Optical module

Abstract

An optical module (1) according to the present disclosure comprises a substrate (2), an optical element (3), a heat dissipation member (4), an optical connector (31), and a thermally conductive resin (5). The substrate (2) has a first surface, and a second surface positioned on the opposite side of the first surface. The optical element (3) has a third surface facing the first surface of the substrate (2), and a fourth surface positioned on the opposite side of the third surface. The heat dissipation member (4) is positioned on the fourth surface of the optical element (3). The optical connector (31) is positioned on the fourth surface of the optical element (3) with a space (S) between the optical connector (31) and the heat dissipation member (4). The thermally conductive material (5) is positioned between the optical element (3) and the heat dissipation member (4). The thermally conductive material (5) is also positioned in the space (S).

Description

Optical module

[0001] The present disclosure relates to an optical module.

[0002] Conventionally, an optical module having a function of converting an electrical signal into an optical signal is known. An optical connector for transmitting the converted optical signal from the optical module to the outside may be mounted on the optical module (see Patent Document 1). In addition, a heat radiating member for cooling the optical element may be mounted on the optical module.

[0003] Japanese Patent Application Laid-Open No. 2010-175942

[0004] The optical module according to one aspect of the present disclosure includes a substrate, an optical element, a heat radiating member, an optical connector, and a thermally conductive resin. The substrate has a first surface and a second surface located on the opposite side of the first surface. The optical element has a third surface facing the first surface of the substrate and a fourth surface located on the opposite side of the third surface. The heat radiating member is located on the fourth surface of the optical element. The optical connector is located on the fourth surface of the optical element with a space between it and the heat radiating member. The thermally conductive material is located between the optical element and the heat radiating member. The thermally conductive material is also located in the space.

[0005] FIG. 1 is a perspective view of the optical module according to the first embodiment as viewed obliquely from above. FIG. 2 is a schematic cross-sectional view of the optical module according to the first embodiment. FIG. 3 is a schematic cross-sectional view of the optical module according to the second embodiment. FIG. 4 is a schematic cross-sectional view of the optical module according to the third embodiment. FIG. 5 is a schematic cross-sectional view of the optical module according to the fourth embodiment. FIG. 6 is a schematic cross-sectional view of the optical module according to the fifth embodiment.

[0006] Hereinafter, embodiments for implementing the optical module according to the present disclosure (hereinafter referred to as "embodiments") will be described in detail with reference to the drawings. Note that the present disclosure is not limited by this embodiment. Also, the embodiments can be appropriately combined as long as the processing contents do not conflict. In addition, the same parts in the following embodiments are denoted by the same reference numerals, and duplicate explanations are omitted.

[0007] Furthermore, in the embodiments described below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not require strict adherence to "constant," "orthogonal," "perpendicular," or "parallel" conditions. In other words, each of the above expressions allows for deviations such as manufacturing accuracy or installation accuracy.

[0008] Furthermore, in the drawings referenced below, for the sake of clarity, mutually orthogonal X, Y, and Z axis directions are sometimes defined, and a Cartesian coordinate system is shown with the positive Z axis pointing vertically upward.

[0009] In recent years, there has been a demand for miniaturization of optical modules. On the other hand, to improve cooling efficiency, a larger heat dissipation component is preferable. As a result of trying to achieve both miniaturization and cooling efficiency, the heat dissipation component and the optical connector are sometimes placed in close proximity.

[0010] However, the shorter the distance between the heat dissipation component and the optical connector, the more likely they are to come into contact. When the heat dissipation component and the optical connector come into contact, vibrations from the heat dissipation component are transmitted to the optical connector, which could cause the optical connector to detach from the optical module.

[0011] Therefore, there is a growing expectation for the realization of optical modules with optical connectors that are less likely to detach.

[0012] (First Embodiment) First, the configuration of the optical module 1 according to the first embodiment will be described with reference to Figure 1. Figure 1 is a perspective view of the optical module 1 according to the first embodiment, seen from diagonally above.

