An ultrafast laser processing system and method capable of continuously adjusting the inclination of micro-groove sidewalls
By combining a dual-beam adjustable tilting movement device and a three-dimensional motion platform, stepless control of the tilt angle of the microgroove sidewall is achieved, solving the problem of controlling the tilt angle of the microgroove sidewall in traditional laser processing and improving processing efficiency and accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XI AN JIAOTONG UNIV
- Filing Date
- 2024-01-11
- Publication Date
- 2026-07-21
AI Technical Summary
Traditional laser processing methods have difficulty controlling the inclination of the sidewalls of microgrooves, especially rectangular microgrooves, resulting in low processing accuracy and efficiency, and making it difficult to achieve microgrooves with regular rectangular cross-sections.
A dual-beam adjustable tilting and moving device is adopted. By adjusting the included angle of the two beams and the spacing of the converging beams, the tilt of the microgroove sidewall can be infinitely controlled. Combined with a three-dimensional motion platform, the microgroove can be processed efficiently.
It achieves reliable control of the inclination of the microgroove sidewalls, expands the inclination adjustment range, and enables the processing of irregular interfaces and microgrooves with negative inclination, thereby improving processing efficiency and accuracy.
Smart Images
Figure CN117600646B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of laser processing technology, specifically relating to an ultrafast laser processing system and method with stepless adjustable microgroove sidewall inclination. Background Technology
[0002] With the development of new energy vehicles, photovoltaic power generation, rail transportation, smart grids, aerospace and other fields, the requirements for power electronic devices and microelectromechanical systems (MEMS) in terms of high efficiency, high reliability, miniaturization and lightweight are becoming increasingly stringent. Rectangular microchannels are one of the most common basic processing requirements in power electronic devices and MEMS, and their processing quality will significantly affect the performance of the final fabricated microdevices.
[0003] Traditional machining methods such as mechanical, electrical discharge, and electrolytic processes are selective in materials, have low efficiency, low yield, poor precision, and limited processing dimensions. Ultrafast laser processing is stress-free, applicable to any material, and has high precision and high processing resolution. However, previous laser processing methods used a single beam to process the workpiece surface vertically from top to bottom. The resulting microgrooves had inclined sidewalls and "V"-shaped cross-sections (Gao Xianming, Guo Ningbo, Zhang Gongxue, et al. Experimental study on microgrooves in laser micro-nano processing [J]. Journal of Shaanxi University of Science and Technology, 2023, 41(01): 138-143.; Wei Xinyu, Wen Qiuling, Lu Jing, et al. Optimization of process parameters for diamond microgrooves processed by ultraviolet nanosecond laser [J]. Chinese Journal of Lasers, 2022, 49(10): 96-106.). The control of the sidewall inclination was greatly limited, making it difficult to manufacture microgrooves with regular rectangular cross-sections. Summary of the Invention
[0004] In order to overcome the shortcomings of the prior art, the present invention aims to provide an ultrafast laser processing system and method with stepless adjustable microgroove sidewall inclination, realizing laser processing of rectangular microgrooves and adjusting the microgroove sidewall inclination; the inclination of both sidewalls can be adjusted simultaneously to achieve efficient and controllable processing of rectangular microgrooves, microgrooves with other sidewall inclinations, and even microgrooves with negative inclination.
[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:
[0006] An ultrafast laser processing system with stepless adjustable microgroove sidewall tilt includes a laser 1. The laser beam emitted from the laser 1 is split into two beams after passing through a beam splitter 8, where beam 1 is parallel to the X-axis and beam 2 is parallel to the Y-axis. Beam 1 is reflected by a first reflector 7 and then emitted parallel to the Y-axis. The two beams are perpendicularly incident into a dual-beam adjustable tilting device 4. After the beams are adjusted by the dual-beam adjustable tilting device 4, the two beams pass through a second reflector 9 and a third reflector 10, and then through a first convex lens 11 and a second convex lens 12, respectively, and converge at a certain angle and a certain distance onto the surface of the workpiece 6 to be processed. The workpiece 6 is clamped on a three-dimensional motion platform 5. The focal point of the two converging beams moves relative to the workpiece 6, realizing laser etching of microgrooves on the surface.
