Prober

Abstract

This prober comprises: a partition wall that separates an inspection space from an external space; an exhaust port that is formed in the partition wall and is configured to be openable and closable by a shutter; and a fan that is provided in the exhaust port and discharges air in the inspection space to the external space. The air discharged by the fan is brought into contact with refrigerant piping installed in the external space. By installing the fan at a position separated from the partition wall by a predetermined distance, a ventilation opening for sending the air to the fan not only from the inspection space but also from the external space is formed.

Description

Prober

[0001] The present invention relates to a prober for inspecting devices formed on a wafer.

[0002] In the pre-process of semiconductor manufacturing, a wafer on which a large number of devices are formed is divided into a plurality of chips for each device in the dicing process. Prior to the dicing process, probing is performed to remove defective products from the devices on the wafer. Probing is a wafer-level inspection that identifies defective products by inspecting the electrical characteristics of the devices formed on the wafer. The device that performs this probing is a prober (see Patent Document 1).

[0003] Japanese Unexamined Patent Application Publication No. 2018 - 49989

[0004] Since probing is performed in consideration of the actual use environment to ensure the functionality of the device, it is sometimes performed in a low-temperature environment depending on the specifications of the device. The low-temperature environment is created by flowing a low-temperature coolant through an internal passage of a stage (wafer chuck) on which the wafer is placed to cool the wafer (hereinafter, this coolant is also referred to as "refrigerant" and the internal passage as "refrigerant passage"). A cooling device (hereinafter, referred to as a "chiller") is installed near the prober. The refrigerant flows through a refrigerant circulation passage connecting the prober and the chiller and is cooled when passing through the chiller. The low-temperature refrigerant flows from the chiller into the prober through a pipe (hereinafter, referred to as a "refrigerant pipe") installed in the external space.

[0005] During low-temperature measurement, since low-temperature refrigerant flows through the refrigerant pipe, condensation is likely to occur on the surface of the refrigerant pipe. If the condensation is left unattended, the floor surface will be soiled by water droplets falling from the surface of the refrigerant pipe. To prevent condensation, in addition to wrapping a heat insulating material around the refrigerant pipe, measures such as continuously blowing outside air or dry air onto the refrigerant pipe using a fan are taken. However, to implement these measures, it is necessary to add fans along the path of the refrigerant pipe and add outlets for dry air, which increases the cost.

[0006] This invention was made in view of these circumstances, and one of its objectives is to reduce condensation in the refrigerant piping that supplies refrigerant to the prober, while keeping costs down.

[0007] A prober in one aspect of the present invention comprises a partition wall that isolates the inspection space from the outside space, an exhaust port formed in the partition wall and configured to be openable and closable by a shutter, and a fan provided in the exhaust port for discharging air from the inspection space to the outside space. The air discharged by the fan is configured to come into contact with refrigerant piping installed in the outside space, and by installing the fan at a predetermined distance from the partition wall, a vent is formed to supply air to the fan not only from the inspection space but also from the outside space.

[0008] According to the present invention, it is possible to reduce costs while making it less likely for condensation to form on the refrigerant piping that supplies refrigerant to the prober.

[0009] This is a diagram showing the schematic configuration of the prober according to the first embodiment. This is a schematic horizontal cross-sectional view showing the internal structure of the prober. This is an enlarged view of part B in Figure 3, which is a cross-sectional view taken along the line A-A in Figure 2. This is a diagram showing the configuration of the measuring section. This is a perspective view of the prober and chiller. This is a diagram showing the measuring section of a multi-stage measuring unit. This is a schematic diagram showing the configuration and operation of the fan and its surroundings when the exhaust port is open in the first embodiment. This is a schematic diagram showing the configuration and operation of the fan and its surroundings when the exhaust port is closed in the first embodiment. This is a schematic diagram showing the configuration and operation of the fan and its surroundings when the exhaust port is open in the second embodiment. This is a schematic diagram showing the configuration and operation of the fan and its surroundings when the exhaust port is closed in the second embodiment. This is a schematic diagram showing the configuration and operation of the fan and its surroundings when the exhaust port is open in the third embodiment. This is a schematic diagram showing the configuration and operation of the fan and its surroundings when the exhaust port is closed in the third embodiment. This is a schematic diagram showing the configuration and operation of the fan and its surroundings when the rolling bearing and inclined plate are swapped in the second embodiment.

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following embodiment and its modified examples, substantially identical components are denoted by the same reference numerals, and their descriptions are omitted as appropriate.

[0011] [First Embodiment] The prober of this embodiment inspects the electrical characteristics of a semiconductor device (also simply called a "device") formed on a wafer. This prober is provided with a plurality of areas, including an inspection area and a transport area.

[0012] Figure 1 is a diagram showing the schematic configuration of the prober 100 according to the first embodiment. For the sake of explanation below, the left-right direction, front-back direction, and up-down direction, as viewed from the front of the device, will be described as the X direction, Y direction, and Z direction, respectively. The prober 100 has a rectangular housing 101 in front view and in plan view. Inside the housing 101 are a measurement area 110 where wafers are inspected and a loader area 120 where wafers and the like are transported to and from the measurement area 110. The loader area 120 includes a storage area 121 for storing wafers and probe cards.

[0013] The storage area 121 is provided with a wafer storage section 122 for storing wafers and a card storage section 123 for storing probe cards. The wafer storage section 122 accepts wafer cassettes such as FOUP and FOSB that store multiple wafers. When workers or robots retrieve wafers or probe cards, they can access each storage section from the front. A loader door 124 is provided on the side of the housing 101 for workers to enter and exit the loader area 120.

[0014] The prober 100 is also equipped with a control unit 125 and an operation panel 126. The control unit 125 consists of a general-purpose computer and includes a CPU for executing various calculation processes, memory or storage for storing control programs, memory used as a work area for data storage and program execution, an input / output interface, a user interface, etc. The user interface accepts operator input via the operation panel 126. The control unit 125 controls each functional part (mechanism and device) of the prober 100 according to the control program. The control unit 125 also functions as an "exhaust control unit".

[0015] Figure 2 is a schematic horizontal cross-sectional view showing the internal structure of the prober 100. The prober 100 has a measurement area 110 and a loader area 120. The measurement area 110 includes an inspection area, which will be described later. The measurement area 110 and the loader area 120 are separated by a partition wall provided inside the housing 101. The loader area 120 includes a storage area 121 and a transport area 127. A transport unit 128 for transporting wafers W and probe cards (described later) is movably arranged in the transport area 127.

