Curable composition, film, and optical sensor

Abstract

A curable composition comprising a polymerizable compound; a resin; a photopolymerization initiator; and a solvent, wherein the photopolymerization initiator comprises a glyoxylate compound; the solid content concentration of the curable composition is 1-60 mass%; and a film formed by applying the curable composition onto a support, followed by light exposure and subsequent heating at 230°C for 15 minutes, has a maximum transmittance of 80% or more in a wavelength range of 400-700 nm. Also provided are a film and an optical sensor each using the aforementioned curable composition.

Description

Curable compositions, films, and optical sensors

[0001] This invention relates to a curable composition comprising a polymerizable compound, a resin, a photopolymerization initiator, and a solvent. Furthermore, this invention relates to a film and an optical sensor using the curable composition.

[0002] Curable compositions containing a photopolymerization initiator, a polymerizable compound, a resin, and a solvent can be polymerized and cured by irradiation with light, and are therefore used in optical filters, photocurable inks, photosensitive printing plates, various photoresists, and the like.

[0003] Patent Document 1 discloses a curable composition comprising a colorant, an alkali-soluble resin, a polymerizable compound, an oxime-based photopolymerization initiator, and a solvent.

[0004] Japanese Patent Publication No. 2022-063556

[0005] When forming a film using a curable composition containing a polymerizable compound, a resin, a photopolymerization initiator, and a solvent, the film tended to discolor easily due to heating during the removal of the solvent during film formation. Furthermore, further investigation by the inventors revealed that discoloration tends to occur during film formation due to interactions between the photopolymerization initiator and other materials in the curable composition, such as the resin and polymerizable compound.

[0006] Therefore, an object of the present invention is to provide a curable composition capable of forming a film in which discoloration is suppressed. Another object of the present invention is to provide a film and an optical sensor using the curable composition.

[0007] The present invention provides the following:

[0008] <1> A curable composition comprising a polymerizable compound, a resin, a photopolymerization initiator, and a solvent, wherein the photopolymerization initiator comprises a glyoxylate compound, the solid content concentration of the curable composition is 1 to 60% by mass, and when the curable composition is applied to a support, exposed to light, and then heated at 230°C for 15 minutes to form a film, the maximum transmittance of the film at a wavelength of 400 to 700 nm is 80% or more. <2> The curable composition according to <1>, wherein the polymerizable compound comprises an ether bond. <3> The curable composition according to <1> or <2>, wherein the total content of the resin and the polymerizable compound in the total solid content of the curable composition is 70% by mass or more. <4> The curable composition according to any one of <1> to <3>, wherein the content of the polymerizable compound in the total solid content of the curable composition is 1 to 49% by mass. <5> The curable composition according to any one of <1> to <4>, wherein the resin content in the total solid content of the curable composition is 40% by mass or more. <6> The curable composition according to any one of <1> to <5>, further comprising an ultraviolet absorber. <7> The curable composition according to any one of <1> to <6>, wherein the total content of chromatic colorants and black colorants in the total solid content of the curable composition is 1% by mass or less. <8> The curable composition according to any one of <1> to <7>, wherein the photopolymerization initiator comprises a compound different from the glyoxylate compound. <9> The curable composition according to any one of <1> to <8>, wherein the glyoxylate compound comprises a compound represented by formula (1) or formula (2); In formula (1), Ar １ R represents an m1+n1 valent group containing at least one selected from the group consisting of aromatic rings and heteroaromatic rings, １ R represents an alkyl group. ２ represents a halogen atom, nitro group, cyano group, or acyl group, n1 represents an integer from 1 to 4, and m1 represents an integer from 0 to 2; in formula (2), Ar １１ R represents an m²+1 valent group containing at least one selected from the group consisting of aromatic rings and heteroaromatic rings, １１ R represents an n-2 valent organic group. １２n2 represents a halogen atom, a nitro group, a cyano group, or an acyl group, n2 represents an integer from 2 to 6, and m2 represents an integer from 0 to 2. <10> A film obtained using the curable composition described in any one of <1> to <9>. <11> An optical sensor having the film described in <10>.

[0009] According to the present invention, it is possible to provide a curable composition capable of forming a film in which the occurrence of discoloration is suppressed. Furthermore, according to the present invention, it is possible to provide a film and an optical sensor using the curable composition.

[0010] The present invention will be described in detail below. In this specification, "~" is used to mean that the numerical values ​​before and after it are included as the lower and upper limits. In the notation of groups (atomic groups) in this specification, notations that do not specify substituted or unsubstituted include both groups (atomic groups) with substituents and groups (atomic groups) without substituents. For example, "alkyl group" includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. In addition, examples of light used for exposure include the emission line spectrum of mercury lamps, far ultraviolet light represented by excimer lasers, extreme ultraviolet (EUV) light, X-rays, electron beams, and other active light or radiation. In this specification, "(meth)acrylate" refers to both acrylate and methacrylate, or either of them; "(meth)acrylic" refers to both acrylic and methacrylic, or either of them; and "(meth)acryloyl" refers to both acryloyl and methacryloyl, or either of them. In this specification, Me in structural formulas represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group. In this specification, weight-average molecular weight and number-average molecular weight are polystyrene equivalent values ​​measured by GPC (gel permeation chromatography). In this specification, total solids refer to the total mass of components of a composition excluding the solvent. In this specification, pigment refers to particles that are poorly soluble in solvents. In this specification, the term "process" includes not only independent processes, but also processes that cannot be clearly distinguished from other processes, as long as the intended function of that process is achieved.

[0011] <Curable Composition> The curable composition of the present invention is a curable composition comprising a polymerizable compound, a resin, a photopolymerization initiator, and a solvent, wherein the photopolymerization initiator comprises a glyoxylate compound, the solid content concentration of the curable composition is 1 to 60% by mass, and when the curable composition is applied to a support, exposed to light, and then heated at 230°C for 15 minutes to form a film, the maximum transmittance of the film at a wavelength of 400 to 700 nm is 80% or more.

[0012] Through the inventors' research, it was found that glyoxylate compounds do not readily interact with materials other than photopolymerization initiators contained in curable compositions such as resins and polymerizable compounds, and that discoloration of these materials can be suppressed. Therefore, the curable composition of the present invention that uses a glyoxylate compound as a photopolymerization initiator can form a film in which discoloration is suppressed.

[0013] The curable composition of the present invention, when applied to a support, exposed to light, and then heated at 230°C for 15 minutes to form a film, has a maximum transmittance of 80% or more, preferably 85% or more, and more preferably 90% or more at wavelengths of 400 to 700 nm. The support used for forming the film is not particularly limited as long as it is used for determining the spectral characteristics of the film. For example, a glass substrate can be used. In forming the film, the exposure is performed with light at a wavelength of 365 nm at a rate of 1000 mJ / cm². ２ It is preferable to expose the film by irradiating it with the specified exposure dose. Before exposure, a drying treatment may be performed when forming the above film. When a drying treatment is performed, the drying temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, and also 80°C or higher. The drying time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. For measuring the above spectral characteristics, the curable composition is applied to a glass substrate by a method such as spin coating, dried at 100°C for 120 seconds using a hot plate or the like, and then exposed to light with a wavelength of 365 nm at 1000 mJ / cm². ２It is preferable to perform the measurement using a 1 μm thick film formed by irradiating with the specified exposure dose and then heating it at 230 for 15 minutes.

[0014] The minimum transmittance of the above film at wavelengths of 450 to 650 nm is preferably 50% or more, more preferably 70% or more, and even more preferably 80% or more. Furthermore, the average transmittance of the above film at wavelengths of 450 to 650 nm is preferably 60% or more, more preferably 75% or more, and even more preferably 85% or more.

[0015] The solid content concentration of the curable composition of the present invention is 1 to 60% by mass. The lower limit is preferably 2% by mass or more, and more preferably 5% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less.

[0016] The curable composition of the present invention can be used for optical sensors. Furthermore, the curable composition of the present invention can be used as a base material, transparent pixels, planarization layer, or overcoat layer in photoelectric conversion semiconductors and optical components.

[0017] The following describes the materials used in the curable composition of the present invention.

[0018] <<Polymerizable Compounds>> The curable composition of the present invention contains polymerizable compounds. Examples of polymerizable compounds include compounds having an ethylenically unsaturated bond-containing group. Examples of ethylenically unsaturated bond-containing groups include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups. The polymerizable compound used in the present invention is preferably a radical polymerizable compound.

[0019] The polymerizable compound may be in any chemical form, such as monomer, prepolymer, or oligomer, but monomer is preferred. The molecular weight of the polymerizable compound is preferably 100 to 3000. The upper limit is more preferably 2000 or less, and even more preferably 1500 or less. The lower limit is more preferably 150 or more, and even more preferably 250 or more.

[0020] The polymerizable compound is preferably a compound containing two or more ethylenically unsaturated bond-containing groups, more preferably a compound containing two to fifteen ethylenically unsaturated bond-containing groups, and even more preferably a compound containing two to six ethylenically unsaturated bond-containing groups. Furthermore, the polymerizable compound is preferably a (meth)acrylate compound with 2 to 15 functions, and more preferably a (meth)acrylate compound with 2 to 6 functions. Specific examples of polymerizable compounds include the compounds described in paragraphs 0075 to 0083 of International Publication No. 2022 / 065215 and the compounds described in Taiwan Patent Application Publication No. 201832008.

[0021] Preferred polymerizable compounds include dipentaerythritol tri(meth)acrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available as KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available as KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK Ester A-DPH-12E; manufactured by Shin Nakamura Chemical Industry Co., Ltd.), and compounds in which the (meth)acryloyl groups of these compounds are linked via ethylene glycol and / or propylene glycol residues (for example, SR454 and SR499, commercially available from Sartomer).Furthermore, polymerizable compounds include diglycerin EO (ethylene oxide) modified (meth)acrylate (commercially available as M-460; manufactured by Toagosei), pentaerythritol tetraacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., NK Ester A-TMMT), and 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD). HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.), 8UH-1 006, 8UH-1012 (both manufactured by Taisei Fine Chemical Co., Ltd.), Light Acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.), Arronix MT-3041, 3042 (manufactured by Toagosei Co., Ltd., polymerizable compound containing amine), Arronix M-510, 520 (manufactured by Toagosei Co., Ltd., polymerizable compound having an acidic group), Etercure 6361-100 (Eternal Materials Inc. (a polymerizable compound with a hyperbranched structure), EBECRYL80 (a tetrafunctional monomer containing an amine, manufactured by Daicel-Orkenes Corporation), EBECRYL7100 (a difunctional monomer containing an amine, manufactured by Daicel-Orkenes Corporation), CN371NS (a difunctional monomer containing an amine, manufactured by Arkema Corporation), HOA-MPL (2-acryloyloxyethyl phthalate, manufactured by Kyoeisha Chemical Co., Ltd.), HOA-MPE (2-acryloyloxyethyl-2-hydroxyethyl phthalate, manufactured by Kyoeisha Chemical Co., Ltd.) Other polymerizable compounds that can be used include those described in Japanese Patent Publication No. 2023-043479 (manufactured by Daicel Ornex Co., Ltd.), polymerizable compounds that have a dendrimer structure or a hyperbranch structure, those described in Japanese Patent Publication No. 2023-529984, polymerizable compounds that contain a urethane bond as described in Japanese Patent Publication No. 2024-070237, EBECRYL 5129 (manufactured by Daicel Ornex Co., Ltd.), EBECRYL 220 (manufactured by Daicel Ornex Co., Ltd.), KUA-9N (manufactured by KSM Co., Ltd.), and polymerizable compounds described in Japanese Patent Publication No. 2024-085753.

[0022] As polymerizable compounds, polymerizable compounds having a fluorene skeleton can also be used. The polymerizable compound having a fluorene skeleton is preferably a bifunctional polymerizable compound. Examples of commercially available polymerizable compounds having a fluorene skeleton include Ogusol EA-0200 and EA-0300 (manufactured by Osaka Gas Chemical Co., Ltd., (meth)acrylate monomers having a fluorene skeleton).

[0023] It is also preferable to use polymerizable compounds that contain ether bonds. By using such polymerizable compounds, the hydrophilicity of the matrix is ​​improved, and the generation of residue after development can be further suppressed.

[0024] The number of ether bonds contained in the polymerizable compound is preferably 1 to 30, more preferably 3 to 25, and even more preferably 5 to 20.

[0025] The content of polymerizable compounds in the total solids of the curable composition is preferably 1 to 70% by mass. The upper limit is preferably 60% by mass or less, and more preferably 49% by mass or less. The lower limit is preferably 10% by mass or more, and more preferably 20% by mass or more.

[0026] The content of polymerizable compounds containing ether bonds in the total solid content of the curable composition is preferably 1 to 70% by mass. The upper limit is preferably 60% by mass or less, and more preferably 49% by mass or less. The lower limit is preferably 10% by mass or more, and more preferably 20% by mass or more.

[0027] The curable composition of the present invention may contain only one polymerizable compound or two or more polymerizable compounds. When two or more polymerizable compounds are included, it is preferable that their total amount falls within the above range.

[0028] <<Resin>> The curable composition of the present invention contains a resin. The resin is used, for example, to disperse pigments and the like in the curable composition, or as a binder. A resin used mainly to disperse pigments and the like in the curable composition is also called a dispersant. However, such uses of the resin are just examples, and the resin can also be used for purposes other than those mentioned above. The curable composition of the present invention preferably contains a resin as a binder.

