Capacitor and capacitor array

Abstract

The present disclosure addresses the problem of providing a capacitor that enables characteristics thereof to be controlled easily. A capacitor (100) according to the present disclosure comprises a base substrate (1), one or more capacitor elements (3) stacked on the base substrate (1), and an end surface connection part (4). Each of the one or more capacitor elements (3) comprises an anode part (5), a cathode part (6), and a dielectric (7) disposed between the anode part (5) and the cathode part (6). At least one of the anode part (5) and the cathode part (6) has an electrode connection part (31) positioned on an outer peripheral end surface (30) of the capacitor element (3). The base substrate (1) has a wiring part (10). The wiring part (10) has a wiring connection part (101) positioned on an outer peripheral end surface (12) of the base substrate (1). The end surface connection part (4) is electrically connected to the electrode connection part (31) and the wiring connection part (101).

Description

Capacitor and Capacitor Array

[0001] The present disclosure relates to a capacitor and a capacitor array. More particularly, the present disclosure relates to a capacitor and a capacitor array including a substrate and capacitor elements.

[0002] Patent Document 1 describes a capacitor component in which capacitor elements are sandwiched between a first and a second substrate. The base substrate has a first inner anode terminal and a first inner cathode terminal on the inner side, while having a first outer anode terminal and a first outer cathode terminal on the outer side. Each of the first inner anode terminal and the first inner cathode terminal is electrically connected to each of the first outer anode terminal and the first outer cathode terminal. The second substrate has a second inner anode terminal and a second inner cathode terminal on the inner side, while having a second outer anode terminal and a second outer cathode terminal on the outer side. Each of the second inner anode terminal and the second inner cathode terminal is electrically connected to each of the second outer anode terminal and the second outer cathode terminal. Each of the first inner anode terminal and the second inner anode terminal is electrically connected to the anode of the capacitor element. Each of the first inner cathode terminal and the second inner cathode terminal is electrically connected to the cathode of the capacitor element.

[0003] In a capacitor component such as that of Patent Document 1, it has been desired to control capacitor characteristics such as increased capacitance, low ESR, and low ESL.

[0004] Japanese Patent Application Laid-Open No. 2009-224679

[0005] An object of the present disclosure is to provide a capacitor whose capacitor characteristics can be easily controlled.

[0006] A capacitor according to one aspect of the present disclosure comprises a base substrate, one or more capacitor elements laminated on the base substrate, and an end face connection portion. Each of the one or more capacitor elements comprises an anode portion, a cathode portion, and a dielectric disposed between the anode portion and the cathode portion. At least one of the anode portion and the cathode portion has an electrode connection portion located on the outer peripheral end face of the capacitor element. The base substrate has a wiring portion. The wiring portion has a wiring connection portion located on the outer peripheral end face of the base substrate. The end face connection portion is electrically connected to the electrode connection portion and the wiring connection portion.

[0007] A capacitor array according to one aspect of the present disclosure comprises a plurality of capacitors. The plurality of capacitors are electrically connected to each other at their end face connections and are arranged in a planar manner.

[0008] A capacitor array according to another aspect of the present disclosure comprises a base substrate and one or more capacitor elements laminated on the base substrate. The capacitor element comprises an anode portion, a plurality of cathode division portions, and a dielectric disposed between the anode portion and the plurality of cathode division portions, thereby having a plurality of element division portions composed of each of the plurality of cathode division portions and the anode portion. The base substrate has a cathode wiring portion. The cathode wiring portion has a plurality of cathode wiring division portions corresponding to each of the plurality of element division portions. The plurality of element division portions and the plurality of cathode wiring division portions corresponding to each of the plurality of element division portions are electrically connected.

[0009] Figure 1 is a schematic perspective view showing a capacitor according to Embodiment 1 of the present disclosure. Figure 2 is a schematic perspective view showing a capacitor according to Embodiment 1 of the present disclosure. Figure 3 is a schematic plan view showing a capacitor element used in a capacitor according to Embodiment 1 of the present disclosure. Figure 4 shows a capacitor element used in a capacitor according to Embodiment 1 of the present disclosure, and is a cross-sectional view taken along line A-A in Figure 3. Figure 5 shows a capacitor element used in a capacitor according to Embodiment 1 of the present disclosure, and is a cross-sectional view taken along line B-B in Figure 3. Figure 6 is a schematic cross-sectional view showing a base substrate used in a capacitor according to Embodiment 1 of the present disclosure. Figure 7 is a schematic plan view showing one main surface of the base substrate used in a capacitor according to Embodiment 1 of the present disclosure. Figure 8 is a schematic plan view showing the inner layer of the base substrate used in a capacitor according to Embodiment 1 of the present disclosure. Figure 9 is a schematic plan view showing the other main surface of the base substrate used in a capacitor according to Embodiment 1 of the present disclosure. Figure 10 is a schematic perspective view showing a method for manufacturing a capacitor according to Embodiment 1 of the present disclosure. Figure 11 is a schematic perspective view showing a method for manufacturing a capacitor according to Embodiment 1 of the present disclosure. Figure 12 is a schematic perspective view showing a method for manufacturing a capacitor according to Embodiment 1 of the present disclosure. Figure 13 is a schematic perspective view showing a method for manufacturing a capacitor according to Embodiment 1 of the present disclosure. Figure 14 is a schematic diagram showing the operation of a capacitor according to Embodiment 1 of the present disclosure. Figure 15 is a schematic diagram showing measurement points in a simulation of a capacitor according to Embodiment 1 of the present disclosure. Figure 16 is a schematic diagram showing measurement points in a simulation of a capacitor according to Embodiment 1 of the present disclosure. Figure 17 is a schematic diagram showing measurement points in a simulation of a capacitor according to Embodiment 1 of the present disclosure. Figure 18 is a schematic diagram showing measurement points in a simulation of a capacitor according to Embodiment 1 of the present disclosure. Figure 19 is a schematic diagram showing measurement points in a simulation of a capacitor according to Embodiment 1 of the present disclosure. Figure 20 is a schematic diagram showing measurement points in a simulation of a capacitor according to Embodiment 1 of the present disclosure. Figure 21 is a schematic plan view showing a modified example of a capacitor element used in a capacitor according to Embodiment 1 of the present disclosure.Figure 22 is a schematic perspective view showing the metal foil of the capacitor element used in the capacitor according to Embodiment 1 of this disclosure. Figure 23 is a schematic perspective view showing a modified example of the stacked state of the capacitor element used in the capacitor according to Embodiment 1 of this disclosure. Figure 24 is a schematic perspective view showing a modified example of the capacitor according to Embodiment 1 of this disclosure. Figure 25 is a schematic perspective view showing a modified example of the stacked state of the capacitor element used in the capacitor according to Embodiment 1 of this disclosure. Figure 26 is a schematic plan view showing the manufacturing process of a modified example of the capacitor according to Embodiment 1 of this disclosure. Figure 27 is a schematic plan view showing the manufacturing process of a modified example of the capacitor according to Embodiment 1 of this disclosure. Figure 28 is a schematic perspective view showing a modified example of the capacitor according to Embodiment 1 of this disclosure. Figure 29 is a schematic perspective view showing a modified example of the capacitor according to Embodiment 1 of this disclosure. Figure 30 is a schematic cross-sectional view showing a modified example of the base substrate used in the capacitor according to Embodiment 1 of this disclosure. Figure 31 shows a capacitor according to Embodiment 2 of this disclosure, and is a cross-sectional view taken along A-A' in Figure 33. Figure 32 shows a capacitor according to Embodiment 2 of this disclosure, and is a cross-sectional view taken along B-B' in Figure 33. Figure 33 is a schematic plan view showing a capacitor according to Embodiment 2 of the present disclosure. Figure 34 is a cross-sectional view taken along line A-A' in Figure 35, showing a capacitor according to Embodiment 3 of the present disclosure. Figure 35 is a schematic plan view showing a capacitor according to Embodiment 3 of the present disclosure. Figure 36 is a schematic perspective view showing a plurality of capacitors in a capacitor array according to Embodiment 4 of the present disclosure. Figure 37 is a schematic perspective view showing a capacitor array according to Embodiment 4 of the present disclosure. Figure 38 is a schematic perspective view showing a capacitor array according to Embodiment 5 of the present disclosure. Figure 39 is a schematic diagram showing a base substrate used in a capacitor array according to Embodiment 5 of the present disclosure.