[0016] The measurement area 110 is provided with multiple measurement units 130 for performing wafer W probing (wafer level inspection). In this embodiment, a multi-stage prober is employed, in which a stage with four measurement units 130 arranged horizontally is arranged in three vertical rows, but the number of arrangements and rows can be set as appropriate. The measurement units 130 correspond to the "inspection space".

[0017] In the measurement area 110, a common alignment device 131 is placed for each stage of the measurement section 130. The alignment device 131 detachably supports a wafer chuck 132. The wafer chuck 132 holds and fixes the wafer W by means of vacuum suction, for example, and is attached to and detached from the test head of the measurement section 130 during the probing process (details will be described later). The alignment device 131 can move between multiple measurement sections 130 arranged in the horizontal direction. The wafer chuck 132 can move in the X, Y, and Z directions within the measurement area 110 by the operation of the alignment device 131, and can also rotate around the Z axis (θ direction).

[0018] The transport unit 128 transports wafers W between the wafer housing section 122 and each measurement section 130, and transports probe cards between the card housing section 123 and each measurement section 130. The transport unit 128 is equipped with an arm 129 for receiving and transferring wafers W. A suction pad (not shown) is provided on the upper surface of the arm 129. The arm 129 holds the wafer W by vacuum adsorption of the back surface of the wafer W using this suction pad. The transport unit 128 is a transport device shared by all measurement sections 130, and is movable in the X and Z directions by the operation of a drive mechanism (not shown), and can also rotate around the Z axis (θ direction).

[0019] The transport unit 128 moves the arm 129 back and forth (extends and retracts) by the operation of an arm drive mechanism (not shown). The wafers W in the wafer housing section 122 are removed by the arm 129 and transported to each measurement section 130 by the transport unit 128. After inspection is complete, the wafers W are returned to the wafer housing section 122 by following the reverse path from each measurement section 130.

[0020] An exhaust port 134 is provided in a partition wall (hereinafter referred to as "partition wall 133") of the prober 100, which is provided along the front-to-back direction (Y direction) to separate the measuring section 130 located at the right end (positive X direction) of the prober 100 from the external space. A shutter 135 (sealed shutter) capable of opening and closing the exhaust port 134 is also provided along the surface of the partition wall 133, housed inside the partition wall 133. Furthermore, a fan 136 (exhaust fan) that blows air to the right is provided on the external space side of the partition wall 133, opposite the exhaust port 134.

[0021] As will be explained in detail later, probing may be performed by raising the temperature of the wafer W to a high or low state through the wafer chuck 132. During high-temperature measurements, the temperature of the measurement section 130 rises due to the high temperature of the wafer chuck 132, which may adversely affect the electrical equipment inside the prober 100. For this reason, an exhaust port 134 is provided in the partition wall 133, and a fan 136 is provided on the external space side of the partition wall 133. By driving the fan 136 during high-temperature measurements, the hot air inside the measurement section 130 can be discharged into the external space.

[0022] On the other hand, during low-temperature measurements, condensation is likely to form inside the measurement unit 130, which could adversely affect the device and the electrical equipment inside the prober 100. Therefore, it is necessary to prevent high-humidity outside air from flowing into the measurement unit 130. For this reason, during low-temperature measurements, the measurement unit 130 is completely isolated from the outside space by closing the exhaust port 134 with a shutter 135.

[0023] In this way, depending on the temperature inside the measuring unit 130 during probing, the shutter 135 opens and closes the exhaust port 134 and the fan 136 blows air. This reduces damage to the electrical equipment inside the prober 100.

[0024] Figure 3 is a cross-sectional view taken along the line A-A in Figure 2. Figure 4 is an enlarged view of section B in Figure 3. As shown in Figure 3, the measurement area 110 is provided with three upper and lower level measurement sections 130. Each measurement section 130 is partitioned by a partition wall 137 into an inspection area 140 and an equipment housing area 150. The inspection area 140 is the area where the wafer W to be inspected is placed and is located relatively lower. The equipment housing area 150 is the area where the test head 151 and other electrical equipment are housed and is located relatively higher. The inspection area 140 is partitioned from the transport area 127 by a partition wall 141, and the equipment housing area 150 is partitioned from the transport area 127 by a partition wall 152.

[0025] More specifically, as shown in Figure 4, the alignment device 131 is positioned in the inspection area 140. The partition wall 141 is provided with an opening 142 that connects the inspection area 140 and the transport area 127, and a shutter 143 (transfer shutter) that opens and closes the opening 142. By opening the shutter 143, the arm 129 of the transport unit 128 can be extended into the inspection area 140. In other words, wafers W can be transferred between the transport unit 128 and the alignment device 131.

[0026] The inspection area 140 is equipped with internal piping 144 through which a refrigerant flows to cool the wafer chuck 132. The internal piping 144 is connected to the refrigerant piping, which will be described later, across a partition wall 133 (see Figure 2). When probing is performed in a low-temperature environment, refrigerant is supplied to the wafer chuck 132 via the internal piping 144. This allows the wafer W (i.e., the device formed on the wafer W) placed on the wafer chuck 132 to be cooled.

[0027] Meanwhile, the equipment housing area 150 contains the test head 151 and electrical equipment (not shown). A pogo frame 153 is positioned at the boundary between the inspection area 140 and the equipment housing area 150. The pogo frame 153 functions as an interface connecting the test head 151 and the probe card (described later).

[0028] Each of the transport area 127, inspection area 140, and equipment housing area 150 is equipped with a discharge unit 145 that discharges dry air to prevent condensation. When probing (wafer level inspection) is performed in a low-temperature environment, measures are taken to lower the dew point by purging the inspection area 140 with dry air to prevent device damage due to condensation. However, condensation must be prevented not only in the inspection area 140 but also in areas where electrical equipment is housed. Furthermore, there is concern that condensation may occur during the process of wafer removal after the inspection is completed. Therefore, dry air purging is performed not only in the inspection area 140 but also in the transport area 127 and the equipment housing area 150.

[0029] Figure 5 shows the configuration of the measurement unit 130 and corresponds to the cross-section taken along the line C-C in Figure 4. Here, we will explain the outline of probing using Figure 5. Probing is the process of checking whether each device is functioning correctly by having the test head 151 supply test signals (electrical signals) to each device on the wafer W, detecting the output signals from each device, and obtaining electrical characteristics.