[0007] The beam splitter 8 is installed in the cube mirror frame 3, the first reflecting mirror 7 is installed in the first 45° reflecting mirror frame 2, and the first convex lens 11 and the second convex lens 12 have the same focal length.
[0008] The dual-beam adjustable tilting and moving device 4 includes a fixed base 4-1, on which a translational base 4-2 is mounted. The translational base 4-2 is connected to the fixed base 4-1 via a guide rail and can move on the guide rail of the fixed base 4-1. A first rotating base 4-3-1 is connected to the translational base 4-2. A second reflector 9 is mounted on the first rotating base 4-3-1 via a second 45° reflector frame 4-3-2. The second 45° reflector frame 4-3-2 is connected to the upper end of a first support rod assembly 4-3-5. The middle part of the first support rod assembly 4-3-5 passes through a first fixed bracket 4-3-3, which is connected to the first rotating base 4-3-1. A first convex lens 11 is mounted on the lower end of the first support rod assembly 4-3-5 via a first coaxial lens frame 4-3-4.
[0009] A second rotating base 4-4-1 is connected to a fixed base 4-1. A third reflector 10 is mounted on the second rotating base 4-4-1 via a third 45° reflector bracket 4-4-2. The third 45° reflector bracket 4-4-2 is connected to the upper end of a second support rod assembly 4-4-5. The middle part of the second support rod assembly 4-4-5 passes through a second fixed bracket 4-4-3. The second fixed bracket 4-4-3 is connected to the second rotating base 4-4-1. A second convex lens 12 is mounted on the lower end of the second fixed bracket 4-4-3 via a second coaxial lens bracket 4-4-4.
[0010] The first rotating base 4-3-1 and the second rotating base 4-4-1 can rotate around their respective rotation axes, i.e., the incident beam.
[0011] The second 45° reflecting mirror frame 4-3-2, the first fixed bracket 4-3-3, the first coaxial mirror frame 4-3-4, and the first support rod assembly 4-3-5 rotate with the first rotating base 4-3-1 about the beam 1 as the axis in the XZ plane; the translation base 4-2 translates along the X-axis on the fixed base 4-1; the first 45° reflecting mirror frame 2 is connected to the translation base 4-2 in the dual-beam adjustable tilting moving device 4 through the support rod assembly and can translate with the translation base; the third 45° reflecting mirror frame 4-4-2, the second fixed bracket 4-4-3, the second coaxial mirror frame 4-4-4, and the second support rod assembly 4-4-5 rotate with the second rotating base 4-4-1 about the beam 2 as the axis in the XZ plane.
[0012] The fixed base 4-1 and the translational base 4-2 are machined with rotation limiting grooves. The first rotating base 4-3-1 and the second rotating base 4-4-1 are machined with auxiliary positioning rods. The top of the auxiliary positioning rods is threaded. The auxiliary positioning rods cooperate with the rotation limiting grooves and slide within the rotation limiting grooves. The position of the rotating bases is fixed by the first fixing nut 4-3-7 and the second fixing nut 4-4-7.
[0013] The translational base 4-2, the fixed base 4-1, and the rotating base are provided with light-transmitting holes, and the incident light beam always maintains a coaxial relationship with the light-transmitting holes; after passing through the light-transmitting holes, the incident light beam is projected onto the second reflector 9 and the third reflector 10 respectively.
[0014] During the rotation of the first rotating base 4-3-1 and the second rotating base 4-4-1, their rotation axes are the incident beams. The beams reflected by the second reflector 9 and the third reflector 10 will always be emitted parallel to the direction of the first support rod group 4-3-5 and the second support rod group 4-4-5. When the rotating base rotates by an angle θ relative to the YZ plane, the two emitted beams also rotate by an angle θ.