[0029] The weight-average molecular weight (Mw) of the resin is preferably between 3,000 and 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 4,000 or more, and more preferably 5,000 or more.

[0030] Examples of resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene etherphosphine oxide resins, polyimide resins, polyamide-imide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, siloxane resins, and urethane resins. Urethane resin is a polymer compound formed by the reaction of an isocyanate group and an alcohol group. Specifically, it is a polymer compound having a urethane bond (or carbamate bond) formed by reacting a compound having an isocyanate group (polyisocyanate) with a compound having an alcohol group (polyol). The urethane value of the urethane resin is preferably 0.5 to 6.0 mmol / g. The lower limit is preferably 1.0 mmol / g or more, more preferably 1.5 mmol / g or more, and even more preferably 2.0 mmol / g or more. The upper limit is preferably 5.0 mmol / g or less, more preferably 4.5 mmol / g or less, and even more preferably 4.0 mmol / g or less. The urethane value of the urethane resin is particularly preferably 2.0 to 4.0 mmol / g. The urethane value of the urethane resin is a numerical value that represents the molar amount of urethane bonds per gram of solid content of the urethane resin.

[0031] Furthermore, the resins include the resin described in paragraphs 0091 to 0099 of International Publication No. 2022 / 065215, the blocked polyisocyanate resin described in Japanese Patent Publication No. 2016-222891, the resin described in Japanese Patent Publication No. 2020-122052, the resin described in Japanese Patent Publication No. 2020-111656, the resin described in Japanese Patent Publication No. 2020-139021, the resin described in Japanese Patent Publication No. 2017-138503 which includes a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain, the resin described in paragraphs 0199 to 0233 of Japanese Patent Publication No. 2020-186373, the alkali-soluble resin described in Japanese Patent Publication No. 2020-186325, and Korean Patent Publication No. 10-2020-0078339. You may also use a resin represented by Formula 1 as described in the publication, a copolymer containing epoxy and acid groups as described in International Publication No. 2022 / 030445, a resin as described in Japanese Patent Application Publication No. 2018-135514, a copolymer as described in Japanese Patent Application Publication No. 2020-041046, a resin as described in Japanese Patent Application Publication No. 2023-033156, a resin as described in Japanese Patent Application Publication No. 2023-030386, a resin as described in Japanese Patent Application Publication No. 2023-027753, a resin as described in Japanese Patent Application Publication No. 2020-139021, a resin as described in Japanese Patent Application Publication No. 2023-074038, a resin as described in Japanese Patent Application Publication No. 2023-079666, a cardo resin as described in Chinese Patent Application Publication No. 115947929, or a copolymer as described in Japanese Patent Application Publication No. 2024-014141.

[0032] It is preferable to use a resin having acidic groups. Examples of acidic groups include carboxyl groups, phosphate groups, sulfo groups, and phenolic hydroxyl groups.

[0033] The acid value of the resin having acid groups is preferably 30 to 500 mg KOH / g. The lower limit is preferably 40 mg KOH / g or more, and more preferably 50 mg KOH / g or more. The upper limit is preferably 400 mg KOH / g or less, more preferably 300 mg KOH / g or less, and even more preferably 200 mg KOH / g or less. The weight-average molecular weight (Mw) of the resin having acid groups is preferably 5,000 to 100,000, and more preferably 5,000 to 50,000. The number-average molecular weight (Mn) of the resin having acid groups is preferably 1,000 to 20,000.

[0034] Resins having acidic groups preferably contain repeating units having acidic groups in their side chains, and more preferably contain repeating units having acidic groups in their side chains in an amount of 5 to 70 mol% of the total repeating units of the resin. The upper limit of the content of repeating units having acidic groups in their side chains is preferably 50 mol% or less, and more preferably 30 mol% or less. The lower limit of the content of repeating units having acidic groups in their side chains is preferably 10 mol% or more, and more preferably 20 mol% or more.

[0035] Regarding resins having acid groups, reference can be made to paragraphs 0558-0571 of Japanese Patent Application Publication No. 2012-208494 (paragraphs 0685-0700 of the corresponding US Patent Application Publication No. 2012 / 0235099) and paragraphs 0076-0099 of Japanese Patent Application Publication No. 2012-198408, the contents of which are incorporated herein by reference. Furthermore, commercially available resins having acid groups can also be used. There are no particular restrictions on the method of introducing acid groups into the resin, but for example, the method described in Japanese Patent No. 6349629 can be cited. In addition, as a method of introducing acid groups into the resin, a method can be cited in which an acid anhydride is reacted with a hydroxyl group produced by a ring-opening reaction of an epoxy group to introduce an acid group.

[0036] The curable composition of the present invention may also preferably contain a resin having a basic group. The resin having a basic group is preferably a resin containing repeating units having a basic group in its side chain, more preferably a copolymer having repeating units having a basic group in its side chain and repeating units not having a basic group, and even more preferably a block copolymer having repeating units having a basic group in its side chain and repeating units not having a basic group. The resin having a basic group can also be used as a dispersant. The amine value of the resin having a basic group is preferably 5 to 300 mg KOH / g. The lower limit is preferably 10 mg KOH / g or more, and more preferably 20 mg KOH / g or more. The upper limit is preferably 200 mg KOH / g or less, and more preferably 100 mg KOH / g or less.

[0037] Commercially available resins containing basic groups include DISPERBY K-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, BYK-LPN6919 (all manufactured by Bic Chemie), and Solspers 112. Examples include 00, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 35200, 37500, 38500, 39000, 53095, 56000, 7100 (all manufactured by Lubrizol Japan), Efka PX 4300, 4330, 4046, 4060, 4080 (all manufactured by BASF), etc. Furthermore, the resin having basic groups may also be the block copolymer (B) described in paragraphs 0063 to 0112 of Japanese Patent Application Publication No. 2014-219665, the block copolymer A1 described in paragraphs 0046 to 0076 of Japanese Patent Application Publication No. 2018-156021, or the vinyl resin having basic groups described in paragraphs 0150 to 0153 of Japanese Patent Application Publication No. 2019-184763, the details of which are incorporated herein by reference.

[0038] The curable composition of the present invention may also preferably contain a resin having an acidic group and a resin having a basic group. According to this embodiment, the storage stability of the curable composition can be further improved. When a resin having an acidic group and a resin having a basic group are used in combination, the content of the resin having a basic group is preferably 20 to 500 parts by mass, more preferably 30 to 300 parts by mass, and even more preferably 50 to 200 parts by mass, per 100 parts by mass of the resin having an acidic group.

[0039] It is also preferable to use a resin having aromatic carboxyl groups as the resin. In a resin having aromatic carboxyl groups, the aromatic carboxyl groups may be included in the main chain of the repeating unit or in the side chain of the repeating unit. It is preferable that the aromatic carboxyl groups are included in the main chain of the repeating unit. In this specification, an aromatic carboxyl group is a group having a structure in which one or more carboxyl groups are bonded to an aromatic ring. In an aromatic carboxyl group, the number of carboxyl groups bonded to the aromatic ring is preferably 1 to 4, and more preferably 1 to 2. Examples of resins having aromatic carboxyl groups include the resins described in paragraphs 0082 to 0107 of International Publication No. 2021 / 166858.

[0040] It is also preferable to use a resin having crosslinkable groups. Examples of crosslinkable groups include ethylenically unsaturated bond-containing groups and cyclic ether groups. Examples of ethylenically unsaturated bond-containing groups include vinyl groups, allyl groups, (meth)acryloyl groups, and styrene groups. Examples of cyclic ether groups include epoxy groups and oxetanyl groups. When using a resin having crosslinkable groups, the content of the resin having crosslinkable groups in the resin contained in the curable composition is preferably 30% by mass or more, more preferably 50% by mass or more, and even more preferably 70% by mass or more.

[0041] The resin preferably includes a graft resin. Examples of graft resins include resins having repeating units with graft chains. In this specification, a graft chain refers to a polymer chain that branches off and extends from the main chain of the repeating unit. The graft chain preferably has 40 to 10,000 atoms excluding hydrogen atoms, more preferably 50 to 2,000 atoms excluding hydrogen atoms, and even more preferably 60 to 500 atoms excluding hydrogen atoms.

[0042] The graft chain preferably contains repeating units of at least one structure selected from the group consisting of polyester structures, polyether structures, poly(meth)acrylic structures, polystyrene structures, polyurethane structures, polyurea structures, and polyamide structures; more preferably contains repeating units of at least one structure selected from the group consisting of polyester structures, polyether structures, poly(meth)acrylic structures, and polystyrene structures; even more preferably contains repeating units of polyester structures or polyether structures; and particularly preferably contains repeating units of polyester structures.

[0043] If the curable composition of the present invention contains a pigment, it is also preferable that the curable composition of the present invention contains a resin as a dispersant. The dispersant content is preferably 1 to 45 parts by mass per 100 parts by mass of pigment. The upper limit is preferably 40 parts by mass or less, and more preferably 35 parts by mass or less. The lower limit is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more.

[0044] Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, an acidic dispersant (acidic resin) refers to a resin in which the amount of acidic groups is greater than the amount of basic groups. As an acidic dispersant (acidic resin), it is preferable that the amount of acidic groups is 70 mol% or more when the total amount of acidic groups and basic groups is set to 100 mol%. The acidic group of the acidic dispersant (acidic resin) is preferably a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mg KOH / g. Furthermore, a basic dispersant (basic resin) refers to a resin in which the amount of basic groups is greater than the amount of acidic groups. As a basic dispersant (basic resin), it is preferable that the amount of basic groups exceeds 50 mol% when the total amount of acidic groups and basic groups is set to 100 mol%. The basic group of the basic dispersant is preferably an amino group.

[0045] The resin used as a dispersant is preferably a graft resin. The resin used as a dispersant is also preferably a resin having aromatic carboxyl groups.

[0046] The resin used as a dispersant is preferably a polyimine-based dispersant containing a nitrogen atom in at least one of its main chain and side chains. Preferably, the polyimine-based dispersant has a main chain having a substructure with functional groups having a pKa of 14 or less, and side chains with 40 to 10,000 atoms, and contains a basic nitrogen atom in at least one of its main chain and side chains. The basic nitrogen atom is not particularly limited as long as it exhibits basic properties. For polyimine-based dispersants, refer to paragraphs 0102 to 0166 of Japanese Patent Application Publication No. 2012-255128, the contents of which are incorporated herein by reference.

[0047] The resin used as a dispersant is preferably a resin with a structure in which multiple polymer chains are bonded to the core. Examples of such resins include dendrimers (including star-shaped polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of Japanese Patent Application Publication No. 2013-043962.

[0048] The resin used as a dispersant is preferably a resin containing repeating units having ethylenically unsaturated bond-containing groups in their side chains. The content of repeating units having ethylenically unsaturated bond-containing groups in their side chains is preferably 10 mol% or more, more preferably 10 to 80 mol%, and even more preferably 20 to 70 mol% of the total repeating units of the resin.

[0049] As a dispersant, the resin described in Japanese Patent Publication No. 2018-087939, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077, polyethyleneimine having polyester side chains as described in International Publication No. 2016 / 104803, the block copolymer described in International Publication No. 2019 / 125940, the block polymer having acrylamide structural units as described in Japanese Patent Publication No. 2020-066687, and the acrylic polymer described in Japanese Patent Publication No. 2020-066688. Block polymers having lylamide structural units, dispersants described in International Publication No. 2016 / 104803, triazine compounds described in Korean Patent Publication No. 10-2017-0129400, dispersants described in Japanese Patent Application Publication No. 2024-050950, triazine compounds described in Korean Patent Publication No. 10-2017-0129416, aryl-modified branched reaction products described in Japanese Patent Application Publication No. 2024-510115, pigment dispersants described in Chinese Patent Application Publication No. 109554004, and the like can also be used.

[0050] Dispersants are also available commercially, and specific examples include the DISPERBYK series from BYK Chemie, the SOLSPERSE series from Lubrizol Nippon, the Efka series from BASF, and the Azisper series from Ajinomoto Fine Techno Co., Ltd. In addition, the products described in paragraph 0129 of Japanese Patent Publication No. 2012-137564 and paragraph 0235 of Japanese Patent Publication No. 2017-194662 can also be used as dispersants.

[0051] The content of the resin in the total solid content of the curable composition is preferably 30% by mass or more, more preferably 40% by mass or more, and still more preferably 50% by mass or more. The upper limit is preferably 95% by mass or less, and more preferably 90% by mass or less.

[0052] The total content of the resin and the polymerizable compound in the total solid content of the curable composition is preferably 50% by mass or more, more preferably 60% by mass or more, and still more preferably 70% by mass or more. The upper limit is preferably 99% by mass or less, and more preferably 97% by mass or less.

[0053] The ratio of the resin to the polymerizable compound in the curable composition is preferably 30 to 300 parts by mass of the polymerizable compound with respect to 100 parts by mass of the resin. The upper limit is preferably 250 parts by mass or less, more preferably 200 parts by mass or less, and still more preferably 140 parts by mass or less. The lower limit is preferably 50 parts by mass or more, and more preferably 70 parts by mass or more.

[0054] The curable composition of the present invention may contain only one kind of resin or two or more kinds of resins. When two or more kinds of resins are contained, the total amount thereof is preferably within the above range.

[0055] <<Photoinitiator>> The curable composition of the present invention contains a photoinitiator. The photoinitiator is preferably a photo radical polymerization initiator.

