Compact apparatuses and devices for wireless connectivity

Abstract

An apparatus for wireless connectivity, comprising: a dielectric substrate; a plurality of electrically conductive devices; wherein the plurality of electrically conductive devices is arranged on the dielectric substrate such that: at least two rows of electrically conductive devices are formed, the at least two rows being apart along a first direction; each row of the at least two rows comprises a respective subset of electrically conductive devices of the plurality of electrically conductive devices; each row of the at least two rows has a length extending along a second direction, the first and second directions not being parallel to each other; and each subset of electrically conductive devices comprises three or more electrically conductive devices spaced apart one another along the second direction. Also, a device with the apparatus, a method for manufacturing the apparatus, and a method for manufacturing a device with the apparatus.

Description

[0001] COMPACT APPARATUSES AND DEVICES FOR WIRELESS CONNECTIVITY

[0002] TECHNICAL FIELD

[0003] The present disclosure relates to the field of wireless communications. More particularly, the present disclosure relates to devices, apparatuses and methods for enhanced wireless connectivity.

[0004] BACKGROUND

[0005] Every year, more and more apparatuses in multiple industries require connectivity owing to the large amounts of data available, which are used to improve, e.g., performance of machines, knowledge of the status of apparatuses or machines, user information, etc. Accordingly, apparatuses need to transmit to and / or receive data from data networks, satellite systems, etc. As data may be transmitted to and / or received from many different networks, depending on, for example, cellular connectivity, local area connectivity, global navigation satellite system connectivity, among others, the apparatuses require multiband operation.

[0006] The global trend is to move away from wired connections to wireless connections. In some cases, this is due to the fact that the apparatuses with connectivity are wireless devices, e.g., portable apparatuses, handheld apparatuses, movable apparatuses, etc., whereas, in some others, the apparatuses could as well have wired connectivity yet they are more appealing products when featuring fewer or no cables at all.

[0007] Moreover, apparatuses tend to be made smaller and, thus, they tend to feature less real estate to host all the electronics needed for operation, which limits how much space there is for wireless connectivity.

[0008] The need for miniaturization and multiband operation has led to the development of radiating assemblies that reduce the surface and volume thereof in terms of the physical components themselves and the real estate required in the apparatus where the respective radiating assemblies are arranged.

[0009] As the radiating assemblies must support more and more bands of operation, many existing solutions involved providing multiple components to provide wireless connectivity in different bands that are apart to avoid mutual coupling issues. In many cases, several radiating assemblies have components arranged on different parts of apparatuses to increase the distance between the components to isolate one another and avoid mutual coupling; in fact, oftentimes the arrangement of the components is such that they are placed on opposite sides or corners of the apparatuses.

[0010] Structural and electrical features of the apparatus receiving the radiating assemblies also play a role in the radioelectric performance of the radiating assemblies. This, in turn, tends to force bespoke design of the radiating assemblies and / or dynamic tuning of radiating assemblies in many existing multiband apparatuses.

[0011] There is interest in providing apparatuses with wireless connectivity that alleviate some of the aforementioned issues.

[0012] DESCRIPTION

[0013] An aspect of the present disclosure relates to an apparatus for wireless connectivity. The apparatus comprises a dielectric substrate and a plurality of electrically conductive devices (hereinafter also referred to as conductive devices).

[0014] The plurality of electrically conductive devices is arranged on the dielectric substrate forming at least two rows of electrically conductive devices. Each row has a respective subset of electrically conductive devices of the plurality of electrically conductive devices. Each row is spaced apart, along a first direction (for the sake of clarity only, hereinafter also referred to as inter-row direction), from other rows of the at least two rows.

[0015] The rows of the at least two rows each extend each along a second direction (for the sake of clarity only, hereinafter also referred to as intra-row direction), thereby defining the length dimension of the rows. Electrically conductive devices forming the respective subset of electrically conductive devices are arranged to form the row with a length of the row along the intra-row direction. The electrically conductive devices of a same subset, i.e., of a same row, are spaced apart one another along the intra-row direction, which also influences the total length of the respective row.

[0016] Accordingly, the plurality of electrically conductive devices is arranged such that gaps are formed between conductive devices. In particular, at least one gap is formed along the inter-row direction, that is to say, at least one inter-row gap is formed. And also, a plurality of gaps is formed along the intra-row direction, that is to say, a plurality of intra-row gaps is formed. Each inter-row gap of the at least one inter-row gap is the same in some embodiments, whereas, in some other embodiments, several inter-row gaps are present. Likewise, each intra-row gap of the plurality of intra-row gaps is the same in some embodiments, whereas, in some other embodiments, several intra-row gaps are present. The inter-row direction and the intra-row direction are not parallel. In some embodiments, the inter-row direction and the intra-row direction are perpendicular one another.

[0017] The apparatus is capable of providing wireless connectivity to a device incorporating the apparatus when the apparatus is electrically connected to a ground plane and, optionally, a matching network. Therefore, the apparatus enables the device to transmit data and / or receive data in a wireless form; or, in other words, the apparatus enables the device to radiate electromagnetic wave signals and / or capture electromagnetic wave signals.

[0018] The apparatus allows the adjustment of the wireless connectivity provided without requiring modification. This means that the device incorporating the apparatus is capable of operating in one or several frequency bands of interest without having to modify the shape or structure of the apparatus. Namely, the same apparatus is valid for a set of devices with different frequency bands of operation, and / or the same apparatus is valid for a set of devices with different structural and electrical features. In this sense, a same apparatus can be used in a first device with a particular ground plane and with particular frequency bands of operation of, e.g., LTE (Long Term Evolution) and GNSS (Global Navigation Satellite Systems), and also in a second device with a particular ground plane (different from, or the same as, the ground plane of the first device) and with particular frequency bands of operation (different from, or the same as, the particular frequency bands of operation of the first device, e.g., Bluetooth and GNSS).

[0019] A single part number is thus enough to cope with the wireless connectivity requirements of multiple devices with different characteristics. Reducing the amount of part numbers when manufacturing devices or when providing manufactured devices with wireless connectivity simplifies the concerned manufacturing or arrangement process because the same part number is selected over and over instead of having to select the appropriate part number for the device at hand. Such reduction of part numbers also simplifies stock storage and handling as there are fewer apparatuses to keep track of.

[0020] The apparatus furthermore makes arrangement thereof in a device easy since conductive devices of the apparatus can be directly soldered to pads in the device, and the whole apparatus be used in a pick-and-place arrangement process and machine.

[0021] Adapting the wireless connectivity and, thus, the radioelectric performance of the device, different ways of connecting conductive devices is possible and / or different matching networks to provide impedance matching are possible. The conductive devices provide flexibility in how they are interconnected in inter-row and / or intra-row fashion.

[0022] Also, by selecting which conductive devices are used and how they are interconnected, and the gaps along the inter-row and intra-row directions, multiband operation with reduced mutual coupling is attainable.

[0023] In some embodiments, a gap along the first direction between electrically conductive devices of neighboring rows of the at least two rows is greater than a gap along the second direction between electrically conductive devices of each respective subset of electrically conductive devices. The radioelectric performance of conductive devices in one row has less mutual coupling of conductive devices in other rows by making the inter-row gap larger, thereby improving the wireless connectivity attainable by the apparatus.

[0024] In some embodiments, one, some or all electrically conductive devices of the plurality of electrically conductive devices at least comprises respective first and second electrically conductive layers, the first and second electrically conductive layers being arranged on the dielectric substrate forming a gap therebetween along a third direction. The third direction is perpendicular to both the first and second directions (i.e. , inter-row and intra-row directions).

[0025] For example, multiple electrically conductive layers are arrangeable to form a single electrically conductive device. Currents flowing on one of the electrically conductive layers are coupled to the other electrically conductive layers owing to a reduced gap in the third direction and / or owing to a physical electrical connection between the different layers. To this end, in some embodiments, the apparatus also comprises at least one electrically conductive element, each arranged between the first and second electrically conductive layers of the one, some or all electrically conductive devices for electrical connection thereof. Namely, when conductive devices have two or more electrically conductive layers, each respective set of electrically conductive layers is physically connectable with one or more respective electrically conductive elements, such as, for example, via holes, conductive traces, conductive strands, lumped components, transmission lines, systems in package, or combinations thereof. Lumped components comprise, for example but without limitation, resistors including zero-ohm resistors, capacitors, inductors, combinations thereof, etc.