[0010] 1. Overview In power supply modules and the like, the current consumption of CPUs / GPUs is on the rise. To reduce power supply losses and lower circuit impedance, attempts have been made to reduce power loss by placing the power supply directly below the CPU / GPU (vertical power delivery VPD) and embedding passive components on the back or inside the circuit board. Currently, multilayer ceramic capacitors are frequently used in parallel on the back of the circuit board near or directly below the CPU / GPU. In recent years, there have been studies to replace all of these multilayer ceramic capacitors with high-capacity capacitors. As a result of various studies, the inventors have invented the capacitor 100 according to this embodiment.

[0011] The capacitor 100 according to this embodiment comprises a base substrate 1, one or more capacitor elements 3 stacked on the base substrate 1, and an end face connection portion 4 (see Figures 1 and 2). Each of the one or more capacitor elements 3 comprises an anode portion 5, a cathode portion 6, and a dielectric 7 disposed between the anode portion 5 and the cathode portion 6 (see Figures 4 and 5). At least one of the anode portion 5 and the cathode portion 6 has an electrode connection portion 31 located on the outer peripheral end face 30 of the capacitor element 3. The base substrate 1 has a wiring portion 10 (see Figure 6). The wiring portion 10 has a wiring connection portion 101 located on the outer peripheral end face 12 of the base substrate 1. The end face connection portion 4 is electrically connected to the electrode connection portion 31 and the wiring connection portion 101.

[0012] In the capacitor 100 of this embodiment, a base board 1 is used instead of a lead frame, and the ESR and ESL can be intentionally controlled by the position and number of connection terminals on the circuit formed on the base board 1, making it easy to set the necessary capacitor characteristics (circuit constants) in the circuit of the base board 1.

[0013] Furthermore, in the capacitor 100 of this embodiment, flexible wiring configurations are possible, such as wiring on the base board 1 or wiring on the same surface, and connection terminals can be selected according to the required capacitor characteristics (circuit constants).

[0014] Furthermore, in the capacitor 100 of this embodiment, the structure of the capacitor element 3 is standardized, and the terminal arrangement can be changed to meet requirements simply by modifying the design of the base board 1, thereby significantly shortening the development lead time for custom products of the capacitor 100.

[0015] Furthermore, the capacitor 100 of this embodiment can replace many MLCCs on the back surface of the substrate near or directly beneath the CPU / GPU, thereby reducing the mounting area.

[0016] 2. Details (Embodiment 1) The capacitor 100 of this embodiment comprises a base substrate 1, one or more capacitor elements 3 stacked on the base substrate 1, and an end face connection portion 4 (see Figures 1 and 2).

[0017] <Capacitor Element> The capacitor element 3 is the main component that enables the capacitor 100 to perform its function. The capacitance of the capacitor element 3 can be increased by forming it into a sheet.

[0018] As shown in Figures 3, 4, and 5, the capacitor element 3 comprises an anode portion 5, a cathode portion 6, and a dielectric 7 disposed between the anode portion 5 and the cathode portion 6. The capacitor element 3 has a metal layer 33, a dielectric layer 34, a solid electrolyte layer 35, a carbon layer 36, and a silver layer 37. The metal layer 33, dielectric layer 34, solid electrolyte layer 35, carbon layer 36, and silver layer 37 are laminated. Therefore, the capacitor element 3 is a laminate. The capacitor element 3 has an anode portion 5 and a cathode portion 6 as internal electrodes. The anode portion 5 is made of a metal layer 33, the cathode portion 6 is made of a solid electrolyte layer 35, a carbon layer 36, and a silver layer 37, and the dielectric 7 is made of a dielectric layer 34.

[0019] The metal layer 33 is formed of a metal foil such as aluminum or an aluminum alloy. The thickness of the metal layer 33 is not particularly limited, but may be, for example, 15 μm or more and 300 μm or less, or 80 μm or more and 250 μm or less. It is preferable that both sides of the metal layer 33 have rough surfaces with fine irregularities to increase the surface area. In addition to aluminum or an aluminum alloy, the metal layer 33 may also contain at least one metal selected from tantalum, niobium, titanium, etc.

[0020] The dielectric layer 34 is provided on the metal layer 33. The dielectric layer 34 is an electrically insulating layer, thereby ensuring electrical insulation between the metal layer 33 of the anode portion 5 and the cathode portion 6. The dielectric layer 34 covers almost the entire surface of the metal layer 33, except for the peripheral edges on both sides of the metal layer 33. Therefore, the dielectric layer 34 is formed to face both sides of the metal layer 33.

[0021] The dielectric layer 34 is preferably an oxide film of the metal constituting the metal layer 33. If the metal layer 33 is aluminum or an aluminum alloy, the dielectric layer 34 is aluminum oxide (Al ２ O ３ The dielectric layer 34 of the oxide film can be formed by performing anodizing treatment on the metal layer 33. The thickness of the dielectric layer 34 is set according to the required dielectric strength and capacitance.

[0022] The solid electrolyte layer 35 is provided on the dielectric layer 34. The capacitor element 3 has two solid electrolyte layers 35 facing each other in the stacking direction, and a metal layer 33 and a dielectric layer 34 are arranged between the two solid electrolyte layers 35.