[0013] As shown in Figure 1, the optical module 1 according to the first embodiment comprises a substrate 2, a plurality of optical elements 3 (optical elements 3a to 3d), and a heat dissipation member 4.

[0014] The substrate 2 has, for example, a rectangular plate shape in plan view. The substrate 2 has a first surface 20a and a second surface 20b (see Figure 2) located on the opposite side of the first surface 20a. Multiple optical elements 3a to 3d and a heat dissipation member 4 are located on the first surface 20a of the substrate 2, as well as a power supply IC, a control IC, or a chip resistor. Capacitors and coils may also be located on the first surface 20a of the substrate 2.

[0015] A connector (not shown) is located on the second surface 20b of the circuit board 2. The circuit board 2 is electrically connected to the motherboard via the connector.

[0016] The optical element 3 is an element that includes a photoelectric conversion circuit that converts electrical signals into optical signals. The optical element 3 may also convert optical signals into electrical signals. The optical element 3 has a third surface 30a (see Figure 2) facing the first surface 20a of the substrate 2, and a fourth surface 30b (see Figure 2) located on the opposite side of the third surface 30a. An optical connector 31 is located on the fourth surface 30b of each optical element 3. The optical connector 31 is connected to a connector 33 via a group of cables consisting of multiple optical fiber cables 32.

[0017] The heat dissipation member 4 is a so-called heat sink and is located on the fourth surface 30b of the multiple optical elements 3. The heat dissipation member 4 covers a portion of the fourth surface 30b of the multiple optical elements 3. That is, the fourth surface 30b of the multiple optical elements 3 is partially exposed from the heat dissipation member 4.

[0018] The heat dissipation member 4 is positioned close to the multiple optical elements 3 and releases the heat generated from the optical elements 3 to the outside of the optical module 1. The heat dissipation member 4 may be made of a metal with relatively high thermal conductivity, such as aluminum, copper, or iron.

[0019] The heat dissipation member 4 has a plate-shaped portion 41, a plurality of leg portions 42, and a plurality of heat sinks 45. The plate-shaped portion 41 is a plate-shaped part that is positioned opposite the first surface 20a of the substrate 2 at a distance from it. The plurality of leg portions 42 are provided on the plate-shaped portion 41. Specifically, the plurality of leg portions 42 extend from the plate-shaped portion 41 toward the substrate 2 and make contact with the substrate 2.

[0020] The leg portion 42 may be integrated with the plate-like portion 41. Multiple leg portions 42 may be connected to the plate-like portion 41 and the substrate 2. Multiple leg portions 42 extend in a certain direction (here, the X-axis direction). Also, multiple leg portions 42 are arranged in a line along a certain direction (here, the Y-axis direction).

[0021] Multiple heat sinks 45 are located on the surface of the plate-shaped portion 41 opposite to the surface facing the substrate 2. Figure 1 shows an example where the heat sinks 45 have a plate shape (i.e., they are heat sink fins). As shown in Figure 1, the heat sinks 45 may protrude in the Z-axis direction, extend in the X-axis direction, and be arranged in a line along the Y-axis direction. The heat sinks 45 may also be, for example, pin-shaped (i.e., heat sink pins).

[0022] A cooling fan or other blower (not shown) that blows air onto the optical module 1 may be located on the negative X-axis side of the optical module 1. Such a blower generates airflow directed in the positive X-axis direction.

[0023] The air blown from the blower hits the multiple heat sinks 45 and flows along the first surface 20a of the substrate 2 so as to pass through the ventilation passage 100 formed between the substrate 2 and the plate-shaped portion 41 of the heat dissipation member 4.

[0024] Furthermore, in the first embodiment, this airflow strikes multiple optical elements 3 located on the outlet side of the ventilation passage 100, thereby further increasing the heat dissipation efficiency of the multiple optical elements 3.

