Flexible printed circuit board and electronic device including same

Abstract

An electronic device according to an embodiment disclosed herein comprises: a housing; a battery disposed inside the housing; a wireless power receiver that includes a coil and is disposed inside the housing; a first circuit board; a second circuit board; and a flexible printed circuit board disposed between the wireless power receiver and the battery, the flexible printed circuit board including a first section including a first end connected to the first circuit board, a second section including a second end connected to the second circuit board, and a third section connecting the first section and the second section, wherein the third section, when viewed from above, overlaps the coil of the wireless power receiver and is connected between the first section and the second section. The third section includes: a first base layer; a first wiring layer that includes a 1-1 signal line disposed in a first region of the first base layer and a 2-1 signal line disposed in a second region of the first base layer and spaced apart from the 1-1 signal line in a first direction; a first dielectric layer disposed on the first wiring layer; a first shielding layer disposed between the wireless power receiver and the first dielectric layer; and a second shielding layer disposed between the first base layer and the battery at a position corresponding to the 2-1 signal line, wherein the second shielding layer is prevented from overlapping the 1-1 signal line between the first base layer and the battery in order to reduce and / or prevent wireless signal interference due to the second shielding layer. The thickness of the third section is less than the thickness (T1) of the first section and the thickness of the second section.

Description

Flexible printed circuit board and electronic device including the same

[0001] The various embodiments disclosed in this document relate to flexible printed circuit boards, for example, flexible printed circuit boards and electronic devices including the same.

[0002] Driven by remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. In particular, recent electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and in-car navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can recently be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, and functions such as schedule management or electronic wallets are being integrated into a single electronic device.

[0004] As electronic devices have become miniaturized, securing mounting space for internal circuit boards has become difficult. Circuit boards containing various wiring and wires pose challenges in ensuring signal efficiency due to signal interference when they run across electronic components. Furthermore, as internal circuit boards are placed inside electronic devices, it has been difficult to achieve a thin profile while simultaneously reducing signal loss.

[0005] The information described above may be provided as background art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0006] An electronic device according to one embodiment of the present disclosure comprises a housing, a battery disposed within the housing, a wireless power receiver disposed within the housing and including a coil, a first circuit board, a second circuit board, and a flexible printed circuit board disposed between the wireless power receiver and the battery, comprising a first portion including a first end connected to the first circuit board, a second portion including a second end connected to the second circuit board, and a third portion connecting the first portion and the second portion, wherein, when viewed from above, the coil of the wireless power receiver overlaps and is connected between the first portion and the second portion, wherein the third portion comprises a first substrate layer, a first-1 signal line disposed in a first region of the first substrate layer, and a second-1 signal line disposed in a second region of the first substrate layer and spaced apart from the first-1 signal line in a first direction, a first dielectric layer disposed on the first wiring layer, a first shielding layer disposed between the wireless power receiver and the first dielectric layer, and the first at a position corresponding to the second-1 signal line A second shielding layer disposed between the substrate layer and the battery, wherein, in order to reduce and / or prevent interference of a wireless signal by the second shielding layer, the second shielding layer comprises a second shielding layer that does not overlap with a first-1 signal line between the first substrate layer and the battery, and the thickness of the third portion may be smaller than the thickness of the first portion and the thickness of the second portion.

[0007] An electronic device according to one embodiment of the present disclosure comprises a housing for housing a wireless power receiver including a battery and a coil, and a flexible printed circuit board disposed between the battery and the wireless power receiver and comprising a first portion, a second portion and a third portion connecting the first portion and the second portion, wherein the third portion may include a first substrate layer, a first wiring layer comprising a first-1 signal line disposed on a portion of the first substrate layer, a first dielectric layer disposed on the first wiring layer and partially supporting the first-1 signal line and the second-1 signal line, and a first shielding layer disposed between the wireless power receiver and the first dielectric layer.

[0008] A flexible printed circuit board according to one embodiment of the present disclosure comprises a first portion, a second portion, and a third portion connecting the first portion and the second portion and thinner than the thickness of the first portion and the second portion, wherein the third portion comprises a first wiring layer comprising a first substrate layer, a first-1 signal line disposed on a part of the first substrate layer, and a second-1 signal line disposed on another part of the first substrate layer and spaced apart from the first-1 signal line in a first direction, a first dielectric layer disposed on the first wiring layer and partially supporting the first-1 signal line and the second-1 signal line, a second substrate layer disposed between the first dielectric layer and the first shielding layer, a first shielding layer disposed on the second substrate layer, and a second shielding layer disposed below the first substrate layer at a position corresponding to the second-1 signal line, wherein the second shielding layer does not overlap with the first-1 signal line below the first substrate layer to reduce and / or prevent interference of a wireless signal by the second shielding layer. It may include a second shielding layer.

[0009] The aspects, configurations, and / or advantages described above regarding various embodiments of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0011] FIG. 2 is a perspective view showing an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 3 is a perspective view showing an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 5 is a disassembled view of a portion of the rear of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 6 is a conceptual diagram viewed from the -Z direction to the +Z direction showing a flexible printed circuit board according to one embodiment of the present disclosure.

[0016] FIG. 7 is a conceptual diagram showing an exploded view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0017] FIG. 8a is a conceptual diagram showing a portion of cross-section A-A' shown in FIG. 5, according to one embodiment of the present disclosure.

[0018] FIG. 8b is a conceptual diagram showing a part of cross-section B-B' shown in FIG. 5, according to one embodiment of the present disclosure.

[0019] FIG. 8c is a conceptual diagram showing a part of the cross-section C-C' illustrated in FIG. 5 according to one embodiment of the present disclosure.

[0020] FIG. 9 is a drawing showing a portion of a flexible printed circuit board according to one embodiment of the present disclosure.

[0021] FIG. 10 is a conceptual diagram showing a flexible printed circuit board according to one embodiment of the present disclosure.

[0022] FIG. 11 is a conceptual diagram showing a part of cross-section B-B' shown in FIG. 5 according to one embodiment of the present disclosure.

[0023] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0024] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment.

[0025] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0026] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0027] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0028] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0032] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0033] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0034] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0038] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0040] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0043] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0044] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0045] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104 or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] The electronic device (101) according to one embodiment disclosed in this document may be of various forms. The electronic device (101) may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device (101) according to the embodiment of this document is not limited to the aforementioned devices.

[0048] The embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0049] As used in one embodiment of this document, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0050] One embodiment of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0051] According to one embodiment, the method according to one embodiment disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0052] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0053] In the following detailed description, the length direction of the electronic device (101) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the following detailed description, the references to length direction, width direction, and / or height direction (or thickness direction) may refer to the length direction, width direction, and / or height direction (or thickness direction) of the electronic device.

[0054] According to one embodiment, the statement that a component faces 'a certain direction' can be understood to include not only the component facing 'a direction identical to a certain direction' but also the component facing 'a direction parallel to a certain direction'. It should be noted that in the following description, when a component is said to overlap (or stacked) with another component, the description of the arrangement relationship in the height direction described above may apply.

[0055] In describing directions, if 'negative / positive (- / +)' is not indicated, it may be interpreted to include both the positive and negative directions unless otherwise defined. For example, the 'Z-axis direction' may be interpreted to include both the +Z direction and the -Z direction. Similarly, the 'X-axis direction' may be interpreted to include both the +X direction and the -X direction, and the 'Y-axis direction' may be interpreted to include both the +Y direction and the -Y direction. However, in the XYZ spatial coordinate system depicted in the drawing, if 'negative / positive (- / +)' is not indicated on an axis, that axis may be interpreted to face the positive direction unless otherwise specified. In describing directions, facing any one of the three axes of the Cartesian coordinate system may include facing a direction parallel to said axis.

[0056] In the following description of the electronic device (e.g., 200 in FIG. 2), the ‘first direction’ may mean the X-axis direction or a direction parallel to the X-axis. The ‘second direction’ may mean the -Z-axis direction or a direction parallel to the Z-axis direction. The ‘third direction’ may mean the Y-axis direction or a direction parallel thereto. The ‘third direction’ may mean a direction perpendicular to the ‘first direction’ or the ‘second direction’. Note that the foregoing description is based on the orthogonal coordinate system described in the drawings for the sake of brevity, and that the description of these directions or components does not limit the various embodiments of the present disclosure.

[0057] Although specific embodiments have been described in the detailed description of the present disclosure, it will be obvious to those skilled in the art that various modifications are possible within the scope of the present disclosure.

[0058] FIG. 2 is a drawing illustrating an electronic device (200) in an unfolded state according to one embodiment of the present disclosure. FIG. 3 is a drawing illustrating an electronic device (200) in a folded state according to one embodiment of the present disclosure.

[0059] The configurations described with reference to FIGS. 2 and 3 may be substantially identical to the configurations described with reference to FIG. 1. The configurations described with reference to FIGS. 2 and 3 may be substantially identical to the configurations according to an embodiment of the present disclosure described with reference to FIGS. 4 through 11 to the extent that they do not conflict. The embodiments of FIGS. 2 and 3 may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIGS. 4 through 11. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIGS. 4 through 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 1.

[0060] Referring to FIGS. 2 and 3, according to one embodiment, an electronic device (200) may include a set housing (201), a hinge cover (230) covering a foldable portion of the set housing (201), and a flexible or foldable display (240) (hereinafter abbreviated as "display" (240)) disposed on the set housing (201). According to one embodiment, the surface on which the display (240) is disposed is defined as the front surface of the electronic device (200) (e.g., a first front surface (210a) and a second front surface (220a)). And, the opposite surface of the front surface is defined as the rear surface of the electronic device (200) (e.g., a first rear surface (210b) and a second rear surface (220b)). Additionally, the surface surrounding the space between the front and the rear is defined as a side of the electronic device (200) (e.g., a first side (211a) and a second side (221a)). The electronic device (200) may be a foldable electronic device.

[0061] According to one embodiment, the set housing (201) may include a first housing (210), a second housing (220) rotatably coupled to the first housing (210), a first rear cover (280), a second rear cover (290), and a hinge assembly (e.g., the hinge assembly (202) of FIG. 4). The hinge assembly (202) may provide at least one folding axis (F) that serves as the center of folding or unfolding of the electronic device (200) of the first housing (210) and / or the second housing (220). The set housing (201) of the electronic device (200) is not limited to the form and combination shown in FIG. 2 and FIG. 3 and may be implemented by other shapes or combinations and / or combinations of parts. For example, in another embodiment, the first housing (210) and the first rear cover (280) may be formed integrally, and the second housing (220) and the second rear cover (290) may be formed integrally. According to various embodiments, the first housing (210) is connected to a hinge assembly (e.g., the hinge assembly (202) of FIG. 4) and may include a first front (210a) facing the -Z axis direction in the unfolded state and a first rear (210b) facing the +Z axis direction opposite to the -Z axis direction in the unfolded state. The second housing (220) is connected to the hinge assembly (202) and includes a second front surface (220a) facing the -Z axis direction in the unfolded state and a second rear surface (220b) facing the +Z axis direction opposite to the -Z axis direction in the unfolded state, and can rotate relative to the first housing (210) around the hinge assembly (202). Accordingly, the electronic device (200) can be varied between a folded state and an unfolded state. In the folded state, the first front surface (210a) of the electronic device (200) may face the second front surface (220a), and below, unless otherwise noted, the direction is described based on the unfolded state of the electronic device (200).

[0062] According to one embodiment, the first housing (210) and the second housing (220) may be arranged on both sides of the folding axis (F). As an example, the first housing (210) and the second housing (220) may have a shape that is symmetrical with respect to the folding axis (F). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (200) is in an unfolded state, a folded state, or an intermediate state. According to one embodiment, unlike the first housing (210), the second housing (220) additionally includes a sensor area (224) where various sensors (e.g., a front camera) are arranged, but in other areas, it may have a shape symmetrical to the first housing (210). According to one embodiment, the folding axis (F) may be a plurality of parallel folding axes (e.g., two). In the present disclosure, the folding axis (F) is provided along the length direction (Y-axis direction) of the electronic device (200), but the direction of the folding axis (F) is not limited thereto. For example, depending on the external design or the user's usage habits, the electronic device (200) may be understood to include a folding axis (F) extended along the width direction (e.g., X-axis direction).

[0063] According to one embodiment, the electronic device (200) may include a structure into which a digital pen can be inserted. For example, a hole (223) into which the digital pen can be inserted may be formed on the side of the first housing (210) or the side of the second housing (220) of the electronic device (200).

[0064] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metal or non-metal material having a selected size of rigidity to support the display (240). The at least portion formed of the metal material may provide a ground plane of the electronic device (200) and may be electrically connected to a ground conductor provided on a printed circuit board (e.g., the substrate portion (260) of FIG. 4).

[0065] According to one embodiment, the sensor area (224) may be formed to have a predetermined area adjacent to one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated examples. For example, in another embodiment, the sensor area (224) may be provided in another corner of the second housing (220), any area between the top corner and the bottom corner, or in the first housing (210). According to one embodiment, components for performing various functions embedded in the electronic device (200) may be visually exposed to the front of the electronic device (200) through the sensor area (224) or through one or more openings provided in the sensor area (224). In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0066] According to one embodiment, the first rear cover (280) is positioned on one side of the folding axis (F) on the rear of the electronic device (200) and may have a substantially rectangular periphery, for example, and the periphery may be enclosed by a first housing (210). Similarly, the second rear cover (290) is positioned on the other side of the folding axis (F) on the rear of the electronic device (200) and its periphery may be enclosed by a second housing (220).

[0067] According to one embodiment, the first rear cover (280) and the second rear cover (290) may have a substantially symmetrical shape with respect to the folding axis (F). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetrical shapes, and in another embodiment, the electronic device (200) may include the first rear cover (280) and the second rear cover (290) of various shapes.

[0068] According to one embodiment, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may form a space in which various components of the electronic device (200) (e.g., a printed circuit board, or a battery) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear of the electronic device (200). For example, at least a portion of a sub-display (e.g., the sub-display (244) of FIG. 3) may be visually exposed through the first rear area (282) of the first rear cover (280). In another embodiment, one or more components or sensors may be visually exposed through the second rear area (292) of the second rear cover (290). In various embodiments, the sensors may include a proximity sensor and / or a camera module (206) (e.g., a rear camera).

