetic element of the second driving component is disposed on the connecting arm, and the magnetic element of the first driving component is disposed on the anti-shake bracket.

25. The camera module according to claim 1, wherein, The lens includes a first lens group and a second lens group arranged sequentially along the optical path propagation direction. The camera module also includes a focusing drive mechanism, which includes a housing and a moving part. The moving part is capable of moving relative to the housing along the axial direction of the lens. The first lens group is fixedly mounted on the housing, and the second lens group is connected to the moving part.

26. The camera module according to claim 25, wherein, The second lens group has fewer lenses than the first lens group.

27. The camera module according to claim 1, wherein, The camera module also includes a stabilization circuit carrier, a flexible support, and a drive module. The flexible support is disposed on the stabilization circuit carrier, the image sensor is disposed on the flexible support and electrically connected to the stabilization circuit carrier, and the drive module is used to drive the image sensor to move relative to the stabilization circuit carrier to achieve optical image stabilization.

28. The camera module according to claim 27, wherein, The flexible support includes a deformable part and a load-bearing part. The deformable part is fixedly disposed on the anti-shake circuit carrier, and the load-bearing part is connected to the deformable part and suspended on the anti-shake circuit carrier. The image sensor is supported on the load-bearing part.

29. The camera module according to claim 28, wherein, The deformation part includes a deformation body and a fixing structure. The deformation body is arranged around the image sensor in the circumferential direction. The fixing structure is connected to the inner side of the deformation body and fixedly connected to the image stabilization circuit carrier. The portion of the deformation body located outside the fixing structure is spaced apart from the image stabilization circuit carrier. The bearing part is connected to the inner side of the deformation body.

30. The camera module according to claim 29, wherein, The flexible support member has two bearing portions, which are respectively connected to two opposite parts of the deformable body in a second direction. The deformable portion has two fixing structures, which are respectively connected to two opposite parts of the deformable body in a first direction. The second direction is parallel to the vertical line connecting the lens and the image sensor, and the first direction is perpendicular to the axis of the lens and the second direction.

31. The camera module according to claim 27, wherein, The camera module also includes a second circuit element, the image sensor is disposed on the second circuit element and electrically connected to the second circuit element, the second circuit element is supported on the flexible support member and electrically connected to the image stabilization circuit carrier.

32. The camera module according to claim 31, wherein, The camera module also includes an elastic conductive cantilever, which is connected to the second circuit element and the image stabilization circuit carrier. The elastic conductive cantilever is electrically connected to the second circuit element and the image stabilization circuit carrier and can deform with the movement of the second circuit element relative to the image stabilization circuit carrier.

33. The camera module according to claim 31, wherein, The camera module also includes a stabilization mount, which is disposed on the optical transmission element. The stabilization circuit carrier is disposed on the stabilization mount. The driving module includes a magnetic element and an electromagnetic element disposed opposite to each other. One of the magnetic element and the electromagnetic element is disposed on the stabilization mount, and the other is disposed on the second circuit element.

34. An electronic device comprising a camera module as described in any one of claims 1-33.

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