Cooling system for a modular data center

Abstract

A modular data center has a housing defining an enclosure that is sized to receive an array of server cabinets. A baffle extends between the sidewall of the enclosure and the server cabinets to define a cool air volume adjacent to the air inlets of the server cabinets and a warm air volume adjacent to the air outlets such that airflow from the cool air volume to the warm air volume passes through the array of server cabinets. A cooling circuit has fans that draw air from the warm air volume into the cool air volume and an air-cooling heat exchanger that cool the air before entering the cool air volume.

Description

COOLING SYSTEM FOR A MODULAR DATA CENTERTECHNICAL FIELD

[0001] This relates to a cooling system for a modular data center, and in particular, a cooling system that cools air entering servers.BACKGROUND

[0002] Data centers are often used when processing large amounts of data, such as for cloud computing, artificial intelligence (Al), machine learning (ML), blockchain, data mining, etc. Modular data centers are often used to create a new data center, or to provide additional capacity to an existing data center. These may be manufactured and outfitted off-site, or modular components may be delivered and installed on site and typically include systems for powering and controlling the temperature of the servers in the modular data center.

[0003] United States patent no. 9,826,663 (Chang) entitled “Container data center and heat dissipation system” is an example of a containerized data center with a cooling system.SUMMARY

[0004] According to an aspect, there is provided a modular data center, comprising a housing defining an enclosure, an array of server cabinets installed in the enclosure, the array of server cabinets having air inlets and air outlets, and a baffle that extends between the enclosure and the array of server cabinets, the baffle connecting to the array of server cabinets along a line that separates the air inlets and the air outlets. A cool air volume is defined between the baffle and the array of server cabinets and adjacent to the air inlets of the array of server cabinets. A warm air volume is defined adjacent to the air outlets of the array of server cabinets, the cool air volume being separated from the warm airvolume by the baffle, the cool air volume and the warm air volume being disposed such that airflow from the cool air volume to the warm air volume passes through the array of server cabinets. A cooling circuit comprises an air-cooling heat exchanger, the air-cooling heat exchanger being positioned between the cool air volume and the warm air volume such that the air-cooling heat exchanger cools air drawn from the warm air volume into the cool air volume.

[0005] According to other aspects, the modular data center comprises one or more of the following features, alone or in combination: a coolant circuit may be connected to the heat exchanger, the coolant circuit supplying cold liquid to the air-cooling heat exchanger; the coolant circuit may be further connected to a direct-to-chip cooling circuit carried by the server cabinets; there may be fans that draw air from the warm air volume into the cool air volume, wherein the fans are positioned downstream of the air-cooling heat exchanger and within the cool air volume; the server cabinets may comprise server fans that circulate air from the air inlets to the air outlets of the array of server cabinets; the baffle ma extend substantially horizontal from a top of the array of server cabinets to a sidewall of the housing; a distal edge of the baffle may be opposite the array of server cabinets defines an inlet to a plenum; the plenum may be adjacent to orwithin the sidewall and below the distal edge of the baffle, and wherein the air-cooling heat exchanger is disposed between the plenum and the cool air volume; the array of server cabinets may extends laterally between a first end and a second end of the enclosure, and the baffle extends horizontally from a top end of the array of server cabinets to a sidewall of the enclosure, such that the warm air volume is adjacent to the array of server cabinets and above the array of server cabinets, and the cool air volume is adjacent to the array of server cabinets opposite the warm air volume; there may be one or more HVAC units having an air return that withdraws air from the enclosure and an air vent that introduces air into the enclosure, the one or more HVAC units being adapted to condition air within the enclosure; and there may be a controller that is connected to receive readings from one or more temperature sensors within the enclosure, the controller being adapted to control the cooling circuit in response to the readings.

[0006] According to an aspect, there is provided a method of controlling a temperature of a modular data center, comprising the steps of: providing a modular data center as described above; installing the array of server cabinets in the enclosure; and circulating air between the warm air volume and the cool air volume such that cool air circulates from the cool air volume to the warm air volume through the array of server cabinets, and warm air circulates from the warm air volume to the cool air volume through the air-cooling heat exchanger.