[0025] Next, the configuration of the optical element 3 and the optical connector 31 in the optical module 1 according to the first embodiment will be described with reference to Figure 2. Figure 2 is a schematic cross-sectional view of the optical module 1 according to the first embodiment.

[0026] As shown in Figure 2, the optical element 3 according to the first embodiment includes a substrate 34, a heating element 35, and an optical transmission line 36.

[0027] The substrate 34 supports various components that make up the optical element 3 (for example, the heat-generating part 35 and the optical transmission line 36). The substrate 34 is, for example, a silicon substrate.

[0028] The heat-generating element 35 is located, for example, on the main surface of the substrate 34. The heat-generating element 35 is, for example, a silicon IC.

[0029] The optical transmission path 36 is optically connected to a light-emitting element or light-receiving element (not shown) of the optical element 3 and transmits optical signals. The optical element 3 has multiple optical transmission paths 36. Each of the multiple optical transmission paths 36 is optically connected to a plurality of optical fiber cables 32 (see Figure 1) housed in the optical connector 31.

[0030] As shown in Figure 2, the optical transmission path 36 is positioned to extend toward the optical connector 31 (for example, along the Z-axis direction). In the first embodiment, the optical transmission path 36 may be positioned at an angle with respect to the Z-axis direction.

[0031] Furthermore, the multiple optical transmission lines 36 may be arranged in a line along a predetermined first direction (the Y-axis direction in the figure), for example.

[0032] The optical element 3 and the optical connector 31 are fixed together with an adhesive 37. This adhesive 37 is made of an adhesive capable of transmitting optical signals, such as a UV-curing resin.

[0033] The optical connector 31 is located at one end of the plurality of optical fiber cables 32 and is optically connected to the optical transmission path 36 of the optical element 3. The optical connector 31 has a main body portion 31a and a protruding portion 31b. The main body portion 31a houses the plurality of optical fiber cables 32 inside.

[0034] The protruding portion 31b is a part that protrudes from the main body portion 31a. For example, the protruding portion 31b protrudes toward the side of the main body portion 31a facing the optical element 3 (the negative Z-axis direction in the figure). The protruding portion 31b may be integrally formed with the main body portion 31a, or it may be formed separately from the main body portion 31a and joined to the main body portion 31a by a joining member or the like.

[0035] Next, the main components of the optical module 1 according to this embodiment will be described further.

[0036] As shown in Figure 2, the heat dissipation member 4 is in contact with the optical element 3 via a thermally conductive material 5. In other words, the thermally conductive material 5 is located between the optical element 3 and the heat dissipation member 4. Specifically, the thermally conductive material 5 is located between the region of the fourth surface 30b of the optical element 3 where the heat-generating part 35 is located and the heat dissipation member 4. That is, the heat dissipation member 4 may be thermally connected to multiple optical elements 3. The thermally conductive material is, for example, a thermally conductive resin such as TIM (Thermal Interface Material). TIM is a composite material that contains a thermally conductive filler in the resin.

[0037] Furthermore, as shown in Figure 2, the optical connector 31 is positioned on the fourth surface 30b of the optical element 3, with a space S between it and the heat dissipation member 4. The space S is the space sandwiched in the X-axis direction between the surface 4a of the heat dissipation member 4 that faces the optical connector 31 and the surfaces 31c and 31d of the optical connector 31 that face the heat dissipation member 4. Note that the surfaces 31c and 31d of the optical connector 31 according to the first embodiment may be inclined with respect to the Z-axis direction. Such an example will be described later in the fifth embodiment.

[0038] Space S comprises a first space S1 and a second space S2. The first space S1 is the space sandwiched between the surface 4a of the heat dissipation member 4 and the side surface 31d of the protruding portion 31b of the optical connector 31 that faces the heat dissipation member 4. The second space S2 is located above the first space S1. The second space S2 is the space sandwiched between the surface 4a of the heat dissipation member 4 and the side surface 31c of the main body portion 31a of the optical connector 31 that faces the heat dissipation member 4. In the second space S2, the distance between the optical connector 31 and the heat dissipation member 4 is narrower than in the first space S1. That is, the distance d2 between the heat dissipation member 4 and the surface 31c of the optical connector 31 facing the heat dissipation member 4 in the second space S2 is smaller than the distance d1 between the heat dissipation member 4 and the surface 31d of the optical connector 31 facing the heat dissipation member 4 in the first space S1. Here, distances d1 and d2 are lengths in the X-axis direction.