[0069] According to one embodiment, a front camera visually exposed to the front of the electronic device (200) through one or more openings provided in the sensor area (224) or a camera module (206) visually exposed through a second rear area (292) of the second rear cover (290) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0070] Referring to FIG. 3, according to one embodiment of the present disclosure, the hinge cover (230) may be configured to be positioned between the first housing (210) and the second housing (220) to cover an internal component (e.g., the hinge assembly (202) of FIG. 4). According to one embodiment, the hinge cover (230) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside depending on the state of the electronic device (200) (flat state or folded state). For example, in the flat state, the hinge cover (230) may be substantially covered by the first housing (210) and the second housing (220), and in the folded state, most of the outer surface of the hinge cover (230) may be exposed to the outside.

[0071] According to one embodiment, as shown in FIG. 2, when the electronic device (200) is in an unfolded state, the hinge cover (230) may be covered by the first housing (210) and the second housing (220) and not exposed. As another example, as shown in FIG. 3, when the electronic device (200) is in a folded state (e.g., a fully folded state), the hinge cover (230) may be exposed to the outside between the first housing (210) and the second housing (220). As yet another example, when the first housing (210) and the second housing (220) are in an intermediate state with a certain angle, the hinge cover (230) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be smaller than in the fully folded state. In one embodiment, the hinge cover (230) may include a curved surface.

[0072] According to one embodiment, the display (240) may be placed in the set housing (201). For example, the display (240) may be seated on a recess formed by the set housing (201) and may form at least a portion of the front surface of the electronic device (200). Accordingly, the front surface of the electronic device (200) may include the display (240) and a portion of the first housing (210) and a portion of the second housing (220) adjacent to the display (240). The rear surface of the electronic device (200) may include a first rear cover (280), a portion of the first housing (210) adjacent to the first rear cover (280), a second rear cover (290), and a portion of the second housing (220) adjacent to the second rear cover (290).

[0073] According to one embodiment, the display (240) may mean a display in which at least some area can be transformed into a flat or curved surface. According to one embodiment, the display (240) may include a folding area (243), a first display area (241) disposed on one side (e.g., the left side of the folding area (243) shown in FIG. 2) relative to the folding area (243), and a second display area (242) disposed on the other side (e.g., the right side of the folding area (243) shown in FIG. 2). The division of the areas of the display (240) is exemplary, and the display (240) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 1, the area of ​​the display (240) may be divided by a folding area (243) extended parallel to the Y-axis or a folding axis (A-axis), but in other embodiments, the area of ​​the display (240) may be divided based on a different folding area (e.g., a folding area parallel to the X-axis) or a different folding axis (e.g., a folding axis parallel to the X-axis).

[0074] According to one embodiment, the display (240) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer (not shown) configured to detect a magnetic field type stylus pen.

[0075] According to one embodiment, the first display area (241) and the second display area (242) may have a shape that is symmetrical overall with respect to the folding area (243). According to one embodiment (not shown), the second display area (242), unlike the first display area (241), may include a notch cut according to the presence of the sensor area (224), but in other areas, may have a shape symmetrical to the first display area (241). In other words, the first display area (241) and the second display area (242) may include a portion having a shape symmetrical to each other and a portion having a shape asymmetrical to each other.

[0076] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of ​​the display (240) according to the state of the electronic device (200) (e.g., flat state, or unfolded state and folded state) will be described.

[0077] According to one embodiment, when the electronic device (200) is in a flat state (see FIG. 3), the first housing (210) and the second housing (220) may be arranged such that they form an angle of substantially 180 degrees and the first display area (241) and the second display area (242) face substantially the same direction. For example, in the flat state, the surface of the first display area (241) and the surface of the second display area (242) may form an angle of 180 degrees to each other and face the same direction (e.g., the front direction of the electronic device). The folding area (243) may form a plane with the first display area (241) and the second display area (242).

[0078] According to one embodiment, when the electronic device (200) is in a folded state (e.g., FIG. 3), the first housing (210) and the second housing (220) may be positioned facing each other. The surface of the first display area (241) and the surface of the second display area (242) of the display (240) may form a narrow angle (e.g., between 0 and 10 degrees) with respect to each other and may substantially face each other. The folding area (243) may be formed of a curved surface having at least a portion having a predetermined curvature.

[0079] According to one embodiment, when the electronic device (200) is in a folded state, the first housing (210) and the second housing (220) may be positioned at a certain angle to each other. The surface of the first display area (241) and the surface of the second display area (242) of the display (240) may form an angle that is larger than the folded state and smaller than the unfolded state. The folding area (243) may be formed of a curved surface having at least a portion of a certain curvature, and the curvature may be smaller than in the folded state.

[0080] Note that the electronic device (200) of FIGS. 2 and 3 is not limited to a foldable electronic device. For example, it may be substantially the same as a tablet, a multi-foldable electronic device, a slideable electronic device, etc.

[0081] FIG. 4 is an exploded perspective view of an electronic device (200) according to one embodiment of the present disclosure.

[0082] Referring to FIG. 4, the electronic device (200) may include a set housing (201), a display (240), a hinge assembly (202), a battery (250), and a substrate (260). The set housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290).

[0083] The configurations described with reference to FIG. 4 may be substantially identical to the configurations described with reference to FIG. 1 through 3. The configurations described with reference to FIG. 4 may be substantially identical to the configurations according to an embodiment of the present disclosure described with reference to FIG. 5 through 11 to the extent that they do not conflict. The embodiments of FIG. 4 may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIG. 5 through 11. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 5 through 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 1 through 3.

[0084] According to one embodiment, the set housing (201) may include a first housing (210), a second housing (220), a hinge cover (230), a first rear cover (280), and a second rear cover (290). In one embodiment, a hinge assembly (202) is disposed inside the set housing (201) to rotatably connect the first housing (210) and the second housing (220).

[0085] According to one embodiment, the first housing (210) and the second housing (220) may be assembled together to be joined to both sides of the hinge assembly (202). According to one embodiment, the first housing (210) may include a first support area (212) (e.g., a first support plate or a first support member) capable of supporting a component of the electronic device (200) (e.g., a first housing circuit board (262) and / or a first battery (252)) and a first side wall (211) surrounding at least a portion of the first support area (212). The first side wall (211) may include a first side of the electronic device (200) (e.g., the first side (211a) of FIG. 2). According to one embodiment, the second housing (220) may include a second support area (222) (e.g., a second support plate or a second support member) capable of supporting a component of the electronic device (200) (e.g., a second housing circuit board (264) and / or a second battery (254)) and a second side wall (221) surrounding at least a portion of the second support area (222). The second side wall (221) may include a second side of the electronic device (200) (e.g., the second side (221a) of FIG. 2).

[0086] According to one embodiment, the display (240) may include a first display area (241), a second display area (242), a folding area (243), and a sub-display (244). The configuration of the first display area (241), the second display area (242), and the folding area (243) of FIG. 4 may be all or part identical to the configuration of the first display area (241), the second display area (242), and the folding area (243) of FIG. 2 and / or FIG. 3.

[0087] According to one embodiment, the sub-display (244) can display a screen in a direction different from the display area (241, 242). For example, the sub-display (244) can output a screen in a direction opposite to the first display area (241). According to one embodiment, the sub-display (244) can be placed on the first rear cover (280).

[0088] According to one embodiment, the battery (250) may include a first battery (252) disposed within a first housing (210) and a second battery (254) disposed within a second housing (220). According to one embodiment, the first battery (252) may be disposed on a first housing circuit board (262), and the second battery (254) may be disposed on a second housing circuit board (264).

[0089] According to one embodiment, the substrate portion (260) may include a first housing circuit board (262) disposed within a first housing (210) and a second housing circuit board (264) disposed within a second housing (220). According to one embodiment, the substrate portion (260) may include at least one flexible printed circuit board (266) for electrically connecting the first housing circuit board (262) and the second housing circuit board (264). The flexible printed circuit board (266) may be disposed across the hinge assembly (202). The flexible printed circuit board (266) may be disposed across the folding axis (F). According to one embodiment, the first housing circuit board (262) and the second housing circuit board (264) may be disposed inside a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). Components for implementing various functions of the electronic device (200) may be disposed on the first housing circuit board (262) and the second housing circuit board (264).

[0090] According to one embodiment, the second housing circuit board (264) may include a first circuit board (264a) and a second circuit board (264b). The first circuit board (264a) may be placed inside the second housing (220). The second circuit board (264b) may be placed inside the second housing (220). The first circuit board (264a) and the second circuit board (264b) may be placed spaced apart from each other with a battery (e.g., a second battery (254)) in between. The first circuit board (264a) and the second circuit board (264b) may be electrically connected through a flexible printed circuit board (301). For example, one end of the flexible printed circuit board (301) may be electrically connected to the second circuit board (264b), and the other end of the flexible printed circuit board (301) may be electrically connected to the first circuit board (264a) across the underside of the second battery (254).

[0091] According to one embodiment, the electronic device (200) may include a flexible printed circuit board (FPCB) (301). The flexible printed circuit board (301) may be placed inside the second housing (220). The flexible printed circuit board (301) may be placed below the second battery (254) (e.g., in the -Z direction). The flexible printed circuit board (301) may be placed between the second battery (254) and the wireless power receiver (302). The flexible printed circuit board (301) may transmit power transmitted from the outside to an internal component of the electronic device (200) (e.g., the second circuit board (264b)). The flexible printed circuit board (301) may transmit a wireless signal transmitted from the outside to an internal component (e.g., the second circuit board (264b)). The flexible printed circuit board (301) may be configured to transmit power from the outside in one area and to transmit wireless signals in another area. The flexible printed circuit board (301) may be positioned to span the internal space of the second housing (220). The flexible printed circuit board (301) may be positioned inside the housing spanning between the second battery (254) and the wireless power receiver (302). The flexible printed circuit board (301) may be positioned along the +Y direction such that the thickness in at least one area differs from that in another area. For example, in the area overlapping with the coil of the wireless power receiver (302) (e.g., the coil (3021) in FIG. 5), the thickness may be configured to be thinner than the thickness in the other area and may be positioned between the second battery (254) and the wireless power receiver (301).

[0092] The flexible printed circuit board (301) described in the present disclosure is not limited to the wireless power receiver (302) being placed between the second battery (254), but may be placed between the first battery (252) and another wireless power receiver (not shown).

[0093] According to one embodiment, the electronic device (200) may include a wireless power receiver (302). The wireless power receiver (302) may be placed inside the second housing (220). The wireless power receiver (302) may be placed in the portion of the second housing (220) of the hinge cover (230). The wireless power receiver (302) may be placed in the second rear cover (290) of the second housing (220). The wireless power receiver (302) may be placed between the second battery (254) and the portion of the second housing (220) of the hinge cover (230). The wireless power receiver (302) may be placed between the second battery (254) and the second rear cover (290). The wireless power receiver (302) may be placed spaced apart from the second battery (254) with a flexible printed circuit board (301) in between. For example, a wireless power receiver (302), a flexible printed circuit board (301), and a second battery (254) may be arranged in a stacked structure in the +Z direction. However, it should be noted that this is not limited thereto. The wireless power receiver (302) may receive power wirelessly from the outside by electromagnetic induction and / or resonance. For example, the wireless power receiver (302) may transfer power from the outside by electromagnetic induction to a battery (250) placed inside the electronic device (200).

[0094] According to one embodiment, the electronic device (200) may include a speaker module (208) (e.g., the audio module (170) of FIG. 1). According to one embodiment, the speaker module (208) may convert an electrical signal into sound. According to one embodiment, the speaker module (208) may be placed inside a space formed by a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290).

[0095] In the following detailed description, a configuration in which the first housing (210) and the second housing (220) are rotatably connected or coupled by a hinge assembly (or, referred to as a ‘hinge structure’) may be illustrated. However, it should be noted that such embodiments do not limit the electronic device according to various embodiments of the present disclosure. For example, the electronic device according to various embodiments of the present disclosure may include three or more housings, and the “pair of housings” in the embodiments disclosed below may mean “two housings among three or more housings that are rotatably coupled to each other.”

[0096] The flexible printed circuit board (301) and wireless power receiver (302) of FIG. 4 described in this disclosure are not limited to being placed inside the second housing (220). The flexible printed circuit board (301) of FIG. 4 is not limited to being placed under the second battery (254).

[0097] FIG. 5 is a disassembled view of a portion of the rear of an electronic device according to one embodiment of the present disclosure.

[0098] The configurations described with reference to FIG. 5 may be substantially identical to the configurations described with reference to FIG. 1 through 4. The configurations described with reference to FIG. 5 may be substantially identical to the configurations according to an embodiment of the present disclosure described with reference to FIG. 6 through 11 to the extent that they do not conflict. The embodiments of FIG. 5 may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIG. 6 through 11. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 6 through 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 1 through 4.

[0099] According to one embodiment, the electronic device (200) may include a housing (220). The housing (220) may be the first housing (210) or the second housing (220) of FIGS. 2 to 4. The housing (220) may provide a space for accommodating an electronic component (e.g., a flexible printed circuit board (301)).

[0100] According to one embodiment, the electronic device (200) may include a battery (e.g., the second battery (254) of FIG. 4). The battery (e.g., the second battery (254) of FIG. 4) may be placed within a housing (220). The battery (e.g., the second battery (254) of FIG. 4) may overlap with a flexible printed circuit board (301) and a wireless power receiver (302) when viewed from the -Z direction.

[0101] According to one embodiment, the electronic device (200) may include a wireless power receiver (302). The wireless power receiver (302) may be placed inside a housing (220). The wireless power receiver (302) may be placed to cover a flexible printed circuit board (301) and / or a battery (e.g., the second battery (254) of FIG. 4) when viewed from the -Z direction. The wireless power receiver (302) may overlap with a battery (e.g., the second battery (254) of FIG. 4) and a flexible printed circuit board (301). For example, when viewing the electronic device (200) from the rear (from the -Z direction to the +Z direction), the flexible printed circuit board (301) may be positioned below the wireless power receiver (302), and the battery (e.g., the second battery (254) of FIG. 4) may be positioned below the flexible printed circuit board (301). The wireless power receiver (302) may come into contact with the flexible printed circuit board (301).