[0023] The solid electrolyte layer 35 is formed in layers containing a conductive polymer and an inorganic solid electrolyte. Examples of conductive polymers include polypyrrole, polythiophene, and polyaniline. The thickness of the solid electrolyte layer 35 is set according to the required voltage resistance.

[0024] The carbon layer 36 is provided on the solid electrolyte layer 35. The capacitor element 3 has two carbon layers 36 facing each other in the stacking direction, and a metal layer 33, a dielectric layer 34, and two solid electrolyte layers 35 are arranged between the two carbon layers 36.

[0025] The carbon layer 36 is formed in layers containing carbon particles. The carbon layer 36 can be formed by applying carbon paste or the like onto the solid electrolyte layer 35 and curing it. The thickness of the carbon layer 36 is set according to the required conductivity performance.

[0026] The silver layer 37 is provided on the carbon layer 36. The capacitor element 3 has two silver layers 37 facing each other in the stacking direction, and a metal layer 33, a dielectric layer 34, two solid electrolyte layers 35, and two carbon layers 36 are arranged between the two silver layers 37.

[0027] The silver layer 37 is formed in layers containing silver particles. The silver layer 37 can be formed by applying silver paste or the like onto the carbon layer 36 and hardening it. The thickness of the silver layer 37 is set according to the required conductivity performance.

[0028] A resist layer 38 is provided on the capacitor element 3. The resist layer 38 is formed from a cured resin insulating material or the like. Alternatively, the resist layer 38 can be formed from a resist material such as a water-repellent ink for inkjet printing. The resist layer 38 is provided on the surface of the peripheral edge of the metal layer 33. The resist layer 38 is provided on both surfaces of the metal layer 33 and is formed to surround the dielectric layer 34 around its entire circumference.

[0029] The capacitor element 3 is provided with one or more conductive portions 39. The conductive portions 39 are formed by creating through holes 390 that penetrate the capacitor element 3 in the stacking direction and filling these through holes 390 with a conductive paste 391 such as silver paste. The conductive portions 39 are electrically and mechanically connected to the cathode portions 6 on both sides of the metal layer 33.

[0030] The anode portion 5 has an electrode connection portion 31 located on the outer peripheral end surface 30 of the capacitor element 3. In this embodiment, the electrode connection portion 31 is an anode connection portion 51 formed from the outer peripheral end surface of the anode portion 5 located on the outer peripheral end surface 30 of the capacitor element 3. That is, the outer peripheral end surface of the metal layer 33 is formed as an anode connection portion 51, which is the electrode connection portion 31.

[0031] <Base Substrate> The base substrate 1 is formed in a flat plate shape with a pair of opposing main surfaces 11 (see Figures 6, 7, 8, and 9). The base substrate 1 also has a linear outer peripheral end surface 12 when viewed from the direction normal to the main surfaces 11. In this embodiment, the base substrate 1 is formed in a rectangular shape when viewed from the direction normal to the main surfaces 11. Therefore, the base substrate 1 has four linear outer peripheral end surfaces 12.

[0032] The base substrate 1 is formed from a printed circuit board. The base substrate 1 has an insulating layer 13 that has electrical insulating properties. The insulating layer 13 is flat and is formed in a rectangular shape when viewed from the direction normal to the main surface 11 of the base substrate 1. The base substrate 1 also has a wiring section 10. The wiring section 10 is a circuit pattern formed from a conductive material and is formed on the surface and inside the insulating layer 13. The wiring section 10 is formed from metal foil such as copper foil and metal plating such as copper plating. The wiring section 10 has a wiring connection section 101 located on the outer peripheral end face 12 of the base substrate 1.

[0033] The wiring section 10 includes an anode wiring section 150 on the base substrate 1. The anode wiring section 150 is formed in a flat layer inside the insulating layer 13. The anode wiring section 150 is located opposite the cathode wiring section 160, with the insulating layer 13 in between. Therefore, the anode wiring section 150 and the cathode wiring section 160 are insulated by the insulating layer 13. The anode wiring section 150 is also formed in a rectangular shape when viewed from the direction normal to the main surface 11 of the base substrate 1. The anode wiring section 150 has an anode wiring connection section 151. The anode wiring connection section 151 corresponds to the wiring connection section 101 of the wiring section 10. Therefore, the anode wiring connection section 151 is formed on the outer peripheral end surface of the anode wiring section 150 located on the outer peripheral end surface 12 of the base substrate 1. In this embodiment, the anode wiring connection portion 151 is formed along one of the four outer peripheral end faces 12 of the base substrate 1 (see Figure 1).

[0034] The wiring section 10 includes a cathode wiring section 160 on the base substrate 1. Therefore, the base substrate 1 has a cathode wiring section 160. The cathode wiring section 160 is formed on the surface of the base substrate 1 facing the cathode section 6. The cathode wiring section 160 is formed as a flat layer on one side of the insulating layer 13 (the surface on the cathode section 6 side). When viewed from the direction normal to the main surface 11 of the base substrate 1, the cathode wiring section 160 is formed as a rectangle smaller than the insulating layer 13. Therefore, the peripheral edges of the cathode wiring section 160 are separated from the peripheral edges of the insulating layer 13.

[0035] The wiring section 10 further comprises terminal sections 102. The terminal sections 102 are exposed on the surface of the base substrate 1 opposite to the surface facing the capacitor element 3. The terminal sections 102 are formed using through-holes. That is, a through-hole is formed that penetrates the insulating layer 13 in the thickness direction, a resist section 104 is formed over the entire inner surface of the through-hole 103, and through-hole plating such as copper plating is applied to the inside of the resist section 104 to form the terminal sections 102. The base substrate 1 comprises a plurality of terminal sections 102.

[0036] The terminal section 102 includes a plurality of anode terminal sections 155 of the anode wiring section 150 and a plurality of cathode terminal sections 165 of the cathode wiring section 160. The plurality of anode terminal sections 155 and the plurality of cathode terminal sections 165 are arranged alternately on the surface of the base substrate 1.

[0037] <End face connection part> The end face connection part 4 electrically and mechanically connects the electrode connection parts 31 of the multiple capacitor elements 3 and the wiring connection parts 101 of the base substrate 1.

[0038] In this embodiment, the end face connection portion 4 is an anode end face connection portion 40 that electrically and mechanically connects the anode connection portion 51 of the capacitor element 3 and the anode wiring connection portion 151 of the base substrate 1.

[0039] The end face connection portion 4 is provided along the straight outer peripheral end face 12. The end face connection portion 4 is provided along at least one of the four outer peripheral end faces 12 of the base substrate 1.