[0056] (Glyoxylate compound) As the photoinitiator contained in the curable composition of the present invention, those containing a glyoxylate compound are used.

[0057] Examples of the glyoxylate compound include the compound represented by the formula (1) and the compound represented by the formula (2). For the reason that a film with more suppressed coloring can be formed, the compound represented by the formula (1) is preferable.

[0058]

[0059] In the formula (1), Ar １R represents an m1+n1 valent group containing at least one selected from the group consisting of aromatic rings and heteroaromatic rings, １ R represents an alkyl group. ２ represents a halogen atom, nitro group, cyano group, or acyl group, n1 represents an integer from 1 to 4, and m1 represents an integer from 0 to 2; in formula (2), Ar １１ R represents an m²+1 valent group containing at least one selected from the group consisting of aromatic rings and heteroaromatic rings, １１ R represents an n-2 valent organic group. １２ n² represents a halogen atom, nitro group, cyano group, or acyl group, n² represents an integer from 2 to 6, and m² represents an integer from 0 to 2.

[0060] -Ar １ Regarding - In equation (1), Ar １ This represents an m1+n1 valent group containing at least one selected from the group consisting of aromatic rings and heteroaromatic rings.

[0061] Ar １ Examples of m1+n1 valent groups represented by include m1+n1 valent aromatic ring groups, m1+n1 valent heterocyclic groups, groups in which two or more aromatic ring groups are linked by a single bond or a linking group, groups in which two or more heterocyclic groups are linked by a single bond or a linking group, and groups in which an aromatic ring group and a heterocyclic group are linked by a single bond or a linking group. Examples of linking groups that link aromatic rings together, heterocyclic groups together, or aromatic ring groups and heterocyclic groups include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - And combinations thereof, etc. are examples. ｘ This represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0062] Ar in equation (1) １ It is preferable that the group is represented by any of the formulas (Ar1-1) to (Ar1-14), more preferably by the formula (Ar1-1), (Ar1-6), or (Ar1-8), and even more preferably by the formula (Ar1-1).

[0063] In the formula, * represents the bond with the glyoxylate group in formula (1), and the wavy line represents R in formula (1). ２ This represents a combination of n1 and m1, where n1 is an integer from 1 to 4, m1 is an integer from 0 to 2, and Ar Ａ１ R represents an arylene group or a heteroarylene group. Ａ１ ~R Ａ９ Each of these independently represents a hydrogen atom or a monovalent organic group.

[0064] R Ａ１ ~R Ａ９ Examples of monovalent organic groups represented by include alkyl groups, alkenyl groups, alkynyl groups, aryl groups, and heterocyclic groups. The number of carbon atoms in an alkyl group is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have substituents. Examples of substituents include halogen atoms, aryl groups, and heterocyclic groups. The number of carbon atoms in an alkenyl group is preferably 2 to 15, and more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have substituents. Examples of substituents include halogen atoms, aryl groups, and heterocyclic groups. The number of carbon atoms in an alkynyl group is preferably 2 to 15, and more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have substituents. Examples of substituents include halogen atoms, aryl groups, and heterocyclic groups. The aryl group has 6 to 20 carbon atoms, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferably 6 carbon atoms. The aryl group may have substituents. Examples of substituents include halogen atoms, alkyl groups, alkenyl groups, alkynyl groups, and heterocyclic groups. The heterocyclic group is preferably a 5-membered or 6-membered ring. The heteroatoms of the heterocyclic group are preferably oxygen, nitrogen, and sulfur atoms. The number of heteroatoms of the heterocyclic group is preferably 1 to 3. The heterocyclic group may have substituents. Examples of substituents include halogen atoms, alkyl groups, alkenyl groups, alkynyl groups, and aryl groups.

[0065] Ar Ａ１The symbol represents an arylene group or a heteroarylene group, and an arylene group is preferred. The number of carbon atoms in the arylene group is preferably 6 to 20, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferred to be 6. The heteroarylene group is preferably a 5-membered ring or a 6-membered ring. The heteroatoms in the heteroarylene group are preferably oxygen, nitrogen, and sulfur atoms. The number of heteroatoms in the heteroarylene group is preferably 1 to 3.

[0066] n1 and m1 in equations (Ar1-1) to (Ar1-14) are equivalent to n1 and m1 in equation (1).

[0067] -R １ Regarding - R in equation (1) １ R represents an alkyl group. １ The alkyl group represented by is preferably 1 to 15 carbon atoms, more preferably 1 to 10, and even more preferably 1 to 5 carbon atoms. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. １ The alkyl group represented by may have substituents, but it is preferable that it be an unsubstituted alkyl group. Examples of substituents include aryl groups, heteroaryl groups, alkoxy groups, alkylthio groups, alkylamino groups, aryloxy groups, arylthio groups, arylamino groups, heteroaryloxy groups, heteroarylthio groups, heteroarylamino groups, cyano groups, nitro groups, hydroxyl groups, carboxyl groups, halogen atoms, and acyl groups.

[0068] -R ２ Regarding - R in equation (1) ２ represents a halogen atom, a nitro group, a cyano group, or an acyl group, preferably a nitro group or an acyl group, and more preferably an acyl group.

[0069] R ２ Examples of halogen atoms represented by this symbol include fluorine, chlorine, bromine, and iodine.

[0070] R ２ The acyl group represented by is -COR ２０１It is preferable that the group is represented by R. ２０１ R represents an alkyl group, an aryl group, or a heteroaryl group, and is preferably an aryl group. ２０１ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have substituents. Examples of substituents include aryl groups, heteroaryl groups, alkoxy groups, alkylthio groups, alkylamino groups, aryloxy groups, arylthio groups, arylamino groups, heteroaryloxy groups, heteroarylthio groups, heteroarylamino groups, cyano groups, nitro groups, hydroxyl groups, carboxyl groups, halogen atoms, and acyl groups. ２０１ The aryl group represented by is preferably 6 to 20 carbon atoms, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferably 6 carbon atoms. The aryl group may have substituents. Examples of substituents include alkyl groups, aryl groups, heteroaryl groups, alkoxy groups, alkylthio groups, alkylamino groups, aryloxy groups, arylthio groups, arylamino groups, heteroaryloxy groups, heteroarylthio groups, heteroarylamino groups, cyano groups, nitro groups, hydroxyl groups, carboxyl groups, halogen atoms, and acyl groups, with alkyl groups being preferred. ２０１ The number of carbon atoms constituting the ring of the heteroaryl group represented by is preferably 1 to 15, and more preferably 1 to 10. Examples of heteroatoms constituting the ring of the heteroaryl group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3, and more preferably 1 to 2. The heteroaryl group may be a monoring or a fused ring. The heteroaryl group may have substituents. Examples of substituents include alkyl groups, aryl groups, heteroaryl groups, alkoxy groups, alkylthio groups, alkylamino groups, aryloxy groups, arylthio groups, arylamino groups, heteroaryloxy groups, heteroarylthio groups, heteroarylamino groups, cyano groups, nitro groups, hydroxyl groups, carboxyl groups, halogen atoms, and acyl groups, with alkyl groups being preferred.

[0071] -Regarding n1- In equation (1), n1 represents an integer from 1 to 4, and is preferably 1 or 2, and more preferably 1.

[0072] -Regarding m1- In equation (1), m1 represents an integer between 0 and 2, preferably 0 or 1, and more preferably 1.

[0073] -Ar １１ Regarding - Ar in equation (2) １１ This represents an m²+1 valent group containing at least one selected from the group consisting of aromatic rings and heteroaromatic rings.

[0074] Ar １１ Examples of m²+1 valent groups represented by include m²+1 valent aromatic ring groups, m²+1 valent heterocyclic groups, groups in which two or more aromatic ring groups are linked by a single bond or a linking group, groups in which two or more heterocyclic groups are linked by a single bond or a linking group, and groups in which an aromatic ring group and a heterocyclic group are linked by a single bond or a linking group. Examples of linking groups that link aromatic rings together, heterocyclic groups together, or aromatic ring groups and heterocyclic groups include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - And combinations thereof, etc. are examples. ｘ This represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0075] Ar in equation (2) １１ It is preferable that the group is represented by any of the formulas (Ar2-1) to (Ar2-14), more preferably by the formula (Ar2-1), (Ar2-6), or (Ar2-8), and even more preferably by the formula (Ar2-1).

[0076] In the formula, * represents the bond with the glyoxylate group in formula (2), and the wavy line represents R in formula (2). １２ This represents a combination with, where m² represents an integer between 0 and 2, and Ar Ｂ１ R represents an arylene group or a heteroarylene group. Ｂ１ ~R Ｂ９ Each of these independently represents a hydrogen atom or a monovalent organic group.

[0077] R Ｂ１ ~R Ｂ９ Examples of monovalent organic groups represented by include alkyl groups, alkenyl groups, alkynyl groups, aryl groups, and heterocyclic groups. The number of carbon atoms in an alkyl group is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have substituents. Examples of substituents include halogen atoms, aryl groups, and heterocyclic groups. The number of carbon atoms in an alkenyl group is preferably 2 to 15, and more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have substituents. Examples of substituents include halogen atoms, aryl groups, and heterocyclic groups. The number of carbon atoms in an alkynyl group is preferably 2 to 15, and more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have substituents. Examples of substituents include halogen atoms, aryl groups, and heterocyclic groups. The aryl group has 6 to 20 carbon atoms, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferably 6 carbon atoms. The aryl group may have substituents. Examples of substituents include halogen atoms, alkyl groups, alkenyl groups, alkynyl groups, and heterocyclic groups. The heterocyclic group is preferably a 5-membered or 6-membered ring. The heteroatoms of the heterocyclic group are preferably oxygen, nitrogen, and sulfur atoms. The number of heteroatoms of the heterocyclic group is preferably 1 to 3. The heterocyclic group may have substituents. Examples of substituents include halogen atoms, alkyl groups, alkenyl groups, alkynyl groups, and aryl groups.

[0078] Ar Ｂ１The symbol represents an arylene group or a heteroarylene group, and an arylene group is preferred. The number of carbon atoms in the arylene group is preferably 6 to 20, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferred to be 6. The heteroarylene group is preferably a 5-membered ring or a 6-membered ring. The heteroatoms in the heteroarylene group are preferably oxygen, nitrogen, and sulfur atoms. The number of heteroatoms in the heteroarylene group is preferably 1 to 3.

[0079] In equations (Ar2-1) to (Ar2-14), m1 is equivalent to m2 in equation (2).

[0080] -R １１ Regarding R in equation (2) １１ This represents an n2-valent organic group. Examples of n2-valent organic groups include hydrocarbon groups; two or more hydrocarbon groups bonded together by a single bond, -O-, -S-, -CO-, -COO-, -OCO-, -SO ２ Examples include groups bonded via -, -NH-, -NHCO-, -CONH-, -NHCONH-, -NHCOO-, or -OCONH-.

[0081] Examples of hydrocarbon groups include aliphatic hydrocarbon groups and aromatic hydrocarbon groups, with aliphatic hydrocarbon groups being preferred. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The cyclic aliphatic hydrocarbon group may be monocyclic or fused. The cyclic aliphatic hydrocarbon group may also have a crosslinking structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have substituents. Examples of substituents include alkyl groups, aryl groups, heteroaryl groups, alkoxy groups, alkylthio groups, alkylamino groups, aryloxy groups, arylthio groups, arylamino groups, heteroaryloxy groups, heteroarylthio groups, heteroarylamino groups, cyano groups, nitro groups, hydroxyl groups, carboxyl groups, halogen atoms, and acyl groups.

[0082] -R １２ Regarding R in equation (2)１２ R represents a halogen atom, a nitro group, a cyano group, or an acyl group, preferably a nitro group or an acyl group, and more preferably an acyl group. １２ For details of the above base represented by, see R in equation (1) ２ The content is the same as explained earlier, and the preferred range is also the same.

[0083] -Regarding n2- In equation (2), n2 represents an integer between 2 and 6, preferably between 2 and 4, and more preferably 2.

[0084] -Regarding m²- In equation (2), m² represents an integer between 0 and 2, preferably 0 or 1, and more preferably 1.

[0085] The glyoxylate compound is preferably a compound represented by formula (3).

[0086] In formula (3), R １０１ R represents an alkyl group. １１１ ~R １１５ Each of these independently represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an alkylthio group, an alkylamino group, an aryloxy group, an arylthio group, an arylamino group, a heteroaryloxy group, a heteroarylthio group, a heteroarylamino group, a cyano group, a nitro group, a hydroxyl group, a carboxyl group, a halogen atom, or an acyl group.

[0087] R in equation (3) １０１ R in equation (1) １ This is synonymous with the following, and the preferred range is also similar. １１１ ~R １１５ It is preferable that it be a hydrogen atom.

[0088] Specific examples of glyoxylate compounds include compounds I-1 to I-3 described in the examples below. A commercially available example of a glyoxylate compound is Esacure 563 (manufactured by IGM Resins B.V.).