[0102] According to one embodiment, the wireless power receiver (302) may include a coil (3021). The wireless power receiver (302) may have a structure in which the coil (3021) is laminated. The coil (3021) may come into contact with a flexible printed circuit board (301). For example, a portion of the flexible printed circuit board (301) may come into contact with the coil (3021), and the remaining portion may come into contact with the wireless power receiver (302).

[0103] According to one embodiment, the electronic device (200) may include a flexible printed circuit board (FPCB) (301). The flexible printed circuit board (301) may be positioned across the internal space of the housing (220). One end of the flexible printed circuit board (FPCB) (301) may be positioned at the end of the housing (220), and the other end may be positioned across the internal space of the housing (220) to contact an electronic component inside the housing (220) (e.g., the first circuit board (264a) of FIG. 4). The flexible printed circuit board (301) may be configured to electrically connect a plurality of electronic components (e.g., the first circuit board (264a) and the second circuit board (264b) shown in FIG. 4) inside the housing (220). When viewed from the -Z direction, at least a portion of the flexible printed circuit board (FPCB) (301) may overlap with a coil (3021). A flexible printed circuit board (FPCB) (301) can be connected to an electronic component (e.g., the first circuit board (264a) of FIG. 4) across the space between the battery (e.g., the second battery (254) of FIG. 4) and the wireless power receiver (302) at one end of the housing (220).

[0104] FIG. 6 is a conceptual diagram viewed from the -Z direction to the +Z direction showing a flexible printed circuit board according to one embodiment of the present disclosure.

[0105] FIG. 7 is a conceptual diagram showing an exploded view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0106] The configurations described with reference to FIGS. 6 and 7 may be substantially identical to the configurations described with reference to FIGS. 1 through 5. The configurations described with reference to FIGS. 6 and 7 may be substantially identical to the configurations according to an embodiment of the present disclosure described with reference to FIGS. 8a through 11 to the extent that they do not conflict. The embodiments of FIGS. 6 and 7 may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIGS. 8a through 11. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIGS. 8a through 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIGS. 1 through 5.

[0107] According to one embodiment, the flexible printed circuit board (301) may include a first layer (3011a, 3012a, 3013a, 3014a). The first layer (3011a, 3012a, 3013a, 3014a) may be spaced apart from each other. The first layer may include a coating layer (e.g., the first coating layer (317) of FIG. 8a). The first layer (3011a, 3012a, 3013a, 3014a) may include a ground portion (e.g., the second-third ground portion (315c) of FIG. 8a). The first layer (3011a, 3012a, 3013a, 3014a) may include a dielectric layer (e.g., the second-second dielectric layer (313b) of FIG. 8a). The first layer (3011a, 3012a, 3013a, 3014a) may have a stacked structure comprising a coating layer (e.g., the first coating layer (317) of FIG. 8a), a grounding portion (e.g., the second-third grounding portion (315c) of FIG. 8a) and a dielectric layer (e.g., the second-second dielectric layer (313b) of FIG. 8a).

[0108] According to one embodiment, the flexible printed circuit board (301) may include a second layer (301b). The second layer (301b) may be partially bonded to the first layers (3011a, 3012a, 3013a, 3014a) spaced apart from each other. The second layer (301b) may include a dielectric layer (e.g., the first dielectric layer (333) of FIG. 8b). A signal line (e.g., the first signal line (3321) of FIG. 8a) may be disposed on one side of the second layer (301b). The second layer (301b) may extend in correspondence with the area of ​​the flexible printed circuit board (301).

[0109] According to one embodiment, the flexible printed circuit board (301) may include a third layer (301c). The third layer (301c) may be in contact with the second layer (301b). The third layer (301c) may be spaced apart from the first layer (3011a, 3012a, 3013a, 3014a) with the second layer (301b) in between. The third layer (301c) may include a dielectric layer (e.g., the first dielectric layer (333) of FIG. 8b). The third layer (301c) may include a ground portion (e.g., the first-second ground portion (335b) of FIG. 8b). The third layer (301b) may have a stacked structure of a dielectric layer (e.g., the first dielectric layer (333) of FIG. 8b) and a ground portion (e.g., the first-second ground portion (335b) of FIG. 8b). The third layer (301c) may form a dielectric layer (e.g., the first dielectric layer (333) of FIG. 8b) with the second layer (301b).

[0110] According to one embodiment, the flexible printed circuit board (301) may have a plurality of laminated structures. For example, it may have a structure in which a first layer (3011a, 3012a, 3013a, 3014a), a second layer (301b), and a third layer (301c) are sequentially laminated. The flexible printed circuit board (301) may have a structure in which the second layer (301b) and the third layer (301c) are partially laminated. For example, three layers may be laminated in one region, and two layers may be laminated in another region. The ground portion described in this disclosure (e.g., the first-second ground portion (335b) of FIG. 8b) may be a copper (Cu) plating layer. The dielectric layer described in the present disclosure (e.g., the first dielectric layer (333) of FIG. 8b) may comprise at least one of polyester (PES), polyimide (PI), copper (Cu), insulating material and / or adhesive. The coating layer described in the present disclosure (e.g., the first coating layer (317) of FIG. 8a) may comprise at least one of photosolder resist (PSR), polymer, and photosensitive material.

[0111] According to one embodiment, the flexible printed circuit board (301) may include a first portion (310). The first portion (310) may be disposed at one end of the flexible printed circuit board (301). A portion (3011a) of a first layer may be disposed at the first portion (310). The first portion (310) may have a stacked structure of a portion (3011a) of the first layer, a second layer (301b), and a third layer (301c). The first portion (310) may include a first end (3041) connected to a first circuit board (e.g., the first circuit board (264a) of FIG. 4). The first end (3041) may transmit power or / and signals transmitted through the flexible printed circuit board (301) to the first circuit board (e.g., the first circuit board (264a) of FIG. 4).

[0112] According to one embodiment, the flexible printed circuit board (301) may include a second portion (320). The second portion (320) may be spaced apart from the first portion (310). The second portion (320) may be extended to form another end of the flexible printed circuit board (301). The second portion (320) may include other parts (3012a, 3013a, 3014a) of the first layer. The second portion (320) may have a stacked structure in which other parts (3012a, 3013a, 3014a) of the first layer, the second layer (301b), and the third layer (301c) are stacked. The second portion (320) may include a second end (3032). The second end (3032) may be connected to the second circuit board (264b). The second part (320) may be configured to transmit power and / or signals transmitted through the second end (3032) to the first part (310) and / or the third part (330). The second part (310) may be spaced apart from the first part (310) with the third part (330) in between. The second part (320) may be connected to the third part (330) and may be connected to the first part (310) through the third part (330).

[0113] According to one embodiment, the second part (320) may include a fourth-1 part (340a) and a fourth-2 part (340b). The fourth-1 part (340a) may be connected to a second-1 end (381). The second-1 end (381) may be configured to transmit power and / or signals from outside the electronic device (e.g., the electronic device (200) of FIG. 4) to the second part (320). The fourth-2 part (340b) may be connected to a second-2 end (382). The fourth-1 part (340a) and the fourth-2 part (340b) may be spaced apart from each other in the X-axis direction and each extend from the second part (320). The 4-1 part (340a) and the 4-2 part (340b) are spaced apart from each other in the X-axis direction and can extend from the 2 part (320) away from the 1 part (310).

[0114] In the present disclosure, the second end (3032) may be named as a configuration comprising a fourth-1 part (340a), a fourth-2 part (340b), a second-1 end (381), and a second-2 end (382). The second-1 end (381) may be named as a part of the second end (3032).

[0115] According to one embodiment, the flexible printed circuit board (301) may include a third part (330). The third part (330) may be positioned between the first part (310) and the second part (320). The third part (330) may connect the first part (310) and the second part (320) between the first part (310) and the second part (320). The third part (330) may have a structure in which the second layer (301b) and the third layer (301c) are laminated. The third part (330) may be composed of a flexible material. The third part (330) may transmit signals and / or power transmitted from the first part (310) or the second part (320) to the second part (320) or the first part (310).

[0116] According to one embodiment, the third part (330) may be positioned to overlap with the coil (3021) of the wireless power receiver (302). The third part (330) may overlap with the coil (3021) when viewed from the -Z direction. The thickness of the third part (330) (e.g., T3' in FIG. 8b) may be smaller than the thickness of the first part (310) (e.g., T1 in FIG. 8a) so as to overlap with the coil (3021). The thickness of the third part (330) (e.g., T3' in FIG. 8b) may be smaller than the thickness of the second part (320) (e.g., T2 in FIG. 8c) so as to overlap with the coil (3021). For example, the thickness of the third part (330) may be formed thinner than the other parts, thereby securing space for the coil (3021).

[0117] According to one embodiment, the flexible printed circuit board (301) may include at least one signal line (370). The signal line (370) may extend along the first portion (310) to the third portion (330). The signal line (370) may be disposed on at least one surface of the second layer (301b) and / or the third layer (301c). The signal line (370) may be configured to transmit a wireless signal and / or power transmitted from the outside to an internal component (e.g., the first circuit board (264a) of FIG. 4) of an electronic device (e.g., the electronic device (200) of FIG. 4).

[0118] FIG. 8a is a conceptual diagram showing a portion of cross-section A-A' in FIG. 5 according to one embodiment of the present disclosure.

[0119] The configurations described with reference to FIG. 8a may be substantially identical to the configurations described with reference to FIG. 1 through 7. The configurations described with reference to FIG. 8a may be substantially identical to the configurations according to an embodiment of the present disclosure described with reference to FIG. 8b through 11 to the extent that they do not conflict. The embodiments of FIG. 8a may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIG. 8b through 11. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 8b through 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 1 through 7.

[0120] According to one embodiment, a flexible printed circuit board (e.g., 301 in FIG. 6) may include a first portion (310). The first portion (310) may be positioned between a battery (254) and a wireless power receiver (302). The first portion (310) may include a portion of a first layer (e.g., the first layer (3011a) in FIG. 7), a second layer (e.g., the second layer (301b) in FIG. 7), and a third layer (e.g., the third layer (301c) in FIG. 7).

[0121] According to one embodiment, the first portion (310) may include a first coating layer (317). The first coating layer (317) may be in contact with the battery (254). The first coating layer (317) may be spaced apart in the -Z direction from the wireless power receiver (302). The first coating layer (317) may be spaced furthest away in the -Z direction from the wireless power receiver (302). For example, when the first portion (310) is placed between the battery (254) and the wireless power receiver (302), the first coating layer (317) may be placed on the bottom layer relative to the battery (254). The first coating layer (317) may be configured to prevent or / and reduce damage to the flexible printed circuit board (301). The first coating layer (317) may include at least one of photo solder resist (PSR) ink, a polymer, or a photosensitive material.

[0122] According to one embodiment, the first portion (310) may include a second-1 dielectric layer (313a). The second-1 dielectric layer (313a) may be spaced apart from the first coating layer (317) and positioned in the +Z direction. The second-1 dielectric layer (313a) may be stacked spaced apart from the first coating layer (317) and positioned in the +Z direction. The second-1 dielectric layer (313a) may be spaced apart from the first coating layer (317) in the +Z direction, with a second-6 signal line (3124) and a second-3 ground portion (315c) placed between it and the first coating layer (317). The second-6 signal line (3124) may be named as part of the second power line or the second-2 power line.

[0123] According to one embodiment, the first portion (310) may include a second wiring layer (312). The second wiring layer (312) may be spaced apart from the second-1 dielectric layer (313a). The second wiring layer (312) may be spaced apart in the -Z direction from the portion (311) of the second substrate layer extending from the portion (e.g., 331b in FIG. 8b) placed in the third portion (e.g., 330 in FIG. 8b). The second wiring layer (312) may be laminated spaced apart from the second-1 dielectric layer (313a) in the +Z direction. The second wiring layer (312) may be spaced apart from the second-1 dielectric layer (313a) with a first adhesive layer (3131) between them. The second wiring layer (312) may be placed on the first adhesive layer (3131). The second wiring layer (312) can be placed on the first adhesive layer (3131) that is bonded to the second-1 dielectric layer (313a).

[0124] According to one embodiment, the second wiring layer (312) may include a first-second signal line (3121). The first-second signal line (3121) may be electrically connected to the first-first signal line (e.g., 3321 in FIG. 8b) of the third part (e.g., 330 in FIG. 8b). The first-second signal line (3121) may be arranged with a first width (w1). The first-second signal line (3121) may be arranged spaced apart from the second-second signal line (3122) in the +X direction. The first-second signal line (3121) may be arranged between the second-second grounding part (315b) and the second-third grounding part (315c). The first-2 signal line (3121) may overlap with the second-2 grounding section (315b) and the second-3 grounding section (315c) when viewed from the +z direction.

[0125] According to one embodiment, the second wiring layer (312) may include a second-second signal line (3122). The second-second signal line (3122) may be spaced apart from the first-second signal line (3121) in the -X direction. The second-second signal line (3122) may be electrically connected to the second-first signal line (e.g., 3322 in FIG. 8b) of the third part (e.g., 330 in FIG. 8b). The second-second signal line (3122) may be named as part of the second-first power wiring or the second power wiring.

[0126] According to one embodiment, the first portion (310) may include a second dielectric layer (313b). The second dielectric layer (313b) may be spaced apart from the second dielectric layer (313a) and may be positioned between the second wiring layer (312) and the wireless power receiver (302). The second dielectric layer (313b) may be positioned between the second wiring layer (312) and the layer in which the second ground portion (315b) and the second signal line (or second power wiring) (3123) are positioned. The second dielectric layer (313b) may partially contact the first signal line (3121) and the second signal line (3122) of the second wiring layer (312). The second-2 dielectric layer (313b) and the second-1 dielectric layer (313a) can support the first adhesive layer (3131) and the second wiring layer (312) disposed between the second-2 dielectric layer (313b) and the second-1 dielectric layer (313a).