[0026] In some embodiments, the gap along the first direction is constant throughout a length of each row of the at least two rows.

[0027] In some embodiments, the gap along the second direction is constant throughout a length of each row of the at least two rows.

[0028] In some embodiments, the gap along the third direction, if any, is constant throughout a length of each row of the at least two rows.

[0029] The existence of constant gaps eases the provision of electrically conductive layers, e.g., electrically conductive pads, in the device that is to receive the apparatus. Constant gaps require the provision of, e.g., equally spaced conductive pads, if gaps are arranged in the conductive pads. In some cases, several conductive pads are electrically connected one another by way of electrically conductive layers, e.g., electrically conductive traces, that may be narrower or wider than a width of the electrically conductive devices, thus the process for providing the electrically conductive pads in the device is likewise simpler. In some embodiments, each subset of electrically conductive devices comprises six or more electrically conductive devices spaced apart one another along the second direction. In some embodiments, each subset of electrically conductive devices comprises between eight and fourteen electrically conductive devices spaced apart one another along the second direction.

[0030] A larger number of conductive devices provides more flexibility in the provision of wireless connectivity tailored to the characteristics and requirements of the device incorporating the apparatus.

[0031] In some embodiments, a length of some or all electrically conductive devices of the plurality of electrically conductive devices is less than 10.0 mm. In some embodiments, the length of some or all electrically conductive devices of the plurality of electrically conductive devices is less than 5.0 mm and, in some cases, less than 3.5 mm.

[0032] In some embodiments, a length of some or all electrically conductive devices of the plurality of electrically conductive devices is less than a longest wavelength of the wireless connectivity of the apparatus divided by 10. In some embodiments, the length of some or all electrically conductive devices of the plurality of electrically conductive devices is less than the longest wavelength of the wireless connectivity of the apparatus divided by 20 and, in some cases, said longest wavelength divided by 25.

[0033] In some embodiments, a length of some or all electrically conductive devices of the plurality of electrically conductive devices is less than a shortest wavelength of the wireless connectivity of the apparatus divided by 4. In some embodiments, the length of some or all electrically conductive devices of the plurality of electrically conductive devices is less than the shortest wavelength of the wireless connectivity of the apparatus divided by 8 and, in some cases, said shortest wavelength divided by 20.

[0034] In some embodiments, a length of some or all electrically conductive devices of the plurality of electrically conductive devices is: equal to or greater than 2.0 mm, and / or greater than a longest wavelength of the wireless connectivity of the apparatus divided by 10, and / or greater than a shortest wavelength of the wireless connectivity of the apparatus divided by 4.

[0035] In some embodiments, the at least two rows comprise two rows. In some embodiments, the at least two rows comprise three rows. In some embodiments, the at least two rows comprise four or more rows.

[0036] A greater number of rows provides more flexibility in the provision of wireless connectivity tailored to the characteristics and requirements of the device incorporating the apparatus. By contrast, when the apparatus is miniaturized, for a same width of the apparatus (the width corresponding to the first direction), a greater number of rows resulting in a shorter inter-row gap, thereby increasing the potential mutual coupling between several conductive devices. A trade-off between flexibility and mutual coupling is generally found at two or three rows.

[0037] In some embodiments, the dielectric substrate is a parallelepiped with length, width and thickness (or height) dimensions. The thickness is smaller than the length and the width.

[0038] In some embodiments, a ratio of the length divided by the width is equal to or greater than 2.00. In some embodiments, said ratio is equal to or greater than 3.00. In some embodiments, said ratio is equal to or smaller than 5.00 and, optionally, equal to or smaller than 4.00.

[0039] In some embodiments, a ratio of the length divided by the thickness is equal to or greater than 20.00. In some embodiments, said ratio is equal to or greater than 40.00.

[0040] A total surface or footprint of the apparatus is optimized to provide a trade-off between row length and inter-row gap, thereby enhancing the overall radioelectric performance of the apparatus and, thus, of the device incorporating the apparatus.

[0041] The ratio between the length and the thickness of the apparatus enables the provision of multiband operation with a slim apparatus. Slim apparatuses, i.e., apparatuses with low thickness, are convenient for reducing the total volume occupied in the device; sometimes, devices are slim and, thus, only apparatuses or antennas with reduced thickness may be arranged in the devices.

[0042] In some embodiments, the apparatus has a length that is: less than 80 mm; and / or less than a longest wavelength of at least one frequency band of the wireless connectivity divided by 5. In some embodiments, the length of the apparatus is: less than 50 mm; and / or less than the longest wavelength of the at least one frequency band divided by 10.

[0043] In some embodiments, a subset of electrically conductive devices in a row of the at least two rows has the electrically conductive devices thereof offset along the second direction with respect to electrically conductive devices of a subset of electrically conductive devices of at least one other row of the at least two rows.

[0044] Offsetting at least some conductive devices of a row in respect of at least some conductive devices of another row reduces mutual coupling between said conductive devices, which further increases the radioelectric performance of the apparatus.

[0045] In some embodiments, the gap along the first direction is equal to or greater than 0.5 times a minimum size along the first direction of the plurality of electrically conductive devices.

[0046] In some embodiments, the gap along the first direction is equal to or greater than 1.0, 1.5, 2.0, 2.5 and / or 3.0 times the minimum size along the first direction of the plurality of electrically conductive devices. Such values of inter-row gap make conductive devices of different rows to feature reduced mutual coupling between them.

[0047] The provision of a longer gap, e.g., 2.0 times (i.e., twice) the minimum size or longer, although generally causing less mutual coupling, makes the apparatus, in some cases, not have a size appropriate for devices such as, e.g., wireless devices and / or handheld devices, where available space (e.g., available area) is scarce, which limits the size of apparatuses that may be arranged therein.

[0048] When all conductive devices have the same width, the minimum size along the first direction is the width of any such conductive device. By contrast, when one or more conductive devices have different widths, the minimum size along the first direction is the width of the conductive device with shortest width.

[0049] By way of example, in some embodiments, the gap along the first direction is at least (i.e., equal to or greater than) 8.0 mm and / or 10.0 mm.

[0050] In some embodiments, the gap along the first direction is equal to or less than 2.0 and / or 3.0 times the minimum size along the first direction of the plurality of electrically conductive devices.

[0051] In some embodiments, the gap along the second direction is less than a minimum size along the second direction of the plurality of electrically conductive devices.

[0052] Such intra-row gap makes conductive devices of a same row to be easily connectable one another, when such connection is desired.

[0053] When all conductive devices have the same length, the minimum size along the second direction is the length of any such conductive device. By contrast, when one or more conductive devices have different length, the minimum size along the first direction is the length of the conductive device with shortest length.

[0054] In some embodiments, the plurality of electrically conductive devices is arranged on the dielectric substrate such that the plurality of electrically conductive devices has a plane of symmetry with a normal vector being parallel to the first direction and / or a plane of symmetry with a normal vector being parallel to the second direction.

[0055] In some embodiments, the plurality of electrically conductive devices is arranged on the dielectric substrate such that the plurality of electrically conductive devices has a plane of symmetry with a normal vector that is perpendicular to both the first and the second directions.

[0056] The existence of one or more planes of symmetry makes the handling of the apparatus simpler, especially during arrangement of the apparatus in a device, since several possible orientations for the apparatus are possible for correct arrangement in the device without influencing the radioelectric performance thereof. In some embodiments, the apparatus further comprises one or more isolation bridges. Each isolation bridge of the one or more isolation bridges is arranged between two electrically conductive devices of the plurality of electrically conductive devices.

[0057] Isolation bridges may improve the wireless connectivity of the apparatus by increasing an isolation bandwidth in frequencies of the wireless connectivity and / or proximate thereto.

[0058] The one or more isolation bridges provide signals for partial or complete phase cancellation for frequencies of interest, thereby causing an isolation effect for the wireless connectivity at those frequencies. To this end, each isolation bridge of the one or more isolation bridge is configured, in some embodiments, for isolation at a respective isolation bandwidth.