[0015] The dual-beam adjustable tilting and moving device 4 can steplessly adjust the relative angle φ between the two beams and the relative distance W between the converging spots of the two beams, and can steplessly adjust the angle θ between the two beams relative to the surface of the workpiece to be processed.
[0016] The method using the ultrafast laser processing system with stepless adjustable microgroove sidewall inclination includes the following steps:
[0017] S1. Clamp the workpiece 6 to be processed onto the three-dimensional motion platform 5;
[0018] S2. Adjust the rotation angle of the first rotating base 4-3-1 and the second rotating base 4-4-1 according to the required microgroove sidewall inclination and microgroove width, so that the angle θ between the main beam of the focused laser beam and the surface of the workpiece 6 to be processed and the relative angle φ between the two beams reach the required values, and tighten the first fixing nut 4-3-7 and the second fixing nut 4-4-7 to fix the position of the rotating base.
[0019] S3. Move the translation base 4-2 to bring the two beam convergence spots closer together, and fine-tune the relative distance W between the two beam convergence spots as needed;
[0020] S4. Move the workpiece 6 to be processed so that the laser beam is focused on the surface to be processed, or has a certain defocus distance;
[0021] S5. By translating the three-dimensional motion platform 5, a microgroove with controllable sidewall inclination is processed.
[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0023] This invention discloses an ultrafast laser processing system with stepless adjustment of the microgroove sidewall inclination. The system controls the sidewall inclination of the microgroove by adjusting the relative inclination of the focused laser beam to the processing surface, resulting in a simple and reliable control method. The system allows for stepless adjustment of the microgroove sidewall inclination with a wide controllable range. It enables separate adjustment of the inclination of each sidewall to process irregularly shaped interface microgrooves. It can process microgrooves with negative inclination, including micro-dovetail grooves within a certain negative inclination range. Furthermore, it allows simultaneous adjustment of the inclination of both sidewalls within a single processing step, eliminating the need for multiple processing steps and resulting in high efficiency. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the ultrafast laser processing system of the present invention.
[0025] Figure 2 This is a schematic diagram of the light path and optical components in the ultrafast laser processing system of the present invention.
[0026] Figure 3 This is a schematic diagram of the dual-beam adjustable tilting and moving device.
[0027] Figure 4 This is a partial cross-sectional view of the dual-beam adjustable tilting and moving device in the plane where beam 1 is located.
[0028] Figure 5 This is a partial cross-sectional view of the dual-beam adjustable tilting and moving device in the plane where beam 2 is located.
[0029] Figure 6 This is a schematic diagram illustrating the principle of using dual tilting beams to adjust the tilt of the microgroove sidewalls. Detailed Implementation
[0030] The technical solutions in the embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
[0031] Reference Figure 1 , Figure 2 An ultrafast laser processing system with stepless adjustable microgroove sidewall tilt angle includes a laser 1. The laser beam emitted from the laser 1 is split into two beams after passing through a beam splitter 8, where beam 1 is parallel to the X-axis and beam 2 is parallel to the Y-axis. Beam 1 is reflected by a first reflector 7 and then emitted parallel to the Y-axis. The two beams are perpendicularly incident into a dual-beam adjustable tilting device 4. After the beams are adjusted by the dual-beam adjustable tilting device 4, the two beams pass through a second reflector 9 and a third reflector 10, and then through a first convex lens 11 and a second convex lens 12, respectively, and converge at a certain angle and a certain distance onto the surface of the workpiece 6 to be processed. The workpiece 6 is clamped on a three-dimensional motion platform 5. The focal point of the two converging beams moves relative to the workpiece 6, realizing laser etching of microgrooves on the surface.
[0032] The beam splitter 8 is installed in the cube mirror frame 3, the first reflecting mirror 7 is installed in the first 45° reflecting mirror frame 2, and the first convex lens 11 and the second convex lens 12 have the same focal length.
