Capacitor and capacitor array

Abstract

The present disclosure addresses the problem of providing a capacitor in which capacitor characteristics are easily controlled. A capacitor (100) according to the present disclosure comprises: a first substrate (1); a second substrate (2); one or more laminated capacitor elements (3) disposed between the first substrate (1) and the second substrate (2); and an end surface connection part (4). The capacitor element (3) comprises an anode part (5), a cathode part (6), and a dielectric (7) disposed between the anode part (5) and the cathode part (6). At least one among the anode part (5) and the cathode part (6) has an electrode connection part (31) positioned on an outer peripheral end surface (30) of the capacitor element (3). The first substrate (1) has a wiring part (10). The wiring part (10) has a wiring connection part (101) positioned on an outer peripheral end surface (12) of the first substrate (1). The end surface connection part (4) is electrically connected to the electrode connection part (31) and the wiring connection part (101).

Description

Capacitor and Capacitor Array

[0001] The present disclosure relates to a capacitor and a capacitor array. More specifically, the present disclosure relates to a capacitor including a substrate and a capacitor element, and a capacitor array using this capacitor.

[0002] Patent Document 1 describes a capacitor component in which a capacitor element is sandwiched between a first and a second substrate. The first substrate has a first inner anode terminal and a first inner cathode terminal on the inner side, while having a first outer anode terminal and a first outer cathode terminal on the outer side. Each of the first inner anode terminal and the first inner cathode terminal is electrically connected to each of the first outer anode terminal and the first outer cathode terminal. The second substrate has a second inner anode terminal and a second inner cathode terminal on the inner side, while having a second outer anode terminal and a second outer cathode terminal on the outer side. Each of the second inner anode terminal and the second inner cathode terminal is electrically connected to each of the second outer anode terminal and the second outer cathode terminal. Each of the first inner anode terminal and the second inner anode terminal is electrically connected to the anode of the capacitor element. Each of the first inner cathode terminal and the second inner cathode terminal is electrically connected to the cathode of the capacitor element.

[0003] In a capacitor component such as that of Patent Document 1, it has been desired to control capacitor characteristics such as increased capacitance, low ESR, and low ESL.

[0004] Japanese Unexamined Patent Application Publication No. 2009-224679

[0005] An object of the present disclosure is to provide a capacitor and a capacitor array that are easy to control capacitor characteristics.

[0006] A capacitor according to one aspect of the present disclosure comprises a first substrate, a second substrate, one or more capacitor elements arranged between the first substrate and the second substrate, and an end face connection portion. The capacitor element comprises an anode portion, a cathode portion, and a dielectric disposed between the anode portion and the cathode portion. At least one of the anode portion and the cathode portion has an electrode connection portion located on the outer peripheral end face of the capacitor element. The first substrate has a wiring portion. The wiring portion has a wiring connection portion located on the outer peripheral end face of the first substrate. The end face connection portion is electrically connected to the electrode connection portion and the wiring connection portion.

[0007] A capacitor array according to one aspect of the present disclosure comprises a plurality of capacitors. The plurality of capacitors are electrically connected to each other at their end face connections and are arranged in a planar manner.

[0008] A capacitor array according to another aspect of the present disclosure comprises a first substrate, a second substrate, and one or more stacked capacitor elements disposed between the first substrate and the second substrate. Each capacitor element comprises an anode portion, a plurality of cathode division portions, and a dielectric disposed between the anode portion and the plurality of cathode division portions, thereby having a plurality of element division portions formed by each of the plurality of cathode division portions and the anode portion. The first substrate and the second substrate each have a cathode wiring portion. The cathode wiring portion has a plurality of cathode wiring division portions corresponding to each of the plurality of element division portions. The plurality of element division portions and the plurality of cathode wiring division portions corresponding to each of the plurality of element division portions are electrically connected.

[0009] A capacitor array according to another aspect of the present disclosure comprises a plurality of capacitor arrays, wherein the anode portions of the plurality of capacitor arrays are electrically connected to each other, and the plurality of cathode wiring division portions are electrically connected to each other.

[0010] Figure 1 is a schematic perspective view showing a capacitor according to Embodiment 1 of the present disclosure. Figure 2 is a schematic cross-sectional view showing a capacitor according to Embodiment 1 of the present disclosure. Figure 3 is a schematic exploded perspective view showing a capacitor according to Embodiment 1 of the present disclosure. Figure 4 is a schematic plan view showing capacitor elements used in a capacitor according to Embodiment 1 of the present disclosure. Figure 5 shows capacitor elements used in a capacitor according to Embodiment 1 of the present disclosure, and is a cross-sectional view taken along X-X in Figure 4. Figure 6 shows capacitor elements used in a capacitor according to Embodiment 1 of the present disclosure, and is a cross-sectional view taken along Y-Y in Figure 4. Figure 7 is a schematic cross-sectional view showing a first substrate and a second substrate used in a capacitor according to Embodiment 1 of the present disclosure. Figure 8 is a schematic plan view showing one main surface of the first substrate and the second substrate used in a capacitor according to Embodiment 1 of the present disclosure. Figure 9 is a schematic plan view showing the other main surface of the first substrate and the second substrate used in a capacitor according to Embodiment 1 of the present disclosure. Figure 10 is a schematic plan view showing a method for manufacturing a capacitor according to Embodiment 1 of the present disclosure. Figure 11 is a schematic plan view showing a laminate manufactured by the method for manufacturing a capacitor according to Embodiment 1 of the present disclosure. Figure 12 is a schematic cross-sectional view showing a laminate manufactured by the capacitor manufacturing method according to Embodiment 1 of the present disclosure. Figure 13 is a schematic perspective view showing the capacitor manufacturing method according to Embodiment 1 of the present disclosure. Figure 14 is a schematic perspective view showing the capacitor manufacturing method according to Embodiment 1 of the present disclosure. Figure 15 is a schematic plan view showing a modified capacitor element used in the capacitor according to Embodiment 1 of the present disclosure. Figure 16 is a schematic perspective view showing the metal foil of the capacitor element used in the capacitor according to Embodiment 1 of the present disclosure. Figure 17 is a schematic perspective view showing a modified capacitor according to Embodiment 1 of the present disclosure. Figure 18 is a schematic plan view showing the manufacturing process of a modified capacitor according to Embodiment 1 of the present disclosure. Figure 19 is a schematic plan view showing the manufacturing process of a modified capacitor according to Embodiment 1 of the present disclosure. Figure 20 is a schematic plan view showing the manufacturing process of a modified capacitor according to Embodiment 1 of the present disclosure. Figure 21 is a schematic plan view showing the manufacturing process of a modified capacitor according to Embodiment 1 of the present disclosure. Figure 22 is a schematic perspective view showing a modified capacitor element used in the capacitor according to Embodiment 1 of the present disclosure.Figure 23 is a schematic perspective view showing modified examples of the first and second substrates used in a capacitor according to Embodiment 1 of the present disclosure. Figure 24 is a schematic perspective view showing modified examples of the first and second substrates used in a capacitor according to Embodiment 1 of the present disclosure. Figure 25 is a schematic exploded perspective view showing modified examples of the capacitor according to Embodiment 1 of the present disclosure. Figure 26 is a schematic perspective view showing a plurality of capacitors in a capacitor array according to Embodiment 2 of the present disclosure. Figure 27 is a schematic perspective view showing a capacitor array according to Embodiment 2 of the present disclosure. Figure 28 is a schematic cross-sectional view showing the first and second substrates used in a capacitor according to Embodiment 3 of the present disclosure. Figure 29 is a schematic perspective view showing metal foil and capacitor elements used in a capacitor according to Embodiment 3 of the present disclosure. Figure 30 shows a capacitor according to Embodiment 3 of the present disclosure, and is a cross-sectional view taken along line A-A' in Figure 32. Figure 31 shows a capacitor according to Embodiment 3 of the present disclosure, and is a cross-sectional view taken along line B-B' in Figure 32. Figure 32 is a schematic plan view showing a capacitor according to Embodiment 3 of the present disclosure. Figure 33 shows a capacitor according to Embodiment 4 of the present disclosure, and is a cross-sectional view taken along line A-A' in Figure 34. Figure 34 is a schematic plan view showing a capacitor according to Embodiment 4 of the present disclosure. Figure 35 is a schematic perspective view showing a capacitor array according to Embodiment 5 of the present disclosure. Figure 36 is a schematic diagram showing a first substrate and a second substrate used in the capacitor array according to Embodiment 5 of the present disclosure.