[0089] (Other Photopolymerization Initiators) The photopolymerization initiator contained in the curable composition of the present invention may include a compound different from the glyoxylate compound (hereinafter also referred to as "other photopolymerization initiator"). By using the glyoxylate compound and other photopolymerization initiators in combination, it is possible to adjust the balance between suppressing the generation of residue, suppressing discoloration, and maintaining stability over time. When using the glyoxylate compound and other photopolymerization initiators in combination, the content of the other photopolymerization initiator is preferably 10 to 90 parts by mass per 100 parts by mass of the glyoxylate compound. The upper limit is preferably 80 parts by mass or less, and more preferably 70 parts by mass or less. The lower limit is preferably 20 parts by mass or more, and more preferably 30 parts by mass or more. Furthermore, it is also preferable that the photopolymerization initiator used in the present invention is substantially only the glyoxylate compound. According to this embodiment, the occurrence of discoloration caused by the photopolymerization initiator can be suppressed. The term "substantially consisting of a glyoxylate compound" means that the glyoxylate compound content in the photopolymerization initiator is 99% by mass or more, preferably 99.9% by mass or more, and more preferably consisting solely of a glyoxylate compound.

[0090] Other photopolymerization initiators include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, and α-aminoketone compounds. Other photopolymerization initiators are preferably trihalomethyltriazine compounds, benzyldimethylketal compounds, α-hydroxyketone compounds, α-aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, hexaarylbiimidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halomethyloxadiazole compounds, or 3-aryl-substituted coumarin compounds, more preferably oxime compounds, α-hydroxyketone compounds, α-aminoketone compounds, or acylphosphine compounds, even more preferably α-aminoketone compounds or oxime compounds, and particularly preferably oxime compounds.

[0091] Other photopolymerization initiators include the compounds described in paragraphs 0065 to 0111 of Japanese Patent Publication No. 2014-130173, the compounds described in Japanese Patent Publication No. 6301489, and MATERIAL STAGE 37-60p, vol. 19, No. 3. Peroxide-based photopolymerization initiators described in 2019, photopolymerization initiators described in International Publication No. 2018 / 221177, photopolymerization initiators described in International Publication No. 2018 / 110179, photopolymerization initiators described in JP 2019-043864, photopolymerization initiators described in JP 2019-044030, peroxide-based initiators described in JP 2019-167313, aminoacetophenone-based initiators having an oxazolidine group described in JP 2020-055992, JP 2013- Oxime-based photopolymerization initiator described in Japanese Patent Publication No. 190459, polymer described in Japanese Patent Application Publication No. 2020-172619, compound represented by formula 1 described in International Publication No. 2020 / 152120, compound described in Japanese Patent Application Publication No. 2021-181406, photopolymerization initiator described in Japanese Patent Application Publication No. 2022-013379, compound represented by formula (1) described in Japanese Patent Application Publication No. 2022-015747, fluorine-containing fluorene oxime ester-based photoinitiator described in Japanese Patent Application Publication No. 2021-507058, Chinese Patent Application Publication No. 11 Initiators described in Specification No. 0764367, initiators described in Japanese Patent Publication No. 2022-518535, initiators described in International Publication No. 2021 / 175855, compounds described in Taiwan Patent Application Publication No. 202200534, compounds described in Japanese Patent Application Publication No. 2022-078550, compounds described in Korean Published Patent No. 10-2017-0087330, compounds described in International Publication No. 2022 / 075452, oxime ester compounds described in Chinese Patent Application Publication No. 110066225, Korean Compounds described in Japanese Patent Publication No. 10-2022-0076157, compounds described in paragraphs 0042-0062 of International Publication No. 2019 / 013112 having a triarylamine or N-arylcarbazole skeleton, oxime ester-based photopolymerization initiators described in Japanese Patent Publication No. 7219378, photopolymerization initiators described in Korean Published Patent No. 10-2021-0146174, photopolymerization initiators described in International Publication No. 2019 / 013112, photopolymerization initiators described in Japanese Patent Publication No. 2023-033731,Initiators described in Japanese Patent Publication No. 2022-515524, initiators described in Japanese Patent Publication No. 2023-517304, initiators described in Chinese Patent Application Publication No. 114149517, aminoketone compounds described in Chinese Patent Application Publication No. 115925596, compounds described in Japanese Patent Application Publication No. 2023-159489, compounds described in Japanese Patent Application Publication No. 2023-159487, compounds described in Taiwan Patent Application Publication No. 202336003, compounds described in Chinese Patent Application Publication No. 113527138, organosilicon compounds described in Japanese Patent Publication No. 2022-502526, Korean Published Patent Examples include the oxime compound described in Japanese Patent Publication No. 10-2017-0009794, the photopolymerization initiator described in Korean Published Patent Publication No. 10-2023-0033862, the oxime ester compound described in Japanese Patent Publication No. 2019-519518, the polyfunctional polymer photopolymerization initiator described in Japanese Patent Publication No. 2024-517534, the photopolymerization initiator described in International Publication No. 2024 / 085227, the compound described in Japanese Patent Publication No. 2024-521379, the photopolymerization initiator described in Japanese Patent Publication No. 2024-523053, and the oxime ester initiator described in Chinese Patent Application Publication No. 117510396.

[0092] Specific examples of hexaarylbiimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole.

[0093] Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (all manufactured by IGM Resins B.V.), and Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (all manufactured by BASF). Commercially available acylphosphine compounds include Omnirad 819 and Omnirad TPO (both manufactured by IGM Resins B.V.), and Irgacure 819 and Irgacure TPO (both manufactured by BASF).

[0094] Examples of oxime compounds include the compounds described in paragraph 0142 of International Publication No. 2022 / 085485, the compounds described in Japanese Patent No. 5430746, the compounds described in Japanese Patent No. 5647738, the compounds represented by general formula (1) and the compounds described in paragraphs 0022 to 0024 of Japanese Patent Publication No. 2021-173858, and the compounds represented by general formula (1) and the compounds described in paragraphs 0117 to 0120 of Japanese Patent Publication No. 2021-170089. Specific examples of oxime compounds include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropane-1-one, 2-benzoyloxyimino-1-phenylpropane-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropane-1-one, and 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime). Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04, Irgacure OXE05 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-3054, TR-PBG-3057, TR-PBG-314, TR-PBG-327, TR-PBG-345, TR-PBG-346, TR- Examples include PBG-358, TR-PBG-365, TR-PBG-380, TR-PBG-610, TR-PBG-A, TR-PBG-B (all manufactured by TRONLY), and ADEKA Optomer N-1919 (manufactured by ADEKA Corporation, photopolymerization initiator 2 described in Japanese Patent Publication No. 2012-014052). Furthermore, it is also preferable to use compounds that do not produce color or compounds that are highly transparent and resistant to discoloration as oxime compounds. Examples of commercially available products include ADEKA Arclus NCI-730, NCI-831, NCI-831E, and NCI-930 (all manufactured by ADEKA Corporation).

[0095] Other photopolymerization initiators may include oxime compounds having a fluorene ring, oxime compounds having a skeleton in which at least one benzene ring of the carbazole ring is replaced by a naphthalene ring, oxime compounds having a fluorine atom, oxime compounds having a nitro group, oxime compounds having a benzofuran skeleton, oxime compounds in which a substituent having a hydroxyl group is attached to the carbazole skeleton, and compounds described in paragraphs 0143 to 0149 of International Publication No. 2022 / 085485.

[0096] As an alternative photopolymerization initiator, the compound represented by formula (OX-1) can also be used.

[0097] In formula (OX-1), X １ａ R represents a divalent linking group containing at least one selected from the group consisting of aromatic rings and heterocycles. １ａ R represents a hydrogen atom or an acyl group. ２ａ R represents an alkyl or aryl group. ３ａ and R ４ａ Each of these independently represents a hydrogen atom or an alkyl group, and Alk １ and Alk ２ Each of these independently represents an alkyl group, R ３ａ and R ４ａ They may be bonded together to form a ring, Alk １ and Alk ２ The elements may be joined together to form a ring, and n represents either 0 or 1.

[0098] X in equation (OX-1) １ａ Examples of divalent linking groups represented by include divalent aromatic ring groups, divalent heterocyclic groups, divalent groups formed by linking two or more aromatic ring groups via single bonds or linking groups, divalent groups formed by linking two or more heterocyclic groups via single bonds or linking groups, and divalent groups formed by linking an aromatic ring group and a heterocyclic group via single bonds or linking groups. Examples of linking groups that link aromatic ring groups to each other, heterocyclic groups to each other, or an aromatic ring group and a heterocyclic group include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - And combinations thereof, etc. are examples. ｘrepresents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heterocyclic group.

[0099] X in formula (OX-1) １ａ is preferably a group represented by any of formulas (X-1) to (X-13), more preferably a group represented by formula (X-1), formula (X-2), formula (X-4), formula (X-6) or formula (X-8), and still more preferably a group represented by formula (X-2) or formula (X-6).

[0100] In the formula, R Ｘ１ to R Ｘ９ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, and * represents a bond.

[0101] R Ｘ１ to R Ｘ９ The alkyl group represented by R preferably has 1 to 15 carbon atoms, more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, a heteroaryl group, etc.

[0102] R Ｘ１ to R Ｘ９ The alkenyl group represented by R preferably has 2 to 15 carbon atoms, more preferably 2 to 10 carbon atoms. The alkenyl group may be linear, branched or cyclic. The alkenyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, a heteroaryl group, etc.

[0103] R Ｘ１ to R Ｘ９ The alkynyl group represented by R preferably has 2 to 15 carbon atoms, more preferably 2 to 10 carbon atoms. The alkynyl group may be linear, branched or cyclic. The alkynyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, a heteroaryl group, etc.

[0104] R Ｘ１ to R Ｘ９The number of carbon atoms of the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, a heteroaryl group, and the like.

[0105] R Ｘ１ ~R Ｘ９ The heteroaryl group represented by is preferably a 5-membered ring or a 6-membered ring. The heteroatoms contained in the heteroaryl group are preferably an oxygen atom, a nitrogen atom, and a sulfur atom. The number of heteroatoms contained in the heteroaryl group is preferably 1 to 3. The heteroaryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, and the like.

[0106] R in formula (OX-1) １ａ represents a hydrogen atom or an acyl group, and is preferably an acyl group.

[0107] R in formula (OX-1) ２ａ represents an alkyl group or an aryl group, and is preferably an alkyl group because of the high reactivity of the generated radical. The number of carbon atoms of the alkyl group represented by R is preferably 1 to 15, more preferably 1 to 10, still more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ２ａ The alkyl group represented by is preferably an unsubstituted linear or branched alkyl group, and more preferably an unsubstituted linear alkyl group. The number of carbon atoms of the aryl group represented by R is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group. ２ａ The alkyl group represented by is preferably an unsubstituted linear or branched alkyl group, and more preferably an unsubstituted linear alkyl group. R ２ａ The number of carbon atoms of the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group.

[0108] R in formula (OX-1) ３ａ and R ４ａEach of these independently represents a hydrogen atom or an alkyl group, and a hydrogen atom is preferred. ３ａ and R ４ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have substituents, but is preferably an unsubstituted alkyl group. ３ａ and R ４ａ These may be bonded together to form a ring. The formed ring is preferably a five-membered or six-membered ring, and more preferably a five-membered or six-membered aliphatic hydrocarbon ring.

[0109] Alk in equation (OX-1) １ and Alk ２ Each of these independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have substituents, but is preferably an unsubstituted alkyl group. Alk １ and Alk ２ The elements may be bonded together to form a ring, and it is preferable that a ring is formed. The formed ring is preferably a five-membered or six-membered ring, more preferably a five-membered or six-membered aliphatic hydrocarbon ring, and even more preferably a cyclopentane ring or a cyclohexane ring.

[0110] In formula (OX-1), n ​​represents either 0 or 1, and is preferably 0.

[0111] Specific examples of compounds represented by formula (OX-1) include the compounds described in paragraphs 0092 to 0096 of Japanese Patent Publication No. 2012-113104 and the compounds described in paragraph 0041 of Japanese Patent Publication No. 2012-189997.

[0112] As an alternative photopolymerization initiator, the compound represented by formula (OX-2) can also be used.

[0113]

[0114] In formula (OX-2), R １ｂ and R ２ｂ Each of these independently represents a substituent, R ３ｂ ~R ７ｂ Each of these independently represents a hydrogen atom or a substituent, and Ar １ｂ represents an optionally substituted aryl group or an optionally substituted heteroaryl group, and n represents 0 or 1.

[0115] R １ｂ and R ２ｂ The substituents represented by include alkyl groups and aryl groups, with alkyl groups being preferred. The number of carbon atoms in the alkyl group is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have substituents. Examples of substituents include halogen atoms, aryl groups, alkenyl groups, alkynyl groups, and heteroaryl groups. The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferably 6. The aryl group may have substituents. Examples of substituents include halogen atoms, alkyl groups, alkenyl groups, alkynyl groups, and heteroaryl groups.

[0116] R ３ｂ ~R ７ｂ The substituents represented by include halogen atoms, alkyl groups, and aryl groups. Examples of alkyl groups and aryl groups are those mentioned above. ３ｂ ~R ７ｂ It is preferable that it is a hydrogen atom.

[0117] Ar １ｂ Ar represents an optionally substituted aryl group or an optionally substituted heteroaryl group. １ｂIt is preferable that the group is an aryl group which may have substituents. The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferably 6. Examples of substituents include halogen atoms, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, alkylthio groups, arylthio groups, nitro groups, and acyl groups, with acyl groups being preferred.

[0118] As an alternative photopolymerization initiator, the compound represented by formula (OX-3) can also be used.