[0039] Here, if nothing is provided in the space S between the heat dissipation member 4 and the optical connector 31, the surface 4a of the heat dissipation member 4 and the surface 31c of the optical connector 31 are likely to come into contact. When the surface 4a of the heat dissipation member 4 and the surface 31c of the optical connector 31 come into contact, the vibration of the heat dissipation member 4 may be transmitted to the optical connector 31, and there is a risk that the optical connector 31 may fall off from the optical module 1.

[0040] Therefore, in the optical module 1 according to the first embodiment, the heat conductive material 5 is also located in the space S. Specifically, as shown in FIG. 2, the heat conductive material 5 is located in the first space S1.

[0041] Since the heat conductive material 5 is located in the space S, the heat conductive material 5 serves as a buffer to receive the vibration from the heat dissipation member 4, making it difficult for the vibration of the heat dissipation member 4 to be transmitted to the optical connector 31 and making it difficult for the optical connector 31 to fall off.

[0042] Also, as described above, since the distance d1 in the first space S1 is larger than the distance d2 in the second space S2, the first space S1 has a pocket structure. When the first space S1 has a pocket structure, the heat conductive material 5 is less likely to flow in the planar direction (for example, the Y-axis direction) and is more likely to spread in the height direction (here, the Z-axis direction). In this embodiment, since the first space S1 has a pocket structure, the heat conductive material 5 can be filled in the entire first space S1 with a small amount. Therefore, the optical module 1 according to this embodiment has excellent fixing strength for the optical connector 31, and it is difficult for the optical connector 31 to fall off.

[0043] A part of the heat conductive material 5 may contact the optical connector 31 in the space S.

[0044] According to such a configuration, when the heat conductive material 5 has an adhesive function, in addition to the optical element 3 and the heat dissipation member 4, the heat conductive material 5 also fixes the optical connector 31. Therefore, the optical module 1 according to the first embodiment has excellent fixing strength for the optical connector 31, and it is difficult for the optical connector 31 to fall off.

[0045] Further, a part of the heat conductive material 5 extends into the space S until it contacts the optical connector 31, so that it becomes possible to receive larger vibrations from the heat radiating member 4, and the function as a buffer material can be enhanced.

[0046] A part of the heat conductive material 5 may contact the adhesive 37.

[0047] According to such a configuration, since the adhesive 37 fixes not only the optical connector 31 and the optical element 3 but also the heat conductive material 5, the optical module 1 according to the present embodiment has excellent fixing strength of the optical connector 31, and it becomes difficult for the optical connector 31 to fall off.

[0048] Further, a part of the heat conductive material 5 extends into the space S until it contacts the adhesive 37, so that it becomes possible to receive larger vibrations from the heat radiating member 4, and the function as a buffer material can be enhanced.

[0049] Further, when the viscosity of the heat conductive material 5 is relatively high, not only does it spread in a planar shape (here, a plane composed of the X-axis direction and the Y-axis direction) within the space S, but it also easily spreads in the height direction (here, the Z-axis direction). In this case, since a wider area within the space S can be filled with the heat conductive material 5, the function of the heat conductive material 5 as a buffer material can be enhanced.

[0050] <Manufacturing method of the optical module 1> Next, the manufacturing method of the optical module 1 according to the first embodiment will be described with reference to FIG. 2.

[0051] First, the optical element 3 is arranged on the first surface 20a of the substrate 20. Specifically, the optical element 3 is arranged so that the first surface 20a of the substrate 2 and the third surface 30a of the optical element 3 face each other.