[0040] The end face connection portion 4 can be formed by adhering a metallic material, such as copper powder, to the surface using a cold spray or the like. Alternatively, the end face connection portion 4 can be formed by plating, thermal spraying, or sputtering of a conductive metal material such as copper. Furthermore, the end face connection portion 4 can be formed by wire bonding using a conductive metal wire.

[0041] <Capacitor> The capacitor 100 of this embodiment comprises a base substrate 1 and one or more capacitor elements 3 stacked on the base substrate 1. The anode wiring connection portion 151 of the anode wiring portion 150 of the base substrate 1 and the anode connection portions 51 of the plurality of capacitor elements 3 are electrically connected by an anode end face connection portion 40. The anode end face connection portion 40 is exposed on the outer end face of the capacitor 100.

[0042] Furthermore, the capacitor 100 in this embodiment has a plurality of anode terminals 155 on the anode wiring section 150 and a plurality of cathode terminals 165 on the cathode wiring section 160. The plurality of anode terminals 155 and the plurality of cathode terminals 165 are exposed on the surface of the base substrate 1 facing away from the capacitor element 3 (see Figure 2). The plurality of anode terminals 155 and the plurality of cathode terminals 165 are arranged alternately.

[0043] Further, in the capacitor 100 of the present embodiment, a plurality of stacked capacitor elements 3 are covered with a sealing resin portion 2. The sealing resin portion 2 is a resin cured product containing a thermosetting resin such as an epoxy resin. The sealing resin portion 2 can be formed of, for example, a compression mold resin. In FIGS. 1 and 2, the capacitor element 3 is shown by a solid line so as to be visible, but actually, the capacitor element 3 is disposed inside the sealing resin portion 2, and since the sealing resin portion 2 is opaque, the capacitor element 3 cannot be seen from the outside through the sealing resin portion 2 (the same applies to FIGS. 10 to 13, 24, 28, and 29).

[0044] FIG. 14 shows the connection state of the circuit of the capacitor 100 of the present embodiment. The arrow in the figure indicates the movement of electrons during the operation of the capacitor 100. The capacitor 100 of the present embodiment can intentionally control ESR and ESL by the positions and the number of connection terminals on the circuit formed on the base substrate 1. For example, in the capacitor 100, since a plurality of anode terminal portions 155 and a plurality of cathode terminal portions 165 are arranged alternately, a current magnetic field can be canceled, and the ESL can be reduced.

[0045] FIGS. 15 to 18 show the results of simulations using the capacitor 100 having the base substrate 1 with the main surface 11 sized 2 mm × 4 mm.

[0046] FIG. 15 shows measurement points A and B arranged in proximity near the center of the base substrate 1. In the case of FIG. 15, the ESL (@10 MHz) was 33.8 pH, the ESR (@100 kHz) was 10.73 mΩ, and the capacitance (@100 Hz) was 10.6 μF. FIG. 16 shows measurement point A fixed near the center of the base substrate 1 and measurement point B arranged at a position approximately midway between the corner of the base substrate 1 and measurement point A. In the case of FIG. 16, the ESL (@10 MHz) was 111.1 pH, the ESR (@100 kHz) was 12.25 mΩ, and the capacitance (@100 Hz) was 10.6 μF. FIG. 17 shows measurement point A fixed near the center of the base substrate 1 and measurement point B arranged near the corner of the base substrate 1. In the case of FIG. 17, the ESL (@10 MHz) was 217.4 pH, the ESR (@100 kHz) was 13.56 mΩ, and the capacitance (@100 Hz) was 10.7 μF.

[0047] FIG. 18 shows measurement points A and B arranged near the corners of the base substrate 1. In the case of FIG. 18, the ESL (@10 MHz) was 81.4 pH, the ESR (@100 kHz) was 13.21 mΩ, and the capacitance (@100 Hz) was 10.7 μF. FIG. 19 shows measurement point B fixed near the corner of the base substrate 1 and measurement point A arranged near the center of the base substrate 1. In the case of FIG. 19, the ESL (@10 MHz) was 217.4 pH, the ESR (@100 kHz) was 13.56 mΩ, and the capacitance (@100 Hz) was 10.7 μF. FIG. 20 shows measurement point B fixed near the corner of the base substrate 1 and measurement point A arranged at a diagonal position to measurement point B near the corner of the base substrate 1. In the case of FIG. 20, the ESL (@10 MHz) was 4498.0 pH, the ESR (@100 kHz) was 17.43 mΩ, and the capacitance (@100 Hz) was 10.6 μF.

[0048] From the above simulation results, it can be seen that the ESL of capacitor 100 is affected by the distance between terminals, and tends to be lower when using terminals in the center of the base board 1. Also, the difference in ESR of capacitor 100 depending on the terminal position is small, and tends to be lower when using terminals in the center of the base board 1. In this way, the terminal position of capacitor 100 can be selected according to the impedance of the circuit to which it is applied, for example, by increasing the number of terminals near the center of the base board 1 and designing the distance between terminals to be short when drawing out the circuit. In this way, it is easy to set the required capacitor characteristics (circuit constants) according to the circuit of the base board 1.

[0049] <Manufacturing Method for Capacitors> The capacitor 100 of this embodiment is manufactured as follows.

[0050] First, as shown in Figure 10, multiple capacitor elements 3 are stacked on one surface of the base substrate 1. Then, the multiple capacitor elements 3 stacked on the surface of the base substrate 1 are sealed with a sealing resin portion 2.

[0051] Next, as shown in Figure 11, the outer periphery of the base substrate 1, the outer periphery of the multiple capacitor elements 3, and the outer periphery of the sealing resin portion 2 are cut. As a result, the cut end surface of the base substrate 1 becomes the outer periphery end surface 12, and the anode wiring connection portion 151 is formed. In addition, the cut end surfaces of the metal layers 33 of the multiple capacitor elements 3 are formed as anode connection portions 51.

[0052] Subsequently, as shown in Figure 12, the anode end face connection portion 40 can be formed by spraying and adhering a metal material 410, such as copper powder, to the outer peripheral end face 12 and the anode connection portion 51 using a cold spray or the like.

[0053] Furthermore, as shown in Figure 13, the anode end face connection portion 40 can be formed with the wire 412 by wire bonding the conductive wire 412 to the anode wiring connection portion 151 and the anode connection portion 51 exposed on the outer peripheral end face 12. When wire bonding is performed, a resin coating can be applied to cover the outer peripheral end face 12, the anode connection portion 51, and the wire 412 to form a protective layer with a shape similar to the anode end face connection portion 40 in Figure 1.

[0054] (Modifications) The above embodiments are merely one of many embodiments of the present disclosure. The embodiments can be modified in various ways depending on the design, etc., as long as they achieve the objectives of the present disclosure.