[0007] Other aspects will be apparent from the description and claims.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] These and other features will become more apparent from the following description in which reference is made to the appended drawings, the drawings are for the purpose of illustration only and are not intended to be in any way limiting, wherein:FIG. 1 is a perspective view of a modular data center with the outer cladding removed.FIG. 2 is a side view of a modular data center with the outer cladding removed.FIG. 3 is an end view of a modular data center with the outer cladding removed.FIG. 4 is a perspective view of a set of fans and air-cooling heat exchangers.FIG. 5 is a detailed perspective view a set of fans and air-cooling heat exchangers between server cabinets.FIG. 6 is a schematic end view of airflow within a modular data center.FIG. 7 is a schematic top plan view of a modular data center.DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0009] A modular data center 10 will now be described with reference to FIG. 1 through 7.

[0010] Referring to FIG. 1 , modular data center 10 has a housing 12, which may be shaped and structured similar to a shipping container or other modular structure. Housing 12 is mounted on a base 14, such as a skid, which facilitates transportation where modular data is constructed at a separate location. Housing 12 is at least partly framed using structural elements 16, such as studs, beams, or the like, that are covered with cladding 18, shown in FIG. 6 and 7. Structural elements 16 and cladding 18 may be selected according to known construction methods, which may be selected based on considerations such as transportation requirements, the climate in which the modular data center may be used, or the like. Referring to FIG. 3, modular data center 10 has an access point 20, such as a door depicted in broken lines, that provides access to an enclosure 22 defined by housing 12 and base 14. Access point 20 may take other forms and may be located at one or both ends of housing 12, or any suitable location. Preferably, access points 20 are sized and shaped to permit equipment, such as server cabinets 30, to be installed.

[0011] Modular data center 10 may be designed to be integrated with other equipment or other utilities. For example, referring to FIG. 3, modular data center 10 may be adapted to house supply lines which may include electrical cables, communication lines, fluid lines for circulating liquid coolant, etc. that connect to external power sources, communication equipment, cooling plants, and the like (not shown). As shown, these supply lines are represented by conduits 26. It will be understood that supply lines may be housed differently, and each type of supply line may be run different. For example, other supply lines may be run through the ceiling of housing 12, base 14, or the sidewalls, and may have connections (not shown) accessible from the outside that are designed to connect to external power sources, communication equipment, cooling plants, and the like. This may facilitate installing modular data centers 10 at a remote site that has available power, electrical, and cooling plants, which may also connect to other modular data centers 10. In other examples, power, electrical and / or cooling plants may be provided and installed along with modular data center 10.

[0012] Modular data center 10 is intended to house an array of server cabinets 30within enclosure 22. The array of server cabinets 30 may be installed linearly from end to end as shown, which is an efficient use of space within the enclosure. The layout and configuration of modular data center 10 may depend on the size and shape of housing 12, as well as the size, configuration, and number of server cabinets 30 and / or the presence of other equipment or objects (including supply lines and / or conduits 26) to be housed in housing 12.

[0013] Referring to FIG. 6, server cabinets 30 have air inlets 32 and air outlets 34 that allow air to circulate through cabinets 30 and cool the computer equipment 28 housed therein. Air inlets 32 and outlets 34 are generically identified in FIG. 6, but their location, size, and configuration will depend on the design of cabinets 30. For example, air inlets 32 and outlets 34 may be any suitable openings in cabinets 30, such as grates, arrays of apertures, removable panels or doors, etc. Modular data center 10 is intended to provide cool air that can then be circulated through the array of server cabinets 30 to cool the servers and / or other computer equipment 28 being housed within cabinets 30 by cooling heated air that exits the array of server cabinets 30. The array of server cabinets 30 may also be provided with its own air circulation equipment, such as server or cabinet fans 35 that may draw the cooling air through server cabinets 30, which may be controlled based on a sensed temperature within server cabinets 30. These may be controlled separately from, or integrally controlled with, the cooling circuit of modular data center 10 described herein. Server cabinets 30 may also be designed to allow for liquid cooling, such as direct-to-chip liquid cooled circuits, in which case modular data center 10 may be provided with liquid connections that permit liquid coolant to be circulated through the array of server cabinets using supply and return lines connected to a cooled fluid source. The liquid coolant may be supplied by the same supply of liquid coolant that supplies air- cooling heat exchangers discussed herein. It will be understood that modular data center 10 may be modified to supply server cabinets 30 and / or the equipment housed with what is necessary to operate the cooling systems contained therein. These internal cooling systems may operate independently of the cooling system of modular data center 10 described herein or may be fully or partially integrated with the cooling system orcomponents of the cooling system.