[0052] Next, the adhesive 37 is applied to the region of the fourth surface 30b of the optical element 3 where the optical transmission path 36 is located.

[0053] Next, the optical connector 31 is arranged on the region of the fourth surface 30b of the optical element 3 where the adhesive 37 is applied. Specifically, the optical connector 31 is arranged at a position where the tip of the optical fiber cable 32 exposed from the bottom surface of the protruding portion 31b of the optical connector 31 and the optical transmission path 36 of the optical element 3 overlap in the Z-axis direction.

[0054] Next, a thermally conductive material 5 is applied to the region of the fourth surface 30b of the optical element 3 where the heat-generating part 35 is located.

[0055] Next, the heat dissipation member 4 is placed on the region of the fourth surface 30b of the optical element 3 where the thermally conductive material 5 is applied. At this time, the heat dissipation member 4 is placed at a position further away from the optical connector 31 than the desired position (for example, the position shown in Figure 2). For example, the heat dissipation member 4 is placed at a position shifted in the negative X-axis direction from the desired position.

[0056] Next, the heat dissipation member 4 is slid toward the desired position. Specifically, the heat dissipation member 4 is slid toward the optical connector 31. For example, the heat dissipation member 4 is slid in the positive X-axis direction. As a result, a portion of the thermal conductive material 5 applied between the optical element 3 and the heat dissipation member 4 moves with the heat dissipation member 4 and protrudes into the space S between the heat dissipation member 4 and the optical connector 31. Therefore, the thermal conductive material 5 is also located in space S.

[0057] As described above, in the optical module 1 according to the first embodiment, the thermally conductive material 5 is also located in space S. As a result, the thermally conductive material 5 acts as a buffer that absorbs vibrations from the heat dissipation member 4, making it difficult for vibrations from the heat dissipation member 4 to be transmitted to the optical connector 31, and thus making it less likely for the optical connector 31 to fall off.

[0058] (Second Embodiment) Figure 3 is a schematic cross-sectional view of the optical module 1 according to the second embodiment. The adhesive 37 may be located in space S in addition to between the optical connector 31 and the optical element 3. That is, the adhesive 37 may be located between the heat dissipation member 4 and the optical connector 31. A portion of the thermal conductive material 5 may be in contact with the adhesive 37 in space S. Specifically, as shown in Figure 3, the adhesive 37 and the thermal conductive material 5 may be located in the first space S1.

[0059] When a portion of the thermal conductive material 5 comes into contact with the adhesive 37 in the space S, the adhesive 37 and the thermal conductive material 5 spread throughout the space S, thereby improving its function as a buffer that absorbs vibrations from the heat dissipation member 4. As a result, vibrations from the heat dissipation member 4 are less likely to be transmitted to the optical connector 31, and the optical connector 31 is less likely to fall off.

[0060] Furthermore, as a portion of the thermally conductive material 5 spreads within the space S until it comes into contact with the adhesive 37, it becomes possible to absorb larger vibrations from the heat dissipation member 4, thereby enhancing its function as a cushioning material.

[0061] A portion of the adhesive 37 may further contact the heat dissipation member 4 in space S. This expands the adhesive area of ​​the adhesive 37, and the adhesive 37 plays a role in fixing the optical connector 31 and the heat dissipation member 4. As a result, the optical module 1 of this disclosure has superior fixing strength of the optical connector 31, and the optical connector 31 is less likely to fall off.

[0062] In space S, at least a portion of the adhesive 37 may be located on the thermally conductive material 5. Specifically, at least a portion of the adhesive 37 may be located on the thermally conductive material 5 in the first space S1.

[0063] When a low-viscosity thermally conductive material 5 is used, the thermally conductive material 5 may be located only in the lower part of the space S. In such cases, the adhesive 37 can be used to fill the upper area of ​​the space S, allowing the adhesive 37 and the thermally conductive material 5 to spread throughout the space S. Therefore, the function of the thermally conductive material as a buffer that absorbs vibrations from the heat dissipation member 4 can be further improved.