[0055] In the above embodiment, an anode end face connection portion 40 was formed on one of the four outer peripheral end faces 12 of the rectangular capacitor 100, but the embodiment is not limited to this. Anode end face connection portions 40 may be formed at multiple locations on the capacitor 100.

[0056] In the above embodiment, the anode portion 5 and the anode wiring portion 150 are connected by the anode end face connection portion 40, which is the end face connection portion 4, but the embodiment is not limited to this. For example, the cathode portion 6 and the cathode wiring portion 160 may be connected by the end face connection portion 4.

[0057] As shown in Figure 21, the capacitor element 3 may be divided into multiple insulating sections 336, such as a grid. In this case, it is preferable that a conductive section 39 is formed in each section divided by the multiple insulating sections 336. This makes it possible to package parts with different capacitor characteristics that are independent of each other into a single package.

[0058] As shown in Figure 22, it is preferable that the metal foil 330 forming the metal layer 33 is unwound continuously in the longitudinal direction from a rolled state and cut to a predetermined size to be processed into a rectangular metal layer 33. At this time, the direction in which the peripheral edge 332 of the metal layer 33 extends is tilted so that it is not parallel or perpendicular to the longitudinal direction 333 of the unwound metal foil 330. This reduces the distortion of the metal layer 33 during processing and suppresses warping of the capacitor element 3.

[0059] In the case of a rectangular capacitor 100, anode end face connections can be formed on two opposing outer end faces, and cathode end face connections can be formed on the remaining two opposing outer end faces. In this case, as shown in Figure 23, a metal foil 400 such as copper foil is placed between a plurality of capacitor elements 3. This metal foil 400 is larger than the capacitor elements 3 and protrudes outward from the two opposing sides of the capacitor elements 3. The metal foil 400 is also electrically connected to the cathode portion 6 of the capacitor elements 3. Then, the portion of the metal foil 400 that protrudes beyond the capacitor elements 3 is cut to form a cathode connection portion 61. After this, as shown in Figure 24, the cathode end face connection portion 44, which is electrically connected to the cathode wiring connection portion 161 located on the outer end face 30 of the capacitor elements 3, is formed as an end face connection portion 4 in the same manner as described above.

[0060] In the case of a rectangular capacitor 100, both an anode end face connection and a cathode end face connection can be formed on two opposing outer end faces. In this case, as shown in Figures 25, 26, and 27, a metal foil 301 such as copper foil is placed between multiple capacitor elements 3. On two opposing sides of the capacitor element 3, the portion that will become the anode connection protrudes, and the portion that will become the cathode connection is recessed. On two opposing sides of the metal foil 301, the portion that will become the anode connection is recessed, and the portion that will become the cathode connection protrudes. Then, as shown in Figures 26 and 27, the anode and cathode connection portions of the capacitor element 3 can be formed by cutting the capacitor element 3 and the metal foil 301 at the position of the virtual cutting line CT. After this, the end face connection portion 4 (anode end face connection portion and cathode end face connection portion) can be formed in the same manner as described above. By changing the anode end face connection portion and the cathode end face connection portion in this way, it is easier to control the reduction of ESL.

[0061] As shown in Figure 28, an anode end face connection portion 40 can be formed on one outer surface of the outer circumference of the capacitor 100, and a connection portion 45 can be formed on the other outer surface opposite to this outer surface, as shown in Figure 29, to electrically connect only the anode connection portion 51 of the capacitor element 3. In this case, the terminal structure for connecting the anode can be used as a transmission line element, and a noise filter effect can be obtained.

[0062] Figure 30 shows a modified example of the base substrate 1. The base substrate 1 is formed in a flat plate shape with a pair of opposing main surfaces 11. The base substrate 1 also has a linear outer peripheral end surface 12 when viewed from the direction normal to the main surfaces 11. Note that a linear outer peripheral end surface 12 means that the edge of the outer peripheral end surface 12 is linear when viewed from the direction normal to the main surfaces 11. The base substrate 1 is formed in a rectangular shape when viewed from the direction normal to the main surfaces 11. Therefore, the base substrate 1 has four linear outer peripheral end surfaces 12.

[0063] The base substrate 1 is formed from a printed circuit board. The base substrate 1 has an insulating layer 13 that has electrical insulating properties. The insulating layer 13 is flat and is formed in a rectangular shape when viewed from the direction normal to the main surface 11 of the base substrate 1. The base substrate 1 also has a wiring section 10. The wiring section 10 is a circuit pattern formed from a conductive material and is formed on the surface and inside the insulating layer 13. The wiring section 10 is formed from metal foil such as copper foil and metal plating such as copper plating. The wiring section 10 has a wiring connection section 101 located on the outer peripheral end face 12 of the base substrate 1.

[0064] The wiring section 10 includes an anode wiring section 150 on the base substrate 1. The anode wiring section 150 is formed in a flat layer on the surface of the insulating layer 13. The anode wiring section 150 is also formed in a rectangular shape when viewed from the direction normal to the main surface 11 of the base substrate 1. The anode wiring section 150 has an anode wiring connection section 151. The anode wiring connection section 151 corresponds to the wiring connection section 101 of the wiring section 10. Therefore, the anode wiring connection section 151 is formed on the outer peripheral end surface of the anode wiring section 150 located on the outer peripheral end surface 12 of the base substrate 1. The anode wiring connection section 151 is formed along two opposing outer peripheral end surfaces 12 of the four outer peripheral end surfaces 12 of the base substrate 1.

[0065] The wiring section 10 includes a cathode wiring section 160 on the base substrate 1. Therefore, the base substrate 1 has a cathode wiring section 160. The cathode wiring section 160 has a cathode layer 168 and a cathode terminal section 165. The cathode layer 168 is formed on the surface of the base substrate 1 facing the cathode section 6. The cathode terminal section 165 is electrically connected to the cathode layer 168. The cathode terminal section 165 penetrates the base substrate 1 and is exposed on the surface of the base substrate 1 that does not face the cathode section 6.

[0066] The cathode layer 168 is formed as a flat layer on one side of the insulating layer 13 (the surface on the cathode portion 6 side). When viewed from the direction normal to the main surface 11 of the base substrate 1, the cathode layer 168 is formed as a rectangle smaller than the insulating layer 13. Therefore, the peripheral edge of the cathode layer 168 is separated from the peripheral edge of the insulating layer 13.

[0067] The cathode terminal portion 165 is formed using through-holes. Specifically, a through-hole 163 is formed that penetrates the insulating layer 13 and the anode wiring portion 150 in the thickness direction, a resist portion 164 is formed over the entire inner surface of the through-hole 163, and through-hole plating such as copper plating is applied to the inside of the resist portion 164 to form the cathode terminal portion 165. The base substrate 1 is provided with a plurality of cathode terminal portions 165.