[0033] Reference Figure 3 , Figure 4 , Figure 5 The dual-beam adjustable tilting and moving device 4 includes a fixed base 4-1, on which a translational base 4-2 is mounted. The translational base 4-2 is connected to the fixed base 4-1 via a guide rail and can move on the guide rail of the fixed base 4-1. A first rotating base 4-3-1 is connected to the translational base 4-2 via a first deep groove ball bearing 4-3-6. A second 45° reflecting mirror frame 4-3-2 is connected to the first rotating base 4-3-1. A second reflector 9 is mounted on the 45° reflector frame 4-3-2; the second 45° reflector frame 4-3-2 is connected to the upper end of the first support rod assembly 4-3-5, the middle part of the first support rod assembly 4-3-5 passes through the first fixed bracket 4-3-3, the first fixed bracket 4-3-3 is connected to the first rotating base 4-3-1; the lower end of the first support rod assembly 4-3-5 is connected to the first coaxial mirror frame 4-3-4, and a first convex lens 11 is mounted on the first coaxial mirror frame 4-3-4;
[0034] A second rotating base 4-4-1 is connected to a fixed base 4-1 via a second deep groove ball bearing 4-4-6. A third 45° reflector mount 4-4-2 is connected to the second rotating base 4-4-1. A third reflector 10 is mounted on the third 45° reflector mount 4-4-2. The third 45° reflector mount 4-4-2 is connected to the fixed base 4-1 via a second fixing nut 4-4-7. The third 45° reflector mount 4-4-2 is connected to the upper end of the second support rod assembly 4-4-5. The middle part of the second support rod assembly 4-4-5 passes through the second fixed bracket 4-4-3. The second fixed bracket 4-4-3 is connected to the second rotating base 4-4-1. A second coaxial lens mount 4-4-4 is connected to the lower end of the second fixed bracket 4-4-3. A second convex lens 12 is mounted on the second coaxial lens mount 4-4-4.
[0035] The first rotating base 4-3-1 and the second rotating base 4-4-1 can rotate around their respective rotation axes, i.e., the incident beam.
[0036] The third 45° reflecting mirror frame 4-4-2, the second fixed bracket 4-4-3, the second coaxial mirror frame 4-4-4, the second support rod assembly 4-4-5, the second deep groove ball bearing 4-4-6, and the second fixing nut 4-4-7 are fixed on the second rotating base 4-4-1 and rotate with the second rotating base 4-4-1 about the beam 2 as the axis in the XZ plane; the translation base 4-2 can translate along the X-axis on the fixed base 4-1 within a certain range; the first 45° reflecting mirror frame 2 is connected to the translation base 4-2 in the dual beam adjustable tilting moving device 4 through the support rod assembly and can translate with the translation base. The second 45° reflecting mirror frame 4-3-2, the first fixed bracket 4-3-3, the first coaxial mirror frame 4-3-4, the first support rod group 4-3-5, the first deep groove ball bearing 4-3-6, and the first fixing nut 4-3-7 are fixed on the first rotating base 4-3-1. They can rotate with the first rotating base 4-3-1 about the beam 1 as the axis in the XZ plane, and translate along the X-axis with the translation base 4-2. During the translation, the beam 1 is turned by the first reflecting mirror 7, and always maintains the coaxial relationship with the light passage of the translation base 4-2.
[0037] The fixed base 4-1 and the translation base 4-2 are machined with rotation limiting grooves. The first rotating base 4-3-1 and the second rotating base 4-4-1 are machined with auxiliary positioning rods. The top of the auxiliary positioning rods is threaded. The auxiliary positioning rods cooperate with the rotation limiting grooves and slide within the rotation limiting grooves. The position of the rotating bases can be fixed by the first fixing nut 4-3-7 and the second fixing nut 4-4-7.
[0038] The translational base 4-2, the fixed base 4-1, and the rotating base are provided with light-transmitting holes, and the incident light beam always maintains a coaxial relationship with the light-transmitting holes; after passing through the light-transmitting holes, the incident light beam is projected onto the second reflector 9 and the third reflector 10 respectively.