[0014] Referring to FIG. 6, modular data center 10 has a cool air volume 36 in communication with air inlets 32 of server cabinets 30, and a warm air volume 38 in communication with air outlets 34 of server cabinets 30. The air is cooled prior to entering cool air volume 36, and warmed as it passes through server cabinets 30 to cool the servers and computer equipment 28 housed therein.

[0015] Referring to FIG. 2 and 3, where server cabinets 30 are in an array that extends linearly within enclosure 22, cool air volume 36 and warm air volume 38 extend parallel to the array of server cabinets 30. Cool air volume 36 and warm air volume 38 may have separate access openings 20, such as doors, that may be used to help keep the volumes separated. Server cabinets 30 may be oriented such that operators are able to service them from within the cool air volume for their comfort.

[0016] Referring to FIG. 6, cool air volume 36 is defined between air inlets of server cabinets 30 and a baffle 40 that extends between the array of server cabinets 30 and the inside of housing 12. Baffle 40 is shown as extending horizontally between a top of the array of server cabinets 30 and the inner surface of housing 12 enclosure. To properly define cool air volume 36, baffle 40 extends between a point above air inlets 32 of server cabinets 30, which may be above or below the top surface of server cabinets 30, to a point above where cool air enters cool air volume 36. The actual position and orientation of baffle 40 may depend on the height of server cabinets 30 or the height of air inlets 32. There may be benefits to reducing the size of cool air volume 36 relative to warm air volume 38.

[0017] Baffle 40 may, for example, be a drop ceiling and may be installed before or after array of server cabinets 30 is installed. Where baffle 40 is installed before server cabinets 30, and skirt (not shown) may be installed or adjusted to engage server cabinets 30. Baffle may also be used to support lighting, to provide thermal insulation, and / or to provide sound insulation. Baffle 40 may take other forms based on the preferences of the user. It will be understood that baffle 40 may act as a sealing surface between cool airvolume 36 and warm air volume or may allow for some air leakage, in which case the amount of air leakage should be limited to ensure sufficient separation between air volumes 36 and 38 to provide sufficient cooling to server cabinets 30.

[0018] The path of the air-cooling circuit is shown in FIG. 6. The distal edge 42 of baffle 40 relative to server cabinets 30 may be used to define an inlet 44 to a plenum 46 that feeds warm air to air-cooling heat exchangers 48. Referring to FIG. 4, plenum 46 may be adjacent to or within the sidewall 50 of housing 12 and below edge 42 of baffle 40. By way of example, where the walls of housing 12 are made using individual supports, such as studs 52, the spaces 54 between studs 52 may define some or all of plenum 46. In other examples, ducting or other types of plenums may be provided to supply warm air to air-cooling heat exchangers 48. Using the space between structural members may be used to increase the volume of plenum 46 while minimizing the impact on the volume of enclosure 22.

[0019] Referring to FIG. 6, a portion of the air may circulate through an HVAC unit 56, which may be mounted outside housing 12, such as on the roof. Inlet vents 58 and outlet vents 60 may be disposed in warm air volume 38 and are used to circulate air through HVAC unit 56. HVAC unit 56 may be used to condition the air within enclosure 22, for example, to ensure a supply of fresh air within enclosure 22, to control the humidity, to control the temperature, etc. As shown, outlet vents 60 may be oriented to direct air toward the plenum inlets, and in some examples, may be ducted into plenum 46. This may be useful, for example, where air is partially cooled by HVAC unit 56.