[0030] More specifically, a probe card 146 is mounted on the lower surface of the pogo frame 153, facing the wafer chuck 132. Numerous needle-shaped probes 147, each corresponding to an electrode on the wafer W to be inspected, are attached to the probe card 146, extending toward the wafer chuck 132. Seal rings 154 and 148 are provided on the periphery of the upper surface (facing the test head 151) and lower surface (facing the probe card) of the pogo frame 153, respectively.

[0031] A suction device 155 (e.g., a vacuum pump) is connected to the pogo frame 153. By operating the suction device 155, the space surrounded by the test head 151, pogo frame 153, and seal ring 154, and the space surrounded by the probe card 146, pogo frame 153, and seal ring 148 are depressurized. As a result, the test head 151, pogo frame 153, and probe card 146 are integrated, and each probe 147 is electrically connected to the test head 151 via the pogo frame 153.

[0032] Meanwhile, the wafer chuck 132 is detachably supported by the alignment device 131. A seal ring 138 is provided on the upper surface of the wafer chuck 132 so as to surround the wafer W. During probing, the alignment device 131 is moved, and the wafer chuck 132 is moved (raised and lowered) toward the probe card 146. At this time, the seal ring 138 comes into contact with the lower surface of the probe card 146, creating a space surrounded by the wafer chuck 132, the probe card 146, and the seal ring 138. This space is depressurized by operating a suction device (e.g., a vacuum pump) not shown, and the wafer chuck 132 is attracted to the probe card 146. In other words, the wafer chuck 132 is indirectly attracted to the test head 151. As a result, each probe 147 of the probe card 146 comes into contact with each device of the wafer W, making it possible to inspect the electrical characteristics of the device.

[0033] At this time, the wafer chuck 132 is detached from the alignment device 131, allowing the alignment device 131 to be used for other measurement units 130. As described above, the alignment device 131 is shared by each stage of the measurement units 130. Therefore, while inspection is being performed in one measurement unit 130, wafer W can be transferred to another measurement unit 130.

[0034] A heating and cooling structure (not shown) is provided inside the wafer chuck 132. This allows the wafer W to be subjected to high temperatures (e.g., 150°C) or low temperatures (e.g., -40°C) to test the electrical characteristics of the device in a manner that takes into account the actual operating environment. The former is called "high-temperature measurement," and the latter is called "low-temperature measurement." In this embodiment, a double-layer structure is employed for this heating and cooling mechanism, consisting of a heating layer with a surface heater and a cooling layer with a refrigerant passage. The refrigerant passage in the wafer chuck 132 is connected to the internal piping 144 shown in Figure 4.

[0035] Figure 6 is a perspective view of the prober 100 and chiller 200. Figure 7 is a diagram showing the multi-stage measuring unit 130. Figure 6 shows a view of the prober 100 and chiller 200 from the upper right rear (positive X-direction and positive Y-direction), and is drawn from the opposite viewpoint to Figure 1. Figure 7 is an excerpt of the prober 100, showing the part where 12 measuring units 130 are concentrated (4 units x 3 stages).

[0036] As described above, the chiller 200 is a device that cools the refrigerant necessary to lower the temperature of the wafer W. As shown in Figure 6, in this embodiment, the chiller 200 is shorter in length in the front-to-back direction (Y direction) than the prober 100. The chiller 200 is installed adjacent to the prober 100 such that the front wall of the chiller 200 is flush with the surface on which the housing area 121 of the prober 100 is located. As a result, the rear wall of the chiller 200 and the right-hand wall (partition wall 133) of the prober 100 (measuring section 130) are positioned perpendicular to each other toward the outside space.

[0037] Refrigerant piping 160 is arranged along the rear wall of the chiller 200 and the right-side wall (partition wall 133) of the prober 100 (measurement section 130), exposed to the outside space. During low-temperature measurement, the refrigerant cooled by the chiller 200 flows into the prober 100 (measurement section 130) through the refrigerant piping 160. The refrigerant then reaches the inside of the wafer chuck 132 through the internal piping 144 (see Figure 4). The wafer W placed in the wafer chuck 132 is cooled by the refrigerant flowing from the chiller 200.

[0038] The refrigerant that reaches the wafer chuck 132 flows through the refrigerant piping 160 leading from the prober 100 to the chiller 200 and returns to the chiller 200. After being recooled by the chiller 200, the refrigerant flows out to the prober 100 through the refrigerant piping 160. In this way, the refrigerant is cooled by the chiller 200 and circulates between the chiller 200 and the prober 100. That is, a refrigerant circulation passage is formed between the chiller 200 and the prober 100.

[0039] Furthermore, even during high-temperature measurements, it is necessary to ensure that cooling of the air inside the measurement unit 130 can be started quickly after the probing is completed. For this reason, even during high-temperature measurements, a smaller flow rate of refrigerant than during low-temperature measurements circulates through the refrigerant circulation passage as a standby for cooling the wafer W.

[0040] When refrigerant flows through the refrigerant pipe 160, the air near the surface of the refrigerant pipe 160 is cooled, causing condensation to form on the surface of the refrigerant pipe 160. Over time, the water droplets formed by the accumulation of condensation fall onto the floor. Unless special measures are taken, the floor surface will be soiled by these water droplets. To avoid this situation, measures are taken to cover the outer perimeter of the refrigerant pipe 160 with insulating material, but condensation may still occur. Therefore, further measures are taken to prevent condensation depending on the location where the refrigerant pipe 160 is installed.

[0041] For example, in the case of the refrigerant pipe 160 disposed on the back side of the chiller 200, a frame 201 is installed so as to surround the entire refrigerant pipe 160. A plurality of fans 202 (drip-proof fans) are attached to the columns of the frame 201. The fans 202 blow air from the external space toward the chiller 200. The air created by the fans 202 hits the refrigerant pipe 160 disposed along the partition wall of the chiller 200. Thereby, since the cold air near the surface of the refrigerant pipe 160 is removed, the occurrence of dew condensation can be prevented or suppressed.

[0042] Also, the joint portion between the refrigerant pipe 160 and the probe 100 (measurement unit 130) is sealed by a plate-like member made of a material through which outside air does not permeate (for example, metal), and a buffer area 161 is formed. Since the buffer area 161 is isolated from the external space, the inflow of outside air into the measurement unit 130 from the joint portion between the refrigerant pipe 160 and the probe 100 can be restricted.