[0127] According to one embodiment, the first part (310) may include a second-1 grounding part (315a). The first part (310) may include a plurality of second-1 grounding parts (315a). The plurality of second-1 grounding parts (315a) may be spaced apart from each other on both sides of the first-2 signal line (3121). For example, one of the plurality of second-1 grounding parts (315a) may be placed between the second-2 signal line (3122) and the first-2 signal line (3121), and the other one may be spaced apart from the first-2 signal line (3121) in the +X direction. The plurality of second-1 grounding parts (315a) may form a second wiring layer (312) by being spaced apart from each other on both sides of the first-2 signal line (3121).

[0128] According to one embodiment, a plurality of second-1 grounding portions (315a) may be spaced apart from each other on both sides of the first-2 signal line (3121) and placed on a first adhesive layer (3131) attached to the second-1 dielectric layer (313a).

[0129] It should be noted that the term "arranged" in the present disclosure may mean stacking in the +Z direction, but is not limited thereto.

[0130] According to one embodiment, the first portion (310) may include a second-2 ground portion (315b). The second-2 ground portion (315b) may be disposed in the second-2 dielectric layer (313b) so as to partially overlap in the Z-axis direction with a plurality of spaced-apart second-1 ground portions (315a). The second-2 ground portion (315b) may be disposed spaced apart from the second-1 ground portion (315a) in the +Z direction. The second-2 ground portion (315b) may be configured with a length corresponding to a certain distance between the spaced-apart second-1 ground portions (315a). The second-2 grounding portion (315b) may be positioned between the second substrate layer (311) extending from the portion (e.g., the second substrate layer (331b) in FIG. 8b) positioned in the third portion (e.g., 330 in FIG. 8b) and the second-2 dielectric layer (313b). The second-2 grounding portion (315b) may be positioned to surround at least a portion of the first-2 signal line (3121). The second-2 grounding portion (315b) may be configured to prevent and / or reduce wireless signal interference of the first-2 signal line (3121).

[0131] According to one embodiment, the first portion (310) may include a second-third ground portion (315c). The second-third ground portion (315c) may be disposed on the first coating layer (317). The second-third ground portion (315c) may be disposed between the first coating layer (317) and the second-first dielectric layer (313a). The second-third ground portion (315c) may be disposed spaced apart in the +X direction from the second-six signal line (or second-third power line) (3124). The second-third ground portion (315c) may be disposed to overlap with a plurality of second-first ground portions (315a) and second-second ground portions (315b) in the Z-axis direction. The second-third ground portion (315c) may be disposed to surround at least a portion of the first-second signal line (3121). The second-third grounding section (315c) may be configured to prevent and / or reduce wireless signal interference of the first-second signal line (3121).

[0132] According to one embodiment, the first portion (310) may include a plurality of second-1 connection portions (316a). The plurality of second-1 connection portions (316a) may be arranged to connect between a plurality of second-1 ground portions (315a) and a second-3 ground portion (315c). Each of the plurality of second-1 connection portions (316a) may penetrate the second-1 dielectric layer (313a) to connect the plurality of second-1 ground portions (315a) and the second-3 ground portion (315c). The second-1 connection portion (316a) may be a via hole connecting the plurality of second-1 ground portions (315a) and the second-3 ground portion (315c). A plurality of 2-1 connecting portions (316a) can connect a plurality of 2-1 grounding portions (315a) and a plurality of 2-3 grounding portions (315c) with a length equal to the distance (L1) between the plurality of 2-1 grounding portions (315a) and the 2-3 grounding portions (315c).

[0133] According to one embodiment, the first part (310) may include a plurality of second-2 connecting parts (316b). The plurality of second-2 connecting parts (316b) may be arranged to connect between a plurality of second-1 grounding parts (315a) and a second-2 grounding part (315b). Each of the plurality of second-2 connecting parts (316b) may penetrate the second-2 dielectric layer (313b) to connect a plurality of second-1 grounding parts (315a) and a second-2 grounding part (315b). The plurality of second-2 connecting parts (316b) may be via holes connecting a plurality of second-1 grounding parts (315a) and a second-2 grounding part (315b). A plurality of 2-2 connecting parts (316b) can connect a plurality of 2-1 grounding parts (315a) and 2-2 grounding parts (315b) with a length equal to the distance (L2) between the plurality of 2-1 grounding parts (315a) and 2-2 grounding parts (315b).

[0134] According to one embodiment, a plurality of second-1 connection portions (316a), a plurality of second-2 connection portions (316b), a second-1 ground portion (315a), a second-2 ground portion (315b), and a second-3 ground portion (315c) may be configured to surround at least a portion of the first-2 signal line (3121) to prevent and / or reduce wireless signal interference of the first-2 signal line (3121).

[0135] According to one embodiment, the first part (310) may include a first shielding portion (314a) that is an extension of the first shielding layer (e.g., 334a in FIG. 8A) of the third part (e.g., 330 in FIG. 8B). The first part (310) may include an extension (311) of the second substrate layer (e.g., 331b in FIG. 8B) of the third part (e.g., 330 in FIG. 8B). The extension of the first shielding portion (314a) may be disposed between the wireless power receiver (302) and the extension (311) of the second substrate layer (e.g., 331b in FIG. 8B).

[0136] According to one embodiment, the first width (w1) of the first-2 signal line (3121) of the first part (310) may be smaller than the width of other signal lines (e.g., the second width (w2) of the first-1 signal line (3321) of FIG. 8b).

[0137] According to one embodiment, the first portion (310) may be a structure in which a first coating layer (317), a layer having a second-6 signal line (or second-3 power wiring) (3124) and a second-3 ground portion (315c) are arranged, a second-1 dielectric layer (313a) and a first adhesive layer (3131), a second wiring layer (312), a second-2 dielectric layer (313b), a layer having a second-5 signal line (or second-2 power wiring) (3123) and a second-2 ground portion (315b) are arranged, an extended portion (311) of a second substrate layer (e.g., 331b in FIG. 8b), and a first shielding portion (314a) are stacked in order. However, it is not limited thereto.

[0138] According to one embodiment, the first part (310) may have greater hardness than the third part (e.g., 330 in FIG. 8b). For example, the first part (310) may be configured to be more rigid than the third part (e.g., 330 in FIG. 8b) in order to be connected to the first circuit board (e.g., 264a in FIG. 4). The first part (310) may have a relatively greater thickness (e.g., length in the Z direction) than the third part (e.g., 330 in FIG. 8b).

[0139] FIG. 8b is a conceptual diagram showing a portion of cross-section B-B' in FIG. 5 according to one embodiment of the present disclosure.

[0140] The configurations described with reference to FIG. 8b may be substantially identical to the configurations described with reference to FIG. 1 through 8a. The configurations described with reference to FIG. 8b may be substantially identical to the configurations according to an embodiment of the present disclosure described with reference to FIG. 8c through 11 to the extent that they do not conflict. The embodiments of FIG. 8b may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIG. 8c through 11. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 8c through 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 1 through 8a.

[0141] According to one embodiment, a flexible printed circuit board (e.g., 301 in FIG. 6) may include a third part (330). The third part (330) may be positioned between a battery (254) and a wireless power receiver (302). The third part (330) may be positioned between the battery (254) and a coil (3021) of the wireless power receiver (302). The third part (330) may include a second layer (e.g., the second layer (301b) in FIG. 7) and a third layer (e.g., the third layer (301c) in FIG. 7). For example, the third part (330) may have a plurality of stacked structures in which the first layer (e.g., 3011a to 3014a in FIG. 7) is removed.

[0142] According to one embodiment, the third portion (330) may include a first substrate layer (331a). The first substrate layer (331a) may be spaced apart from the battery (254) in the +Z direction. The first substrate layer (331a) may be spaced apart from the battery (254) in the +Z direction with the second shielding layer (334b) in between. The first substrate layer (331a) may include a conductive material or a non-conductive material.

[0143] According to one embodiment, the third portion (330) may include a first wiring layer (332). The first wiring layer (332) may be disposed on the first substrate layer (331a). The first wiring layer (332) may be disposed spaced apart in the -Z direction from the first shielding layer (334a). The first wiring layer (332) may be disposed between the first dielectric layer (333) and the first substrate layer (331a). The first wiring layer (332) may include a first-1 signal line (3321) and a second-1 signal line (3322) spaced apart from each other. For example, a void space may be formed between the first-1 signal line (3321) and the second-1 signal line (3322) spaced apart from each other in the first wiring layer (332).

[0144] According to one embodiment, the first wiring layer (332) may include a first-1 signal line (3321). The first-1 signal line (3321) may be disposed in a region of the first substrate layer (331a). The first-1 signal line (3321) may be disposed between a plurality of first-1 ground portions (335a) spaced apart from each other. The first-1 signal line (3321) may be disposed spaced apart from the second-1 signal line (3322) in the +X direction. The first-1 signal line (3321) may be configured to be electrically connected to the first-2 signal line (e.g., 3121 in FIG. 8a) and the first-3 signal line (e.g., 3221 in FIG. 8c). The first-1 signal line (3321) may be configured to have a second width (w2).

[0145] According to one embodiment, the first wiring layer (332) may include a second-1 signal line (3322). The second-1 signal line (3322) may be placed in an area different from the area where the first-1 signal line (3321) of the first substrate layer (331a) is placed. The second-1 signal line (3322) may be placed spaced apart from the first-1 signal line (3321) in the -X direction. The second-1 signal line (3322) may be configured to be electrically connected to the second-2 signal line (e.g., 3122 in FIG. 8a) and the second-3 signal line (e.g., 3222 in FIG. 8c). The second-1 signal line (3322) may be named as part of the first power wiring or the first-1 power wiring.

[0146] According to one embodiment, the third portion (330) may include a first dielectric layer (333) disposed on the first wiring layer (332). The first dielectric layer (333) may partially contact the first-1 signal line (3321) and the second-1 signal line (3322) which are spaced apart from each other. The first dielectric layer (333) may support the first-1 signal line (3321) and the second-1 signal line (3322) of the first wiring layer (332).

[0147] According to one embodiment, the third part (330) may include a first shielding layer (334a). The first shielding layer (334a) may be placed between the wireless power receiver (302) and the first dielectric layer (333). The first shielding layer (334a) may be placed between the coil (3021) and the second shielding layer (334b). The first shielding layer (334a) may be spaced apart from the first-1 signal line (3321) by a certain distance (L3). The first shielding layer (334a) may be connected through the first-2 grounding part (335b) and the second connection part (336b). For example, the first shielding layer (334a) may be connected through the first-2 grounding part (335b) and the second connection part (336b) to serve as a substitute for the grounding layer. The first shielding layer (334a) may be positioned to surround at least a portion of the first-1 signal line (3321).

[0148] According to one embodiment, the third portion (330) may include a second shielding layer (334b). The second shielding layer (334b) may be positioned between the battery (254) and the first shielding layer (334a). The second shielding layer (334b) may be positioned between the battery (254) and the first substrate layer (334a) at a location corresponding to the second-1 signal line (3322). For example, the second shielding layer (334b) may be positioned between the battery (254) and the first substrate layer (331a) by extending a length corresponding to the location where the second-1 signal line (3322) is positioned. The second shielding layer (334b) may be positioned so as not to overlap with the first-1 signal line (3321). For example, to reduce and / or prevent interference of wireless signals by the second shielding layer (334b), the first signal line (3321) between the first substrate layer (331a) and the battery (254) may not overlap.

[0149] According to one embodiment, the first shielding layer (334a) may have greater electrical conductivity than the second shielding layer (334b). For example, the first shielding layer (334a) may have high electrical conductivity to prevent or / and reduce electromagnetic interference by the coil (3021) in contact with the coil (3021).

[0150] According to one embodiment, the third portion (330) may include a second substrate layer (331b). The second substrate layer (331b) may be disposed between the first dielectric layer (333) and the first shielding layer (334a). The second substrate layer (331b) may be disposed spaced apart from the first dielectric layer (333) with the second-fourth signal line (or first-second power line) (3323) and the first-second ground portion (315b) in between. The thickness (Tb) of the second substrate layer (331b) may be greater than the thickness (Ta) of the first substrate layer (331a). For example, the thickness (Tb) of the second substrate layer (331b) may be greater than the thickness (Ta) of the first substrate layer (331a) such that the distance between the first-1 signal line (3321) and the first shielding layer (334a) is greater than the distance between the first-1 signal line (3321) and the battery (254). For example, the thickness (Tb) of the second substrate layer (331b) may be configured to be large, thereby preventing and / or reducing signal interference of the first-1 signal line (3321) by the coil (3021).

[0151] According to one embodiment, the third part (330) may include a plurality of first-1 grounding portions (335a). The third part (330) may include a plurality of first-1 grounding portions (335a) spaced apart from each other on both sides of the first-1 signal line (3321). The plurality of first-1 grounding portions (335a) may be spaced apart from each other with the first-1 signal line (3321) in between and may be placed on the first substrate layer (331a). The plurality of first-1 grounding portions (335a) may be spaced apart from each other with the first-1 signal line (3321) in between and may be placed on the first wiring layer (332) or constitute the first wiring layer (332).

[0152] According to one embodiment, the third portion (330) may include a plurality of first-second grounding portions (335b). The plurality of first-second grounding portions (335b) may be disposed between the first dielectric layer (333) and the second substrate layer (331b). The plurality of first-second grounding portions (335b) may be disposed between the first dielectric layer (333) and the second substrate layer (331b) and may be spaced apart from a position corresponding to the plurality of first-first grounding portions (335a). The plurality of first-second grounding portions (335b) may be spaced apart in the +X direction from the second-fourth signal line (or first-second power line) (3323).

[0153] According to one embodiment, the third part (330) may include a plurality of first-1 connecting parts (336a). The plurality of first-1 connecting parts (336a) may be arranged to connect between a plurality of first-1 grounding parts (335a) and a plurality of first-2 grounding parts (335b). The plurality of first-1 connecting parts (336a) may penetrate the first dielectric layer (333) to connect the plurality of first-1 grounding parts (335a) and the plurality of first-2 grounding parts (335b). The plurality of first-1 connecting parts (336a) may be via holes connecting the plurality of first-1 grounding parts (335a) and the plurality of first-2 grounding parts (335b).