[0059] In some embodiments, one, some or all isolation bridges of the one or more isolation bridges devices comprise at least one electrically conductive device.

[0060] Isolation bridges may be arranged by way of electrically conductive devices that provide additional path or paths for currents to follow so that, based on configured feature(s) of said electrically conductive devices, some currents may at least partially cancellate some other current(s) at given frequencies. The configured features cause the currents flowing in the respective electrically conductive devices to have a phase shift for the isolation effect. To this end, the configured feature or features may be any for configured the phase of the currents like, for example, the length of the electrically conductive device.

[0061] Accordingly, currents flowing in the plurality of electrically conductive devices of the apparatus (e.g., first conductive devices) may reach one or more isolation bridges and have part of the currents flow in the electrically conductive device(s) of the one or more isolation bridges (e.g., second conductive devices). In some cases, currents in the second conductive devices reach the first conductive devices again and flow therein.

[0062] In some embodiments, one, some or all isolation bridges of the one or more isolation bridges comprises a capacitance.

[0063] In some embodiments, one, some or all isolation bridges of the one or more isolation bridges comprises an inductance.

[0064] In some embodiments, one, some or all isolation bridges of the one or more isolation bridges devices comprise one or more lumped components.

[0065] Lumped components, which may be, for example, any as described previously in this disclosure, are capable of tuning the performance of the isolation bridges as they influence the impedance and phase thereof. Additionally or alternatively, lumped components may be provided for selectively configuring frequencies of interest, for example by way of filters comprised of lumped components, and / or for allowing selective enablement of the isolation bridges. Concerning the latter, an isolation bridge may, for instance, have one or more electrically conductive devices not electrically connected to one or two of the two electrically conductive devices that have the isolation bridge therebetween, which is made possible by arranging a gap between the electrically conductive devices. Then, upon arranging lumped components in the gap or gaps, the isolation bridge becomes electrically connected with the two electrically conductive devices.

[0066] The selective enablement of isolation bridges is particularly convenient for providing a configurable apparatus. Depending, for example, on the wireless connectivity that is sought from the apparatus, and / or radioelectric performance of a device where the apparatus is to be arranged, isolation bridges may be convenient for improving the operation in the wireless connectivity and, thus, they may be enabled with lumped components; when the isolation bridges are unnecessary to that end, they remain disconnected.

[0067] In some embodiments, some or all electrically conductive devices of the plurality of electrically conductive devices each has a regular polygon shape or a circular shape.

[0068] In some embodiments, some or all electrically conductive devices of the plurality of electrically conductive devices have the same shape.

[0069] Regularly- and / or same-shaped conductive devices makes the manufacturing of the apparatus and the arrangement of the apparatus in a device more-cost effective.

[0070] Another aspect of the present disclosure relates to a device. The device comprises: at least one dielectric substrate comprising a ground plane in the form of at least one electrically conductive layer; and an apparatus as described in the previous aspect, which is arranged on the at least one dielectric substrate.

[0071] The device has wireless connectivity in at least one frequency band owing to the apparatus. The device has one, two, three, four or more ports for connection of, e.g., at least one wireless communications module. In this sense, in some embodiments, the device further comprises a wireless communications module configured to provide electrical signals for radiation in the form of electromagnetic waves and / or configured to receive electrical signals from capturing electromagnetic waves.

[0072] In some embodiments, the device also comprises at least one matching network electrically connected with one or more electrically conductive devices of the plurality of electrically conductive devices of the apparatus.

[0073] The at least one matching network provides matching impedance in at least one frequency band of the wireless connectivity of the device. The at least one matching network is arranged on the at least one dielectric substrate. The at least one matching network comprises any one of one or more passive components and / or one or more active components. Passive components may be, for example, one or more of: lumped components, passive filters, transmission lines, feeding lines, etc. Active components may be, for example, one or more of: a system-in-package (as, for example, the system-in-package described later in this disclosure), active filters, digitally tunable capacitors, switches, etc.

[0074] In some embodiments, some electrically conductive devices of the plurality of electrically conductive devices are electrically connected, thereby forming at least one assembly of electrically conductive devices connected together.

[0075] The connection or connections between conductive devices comprise one or more of: via holes, electrically conductive traces, electrically conductive strands, lumped components, transmission lines, systems in package, or combinations thereof. Lumped components comprise, for example but without limitation, resistors including zero-ohm resistors, capacitors, inductors, combinations thereof, etc. The connection or connections may be solely in or on the at least one dielectric substrate, in or on the apparatus itself, or both, i.e. , in or on the at least one dielectric substrate and in or on the apparatus itself.

[0076] In some embodiments, one or more assemblies of the at least one assembly form at least one non-resonant electrically conductive element. In some embodiments, two or more assemblies of the at least one assembly form a non-resonant electrically conductive element.

[0077] A non-resonant electrically conductive element comprises, for example, a radiation booster configured to couple a majority of electrical energy for radiation into the ground plane. The non-resonant electrically conductive element is tuned to at least one frequency band of the wireless connectivity by way of at least one matching network that provides the matching impedance in such at least one frequency band.

[0078] The non-resonant electrically conductive element has a physical length and / or an electrical length that is shorter than a longest wavelength of a frequency band of the at least one frequency band of the wireless connectivity, or a longest wavelength of a frequency band associated with the respective non-resonant electrically conductive element, divided by 8. In some cases, said physical length and / or an electrical length is shorter than any such longest wavelength divided by 10. In some cases, said physical length and / or an electrical length is shorter than any such longest wavelength divided by 15 and, optionally, divided by 20.

[0079] In some embodiments, one or more assemblies of the at least one assembly form at least one radiating element. In some embodiments, two or more assemblies of the at least one assembly form a respective radiating element. The radiating element is, in some embodiments, tuned to at least one frequency band of the wireless connectivity by way of at least one matching network that provides the matching impedance in such at least one frequency band. In some other embodiments, the radiating element is already tuned to the at least one frequency band, thus a matching network may or may not be provided and connected to the radiating element.

[0080] The radiating element has a physical length and / or an electrical length that is equal to or longer than a longest wavelength of a frequency band of the at least one frequency band of the wireless connectivity, or a longest wavelength of a frequency band associated with the radiating element, divided by 8. In some cases, said physical length and / or an electrical length is equal to or greater than any such longest wavelength divided by 4.

[0081] In some embodiments, one or more assemblies of the at least one assembly has a combined length and / or an electrical length that are / is: less than 50 mm; and / or less than a longest wavelength of a frequency band of the at least one frequency band divided by 5, said frequency band being associated with the respective assembly; wherein the combined length is measured as the length of the respective electrically conductive devices and the gaps between said devices along the second direction. In some embodiments, the combined length and / or the electrical length are / is: less than 35 mm; and / or less than the longest wavelength of the frequency band associated with the respective assembly divided by 10.

[0082] Even though the apparatus and the device make it possible to form assemblies that are long in combined length and / or electrical length, the wireless connectivity is attainable without requiring the provision of any such length that is comparable to a wavelength of operation. Namely, the assembly or assemblies are non-resonant for the frequency band or bands of operation.

[0083] In some embodiments, the at least one matching network comprises two or more matching networks. In some embodiments, each matching network of the two or more matching networks is electrically connected with different one or more electrically conductive devices of the plurality of electrically conductive devices.

[0084] Multiple matching networks may be provided for impedance matching the apparatus in one, two or more ports. Each matching network may be connected with a single conductive device or a combination of conductive devices that forms an assembly, thereby impedance matching the respective conductive device or assembly.

[0085] In some embodiments, the device further comprises one or more isolation bridges. Each isolation bridge of the one or more isolations bridges is arranged between two electrically conductive pads of the plurality of electrically conductive pads. In addition to, or alternative to, the provision of isolation bridges in the apparatus, the device comprises one or more isolation bridges for improving the wireless connectivity of the device by increasing an isolation bandwidth.