[0043] Inside the buffer area 161, a discharge portion (not shown) that discharges dry air is provided. The discharge portion provided in the buffer area 161 is the same as the discharge portion 145 shown in FIGS. 3 and 4. When the refrigerant flows through the refrigerant pipe 160, the dew point of the buffer area 161 decreases due to the discharge of dry air from the discharge portion. Thereby, inside the buffer area 161, the occurrence of dew condensation on the refrigerant pipe 160 can be prevented. Thus, the refrigerant pipe 160 disposed along the partition wall of the chiller 200 and the refrigerant pipe 160 near the joint portion with the probe 100 can be prevented from dew condensation by the above-described countermeasures.

[0044] Here, with respect to the refrigerant pipe 160 (hereinafter referred to as "refrigerant pipe 160P") disposed along the right side wall surface (partition wall 133) of the probe 100 (measurement unit 130) and not included in the buffer area 161, it is also necessary to take measures to prevent the occurrence of dew condensation. For example, by further installing the fan 202 or expanding the buffer area 161 to增设 the discharge portion 145, the dew condensation of the refrigerant pipe 160P can be suppressed. However, additional costs are incurred in order to practice these methods.

[0045] Therefore, in the present embodiment, the fan 136 (exhaust fan) installed in the partition wall 133 shown in FIG. 7 is used to prevent (suppress) the occurrence of condensation on the refrigerant pipe 160P. The fan 136 of the present embodiment is arranged to face the refrigerant pipe 160P in the left-right direction (X direction) of the probe 100. The wind created by the fan 136 hits the refrigerant pipe 160P. Due to this wind, the cold air near the surface of the refrigerant pipe 160 is removed, so that the occurrence of condensation can be prevented or suppressed.

[0046] Basically, the fan 136 is driven during high-temperature measurement, but by also driving it during low-temperature measurement, condensation on the surface of the refrigerant pipe 160P can always be prevented or suppressed. However, as described above, during low-temperature measurement, the exhaust port 134 is closed by the shutter 135. As a result, since the ventilation passage is not formed at the rear part (negative side in the X direction) of the fan 136, it becomes difficult for the fan 136 to generate wind during low-temperature measurement.

[0047] Therefore, in the present embodiment, during low-temperature measurement, the fan 136 is installed at a position away from the wall surface of the partition wall 133 in the right direction (positive side in the X direction) of the probe 100, and a gap is formed between the fan 136 and the partition wall 133. Thereby, the fan 136 can take in the outside air near the wall surface of the partition wall 133 and blow it toward the refrigerant pipe 160P. Details of this method will be described later.

[0048] Hereinafter, an explanation will be given while referring to the view (front view) of the periphery of the fan 136 as seen from the right direction (positive side in the X direction) of the probe 100, the view (side view) as seen from the depth direction (positive side in the Y direction), and the view (plan view) as seen from the upward direction (positive side in the Z direction). Note that since each view is shown as a schematic view, there are parts that are different from the actual physical configuration. Also, in the following explanation, a pair of fans (fan unit) provided side by side in the Y direction will be referred to as "fan 136".

[0049] FIGS. 8 and 9 are schematic views showing the configuration and operation of the fan 136 and its periphery. FIG. 8 shows the state when the exhaust port 134 is open, and FIG. 9 shows the state when the exhaust port 134 is closed. In each figure, (a) shows the front view, (b) shows the plan view, and (c) shows the side view.

[0050] As shown in Figures 8(a) to 8(c), the partition wall 133 is provided with a rectangular exhaust port 134 in a front view. A fan 136 is positioned on the external space OS side of the exhaust port 134. The fan 136 has a rectangular housing in a front view. The area of ​​the fan 136 facing the exhaust port 134 is set to be greater than or equal to the area of ​​the opening of the exhaust port 134. The fan 136 blows air from inside the measuring unit 130 out through the exhaust port 134 towards the external space OS.

[0051] The fan 136 is attached to the partition wall 133 via a plurality of fixing members 170. The fixing members 170 are plate-shaped members with an L-shaped cross-section, where the long and short portions are perpendicular to each other. The tips of the long portions of the fixing members 170 are attached to the four corners (top, bottom, left, and right) of the housing of the fan 136. On the other hand, the short portions of the fixing members 170 are attached to the partition wall 133 along the periphery of the exhaust port 134.

[0052] As a result, the housing of the fan 136 is fixed to the partition wall 133 via the fixing member 170. More specifically, the fan 136 is positioned outside the measuring unit 130 (external space OS) at a predetermined distance from the partition wall 133. Therefore, gaps S are formed between the partition wall 133 and the fan 136 in all directions (up, down, left, and right). These gaps S become ventilation openings 171 for outside air near the partition wall 133, as will be described later.

[0053] Below the exhaust port 134, a shutter 135 is housed inside the partition wall 133. The shutter 135 has a trapezoidal shape when viewed from the front, and is composed of a plate-like member with its upper and lower ends parallel to each other, and the lower end being longer than the upper end. The front of the shutter 135 is parallel to the partition wall 133, and the area of ​​the shutter 135 is greater than or equal to the area of ​​the opening of the exhaust port 134. As will be described later, the shutter 135 is slidable (movable) in the vertical direction (Z direction) of the exhaust port 134.

[0054] As shown in Figure 8, during high-temperature measurement, the shutter 135 is housed inside the partition wall 133 and the exhaust port 134 is opened. High-temperature measurement is started when the operator operates the control panel 126 and inputs an instruction to perform high-temperature measurement of the wafer W. The control unit 125 receives the operation input from the operator and controls the driving of the fan 136 and shutter 135 according to the control program.

[0055] More specifically, the partition wall 133 is provided with a moving mechanism (not shown) for opening and closing the shutter 135. The moving mechanism is, for example, a screw feed mechanism and is driven by a drive unit 174 such as a servo motor. The control unit 125 includes a fan control unit 172 and a shutter control unit 173. Upon receiving operator input, the fan control unit 172 drives the fan 136. The shutter control unit 173 controls the drive unit 174 to open and close the shutter 135.

[0056] When the fan 136 is driven, the hot air inside the measuring unit 130 is discharged into the external space OS. At the same time, outside air from near the wall surface of the partition wall 133 is drawn in through the gap S between the fan 136 and the partition wall 133, i.e., the vent 171, and is sent out along with the hot air. The airflow produced by the fan 136 hits the refrigerant pipe 160P opposite the fan 136. As a result, the cold air near the surface of the refrigerant pipe 160 is removed, and the occurrence of condensation can be suppressed.