[0154] According to one embodiment, the third part (330) may include a plurality of first-second connecting parts (336b). The plurality of first-second connecting parts (336b) may connect between a plurality of first-second grounding parts (335b) and a first shielding layer (334a). The plurality of first-second connecting parts (336b) may penetrate the second substrate layer (331b) to connect a plurality of first-second grounding parts (335b) and a first shielding layer (334a). The plurality of first-second connecting parts (336b) may be via holes connecting a plurality of first-second grounding parts (335b) and a first shielding layer (334a). For example, the plurality of first-second connecting parts (336b) may be directly connected to the first shielding layer (334a) so that the first shielding layer (334a) serves as a grounding layer.

[0155] According to one embodiment, the first shielding layer (334a), a plurality of first-1 connecting portions (336a) and a plurality of first-2 connecting portions (336b) may be configured to surround at least a portion of the first-1 signal line (3321) to prevent and / or reduce wireless signal interference. The first-1 connecting portions (336a) and the first-2 connecting portions (336b) may form a portion of the first conductive portion (e.g., 303a in FIG. 9). The first conductive portion (e.g., 303a in FIG. 9) may be configured to surround at least a portion of the first-1 signal line (3321) together with the first shielding layer (334a) to shield wireless signal interference.

[0156] According to one embodiment, the third part (330) may include a second-fourth signal line (3323). The second-fourth signal line (3323) may be spaced apart in the +Z direction at a position corresponding to the second-first signal line (3322) and positioned between the first dielectric layer (333) and the second substrate layer (331b). The second-fourth signal line (3323) may be named the first-second power line, a part of the first power line, or the third-first signal line.

[0157] According to one embodiment, the second-1 signal line (3322) and the third-1 signal line (or second-4 signal line) (3323) may be configured to transmit power (or signal) transmitted from outside the electronic device (e.g., 200 in FIG. 4) to a first circuit board (e.g., 264a in FIG. 4) inside a housing (e.g., 220 in FIG. 5) through a first end (e.g., 3041 in FIG. 6).

[0158] According to one embodiment, the first signal line (3321) may be configured to transmit a wireless signal transmitted from outside an electronic device (e.g., 200 in FIG. 4) to a first circuit board (e.g., 264a in FIG. 4) inside a housing (e.g., 220 in FIG. 5) through a first end (e.g., 3041 in FIG. 6).

[0159] According to one embodiment, the thickness (T3') of the third part (330) may be smaller than the thickness of the first part (310) (e.g., T1 in FIG. 8a) and the thickness of the second part (320) (e.g., T2 in FIG. 8c). For example, the thickness (T3') of the third part (330) may be configured to be smaller than the thickness of the first part (310) (e.g., T1 in FIG. 8a) and the thickness of the second part (320) (e.g., T2 in FIG. 8c) to secure space for the coil (3021) to be placed by the difference in thickness. For example, a portion of the third part (330) is removed, and the thickness (T3') of the third part is configured to be smaller than the thickness of the first part (310) (e.g., T1 in FIG. 8a) and the thickness of the second part (320) (e.g., T2 in FIG. 8c) to secure a space for the coil (3021) to be accommodated, thereby allowing a flexible printed circuit board (e.g., 301 in FIG. 5) to be placed across the battery (254) and the wireless power receiver (302).

[0160] According to one embodiment, the sum of the thicknesses (T3) of the third part (330) and the coil (3021) may correspond to the thickness of the first part (310) (e.g., T1 in FIG. 8a) and the thickness of the second part (320) (e.g., T2 in FIG. 8c). For example, if the thickness (T3') of the third part (330) is smaller than the thickness of the first part (310) (e.g., T1 in FIG. 8a) and the thickness of the second part (320) (e.g., T2 in FIG. 8c), the sum of the thicknesses (T3) of the third part (330) and the coil (3021) may correspond to the thickness of the first part (310) (e.g., T1 in FIG. 8a) and the thickness of the second part (320) (e.g., T2 in FIG. 8c), and the thickness of the flexible printed circuit board (e.g., 301 in FIG. 5) may be constant.

[0161] According to one embodiment, the width (w2) of the first-1 signal line (3321) may be smaller than the width of the first-3 signal line (3221) (e.g., w3 in FIG. 8c) and larger than the width of the first-2 signal line (3121) (e.g., w1 in FIG. 8a). The distance (L3) between the first-1 signal line (3321) and the first shielding layer (334a) may be smaller than the distance (e.g., L4 in FIG. 8c) between the first-3 signal line (e.g., 3321 in FIG. 8c) and the third-3 grounding portion (e.g., 325c in FIG. 8c). For example, the impedance defined by the width (w2) of the first-1 signal line (3321) and the distance (L3) between the first-1 signal line (3321) and the first shielding layer (334a) can be configured such that the width of the first-3 signal line (e.g., w3 in FIG. 8c) is larger than the distance (L3) between the first-1 signal line (3321) and the first shielding layer (334a), according to the distance (L4) between the first-3 signal line (e.g., 3321 in FIG. 8c) and the third-3 grounding part (e.g., 325c in FIG. 8c), so that the same impedance is achieved.

[0162] According to one embodiment, the third part (330) may have a structure in which a second shielding layer (334b) having a length corresponding to the second-1 signal line (3322), a first substrate layer (331a), a first wiring layer (332), a first dielectric layer (333), a layer in which the second-4 signal line (3323) and the second-2 grounding part (335b) are arranged, and the second substrate layer (331b) and the first shielding layer (334a) are stacked in order in the +Z direction. However, it is not limited thereto.

[0163] FIG. 8c is a conceptual diagram showing a portion of cross-section C-C' in FIG. 5 according to one embodiment of the present disclosure.

[0164] The configurations described with reference to FIG. 8c may be substantially identical to the configurations described with reference to FIG. 1 through 8b. The configurations described with reference to FIG. 8c may be substantially identical to the configurations according to an embodiment of the present disclosure described with reference to FIG. 9 through 11 to the extent that they do not conflict. The embodiments of FIG. 8c may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIG. 9 through 11. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 9 through 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 1 through 8b.

[0165] According to one embodiment, a flexible printed circuit board (e.g., 301 in FIG. 6) may include a second part (320). The second part (320) may be positioned between a battery (254) and a wireless power receiver (302). The second part (320) may include a portion of a first layer (e.g., the first layer (3012a) in FIG. 7), a second layer (e.g., the second layer (301b) in FIG. 7), and a third layer (e.g., the third layer (301c) in FIG. 7).

[0166] According to one embodiment, the second portion (320) may include a second coating layer (327). The second coating layer (327) may be in contact with the battery (254). The second coating layer (327) may be spaced apart from the first coating layer (e.g., 317 in FIG. 8A). The second coating layer (327) described with reference to FIG. 8C may utilize the first coating layer (e.g., 317 in FIG. 8A) within a range that does not collide.

[0167] According to one embodiment, the second portion (320) may include a third wiring layer (322). The third wiring layer (322) may be disposed on the second coating layer (327). The third wiring layer (322) may be disposed spaced apart from the battery (254) in the +Z direction with the second coating layer (327) in between. The third wiring layer (322) may be disposed on the coating layer (327) in contact with the battery (254). The third wiring layer (322) may be disposed between the third-1 dielectric layer (323a) and the second coating layer (327). The third wiring layer (322) may be laminated on the second coating layer (327) in the +Z direction.

[0168] According to one embodiment, the third wiring layer (322) may include a first-third signal line (3221). The first-third signal line (3221) may be placed in a region of the second coating layer (327). The first-third signal line (3221) may be electrically connected to the first-first signal line (e.g., 3321 in FIG. 8b) of the third part (e.g., 330 in FIG. 8b). The first-third signal line (3221) may be placed with a third width (W3). The first-third signal line (3221) may be placed spaced apart from the second-third signal line (3222) in the +X direction. The first-third signal line (3221) may overlap with the third-third ground portion (315c) when viewed from the +z direction.

[0169] According to one embodiment, the third wiring layer (322) may include a second-third signal line (3222). The second-third signal line (3222) may be electrically connected to the second-first signal line (e.g., 3322 in FIG. 8b) of the third part (e.g., 330 in FIG. 8b). The second-third signal line (3222) may be placed in a different area from the area where the first-third signal line (3321) of the second coating layer (327) is placed. The second-third signal line (3222) may be placed spaced apart in the X-direction from the first-third signal line (3221). The second-third signal line (3222) may be placed in the coating layer (327) spaced apart in the X-direction from the first-third signal line (3221).

[0170] According to one embodiment, the second portion (320) may include a third-1 dielectric layer (323a). The third-1 dielectric layer (323a) may be disposed on the third wiring layer (322). The third-1 dielectric layer (323a) may be laminated in the +Z direction between the third wiring layer (322) and the third-2 dielectric layer (323b). The third-1 dielectric layer (323a) may partially contact the second-3 signal line (3222) and the first-3 signal line (3221). The third-1 dielectric layer (323a) may support the second-3 signal line (3222) and the first-3 signal line (3221) of the third wiring layer (322) together with the second coating layer (327).

[0171] According to one embodiment, the second portion (320) may include a second adhesive layer (3231). The second adhesive layer (3231) may be placed on the third-1 dielectric layer (323a). The second adhesive layer (3231) may be adhered to the third-1 dielectric layer (323a) between the third-1 dielectric layer (323a) and the layer on which the second-7 signal line (3223) and the third-2 ground portion (325b) are placed. The second adhesive layer (3231) may be adhered to the third-1 dielectric layer (323a) to support the second-7 signal line (3223) and the third-2 ground portion (325b).

[0172] According to one embodiment, the second portion (320) may include a third-2 dielectric layer (323b). The third-2 dielectric layer (323b) may be spaced apart in a direction (+Z direction) away from the third-1 dielectric layer (323a) and the third wiring layer (322). The third-2 dielectric layer (323b) may be placed between the layer on which the second-7 signal line (3223) and the third-2 ground portion (325b) are placed and the layer on which the second-8 signal line (3224) and the third-3 ground portion (325c) are placed. The third-2 dielectric layer (323b) may support the second-7 signal line (3223) and the third-2 ground portion (325b) together with the second adhesive layer (3231). For example, the third-2 dielectric layer (323b) can be supported by partially contacting the second-7 signal line (3223) and the third-2 ground portion (325b) together with the second adhesive layer (3231). The third-2 dielectric layer (323b) can be fixed and supported by the second-8 signal line (3224) and the third-3 ground portion (325c) in between, together with a portion (321) of the extended substrate layer. For example, the third-2 dielectric layer (323b) can be supported by partially contacting the second-8 signal line (3224) and the third-3 ground portion (325c) together with a portion (321) of the extended substrate layer.

[0173] According to one embodiment, the second portion (320) may include a plurality of third-1 ground portions (325a). A plurality of third-1 ground portions (325a) may be disposed in the third wiring layer (322). A plurality of third-1 ground portions (325a) may be disposed between the coating layer (327) and the third-1 dielectric layer (323a). A plurality of third-1 ground portions (325a) may be spaced apart from each other on both sides of the first-3 signal line (3221). A plurality of third-1 ground portions (325a) may be disposed in the coating layer (327) spaced apart from each other with the first-3 signal line (3221) in between. A plurality of third-1 ground portions (325a) may be disposed to surround at least a portion of the first-3 signal line (3221).

[0174] According to one embodiment, the second portion (320) may include a plurality of third-2 ground portions (325b). A plurality of third-2 ground portions (325b) may be disposed on the second adhesive layer (3231). A plurality of third-2 ground portions (325b) may be disposed on the second adhesive layer (3231) spaced apart from each other. A plurality of third-2 ground portions (325b) may be disposed on the second adhesive layer (3231) bonded to the third-1 dielectric layer (323a) spaced apart from each other at positions corresponding to the spaced-apart third-1 ground portions (325a). A plurality of third-2 ground portions (325b) may be disposed spaced apart in the +X direction from the second-7 signal line (3223).

[0175] According to one embodiment, the second part (320) may include a third-third grounding part (325c). The third-third grounding part (325c) may be placed in the third-second dielectric layer (323b). The third-third grounding part (325c) may be placed between the third-second dielectric layer (323b) and another part (321) extending from the second substrate layer (e.g., 331b in FIG. 8a) placed in the third part (e.g., 330 in FIG. 8b). The third-third grounding part (325c) may be placed at a certain distance (L4) from the first-third signal line (3221). The third-third grounding part (325c) may be placed so as to overlap with a plurality of third-first grounding parts (325a) and a plurality of third-second grounding parts (325b) that are spaced apart from each other when viewed from the +Z direction. The third-3 grounding section (325c) may be spaced apart from the second-8 signal line (3224) in the +X direction. The third-3 grounding section (325c) may be positioned to surround at least a portion of the first-3 signal line (3221).

[0176] According to one embodiment, the second part (320) may include a second conductive part (e.g., 303b in FIG. 9). The second conductive part (e.g., 303b in FIG. 9) may be arranged to surround at least a portion of the first-third signal line (3221). The second conductive part (e.g., 303b in FIG. 9) may be configured to surround at least a portion of the first-third signal line (3221) together with a plurality of third-first grounding parts (325a), a plurality of third-second grounding parts (325b) and a third-third grounding part (325c) to prevent and / or reduce wireless signal interference of the first-third signal line (3221).

[0177] According to one embodiment, the second conductive part (e.g., 303b in FIG. 9) may include a plurality of third-1 connecting parts (326a). The plurality of third-1 connecting parts (326a) may penetrate the third-1 dielectric layer (323a) to connect a plurality of third-1 grounding parts (325a) and a plurality of third-2 grounding parts (325b). The plurality of third-1 connecting parts (326a) may penetrate the third-1 dielectric layer (323a) and the second adhesive layer (3231) to connect a plurality of third-1 grounding parts (325a) and a plurality of third-2 grounding parts (325b). The second conductive part (e.g., 303b in FIG. 9) may include a plurality of third-2 connecting parts (326b). Multiple third-2 connecting portions (326b) can penetrate the third-2 dielectric layer (323b) to connect multiple third-2 grounding portions (325b) and third-3 grounding portions (325c).