[0086] The provision of isolation bridges in the device and / or the apparatus depends, in some cases, on the manufacturability and ease of configuration of the device and the apparatus. Therefore, the device can be configured for providing isolation bandwidth regardless of the possible configuration of the apparatus to that end. Sometimes, it is more cost-effective to manufacture the apparatus without isolation bridges, and provide isolation bridges in the device as part of the manufacturing of, e.g., the at least one dielectric substrate with the ground plane.

[0087] In some embodiments, each isolation bridge of the one or more isolation bridge is configured for isolation at a respective isolation bandwidth.

[0088] In some embodiments, one, some or all isolation bridges of the one or more isolation bridges devices comprise at least one electrically conductive trace.

[0089] In some embodiments, one, some or all isolation bridges of the one or more isolation bridges comprises a capacitance.

[0090] In some embodiments, one, some or all isolation bridges of the one or more isolation bridges comprises an inductance.

[0091] In some embodiments, one, some or all isolation bridges of the one or more isolation bridges devices comprise one or more lumped components.

[0092] In some embodiments, the device only has wireless connectivity according to the wireless connectivity provided by the apparatus and, optionally, the at least one matching network.

[0093] The apparatus enables the device to have multiband operation (or single-band operation in cases in which only a particular frequency band is of interest) in a compact manner that occupies limited surface and volume of the device. Accordingly, in many cases, the device does not require the provision of any further apparatus or antenna that provides wireless connectivity, and the complete wireless connectivity of the device is provided by the apparatus together with the ground plane and, in some cases, the at least one matching network.

[0094] In some embodiments, the device further comprises at least one system-in-package electrically connected with at least one electrically conductive device of the plurality of electrically conductive devices and / or the at least one matching network.

[0095] The system-in-package comprises one or more passive components, such as, for example, but without limitation, inductors, capacitors, etc., and one or more active components that allow dynamic reconfiguration, such as, for example, a switch (e.g., singlepole multiple-throw), a digitally tunable capacitor, etc.

[0096] The system-in-package provides impedance matching in at least one frequency band of the wireless connectivity of the device and / or selectively connects a conductive device or an assembly of an apparatus to one or more matching networks of the at least one matching network.

[0097] In some embodiments, the device is a wireless device and / or a handheld device. For example, but without limitation, the device is a mobile phone, a tablet device, a laptop, a personal computer, a goods tracker, a consumer electronics device, an alarm or security device, a motor vehicle, an electric vehicle, a lamp, etc.

[0098] In some cases, the device has a cable for intermittent or continuous electric powering thereof. For example, but without limitation, an appliance such as a TV, a fridge, a lamp, etc.

[0099] Another aspect of the present disclosure relates to a method that is suitable for manufacturing or providing an apparatus, such as, for example, an apparatus as described in a previous aspect of the disclosure. The method comprises arranging a dielectric substrate and arranging a plurality of electrically conductive devices on the dielectric substrate.

[0100] The plurality of electrically conductive devices is arranged to provide: at least two rows of electrically conductive devices, the at least two rows being apart along a first direction, each row of the at least two rows comprising a respective subset of electrically conductive devices of the plurality of electrically conductive devices, each row of the at least two rows having a length extending along a second direction, the first and second directions not being parallel to each other, and each subset of electrically conductive devices comprising three or more electrically conductive devices spaced apart one another along the second direction.

[0101] In some embodiments, arranging the plurality of electrically conductive devices comprises depositing electrically conductive material in portions of the dielectric substrate. In some embodiments, arranging the dielectric substrate comprises drilling the dielectric substrate.

[0102] The apparatus is manufacturable using manufacturing known in the art such as conductive layer deposition on a dielectric substrate.

[0103] In some embodiments, the manufactured apparatus is an apparatus as described in a previous aspect of the present disclosure.

[0104] Another aspect of the present disclosure relates to a method that is suitable for manufacturing or providing a device, such as, for example, a device as described in a previous aspect of the disclosure. The method comprises arranging at least one dielectric substrate comprising a ground plane in the form of at least one electrically conductive layer to provide the device, and arranging an apparatus like, for example, an apparatus as described in a previous aspect of the disclosure or an apparatus manufactured with a method as described in a previous aspect of the disclosure. The apparatus is arranged on the at least one dielectric substrate.

[0105] In some embodiments, the method comprises arranging at least one matching network on the at least one dielectric substrate; and electrically connected the at least one matching network with one or more electrically conductive devices of the plurality of electrically conductive devices of the apparatus, the at least one matching network providing matching impedance in at least one frequency band of a wireless connectivity.

[0106] In some embodiments, the device is a device as described in a previous aspect of the disclosure.

[0107] BRIEF DESCRIPTION OF THE DRAWINGS

[0108] To complete the description and in order to provide for a better understanding of the disclosure, a set of drawings is provided. Said drawings form an integral part of the description and illustrate embodiments of the disclosure, which should not be interpreted as restricting the scope of the disclosure, but just as examples of how the disclosure can be carried out. The drawings comprise the following figures:

[0109] Figures 1A and 1 B show an apparatus in accordance with some embodiments.

[0110] Figure 2 shows an apparatus in accordance with some embodiments.

[0111] Figure 3 shows an apparatus in accordance with some embodiments.

[0112] Figure 4 shows an apparatus in accordance with some embodiments.

[0113] Figure 5 shows an apparatus in accordance with some embodiments.

[0114] Figures 6A and 6B show an apparatus in accordance with some embodiments.

[0115] Figure 7 shows an apparatus in accordance with some embodiments.

[0116] Figure 8 shows an apparatus in accordance with some embodiments.

[0117] Figure 9 shows part of a device in accordance with some embodiments.

[0118] Figure 10 shows part of a device in accordance with some embodiments.

[0119] Figure 11 shows part of a device in accordance with some embodiments.

[0120] Figure 12 shows part of a device in accordance with some embodiments.

[0121] Figure 13 shows a matching network of a device in accordance with some embodiments.

[0122] Figure 14 shows a matching network of a device in accordance with some embodiments. Figure 15 shows a reflection coefficient attained by a device in accordance with some embodiments.

[0123] Figure 16 shows total efficiency attained by a device in accordance with some embodiments.

[0124] Figure 17 shows part of a device in accordance with some embodiments.

[0125] Figure 18 shows part of a device in accordance with some embodiments.

[0126] Figure 19 shows an apparatus in accordance with some embodiments.

[0127] DETAILED DESCRIPTION

[0128] Figures 1A and 1 B show an apparatus 10 in accordance with some embodiments.

[0129] The apparatus 10 includes a dielectric substrate 11 and a plurality of electrically conductive devices 12. The dielectric substrate is or comprises, for example, but without limitation, resin, plastic, fiberglass, epoxy resin, glass epoxy (e.g., FR4).

[0130] The conductive devices 12 are arranged forming rows of at least three conductive devices 12, with a length of the respective along a direction or axis. In the embodiments of Figures 1A and 1 B, the apparatus 10 has two rows of conductive devices 12 with a length along the X axis illustrated.

[0131] Conductive devices 12 are arrangeable inside and / or on the outside of the at least one dielectric substrate 11. When at least a portion of a conductive device 12 is arranged on the outside of the substrate 11 , at least said portion can come into direct contact with electrically conductive elements, such as, e.g., elements that may be part of the apparatus 10 or a device incorporating the apparatus 10. For example, electrical connection pads, via holes, lumped components, etc.

[0132] In embodiments such as those of Figures 1 A and 1 B, the conductive devices 12 are electrically conductive blocks. In some other embodiments, the conductive devices 12 are electrically conductive layers. In yet some other embodiments, the plurality of conductive devices 12 includes a combination of conductive blocks and conductive layers.

[0133] The apparatus 10 features a length 21 along a length axis, which in these embodiments is along the X axis, a width 22 along a width axis that is perpendicular to the length axis, and a thickness or height 23 along a height axis that is perpendicular to both the length and the width axes. In these examples, the width 22 is along the Y axis illustrated, and the thickness or height 23 is along the Z axis illustrated whereas, in other examples, it is the other way around, the width along the Z axis illustrated and the thickness or height is along the Y axis illustrated. In some embodiments, the thickness or height 23 corresponds to the minimum dimension of the three dimensions (i.e., length 21 , width 22 and height 23), thus, in these examples, along the Z axis illustrated. The length 21 of the apparatus 10 divided by the width 22 thereof is, in some cases, between 2.00 and 5.00 and, in yet some cases, between 3.00 and 4.00. The length 21 of the apparatus 10 divided by the thickness 23 thereof is equal to or greater than 20.00 and, in some cases, equal to or greater than 40.00.