[0020] Referring to FIG. 4, air-cooling heat exchangers 48 may include fans 62 that draw or push air from plenum 46 through heat exchangers 48. As shown, fans 62 may be positioned between air-cooling heat exchangers 48 and cool air volume 36, such that fans 62 draw air through air-cooling heat exchangers 48 and direct the cooled air toward server cabinets 30. FIG. 4 shows baffle 40, plenum 46, and fans 62 adjacent to air-cooling heat exchangers 48. Air-cooling heat exchangers 48 may be liquid cooled, such as by using coolant lines 64 that connect to air-cooling heat exchangers 48 to circulate liquidcoolant from a refrigerator unit 68 through air-cooling heat exchangers 48. Coolant lines 64 may run through the floor of housing 12, which may also be used to connect to server cabinets 30 for direct-to-chip cooling as discussed above. FIG. 5 shows baffle 40, plenum 46, and the array of server cabinets 30 with one server cabinet removed such that the relative position of the various components is more easily visible.

[0021] Referring to FIG. 6, there may be a controller 66 that is connected to receive readings from one or more temperature sensors (not shown) that measures the temperature within enclosure 22 at different points, the temperature of coolant in coolant lines 64, etc. Controller 66 may also receive readings related to the operation of fans 62, heat exchangers 48, HVAC units 56, etc. and may adjust the operation of the cooling equipment in response to the readings. While not shown, it will be apparent that the location and type of sensors may be appropriately selected by those skilled in the art. Controller 66 may be, for example, a computer controller with one or more control modules, either as a single unit or separately. Controller 66 may be used to generate instructions to control the cooling circuit based on predetermined ranges. By way of example, controller 66 may be used to control the speed of fans 62 to circulate air through air-cooling heat exchangers 48, the flow rate and / or temperature of liquid coolant through coolant lines 64, and / or HVAC unit(s) 56. In some cases, the controller may also be connected to help control the cooling equipment in server cabinets 30, although these may be independently controlled, such as by the servers themselves. Controller 66 may also include communication equipment that facilitates communication with remote users or computers.

[0022] Fans 62 may be used to increase the air pressure in cool air volume 36 relative to warm air volume 38 to create a pressure differential across server cabinets 30 in order to induce some flow of air through server cabinets 30 and reduce the load on the server fans. The load on the server fans may also be reduced by cooling the air in cool air volume 36 to a greater degree, i.e. , by creating a greater temperature differential between cool air volume 36 and warm air volume 38, such that more heat is drawn from the servers as the air circulates through server cabinets 30. In this manner, the speed of the server fans,and therefore the noise generated by the server fans, may be reduced.

[0023] In this patent document, the word "comprising" is used in its non-limiting sense to mean that items following the word are included, but items not specifically mentioned are not excluded. A reference to an element by the indefinite article "a" does not exclude the possibility that more than one of the elements is present, unless the context clearly requires that there be one and only one of the elements.

[0024] The scope of the following claims should not be limited by the preferred embodiments set forth in the examples above and in the drawings, but should be given the broadest interpretation consistent with the description as a whole.

Claims

What is Claimed is:1 . A modular data center, comprising: a housing defining an enclosure, the enclosure being adapted to house an array of server cabinets, the server cabinets having air inlets and air outlets; a baffle that extends between the enclosure and the array of server cabinets, the baffle connecting to the array of server cabinets along a line that separates the air inlets and the air outlets; a cool air volume between the baffle and the array of server cabinets and adjacent to the air inlets of the array of server cabinets; a warm air volume adjacent to the air outlets of the array of server cabinets, the cool air volume being separated from the warm air volume by the baffle, the cool air volume and the warm air volume being disposed such that airflow from the cool air volume to the warm air volume passes through the array of server cabinets; and a cooling circuit comprising an air-cooling heat exchanger, the air-cooling heat exchanger being positioned between the cool air volume and the warm air volume such that the air-cooling heat exchanger cools air drawn from the warm air volume into the cool air volume.

2. The modular data center of claim 1 , further comprising a coolant circuit connected to the heat exchanger, the coolant circuit supplying cold liquid to the air-cooling heat exchanger.

3. The modular data center of claim 1 or 2, wherein the coolant circuit is further connected to a direct-to-chip cooling circuit carried by the server cabinets.

4. The modular data center of claim 1 , 2, or 3, further comprising fans that draw air from the warm air volume into the cool air volume, wherein the fans are positioned downstream of the air-cooling heat exchanger and within the cool air volume.