[0064] The optical module 1 according to the second embodiment can be manufactured, for example, by applying an additional adhesive 37 between the optical connector 31 and the heat dissipation member 4 after manufacturing the optical module 1 according to the first embodiment.

[0065] (Third Embodiment) Figure 4 is a schematic cross-sectional view of the optical module 1 according to the third embodiment. The adhesive 37 and the thermal conductive material 5 may be located in the first space S1 and the second space S2. In the example shown in Figure 4, the adhesive 37 and the thermal conductive material 5 are located in the first space S1, and the adhesive 37 is located in the second space S2.

[0066] By positioning the adhesive 37 in the second space S2, where the gap between the optical connector 31 and the heat dissipation member 4 is narrow, the function of the adhesive 37 as a buffer that absorbs vibrations from the heat dissipation member 4 is enhanced. As a result, vibrations from the heat dissipation member 4 are less likely to be transmitted to the optical connector 31, making it less likely for the optical connector 31 to fall off. In the example shown in Figure 4, the adhesive 37 is located in the second space S2, but if the thermal conductive material 5 is located there, the thermal conductive material 5 also acts as a buffer, making it less likely for vibrations from the heat dissipation member 4 to be transmitted to the optical connector 31, making it less likely for the optical connector 31 to fall off. Furthermore, by positioning at least one of the adhesive 37 or the thermal conductive material 5 in the second space S2, the optical connector 31 and the heat dissipation member 4 are less likely to come into contact.

[0067] Furthermore, the presence of at least one of the adhesive 37 or the thermal conductive material 5 in the second space S2 increases the occupancy rate of at least one of the adhesive 37 or the thermal conductive material 5 in the height direction (here, the Z-axis direction) of the first space S1 and the second space S2. In other words, the adhesive area between the heat dissipation member 4 and the optical connector 31 becomes larger. As a result, the optical module 1 according to this embodiment has excellent fixing strength for the optical connector 31, and the optical connector 31 is less likely to fall off.

[0068] In the example shown in Figure 4, only the adhesive 37 is located in the second space S2, but this is not the only example. For example, only the thermal conductive material 5 may be located in the second space S2, or both the thermal conductive material 5 and the adhesive 37 may be located there.

[0069] (Fourth Embodiment) Figure 5 is a schematic cross-sectional view of the optical module 1 according to the fourth embodiment. In the example of Figure 1 of the first embodiment, an example was shown in which the adhesive 37 and the thermal conductive material 5 are in contact, but the invention is not limited to this. As shown in Figure 5, the adhesive 37 and the thermal conductive material 5 do not need to be bonded together.

[0070] In this case as in the first embodiment, the thermal conductive material 5 is also located in the space S. As a result, the thermal conductive material 5 acts as a buffer to absorb vibrations from the heat dissipation member 4, making it difficult for vibrations from the heat dissipation member 4 to be transmitted to the optical connector 31, and thus making it less likely for the optical connector 31 to fall off.

[0071] (Fifth Embodiment) Figure 6 is a schematic cross-sectional view of the optical module 1 according to the fifth embodiment. As shown in Figure 6, the surfaces 31c and 31d of the optical connector 31 according to the first embodiment may be inclined with respect to the Z-axis direction. Specifically, the surfaces 31c and 31d may be inclined in a direction that brings them closer to the heat dissipation member 4 as they approach the optical element 3. In other words, as shown in Figure 6, in a cross-sectional view of the optical module 1, the distance between the optical connector 31 and the heat dissipation member 4 may decrease in the first space S1 as it approaches the optical element 3. Similarly, in a cross-sectional view of the optical module 1, the distance between the optical connector 31 and the heat dissipation member 4 may decrease in the second space S2 as it approaches the optical element 3. Note that if the surface 31c of the optical connector is inclined, the adhesive 37 can be injected from above the optical connector in the Z-axis direction and easily filled into the space S.