[0134] An inter-row gap 25 is defined by a minimum distance measurable between points of conductive devices 12 of different rows. In some embodiments, the apparatus 10 has a single inter-row gap 25, in which case the inter-row gap 25 is constant whereas, in some other embodiments, there are two or more inter-row gaps.

[0135] Also, an intra-row gap 26 is defined by a minimum distance measurable between points of adjacent conductive devices 12 of a same row. In some embodiments, the apparatus 10 has a single intra-row gap 26, in which case the intra-row gap 26 constant whereas, in some other embodiments, there are two or more inter-row gaps. Concerning the latter, multiple inter-row gaps 26 may exist within a same row and / or in different rows (namely, there is one or intra-row gaps in one row and one or more other intra-row gaps in at least one other row). The inter-row gap(s) 25 and the intra-row gap(s) 26 are defined in respect of axes that are not parallel; in some cases, the respective axes are perpendicular axes, and in some other cases, the respective axes are not perpendicular.

[0136] In some embodiments, the apparatus 10 features one or more symmetry planes 17, 18, 19. In the examples of Figures 1A and 1 B, the apparatus 10 has symmetry with respect to three perpendicular symmetry planes: a first symmetry plane 17 having the Y axis illustrated as normal vector, a second symmetry plane 18 having the X axis illustrated as normal vector and a third symmetry plane 19 having the Z axis illustrated as normal vector.

[0137] Although a particular set of X, Y and Z axes have been illustrated throughout the different Figures for the sake of clarity only, it will be noted that other sets of axes are possible as well without departing from the scope of the present disclosure.

[0138] Figure 2 shows an apparatus 10 in accordance with some embodiments.

[0139] The apparatus 10 has the dielectric substrate 11 and the plurality of electrically conductive devices 12. In these cases, the number of rows is three, and each has three conductive devices 12. Although not illustrated, the apparatus 10 has at least first and second symmetry planes as described with reference to the embodiments of Figures 1A and 1 B; it will be noted, however, that in some other embodiments there are fewer or no symmetry planes. Depending on the arrangement of the conductive devices 12, the apparatus 10 may also feature a third symmetry plane with a normal vector according to the Z axis illustrated.

[0140] Superimposed on the apparatus 10 is shown, for the sake of clarity only, contours (illustrated with dashed border for the sake of the illustration only) representing an example of assemblies 30a, 30b, 30c of conductive devices 12 that may be formed to provide wireless connectivity. For instance, a first assembly 30a with the three conductive devices 12 of the top row, a second assembly 30b with two conductive devices 12 of the medium and bottom rows, and a third assembly 30c with two conductive devices 12 of the medium and bottom rows. Each assembly 30a, 30b, 30c features a respective combined length 31 , which comprises the measured length of the respective conductive devices 12 in a straight line along an intra-row axis (in these examples, along the X axis illustrated) and the gap or gaps along an intra-row axis. Each assembly 30a, 30b, 30c also features a respective combined width 31 , which comprises the measured width of the respective conductive devices 12 in a straight line along an inter-row axis (in these examples, along the Y axis illustrated) and the gap or gaps, if any, along an inter-row axis.

[0141] To provide such assemblies 30a, 30b, 30c, one or more electrically conductive elements (not shown) are to be arranged for interconnecting respective conductive devices 12. The conductive elements may be arranged on the apparatus 10 itself, on a device that receives the apparatus 10, or a combination thereof.

[0142] Depending on, e.g., a location of the assemblies 30a, 30b, 30c in respect of, e.g., a ground plane of the device, the number and arrangement of the conductive devices 12 of the respective assembly, the frequency band or bands of interest that the respective assembly shall provide wireless connectivity for, and / or matching networks electrically connected thereto, the apparatus 10 provides wireless connectivity in one or several frequency bands with variable reflection coefficient and total efficiency.

[0143] A device manufacturer, or personnel responsible for providing a device with wireless connectivity, has flexibility to decide which assemblies to form, how they are to be interconnected, and what frequency band or bands they are to operate in to configure the device and optimize the radioelectric performance enabled by the apparatus 10.

[0144] Figure 3 shows an apparatus 10 in accordance with some embodiments.

[0145] The plurality of conductive devices 12 of the apparatus 12 includes conductive devices 12 with different aspect ratios. In these particular examples, the conductive devices 12 of the medium row are shorter and wider than the conductive devices 12 of the top and bottom rows. In some other examples, additionally or alternatively, the conductive devices 12 feature different shapes.

[0146] Due to these conductive devices 12, the apparatus 10 features at least a first intra- row gap 26a and a second intra-row gap 26b.

[0147] Figure 4 shows an apparatus 10 in accordance with some embodiments.

[0148] The apparatus 10 has a plurality of conductive devices 12a, 12b on the dielectric substrate 11 such that at least some conductive devices 12a, 12b are formed by a plurality of conductive elements. In particular, two rows of conductive devices 12a, 12b are provided with electrically conductive portions, e.g., a conductive layer 12a, on a first side of the dielectric substrate 11 . Four conductive devices 12a, 12b of each row also have electrically conductive portions, e.g., another conductive layer 12b, on a second side of the dielectric substrate 11 .

[0149] In some cases, further electrically conductive layers are arranged. For example, the conductive layers may be arranged inside the dielectric substrate 11 , on the outside of the dielectric substrate, or a combination thereof. Different conductive layers 12a, 12b of a same conductive device couple currents flowing therein by proximity or by means of a direct electrical connection, such as, with lumped components, via holes, conductive strands, etc. In some other examples, the conductive layers 12a, 12b are not electrically connected nor close enough to sufficiently couple currents from one layer to the other, thereby providing a conductive device each.

[0150] Although in these examples only some conductive devices 12a, 12b have two conductive layers, in other examples, fewer, more or all conductive devices have two or more conductive portions 12a, 12b.

[0151] Figure 5 shows an apparatus 10 in accordance with some embodiments.

[0152] The apparatus 10 has two rows of electrically conductive devices 12 arranged in or on the dielectric substrate 11 forming two rows.

[0153] The number of conductive devices 12 in one row is different of the number of conductive devices 12 in the other row.

[0154] Further, in these examples, the conductive devices 12 of a first row of the at least two rows is arranged staggered with respect to the conductive devices 12 of another row of the at least two rows. Particularly, all conductive devices 12 in, e.g., the bottom row, are offset with respect to all conductive devices 12 in, e.g., the top row, by an offset distance 29. In some other embodiments, only a subset of conductive devices 12 of one or more rows is offset with respect to conductive devices 12 in other rows.

[0155] The offset distance may be constant, i.e. , all offset conductive devices 12 are offset by the same length, or not, i.e., at least one offset conductive devices 12 is offset by at least a first offset distance that is different than a second offset distance that at least one other offset conductive device 12 is offset.

[0156] Figures 6A and 6B show an apparatus 10 in accordance with some embodiments.

[0157] The apparatus 10 includes two rows with, e.g., ten conductive devices 12 each on the dielectric substrate 11. In these embodiments, an inter-row gap (along the Y axis illustrated) is constant and larger than the intra-row gap (along the X axis illustrated), which is constant as well. In these examples, the inter-row gap is at least 0.5 times the width (along the Y axis illustrated) of the conductive devices 12. In some examples, the inter-row gap is 1.0 times the width of the conductive devices 12, whereas in some other examples the inter-row gap is 2.0 times and / or 2.5 times the width of the conductive devices 12. Also, in these examples, the intra-row gap is less than the length (along the X axis illustrated) of the conductive devices 12.

[0158] In these examples, the apparatus 10 has conductive devices 12 on one side of the dielectric substrate 11 . By contrast, in some other examples such as those of Figure 7 that shows an apparatus 10 in accordance with some embodiments, the apparatus 12 has conductive devices with at least two portions 12a, 12b in or on the dielectric substrate 11 , in particular on opposite sides.