[0119]

[0120] In formula (OX-3), Ar １ｃ Ar represents an aromatic ring group with (k+m+1) valency or a heterocyclic ring group with (k+m+1) valency. ２ｃ R represents a (k+2) valent aromatic ring group or a (k+2) valent heterocyclic group, １ｃ ~R ３ｃ Each of these independently represents a substituent, L １ｃ is a single bond or CR １１ｃ R １２ｃ Represents R １１ｃ and R １２ｃ Each of these independently represents a hydrogen atom, an alkyl group, or an aryl group, X １ｃ ha-CH ２ It represents -, -N-, -O-, or -S-, where k represents 0 or 1, m represents an integer from 0 to 4, and n represents 0 or 1.

[0121] R １ｃ and R ２ｃThe substituents represented by include alkyl groups and aryl groups, with alkyl groups being preferred. The number of carbon atoms in the alkyl group is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have substituents. Examples of substituents include halogen atoms, aryl groups, alkenyl groups, alkynyl groups, and heteroaryl groups. The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferably 6. The aryl group may have substituents. Examples of substituents include halogen atoms, alkyl groups, alkenyl groups, alkynyl groups, and heteroaryl groups. ２ｃ It is preferable that the alkyl group has a branched or cyclic structure.

[0122] R ３ｃ Examples of substituents represented by include halogen atoms, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, and acyl groups, with acyl groups being preferred.

[0123] L １ｃ is a single bond or CR １１ｃ R １２ｃ Represents R １１ｃ and R １２ｃ Each of these independently represents a hydrogen atom, an alkyl group, or an aryl group. １１ｃ and R １２ｃ The alkyl and aryl groups in R １ｃ and R ２ｃ This is synonymous with alkyl and aryl groups in [the given context]. When k is 1, L １ｃ It is preferable that the bond is a single bond.

[0124] X １ｃ is, -CH ２ It represents -, -N-, -O-, or -S-, with -O- or -S- being preferred.

[0125] Ar １ｃrepresents a (k+m+1) valent aromatic ring group or a (k+m+1) valent heterocyclic group, and is preferably a (k+m+1) valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0126] Ar ２ｃ represents a (k+2) valent aromatic ring group or a (k+2) valent heterocyclic group, and is preferably a (k+2) valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0127] k represents 0 or 1, preferably 0. m represents an integer from 0 to 4, preferably 0 or 1, more preferably 1. n represents 0 or 1, preferably 0.

[0128] Other photopolymerization initiators that can be suitably used include ketoxime ester compounds having an allyl oil oxy group at the ortho position, represented by formula (OX-4). Examples of such compounds include those described in Chinese Patent Application Publication No. 117342977.

[0129] In formula (OX-4), R １ｄ and R ２ｄ Each of these independently represents an alkyl group, an aryl group, or a heterocyclic group; R ３ｄ , R ４ｄ , R ５ｄ , R ６ｄ These are, independently, hydrogen atoms, halogen atoms, CN, and NO. ２ CF ３ ,R,OR,SR,SOR,SO ２ R represents R or NRR', where R and R' each independently represent an alkyl group or an aryl group, and when R and R' are present together, R and R' may be bonded to form a ring, and one or more -CH groups in the alkyl group or aryl group represented by R and R' ２ Each of the hyphens may be independently substituted with -O-, -N-, -S-, -CO-, -COO-, -OCO-, or a benzene ring; R ７ｄ , R８ｄ and R ９ｄ Each of these independently represents either a hydrogen atom or a methyl group.

[0130] Other photopolymerization initiators that can be suitably used include compounds represented by formula (OX-5). Examples of such compounds include those described in International Publication No. 2024 / 101219.

[0131] In formula (OX-5), R １ｅ ~R ５ｅ Each of these independently represents a hydrocarbon group which may have substituents, and n represents an integer from 0 to 4.

[0132] Specific examples of oxime compounds include the following compounds.

[0133]

[0134]

[0135]

[0136]

[0137]

[0138] Other photopolymerization initiators may be used, including bifunctional or trifunctional or more functional photopolymerization initiators. Specific examples of bifunctional or trifunctional or more functional photopolymerization initiators include the compounds described in paragraph 0148 of International Publication No. 2022 / 065215.

[0139] The content of the photopolymerization initiator in the total solid content of the curable composition is preferably 1 to 20% by mass. The lower limit is preferably 2% by mass or more, and more preferably 3% by mass or more. The upper limit is preferably 15% by mass or less, and more preferably 10% by mass or less.

[0140] The content of the glyoxylate compound in the photopolymerization initiator is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more. The upper limit can be 100% by mass or less.

[0141] The ratio of photopolymerization initiator to polymerizable compound in the curable composition is preferably 2 to 100 parts by mass of photopolymerization initiator per 100 parts by mass of polymerizable compound. The upper limit is preferably 80 parts by mass or less, and more preferably 50 parts by mass or less. The lower limit is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more.

[0142] The ratio of the glyoxylate compound to the polymerizable compound in the curable composition is preferably 2 to 100 parts by mass of the glyoxylate compound per 100 parts by mass of the polymerizable compound. The upper limit is preferably 80 parts by mass or less, and more preferably 50 parts by mass or less. The lower limit is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more.

[0143] In the photocurable composition of the present invention, one photopolymerization initiator may be used alone, or two or more may be used. When two or more are used, it is preferable that their total amount is within the above range.

[0144] <<Solvent>> The curable composition of the present invention contains a solvent. Examples of solvents include organic solvents. The type of solvent is not particularly limited as long as it satisfies the solubility of each component and the applicability of the composition. Examples of organic solvents include ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, and hydrocarbon solvents. For further details, please refer to paragraph 0223 of International Publication No. 2015 / 166779, which is incorporated herein by reference. In addition, ester solvents and ketone solvents substituted with cyclic alkyl groups can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether, propylene Examples include propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol.However, the amount of aromatic hydrocarbons used as organic solvents (benzene, toluene, xylene, ethylbenzene, etc.) may be reduced for environmental reasons (for example, it may be reduced to 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less relative to the total amount of organic solvent).

[0145] It is preferable that the metal content of the organic solvent be low. The metal content of the organic solvent is preferably, for example, 10 ppb (parts per billion) or less by mass. If necessary, an organic solvent with a metal content at the ppt (parts per trillion) level by mass may be used; such organic solvents are provided, for example, by Toyo Gosei Co., Ltd. (Chemical Daily, November 13, 2015).

[0146] Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The material of the filter is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0147] Organic solvents may contain isomers (compounds with the same number of atoms but different structures). Furthermore, they may contain only one type of isomer or multiple types.

[0148] It is preferable that the peroxide content in the organic solvent is 0.8 mmol / L or less, and more preferably that it is substantially peroxide-free.

[0149] The solvent content in the curable composition is preferably 40 to 99% by mass. The lower limit is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more. The upper limit is preferably 98% by mass or less, and more preferably 95% by mass or less.

[0150] From the viewpoint of environmental regulations, the curable composition of the present invention preferably contains substantially no environmentally regulated substances. In this invention, "substantially free of environmentally regulated substances" means that the content of environmentally regulated substances in the curable composition is 50 ppm by mass or less, preferably 30 ppm by mass or less, more preferably 10 ppm by mass or less, and particularly preferably 1 ppm by mass or less. Examples of environmentally regulated substances include benzene; alkylbenzenes such as toluene and xylene; halogenated benzenes such as chlorobenzene, etc. These substances are registered as environmentally regulated substances under the REACH (Registration Evaluation Authorization and Restriction of Chemicals) regulations, the PRTR (Pollutant Release and Transfer Register) law, and the VOC (Volatile Organic Compounds) regulations, and their usage and handling methods are strictly regulated. These compounds may be used as solvents when manufacturing the various components used in curable compositions, and may be mixed into the curable composition as residual solvents. From the standpoint of human safety and environmental considerations, it is preferable to reduce these substances as much as possible. One method for reducing environmentally regulated substances is to heat or reduce the pressure in the system to above the boiling point of the environmentally regulated substance and distillate it off the system. Furthermore, when removing small amounts of environmentally regulated substances by distillation, it is useful to azeotrope with a solvent having a boiling point equivalent to that of the solvent in question in order to improve efficiency. In addition, if the mixture contains compounds that exhibit radical polymerization, polymerization inhibitors may be added during reduced-pressure distillation to suppress the progression of radical polymerization reactions and the resulting crosslinking between molecules. These distillation methods can be implemented at any stage, including the raw material stage, the product stage (e.g., the polymerized resin solution or polyfunctional monomer solution), or the stage of the curable composition prepared by mixing these compounds.

[0151] <<Ultraviolet Absorber>> The curable composition of the present invention may contain an ultraviolet absorber. Examples of ultraviolet absorbers include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl compounds. Specific examples of such compounds include the compound described in paragraph 0179 of International Publication No. 2022 / 085485, the reactive triazine ultraviolet absorber described in Japanese Patent Application Publication No. 2021-178918, the ultraviolet absorber described in Japanese Patent Application Publication No. 2022-007884, the compound described in Korean Patent Publication No. 10-2022-0014454, the compound described in Japanese Patent Application Publication No. 2023-013321, and the compound described in Japanese Patent Application Publication No. 2023-178225. It is also preferable to use a compound containing sulfur or nitrogen as the ultraviolet absorber. The content of ultraviolet absorbers in the total solid content of the curable composition is preferably 0.01 to 10% by mass, and more preferably 0.01 to 5% by mass. Only one type of ultraviolet absorber may be used, or two or more types may be used. If two or more types are used, it is preferable that their total amount falls within the above range.

[0152] <<White or colorless pigment (white pigment)>> The curable composition of the present invention may contain a white or colorless pigment (hereinafter also referred to as a white pigment).

[0153] Examples of white pigments include inorganic pigments such as titanium dioxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, and zinc sulfide. White pigments can be those described in paragraphs 0040-0043 of International Publication No. 2022 / 085485.

[0154] White pigments are preferably silica particles. Examples of silica particles include silica particles in which multiple spherical silica particles are linked together in a bead-like manner, silica particles in which multiple spherical silica particles are linked together in a planar manner, silica particles with a hollow structure, and solid silica particles.

[0155] Commercially available white pigments may be used. Examples of commercially available titanium dioxide include the TTO series (TTO-51(A), TTO-51(C), TTO-55(C), etc.), TTO-S, V series (TTO-S-1, TTO-S-2, TTO-V-3, etc.) (manufactured by Ishihara Sangyo Co., Ltd.), and MT series (MT-01, MT-05, etc.) (manufactured by Teika Co., Ltd.). Examples of commercially available silica particles include Aerosil 50, 90, 130, 150, 200, 255, 300, and 380 (manufactured by Evonik).

[0156] The content of white pigment in the total solids of the curable composition is preferably 80% by mass or less, more preferably 70% by mass or less, and even more preferably 60% by mass or less. The lower limit can be 20% by mass or more, and can also be 30% by mass or more. Depending on the desired film properties, the curable composition of the present invention may be substantially free of white pigment. In this specification, "substantially free of white pigment" means that the content of white pigment in the total solids of the curable composition is 0.5% by mass or less, preferably 0.1% by mass or less, and more preferably free of white pigment.

[0157] <<Coloring Agent>> The curable composition of the present invention may contain a coloring agent. Examples of coloring agents include chromatic coloring agents and black coloring agents. The coloring agent may be a pigment or a dye. Pigments and dyes may be used in combination.

[0158] Examples of colorants include chromatic colorants and black colorants. In this specification, a black colorant means a colorant that exhibits absorption over the entire wavelength range of 400 to 700 nm.

[0159] Examples of chromatic colorants include those having a maximum absorption wavelength in the range of 400 to 700 nm. Examples include green colorants, red colorants, yellow colorants, purple colorants, blue colorants, and orange colorants.

[0160] The content of colorants in the total solids of the curable composition is preferably 1% by mass or less. Furthermore, the total content of chromatic and black colorants in the total solids of the curable composition is preferably 1% by mass or less, and it is more preferable that the composition is substantially free of chromatic and black colorants. In this specification, "substantially free of chromatic and black colorants" means that the total content of chromatic and black colorants in the total solids of the curable composition is 0.5% by mass or less, preferably 0.1% by mass or less, and more preferable that the composition is free of chromatic and black colorants.

[0161] <<Pigment Derivatives>> The curable composition of the present invention may contain pigment derivatives. Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton. Pigment derivatives are used, for example, as dispersion aids. A dispersion aid is a material used to improve the dispersibility of pigments in a curable composition.

[0162] Examples of the above-mentioned pigment structures include quinoline pigment structure, benzimidazolone pigment structure, benzoisoindole pigment structure, benzothiazole pigment structure, iminium pigment structure, squarylium pigment structure, crokonium pigment structure, oxonol pigment structure, pyrrolopyrrole pigment structure, diketopyrrolopyrrole pigment structure, azo pigment structure, azomethine pigment structure, phthalocyanine pigment structure, naphthalocyanine pigment structure, anthraquinone pigment structure, quinacridone pigment structure, dioxazine pigment structure, perinone pigment structure, perylene pigment structure, thiaidine indigo pigment structure, thioindigo pigment structure, isoindoline pigment structure, isoindolinone pigment structure, quinophthalone pigment structure, dithiol pigment structure, triarylmethane pigment structure, pyromethene pigment structure, and the like.

[0163] Examples of acidic groups found in pigment derivatives include carboxyl groups, sulfo groups, phosphate groups, boronic acid groups, imido acid groups, and salts thereof. Examples of atoms or groups of atoms constituting the salt include alkali metal ions (Li ＋ Na ＋ _K ＋ (Ca) ２＋ Mg ２＋ Examples include ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions.