[0068] (Embodiment 2) The capacitor 100B according to Embodiment 2 shown in Figures 31 to 33 uses metal foil 400 as shown in Figure 23. Hereinafter, components similar to those in Embodiment 1 will be denoted by common reference numerals and their descriptions will be omitted as appropriate. The configuration described in Embodiment 2 can be applied in appropriate combination with the configuration described in Embodiment 1 (including modified versions).

[0069] The capacitor 100B of this embodiment comprises a base substrate 1, two or more capacitor elements 3 and multiple metal foils 400 laminated on the base substrate 1. The two or more capacitor elements 3 and the multiple metal foils 400 are arranged and laminated on the surface of the base substrate 1. The multiple capacitor elements 3 and the multiple metal foils 400 are laminated alternately.

[0070] As shown in Figure 23, two or more capacitor elements 3 are stacked with a metal foil 400 placed between adjacent capacitor elements 3, and each metal foil 400 is electrically connected to the cathode portion 6 of the capacitor element 3.

[0071] As shown in Figures 31 and 32, a metal foil 400 is also provided between the base substrate 1 and the capacitor element 3 adjacent to the base substrate 1. This metal foil 400 is electrically connected to the cathode wiring portion 160 of the base substrate 1.

[0072] As shown in Figures 31 and 32, the multiple anode terminals 155 and multiple cathode terminals 165 of the base substrate 1 are exposed on the outer surface of the base substrate 1 facing away from the capacitor element 3.

[0073] As shown in Figure 31, the anode wiring connection portion 151 of the anode wiring portion 150 of the base substrate 1 and the anode connection portion 51 of the capacitor element 3 are electrically connected by the anode end face connection portion 40. The anode end face connection portion 40 is exposed on the outer end face of the capacitor 100B. The anode end face connection portion 40 is used as an external connection terminal.

[0074] As shown in Figure 32, the ends (cathode connection portions) 61 of the multiple metal foils 400 are electrically connected by a cathode end-face connection portion 41, which is formed as an end-face connection portion 4. As shown in Figure 32, the cathode end-face connection portion 41 is exposed on the outer end face of the capacitor 100B. The cathode end-face connection portion 41 is used as an external connection terminal.

[0075] As shown in Figure 33, the anode end face connection portion 40 is formed on two opposing outer surfaces (end faces) of the rectangular capacitor 100B. The cathode end face connection portion 41 is formed on two other opposing outer surfaces different from the anode end face connection portion 40. Note that the anode end face connection portion 40 and the cathode end face connection portion 41 may each be formed on one outer surface of the rectangular capacitor 100B.

[0076] In the capacitor 100B of this embodiment, by using a common capacitor element 3 and simply changing the design of the base board 1, which is a printed circuit board, it is easy to change the terminal arrangement (arrangement of multiple anode terminals 155 and multiple cathode terminals 165) to meet the requirements. Therefore, it is possible to significantly shorten the development lead time for custom products.

[0077] Furthermore, terminals (multiple anode terminals 155 and multiple cathode terminals 165) are present on both the upper and lower surfaces of the capacitor 100B, allowing the connection terminals to the circuit to be customized to correspond to the required circuit impedance characteristics.

[0078] (Embodiment 3) The capacitor 100C according to Embodiment 4 shown in Figures 34 and 35 differs from the capacitor 100B according to Embodiment 3 in that the anode end face connection portion 40 and the cathode end face connection portion 41 are different. Hereinafter, components similar to those in Embodiment 3 will be denoted by common reference numerals and their descriptions will be omitted as appropriate. The configuration described in Embodiment 4 can be applied in appropriate combination with the configurations described in Embodiments 1 and 3 (including modified versions).

[0079] In this embodiment, the capacitor 100C has an anode end face connection portion 40 formed on one outer surface of the rectangular capacitor 100C. The cathode end face connection portion 41 is formed on another outer surface different from the anode end face connection portion 40. The anode end face connection portion 40 and the cathode end face connection portion 41 are formed on two corresponding outer surfaces of the rectangular capacitor 100C, respectively.

[0080] In the capacitor 100C of this embodiment, the anode end face connection portion 40 and the cathode end face connection portion 41 are connected at their opposing outer surfaces (end faces), resulting in opposing current paths. This allows for the cancellation of magnetic fields, thereby achieving low ESL.

[0081] (Embodiment 4) The capacitor array 300A according to this embodiment includes a plurality of capacitors 100 according to this embodiment.

[0082] In the following, components similar to those in Embodiments 1 to 3 will be denoted by common reference numerals, and their descriptions will be omitted as appropriate. The configuration described in Embodiment 4 can be applied in appropriate combination with the configurations described in Embodiments 1 to 3 (including modified versions).

[0083] As shown in Figures 36 and 37, the capacitor array 300A comprises a plurality of capacitors 100 according to the above embodiment 1. The plurality of capacitors 100 are electrically connected to each other at their end face connection portions 4 and are arranged in a planar manner.

[0084] Each of the outer peripheral end faces 12 and 22 of the multiple capacitors 100 has an anode end face connection portion 40 formed as an end face connection portion 4, and the anode terminal portion 155 and cathode terminal portion 165 are exposed on the main surface 11. Conductive adhesive portions 200 are provided between adjacent capacitors 100 using conductive paste or the like, and the anode end face connection portions 40 are electrically and mechanically connected to each other by the conductive adhesive portions 200.

[0085] Even with such a 300A capacitor array, end-face current collection allows for shorter electrical paths and low-resistance connections, thus enabling low ESL and low ESR.

[0086] (Embodiment 5) The capacitor array 300B according to Embodiment 5 shown in Figure 35 is formed using the capacitor element 3 shown in Figure 21 and the base substrate 1 shown in Figure 39. Hereinafter, components similar to those in Embodiments 1 to 4 will be denoted by common reference numerals and their descriptions will be omitted as appropriate. The configuration described in Embodiment 5 can be applied in appropriate combination with the configurations described in Embodiments 1 to 4 (including modified versions).

[0087] As shown in Figure 21, the capacitor element 3 used in this embodiment is divided by a grid of insulating portions 336 and has a plurality of cathode division portions 62 separated by the insulating portions 336. Conductive portions 39 are formed in each of the plurality of cathode division portions 62. The capacitor element 3 has a dielectric 7 that is placed between the anode portion 5 and the plurality of cathode division portions 62. Therefore, a plurality of element division portions 32 are formed by each of the plurality of cathode division portions 62 and the anode portion 5. Preferably, the plurality of element division portions 32 are formed so that they have different capacitances, for example. The anode portion 5 is not divided and is common to the plurality of element division portions 32.