[0039] Reference Figure 6 During the rotation of the first rotating base 4-3-1 and the second rotating base 4-4-1, their rotation axes are the incident beams. The beams reflected by the second reflector 9 and the third reflector 10 will always be emitted parallel to the direction of the first support rod group 4-3-5 and the second support rod group 4-4-5. When the rotating base rotates relative to the YZ plane by an angle θ, the two emitted beams also rotate by an angle θ.
[0040] Reference Figure 6 The dual-beam adjustable tilting device 4 can steplessly adjust the relative angle φ between the two beams and the relative distance W between the converging spots of the two beams, and can steplessly adjust the angle θ between the two beams relative to the surface to be processed.
[0041] The method using the ultrafast laser processing system with stepless adjustable microgroove sidewall inclination includes the following steps:
[0042] S1. Clamp the workpiece 6 to be processed onto the three-dimensional motion platform 5;
[0043] S2. Adjust the rotation angle of the first rotating base 4-3-1 and the second rotating base 4-4-1 according to the required microgroove sidewall inclination and microgroove width, so that the angle θ between the main beam of the focused laser beam and the surface of the workpiece 6 to be processed and the relative angle φ between the two beams reach the required values, and tighten the first fixing nut 4-3-7 and the second fixing nut 4-4-7 to fix the position of the rotating base.
[0044] S3. Move the translation base 4-2 to bring the two beam convergence spots closer together, and fine-tune the relative distance W between the two beam convergence spots as needed;
[0045] S4. Move the workpiece 6 to be processed on the Z-axis so that the laser beam is focused on the surface to be processed, or has a certain defocus distance;
[0046] S5. By translating the three-dimensional motion platform 5 along the Y-axis, a microgroove with controllable sidewall inclination along the Y-axis is machined.
Claims
1. An ultrafast laser processing system with stepless adjustable microgroove sidewall inclination, comprising a laser (1), characterized in that: The laser beam emitted from the laser (1) is split into two beams after passing through the beam splitter (8). One beam is parallel to the X-axis and the other beam is parallel to the Y-axis. The first beam is reflected by the first reflector (7) and then emitted parallel to the Y-axis. The two beams are perpendicularly incident into the dual-beam adjustable tilting device (4). After the dual-beam adjustable tilting device (4) controls the two beams, the two beams pass through the second reflector (9) and the third reflector (10) respectively, and then through the first convex lens (11) and the second convex lens (12) to converge at a certain angle and a certain distance onto the surface of the workpiece (6) to be processed. The workpiece (6) to be processed is clamped on the three-dimensional motion platform (5). The focal point of the two converging beams moves relative to the workpiece (6) to achieve laser etching of surface microgrooves. The dual-beam adjustable tilting and moving device (4) includes a fixed base (4-1), on which a translational base (4-2) is mounted. The translational base (4-2) is connected to the fixed base (4-1) via a guide rail and can move on the guide rail of the fixed base (4-1). A first rotating base (4-3-1) is connected to the translational base (4-2), and a second 45° reflecting mirror frame (4-3-1) is mounted on the first rotating base (4-3-1). 3-2) A second reflector (9) is installed; the second 45° reflector frame (4-3-2) is connected to the upper end of the first support rod assembly (4-3-5), the middle part of the first support rod assembly (4-3-5) passes through the first fixed bracket (4-3-3), the first fixed bracket (4-3-3) is connected to the first rotating base (4-3-1); the lower end of the first support rod assembly (4-3-5) is equipped with a first convex lens (11) via the first coaxial mirror frame (4-3-4); A second rotating base (4-4-1) is connected to a fixed base (4-1). A third reflector (10) is mounted on the second rotating base (4-4-1) via a third 45° reflector frame (4-4-2). The third 45° reflector frame (4-4-2) is connected to the upper end of a second support rod assembly (4-4-5). The middle part of the second support rod assembly (4-4-5) passes through a second fixed bracket (4-4-3). The second fixed bracket (4-4-3) is connected to the second rotating base (4-4-1). A second convex lens (12) is mounted on the lower end of the second fixed bracket (4-4-3) via a second coaxial mirror frame (4-4-4). The first rotating base (4-3-1) and the second rotating base (4-4-1) rotate around their respective rotation axes, i.e., the incident beam.