[0164] Basic groups found in pigment derivatives include amino groups, pyridinyl groups and their salts, ammonium groups, and phthalimidomethyl groups. Atoms or groups of atoms that make up the salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

[0165] Pigment derivatives with excellent visible transparency (hereinafter also referred to as transparent pigment derivatives) can also be used. The maximum molar extinction coefficient (εmax) of the transparent pigment derivative in the wavelength region of 400 to 700 nm is 3000 L·mol －１ ・cm －１ Preferably, the following: 1000 L·mol －１ ・cm －１ It is more preferable that the following conditions apply: 100 L·mol －１ ・cm －１ It is even more preferable that the following conditions are met: The lower limit of εmax is, for example, 1 L·mol －１ ・cm －１ That is all. 10 L·mol －１ ・cm －１ That's fine too.

[0166] Specific examples of pigment derivatives include the compounds described in paragraph 0124 of International Publication No. 2022 / 085485, the benzimidazolone compounds or salts thereof described in Japanese Patent Application Publication No. 2018-168244, the compounds having an isoindoline skeleton described in general formula (1) of Japanese Patent No. 6996282, the compounds described in Japanese Patent Application Publication No. 2019-172968, the compounds described in Chinese Patent Application Publication No. 115124889, the quinophthalone-based dye derivatives described in Japanese Patent Application Publication No. 2024-046989, the dispersion aids described in Japanese Patent Application Publication No. 2024-066986, the dispersion aids described in Japanese Patent Application Publication No. 2024-066995, the compounds described in Japanese Patent Application Publication No. 2022-018967, and the dispersion aids described in Japanese Patent Application Publication No. 2024-066992.

[0167] The pigment derivative content is preferably 0.1 to 30 parts by mass per 100 parts by mass of pigment. The lower limit is preferably 0.25 parts by mass or more, more preferably 0.5 parts by mass or more, even more preferably 0.75 parts by mass or more, and particularly preferably 1 part by mass or more. The upper limit is preferably 25 parts by mass or less, and more preferably 20 parts by mass or less. Only one type of pigment derivative may be used, or two or more types may be used in combination. When two or more types are used in combination, it is preferable that their total amount is within the above range.

[0168] <<Polyalkyleneimines>> The curable composition of the present invention may contain polyalkyleneimines. Polyalkyleneimines are used, for example, as dispersing aids for pigments. A polyalkyleneimine is a polymer obtained by ring-opening polymerization of alkyleneimines. Preferably, the polyalkyleneimine is a polymer having a branched structure containing primary amino groups, secondary amino groups, and tertiary amino groups. The number of carbon atoms in the alkyleneimine is preferably 2 to 6, more preferably 2 to 4, even more preferably 2 or 3, and particularly preferably 2.

[0169] The molecular weight of the polyalkyleneimine is preferably 200 or more, and more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, even more preferably 10,000 or less, and particularly preferably 2,000 or less. When the molecular weight of the polyalkyleneimine can be calculated from the structural formula, the molecular weight of the polyalkyleneimine is the value calculated from the structural formula. On the other hand, when the molecular weight of a specific amine compound cannot be calculated from the structural formula, or when it is difficult to calculate, the number-average molecular weight measured by the boiling point elevation method is used. Furthermore, when it cannot be measured by the boiling point elevation method, or when it is difficult to measure, the number-average molecular weight measured by the viscosity method is used. Furthermore, when it cannot be measured by the viscosity method, or when it is difficult to measure by the viscosity method, the number-average molecular weight in polystyrene equivalent values ​​measured by GPC (gel permeation chromatography) is used.

[0170] The amine value of the polyalkyleneimine is preferably 5 mmol / g or more, more preferably 10 mmol / g or more, and even more preferably 15 mmol / g or more.

[0171] Specific examples of alkyleneimines include ethyleneimine, propyleneimine, 1,2-butyleneimine, and 2,3-butyleneimine, with ethyleneimine or propyleneimine being preferred, and ethyleneimine being more preferred. Polyalkyleneimines are particularly preferably polyethyleneimine. Furthermore, polyethyleneimine preferably contains 10 mol% or more of primary amino groups relative to the total of primary, secondary, and tertiary amino groups, more preferably 20 mol% or more, and even more preferably 30 mol% or more. Commercially available polyethyleneimines include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (all manufactured by Nippon Shokubai Co., Ltd.).

[0172] The polyalkylene imine content in the total solid content of the curable composition is preferably 0.1 to 5% by mass. The lower limit is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. The upper limit is preferably 4.5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less. Furthermore, the polyalkylene imine content is preferably 0.5 to 20 parts by mass per 100 parts by mass of pigment. The lower limit is preferably 0.6 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more. The upper limit is preferably 10 parts by mass or less, and even more preferably 8 parts by mass or less. Only one type of polyalkylene imine may be used, or two or more types may be used. When two or more types are used, it is preferable that their total amount is within the above range.

[0173] <<Chain Transfer Agent>> The curable composition of the present invention may contain a chain transfer agent. Examples of chain transfer agents include thiol compounds, thiocarbonylthio compounds, and dimers of aromatic α-methylalkenyls, with thiol compounds being preferred. Examples of chain transfer agents include those described in paragraphs 0093 to 0113 of International Publication No. 2019 / 188652.

[0174] The thiol compound used as a chain transfer agent is a compound having one or more thiol groups, and preferably a compound having two or more thiol groups. The upper limit of the number of thiol groups contained in the thiol compound is preferably 10 or less, more preferably 6 or less, and even more preferably 4 or less. It is particularly preferable that the thiol compound is a compound having two thiol groups.

[0175] The thiol compound is preferably a compound represented by the following formula (SH-1). Ｓ１ - (SH) ｎ ...Formula (SH-1) (wherein SH represents a thiol group, L １ (This represents an n-valence base, where n is an integer greater than or equal to 1.)

[0176] L in equation (SH-1) Ｓ１The n-valent groups represented by include hydrocarbon groups, heterocyclic groups, -O-, -S-, and -NR Ｓ１ -, -CO-, -COO-, -OCO-, -SO ２ - Or a group consisting of a combination of these. R Ｓ１ The group represents a hydrogen atom, an alkyl group, or an aryl group, with a hydrogen atom being preferred. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The aliphatic hydrocarbon group may be cyclic or acyclic. The aliphatic hydrocarbon group may be a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group. The hydrocarbon group may have substituents or may not have substituents. The cyclic aliphatic hydrocarbon group and the aromatic hydrocarbon group may be monocyclic or fused rings. The heterocyclic group may be monocyclic or fused rings. A five-membered ring or a six-membered ring is preferred for the heterocyclic group. The heterocyclic group may be an aliphatic heterocyclic group or an aromatic heterocyclic group. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. １ The number of carbon atoms constituting the compound is preferably 3 to 100, and more preferably 6 to 50.

[0177] In formula (SH-1), n ​​represents an integer greater than or equal to 1. The upper limit of n is preferably 10 or less, more preferably 6 or less, and even more preferably 4 or less. The lower limit of n is preferably 2 or greater.

[0178] Specific examples of thiol compounds include those described in paragraphs 0100-0103 of International Publication No. 2019 / 188652. Commercially available thiol compounds include PEMP (manufactured by SC Organic Chemicals Co., Ltd.), Suncellar M (manufactured by Sanshin Chemical Industry Co., Ltd.), Karenz MTBD1, Karenz MTPE1, Karenz MTNR1, and Karenz MTTPMB (all manufactured by Resonac Co., Ltd.). Thiol compounds described in Japanese Patent Publication No. 2020-109068 can also be used as chain transfer agents.

[0179] As a chain transfer agent, ether-bonded thiol compounds, Multiol Y-2, Y-3, and Y-4 (manufactured by Sakai Chemical Industry Co., Ltd.), described in International Publication No. 2020 / 170944, can also be used.

[0180] The molecular weight of the chain transfer agent is preferably 200 or more. The upper limit is preferably 1000 or less, more preferably 800 or less, and even more preferably 600 or less, because it can increase the SH valency per unit weight.

[0181] The content of the chain transfer agent in the total solid content of the curable composition is preferably 0.001 to 5% by mass. The upper limit is preferably 3% by mass or less, and more preferably 1% by mass or less. The lower limit is preferably 0.05% by mass or more, and more preferably 0.01% by mass or more. Only one type of chain transfer agent may be used, or two or more types may be used. When two or more types are used, it is preferable that their total amount is within the above range.

[0182] <<Compounds Having Cyclic Ether Groups>> The curable composition of the present invention may contain compounds having cyclic ether groups. Examples of cyclic ether groups include epoxy groups and oxetanyl groups. The epoxy group may be an alicyclic epoxy group. An alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are fused. The compound having a cyclic ether group is preferably a compound having an epoxy group (hereinafter also referred to as an epoxy compound). Examples of epoxy compounds include compounds having one or more epoxy groups in one molecule, and compounds having two or more epoxy groups are preferred. The epoxy compound is preferably a compound having 1 to 100 epoxy groups in one molecule. The upper limit of the number of epoxy groups contained in the epoxy compound can be, for example, 10 or less, or 5 or less. The lower limit of the number of epoxy groups contained in the epoxy compound is preferably 2 or more.

[0183] As compounds having a cyclic ether group, you can use the compounds described in paragraphs 0034 to 0036 of Japanese Patent Publication No. 2013-011869, paragraphs 0147 to 0156 of Japanese Patent Publication No. 2014-043556, paragraphs 0085 to 0092 of Japanese Patent Publication No. 2014-089408, the compounds described in Japanese Patent Publication No. 2017-179172, the xanthene type epoxy resin described in Japanese Patent Publication No. 2021-195421, and the xanthene type epoxy resin described in Japanese Patent Publication No. 2021-195422.

[0184] The compound having a cyclic ether group may be a low molecular weight compound (for example, with a molecular weight of less than 2000, and even less than 1000) or a high molecular weight compound (macromolecule) (for example, with a molecular weight of 1000 or more, or in the case of a polymer, with a weight-average molecular weight of 1000 or more). The weight-average molecular weight of the compound having a cyclic ether group is preferably 200 to 100000, and more preferably 500 to 50000. The upper limit of the weight-average molecular weight is preferably 10000 or less, more preferably 5000 or less, and even more preferably 3000 or less.

[0185] Examples of commercially available compounds containing cyclic ether groups include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (all manufactured by NOF Corporation, epoxy group-containing polymers).

[0186] The content of compounds having cyclic ether groups in the total solid content of the curable composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 15% by mass or less, and more preferably 10% by mass or less. Only one compound having a cyclic ether group may be used, or two or more compounds may be used. When two or more compounds are used, it is preferable that their total amount is within the above range.

[0187] <<Polymerization Inhibitor>> The curable composition of the present invention may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerium salts, etc.). Among these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the curable composition is preferably 0.0001 to 5% by mass. There may be only one type of polymerization inhibitor, or there may be two or more types. If there are two or more types, it is preferable that the total amount is within the above range.

[0188] <<Silane Coupling Agent>> The curable composition of the present invention may contain a silane coupling agent. Examples of silane coupling agents include silane compounds having a hydrolyzable group, and it is preferable that the silane compound has a hydrolyzable group and other functional groups. A hydrolyzable group is a substituent that is directly bonded to a silicon atom and can form a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of hydrolyzable groups include halogen atoms, alkoxy groups, and acyloxy groups, with alkoxy groups being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than hydrolyzable groups include vinyl groups, (meth)allyl groups, (meth)acryloyl groups, thiol groups, epoxy groups, oxetanyl groups, amino groups, ureido groups, sulfide groups, isocyanate groups, and phenyl groups, with amino groups, (meth)acryloyl groups, and epoxy groups being preferred. Specific examples of silane coupling agents include the compound described in paragraph 0177 of International Publication No. 2022 / 085485 and the compound described in Japanese Patent Publication No. 2019-183020. The content of the silane coupling agent in the total solid content of the curable composition is preferably 0.1 to 15% by mass. The upper limit is preferably 10% by mass or less, and more preferably 5% by mass or less. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. There may be only one type of silane coupling agent, or there may be two or more types. If there are two or more types, it is preferable that the total amount is within the above range.

[0189] <<Surfactants>> The curable composition of the present invention may contain a surfactant. Various surfactants can be used, such as fluorinated surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicone surfactants. The surfactant is preferably a silicone surfactant or a fluorinated surfactant, and more preferably a silicone surfactant. For surfactants, refer to the surfactants described in paragraphs 0238 to 0245 of International Publication No. 2015 / 166779, which are incorporated herein by reference.

[0190] As fluorinated surfactants, compounds described in paragraphs 0167-0173 of International Publication No. 2022 / 085485 can be used.

[0191] Examples of nonionic surfactants include the compounds described in paragraph 0174 of International Publication No. 2022 / 085485.

[0192] Examples of silicone-based surfactants include DOWSIL SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419. Examples include OIL (manufactured by Dow Toray Industries, Inc.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (manufactured by Bic Chemie, Inc.), etc. Furthermore, compounds with the following structure can also be used as silicone-based surfactants.

[0193] As surfactants, polymers described in International Publication No. 2021 / 131726, silicone-containing copolymers described in International Publication No. 2024 / 024440, and silicone-containing copolymers described in International Publication No. 2024 / 024441 can also be used.

[0194] The surfactant content in the total solids of the curable composition is preferably 0.001% to 5.0% by mass, and more preferably 0.005% to 3.0% by mass. The surfactant may be one type or two or more types. If two or more types are used, the total amount is preferably within the above range.