[0088] Furthermore, each base substrate 1 has a cathode wiring section 160 as shown in Figure 6. The cathode wiring section 160 also has a plurality of cathode wiring division sections 166 as shown in Figure 39. Each of the plurality of cathode wiring division sections 166 is formed corresponding to a plurality of element division sections 32. The plurality of cathode wiring division sections 166 are divided by an insulating section 167.

[0089] Furthermore, the insulating portions 167 and 336 can be formed with insulating ink or paint. In addition, the multiple element division portions 32 can be formed with any area, and the area of ​​the multiple cathode wiring division portions 166 can be changed accordingly.

[0090] Then, as shown in Figure 39, a capacitor array 300B is formed by arranging the capacitor elements 3 on one side of the base substrate 1. Here, the multiple element division sections 32 and the multiple cathode wiring division sections 166 corresponding to each of the multiple element division sections 32 are arranged to overlap. Therefore, the multiple element division sections 32 and the multiple cathode wiring division sections 166 corresponding to each of them are electrically connected.

[0091] The capacitor array 300B of this embodiment is a capacitor array in which capacitors with different connection terminal positions, number of connection terminals, and capacitance values ​​are connected in parallel. This allows for the intentional selection of ESR, ESL, and capacitance values ​​to set the necessary circuit constants in the circuit, and enables the removal of noise from the power supply line supplied to the xPU and VLSI over a wide bandwidth from low to high frequencies.

[0092] Furthermore, the capacitor array 300B of this embodiment allows for flexible wiring line configurations using wiring on the base board 1 or wiring on the same surface, and connection terminals can be selected according to the required capacitor characteristics (circuit constants).

[0093] Furthermore, in this embodiment, the capacitor array 300B is molded by sealing the capacitor elements 3 on the base substrate 1 with a sealing resin part 2, which allows the power supply to the load to be changed from horizontal to vertical, thereby reducing the mounting area.

[0094] Furthermore, the capacitor array 300B of this embodiment can significantly shorten the development lead time for customized products and can be provided at a low cost. In addition, the capacitor array 300B has terminals (multiple anode terminals 155 and multiple cathode terminals 165), making it easy to customize the selection of circuit connection terminals and capacitance values ​​to correspond to the required circuit impedance characteristics.

[0095] Furthermore, a capacitor array can be formed that comprises multiple capacitor arrays 300B. In this case, the anode portions 5 of the capacitor elements 3 provided in each of the multiple capacitor arrays 300B are electrically connected to each other. In addition, the corresponding cathode wiring division portions 166 of the base substrate 1 provided in each of the multiple capacitor arrays 300B can be electrically connected to each other. This makes it possible to further increase the capacitance and reduce the ESR of the capacitor array.

[0096] (Summary) As described above, the capacitor (100) according to the first embodiment comprises a base substrate (1), one or more capacitor elements (3) laminated on the base substrate (1), and an end face connection portion (4). Each of the one or more capacitor elements (3) comprises an anode portion (5), a cathode portion (6), and a dielectric (7) disposed between the anode portion (5) and the cathode portion (6). At least one of the anode portion (5) and the cathode portion (6) has an electrode connection portion (31) located on the outer peripheral end face (30) of the capacitor element (3). The base substrate (1) has a wiring portion (10). The wiring portion (10) has a wiring connection portion (101) located on the outer peripheral end face (12) of the base substrate (1). The end face connection portion (4) is electrically connected to the electrode connection portion (31) and the wiring connection portion (101).

[0097] According to this embodiment, the base substrate (1) and the capacitor element (3) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0098] The second embodiment is a capacitor (100) according to the first embodiment, wherein the base substrate (1) is a flat plate with a pair of opposing main surfaces (11) and is formed in a rectangular shape when viewed from the direction normal to the main surfaces (11). The end face connection portion (4) is provided on at least one of the outer peripheral end faces (12) of the base substrate (1).

[0099] According to this embodiment, there is an advantage in that the capacitor characteristics can be easily controlled by adjusting the position of the outer peripheral end face (12) that forms the end face connection portion (4).

[0100] The third embodiment is a capacitor (100) according to the first or second embodiment, wherein the electrode connection portion (31) is an anode connection portion (51) formed from the outer peripheral end surface of the anode portion (5) located on the outer peripheral end surface (30) of the capacitor element (3). The wiring portion (10) includes an anode wiring portion (150) of the base substrate (1). The wiring connection portion (101) includes an anode wiring connection portion (151) formed from the outer peripheral end surface of the anode wiring portion (150) located on the outer peripheral end surface (12) of the base substrate (1). The end face connection portion (4) includes an anode end face connection portion (40) electrically connected to the anode connection portion (51) and the anode wiring connection portion (151).

[0101] According to this embodiment, the position of the anode end face connection portion (40) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0102] The fourth embodiment is a capacitor (100) according to any one of the first to third embodiments, wherein the electrode connection portion (31) has a cathode connection portion (61) which is formed from the outer peripheral end surface of the cathode portion (6) located on the outer peripheral end surface (30) of the capacitor element (3). The wiring portion (10) includes a cathode wiring portion (160) of the base substrate (1). The wiring connection portion (101) includes a cathode wiring connection portion (161) which is formed from the outer peripheral end surface of the cathode wiring portion (160) located on the outer peripheral end surface (12) of the base substrate (1). The end face connection portion (4) includes a cathode end face connection portion (44) which is electrically connected to the cathode connection portion (61) and the cathode wiring connection portion (161).

[0103] According to this embodiment, the position of the cathode end face connection portion (44) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0104] The fifth embodiment is a capacitor (100) according to any one of the first to fourth embodiments, wherein the wiring portion (10) further comprises a terminal portion (102). The terminal portion (102) is exposed on the surface of the base substrate (1) opposite to the surface facing the capacitor element (3).

[0105] According to this embodiment, the position of the terminal portion (102) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0106] The sixth aspect is a capacitor (100) according to the fifth aspect, wherein the wiring section (10) includes an anode wiring section (150) on the base substrate (1) and a cathode wiring section (160) on the base substrate (1). The terminal section (102) includes a plurality of anode terminal sections (155) on the anode wiring section (150) and a plurality of cathode terminal sections (165) on the cathode wiring section (160). The plurality of anode terminal sections (155) and the plurality of cathode terminal sections (165) are arranged alternately.

[0107] According to this embodiment, the positions of the anode terminal (155) and the cathode terminal (165) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0108] The seventh embodiment is a capacitor (100) according to any one of the first to sixth embodiments, further comprising a sealing resin portion (2) that seals the capacitor element (3).

[0109] This embodiment has the advantage that the sealing resin portion (2) can protect the capacitor element (3).

[0110] The eighth aspect is a capacitor (100) according to any one of the first to seven aspects, wherein the base substrate (1) has a cathode wiring portion (160). The cathode wiring portion (160) has a cathode layer (168) formed on the surface of the base substrate (1) facing the cathode portion (6), and a cathode terminal portion (165) electrically connected to the cathode layer (168). The cathode terminal portion (165) penetrates the base substrate (1) and is exposed on the surface of the base substrate (1) that does not face the cathode portion (6).