[0057] As shown in Figure 9, during low-temperature measurement, the shutter 135 slides upward and the exhaust port 134 is closed. Low-temperature measurement is started when the operator operates the control panel 126 and inputs an instruction to perform low-temperature measurement of the wafer W. The control unit 125 receives the operation input from the operator and controls the driving of the shutter 135 and the fan 136 according to the control program. The drive unit 174 slides the shutter 135 upward.

[0058] Even when the exhaust port 134 is closed, a ventilation passage is formed at the rear of the fan 136 (negative side in the X direction) by the vent 171. When the fan 136 is driven, outside air near the wall surface of the partition wall 133 is taken in through the vent 171 and sent out to the external space OS. As a result, the fan 136 can generate airflow that hits the refrigerant piping 160P even during low-temperature measurements, thereby suppressing condensation on the surface of the refrigerant piping 160P.

[0059] In summary, in the first embodiment, the fan 136 that discharges the air inside the measuring unit 130 toward the external space OS is positioned at a predetermined distance from the partition wall 133 toward the external space OS. This allows for constant airflow, drawing in not only air inside the measuring unit 130 but also outside air around the partition wall 133. By positioning the fan 136 opposite the refrigerant piping 160P, air can be constantly directed toward the refrigerant piping 160P, thereby preventing or suppressing condensation.

[0060] Furthermore, if the fan 136 is placed too far away from the partition wall, the efficiency of exhausting hot air from inside the measuring section 130 during high-temperature measurements will decrease. Therefore, in order to draw in outside air near the partition wall 133 while maintaining the efficiency of hot air exhaust as much as possible, the fan 136 is fixed in a position such that the area of ​​the opening of the vent 171 is smaller than the area of ​​the opening of the exhaust port 134.

[0061] [Second Embodiment] Figures 10 and 11 are schematic diagrams showing the configuration and operation of the fan 136 and its surroundings in the second embodiment. Figure 10 shows the state when the exhaust port 134 is open, and Figure 11 shows the state when the exhaust port 134 is closed. In each figure, (a) is a front view, (b) is a top view, and (c) is a side view. The following will mainly describe the differences from the first embodiment.

[0062] In the second embodiment, the distance between the partition wall 133 and the fan 136 changes in conjunction with the opening and closing (sliding vertically) of the shutter 135, due to a mechanism formed in the shutter 135 and the fan 136, which will be described later. More specifically, when the shutter 135 slides in the direction that opens the exhaust port 134 (downward), the fan 136 moves in a direction that approaches the partition wall 133. When the shutter 135 slides in the direction that closes the exhaust port 134 (upward), the fan 136 moves in a direction that moves away from the partition wall 133.

[0063] As shown in Figures 10(a) to (c), the fan 136 is attached to the partition wall 133 via a plurality of support mechanisms 175. The support mechanism 175 includes a guide member 176 fixed to the partition wall 133, a support member 177 slidably supported on the guide member 176, and a compression spring 178 that biases the support member 177 toward the partition wall 133.

[0064] Guide members 176 are attached to the four corners of the periphery of the exhaust port 134 in the bulkhead 133. The guide members 176 are rectangular parallelepiped cylinders and are erected horizontally from the bulkhead 133 toward the external space OS. A space is formed inside the guide member 176 to accommodate a support member 177 and a compression spring 178. A hole 176a is provided in the center of the tip of the guide member 176 through which the support member 177 can be inserted.

[0065] The support member 177 is a rod-shaped member that extends horizontally inside the guide member 176 and passes through the hole 176a of the guide member 176. A flat plate-shaped stopper 179 is provided at the base end of the support member 177. The tip of the support member 177 is bent at a right angle and fixed to the housing of the fan 136. The support member 177 is supported so as to be slidable along the inner circumferential surface of the guide member 176 in a direction approaching or moving away from the partition wall 133. A compression spring 178 is interposed between the bottom surface of the tip of the guide member 176 and the stopper 179 to bias the support member 177 toward the partition wall 133. The compression spring 178 corresponds to the "biasing member".

[0066] Support members 177 are attached to the left and right sides of the upper and lower surfaces of the fan 136. The fan 136 is supported by these four support members 177. The fan 136 is movable in a direction toward or toward the partition wall 133 in conjunction with the support members 177. The fan 136 is biased toward the partition wall 133 by a compression spring 178.

[0067] Rectangular flange portions 180 are provided at both the left and right ends of the fan 136 so as to be flush with the surface facing the exhaust port 134. The height (length in the Z direction) of the flange portion 180 is equal to the height of the fan 136. The width (length in the Y direction) of the flange portion 180 is at least the length of the wheel width of the rolling bearing 181, which will be described later. In the second embodiment, the exhaust port 134 is closed by the fan 136 (including the flange portion 180).

[0068] A rolling bearing 181 is provided at the lower rear of the flange portion 180 (Figure 10(c)). The rolling bearing 181 corresponds to the "interlocking member".

[0069] On the other hand, an inclined plate 182 is provided on the surface of the shutter 135 facing the flange portion 180. The inclined plate 182 is a rectangular member in front view and a right-angled triangular member in side view, and has an inclined surface (inclined path) facing the rolling bearing 181. More specifically, the inclined plate 182 is mounted perpendicular to the front of the shutter 135, facing the flange portion 180. As a result, the inclined plate 182 slides vertically together with the shutter 135.

[0070] When viewed from the side, the inclined plate 182 has a right-angle lower end that contacts the shutter 135 and tapers upwards. In other words, the inclined plate 182 has an inclined surface that is higher towards the bottom and lower towards the top. As described above, the front of the shutter 135 is parallel to the bulkhead 133. Therefore, the inclined surface of the inclined plate 182 is further away from the shutter 135 towards the bottom and closer to the shutter 135 towards the top. When viewed from the front, the inclined plate 182 has a thickness of at least the width of the wheel of the rolling bearing 181.

[0071] Because the compression spring 178 biases the fan 136 toward the partition wall 133, the rolling bearing 181 attached to the flange portion 180 is always pressed against the inclined surface of the inclined plate 182. As a result, the rolling bearing 181 rolls while in contact with the inclined surface and moves in a direction toward or toward the front of the shutter 135. Along with this movement of the rolling bearing 181, the fan 136 also moves in a direction toward or toward the partition wall 133.

[0072] As shown in Figure 10, during high-temperature measurement, the shutter 135 is housed inside the partition wall 133 and the exhaust port 134 is opened. At this time, the rolling bearing 181 comes into contact with the upper end of the slope on the inclined plate 182. As a result, the fan 136 comes closest to the partition wall 133 and closes the exhaust port 134. The movement of the fan 136 toward the partition wall 133 is restricted by the stopper 179 being locked to the partition wall 133.