[0011] 1. Overview In power supply modules and the like, the current consumption of CPUs / GPUs is on the rise. To reduce power supply losses, attempts have been made to lower circuit impedance by placing the power supply directly below the CPU / GPU (vertical power delivery VPD) and embedding passive components on the back or inside the circuit board to reduce power loss. Currently, multilayer ceramic capacitors are frequently used in parallel on the back of the circuit board near or directly below the CPU / GPU. In recent years, there have been studies to replace these multilayer ceramic capacitors with large-capacity capacitors. As a result of various studies, the inventors have invented the capacitor 100 according to this embodiment.

[0012] As shown in Figures 1, 2, and 3, the capacitor 100 according to this embodiment comprises a first substrate 1, a second substrate 2, one or more capacitor elements 3 disposed between the first substrate 1 and the second substrate 2, and an end face connection portion 4. The capacitor element 3 comprises an anode portion 5, a cathode portion 6, and a dielectric 7 disposed between the anode portion 5 and the cathode portion 6. At least one of the anode portion 5 and the cathode portion 6 has an electrode connection portion 31 located on the outer peripheral end face 30 of the capacitor element 3. The first substrate 1 has a wiring portion 10. The wiring portion 10 has a wiring connection portion 101 located on the outer peripheral end face 12 of the first substrate 1. The end face connection portion 4 is electrically connected to the electrode connection portion 31 and the wiring connection portion 101.

[0013] In this embodiment, the capacitor 100 uses a first substrate 1 and a second substrate 2 instead of a lead frame. The position and number of connection terminals on the circuit formed on the first substrate 1 and the second substrate 2 allow for intentional control of ESR and ESL, making it easy to set the necessary capacitor characteristics (circuit constants) in the circuit of the first substrate 1 and the second substrate 2.

[0014] Furthermore, the capacitor 100 of this embodiment allows for flexible wiring configurations, such as wiring on the first substrate 1 and the second substrate 2, or wiring on the same surface, and the connection terminals can be selected according to the required capacitor characteristics (circuit constants).

[0015] Furthermore, in the capacitor 100 of this embodiment, the structure of the capacitor element 3 is standardized, and the terminal arrangement can be changed to meet requirements simply by modifying the design of the first substrate 1 and the second substrate 2, thereby significantly shortening the development lead time for custom products of the capacitor 100.

[0016] 2. Details (Embodiment 1) The capacitor 100 of this embodiment comprises a first substrate 1, a second substrate 2, one or more capacitor elements 3 arranged between the first substrate 1 and the second substrate 2, and an end face connection portion 4 (see Figures 1, 2, and 3).

[0017] <Capacitor Element> The capacitor element 3 is the main component that enables the capacitor 100 to perform its function. The capacitance of the capacitor element 3 can be increased by forming it into a sheet.

[0018] As shown in Figures 4, 5, and 6, the capacitor element 3 comprises an anode portion 5, a cathode portion 6, and a dielectric 7 disposed between the anode portion 5 and the cathode portion 6. The capacitor element 3 has a metal layer 33, a dielectric layer 34, a solid electrolyte layer 35, a carbon layer 36, and a silver layer 37. The metal layer 33, dielectric layer 34, solid electrolyte layer 35, carbon layer 36, and silver layer 37 are laminated. Therefore, the capacitor element 3 is a laminate. The capacitor element 3 has an anode portion 5 and a cathode portion 6 as internal electrodes. The anode portion 5 is made of a metal layer 33, the cathode portion 6 is made of a solid electrolyte layer 35, a carbon layer 36, and a silver layer 37, and the dielectric 7 is made of a dielectric layer 34.

[0019] The metal layer 33 is formed of a metal foil such as aluminum or an aluminum alloy. The thickness of the metal layer 33 is not particularly limited, but may be, for example, 15 μm or more and 300 μm or less, or 80 μm or more and 250 μm or less. It is preferable that both sides of the metal layer 33 have rough surfaces with fine irregularities to increase the surface area. In addition to aluminum or an aluminum alloy, the metal layer 33 may also contain at least one metal selected from tantalum, niobium, titanium, etc.

[0020] The dielectric layer 34 is provided on the metal layer 33. The dielectric layer 34 is an electrically insulating layer, thereby ensuring electrical insulation between the metal layer 33 of the anode portion 5 and the cathode portion 6. The dielectric layer 34 covers almost the entire surface of the metal layer 33, except for the peripheral edges on both sides of the metal layer 33. Therefore, the dielectric layer 34 is formed to face both sides of the metal layer 33.

[0021] The dielectric layer 34 is preferably an oxide film of the metal constituting the metal layer 33. If the metal layer 33 is aluminum or an aluminum alloy, the dielectric layer 34 is aluminum oxide (Al ２ O ３ The dielectric layer 34 of the oxide film can be formed by performing anodizing treatment on the metal layer 33. The thickness of the dielectric layer 34 is set according to the required dielectric strength and capacitance.

[0022] The solid electrolyte layer 35 is provided on the dielectric layer 34. The capacitor element 3 has two solid electrolyte layers 35 facing each other in the stacking direction, and a metal layer 33 and a dielectric layer 34 are arranged between the two solid electrolyte layers 35.

[0023] The solid electrolyte layer 35 is formed in layers containing a conductive polymer and an inorganic solid electrolyte. Examples of conductive polymers include polypyrrole, polythiophene, and polyaniline. The thickness of the solid electrolyte layer 35 is set according to the required voltage resistance.

[0024] The carbon layer 36 is provided on the solid electrolyte layer 35. The capacitor element 3 has two carbon layers 36 facing each other in the stacking direction, and a metal layer 33, a dielectric layer 34, and two solid electrolyte layers 35 are arranged between the two carbon layers 36.

[0025] The carbon layer 36 is formed in layers containing carbon particles. The carbon layer 36 can be formed by applying carbon paste or the like onto the solid electrolyte layer 35 and curing it. The thickness of the carbon layer 36 is set according to the required conductivity performance.

[0026] The silver layer 37 is provided on the carbon layer 36. The capacitor element 3 has two silver layers 37 facing each other in the stacking direction, and a metal layer 33, a dielectric layer 34, two solid electrolyte layers 35, and two carbon layers 36 are arranged between the two silver layers 37.

[0027] The silver layer 37 is formed in layers containing silver particles. The silver layer 37 can be formed by applying silver paste or the like onto the carbon layer 36 and hardening it. The thickness of the silver layer 37 is set according to the required conductivity performance.

[0028] A resist layer 38 is provided on the capacitor element 3. The resist layer 38 is formed from a cured resin insulating material or the like. Alternatively, the resist layer 38 can be formed from a resist material such as a water-repellent ink for inkjet printing. The resist layer 38 is provided on the surface of the peripheral edge of the metal layer 33. The resist layer 38 is provided on both surfaces of the metal layer 33 and is formed to surround the dielectric layer 34 around its entire circumference.

[0029] The capacitor element 3 is provided with one or more conductive portions 39. The conductive portions 39 are formed by creating through holes 390 that penetrate the capacitor element 3 in the stacking direction and filling these through holes 390 with a conductive paste 391 such as silver paste. The conductive portions 39 are electrically and mechanically connected to the cathode portions 6 on both sides of the metal layer 33.