[0178] According to one embodiment, the second conductive part (e.g., 303b in FIG. 9) may be spaced apart from the first conductive part (e.g., 303a in FIG. 9) by a certain distance.

[0179] According to one embodiment, the second portion (320) may be a structure in which a second coating layer (327), a third wiring layer (322), a third-1 dielectric layer (323a) and a second adhesive layer (3231), a layer in which a second-7 signal line (3223) and a third-2 ground portion (325b) are arranged, a third-2 dielectric layer (323b), a layer in which a second-8 signal line (3224) and a third-3 ground portion (325c) are arranged, and an extended other portion (321) of the second substrate layer (e.g., 331b in FIG. 8b) are stacked in order in the +Z direction. However, it should be noted that it is not limited thereto.

[0180] According to one embodiment, the second part (320) may have greater hardness than the third part (e.g., 330 in FIG. 8b). For example, the second part (320) may be configured to be more rigid than the third part (e.g., 330 in FIG. 8b) in order to be connected to the first circuit board (e.g., 264a in FIG. 4). The second part (320) may have a relatively greater thickness than the third part (e.g., 330 in FIG. 8b).

[0181] Another part (321) extending from the second substrate layer (e.g., 331b in FIG. 8a) placed in the third part (e.g., 330 in FIG. 8b) described with reference to FIG. 8c may be used to the extent that it does not conflict with the part (e.g., 311 in FIG. 8a) extending from the second substrate layer (e.g., 331b in FIG. 8a) placed in the third part (e.g., 330 in FIG. 8b) described with reference to FIG. 8a. For example, another part (321) extending from the second substrate layer (e.g., 331b in FIG. 8a) disposed in the third part (e.g., 330 in FIG. 8b) can be formed integrally with the second substrate layer (e.g., 311 in FIG. 8a) extending from the second substrate layer (e.g., 331b in FIG. 8a) disposed in the third part (e.g., 330 in FIG. 8b) described with reference to FIG. 8a.

[0182] The second-third signal line (3222), described with reference to FIG. 8c, may be named as part of the third power wiring or as the third-first power wiring. The second-seventh signal line (3223) may be named as part of the third power wiring or as the third-second power wiring. The second-eighth signal line (3224) may be named as part of the third power wiring or as the third-third power wiring.

[0183] The shielding layer (324a) of FIG. 8c may be identical to the extended portion of the first shielding layer (e.g., 334a of FIG. 8b) of the third portion (e.g., 320 of FIG. 8b). The shielding layer (324a) of the second portion, which is an extended portion of the first shielding layer (e.g., 334a of FIG. 8b), may be placed on a portion (321) of the extended substrate layer. Hereinafter, the shielding layer (324a) of FIG. 8c may be used within a range that does not collide with the first shielding layer (e.g., 334a of FIG. 8b).

[0184] The signal lines described with reference to FIGS. 8a to 8c (e.g., the first-1 signal line (3321)) can be combined within a range where they do not collide with each other.

[0185] FIG. 9 is a drawing showing a part of a flexible printed circuit board according to one embodiment of the present disclosure.

[0186] The configurations described with reference to FIG. 9 may be substantially identical to the configurations described with reference to FIG. 1 through 8c. The configurations described with reference to FIG. 9 may be substantially identical to the configurations according to an embodiment of the present disclosure described with reference to FIG. 10 and FIG. 11 to the extent that they do not conflict. The embodiments of FIG. 9 may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIG. 10 and FIG. 11. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 10 and FIG. 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to an embodiment of the present disclosure of FIG. 1 through 8c.

[0187] According to one embodiment, the flexible printed circuit board (301) may include a first conductive portion (303a). The flexible printed circuit board (301) may include a plurality of first conductive portions (303a). The first conductive portion (303a) may be disposed in a first portion (330). The first conductive portion (303a) may be disposed to surround at least a portion of a first-1 signal line (e.g., 3321 in FIG. 8a). The first conductive portion (303a) may include a plurality of first-1 connection portions (e.g., 336a in FIG. 8a) and a plurality of first-2 connection portions (e.g., 336b in FIG. 8a). The first conductive portion (303a) may be spaced apart by a first distance (D1) along the +Y direction or the direction of the first portion (e.g., 310 in FIG. 6) from the second portion (320). The first conductive part (303a) may be spaced apart from each other by a first distance (D1) along the first-1 signal line (e.g., 3321 in FIG. 8a) so as to shield the first-1 signal line (e.g., 3321 in FIG. 8a). The first distance (D1) may be half of a first wavelength defined by the frequency of the signal transmitted from the first-1 signal line (e.g., 3321 in FIG. 8a). For example, in the case where the first-1 signal line (e.g., 3321 in FIG. 8a) is a wireless signal line (e.g., radio frequency wiring) transmitting a signal at a frequency of 3.5 GHz (Hertz), it may be about 8.57 cm. Note, however, that it is not limited thereto.

[0188] According to one embodiment, the flexible printed circuit board (301) may include a second conductive portion (303b). The flexible printed circuit board (301) may include a plurality of second conductive portions (303b). The second conductive portion (303b) may be disposed in a second portion (320). The second conductive portion (303b) may be disposed along the first-third signal line (e.g., 3221 in FIG. 8c). The second conductive portion (303b) may be disposed to surround at least a portion of the first-third signal line (e.g., 3221 in FIG. 8c). The second conductive portion (303b) may be disposed spaced apart from the first conductive portion (303a) by a first distance (D1). The second conductive portion (303b) may be disposed spaced apart from each other by a first distance (D1).

[0189] According to one embodiment, a first conductive part (303a) and / or a second conductive part (303b) spaced apart by half of a first wavelength may prevent and / or reduce signal attenuation of a signal line (e.g., the first-1 signal line (3321) of FIG. 8a). Or, may prevent and / or reduce parasitic resonance.

[0190] FIG. 10 is a conceptual diagram showing a flexible printed circuit board according to one embodiment of the present disclosure.

[0191] The configurations described with reference to FIG. 10 may be substantially identical to the configurations described with reference to FIG. 1 through 9. The configurations described with reference to FIG. 10 may be substantially identical to the configurations according to one embodiment of the present disclosure described with reference to FIG. 11 to the extent that they do not conflict. The embodiments of FIG. 10 may be combined to the extent that they do not conflict with the embodiments of the present disclosure of FIG. 11. Configurations not described below may be substantially identical to the configurations according to one embodiment of the present disclosure of FIG. 11 to the extent that they do not conflict. Configurations not described below may be substantially identical to the configurations according to one embodiment of the present disclosure of FIG. 1 through 9.

[0192] According to one embodiment, the flexible printed circuit board (301) may include a first part (310), a second part (320), and a third part (330). The first part (310) to the third part (330) may utilize the first part (310) to the third part (330) of FIGS. 5 to 9 within a range that does not conflict.

[0193] According to one embodiment, the flexible printed circuit board (301) may include a fourth portion (340a, 340b). The flexible printed circuit board (301) may include a fourth-1 portion (340a) and a fourth-2 portion (340b). The fourth-1 portion (340a) and the fourth-2 portion (340b) may each have a structure in which a second layer (301b) and a third layer (301c) are stacked. The second-1 end (381) and the second-2 end (382) may have a structure in which another part of the first layer (e.g., 3013a, 3014a of FIG. 7) and the second layer (e.g., 301b of FIG. 7) and the third layer (e.g., 301c of FIG. 7) are stacked. Part 4-1 (340a) and Part 4-2 (340b) may be formed with the same stacked structure as Part 3 (e.g., 330 in FIG. 8b). However, it should be noted that this is not limited thereto. For example, Part 4-1 (340a) and Part 4-2 (340b) may be a stacked structure of Part 2 (e.g., 301b in FIG. 7) and Part 3 (e.g., 301c in FIG. 7). Part 4-1 (340a) and Part 4-2 (340b), which are not described below, may be adapted from Part 4-1 (340a) and Part 4-2 (340b) described with reference to FIG. 6 and FIG. 7 to the extent that they do not conflict.

[0194] According to one embodiment, the flexible printed circuit board (301) may include a second-1 end (381) connected to a fourth-1 part (340a) and a second-2 end (382) connected to a fourth-2 part (340b).

[0195] According to one embodiment, power transmitted through the second-1 end (381) can be transmitted to the first part (310) along the power signal lines (e.g., the second-1 signal line (3322)) of the fourth-1 part (340a), the second part (320), and the third part (330), and can be configured to be transmitted to a component (e.g., the second battery (254) of FIG. 4) inside an electronic device (e.g., 200 of FIG. 5) through the first end (3041).

[0196] According to one embodiment, the signal transmitted through the second-2 end (382) can be transmitted to the first part (310) along the wireless signal lines (e.g., the first-1 signal line (3321)) of the fourth-2 part (340b), the second part (320), and the third part (330), and can be configured to be transmitted to a component (e.g., the first circuit board (264a) of FIG. 4) inside an electronic device (e.g., 200 of FIG. 5) through the first end (3041).

[0197] FIG. 11 is a conceptual diagram showing a part of cross-section B-B' in FIG. 5 according to one embodiment of the present disclosure.

[0198] The configurations described with reference to FIG. 11 may be substantially identical to the configurations described with reference to FIG. 1 to 10. Configurations not described below may be substantially identical to the configurations according to one embodiment of the present disclosure of FIG. 1 to 10.

[0199] In the cross-section B-B' according to one embodiment described with reference to FIG. 11, a non-conductive object (234) other than a battery (e.g., 254 in FIG. 8b) may be placed.

[0200] According to one embodiment, a flexible printed circuit board (e.g., 301 in FIG. 6) may include a third part (430). The third part (430) may be placed between a non-conductive object (234) and a wireless power receiver (402). The third part (430) may include a second layer (e.g., the second layer (301b) in FIG. 7) and a third layer (e.g., the third layer (301c) in FIG. 7). For example, the third part (330) may have a plurality of stacked structures in which the first layer (e.g., 3011a–3014a in FIG. 7) is removed.

[0201] According to one embodiment, the third portion (430) may include a first substrate layer (431a). The first substrate layer (431a) may be placed on a non-conductive object (234). For example, the first substrate layer (431a) and the non-conductive object (234) may be in contact. The first substrate layer (431a) may include a conductive material or a non-conductive material.

[0202] The third part (430) described with reference to FIG. 11 may utilize the third part described with reference to FIG. 8b (e.g., 330 of FIG. 8b) to the extent that it does not conflict.

[0203] It may include a first wiring layer (432). The first wiring layer (432) may include a first-1 signal line (4321). The first wiring layer (432) may include a second-1 signal line (4322). The first wiring layer (432), the first-1 signal line (4321), and the second-1 signal line (4322) described with reference to FIG. 11 may be used to the extent that they do not conflict with the first wiring layer (e.g., 332 in FIG. 8b), the first-1 signal line (e.g., 3321 in FIG. 8b), and the second-1 signal line (e.g., 3322 in FIG. 8b) described with reference to FIG. 8b.

[0204] According to one embodiment, the third part (430) may include a first dielectric layer (433). The first dielectric layer (433) described with reference to FIG. 11 may be adapted from the first dielectric layer described with reference to FIG. 8b (e.g., 333 of FIG. 8b) to the extent that it does not conflict.

[0205] According to one embodiment, the third part (430) may include a first shielding layer (434a). The first shielding layer (434a) described with reference to FIG. 11 may be adapted from the first shielding layer (e.g., 334a of FIG. 8b) described with reference to FIG. 8b to the extent that it does not collide.

[0206] According to one embodiment, the third portion (430) may include a second substrate layer (431b). The second substrate layer (431b) described with reference to FIG. 11 may be adapted from the second substrate layer described with reference to FIG. 8b (e.g., 331b of FIG. 8b) to the extent that it does not conflict.

[0207] According to one embodiment, the third part (430) may include a plurality of first-1 grounding parts (435a). The plurality of first-1 grounding parts (435a) described with reference to FIG. 11 may be used within a range that does not conflict with the plurality of first-1 grounding parts (e.g., 335a of FIG. 8b) described with reference to FIG. 8b.

[0208] According to one embodiment, the third part (430) may include a plurality of first-second grounding parts (435b). The plurality of first-second grounding parts (435b) described with reference to FIG. 11 may be used within a range that does not conflict with the plurality of first-second grounding parts (e.g., 335b of FIG. 8b) described with reference to FIG. 8b.

[0209] According to one embodiment, the third part (330) may include a plurality of first-1 connecting parts (436a). The plurality of first-1 connecting parts (436a) described with reference to FIG. 11 may be used with reference to the plurality of first-1 connecting parts (e.g., 336a of FIG. 8b) described with reference to FIG. 8b, to the extent that they do not collide.

[0210] According to one embodiment, the third part (430) may include a plurality of first-second connecting parts (436b). The plurality of first-second connecting parts (436b) described with reference to FIG. 11 may be used with reference to the plurality of first-second connecting parts (e.g., 336b of FIG. 8b) described with reference to FIG. 8b, to the extent that they do not collide.

[0211] According to one embodiment, the third part (430) may include a second-fourth signal line (4323). The second-fourth signal line (4323) described with reference to FIG. 11 may be adapted from the second-fourth signal line (e.g., 3323 of FIG. 8b) described with reference to FIG. 8b to the extent that it does not conflict.

[0212] In a flexible printed circuit board according to one embodiment of the present disclosure (e.g., 301 in FIG. 5), a first shielding layer (e.g., 334a in FIG. 8b) may perform the role of ground in a part.

[0213] A flexible printed circuit board (e.g., 301 in FIG. 5) according to one embodiment of the present disclosure may be positioned across a battery (e.g., 254 in FIG. 4) and a wireless power receiver (e.g., 302 in FIG. 5).

[0214] A flexible printed circuit board (e.g., 301 in FIG. 5) according to one embodiment of the present disclosure can reduce signal loss as the path of the flexible printed circuit board (e.g., 301 in FIG. 5) increases across the interior of a housing (e.g., 220 in FIG. 4).