[0159] Concerning Figure 7, as best seen in a zoomed-in view, each pair of portions (each in the form of a respective conductive layer 12a, 12b) forming a conductive device is connected together by way of at least one electrically conductive element. In these examples, the at least one electrically conductive element comprises two via holes.

[0160] The pair of portions 12a, 12b is apart from the other, along the Z axis illustrated, by a gap 27. Preferably, said gap is less than a minimum size of conductive devices 12a, 12b along the inter-row and / or the intra-row directions.

[0161] Moreover, in the examples of Figure 7, the apparatus 10 has at least three symmetry planes, one with normal vector according to the axis X illustrated, another one with normal vector according to the axis Y illustrated and another one with normal vector according to the axis Z illustrated.

[0162] Figure 8 shows an apparatus 10 in accordance with some embodiments.

[0163] In addition to the conductive devices 12 of the apparatus 10, Figure 8 illustrates a means for interconnecting several conductive devices 12 together to form a respective assembly 30a, 30b. In these examples, said means comprises an electrically conductive element 50, for example, one or more lumped components, an electrically conductive trace of, e.g., tin, that cascades some conductive devices 12.

[0164] By way of example, a first assembly 30a with nine conductive devices 12 may provide wireless connectivity in cellular frequency bands such as, for example, but without limitation, bands in a frequency range between 617 MHz and 960 MHz, and in a frequency range between 1710 MHz and 2200 MHz; a second assembly 30b with five conductive devices 12 may provide wireless connectivity in GNSS frequency bands such as, for example, but without limitation, bands in a frequency range between 1566 and 1606 MHz; and a separate conductive device 12 like, for example, the device 12 in the bottom-right corner, provide wireless connectivity in local area networks frequency bands such as, for example, but without limitation, bands in a frequency range between 2400 and 2485 MHz. Although the apparatuses 10 of all the previous examples have been shown with some conductive devices 12 arranged adjacent to some edges of the dielectric substrate 11 , it will be noted that such arrangement is not required and other arrangements are possible within the scope of the present disclosure, including arrangement in which fewer or no conductive devices 12 are arranged adjacent to an edge of the dielectric substrate 11. Likewise, although the dielectric substrate 11 of the apparatuses 10 of all the previous examples have been shown as having a rectangular footprint, it will be noted that the dielectric substrate may have other shapes and volumes as well, including non-regular polygonal shapes.

[0165] Figure 9 shows part of a device 70 in accordance with some embodiments.

[0166] The device 70 includes at least one dielectric substrate 71 with at least a ground plane 72 owing to one or more electrically conductive layers. A plurality of connection pads 73 are also arranged on the at least one dielectric substrate 71 to receive, for example, an apparatus (not illustrated) of the device, such as an apparatus, according to the present disclosure and, optionally, a system-in-package. The at least one dielectric substrate 71 is, in some examples, a printed circuit board.

[0167] One or some connection pads 73 may include feeding lines or transmission lines 74 for electrically connecting particular conductive devices of apparatus or system-in-package with circuitry of the device 70, such as, for example, pads 75 for arranging one or more of: a matching network, a wireless communications module, a receiver, a transmitter, a transceiver, a GNSS processor, etc. The feeding lines or transmission lines 74, if any, may be tailored to modify an impedance of the apparatus or system-in-package.

[0168] Although not illustrated, the connection pads 73 may be matched in size and shape to those of an apparatus to be received, or not. Concerning the latter, one or more connection pads 73 may be extended to cover several conductive devices of an apparatus to be received, or allow the insertion of electrically conductive elements such as, for example, lumped components for configuring the electrical connection of different conductive devices.

[0169] Although the illustrated device 70 has been represented with a rectangular dielectric substrate 70, a somewhat regularly-shaped ground plane 72, and a rectangular area free of ground plane 70 for receiving an apparatus, it will be noted that other shapes for any such components or areas are also possible within the scope of the present disclosure.

[0170] Figure 10 shows part of a device 70 in accordance with some embodiments.

[0171] The device 70 includes an apparatus 10 (a contour thereof shown with a dotted line for the sake of the illustration only) arranged on the at least one dielectric substrate 71 , with a partially represented ground plane 72. The device 70 also includes at least one matching network 80 next to connection pads 73 for the apparatus 10; in this case, three matching networks 80 have been illustrated adjacent to feeding lines or transmission lines 74.

[0172] The device 70 also includes, in this case on the at least one dielectric substrate 71 , multiple electrically conductive elements 76 for interconnection of connection pads 73 and, thus, for interconnection of conductive devices of the apparatus 10. The electrically conductive elements 76 comprise, for example, conductive layers that form connection traces.

[0173] In these examples, for instance a first assembly 30a of conductive devices of the apparatus 10 is provided for wireless connectivity in some frequency bands of operation, a second assembly 30b of other conductive devices of the apparatus 10 is provided for wireless connectivity in some frequency bands of operation, and one or more other conductive devices of the apparatus 10 are usable for provision of wireless connectivity in some frequency bands of operation.

[0174] By way of example, the first assembly 30a may provide wireless connectivity in frequency bands with a minimum frequency that is lower than the minimum frequency of frequency bands of wireless connectivity provided by the second assembly 30b owing to the longer combined length and / or electrical length of the first assembly 30a. Likewise, by way of example, the second assembly 30b may provide wireless connectivity in frequency bands with a minimum frequency that is lower than the minimum frequency of frequency bands of wireless connectivity provided by a conductive device of the apparatus 10 owing to the longer combined length and / or electrical length of the second assembly 30b.

[0175] Figure 11 shows part of a device 70 in accordance with some embodiments.

[0176] The connection pads 73 of the device 70 have a shape different than the connection pads 73 of the device 70 of Figure 11 , which is a possible adaptation of the device 70 to the particular conductive devices of the apparatus 10.

[0177] Electrically conductive elements 76 are arranged forming one or more assemblies 30a, 30b, not necessarily connecting conductive devices of a single row but also from different rows.

[0178] Figure 12 shows part of a device 70 in accordance with some embodiments.

[0179] Connection pads 73 of the device 70 have been illustrated for the sake of clarity only. The device 70 includes an apparatus 10 that is arranged on a subset of the connection pads 73, and a system-in-package 90 (a contour thereof shown with a dashed line for the sake of the illustration only) of the device 70 that is arranged on another subset of the connection pads 73.

[0180] Electrically conductive elements 76 are arranged forming one or more assemblies 30a, 30b, not necessarily connecting conductive devices of a single row but also from different rows.

[0181] Figure 13 shows a matching network 80 of a device in accordance with some embodiments.

[0182] The matching network 80 is suitable, for example, for providing impedance matching to the first assembly 30a in a device 70 such as that illustrated in Figure 10.

[0183] The matching network 80 has a first connection end 81a, connected or connectable with the first assembly 30a, for example through a feeding line, and a second connection end 81 b, connected or connectable with, e.g., a wireless communications module configured for cellular networks communications.

[0184] The matching network 80 has a first shunt component 82a such as, e.g., a capacitor of 6.7 pF, a series component 82b such as, e.g., an inductor of 2.2 nH, and a second shunt component 82c such as, e.g., a capacitor of 7.1 pF.

[0185] Figure 14 shows a matching network 80 of a device in accordance with some embodiments.

[0186] The matching network 80 is suitable, for example, for providing impedance matching to a single conductive device of an apparatus in a device 70 such as that illustrated in Figure 10.

[0187] The matching network 80 has a first connection end 81a, connected or connectable with the conductive device, for example through a feeding line, and a second connection end 81 b, connected or connectable with, e.g., a wireless communications module configured for local area networks communications.

[0188] The matching network 80 has a series component 82a such as, e.g., a capacitor of 3.2 pF and a shunt component 82b such as, e.g., an inductor of 4.3 nH.

[0189] Figure 15 shows a reflection coefficient attained by a device in accordance with some embodiments.

[0190] The reflection coefficient may be attained, for example, by a device 70 such as that illustrated in Figure 10.