[0030] The anode portion 5 has an electrode connection portion 31 located on the outer peripheral end surface 30 of the capacitor element 3. In this embodiment, the electrode connection portion 31 is an anode connection portion 51 formed from the outer peripheral end surface of the anode portion 5 located on the outer peripheral end surface 30 of the capacitor element 3. That is, the outer peripheral end surface of the metal layer 33 is formed as an anode connection portion 51, which is the electrode connection portion 31.

[0031] <First Substrate> The first substrate 1 is formed in a flat plate shape with a pair of opposing main surfaces 11 (see Figure 7). The first substrate 1 also has a linear outer peripheral end surface 12 when viewed from the direction normal to the main surface 11 (see Figures 8 and 9). Note that a linear outer peripheral end surface 12 means that the edge of the outer peripheral end surface 12 is linear when viewed from the direction normal to the main surface 11. In this embodiment, the first substrate 1 is formed in a rectangular shape when viewed from the direction normal to the main surface 11. Therefore, the first substrate 1 has four linear outer peripheral end surfaces 12.

[0032] The first substrate 1 is formed from a printed circuit board. The first substrate 1 has an insulating layer 13 that has electrical insulating properties. The insulating layer 13 is flat and is formed in a rectangular shape when viewed from the direction normal to the main surface 11 of the first substrate 1. The first substrate 1 also has a wiring section 10. The wiring section 10 is a circuit pattern formed from a conductive material and is formed on the surface and inside the insulating layer 13. The wiring section 10 is formed from metal foil such as copper foil and metal plating such as copper plating. The wiring section 10 has a wiring connection section 101 located on the outer peripheral end face 12 of the first substrate 1.

[0033] The wiring section 10 includes an anode wiring section 150 on the first substrate 1. The anode wiring section 150 is formed in a flat layer on the surface of the insulating layer 13. The anode wiring section 150 is also formed in a rectangular shape when viewed from the direction normal to the main surface 11 of the first substrate 1. The anode wiring section 150 has an anode wiring connection section 151. The anode wiring connection section 151 corresponds to the wiring connection section 101 of the wiring section 10. Therefore, the anode wiring connection section 151 is composed of the outer peripheral end surface of the anode wiring section 150 located on the outer peripheral end surface 12 of the first substrate 1. In this embodiment, the anode wiring connection section 151 is formed along two opposing outer peripheral end surfaces 12 of the four outer peripheral end surfaces 12 of the first substrate 1 (see Figure 7).

[0034] The wiring section 10 includes a cathode wiring section 160 on the first substrate 1. Therefore, the first substrate 1 has a cathode wiring section 160. The cathode wiring section 160 has a cathode layer 161 and a cathode terminal section 162. The cathode layer 161 is formed on the surface of the first substrate 1 facing the cathode section 6. The cathode terminal section 162 is electrically connected to the cathode layer 161. The cathode terminal section 162 penetrates the first substrate 1 and is exposed on the surface of the first substrate 1 that does not face the cathode section 6.

[0035] The cathode layer 161 is formed as a flat layer on one side of the insulating layer 13 (the surface on the cathode portion 6 side). When viewed from the direction normal to the main surface 11 of the first substrate 1, the cathode layer 161 is formed as a rectangle smaller than the insulating layer 13. Therefore, the peripheral edge of the cathode layer 161 is separated from the peripheral edge of the insulating layer 13.

[0036] The cathode terminal portion 162 is formed using through-holes. Specifically, a through-hole 163 is formed that penetrates the insulating layer 13 and the anode wiring portion 150 in the thickness direction, a resist portion 164 is formed over the entire inner surface of the through-hole 163, and through-hole plating such as copper plating is applied to the inside of the resist portion 164 to form the cathode terminal portion 162. The first substrate 1 is provided with a plurality of cathode terminal portions 162.

[0037] <Second Substrate> The second substrate 2 has the same form as the first substrate 1. That is, the second substrate 2 is formed in a flat plate shape with a pair of opposing main surfaces 21 (see Figure 7). The second substrate 2 also has a linear outer peripheral end surface 22 when viewed from the direction normal to the main surface 21 (see Figures 8 and 9). In this embodiment, the second substrate 2 is formed in a rectangular shape when viewed from the direction normal to the main surface 21. Therefore, the second substrate 2 has four linear outer peripheral end surfaces 22.

[0038] The second substrate 2 is formed from a printed circuit board. The second substrate 2 has an insulating layer 23 having the same electrical insulating properties as the first substrate 1. The second substrate 2 also has a wiring section 20 similar to the first substrate 1. The wiring section 20 has a wiring connection section 201 located on the outer peripheral end face 22 of the second substrate 2.

[0039] The wiring section 20 includes an anode wiring section 250 on the second substrate 2. The anode wiring section 250 is formed in a flat layer on the surface of the insulating layer 23. The anode wiring section 250 is also formed in a rectangular shape when viewed from the direction normal to the main surface 21 of the second substrate 2. The anode wiring section 250 has an anode wiring connection section 251. The anode wiring connection section 251 corresponds to the wiring connection section 201 of the wiring section 20. Therefore, the anode wiring connection section 251 is formed on the outer peripheral end surface of the anode wiring section 250 located on the outer peripheral end surface 22 of the second substrate 2. In this embodiment, the anode wiring connection section 251 is formed along two opposing outer peripheral end surfaces 22 of the four outer peripheral end surfaces 22 of the second substrate 2 (see Figure 7).

[0040] The wiring portion 20 includes a cathode wiring portion 260 of the second substrate 2. Therefore, the second substrate 2 has a cathode wiring portion 260. The cathode wiring portion 260 has a cathode layer 261 and a cathode terminal portion 262. The cathode layer 261 is formed on the surface of the second substrate 2 facing the cathode portion 6. The cathode terminal portion 262 is electrically connected to the cathode layer 261. The cathode terminal portion 262 penetrates the second substrate 2 and is exposed on the surface of the second substrate 2 that does not face the cathode portion 6.

[0041] The cathode layer 261 is formed in a flat layer on one side (the surface on the cathode portion 6 side) of the insulating layer 23. The cathode layer 261 is formed in a rectangular shape smaller than the insulating layer 23 when viewed from the normal direction of the main surface 21 of the second substrate 2. Therefore, the peripheral end portion of the cathode layer 261 is separated from the peripheral end portion of the insulating layer 23.

[0042] The cathode terminal portion 262 is formed using a through-hole. That is, a through-hole 263 that penetrates the insulating layer 23 and the cathode wiring portion 260 in the thickness direction is formed, a resist portion 264 is formed over the entire inner peripheral surface of the through-hole 263, and the cathode terminal portion 262 can be formed by performing through-hole plating such as copper plating inside the resist portion 264. The second substrate 2 includes a plurality of cathode terminal portions 262.

[0043] <End face connection portion> The end face connection portion 4 electrically and mechanically connects the electrode connection portion 31 of the capacitor element 3, the wiring connection portion 101 of the first substrate 1, and the wiring connection portion 201 of the second substrate 2 (see FIG. 2).

[0044] In the present embodiment, the end face connection portion 4 is an anode end face connection portion 40 that electrically and mechanically connects the anode connection portion 51 of the capacitor element 3, the anode wiring connection portion 151 of the first substrate 1, and the anode wiring connection portion 251 of the second substrate 2.

[0045] The end face connection part 4 is provided along the linear outer peripheral end faces 12 and 22. The end face connection part 4 is provided along at least one of the four outer peripheral end faces 12 of the first substrate 1. Also, the end face connection part 4 is provided along at least one of the four outer peripheral end faces 22 of the second substrate 2. The outer peripheral end face 12 and the outer peripheral end face 22 where the end face connection part 4 is provided face the same direction, and the outer peripheral end face 12 and the outer peripheral end face 22 are substantially flush in the stacking direction. In the present embodiment, the end face connection part 4 is formed on two outer peripheral end faces 12 and 22 that face each other when viewed from the normal direction of the main faces 11 and 21.