[0073] In this state, when the fan 136 is driven, the fan 136 blows air toward the external space OS. Since the exhaust port 134 is closed by the fan 136, the vent 171 as in the first embodiment is not formed. Therefore, the fan 136 can efficiently discharge the hot air inside the measuring section 130 during high-temperature measurement. The airflow produced by the fan 136 removes the cold air near the surface of the refrigerant pipe 160P, thus suppressing the occurrence of condensation.

[0074] As shown in Figure 11, during low-temperature measurement, the shutter 135 slides upward and the exhaust port 134 closes. At this time, the rolling bearing 181 comes into contact with the lower end of the slope on the inclined plate 182. As a result, the fan 136 is positioned furthest from the partition wall 133, and the exhaust port 134 remains open. Consequently, the fan 136 is positioned at a distance from the partition wall 133 equal to the height of the inclined plate 182.

[0075] When the exhaust port 134 is closed by the shutter 135, the air inside the measuring section 130 is completely prevented from being discharged. However, because the fan 136 is fixed away from the partition wall 133 towards the external space OS, a gap S, or vent 171, is formed between the fan 136 and the partition wall 133. Due to the presence of the vent 171, a ventilation passage is formed at the rear of the fan 136. When the fan 136 is driven, outside air near the wall surface of the partition wall 133 is taken in through the vent 171 and sent out into the external space OS. As a result, the fan 136 can create airflow that hits the refrigerant piping 160P, preventing or suppressing condensation on the surface of the refrigerant piping 160P.

[0076] In summary, in the second embodiment, during high-temperature measurement, the control unit 125 slides the shutter 135 downward to open the exhaust port 134, indirectly moving the fan 136 closer to the partition wall 133. In this case, the fan 136 is closest to the exhaust port 134, allowing the air inside the measurement unit 130 to be discharged into the external space OS.

[0077] Conversely, during low-temperature measurement, the control unit 125 slides the shutter 135 upward to close the exhaust port 134, indirectly moving the fan 136 away from the partition wall 133 (towards the external space OS). Although the exhaust port 134 is closed by the shutter 135, a ventilation passage is formed behind the shutter 135. As a result, the fan 136 can take in outside air near the wall surface of the partition wall 133 and discharge it into the external space OS.

[0078] An inclined plate 182 having an inclined surface (ramp) in the vertical direction is mounted perpendicular to the front of the shutter 135. A rolling bearing 181 (interlocking member) attached to the fan 136 (flange portion 180) contacts the inclined surface of the inclined plate 182. When the shutter 135 slides downward, the rolling bearing 181 rolls toward the upper end of the inclined surface of the inclined plate 182, and the fan 136 moves closer to the partition wall 133. Conversely, when the shutter 135 slides upward, the rolling bearing 181 rolls toward the lower end of the inclined surface of the inclined plate 182, and the fan 136 moves away from the partition wall 133. This makes it possible to change the position of the fan 136 relative to the partition wall 133.

[0079] A guide member 176 attached to the partition wall 133 houses a compression spring 178 that has a biasing force toward the partition wall 133. A support member 177 with a stopper 179 is attached to the fan 136. When the exhaust port 134 is open, the compression spring 178 presses the stopper 179 toward the partition wall 133. The fan 136 is fixed to the partition wall 133 via the stopper 179 and the support member 177, closing the exhaust port 134. As a result, the fan 136 can discharge the air inside the measuring section 130 to the outside space without shaking, while maintaining exhaust efficiency.

[0080] In this manner, the fan 136 can always blow air toward the external space OS, whether during high-temperature or low-temperature measurements. This airflow strikes the refrigerant pipe 160P, removing the cold air near the surface of the refrigerant pipe 160P, thereby preventing or suppressing condensation.

[0081] [Third Embodiment] Figures 12 and 13 are schematic diagrams showing the configuration and operation of the fan 136 and its surroundings in the third embodiment. Figure 12 shows the state when the exhaust port 134 is open, and Figure 13 shows the state when the exhaust port 134 is closed. In each figure, (a) is a front view, (b) is a top view, and (c) is a side view. In the third embodiment as well, the distance between the partition wall 133 and the fan 136 changes in conjunction with the opening and closing of the shutter 135, due to a mechanism formed in the shutter 135 and the fan 136, which will be described later. The following will focus on the differences from the second embodiment.

[0082] An L-shaped shaft member 183 is provided at the lower rear of the flange portion 180. The shaft member 183 has a rotating shaft that extends parallel to the shutter 135 (in the Y direction), and a rolling bearing 181 is attached to this rotating shaft.

[0083] On the other hand, an inclined plate 182 is provided on the surface of the shutter 135 facing the flange portion 180. The inclined plate 182 has an inclined surface in the vertical direction and has a trapezoidal shape when viewed from the side. More specifically, the inclined plate 182 is mounted perpendicular to the front surface of the shutter 135, facing the flange portion 180. When viewed from the side, the inclined plate 182 has both ends in the vertical direction perpendicular to the front surface of the shutter 135 (parallel to each other) and has a shape that tapers upwards. Similar to the second embodiment, the inclined surface of the inclined plate 182 moves further away from the shutter 135 as it goes downwards and closer to the shutter 135 as it goes upwards.

[0084] A guide hole 184 is provided in the inclined plate 182. The guide hole 184 corresponds to a "groove". The guide hole 184 is a slit that penetrates the side surface of the inclined plate 182. The guide hole 184 has a width approximately the same as the outer diameter of the rolling bearing 181 and extends parallel to the inclined surface. The rolling bearing 181, attached to the shaft member 183, fits into the guide hole 184 and rolls in the direction of the extension of the guide hole 184 while contacting the inner edge of the guide hole 184.

[0085] In the third embodiment, the support mechanism 175 does not include a compression spring 178. However, the rolling bearing 181 rolls inside the guide hole 184, guiding it in a direction toward or toward the front of the shutter 135. As a result, the fan 136 moves toward or toward the partition wall 133.

[0086] Figure 12 shows the scenario during high-temperature measurement. The shutter 135 is housed inside the partition wall 133, and the exhaust port 134 is open. At this time, the rolling bearing 181 is located at the upper end of the guide hole 184. As a result, the fan 136 is closest to the partition wall 133 and closes the exhaust port 134.