[0191] As it can be seen, the device 70 has wireless connectivity in at least three frequency ranges of interest. A first frequency range at least spans between 790 MHz and 960 MHz, which features a reflection coefficient below -8 dB; a second frequency range at least spans between 1560 MHz and 1610 MHz, which features a reflection coefficient below -10 dB; and a third frequency range at least spans between 2400 MHz and 2485 MHz, which features a reflection coefficient below -8 dB.

[0192] Figure 16 shows total efficiency attained by a device in accordance with some embodiments.

[0193] The total efficiency may be attained, for example, by a device 70 such as that illustrated in Figure 10.

[0194] As can be seen, the device 70 has wireless connectivity in at least three frequency ranges of interest. A first frequency range at least spans between 790 MHz and 960 MHz, which features a total efficiency above 45%; a second frequency range at least spans between 1560 MHz and 1610 MHz, which features a total efficiency above 80%; and a third frequency range at least spans between 2400 MHz and 2485 MHz, which features a total efficiency above 75%.

[0195] Figure 17 shows part of a device 70 in accordance with some embodiments.

[0196] The part of the device 70 illustrated in Figure 17 is that where an apparatus according to the present disclosure is arranged in some embodiments. In particular, the device 70 of Figure 17 comprises the at least one dielectric substrate 71 with a plurality of electrically conductive pads 73, which in this example has two rows along the axis X illustrated that are apart along the axis Y illustrated, with each row having five electrically conductive pads 73.

[0197] The device 70 comprises at least one isolation bridge 77 arranged between an electrically conductive pad 73 of a first row and an electrically conductive pad 73 of a second row. In this example, the isolation bridge 77 is arranged between electrically conductive pads 73 particularly between the closest (i.e., neighboring) pads 73 of the different rows, whereas in some other examples the isolation bridge 77 is arranged between electrically conductive pads 73 not being the closest pads 73 of the different rows (such as one of the isolation bridges of the embodiment of Figure 18).

[0198] In this example, the at least one isolation bridge 77 provides a capacitive isolation bridge by way of two electrically conductive traces, with each electrically conductive trace stemming from a respective pad 73. The at least one isolation bridge 77 comprises a capacitance; a gap between the electrically conductive traces provides the capacitive effect of the isolation bridge 77. In some embodiments, a lumped component may be arranged to connect both electrically conductive traces.

[0199] Upon arranging an apparatus according to the present disclosure on the device 70 such that at least some electrically conductive devices of the apparatus are electrically connected with at least some electrically conductive pads 73 on the at least one dielectric substrate 71 , currents flowing in the apparatus may be influenced by the at least one isolation bridge 77, thereby influencing the wireless connectivity and bandwidths thereof.

[0200] Figure 18 shows part of a device 70 in accordance with some embodiments.

[0201] Like in Figure 17, Figure 18 shows the part of the device 70 where an apparatus according to the present disclosure is arranged in some embodiments.

[0202] In this example, the device 70 comprises two isolation bridges 77. Each isolation bridge 77 comprises a respective electrically conductive trace that connects two electrically conductive pads 73 of the device 70.

[0203] A first isolation bridge 77, which is closest to the left side, is arranged between two neighboring pads 73 of two different rows.

[0204] A second isolation bridge 77, which is closest to the right side, is arranged between two pads 73 of two different rows that are not neighboring. In particular, the second isolation bridge 77 is arranged between a fourth electrically conductive pad 73 (counted following a positive direction of the X axis illustrated) of a first row (counted following a positive direction of the Y axis illustrated), and a third electrically conductive pad 73 of a second row.

[0205] The first and second isolation bridges 77 are, for example, inductive isolation bridges, i.e. , the isolation bridges 77 comprises an inductance. As it can be seen, isolation bridges 77 may have one or multiple segments.

[0206] Isolation bridges may have openings, like the isolation bridge 77 illustrated with reference to the embodiments of Figure 17, and / or be continuous with no openings, like the isolation bridges 77 illustrated with reference to the embodiments of Figure 18.

[0207] It will be noted that the isolation bridges 77 illustrated with reference to the embodiments of Figures 17 and 18 are examples of isolation bridges 77 possibles within devices 70. Accordingly, combinations of isolation bridges like those illustrated with reference to the embodiments of Figures 17 and 18 may be combined in some other embodiments.

[0208] In some embodiments other than those of Figures 17 and 18, the plurality of electrically conductive pads 73 comprises more pads (e.g., eight pads, ten pads, twelve pads, fourteen pads, etc.) per row, and / or more rows (e.g., three rows, four rows, etc.). Notwithstanding, in those embodiments, one or more isolation bridges 77 as shown, for example, with reference to the embodiments of Figures 17 and 18 may likewise be arranged, between neighboring electrically conductive pads 13 and / or non-neighboring electrically conductive pads 13.

[0209] Figure 19 shows an apparatus 10 in accordance with some embodiments.

[0210] The apparatus 10 comprises the at least one dielectric substrate 11 and the plurality of electrically conductive elements 12.

[0211] The apparatus 10 also comprises at least one isolation bridge 14, which comprises at least one electrically conductive device. Each isolation bridge 14 is arranged between two electrically conductive devices 12. The two conductive devices 12 may be neighboring electrically conductive devices 12 of different rows, like the left-most isolation bridge 14, and / or non-neighboring electrically conductive devices 12 of different rows, like the rightmost isolation bridge 14. In this example, each isolation bridge 14 illustrated has at least one gap 16 with respect to one or both electrically conductive devices 12, and / or between two portions of an isolation bridge 14, which forms at least two electrically conductive devices like the left-most isolation bridge 14. In some other examples, one or more isolation bridges do not have any gap with respect to one or both electrically conductive devices and / or there are no two portions of an isolation bridge, like with the isolation bridges 77 of a device illustrated with reference to embodiments of Figures 17 and 18.

[0212] The gap 16 or gaps may be provided for capacitive behavior, or for allowing arrangement of one or more components, such as lumped components. The one or more components may enable the function of the respective isolation bridge 14 or tune a behavior of the isolation bridge 14 in terms of phase or impedance.

[0213] As it can be seen, isolation bridges 14 may have one or multiple segments.

[0214] In this text, the terms first, second, third, etc. have been used herein to describe several devices, elements or parameters, it will be understood that the devices, elements or parameters should not be limited by these terms since the terms are only used to distinguish one device, element or parameter from another. For example, the first direction could as well be named second direction, and the second direction could be named first direction without departing from the scope of this disclosure.

[0215] In this text, the term “includes”, “comprises” and derivations thereof (such as “including”, “comprising”, etc.) should not be understood in an excluding sense, that is, these terms should not be interpreted as excluding the possibility that what is described and defined may include further elements, steps, etc.

[0216] On the other hand, the disclosure is obviously not limited to the specific embodiment(s) described herein, but also encompasses any variations that may be considered by any person skilled in the art (for example, as regards the choice of materials, dimensions, components, configuration, etc.), within the general scope of the invention as defined in the claims.

Claims

26CLAIMS1. An apparatus for wireless connectivity, comprising: a dielectric substrate; and a plurality of electrically conductive devices; wherein the plurality of electrically conductive devices is arranged on the dielectric substrate such that: at least two rows of electrically conductive devices are formed, the at least two rows being apart along a first direction; each row of the at least two rows comprises a respective subset of electrically conductive devices of the plurality of electrically conductive devices; each row of the at least two rows has a length extending along a second direction, the first and second directions not being parallel to each other; and each subset of electrically conductive devices comprises three or more electrically conductive devices spaced apart one another along the second direction.

2. The apparatus of claim 1 , wherein a gap along the first direction between electrically conductive devices of neighboring rows of the at least two rows is greater than a gap along the second direction between electrically conductive devices of each respective subset of electrically conductive devices.

3. The apparatus of any one of the preceding claims, wherein the plurality of electrically conductive devices is arranged on the dielectric substrate such that the plurality of electrically conductive devices has a plane of symmetry with a normal vector being parallel to the first direction.

4. The apparatus of any one of the preceding claims, wherein the plurality of electrically conductive devices is arranged on the dielectric substrate such that the plurality of electrically conductive devices has a plane of symmetry with a normal vector being parallel to the second direction.