[0046] The end face connection part 4 can be formed by attaching a metal material made of copper powder or the like by cold spray or the like. Also, the end face connection part 4 can be formed by plating, spraying or sputtering a conductive metal material such as copper. Also, the end face connection part 4 can be formed by wire bonding using a wire of a conductive metal.

[0047] <Capacitor> The capacitor 100 of the present embodiment includes a first substrate 1, a second substrate 2, and a capacitor element 3 between the first substrate 1 and the second substrate 2. The anode wiring connection part 151 of the anode wiring part 150 of the first substrate 1, the anode wiring connection part 251 of the anode wiring part 250 of the second substrate 2, and the anode connection part 51 of the capacitor element 3 are electrically connected by the anode end face connection part 40. The anode end face connection part 40 is exposed on the outer peripheral end face of the capacitor 100. The anode end face connection part 40 is used as an external connection terminal.

[0048] Also, the cathode part 6 of the capacitor element 3 is electrically connected to the cathode wiring part 160 of the first substrate 1 and the cathode wiring part 260 of the second substrate 2. The plurality of cathode terminal parts 162 of the first substrate 1 are exposed on the outer surface of the first substrate 1 facing away from the capacitor element 3. Also, the plurality of cathode terminal parts 262 of the second substrate 2 are exposed on the outer surface of the second substrate 2 facing away from the capacitor element 3.

[0049] In this embodiment, the capacitor 100 allows for the intentional control of ESR and ESL by the position and number of connection terminals on the circuit formed on the first substrate 1 and the second substrate 2. For example, when simulating the case where the first substrate 1 and the second substrate 2 are rectangular when viewed from the normal direction of the main surfaces 11 and 21, and anode end face connection portions 40 are provided on all four outer peripheral end faces 12, there is a capacitor 100 with a capacitance of 2973.4 μF and an ESR of 0.035 mΩ.

[0050] When a simulation is performed on this capacitor 100 in which anode end face connections 40 are provided on two opposing outer end faces 12, the capacitance remains the same at 2973.4 μF, but the ESR becomes 0.065 mΩ.

[0051] Furthermore, when a simulation is performed on this capacitor 100 in which an anode end face connection portion 40 is provided on one of the outer end faces 12, the capacitance remains the same at 2973.4 μF, but the ESR becomes 0.212 mΩ.

[0052] Thus, the more anode end face connections 40 there are, the lower the ESR tends to be. The ESR can be controlled by providing anode end face connections 40 on many outer peripheral end faces 12 or by increasing or decreasing the area of ​​the anode end face connections 40. In this way, the circuits of the first substrate 1 and the second substrate 2 make it easy to set the required capacitor characteristics (circuit constants).

[0053] Furthermore, because the capacitor element 3 is sandwiched between the rigid first substrate 1 and the second substrate 2, the strength of the capacitor 100 can be improved.

[0054] <Manufacturing Method for Capacitors> The capacitor 100 of this embodiment is manufactured as follows.

[0055] First, as shown in Figure 10, a first substrate master plate 110, a second substrate master plate 210, and a capacitor element master plate 310 are created. The first substrate master plate 110 has multiple first substrates 1 (or areas that will become first substrates). The second substrate master plate 210 has multiple second substrates 2 (or areas that will become second substrates). The capacitor element master plate 310 has multiple capacitor elements 3 (or areas that will become capacitor elements). The first substrate master plate 110 and the second substrate master plate 210 are held in holding frames 111 and 211, respectively.

[0056] Next, the capacitor element original plate 310 is stacked between the first substrate original plate 110, which is held in the holding frame 111, and the second substrate original plate 210, which is held in the holding frame 211. At this time, the alignment holes 113 provided in the first substrate original plate 110, the alignment holes 213 provided in the second substrate original plate 210, and the alignment holes 313 provided in the capacitor element original plate 310 are aligned by overlapping them.

[0057] Next, the overlapping first substrate plate 110, the second substrate plate 210, and the capacitor element plate 310 are cut in the thickness direction to obtain a laminate 140 in which the first substrate 1, the second substrate 2, and the capacitor element 3 between them are overlapped (see Figures 11 and 12). Here, as shown in Figure 12, the outer peripheral end faces 12 and 22 are exposed at the cut end faces of the laminate 140, and the anode connection portion 51 is exposed.

[0058] Subsequently, as shown in Figure 13, the anode end face connection portion 40 can be formed by spraying a metal material 410, such as copper powder, from the nozzle 411 onto the outer peripheral end faces 12, 22 and the anode connection portion 51 using a cold spray or the like.

[0059] Furthermore, as shown in Figure 14, the anode end face connection portion 40 can be formed by wire bonding the conductive wire 412 to the anode wiring connection portions 151, 251 and the anode connection portion 51 that are exposed on the outer peripheral end faces 12, 22.

[0060] (Modification) Embodiment 1 described above is merely one of many embodiments of the present disclosure. Embodiment 1 can be modified in various ways depending on the design, etc., as long as the objectives of the present disclosure are achieved.

[0061] In the above embodiment 1, the first substrate 1 and the second substrate 2 used printed circuit boards of the same form, but the invention is not limited to this. For example, the first substrate 1 and the second substrate 2 may be printed circuit boards of different forms. Different forms include cases where the wiring portion 10 of the first substrate 1 and the wiring portion 10 of the second substrate 2 are formed with different circuit patterns. This makes it easier to control the capacitor characteristics of the capacitor 100.

[0062] In the above embodiment 1, the anode portion 5 and the anode wiring portions 150 and 250 were connected by the anode end face connection portion 40, which is the end face connection portion 4, but the invention is not limited to this. For example, the cathode portion 6 and the cathode wiring portions 160 and 260 may be connected by the end face connection portion 4.

[0063] In the above embodiment 1, the case in which the end face connection portion 4 is provided along the straight outer peripheral end faces 12 and 22 was described, but it is not limited to this. The end face connection portion 4 may also be provided along the outer peripheral end faces 12 and 22 that are not straight. The outer peripheral end faces 12 and 22 are those whose edges are convex, concave, or wavy when viewed from the direction normal to the main surfaces 11 and 21. Note that the outer peripheral end faces 12 and 22 do not include inner peripheral surfaces such as holes (through holes). The outer peripheral end faces 12 and 22 do not include closed end faces, and both ends are open.

[0064] As shown in Figure 15, the capacitor element 3 may be divided into multiple insulating sections 336, such as a grid. In this case, it is preferable that a conductive section 39 is formed in each section divided by the multiple insulating sections 336. This makes it possible to package parts with different capacitor characteristics that are independent of each other into a single package.

[0065] As shown in Figure 16, it is preferable that the metal foil 330 forming the metal layer 33 is unwound continuously in the longitudinal direction from a rolled state and cut to a predetermined size to be processed into a rectangular metal layer 33. At this time, the direction in which the peripheral edge 332 of the metal layer 33 extends is tilted so that it is not parallel or perpendicular to the longitudinal direction 333 of the unwound metal foil 330. This reduces the distortion of the metal layer 33 during processing and suppresses warping of the capacitor element 3.

[0066] As shown in Figure 17, multiple capacitor elements 3 may be stacked and provided between the first substrate 1 and the second substrate 2. In this case, a large-capacity capacitor 100A can be formed.

[0067] In the above embodiment 1, an anode end face connection portion 40 was formed as the end face connection portion 4, but the embodiment is not limited to this. The capacitor 100 may also have a cathode end face connection portion as the end face connection portion 4. That is, the cathode wiring portion 160 of the first substrate 1, the cathode wiring portion 260 of the second substrate 2, and the cathode portion 6 of the capacitor element 3 are electrically connected by cathode end face connection portions provided on the outer peripheral end faces 12 and 22.