[0195] <<Antioxidants>> The curable composition of the present invention may contain antioxidants. Examples of antioxidants include phenolic antioxidants, amine-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants. Examples of phenolic antioxidants include hindered phenol compounds. Phenolic antioxidants are preferably compounds having a substituent at the ortho position adjacent to the phenolic hydroxyl group. As the substituents, substituted or unsubstituted alkyl groups having 1 to 22 carbon atoms are preferred. Antioxidants are also preferably compounds having a phenol group and a phosphite ester group in the same molecule. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosfepin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosfepin-2-yl)oxy]ethyl]amine, ethylbis(2,4-di-tert-butyl-6-methylphenyl) phosphate, and tris(2,4-di-tert-butylphenyl) phosphite. Examples of commercially available antioxidants include ADEKA stab AO-20, ADEKA stab AO-30, ADEKA stab AO-40, ADEKA stab AO-50, ADEKA stab AO-50F, ADEKA stab AO-60, ADEKA stab AO-60G, ADEKA stab AO-80, and ADEKA stab AO-330 (all manufactured by ADEKA Corporation), and JP-650 (manufactured by Johoku Chemical Industry Co., Ltd.). The antioxidants can also be compounds described in paragraphs 0023-0048 of Japanese Patent No. 6268967, compounds described in International Publication No. 2017 / 006600, compounds described in International Publication No. 2017 / 164024, and compounds described in Korean Published Patent No. 10-2019-0059371. The antioxidant content in the total solid content of the curable composition is preferably 0.01 to 20% by mass, and more preferably 0.3 to 15% by mass. Only one type of antioxidant may be used, or two or more types may be used. If two or more types are used, it is preferable that their total amount falls within the above range.

[0196] <<Other Components>> The curable composition of the present invention may optionally contain sensitizers, plasticizers, and other auxiliary agents (e.g., conductive particles, fillers, defoamers, flame retardants, leveling agents, peel accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately including these components, properties such as film properties can be adjusted. These components can be compounds described in paragraph 0182 of International Publication No. 2022 / 085485, compounds having two or more triethoxysilyl groups described in Japanese Patent Application Publication No. 2023-180607, and the like.

[0197] The curable composition of the present invention may contain a lightfastness modifier. Examples of lightfastness modifiers include the compounds described in paragraph 0183 of International Publication No. 2022 / 085485.

[0198] The curable composition of the present invention may contain compounds derived from biomass raw materials, compounds containing radioactive carbon atoms, and compounds having a percentage modern carbon content of 50% or more. The content of compounds derived from biomass raw materials relative to the total compounds contained in the curable composition of the present invention may be 20% by mass or more.

[0199] The curable composition of the present invention preferably contains substantially no terephthalate ester. Here, "substantially free" means that the terephthalate ester content is 1,000 ppb by mass or less of the total amount of the curable composition, more preferably 100 ppb by mass or less, and particularly preferably zero.

[0200] From the viewpoint of environmental regulations, the curable composition of the present invention preferably has a melamine content of 10,000 ppm by mass or less.

[0201] The curable composition of the present invention preferably has a free metal content of 100 ppm or less, and more preferably 50 ppm or less. Furthermore, the free halogen content is preferably 100 ppm or less, and more preferably 50 ppm or less. Methods for reducing free metals and halogens in the curable composition include washing with deionized water, filtration, ultrafiltration, and purification with ion exchange resin.

[0202] From an environmental perspective, the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts may be restricted. In the curable composition of the present invention, when the content of the above-mentioned compounds is reduced, the content of perfluoroalkyl sulfonic acid (particularly perfluoroalkyl sulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group) and its salts, and perfluoroalkyl carboxylic acid (particularly perfluoroalkyl carboxylic acid having 6 to 8 carbon atoms in the perfluoroalkyl group) and its salts is preferably in the range of 0.01 ppb to 1000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb, relative to the total solid content of the curable composition. The curable composition of the present invention may substantially not contain perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. For example, a curable composition substantially free of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, may be selected by using compounds that can substitute for perfluoroalkyl sulfonic acid and its salts, and compounds that can substitute for perfluoroalkyl carboxylic acid and its salts. Examples of compounds that can substitute for regulated compounds include compounds that have been excluded from regulation due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above does not preclude the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. The curable composition of the present invention may contain perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, to the maximum permissible extent.

[0203] <<Container>> There are no particular limitations on the container used to contain the curable composition, and any known container can be used. Alternatively, the container described in paragraph 0187 of International Publication No. 2022 / 085485 can be used as the container.

[0204] <Method for preparing the curable composition> The curable composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the curable composition, all components may be dissolved and / or dispersed simultaneously in a solvent to prepare the curable composition, or, if necessary, each component may be prepared as two or more solutions or dispersions and mixed at the time of use (coating) to prepare the curable composition.

[0205] The preparation of the curable composition preferably includes a process for dispersing the pigment. Examples of mechanical forces used in the pigment dispersion process include compression, squeezing, impact, shearing, and cavitation. Specific examples of these processes include bead mills, sand mills, roll mills, ball mills, paint shakers, microfluidizers, high-speed impellers, sand grinders, flow jet mixers, high-pressure wet atomization, and ultrasonic dispersion. Furthermore, in the grinding of the pigment in a sand mill (bead mill), it is preferable to process the material under conditions that enhance grinding efficiency, such as by using small-diameter beads or increasing the bead packing density. It is also preferable to remove coarse particles after the grinding process by filtration or centrifugation. Furthermore, the processes and dispersers for dispersing the pigments can suitably be those described in "Complete Collection of Dispersion Technologies, published by Joho Kiko Co., Ltd., July 15, 2005," "Comprehensive Data Collection on Dispersion Technologies and Industrial Applications Focusing on Suspensions (Solid / Liquid Dispersion Systems), published by Keiei Kaihatsu Center Publishing Department, October 10, 1978," and paragraph 0022 of Japanese Patent Publication No. 2015-157893. In addition, in the process of dispersing the pigments, particle refinement treatment may be performed in a salt milling step. For materials, equipment, and processing conditions used in the salt milling step, for example, refer to the descriptions in Japanese Patent Publication No. 2015-194521 and Japanese Patent Publication No. 2012-046629. Examples of bead materials used for dispersion include zirconia, agate, quartz, titania, tungsten carbide, silicon nitride, alumina, stainless steel, and glass. Furthermore, the beads may be inorganic compounds with a Mohs hardness of 2 or higher. The curable composition may contain 1 to 10,000 ppm of the above-mentioned beads.

[0206] In preparing a curable composition, it is preferable to filter the composition with a filter for purposes such as removing foreign matter and reducing defects. Examples of filters and filtration methods used for filtration include those described in paragraphs 0196 to 0199 of International Publication No. 2022 / 085485.

[0207] <Membrane> The membrane of the present invention is a membrane obtained by curing the curable composition of the present invention described above. The membrane of the present invention can be used in optical filters such as color filters, infrared transmission filters and infrared cut filters.

[0208] The film thickness of the film of the present invention can be appropriately adjusted depending on the purpose. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

[0209] When the film of the present invention is used as a color filter, it is preferable that the film has a hue of green, red, blue, cyan, magenta, or yellow. Furthermore, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

[0210] <Method for Manufacturing Pixels> A method for manufacturing pixels using the curable composition of the present invention will now be described. The method for manufacturing pixels includes the steps of forming a composition layer on a support using the curable composition of the present invention, exposing the composition layer in a pattern, and developing and removing the unexposed parts of the composition layer. If necessary, a step of drying the composition layer (pre-bake step) and a step of heat-treating the developed pattern (pixel) (post-bake step) may be provided.

[0211] In the step of forming the composition layer, the curable composition of the present invention is used to form the composition layer on a support. The support is not particularly limited and can be appropriately selected depending on the application. Examples include glass substrates and silicon substrates, with silicon substrates being preferred. A charge-coupled device (CCD), complementary metal-oxide-semiconductor (CMOS), transparent conductive film, etc., may be formed on the silicon substrate. A black matrix that isolates each pixel may also be formed on the silicon substrate. Furthermore, a base layer may be provided on the silicon substrate to improve adhesion with the upper layer, prevent diffusion of substances, or flatten the substrate surface. The surface contact angle of the base layer is preferably 20 to 70° when measured with diiodomethane. It is also preferably 30 to 80° when measured with water.

[0212] Known methods can be used for coating the curable composition. For example, drop casting; slit coating; spray coating; roll coating; spin coating; casting; slit and spin coating; pre-wetting (for example, the method described in Japanese Patent Application Publication No. 2009-145395); various printing methods such as inkjet (for example, on-demand, piezo, and thermal), nozzle jet printing, flexographic printing, screen printing, gravure printing, reverse offset printing, and metal mask printing; transfer methods using molds, etc.; and nanoimprint methods. In addition, the coating method described in paragraph 0207 of International Publication No. 2022 / 085485 can also be used.

[0213] The composition layer formed on the support may be dried (pre-baked). Pre-baking is not necessary when manufacturing the film by a low-temperature process. If pre-baking is performed, the pre-baking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, and also 80°C or higher. The pre-baking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Pre-baking can be performed using a hot plate, oven, etc.

[0214] Next, the composition layer is exposed in a pattern (exposure step). For example, the composition layer can be exposed in a pattern by using a stepper exposure machine or a scanner exposure machine to expose it through a mask having a predetermined mask pattern. This allows the exposed areas to be cured.

[0215] Examples of radiation (light) that can be used for exposure include g-rays and i-rays. Light with a wavelength of 150 to 300 nm can also be used. Examples of light with a wavelength of 150 to 300 nm include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm), with KrF rays (wavelength 248 nm) being preferred. The light with a wavelength of 150 to 300 nm is preferably excimer laser light with a wavelength of 150 to 300 nm. In addition, long-wavelength light sources of 300 nm or more can also be used for exposure.

[0216] During exposure, the light may be irradiated continuously or pulsed (pulsed exposure). Pulsed exposure is an exposure method in which light irradiation and pauses are repeated in short cycles (for example, at the millisecond level or less).

[0217] The irradiation dose (exposure dose) is, for example, 0.03 to 2.5 J / cm². ２ Preferably, 0.05 to 1.0 J / cm ２ This is more preferable. The oxygen concentration during exposure can be appropriately selected. In addition to exposure in air, exposure may be carried out in a low-oxygen atmosphere with an oxygen concentration of 19 volume% or less (e.g., 15 volume%, 5 volume%, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration exceeding 21 volume% (e.g., 22 volume%, 30 volume%, or 50 volume%). Furthermore, the exposure intensity can be appropriately set, usually 1000 W / m². ２ ~100000W / m ２ (For example, 5000 W / m) ２ , 15000 W / m ２ , or 35,000 W / m ２ The oxygen concentration and exposure intensity can be combined as appropriate; for example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m². ２At an oxygen concentration of 35% by volume, the illuminance is 20,000 W / m². ２ This can be done as follows.

[0218] Next, the unexposed areas of the composition layer are developed and removed to form a pattern (pixels). The unexposed areas of the composition layer can be developed and removed using a developer. This causes the unexposed areas of the composition layer in the exposure process to dissolve in the developer, leaving only the photocured parts. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, to improve the ability to remove residue, the developer may be emptied every 60 seconds, and the process of supplying fresh developer may be repeated several times.

[0219] Examples of developing solutions include organic solvents and alkaline developers, with alkaline developers being preferred. For the developing solution and the rinsing method after development, the developing solution and rinsing method described in paragraph 0214 of International Publication No. 2022 / 085485 may be used.

[0220] After development and drying, it is preferable to perform additional exposure or heat treatment (post-bake). Additional exposure and post-bake are curing treatments after development to ensure complete hardening. The heating temperature in post-bake is preferably 100 to 300°C, and more preferably 200 to 270°C. Post-bake can be performed continuously or in batches using heating means such as a hot plate, convection oven (hot air circulation dryer), or high-frequency heater to achieve the above conditions. When performing additional exposure, it is preferable that the light used for exposure has a wavelength of 400 nm or less. The additional exposure may also be performed by the method described in Korean Published Patent No. 10-2017-0122130.

[0221] <Optical Sensor> The film of the present invention can be used in optical sensors. Examples of optical sensors include solid-state image sensors. The configuration of the solid-state image sensor is not particularly limited as long as it is equipped with the film of the present invention and functions as a solid-state image sensor, but examples include the following configuration.

[0222] The device has a substrate on which multiple photodiodes and transfer electrodes made of polysilicon or the like constitute the light-receiving area of ​​a solid-state image sensor (such as a CCD (charge-coupled device) image sensor or a CMOS (complementary metal-oxide-semiconductor) image sensor), a light-shielding film with an opening only for the light-receiving portion of the photodiode is placed on the photodiode and transfer electrodes, a device protection film made of silicon nitride or the like is formed on the light-shielding film to cover the entire surface of the light-shielding film and the light-receiving portion of the photodiode, and a color filter is placed on the device protection film. Furthermore, the device may have a configuration in which a light-gathering means (for example, a microlens; the same applies hereinafter) is placed on the device protection film and below the color filter (on the side closer to the substrate), or a configuration in which the light-gathering means is placed on the color filter. The color filter may also have a structure in which each colored pixel is embedded in a space partitioned by partitions, for example in a grid pattern. In this case, it is preferable that the partitions have a lower refractive index than each colored pixel. Examples of imaging devices having such a structure include those described in Japanese Patent Publication No. 2012-227478, Japanese Patent Publication No. 2014-179577, and International Publication No. 2018 / 043654. Furthermore, as shown in Japanese Patent Publication No. 2019-211559, the light resistance may be improved by providing an ultraviolet absorption layer within the structure of the solid-state image sensor. The imaging device equipped with the solid-state image sensor of the present invention can be used not only in digital cameras and electronic devices with imaging functions (such as mobile phones), but also in in-vehicle cameras and surveillance cameras.