[0087] In this state, when the fan 136 is driven, the fan 136 blows air toward the external space OS. Similar to the second embodiment (Figure 10), since no vents 171 are formed around the fan 136, the hot air inside the measuring section 130 can be efficiently discharged. The air produced by the fan 136 removes the cold air near the surface of the refrigerant pipe 160P, thus suppressing the occurrence of condensation.

[0088] Figure 13 shows the scenario during low-temperature measurement, where the exhaust port 134 is closed by the shutter 135. In this case, since the rolling bearing 181 is located at the lower end of the guide hole 184, the fan 136 is positioned at the furthest point from the partition wall 133. In other words, the fan 136 is positioned at a distance from the partition wall 133 equal to the height of the lower end of the inclined plate 182.

[0089] The formation of the vent 171 creates a ventilation passage at the rear of the fan 136 (negative side in the X direction) even when the exhaust port 134 is closed. When the fan 136 is driven, outside air near the wall surface of the partition wall 133 is drawn in through the vent 171 and sent out into the outside space. As a result, the fan 136 can create airflow that hits the refrigerant pipe 160P, thereby suppressing condensation on the surface of the refrigerant pipe 160P.

[0090] In summary, in the third embodiment, an inclined plate 182 having a guide hole 184 extending parallel to the inclined surface is attached to the front of the shutter 135. A rolling bearing 181 (interlocking member) is attached to the flange portion 180 via a shaft member 183. The rolling bearing 181 fits into the guide hole 184 and rolls along the inner edge of the guide hole 184. When the shutter 135 moves in the direction that opens the exhaust port 134 (upwards), the fan 136 moves in the direction that approaches the partition wall 133. Conversely, when the shutter 135 moves in the direction that closes the exhaust port 134 (downwards), the fan 136 moves in the direction that moves away from the partition wall 133. As a result, a ventilation passage is always formed at the rear of the fan 136, so that the fan 136 can always blow air into the external space OS. The airflow generated by the fan 136 removes the cold air near the surface of the refrigerant pipe 160P, thereby preventing or suppressing condensation.

[0091] In the second embodiment, the support mechanism 175 includes a compression spring 178 that presses the fan 136 toward the partition wall 133. As a result, in order to move the fan 136 toward the partition wall 133 during low-temperature measurement, it is necessary to apply a force that is contrary to the biasing force of the compression spring 178, which places a load on the drive unit 174. On the other hand, in the third embodiment, the support mechanism 175 does not include a compression spring 178, and the force that slides the shutter 135 vertically is directly converted into a force that moves the fan 136. Therefore, the third embodiment can reduce the load on the drive unit 174 compared to the second embodiment.

[0092] Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these specific embodiments, and various modifications are possible within the scope of the technical concept of the present invention.

[0093] [Modification 1] In the second and third embodiments, an inclined plate 182 is attached to the shutter 135. On the other hand, a rolling bearing 181 that contacts the inclined plate 182 is attached to the fan 136 (including the flange portion 180). Furthermore, it has been explained that the fan 136 moves as the rolling bearing 181 moves in conjunction with the vertical sliding of the shutter 135. As a modification, the shutter 135 and the fan 136 may move independently of each other. In this case, it is not necessary to provide an inclined plate 182 on the shutter 135 or a rolling bearing 181 on the fan 136. In addition, a drive unit (not shown) is provided that can move the fan 136 horizontally independently of the sliding of the shutter 135. The fan control unit 172 can move the fan 136 horizontally by driving this drive unit.

[0094] For example, suppose an operator operates the control panel 126 and inputs an instruction to perform a low-temperature measurement of wafer W. At this time, the shutter control unit 173 slides the shutter 135 upward and closes the exhaust port 134. After the exhaust port 134 is completely closed by the shutter 135, the fan control unit 172 may move the fan 136 away from the partition wall 133. This method is effective when it is desired to lower the wafer W to a low temperature more quickly during probing and to prevent outside air from flowing into the measurement unit 130.

[0095] Alternatively, when an operator instructs the system to perform a low-temperature measurement, the fan control unit 172 may move the fan 136 away from the partition wall 133, and then the shutter control unit 173 may slide the shutter 135 upward. As described above, when the shutter 135 closes the exhaust port 134, no ventilation passage is formed at the rear of the fan 136 (negative side in the X direction). Therefore, this method is effective when prioritizing the constant airflow onto the refrigerant piping 160P.

[0096] [Modification 2] In the second and third embodiments, it was explained that an inclined plate 182 is attached to the shutter 135, and a rolling bearing 181 that contacts the inclined plate 182 is attached to the fan 136. As a modification, the rolling bearing 181 may be attached to the shutter 135, and the inclined plate 182 may be attached to the fan 136.

[0097] Figure 14 is a schematic diagram showing the configuration and operation of the fan 136 and its surroundings when the rolling bearing 181 and the inclined plate 182 are swapped in the second embodiment. Figure 14(a) corresponds to when the exhaust port 134 is open (Figure 10(c)), and Figure 14(b) corresponds to when the exhaust port 134 is closed (Figure 11(c)).

[0098] As shown in Figures 14(a) and (b), a rolling bearing 181 is attached to the upper end of the surface of the shutter 135 facing the fan 136. In addition, a triangular inclined plate 182, which has an inclined surface in the vertical direction, is attached to the flange portion 180 of the fan 136. The inclined plate 182 has an inclined surface that is lower as it goes downwards from the flange portion 180 and higher as it goes upwards. In other words, the inclined surface of the inclined plate 182 is closer to the fan 136 as it goes downwards and further away from the fan 136 as it goes upwards.

[0099] Figure 14(a) shows the scenario during high-temperature measurement, where the shutter 135 is housed inside the partition wall 133 and the exhaust port 134 is open. The rolling bearing 181 attached to the flange portion 180 contacts the lower end of the inclined surface of the inclined plate 182. As a result, the fan 136 comes closest to the partition wall 133 and closes the exhaust port 134. When the fan 136 is driven in this state, an airflow is created toward the outside space, removing the cold air near the surface of the refrigerant piping 160, thereby preventing or suppressing condensation.

[0100] During low-temperature measurements, the exhaust port 134 is closed by the shutter 135, as shown in Figure 14(b). Since the rolling bearing 181 is in contact with the upper end of the inclined plate 182, the fan 136 is positioned away from the partition wall 133 by the height of the inclined plate 182. This creates a gap S, i.e., a vent 171, and when the fan 136 is driven, air is generated toward the external space OS. This air hits the refrigerant pipe 160P, preventing or suppressing condensation on the surface of the refrigerant pipe 160P. Thus, even if the positions of the rolling bearing 181 and the inclined plate 182 are swapped, the same effects as those described in Figures 10 and 11 can be obtained. The same applies to the third embodiment.