[0068] In the case of a rectangular capacitor 100, anode end face connections can be formed on two opposing outer end faces, and cathode end face connections can be formed on the remaining two opposing outer end faces. In this case, as shown in Figures 18 and 19, when forming a laminate 140 in which a first substrate 1, a second substrate 2, and a capacitor element 3 overlap, the two cut end faces that form the anode end face connections are cut at the position of the virtual cutting line CT so that the anode connection portion 51 of the capacitor element 3 and the anode wiring connection portions 151 and 251 of the first substrate 1 and the second substrate 2 are exposed. The other two cut end faces that form the cathode end face connections are cut at the position of the virtual cutting line CT so that the cathode portion 6 of the capacitor element 3 and the cathode wiring portions 160 and 260 of the first substrate 1 and the second substrate 2 are exposed. After this, the anode end face connections and cathode end face connections are formed in the same manner as described above by cold spraying, thermal spraying, sputtering, plating, wire bonding, etc.

[0069] In the case of a rectangular capacitor 100, both an anode end face connection portion and a cathode end face connection portion can be formed on two opposing outer end faces. In this case, as shown in Figures 20 and 21, when forming the laminate 140 in which the first substrate 1, the second substrate 2 and the capacitor element 3 between them are stacked, the material is cut at the position of the virtual cutting line CT so that the anode connection portion 51 of the capacitor element 3 and the anode wiring connection portions 151 and 251 of the first substrate 1 and the second substrate 2 are exposed on the two cut end faces that form the anode end face connection portion and the cathode end face connection portion. The material is also cut at the position of the virtual cutting line CT so that the cathode portion 6 of the capacitor element 3 and the cathode wiring portions 160 and 260 of the first substrate 1 and the second substrate 2 are exposed on these cut end faces. In this case, the anode end face connection portion and the cathode end face connection portion are formed side by side on the outer end face of the capacitor 100.

[0070] By changing the anode end face connection and the cathode end face connection in this way, it becomes easier to control the reduction of ESL (End-Splitting Line).

[0071] In the above embodiment 1, an anode end face connection portion 40 was formed on at least one of the four outer peripheral end faces 12, 22 of the first substrate 1 and the second substrate 2 of the rectangular capacitor 100, but the embodiment is not limited to this. The anode end face connection portion 40 may be formed at a location other than the outer peripheral of the capacitor 100.

[0072] For example, as shown in Figure 22, a slit 353 is formed in the capacitor element 3, and the end face (edge ​​portion) of the slit 353 becomes the outer peripheral end face 30 of the capacitor element 3. The end face of the slit 353 exposes the cut end face of the anode portion 5 that was cut when the slit 353 was formed. The slit 353 is filled with a conductive material such as conductive paste, and is in contact with the cut end face of the anode portion 5 to make an electrical connection. The conductive material filled in the slit 353 forms an element connection portion 354.

[0073] As shown in Figure 23, a slit 153 is formed in the first substrate 1, and the end face (edge ​​portion) of the slit 153 becomes the outer peripheral end face 12 of the first substrate 1. The cut end face of the anode wiring portion 150, which was cut when the slit 153 was formed, is exposed at the end face of the slit 153. The slit 153 is filled with a conductive material such as conductive paste, and is electrically connected to the cut end face of the anode wiring portion 150 by contact. The conductive material filled in the slit 153 forms the first substrate connection portion 154.

[0074] As shown in Figure 24, a slit 253 is formed in the second substrate 2, and the end face (edge ​​portion) of the slit 253 becomes the outer peripheral end face 22 of the second substrate 2. The cut end face of the anode wiring portion 250, which was cut when the slit 253 was formed, is exposed at the end face of the slit 253. The slit 253 is filled with a conductive material such as conductive paste, and is electrically connected to the cut end face of the anode wiring portion 250 by contact. The conductive material filled in the slit 253 forms the second substrate connection portion 254.

[0075] Furthermore, multiple cathode through-holes 46 are formed in the first substrate 1 and the second substrate 2. The cathode through-holes 46 are electrically connected to the cathode wiring sections 160 and 260. The cathode through-holes 46 are electrically insulated from the anode wiring sections 150 and 250 by the resist section 47.

[0076] Then, the element connection portion 354, the first substrate connection portion 154, and the second substrate connection portion 254 are aligned, and the first substrate 1, the second substrate 2, and the capacitor element 3 between them are stacked as shown in Figure 25. In this way, the element connection portion 354, the first substrate connection portion 154, and the second substrate connection portion 254 come into contact and are electrically connected, forming an end face connection portion 4, which can be formed inside the capacitor 100.

[0077] The first substrate 1 and the second substrate 2 can form the circuit patterns of the wiring section 10 corresponding to the element connection section 354. For example, an anode wiring section 150 can be formed at the location corresponding to the element connection section 354, and a cathode wiring section 160 can be formed at the other locations. The conductive section 39 of the capacitor element 3 can be formed by insulating the end face of the slit 392 with a chemical treatment or insulating material, and then filling the slit 392 with conductive paste.

[0078] (Embodiment 2) The capacitor array 300A according to this embodiment includes a plurality of capacitors 100 according to this embodiment.

[0079] In the following, components similar to those in Embodiment 1 will be denoted by common reference numerals and their descriptions will be omitted as appropriate. The configuration described in Embodiment 2 can be applied in appropriate combination with the configuration described in Embodiment 1 (including modified versions).

[0080] As shown in Figures 26 and 27, the capacitor array 300A comprises a plurality of capacitors 100 according to the above embodiment 1. The plurality of capacitors 100 are electrically connected to each other at their end face connection portions 4 and are arranged in a planar manner.

[0081] On the outer peripheral end faces 12 and 22 of the first substrate 1 and second substrate 2 provided on each of the multiple capacitors 100, an anode end face connection portion 40 is formed as an end face connection portion 4, and a cathode terminal portion 162 is exposed on the main surface 11. Conductive adhesive portions 200 are provided between adjacent capacitors 100 using conductive paste or the like, and the anode end face connection portions 40 are electrically and mechanically connected to each other by the conductive adhesive portions 200.

[0082] Even with such a 300A capacitor array, end-face current collection allows for shorter electrical paths and low-resistance connections, thus enabling low ESL and low ESR.

[0083] (Embodiment 3) The capacitor 100B according to Embodiment 3 shown in Figures 28 to 32 differs from the capacitor 100 according to Embodiment 1 in the configuration of the first substrate 1 and the second substrate 2. Hereinafter, components similar to those in Embodiment 1 will be denoted by common reference numerals and their descriptions will be omitted as appropriate. The configuration described in Embodiment 3 can be applied in appropriate combination with the configuration described in Embodiment 1 (including modified versions).

[0084] <First Substrate> The first substrate 1 is formed in a flat plate shape with a pair of opposing main surfaces 11 (see Figure 28). The first substrate 1 also has a linear outer peripheral end surface 12 when viewed from the direction normal to the main surfaces 11. In this embodiment, the first substrate 1 is formed in a rectangular shape when viewed from the direction normal to the main surfaces 11. Therefore, the first substrate 1 has four linear outer peripheral end surfaces 12.

[0085] The first substrate 1 is formed from a printed circuit board. The first substrate 1 has an insulating layer 13 that has electrical insulating properties. The insulating layer 13 is flat and is formed in a rectangular shape when viewed from the direction normal to the main surface 11 of the first substrate 1. The first substrate 1 also has a wiring section 10. The wiring section 10 is a circuit pattern formed from a conductive material and is formed on the surface and inside the insulating layer 13. The wiring section 10 is formed from metal foil such as copper foil and metal plating such as copper plating. The wiring section 10 has a wiring connection section 101 located on the outer peripheral end face 12 of the first substrate 1.

[0086] The wiring section 10 includes an anode wiring section 150 on the first substrate 1. The anode wiring section 150 is formed in a flat layer inside the insulating layer 13. The anode wiring section 150 is located opposite the cathode wiring section 160, with the insulating layer 13 in between. Therefore, the anode wiring section 150 and the cathode wiring section 160 are insulated by the insulating layer 13. The anode wiring section 150 is also formed in a rectangular shape when viewed from the direction normal to the main surface 11 of the first substrate 1. The anode wiring section 150 has an anode wiring connection section 151. The anode wiring connection section 151 corresponds to the wiring connection section 101 of the wiring section 10. Therefore, the anode wiring connection section 151 is formed on the outer peripheral end surface of the anode wiring section 150 located on the outer peripheral end surface 12 of the first substrate 1. In this embodiment, the anode wiring connection portion 151 is formed along two opposing outer peripheral end faces 12 of the four outer peripheral end faces 12 of the first substrate 1.