[0223] <Image Display Devices> The film of the present invention can be used in image display devices. Examples of image display devices include liquid crystal displays and organic electroluminescent displays. For definitions of image display devices and details of each image display device, see, for example, "Electronic Display Devices" (by Akio Sasaki, Kogyo Chosakai Co., Ltd., published in 1990) and "Display Devices" (by Yoshiaki Ibuki, Sangyo Tosho Co., Ltd., published in 1989). Liquid crystal displays are described, for example, in "Next-Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, Kogyo Chosakai Co., Ltd., published in 1994). There are no particular restrictions on the liquid crystal display devices to which the present invention can be applied; for example, it can be applied to various types of liquid crystal display devices described in the above-mentioned "Next-Generation Liquid Crystal Display Technology".

[0224] The present invention will be described in more detail below with reference to examples. The materials, amounts used, proportions, processing content, and processing procedures shown in the following examples can be modified as appropriate, as long as they do not depart from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. In the structural formulas shown below, Me represents a methyl group, Et represents an ethyl group, and Ph represents a phenyl group.

[0225] <Production of Dispersion> The materials listed in the table below are mixed to obtain a mixture. The resulting mixture is then dispersed using an Ultra Apex Mill manufactured by Kotobuki Kogyo Co., Ltd. as a circulating dispersion device (bead mill) to produce the dispersion.

[0226]

[0227] The details of the materials listed using the abbreviations in the table above are as follows: (Pigments) P-1: Titanium dioxide particles (manufactured by Ishihara Sangyo Co., Ltd., TTO-51(C), white or colorless pigment) P-2: Silica particles (Aerosil 50, manufactured by Evonik, white or colorless pigment)

[0228] (Dispersed resin) D-1: Block-type resin with the following structure (the values ​​appended to the main chain are the molar ratio of repeating units. Weight-average molecular weight 9800, amine value 90 mgKOH / g, quaternary ammonium salt value 30 mgKOH / g). D-2: Resin with the following structure (the values ​​attached to the main chain are molar ratios, and the values ​​attached to the side chains are the number of repeating units. Weight-average molecular weight 12000, acid value 61.8 mgKOH / g)

[0229] (Solvent) S-1: Propylene glycol monomethyl ether acetate

[0230] <Manufacturing of Curable Composition> The curable composition is manufactured by mixing the materials listed in the table below.

[0231] The details of the materials listed in the table above are as follows:

[0232] (Dispersion) Dispersion 1, 2: Dispersion 1, 2 as described above

[0233] (Resin) B-1: Copolymer of methacrylic acid (MAA) and benzyl methacrylate (BnMA) (MAA:BnMA = 70:30 (molar ratio), acid value 112.8 mg KOH / g, weight-average molecular weight 30000) B-2: Cyclomer P (ACA) 230AA (manufactured by Daicel Corporation) B-3: BGM-601 (manufactured by Osaka Organic Chemical Industry Co., Ltd.) B-4: Resin with the following structure (the values ​​attached to the main chain are molar ratios. Weight-average molecular weight 12000, acid value 31.8 mg KOH / g)

[0234] (Polymerizable compounds) M-1 to M-5: Compounds with the following structure. M-1 to M-4 are polymerizable compounds having an ether linkage, while M-5 is a polymerizable compound that does not contain an ether linkage.

[0235] (Photopolymerization initiators) I-1 to I-3: Compounds with the following structure (glyoxylate compounds) CI-1: Compound with the following structure (oxime compound)

[0236] (Other ingredients 1) Su-1: KF-6001 (manufactured by Shin-Etsu Chemical Co., Ltd., silicone-based surfactant) Su-2: SH8400 (manufactured by Dow Toray Industries, Inc., silicone-based surfactant) In-1: p-methoxyphenol (polymerization inhibitor)

[0237] (Other components 2) A-1, A-2: Compounds with the following structure (ultraviolet absorbers) A-3: Adeka Stab AO-80 (manufactured by ADEKA Corporation, antioxidant) A-4: Adeka Stab LA-82 (manufactured by ADEKA Corporation, antioxidant) A-5: EHPE3150 (manufactured by Daicel Corporation, epoxy resin) A-6: Denacol EX-614 (manufactured by Nagase ChemteX Corporation, epoxy compound) A-7: Compound with the following structure (silane coupling agent) A-8: KBM-602 (Shin-Etsu Chemical Co., Ltd., silane coupling agent) (Shin-Etsu Chemical) (Solvent) S-1: Propylene glycol monomethyl ether acetate S-2: Propylene glycol monomethyl ether S-3: Cyclopentanone

[0238] <Evaluation> (Spectroscopic Characteristics) Each curable composition is applied to a glass substrate using a spin coater (manufactured by Mikasa Corporation) to form a coating film with a post-baking film thickness of 1.0 μm. Next, it is heated (pre-baked) at 100°C for 120 seconds using a hot plate. Then, it is exposed at 1000 mJ / cm using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation). ２ Full surface exposure is performed with the specified exposure dose. Then, the film is formed by heating (post-bake) at 220°C for 5 minutes using a hot plate. The spectral characteristics of the resulting film are measured using a spectrometer (UH-4150, Hitachi High-Tech Corporation) to determine the maximum transmittance at wavelengths of 400 to 700 nm. 2: The maximum transmittance at wavelengths of 400 to 700 nm is 80% or more. 1: The maximum transmittance at wavelengths of 400 to 700 nm is less than 80%.

[0239] (Residue) Each curable composition is applied to a silicon wafer using a spin coater (Mikasa Corporation) to form a coating film so that the post-baking film thickness is 1.0 μm. Then, it is heated on a hot plate at 100°C for 2 minutes. Next, a proximity exposure system EVG6200T (EVG Corporation) is used to expose it at 1000 mJ / cm². ２Exposure is performed using the specified exposure level, through a mask having a 10 μm square Island pattern. Next, paddle development is performed at 23°C for 60 seconds using a 0.3 mass% aqueous solution of tetramethylammonium hydroxide (TMAH). After that, rinsing is performed with a spin shower, and then washing with pure water. Next, the pattern is formed by heating (post-bake) at 200°C for 5 minutes using a hot plate. The outer edge of the pattern (unexposed area) is observed using a scanning electron microscope, and the residue is evaluated according to the following criteria: 4: No residue present 3: Residue present, isolated from the pattern 2: A trailing edge is present on part of the outer edge of the pattern 1: A trailing edge is present all the way around the outer edge of the pattern

[0240] (Coloring) Each curable composition is applied to a glass substrate using a spin coater (manufactured by Mikasa Corporation) to form a coating film with a post-baking film thickness of 1.0 μm. Next, it is heated on a hot plate at 100°C for 120 seconds (pre-baking). Then, it is exposed at 1000 mJ / cm using an i-line stepper exposure apparatus FPA-3000i5+ (manufactured by Canon Corporation). ２Full surface exposure is performed with the specified exposure dose. Next, a hot plate is used to heat the film at 220°C for 300 seconds (post-bake) to form a film. The resulting film is placed in a 150°C incubator and subjected to a high-temperature test for two months. Then, the average absorbance (ODa) at wavelengths of 400-450 nm is measured vertically using a UH-4150 spectrometer (manufactured by Hitachi High-Tech Corporation). Subsequently, reference composition B, obtained by removing only the photopolymerization initiator from each curable composition, is subjected to film formation, high-temperature testing, and spectroscopic measurement using the same method, and the average absorbance (ODb) at wavelengths of 400-450 nm is measured. Subsequently, reference composition C, obtained by adjusting the photopolymerization initiator used in each curable composition and resin B-1 so that the content of the photopolymerization initiator in the solid content is the same as in each curable composition, is subjected to film formation, high-temperature testing, and spectroscopic measurement using the same method, and the average absorbance (ODc) at wavelengths of 400-450 nm is measured. Using these values, ΔOD = ODa / (ODb + ODc) is calculated to evaluate the degree of discoloration due to the synergistic effect of the photopolymerization initiator and other components. A smaller ΔOD indicates that the occurrence of discoloration is suppressed. 4: ΔOD ≤ 1.03 3: 1.03 < ΔOD ≤ 1.05 2: 1.05 < ΔOD ≤ 1.10 1: 1.10 < ΔOD

[0241] (Film Thickness Uniformity) Each curable composition is applied to an 8-inch silicon wafer using a spin coater (Mikasa Corporation) to form a coating film so that the post-baking film thickness is 1.0 μm. Next, it is heated on a hot plate at 100°C for 2 minutes. Then, using an optical film thickness gauge F-50 (Filmmetrics Corporation), the film thickness (FTn) is measured at a total of 19 locations at 1 cm intervals from the center along a line passing through the notch and the center of the 8-inch silicon wafer. FTmax = maximum value of FTn, FTmin = minimum value of FTn, and FTave = average value of FTn. The formula ΔFT% = (FTmax - FTmin) / FTave is calculated, and the film thickness uniformity is evaluated according to the following criteria: A smaller ΔFT% value indicates better film thickness uniformity. 3: ΔFT% ≤ 5% 2: 5% ≤ ΔFT% ≤ 10% 1: 10% < ΔFT%

[0242] (Temporal stability of sensitivity) Immediately after manufacturing, the curable composition is applied to a silicon wafer using a spin coater (manufactured by Mikasa Corporation) to form a coating film so that the film thickness after post-baking is 1 μm. Next, it is heated at 100°C for 2 minutes using a hot plate. Then, using an i-line stepper exposure apparatus FPA-3000i5+ (manufactured by Canon Corporation), exposure is performed at 50 to 2500 mJ / cm². ２ Within the range of 25 mJ / cm ２ Exposure is performed at intervals through a 2 μm square Island pattern mask. Next, paddle development is performed at 23°C for 60 seconds using a 0.3 mass% aqueous solution of tetramethylammonium hydroxide (TMAH). After that, rinsing is performed with a spin shower and then with pure water. Next, the pattern is formed by heating (post-bake) at 220°C for 5 minutes using a hot plate. The silicon wafer with the above pattern formed is divided, platinum deposition is performed, and then cross-sectional scanning electron microscope (SEM) images of the pattern at each exposure level are obtained using a scanning electron microscope (manufactured by Hitachi High-Tech Corporation). The average value of the pattern width is derived for each exposure level with N=45, and the exposure level (E_be) at which the average pattern width is closest to 2 μm is derived. Subsequently, the same process is performed on each curable composition after storage at 25°C for 12 months, and the exposure level (E_af) at which the average pattern width is closest to 2 μm is derived. Based on these, we calculate "ΔE = |E_af - E_be|" to evaluate the temporal stability of the sensitivity. ΔE = 0 mJ / cm ２ The closer the value is to this, the better the sensitivity's stability over time. 4: ΔE < 50 mJ / cm ２ 3:200mJ / cm ２ >ΔE≧50mJ / cm ２ 2:ΔE≧200mJ / cm ２ 1: Unable to obtain E_af

[0243]

[0244] As shown in the table above, the examples can suppress the occurrence of discoloration more effectively than the comparative examples.

Claims

1. A curable composition comprising a polymerizable compound, a resin, a photopolymerization initiator, and a solvent, wherein the photopolymerization initiator comprises a glyoxylate compound, the solid content concentration of the curable composition is 1 to 60% by mass, and when the curable composition is applied to a support, exposed to light, and then heated at 230°C for 15 minutes to form a film, the maximum transmittance of the film at a wavelength of 400 to 700 nm is 80% or more.

2. The curable composition according to claim 1, wherein the polymerizable compound contains an ether bond.

3. The curable composition according to claim 1 or 2, wherein the total content of the resin and the polymerizable compound in the total solid content of the curable composition is 70% by mass or more.

4. The curable composition according to claim 1 or 2, wherein the content of the polymerizable compound in the total solid content of the curable composition is 1 to 49% by mass.

5. The curable composition according to claim 1 or 2, wherein the resin content in the total solid content of the curable composition is 40% by mass or more.

6. The curable composition according to claim 1 or 2, further comprising an ultraviolet absorber.

7. The curable composition according to claim 1 or 2, wherein the total content of chromatic colorants and black colorants in the total solid content of the curable composition is 1% by mass or less.

8. The curable composition according to claim 1 or 2, wherein the photopolymerization initiator comprises a compound different from the glyoxylate compound.

9. The curable composition according to claim 1 or 2, wherein the glyoxylate compound comprises a compound represented by formula (1) or formula (2); In formula (1), Ar １ R represents an m1+n1 valent group containing at least one selected from the group consisting of aromatic rings and heteroaromatic rings, １ R represents an alkyl group. ２ represents a halogen atom, nitro group, cyano group, or acyl group, n1 represents an integer from 1 to 4, and m1 represents an integer from 0 to 2; in formula (2), Ar １１ R represents an m²+1 valent group containing at least one selected from the group consisting of aromatic rings and heteroaromatic rings, １１ R represents an n-2 valent organic group. １２ n² represents a halogen atom, nitro group, cyano group, or acyl group, n² represents an integer from 2 to 6, and m² represents an integer from 0 to 2.

10. A film obtained using the curable composition according to claim 1 or 2.

11. An optical sensor having the film described in claim 10.

Images