2. The ultrafast laser processing system according to claim 1, characterized in that: The beam splitter (8) is installed in the cube mirror frame (3), the first reflecting mirror (7) is installed in the first 45° reflecting mirror frame (2), and the first convex lens (11) and the second convex lens (12) have the same focal length.
3. The ultrafast laser processing system according to claim 1, characterized in that: The second 45° reflector frame (4-3-2), the first fixed bracket (4-3-3), the first coaxial frame (4-3-4), and the first support rod group (4-3-5) rotate with the first rotating base (4-3-1) about the first beam axis in the XZ plane; the translation base (4-2) translates along the X-axis on the fixed base (4-1); the first 45° reflector frame (2) is connected to the translation base (4-2) in the dual-beam adjustable tilting moving device (4) through the support rod group and can translate with the translation base; the third 45° reflector frame (4-4-2), the second fixed bracket (4-4-3), the second coaxial frame (4-4-4), and the second support rod group (4-4-5) rotate with the second rotating base (4-4-1) about the second beam axis in the XZ plane.
4. The ultrafast laser processing system according to claim 1, characterized in that: Rotational limiting grooves are machined on the fixed base (4-1) and the translational base (4-2). Auxiliary positioning rods are machined on the first rotating base (4-3-1) and the second rotating base (4-4-1). The top of the auxiliary positioning rod has a thread. The auxiliary positioning rod cooperates with the rotational limiting groove and slides in the rotational limiting groove. The positions of the first rotating base (4-3-1) and the second rotating base (4-4-1) are fixed by the first fixing nut (4-3-7) and the second fixing nut (4-4-7) respectively.
5. The ultrafast laser processing system according to claim 1, characterized in that: The translational base (4-2), the fixed base (4-1), and the rotating base are provided with light-transmitting holes, and the incident beam always maintains a coaxial relationship with the light-transmitting holes; after passing through the light-transmitting holes, the incident beam is projected onto the second reflector (9) and the third reflector (10) respectively.
6. The ultrafast laser processing system according to claim 1, characterized in that: During the rotation of the first rotating base (4-3-1) and the second rotating base (4-4-1), their axes of rotation are the incident light beams; the light beams reflected by the second reflector (9) and the third reflector (10) will always be emitted parallel to the directions of the first support rod group (4-3-5) and the second support rod group (4-4-5). When the first rotating base (4-3-1) and the second rotating base (4-4-1) rotate relative to the YZ plane by an angle θ At the same time, the two emitted beams also rotate at an angle. θ .
7. The ultrafast laser processing system according to claim 1, characterized in that: The dual-beam adjustable tilting device (4) continuously adjusts the relative angle between the two beams. φ and the relative distance between the converging beams of the two beams W The angle between the two beams relative to the surface of the workpiece to be machined is infinitely adjustable. θ .
8. A method for using an ultrafast laser processing system with steplessly adjustable microgroove sidewall inclination as described in any one of claims 1-7, characterized in that, Includes the following steps: S1. Clamp the workpiece (6) to be processed onto the three-dimensional motion platform (5); S2. Adjust the rotation angle of the first rotating base (4-3-1) and the second rotating base (4-4-1) according to the required microgroove sidewall inclination and microgroove width, so that the angle between the main beam of the focused laser beam and the surface of the workpiece (6) to be processed is adjusted. θ The relative angle between the two beams φ Once the desired value is reached, tighten the first fixing nut (4-3-7) and the second fixing nut (4-4-7) to fix the positions of the first rotating base (4-3-1) and the second rotating base (4-4-1) respectively; S3. Move the translation base (4-2) to bring the convergent beam spots of the two beams closer together, and fine-tune the relative distance between the convergent beam spots of the two beams as needed. W ; S4. Move the workpiece to be processed (6) so that the two beams can focus on the surface to be processed, or have a certain defocus distance; S5. Through the translation of the three-dimensional motion platform (5), a micro-groove with controllable sidewall inclination is processed.