5. The modular data center of any one of claims 1 -4, wherein the server cabinets comprise server fans that circulate air from the air inlets to the air outlets of the array ofserver cabinets.

6. The modular data center of any one of claims 1-5, wherein the baffle extends substantially horizontal from a top of the array of server cabinets to a sidewall of the housing.

7. The modular data center of claim 6, wherein a distal edge of the baffle opposite the array of server cabinets defines an inlet to a plenum.

8. The modular data center of claim 7, wherein the plenum is adjacent to or within the sidewall and below the distal edge of the baffle, and wherein the air-cooling heat exchanger is disposed between the plenum and the cool air volume.

9. The modular data center of any one of claims 1 -8, wherein the array of server cabinets extends laterally between a first end and a second end of the enclosure, and the baffle extends horizontally from a top end of the array of server cabinets to a sidewall of the enclosure, such that the warm air volume is adjacent to the array of server cabinets and above the array of server cabinets, and the cool air volume is adjacent to the array of server cabinets opposite the warm air volume an.

10. The modular data center of any one of claims 1-9, further comprising one or more HVAC units having an air return that withdraws air from the enclosure and an air vent that introduces air into the enclosure, the one or more HVAC units being adapted to condition air within the enclosure.

11. The modular data center of any one of claims 1-10, further comprising a controller that is connected to receive readings from one or more temperature sensors within the enclosure, the controller being adapted to control the cooling circuit in response to the readings.

12. A method of controlling a temperature of a modular data center, comprising the steps of: providing a modular data center, comprising:a housing defining an enclosure; an array of server cabinets installed in the enclosure, the array of server cabinets having air inlets and air outlets; a baffle that extends between the enclosure and the array of server cabinets, the baffle connecting to the array of server cabinets along a line that separates the air inlets and the air outlets; a cool air volume between the baffle and the array of server cabinets and adjacent to the air inlets of the array of server cabinets; a warm air volume adjacent to the air outlets of the array of server cabinets, the cool air volume being separated from the warm air volume by the baffle and the array of server cabinets; and a cooling circuit comprising an air-cooling heat exchanger between the cool air volume and the warm air volume; and circulating air between the warm air volume and the cool air volume such that cool air circulates from the cool air volume to the warm air volume through the array of server cabinets, and warm air circulates from the warm air volume to the cool air volume through the air-cooling heat exchanger.

13. The method of claim 12, wherein circulating air comprises generating an air pressure differential between the warm air volume and the cool air volume.

14. The method of claim 12 or 13, further comprising a coolant circuit connected to the heat exchanger, and further comprising the step of supplying cold liquid to the air- cooling heat exchanger via the coolant circuit.

15. The method of claim 14, further comprising the step of circulating cooled liquid to a direct-to-chip cooling circuit carried by the server cabinets via the coolant circuit.

16. The method of any one of claims 12-15, further comprising the step of drawing air from the warm air volume into the cool air volume using fans positioned downstream of the air-cooling heat exchanger and within the cool air volume.

17. The method of any one of claims 12-16, wherein the server cabinets comprise server fans, and further comprising the fan of operating the server fans to circulate air from the air inlets to the air outlets of the array of server cabinets.

18. The method of any one of claims 12-17, wherein the baffle extends substantially horizontal from a top of the array of server cabinets to a sidewall of the housing.

19. The method of claim 18, wherein a distal edge of the baffle opposite the array of server cabinets defines an inlet to a plenum.

20. The method of claim 19, wherein the plenum is adjacent to or within the sidewall and below the distal edge of the baffle, and wherein the air-cooling heat exchanger is disposed between the plenum and the cool air volume.21 . The method of any one of claims 12-20, wherein the array of server cabinets extends laterally between a first end and a second end of the enclosure, and the baffle extends horizontally from a top end of the array of server cabinets to a sidewall of the enclosure, such that the warm air volume is adjacent to the array of server cabinets and above the array of server cabinets, and the cool air volume is adjacent to the array of server cabinets opposite the warm air volume an.

22. The method of any one of claims 12-21 , further comprising one or more HVAC units having an air return that withdraws air from the enclosure and an air vent that introduces air into the enclosure, the one or more HVAC units being adapted to condition air within the enclosure.

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