[0215] A flexible printed circuit board (e.g., 301 of FIG. 5) according to one embodiment of the present disclosure can prevent and / or reduce signal loss.

[0216] A flexible printed circuit board (e.g., 301 in FIG. 5) according to one embodiment of the present disclosure can reduce its thickness to secure mounting space for a battery (e.g., 254 in FIG. 4) and / or a wireless power receiver (e.g., 302 in FIG. 5).

[0217] A flexible printed circuit board (e.g., 301 of FIG. 5) according to one embodiment of the present disclosure can simultaneously place power lines (e.g., the second-1 signal line (3322) of FIG. 8b) or wireless signal lines (e.g., the first-1 signal line (3321) of FIG. 8b).

[0218] A flexible printed circuit board (e.g., 301 in FIG. 5) according to one embodiment of the present disclosure can be designed by separating a stacked structure and a plurality of signal lines (e.g., the first-1 signal line (3321) in FIG. 8b).

[0219] A flexible printed circuit board (e.g., 301 of FIG. 5) according to one embodiment of the present disclosure can prevent signal loss and reduce thickness when in contact with a non-conductive object.

[0220] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0221] An electronic device (e.g., 200 of FIG. 4) according to one embodiment of the present disclosure may include a housing (e.g., 220 of FIG. 4).

[0222] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIG. 4) may include a battery (e.g., 254 of FIG. 4) disposed within the housing.

[0223] An electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a coil (e.g., 3021 in FIG. 5) and a wireless power receiver (e.g., 302 in FIG. 5) disposed within the housing.

[0224] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIG. 4) may include a first circuit board (e.g., 264a of FIG. 4).

[0225] An electronic device according to one embodiment of the present disclosure (e.g., 200 of FIG. 4) may include a second circuit board (e.g., 264b of FIG. 4).

[0226] An electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a flexible printed circuit board (e.g., 301 in FIG. 6) disposed between the wireless power receiver and the battery, comprising a first part (e.g., 310 in FIG. 6) including a first end (e.g., 3041 in FIG. 6) connected to a first circuit board, a second part (e.g., 320 in FIG. 6) including a second end (e.g., 3032 in FIG. 6) connected to a second circuit board, and a third part (e.g., 330 in FIG. 6) connecting the first part and the second part, wherein, when viewed from above, the coil of the wireless power receiver overlaps and is connected between the first part and the second part.

[0227] The third portion of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first substrate layer (e.g., 331a in FIG. 8b).

[0228] The third portion of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first wiring layer (e.g., 332 in FIG. 8b) comprising a first-1 signal line (e.g., 3321 in FIG. 8b) disposed in a first region of the first substrate layer, and a second-1 signal line (e.g., 3322 in FIG. 8b) disposed in a second region of the first substrate layer and spaced apart from the first-1 signal line in a first direction (X-axis direction).

[0229] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first dielectric layer (e.g., 333 in FIG. 8b) disposed on the first wiring layer.

[0230] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first shielding layer (e.g., 334a in FIG. 8b) disposed between the wireless power receiver and the first dielectric layer.

[0231] The third portion of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure is a second shielding layer (e.g., 334b ​​in FIG. 8b) disposed between the first substrate layer and the battery at a position corresponding to the second-1 signal line, wherein the second shielding layer may include a second shielding layer (e.g., 334b ​​in FIG. 8b) that does not overlap with the first-1 signal line between the first substrate layer and the battery in order to reduce and / or prevent interference of the wireless signal by the second shielding layer.

[0232] According to one embodiment of the present disclosure, the thickness of the third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of the electronic device (e.g., 200 in FIG. 4) may be smaller than the thickness of the first portion (e.g., T1 in FIG. 8a) and the thickness of the second portion (e.g., T2 in FIG. 8c).

[0233] The sum of the thickness of the third part of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure and the thickness of the coil (e.g., T3 in FIG. 8b) may correspond to the thickness of the first part and the thickness of the second part.

[0234] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a second substrate layer (e.g., 331b in FIG. 8b) disposed between the first dielectric layer and the first shielding layer.

[0235] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of first-1 ground portions (e.g., 335a in FIG. 8b) spaced apart from each other on both sides of the first-1 signal line.

[0236] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of first-2 ground portions (e.g., 335b in FIG. 8b) disposed between the first dielectric layer and the second substrate layer and spaced apart at positions corresponding to the plurality of first-1 ground portions.

[0237] The third portion of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of first-1 connecting portions (e.g., 336a in FIG. 8b) that penetrate the first dielectric layer and connect the plurality of first-1 ground portions and the plurality of first-2 ground portions.

[0238] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of first-2 connecting portions (e.g., 336b in FIG. 8b) that penetrate the second substrate layer and connect the plurality of first-2 ground portions and the first shielding layer.

[0239] The plurality of first-1 connection portions and the plurality of first-2 connection portions of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure are configured to ground through the first shielding layer.

[0240] The first shielding layer, the first-1 connection, and the first-2 connection of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may surround at least a portion of the first-1 signal line to prevent and / or reduce wireless signal interference.

[0241] A flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure comprises a plurality of first conductive parts (e.g., 303a in FIG. 9), each comprising a plurality of first-1 connecting parts and a plurality of first-2 connecting parts, and the plurality of first conductive parts are spaced apart from each other by a first distance (e.g., D1 in FIG. 9) along the first-1 signal line to shield the first-1 signal line together with the first shielding layer, and the first distance (e.g., D1 in FIG. 9) may be less than or equal to half of a first wavelength defined as the maximum frequency of a signal transmitted from the first-1 signal line.

[0242] The thickness of the second substrate layer (e.g., Tb in FIG. 8b) of the third part (e.g., 330 in FIG. 8b) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may be greater than the thickness of the first substrate layer (e.g., Ta in FIG. 8b) such that the distance between the first shielding sheet and the first signal line is greater than the distance between the first signal line and the battery.

[0243] The wireless power receiver of an electronic device (e.g., 200 of FIG. 4) according to one embodiment of the present disclosure has the flexible printed circuit board connecting the second circuit board and the first circuit board across between the battery and the wireless power transmitter, and the wireless power receiver may be in contact with the first part and the second part where the coil of the wireless power receiver is not placed.

[0244] The first portion (e.g., 310 in FIG. 8a) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first-2 signal line (e.g., 3121 in FIG. 8a) electrically connected to the first-1 signal line and a second-2 signal line (e.g., 3122 in FIG. 8a) electrically connected to the second-1 signal line, and may include a second wiring layer (e.g., 312 in FIG. 8a) disposed on a first adhesive layer (e.g., 3131 in FIG. 8a) attached to a second-1 dielectric layer (e.g., 313a in FIG. 8a).

[0245] The first portion (e.g., 310 in FIG. 8a) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a second dielectric layer (e.g., 313b in FIG. 8a) spaced apart from the second dielectric layer and disposed between the wireless power receiver and the second wiring layer.

[0246] The first portion (e.g., 310 in FIG. 8a) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of second-1 ground portions (e.g., 315a in FIG. 8a) spaced apart by a second distance from both sides of the first-2 signal line.

[0247] The first portion (e.g., 310 in FIG. 8a) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include the second-2 ground portion (e.g., 315b in FIG. 8a) disposed on the second-2 dielectric layer to partially overlap the spaced-apart second-1 ground portions in a direction perpendicular to the first direction.

[0248] The first portion (e.g., 310 in FIG. 8a) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of second-1 ground portions and a second-3 ground portion (e.g., 315c in FIG. 8a) disposed on the coating layer and disposed to overlap the second-2 ground portions in a direction perpendicular to the first direction.

[0249] The first portion (e.g., 310 in FIG. 8a) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of second-1 connection portions (e.g., 316a in FIG. 8a) that penetrate the second-2 dielectric layer and connect the plurality of second-1 ground portions and the second-2 ground portions.

[0250] The first portion (e.g., 310 in FIG. 8a) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of second-2 connecting portions (e.g., 316b in FIG. 8a) that penetrate the second-1 dielectric layer and connect the second-1 ground portion and the second-3 ground portion.

[0251] The plurality of 2-1 connection portions, the plurality of 2-2 connection portions, the 2-2 ground portion, and the 2-3 ground portion of the first portion (e.g., 310 in FIG. 8a) of the flexible printed circuit board (e.g., 200 in FIG. 4) of an electronic device (e.g., 201 in FIG. 4) according to one embodiment of the present disclosure may be configured to surround at least a portion of the 1-2 signal line so as to prevent and / or reduce wireless signal interference of the 1-2 signal line.

[0252] The second portion (e.g., 320 in FIG. 8c) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first-3 signal line (e.g., 3221 in FIG. 8c) electrically connected to the first-1 signal line and a second-3 signal line (e.g., 3222 in FIG. 8c) electrically connected to the second-1 signal line, and may include a third wiring layer (e.g., 322 in FIG. 8c) disposed on a second coating layer (e.g., 327 in FIG. 8c) in contact with the battery.

[0253] The second portion (e.g., 320 in FIG. 8c) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a third-1 dielectric layer (e.g., 323a in FIG. 8c) disposed on the third wiring layer.

[0254] The second portion (e.g., 320 in FIG. 8c) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a third-2 dielectric layer (e.g., 323b in FIG. 8c) spaced apart from the third-1 dielectric layer in a direction away from the third wiring layer.

[0255] The second portion (e.g., 320 in FIG. 8c) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of third-1 ground portions (e.g., 325a in FIG. 8c) spaced apart from both sides of the first-3 signal lines.

[0256] The second portion (e.g., 320 in FIG. 8c) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of third-2 ground portions (e.g., 325b in FIG. 8c) disposed on a second adhesive layer (e.g., 3231 in FIG. 8c) that is bonded to the third-1 dielectric layer and is spaced apart from each other at a position corresponding to the third-1 ground portion.

[0257] The second portion (e.g., 320 in FIG. 8c) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a third-third ground portion (e.g., 325c in FIG. 8c) disposed on the third-second dielectric layer so as to overlap the third-first ground portion and the third-second ground portion in a direction perpendicular to the first direction.

[0258] The second portion (e.g., 320 in FIG. 8c) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a second conductive portion (e.g., 303b in FIG. 8c) comprising a plurality of third-1 connecting portions (e.g., 326a in FIG. 8c) that penetrate the third-1 dielectric layer and connect the plurality of third-1 ground portions and the plurality of third-2 ground portions, and a plurality of third-2 connecting portions (e.g., 326b in FIG. 8c) that penetrate the third-2 dielectric layer and connect the plurality of third-2 ground portions and the third-3 ground portions.

[0259] The second conductive portion of the second portion (e.g., 320 in FIG. 8c) of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may be configured to surround at least a portion of the first-3 signal line together with the third-1 ground portion, the third-2 ground portion, and the third-3 ground portion to prevent and / or reduce wireless signal interference of the first-3 signal line.

[0260] The first shielding layer and the second substrate layer of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure are in contact with the wireless power receiver and extend from the second portion so as to be disposed in the first portion and the third portion, and the first shielding layer may be in contact with the wireless power receiver.

[0261] According to one embodiment of the present disclosure, the first portion of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) comprises a first-2 signal line (e.g., 3121 in FIG. 8a) electrically connected to the first-1 signal line, and the second portion comprises a first-3 signal line (e.g., 3221 in FIG. 8c) electrically connected to the first-1 signal line, wherein the width of the first-2 signal line is smaller than the width of the first-3 signal line and the width of the first-1 signal line, the width of the first-3 signal line is larger than the width of the first-1 signal line, and the distance between the first-3 signal line and the third-3 ground portion (e.g., L4 in FIG. 8c) may be greater than the distance between the first-1 signal line and the first shielding layer (e.g., L3 in FIG. 8b).

[0262] The third portion of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure further comprises a third-1 signal line (e.g., 3323 in FIG. 8b) disposed between the first dielectric layer and the second substrate layer, wherein the second-1 signal line and the third-1 signal line are configured to transmit a signal and power transmitted from outside the electronic device to a first circuit board inside the housing through the first end, and the first-1 signal line may be configured to transmit a wireless signal transmitted from outside the electronic device to the first circuit board through the first end.

[0263] The first shielding layer of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may have electrical conductivity greater than that of the second shielding layer.

[0264] A portion (381) of the second end of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may be configured to transmit power and signals introduced from outside the electronic device to the second portion.

[0265] A portion of the second end (e.g., 381 in FIG. 6) of a flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may be configured to transmit power and signals introduced from outside the electronic device to the second portion.

[0266] An electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a housing (e.g., 220 in FIG. 5) that accommodates a wireless power receiver (e.g., 302 in FIG. 5) comprising a battery (254) and a coil (e.g., 3021 in FIG. 5).

[0267] An electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a flexible printed circuit board (e.g., 301 in FIG. 6) disposed between the battery and the wireless power receiver, comprising a first portion (e.g., 310 in FIG. 6), a second portion (e.g., 320 in FIG. 6), and a third portion (e.g., 330 in FIG. 6) connecting the first portion and the second portion.

[0268] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first substrate layer (e.g., 331a in FIG. 8b).

[0269] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first wiring layer (e.g., 332 in FIG. 8b) comprising a first-1 signal line (e.g., 3321 in FIG. 8b) disposed on a portion of the first substrate layer.

[0270] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first dielectric layer (e.g., 333 in FIG. 8b) disposed on the first wiring layer and partially supporting the first-1 signal line and the second-1 signal line.

[0271] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first shielding layer (e.g., 334a in FIG. 8b) disposed between the wireless power receiver and the first dielectric layer.

[0272] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first wiring layer, which may include a second-1 signal line (e.g., 3322 in FIG. 8b) disposed on the first substrate layer and spaced apart from the first-1 signal line in a first direction.

[0273] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure is a second shielding layer (e.g., 334b ​​in FIG. 8b) disposed between the first substrate layer and the battery at a position corresponding to the second-1 signal line, wherein, in order to reduce and / or prevent interference of a wireless signal by the second shielding layer, the second shielding layer comprises a second shielding layer (e.g., 334b ​​in FIG. 8b) that does not overlap with the first-1 signal line between the first substrate layer and the battery.