[0087] The wiring portion 10 includes the cathode wiring portion 160 of the first substrate 1. Therefore, the first substrate 1 has the cathode wiring portion 160. The cathode wiring portion 160 is formed on the surface of the first substrate 1 facing the cathode portion 6. The cathode wiring portion 160 is formed in a flat layer on one side of the insulating layer 13 (the surface on the cathode portion 6 side). When viewed from the direction normal to the main surface 11 of the first substrate 1, the cathode wiring portion 160 is formed in a rectangular shape smaller than the insulating layer 13. Therefore, the peripheral edge of the cathode wiring portion 160 is separated from the peripheral edge of the insulating layer 13.

[0088] The wiring section 10 further comprises terminal sections 102. The terminal sections 102 are exposed on the surface of the first substrate 1 opposite to the surface facing the capacitor element 3. The terminal sections 102 are formed using through-holes. That is, the terminal sections 102 can be formed by forming through-holes that penetrate the insulating layer 13 in the thickness direction, forming a resist section 104 over the entire inner surface of the through-hole 103, and applying through-hole plating such as copper plating to the inside of the resist section 104. The first substrate 1 comprises a plurality of terminal sections 102.

[0089] The terminal section 102 includes a plurality of anode terminal sections 152 of the anode wiring section 150 and a plurality of cathode terminal sections 162 of the cathode wiring section 160. The plurality of anode terminal sections 152 and the plurality of cathode terminal sections 162 are arranged alternately on the surface of the first substrate 1.

[0090] <Second Substrate> The second substrate 2 has the same form as the first substrate 1. The second substrate 2 has the same main surface 11, insulating layer 13, wiring connection portion 101, terminal portion 102, through hole 103, resist portion 104 and anode wiring connection portion 151 as the first substrate 1. The second substrate 2 has a wiring portion 20. The wiring portion 20 corresponds to the wiring portion 10 of the first substrate 1. The second substrate 2 has an anode wiring portion 250. The anode wiring portion 250 corresponds to the anode wiring portion 150 of the first substrate 1. The second substrate 2 has a cathode wiring portion 260. The cathode wiring portion 260 corresponds to the cathode wiring portion 160 of the first substrate 1. The second substrate 2 has an anode terminal portion 252. The anode terminal portion 252 corresponds to the anode terminal portion 152 of the first substrate 1. The second substrate 2 has a cathode terminal portion 262. The cathode terminal portion 262 corresponds to the cathode terminal portion 162 of the first substrate 1. The multiple anode terminal portions 252 and the multiple cathode terminal portions 262 are arranged alternately on the surface of the second substrate 2.

[0091] <Capacitor> The capacitor 100B of this embodiment comprises a first substrate 1, a second substrate 2, two or more capacitor elements 3, and a plurality of metal foils 400. The two or more capacitor elements 3 and the plurality of metal foils 400 are arranged and stacked between the first substrate 1 and the second substrate 2. The plurality of capacitor elements 3 and the plurality of metal foils 400 are stacked alternately.

[0092] As shown in Figure 29, two or more capacitor elements 3 are stacked with a metal foil 400 placed between adjacent capacitor elements 3, and each metal foil 400 is electrically connected to the cathode portion 6 of the capacitor element 3.

[0093] As shown in Figures 30 and 31, a metal foil 400 is also provided between the first substrate 1 and the capacitor element 3 adjacent to the first substrate 1. This metal foil 400 is electrically connected to the cathode wiring portion 160 of the first substrate 1. Furthermore, a metal foil 400 is also provided between the second substrate 2 and the capacitor element 3 adjacent to the second substrate 2. This metal foil 400 is electrically connected to the cathode wiring portion 260 of the second substrate 2.

[0094] Therefore, the cathode portion 6 of the capacitor element 3 is electrically connected to the cathode wiring portion 160 of the first substrate 1 and the cathode wiring portion 260 of the second substrate 2 via the metal foil 400.

[0095] As shown in Figure 32, the multiple anode terminals 152 and multiple cathode terminals 162 of the first substrate 1 are exposed on the outer surface of the first substrate 1 facing away from the capacitor element 3. Similarly, the multiple anode terminals 252 and multiple cathode terminals 262 of the second substrate 2 are exposed on the outer surface of the second substrate 2 facing away from the capacitor element 3.

[0096] As shown in Figure 30, the anode wiring connection portion 151 of the anode wiring portion 150 of the first substrate 1, the anode wiring connection portion 251 of the anode wiring portion 250 of the second substrate 2, and the anode connection portion 51 of the capacitor element 3 are electrically connected by the anode end face connection portion 40. The anode end face connection portion 40 is exposed on the outer end face of the capacitor 100B. The anode end face connection portion 40 is used as an external connection terminal.

[0097] As shown in Figure 31, the ends 61 of the multiple metal foils 400 are electrically connected by cathode end face connections 41, which are formed as end face connections 4. As shown in Figure 32, the cathode end face connections 41 are exposed on the outer peripheral end face of the capacitor 100B. The cathode end face connections 41 are used as external connection terminals. The anode end face connections 40 are formed on two opposing outer surfaces (end faces) of the rectangular capacitor 100B. The cathode end face connections 41 are formed on two other opposing outer surfaces different from the anode end face connections 40. Note that the anode end face connections 40 and the cathode end face connections 41 may each be formed on one outer surface of the rectangular capacitor 100B.

[0098] In the capacitor 100B of this embodiment, by using a common capacitor element 3 and simply changing the design of the first board 1 and the second board 2, which are printed circuit boards, it is easy to change the terminal arrangement (arrangement of multiple anode terminals 252 and multiple cathode terminals 262) to meet the requirements. Therefore, it is possible to significantly shorten the development lead time for custom products.

[0099] Furthermore, terminals (multiple anode terminals 152, 252 and multiple cathode terminals 162, 262) are present on both the upper and lower surfaces of the capacitor 100B, allowing the connection terminals to the circuit to be customized to correspond to the required circuit impedance characteristics.

[0100] (Embodiment 4) The capacitor 100C according to Embodiment 4 shown in Figures 33 and 34 differs from the capacitor 100B according to Embodiment 3 in that the anode end face connection portion 40 and the cathode end face connection portion 41 are different. Hereinafter, components similar to those in Embodiment 3 will be denoted by common reference numerals and their descriptions will be omitted as appropriate. The configuration described in Embodiment 4 can be applied in appropriate combination with the configurations (including modified versions) described in Embodiments 1 and 3.

[0101] In this embodiment, the capacitor 100C has an anode end face connection portion 40 formed on one outer surface of the rectangular capacitor 100C. The cathode end face connection portion 41 is formed on another outer surface different from the anode end face connection portion 40. The anode end face connection portion 40 and the cathode end face connection portion 41 are formed on two corresponding outer surfaces of the rectangular capacitor 100C, respectively.

[0102] In the capacitor 100C of this embodiment, the anode end face connection portion 40 and the cathode end face connection portion 41 are connected at their opposing outer surfaces (end faces), resulting in opposing current paths. This allows for the cancellation of magnetic fields, thereby achieving low ESL.

[0103] (Embodiment 5) The capacitor array 300B according to Embodiment 5 shown in Figure 35 is formed using the capacitor element 3 shown in Figure 15 and the first substrate 1 and second substrate 2 shown in Figure 36. Hereinafter, components similar to those in Embodiments 1 to 4 will be denoted by common reference numerals and their descriptions will be omitted as appropriate. The configuration described in Embodiment 5 can be applied in appropriate combination with the configurations described in Embodiments 1 to 4 (including modified versions).