[0111] According to this embodiment, the position of the cathode terminal (165) can be designed according to the capacitor characteristics, which has the advantage of making it easier to control the capacitor characteristics.

[0112] The ninth embodiment is a capacitor (100B, 100C) according to any one of the first to eight embodiments, wherein two or more capacitor elements (3) are stacked with a metal foil (400) between adjacent capacitor elements (3), and the metal foil (400) is electrically connected to the cathode (6).

[0113] This embodiment has the advantage that it is easy to form an end face connection portion (4) that is connected to the cathode portion (6) by the metal foil (400).

[0114] The capacitor array (300A) according to the tenth embodiment comprises a plurality of capacitors (100, 100B, 100C) according to any one of the first to nin embodiments. The plurality of capacitors (100, 100B, 100C) are electrically connected to each other at their end face connection portions (4) and are arranged in a planar manner.

[0115] This configuration has the advantage of making it easy to control capacitance and other properties using multiple capacitors (100, 100B, 100C).

[0116] A capacitor array (300B) according to the eleventh embodiment comprises a base substrate (1) and one or more capacitor elements (3) stacked on the base substrate (1). Each capacitor element (3) comprises an anode portion (5), a plurality of cathode division portions (62), and a dielectric (7) disposed between the anode portion (5) and the plurality of cathode division portions (62), thereby having a plurality of element division portions (32) each composed of the plurality of cathode division portions (62) and the anode portion (5). The base substrate 1 has a cathode wiring portion (160). The cathode wiring portion (160) has a plurality of cathode wiring division portions (166) corresponding to each of the plurality of element division portions (32). The plurality of element division portions (32) and the plurality of cathode wiring division portions (166) corresponding to each of the plurality of element division portions (32) are electrically connected.

[0117] According to this embodiment, it is possible to easily configure multiple element division sections (32) in parallel with a single capacitor element (3), which has the advantage of enabling the removal of a wide range of frequency noise in power lines with xPU and VLSI as loads.

[0118] 1 Base substrate 2 Encapsulating resin part 3 Capacitor element 4 End face connection part 5 Anode part 6 Cathode part 7 Dielectric 10 Wiring part 11 Main surface 12 Outer peripheral end face 30 Outer peripheral end face 31 Electrode connection part 32 Element division part 40 Anode end face connection part 44 Cathode end face connection part 51 Anode connection part 61 Cathode connection part 62 Cathode division part 100 Capacitor 100B Capacitor 100C Capacitor 101 Wiring connection part 102 Terminal part 150 Anode wiring part 151 Anode wiring connection part 155 Anode terminal part 160 Cathode wiring part 161 Cathode wiring connection part 165 Cathode terminal part 166 Cathode wiring division part 168 Cathode layer 400 Metal foil 300A Capacitor array 300B Capacitor array

Claims

1. A capacitor comprising a base substrate, one or more capacitor elements laminated on the base substrate, and an end face connection portion, wherein each of the one or more capacitor elements comprises an anode portion, a cathode portion, and a dielectric disposed between the anode portion and the cathode portion, and at least one of the anode portion and the cathode portion has an electrode connection portion located on the outer peripheral end face of the capacitor element, the base substrate has a wiring portion, the wiring portion has a wiring connection portion located on the outer peripheral end face of the base substrate, and the end face connection portion is electrically connected to the electrode connection portion and the wiring connection portion.

2. The capacitor according to claim 1, wherein the base substrate is a flat plate with a pair of opposing main surfaces and is formed in a rectangular shape when viewed from the direction normal to the main surfaces, and the end face connection portion is provided on at least one of the outer peripheral end faces of the base substrate.

3. The capacitor according to claim 1, wherein the electrode connection portion has an anode connection portion formed from the outer peripheral end surface of the anode portion located on the outer peripheral end surface of the capacitor element, the wiring portion includes an anode wiring portion of the base substrate, the wiring connection portion includes an anode wiring connection portion formed from the outer peripheral end surface of the anode wiring portion located on the outer peripheral end surface of the base substrate, and the end face connection portion includes an anode end face connection portion electrically connected to the anode connection portion and the anode wiring connection portion.

4. The capacitor according to claim 1, wherein the electrode connection portion has a cathode connection portion formed from the outer peripheral end surface of the cathode portion located on the outer peripheral end surface of the capacitor element, the wiring portion includes a cathode wiring portion of the base substrate, the wiring connection portion includes a cathode wiring connection portion formed from the outer peripheral end surface of the cathode wiring portion located on the outer peripheral end surface of the base substrate, and the end face connection portion includes a cathode end face connection portion electrically connected to the cathode connection portion and the cathode wiring connection portion.

5. The capacitor according to claim 1, wherein the wiring portion further comprises a terminal portion, and the terminal portion is exposed on the surface of the base substrate opposite to the surface facing the capacitor element.

6. The capacitor according to claim 5, wherein the wiring portion includes an anode wiring portion of the base substrate and a cathode wiring portion of the base substrate, the terminal portion includes a plurality of anode terminal portions of the anode wiring portion and a plurality of cathode terminal portions of the cathode wiring portion, and the plurality of anode terminal portions and the plurality of cathode terminal portions are arranged alternately.

7. The capacitor according to claim 1, further comprising a sealing resin portion for sealing the capacitor element.

8. The capacitor according to claim 1, wherein the wiring portion has a cathode wiring portion, the cathode wiring portion has a cathode layer formed on the surface of the base substrate facing the cathode portion, and a cathode terminal portion electrically connected to the cathode layer, and the cathode terminal portion penetrates the base substrate and is exposed on the surface of the base substrate that does not face the cathode portion.

9. The capacitor according to claim 1, comprising two or more stacked capacitor elements, wherein a metal foil is provided between adjacent capacitor elements, and the metal foil is electrically connected to the cathode portion.

10. A capacitor array comprising a plurality of capacitors according to any one of claims 1 to 9, wherein the plurality of capacitors are electrically connected to each other at their end face connections and are arranged in a planar manner.

11. A capacitor array comprising a base substrate and one or more capacitor elements laminated on the base substrate, wherein each capacitor element comprises an anode portion, a plurality of cathode division portions, and a dielectric disposed between the anode portion and the plurality of cathode division portions, thereby having a plurality of element division portions composed of each of the plurality of cathode division portions and the anode portion, the base substrate having a cathode wiring portion, the cathode wiring portion having a plurality of cathode wiring division portions corresponding to each of the plurality of element division portions, and the plurality of element division portions and the plurality of cathode wiring division portions corresponding to each of the plurality of element division portions are electrically connected.

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