5. The apparatus of any one of the preceding claims, wherein the plurality of electrically conductive devices is arranged on the dielectric substrate such that the plurality of electrically conductive devices has a plane of symmetry with a normal vector that is perpendicular to both the first and the second directions.

6. The apparatus of any one of the preceding claims, wherein one, some or all electrically conductive devices of the plurality of electrically conductive devices comprises respective first and second electrically conductive layers, the first and second electrically conductive layers being arranged on the dielectric substrate forming a gap therebetween along a third direction that is perpendicular to both the first and second directions.

7. The apparatus of claim 6, further comprising at least one electrically conductive element; wherein each electrically conductive element of the at least one electrically conductive element is arranged between the first and second electrically conductive layers of the one, some or all electrically conductive devices for electrical connection thereof.

8. The apparatus of any one of the preceding claims, wherein the first and second directions are perpendicular one another.

9. The apparatus of any one of the preceding claims, wherein a gap along the first direction between electrically conductive devices of the plurality of electrically conductive devices is constant throughout a length of each row of the at least two rows, and a gap along the second direction between electrically conductive devices of the plurality of electrically conductive devices is constant throughout the length of each row of the at least two rows.

10. The apparatus of any one of the preceding claims, wherein some or all electrically conductive devices of the plurality of electrically conductive devices each has a regular polygon shape or a circular shape.

11. The apparatus of any one of the preceding claims, wherein some or all electrically conductive devices of the plurality of electrically conductive devices have the same shape.

12. The apparatus of any one of the preceding claims, wherein each subset of electrically conductive devices comprises six or more electrically conductive devices spaced apart one another along the second direction, and optionally each subset of electrically conductive devices comprises between eight and fourteen electrically conductive devices spaced apart one another along the second direction.

13. The apparatus of any one of the preceding claims, wherein a length of some or all electrically conductive devices of the plurality of electrically conductive devices is: less than 5.0 mm; and / orless than a longest wavelength of the wireless connectivity of the apparatus divided by 20; and / or less than a shortest wavelength of the wireless connectivity of the apparatus divided by 8.

14. The apparatus of any one of the preceding claims, wherein the at least two rows comprises two or three rows.

15. The apparatus of any one of the preceding claims, wherein the dielectric substrate is a parallelepiped with length, width and height dimensions, wherein the height is smaller than the length and the width, and wherein a ratio of the length divided by the width is equal to or greater than 2.00, preferably equal to or greater than 3.00.

16. The apparatus of any one of the preceding claims, wherein a subset of electrically conductive devices in a row of the at least two rows has the electrically conductive devices thereof offset along the second direction with respect to electrically conductive devices of a subset of electrically conductive devices of at least one other row of the at least two rows.

17. The apparatus of any one of the preceding claims, wherein a gap along the first direction is equal to or greater than 0.5 times a minimum size along the first direction of the plurality of electrically conductive devices.

18. The apparatus of the preceding claim, wherein the gap along the first direction is equal to or greater than 1.0, 1.5, 2.0, 2.5 and / or 3.0 times the minimum size along the first direction of the plurality of electrically conductive devices.

19. The apparatus of any one of the preceding claims, wherein the gap along the second direction is less than a minimum size along the second direction of the plurality of electrically conductive devices.

20. The apparatus of any one of the preceding claims, further comprising one or more isolation bridges, each isolation bridge of the one or more isolations bridges being arranged between two electrically conductive devices of the plurality of electrically conductive devices.21 . The apparatus of the preceding claim, wherein one, some or all isolation bridges of the29 one or more isolation bridges devices comprise at least one electrically conductive device.

22. The apparatus of any one of claims 20-21 , wherein one, some or all isolation bridges of the one or more isolation bridges devices comprise one or more lumped components.

23. A device comprising: at least one dielectric substrate comprising a ground plane in the form of at least one electrically conductive layer; the apparatus of any one of the preceding claims, the apparatus being arranged on the at least one dielectric substrate; and at least one matching network electrically connected with one or more electrically conductive devices of the plurality of electrically conductive devices of the apparatus, the at least one matching network providing matching impedance in at least one frequency band of a wireless connectivity and providing a respective port of the wireless connectivity, and the at least one matching network being arranged on the at least one dielectric substrate.

24. The device of the preceding claim, wherein some electrically conductive devices of the plurality of electrically conductive devices are electrically connected, thereby forming at least one assembly of electrically conductive devices connected together.

25. The device of the preceding claim, wherein one or more assemblies of the at least one assembly form at least one non-resonant electrically conductive element.

26. The device of any one of claims 24-25, wherein one or more assemblies of the at least one assembly form at least one radiating element.

27. The device of any one of claims 23-26, wherein one or more assemblies of the at least one assembly has a combined length and / or an electrical length that are / is: less than 50 mm; and / or less than a longest wavelength of a frequency band of the at least one frequency band divided by 5, said frequency band being associated with the respective assembly; wherein the combined length is measured as the length of the respective electrically conductive devices and gaps between said devices along the second direction.

28. The device of the preceding claim, wherein the combined length and / or the electrical length are / is:30 less than 35 mm; and / or less than the longest wavelength of the frequency band associated with the respective assembly divided by 10.

29. The device of any one of the preceding claims, wherein the at least one matching network comprises two or more matching networks, each matching network of the two or more matching networks being electrically connected with different one or more electrically conductive devices of the plurality of electrically conductive devices.

30. The device of any one of the preceding claims, further comprising a wireless communications module configured to provide electrical signals for radiation in the form of electromagnetic waves and / or configured to receive electrical signals from capturing electromagnetic waves.

31. The device of any one of the preceding claims, wherein the device only has wireless connectivity according to the wireless connectivity provided by the apparatus and the at least one matching network.

32. The device of any one of the preceding claims, further comprising at least one system- in-package electrically connected with at least one electrically conductive device of the plurality of electrically conductive devices and / or at least one matching network of the device, the at least one system-in-package comprising one or more passive components and one or more active components, and the at least one system-in-package being configured to provide impedance matching in at least one frequency band of the wireless connectivity of the device and / or selectively connect a conductive device or an assembly of the apparatus to one or more matching networks of the at least one matching network.

33. The device of any one of the preceding claims, wherein the at least one dielectric substrate of the device further comprises a plurality of electrically conductive pads, wherein the apparatus is arranged on at least some electrically conductive pads of the plurality of electrically conductive pads.

34. The device of the preceding claim, further comprising one or more isolation bridges, each isolation bridge of the one or more isolations bridges being arranged between two electrically conductive pads of the plurality of electrically conductive pads.3135. The device of the preceding claim, wherein one, some or all isolation bridges of the one or more isolation bridges devices comprise at least one electrically conductive trace.

36. A method comprising: arranging a dielectric substrate; arranging a plurality of electrically conductive devices on the dielectric substrate; and providing, with the arranged plurality of electrically conductive devices, at least two rows of electrically conductive devices, the at least two rows being apart along a first direction, each row of the at least two rows comprising a respective subset of electrically conductive devices of the plurality of electrically conductive devices, each row of the at least two rows having a length extending along a second direction, the first and second directions not being parallel to each other, and each subset of electrically conductive devices comprising three or more electrically conductive devices spaced apart one another along the second direction.

37. The method of the preceding claim, wherein arranging the plurality of electrically conductive devices comprises depositing an electrically conductive material in portions of the dielectric substrate.

38. The method of any one of the preceding claims, wherein the manufactured apparatus is an apparatus according to any one of claims 1-22.

39. A method comprising: arranging at least one dielectric substrate comprising a ground plane in the form of at least one electrically conductive layer to provide a device; and arranging an apparatus according to any one of claims 1-22 or an apparatus manufactured with a method according to any one of claims 36-38, wherein the apparatus is arranged on the at least one dielectric substrate.

40. The method of the preceding claim, further comprising: arranging at least one matching network on the at least one dielectric substrate; and electrically connecting the at least one matching network with one or more electrically conductive devices of the plurality of electrically conductive devices of the apparatus, the at least one matching network providing matching impedance in at least one frequency band of a wireless connectivity.3241 . The method of the preceding claim, wherein the device is a device according to any one of claims 23-35.

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