[0104] As shown in Figure 15, the capacitor element 3 used in this embodiment is divided by a grid of insulating portions 336 and has a plurality of cathode division portions 62 separated by the insulating portions 336. Conductive portions 39 are formed in each of the plurality of cathode division portions 62. The capacitor element 3 has a dielectric 7 that is placed between the anode portion 5 and the plurality of cathode division portions 62. Therefore, a plurality of element division portions 32 are formed by each of the plurality of cathode division portions 62 and the anode portion 5. The plurality of element division portions 32 may be formed to have different capacitances, for example, or to have different other capacitor characteristics. The anode portion 5 is not divided and is common to the plurality of element division portions 32.

[0105] Furthermore, the first substrate 1 and the second substrate 2 each have cathode wiring sections 160 and 260, as shown in Figure 7. The cathode wiring sections 160 and 260 also have a plurality of cathode wiring division sections 166 and 266, as shown in Figure 36. The plurality of cathode wiring division sections 166 and 266 are each formed corresponding to a plurality of element division sections 32. The plurality of cathode wiring division sections 166 and 266 are divided by an insulating section 167.

[0106] Furthermore, the insulating portions 167 and 336 can be formed with insulating ink or paint. In addition, the multiple element division portions 32 can be formed with any area, and the areas of the multiple cathode wiring division portions 166 and 266 can be changed accordingly.

[0107] Then, as shown in Figure 35, a capacitor array 300B is formed by arranging a capacitor element 3 between the first substrate 1 and the second substrate 2. Here, the multiple element division sections 32 and the multiple cathode wiring division sections 166, 266 corresponding to each of the multiple element division sections 32 are arranged to overlap. Therefore, the multiple element division sections 32 and the multiple cathode wiring division sections 166, 266 corresponding to each of them are electrically connected.

[0108] The capacitor array 300B of this embodiment is a capacitor array in which capacitors with different connection terminal positions, number of connection terminals, and capacitance values ​​are connected in parallel. This allows for the intentional selection of ESR, ESL, and capacitance values ​​to set the necessary circuit constants in the circuit, and enables the removal of noise from the power supply line supplied to the xPU and VLSI over a wide bandwidth from low to high frequencies.

[0109] Furthermore, the capacitor array 300B of this embodiment allows for flexible wiring configurations using wiring on both sides of the first substrate 1 and the second substrate 2, or wiring on the same side, and allows for the selection of connection terminals according to the required capacitor characteristics (circuit constants).

[0110] Furthermore, in this embodiment, the capacitor array 300B is embedded in the substrate by sandwiching the capacitor element 3 between the first substrate 1 and the second substrate 2, which allows the power supply to the load to be changed from horizontal to vertical, thereby reducing the mounting area.

[0111] Furthermore, the capacitor array 300B of this embodiment can significantly shorten the development lead time for customized products and can be provided at a low cost. In addition, terminals (multiple anode terminals 152, 252 and multiple cathode terminals 162, 262) are present on both the upper and lower surfaces of the capacitor array 300B, making it easy to customize the selection of circuit connection terminals and capacitance values ​​to correspond to the required circuit impedance characteristics.

[0112] Furthermore, a capacitor array can be formed that comprises multiple capacitor arrays 300B. In this case, the anode portions 5 of the capacitor elements 3 provided in each of the multiple capacitor arrays 300B are electrically connected to each other. In addition, the corresponding cathode wiring division portions 166 and 266 of the first substrate 1 and second substrate 2 provided in each of the multiple capacitor arrays 300B can be electrically connected to each other. This makes it possible to further increase the capacitance and reduce the ESR of the capacitor array.

[0113] (Summary) As described above, the capacitor (100) according to the first embodiment comprises a first substrate (1), a second substrate (2), one or more stacked capacitor elements (3) disposed between the first substrate (1) and the second substrate (2), and an end face connection portion (4). The capacitor element (3) comprises an anode portion (5), a cathode portion (6), and a dielectric (7) disposed between the anode portion (5) and the cathode portion (6). At least one of the anode portion (5) and the cathode portion (6) has an electrode connection portion (31) located on the outer peripheral end face (30) of the capacitor element (3). The first substrate (1) has a wiring portion (10). The wiring portion (10) has a wiring connection portion (101) located on the outer peripheral end face (12) of the first substrate (1). The end face connection portion (4) is electrically connected to the electrode connection portion (31) and the wiring connection portion (101).

[0114] According to this embodiment, the first substrate (1), the second substrate (2), and the capacitor element (3) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0115] The second embodiment is a capacitor (100) according to the first embodiment, wherein the first substrate (1) is a flat plate with a pair of opposing main surfaces (11) and has a linear outer peripheral end surface (12) when viewed from the direction normal to the main surfaces (11). The end surface connection portion (4) is provided along the linear outer peripheral end surface (12).

[0116] According to this embodiment, there is an advantage in that the capacitor characteristics can be easily controlled by adjusting the position of the outer peripheral end face (12) that forms the end face connection portion (4).

[0117] The third embodiment is a capacitor (100) according to the second embodiment, wherein the first substrate (1) is formed in a rectangular shape when viewed from the direction normal to the main surface (11). The end face connection portion (4) is provided along at least one of the outer peripheral end faces (12) of the first substrate (1).

[0118] According to this embodiment, there is an advantage in that the capacitor characteristics can be easily controlled by adjusting the position and number of outer peripheral end faces (12) that form the end face connection portion (4).

[0119] The fourth embodiment is a capacitor (100) according to any one of the first to third embodiments, wherein the electrode connection portion (31) is an anode connection portion (51) formed by the outer peripheral end surface of the anode portion (5) located on the outer peripheral end surface (30) of the capacitor element (3). The wiring portion (10) includes an anode wiring portion (150) of the first substrate (1). The wiring connection portion (101) includes an anode wiring connection portion (151) formed by the outer peripheral end surface of the anode wiring portion (150) located on the outer peripheral end surface (12) of the first substrate (1). The end face connection portion (4) includes an anode end face connection portion (40) which is electrically connected to the anode connection portion (51) and the anode wiring connection portion (151).

[0120] According to this embodiment, the position of the anode end face connection portion (40) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0121] The fifth embodiment is a capacitor (100) according to any one of the first to fourth embodiments, wherein the first substrate (1) has a cathode wiring portion (160). The cathode wiring portion (160) has a cathode layer (161) formed on the surface of the first substrate (1) facing the cathode portion (6), and a cathode terminal portion (162) electrically connected to the cathode layer (161). The cathode terminal portion (162) penetrates the first substrate (1) and is exposed on the surface of the first substrate (1) that does not face the cathode portion (6).

[0122] According to this embodiment, the position of the cathode terminal (162) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0123] The sixth embodiment is a capacitor (100) according to the fifth embodiment, comprising a plurality of cathode terminal portions (162).

[0124] According to this embodiment, the number of cathode terminals (162) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0125] The seventh embodiment is a capacitor (100) according to any one of the first to sixth embodiments, wherein the second substrate (2) has an anode wiring portion (250). The anode wiring portion (250) of the second substrate (2) has an anode wiring connection portion (251) located on the outer peripheral end face (22) of the second substrate (2). The end face connection portion (4) is electrically connected to the anode wiring connection portion (251) of the second substrate (2).

[0126] According to this embodiment, the circuit of the second substrate (2) can be designed according to the capacitor characteristics, and there is an advantage that the capacitor characteristics can be easily controlled.

[0127] The eighth embodiment is a capacitor (100) according to any one of the first to seven embodiments, wherein the second substrate (2) has a cathode wiring portion (260). The cathode wiring portion (260) of the second substrate (2) has a cathode layer (261) formed on the surface of the second substrate (2) facing the cathode portion (6), and a plurality of cathode terminal portions (262) electrically connected to the cathode layer (261) of the second substrate (2). The plurality of cathode terminal portions (262) of the second substrate (2) penetrate the second substrate (2) and are exposed on the surface of the second substrate (2) that does not face the cathode portion (6).