[0072] In this case as well, the thermally conductive material 5 is located in the space S, similar to the first embodiment. As a result, the thermally conductive material 5 acts as a buffer to absorb vibrations from the heat dissipation member 4, making it difficult for vibrations from the heat dissipation member 4 to be transmitted to the optical connector 31, and thus making it less likely for the optical connector 31 to fall off.

[0073] Furthermore, this technology can also take the following configurations: (1) An optical module comprising: a substrate having a first surface and a second surface located opposite to the first surface; an optical element having a third surface facing the first surface of the substrate and a fourth surface located opposite to the third surface; a heat dissipation member located on the fourth surface of the optical element; an optical connector located on the fourth surface of the optical element with a space between it and the heat dissipation member; and a thermally conductive material located between the optical element and the heat dissipation member, wherein the thermally conductive material is also located in the space. (2) The optical module according to (1), wherein a portion of the thermally conductive material is in contact with the optical connector in the space. (3) The optical module according to (1) or (2), further comprising an adhesive for fixing the optical connector to the optical element, wherein the adhesive is also located in the space, and a portion of the thermally conductive material is in contact with the adhesive in the space. (4) The optical module according to (3), wherein at least a portion of the adhesive is located on the thermal conductive material in the space. (5) The optical module according to (1) or (2), further comprising an adhesive for fixing the optical connector to the optical element, wherein the adhesive is also located in the space, and a portion of the adhesive is in contact with the heat dissipation member in the space. (6) The optical module according to (1) or (2), further comprising an adhesive for fixing the optical connector to the optical element, wherein the space comprises a first space and a second space located above the first space, the distance between the heat dissipation member and the surface of the optical connector facing the heat dissipation member is smaller in the second space than in the first space, and the adhesive and the thermal conductive material are located in the first space. (7) The optical module according to (6), wherein the adhesive and the thermal conductive material are located in the first space and the second space.

[0074] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. Indeed, the embodiments described above can be embodied in a variety of forms. Furthermore, the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.

[0075] 1 Optical module 2 Substrate 3 Optical element 4 Heat dissipation member 5 Thermally conductive material 31 Optical connector 31a Main body 31b Protruding part 32 Optical fiber cable 33 Connector 35 Heat generating part 36 Optical transmission path 37 Adhesive 41 Plate-shaped part 42 Leg part 45 Heat sink 100 Ventilation passage S Space S1 First space S2 Second space

Claims

1. An optical module comprising: a substrate having a first surface and a second surface located opposite to the first surface; an optical element having a third surface facing the first surface of the substrate and a fourth surface located opposite to the third surface; a heat dissipation member located on the fourth surface of the optical element; an optical connector located on the fourth surface of the optical element with a space between it and the heat dissipation member; and a thermally conductive material located between the optical element and the heat dissipation member, wherein the thermally conductive material is also located in the space.

2. The optical module according to claim 1, wherein a portion of the thermally conductive material is in contact with the optical connector in the space.

3. The optical module according to claim 1 or 2, further comprising an adhesive for fixing the optical connector to the optical element, wherein the adhesive is also located in the space, and a portion of the thermally conductive material is in contact with the adhesive in the space.

4. The optical module according to claim 3, wherein at least a portion of the adhesive is located on the thermally conductive material in the space.

5. The optical module according to claim 1 or 2, further comprising an adhesive for fixing the optical connector to the optical element, wherein the adhesive is also located in the space, and a portion of the adhesive is in contact with the heat dissipation member in the space.

6. The optical module according to claim 1 or 2, further comprising an adhesive for fixing the optical connector to the optical element, wherein the space comprises a first space and a second space located above the first space, the distance between the heat dissipation member and the surface of the optical connector facing the heat dissipation member is smaller in the second space than in the first space, and the adhesive and the thermal conductive material are located in the first space.

7. The optical module according to claim 6, wherein the adhesive and the thermally conductive material are located in the first space and the second space.

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