[0274] In the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure, the thickness of the third portion (e.g., T3' in FIG. 8b) may be smaller than the thickness of the first portion (e.g., T1 in FIG. 8a) and / or the thickness of the second portion (e.g., T2 in FIG. 8c) that does not overlap with the coil.

[0275] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a second substrate layer (e.g., 331b in FIG. 8b) disposed between the first dielectric layer and the first shielding layer.

[0276] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include first-1 ground portions (e.g., 335a in FIG. 8b) spaced apart from each other on both sides of the first-1 signal line.

[0277] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first-2 ground portion (e.g., 335b in FIG. 8b) disposed between the first dielectric layer and the second substrate layer and spaced apart from each other at a position corresponding to the first-1 ground portion.

[0278] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may include a first-1 connection portion (336a) that penetrates the first dielectric layer to connect the first-1 ground portion and the first-2 ground portion, and a first-2 connection portion (e.g., 336b in FIG. 8b) that penetrates the second substrate layer to connect the first-2 ground portion and the first shielding layer.

[0279] The third portion of the flexible printed circuit board (e.g., 301 in FIG. 6) of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure may surround at least a portion of the first-1 signal line so as to ground the first shielding layer, the first-1 connection portion, and the first-2 connection portion through the first shielding layer and prevent wireless signal interference.

[0280] The battery of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure comprises a non-conductive material, and the first signal line may be configured to transmit a wireless signal transmitted from outside the electronic device to a second circuit board (e.g., 264b in FIG. 4) disposed inside the housing.

[0281] The flexible printed circuit board of an electronic device (e.g., 200 in FIG. 4) according to one embodiment of the present disclosure comprises a plurality of first conductive portions (e.g., 303a in FIG. 9), each comprising a first-1 connection portion and a first-2 connection portion, and the plurality of first conductive portions are spaced apart from each other by a first distance along the first-1 signal line to shield the first-1 signal line together with the first shielding layer, and the first distance (e.g., D1 in FIG. 9) may be less than or equal to half of a first wavelength defined as the maximum frequency transmitted from the first-1 signal line.

[0282] A flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include a first portion (e.g., 310 in FIG. 6), a second portion (e.g., 320 in FIG. 6), and a third portion (e.g., 330 in FIG. 6) connecting the first portion and the second portion and thinner than the thickness of the first portion and the second portion.

[0283] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include a first substrate layer (331a).

[0284] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include a first wiring layer (e.g., 332 in FIG. 8b) comprising a first-1 signal line (e.g., 3321 in FIG. 8b) disposed in a portion of the first substrate layer, and a second-1 signal line (e.g., 3322 in FIG. 8b) disposed in another portion of the first substrate layer and spaced apart from the first-1 signal line in a first direction.

[0285] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include a first dielectric layer (e.g., 333 in FIG. 8b) disposed on the first wiring layer and partially supporting the first-1 signal line and the second-1 signal line.

[0286] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include a second substrate layer (e.g., 331b in FIG. 8b) disposed between the first dielectric layer and the first shielding layer.

[0287] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include a first shielding layer (e.g., 334a in FIG. 8b) disposed on the second substrate layer.

[0288] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure is a second shielding layer (e.g., 334b ​​in FIG. 8b) disposed below the first substrate layer at a position corresponding to the second-1 signal line, wherein the second shielding layer may include a second shielding layer (e.g., 334b ​​in FIG. 8b) that does not overlap with the first-1 signal line below the first substrate layer in order to reduce and / or prevent interference of the wireless signal by the second shielding layer.

[0289] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include first-1 ground portions (e.g., 335a in FIG. 8b) spaced apart from each other on both sides of the first-1 signal line.

[0290] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include a first-2 ground portion (e.g., 335b in FIG. 8b) disposed between the first dielectric layer and the second substrate layer and spaced apart at a position corresponding to the first-1 ground portion.

[0291] The third portion (e.g., 330 in FIG. 8b) of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure may include a plurality of first conductive portions (e.g., 303a in FIG. 9), each comprising a first-1 connection portion (e.g., 336a in FIG. 8b) that penetrates the first dielectric layer to connect the first-1 ground portion and the first-2 ground portion, and a first-2 connection portion (e.g., 336b in FIG. 8b) that penetrates the second substrate layer to connect the first-2 ground portion and the first shielding layer.

[0292] The plurality of first conductive portions of a flexible printed circuit board (e.g., 301 in FIG. 4) according to one embodiment of the present disclosure are spaced apart from each other by a first distance along the first-1 signal line so as to shield the first-1 signal line together with the first shielding layer, and the first distance (e.g., D1 in FIG. 9) may be less than or equal to half of a first wavelength defined as the maximum frequency transmitted from the first-1 signal line.

Claims

1. In an electronic device (200), Housing (220); A battery (254) placed within the above housing; A wireless power receiver (302) including a coil (3021) and disposed within the housing; First circuit board (264a); Second circuit board (264b); and A flexible printed circuit board (301) comprising a first part (310) including a first end (3041) connected to a first circuit board and disposed between the wireless power receiver and the battery, a second part (320) including a second end (3032) connected to a second circuit board, and a third part (330; 430) connecting the first part and the second part, wherein when viewed from above, the coil of the wireless power receiver overlaps and is connected between the first part and the second part. The above third part is, First substrate layer (331a; 431a); A first wiring layer (332; 432) comprising a first-1 signal line (3321; 4321) disposed in a first region of the first substrate layer, and a second-1 signal line (3322; 4322) disposed in a second region of the first substrate layer and spaced apart from the first-1 signal line in a first direction; A first dielectric layer (333; 433) disposed on the first wiring layer above; A first shielding layer (334a; 434a) disposed between the wireless power receiver and the first dielectric layer; and A second shielding layer (334b; 434b) disposed between the first substrate layer and the battery at a position corresponding to the second-1 signal line, wherein, in order to reduce and / or prevent interference of wireless signals by the second shielding layer, the second shielding layer (334b; 434b) does not overlap with the first-1 signal line between the first substrate layer and the battery; and The thickness of the third part (T3') is smaller than the thickness of the first part (T1) and the thickness of the second part (T2) of the electronic device.

2. In Paragraph 1, The sum of the thickness of the third part and the coil (T3) corresponds to the thickness of the first part and the thickness of the second part, and The above third part is, A second substrate layer (331b) disposed between the first dielectric layer and the first shielding layer, A plurality of first-1 grounding sections (335a) spaced apart from each other on both sides of the first-1 signal line, A plurality of first-second grounding portions (335b) disposed between the first dielectric layer and the second substrate layer and spaced apart at positions corresponding to the plurality of first-first grounding portions, A plurality of 1-1 connecting portions (336a) that penetrate the first dielectric layer and connect the plurality of 1-1 ground portions and the plurality of 1-2 ground portions, and It further includes a plurality of first-2 connecting portions (336b) that penetrate the second substrate layer and connect the plurality of first-2 grounding portions and the first shielding layer, and The plurality of first-1 connecting parts and the plurality of first-2 connecting parts are configured to be grounded through the first shielding layer, and An electronic device in which the first shielding layer, the first-1 connection part, and the first-2 connection part surround at least a portion of the first-1 signal line to prevent and / or reduce the wireless signal interference.

3. In Paragraph 2, The flexible printed circuit board comprises a plurality of first conductive parts (303a), each including a plurality of first-1 connecting parts and a plurality of first-2 connecting parts, and The plurality of first conductive members are spaced apart from each other by a first distance (D1) along the first-1 signal line to shield the first-1 signal line together with the first shielding layer, The above first distance (D1) is an electronic device that is less than or equal to half of the first wavelength defined as the maximum frequency of the signal transmitted from the above first-1 signal line.

4. In Paragraph 2 or 3, An electronic device in which the thickness (Tb) of the second substrate layer is greater than the thickness (Ta) of the first substrate layer, such that the distance between the first signal line and the first shielding sheet is greater than the distance between the first signal line and the battery.

5. In any one of paragraphs 1 through 4, The wireless power receiver has the flexible printed circuit board connecting the second circuit board and the first circuit board across the space between the battery and the wireless power transmitter, and The above wireless power receiver is an electronic device in contact with the first part and the second part where the coil of the above wireless power receiver is not placed.

6. In any one of paragraphs 1 through 5, The above first part is, A second wiring layer (312) disposed on a first adhesive layer (3131) attached to a second dielectric layer (313a), comprising a first-2 signal line (3121) electrically connected to the first-1 signal line and a second-2 signal line (3122) electrically connected to the second-1 signal line; A second-second dielectric layer (313b) spaced apart from the second-first dielectric layer and disposed between the wireless power receiver and the second wiring layer, A plurality of 2-1 grounding sections (315a) spaced apart by a second distance from both sides of the above 1-2 signal line, The second-2 grounding portion (315b) disposed in the second-2 dielectric layer to partially overlap the plurality of spaced-apart second-1 grounding portions in a direction perpendicular to the first direction, A second-third grounding portion (315c) disposed on the coating layer and disposed to overlap the plurality of second-first grounding portions and the second-second grounding portions in a direction perpendicular to the first direction, A plurality of 2-1 connecting portions (316a) that penetrate the 2-2 dielectric layer and connect the plurality of 2-1 ground portions and the 2-2 ground portions, and It includes a plurality of 2-2 connecting parts (316b) that penetrate the 2-1 dielectric layer and connect the 2-1 grounding part and the 2-3 grounding part, and An electronic device configured such that the plurality of 2-1 connection parts, the plurality of 2-2 connection parts, the 2-2 ground part, and the 2-3 ground part surround at least a portion of the 1-2 signal line to prevent and / or reduce wireless signal interference of the 1-2 signal line.

7. In any one of paragraphs 1 through 6, The above second part is, A third wiring layer (322) disposed on a second coating layer (327) in contact with the battery, comprising a first-3 signal line (3221) electrically connected to the first-1 signal line and a second-3 signal line (3222) electrically connected to the second-1 signal line, The third-1 dielectric layer (323a) disposed in the third wiring layer above, A third-2 dielectric layer (323b) spaced apart from the third-1 dielectric layer in a direction away from the third wiring layer, A plurality of 3-1 grounding sections (325a) spaced apart from both sides of the above 1-3 signal lines, A plurality of 3-2 grounding portions (325b) spaced apart from each other and positioned on a 2 adhesive layer (3231) attached to the 3-1 dielectric layer, corresponding to the 3-1 grounding portions, A third-3 grounding portion (325c) disposed in the third-2 dielectric layer so as to overlap the third-1 grounding portion and the third-2 grounding portion in a direction perpendicular to the first direction, and It includes a second conductive part (303b) comprising a plurality of third-1 connecting parts (326a) that penetrate the third-1 dielectric layer and connect the plurality of third-1 grounding parts and the plurality of third-2 grounding parts, and a plurality of third-2 connecting parts (326b) that penetrate the third-2 dielectric layer and connect the plurality of third-2 grounding parts and the third-3 grounding part. An electronic device configured such that the second conductive part surrounds at least a portion of the first-3 signal line together with the third-1 grounding part, the third-2 grounding part and the third-3 grounding part to prevent and / or reduce wireless signal interference of the first-3 signal line.

8. In Paragraph 6 or 7, The first shielding layer and the second substrate layer are in contact with the wireless power receiver and extend from the second portion so as to be disposed in the first portion and the third portion, and The first shielding layer is an electronic device in contact with the wireless power receiver.

9. In any one of paragraphs 1 through 8, The first part includes a first-2 signal line (3121) electrically connected to the first-1 signal line, and the second part includes a first-3 signal line (3221) electrically connected to the first-1 signal line. The width of the first-2 signal line is smaller than the width of the first-3 signal line and the width of the first-1 signal line, and An electronic device in which the width of the first-3 signal line is greater than the width of the first-1 signal line, and the distance (L4) between the first-3 signal line and the third-3 ground portion is greater than the distance (L3) between the first-1 signal line and the first shielding layer.

10. In any one of paragraphs 1 through 9, The above third portion further includes a third-1 signal line (3323; 4323) disposed between the first dielectric layer and the second substrate layer, and The above 2-1 signal line and the above 3-1 signal line are configured to transmit signals and power transmitted from outside the electronic device to a first circuit board inside the housing through the first end, and The above-mentioned first-1 signal line is an electronic device configured to transmit a wireless signal transmitted from outside the electronic device to the first circuit board through the first end.

11. In any one of paragraphs 1 through 10, The first shielding layer is an electronic device having electrical conductivity greater than that of the second shielding layer.

12. In any one of paragraphs 1 through 11, The electronic device is configured such that a portion (381) of the second end is configured to transmit power and signals from outside the electronic device to the second part.

13. In an electronic device (200), A housing (220) for housing a wireless power receiver (302) including a battery (254) and a coil (3021); and A flexible printed circuit board (301) is disposed between the battery and the wireless power receiver and includes a first part (310), a second part (320), and a third part (330; 430) connecting the first part and the second part. The above third part is, First substrate layer (331a; 431a), A first wiring layer (332; 432) including a first-1 signal line (3321; 4321) disposed on a part of the first substrate layer, A first dielectric layer (333; 433) disposed on the first wiring layer and partially supporting the first-1 signal line and the second-1 signal line, and An electronic device comprising a first shielding layer (334a; 434a) disposed between the wireless power receiver and the first dielectric layer.

14. In Paragraph 13, The first wiring layer comprises a second-1 signal line (3322; 4322) disposed on the first substrate layer and spaced apart from the first-1 signal line in a first direction; and, The third portion comprises a second shielding layer (334b; 434b) disposed between the first substrate layer and the battery at a position corresponding to the second-1 signal line, wherein, in order to reduce and / or prevent interference of wireless signals by the second shielding layer, the second shielding layer comprises a second shielding layer (334b; 434b) that does not overlap with the first-1 signal line between the first substrate layer and the battery. An electronic device in which the thickness (T3') of the third part is smaller than the thickness (T1) of the first part and / or the thickness (T2) of the second part that does not overlap with the coil.

15. In Paragraph 13, The above battery includes a non-conductive material, and The above first-1 signal line is an electronic device configured to transmit a wireless signal transmitted from outside the electronic device to a second circuit board (264b) disposed inside the housing.

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