[0128] According to this embodiment, the circuit of the second substrate (2) can be designed according to the capacitor characteristics, and there is an advantage that the capacitor characteristics can be easily controlled.

[0129] The ninth embodiment is a capacitor (100B, 100C) according to any one of the first to eight embodiments, wherein the wiring section (10) includes an anode wiring section (150), a cathode wiring section (160), a plurality of anode terminal sections (152) of the anode wiring section (150), and a plurality of cathode terminal sections (162) of the cathode wiring section (160), and the plurality of anode terminal sections (152) and the plurality of cathode terminal sections (162) are arranged alternately.

[0130] According to this embodiment, the first substrate (1), the second substrate (2), and the capacitor element (3) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0131] The tenth embodiment is a capacitor (100B, 100C) according to any one of the first to ninth embodiments, wherein two or more capacitor elements (3) are stacked with a metal foil (400) between adjacent capacitor elements (3), and the metal foil (400) is electrically connected to the cathode (6).

[0132] This embodiment has the advantage that it is easy to form an end face connection portion (4) that is connected to the cathode portion (6) by the metal foil (400).

[0133] The capacitor array (300A) according to the eleventh embodiment comprises a plurality of capacitors (100) according to any one of the first to ten embodiments. The plurality of capacitors (100) are electrically connected to each other at their end face connection portions (4) and are arranged in a planar manner.

[0134] This embodiment has the advantage of making it easy to control capacitance and other properties using multiple capacitors (100).

[0135] A capacitor array (300B) according to the twelfth embodiment comprises a first substrate (1), a second substrate (2), and one or more stacked capacitor elements (3) disposed between the first substrate (1) and the second substrate (2), wherein each capacitor element (3) comprises an anode portion (5), a plurality of cathode division portions (62), and a dielectric (7) disposed between the anode portion (5) and the plurality of cathode division portions (62), thereby enabling each of the plurality of cathode division portions (62) to interact with the anode. The first substrate (1) and the second substrate (2) each have cathode wiring sections (160, 260), and the cathode wiring sections (160, 260) each have cathode wiring sections (166, 266) corresponding to each of the multiple element division sections (32), and the multiple element division sections (32) and the multiple cathode wiring sections (166, 266) corresponding to each of the multiple element division sections (32) are electrically connected.

[0136] According to this embodiment, it is possible to easily configure multiple element division sections (32) in parallel with a single capacitor element (3), which has the advantage of enabling the removal of a wide range of frequency noise in power lines with xPU and VLSI as loads.

[0137] The capacitor array according to the 13th embodiment comprises a plurality of capacitor arrays (300B), wherein the anode portions (5) of the plurality of capacitor arrays (300B) are electrically connected to each other, and the cathode wiring division portions (166, 266) of the plurality of capacitor arrays (300B) are electrically connected to each other.

[0138] This embodiment has the advantage of making it easier to obtain a capacitor array that achieves both high capacity and low ESR.

[0139] 1 First substrate 2 Second substrate 3 Capacitor element 4 End face connection part 5 Anode part 6 Cathode part 7 Dielectric 10 Wiring part 11 Main surface 12 Outer peripheral end face 30 Outer peripheral end face 31 Electrode connection part 32 Element division part 40 Anode end face connection part 41 Cathode end face connection part 51 Anode connection part 62 Cathode division part 100 Capacitor 100B Capacitor 100C Capacitor 101 Wiring connection part 150 Anode wiring part 151 Anode wiring connection part 152 Anode terminal part 160 Cathode wiring part 161 Cathode layer 162 Cathode terminal part 166 Cathode wiring division part 250 Anode wiring part 251 Anode wiring connection part 252 Anode terminal part 260 Cathode wiring part 261 Cathode layer 262 Cathode terminal section 266 Cathode wiring division section 400 Metal foil 300A Capacitor array 300B Capacitor array

Claims

1. A capacitor comprising a first substrate, a second substrate, one or more capacitor elements arranged between the first substrate and the second substrate, and an end face connection portion, wherein the capacitor element comprises an anode portion, a cathode portion, and a dielectric disposed between the anode portion and the cathode portion, at least one of the anode portion and the cathode portion has an electrode connection portion located on the outer peripheral end face of the capacitor element, the first substrate has a wiring portion, the wiring portion has a wiring connection portion located on the outer peripheral end face of the first substrate, and the end face connection portion is electrically connected to the electrode connection portion and the wiring connection portion.

2. The capacitor according to claim 1, wherein the first substrate is a flat plate with a pair of opposing main surfaces and has a linear outer peripheral end surface when viewed from the direction normal to the main surfaces, and the end surface connection portion is provided along the linear outer peripheral end surface.

3. The capacitor according to claim 2, wherein the first substrate is formed in a rectangular shape when viewed from the direction normal to the main surface, and the end face connection portion is provided along at least one of the outer peripheral end faces of the first substrate.

4. The capacitor according to claim 1, wherein the electrode connection portion is an anode connection portion formed from the outer peripheral end surface of the anode portion located on the outer peripheral end surface of the capacitor element, the wiring portion includes an anode wiring portion of the first substrate, the wiring connection portion includes an anode wiring connection portion formed from the outer peripheral end surface of the anode wiring portion located on the outer peripheral end surface of the first substrate, and the end face connection portion includes an anode end face connection portion electrically connected to the anode connection portion and the anode wiring connection portion.

5. The capacitor according to claim 1, wherein the first substrate has a cathode wiring portion, the cathode wiring portion has a cathode layer formed on the surface of the first substrate facing the cathode portion, and a cathode terminal portion electrically connected to the cathode layer, and the cathode terminal portion penetrates the first substrate and is exposed on the surface of the first substrate that does not face the cathode portion.

6. The capacitor according to claim 5, comprising a plurality of cathode terminal portions.

7. The capacitor according to claim 1, wherein the second substrate has an anode wiring portion, the anode wiring portion of the second substrate has an anode wiring connection portion located on the outer peripheral end face of the second substrate, and the end face connection portion is electrically connected to the anode wiring connection portion of the second substrate.

8. The capacitor according to claim 1, wherein the second substrate has a cathode wiring portion, the cathode wiring portion of the second substrate has a cathode layer formed on the surface of the second substrate facing the cathode portion, and a plurality of cathode terminal portions electrically connected to the cathode layer of the second substrate, and the plurality of cathode terminal portions of the second substrate penetrate the second substrate and are exposed on the surface of the second substrate that does not face the cathode portion.

9. The capacitor according to claim 1, wherein the wiring section includes an anode wiring section, a cathode wiring section, a plurality of anode terminal sections of the anode wiring section, and a plurality of cathode terminal sections of the cathode wiring section, and the plurality of anode terminal sections and the plurality of cathode terminal sections are arranged alternately.

10. The capacitor according to claim 1, wherein the two or more capacitor elements are stacked with a metal foil between adjacent capacitor elements, and the metal foil is electrically connected to the cathode portion.

11. A capacitor array comprising a plurality of capacitors according to any one of claims 1 to 10, wherein the plurality of capacitors are electrically connected to each other at their end face connections and are arranged in a planar manner.

12. A capacitor array comprising a first substrate, a second substrate, and one or more stacked capacitor elements disposed between the first substrate and the second substrate, wherein each capacitor element comprises an anode portion, a plurality of cathode division portions, and a dielectric disposed between the anode portion and the plurality of cathode division portions, thereby having a plurality of element division portions formed by each of the plurality of cathode division portions and the anode portion, the first substrate and the second substrate each have a cathode wiring portion, the cathode wiring portion has a plurality of cathode wiring division portions corresponding to each of the plurality of element division portions, and the plurality of element division portions and the plurality of cathode wiring division portions corresponding to each of the plurality of element division portions are electrically connected.

13. A capacitor array comprising a plurality of capacitor arrays as described in claim 12, wherein the plurality of capacitor arrays are electrically connected to each other at the anode portions and to each other at the cathode wiring division portions.

Images