[0101] [Modification 3] The prober 100 is equipped with a temperature sensor (not shown) capable of measuring the temperature inside the measuring unit 130. In this case, the shutter control unit 173 may slide the shutter 135 according to the temperature inside the measuring unit 130 measured by the temperature sensor. For example, the shutter control unit 173 may slide the shutter 135 vertically and open or close the exhaust port 134 when the temperature inside the measuring unit 130 begins to deviate significantly from the ambient temperature at the location where the prober 100 is installed.

[0102] For example, during high-temperature measurement, the shutter control unit 173 may move the shutter 135 downward and open the exhaust port 134 when the temperature inside the measurement unit 130 reaches 40°C (first temperature) or higher. Alternatively, during low-temperature measurement, the shutter control unit 173 may move the shutter 135 upward and close the exhaust port 134 when the temperature inside the measurement unit 130 reaches 0°C (second temperature) or lower.

[0103] Probing is performed by changing the temperature of the wafer W through the wafer chuck 132. However, the temperature inside the measurement unit 130 does not change immediately through the wafer chuck 132 after heating or cooling begins. In other words, it takes a considerable amount of time for the temperature inside the measurement unit 130 to change. Therefore, as long as the temperature inside the measurement unit 130 does not deviate significantly from the current ambient temperature at the location where the prober 100 is installed, it is considered that closing the exhaust port 134 during high-temperature measurement or opening the exhaust port 134 during low-temperature measurement will not adversely affect the electrical equipment inside the prober 100.

[0104] In particular, if power is required to maintain the position of the shutter 135, sliding the shutter 135 too quickly during high-temperature or low-temperature measurements will increase the time the exhaust port 134 remains open or closed, in other words, the time the shutter 135 is held in position. That is, power consumption increases in proportion to the time the shutter 135 is held in position.

[0105] To avoid this situation, a first temperature and a second temperature are set as reference temperatures for moving the shutter 135. For example, the first temperature is set to a temperature higher than the highest temperature recorded in the area where the prober 100 is installed. The second temperature is set to a temperature lower than the lowest temperature recorded in the same area. When the temperature inside the measuring unit 130 reaches the first temperature or the second temperature or lower, the shutter control unit 173 slides the shutter 135. This method can reduce the power consumption of the prober 100.

[0106] [Other Modifications] In the first to third embodiments, the exhaust port 134, shutter 135, and fan 136 were described as being mounted on the right side (positive side in the X direction) of the measuring unit 130, but the mounting position is not limited to this. For example, they may be on the back side (positive side in the Y direction) of the prober 100. Depending on the location of the refrigerant piping 160 in the external space OS, the exhaust port 134, etc., can be positioned opposite the refrigerant piping 160 to prevent or suppress condensation on the surface of the refrigerant piping 160.

[0107] In the first to third embodiments, the shutter 135 was described as being housed inside the partition wall 133 below the exhaust port 134, but the location of housing is not limited to this. For example, it may be housed above the exhaust port 134, or on either the left or right side of the exhaust port 134. In particular, in the second and third embodiments, the direction of movement of the shutter 135 changes depending on the housing location, but coordination (interlocking) between the opening and closing operation of the shutter 135 and the movement of the fan 136 can be achieved.

[0108] In the first to third embodiments, the control unit 125 may control the area of ​​the opening of the exhaust port 134 by driving the shutter 135. This allows for adjustment of the airflow rate and temperature of the air supplied to the refrigerant piping 160P, thereby optimizing the environment of the external space OS for preventing condensation.

[0109] It should be noted that the present invention is not limited to the embodiments and modifications described above, and the components can be modified and implemented without departing from the spirit of the invention. Various inventions may be formed by appropriately combining the multiple components disclosed in the embodiments and modifications described above. In addition, some components may be deleted from all the components shown in the embodiments and modifications described above.

Claims

1. A prober comprising: a partition wall that isolates an inspection space from the outside space; an exhaust port formed in the partition wall and configured to be openable and closable by a shutter; and a fan provided in the exhaust port for discharging air from the inspection space to the outside space, wherein the air discharged by the fan is configured to come into contact with refrigerant piping installed in the outside space, and by installing the fan at a predetermined distance from the partition wall, a vent is formed to supply air to the fan not only from the inspection space but also from the outside space.

2. The prober according to claim 1, wherein the fan is fixed in a position such that the opening area of ​​the vent is smaller than the opening area of ​​the exhaust port.

3. The probe according to claim 1, further comprising an exhaust control unit that changes the distance between the fan and the partition wall by moving the fan, wherein the exhaust control unit moves the fan toward the partition wall when the exhaust port is opened, and moves the fan toward the partition wall when the exhaust port is closed.

4. The prober according to claim 3, wherein either the shutter or the fan has an inclined path that is inclined with respect to the direction of movement of the shutter, and the other is provided with an interlocking member that is movable along the inclined path, and the distance between the shutter and the fan changes depending on the contact position between the interlocking member and the inclined path, and the exhaust control unit moves the interlocking member along the inclined path in a direction that brings the fan closer to the partition wall when the shutter is moved in the opening direction, and moves the interlocking member along the inclined path in a direction that moves the fan away from the partition wall when the shutter is moved in the closing direction.

5. The prober according to claim 4, further comprising a biasing member that biases the fan toward the partition wall, wherein when the exhaust control unit moves the shutter toward the closing direction, it moves the interlocking member toward the inclined path toward the fan toward the partition wall toward the opposite direction to the biasing force of the biasing member.

6. The prober according to claim 4, wherein the shutter has a groove formed therein that is inclined with respect to the direction of movement of the shutter, the fan is provided with an interlocking member that is movable along the groove, and the distance between the shutter and the fan changes depending on the contact position of the interlocking member in the groove, and the exhaust control unit moves the interlocking member along the groove in a direction that brings the fan closer to the partition wall when the shutter is moved in the opening direction, and moves the interlocking member along the groove in a direction that moves the fan away from the partition wall when the shutter is moved in the closing direction.

7. A prober according to any one of claims 3 to 6, further comprising a temperature sensor for measuring the temperature of the inspection space, wherein the exhaust control unit opens the exhaust port when the temperature in the inspection space is above a predetermined first temperature, and closes the exhaust port when the temperature in the inspection space is below a predetermined second temperature which is lower than the first temperature.

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